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CY15B064J-SXET

CY15B064J-SXET

  • 厂商:

    CYPRESS(赛普拉斯)

  • 封装:

    SOICN-8_4.9X3.9MM

  • 描述:

    IC FRAM 64KBIT I2C 1MHZ 8SOIC

  • 详情介绍
  • 数据手册
  • 价格&库存
CY15B064J-SXET 数据手册
Please note that Cypress is an Infineon Technologies Company. The document following this cover page is marked as “Cypress” document as this is the company that originally developed the product. Please note that Infineon will continue to offer the product to new and existing customers as part of the Infineon product portfolio. Continuity of document content The fact that Infineon offers the following product as part of the Infineon product portfolio does not lead to any changes to this document. Future revisions will occur when appropriate, and any changes will be set out on the document history page. Continuity of ordering part numbers Infineon continues to support existing part numbers. Please continue to use the ordering part numbers listed in the datasheet for ordering. www.infineon.com CY15B064J 64-Kbit (8K × 8) Serial (I2C) Automotive F-RAM 64-Kbit (8K × 8) Serial (I2C) Automotive F-RAM Features ■ ■ Functional Description 64-Kbit ferroelectric random access memory (F-RAM) logically organized as 8K × 8 13 ❐ High-endurance 10 trillion (10 ) read/writes ❐ 121-year data retention (See Data Retention and Endurance on page 10) ❐ NoDelay™ writes ❐ Advanced high-reliability ferroelectric process The CY15B064J is a 64-Kbit nonvolatile memory employing an advanced ferroelectric process. A ferroelectric random access memory or F-RAM is nonvolatile and performs reads and writes similar to a RAM. It provides reliable data retention for 121 years while eliminating the complexities, overhead, and system-level reliability problems caused by EEPROM and other nonvolatile memories. Fast two-wire Serial interface (I2C) ❐ Up to 1-MHz frequency 2 ❐ Direct hardware replacement for serial (I C) EEPROM ❐ Supports legacy timings for 100 kHz and 400 kHz Unlike EEPROM, the CY15B064J performs write operations at bus speed. No write delays are incurred. Data is written to the memory array immediately after each byte is successfully transferred to the device. The next bus cycle can commence without the need for data polling. In addition, the product offers substantial write endurance compared with other nonvolatile memories. Also, F-RAM exhibits much lower power during writes than EEPROM since write operations do not require an internally elevated power supply voltage for write circuits. The CY15B064J is capable of supporting 1013 read/write cycles, or 10 million times more write cycles than EEPROM. ■ Low power consumption ❐ 120 A (typ) active current at 100 kHz ❐ 6 A (typ) standby current ■ Voltage operation: VDD = 3.0 V to 3.6 V ■ Automotive-E temperature: –40 C to +125 C ■ 8-pin small outline integrated circuit (SOIC) package ■ AEC Q100 Grade 1 compliant ■ Restriction of hazardous substances (RoHS) compliant These capabilities make the CY15B064J ideal for nonvolatile memory applications, requiring frequent or rapid writes. Examples range from data logging, where the number of write cycles may be critical, to demanding industrial controls where the long write time of EEPROM can cause data loss. The combination of features allows more frequent data writing with less overhead for the system. The CY15B064J provides substantial benefits to users of serial (I2C) EEPROM as a hardware drop-in replacement. The device specifications are guaranteed over an automotive-e temperature range of –40 C to +125 C. Logic Block Diagram Address Latch Counter 8Kx8 F-RAM Array 13 8 SDA Serial to Parallel Converter Data Latch 8 SCL WP Control Logic A2-A0 Cypress Semiconductor Corporation Document Number: 002-10027 Rev. *C • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised November 22, 2018 CY15B064J Contents Pinout ................................................................................ 3 Pin Definitions .................................................................. 3 Functional Overview ........................................................ 4 Memory Architecture ........................................................ 4 I2C Interface ...................................................................... 4 STOP Condition (P) ..................................................... 4 START Condition (S) ................................................... 4 Data/Address Transfer ................................................ 5 Acknowledge/No-acknowledge ................................... 5 Slave Device Address ................................................. 6 Addressing Overview .................................................. 6 Data Transfer .............................................................. 6 Memory Operation ............................................................ 6 Write Operation ........................................................... 6 Read Operation ........................................................... 7 Maximum Ratings ............................................................. 9 Operating Range ............................................................... 9 DC Electrical Characteristics .......................................... 9 Data Retention and Endurance ..................................... 10 Example of an F-RAM Life Time in an AEC-Q100 Automotive Application ..................... 10 Document Number: 002-10027 Rev. *C Capacitance .................................................................... 10 Thermal Resistance ........................................................ 10 AC Test Loads and Waveforms ..................................... 11 AC Test Conditions ........................................................ 11 AC Switching Characteristics ....................................... 12 Power Cycle Timing ....................................................... 13 Ordering Information ...................................................... 14 Ordering Code Definitions ......................................... 14 Package Diagram ............................................................ 15 Acronyms ........................................................................ 16 Document Conventions ................................................. 16 Units of Measure ....................................................... 16 Document History Page ................................................. 17 Sales, Solutions, and Legal Information ...................... 18 Worldwide Sales and Design Support ....................... 18 Products .................................................................... 18 PSoC® Solutions ...................................................... 18 Cypress Developer Community ................................. 18 Technical Support ..................................................... 18 Page 2 of 18 CY15B064J Pinout Figure 1. 8-pin SOIC pinout A0 1 A1 2 A2 3 VSS 4 Top View not to scale 8 VDD 7 WP 6 SCL 5 SDA Pin Definitions Pin Name I/O Type Description A2–A0 Input Device Select Address 2–0. These pins are used to select one of up to 8 devices of the same type on the same I2C bus. To select the device, the address value on the three pins must match the corresponding bits contained in the slave address. The address pins are pulled down internally. SDA Input/Output Serial Data/Address. This is a bi-directional pin for the I2C interface. It is open-drain and is intended to be wire-AND'd with other devices on the I2C bus. The input buffer incorporates a Schmitt trigger for noise immunity and the output driver includes slope control for falling edges. An external pull-up resistor is required. SCL Input Serial Clock. The serial clock pin for the I2C interface. Data is clocked out of the device on the falling edge, and into the device on the rising edge. The SCL input also incorporates a Schmitt trigger input for noise immunity. WP Input Write Protect. When tied to VDD, addresses in the entire memory map will be write-protected. When WP is connected to ground, all addresses are write enabled. This pin is pulled down internally. VSS Power supply Ground for the device. Must be connected to the ground of the system. VDD Power supply Power supply input to the device. Document Number: 002-10027 Rev. *C Page 3 of 18 CY15B064J Functional Overview a new bus transaction can be shifted into the device, a write operation is complete. This is explained in more detail in the interface section. The CY15B064J is a serial F-RAM memory. The memory array is logically organized as 8,192 × 8 bits and is accessed using an industry-standard I2C interface. The functional operation of the F-RAM is similar to serial (I2C) EEPROM. The major difference between the CY15B064J and a serial (I2C) EEPROM with the same pinout is the F-RAM's superior write performance, high endurance, and low power consumption. I2C Interface The CY15B064J employs a bi-directional I2C bus protocol using few pins or board space. Figure 2 illustrates a typical system configuration using the CY15B064J in a microcontroller-based system. The industry standard I2C bus is familiar to many users but is described in this section. Memory Architecture By convention, any device that is sending data onto the bus is the transmitter while the target device for this data is the receiver. The device that is controlling the bus is the master. The master is responsible for generating the clock signal for all operations. Any device on the bus that is being controlled is a slave. The CY15B064J is always a slave device. When accessing the CY15B064J, the user addresses 8K locations of eight data bits each. These eight data bits are shifted in or out serially. The addresses are accessed using the I2C protocol, which includes a slave address (to distinguish other non-memory devices) and a two-byte address. The upper 3 bits of the address range are 'don't care' values. The complete address of 13 bits specifies each byte address uniquely. The bus protocol is controlled by transition states in the SDA and SCL signals. There are four conditions including START, STOP, data bit, or acknowledge. Figure 3 on page 5 and Figure 4 on page 5 illustrates the signal conditions that specify the four states. Detailed timing diagrams are shown in the electrical specifications section. The access time for the memory operation is essentially zero, beyond the time needed for the serial protocol. That is, the memory is read or written at the speed of the I2C bus. Unlike a serial (I2C) EEPROM, it is not necessary to poll the device for a ready condition because writes occur at bus speed. By the time Figure 2. System Configuration using Serial (I2C) nvSRAM RPmin = (VDD - VOLmax) / IOL V DD RPmax = tr / (0.8473 * Cb) SDA Microcontroller SCL V DD V DD A0 A1 A2 SCL A0 SCL A0 SCL SDA A1 SDA A1 SDA WP A2 WP #0 #1 A2 WP #7 STOP Condition (P) START Condition (S) A STOP condition is indicated when the bus master drives SDA from LOW to HIGH while the SCL signal is HIGH. All operations using the CY15B064J should end with a STOP condition. If an operation is in progress when a STOP is asserted, the operation will be aborted. The master must have control of SDA in order to assert a STOP condition. A START condition is indicated when the bus master drives SDA from HIGH to LOW while the SCL signal is HIGH. All commands should be preceded by a START condition. An operation in progress can be aborted by asserting a START condition at any time. Aborting an operation using the START condition will ready the CY15B064J for a new operation. If during operation the power supply drops below the specified VDD minimum, the system should issue a START condition prior to performing another operation. Document Number: 002-10027 Rev. *C Page 4 of 18 CY15B064J Figure 3. START and STOP Conditions full pagewidth SDA SDA SCL SCL S P STOP Condition START Condition Figure 4. Data Transfer on the I2C Bus handbook, full pagewidth P SDA Acknowledgement signal from slave MSB SCL S 1 2 7 9 8 1 Acknowledgement signal from receiver 2 3 4-8 ACK START condition 9 ACK All data transfers (including addresses) take place while the SCL signal is HIGH. Except under the three conditions described above, the SDA signal should not change while SCL is HIGH. Acknowledge/No-acknowledge The acknowledge takes place after the 8th data bit has been transferred in any transaction. During this state the transmitter should release the SDA bus to allow the receiver to drive it. The receiver drives the SDA signal LOW to acknowledge receipt of the byte. If the receiver does not drive SDA LOW, the condition is a no-acknowledge and the operation is aborted. S or P STOP or START condition Byte complete Data/Address Transfer S The receiver would fail to acknowledge for two distinct reasons. First is that a byte transfer fails. In this case, the no-acknowledge ceases the current operation so that the device can be addressed again. This allows the last byte to be recovered in the event of a communication error. Second and most common, the receiver does not acknowledge to deliberately end an operation. For example, during a read operation, the CY15B064J will continue to place data onto the bus as long as the receiver sends acknowledges (and clocks). When a read operation is complete and no more data is needed, the receiver must not acknowledge the last byte. If the receiver acknowledges the last byte, this will cause the CY15B064J to attempt to drive the bus on the next clock while the master is sending a new command such as STOP. Figure 5. Acknowledge on the I2C Bus handbook, full pagewidth DATA OUTPUT BY MASTER No Acknowledge DATA OUTPUT BY SLAVE Acknowledge SCL FROM MASTER 1 2 8 9 S START Condition Document Number: 002-10027 Rev. *C Clock pulse for acknowledgement Page 5 of 18 CY15B064J Slave Device Address acknowledge occurs, the CY15B064J will transfer the next sequential byte. If the acknowledge is not sent, the CY15B064J will end the read operation. For a write operation, the CY15B064J will accept 8 data bits from the master then send an acknowledge. All data transfer occurs MSB (most significant bit) first. The first byte that the CY15B064J expects after a START condition is the slave address. As shown in Figure 6, the slave address contains the device type or slave ID, the device select address bits, and a bit that specifies if the transaction is a read or a write. Memory Operation Bits 7–4 are the device type (slave ID) and should be set to 1010b for the CY15B064J. These bits allow other function types to reside on the I2C bus within an identical address range. Bits 3–1 are the device select address bits. They must match the corresponding value on the external address pins to select the device. Up to eight CY15B064J devices can reside on the same I2C bus by assigning a different address to each. Bit 0 is the read/write bit (R/W). R/W = ‘1’ indicates a read operation and R/W = ‘0’ indicates a write operation. The CY15B064J is designed to operate in a manner very similar to other I2C interface memory products. The major differences result from the higher performance write capability of F-RAM technology. These improvements result in some differences between the CY15B064J and a similar configuration EEPROM during writes. The complete operation for both writes and reads is explained below. Write Operation Figure 6. Memory Slave Device Address MSB handbook, halfpage 1 All writes begin with a slave address, then a memory address. The bus master indicates a write operation by setting the LSB of the slave address (R/W bit) to a ‘0’. After addressing, the bus master sends each byte of data to the memory and the memory generates an acknowledge condition. Any number of sequential bytes may be written. If the end of the address range is reached internally, the address counter will wrap from 1FFFh to 0000h. LSB 0 1 Slave ID 0 A2 A1 A0 R/W Device Select Addressing Overview Unlike other nonvolatile memory technologies, there is no effective write delay with F-RAM. Since the read and write access times of the underlying memory are the same, the user experiences no delay through the bus. The entire memory cycle occurs in less time than a single bus clock. Therefore, any operation including read or write can occur immediately following a write. Acknowledge polling, a technique used with EEPROMs to determine if a write is complete is unnecessary and will always return a ready condition. After the CY15B064J (as receiver) acknowledges the slave address, the master can place the memory address on the bus for a write operation. The address requires two bytes. The complete 13-bit address is latched internally. Each access causes the latched address value to be incremented automatically. The current address is the value that is held in the latch; either a newly written value or the address following the last access. The current address will be held for as long as power remains or until a new value is written. Reads always use the current address. A random read address can be loaded by beginning a write operation as explained below. Internally, an actual memory write occurs after the 8th data bit is transferred. It will be complete before the acknowledge is sent. Therefore, if the user desires to abort a write without altering the memory contents, this should be done using START or STOP condition prior to the 8th data bit. The CY15B064J uses no page buffering. After transmission of each data byte, just prior to the acknowledge, the CY15B064J increments the internal address latch. This allows the next sequential byte to be accessed with no additional addressing. After the last address (1FFFh) is reached, the address latch will roll over to 0000h. There is no limit to the number of bytes that can be accessed with a single read or write operation. The memory array can be write-protected using the WP pin. Setting the WP pin to a HIGH condition (VDD) will write-protect all addresses. The CY15B064J will not acknowledge data bytes that are written to protected addresses. In addition, the address counter will not increment if writes are attempted to these addresses. Setting WP to a LOW state (VSS) will disable the write protect. WP is pulled down internally. Data Transfer After the address bytes have been transmitted, data transfer between the bus master and the CY15B064J can begin. For a read operation the CY15B064J will place 8 data bits on the bus then wait for an acknowledge from the master. If the Figure 7 and Figure 8 on page 7 below illustrate a single-byte and multiple-byte write cycles. Figure 7. Single-Byte Write By Master Start S Stop Address & Data Slave Address By F-RAM Document Number: 002-10027 Rev. *C 0 A Address MSB A Address LSB A Data Byte A P Acknowledge Page 6 of 18 CY15B064J Figure 8. Multi-Byte Write Start Stop Address & Data By Master S Slave Address 0 A Address MSB By F-RAM A Address LSB A Data Byte A Data Byte A P Acknowledge Read Operation There are two basic types of read operations. They are current address read and selective address read. In a current address read, the CY15B064J uses the internal address latch to supply the address. In a selective read, the user performs a procedure to set the address to a specific value. Current Address & Sequential Read As mentioned above the CY15B064J uses an internal latch to supply the address for a read operation. A current address read uses the existing value in the address latch as a starting place for the read operation. The system reads from the address immediately following that of the last operation. To perform a current address read, the bus master supplies a slave address with the LSB set to a ‘1’. This indicates that a read operation is requested. After receiving the complete slave address, the CY15B064J will begin shifting out data from the current address on the next clock. The current address is the value held in the internal address latch. Beginning with the current address, the bus master can read any number of bytes. Thus, a sequential read is simply a current address read with multiple byte transfers. After each byte the internal address counter will be incremented. Note Each time the bus master acknowledges a byte, this indicates that the CY15B064J should read out the next sequential byte. There are four ways to properly terminate a read operation. Failing to properly terminate the read will most likely create a bus contention as the CY15B064J attempts to read out additional data onto the bus. The four valid methods are: 1. The bus master issues a no-acknowledge in the 9th clock cycle and a STOP in the 10th clock cycle. This is illustrated in the diagrams below. This is preferred. 2. The bus master issues a no-acknowledge in the 9th clock cycle and a START in the 10th. 3. The bus master issues a STOP in the 9th clock cycle. 4. The bus master issues a START in the 9th clock cycle. If the internal address reaches 1FFFh, it will wrap around to 0000h on the next read cycle. Figure 9 and Figure 10 below show the proper operation for current address reads. Figure 9. Current Address Read By Master Start No Acknowledge Address Stop S Slave Address By F-RAM 1 A Acknowledge Data Byte 1 P Data Figure 10. Sequential Read By Master Start No Acknowledge Acknowledge Address Stop S Slave Address By F-RAM Document Number: 002-10027 Rev. *C 1 A Acknowledge Data Byte A Data Byte 1 P Data Page 7 of 18 CY15B064J Selective (Random) Read There is a simple technique that allows a user to select a random address location as the starting point for a read operation. This involves using the first three bytes of a write operation to set the internal address followed by subsequent read operations. To perform a selective read, the bus master sends out the slave address with the LSB (R/W) set to 0. This specifies a write operation. According to the write protocol, the bus master then sends the address bytes that are loaded into the internal address latch. After the CY15B064J acknowledges the address, the bus master issues a START condition. This simultaneously aborts the write operation and allows the read command to be issued with the slave address LSB set to a ‘1’. The operation is now a current address read. Figure 11. Selective (Random) Read Start Address By Master Start No Acknowledge Address Stop S Slave Address 0 A By F-RAM Document Number: 002-10027 Rev. *C Address MSB A Address LSB Acknowledge A S Slave Address 1 A Data Byte 1 P Data Page 8 of 18 CY15B064J Maximum Ratings Transient voltage (< 20 ns) on any pin to ground potential ............ –2.0 V to VDD + 2.0 V Exceeding maximum ratings may shorten the useful life of the device. These user guidelines are not tested. Package power dissipation capability (TA = 25 °C) ................................................................. 1.0 W Storage temperature ................................ –65 °C to +150 °C Surface mount lead soldering temperature (10 seconds) ............................................................ +260 C Maximum accumulated storage time At 150 °C ambient temperature ................................. 1000 h At 125 °C ambient temperature ................................11000 h At 85 °C ambient temperature .............................. 121 Years Ambient temperature with power applied ................................... –55 °C to +125 °C Supply voltage on VDD relative to VSS .........–1.0 V to +4.5 V Input voltage .......... –1.0 V to + 4.5 V and VIN < VDD + 1.0 V DC voltage applied to outputs in High-Z state .................................... –0.5 V to VDD + 0.5 V Electrostatic Discharge Voltage [1] Human Body Model (AEC-Q100-002 Rev. E) ..................... 2 kV Charged Device Model (AEC-Q100-011 Rev. B) ................ 500 V Latch-up current .................................................... > 140 mA * Exception: The “VIN < VDD + 1.0 V” restriction does not apply to the SCL and SDA inputs. Operating Range Range Ambient Temperature (TA) VDD Automotive-E –40 C to +125 C 3.0 V to 3.6 V DC Electrical Characteristics Over the Operating Range Parameter Description VDD Power supply IDD Average VDD current Min Typ [2] Max Unit 3.0 3.3 3.6 V fSCL = 100 kHz – – 120 A fSCL = 400 kHz – – 200 A fSCL = 1 MHz – – 340 A Test Conditions SCL toggling between VDD – 0.2 V and VSS, other inputs VSS or VDD – 0.2 V. SCL = SDA = VDD. All TA = 85 C other inputs VSS or T = 125 C VDD. Stop command A issued. – – 6 A – – 20 A Input leakage current (Except WP and A2–A0) VSS < VIN < VDD –1 – +1 A Input leakage current (for WP and A2–A0) VSS < VIN < VDD –1 – +100 A ILO Output leakage current VSS < VIN < VDD –1 – +1 A VIH Input HIGH voltage 0.75 × VDD – VDD + 0.3 V VIL Input LOW voltage –0.3 – 0.25 × VDD V ISB ILI VOL Rin [3] Standby current Output LOW voltage IOL = 3 mA – – 0.4 V Input resistance (WP, A2–A0) For VIN = VIL (Max) 40 – – k 1 – – M 0.05 × VDD – – V For VIN = VIH (Min) VHYS[4] Input hysteresis Notes 1. Electrostatic Discharge voltages specified in the datasheet are the AEC-Q100 standard limits used for qualifying the device. To know the maximum value device passes for, please refer to the device qualification report available on the website. 2. Typical values are at 25 °C, VDD = VDD (typ). Not 100% tested. 3. The input pull-down circuit is strong (40 k) when the input voltage is below VIL and weak (1 M) when the input voltage is above VIH. 4. This parameter is guaranteed by design and is not tested. Document Number: 002-10027 Rev. *C Page 9 of 18 CY15B064J Data Retention and Endurance Parameter TDR NVC Description Data retention Endurance Min Max Unit TA = 125 C Test condition 11000 – Hours TA = 105 C 11 – Years TA = 85 C 121 – Years 13 – Cycles Over Operating Temperature 10 Example of an F-RAM Life Time in an AEC-Q100 Automotive Application An application does not operate under a steady temperature for the entire usage life time of the application. Instead, it is often expected to operate in multiple temperature environments throughout the application’s usage life time. Accordingly, the retention specification for F-RAM in applications often needs to be calculated cumulatively. An example calculation for a multi-temperature thermal profiles is given below. Acceleration Factor with respect to Tmax A [5] Temperature T Time Factor t LT A = ----------------------- = e L  Tmax  Ea  1 1  ------- --- – --------------k  T Tmax T1 = 125 C t1 = 0.1 T2 = 105 C t2 = 0.15 A2 = 8.67 T3 = 85 C t3 = 0.25 A3 = 95.68 T4 = 55 C t4 = 0.50 A4 = 6074.80 Profile Factor P Profile Life Time L (P) 1 P = ------------------------------------------------------t1- + -----t2- + -----t3- + -----t4-  ----- A1 A2 A3 A4 L  P  = P  L  Tmax  8.33 > 10.46 Years A1 = 1 Capacitance Parameter [6] Description CO Output pin capacitance (SDA) CI Input pin capacitance Test Conditions Max Unit 8 pF 6 pF Test Conditions 8-pin SOIC Unit Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/JESD51. 147 C/W 47 C/W TA = 25 C, f = 1 MHz, VDD = VDD(typ) Thermal Resistance Parameter [6] Description JA Thermal resistance (junction to ambient) JC Thermal resistance (junction to case) Notes 5. Where k is the Boltzmann constant 8.617 × 10-5 eV/K, Tmax is the highest temperature specified for the product, and T is any temperature within the F-RAM product specification. All temperatures are in Kelvin in the equation. 6. This parameter is periodically sampled and not 100% tested. Document Number: 002-10027 Rev. *C Page 10 of 18 CY15B064J AC Test Loads and Waveforms Figure 12. AC Test Loads and Waveforms 3.6 V 1.8 k OUTPUT 100 pF AC Test Conditions Input pulse levels .................................10% and 90% of VDD Input rise and fall times .................................................10 ns Input and output timing reference levels ................0.5 × VDD Output load capacitance ............................................ 100 pF Document Number: 002-10027 Rev. *C Page 11 of 18 CY15B064J AC Switching Characteristics Over the Operating Range Parameters [7] Cypress Parameter Description Alt. Parameter Min Max Min Max Min Max Unit – 0.1 – 0.4 – 1.0 MHz fSCL[8] SCL clock frequency tSU; STA Start condition setup for repeated Start 4.7 – 0.6 – 0.25 – s tHD;STA Start condition hold time 4.0 – 0.6 – 0.25 – s tLOW Clock LOW period 4.7 – 1.3 – 0.6 – s tHIGH Clock HIGH period 4.0 – 0.6 – 0.4 – s tSU;DAT tSU;DATA Data in setup 250 – 100 – 100 – ns tHD;DAT tHD;DATA Data in hold 0 – 0 – 0 – ns Data output hold (from SCL @ VIL) 0 – 0 – 0 – ns – 1000 – 300 – 300 ns tDH [9] tr Input rise time tF[9] tf Input fall time tR – 300 – 300 – 100 ns 4.0 – 0.6 – 0.25 – s SCL LOW to SDA Data Out Valid – 3 – 0.9 – 0.55 s tBUF Bus free before new transmission 4.7 – 1.3 – 0.5 – s tSP Noise suppression time constant on SCL, SDA – 50 – 50 – 50 ns tSU;STO STOP condition setup tAA tVD;DATA Figure 13. Read Bus Timing Diagram tR ` tF tHIGH tSP tLOW tSP SCL tSU:SDA 1/fSCL tBUF tHD:DAT tSU:DAT SDA tDH tAA Stop Start Start Acknowledge Figure 14. Write Bus Timing Diagram tHD:DAT SCL tHD:STA tSU:STO tSU:DAT tAA SDA Start Stop Start Acknowledge Notes 7. Test conditions assume signal transition time of 10 ns or less, timing reference levels of VDD/2, input pulse levels of 0 to VDD(typ), and output loading of the specified IOL and load capacitance shown in Figure 12. 8. The speed-related specifications are guaranteed characteristic points along a continuous curve of operation from DC to fSCL (max). 9. These parameters are guaranteed by design and are not tested. Document Number: 002-10027 Rev. *C Page 12 of 18 CY15B064J Power Cycle Timing Over the Operating Range Parameter Description Min Max Unit tPU Power-up VDD(min) to first access (START condition) 1 – ms tPD Last access (STOP condition) to power-down (VDD(min)) 0 – µs tVR [10, 11] VDD power-up ramp rate 30 – µs/V tVF [10, 11] VDD power-down ramp rate 20 – µs/V VDD ~ ~ Figure 15. Power Cycle Timing VDD(min) tVR SDA I2 C START tVF tPD ~ ~ tPU VDD(min) I2 C STOP Notes 10. Slope measured at any point on the VDD waveform. 11. Guaranteed by design. Document Number: 002-10027 Rev. *C Page 13 of 18 CY15B064J Ordering Information Package Diagram Ordering Code Package Type CY15B064J-SXE 51-85066 8-pin SOIC CY15B064J-SXET 51-85066 8-pin SOIC Operating Range Automotive-E All these parts are Pb-free. Contact your local Cypress sales representative for availability of these parts. Ordering Code Definitions CY 15 B 064 J - S X E X Option: X = blank or T blank = Standard; T = Tape and Reel Temperature Range: E = Automotive-E (–40 C to +125 C) X = Pb-free Package Type: S = 8-pin SOIC Q = I2C F-RAM Density: 064 = 64-kbit Voltage: B = 2.0 V to 3.6 V F-RAM Company ID: CY = Cypress Document Number: 002-10027 Rev. *C Page 14 of 18 CY15B064J Package Diagram Figure 16. 8-pin SOIC (150 Mils) Package Outline, 51-85066 51-85066 *I Document Number: 002-10027 Rev. *C Page 15 of 18 CY15B064J Acronyms Acronym Document Conventions Description Units of Measure ACK Acknowledge CMOS Complementary Metal Oxide Semiconductor °C degree Celsius EIA Electronic Industries Alliance Hz hertz I2C Inter-Integrated Circuit Kb 1024 bit I/O Input/Output kHz kilohertz JEDEC Joint Electron Devices Engineering Council k kilohm LSB Least Significant Bit MHz megahertz MSB Most Significant Bit M megaohm NACK No Acknowledge A microampere RoHS Restriction of Hazardous Substances s microsecond R/W Read/Write mA milliampere SCL Serial Clock Line ms millisecond ns nanosecond SDA Serial Data Access  ohm SOIC Small Outline Integrated Circuit % percent WP Write Protect pF picofarad V volt W watt Document Number: 002-10027 Rev. *C Symbol Unit of Measure Page 16 of 18 CY15B064J Document History Page Document Title: CY15B064J, 64-Kbit (8K × 8) Serial (I2C) Automotive F-RAM Document Number: 002-10027 Rev. ECN No. Orig. of Change Submission Date ** 5023918 GVCH 12/02/2015 New data sheet. *A 5568261 GVCH 01/27/2017 Changed status from Preliminary to Final. Updated Maximum Ratings: Updated Electrostatic Discharge Voltage (in compliance with AEC-Q100 standard): Changed value of “Human Body Model” from 4 kV to 2 kV. Changed value of “Charged Device Model” from 1.25 kV to 500 V. Removed Machine Model related information. Updated Ordering Information: Updated part numbers. Updated to new template. *B 5693278 GVCH 04/12/2017 Updated Maximum Ratings: Added Note 1 and referred the same note in “Electrostatic Discharge Voltage”. Updated to new template. *C 6391616 GVCH 11/22/2018 Updated Maximum Ratings: Replaced “–55 °C to +150 °C” with “–65 °C to +150 °C” in ratings corresponding to “Storage temperature”. Updated Package Diagram: spec 51-85066 – Changed revision from *H to *I. Updated to new template. Completing Sunset Review. Document Number: 002-10027 Rev. *C Description of Change Page 17 of 18 CY15B064J Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Arm® Cortex® Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface cypress.com/clocks cypress.com/interface Internet of Things Memory cypress.com/iot cypress.com/memory Microcontrollers cypress.com/mcu PSoC cypress.com/psoc Power Management ICs Cypress Developer Community Community | Projects | Video | Blogs | Training | Components Technical Support cypress.com/support cypress.com/pmic Touch Sensing cypress.com/touch USB Controllers Wireless Connectivity PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 MCU cypress.com/usb cypress.com/wireless © Cypress Semiconductor Corporation, 2015–2018. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). This document, including any software or firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress’s patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation of the Software is prohibited. TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. No computing device can be absolutely secure. Therefore, despite security measures implemented in Cypress hardware or software products, Cypress does not assume any liability arising out of any security breach, such as unauthorized access to or use of a Cypress product. In addition, the products described in these materials may contain design defects or errors known as errata which may cause the product to deviate from published specifications. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage (“Unintended Uses”). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 002-10027 Rev. *C Revised November 22, 2018 Page 18 of 18
CY15B064J-SXET
1. 物料型号:型号为STM32F103C8T6,是一款基于ARM Cortex-M3内核的32位微控制器。

2. 器件简介:该器件是意法半导体生产的高性能微控制器,具有多种通信接口和外设,适用于多种嵌入式应用。

3. 引脚分配:该芯片共有48个引脚,包括电源引脚、地引脚、I/O引脚等,具体分配需参考芯片手册。

4. 参数特性:主频72MHz,内置64KB Flash和20KB RAM,工作电压2.0V至3.6V,工作温度范围-40至+85摄氏度。

5. 功能详解:包括GPIO、ADC、定时器、通信接口(UART、SPI、I2C)等模块的详细介绍。

6. 应用信息:适用于工业控制、医疗设备、消费电子等多种应用场景。
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