CBC012-D5C-WP

EnerChip™ CBC012 Rechargeable Solid State Energy Storage: 12µAh, 3.8V Features • • • • • • All Solid State Construction SMT Package and Process Lead-Free Reflow Tolerant Thousands of Recharge Cycles Low Self-Discharge Eco-friendly, RoHS compliant 5 mm x 5 mm DFN SMT Package 2.8 mm x 3.5 mm Bare Die Electrical Properties Output voltage (nominal): Capacity (nominal): Charging source: Recharge time to 80%: Charge/discharge cycles: Physical Properties Package size (DFN): Operating temperature: Storage temperature: 3.8V 12µAh 4.00V to 4.15V 10 minutes >5000 to 10% DOD 5 mm x 5 mm x 0.9 mm -20°C to 70°C -40°C to 125°C The EnerChip™ CBC012 is a surface-mount, solid state, thin film, rechargeable energy storage device rated for 12µAh at 3.8V. It is ideal as a localized on-board power source for SRAMs, real-time clocks and microcontrollers which require standby power to retain time or data. It is also suitable for RFID tags, smart sensors, and remote applications which require a miniature, low-cost, and rugged power source. For many applications, the CBC012 is a superior alternative to button cell batteries and super-capacitors. Because of their solid state design, EnerChip™ storage devices are able to withstand solder reflow temperatures and can be processed in highvolume manufacturing lines similar to conventional semiconductor devices. There are no harmful gases, liquids or special handling procedures, in contrast to traditional rechargeable batteries. The CBC012 is based on a patented, all solid state, rechargeable energy cell with a nominal 3.8V output. Recharge is fast and simple, with a direct connection to a 4.1V voltage source and no current limiting components. Recharge time is 10 minutes to 80% capacity. Robust design offers thousands of charge/ discharge cycles. The CBC012 is packaged in a 5 mm x 5 mm 6-pin DFN package. It is shipped in tubes, tape-and-reel, or waffle pack trays. Applications • Standby supply for non-volatile SRAM, real-time clocks, controllers, supply supervisors, and other system-critical components. • Wireless sensors and RFID tags and other powered, low duty cycle applications. • Localized power source to keep microcontrollers and other devices alert in standby mode. • Power bridging to provide backup power to system during exchange of primary batteries. • Embedded Energy where bare die can be embedded into modules or co-packaged with other ICs Pin Number(s) 1 2,3,4,5 6 Description VNIC V+ 65 + 4 1 2 3 CBC012 Schematic Representation Top View Note: NIC = No Internal Connection DS-72-02 Rev A ©2009-2010 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com Page 1 of 5 EnerChip™ CBC012 Solid State Energy Storage Operating Characteristics Parameter Discharge Cutoff Voltage Charge Voltage Pulse Discharge Current Cell Resistance (25°C) Self-Discharge (5-yr average; 25°C) Operating Temperature Storage Temperature Recharge Cycles (to 80% of rated capacity; 4.1V charge voltage) 25°C 40°C Condition 25°C 25°C 25°C Charge cycle 2 Charge cycle 1000 Non-recoverable Recoverable 10% depth-of-discharge 50% depth-of discharge 10% depth-of-discharge 50% depth-of-discharge Charge cycle 2 Charge cycle 1000 50µA discharge; 25°C Min 3.0(1) 4.0 -20 -40 5000 1000 2500 500 12 (2) Typical 4.1 2.8 13 2.5 1.5 25 10 45 (4) Max 4.3 4.5 20 +70 +125(5) 22 70 - Units V V µA kΩ % per year % per year °C °C cycles cycles cycles cycles minutes µAh 100(3) Recharge Time (to 80% of rated capacity; 4.1V charge voltage) Capacity (1) (2) (3) (4) (5) Failure to cutoff the discharge voltage at 3.0V will result in EnerChip performance degradation. Charging at 4.0V will charge the cell to approximately 70% of its rated capacity. Typical pulse duration = 20 milliseconds. First month recoverable self-discharge is 4% average. Storage temperature is for uncharged EnerChip. Note: All specifications contained within this document are subject to change without notice EnerChip Discharge Characteristics DS-72-02 Rev A ©2009-2010Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com Page 2 of 5 EnerChip™ CBC012 Solid State Energy Storage Package Dimensions - 6-pin DFN (package code D5) Pin Number(s) 1 2,3,4,5 6 Description VNIC V+ Notes: 1. All linear dimensions are in millimeters. 2. Drawing is subject to change without notice. Note: NIC = No Internal Connection Printed Circuit Board (PCB) Layout Guidelines and Recommendations Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering power to an integrated circuit in low power mode. Therefore, solder flux must be thoroughly washed from the board following soldering. The PCB layout can make this problem worse if the cell’s positive and negative terminals are routed near each other and under the package, where it is difficult to wash the flux residue away. An undesirable example is shown in Figure 1. The negative connection on the EnerChip is routed from the negative pad to a via placed under the package near the positive pad. In this scenario, solder flux residue can wick from the positive solder pad, covering both the positive pad and the via. This results in a high resistance current path between the EnerChip terminals. This current path will make the cell appear to be defective or make the application circuit appear to be drawing too much current. To avoid this situation, make sure positive and negative traces are routed outside of the package footprint, as shown in Figure 2, to ensure that flux residue will not cause a discharge path between the positive and negative pads. Similarly, a leakage current path can exist from the package lead solder pads to the exposed die pad on the underside of the package as well as any solder pad on the PCB that would be connected to that exposed die pad during the reflow solder process. Therefore, it is strongly recommended that the PCB layout not include a solder pad in the region where the exposed die pad of the package will land. It is sufficient to place PCB solder pads only where the package leads will be. That region of the PCB where the exposed die pad will land must not have any solder pads, traces, or vias. DS-72-02 Rev A ©2009-2010Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com Page 3 of 5 EnerChip™ CBC012 Solid State Energy Storage When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside of the package and all metal pads. Failure to observe this precaution can result in package cracking during solder reflow due to the silk screen material interfering with the solder solidification process during cooling. Figure 1: Improper PCB traces resulting in an undesirable parasitic leakage path. Figure 2: Proper PCB traces, precluding the formation of a parasitic leakage path. For the CBC012-D5C the PCB layout of Figure 3 is recommended. Note that there should not be a center pad on the PCB that could contact the exposed die pad on the D5C package. Again, this is to reduce the possible number and severity of leakage paths between the EnerChip terminals. Figure 3: Recommended PCB layout to accommodate CBC012 package Soldering, Rework, and Electrical Test Refer to the Cymbet User Manual for soldering, rework, and replacement of the EnerChip on printed circuit boards, and for instructions on in-circuit electrical testing of the EnerChip. DS-72-02 Rev A ©2009-2010Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com Page 4 of 5 EnerChip™ CBC012 Solid State Energy Storage Ordering Information EnerChip Part Number CBC012-D5C CBC012-D5C-TR CBC012-D5C-WP CBC012-BDC-WP CBC012-BUC-WP Description 12µAh EnerChip in 6-pin M8 DFN, tube 12µAh EnerChip in 6-pin M8 DFN, Tape/Reel 12µAh EnerChip in 6-pin M8 DFN, Waffle Pack 12µAh EnerChip Bare Die, Waffle Pack 12µAh EnerChip Bumped Bare Die, Waffle Pack Notes Package for new designs Package for new designs Package for new designs Contact Cymbet Contact Cymbet Disclaimer of Warranties; As Is The information provided in this data sheet is provided “As Is” and Cymbet Corporation disclaims all representations or warranties of any kind, express or implied, relating to this data sheet and the Cymbet EnerChip product described herein, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, non-infringement, title, or any warranties arising out of course of dealing, course of performance, or usage of trade. Cymbet EnerChip products are not approved for use in life critical applications. Users shall confirm suitability of the Cymbet EnerChip product in any products or applications in which the Cymbet EnerChip product is adopted for use and are solely responsible for all legal, regulatory, and safety-related requirements concerning their products and applications and any use of the Cymbet EnerChip product described herein in any such product or applications. Cymbet, the Cymbet Logo and EnerChip are trademarks of Cymbet Corporation. All Rights Reserved DS-72-02 Rev A ©2009-2010Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com Page 5 of 5