CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
2
64-Kbit (8 K × 8) Serial (I C) nvSRAM
64-Kbit (8 K × 8) Serial (I2C) nvSRAM
■
Industry standard configurations
❐ Operating voltages:
• CY14MB064J: VCC = 2.7 V to 3.6 V
• CY14ME064J: VCC = 4.5 V to 5.5 V
❐ Industrial temperature
❐ 8-pin small outline integrated circuit (SOIC) package
❐ Restriction of hazardous substances (RoHS) compliant
■
64-Kbit nonvolatile static random access memory (nvSRAM)
❐ Internally organized as 8 K × 8
❐ STORE to QuantumTrap nonvolatile elements initiated
automatically on power-down (AutoStore) or by using I2C
command (Software STORE)
❐ RECALL to SRAM initiated on power-up (Power-Up
RECALL) or by I2C command (Software RECALL)
❐ Automatic STORE on power-down with a small capacitor
(except for CY14MX064J1A)
■ High reliability
❐ Infinite read, write, and RECALL cycles
❐ 1 million STORE cycles to QuantumTrap
❐ Data retention: 20 years at 85 C
2
[1]
■ High speed I C interface
❐ Industry standard 100 kHz and 400 kHz speed
❐ Fast-mode Plus: 1 MHz speed
❐ High speed: 3.4 MHz
❐ Zero cycle delay reads and writes
■ Write protection
❐ Hardware protection using Write Protect (WP) pin
❐ Software block protection for 1/4, 1/2, or entire array
2
■ I C access to special functions
❐ Nonvolatile STORE/RECALL
❐ 8 byte serial number
❐ Manufacturer ID and Product ID
❐ Sleep mode
■ Low power consumption
❐ Average active current of 1 mA at 3.4-MHz operation
❐ Average standby mode current of 120 µA
❐ Sleep mode current of 8 µA
Overview
The Cypress CY14MX064J combines a 64-Kbit nvSRAM[2] with
a nonvolatile element in each memory cell. The memory is
organized as 8 K words of 8 bits each. The embedded
nonvolatile elements incorporate the QuantumTrap technology,
creating the world’s most reliable nonvolatile memory. The
SRAM provides infinite read and write cycles, while the
QuantumTrap cells provide highly reliable nonvolatile storage of
data. Data transfers from SRAM to the nonvolatile elements
(STORE operation) takes place automatically at power-down
(except for CY14MX064J1A). On power-up, data is restored to
the SRAM from the nonvolatile memory (RECALL operation).
The STORE and RECALL operations can also be initiated by the
user through I2C commands.
Configuration
Feature
AutoStore
Software STORE
Slave Address pins
CY14MX064J1A
No
Yes
A2, A1, A0
CY14MX064J2A
Yes
Yes
A2, A1
Logic Block Diagram
Serial Number
8x8
VCC VCAP
Manufacturer ID /
Product ID
Power Control
Block
Memory Control Register
Quantum Trap
8Kx8
Command Register
Sleep
SDA
SCL
A2, A1, A0
WP
2
Control Registers Slave
I C Control Logic
Slave Address
Decoder
Memory Slave
Memory
Address and Data
Control
SRAM
8Kx8
STORE
RECALL
Notes
1. The I2C nvSRAM is a single solution which is usable for all four speed modes of operation. As a result, some I/O parameters are slightly different than those on
chips which support only one mode of operation. Refer to AN87209 for more details.
2. Serial (I2C) nvSRAM is referred to as nvSRAM throughout the datasheet.
Cypress Semiconductor Corporation
Document Number: 001-70393 Rev. *J
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised August 29, 2013
Not Recommended for New Designs
Features
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Pinout ................................................................................ 3
Pin Definitions .................................................................. 3
I2C Interface ...................................................................... 4
Protocol Overview ....................................................... 4
I2C Protocol – Data Transfer ....................................... 4
Data Validity ................................................................ 5
START Condition (S) ................................................... 5
STOP Condition (P) ..................................................... 5
Repeated START (Sr) ................................................. 5
Byte Format ................................................................. 5
Acknowledge / No-acknowledge ................................. 5
High Speed Mode (Hs-mode) ...................................... 6
Slave Device Address ................................................. 6
Write Protection (WP) .................................................. 9
AutoStore Operation .................................................... 9
Write Operation ........................................................... 9
Read Operation ......................................................... 10
Memory Slave Access ............................................... 10
Control Registers Slave ............................................. 14
Serial Number ................................................................. 16
Serial Number Write .................................................. 16
Serial Number Lock ................................................... 16
Serial Number Read .................................................. 16
Device ID ......................................................................... 17
Executing Commands Using Command Register ..... 17
Maximum Ratings ........................................................... 18
Document Number: 001-70393 Rev. *J
Operating Range ............................................................. 18
DC Electrical Characteristics ........................................ 18
Data Retention and Endurance ..................................... 19
Thermal Resistance ........................................................ 19
AC Test Loads and Waveforms ..................................... 20
AC Test Conditions ........................................................ 20
AC Switching Characteristics ....................................... 21
Switching Waveforms .................................................... 21
nvSRAM Specifications ................................................. 22
Switching Waveforms .................................................... 22
Software Controlled STORE/RECALL Cycles .............. 23
Switching Waveforms .................................................... 23
Ordering Information ...................................................... 24
Ordering Code Definitions ......................................... 24
Package Diagrams .......................................................... 25
Acronyms ........................................................................ 26
Document Conventions ................................................. 26
Units of Measure ....................................................... 26
Document History Page ................................................. 27
Sales, Solutions, and Legal Information ...................... 28
Worldwide Sales and Design Support ....................... 28
Products .................................................................... 28
PSoC® Solutions ...................................................... 28
Cypress Developer Community ................................. 28
Technical Support ..................................................... 28
Page 2 of 28
Not Recommended for New Designs
Contents
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Pinout
Figure 1. 8-pin SOIC pinout
1
8
A1
2
A2
3
CY14MX064J1A 7
Top View
6
not to scale
VSS
4
5
VCAP
1
8
WP
A1
2
SCL
A2
3
CY14MX064J2A 7
Top View
6
not to scale
SDA
VSS
4
VCC
5
VCC
WP
SCL
SDA
Pin Definitions
Pin Name
I/O Type
SCL
Input
SDA
Description
Clock. Runs at speeds up to a maximum of fSCL.
Input/Output I/O. Input/Output of data through I2C interface.
Output: Is open-drain and requires an external pull-up resistor.
WP
Input
Write Protect. Protects the memory from all writes. This pin is internally pulled LOW and hence can
be left open if not connected.
A2–A0 [3]
Input
Slave Address. Defines the slave address for I2C. This pin is internally pulled LOW and hence can
be left open if not connected.
VCAP
NC
Power supply AutoStore Capacitor. Supplies power to the nvSRAM during power loss to STORE data from the
SRAM to nonvolatile elements. If not required, AutoStore must be disabled and this pin left as no
connect. It must never be connected to ground.
No connect
No Connect. This pin is not connected to the die.
VSS
Power supply Ground
VCC
Power supply Power supply
Note
3. A0 pin is not available in CY14MX064J2A.
Document Number: 001-70393 Rev. *J
Page 3 of 28
Not Recommended for New Designs
A0
I2C Interface
or a write (0) operation. All signals are transmitted on the
open-drain SDA line and are synchronized with the clock on SCL
line. Each byte of data transmitted on the I2C bus is
acknowledged by the receiver by holding the SDA line LOW on
the ninth clock pulse. The request for write by the master is
followed by the memory address and data bytes on the SDA line.
The writes can be performed in burst-mode by sending multiple
bytes of data. The memory address increments automatically
after receiving/transmitting each byte on the falling edge of ninth
clock cycle. The new address is latched just prior to
sending/receiving the acknowledgment bit. This allows the next
sequential byte to be accessed with no additional addressing. On
reaching the last memory location, the address rolls back to
0x0000 and writes continue. The slave responds to each byte
sent by the master during a write operation with an ACK. A write
sequence can be terminated by the master generating a STOP
or Repeated START condition.
I2C bus consists of two lines – serial clock line (SCL) and serial
data line (SDA) that carry information between multiple devices
on the bus. I2C supports multi-master and multi-slave
configurations. The data is sent from the transmitter to the
receiver on the SDA line and is synchronized with the clock SCL
generated by the master.
The SCL and SDA lines are open-drain lines and are pulled up
to VCC using resistors. The choice of pull-up resistor on the
system depends on the bus capacitance and the intended speed
of operation. The master generates the clock and all the data
I/Os are transmitted in synchronization with this clock. The
CY14MX064J supports up to 3.4-MHz clock speed on the SCL
line.
Protocol Overview
A read request is performed at the current address location
(address next to the last location accessed for read or write). The
memory slave device responds to a read request by transmitting
the data on the current address location to the master. A random
address read may also be performed by first sending a write
request with the intended address of read. The master must
abort the write immediately after the last address byte and issue
a Repeated START or STOP signal to prevent any write
operation. The following read operation starts from this address.
The master acknowledges the receipt of one byte of data by
holding the SDA pin LOW for the ninth clock pulse. The reads
can be terminated by the master sending a no-acknowledge
(NACK) signal on the SDA line after the last data byte. The
no-acknowledge signal causes the CY14MX064J to release the
SDA line and the master can then generate a STOP or a
Repeated START condition to initiate a new operation.
This device supports only a 7-bit addressable scheme. The
master generates a START condition to initiate the
communication followed by broadcasting a slave select byte.
The slave select byte consists of a seven bit address of the slave
that the master intends to communicate with and R/W bit
indicating a read or a write operation. The selected slave
responds to this with an acknowledgement (ACK). After a slave
is selected, the remaining part of the communication takes place
between the master and the selected slave device. The other
devices on the bus ignore the signals on the SDA line until a
STOP or Repeated START condition is detected. The data is
transferred between the master and the selected slave device
through the SDA pin synchronized with the SCL clock generated
by the master.
I2C Protocol – Data Transfer
Each transaction in I2C protocol starts with the master
generating a START condition on the bus, followed by a
seven-bit slave address and eighth bit (R/W) indicating a read (1)
Figure 2. System Configuration using Serial (I2C) nvSRAM
RPmin = (VCC - VOLmax) / IOL
Vcc
RPmax = tr / (0.8473) * Cb
SDA
Microcontroller
SCL
Vcc
Vcc
A0
SCL
A0
SCL
A0
SCL
A1
SDA
A1
SDA
A1
SDA
WP
A2
WP
A2
CY14MX064J
#0
Document Number: 001-70393 Rev. *J
A2
WP
CY14MX064J
CY14MX064J
#1
#7
Page 4 of 28
Not Recommended for New Designs
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Data Validity
STOP Condition (P)
The data on the SDA line must be stable during the HIGH period
of the clock. The state of the data line can only change when the
clock on the SCL line is LOW for the data to be valid. There are
only two conditions under which the SDA line may change state
with the SCL line held HIGH, that is, START and STOP condition.
The START and STOP conditions are generated by the master
to signal the beginning and end of a communication sequence
on the I2C bus.
A LOW to HIGH transition on the SDA line while SCL is HIGH
indicates a STOP condition. This condition indicates the end of
the ongoing transaction.
START and STOP conditions are always generated by the
master. The bus is considered to be busy after the START
condition. The bus is considered to be free again after the STOP
condition.
A HIGH to LOW transition on the SDA line while SCL is HIGH
indicates a START condition. Every transaction in I2C begins
with the master generating a START condition.
If an Repeated START condition is generated instead of a STOP
condition the bus continues to be busy. The ongoing transaction
on the I2C lines is stopped and the bus waits for the master to
send a slave ID for communication to restart.
Figure 3. START and STOP Conditions
full pagewidth
SDA
SDA
SCL
SCL
S
P
STOP Condition
START Condition
Figure 4. Data Transfer on the I2C Bus
handbook, full pagewidth
P
SDA
Acknowledgement
signal from slave
MSB
SCL
S
or
Sr
1
2
START or
Repeated START
condition
7
8
9
in MSB first format on the SDA line and each byte is followed by
an ACK signal by the receiver.
An operation continues until a NACK is sent by the receiver or
STOP or Repeated START condition is generated by the master
The SDA line must remain stable when the clock (SCL) is HIGH
except for a START or STOP condition.
Acknowledge / No-acknowledge
After transmitting one byte of data or address, the transmitter
releases the SDA line. The receiver pulls the SDA line LOW to
acknowledge the receipt of the byte. Every byte of data
transferred on the I2C bus needs to be responded with an ACK
signal by the receiver to continue the operation. Failing to do so
is considered as a NACK state. NACK is the state where the
2
3-8
9
ACK
Byte complete,
interrupt within slave
Each operation in I2C is done using 8-bit words. The bits are sent
Document Number: 001-70393 Rev. *J
1
ACK
Byte Format
Acknowledgement
signal from receiver
Clock line held LOW while
interrupts are serviced
Sr
Sr
or
P
STOP or
Repeated START
condition
receiver does not acknowledge the receipt of data and the
operation is aborted.
The master can generate NACK during a READ operation in the
following cases:
■
The master did not receive valid data due to noise
■
The master generates a NACK to abort the READ sequence.
After a NACK is issued by the master, the nvSRAM slave
releases control of the SDA pin and the master is free to
generate a Repeated START or STOP condition.
The nvSRAM slave can generate NACK during a WRITE
operation in the following cases:
■
nvSRAM did not receive valid data due to noise.
■ The master tries to access write-protected locations on the
nvSRAM. The master must restart the communication by
generating a STOP or Repeated START condition.
Page 5 of 28
Not Recommended for New Designs
Repeated START (Sr)
START Condition (S)
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Figure 5. Acknowledge on the I2C Bus
handbook, full pagewidth
DATA OUTPUT
BY MASTER
not acknowledge (A)
DATA OUTPUT
BY SLAVE
acknowledge (A)
1
2
8
9
S
clock pulse for
acknowledgement
START
condition
High Speed Mode (Hs-mode)
Serial Data Format in Hs-mode
In Hs-mode, nvSRAM can transfer data at bit rates of up to
3.4 Mbit/s. A master code (0000 1XXXb) must be issued to place
the device in high-speed mode. This enables master/slave
communication for a speed of up to 3.4 MHz. A stop condition
exits Hs-mode.
Serial data transfer format in Hs-mode meets the standard-mode
I2C-bus specification. Hs-mode can only commence after the
following conditions (all of which are in F/S-modes):
1. START condition (S)
2. 8-bit master code (0000 1XXXb)
3. No-acknowledge bit (A)
Figure 6. Data transfer format in Hs-mode
handbook, full pagewidth
Hs-mode
F/S-mode
S
MASTER CODE
A Sr SLAVE ADD. R/W A
F/S-mode
DATA
n (bytes+ ack.)
A/A P
Hs-mode continues
Sr SLAVE ADD.
Single and multiple-byte reads and writes are supported. After
the device enters Hs-mode, data transfer continues in Hs-mode
until the stop condition is sent by the master device. The slave
switches back to F/S-mode after a STOP condition (P). To
continue data transfer in Hs-mode, the master sends Repeated
START (Sr).
seven MSBs are the device address and the LSB (R/W bit) is
used for indicating Read or Write operation. The CY14MX064J
reserves two sets of upper 4 MSBs [7:4] in the slave device
address field for accessing Memory and Control Registers. The
accessing mechanism is described in Memory Slave Device on
page 7.
See Figure 12 on page 11 and Figure 15 on page 12 for Hs-mode
timings for read and write operation.
The nvSRAM product provides two functionalities: Memory and
Control Registers functions (such as serial number and product
ID). The two functions of the device are accessed through
different slave device addresses. The first four most significant
bits [7:4] in the device address register are used to select
between the nvSRAM functions.
Slave Device Address
Every slave device on an I2C bus has a device select address.
The first byte after START condition contains the slave device
address with which the master intends to communicate. The
Document Number: 001-70393 Rev. *J
Page 6 of 28
Not Recommended for New Designs
SCL FROM
MASTER
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Table 1. Slave device Addressing
Bit 7
Bit 6
Bit 5
Bit 4
1
0
1
0
Bit 3
Bit 2
Bit 1
Device Select ID
Bit 0
nvSRAM Function
Select
CY14MX064J Slave Devices
R/W Selects Memory
Memory, 8 K × 8
Control Registers
0
0
1
1
Device Select ID
R/W
- Serial Number, 8 × 8
Selects Control
Registers
- Device ID, 4 × 8
- Command Register, 1 × 8
Memory Slave Device
Control Registers Slave Device
The nvSRAM device is selected for Read/Write if the master
issues the slave address as 1010b followed by two/three bits of
device select. For CY14MX064J1A, the device select is 3 bits
and for CY14MX064J2A, it is two bits with the third bit set to don’t
care. If the slave address sent by the master matches the
Memory Slave device address, then depending on the R/W bit of
the slave address, data is either read from (R/W = ‘1’) or written
to (R/W = ’0’) the nvSRAM.
The Control Registers Slave device includes the Serial Number,
Product ID, Memory Control, and Command Register.
The address length for CY14MX064J is 13 bits and, therefore, it
requires two address bytes to map the entire memory address
location. The two dedicated address bytes represent bit A0 to
A12. However, since the address is only 13 bits, it implies that
the device ignores the first three MSB bits that are fed in.
Although these bits are ‘don’t care’, Cypress recommends that
this bit is treated as 0 to enable seamless transition to higher
memory densities.
The nvSRAM Control Register Slave device is selected for
Read/Write if the master issues the Slave address as 0011b
followed by two/three bits of device select. For CY14MX064J1A,
device select is 3 bits and for CY14MX064J2A, it is two bits with
the third bit set to don’t care. If the slave address sent by the
master matches the Memory Slave device address, then
depending on the R/W bit of the slave address, data is either read
from (R/W = ‘1’) or written to (R/W = ’0’) the nvSRAM.
Figure 8. Control Registers Slave Device Address
MSB
handbook, halfpage
0
LSB
0
1
Slave ID
1
A2
A1 A0/X R/W
Device Select
Figure 7. Memory Slave Device Address
MSB
handbook, halfpage
1
LSB
0
1
Slave ID
0
A2
A1
A0/X R/W
Device Select
Document Number: 001-70393 Rev. *J
Page 7 of 28
Not Recommended for New Designs
- Memory Control Register, 1 × 8
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Command Register
Address Description Read/Write
0x00
Memory
Read/Write
Control
Register
Read/Write
0x01
Serial
(Read only
Number 8
0x02
when SNL is
Bytes
0x03
set)
0x04
0x05
0x06
0x07
0x08
0x09
Device ID
Read only
0x0A
0x0B
0x0C
0x0D
Reserved
Reserved
0xAA
Command
Write only
Register
Details
Contains Block Protect
Bits and Serial Number
Lock bit
Programmable Serial
Number. Locked by
setting the Serial
Number lock bit in the
Memory Control
Register to ‘1’.
The Command Register resides at address “AA” of the Control
Registers Slave device. This is a write only register. The byte
written to this register initiates a STORE, RECALL, AutoStore
Enable, AutoStore Disable, and sleep mode operation as listed
in Table 5. Refer to Serial Number on page 16 for details on how
to execute a command register byte.
Table 5. Command Register bytes
Device ID is factory
programmed
Reserved
Allows commands for
STORE, RECALL,
AutoStore
Enable/Disable, SLEEP
Mode
Memory Control Register
■
Bit 5
0
Bit 4
0
Bit 3
BP1
(0)
Bit 2
BP0
(0)
Bit 1
0
BP1:BP0
00
01
10
11
Block Protection
None
0x1800–0x1FFF
0x1000–0x1FFF
0x0000–0x1FFF
SNL (S/N Lock) Bit: Serial Number Lock bit (SNL) is used to lock
the serial number. After the bit is set to ‘1’, the serial number
registers are locked and no modification is allowed. This bit
cannot be cleared to ‘0’. The serial number is secured on the next
STORE operation (Software STORE or AutoStore). If AutoStore
is not enabled, the user must perform the Software STORE
operation to secure the lock bit status. If a STORE was not
performed, the serial number lock bit will not survive the power
cycle. The default value shipped from the factory for SNL is ‘0’.
Document Number: 001-70393 Rev. *J
0110 0000
RECALL
0101 1001
0001 1001
1011 1001
ASENB
ASDISB
SLEEP
STORE SRAM data to nonvolatile
memory
RECALL data from nonvolatile
memory to SRAM
Enable AutoStore
Disable AutoStore
Enter Sleep Mode for low power
consumption
RECALL: Initiates nvSRAM Software RECALL. The nvSRAM
cannot be accessed for tRECALL time after this instruction has
been executed. The RECALL operation does not alter the data
in the nonvolatile elements. A RECALL may be initiated in two
ways: Hardware RECALL, initiated on power-up; and Software
RECALL, initiated by a I2C RECALL instruction.
■
ASENB: Enables nvSRAM AutoStore. The nvSRAM cannot be
accessed for tSS time after this instruction has been executed.
This setting is not nonvolatile and needs to be followed by a
manual STORE sequence if this is desired to survive power
cycle. The part comes from the factory with ‘AutoStore Enabled’
and ‘0x00’ written in all cells.
■
ASDISB: Disables nvSRAM AutoStore. The nvSRAM cannot
be accessed for tSS time after this instruction has been
executed. This setting is not nonvolatile and needs to be
followed by a manual STORE sequence if this is desired to
survive the power cycle.
Table 4. Block Protection
Level
0
1/4
1/2
1
STORE
■
Bit 0
0
BP1:BP0: Block Protect bits are used to protect 1/4, 1/2, or full
memory array. These bits can be written through a write
instruction to the 0x00 location of the Control Register Slave
device. However, any STORE cycle causes transfer of SRAM
data to a nonvolatile cell, regardless of whether or not the block
is protected. The default value shipped from the factory for BP0
and BP1 is ‘0’.
Description
STORE: Initiates nvSRAM Software STORE. The nvSRAM
cannot be accessed for tSTORE time after this instruction is
executed. When initiated, the device performs a STORE
operation, regardless of whether a write has been performed
since the last NV operation. After the tSTORE cycle time is
completed, the SRAM is activated again for read/write
operations.
Table 3. Memory Control Register Bits
Bit 6
SNL
(0)
Command
■
The Memory Control Register contains the following bits:
Bit 7
0
Data Byte
[7:0]
0011 1100
Note If AutoStore is disabled and VCAP is not required, it is
required that the VCAP pin is left open. The VCAP pin must never
be connected to ground. Power-Up RECALL operation cannot
be disabled in any case.
■
SLEEP: SLEEP instruction puts the nvSRAM in sleep mode.
When the SLEEP instruction is registered, the nvSRAM takes
tSS time to process the SLEEP request. After the SLEEP
command is successfully registered and processed, the
nvSRAM performs a STORE operation to secure the data to
nonvolatile memory and then enters SLEEP mode. Whenever
nvSRAM enters SLEEP mode, it initiates a nonvolatile STORE
cycle, which results in losing an endurance cycle for every sleep
command execution. A STORE cycle starts only if a write to
the SRAM has been performed since the last STORE or
RECALL cycle.
Page 8 of 28
Not Recommended for New Designs
Table 2. Control Registers map
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Once in Sleep mode, the device starts consuming IZZ current
tSLEEP time after SLEEP instruction is registered. The device is
not accessible for normal operations until it is out of sleep mode.
The nvSRAM wakes up after tWAKE duration after the device
slave address is transmitted by the master.
Transmitting any of the two slave addresses wakes the nvSRAM
from Sleep mode. The nvSRAM device is not accessible during
tSLEEP and tWAKE interval, and any attempt to access the
nvSRAM device by the master is ignored and nvSRAM sends
NACK to the master. As an alternative method of determining
when the device is ready, the master can send read or write
commands and look for an ACK.
Write Protection (WP)
The WP pin is an active high pin and protects entire memory and
all registers from write operations. To inhibit all the write
operations, this pin must be held high. When this pin is high, all
memory and register writes are prohibited and the address
counter is not incremented. This pin is internally pulled LOW and
hence can be left open if not used.
AutoStore Operation
The AutoStore operation is a unique feature of nvSRAM, which
automatically stores the SRAM data to QuantumTrap cells
during power-down. This STORE uses an external capacitor
(VCAP) and enables the device to safely STORE the data in the
nonvolatile memory when power goes down.
During normal operation, the device draws current from VCC to
charge the capacitor connected to the VCAP pin. When the
voltage on the VCC pin drops below VSWITCH during power-down,
the device inhibits all memory accesses to nvSRAM and
automatically performs a conditional STORE operation using the
charge from the VCAP capacitor. The AutoStore operation is not
initiated if no write cycle has been performed since the last
STORE or RECALL.
Note If a capacitor is not connected to the VCAP pin, AutoStore
must be disabled by issuing the AutoStore Disable instruction
specified in Command Register on page 8. If AutoStore is
enabled without a capacitor on VCAP pin, the device attempts an
AutoStore operation without sufficient charge to complete the
Store. This corrupts the data stored in nvSRAM as well as the
serial number and it unlocks the SNL bit.
Figure 9 shows the proper connection of the storage capacitor
(VCAP) for AutoStore operation. Refer to DC Electrical
Characteristics on page 18 for the size of the VCAP.
Document Number: 001-70393 Rev. *J
Figure 9. AutoStore Mode
VCC
0.1 uF
VCC
VCAP
VSS
VCAP
Hardware RECALL (Power-Up)
During power-up, when VCC crosses VSWITCH, an automatic
RECALL sequence is initiated, which transfers the content of
nonvolatile memory to the SRAM. The data would previously
have been stored in the nonvolatile memory through a STORE
sequence.
A Power-Up RECALL cycle takes tFA time to complete and the
memory access is disabled during this time.
Write Operation
The last bit of the slave device address indicates a read or a write
operation. In case of a write operation, the slave device address
is followed by the memory or register address and data. A write
operation continues as long as a STOP or Repeated START
condition is generated by the master or if a NACK is issued by
the nvSRAM.
A NACK is issued from the nvSRAM under the following
conditions:
1. A valid Device ID is not received.
2. A write (burst write) access to a protected memory block
address returns a NACK from nvSRAM after the data byte is
received. However, the address counter is set to this address
and the following current read operation starts from this
address.
3. A write/random read access to an invalid or out-of-bound
memory address returns a NACK from the nvSRAM after the
address is received. The address counter remains unchanged
in such a case.
After a NACK is sent out from the nvSRAM, the write operation
is terminated and any data on the SDA line is ignored until a
STOP or a Repeated START condition is generated by the
master.
For example, consider a case where the burst write access is
performed on Control Register Slave address 0x01 for writing the
serial number and continued to the address 0x09, which is a read
only register. The device returns a NACK and address counter
will not be incremented. A following read operation will be started
from the address 0x09. Further, the nvSRAM responds to any
write operation, which starts from a write-protected address (say,
0x09), with a NACK after the data byte is sent and set the
Page 9 of 28
Not Recommended for New Designs
The nvSRAM enters sleep mode as follows:
1. The Master sends a START command
2. The Master sends Control Registers Slave device ID with I2C
Write bit set (R/W = ’0’)
3. The Slave (nvSRAM) sends an ACK back to the Master
4. The Master sends the Command Register address (0xAA)
5. The Slave (nvSRAM) sends an ACK back to the Master
6. The Master sends the Command Register byte for entering
into Sleep mode
7. The Slave (nvSRAM) sends an ACK back to the Master
8. The Master generates a STOP condition.
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
address counter to this address. A following read operation will
start from the address 0x09 in this case also.
More details on write instruction are provided in Section Memory
Slave Access on page 10.
Note If the user tries to read/write access an address that does
not exist (for example 0x0D in Control Register Slave), nvSRAM
responds with a NACK immediately after the out-of-bound
address is transmitted. The address counter remains unchanged
and holds the previous successful read or write operation
address.
Memory Slave Access
A write operation is performed internally with no delay after the
eighth bit of data is transmitted. If a write operation is not
intended, the master must terminate the write operation before
the eighth clock cycle by generating a STOP or Repeated
START condition.
Each write operation consists of a slave address being
transmitted after the start condition. The last bit of slave address
must be set as ‘0’ to indicate a Write operation. The master may
write one byte of data or continue writing multiple consecutive
address locations while the internal address counter keeps
incrementing automatically. The address register is reset to
0x0000 after the last address in memory is accessed. The write
operation continues till a STOP or Repeated START condition is
generated by the master or a NACK is issued by the nvSRAM.
Read Operation
If the last bit of the slave device address is ‘1’, a read operation
is assumed and the nvSRAM takes control of the SDA line
immediately after the slave device address byte is sent out by
the master. The read operation starts from the current address
location (the location following the previous successful write or
read operation). When the last address is reached, the address
counter loops back to the first address.
In case of the Control Register Slave, when a burst read is
performed such that it flows to a non-existent address, the reads
operation will loop back to 0x00. This is applicable, in particular
for the Command Register.
There are the following ways to end a read operation:
1. The Master issues a NACK on the 9th clock cycle followed by
a STOP or a Repeated START condition on the 10th clock
cycle.
2. Master generates a STOP or Repeated START condition on
the 9th clock cycle.
Write nvSRAM
A write operation is executed only after all the 8 data bits have
been received by the nvSRAM. The nvSRAM sends an ACK
signal after a successful write operation. A write operation may
be terminated by the master by generating a STOP condition or
a Repeated START operation. If the master desires to abort the
current write operation without altering the memory contents, this
should be done using a START/STOP condition prior to the 8th
data bit.
If the master tries to access a write protected memory address
on the nvSRAM, a NACK is returned after the data byte intended
to write the protected address is transmitted and address counter
will not be incremented. Similarly, in a burst mode write
operation, a NACK is returned when the data byte that attempts
to write a protected memory location and address counter will not
be incremented.
Figure 10. Single-Byte Write into nvSRAM (except Hs-mode)
By Master
SDA Line
S
T
A
R
T
Most Significant Address Byte
Memory Slave Address
S
1
0
1
0 A2 A1 A0
X
0
X
Least Significant Address Byte
S
T
0
P
Data Byte
P
X
By nvSRAM
A
A
A
A
Figure 11. Multi-Byte Write into nvSRAM (except Hs-mode)
SDA Line
S
1
0
1
0 A2 A1 A0
Least Significant Address
Byte
Most Significant Address
Byte
0
X
X
S
T
0
P
Data Byte N
Data Byte 1
~
~
By Master
S
T
A
R Memory Slave Address
T
X
P
By nvSRAM
A
Document Number: 001-70393 Rev. *J
A
A
A
A
Page 10 of 28
Not Recommended for New Designs
More details on write instruction are provided in the section,
Memory Slave Access on page 10
The following sections describe the data transfer sequence
required to perform Read or Write operations from nvSRAM.
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Figure 12. Single-Byte Write into nvSRAM (Hs-mode)
By Master
SDA Line
S
T
A
R
T
Hs-mode command
S 0 0 0
0 1
Most Significant Address
Byte
Memory Slave Address
X X X
Sr 1 0
1 0 A2 A1 A0 0
Least Significant Address
Byte
S
T
0
P
Data Byte
P
X X X
By nvSRAM
A
A
A
Figure 13. Multi-Byte Write into nvSRAM (Hs-mode)
SDA Line
Hs-mode command
S 0 0 0
0 1
Most Significant Address
Byte
Memory Slave Address
X X X
Sr 1 0
1 0 A2 A1 A0 0
Least Significant Address
Byte
Data Byte 1
~
~
By Master
S
T
A
R
T
X X X
By nvSRAM
A
By Master
A
~
~
SDA Line
By nvSRAM
A
P
A
Current nvSRAM Read
Each read operation starts with the master transmitting the
nvSRAM slave address with the LSB set to ‘1’ to indicate “Read”.
The reads start from the address on the address counter. The
address counter is set to the address location next to the last
accessed with a “Write” or “Read” operation. The master may
A
S
T
0
P
Data Byte N
Data Byte 3
Data Byte 2
A
A
A
terminate a read operation after reading 1 byte or continue
reading addresses sequentially until the last address in the
memory after which the address counter rolls back to the
address 0x0000. The valid methods of terminating read access
are described in the section Read Operation on page 10.
Figure 14. Current Location Single-Byte nvSRAM Read (except Hs-mode)
By Master
SDA Line
S
T
A
R
T
S
A
Memory Slave Address
1
0
1
0
S
T
0
P
P
A2 A1 A0 1
By nvSRAM
A
Document Number: 001-70393 Rev. *J
Data Byte
Page 11 of 28
Not Recommended for New Designs
A
A
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Figure 15. Current Location Multi-Byte nvSRAM Read (except Hs-mode)
S
T
A
R
T
SDA Line
S
Memory Slave Address
1
1
0
0 A2 A1 A0 1
By nvSRAM
S
T
0
P
P
~
~
By Master
A
A
Data Byte N
Data Byte
Figure 16. Current Location Single-Byte nvSRAM Read (Hs-mode)
S
T
A
R
T
By Master
SDA Line
Hs-mode command
S 0 0 0
0 1
S
A T
0
P
Memory Slave Address
X X X
Sr 1 0
P
1 0 A2 A1 A0 1
By nvSRAM
Data Byte
A
A
Figure 17. Current Location Multi-Byte nvSRAM Read (Hs-mode)
By Master
SDA Line
A
Hs-mode command
S 0 0 0
0 1
A
Memory Slave Address
X X X
Sr 1 0
1 0 A2 A1 A0 1
~
~
S
T
A
R
T
Data Byte
By nvSRAM
S
T
0
P
P
Data Byte N
A
A
Random Address Read
A random address read is performed by first initiating a write
operation and generating a Repeated START immediately after
the last address byte is acknowledged. The address counter is
set to this address and the next read access to this slave initiates
a read operation from here. The master may terminate a read
operation after reading 1 byte or continue reading addresses
sequentially until the last address in the memory after which the
address counter rolls back to the start address 0x0000.
Figure 18. Random Address Single-Byte Read (except Hs-mode)
By Master
SDA Line
S
T
A
R
T
S
Memory Slave Address
1
0
1
Least Significant Address
Byte
Most Significant Address
Byte
0 A2 A1 A0 0
X
X
A
Memory Slave Address
Sr 1
X
0
1
S
T
0
P
P
0 A2 A1 A0 1
By nvSRAM
Data Byte
A
Document Number: 001-70393 Rev. *J
A
A
A
Page 12 of 28
Not Recommended for New Designs
A
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Figure 19. Random Address Multi-Byte Read (except Hs-mode)
S
1
0
1
0 A2 A1 A0 0
X
X
A
Memory Slave Address
Sr 1
X
0
1
0 A2 A1 A0 1
By nvSRAM
Data Byte 1
A
A
S
T
0
P
A
A
A
P
Data Byte N
Figure 20. Random Address Single-Byte Read (Hs-mode)
SDA Line
Hs-mode command
S 0 0 0
0 1
Most Significant Address
Byte
Memory Slave Address
X X X
Sr 1 0
1 0 A2 A1 A0 0
Least Significant Address
Byte
Memory Slave Address
Sr 1 0
X X X
1 0 A2 A1 A0 1
~
~
By Master
S
T
A
R
T
By nvSRAM
A
A
A
A
A
S
T
A 0
P
P
Data Byte
Figure 21. Random Address Multi-Byte Read (Hs-mode)
SDA Line
Hs-mode command
S 0 0 0
0 1
Most Significant Address
Byte
Memory Slave Address
X X X
Sr 1 0
1 0 A2 A1 A0 0
Least Significant Address
Byte
Memory Slave Address
Sr 1 0
X X X
1 0 A2 A1 A0 1
~
~
By Master
S
T
A
R
T
By nvSRAM
A
~
~
A
Data Byte
A
A
A
Document Number: 001-70393 Rev. *J
A
A
S
T
0
P
P
Data Byte N
Page 13 of 28
Not Recommended for New Designs
SDA Line
Least Significant Address
Byte
Most Significant Address
Byte
Memory Slave Address
~
~
By Master
S
T
A
R
T
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
The following sections describe the data transfer sequence
required to perform read or write operations from the Control
Registers Slave.
Write Control Registers
To write the Control Registers Slave, the master transmits the
Control Registers Slave address after generating the START
condition. The write sequence continues from the address
location specified by the master until the master generates a
STOP condition or the last writable address location.
If a non writable address location is accessed for write operation
during a normal write or a burst, the slave generates a NACK
after the data byte is sent and the write sequence terminates.
Any following data bytes are ignored and the address counter is
not incremented.
If a write operation is performed on the Command Register
(0xAA), the following current read operation also begins from the
first address (0x00), and the current address is an out-of-bound
address. The address is not incremented and the next current
read operation begins from this address location. If a write
operation is attempted on an out-of-bound address location, the
nvSRAM sends a NACK immediately after the address byte is
sent.
Further, if the serial number is locked, only two addresses (0xAA
or Command Register, and 0x00 or Memory Control Register)
are writable in the Control Registers Slave. On a write operation
to any other address location, the device will acknowledge
command byte and address bytes but it returns a NACK from the
Control Registers Slave for data bytes. In this case, the address
will not be incremented and a current read will happen from the
last acknowledged address.
The nvSRAM Control Registers Slave sends a NACK when an
out of bound memory address is accessed for write operation, by
the master. In such a case, a following current read operation
begins from the last acknowledged address.
Figure 22. Single-Byte Write into Control Registers
S
T
A
R
T
By Master
SDA Line
S
Control Registers
Slave Address
0
0
1
Control Register Address
S
T
0
P
Data Byte
P
1 A2 A1 A0 0
By nvSRAM
A
A
A
Figure 23. Multi-Byte Write into Control Registers
SDA Line
S
Control Registers
Slave Address
0
0
1
Control Register Address
Data Byte
S
T
0
P
Data Byte N
P
~
~
By Master
S
T
A
R
T
1 A2 A1 A0 0
By nvSRAM
A
A
Current Control Registers Read
A read of the Control Registers Slave is started with the master
sending the Control Registers Slave address after the START
condition with the LSB set to ‘1’. The reads begin from the current
address which is the next address to the last accessed location.
The reads to Control Registers Slave continue until the last
A
A
readable address location and loop back to the first location
(0x00). Note that the Command Register is a write only register
and is not accessible through the sequential read operations. If
a burst read operation begins from the Command Register
(0xAA), the address counter wraps around to the first address in
the register map (0x00).
Figure 24. Control Registers Single-Byte Read
By Master
SDA Line
S
T
A
R
T
S
Control Registers
Slave Address
0
0
1
A
S
T
0
P
P
1 A2 A1 A0 1
By nvSRAM
Data Byte
A
Document Number: 001-70393 Rev. *J
Page 14 of 28
Not Recommended for New Designs
Control Registers Slave
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Figure 25. Current Control Registers Multi-Byte Read
S
T
A
R
T
SDA Line
S
0
0
1
A
A
1 A2 A1 A0 1
By nvSRAM
Data Byte
S
T
0
P
P
~
~
By Master
Control Registers
Slave Address
Data Byte N
Random Control Registers Read
A read of random address may be performed by initiating a write
operation to the intended location of read and immediately
following with a Repeated START operation. The reads to the
Control Registers Slave continue until the last readable address
location and loop back to the first location (0x00). Note that the
Command Register is a write only register and is not accessible
through the sequential read operations. A random read starting
at the Command Register (0xAA) loops back to the first address
in the Control Registers map (0x00). If a random read operation
is initiated from an out-of-bound memory address, the nvSRAM
sends a NACK after the address byte is sent.
.
Figure 26. Random Control Registers Single-Byte Read
By Master
SDA Line
S
T
A
R
T
S
Control Registers
Slave Address
0
0
1
Control Register Address
A
Control Registers Slave Address
Sr 0
1 A2 A1 A0 0
0
1
1
A2 A1 A0 1
S
T
0
P
P
By nvSRAM
Data Byte
A
A
A
Figure 27. Random Control Registers Multi-Byte Read
SDA Line
S
Control Registers
Slave Address
0
0
1
Control Register Address
A
Control Registers Slave Address
Sr 0
1 A2 A1 A0 0
0
1
1
A2 A1 A0 1
~
~
By Master
S
T
A
R
T
By nvSRAM
Data Byte
A
A
A
A
S
T
0
P
P
Data Byte N
Document Number: 001-70393 Rev. *J
Page 15 of 28
Not Recommended for New Designs
A
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
The serial number is an 8-byte memory space provided to the
user to uniquely identify this device. It typically consists of a
two-byte customer ID, followed by five bytes of a unique serial
number and one byte of CRC check. However, nvSRAM does
not calculate the CRC and it is up to the user to use the eight-byte
memory space in the desired format. The default values for the
eight-byte locations are set to ‘0x00’.
Serial Number Write
The serial number can be accessed through the Control
Registers Slave Device. To write the serial number, the master
transmits the Control Registers Slave address after the START
condition and writes to the address location from 0x01 to 0x08.
The content of Serial Number registers is secured to nonvolatile
memory on the next STORE operation. If AutoStore is enabled,
nvSRAM automatically stores the Serial number in the
nonvolatile memory on power-down. However, if AutoStore is
disabled, the user must perform a STORE operation to secure
the contents of Serial Number registers.
Note If the serial number lock (SNL) bit is not set, the serial
number registers can be re-written regardless of whether or not
a STORE has happened. After the serial number lock bit is set,
no writes to the serial number registers are allowed. If the master
tries to perform a write operation to the serial number registers
when the lock bit is set, a NACK is returned and write will not be
performed.
Document Number: 001-70393 Rev. *J
Serial Number Lock
After writes to Serial Number registers is complete, the master is
responsible for locking the serial number by setting the serial
number lock bit to ‘1’ in the Memory Control Register (0x00). The
content of the Memory Control Register and serial number are
secured on the next STORE operation (STORE or AutoStore). If
AutoStore is not enabled, the user must perform a STORE
operation to secure the lock bit status.
If a STORE was not performed, the serial number lock bit will not
survive the power cycle. The serial number lock bit and 8-byte
serial number is set by default to ‘0’ at power-up.
Serial Number Read
The serial number can be read back by a read operation of the
intended address of the Control Registers Slave. The Control
Registers Device loops back from the last address (excluding the
Command Register) to the 0x00 address location while
performing a burst read operation. The serial number resides in
the locations from 0x01 to 0x08. Even if the serial number is not
locked, a serial number read operation returns the current values
written to the serial number registers. The master may perform
a serial number read operation to confirm if the correct serial
number is written to the registers before setting the lock bit.
Page 16 of 28
Not Recommended for New Designs
Serial Number
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Device ID
The device ID is a 4-byte code consisting of a JEDEC assigned manufacturer ID, product ID, density ID, and die revision. These
registers are set in factory and are read-only registers for the user.
Device
Device ID
(4 bytes)
CY14MB064J1A
CY14MB064J2A
CY14ME064J1A
CY14ME064J2A
0x06812889
0x0681A889
0x06813089
0x0681B089
Device ID Description
20–7
6–3
(14 bits)
(4 bits)
Product ID
Density ID
00001001010001
0001
00001101010001
0001
00001001100001
0001
00001101100001
0001
31–21
(11 bits)
Manufacturer ID
00000110100
00000110100
00000110100
00000110100
2–0
(3 bits)
Die Rev
001
001
001
001
The device ID is divided into four parts as shown in Table 6:
4. Die Rev (3 bits)
1. Manufacturer ID (11 bits)
This is used to represent any major change in the design of the
product.
This is the JEDEC assigned manufacturer ID for Cypress.
JEDEC assigns the manufacturer ID in different banks. The first
three bits of the manufacturer ID represent the bank in which the
ID is assigned. The next eight bits represent the manufacturer ID.
Table 6 lists the Die Rev for device.
Executing Commands Using Command Register
The Control Registers Slave allows different commands to be
executed by writing the specific command byte in the Command
Register (0xAA). The command byte codes for each command
are specified in Table 5 on page 8. During the execution of these
commands the device is not accessible and returns a NACK if
any of the three slave devices is selected. If an invalid command
is sent by the master, the nvSRAM responds with an ACK
indicating that the command has been acknowledged with NOP
(No Operation). The address rolls over to the 0x00 location.
The Cypress manufacturer ID is 0x34 in bank 0. Therefore, the
manufacturer ID for all Cypress nvSRAM products is given as:
Cypress ID - 000_0011_0100
2. Product ID (14 bits)
Table 6 lists the product ID for the device.
3. Density ID (4 bits)
The 4-bit density ID is used, as shown in Table 6, for indicating
the 64-Kb density of the product.
Figure 28. Command Execution using Command Register
By Master
SDA Line
S
T
A
R
T
S
Control Register
Slave Address
0
0
1
Command Register Address
1 A2 A1 A0 0
1
0
1
0
1
0
1
S
T
O
P
Command Byte
P
0
By nvSRAM
A
Document Number: 001-70393 Rev. *J
A
A
Page 17 of 28
Not Recommended for New Designs
Table 6. Device ID
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Maximum Ratings
Package power dissipation
capability (TA = 25 °C) ................................................. 1.0 W
Exceeding maximum ratings may shorten the useful life of the
device. These user guidelines are not tested.
Surface mount lead soldering
temperature (3 seconds) ......................................... +260 C
Maximum accumulated storage time
At 150 C ambient temperature ...................... 1000 h
At 85 C ambient temperature .................... 20 Years
DC output current
(1 output at a time, 1 s duration).................................. 15 mA
Static discharge voltage
(per MIL-STD-883, Method 3015) .......................... > 2001 V
Maximum junction temperature ................................. 150 C
Latch up current ..................................................... > 140 mA
Supply voltage on VCC relative to VSS
CY14MB064J: ...................................–0.5 V to +4.1 V
CY14ME064J: ...................................–0.5 V to +7.0 V
DC voltage applied to outputs
in High Z state .................................... –0.5 V to VCC + 0.5 V
Operating Range
Input voltage ....................................... –0.5 V to VCC + 0.5 V
CY14ME064J
Product
CY14MB064J
Range
Industrial
Ambient
Temperature
VCC
–40 C to +85 C 2.7 V to 3.6 V
4.5 V to 5.5 V
Transient voltage (< 20 ns) on
any pin to ground potential ................. –2.0 V to VCC + 2.0 V
DC Electrical Characteristics
Over the Operating Range
Parameter
Description
VCC
ICC1
Test Conditions
Power supply
Average VCC current
Min
Typ [4]
Max
Unit
CY14MB064J
2.7
3.0
3.6
V
CY14ME064J
4.5
5.0
5.5
V
fSCL = 3.4 MHz;
Values obtained without output loads
(IOUT = 0 mA)
–
–
1
mA
fSCL = 1 MHz;
Values obtained without output loads
(IOUT = 0 mA)
–
–
400
A
ICC2
Average VCC current during
STORE
All inputs don’t care, VCC = Max
Average current for duration tSTORE
–
–
3
mA
ICC4
Average VCAP current during
AutoStore cycle
All inputs don't care. Average current
for duration tSTORE
–
–
3
mA
ISB
VCC standby current
SCL > (VCC – 0.2 V). CY14MB064J
VIN < 0.2 V or
CY14ME064J
VIN > (VCC – 0.2 V).
Standby current level
after nonvolatile cycle
is complete. Inputs are
static. fSCL = 0 MHz.
–
–
120
A
–
–
150
A
IZZ
Sleep mode current
tSLEEP time after SLEEP Instruction is
Issued. All inputs are static and
configured at CMOS logic level.
–
–
8
A
IIX[5]
Input current in each I/O pin
0.1 VCC < Vi < 0.9 VCCmax
–1
–
+1
A
IOZ
Output leakage current
–1
–
+1
A
Ci
Capacitance for each I/O pin
–
–
7
pF
Capacitance measured across all input
and output signal pin and VSS.
Notes
4. Typical values are at 25 °C, VCC = VCC(Typ). Not 100% tested.
5. Not applicable to WP, A2, A1, and A0 pins.
Document Number: 001-70393 Rev. *J
Page 18 of 28
Not Recommended for New Designs
Storage temperature ................................ –65 C to +150 C
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Over the Operating Range
Parameter
Description
Test Conditions
VIH
Input HIGH voltage
VIL
Input LOW voltage
VOL
Output LOW voltage
Rin[6]
Input resistance (WP, A2, A1, For VIN = VIL (Max)
A0)
For VIN = VIH (Min)
Vhys
Hysteresis of Schmitt trigger
inputs
IOL = 3 mA
IOL = 6 mA
VCAP[7]
VVCAP
[8, 9]
Storage capacitor
Between VCAP pin and VSS
Maximum voltage driven on
VCAP pin by the device
VCC = Max
Min
Typ [4]
Max
Unit
0.7 × VCC
–
VCC + 0.5
V
– 0.5
–
0.3 × Vcc
V
0
–
0.4
V
0
–
0.6
V
50
–
–
K
1
–
–
M
0.05 × VCC
–
–
V
42
47
180
F
V
CY14MB064J
–
–
VCC
CY14ME064J
–
–
VCC– 0.5
Data Retention and Endurance
Over the Operating Range
Parameter
Description
DATAR
Data retention
NVC
Nonvolatile STORE operations
Min
Unit
20
Years
1,000
K
Test Conditions
8-pin SOIC
Unit
Test conditions follow standard test methods and
procedures for measuring thermal impedance, per EIA /
JESD51.
101.08
C/W
37.86
C/W
Thermal Resistance
Parameter [9]
JA
JC
Description
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Notes
6. The input pull-down circuit is stronger (50 K) when the input voltage is below VIL and weak (1 M) when the input voltage is above VIH.
7. Min VCAP value guarantees that there is a sufficient charge available to complete a successful AutoStore operation. Max VCAP value guarantees that the capacitor on
VCAP is charged to a minimum voltage during a Power-Up RECALL cycle so that an immediate power-down cycle can complete a successful AutoStore. Therefore it
is always recommended to use a capacitor within the specified min and max limits. Refer application note AN43593 for more details on VCAP options.
8. Maximum voltage on VCAP pin (VVCAP) is provided for guidance when choosing the VCAP capacitor. The voltage rating of the VCAP capacitor across the operating
temperature range should be higher than the VVCAP voltage.
9. These parameters are guaranteed by design and are not tested.
Document Number: 001-70393 Rev. *J
Page 19 of 28
Not Recommended for New Designs
DC Electrical Characteristics (continued)
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
AC Test Loads and Waveforms
Figure 29. AC Test Loads and Waveforms
For 5.0 V (CY14ME064J)
For 3.0 V (CY14MB064J)
5.0 V
3.0 V
867
1.6 K
50 pF
100 pF
AC Test Conditions
Description
Input pulse levels
Input rise and fall times (10%–90%)
Input and output timing reference levels
Document Number: 001-70393 Rev. *J
CY14MB064J
0 V to 3 V
10 ns
1.5 V
CY14ME064J
0 V to 5 V
10 ns
2.5 V
Page 20 of 28
Not Recommended for New Designs
OUTPUT
OUTPUT
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
AC Switching Characteristics
Over the Operating Range
3.4 MHz [11]
Description
[10]
1 MHz [11]
400 kHz [11]
Unit
Min
Max
Min
Max
Min
Max
–
3400
–
1000
–
400
kHz
fSCL
Clock frequency, SCL
tSU; STA
Setup time for Repeated START
condition
160
–
250
–
600
–
ns
tHD;STA
Hold time for START condition
160
–
250
–
600
–
ns
tLOW
LOW period of the SCL
160
–
500
–
1300
–
ns
tHIGH
HIGH period of the SCL
60
–
260
–
600
–
ns
tSU;DATA
Data in setup time
10
–
100
–
100
–
ns
tHD;DATA
Data hold time (In/Out)
0
–
0
–
0
–
ns
tDH
Data out hold time
0
–
0
–
0
–
ns
[12]
tr
Rise time of SDA and SCL
–
80
–
120
–
300
ns
tf[12]
Fall time of SDA and SCL
–
80
–
120
–
300
ns
tSU;STO
Setup time for STOP condition
160
–
250
–
600
–
ns
tVD;DATA
Data output valid time
–
130
–
400
–
900
ns
tVD;ACK
ACK output valid time
–
130
–
400
–
900
ns
tOF[12]
Output fall time from VIH(min) to
VIL(max)
–
80
–
120
–
250
ns
tBUF
Bus free time between STOP and
next START condition
0.3
–
0.5
–
1.3
–
us
tSP
Pulse width of spikes that must be
suppressed by input filter
–
10
–
50
–
50
ns
Switching Waveforms
~
~
~
~
~
~
Figure 30. Timing Diagram
t SU;DATA
~
~
~
~
t HIGH
~
~
tr
t LOW
~
~
SDA
tf
t VD;DAT
t SP
t HD;STA
t VD;ACK
t BUF
t SU;STO
t HD;DATA
tf
t SU;STA
~
~
t HD;STA
~
~
SCL
S
Sr
START condition
Repeated START condition
tr
9th clock
(ACK)
P
S
STOP condition START condition
Notes
10. Test conditions assume signal transition time of 10 ns or less, timing reference levels of VCC/2, input pulse levels of 0 to VCC(typ), and output loading of the specified
IOL and load capacitance shown in Figure 29.
11. Bus Load (Cb) considerations; Cb < 500 pF for I2C clock frequency (SCL) 100/400 KHz; Cb < 550 pF for SCL at 1000 kHz; Cb < 100 pF for SCL at 3.4 MHz.
12. These parameters are guaranteed by design and are not tested.
Document Number: 001-70393 Rev. *J
Page 21 of 28
Not Recommended for New Designs
Parameter
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
nvSRAM Specifications
Parameter
[13]
Description
tFA
tSTORE [14]
tDELAY[15, 16]
tVCCRISE[16]
VSWITCH
Power-Up RECALL duration
STORE cycle duration
Time allowed to complete SRAM write cycle
VCC rise time
Low voltage trigger level
tWAKE
tSLEEP
tSB [16]
Time for nvSRAM to wake up from SLEEP mode
Time to enter low power mode after issuing SLEEP instruction
Time to enter into standby mode after issuing STOP condition
CY14MB064J
CY14ME064J
Min
–
–
–
150
–
–
–
–
–
Max
20
8
25
–
2.65
4.40
20
8
100
Unit
ms
ms
ns
µs
V
V
ms
ms
µs
Switching Waveforms
Figure 31. AutoStore or Power-Up RECALL [17]
VCC
VSWITCH
14
t VCCRISE
Note
14
t STORE
Note
tSTORE
AutoStore
tDELAY
tDELAY
POWERUP
RECALL
tFA
tFA
Read & Write
Inhibited
(RWI)
POWER-UP
RECALL
Read & Write
BROWN
OUT
AutoStore
POWER-UP
RECALL
Read & Write
POWER
DOWN
AutoStore
Notes
13. tFA starts from the time VCC rises above VSWITCH.
14. If an SRAM write has not taken place since the last nonvolatile cycle, no AutoStore takes place.
15. On a AutoStore initiation, SRAM write operation continues to be enabled for time tDELAY.
16. These parameters are guaranteed by design and are not tested.
17. Read and Write cycles are ignored during STORE, RECALL, and while VCC is below VSWITCH.
Document Number: 001-70393 Rev. *J
Page 22 of 28
Not Recommended for New Designs
Over the Operating Range
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Software Controlled STORE/RECALL Cycles
Over the Operating Range
CY14MX064J
Description
Unit
Min
Max
tRECALL
RECALL duration
–
600
µs
tSS[18, 19]
Software sequence processing time
–
500
µs
Switching Waveforms
Figure 32. Software STORE/RECALL Cycle
DATA OUTPUT
BY MASTER
Command Reg Address
nvSRAM Control Slave Address
acknowledge (A) by Slave
acknowledge (A) by Slave
SCL FROM
MASTER
1
2
8
9
1
Command Byte (STORE/RECALL)
2
8
9
1
acknowledge (A) by Slave
2
8
9
P
S
START
condition
RWI
t STORE / t RECALL
Figure 33. AutoStore Enable/Disable Cycle
DATA OUTPUT
BY MASTER
Command Reg Address
nvSRAM Control Slave Address
acknowledge (A) by Slave
acknowledge (A) by Slave
SCL FROM
MASTER
1
2
8
9
1
Command Byte (ASENB/ASDISB)
2
8
9
1
acknowledge (A) by Slave
2
8
9
P
S
START
condition
RWI
t
SS
Notes
18. This is the amount of time it takes to take action on a soft sequence command. VCC power must remain HIGH to effectively register command.
19. Commands such as STORE and RECALL lock out I/O until operation is complete which further increases this time. See the specific command.
Document Number: 001-70393 Rev. *J
Page 23 of 28
Not Recommended for New Designs
Parameter
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Ordering Information
Package
Diagram
Ordering Code
CY14MB064J2A-SXI
Operating
Range
Package Type
51-85066 8-pin SOIC (with VCAP)
CY14MB064J2A-SXIT
8-pin SOIC (with VCAP)
CY14ME064J1A-SXI
8-pin SOIC (without VCAP)
CY14ME064J1A-SXIT
8-pin SOIC (without VCAP)
Industrial
Ordering Code Definitions
CY 14 M B 064 J 1 A - S X I T
Option:
T - Tape and Reel
Blank - Std.
Temperature:
I - Industrial (–40 °C to 85 °C)
Pb-free
1 - Without VCAP
2 - With VCAP
Die revision:
Blank - No Rev
A - 1st Rev
Package:
S - 8-pin SOIC
J - Serial (I2C) nvSRAM
Density:
Metering
Voltage:
B - 3.0 V
E - 5.0 V
064 - 64 Kb
14 - nvSRAM
Cypress
Document Number: 001-70393 Rev. *J
Page 24 of 28
Not Recommended for New Designs
The above parts are Pb-free. This table contains final information. Contact your local Cypress sales representative for availability of these parts.
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Package Diagrams
51-85066 *F
Document Number: 001-70393 Rev. *J
Page 25 of 28
Not Recommended for New Designs
Figure 34. 8-pin SOIC (150 mils) Package Outline, 51-85066
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Acronym
Document Conventions
Description
Units of Measure
ACK
Acknowledge
CMOS
Complementary Metal Oxide Semiconductor
°C
degree Celsius
CRC
Cyclic Redundancy Check
Hz
hertz
EIA
Electronic Industries Alliance
kHz
kilohertz
I2C
Inter-Integrated Circuit
k
kilohm
I/O
Input/Output
Mbit
megabit
JEDEC
Joint Electron Devices Engineering Council
MHz
megahertz
LSB
Least Significant Bit
M
megaohm
MSB
Most Significant Bit
A
microampere
nvSRAM
non-volatile Static Random Access Memory
F
microfarad
NACK
No Acknowledge
s
microsecond
RoHS
Restriction of Hazardous Substances
mA
milliampere
R/W
Read/Write
ms
millisecond
RWI
Read and Write Inhibit
ns
nanosecond
SCL
Serial Clock Line
ohm
SDA
Serial Data Access
%
percent
SNL
Serial Number Lock
pF
picofarad
SOIC
Small Outline Integrated Circuit
V
volt
SRAM
Static Random access memory
W
watt
WP
Write Protect
Document Number: 001-70393 Rev. *J
Symbol
Unit of Measure
Not Recommended for New Designs
Acronyms
Page 26 of 28
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Document History Page
Document Title: CY14MB064J1A/CY14MB064J2A, CY14ME064J1A/CY14ME064J2A, 64-Kbit (8 K × 8) Serial (I2C) nvSRAM
Document Number: 001-70393
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
3291153
GVCH
06/23/2011
New data sheet.
*A
3403128
GVCH
10/12/2011
Updated I2C Interface (SLEEP description on page 8).
Updated Executing Commands Using Command Register (description).
Updated DC Electrical Characteristics (Removed ICC3 parameter).
Updated AC Switching Characteristics (Updated the maximum value of tSP
parameter from 5 ns to 10 ns for 3.4 MHz).
Updated Switching Waveforms (Updated Figure 32 and Figure 33).
*B
3515468
GVCH
02/02/2012
Removed Best Practices.
Updated Ordering Information (Added CY14MB064J2A-SXIT,
CY14MB064J1A-SXIT, CY14ME064J2A-SXIT and CY14ME064J1A-SXIT).
*C
3539393
GVCH
03/16/2012
Updated nvSRAM Specifications (No other change, only referred Note 16 in
tSB parameter).
*D
3605955
GVCH
05/02/2012
No technical updates.
*E
3702613
GVCH
08/03/2012
Updated DC Electrical Characteristics (Added VVCAP parameter and its details,
added Note 8 and referred the same note in VVCAP parameter, also referred
Note 9 in VVCAP parameter).
*F
3759535
GVCH
09/28/2012
Updated Maximum Ratings (Removed “Ambient temperature with power
applied” and included “Maximum junction temperature”).
*G
3823702
GVCH
11/28/2012
Changed status from “Preliminary” to “Final”.
Updated Ordering Information (Updated part numbers).
*H
3983091
GVCH
04/26/2013
Updated Features:
Added Note 1 (To clarify non-compliance with the NXP I2C specification).
Updated DC Electrical Characteristics:
Added one more condition “IOL = 6 mA” for VOL parameter and added
respective values.
Updated AC Switching Characteristics:
Updated Note 11.
Changed value of tOF parameter from 300 ns to 250 ns for 400 kHz frequency.
Updated Package Diagrams:
spec 51-85066 – Changed revision from *E to *F.
*I
3988751
GVCH
05/03/2013
No technical updates.
*J
4108522
GVCH
08/29/2013
Added watermark “Not Recommended for New Designs”.
Updated in new template.
Document Number: 001-70393 Rev. *J
Page 27 of 28
Not Recommended for New Designs
Description of Change
CY14MB064J1A/CY14MB064J2A
CY14ME064J1A/CY14ME064J2A
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
PSoC® Solutions
Products
Automotive
Clocks & Buffers
Interface
Lighting & Power Control
cypress.com/go/automotive
cypress.com/go/clocks
cypress.com/go/interface
cypress.com/go/powerpsoc
psoc.cypress.com/solutions
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP
Cypress Developer Community
Community | Forums | Blogs | Video | Training
cypress.com/go/plc
cypress.com/go/memory
PSoC
Touch Sensing
cypress.com/go/psoc
cypress.com/go/support
cypress.com/go/touch
USB Controllers
Wireless/RF
Technical Support
Not Recommended for New Designs
Memory
cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2011-2013. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-70393 Rev. *J
All products and company names mentioned in this document may be the trademarks of their respective holders.
Revised August 29, 2013
Page 28 of 28
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