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RT2233B7

RT2233B7

  • 厂商:

    CTS(西迪斯)

  • 封装:

  • 描述:

    RT2233B7 - Memory & IDE Terminator - CTS Corporation

  • 详情介绍
  • 数据手册
  • 价格&库存
RT2233B7 数据手册
Memory & IDE Terminator Technical Data Sheet RoHS Compliant Parts Available Description This source terminator network provides high performance resistor termination for high-speed data busses. Designed with a ceramic substrate, this device minimizes channel capacitance, a primary cause of reduced system performance. In addition, the BGA package eases routing design, saving the designer many hours of printed circuit layout. The BGA packaging has been proven to reduce rework and improve reliability. Features • • • • • 16 or 32 Bit Terminators Ultra Low I/O Coupling Slim BGA Package ±1% Resistor Tolerance Top Side Probe-able Version Available for Development RoHS Compliant Designs Available • Compatible with both lead and lead free processes • Style C 4 3 2 1 A B C 16 Bits R1 4 3 2 32 Bits R1 R1 A B C D E F G H J K L M N P R T R1 D E F G H 1 Electrical Specifications Resistor Tolerance: TCR Operating Temperature Range Maximum Resistor Power: Maximum Package Power: Process Requirements: Maximum Temperature ± 1.0% ±200ppm/°C -55°C to +125°C 0.05 Watts at 70°C 1.0 Watts at 70°C Per IPC/JEDEC J-STD-020C Typical Application DRAM Series Termination for Address Lines RT2202B7 Ordering Information 1.00mm Pitch Standard Part No. RT1200B7* RT1202B7 RT1232B7 RT1233B7 RT1235B7 RT1201B7* RT1203B7 RT1205B7* RT1236B7 Style R1 Ω Bits Array Size 4x8 4x8 4x8 4x8 4x8 4 x 16 4 x 16 4 x 16 4 x 16 1.00mm Pitch RoHS Part No. RT2200B7* RT2202B7 RT2232B7 RT2233B7 RT2235B7 RT2201B7* RT2203B7 RT2205B7* RT2236B7 Packaging Information Suffix Tape Width Carrier Pitch Reel Diameter Parts/Reel TR7 24 mm 8 mm 7 inch 1,000 TR13 24mm 8 mm 13 inch 4,000 C C C C C C C C C 10 33 22 25 50 10 33 50 100 16 16 16 16 16 32 32 32 32 Part Number Coding 7 inch reel, Add TR7 to part number, example RT2400B6TR7 13 inch reel, Add TR13 to part number, example RT2400B6TR13 (Bulk packaging is not available) * - Indicates Top Side Probable versions available. Direction of Feed CTS Electronic Components www.ctscorp.com © 2006 CTS Corporation. All rights reserved. Information subject to change. Page 1 Memory & IDE Terminator March 06 Recommended Land Pattern Outline of Substrate BGA Routing Scheme .005 Inch Wide Traces PCB Pad Diameter 1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum) 1.27mm pitch (B6) = 0.64mm/.025 inch (minimum) For .006" Thick Solder Paste Stencil, Aperture Opening Should be Equal to the PCB Pad Diameter. Refer to www.ctscorp.com/components/clearone.asp for additional PCB design information Solder Mask Dia = Pad Diameter +.15mm(.006 inch) Top Side Probe-able Information Top Side Probe-able Probe Pad 4x8 Array Shown Refer to Top Probe-able Application Notes for additional information. Note: Add a ‘P’ suffix to order Top Side Probe-able version. Example: RT2203B7PTR7. Refer to the following link for detailed Top Side Probe-able Information: www.ctscorp.com/components/clearone/TopProveClearOne.pdf Mechanical Diagram L H W RT_2__B7 CTS YRWK P (Pitch) A1 Identifier K P (Pitch) D 16 Bit Style C 32 Bit Style C mm inch mm inch L 8.00±0.15 .315±.006 L 16.00±0.15 .630±.006 W 4.00±0.15 .157±.006 W 4.00±0.15 .157±.006 H 1.19±0.15 .047±.006 H 1.19±0.15 .047±.006 P 1.00±0.25 .039±.010 P 1.00±0.25 .039±.010 D 0.64±0.05 .025±.002 D 0.64±0.05 .025±.002 K 0.50±0.25 .020±.010 K 0.50±0.25 .020±.010 Complete ClearONE Product, Processing, and Application Information can be found at the following link: http://www.ctscorp.com/components/clearone.asp © 2006 CTS Corporation. All rights reserved. Information subject to change. Page 2 Memory & IDE Terminator CTS Electronic Components www.ctscorp.com March 06
RT2233B7
1. 物料型号: - 1.00mm Pitch Standard Part No.: - RT1200B7\, RT1202B7, RT1232B7, RT1233B7, RT1235B7, RT1201B7\, RT1203B7, RT1205B7\, RT1236B7 - 1.00mm Pitch RoHS Part No.: - RT2200B7\, RT2202B7, RT2232B7, RT2233B7, RT2235B7, RT2201B7\, RT2203B7, RT2205B7\, RT2236B7

2. 器件简介: - 该器件是高速数据总线的高性能电阻终结网络,设计采用陶瓷基板,以最小化信道电容,这是降低系统性能的一个主要原因。此外,BGA封装简化了布线设计,节省了设计者大量的印刷电路布局时间。BGA封装已被证明可以减少返工并提高可靠性。

3. 引脚分配: - 提供了16位和32位终结器,具有超低I/O耦合和Slim BGA封装。还有顶部探针可探测版本可供开发使用。

4. 参数特性: - 电阻公差:±1.0% - 温度系数:+200ppm/°C - 工作温度范围:-55°C至+125°C - 最大电阻功率:0.05瓦特在70°C - 最大封装功率:1.0瓦特在70°C - 工艺要求:符合IPC/JEDEC J-STD-020C标准

5. 功能详解: - 提供了16位或32位终结器,超低I/O耦合,Slim BGA封装,±1%电阻公差,顶部探针可探测版本可供开发使用,RoHS兼容设计,兼容铅和无铅工艺。

6. 应用信息: - 典型应用为DRAM系列终结,用于地址线。

7. 封装信息: - 封装后缀TR7和TR13,胶带宽度24mm,载体节距8mm,卷径7英寸和13英寸,每卷零件数分别为1000和4000。 - 7英寸卷,添加TR7到零件号,例如RT2400B6TR7。 - 13英寸卷,添加TR13到零件号,例如RT2400B6TR13(散装包装不可用)。
RT2233B7 价格&库存

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