BCM20735KFBG

Please note that Cypress is an Infineon Technologies Company. The document following this cover page is marked as “Cypress” document as this is the company that originally developed the product. Please note that Infineon will continue to offer the product to new and existing customers as part of the Infineon product portfolio. Continuity of document content The fact that Infineon offers the following product as part of the Infineon product portfolio does not lead to any changes to this document. Future revisions will occur when appropriate, and any changes will be set out on the document history page. Continuity of ordering part numbers Infineon continues to support existing part numbers. Please continue to use the ordering part numbers listed in the datasheet for ordering. www.infineon.com CYW20735B1 Single-Chip Bluetooth Transceiver for Wireless Input Devices CYW20735B1 Single-Chip Bluetooth Transceiver for Wireless Input Devices The Cypress CYW20735B1 is a Bluetooth 5.0-compliant, SoC for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20735B1 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth solutions. The CYW20735B1 is the optimal solution for applications in wireless input devices including game controllers, remote controls, keyboards, and joysticks or any Bluetooth connected IoT application that needs 12 dBm transmit power such as lighting. Features Bluetooth Subsystem ■ ■ Complies with Bluetooth core specification version 5.0 with LE 2-Mbps support ■ Supports Basic Rate (BR) and Bluetooth Low Energy (BLE) ■ Supports Adaptive Frequency Hopping (AFH) ■ Programmable TX power up to 12 dBm ■ Rx sensitivity -94.5 dBm (BLE) ■ Ultra-low-power radio ❐ ❐ RX current 8 mA TX current 18 mA @ 12 dBm Coexistence Support ■ Support for Global Coexistence Interface for easy coexistence implementation with select Cypress Wi-Fi devices MCU Subsystem ■ Supports serial wire debug (SWD) ■ Runs Bluetooth stack and application Peripherals and Communication ■ 6x 16-bit PWMs ■ Programmable key-scan matrix interface, up to 8x20 keyscanning matrix ■ Quadrature decoder ■ Watchdog timer ■ 1x peripheral UART, 1x UART for programming and HCI ■ 1x SPI (master or salve mode) ■ 1x I2C master ■ One ADC (10-ENoB for DC measurement and 12-ENOB for Audio measurement) ■ Hardware security engine General Purpose Input Output (GPIO) 96-MHz ARM Cortex-M4 microcontroller unit MCU with floating point unit (FPU) ■ ■ 24 general purpose I/Os ■ 2 dedicated pins for analog microphone ■ Support 1.7 V to 3.63 V operation ■ Four GPIOs support 16 mA and 8 mA source at 3.3 V and 1.8 V respectively Memory Subsystem ■ 384 KB RAM ■ 2 MB ROM that stores Bluetooth stack and drives and offloads flash for user applications Operating voltage and low-power support ■ Wide operating voltage range - 1.625 V to 3.63V ■ 4 power modes to implement ultra-low power application managed by real time operating system ■ 1 uA current in HID-Off mode Audio features and interfaces ■ 1x I2S with master and slave modes ■ 1x PCM ■ PDM ■ Analog front end for analog microphone Packages ■ On-chip 32 kHz oscillator ■ On-chip 128 kHz oscillator ■ 32 kHz crystal oscillator ■ 24 MHz crystal oscillator Cypress Semiconductor Corporation Document Number: 002-14881 Rev. *L 7 mm x7 mm 60-pin quad flat no-lead (QFN) Software Support Clocks ■ 32-bit real time clock (RTC) ■ • 198 Champion Court WICED Studio • San Jose, CA 95134-1709 • 408-943-2600 Revised August 10, 2021 CYW20735B1 Applications ■ Game controllers ■ 3D glasses ■ Wireless pointing devices (mice) ■ Blood pressure monitors ■ Remote controls ■ Find-me devices ■ Wireless keyboards ■ Heart-rate monitors ■ Joysticks ■ Proximity sensors ■ Home automation ■ Thermometers ■ Point-of-sale input devices Functional Block Diagram Figure 1. Functional Block Diagram Microcontroller Sub-System Bluetooth Core PA RF BT5.0 PHY RAM 320KB BT5.0 MAC ARM® Cortex® M4 96MHz w/ FPU Clocks XTAL OSC 24MHz Patch RAM 64KB Debug UART/SWD HP-LPO 32kHz LP-LPO 16/32/128kHz Watchdog AHB Bus Matrix XTAL OSC 32kHz ROM 2MB Patch Control Peripherals ADC TRNG GPIOs (24) Core DC-DC IR TRIAC I2C Master RF LDO PWM (x6) Timer Analog MIC Digital LDO 3D Glass 3-Axis Quad. UART PA LDO Keyscan PCM/I2S (x2) Q-SPI (x2) Power Management Coexistence Interface (GCI) Document Number: 002-14881 Rev. *L I/ O M U X PDM Page 2 of 45 CYW20735B1 Contents 1. Bluetooth Baseband Core ........................................... 4 1.1 Link Control Layer ................................................. 4 1.2 Test Mode Support ................................................ 5 1.3 Frequency Hopping Generator .............................. 5 1.4 Microprocessor Unit .............................................. 6 1.5 Power Management Unit ....................................... 8 1.6 Integrated Radio Transceiver ................................ 9 1.7 Peripheral Transport Unit .................................... 10 1.8 Peripheral UART Interface .................................. 11 1.9 Clock Frequencies ............................................... 12 1.10 GPIO Ports ........................................................ 13 1.11 Keyboard Scanner ............................................. 14 1.12 Mouse Quadrature Signal Decoder ................... 15 1.13 ADC Port ........................................................... 15 1.14 PWM .................................................................. 16 1.15 Triac Control ...................................................... 16 1.16 Serial Peripheral Interface ................................. 16 1.17 Infrared Modulator ............................................. 17 1.18 PDM Microphone ............................................... 17 1.19 Security Engine ................................................. 18 1.20 Power Management Unit ................................... 18 Document Number: 002-14881 Rev. *L 2. Pin Assignments and GPIOs ..................................... 19 2.1 Pin Assignments .................................................. 19 2.2 GPIO Pin Descriptions ........................................ 21 2.3 Pinouts ................................................................ 24 3. Specifications ............................................................. 25 3.1 Electrical Characteristics ..................................... 25 3.4 Timing and AC Characteristics ............................ 34 4. Mechanical Information ............................................. 40 4.1 Package Diagrams .............................................. 40 4.2 Tray Packaging Specifications ............................ 41 5. Ordering Information .................................................. 42 6. Additional Information ............................................... 42 6.1 IoT Resources ..................................................... 42 6.2 Acronyms and Abbreviations ............................... 42 Document History Page ................................................ 43 Sales, Solutions, and Legal Information ..................... 45 Worldwide Sales and Design Support ....................... 45 Products .................................................................... 45 PSoC® Solutions ....................................................... 45 Cypress Developer Community ................................. 45 Technical Support ..................................................... 45 Page 3 of 45 CYW20735B1 1. Bluetooth Baseband Core The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high-performance Bluetooth operation. The BBC manages the buffering, segmentation, and routing of data for all connections. It also buffers data that passes through it, handles data flow control, schedules ACL and TX/RX transactions, monitors Bluetooth slot usage, optimally segments and packages data into baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to these functions, it independently handles HCI event types, and HCI command types. Table 1. Bluetooth Features Bluetooth 1.0 Basic Rate Bluetooth 1.2 Bluetooth 2.0 Interlaced Scans – – Adaptive Frequency Hopping – Paging and Inquiry – – Page and Inquiry Scan – – Sniff – – Bluetooth 2.1 Bluetooth 3.0 Bluetooth 4.0 Secure Simple Pairing Unicast Connectionless Data Bluetooth Low Energy Enhanced Inquiry Response Enhanced Power Control – Sniff Subrating – – Bluetooth 4.1 Bluetooth 4.2 Low Duty Cycle Advertising Data Packet Length Extension Dual Mode LE Secure Connection LE Link Layer Topology Link Layer Privacy 1.1 Link Control Layer The link control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the link control unit (LCU). This layer consists of the command controller that takes commands from the software, and other controllers that are activated or configured by the command controller, to perform the link control tasks. Each task is performed in a different state or substate in the Bluetooth Link Controller. ■ BLE states: Advertising ❐ Scanning ❐ Connection ❐ ■ Major states: Standby ❐ Connection ❐ ■ Substates: Page ❐ Page Scan ❐ Inquiry ❐ Inquiry Scan ❐ Sniff ❐ Document Number: 002-14881 Rev. *L Page 4 of 45 CYW20735B1 1.2 Test Mode Support The CYW20735B1 fully supports Bluetooth Test mode as described in Part I:1 of the Specification of the Bluetooth System Version 3.0. This includes the transmitter tests, normal and delayed loopback tests, and reduced hopping sequence. In addition to the standard Bluetooth Test Mode, the CYW20735B1 also supports enhanced testing features to simplify RF debugging and qualification and type-approval testing. These features include: ■ Fixed frequency carrier wave (unmodulated) transmission ❐ Simplifies some type-approval measurements (Japan) ❐ Aids in transmitter performance analysis ■ Fixed frequency constant receiver mode ❐ Receiver output directed to I/O pin ❐ Allows for direct BER measurements using standard RF test equipment ❐ Facilitates spurious emissions testing for receive mode ■ Fixed frequency constant transmission ❐ 8-bit fixed pattern or PRBS-9 ❐ Enables modulated signal measurements with standard RF test equipment 1.3 Frequency Hopping Generator The frequency hopping sequence generator selects the correct hopping channel number based on the link controller state, Bluetooth clock, and device address. Document Number: 002-14881 Rev. *L Page 5 of 45 CYW20735B1 1.4 Microprocessor Unit The CYW20735B1 microprocessor unit runs software from the link control (LC) layer up to the host controller interface (HCI). The microprocessor is a Cortex-M4 32-bit RISC processor with embedded ICE-RT debug and serial wire debug (SWD) interface units. The microprocessor also includes 2 MB of ROM memory for program storage and 384 KB of RAM for data scratch-pad. The internal ROM provides flexibility during power-on reset to enable the same device to be used in various configurations. At powerup, the lower-layer protocol stack is executed from internal ROM. External patches can be applied to the ROM-based firmware to provide flexibility for bug fixes and feature additions. The device also supports the integration of user applications and profiles. 1.4.1 Floating Point Unit CYW20735B1 includes the CM4 single precision IEEE-754 compliant floating point unit. For details see the Cortex-M4 manual. 1.4.2 OTP Memory The CYW20735B1 includes 2 KB of one-time programmable memory that can be used by the factory to store product-specific information. Note: Use of OTP requires that a 3V supply be present at all times. 1.4.3 NVRAM Configuration Data and Storage NVRAM contains configuration information about the customer application, including the following: ■ Fractional-N information ■ BD_ADDR ■ UART baud rate ■ SDP service record ■ File system information used for code, code patches, or data. The CYW20735B1 uses SPI flash for NVRAM storage. 1.4.4 Power-On Reset The CYW20735B1 includes POR logic to allow the part to initialize correctly when power is applied. Figure 2 shows the sequence used by the CYW20735B1 during initialization. An small external cap may be used on RESET_N to add delay as VDDIO ramps up. Document Number: 002-14881 Rev. *L Page 6 of 45 CYW20735B1 1.4.5 External Reset An external active-low reset signal, RESET_N, can be used to put the CYW20735B1 in the reset state. Figure 2. Power-On Reset Timing RESET_N (External) >= 2.4 ms (*1) VDDIO ~190 us (*2) VDDC ~2 LPO cycles VDDIO POR 8 LPO cycles VDDC Reset (Internal) XTAL_PU ~2 LPO cycles ~30 LPO cycles XTAL_BUF_PU *1: External RESET_N is only effective 2.4 ms after VDDIO power is up *2: The latency depends on the value of DEFAULT_STRAP. If DEFAULT_STRAP is high, it’s ~190 us. If DEFAULT_STRAP is low, it’s ~250 us. 1.4.6 Brownout Detection An external voltage detector reset IC may be used if brownout detection is required. The reset IC should release RESET_N only after the VDDO supply voltage level has been at or above a minimum operating voltage for 50 ms or longer. Document Number: 002-14881 Rev. *L Page 7 of 45 CYW20735B1 1.5 Power Management Unit Figure 3 shows the CYW20735B1 power management unit (PMU) block diagram. The CYW20735B1 includes an integrated buck regulator, a capless LDO, PALDO and an additional 1.2V LDO for RF. Figure 3. Power Management Unit PMU CBUCK SR_VDDBAT3V 50 mA SR_VLX SR_VBF DIGLDO DIGLDO_VDDIN1P5 RFLDO_VDDIN1P5 (Capless, with bypass mode) 30 mA RFLDO 20 mA DIGLDO_VDDOUT o_vddout_digldo RFLDO_VDDOUT PMU_AVSS PALDO PALDO_VDDIN_5V NOTE:      Document Number: 002-14881 Rev. *L PALDO_VDDOUT3V = Bump/Ball Page 8 of 45 CYW20735B1 1.6 Integrated Radio Transceiver The CYW20735B1 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth wireless systems. It has been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4 GHz unlicensed ISM band. The CYW20735B1 is fully compliant with the Bluetooth Radio Specification and meets or exceeds the requirements to provide the highest communication link quality of service. 1.6.1 Transmit Path The CYW20735B1 features a fully integrated transmitter. The baseband transmit data is GFSK modulated in the 2.4 GHz ISM band. 1.6.2 Digital Modulator The digital modulator performs the data modulation and filtering required for the GFSK signal. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the transmitted signal. 1.6.3 Power Amplifier The CYW20735B1 has an integrated power amplifier (PA) that can transmit up to +10 dBm for class 1 operations. 1.6.4 Receiver Path The receiver path uses a low-IF scheme to downconvert the received signal for demodulation in the digital demodulator and bit synchronizer. The receiver path provides a high degree of linearity, an extended dynamic range to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology, with built-in out-of-band attenuation, enables the CYW20735B1 to be used in most applications with minimal off-chip filtering. 1.6.5 Digital Demodulator and Bit Synchronizer The digital demodulator and bit synchronizer takes the low-IF received signal and performs an optimal frequency tracking and bitsynchronization algorithm. 1.6.6 Receiver Signal Strength Indicator The radio portion of the CYW20735B1 provides a receiver signal strength indicator (RSSI) signal to the baseband, so that the controller can take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether the transmitter should increase or decrease its output power. 1.6.7 Local Oscillator A local oscillator (LO) generation provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels. The CYW20735B1 uses an internal loop filter. 1.6.8 Calibration The CYW20735B1 radio transceiver features a self-contained automated calibration scheme. No user interaction is required during normal operation or during manufacturing to provide optimal performance. Calibration compensates for filter, matching network, and amplifier gain and phase characteristics to yield radio performance within 2% of what is optimal. Calibration takes process and temperature variations into account, and it occurs transparently during normal operation and hop setting times. Document Number: 002-14881 Rev. *L Page 9 of 45 CYW20735B1 1.7 Peripheral Transport Unit 1.7.1 I2C Compatible Master The CYW20735B1 provides a 2-pin master I2C to communicate with peripherals such as trackball or touch-pad modules, and motion tracking ICs used in mouse devices. The BSC interface is compatible with I2C slave devices. I2C does not support multimaster capability or flexible wait-state insertion by either master or slave devices. The following transfer clock rates are supported by I2C: ■ 100 kHz ■ 400 kHz ■ 800 kHz (Not a standard I2C-compatible speed.) ■ 1 MHz (Compatibility with high-speed I2C-compatible devices is not guaranteed.) The following transfer types are supported by BSC: ■ Read (Up to 8 bytes can be read.) ■ Write (Up to 8 bytes can be written.) ■ Read-then-Write (Up to 8 bytes can be read and up to 8 bytes can be written.) ■ Write-then-Read (Up to 8 bytes can be written and up to 8 bytes can be read.) Hardware controls the transfers, requiring minimal firmware setup and supervision. The clock pin (SCL) and data pin (SDA) are both open-drain I/O pins. Pull-up resistors external to the CYW20735B1 are required on both the SCL and SDA pins for proper operation. 1.7.2 HCI UART Interface The CYW20735B1 includes a UART interface for factory programming and when operating as a BT HCI device in a system with an external host. The UART physical interface is a standard, 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 57600 bps to 6 Mbps. During initial boot, UART speeds may be limited to 750 kbps. The baud rate may be selected via a vendorspecific UART HCI command. The CYW20735B1 has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support enhanced data rates. The interface supports the Bluetooth UART HCI (H4) specification. The default baud rate for H4 is 115.2 kbaud. The UART clock default setting is 24 MHz, and can be configured to run as high as 48 MHz to support up to 6 Mbps. The baud rate of the CYW20735B1 UART is controlled by two values. The first is a UART clock divisor (set in the DLBR register) that divides the UART clock by an integer multiple of 16. The second is a baud rate adjustment (set in the DHBR register) that is used to specify a number of UART clock cycles to stuff in the first or second half of each bit time. Up to eight UART cycles can be inserted into the first half of each bit time, and up to eight UART clock cycles can be inserted into the end of each bit time. Table 2 on page 10 contains example values to generate common baud rates with a 24 MHz UART clock. Table 2. Common Baud Rate Examples, 24 MHz Clock Baud Rate (bps) Baud Rate Adjustment High Nibble Low Nibble Mode Error (%) 3M 0xFF 0xF8 High rate 0.00 2M 0XFF 0XF4 High rate 0.00 1M 0X44 0XFF Normal 0.00 921600 0x05 0x05 Normal 0.16 460800 0x02 0x02 Normal 0.16 230400 0x04 0x04 Normal 0.16 115200 0x00 0x00 Normal 0.16 57600 0x00 0x00 Normal 0.16 Document Number: 002-14881 Rev. *L Page 10 of 45 CYW20735B1 Table 3 contains example values to generate common baud rates with a 48 MHz UART clock. Table 3. Common Baud Rate Examples, 48 MHz Clock Baud Rate (bps) High Rate Low Rate Mode Error (%) 6M 0xFF 0xF8 High rate 0 4M 0xFF 0xF4 High rate 0 3M 0x0 0xFF Normal 0 2M 0x44 0xFF Normal 0 1.5M 0x0 0xFE Normal 0 1M 0x0 0xFD Normal 0 921600 0x22 0xFD Normal 0.16 230400 0x0 0xF3 Normal 0.16 115200 0x1 0xE6 Normal –0.08 57600 0x1 0xCC Normal 0.04 Support for changing the baud rate during normal HCI UART operation is included through a vendor-specific command that allows the host to adjust the contents of the baud rate registers. The CYW20735B1 UART operates correctly with the host UART as long as the combined baud rate error of the two devices is within ±5%. 1.8 Peripheral UART Interface The CYW20735B1 has a second UART that may be used to interface to peripherals. This peripheral UART is accessed through the optional I/O ports, which can be configured individually and separately for each functional pin. The CYW20735B1 can map the peripheral UART to any LHL GPIO. The peripheral UART clock is fixed at 24 MHz. Both TX and RX have a 256-byte FIFO (see Table 2: “Common Baud Rate Examples, 24 MHz Clock,” on page 11). Document Number: 002-14881 Rev. *L Page 11 of 45 CYW20735B1 1.9 Clock Frequencies The CYW20735B1 uses a 24 MHz crystal oscillator (XTAL). 1.9.1 Crystal Oscillator The XTAL must have an accuracy of ±20 ppm as defined by the Bluetooth specification. Two external load capacitors in the range of 5 pF to 30 pF are required to work with the crystal oscillator. The selection of the load capacitors is XTAL-dependent (see Figure 4). Figure 4. Recommended Oscillator Configuration—12 pF Load Crystal 22 pF XIN Crystal XOUT 20 pF Table 4 shows the recommended crystal specifications. Table 4. Reference Crystal Electrical Specifications Parameter Nominal frequency Oscillation mode Frequency tolerance Conditions Minimum Typical Maximum Unit – 20 24 40 MHz – ppm – Fundamental – @25°C – ±10 Tolerance stability over temp @0°C to +70°C – ±10 – ppm Equivalent series resistance – – – 60 Ω Load capacitance – – 12 – pF Operating temperature range – 0 – +70 °C Storage temperature range – –40 – +125 °C Drive level – – – 200 μW Aging – – ±3 ±10 ppm/year Shunt capacitance – – – 2 pF 1.9.2 HID Peripheral Block The peripheral blocks of the CYW20735B1 all run from a single 128 kHz low-power RC oscillator. The oscillator can be turned on at the request of any of the peripherals. If the peripheral is not enabled, it shall not assert its clock request line. The keyboard scanner is a special case, in that it may drop its clock request line even when enabled, and then reassert the clock request line if a keypress is detected. Document Number: 002-14881 Rev. *L Page 12 of 45 CYW20735B1 1.9.3 32 kHz Crystal Oscillator Figure 5 shows the 32 kHz XTAL oscillator with external components and Table on page 13 lists the oscillator’s characteristics. It is a standard Pierce oscillator using a comparator with hysteresis on the output to create a single-ended digital output. The hysteresis was added to eliminate any chatter when the input is around the threshold of the comparator and is ~100 mV. This circuit can be operated with a 32 kHz or 32.768 kHz crystal oscillator or be driven with a clock input at a similar frequency. The default component values are: R1 = 10 MΩ and C1 = C2 = ~10 pF. The values of C1 and C2 are used to fine-tune the oscillator. Figure 5. 32 kHz Oscillator Block Diagram C2 32.768 kHz XTAL R1 C1 Table 5. XTAL Oscillator Characteristics Parameter Symbol Conditions Minimum Typical Maximum Unit Foscout – – 32.768 – kHz Output frequency Frequency tolerance Start-up time – Crystal-dependent – 100 – ppm Tstartup – – – 500 ms XTAL drive level Pdrv For crystal selection 0.5 – – μW XTAL series resistance Rseries For crystal selection – – 70 kΩ XTAL shunt capacitance Cshunt For crystal selection – – 1.3 pF 1.10 GPIO Ports GPIO ports for this device is shown in Table 7 on page 21. The CYW20735B1 uses 40 general-purpose I/Os (GPIOs). All GPIOs support programmable pull-ups and are capable of driving up to 8 mA at 3.3V or 4 mA at 1.8V, except P26, P27, P28, and P29, which are capable of driving up to 16 mA at 3.3V or 8 mA at 1.8V. P0, P1, P8-P18, P21-23, P28-P38: all of these pins can be programmed as ADC inputs. Port 26–Port 29: all four of these pins are capable of sinking up to 16 mA for LEDs. These pins also have the PWM function, which can be used for LED dimming. Document Number: 002-14881 Rev. *L Page 13 of 45 CYW20735B1 1.11 Keyboard Scanner The keyboard scanner is designed to autonomously sample keys and store them into buffer registers without the need for the host microcontroller to intervene. The scanner has the following features: ■ Ability to turn off its clock if no keys are pressed. ■ Sequential scanning of up to 160 keys in an 8 × 20 matrix. ■ Programmable number of columns from 1 to 20. ■ Programmable number of rows from 1 to 8. ■ 16-byte key code buffer (can be augmented by firmware). ■ 128 kHz clock that allows scanning of full 160-key matrix in about 1.2 ms. ■ N-key rollover with selective 2-key lockout if ghost is detected. ■ Keys are buffered until host microcontroller has a chance to read it, or until overflow occurs. ■ Hardware debouncing and noise/glitch filtering. ■ Low-power consumption. Single-digit µA-level sleep current. 1.11.1 Theory of Operation The key scan block is controlled by a state machine with the following states: 1.11.2 Idle The state machine begins in the idle state. In this state, all column outputs are driven high. If any key is pressed, a transition occurs on one of the row inputs. This transition causes the 128 kHz clock to be enabled (if it is not already enabled by another peripheral) and the state machine to enter the scan state. Also in this state, an 8-bit row-hit register and an 8-bit key-index counter is reset to 0. 1.11.3 Scan In the scan state, a row counter counts from 0 up to a programmable number of rows minus 1. After the last row is reached, the row counter is reset and the column counter is incremented. This cycle repeats until the row and column counters are both at their respective terminal count values. At that point, the state machine moves into the Scan-End state. As the keys are being scanned, the key-index counter is incremented. This counter value is compared to the modifier key codes stored in RAM, or in the key code buffer if the key is not a modifier key. It can be used by the microprocessor as an index into a lookup table of usage codes. Also, as the nth row is scanned, the row-hit register is ORed with the current 8-bit row input values if the current column contains two or more row hits. During the scan of any column, if a key is detected at the current row, and the row-hit register indicates that a hit was detected in that same row on a previous column, then a ghost condition may have occurred, and a bit in the status register is set to indicate this. 1.11.4 Scan End This state determines whether any keys were detected while in the scan state. If yes, the state machine returns to the scan state. If no, the state machine returns to the idle state, and the 128 kHz clock request signal is made inactive. Note: The microcontroller can poll the key status register. Document Number: 002-14881 Rev. *L Page 14 of 45 CYW20735B1 1.12 Mouse Quadrature Signal Decoder The mouse signal decoder is designed to autonomously sample two quadrature signals commonly generated by an optomechanical mouse. The decoder has the following features: ■ Three pairs of inputs for X, Y, and Z (typical scroll wheel) axis signals. Each axis has two options: ❐ For the X axis, choose P2 or P32 as X0 and P3 or P33 as X1. ❐ For the Y axis, choose P4 or P34 as Y0 and P5 or P35 as Y1. ❐ For the Z axis, choose P6 or P36 as Z0 and P7 or P37 as Z1. ■ Control of up to four external high-current GPIOs to power external optoelectronics: ❐ Turn-on and turn-off time can be staggered for each HC-GPIO to avoid simultaneous switching of high currents and having multiple high-current devices on at the same time. ❐ Sample time can be staggered for each axis. ❐ Sense of the control signal can be active high or active low. ❐ Control signal can be tristated for off condition or driven high or low, as appropriate. 1.12.1 Theory of Operation The mouse decoder block has four 10-bit PWMs for controlling external quadrature devices and sampling the quadrature inputs at its core. The GPIO signals may be used to control such items as LEDs, external ICs that may emulate quadrature signals, photodiodes, and photodetectors. 1.13 ADC Port The ADC block is a single switched-cap Σ-Δ ADC core for audio and DC measurement. It operates at the 12 MHz clock rate and has 32 DC input channels, including 28 GPIO inputs. The internal bandgap reference has ±5% accuracy without calibration. Different calibration and digital correction schemes can be applied to reduce ADC absolute error and improve measurement accuracy in DC mode. Document Number: 002-14881 Rev. *L Page 15 of 45 CYW20735B1 1.14 PWM The CYW20735B1 has six internal PWMs. The PWM module consists of the following: ■ PWM0–5. Each of the six PWM channels contains the following registers: ❐ 16-bit initial value register (read/write) ❐ 16-bit toggle register (read/write) ❐ 16-bit PWM counter value register (read) PWM configuration register shared among PWM0–5 (read/write). This 18-bit register is used: ❐ To configure each PWM channel ❐ To select the clock of each PWM channel ❐ To change the phase of each PWM channel Figure 6 shows the structure of one PWM. ■ Figure 6. PWM Block Diagram pwm#_init_val_adr register enable o_flip clk_sel pwm_cfg_adr register pwm#_togg_val_adr register 16 16 pwm#_cntr_adr 16 cntr value is ARM readable pwm_out Example: PWM cntr w/ pwm#_init_val = 0 (dashed line)                 PWM cntr w/ pwm#_init_val = x (solid line)                   16'HFFFF pwm_togg_val_adr 16'Hx 16'H000 pwm_out 1.15 Triac Control The CYW20735B1 includes hardware support for zero-crossing detection and trigger control for up to four triacs. The CYW20735B1 detects zero-crossing on the AC zero detection line and uses that to provide a pulse that is offset from the zero crossing. This allows the CYW20735B1 to be used in dimmer applications, as well as any other applications that require a control signal that is offset from an input event. The zero-crossing hardware includes an option to suppress glitches. 1.16 Serial Peripheral Interface The CYW20735B1 has two independent SPI interfaces, both of which support single, dual, and quad mode SPI operations. Either interface can be a master or a slave. Each interface has a 64-byte transmit buffer and a 64-byte receive buffer. To support more flexibility for user applications, the CYW20735B1 has optional I/O ports that can be configured individually and separately for each functional pin. The CYW20735B1 acts as an SPI master device that supports 1.8V or 3.3V SPI slaves. The CYW20735B1 can also act as an SPI slave device that supports a 1.8V or 3.3V SPI master. Note: SPI voltage depends on VDDO/VDDM; therefore, it defines the type of devices that can be supported. Document Number: 002-14881 Rev. *L Page 16 of 45 CYW20735B1 1.17 Infrared Modulator The CYW20735B1 includes hardware support for infrared TX. The hardware can transmit both modulated and unmodulated waveforms. For modulated waveforms, hardware inserts the desired carrier frequency into all IR transmissions. IR TX can be sourced from firmware-supplied descriptors, a programmable bit, or the peripheral UART transmitter. If descriptors are used, they include IR on/off state and the duration between 1–32767 µsec. The CYW20735B1 IR TX firmware driver inserts this information in a hardware FIFO and makes sure that all descriptors are played out without a glitch due to underrun (see Figure 7). Figure 7. Infrared TX VCC R1 62 D1 INFRARED‐LD CYW20735B1 R2 IR TX 2.4k Q1 MMBTA42 1.18 PDM Microphone The CYW20735B1 accepts a ΣΔ-based one-bit pulse density modulation (PDM) input stream and outputs filtered samples at either 8 kHz or 16 kHz sampling rates. The PDM signal derives from an external kit that can process analog microphone signals and generate digital signals. The digital signal passes through the chip IO and MUX inputs using an auxADC signal. The PDM shares the filter path with the auxADC. Two types of data rates can be supported: ■ 8 kHz ■ 16 kHz The external digital microphone accepts a 2.4 MHz clock generated by the CYW20735B1 and outputs a PDM signal which is registered by the PDM interface with either the rising or falling edge of the 2.4 MHz clock selectable through a programmable control bit. The design can accommodate two simultaneous PDM input channels, so stereo voice is possible. Document Number: 002-14881 Rev. *L Page 17 of 45 CYW20735B1 1.19 Security Engine The CYW20735B1 includes a hardware security accelerator that greatly decreases the time required to perform typical security operations. These functions include: ■ Public key acceleration (PKA) cryptography ■ AES-CTR/CBC-MAC/CCM acceleration ■ SHA2 message hash and HMAC acceleration ■ RSA encryption and decryption of modulus sizes up to 2048 bits ■ Elliptic curve Diffie-Hellman in prime field GF(p) ■ Generic modular math functions 1.20 Power Management Unit The Power Management Unit (PMU) provides power management features that can be invoked by software through power management registers or packet-handling in the baseband core. 1.20.1 RF Power Management The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz transceiver, which then processes the power-down functions accordingly. 1.20.2 Host Controller Power Management Power is automatically managed by the firmware based on input device activity. As a power-saving task, the firmware controls the disabling of the on-chip regulator when in HIDOFF (deep sleep) mode. 1.20.3 BBC Power Management There are several low-power operations for the BBC: ■ Physical layer packet handling turns RF on and off dynamically within packet TX and RX. ■ Bluetooth-specified low-power connection mode. While in these low-power connection modes, the CYW20735B1 runs on the Low Power Oscillator and wakes up after a predefined time period. The CYW20735B1 automatically adjusts its power dissipation based on user activity. The following power modes are supported: ■ Active mode ■ Idle mode ■ Sleep mode ■ HIDOFF (deep sleep) mode The CYW20735B1 transitions to the next lower state after a programmable period of user inactivity. When user activity resumes, the CYW20735B1 immediately enters Active mode. In HIDOFF mode, the CYW20735B1 baseband and core are powered off by disabling power to VDDC_OUT and PAVDD. The VDDO domain remains powered up and will turn the remainder of the chip on when it detects user events. This mode minimizes chip power consumption and is used for longer periods of inactivity. Document Number: 002-14881 Rev. *L Page 18 of 45 CYW20735B1 2. Pin Assignments and GPIOs 2.1 Pin Assignments Table 6. Pin Assignments Pin Name QFN Pin I/O Power Domain Description MIC_AVDD 48 I MIC_AVDD Microphone supply MICBIAS 45 I MIC_AVDD Microphone bias supply MICN 47 I MIC_AVDD Microphone negative input MICP 46 I MIC_AVDD Microphone positive input BT_VDDO 36 I VDDO I/O pad power supply BT_VDDC 37 I VDDC Baseband core power supply LHL_VDDO 60 I VDDO LHL PAD power supply: can be tied to BT_VDDO 26 I PAVDD2P5 PA supply Microphone Baseband Supply RF Power Supply BT_PAVDD2P5 BT_PLLVDD1P2 31 I PLLVDD1P2 RFPLL and crystal oscillator supply BT_VCOVDD1P2 29 I VCOVDD1P2 VCO supply BT_IFVDD1P2 28 I IFVDD1P2 DIGLDO_VDDIN1P5 25 I – Internal digital LDO input and feedback pin of switching regulator (CBUCK). RFLDO_VDDIN1P5 24 I – RF LDO input RFLDO_VDDOUT 23 O – RF LDO output PALDO_VDDIN_5V 19 I – PA LDO input PALDO_VDDOUT3V 20 O – PA LDO output SR_VDDBAT3V 22 I – Core buck input SR_VLX 21 O – Core buck output H I VSS IFPLL power supply Onboard LDOs Ground Pins HS-VSS Digital ground UART UART_CTS_N 44 I, PU VDDO UART_RTS_N 43 O, PU VDDO RTS for HCI UART interface. NC if unused. UART_RXD 41 I VDDO UART serial input. Serial data input for the HCI UART interface. UART_TXD 42 O, PU VDDO UART serial input. Serial data input for the HCI UART interface. 40 I VDDO SPI Master In Slave Out CTS for HCI UART interface: NC if unused. Serial Peripheral Interface SPI_MISO SPI_MOSI 39 O VDDO SPI Master Out Slave In SPI_CSN 38 O VDDO SPI Chip Select SPI_CLK 35 O VDDO SPI Clock BT_XTALI 32 I PLLVDD1P2 Crystal oscillator input: see “Crystal Oscillator” on page 12 for options BT_XTALO 33 O PLLVDD1P2 Crystal oscillator output Crystal Document Number: 002-14881 Rev. *L Page 19 of 45 CYW20735B1 Table 6. Pin Assignments (Cont.) Pin Name QFN Pin I/O Power Domain XTALI_32K 50 I Description VDDO Low-power oscillator input XTALO_32K 49 O VDDO Low-power oscillator output Others DEFAULT_STRAP 18 I VDDO Connect to VDDO BT_HOST_WAKE 34 O VDDO Host wake-up. This is a signal from the Bluetooth device to the host indicating that the Bluetooth device requires attention. ■ Asserted: Host device must wake up or remain awake. Deasserted: Host device may sleep when sleep criteria is met. The polarity of this signal is software configurable and can be asserted high or low. ■ BT_RF 27 I/O PAVDD2P5 JTAG_SEL 17 – – ARM JTAG debug mode control: connect to GND for all applications RST_N 16 I VDDO Active-low system reset with open-drain output and internal pull-up resistor NC 30 Document Number: 002-14881 Rev. *L RF antenna port Leave floating Page 20 of 45 CYW20735B1 2.2 GPIO Pin Descriptions Table 7. GPIO Pin Descriptionsab QFN Pin Number Pin Name Default Direction POR State Power Domain 8 P0 Input Floating VDDO Default Alternate Function Description ■ GPIO: P0 ■ A/D converter input 29 Note: Not available during TM1 = 1. 9 P1 Input Floating VDDO 52 P2 Input Floating VDDO 53 P3 Input Floating 54 P4 Input Floating 55 P5 Input 56 P6 Input 57 P7 58 P8 ■ GPIO: P1 ■ A/D converter input 28 ■ GPIO: P2 VDDO ■ GPIO: P3 VDDO ■ GPIO: P4 Floating VDDO ■ GPIO: P5 Floating VDDO ■ GPIO: P6 Input Floating VDDO ■ GPIO: P7 Input Floating VDDO ■ GPIO: P8 ■ A/D converter input 27 ■ GPIO: P9 ■ A/D converter input 26 ■ GPIO: P10 ■ A/D converter input 25 ■ GPIO: P11 ■ A/D converter input 24 ■ GPIO: P12 ■ A/D converter input 23 ■ GPIO: P13 ■ A/D converter input 22 ■ GPIO: P14 ■ A/D converter input 21 GPIO: P15 1 P9 Input Floating VDDO 2 P10 Input Floating VDDO 3 P11 Input Floating VDDO 4 P12 Input Floating VDDO 5 P13 Input Floating VDDO 59 P14 Input Floating VDDO 50 P15 Input Floating VDDO ■ 51 P16 Input Floating VDDO ■ GPIO: P16 ■ A/D converter input 19 ■ GPIO: P26 ■ Current: 16 mA sink ■ GPIO: P27 ■ Current: 16 mA sink ■ GPIO: P28 ■ A/D converter input 11 ■ Current: 16 mA sink ■ 13 P26 PWM0 Input Floating VDDO 14 P27 PWM1 Input Floating VDDO P28 PWM2 Input 6 Document Number: 002-14881 Rev. *L Floating VDDO A/D converter input 20 Page 21 of 45 CYW20735B1 Table 7. GPIO Pin Descriptionsab (Cont.) QFN Pin Number Pin Name Default Direction POR State Power Domain 7 P29 PWM3 Input Floating VDDO P32 Input 15 Floating VDDO 10 P34 Input Floating VDDO 11 P38 Input Floating VDDO 12 P39 Input Floating VDDO Default Alternate Function Description ■ GPIO: P29 ■ A/D converter input 10 ■ Current: 16 mA sink ■ GPIO: P32 ■ A/D converter input 7 ■ GPIO: P34 ■ A/D converter input 5 ■ GPIO: P38 ■ A/D converter input 1 Reserved for system use. Leave this GPIO unconnected a. All GPIOs are supermux. All GPIOs can be programmed for any alternative functions. For example, key scan, SPI, I2C, IR_TX, quadrature, peripheral UART, ADC, etc. b. During power-on reset, all inputs are disabled. Document Number: 002-14881 Rev. *L Page 22 of 45 CYW20735B1 Table 8. GPIO Supermux Input/Output Function List Function Function Function Function SPI_1: CLK SPI_1: CS SPI_1: MOSI SPI_1: MISO SPI_1: INT SPI_2: CLK SPI_2: CS SPI_2: MOSI SPI_2: MISO SPI_2: INT SPI_3: CLK SPI_3: CS SPI_3: MOSI SPI_3: MISO SPI_3: INT UART_RX UART_CTS UART_TX UART_RTS PUART_RX PUART_CTS PUART_TX PUART_RTS SCL SDA SCL2 SDA2 PCM_IN PCM_OUT PCM_CLK PCM_SYNC I2S_DO I2S_DI I2S_WS I2S_CLK IR_TX kso0 kso1 kso2 kso3 kso4 kso5 kso6 kso7 kso8 kso9 kso10 kso11 kso12 kso13 kso14 kso15 kso16 kso17 kso18 kso19 PWM0 PWM1 PWM2 PWM3 PWM4 PWM5 aclk0 aclk1 pa_ramp tx_pd ~tx_pd – Document Number: 002-14881 Rev. *L Page 23 of 45 CYW20735B1 2.3 Pinouts 2.3.1 60-Pin QFN Package The 60-pin QFN package is shown in Figure 8. Figure 8. CYW20735B1 60-Pin QFN Package MICP MICN MIC_AVDD XTALO_32K P16 P15/XTALI_32K P2 P3 P4 P7 P6 P5 P8 P9 P10 P11 P12 P13 P28 P29 P0 P1 P34 P38 P39 P26 P27 P32 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 H MICBIAS UART_CTS_N UART_RTS_N UART_TXD UART_RXD SPI_MISO SPI_MOSI SPI_CSN BT_VDDC BT_VDDO SPI_CLK BT_HOST_WAKE BT_XTALO BT_XTALI BT_PLLVDD1P2 ͲͲͲ BT_IFVDD1P2 BT_VCOVDD1P2 BT_RF BT_PAVDD2P5 DIGLDO_VDDIN1P5 RFLDO_VDDOUT RFLDO_VDDIN1P5 SR_VDDBAT3V DEFAULT_STRAP PALDO_VDDIN_5V PALDO_VDDOUT3V SR_VLX RST_N HSͲVSS JTAG_SEL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 P14 LHL_VDDO 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Note: Pin H is a ground pin that is used for the signal name HS-VSS. Document Number: 002-14881 Rev. *L Page 24 of 45 CYW20735B1 3. Specifications 3.1 Electrical Characteristics Caution! The absolute maximum ratings in the following table indicate levels where permanent damage to the device can occur, even if these limits are exceeded for only a brief duration. Functional operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-term reliability of the device Table 9. Absolute Maximum Ratings Requirement Parameter Maximum Junction Temperature Specification Min. Nom. Max. – – 125 Unit °C VDD IO –0.5 – 3.795 V VDD RF –0.5 – 1.38 V VDDBAT3V –0.5 – 3.795 V DIGLDO_VDDIN1P5 –0.5 – 1.65 V RFLDO_VDDIN1P5 –0.5 – 1.65 V PALDO_VDDIN_5V –0.5 – 3.795 V MIC_AVDD –0.5 – 3.795 V OTP_3P3V –0.5 – 3.795 V Table 10. ESD/Latchup Requirement Parameter Specification Unit Min. Nom. Max. ESD Tolerance HBM –2000 – 2000 V ESD Tolerance CDM –500 – 500 V – 200 – Latch-up mA Table 11. Environmental Ratings Value Units Operating Temperature Characteristic –30 to +85 °C Storage Temperature –40 to +150 °C Table 12. Recommended Operating Conditions Parameter VDD IOa VDDRF VDDBAT3Va Specification Unit Min. Typ. Max. VSHUTb 3.0 3.63 V 1.14 1.2 1.26 V VSHUTb 3.0 3.63 V PALDO_VDDIN_5V 2.5 3.3 3.63 DIGLDO_VDDIN1P5 1.3 1.35 1.5 V RFLDO_VDDIN1P5 1.3 1.35 1.5 V MIC_AVDD VSHUTb 3.0 3.63 V OTP_3P3V 3.0 3.3 3.63 V a. VDDIO must be greater or equal to VBAT. b. See Table 13. Document Number: 002-14881 Rev. *L Page 25 of 45 CYW20735B1 The CYW20735B1 uses an onboard low voltage detector to shut down the part when supply voltage (VDDBAT3V) drops below operating range. Table 13. Shutdown Voltage Specification Parameter VSHUT Min. Typ. Max. 1.625 1.7 1.775 Unit V 3.1.1 Core Buck Regulator Table 14. Core Buck Regulator Parameter Input supply voltage DC, VBAT Conditions DC voltage range Min. Typ. Max. Unit 1.62 3.0 3.63 V CBUCK output current – – – 65 mA Output voltage range Programmable, 30mV/step default = 1.35V (bits = 0000) 1.2 1.35 1.5 V Output voltage DC accuracy Includes load and line regulation –4 – +4 % LPOM ripple voltage, static Measured with 20 MHz bandwidth limit, static load. Max ripple based on VBAT = 3V, Vout = 1.35V Inductor: 0806 inch-size, Tmax = 1 mm, 2.2 μH ±25%, DCR = 114 mΩ ±20%, ACR Tr Document Number: 002-14881 Rev. *L Page 39 of 45 CYW20735B1 4. Mechanical Information 4.1 Package Diagrams 4.1.1 60-Pin QFN Package Figure 15. CYW20735B1 7 mm × 7 mm 60-Pin QFN Package Document Number: 002-14881 Rev. *L Page 40 of 45 CYW20735B1 4.2 Tray Packaging Specifications 4.2.1 QFN The CYW20735B1 QFN package and tray dimensions are annotated in Figure 16 and defined in Table 29 and Table 30 on page 41. Figure 16. QFN Package and Tray Dimensions Table 29. QFN Package Dimensions and Tolerances Parameter Nom. Min. Max. ± Tol. Unit P1 Package size Description 7 6.9 7.1 0.1 mm P2 Top hat width 0 0 0 – mm P3 Top hat height 0 0 0 – mm P4 Substrate thickness 0.85 0.8 0.9 0.05 mm P7 Total thickness (P3 + P4) 0.85 0.8 0.9 0.05 mm Table 30. QFN Tray Dimensions and Tolerances Parameter Nom. Min. Max. ± Tol. Unit T1 Top pocket size 7.25 7.17 7.33 0.08 mm T3 Top pocket depth 1.75 1.5 2 0.25 mm T5 Stacking height 2 1.87 2.13 0.13 mm T6 Bottom pocket size 7.25 7.17 7.33 0.08 mm T8 Bottom pocket depth 1.650 1.52 1.78 0.13 mm a2 Bottom pocket relief wall draft angle T10 Description Packing value between two stacking trays Document Number: 002-14881 Rev. *L 5 5 5 0 Degrees 0.2 0.07 0.33 0.13 mm Page 41 of 45 CYW20735B1 5. Ordering Information Table 31. Ordering Information Part Number CYW20735PB1KML1G Package Ambient Operating Temperature 60-pin QFN 0°C to 70°C 6. Additional Information 6.1 IoT Resources Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software updates. Customers can acquire technical documentation and software from the Cypress Support Community website (https://community.cypress.com/) 6.2 Acronyms and Abbreviations In most cases, acronyms and abbreviations are defined upon first use. For a more complete list of acronyms and other terms used in Cypress documents, go to: http://www.cypress.com/glossary. The following list of acronyms and abbreviations may appear in this document. Term Term Description Description ADC analog-to-digital converter LV LogicVision™ AFH adaptive frequency hopping MIA multiple interface agent AHB advanced high-performance bus PDM pulse density modulation APB advanced peripheral bus PLL phase locked loop APU audio processing unit PMU power management unit ARM7TDMI-S™ Acorn RISC Machine 7 Thumb instruction, Debugger, Multiplier, Ice, Synthesizable PWM pulse width modulation QD quadrature decoder BSC Broadcom Serial Control RAM random access memory BTC Bluetooth controller RC oscillator COEX coexistence DFU device firmware update A resistor-capacitor oscillator is a circuit composed of an amplifier, which provides the output signal, and a resistor-capacitor network, which controls the frequency of the signal. DMA direct memory access EBI external bus interface RF radio frequency HCI Host Control Interface ROM HV high voltage read -only memory IDC initial digital calibration IF intermediate frequency IRQ interrupt request JTAG Joint Test Action Group LCU link control unit LDO RX/TX receive, transmit SPI serial peripheral interface SW software SWD serial wire debug UART universal asynchronous receiver/transmitter low drop-out UPI µ-processor interface LHL lean high land WD watchdog LPO low power oscillator Document Number: 002-14881 Rev. *L Page 42 of 45 CYW20735B1 Document History Page Document Title: CYW20735B1, Single-Chip Bluetooth Transceiver for Wireless Input Devices Document Number: 002-14881 Revision ECN Submission Date ** – 05/19/2015 20735-DS100-R Initial release. *A – 10/13/2015 20735-DS101-R See the release for the applicable change description. *B – 11/09/2015 20735-DS102-R Updated: Table 3: “Reference Crystal Electrical Specifications,” on page 21. Section 5: “Ordering Information,” on page 60: updated the part number for the QFN chip. *C – 12/04/2015 20735-DS103-R Updated: Table 3: “Reference Crystal Electrical Specifications,” on page 22. Table 9: “Core Buck Regulator,” on page 45. Table 10: “Digital LDO,” on page 46. Table 11: “PA LDO,” on page 47. Table 12: “RF LDO,” on page 48. Table 13: “Digital I/O Characteristics,” on page 49. Table 14: “BLE Current Consumption,” on page 49. Table 19: “UART Timing Specifications,” on page 54. Added: • “Tray Packaging Specifications” on page 60. Removed • Table 15: “BR Current Consumption,” on page 48. • “Tape and Reel Packaging Specifications,” on page 59. *D – 03/10/2016 20735-DS104-R Updated: Table 14: “BLE Current Consumption,” on page 46. *E – 05/26/2016 20735-DS105-R Updated: Table8:“Absolute Maximum Ratings,” on page42. Table13:“Core Buck Regulator,” on page44. Table14:“Digital LDO,” on page45. Table15:“PA LDO,” on page46. Table16:“RF LDO,” on page47. Table19:“ADC Microphone Specifications,” on page49. Added: “Table 9:“ESD/Latchup,” on page42. Table10:“Environmental Ratings,” on page43. Table11:“Recommended Operating Conditions,” on page43. Table12:“Shutdown Voltage,” on page43. “Power-On Reset” on page14. “Brownout Detection” on page14. *F 5446946 09/29/2016 Updated to Cypress template. *G 5688133 05/22/2017 Updated Specifications: Updated Timing and AC Characteristics: Updated UART Timing: Updated Table 24. Updated BSC Interface Timing: Added Table 28. Added Figure 13. Added Figure 14. Document Number: 002-14881 Rev. *L Description of Change Page 43 of 45 CYW20735B1 Document Title: CYW20735B1, Single-Chip Bluetooth Transceiver for Wireless Input Devices Document Number: 002-14881 Revision ECN Submission Date Description of Change 2 *H 6123642 04/18/2018 Replaced “BSC” with “I C” in all instances across the document. Removed “111-pin fine pitch ball grid array (FBGA)” package related information in all instances across the document. Updated Cypress Part Numbering Scheme: Updated table “Mapping Table for Part Number between Broadcom and Cypress”. Updated Bluetooth Baseband Core: Added Table 1. Bluetooth Features. Rearranged sections. Removed “Infrared Learning”. Updated Pin Assignments and GPIOs: Updated GPIO Pin Descriptions: Updated Table 7. Updated Functional Block Diagram: Updated Figure 1. Updated Ordering Information: Updated part numbers. *I 6284060 08/17/2018 Updated document title to read as “CYW20735B1, Single-Chip Bluetooth Transceiver for Wireless Input Devices”. Replaced “CYW20735” with “CYW20735B1” in all instances across the document. Removed “Cypress Part Numbering Scheme”. Updated Features: Updated almost entire section. Updated Functional Block Diagram: Updated Figure 1. Updated Pin Assignments and GPIOs: Updated Pin Assignments: Updated Table 6. Updated GPIO Pin Descriptions: Updated Table 7. Updated Pinouts: Replaced “Ball Maps” with “Pinouts” in heading. Updated Ordering Information: Updated part numbers. *J 6737859 11/26/2019 Updated Specifications: Updated Electrical Characteristics: Updated PA LDO: Updated Table 16. Updated RF Specifications: Updated Table 22. *K 6785611 01/28/2020 Updated Features: Updated Peripherals and Communication: Removed “1x MIPI DMI-C interface”. *L 7218581 08/10/2021 Updated Ordering Information: Updated part numbers. Completing Sunset Review. Document Number: 002-14881 Rev. *L Page 44 of 45 CYW20735B1 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. 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Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 002-14881 Rev. *L Revised August 10, 2021 Page 45 of 45