LB66B1B

Series LB66B1 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS Part Number Series LB66B1 Natural Conv. (°C/W): 17.1 Forced Air (°C/W): 5.3 Mounting Envelope: 1.40" x 1.12" x .50" DESCRIPTION OF CURVES A. B. C. D. E. N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss. • • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. Derate 1.4 °C/watt for unplated part in natural convection only. Ordering Information CTS IERC PART NO. Comm'l. Black Mil. Black Anodize Anodize LB66B1-76U LB66B1-76CB LB66B1-76B LB66B1U LB66B1CB LB66B1B LB66B1-67U LB66B1-67CB LB66B1-67B LB66B1-77U LB66B1-77CB LB66B1-77B Unplated Semiconductor Accommodated Undrilled TO-66 TO-66 IC TO-66 IC (Socket) Hole patt. ref. no. -9 7 10 Max. Weight (Grams) 6.2 6.2 6.2 6.2 HOLE PATTERNS 9. Hole Pattern no. 133 accommodates TO-66s. Available in LB 7. Hole pattern no. 191 accommodates To-66 Ics. Available in series heat dissipators only. LA-A, LA-B, and LB series heat dissipators only. 10. Hole pattern no. 225 accommodates TO-66 ICs (socket). Available in LB series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872 Rev. 08-29-03