PC1-1CB

HEAT DISSIPATORS FOR PLASTIC Horizontally CASE, CASE-MOUNTED mounted, light-weight, .Accommodates all flat plastic case power semiconductors. .Efficient design requires just. 71 sq. in. of board area (PA Series) and .31" to .5" height above board. SEMICONDUCTORS low-cost heat dissipators .L'4I'ger PB Series offers greater heat dissipation, additional hole patterns, and dual semiconductor mounting capability. .Only one mounting screw required to secure dissipators to semiconductor and circuit board. .Most effective l:1eatdissipator in performance/unit cost. PC1-1CB O .Thermal .Derate Ordering (i~)1u 3 4 5 6 7 Information Max. .375 L..J 2 POWER DISSIPATED (WATTS) Resistance Case to Sink is 0.9.1.1 'C/W w/Joint Compound. 2.4 'C/watt for unplated part in natural convection only. Weight (9.53) Unplated (Grams) '~ PC1.IU , PCI-ICB TO-126, TO-127, TO-220 PC1.1B Dimensions are for reference use only. Contact IERC for dimensions with tolerances or standard part drawings. 1.9 PA1 Series 0 .Thermal .Uprate .Derate 1 .04 (1.02) L Dimensions are for reference use only. ContectlERC for dimensions with tolerances or standsrd part drawings. 2.4 4 Unplated I PAlCB PAl-lU PAl.lCB See PART Com'l. Black Anodize PAlU Note: 5 6 7 8 9 10111213 1415 Information IERC , r 3 POWER DISSIPATED (WATTS) Resistance Case to Sink is 0.9.1.1 °C/W w/Joint Compound. 2.4 °C/watt for black part in natural convection only. 0.6 °C/watt for Insulube~ part in natural convection only. Ordering J .50 (12.70) 2 page iv for NO. I Mil. Black Anodize PAlO PA1.lo other finishes. Insulube~ Semiconductor Accommodated 448 PAl PAl-l Undrllled TO-126, TO-1n TO-220 Max. Weight (Grams) 2.0 2.0