UP1-TO3B

Series UP1 Series for TO-3 Outline and Stud Mount Devices Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS UP1 Series for TO-3 Outline and Stud Mount Devices Natural Conv. (°C/W): 10.4 Forced Air (°C/W): 3.2 Mounting Envelope: 1.78" x 1.78" x .50" DESCRIPTION OF CURVES A. B. C. D. E. • • • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. Derate 0.7 °C/watt for unplated part in natural convection only. Derate 0.4 °C/watt for Insulube® part in natural convection only. N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss. Ordering Information Unplated UP1-000-U UP1-T03-U UP1-T03-46U UP1-436-U UP1-T06-U UP1-T015-U UP-420-U UP1-T0V-7U CTS IERC PART NO. Comm'l. Black Anodize UP1-000-CB UP1-T03-CB UP1-T03-46CB UP1-436-CB UP1-T06-CB UP1-T015-CB UP1-420-CB UP1-T0V-7CB Mil. Black Anodize UP1-000-B UP1-T03-B UP1-T03-46B UP1-436-B UP1-T06-B UP1-T015-B UP1-420-B UP1-T0V-7B Semiconductor Accommodated Undrilled T0-3 T0-3 IC TO-3 (4-pin) T0-6, T0-36 T0-15, D0-5 Universal Universal Hole patt. ref. no. Max. Weight (Grams) -16 17 18 19 23 27 28 15.5 15.5 15.5 15.5 15.5 15.5 15.5 15.5 HOLE PATTERNS 16. Hole pattern no. 1 accommodates T0-3s. Available in UP, 17. Hole pattern no. 202 accommodates T0-3 ICs. Available in UP1, UP2, HP1, and HP3 series heat dissipators. UP, UP1, UP2, HP1, and HP3 series heat dissipators. 18. Hole pattern no. 436 accommodates t0-3s (4-pin). Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 19. Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 23. Hole pattern no. 3 accommodates T0-15s, D0-5s and other ¼” stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 27. Hole pattern no. 420 (Universal) accommodates T0-3s, T066s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 28. Hole pattern no. 64 (Universal) accommodates T0-3s, D0-4s, T0-15s, T0-6s, T0-36s, or other stud mounted devices up to ¼” diameter. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872 Rev. 03-01-03