LVD SCSI Terminator
Technical Data Sheet
RoHS Compliant Parts Available
Description
This LVD SCSI termination network is designed for high performance active termination of SCSI networks compliant to SPI-2 (Ultra2), SPI-3 (Ultra3) and beyond. Designed with a ceramic substrate and a ball grid array interconnect, this device virtually eliminates channel capacitance and lead inductance, the primary cause of reduced system performance. BGA packaging has been proven to reduce rework and improve reliability.
Features
• • • • • • • 9 Line LVD Termination Network Ultra2 and Ultra3 Compliant Low Channel Capacitance Less than 0.25pF BGA package reliability ±1% Resistor Tolerance Low Channel Cross Talk RoHS Compliant Designs Available • Compatible with both lead and lead-free manufacturing processes
Style E
4 3
Schematic Diagram
R1 R2
Electrical Specifications
Resistor Tolerance: TCR Operating Temperature Range Maximum Resistor Power: Maximum Package Power: Process Requirements: Maximum Re-flow Temperature ± 1.0% ± 200ppm/°C -55°C to +125°C 0.05 Watts at 70°C 1.0 Watts at 70°C Per IPC/JEDEC J-STD-020C
2 R1 1 A B C D E F G H J
LVD SCSI Active Termination Circuit
1.3V DIFSENS 2.7V to 5.25 V TERMPWR 2 4.7µF UCC561 4 3 4.7µF 0.75 V 7 6 4.7µF 1.75 V
R1 R2 R1
RT1300B6
RT1300B6
RT1300B6
LVD SCSI Bus
Ordering Information
Standard Part No. R1 Ω R2 Ω Lines Pitch (mm) RoHS Part No.
Packaging Information
Suffix
Tape Width Carrier Pitch Reel Diameter Parts/Reel
Part Number Coding 7 inch reel, Add TR7 to part number, example RT2300B6TR7 13 inch reel, Add TR13 to part number, example RT2300B6TR13 (Bulk packaging is not available)
TR7
24 mm 8 mm 7 inch 1,000
TR13
24mm 8 mm 13 inch 4,000
RT1300B6* 475 121 9 1.27 RT2300B6* *Indicates available Top Probe-able part numbers. Refer to the following link for detailed Top Side Probe-able information: www.ctscorp.com/components/clearone/TopProveClearOne.pdf
Direction of Fee d
CTS Electronic Components www.ctscorp.com
© 2006 CTS Corporation. All rights reserved. Information subject to change. Page 1 LVD SCSI Terminator
March 06
Recommended Land Pattern
Outline of Substrate
PCB Pad Diameter 1.27 mm Pitch (B6) = 0.64mm/.025 inch
Solder Mask Dia = Pad Diameter +.15mm (.006 inch)
For .006" Thick Solder Paste Stencil, Aperture Opening Should be Equal to the PCB Pad Diameter. Refer to www.ctscorp.com/components/clearone.asp for additional PCB design information
Mechanical Diagram
L H
W
RT_300B6 CTS YRWK
P (Pitch)
A1 Identifier
K
P (Pitch)
D
1.27mm Pitch
RT1300B6 RT2300B6 mm Inch
L
11.43±0.15 .450±.006
W
5.08±0.15 .200±.006
H
1.32±0.15 .052±.006
P
1.27±0.25 .050±.010
D
0.76±0.05 .030±.002
K
0.64±0.25 .025±.010
Complete ClearONE Product, Processing, and Application Information can be found at the following link: http://www.ctscorp.com/components/clearone.asp
CTS Electronic Components www.ctscorp.com
© 2006 CTS Corporation. All rights reserved. Information subject to change. Page 2 LVD SCSI Terminator
March 06
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