LAD66A2CB

Series LA-A2 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS Part Number Series LA-A2 Natural Conv. (°C/W): 19.7 Forced Air (°C/W): 6.4 Mounting Envelope: 1.31" x .90" x .25" DESCRIPTION OF CURVES A. B. C. D. E. N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss. • • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. Derate 0.4 °C/watt for unplated part in natural convection only. Ordering Information CTS IERC PART NO. Comm'l. Black Anodize LA000A2U LA000A2CB LAD66A2U LAD66A2CB LAIC66A2U LAIC66A2CB Unplated Mil. Black Anodize LA000A2B LAD66A2B LAIC66A2B Semiconductor Accommodated Undrilled TO-66 TO-66 IC Hole patt. ref. no. -1 (see below) 7 (see below) Max. Weight (Grams) 4.6 4.6 4.6 HOLE PATTERNS 1. Hole Pattern no. 248 accommodates TO-66s. Available in LA- 7. Hole pattern no. 191 accommodates To-66 Ics. Available in A, LA-B and LB series heat dissipators only. LA-A, LA-B, and LB series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872 Rev. 08-29-03