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date 11/07/2014
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1 of 30
ED
SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
FEATURES
•
•
•
•
•
•
• pin and function compatible with
Architects of Modern Power™ product
standards
• industry standard eighth-brick
58.4 x 22.7 x 10.2 mm
(2.299 x 0.894 x 0.402 in)
• industry-leading power density for
telecom and datacom 129~147W / sq. in
• high efficiency, typ. 95.2% at half load,
12 Vout
• fully regulated advanced bus converter
from 36~75Vin
• 2,250 Vdc input to output isolation
• fast feed forward regulation to manage
line transients
• optional baseplate for high temperature
applications
• droop load sharing with 10% current
share accuracy
• 2.9 million hours MTBF
• ISO 9001/14001 certified supplier
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SC
ON
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industry standard footprint
isolated topology
high power density
fast transient response
high conversion efficiency
wide range of input and output
characteristics available
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GENERAL CHARACTERISTICS
MODEL
input voltage
output voltage
output current
output wattage
(Vdc)
(Vdc)
max
(A)
max
(W)
NEB-264NWA-AN
36~75
12
22
264
NEB-300NMA-AN
40~60
12
25
300
NEB-261NWB-AN
36~75
12.45
22
261
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PART NUMBER KEY
ED
NEB- XXX N X X - X X X X - XXX -ES X
Base Number
Engineering Phase:
A~Z
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Design Output Power:
1~999
No Digital Interface
TI
Input Voltage Range:
W = wide (36~75 V)
M = medium (40~60 V)
DI
SC
ON
Nominal Output Voltage:
A = 12.0 V
B = 12.45 V
C = 9.6 V
Load Sharing Function:
D = 9.0 V
D = Vout droop
Engineering Sample:
ES
)LUPZDUH&RQ¿JXUDWLRQ
000~ZZZ
Heatsink Option:
"blank" = open frame
+ KHDWVLQNÀDW
G = heatsink with GND pin
Enable Logic Sense:
N = negative logic
P = positive logic
Pin Description:
A = 5.33 mm (0.210 in.)
B = 4.57 mm (0.180 in.)
C = 3.69 mm (0.145 in.)
D = 2.79 mm (0.110 in.)
S = SMT
Packaging:
20 converters(through hole pin)/tray, PE foam dissipative
20 converters(surface mount pin)/tray, Antistatic PPE
Example part number: NEB-264NWA-AN-001
264 W output power, no digital pins
wide input voltage range, 12.0 V output
5.33 mm pins, negative enable logic
¿UPZDUHUHYLVLRQ
CONTENTS
Part Number Key........................................................2
General Information...................................................3
6DIHW\6SHFL¿FDWLRQ
Absolute Maximum Ratings..........................................4
(OHFWULFDO6SHFL¿FDWLRQ
12V, 22A, 264W, 36~75Vin; NEB-264NWA-AN.....................5
12V, 25A, 300W, 40~60Vin; NEB-300NMA-AN.....................9
12.45V, 22A, 261W, 36~75Vin; NEB-261NWB-AN...............13
12.45 V, 25 A, 296 W, 40~60 Vin; NEB-296NMB-AN...............16
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(0& 6SHFL¿FDWLRQ
Operating Information...................................19
Thermal Consideration..................................21
Connections............................................22
Mechanical Information.................................23
Soldering Information...................................26
Delivery Package Information.........................27
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General Information
Telcordia SR-332 Issue 2 also provides techniques to
HVWLPDWHWKHXSSHUFRQ¿GHQFHOHYHOVRIIDLOXUHUDWHVEDVHG
on the mean and standard deviation.
421 n F ailures/h
Component power supplies for general use should comply
with the requirements in IEC/EN/UL 60950 1 Safety
of Information Technology Equipment. Product related
standards, e.g. IEEE 802.3af Power over Ethernet, and
ETS 300132 2 Power interface at the input to telecom
equipment, operated by direct current (dc) are based on
IEC/EN/UL 60950 1 with regards to safety.
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Mean steady-state failure rate, λ Std. deviation, σ
the responsibility of the installer to ensure that the
¿QDOSURGXFWKRXVLQJWKHVHFRPSRQHQWVFRPSOLHVZLWK
the requirements of all applicable safety standards and
UHJXODWLRQVIRUWKH¿QDOSURGXFW
ED
Reliability
7KHIDLOXUHUDWH NJ DQGPHDQWLPHEHWZHHQIDLOXUHV
07%) NJ LVFDOFXODWHGDWPD[RXWSXWSRZHUDQG
an operating ambient temperature (TA) of +40°C. CUI
Power Modules uses Telcordia SR-332 Issue 2 Method 1 to
calculate the mean steady-state failure rate and standard
GHYLDWLRQ ı
60.9 nF ailures/h
CUI Power Modules DC/DC converters and DC/DC
UHJXODWRUVDUH8/ UHFRJQL]HGDQGFHUWL¿HGLQ
DFFRUGDQFHZLWK(1 7KHÀDPPDELOLW\UDWLQJIRU
all construction parts of the products meet requirements
for V-0 class material according to IEC 60695-11-10, Fire
KD]DUGWHVWLQJWHVWÀDPHV±:KRUL]RQWDODQGYHUWLFDO
ÀDPHWHVWPHWKRGV
MTBF (mean value) for the NEB series = 2.91 Mh.
07%)DW FRQ¿GHQFHOHYHO 0K
Compatability with RoHS requirements
The products are compatible with the relevant clauses
and requirements of the RoHS directive 2011/65/EU and
have a maximum concentration value of 0.1% by weight
in homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
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Isolated DC/DC converters
*DOYDQLFLVRODWLRQEHWZHHQLQSXWDQGRXWSXWLVYHUL¿HG
in an electric strength test and the isolation voltage
(Viso) meets the voltage strength requirement for basic
insulation according to IEC/EN/UL 60950-1.
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ON
Exemptions in the RoHS directive utilized in CUI
Power Modules products are found in the Statement of
Compliance document.
It is recommended to use a slow blow fuse at the input
RIHDFK'&'&FRQYHUWHU,IDQLQSXW¿OWHULVXVHGLQWKH
FLUFXLWWKHIXVHVKRXOGEHSODFHGLQIURQWRIWKHLQSXW¿OWHU
In the rare event of a component problem that imposes a
short circuit on the input source, this fuse will provide the
following functions:
Safety Specification
General Information
CUI Power Modules DC/DC converters and DC/DC
regulators are designed in accordance with the safety
standards IEC60950-1, EN60950-1 and UL60950-1 Safety
of Information Technology Equipment
• Isolate the fault from the input power source so as not to
affect the operation of other parts of the system
• Protect the distribution wiring from excessive current and
power loss thus preventing hazardous overheating
IEC/EN/UL60950-1 contains requirements to prevent
injury or damage due to the following hazards:
The DC/DC converter output is considered as safety extra
low voltage (SELV) if one of the following conditions is
met:
Electrical Shock
Energy hazards
Fire
Mechanical and heat hazards
Radiation hazards
Chemical hazards
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•
•
•
•
•
•
On-board DC/DC converters and DC/DC regulators are
GH¿QHGDVFRPSRQHQWSRZHUVXSSOLHV$VFRPSRQHQWV
they cannot fully comply with the provisions of any
safety requirements without “conditions of acceptability”.
Clearance between conductors and between conductive
parts of the component power supply and conductors on
WKHERDUGLQWKH¿QDOSURGXFWPXVWPHHWWKHDSSOLFDEOH
safety requirements. Certain conditions of acceptability
apply for component power supplies with limited stand-off
(see Mechanical Information for further information). It is
•The input source has double or reinforced insulation from
the AC mains according to IEC/EN/UL 60950-1
•The input source has basic or supplementary insulation
from the AC mains and the input of the DC/DC converter
is maximum 60 Vdc and connected to protective earth
according to IEC/EN/UL 60950-1
•The input source has basic or supplementary insulation
from the AC mains and the DC/DC converter output is
connected to protective earth according to IEC/EN/UL
60950-1
Non - isolated DC/DC regulators
The DC/DC regulator output is SELV if the input source
meets the requirements for SELV circuits according to IEC/
EN/UL 60950-1.
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date 11/07/2014 Ϳ page 4 of 30
Absolute Maximum Ratings
conditions/description
min
max
units
see thermal consideration section
-40
+125
°C
-55
+125
°C
-0.5
+80
+65*
V
2250
Vdc
+100
+80*
V
18
V
storage temperature (TS)
input voltage (VI)
isolation voltage (Viso)
input to output test voltage, see note 1
input voltage transient (Vtr)
according to ETSI EN 300 132-2 and Telcordia GR1089-CORE
remote control pin voltage (VRC)
see operating information section
typ
ED
parameter
operating temperature (TP1)
-0.3
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Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one
SDUDPHWHUDWDWLPHH[FHHGLQJWKHOLPLWVLQWKH(OHFWULFDO6SHFL¿FDWLRQ,IH[SRVHGWRVWUHVVDERYHWKHVHOLPLWVIXQFWLRQDQGSHUIRUPDQFHPD\GHJUDGHLQDQXQVSHFL¿HGPDQQHU
Note 1: Isolation voltage (input/output to base-plate) max 750 Vdc.
* Applies for the narrow input version VI= 40-60 V
Fundamental Circuit Diagram
Driver
TI
+IN
SC
ON
-IN
Auxillary
Supply
RC
+OUT
-OUT
Driver
Control
RC isolation
Functional Description
TP1, TP3 = -40 to +90ºC, VI = 36 to 75 V.
Typical values given at: TP1, TP3 = +25°C, VI= 53 V, max IOXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
&RQ¿JXUDWLRQ)LOH &'$
parameter
conditions/description
min
typ
max
units
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fault protection
characteristics
input under voltage lockout
(UVLO)
fault limit
setpoint accuracy
hysteresis
delay
output voltage - under voltage
protection
fault limit
fault response time
0
200
V
NjV
output voltage - over voltage
protection
fault limit
fault response time
15.6
200
V
NjV
over current protection (OCP)
setpoint accuracy (IO)
fault limit
fault response time
over temperature protection
(OTP)
fault limit
hysteresis
fault response time
0
-6
32
0.5
2
300
25
200
125
10
300
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V
V
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Electrical Specification
12 V, 22 A, 264 W
parameter
conditions/description
ED
TP1 = -40 to +90ºC, VI = 36 to 75V.
Typical values given at: TP1 = +25°C, VI = 53 V, max IOXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
Additional Cin= 0.1 mF, Cout = 0.1 mF. See Operating Information section for selection of capacitor types.
&RQ¿JXUDWLRQ)LOH &'$
min
input voltage range (VI)
typ
36
turn-off input voltage (VIoff)
decreasing input voltage
32
turn-on input voltage (VIon)
increasing input voltage
34
internal input capacitance (CI)
max
units
75
V
33
34
V
35
36
11
0
HI¿FLHQF\ dž
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
power dissipation (Pd)
max IO
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output power (PO)
264
94.7
94.5
95.2
94.8
15.5
V
Nj)
W
%
%
%
%
22
W
IO = 0 A, VI = 53 V
VI = 53 V (turned off with RC)
switching frequency (fs)
0-100% of max IO
output voltage setting and accuracy (VOi)
TP1 = +25°C, VI = 53 V, IO = 12 A
11.88
output voltage tolerance band
(VO)
0-100% of max IO
idling voltage (VO)
IO = 0 A
line regulation (VO)
max IO
load regulation (VO)
VI = 53 V, 1-100% of max IO
load transient voltage deviation
(Vtr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&out = 2.2 mF OSCON type
±350
mV
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&out = 2.2 mF OSCON type
200
µs
ramp-up time (tr) - (from
í RI9Oi)
10-100% of max IO
8
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
10-100% of max IO
23
ms
VI shut-down fall time (tf) (from VI off to 10% of VO)
max IO
IO = 0 A
0.7
6
ms
s
RC start-up time (tRC)
max IO
12
ms
RC shut-down fall time (tRC) (from RC off to 10% of VO)
max IO
IO = 0 A
3
6
ms
s
DI
SC
ON
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input idling power (Pli)
input standby power (PRC)
output current (IO)
current limit threshold (Ilim)
VO = 10.8 V, TP1 < max TP1
W
W
180
kHz
12.12
V
11.76
12.24
V
11.88
12.12
V
12.0
100
200
mV
30
100
mV
0
24
short circuit current (Isc)
TP1 = 25ºC, see Note 1
recommended capacitive load
(Cout)
TP1 = 25ºC, see Note 2
output ripple & noise (VOac)
See ripple & noise section, VOi
over voltage protection (OVP)
TP1 = +25°C, VI = 53 V, 10-100 % of max IO
remote control (RC)
sink current (note 3), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
Note
3.5
0.4
25
22
A
26
A
1.1
0
2.2
6
mF
50
100
mVp-p
0.7
mA
V
V
15.6
2.6
2.9
1: OCP in hic-up mode
2: Low ESR-value
3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function.
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date 11/07/2014 Ϳ page 6 of 30
Typical Characteristics
12 V, 22 A, 264 W
Efficiency
Power Dissipation
100
ED
[W]
20
[%]
16
95
36 V
90
53 V
85
36 V
12
48 V
48 V
8
75 V
53 V
75 V
4
NU
80
0
75
0
5
10
15
20
25 [A]
Efficiency vs. load current and input voltage at T P1 = +25°C.
Output Characteristics
0
5
10
15
20
25 [A]
Dissipated power vs. load current and input voltage at
T P1 = +25°C.
Current Limit Characteristics
[V]
[V]
12.20
TI
15.00
12.10
36 V
48 V
12.00
SC
ON
53 V
75 V
11.90
11.80
0
5
10
15
20
25 [A]
DI
Output voltage vs. load current at T P1 = +25°C.
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12.00
36 V
9.00
48 V
53 V
6.00
75 V
3.00
0.00
15
18
21
24
27 [A]
Output voltage vs. load current at I O > max I O , T P1 = +25°C.
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Typical Characteristics
12 V, 22 A, 264 W
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (50 V/div).
Time scale: (5 mS/div)
Shut-down enabled by disconnecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 22 A resistive load.
IN
Start-up enabled by connecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 22 A resistive load.
Shut-down
UE
D
Start-up
Output Load Transient Response
SC
ON
T
Output Ripple & Noise
Output voltage ripple at:
T P1 = +25°C, V I = 53 V,
I O = 22 A resistive load.
Trace: output voltage (20 mV/div).
Time scale: (2 uS/div).
Output voltage response to load current step- Top trace: output voltage (0.5 V/div).
change (5.5 – 16.5 – 5.5 A) at:
Bottom trace: load current (5 A/div).
T P1 =+25°C, V I = 53 V. C O = 2.2 mF.
Time scale: (0.5 mS/div)
DI
Input Voltage Transient Response
Output voltage response to input voltage
transient at: T P1 = +25°C, V I = 36-75 V,
I O = 11 A resistive load, C O = 2.2 mF
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (50 V/div).
Time scale: (2 mS/div).
Top trace: output voltage (2 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (0.5 ms/div.).
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Typical Characteristics
12 V, 22 A, 264 W
[A]
25
ED
Output Current Derating – Open frame
3.0 m/s
20
2.0 m/s
15
1.5 m/s
1.0 m/s
10
0.5 m/s
5
0
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
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Nat. Conv.
Thermal Resistance – Base plate
[A]
25
[°C/W]
TI
3.0 m/s
6
20
5
2.0 m/s
15
4
1.5 m/s
3
1.0 m/s
CO
N
10
0.5 m/s
5
Nat. Conv.
0
0
20
40
60
80
2
1
0
0.0
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate + Heat sink
[A]
25
DI
S
20
20
10
0.5 m/s
5
0
20
40
60
80
2.5
3.0 [m/s]
Tamb
85°C
15
10
5
Nat. Conv.
0
2.0
A
25
1.0 m/s
1.5
Output Current Derating – Cold wall sealed box
2.0 m/s
1.5 m/s
1.0
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per the Thermal
consideration section. V I = 53 V.
3.0 m/s
15
0.5
0
100 [°C]
0
Available load current vs. base plate temperature.
V I = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
20
40
60
80
100 [°C]
Available load current vs. base plate temperature at 85ºC ambient.
V I = 53 V. See Thermal Consideration section.
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Electrical Specification
12 V, 25 A, 300 W
TP1 = -40 to +90ºC, VI = 40 to 60 V.
Typical values given at: TP1 = +25°C, VI= 53 VI max IOXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
Additional Cout = 0.1 mF. See Operating Information section for selection of capacitor types.
&RQ¿JXUDWLRQ)LOH &'$
conditions/description
min
typ
max
units
60
V
ED
parameter
input voltage range (VI)
40
turn-off input voltage (VIoff)
decreasing input voltage
36
37
38
V
turn-on input voltage (VIon)
increasing input voltage
38
39
40
V
internal input capacitance (CI)
11
output power (PO)
0
HI¿FLHQF\ dž
power dissipation (Pd)
max IO
input idling power (Pli)
IO = 0 A, VI = 53 V
95.2
94.6
95.1
94.5
NU
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
Nj)
300
17
%
%
%
%
24
4.4
VI = 53 V (turned off with RC)
0-100% of max IO
output voltage setting and accuracy (VOi)
TP1 = +25°C, VI = 53 V, IO = 12 A
11.88
output voltage tolerance band
(VO)
0-100% of max IO
11.76
TI
input standby power (PRC)
switching frequency (fs)
W
W
W
0.4
W
180
kHz
12.0
V
12.24
V
idling voltage (VO)
IO = 0 A
line regulation (VO)
max IO
load regulation (VO)
VI = 53 V, 1-100% of max IO
load transient voltage deviation
(Vtr)
VI = 53 V, load step 25-75-25% of max Io, di/dt =
$NjV&out = 2.5 mF OSCON type
±300
mV
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max Io, di/dt =
$NjV&out = 2.5 mF OSCON type
250
µs
ramp-up time (tr) - (from
í RI9Oi)
10-100% of max IO
8
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
10-100% of max IO
23
ms
VI shut-down fall time (tf) (from VI off to 10% of VO)
max IO
IO = 0 A
0.7
6
ms
s
RC start-up time (tRC)
max IO
14
ms
RC shut-down fall time (tRC) (from RC off to 10% of VO)
max IO
IO = 0 A
4
6
ms
s
DI
S
CO
N
11.88
12.12
output current (IO)
V
220
mV
45
100
mV
0
current limit threshold (Ilim)
TP1 < max TP1
short circuit current (Isc)
TP1 = 25ºC, see Note 1
recommended capacitive load
(Cout)
TP1 = 25ºC, see Note 2
output ripple & noise (VOac)
See ripple & noise section, VOi
over voltage protection (OVP)
TP1 = +25°C, VI = 53 V, 10-100 % of max IO
remote control (RC)
sink current (note 3), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
Note
12.12
50
27
25
30
33
1.1
0
A
A
2.5
10
mF
70
140
mVp-p
15.6
2.6
2.9
1: OCP in hic-cup mode
2: Low ESR-value
3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function.
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A
V
0.7
mA
V
V
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date 11/07/2014 Ϳ page 10 of 30
Typical Characteristics
12 V, 25 A, 300 W
Power Dissipation
[%]
100
[W]
20
95
16
40 V
90
53 V
85
60 V
80
40 V
12
53 V
8
60 V
4
75
5
10
15
20
0
25 [A]
0
5
10
15
20
25 [A]
NU
0
ED
Efficiency
Dissipated power vs. load current and input voltage at
T P1 = +25°C.
Efficiency vs. load current and input voltage at T P1 = +25°C.
Output Characteristics
Current Limit Characteristics
[V]
[V]
12.20
15.00
12.10
12.00
TI
40 V
12.00
11.90
53 V
9.00
60 V
6.00
53 V
60 V
3.00
0
0.00
CO
N
11.80
5
10
15
20
25
30 [A]
DI
S
Output voltage vs. load current at T P1 = +25°C.
cui.com
15
20
25
40 V
30
35 [A]
Output voltage vs. load current at I O > max I O , T P1 = +25°C.
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date 11/07/2014 Ϳ page 11 of 30
Typical Characteristics
12 V, 25 A, 300 W
Shut-down
Start-up enabled by connecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 25 A resistive load.
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (50 V/div).
Time scale: (10 mS/div)
Shut-down enabled by disconnecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 25 A resistive load.
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (20 V/div).
Time scale: (1 mS/div).
Output Load Transient Response
SC
ON
TI
Output Ripple & Noise
NU
ED
Start-up
Output voltage ripple at:
T P1 = +25°C, V I = 53 V,
I O = 25 A resistive load.
Trace: output voltage (20 mV/div).
Time scale: (2 uS/div).
Output voltage response to load current step- Top trace: Output voltage (500 mV/div).
change (6.25-18.75 -6.25 A) at:
Bottom trace: load current (10 A/div).
T P1 =+25°C, V I = 53 V.
Time scale: (0.5 mS/div)
DI
Input Voltage Transient Response
Output voltage response to input voltage
transient at: T P1 = +25°C, V I = 40-60 V,
I O = 25 A resistive load, C O = 3.3 mF
Top trace: output voltage (2 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (0.5 ms/div.).
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date 11/07/2014 Ϳ page 12 of 30
Typical Characteristics
12 V, 25 A, 300 W
Output Current Derating – Open frame
[A]
25
2.0 m/s
15
1.5 m/s
ED
3.0 m/s
20
1.0 m/s
10
0.5 m/s
5
Nat. Conv.
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
NU
0
Thermal Resistance – Base plate
[°C/W]
[A]
25
3.0 m/s
20
5
4
TI
2.0 m/s
6
1.5 m/s
15
10
5
3
0.5 m/s
2
Nat. Conv.
1
SC
ON
0
1.0 m/s
0
20
40
60
80
0
100 [°C]
0.0
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate + Heat sink
10
DI
5
20
40
60
2.0
2.5
3.0 [m/s]
[A]
30
2.0 m/s
25
1.5 m/s
20
1.0 m/s
15
0.5 m/s
10
Nat. Conv.
Tamb
85°C
5
0
0
0
1.5
Output Current Derating – Cold wall sealed box
3.0 m/s
15
1.0
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per the Thermal
consideration section. V I = 53 V.
[A]
25
20
0.5
80
100 [°C]
0
Available load current vs. base plate temperature.
V I = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
20
40
60
80
100 [°C]
Available load current vs. base plate temperature at 85ºC ambient.
V I = 53 V. See Thermal Consideration section.
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date 11/07/2014 Ϳ page 13 of 30
Electrical Specification
12.45 V, 22 A, 261 W
TP1 = -40 to +90ºC, VI = 36 to 75V.
Typical values given at: TP1 = +25°C, VI = 53 V, max IOXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
Additional Cin= 0.1 mF, Cout = 0.1 mF. See Operating Information section for selection of capacitor types.
&RQ¿JXUDWLRQ)LOH &'$
parameter
conditions/description
min
36
turn-off input voltage (VIoff)
decreasing input voltage
turn-on input voltage (VIon)
increasing input voltage
max
units
75
V
33
34
V
35
36
ED
input voltage range (VI)
typ
32
34
internal input capacitance (CI)
11
output power (PO)
0
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
power dissipation (Pd)
max IO
94.7
94.5
95.2
94.8
NU
HI¿FLHQF\ dž
261
15.3
21
V
Nj)
W
%
%
%
%
W
input idling power (Pli)
IO = 0 A, VI = 53 V
3.5
W
input standby power (PRC)
VI = 53 V (turned off with RC)
0.4
W
switching frequency (fs)
0-100% of max IO
180
kHz
output voltage setting and accuracy (VOi)
TP1 = +25°C, VI = 53 V, IO = 0 A
output voltage tolerance band
(VO)
0-100% of max IO
line regulation (VO)
max IO
load regulation (VO)
VI = 53 V, 1-100% of max IO
load transient voltage deviation
(Vtr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&out = 2.2 mF OSCON type
±350
mV
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&out = 2.2 mF OSCON type
200
µs
ramp-up time (tr) - (from
í RI9Oi)
10-100% of max IO
23
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
10-100% of max IO
38
ms
VI shut-down fall time (tf) (from VI off to 10% of VO)
max IO
IO = 0 A
0.7
6
ms
s
RC start-up time (tRC)
max IO
26
ms
RC shut-down fall time (tRC) (from RC off to 10% of VO)
max IO
IO = 0 A
3.5
6
ms
s
TI
SC
ON
output current (IO)
VO = 10.8 V, TP1 < max TP1
short circuit current (ISC)
TP1 = 25ºC, see Note 1
DI
current limit threshold (Ilim)
recommended capacitive load
(COut)
TP1 = 25ºC, see Note 2
output ripple & noise (VOac)
See ripple & noise section, VOi
over voltage protection (OVP)
TP1 = +25°C, VI = 53 V, 10-100 % of max IO
remote control (RC)
sink current (note 3), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
Note
12.415
12.45
12.485
V
12.7
V
100
250
mV
600
700
mV
11.5
450
0
24
22
25
0
A
A
2.2
6
mF
50
150
mVp-p
15.6
2.6
2.9
1: OCP in hic-cup mode
2: Low ESR-value
3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function.
cui.com
26
7
A
V
0.7
mA
V
V
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date 11/07/2014 Ϳ page 14 of 30
Typical Characteristics
12.45 V, 40 A / 476 W, two products in parallel
Power Dissipation
[W]
45
40
35
30
25
20
15
10
5
0
[%]
100
95
36 V
90
48 V
53 V
85
75 V
80
75
10
20
30
40
36 V
48 V
53 V
75 V
0
[A]
10
20
30
NU
0
ED
Efficiency
40
[A]
Dissipated power vs. load current and input voltage at
T P1 = +25°C
Efficiency vs. load current and input voltage at T P1 = +25°C
Output Characteristics
Current Limit Characteristics
[V]
13.0
[V]
12.6
12.5
11.0
12.4
36 V
TI
36 V
12.3
12.2
12.1
48 V
9.0
53 V
7.0
75 V
48 V
53 V
75 V
5.0
12.0
SC
ON
11.9
3.0
11.8
0
10
20
30
40
40
[A]
Output voltage vs. load current at T P1 , T P3 = +25°C
DI
5VCTVWR
Start-up enabled by connecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 40 A resistive load.
42
44
46
48
50
52 [A]
Output voltage vs. load current at I O > max I O , T P1 , T P3 = +25°C
1WVRWV.QCF6TCPUKGPV4GURQPUG
Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (20 ms/div.).
Output voltage response to load current
step-change (10-30-10 A) at:
T P1 = +25°C, V I = 53 V, C O = 2.2 mF.
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Top trace: output voltage (0.5 V/div.).
Bottom trace: output current (20 A/div.).
Time scale: (0.5 ms/div.).
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date 11/07/2014 Ϳ page 15 of 30
Typical Characteristics
12.45 V, 22 A, 261 W
Output Current Derating – Open frame
[A]
25
2.0 m/s
15
1.5 m/s
ED
3.0 m/s
20
1.0 m/s
10
0.5 m/s
5
Nat. Conv.
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
NU
0
Thermal Resistance – Base plate
[A]
25
[°C/W]
3.0 m/s
20
5
4
TI
2.0 m/s
6
15
1.5 m/s
3
1.0 m/s
10
2
0.5 m/s
5
1
0
0
CO
N
Nat. Conv.
20
40
60
80
0
0.0
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate + Heat sink
[A]
25
20
15
DI
S
10
20
0
20
40
60
80
2.5
3.0 [m/s]
Tamb
85°C
15
10
5
Nat. Conv.
0
2.0
A
25
0.5 m/s
5
1.5
Output Current Derating – Cold wall sealed box
2.0 m/s
1.0 m/s
1.0
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per the Thermal
consideration section. V I = 53 V.
3.0 m/s
1.5 m/s
0.5
0
100 [°C]
0
Available load current vs. base plate temperature.
V I = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
20
40
60
80
100 [°C]
Available load current vs. base plate temperature at 85ºC ambient.
V I = 53 V. See Thermal Consideration section.
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date 11/07/2014 Ϳ page 16 of 30
Electrical Specification
12.45 V, 25 A, 296 W
TP1 = -40 to +90ºC, VI = 40 to 60 V.
Typical values given at: TP1 = +25°C, VI = 53 V, max IOXQOHVVRWKHUZLVHVSHFL¿HGXQGHUFRQGLWLRQV
Additional Cout = 0.1 mF. See Operating Information section for selection of capacitor types.
&RQ¿JXUDWLRQ)LOH &'$
parameter
conditions/description
min
typ
40
max
units
60
V
ED
input voltage range (VI)
turn-off input voltage (VIoff)
decreasing input voltage
36
37
38
V
turn-on input voltage (VIon)
increasing input voltage
38
39
40
V
internal input capacitance (CI)
11
output power (PO)
0
power dissipation (Pd)
max IO
input idling power (Pli)
IO = 0 A, VI = 53 V
NU
95.2
94.6
95.1
94.5
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
HI¿FLHQF\ dž
Nj)
296
17
W
%
%
%
%
24
4.4
W
W
input standby power (PRC)
VI = 53 V (turned off with RC)
switching frequency (fs)
0-100% of max IO
output voltage setting and accuracy (VOi)
TP1 = +25°C, VI = 53 V, IO = 0 A
output voltage tolerance band
(VO)
0-100% of max IO
line regulation (VO)
max IO
load regulation (VO)
VI = 53 V, 1-100% of max IO
load transient voltage deviation
(Vtr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&Out = 2.5 mF OSCON type
±300
mV
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&Out = 2.5 mF OSCON type
250
µs
ramp-up time (tr) - (from
í RI9Oi)
10-100% of max IO
23
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
10-100% of max IO
38
ms
VI shut-down fall time (tf) (from VI off to 10% of VO)
max IO
IO = 0 A
0.7
6
ms
s
RC start-up time (tRC)
max IO
14
ms
RC shut-down fall time (tRC) (from RC off to 10% of VO)
max IO
IO = 0 A
4
6
ms
s
TI
CO
N
400
DI
S
TP1 < max TP1
12.45
12.485
V
12.7
V
50
220
mV
500
700
mV
0
27
short circuit current (ISC)
TP1 = 25ºC, see Note 1
recommended capacitive load
(COut)
TP1 = 25ºC, see Note 2
output ripple & noise (VOac)
See ripple & noise section, VOi
over voltage protection (OVP)
TP1 = +25°C, VI = 53 V, 10-100 % of max IO
remote control (RC)
sink current (note 3), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
Note
W
kHz
11.5
output current (IO)
current limit threshold (Ilim)
12.415
0.4
180
30
25
A
33
A
11
0
2.5
10
mF
70
140
mVp-p
0.7
mA
V
V
15.6
2.6
2.9
1: OCP in hic-cup mode, rms value were recorded.
2: Low ESR-value
3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function.
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V
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 11/07/2014 Ϳ page 17 of 30
Typical Characteristics
12.45 V, 45 A, 533 W, 2 products in parallel
Power Dissipation
[%]
100
[W]
20
95
16
40 V
90
53 V
85
20
30
40
0
50 [A]
0
10
20
30
40
50 [A]
Dissipated power vs. load current and input voltage at
T P1 = +25°C.
Efficiency vs. load current and input voltage at T P1 = +25°C.
Output Characteristics
NU
10
60 V
4
75
0
53 V
8
60 V
80
40 V
12
ED
Efficiency
Current Limit Characteristics
[V]
12.60
[V]
15.00
12.40
40 V
53 V
12.20
12.00
40 V
9.00
TI
60 V
12.00
53 V
6.00
60 V
3.00
11.80
0.00
12
24
36
48
60 [A]
20
SC
ON
0
Output voltage vs. load current at T P1 = +25°C.
DI
Start-up
Start-up enabled by connecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 25 A resistive load.
30
40
50
60
70 [A]
Output voltage vs. load current at I O > max I O , T P1 = +25°C.
Output Load Transient Response
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (50 V/div).
Time scale: (10 mS/div)
Output voltage response to load current step- Top trace: Output voltage (500 mV/div).
change (6.25-18.75 -6.25 A) at:
Bottom trace: load current (10 A/div).
T P1 =+25°C, V I = 53 V.
Time scale: (0.5 mS/div)
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date 11/07/2014 Ϳ page 18 of 30
Typical Characteristics
12.45 V, 25 A, 296 W
Output Current Derating – Open frame
[A]
25
2.0 m/s
15
1.5 m/s
ED
3.0 m/s
20
1.0 m/s
10
0.5 m/s
5
Nat. Conv.
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
NU
0
Thermal Resistance – Base plate
[°C/W]
[A]
25
3.0 m/s
20
2.0 m/s
15
1.5 m/s
5
0
20
40
60
80
4
3
0.5 m/s
2
Nat. Conv.
1
0
100 [°C]
0.0
SC
ON
0
5
TI
1.0 m/s
10
6
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate + Heat sink
3.0 m/s
15
10
5
DI
40
60
80
2.0
2.5
3.0 [m/s]
[A]
30
25
1.5 m/s
20
1.0 m/s
15
0.5 m/s
10
0
20
1.5
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per the Thermal
consideration section. V I = 53 V.
2.0 m/s
Nat. Conv.
0
1.0
Output Current Derating – Cold wall sealed box
[A]
25
20
0.5
100 [°C]
Tamb
85°C
5
0
0
Available load current vs. base plate temperature.
V I = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
20
40
60
80
100 [°C]
Available load current vs. base plate temperature at 85ºC ambient.
V I = 53 V. See Thermal Consideration section.
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date 11/07/2014 Ϳ page 19 of 30
EMC Specification
Conducted EMI measured according to EN55022, CISPR
22 and FCC part 15J (see test set-up). The fundamental
switching frequency is 180 kHz for NEB at VI = 53 V, max
IO .
Test set-up
ED
Conducted EMI Input terminal value (typ)
EMI without filter
NU
Layout recommendations
The radiated EMI performance of the product will depend
on the PWB layout and ground layer design. It is also
important to consider the stand-off of the product. If a
ground layer is used, it should be connected to the output
of the product and the equipment ground or chassis.
A ground layer will increase the stray capacitance in the
PWB and improve the high frequency EMC performance.
2SWLRQDOH[WHUQDO¿OWHUIRUFODVV%
6XJJHVWHGH[WHUQDOLQSXW¿OWHULQRUGHUWRPHHWFODVV%LQ
EN 55022, CISPR 22 and FCC part 15J.
C4
L1
C2
+
C3
+
Module
R
SC
ON
C1
L2
TI
0
Filter components:
C1 = 1 µF
C2 = 1 µF + 220 µF
C3 = 1 µF + 220 µF
C4 = 2.2 nF
C5 = 2.2 nF
L1 = 0.81 mH
L2 = 0.81 mH
Output ripple and noise
2XWSXWULSSOHDQGQRLVHPHDVXUHGDFFRUGLQJWR¿JXUH
below.
-
C5
-
DI
0
EMI with filter
Output ripple and noise test setup
Operating Information
Power Management Overview
This product includes protection features that
continuously safeguard the load from damage due to
unexpected system faults.
Input Voltage
The NEB consists of two different product families
designed for two different input voltage ranges, 36 to 75
Vdc and 40 to 60 Vdc, see ordering information. The input
voltage range 36 to 75 Vdc meets the requirements of the
European Telecom Standard ETS 300 132-2 for normal
LQSXWYROWDJHUDQJHLQ±DQG±9GFV\VWHPVWR
9DQG±WR9UHVSHFWLYHO\$WLQSXWYROWDJHV
exceeding 75 V, the power loss will be higher than at
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Input Voltage (Continued)
normal input voltage and TP1 must be limited to absolute
max +125°C. The absolute maximum continuous input
voltage is 80 Vdc. The input voltage range 40 to 60 Vdc
meets the requirements for normal input voltage range
in -48 V systems, -40.5 to -57.0 V. At input voltages
exceeding 60 V, the power loss will be higher than at
normal input voltage and TP1 must be limited to absolute
max +125°C. The absolute maximum continuous input
voltage is 65 Vdc.
date 11/07/2014 Ϳ page 20 of 30
CO
N
TI
Remote Control (RC)
7KHSURGXFWVDUH¿WWHGZLWKDUHPRWHFRQWUROIXQFWLRQ
The remote control is referenced to the primary negative
input connection (-In). The RC function allows the
converter to be turned on/off by an external device like
a semiconductor or mechanical switch. The RC pin has
an internal pull up resistor. The device should be capable
of sinking 0.7 mA. When the RC pin is left open, the
voltage generated on the RC pin
is max 6 V. The standard product
is provided with “negative logic”
remote control and will be off until
the RC pin is connected to the -In.
To turn on the product the voltage
between RC pin and -In should
be less than 1 V. To turn off the
product the RC pin should be left
open for a minimum of time 150
µs, the same time requirement
applies when the product shall turn
on. In situations where it is desired
to have the product to power up
automatically without the need for control signals or a
VZLWFKWKH5&SLQFDQEHZLUHGGLUHFWO\WR±,Q
Parallel Operation (Droop Load Share, DLS)
The NEB DLS products are variants that can be connected
LQSDUDOOHO7KHSURGXFWVKDYHDSUHFRQ¿JXUHGYROWDJH
droop: The stated output voltage set point is at no load.
The output voltage will decrease when the load current
is increased. The voltage will droop 0.6 V while load
reaches max load. This feature allows the products to
be connected in parallel and share the current with 10%
accuracy. Up to 90% of max output current can be used
from each product.
NU
Turn-off Input Voltage
The product monitors the input voltage and will turn
on and turn off at predetermined levels. The minimum
hysteresis between turn on and turn off input voltage is 2
V.
ED
dynamic load changes. Ceramic capacitors will also
reduce any high frequency noise at the load. It is equally
important to use low resistance and low inductance PWB
layouts and cabling. External decoupling capacitors will
become part of the product’s control loop. The control
loop is optimized for a wide range of external capacitance
and the maximum recommended value that could be used
without any additional analysis is found in the electrical
VSHFL¿FDWLRQ
The ESR of the capacitors is a very important parameter.
6WDEOHRSHUDWLRQLVJXDUDQWHHGZLWKDYHUL¿HG(65YDOXH
RI!PDFURVVWKHRXWSXWFRQQHFWLRQV
For further information please contact your local CUI
Power Modules representative.
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Input and Output Impedance
The impedance of both the input source and the load will
interact with the impedance of the product. It is important
that the input source has low characteristic impedance.
Minimum recommended external input capacitance is
100 µF. The performance in some applications can be
enhanced by addition of external capacitance as described
under External Decoupling Capacitors.
External Decoupling Capacitors
:KHQSRZHULQJORDGVZLWKVLJQL¿FDQWG\QDPLFFXUUHQW
requirements, the voltage regulation at the point of load
can be improved by addition of decoupling capacitors
at the load. The most effective technique is to locate
low ESR ceramic and electrolytic capacitors as close to
the load as possible, using several parallel capacitors
to lower the effective ESR. The ceramic capacitors will
handle high-frequency dynamic load changes while the
electrolytic capacitors are used to handle low frequency
Feed Forward Capability
The NEB products have a feed forward function
implemented that can handle sudden input voltage
changes. The output voltage will be regulated during an
input transient and will typically stay within 10% when an
input transient is applied.
Soft-start Power Up
The rise time of the ramp up is 10 ms. When starting by
applying input voltage the control circuit boot-up time
adds an additional 15 ms delay.
7KH'/6YDULDQWVKDYHDSUHFRQ¿JXUHGUDPSXSWLPHRI
25 ms.
Temperature Protection (OTP, UTP)
The products are protected from thermal overload by an
internal temperature shutdown protection. When TP1 as
GH¿QHGLQWKHUPDOFRQVLGHUDWLRQVHFWLRQLVH[FHHGHGWKH
product will shut down. The product will make continuous
attempts to start up and resume normal operation
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
Over Current Protection (OCP)
The product includes current limiting circuitry for
protection at continuous overload. The setting for the
product is hic-up mode if the maximum output current
is exceeded and the output voltage is below 0.3×Vout.
Above the trip voltage the product will continue to
operate while maintaining the output current at the
maximum output current. The load distribution should be
designed for the maximum output short circuit current
VSHFL¿HG
TI
Droop Load Share variants (DLS) will enter hic-up mode,
with a trip voltage, 0.04×Vout. Above the trip voltage the
product will continue to operate while maintaining the
output current at the maximum output current.
General
The product is designed to operate in different thermal
HQYLURQPHQWVDQGVXI¿FLHQWFRROLQJPXVWEHSURYLGHGWR
ensure reliable operation. For products mounted on a PWB
without a heat sink attached, cooling is achieved mainly by
conduction, from the pins to the host board, and convection,
ZKLFKLVGHSHQGDQWRQWKHDLUÀRZDFURVVWKHSURGXFW
,QFUHDVHGDLUÀRZHQKDQFHVWKHFRROLQJRIWKHSURGXFW7KH
Output Current Derating graph found in the output section for
each model provides the available output current vs. ambient
air temperature and air velocity at VI =53 V. The product is
tested on a 254 x 254 mm, 35 µm (1 oz), 16-layer test board
mounted vertically in a wind tunnel with a cross-section of
608 x 203 mm
ED
Over Voltage Protection (OVP)
The product includes over voltage limiting circuitry for
protection of the load. The OVP limit is 30% above the
nominal output voltage.
The response from an over voltage fault is to immediately
shut down. The device will continuously check for the
presence of the fault condition, and when the fault
condition no longer exists the device will be re-enabled.
Thermal Consideration
NU
Temperature Protection (OTP, UTP) (Continued)
automatically when the temperature has dropped below
WKHWHPSHUDWXUHWKUHVKROG WKHK\VWHUHVLVLVGH¿QHGLQ
JHQHUDOHOHFWULFDOVSHFL¿FDWLRQ7KHSURGXFWDOVRKDVDQ
under temperature protection.
date 11/07/2014 Ϳ page 21 of 30
CO
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Input Over/Under voltage protection
The input of the product is protected from high input
voltage and low input voltage.
Pre-bias Start-up Capability
The product has a Pre-bias start up functionality and will
not sink current during start up if a Pre-bias source is
present at the output terminals. If the Pre-bias voltage
is lower than the target value, the product will ramp up
to the target value. If the Pre-bias voltage is higher than
the target value, the product will ramp down to the target
value and in this case sink current for a limited time.
For products with base plate used in a sealed box/cold wall
application, cooling is achieved mainly by conduction through
the cold wall. The Output Current Derating graphs are found
in the output section for each model. The product is tested in
a sealed box test set up with ambient temperatures 85, 55
and 25°C.
13.4
13.4
13.2
13.2
13.0
13.0
12.8
12.8
Vout [V]
Vout [V]
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Output Voltage Regulation
The NEB products are designed to be fully regulated
within the plotted area. Operating outside this area is not
recommended.
12.6
12.4
12.6
12.4
12.2
12.2
12.0
12.0
35
45
55
65
75
Vin [V]
Vin range: 36-75Vdc
35 40
45 50 55
60 65
Vin [V]
Vin range:40-60Vdc
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
Description
P1
PWB (reference point, open
TP1=125º C
frame and base-plate)
Max temperature
P2
Opto-coupler
TP2=105º C
P3
Secondary MOSFET
TP3=125º C
P4
Magnetic Core
TP4=125º C
For products with base plate the maximum allowed
ambient temperature can be calculated by using the
thermal resistance.
1. The power loss is calculated by using the formula
dž îRXWSXWSRZHU SRZHUORVVHV 3d).
dž HI¿FLHQF\RISURGXFW(J
2. Find the thermal resistance (Rth) in the Thermal
Resistance graph found in the Output section for each
model. Note that the thermal resistance can be
VLJQL¿FDQWO\UHGXFHGLIDKHDWVLQNLVPRXQWHGRQWKH
WRSRIWKHEDVHSODWH
&DOFXODWHWKHWHPSHUDWXUHLQFUHDVH ¨7
¨7 5th x Pd
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Position
Ambient Temperature Calculation
ED
'H¿QLWLRQRISURGXFWRSHUDWLQJWHPSHUDWXUH
The product operating temperature is used to monitor
the temperature of the product, and proper thermal
FRQGLWLRQVFDQEHYHUL¿HGE\PHDVXULQJWKHWHPSHUDWXUH
at positions P1, P2, P3 and P4. The temperature at these
positions (TP1, TP2, TP3, TP4) should not exceed the
maximum temperatures in the table below. The number
of measurement points may vary with different thermal
design and topology. Temperatures above maximum TP1,
measured at the reference point P1 (both for openframe
and base plate versions) are not allowed and may cause
permanent damage.
date 11/07/2014 Ϳ page 22 of 30
3. Max allowed ambient temperature is:
Max TP1¨7
E.g. NEB-264 at 2m/s:
1. ((1/0.945) - 1) × 264 W = 15.4 W
TI
2. 15.4 W × 3.4°C/W = 52°C
SC
ON
&±& PD[DPELHQWWHPSHUDWXUHLV&
The actual temperature will be dependent on several
factors such as the PWB size, number of layers and
GLUHFWLRQRIDLUÀRZ
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%HVWDLUÀRZGLUHFWLRQLVIURPQHJDWLYHWRSRVLWLYHSLQV
Pin
Designation
Function
1
+In
Positive Input
2
RC
Remote Control
4
-In
Negative Input
5
-Out
Negative Output
16
+Out
Positive Output
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 11/07/2014 Ϳ page 23 of 30
Table 1.
X1 = Ordering information
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Top View
Pin Positions According To Recommended Footprint
ED
Mechanical Information - Hole Mount, Open Frame Version
PIN SPECIFICATIONS
Pin 1-5 Material: Copper alloy
Plating: Min Au 0.1 µm over 1-3 µm Ni.
Pin 5 Material: Brass
Plating: Min Au 0.2 µm over 1-3 µm Ni.
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Stand-off to none conductive
components min 0.15mm [0.006]
Stand-off to conductive components
min 1.25mm [0.049]
Pin position 3 not present due to case
to ground pin not available on NEB
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Recommended Footprint - Top View
Recommended keep away area for user components.
The stand-off in combination with insulating material ensures that requirements
as per IEC/EN/UL60950 are met and 2250 V isolation maintained even if open
vias or traces are present under the DC/DC converter.
cui.com
Weight: Typical 26 g
All dimensions: mm [inch]
Tolerances: x.x ±0.50 [0.02], x.xx ±0.25 [0.01]
(not applied on footprint or typical values)
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 11/07/2014 Ϳ page 24 of 30
NU
Top View
Pin Positions According To Recommended Footprint
ED
Mechanical Information - Hole Mount, Base Plate Version
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Table 1.
X1 = Ordering Information
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Recommended Footprint - Top View
Recommended keep away area for user components.
The stand-off in combination with insulating material ensures that requirements
as per IEC/EN/UL60950 are met and 2250 V isolation maintained even if open
vias or traces are present under the DC/DC converter.
cui.com
CASE
Material: Aluminum
For screw attachment apply mounting
torque of max 0.44 Nm [3.9 lbf in].
M3 screws must not protrude more than
2.7mm [0.106] into the base plate.
PIN SPECIFICATIONS
Pin 1-5 Material: Copper alloy
Plating: Min Au 0.1 µm over 1-3 µm Ni.
Stand-off to none conductive
components min 0.15mm [0.006]
Stand-off to conductive components
min 1.25mm [0.049]
Pin position 3 not present due to case
to ground pin not available on NEB
Weight: Typical 38 g
All dimensions: mm [inch]
Tolerances:
x.x ±0.50 [0.02]
x.xx ±0.25 [0.01]
(not applied on footprint or typical values)
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 11/07/2014 Ϳ page 25 of 30
ED
Mechanical Information - Surface Mount Version
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ON
TI
NU
Top View
Pin Positions According To Recommended Footprint
Recommended Footprint - Top View
PIN SPECIFICATIONS
Pin 1-5 Material: Copper alloy
Plating: Min Au 0.1 µm over 1-3 µm Ni.
Pin position 3 not present due to case
to ground pin not available on NEB
DI
Stand-off to none conductive
components min 0.15mm [0.006]
Stand-off to conductive components
min 1.25mm [0.049]
Weight: Typical 24 g
All dimensions: mm [inch]
Tolerances:
x.x ±0.50 [0.02]
x.xx ±0.25 [0.01]
(not applied on footprint or typical values)
Recommended keep away area for user components.
The stand-off in combination with insulating material ensures that requirements
as per IEC/EN/UL60950 are met and 2250 V isolation maintained even if open
vias or traces are present under the DC/DC converter.
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
Soldering Information - Surface Mounting
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (TPIN)
in excess of the solder melting temperature (TL, 217 to
221°C for SnAgCu solder alloys) for more than 60 seconds
and a peak temperature of 245°C on all solder joints is
recommended to ensure a reliable solder joint.
The surface mount product is intended for forced
FRQYHFWLRQRUYDSRUSKDVHUHÀRZVROGHULQJLQ6Q3EDQG
Pb-free processes.
7KHUHÀRZSUR¿OHVKRXOGEHRSWLPLVHGWRDYRLGH[FHVVLYH
heating of the product. It is recommended to have
DVXI¿FLHQWO\H[WHQGHGSUHKHDWWLPHWRHQVXUHDQ
even temperature across the host PWB and it is also
UHFRPPHQGHGWRPLQLPL]HWKHWLPHLQUHÀRZ
Maximum Product Temperature Requirements
ED
Top of the product PWB near pin 2 is chosen as reference
location for the maximum (peak) allowed product
temperature (TPRODUCT) since this will likely be the warmest
SDUWRIWKHSURGXFWGXULQJWKHUHÀRZSURFHVV
$QRFOHDQÀX[LVUHFRPPHQGHGWRDYRLGHQWUDSPHQWRI
FOHDQLQJÀXLGVLQFDYLWLHVLQVLGHWKHSURGXFWRUEHWZHHQ
the product and the host board, since cleaning residues
may affect long time reliability and isolation voltage.
SnPb solder processes
)RU6Q3EVROGHUSURFHVVHVWKHSURGXFWLVTXDOL¿HGIRU06/
1 according to IPC/JEDEC standard J STD 020C.
Typical solder melting (liquidus)
temperature
TL
Minimum reflow time above T L
3°C/s max
3°C/s max
183°C
221°C
60 s
60 s
Minimum pin temperature
T PIN
210°C
235°C
Peak product temperature
T PRODUCT
225°C
260°C
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General reflow process specifications SnPb eutectic Pb-free
Average ramp-up (T PRODUCT )
date 11/07/2014 Ϳ page 26 of 30
'XULQJUHÀRZ7PRODUCT must not exceed 225 °C at any time.
Pb-free solder processes
)RU3EIUHHVROGHUSURFHVVHVWKHSURGXFWLVTXDOL¿HGIRU
MSL 3 according to IPC/JEDEC standard J-STD-020C.
6°C/s max
6°C/s max
Maximum time 25°C to peak
6 minutes
8 minutes
'XULQJUHÀRZ7PRODUCT must not exceed 260 °C at any time.
Dry Pack Information
3URGXFWVLQWHQGHGIRU3EIUHHUHÀRZVROGHULQJSURFHVVHV
are delivered in standard moisture barrier bags according
to IPC/JEDEC standard J STD 033 (Handling, packing,
VKLSSLQJDQGXVHRIPRLVWXUHUHÀRZVHQVLWLYLW\VXUIDFH
mount devices).
TI
Average ramp-down (T PRODUCT )
Temperature
TPRODUCT maximum
TPIN minimum
Pin
profile
Product
profile
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TL
Time in preheat
/ soak zone
Time 25°C to peak
Time in
reflow
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In
case the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J STD 033.
Time
Minimum Pin Temperature Recommendations
Pin number 5 chosen as reference location for the
minimum pin temperature recommendation since this will
OLNHO\EHWKHFRROHVWVROGHUMRLQWGXULQJWKHUHÀRZSURFHVV
Thermocoupler Attachment
Top of PWB near pin 2 for measurement of maximum
product temperature, TPRODUCT
DI
SnPb solder processes
For SnPb solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature, (TL, 183°C
for Sn63Pb37) for more than 60 seconds and a peak
temperature of 220°C is recommended to ensure a reliable
solder joint.
For dry packed products only: depending on the type of
VROGHUSDVWHDQGÀX[V\VWHPXVHGRQWKHKRVWERDUGXSWR
a recommended maximum temperature of 245°C could be
used, if the products are kept in a controlled environment
(dry pack handling and storage) prior to assembly.
Pin 5 for measurement of minimum pin (solder joint)
temperature, TPIN
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 11/07/2014 Ϳ page 27 of 30
Soldering Information - Hole Mounting
The hole mounted product is intended for plated through
hole mounting by wave or manual soldering. The pin
WHPSHUDWXUHLVVSHFL¿HGWRPD[LPXPWR&IRU
maximum 10 seconds.
ED
A maximum preheat rate of 4°C/s and maximum preheat
temperature of 150°C is suggested. When soldering by
hand, care should be taken to avoid direct contact between
the hot soldering iron tip and the pins for more than a few
seconds in order to prevent overheating.
Delivery Package Information
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$QRFOHDQÀX[LVUHFRPPHQGHGWRDYRLGHQWUDSPHQWRI
FOHDQLQJÀXLGVLQFDYLWLHVLQVLGHWKHSURGXFWRUEHWZHHQ
the product and the host board. The cleaning residues may
affect long time reliability and isolation voltage.
The products are delivered in antistatic injection molded
trays (Jedec design guide 4.10D standard) and in antistatic
trays
Tray Specifications– SMD /Pin in paste
Antistatic PPE
Surface resistance
Tray thickness
105 < Ohm/square < 1012
The trays can be baked at maximum
125°C for 48 hours
17.40 mm 0.685 [ inch]
Box capacity
100 products (5 full trays/box)
Tray weight
125 g empty, 605 g full tray
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Bakability
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Material
JEDEC standard tray for 2x5 = 10 products.
All dimensions in mm [inch]
Tolerances: X.x ±0.26 [0.01], X.xx ±0.13 [0.005]
Note: pick up positions refer to center of pocket.
See mechanical drawing for exact location on product.
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 11/07/2014 Ϳ page 28 of 30
Tray Specifications - Through hole Version
105 < Ohm/square < 1012
The trays are not bakeable
25 converters/tray
75 products (3 full trays/box)
Product – Open frame
790 g full tray, 140g empty tray
Product – Base plate option
1090 g full tray, 140 g empty tray
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Weight
PE Foam, dissipative
ED
Material
Surface
resistance
Bakability
Tray capacity
Box capacity
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 11/07/2014 Ϳ page 29 of 30
Product Qualification Specification
Characteristics
IPC-A-610
Change of temperature
(Temperature cycling)
IEC 60068-2-14 Na
Temperature range
Number of cycles
Dwell/transfer time
-40 to 100°C
500
15 min/0-1 min
Cold (in operation)
IEC 60068-2-1 Ad
Temperature T A
Duration
-45°C
72 h
Damp heat
IEC 60068-2-67 Cy
Temperature
Humidity
Duration
Dry heat
IEC 60068-2-2 Bd
Temperature
Duration
Electrostatic discharge
susceptibility
IEC 61340-3-1, JESD 22-A114
IEC 61340-3-2, JESD 22-A115
Human body model (HBM)
Machine Model (MM)
Class 2, 2000 V
Class 3, 200 V
Immersion in cleaning solvents
IEC 60068-2-45 XA, method 2
Water
Glycol ether
Isopropyl alcohol
55°C
35°C
35°C
Mechanical shock
IEC 60068-2-27 Ea
Moisture reflow sensitivity 1
J-STD-020C
Operational life test
MIL-STD-202G, method 108A
Resistance to soldering heat 2
IEC 60068-2-20 Tb, method 1A
Robustness of terminations
IEC 60068-2-21 Test Ua1
IEC 60068-2-21 Test Ue1
IEC 60068-2-20 test Ta 2
Vibration, broad band random
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Level 1 (SnPb-eutectic)
Level 3 (Pb Free)
225°C
260°C
Duration
1000 h
Solder temperature
Duration
270°C
10-13 s
Through hole mount products
Surface mount products
All leads
All leads
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
150°C dry bake 16 h
215°C
235°C
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
Steam ageing
235°C
245°C
Frequency
Spectral density
Duration
10 to 500 Hz
0.07 g2/Hz
10 min in each direction
12QO\IRUSURGXFWVLQWHQGHGIRUUHÀRZVROGHULQJ VXUIDFHPRXQWSURGXFWV
2 Only for products intended for wave soldering (plated through hole products)
DI
Notes:
IEC 60068-2-64 Fh, method 1
125°C
1000 h
100 g
6 ms
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1
85°C
85 % RH
1000 hours
Peak acceleration
Duration
TI
IEC 60068-2-58 test Td
Solderability
ED
External visual inspection
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CUI Inc Ϳ SERIES: NEB-N Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 11/07/2014 Ϳ page 30 of 30
REVISION HISTORY
rev.
date
1.02
11/07/2014
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The revision history provided is for informational purposes only and is believed to be accurate.
Headquarters
20050 SW 112th Ave.
Tualatin, OR 97062
800.275.4899
Fax 503.612.2383
cui.com
techsupport@cui.com
Novum and Architects of Modern Power are trademarks of CUI.
All other trademarks are the property of their respective owners.
CUI offers a two (2) year limited warranty. Complete warranty information is listed on our website.
CUI reserves the right to make changes to the product at any time without notice. Information provided by CUI is believed to be accurate and reliable. However, no responsibility is
assumed by CUI for its use, nor for any infringements of patents or other rights of third parties which may result from its use.
CUI products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any component of a
life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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