HSS-B20-0635H

Additional Resources: Product Page date 08/05/2022 page 1 of 4 SERIES: HSS-B20-0635 | DESCRIPTION: HEAT SINK FEATURES • TO-220 package • solder pin for secure PCB mounting • round hole for component attachment • black anodized finish MODEL thermal resistance1 fin height (mm) HSS-B20-0635H power dissipation1 @ 75°C ΔT, nat conv (°C/W) @ 1 W, nat conv (°C/W) @ 1 W, 200 LFM (°C/W) @ 1 W, 400 LFM (°C/W) @ 75°C ΔT, nat conv (W) 28.85 35.46 10.68 7.88 2.60 6.35 HSS-B20-0635H-01 9.53 27.78 33.93 9.51 6.84 2.70 HSS-B20-0635H-02 12.70 29.09 33.89 10.49 6.81 2.58 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES HSS-B20-0635H Heatsink Temperature Rise Above Ambient (ΔT = Ths - Ta) (°C) Power (W) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 35.46 10.68 7.88 2 59.42 20.81 15.77 3 83.82 31.59 23.83 4 101.40 41.80 31.52 5 122.52 52.02 38.83 Ths: “hot spot” temperature measured on the heatsink Ta: ambient temperature Mounting Surface Temperature Rise Above Ambient (°C) 100 Without Airflow 90 200 LFM 80 400 LFM 70 60 50 40 30 20 10 0 0 1 2 3 Dissipated Power (W) cuidevices.com 4 5 Additional Resources: Product Page CUI DEVICES | SERIES: HSS-B20-0635 | DESCRIPTION: HEAT SINK date 08/05/2022 | page 2 of 4 PERFORMANCE CURVES (CONTINUED) HSS-B20-0635H-01 100 Power (W) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 33.93 9.51 6.84 2 58.86 20.45 14.91 3 81.12 31.36 22.45 4 100.66 40.98 30.96 5 121.15 51.38 38.04 Without Airflow 90 Mounting Surface Temperature Rise Above Ambient (°C) Heatsink Temperature Rise Above Ambient (ΔT = Ths - Ta) (°C) 200 LFM 80 400 LFM 70 60 50 40 30 20 10 Ths: “hot spot” temperature measured on the heatsink Ta: ambient temperature 0 0 1 2 3 4 5 2 3 4 5 Dissipated Power (W) HSS-B20-0635H-02 100 Power (W) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 33.89 10.49 6.81 2 60.40 20.20 13.50 3 84.56 30.26 19.87 4 100.59 40.17 26.37 5 112.14 49.67 32.37 Ths: “hot spot” temperature measured on the heatsink Ta: ambient temperature Without Airflow 90 Mounting Surface Temperature Rise Above Ambient (°C) Heatsink Temperature Rise Above Ambient (ΔT = Ths - Ta) (°C) 200 LFM 80 400 LFM 70 60 50 40 30 20 10 0 0 cuidevices.com 1 Heat Dissipated (W) Additional Resources: Product Page CUI DEVICES | SERIES: HSS-B20-0635 | DESCRIPTION: HEAT SINK date 08/05/2022 | page 3 of 4 MECHANICAL DRAWING units: mm tolerance: ±0.5 mm HSS-B20-0635H MATERIAL AL1050 FINISH black anodized THICKNESS 1.2 mm PIN MATERIAL brass PIN PLATING tin WEIGHT HSS-B20-0635H: 1.5 g HSS-B20-0635H-01: 1.7 g HSS-B20-0635H-02: 2.0 g HSS-B20-0635H-01 HSS-B20-0635H-02 cuidevices.com Additional Resources: Product Page CUI DEVICES | SERIES: HSS-B20-0635 | DESCRIPTION: HEAT SINK date 08/05/2022 | page 4 of 4 REVISION HISTORY rev. description date 1.0 initial release 03/29/2017 1.01 brand update 02/13/2020 logo, datasheet style update 08/05/2022 1.02 The revision history provided is for informational purposes only and is believed to be accurate. CUI Devices offers a one (1) year limited warranty. Complete warranty information is listed on our website. CUI Devices reserves the right to make changes to the product at any time without notice. Information provided by CUI Devices is believed to be accurate and reliable. However, no responsibility is assumed by CUI Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. CUI Devices products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. cuidevices.com