CY14B256LA-ZS45XI

CY14B256LA 256 Kbit (32K x 8) nvSRAM Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Functional Description The Cypress CY14B256LA is a fast static RAM, with a nonvolatile element in each memory cell. The memory is organized as 32K bytes of 8 bits each. The embedded nonvolatile elements incorporate QuantumTrap technology, producing the world’s most reliable nonvolatile memory. The SRAM provides infinite read and write cycles, while independent nonvolatile data resides in the highly reliable QuantumTrap cell. Data transfers from the SRAM to the nonvolatile elements (the STORE operation) takes place automatically at power down. On power up, data is restored to the SRAM (the RECALL operation) from the nonvolatile memory. Both the STORE and RECALL operations are also available under software control. 25 ns and 45 ns Access Times Internally Organized as 32K x 8 (CY14B256LA) Hands off Automatic STORE on Power Down with only a Small Capacitor STORE to QuantumTrap Nonvolatile Elements Initiated by Software, Device Pin, or AutoStore on Power Down RECALL to SRAM Initiated by Software or Power Up Infinite Read, Write, and Recall Cycles 1 Million STORE Cycles to QuantumTrap 20 year Data Retention Single 3V +20% to -10% Operation Industrial Temperature 44-Pin TSOP - II, 48-Pin SSOP, and 32-Pin SOIC Packages Pb-free and RoHS Compliance Cypress Semiconductor Corporation Document Number: 001-54707 Rev. *B • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised December 08, 2009 [+] Feedback CY14B256LA Contents Features ...............................................................................1 Functional Description .......................................................1 Contents ..............................................................................2 Pinouts ................................................................................3 Device Operation ................................................................5 SRAM Read .........................................................................5 SRAM Write .........................................................................5 AutoStore Operation ..........................................................5 Hardware STORE Operation ..............................................5 Hardware RECALL (Power Up) ..........................................6 Software STORE .................................................................6 Software RECALL ...............................................................6 Preventing AutoStore .........................................................7 Data Protection ...................................................................7 Noise Considerations .........................................................7 Best Practices .....................................................................8 Maximum Ratings ...............................................................9 Operating Range .................................................................9 DC Electrical Characteristics ............................................ 9 AC Test Conditions ..........................................................10 Data Retention and Endurance .......................................10 Capacitance ......................................................................10 Thermal Resistance ..........................................................10 AC Switching Characteristics .........................................11 AutoStore/Power Up RECALL .........................................13 Software Controlled STORE/RECALL Cycle ..................14 Hardware STORE Cycle ...................................................15 Truth Table For SRAM Operations ..................................16 Part Numbering Nomenclature ........................................16 Ordering Information ........................................................17 Package Diagrams ............................................................18 Document History Page ...................................................20 Sales, Solutions, and Legal Information ........................20 Worldwide Sales and Design Support .........................20 Products ......................................................................20 Document Number: 001-54707 Rev. *B Page 2 [+] Feedback CY14B256LA Pinouts Figure 1. Pin Diagram - 44 Pin TSOP II/48 Pin SSOP NC [5] NC A0 A1 A2 A3 A4 CE DQ0 DQ1 VCC VSS DQ2 DQ3 WE A5 A6 A7 A8 A9 NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 - TSOP II (x8) Top View (not to scale) 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 HSB NC [4] NC [3] NC [2] NC NC [1] [1] NC OE DQ7 DQ6 VSS VCC DQ5 DQ4 VCAP A14 A13 A12 A11 A10 NC NC VCAP NC A14 A12 A7 A6 A5 NC A4 NC NC NC VSS NC NC DQ0 A3 A2 A1 A0 DQ1 DQ2 NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VCC NC HSB WE A13 A8 A9 NC A11 NC NC NC VSS NC NC DQ6 OE A10 CE DQ7 DQ5 DQ4 DQ3 VCC 48 - SSOP (x8) Top View (not to scale) Figure 2. Pin Diagram - 32-Pin SOIC 32 - SOIC (x8) Top View (not to scale) Notes 1. Address expansion for 1 Mbit. NC pin not connected to die 2. Address expansion for 2 Mbit. NC pin not connected to die. 3. Address expansion for 4 Mbit. NC pin not connected to die. 4. Address expansion for 8 Mbit. NC pin not connected to die. 5. Address expansion for 16 Mbit. NC pin not connected to die. Document Number: 001-54707 Rev. *B Page 3 [+] Feedback CY14B256LA Table 1. Pin Definitions Pin Name A0 – A14 WE CE OE VSS VCC HSB I/O Type Input Description Address Inputs Used to Select One of the 32,768 bytes of the nvSRAM. DQ0 – DQ7 Input/Output Bidirectional Data I/O Lines. Used as input or output lines depending on operation. Input Input Input Ground Power Supply Write Enable Input, Active LOW. When the chip is enabled and WE is LOW, data on the I/O pins is written to the specific address location. Chip Enable Input, Active LOW. When LOW, selects the chip. When HIGH, deselects the chip. Output Enable, Active LOW. The active LOW OE input enables the data output buffers during read cycles. I/O pins are tristated on deasserting OE HIGH. Ground for the Device. Must be connected to the ground of the system. Power Supply Inputs to the Device. 3.0V +20%, –10% Input/Output Hardware STORE Busy (HSB). When LOW this output indicates that a Hardware STORE is in progress. When pulled LOW external to the chip it initiates a nonvolatile STORE operation. A weak internal pull up resistor keeps this pin HIGH if not connected (connection optional). After each STORE operation HSB is driven HIGH for short time with standard output high current. Power Supply AutoStore Capacitor. Supplies power to the nvSRAM during power loss to store data from SRAM to nonvolatile elements. VCAP NC No Connect No Connect. This pin is not connected to the die. Document Number: 001-54707 Rev. *B Page 4 [+] Feedback CY14B256LA Device Operation The CY14B256LA nvSRAM is made up of two functional components paired in the same physical cell. They are an SRAM memory cell and a nonvolatile QuantumTrap cell. The SRAM memory cell operates as a standard fast static RAM. Data in the SRAM is transferred to the nonvolatile cell (the STORE operation), or from the nonvolatile cell to the SRAM (the RECALL operation). Using this unique architecture, all cells are stored and recalled in parallel. During the STORE and RECALL operations, SRAM read and write operations are inhibited. The CY14B256LA supports infinite reads and writes similar to a typical SRAM. In addition, it provides infinite RECALL operations from the nonvolatile cells and up to 1 million STORE operations. Refer to the Truth Table For SRAM Operations on page 16 for a complete description of read and write modes. Figure 3 shows the proper connection of the storage capacitor (VCAP) for automatic STORE operation. Refer to DC Electrical Characteristics on page 9 for the size of VCAP. The voltage on the VCAP pin is driven to VCC by a regulator on the chip. Place a pull up on WE to hold it inactive during power up. This pull up is only effective if the WE signal is tristate during power up. Many MPUs tristate their controls on power up. This must be verified when using the pull up. When the nvSRAM comes out of power-on-recall, the MPU must be active or the WE held inactive until the MPU comes out of reset. To reduce unnecessary nonvolatile stores, AutoStore and Hardware STORE operations are ignored unless at least one write operation has taken place since the most recent STORE or RECALL cycle. Software initiated STORE cycles are performed regardless of whether a write operation has taken place. The HSB signal is monitored by the system to detect if an AutoStore cycle is in progress. Figure 3. AutoStore Mode VCC SRAM Read The CY14B256LA performs a read cycle when CE and OE are LOW and WE and HSB are HIGH. The address specified on pins A0-14 determines which of the 32,768 data bytes each are accessed. When the read is initiated by an address transition, the outputs are valid after a delay of tAA (read cycle 1). If the read is initiated by CE or OE, the outputs are valid at tACE or at tDOE, whichever is later (read cycle 2). The data output repeatedly responds to address changes within the tAA access time without the need for transitions on any control input pins. This remains valid until another address change or until CE or OE is brought HIGH, or WE or HSB is brought LOW. 0.1uF 10kOhm VCC SRAM Write A write cycle is performed when CE and WE are LOW and HSB is HIGH. The address inputs must be stable before entering the write cycle and must remain stable until CE or WE goes HIGH at the end of the cycle. The data on the common I/O pins DQ0–7 are written into the memory if the data is valid tSD before the end of a WE-controlled write or before the end of a CE-controlled write. Keep OE HIGH during the entire write cycle to avoid data bus contention on common I/O lines. If OE is left LOW, internal circuitry turns off the output buffers tHZWE after WE goes LOW. WE VCAP VCAP VSS Hardware STORE Operation The CY14B256LA provides the HSB pin to control and acknowledge the STORE operations. Use the HSB pin to request a Hardware STORE cycle. When the HSB pin is driven LOW, the CY14B256LA conditionally initiates a STORE operation after tDELAY. An actual STORE cycle only begins if a write to the SRAM has taken place since the last STORE or RECALL cycle. The HSB pin also acts as an open drain driver that is internally driven LOW to indicate a busy condition when the STORE (initiated by any means) is in progress. SRAM write operations that are in progress when HSB is driven LOW by any means are given time (tDELAY) to complete before the STORE operation is initiated. However, any SRAM write cycles requested after HSB goes LOW are inhibited until HSB returns HIGH. In case the write latch is not set, HSB is not driven LOW by the CY14B256LA. But any SRAM read and write cycles are inhibited until HSB is returned HIGH by MPU or other external source. AutoStore Operation The CY14B256LA stores data to the nvSRAM using one of the following three storage operations: Hardware STORE activated by HSB; Software STORE activated by an address sequence; AutoStore on device power down. The AutoStore operation is a unique feature of QuantumTrap technology and is enabled by default on the CY14B256LA. During a normal operation, the device draws current from VCC to charge a capacitor connected to the VCAP pin. This stored charge is used by the chip to perform a single STORE operation. If the voltage on the VCC pin drops below VSWITCH, the part automatically disconnects the VCAP pin from VCC. A STORE operation is initiated with power provided by the VCAP capacitor. Note If the capacitor is not connected to VCAP pin, AutoStore must be disabled using the soft sequence specified in Preventing AutoStore on page 7. In case AutoStore is enabled without a capacitor on VCAP pin, the device attempts an AutoStore operation without sufficient charge to complete the Store. This may corrupt the data stored in nvSRAM. Document Number: 001-54707 Rev. *B Page 5 [+] Feedback CY14B256LA During any STORE operation, regardless of how it is initiated, the CY14B256LA continues to drive the HSB pin LOW, releasing it only when the STORE is complete. Upon completion of the STORE operation, the CY14B256LA remains disabled until the HSB pin returns HIGH. Leave the HSB unconnected if it is not used. The software sequence may be clocked with CE controlled reads or OE controlled reads, with WE kept HIGH for all the six READ sequences. After the sixth address in the sequence is entered, the STORE cycle commences and the chip is disabled. HSB is driven LOW. After the tSTORE cycle time is fulfilled, the SRAM is activated again for the read and write operation. Hardware RECALL (Power Up) During power up or after any low power condition (VCC< VSWITCH), an internal RECALL request is latched. When VCC again exceeds the sense voltage of VSWITCH, a RECALL cycle is automatically initiated and takes tHRECALL to complete. During this time, HSB is driven low by the HSB driver. Software RECALL Data is transferred from nonvolatile memory to the SRAM by a software address sequence. A Software RECALL cycle is initiated with a sequence of read operations in a manner similar to the Software STORE initiation. To initiate the RECALL cycle, the following sequence of CE controlled read operations must be performed: 1. Read Address 0x0E38 Valid READ 2. Read Address 0x31C7 Valid READ 3. Read Address 0x03E0 Valid READ 4. Read Address 0x3C1F Valid READ 5. Read Address 0x303F Valid READ 6. Read Address 0x0C63 Initiate RECALL Cycle Internally, RECALL is a two step procedure. First, the SRAM data is cleared. Next, the nonvolatile information is transferred into the SRAM cells. After the tRECALL cycle time, the SRAM is again ready for read and write operations. The RECALL operation does not alter the data in the nonvolatile elements. Software STORE Data is transferred from SRAM to the nonvolatile memory by a software address sequence. The CY14B256LA Software STORE cycle is initiated by executing sequential CE controlled read cycles from six specific address locations in exact order. During the STORE cycle an erase of the previous nonvolatile data is first performed, followed by a program of the nonvolatile elements. After a STORE cycle is initiated, further input and output are disabled until the cycle is completed. Because a sequence of READs from specific addresses is used for STORE initiation, it is important that no other read or write accesses intervene in the sequence, or the sequence is aborted and no STORE or RECALL takes place. To initiate the Software STORE cycle, the following read sequence must be performed: 1. Read Address 0x0E38 Valid READ 2. Read Address 0x31C7 Valid READ 3. Read Address 0x03E0 Valid READ 4. Read Address 0x3C1F Valid READ 5. Read Address 0x303F Valid READ 6. Read Address 0x0FC0 Initiate STORE Cycle Table 2. Mode Selection CE H L L L WE X H L H OE X L X L A14 - A0[6] X X X 0x0E38 0x31C7 0x03E0 0x3C1F 0x303F 0x0B45 Mode Not Selected Read SRAM Write SRAM Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM AutoStore Disable I/O Output High-Z Output Data Input Data Output Data Output Data Output Data Output Data Output Data Output Data Power Standby Active Active Active[7] Notes 6. While there are 15 address lines on the CY14B256LA, only the lower 14 are used to control software modes. 7. The six consecutive address locations must be in the order listed. WE must be HIGH during all six cycles to enable a nonvolatile cycle. Document Number: 001-54707 Rev. *B Page 6 [+] Feedback CY14B256LA Table 2. Mode Selection (continued) CE L WE H OE L A14 - A0[6] 0x0E38 0x31C7 0x03E0 0x3C1F 0x303F 0x0B46 0x0E38 0x31C7 0x03E0 0x3C1F 0x303F 0x0FC0 0x0E38 0x31C7 0x03E0 0x3C1F 0x303F 0x0C63 Mode Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM AutoStore Enable Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM Nonvolatile STORE Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM Nonvolatile Recall I/O Output Data Output Data Output Data Output Data Output Data Output Data Output Data Output Data Output Data Output Data Output Data Output High-Z Output Data Output Data Output Data Output Data Output Data Output High-Z Power Active[7] L H L Active ICC2[7] L H L Active[7] Preventing AutoStore The AutoStore function is disabled by initiating an AutoStore disable sequence. A sequence of read operations is performed in a manner similar to the Software STORE initiation. To initiate the AutoStore disable sequence, the following sequence of CE controlled read operations must be performed: 1. Read address 0x0E38 Valid READ 2. Read address 0x31C7 Valid READ 3. Read address 0x03E0 Valid READ 4. Read address 0x3C1F Valid READ 5. Read address 0x303F Valid READ 6. Read address 0x0B45 AutoStore Disable The AutoStore is reenabled by initiating an AutoStore enable sequence. A sequence of read operations is performed in a manner similar to the Software RECALL initiation. To initiate the AutoStore enable sequence, the following sequence of CE controlled read operations must be performed: 1. Read address 0x0E38 Valid READ 2. Read address 0x31C7 Valid READ 3. Read address 0x03E0 Valid READ 4. Read address 0x3C1F Valid READ 5. Read address 0x303F Valid READ 6. Read address 0x0B46 AutoStore Enable If the AutoStore function is disabled or reenabled, a manual STORE operation (Hardware or Software) must be issued to save the AutoStore state through subsequent power down cycles. The part comes from the factory with AutoStore enabled. Data Protection The CY14B256LA protects data from corruption during low voltage conditions by inhibiting all externally initiated STORE and write operations. The low voltage condition is detected when VCC is less than VSWITCH. If the CY14B256LA is in a write mode (both CE and WE are LOW) at power up, after a RECALL or STORE, the write is inhibited until the SRAM is enabled after tLZHSB (HSB to output active). This protects against inadvertent writes during power up or brown out conditions. Noise Considerations Refer to CY application note AN1064. Document Number: 001-54707 Rev. *B Page 7 [+] Feedback CY14B256LA Best Practices nvSRAM products have been used effectively for over 15 years. While ease-of-use is one of the product’s main system values, experience gained working with hundreds of applications has resulted in the following suggestions as best practices: ■ ■ Power up boot firmware routines should rewrite the nvSRAM into the desired state (for example, autostore enabled). While the nvSRAM is shipped in a preset state, best practice is to again rewrite the nvSRAM into the desired state as a safeguard against events that might flip the bit inadvertently such as program bugs and incoming inspection routines. The VCAP value specified in this data sheet includes a minimum and a maximum value size. Best practice is to meet this requirement and not exceed the maximum VCAP value because the nvSRAM internal algorithm calculates VCAP charge and discharge time based on this max VCAP value. Customers that want to use a larger VCAP value to make sure there is extra store charge and store time should discuss their VCAP size selection with Cypress to understand any impact on the VCAP voltage level at the end of a tRECALL period. The nonvolatile cells in this nvSRAM product are delivered from Cypress with 0x00 written in all cells. Incoming inspection routines at customer or contract manufacturer’s sites sometimes reprogram these values. Final NV patterns are typically repeating patterns of AA, 55, 00, FF, A5, or 5A. End product’s firmware should not assume an NV array is in a set programmed state. Routines that check memory content values to determine first time system configuration, cold or warm boot status, and so on should always program a unique NV pattern (that is, complex 4-byte pattern of 46 E6 49 53 hex or more random bytes) as part of the final system manufacturing test to ensure these system routines work consistently. ■ Document Number: 001-54707 Rev. *B Page 8 [+] Feedback CY14B256LA Maximum Ratings Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ................................. –65°C to +150°C Maximum Accumulated Storage Time: At 150°C Ambient Temperature........................ 1000h At 85°C Ambient Temperature..................... 20 Years Ambient Temperature with Power Applied.. –55°C to +150°C Supply Voltage on VCC Relative to GND ..........–0.5V to 4.1V Voltage Applied to Outputs in High-Z State........................................... –0.5V to VCC + 0.5V Input Voltage.............................................–0.5V to Vcc+0.5V Transient Voltage ( 2001V (per MIL-STD-883, Method 3015) Latch Up Current ................................................... > 200 mA Operating Range Range Industrial Ambient Temperature –40°C to +85°C VCC 2.7V to 3.6V DC Electrical Characteristics Over the Operating Range (VCC = 2.7V to 3.6V) Parameter VCC ICC1 Description Power Supply Average VCC Current tRC = 25 ns tRC = 45 ns Values obtained without output loads (IOUT = 0 mA) All Inputs Don’t Care, VCC = Max Average current for duration tSTORE 35 Test Conditions Min 2.7 Typ[8] 3.0 Max 3.6 70 52 10 Unit V mA mA mA mA ICC2 ICC3 Average VCC Current during STORE Average VCC Current at All I/P cycling at CMOS levels. tRC= 200 ns, Values obtained without output loads (IOUT = 0 mA). VCC (Typ), 25°C Average VCAP Current All Inputs Don’t Care. Average current for duration tSTORE during AutoStore Cycle VCC Standby Current CE > (VCC – 0.2V). VIN < 0.2V or > (VCC – 0.2V). Standby current level after nonvolatile cycle is complete. Inputs are static. f = 0 MHz. –1 –100 –1 2.0 Vss – 0.5 IOUT = –2 mA IOUT = 4 mA Between VCAP pin and VSS, 5V Rated 61 2.4 ICC4 ISB IIX[9] 5 5 mA mA Input Leakage Current VCC = Max, VSS < VIN < VCC (except HSB) Input Leakage Current VCC = Max, VSS < VIN < VCC (for HSB) +1 +1 +1 VCC + 0.5 0.8 0.4 68 180 μA μA μA V V V V μF IOZ VIH VIL VOH VOL VCAP Off-State Output Leakage Current Input HIGH Voltage Input LOW Voltage Output HIGH Voltage Output LOW Voltage Storage Capacitor VCC = Max, VSS < VOUT < VCC, CE or OE > VIH or WE < VIL Notes 8. Typical values are at 25°C, VCC= VCC (Typ). Not 100% tested. 9. The HSB pin has IOUT = -2 uA for VOH of 2.4V when both active high and low drivers are disabled. When they are enabled standard VOH and VOL are valid. This parameter is characterized but not tested. Document Number: 001-54707 Rev. *B Page 9 [+] Feedback CY14B256LA Data Retention and Endurance Parameter DATAR NVC Data Retention Nonvolatile STORE Operations Description Min 20 1,000 Unit Years K Capacitance Parameter[10] CIN COUT Description Input Capacitance Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VCC = VCC (Typ) Max 7 7 Unit pF pF Thermal Resistance Parameter[10] Description Thermal Resistance (Junction to Ambient) Thermal Resistance (Junction to Case) Test Conditions Test conditions follow standard test methods and procedures for measuring thermal impedance, in accordance with EIA/JESD51. Figure 4. AC Test Loads 48-SSOP 44-TSOP II 37.47 24.71 31.11 5.56 32-SOIC 41.55 24.43 Unit °C/W °C/W ΘJA ΘJC 577Ω 3.0V OUTPUT 30 pF R2 789Ω R1 577Ω 3.0V OUTPUT 5 pF R1 for tri-state specs R2 789Ω AC Test Conditions Input Pulse Levels .................................................... 0V to 3V Input Rise and Fall Times (10% - 90%)........................ VIH during address transitions. Address Valid tSCE tHA tHD Input Data Valid High Impedance Document Number: 001-54707 Rev. *B Page 12 [+] Feedback CY14B256LA AutoStore/Power Up RECALL Parameters tHRECALL [17] tSTORE tDELAY [18] [19] Description Power Up RECALL Duration STORE Cycle Duration Time Allowed to Complete SRAM Write Cycle Low Voltage Trigger Level VCC Rise Time HSB Output Disable Voltage HSB To Output Active Time HSB High Active Time CY14B256LA Min Max 20 8 25 2.65 150 1.9 5 500 Unit ms ms ns V µs V µs ns VSWITCH tVCCRISE[10] VHDIS tLZHSB[10] tHHHD[10] [10] Switching Waveforms Figure 9. AutoStore or Power Up RECALL[20] VCC VSWITCH VHDIS VVCCRISE tHHHD HSB OUT Note 18 tSTORE tHHHD Note 18 tSTORE Note 21 tDELAY tLZHSB tDELAY tLZHSB AutoStore POWERUP RECALL Read & Write Inhibited (RWI) tHRECALL tHRECALL POWER-UP RECALL Read & Write BROWN OUT AutoStore POWER-UP RECALL Read & Write POWER DOWN AutoStore Notes 17. tHRECALL starts from the time VCC rises above VSWITCH. 18. If an SRAM write has not taken place since the last nonvolatile cycle, no AutoStore or Hardware STORE takes place. 19. On a Hardware Store and AutoStore initiation, SRAM write operation continues to be enabled for time tDELAY. 20. Read and Write cycles are ignored during STORE, RECALL, and while VCC is below VSWITCH. 21. HSB pin is driven high to VCC only by internal 100 kΩ resistor, HSB driver is disabled. Document Number: 001-54707 Rev. *B Page 13 [+] Feedback CY14B256LA Software Controlled STORE/RECALL Cycle Parameters[22, 23] tRC tSA tCW tHA tRECALL Description STORE/RECALL Initiation Cycle Time Address Setup Time Clock Pulse Width Address Hold Time RECALL Duration 25 ns Min 25 0 20 0 200 Max Min 45 0 30 0 200 45 ns Max Unit ns ns ns ns µs Switching Waveforms Figure 10. CE and OE Controlled Software STORE/RECALL Cycle[23] tRC Address tSA CE tSA OE tHHHD HSB (STORE only) DQ (DATA) tLZCE tHZCE t DELAY Note 24 tRC Address #6 tCW tHA tHA Address #1 tCW tHA tHA tLZHSB High Impedance tSTORE/tRECALL RWI Figure 11. Autostore Enable / Disable Cycle tRC Address tSA CE tSA Address #1 tCW tHA tHA tRC Address #6 tCW tHA tHA OE tLZCE DQ (DATA) tHZCE tSS 24 Note t DELAY Notes 22. The software sequence is clocked with CE controlled or OE controlled reads. 23. The six consecutive addresses must be read in the order listed in Table 2 on page 6. WE must be HIGH during all six consecutive cycles. 24. DQ output data at the sixth read may be invalid since the output is disabled at tDELAY time. Document Number: 001-54707 Rev. *B Page 14 [+] Feedback CY14B256LA Hardware STORE Cycle Parameters tDHSB tPHSB tSS [25, 26] Description HSB To Output Active Time when write latch not set Hardware STORE Pulse Width Soft Sequence Processing Time 15 100 CY14B256LA Min Max 25 Unit ns ns μs Switching Waveforms Figure 12. Hardware STORE Cycle[18] Write latch set tPHSB HSB (IN) tSTORE tDELAY HSB (OUT) tLZHSB DQ (Data Out) RWI tHHHD Write latch not set tPHSB HSB (IN) HSB pin is driven high to VCC only by Internal 100kOhm resistor, HSB driver is disabled SRAM is disabled as long as HSB (IN) is driven low. tDELAY tDHSB tDHSB HSB (OUT) RWI Figure 13. Soft Sequence Processing[25, 26] Soft Sequence Command Address Address #1 tSA Address #6 tCW tSS Soft Sequence Command Address #1 Address #6 tCW tSS CE VCC Notes 25. This is the amount of time it takes to take action on a soft sequence command. Vcc power must remain HIGH to effectively register command. 26. Commands such as STORE and RECALL lock out I/O until operation is complete which further increases this time. See the specific command. Document Number: 001-54707 Rev. *B Page 15 [+] Feedback CY14B256LA Truth Table For SRAM Operations HSB must remain HIGH for SRAM operations. Table 3. Truth Table CE H L L L WE X H H L OE X L H X High-Z Data Out (DQ0–DQ7); High-Z Data in (DQ0–DQ7); Inputs/Outputs Read Output Disabled Write Mode Deselect/Power down Standby Active Active Active Power Part Numbering Nomenclature CY 14 B 256 L A-ZS 25 X I T Option: T - Tape & Reel Blank - Std. Pb-Free Package: ZS - 44 TSOP II SP - 48 SSOP SZ - 32 SOIC Density: 256 - 256 Kb Temperature: I - Industrial (-40 to 85oC) Speed: 25 - 25 ns 45 - 45 ns Die revision: Blank - No Rev A - 1st Rev Data Bus: L - x8 Voltage: B - 3.0V 14 - nvSRAM Cypress Document Number: 001-54707 Rev. *B Page 16 [+] Feedback CY14B256LA Ordering Information Speed (ns) 25 Ordering Code CY14B256LA-ZS25XIT CY14B256LA-ZS25XI CY14B256LA-SP25XIT CY14B256LA-SP25XI CY14B256LA-SZ25XIT CY14B256LA-SZ25XI 45 CY14B256LA-ZS45XIT CY14B256LA-ZS45XI CY14B256LA-SP45XIT CY14B256LA-SP45XI CY14B256LA-SZ45XIT CY14B256LA-SZ45XI All the above parts are Pb-free. Package Diagram 51-85087 51-85087 51-85061 51-85061 51-85127 51-85127 51-85087 51-85087 51-85061 51-85061 51-85127 51-85127 Package Type 44-pin TSOP II 44-pin TSOP II 48-pin SSOP 48-pin SSOP 32-pin SOIC 32-pin SOIC 44-pin TSOP II 44-pin TSOP II 48-pin SSOP 48-pin SSOP 32-pin SOIC 32-pin SOIC Operating Range Industrial Document Number: 001-54707 Rev. *B Page 17 [+] Feedback CY14B256LA Package Diagrams Figure 14. 44-Pin TSOP II (51-85087) 51-85087 *B Document Number: 001-54707 Rev. *B Page 18 [+] Feedback CY14B256LA Package Diagrams (continued) Figure 15. 48-Pin SSOP (51-85061) 51-85061 *C Document Number: 001-54707 Rev. *B Page 19 [+] Feedback CY14B256LA Package Diagrams (continued) Figure 16. 32-Pin SOIC (51-85127) PIN 1 ID 16 1 0.292[7.416] 0.299[7.594] 0.405[10.287] 0.419[10.642] DIMENSIONS IN INCHES[MM] REFERENCE JEDEC MO-119 MIN. MAX. 17 32 PART # S32.3 STANDARD PKG. SZ32.3 LEAD FREE PKG. SEATING PLANE 0.810[20.574] 0.822[20.878] 0.090[2.286] 0.100[2.540] 0.004[0.101] 0.050[1.270] TYP. 0.014[0.355] 0.020[0.508] 0.026[0.660] 0.032[0.812] 0.021[0.533] 0.041[1.041] 0.006[0.152] 0.012[0.304] 0.004[0.101] 0.0100[0.254] 51-85127 *B Document Number: 001-54707 Rev. *B Page 20 [+] Feedback CY14B256LA Document History Page Document Title: CY14B256LA 256 Kbit (32K x 8) nvSRAM Document Number: 001- 54707 Orig. of Submission Rev. ECN No. Description of Change Change Date ** 2746918 GVCH/AESA 07/31/2009 New Data Sheet *A 2772059 GVCH/PYRS 09/30/2009 Updated Software STORE, RECALL and Autostore Enable, Disable soft sequence *B 2829117 GVCH 12/16/09 Updated STORE cycles to QuantumTrap from 200K to 1 Million Updtaed 48-pin SSOP package diagram Added Contents. Moved to external web Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales. Products PSoC Clocks & Buffers Wireless Memories Image Sensors psoc.cypress.com clocks.cypress.com wireless.cypress.com memory.cypress.com image.cypress.com © Cypress Semiconductor Corporation, 2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. 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Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-54707 Rev. *B Revised December 08, 2009 Page 21 All products and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback