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CY22801KSXC-021

CY22801KSXC-021

  • 厂商:

    CYPRESS(赛普拉斯)

  • 封装:

    SOICN-8_4.9X3.9MM

  • 描述:

    IC CLOCK GENERATOR

  • 数据手册
  • 价格&库存
CY22801KSXC-021 数据手册
Product Folder Sample & Buy Support & Community Tools & Software Technical Documents CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 CDCE(L)913: Flexible Low Power LVCMOS Clock Generator With SSC Support for EMI Reduction 1 Features • 1 • • • • • • • • • • Member of Programmable Clock Generator Family – CDCEx913: 1 PLLs, 3 Outputs – CDCEx925: 2 PLLs, 5 Outputs – CDCEx937: 3 PLLs, 7 Outputs – CDCEx949: 4 PLLs, 9 Outputs In-System Programmability and EEPROM – Serial Programmable Volatile Register – Nonvolatile EEPROM to Store Customer Settings Flexible Input Clocking Concept – External Crystal: 8 to 32 MHz – On-Chip VCXO: Pull-Range ±150 ppm – Single-Ended LVCMOS Up to 160 MHz Free Selectable Output Frequency Up to 230 MHz Low-Noise PLL Core – PLL Loop Filter Components Integrated – Low Period Jitter (Typical 60 ps) Separate Output Supply Pins – CDCE949: 3.3 V and 2.5 V – CDCEL949: 1.8 V Flexible Clock Driver – Three User-Definable Control Inputs [S0/S1/S2], for Example, SSC Selection, Frequency Switching, Output Enable or Power Down – Generates Highly Accurate Clocks for Video, Audio, USB, IEEE1394, RFID, Bluetooth®, WLAN, Ethernet™, and GPS – Generates Common Clock Frequencies Used With TI-DaVinci™, OMAP™, DSPs – Programmable SSC Modulation – Enables 0-PPM Clock Generation 1.8-V Device Core Supply Wide Temperature Range: –40°C to 85°C Packaged in TSSOP Development and Programming Kit for Easy PLL Design and Programming (TI Pro-Clock™) 2 Applications D-TVs, STBs, IP-STBs, DVD Players, DVD Recorders, and Printers 3 Description The CDCE949 and CDCEL949 are modular PLLbased low cost, high-performance, programmable clock synthesizers, multipliers and dividers. They generate up to 9 output clocks from a single input frequency. Each output can be programmed insystem for any clock frequency up to 230 MHz, using up to four independent configurable PLLs. The CDCEx949 has separate output supply pins, VDDOUT, 1.8 V for the CDCEL949, and 2.5 V to 3.3 V for CDCE949. The input accepts an external crystal or LVCMOS clock signal. If an external crystal is used, an on-chip load capacitor is adequate for most applications. The value of the load capacitor is programmable from 0 to 20 pF. Additionally, an on-chip VCXO is selectable, allowing synchronization of the output frequency to an external control signal, that is, a PWM signal. Device Information(1) PART NUMBER CDCE949 CDCEL949 PACKAGE TSSOP (24) BODY SIZE (NOM) 7.80 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Schematic Ethernet PHY USB Controller CDCE(L)9xx Clock 25 MHz WiFi FPGA Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description (continued)......................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 8 9 1 1 1 2 4 4 5 Absolute Maximum Ratings ...................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 6 Thermal Information .................................................. 6 Electrical Characteristics........................................... 7 EEPROM Specification ............................................. 8 Timing Requirements: CLK_IN ................................. 9 Timing Requirements: SDA/SCL .............................. 9 Typical Characteristics ............................................ 10 Parameter Measurement Information ................ 11 Detailed Description ............................................ 12 9.1 Overview ................................................................. 12 9.2 Functional Block Diagram ....................................... 13 9.3 Feature Description................................................. 13 9.4 Device Functional Modes........................................ 16 9.5 Programming........................................................... 17 9.6 Register Maps ......................................................... 18 10 Application and Implementation........................ 27 10.1 Application Information.......................................... 27 10.2 Typical Application ................................................ 27 11 Power Supply Recommendations ..................... 31 12 Layout................................................................... 31 12.1 Layout Guidelines ................................................. 31 12.2 Layout Example .................................................... 32 13 Device and Documentation Support ................. 33 13.1 13.2 13.3 13.4 13.5 13.6 13.7 13.8 Device Support...................................................... Related Documentation......................................... Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 33 33 33 33 33 33 34 34 14 Mechanical, Packaging, and Orderable Information ........................................................... 34 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (August 2016) to Revision F • Page Changed data sheet title from: CDCEx949 Programmable 4-PLL VCXO Clock Synthesizer With 1.8-V, 2.5-V, and 3.3-V LVCMOS Outputs to: CDCE(L)913: Flexible Low Power LVCMOS Clock Generator With SSC Support for EMI Reduction................................................................................................................................................................................ 1 Changes from Revision D (March 2010) to Revision E Page • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1 • Condensed down bullets in Features ..................................................................................................................................... 1 • Deleted 'General Purpose Frequency Synthesizing' from Applications ................................................................................. 1 • Updated values in the Thermal Information table to align with JEDEC standards ................................................................ 6 • Changed Byte Read Protocol image, second S to Sr .......................................................................................................... 18 • Changed 100 MHz < ƒVCO > 200 MHz; TO 80 MHz ≤ ƒVCO ≤ 230 MHz; and changed 0 ≤ p ≤ 7 TO 0 ≤ p ≤ 4 ................... 29 • Changed under Example, fifth row, N", 2 places TO N' ....................................................................................................... 29 Changes from Revision C (October 2009) to Revision D • 2 Page Added PLL settings limits: 16 ≤ q ≤ 63, 0 ≤ p ≤ 7, 0 ≤ r ≤ 511, 0 < N < 4096 foot to PLL1, PLL2, PLL3, & PLL4 Configure Register Table...................................................................................................................................................... 22 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 Changes from Revision B (September 2009) to Revision C • Page Deleted sentence - A different default setting can be programmed on customer request. Contact Texas Instruments sales or marketing representative for more information. ...................................................................................................... 15 Changes from Revision A (December 2007) to Revision B • Page Added Note 3: SDA and SCL can go up to 3.6 V as stated in the Recommended Operating Conditions table ................... 6 Changes from Original (August 2007) to Revision A Page • Changed the THERMAL RESISTANCE FOR TSSOP table .................................................................................................. 6 • Changed Generic Configuration Register table RID From: 0h To: Xb ................................................................................. 19 • Added note to the PWDN description, Generic Configuration Register table ...................................................................... 19 Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 3 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com 5 Description (continued) The deep M/N divider ratio allows the generation of zero-ppm audio or video, networking (WLAN, BlueTooth™, Ethernet, GPS) or Interface (USB, IEEE1394, Memory Stick) clocks from a reference input frequency, such as 27 MHz. All PLLs support SSC (Spread-Spectrum Clocking). SSC can be Center-Spread or Down-Spread clocking. This is a common technique to reduce electro-magnetic interference (EMI). Based on the PLL frequency and the divider settings, the internal loop-filter components are automatically adjusted to achieve high stability, and to optimize the jitter-transfer characteristics of each PLL. The device supports non-volatile EEPROM programming for easy customization of the device to the application. It is preset to a factory-default configuration. It can be reprogrammed to a different application configuration before PCB assembly, or reprogrammed by in-system programming. All device settings are programmable through the SDA and SCL bus, a 2-wire serial interface. Three programmable control inputs, S0, S1 and S2, can be used to control various aspects of operation including frequency selection, changing the SSC parameters to lower EMI, PLL bypass, power down, and choosing between low level or 3-state for the output-disable function. The CDCEx949 operates in a 1.8-V environment. It operates within a temperature range of –40°C to 85°C. 6 Pin Configuration and Functions PW Package 24-Pin TSSOP (Top View) Xin/CLK 1 24 Xout S0 2 23 SDA/S1 VDD 3 22 SCL/S2 VCtrl 4 21 Y1 GND 5 20 GND VDDOUT 6 19 Y2 Y4 7 18 Y3 Y5 8 17 VDDOUT GND 9 16 Y6 VDDOUT 10 15 Y7 Y8 11 14 GND Y9 12 13 VDD Not to scale Pin Functions PIN NAME NO. GND SCL/S2 (1) 4 TYPE (1) DESCRIPTION 5, 9, 14, 20 G Ground 22 I SCL: Serial clock input (default configuration), LVCMOS; internal pullup 500 kΩ; or S2: User-programmable control input; LVCMOS inputs; internal pullup 500 kΩ G = Ground, I = Input, O = Output, P = Power Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 Pin Functions (continued) PIN NAME NO. TYPE (1) DESCRIPTION SDA: Bidirectional serial data input/output (default configuration), LVCMOS; internal pullup 500 kΩ; or S1: User-programmable control input; LVCMOS inputs; internal pullup 500 kΩ SDA/S1 23 I/O S0 2 I User-programmable control input S0; LVCMOS inputs; internal pullup 500 kΩ VCtrl 4 I VCXO control voltage (leave open or pull up when not used) VDD 3, 13 P 1.8-V power supply for the device VDDOUT 6, 10, 17 P Xin/CLK 1 I Crystal oscillator input or LVCMOS clock input (selectable through SDA/SCL bus) Xout 24 O Crystal oscillator output (leave open or pull up when not used) Y1 21 Y2 19 Y3 18 Y4 7 O LVCMOS output Y5 8 Y6 16 Y7 15 Y8 11 Y9 12 CDCEL949: 1.8-V supply for all outputs CDCE949: 3.3-V or 2.5-V supply for all outputs 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) VDD Supply voltage VI Input voltage (2) (3) (2) MIN MAX UNIT –0.5 2.5 V –0.5 VDD + 0.5 V –0.5 VDDOUT + 0.5 V 20 mA VO Output voltage II Input current (VI < 0, VI > VDD) IO Continuous output current 50 mA TJ Junction temperature 125 °C Tstg Storage temperature 150 °C (1) (2) (3) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. The input and output negative voltage ratings may be exceeded if the input and output clamp–current ratings are observed. SDA and SCL can go up to 3.6 V as stated in the Recommended Operating Conditions table. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 5 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com 7.3 Recommended Operating Conditions VDD Device supply voltage VDD(OUT) Output Yx supply voltage VIL Low level input voltage LVCMOS VIH High level input voltage LVCMOS VI(thresh) Input voltage threshold LVCMOS VIS Input voltage VICLK Input voltage CLK IOH /IOL MIN NOM MAX 1.7 1.8 1.9 CDCE949 2.3 3.6 CDCEL949 1.7 1.9 0.3 × VDD 0.7 × VDD CL Output load LVCMOS TA Operating free-air temperature V V V V 0.5 × VDD V S0 0 1.9 S1, S2, SDA, SCL, VIthresh = 0.5 × VDD 0 3.6 0 Output current UNIT V 1.9 V VDDout = 3.3 V ±12 mA VDDout = 2.5 V ±10 mA VDDout = 1.8 V ±8 mA 10 pF 85 °C 32 MHz –40 CRYSTAL AND VCXO (1) fXtal Crystal Input frequency (fundamental mode) ESR Effective series resistance fPR Pulling (0 V ≤ VCtrl ≤ 1.8 V) (2) V(Ctrl) Frequency control voltage C0/C1 Pullability ratio CL On-chip load capacitance at Xin and Xout (1) (2) 8 27 100 ±120 ±150 Ω ppm 0 VDD V 220 0 20 pF For more information about VCXO configuration and crystal recommendation, see VCXO Application Guideline for CDCE(L)9xx Family (SCAA085). Pulling range depends on crystal type, on-chip crystal load capacitance and PCB stray capacitance; pulling range of min ±120 ppm applies for crystal listed in VCXO Application Guideline for CDCE(L)9xx Family (SCAA085). 7.4 Thermal Information CDCEx949 THERMAL METRIC (1) PW (TSSOP) UNIT 24 PINS Junction-to-ambient thermal resistance θJA (2) Airflow 0 (LFM) 91 Airflow 150 (LFM) 75 Airflow 200 (LFM) 74 Airflow 250 (LFM) 73 Airflow 500 (LFM) θJCtop Junction-to-case (top) thermal resistance θJB ψJT °C/W 65 0.5 °C/W Junction-to-board thermal resistance 52 °C/W Junction-to-top characterization parameter 0.5 °C/W ψJB Junction-to-board characterization parameter 50.1 °C/W θJCbot Junction-to-case (bottom) thermal resistance 50 °C/W (1) (2) 6 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board). Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 7.5 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN All PLLs on TYP (1) MAX 38 UNIT IDD Supply current (see Figure 1) All outputs off, fCLK = 27 MHz, fVCO= 135 MHz IDD(OUT) Supply current (see Figure 2 and Figure 3) No load, all outputs on, fout = 27 MHz IDD(PD) Power down current Every circuit powered down except SDA/SCL, fIN = 0 MHz, VDD = 1.9 V V(PUC) Supply voltage VDD threshold for power up control circuit 0.85 1.45 V fVCO VCO frequency range of PLL 80 230 MHz fOUT LVCMOS output frequency Per PLL 9 CDCE949 VDDOUT = 3.3 V 4 CDCEL949 VDDOUT = 1.8 V 2 mA mA 50 µA 230 MHz LVCMOS VIK LVCMOS input voltage VDD = 1.7 V, II = –18 mA II LVCMOS input current VI = 0 V or VDD, VDD = 1.9 V IIH LVCMOS input current for S0/S1/S2 IIL CI –1.2 V ±5 µA VI = VDD, VDD = 1.9 V 5 µA LVCMOS input current for S0/S1/S2 VI = 0 V, VDD = 1.9 V –4 µA Input capacitance at Xin/Clk VICLK = 0 V or VDD 6 Input capacitance at Xout VIXout = 0 V or VDD 2 Input capacitance at S0/S1/S2 VIS = 0 V or VDD 3 pF CDCE949 – LVCMOS FOR VDDOUT = 3.3 V LVCMOS high-level output voltage VOH LVCMOS low-level output voltage VOL VDDOUT = 3 V, IOH = –0.1 mA 2.9 VDDOUT = 3 V, IOH = –8 mA 2.4 VDDOUT = 3 V, IOH = –12 mA 2.2 V VDDOUT = 3 V, IOL = 0.1 mA 0.1 VDDOUT = 3 V, IOL = 8 mA 0.5 VDDOUT = 3 V, IOL = 12 mA 0.8 tPLH, tPHL Propagation delay PLL bypass 3.2 tr/tf Rise and fall time VDDOUT = 3.3 V (20%–80%) 0.6 1 PLL switching, Y2-to-Y3 60 90 4 PLLs switching, Y2-to-Y9 120 170 1 PLL switching, Y2-to-Y3 70 100 4 PLLs switching, Y2-to-Y9 130 180 tjit(cc) Cycle-to-cycle jitter (2) (3) tjit(per) Peak-to-peak period jitter (2) (3) tsk(o) Output skew (4) odc Output duty cycle (5) fOUT = 50 MHz, Y1-to-Y3 fVCO = 100 MHz, Pdiv = 1 ns ns 60 fOUT = 50 MHz, Y2-to-Y5 or Y6-to-Y9 160 45% V ps ps ps 55% CDCE949 – LVCMOS FOR VDDOUT = 2.5 V VOH (1) (2) (3) (4) (5) LVCMOS high-level output voltage VDDOUT = 2.3 V, IOH = –0.1 mA 2.2 VDDOUT = 2.3 V, IOH = –6 mA 1.7 VDDOUT = 2.3 V, IOH = –10 mA 1.6 V All typical values are at respective nominal VDD. 10000 cycles. Jitter depends on device configuration. Data is taken under the following conditions: 1-PLL: fIN = 27 MHz, Y2/3 = 27 MHz, (measured at Y2), 4-PLL: fIN = 27 MHz, Y2/3 = 27 MHz, (manured at Y2), Y4/5 = 16.384 MHz, Y6/7 = 74.25 MHz, Y8/9 = 48 MHz. The tsk(o) specification is only valid for equal loading of each bank of outputs and outputs are generated from the same divider; data sampled on rising edge (tr). odc depends on output rise- and fall-time (tr/tf). Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 7 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com Electrical Characteristics (continued) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS LVCMOS low-level output voltage VOL TYP (1) MIN MAX VDDOUT = 2.3 V, IOL = 0.1 mA 0.1 VDDOUT = 2.3 V, IOL = 6 mA 0.5 VDDOUT = 2.3 V, IOL = 10 mA 0.7 tPLH, tPHL Propagation delay PLL bypass 3.4 tr/tf Rise and fall time VDDOUT = 2.5 V (20%–80%) 0.8 1 PLL switching, Y2-to-Y3 60 90 4 PLLs switching, Y2-to-Y9 120 170 1 PLL switching, Y2-to-Y3 70 100 4 PLLs switching, Y2-to-Y9 130 180 tjit(cc) Cycle-to-cycle jitter (2) (3) tjit(per) Peak-to-peak period jitter (2) (3) tsk(o) Output skew (4) odc Output duty cycle (5) fOUT = 50 MHz, Y1-to-Y3 ns 160 fVCO = 100 MHz, Pdiv = 1 45% V ns 60 fOUT = 50 MHz, Y2-to-Y5 or Y6-to-Y9 UNIT ps ps ps 55% CDCEL949 – LVCMOS FOR VDDOUT = 1.8 V LVCMOS high-level output voltage VOH LVCMOS low-level output voltage VOL VDDOUT = 1.7 V, IOH = –0.1 mA 1.6 VDDOUT = 1.7 V, IOH = –4 mA 1.4 VDDOUT = 1.7 V, IOH = –8 mA 1.1 V VDDOUT = 1.7 V, IOL = 0.1 mA 0.1 VDDOUT = 1.7 V, IOL = 4 mA 0.3 VDDOUT = 1.7 V, IOL = 8 mA 0.6 tPLH, tPHL Propagation delay PLL bypass 2.6 tr/tf Rise and fall time VDDOUT = 1.8 V (20%–80%) 0.7 1 PLL switching, Y2-to-Y3 70 120 4 PLLs switching, Y2-to-Y9 120 170 1 PLL switching, Y2-to-Y3 90 140 4 PLLs switching, Y2-to-Y9 130 190 tjit(cc) Cycle-to-cycle jitter (2) (3) tjit(per) Peak-to-peak period jitter (2) (3) tsk(o) Output skew (4) odc Output duty cycle (5) fOUT = 50 MHz, Y1-to-Y3 ns ns 60 fOUT = 50 MHz, Y2-to-Y5 or Y6-to-Y9 V ps ps ps 160 fVCO = 100 MHz, Pdiv = 1 45% 55% SDA AND SCL VIK SCL and SDA input clamp voltage VDD = 1.7 V, II = –18 mA –1.2 V IIH SCL and SDA input current VI = VDD, VDD = 1.9 V ±10 µA VIH SDA/SCL input high voltage (6) 0.7 × VDD VIL SDA/SCL input low voltage VOL SDA low-level output voltage IOL = 3 mA, VDD = 1.7 V CI SCL/SDA input capacitance VI = 0 V or VDD (6) V (6) 0.3 × VDD 3 V 0.2 × VDD V 10 pF SDA and SCL pins are 3.3-V tolerant. 7.6 EEPROM Specification MIN EEcyc Programming cycles of EEPROM EEret Data retention 8 Submit Documentation Feedback TYP MAX UNIT 1000 cycles 10 years Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 7.7 Timing Requirements: CLK_IN MIN f(CLK) LVCMOS clock input frequency tr / tf Rise and fall time CLK signal (20% to 80%) dutyCLK Duty cycle CLK at VDD / 2 NOM MAX PLL bypass mode 0 160 PLL mode 8 160 3 40% UNIT MHz ns 60% 7.8 Timing Requirements: SDA/SCL over operating free-air temperature range (unless otherwise noted; see Figure 14) MIN NOM MAX Standard mode 0 100 Fast mode 0 400 f(SCL) SCL clock frequency tsu(START) START setup time (SCL high before Standard mode SDA low) Fast mode th(START) START hold time (SCL low after SDA low) tw(SCLL) SCL low-pulse duration tw(SCLH) SCL high-pulse duration th(SDA) SDA hold time (SDA valid after SCL Standard mode low) Fast mode 0 3.45 0 0.9 tsu(SDA) SDA setup time Standard mode 250 Fast mode 100 tr SCL/SDA input rise time tf SCL/SDA input fall time tsu(STOP) STOP setup time tBUF Bus free time between a STOP and START condition Standard mode 4.7 4 0.6 Standard mode 4.7 Fast mode 1.3 Standard mode Fast mode µs µs 4 µs 0.6 Standard mode 300 300 Standard mode 4 Fast mode 0.6 Standard mode 4.7 Fast mode 1.3 Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 µs ns 1000 Fast mode kHz µs 0.6 Fast mode UNIT Submit Documentation Feedback ns ns µs µs 9 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com 7.9 Typical Characteristics 100 90 35 VDD = 1.8 V 4 PLL on 70 25 3 PLL on 60 3 outputs on IDDOUT - mA IDD - Supply Current - mA 30 80 2 PLL on 1 PLL on 50 all PLL off 40 VDD = 1.8 V, VDDOUT = 3.3 V, 9 outputs on 7 outputs on No Load 5 outputs on 30 20 15 1 output on all outputs off 10 20 5 10 0 10 60 110 160 PLL - Frequency - MHz 0 10 210 Figure 1. CDCEx949 Supply Current vs PLL Frequency 30 50 70 90 110 130 150 170 190 210 230 fOUT - Output Frequency - MHz Figure 2. CDCE949 Output Current vs Output Frequency 12 10 VDD = 1.8 V, VDDOUT = 1.8 V, No Load 9 outputs on 7 outputs on 5 outputs on 3 outputs on IDDOUT - mA 8 1 output on 6 all outputs off 4 2 0 10 30 50 70 90 110 130 150 170 190 210 230 fOUT - Output Frequency - MHz Figure 3. CDCEL949 Output Current vs Output Frequency 10 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 8 Parameter Measurement Information Copyright © 2016, Texas Instruments Incorporated Figure 4. Test Load CDCE949 CDCEL949 LVCMOS Typical Driver Impedance ~ 32 W LVCMOS Series Termination ~ 18 W Line Impedance Zo = 50 W Copyright © 2016, Texas Instruments Incorporated Figure 5. Test Load for 50-Ω Board Environment Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 11 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com 9 Detailed Description 9.1 Overview The CDCE949 and CDCEL949 devices are modular PLL-based, low-cost, high-performance, programmable clock synthesizers, multipliers, and dividers. They generate up to nine output clocks from a single input frequency. Each output can be programmed in-system for any clock frequency up to 230 MHz, using one of the four integrated configurable PLLs. The CDCEx949 has separate output supply pins, VDDOUT, which is 1.8 V for CDCEL949 and 2.5 V to 3.3 V for CDCE949. The input accepts an external crystal or LVCMOS clock signal. If an external crystal is used, an on-chip load capacitor is adequate for most applications. The value of the load capacitor is programmable from 0 to 20 pF. Additionally, a selectable on-chip VCXO allows synchronization of the output frequency to an external control signal, that is, the PWM signal. The deep M/N divider ratio allows the generation of 0-ppm audio and video, networking (WLAN, Bluetooth, Ethernet, GPS), or Interface (USB, IEEE1394, memory stick) clocks from a reference input frequency such as 27 MHz. All PLLs support spread-spectrum clocking (SSC). SSC can be center-spread or down-spread clocking. This is a common technique to reduce electro-magnetic interference (EMI). Based on the PLL frequency and the divider settings, the internal loop filter components are automatically adjusted to achieve high stability, and to optimize the jitter-transfer characteristics of each PLL. The device supports non-volatile EEPROM programming for easy customization of the device to the application. It is preset to a factory-default configuration (see Default Device Setting). It can be reprogrammed to a different application configuration before PCB assembly, or reprogrammed by in-system programming. All device settings are programmable through the SDA and SCL bus, a 2-wire serial interface. Three programmable control inputs, S0, S1 and S2, can be used to control various aspects of operation including frequency selection, changing the SSC parameters to lower EMI, PLL bypass, power down, and choosing between low level or 3-state for the output-disable function. The CDCEx949 operates in a 1.8-V environment. It operates within a temperature range of –40°C to 85°C. 12 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 9.2 Functional Block Diagram VDD VDDOUT GND LV CMOS Y1 M2 LV CMOS Y2 M3 LV CMOS Y3 M4 LV CMOS Y4 M5 LV CMOS Y5 M6 LV CMOS Y6 M7 LV CMOS Y7 M8 LV CMOS Y8 LV CMOS Y9 Pdiv1 M1 Xin/CLK M9 Input Clock Vctr 10-Bit VCXO XO Pdiv2 with SSC Xout MUX1 PLL 1 LVCMOS 7-Bit Pdiv3 PLL Bypass EEPROM Programming and SDA/SCL Register Pdiv4 PLL 2 with SSC MUX2 S0 S1/SDA S2/SCL 7-Bit Pdiv6 MUX3 PLL 3 7-Bit Pdiv7 7-Bit PLL Bypass Pdiv8 MUX4 PLL 4 with SSC Pdiv5 7-Bit PLL Bypass with SSC 7-Bit 7-Bit Pdiv9 PLL Bypass 7-Bit Copyright © 2016, Texas Instruments Incorporated 9.3 Feature Description 9.3.1 Control Terminal Setting The CDCEx949 has three user-definable control terminals (S0, S1, and S2) which allow external control of device settings. They can be programmed to any of the following setting: • Spread spectrum clocking selection → spread type and spread amount selection • Frequency selection → switching between any of two user-defined frequencies • Output state selection → output configuration and power down control The user can predefine up to eight different control settings. Table 1 and Table 2 explain these settings. Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 13 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com Feature Description (continued) Table 1. Control Terminal Definition Output Y1 and Power Down Selection Y1 SETTING Output Y8/Y9 Selection SSC Selection PLL Frequency Selection PLL4 SETTING Output Y6/Y7 Selection SSC Selection PLL Frequency Selection PLL3 SETTING Output Y4/Y5 Selection PLL Frequency Selection PLL2 SETTING Output Y2/Y3 Selection SSC Selection PLL Frequency Selection Control Function PLL1 SETTING SSC Selection EXTERNAL CONTROL BITS Table 2. PLLx Setting (Can Be Selected for Each PLL Individual) SSC SELECTION (CENTER/DOWN) (1) CENTER DOWN 0 SSCx [3-bits] 0 0 0% (off) 0% (off) 0 0 1 ±0.25% –0.25% 0 1 0 ±0.5% –0.5% 0 1 1 ±0.75% –0.75% 1 0 0 ±1% –1% 1 0 1 ±1.25% –1.25% 1 1 0 ±1.5% –1.5% 1 1 1 ±2% –2% FREQUENCY SELECTION (2) FSx FUNCTION 0 Frequency0 1 Frequency1 OUTPUT SELECTION (3) (Y2 ... Y9) (1) (2) (3) YxYx FUNCTION 0 State0 1 State1 Center/Down-Spread, Frequency0/1 and State0/1 are user-definable in PLLx Configuration Register Frequency0 and Frequency1 can be any frequency within the specified fVCO range State0/1 selection is valid for both outputs of the corresponding PLL module and can be power down, 3-state, low, or active Table 3. Y1 Setting (1) Y1 SELECTION (1) 14 Y1 FUNCTION 0 State 0 1 State 1 State0 and State1 are user definable in Generic Configuration Register and can be power down, 3-state, low, or active. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 S1/SDA and S2/SCL pins of the CDCEx949 are dual function pins. In default configuration they are defined as SDA/SCL for the serial interface. They can be programmed as control-pins (S1/S2) by setting the relevant bits in the EEPROM. Note that the changes to the Control register (Bit [6] of Byte [02]) have no effect until they are written into the EEPROM. Once they are set as control pins, the serial programming interface is no longer available. However, if VDDOUT is forced to GND, the two control-pins, S1 and S2, temporally act as serial programming pins (SDA/SCL). S0 is not a multi-use pin, it is a control pin only. 9.3.2 Default Device Setting The internal EEPROM of CDCEx949 is preconfigured as shown in Figure 6 (the input frequency is passed through to the output as a default). This allows the device to operate in default mode without the extra production step of program it. The default setting appears after power is supplied or after power-down or power-up sequence until it is re-programmed by the user to a different application configuration. A new register setting is programmed through the serial SDA/SCL Interface. VDD Vddout GND PLL 2 power down Pdiv4 = 1 Pdiv5 = 1 PLL Bypass PLL3 LV CMOS Y4 = 27 MHz LV CMOS Y5 = 27 MHz Pdiv6 = 1 LV CMOS Y6 = 27 MHz LV CMOS Y7 = 27 MHz MUX3 power down M2 SCL M3 SDA Programming Bus Y3 = 27 MHz MUX2 “0” = outputs 3-State LV CMOS M4 Programming and SDA/SCA Register S0 Pdiv3 = 1 PLL Bypass EEPROM “1” = outputs enabled Pdiv2 = 1 MUX1 Xout Y2 = 27 MHz M5 PLL1 LV CMOS Pdiv1 =1 X-tal power down Y1 = 27MHz M6 27 MHz Crystal LV CMOS M7 M1 Input Clock Xin Pdiv7 = 1 PLL Bypass Figure 6. Default Device Setting Table 4 shows the factory default setting for the Control Terminal Register (external control pins). In normal operation, all 8 register settings are available, but in the default configuration only the first two settings (0 and 1) can be selected with S0, as S1 and S2 configured as programming pins in default mode. Table 4. Factory Default Setting for Control Terminal Register Y1 EXTERNAL CONTROL PINS (1) PLL1 SETTING PLL2 SETTING PLL3 SETTING PLL3 SETTING OUTPUT SELECT FREQ. SELECT SSC SEL. OUTPUT SELECT FREQ. SELECT SSC SEL. OUTPUT SELECT FREQ. SELECT SSC SEL. OUTPUT SELECT FREQ. SELECT SSC SEL. OUTPUT SELECT S2 S1 S0 Y1 FS1 SSC1 Y2Y3 FS2 SSC2 Y4Y5 FS3 SSC3 Y6Y7 FS4 SSC4 Y8Y9 SCL (I2C) SDA (I2C) 0 3-state fVCO1_0 off 3-state fVCO2_0 off 3-state fVCO3_0 off 3-state fVCO4_0 off 3-state SCL (I2C) SDA (I2C) 1 enabled fVCO1_0 off enabled fVCO2_0 off enabled fVCO3_0 off enabled fVCO4_0 off enabled (1) In default mode or when programmed respectively, S1 and S2 act as serial programming interface, SDA/SCL. They do not have any control-pin function but they are internally interpreted as if S1 = 0 and S2 = 0. However, S0 is a control-pin which in the default mode switches all outputs ON or OFF (as previously predefined). Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 15 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com 9.3.3 SDA/SCL Serial Interface The CDCEx949 operates as a slave device of the 2-wire serial SDA/SCL bus, compatible with the popular SMBus or I2C Bus specification. It operates in the standard-mode transfer (up to 100 kbps) and fast-mode transfer (up to 400 kbps) and supports 7-bit addressing. The S1/SDA and S2/SCL pins of the CDCEx949 are dual function pins. In the default configuration they are used as SDA/SCL serial programming interface. They can be re-programmed as general-purpose control pins, S1 and S2, by changing the corresponding EEPROM setting, Byte 02, Bit [6]. P S tw(SCLL) Bit 7 (MSB) tw(SCLH) Bit 6 tr Bit 0 (LSB) A P tf VIH SCL VIL tsu(START) th(START) tsu(SDA) th(SDA) t(BUS) tsu(STOP) tf tr VIH SDA VIL Figure 7. Timing Diagram for SDA/SCL Serial Control Interface 9.3.4 Data Protocol The device supports Byte Write and Byte Read and Block Write and Block Read operations. For Byte Write/Read operations, the system controller can individually access addressed bytes. For Block Write/Read operations, the bytes are accessed in sequential order from lowest to highest byte (with most significant bit first) with the ability to stop after any complete byte has been transferred. The numbers of Bytes read-out are defined by Byte Count in the Generic Configuration Register. At Block Read instruction all bytes defined in the Byte Count has to be readout to correctly finish the read cycle. Once a byte has been sent, it is written into the internal register and is effective immediately. This applies to each transferred byte independent of whether this is a Byte Write or a Block Write sequence. If the EEPROM Write Cycle is initiated, the internal SDA register contents are written into the EEPROM. During this write cycle, data is not accepted at the SDA/SCL bus until the write cycle is completed. However, data can be read during the programming sequence (Byte Read or Block Read). The programming status can be monitored by reading EEPIP, Byte 01–Bit [6]. The offset of the indexed byte is encoded in the command code, as described in Table 5. Table 5. Slave Receiver Address (7 Bits) A6 A5 A4 A3 A2 A1 (1) A0 (1) R/W CDCEx913 1 1 0 0 1 0 1 1/0 CDCEx925 1 1 0 0 1 0 0 1/0 CDCEx937 1 1 0 1 1 0 1 1/0 CDCEx949 1 1 0 1 1 0 0 1/0 DEVICE (1) Address bits A0 and A1 are programmable through the SDA/SCL bus (Byte 01, Bit [1:0]). This allows addressing up to 4 devices connected to the same SDA/SCL bus. The least-significant bit of the address byte designates a write or read operation. 9.4 Device Functional Modes 9.4.1 SDA/SCL Hardware Interface Figure 8 shows how the CDCEx949 clock synthesizer is connected to the SDA/SCL serial interface bus. Multiple devices can be connected to the bus but the speed may need to be reduced (400 kHz is the maximum) if many devices are connected. 16 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 Device Functional Modes (continued) Note that the pullup resistor value (RP) depends on the supply voltage, bus capacitance and number of connected devices. The recommended pullup value is 4.7 kΩ. It must meet the minimum sink current of 3 mA at VOLmax = 0.4 V for the output stages (for more details, see SMBus or I2C Bus specification). CDCE949 CDCEL949 RP RP Master Slave SDA SCL CBUS CBUS Copyright © 2016, Texas Instruments Incorporated Figure 8. SDA/SCL Hardware Interface 9.5 Programming Table 6. Command Code Definition BIT DESCRIPTION 0 = Block Read or Block Write operation 1 = Byte Read or Byte Write operation 7 (6:0) Byte Offset for Byte Read, Block Read, Byte Write and Block Write operation. 1 S 7 Slave Address 1 1 R/W A LSB MSB MSB S Start Condition Sr Repeated Start Condition 8 Data Byte 1 A 1 P LSB R/W 1 = Read (Rd) from CDCE9xx device; 0 = Write (Wr) to the CDCE9xxx A Acknowledg (ACK = 0 and NACK =1) P Stop Condition Master to Slave Transmission Slave to Master Transmission Figure 9. Generic Programming Sequence 1 S 7 Slave Address 1 Wr 1 A 8 CommandCode 1 A 8 Data Byte 1 A 1 P Figure 10. Byte Write Protocol Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 17 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 1 S www.ti.com 7 Slave Address 1 Wr 1 A 8 Data Byte 1 A 1 P 8 CommandCode 1 A 7 Slave Address 1 Sr 1 Rd 1 A 1 A 1 P Figure 11. Byte Read Protocol 1 S 7 Slave Address 1 Wr 8 Data Byte 0 1 A 1 A 1 A 8 CommandCode 8 Data Byte 1 1 A 1 A 8 Byte Count = N 8 Data Byte N-1 … NOTE: Data Byte 0 Bits [7:0] is reserved for Revision Code and Vendor Identification. Also it is used for internal test purpose and must not be overwritten. Figure 12. Block Write Programming 1 S 7 Slave Address 1 Wr 8 Byte Count N 1 A 1 A 1 A 8 CommandCode 8 Data Byte 0 1 A 1 Sr … 7 Slave Address 1 Rd 1 A 8 Data Byte N-1 1 A 1 P Figure 13. Block Read Protocol P Bit 7 (MSB) S tw(SCLL) Bit 6 tw(SCLH) tr Bit 0 (LSB) A P tf VIH SCL VIL tSU(START) t(BUS) th(START) t SU(SDA) tr t tSU(STOP) h(SDA) tf VIH SDA VIL Figure 14. Timing Diagram for the SDA/SCL Serial Control Interface 9.6 Register Maps 9.6.1 SDA/SCL Configuration Registers The clock input, control pins, PLLs, and output stages are user configurable. The following tables and explanations describe the programmable functions of the CDCEx949. All settings can be manually written to the device through the SDA/SCL bus, or are easily programmable by using the TI Pro Clock software. TI Pro Clock software allows the user to quickly make all settings and automatically calculates the values for optimized performance at lowest jitter. 18 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 Table 7. SDA/SCL Registers ADDRESS OFFSET REGISTER DESCRIPTION TABLE 00h Generic configuration register Table 9 10h PLL1 configuration register Table 10 20h PLL2 configuration register Table 11 30h PLL3 configuration register Table 12 40h PLL4 configuration register Table 13 The grey-highlighted Bits described in the configuration registers tables on the following pages, belong to the Control Pin Register. The user can predefine up to eight different control settings. These settings can then be selected by the external control pins, S0, S1, and S2 (see Control Terminal Setting). Table 8. Configuration Register, External Control Pins EXTERNAL CONTROL PINS S2 S1 S0 Y1 OUTPUT SELECT PLL1 SETTING FREQ SELECT SSC SELECT PLL2 SETTING OUTPUT SELECT FREQ SELECT SSC SELECT PLL3 SETTING OUTPUT SELECT FREQ SELECT SSC SELECT PLL4 SETTING OUTPUT SELECT FREQ SELECT SSC SELECT OUTPUT SELECT Y1 FS1 SSC1 Y2Y3 FS2 SSC2 Y4Y5 FS3 SSC3 Y6Y7 FS4 SSC4 Y8Y9 0 0 0 Y1_0 FS1_0 SSC1_0 Y2Y3_0 FS2_0 SSC2_0 Y4Y5_0 FS3_0 SSC3_0 Y6Y7_0 FS4_0 SSC4_0 Y8Y9_0 0 0 1 Y1_1 FS1_1 SSC1_1 Y2Y3_1 FS2_1 SSC2_1 Y4Y5_1 FS3_1 SSC3_1 Y6Y7_1 FS4_1 SSC4_1 Y8Y9_1 0 1 0 Y1_2 FS1_2 SSC1_2 Y2Y3_2 FS2_2 SSC2_2 Y4Y5_2 FS3_2 SSC3_2 Y6Y7_2 FS4_2 SSC4_2 Y8Y9_2 0 1 1 Y1_3 FS1_3 SSC1_3 Y2Y3_3 FS2_3 SSC2_3 Y4Y5_3 FS3_3 SSC3_3 Y6Y7_3 FS4_3 SSC4_3 Y8Y9_3 1 0 0 Y1_4 FS1_4 SSC1_4 Y2Y3_4 FS2_4 SSC2_4 Y4Y5_4 FS3_4 SSC3_4 Y6Y7_4 FS4_4 SSC4_4 Y8Y9_4 1 0 1 Y1_5 FS1_5 SSC1_5 Y2Y3_5 FS2_5 SSC2_5 Y4Y5_5 FS3_5 SSC3_5 Y6Y7_5 FS4_5 SSC4_5 Y8Y9_5 1 1 0 Y1_6 FS1_6 SSC1_6 Y2Y3_6 FS2_6 SSC2_6 Y4Y5_6 FS3_6 SSC3_6 Y6Y7_6 FS4_6 SSC4_6 Y8Y9_6 1 1 1 Y1_7 FS1_7 SSC1_7 Y2Y3_7 FS2_7 SSC2_7 Y4Y5_7 FS3_7 SSC3_7 Y6Y7_7 FS4_7 SSC4_7 Y8Y9_7 04h 13h 10h-12h 15h 23h 20h-22h 25h 33h 30h-32h 35h 43h 40h-42h 45h Addr. Offset (1) (1) Address Offset refers to the byte address in the Configuration Register on following pages. Table 9. Generic Configuration Register OFFSET 00h 01h (1) (2) (3) (4) (5) (1) ACRONYM DEFAULT (3) 7 E_EL xb Device Identification (read only): ‘1’ is CDCE949 (3.3V), ‘0’ is CDCEL949 (1.8V) 6:4 RID Xb Revision Identification Number (read only) 3:0 VID 1h Vendor Identification Number (read only) 7 – 0b Reserved - always write 0 6 EEPIP 0b EEPROM Programming Status (4): (read only) 0 – EEPROM programming is completed 1 – EEPROM is in programming mode 5 EELOCK 0b Permanently Lock EEPROM Data (5): 0 – EEPROM is not locked 1 – EEPROM is permanently locked 4 PWDN 0b 3:2 INCLK 00b 1:0 SLAVE_ADR 00b BIT (2) DESCRIPTION Device power down (overwrites S0/S1/S2 setting; configuration register settings are unchanged) Note: PWDN cannot be set to 1 in the EEPROM. 0 – device active (all PLLs and all outputs are enabled) 1 – device power down (all PLLs in power down and all outputs in 3-State) Input clock selection: 00 – X-tal 01 – VCXO 10 – LVCMOS 11 – reserved Programmable Address Bits A0 and A1 of the Slave Receiver Address Writing data beyond 50h may adversely affect device function. All data is transferred MSB-first. Unless custom setting is used. During EEPROM programming, no data is allowed to be sent to the device through the SDA/SCL bus until the programming sequence is completed. Data, however, can be read during the programming sequence (Byte Read or Block Read). If this bit is set high in the EEPROM, the actual data in the EEPROM is permanently locked, and no further programming is possible. Data, however can still be written through the SDA/SCL bus to the internal register to change device function on the fly. But new data can no longer be saved to the EEPROM. EELOCK is effective only if written into the EEPROM Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 19 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com Table 9. Generic Configuration Register (continued) OFFSET (1) 02h BIT (2) 7 ACRONYM DEFAULT (3) M1 1b DESCRIPTION Clock source selection for output Y1: 0 – input clock 1 – PLL1 clock Operation mode selection for pin 22/23 (6) 6 SPICON 0b 5:4 Y1_ST1 11b 3:2 Y1_ST0 01b 1:0 Pdiv1 [9:8] 03h 7:0 Pdiv1 [7:0] 04h 7 Y1_7 0b 6 Y1_6 0b 5 Y1_5 0b 4 Y1_4 0b 3 Y1_3 0b 2 Y1_2 0b 1 Y1_1 1b 0 Y1_0 0b 001h 05h 0 – serial programming interface SDA (pin 23) and SCL (pin 22) 1 – control pins S1 (pin 23) and S2 (pin 22) Y1-State0/1 Definition (applies to Y1_ST1 and Y1_ST0) 00 – 01 – 10 – 11 – device power down (all PLLs in power down and all outputs in 3-state) Y1 disabled to 3-state Y1 disabled to low Y1 enabled (normal operation) 10-Bit Y1-Output-Divider Pdiv1: Y1_x State Selection (7) 0 – State0 (predefined by Y1-State0 Definition [Y1_ST0]) 1 – State1 (predefined by Y1-State1 Definition [Y1_ST1]) Crystal load capacitor selection (8): 7:3 XCSEL 0 – divider reset and stand-by 1-to-1023 – divider value 0Ah 00h → 0 pF 01h → 1 pF 02h → 2 pF 14h-to-1Fh → 20 pF Vctr Xin 20pF i.e. XCSEL = 10pF XO Xout 06h (6) (7) (8) (9) 20 20pF 2:0 — 0b Reserved - do not write others than 0 7:1 BCOUNT 50h 7-Bit Byte Count (Defines the number of Bytes which is sent from this device at the next Block Read transfer; all bytes must be read out to correctly finish the read cycle.) 0 EEWRITE 0b 0 – no EEPROM write cycle 1 – start EEPROM write cycle (internal configuration register is saved to the EEPROM) — — 0h Reserved – do not write others than 0 Initiate EEPROM Write Cycle(4) 07h-0Fh VCXO (9) Selection of control-pins is effective only if written into the EEPROM. Once written into the EEPROM, the serial programming pins are no longer available. However, if VDDOUT is forced to GND, the two control-pins, S1 and S2, temporally act as serial programming pins (SDA/SCL), and the two slave receiver address bits are reset to A0 = 0 and A1 = 0. These are the bits of the Control Pin Register. The user can predefine up to eight different control settings. These settings can then be selected by the external control pins, S0, S1, and S2. The internal load capacitor (C1, C2) must be used to achieve the best clock performance. External capacitors must be used only to do a fine adjustment of CL by few pF. The value of CL can be programmed with a resolution of 1 pF for a total crystal load range of 0 pF to 20 pF. For CL > 20 pF use additional external capacitors. Also, the device input capacitance must be considered; this adds 1.5 pF (6 pF, 2 pF) to the selected CL. For more information about VCXO configuration and crystal recommendations, see VCXO Application Guideline for CDCE(L)9xx Family (SCAA085). NOTE: The EEPROM WRITE bit must be sent last. This ensures that the content of all internal registers are written into the EEPROM. The EEWRITE cycle is initiated by the rising edge of the EEWRITE-Bit. A static level high does not trigger an EEPROM WRITE cycle. The EEWRITE-Bit must be reset low after the programming is completed. The programming status can be monitored by readout EEPIP. If EELOCK is set high, no EEPROM programming is possible. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 Table 10. PLL1 Configuration Register OFFSET 10h 11h 12h 13h 14h 15h 16h 17h (1) (2) (3) (4) (1) ACRONYM DEFAULT (3) 7:5 SSC1_7 [2:0] 000b 4:2 SSC1_6 [2:0] 000b 1:0 SSC1_5 [2:1] 7 SSC1_5 [0] 6:4 SSC1_4 [2:0] 000b 3:1 SSC1_3 [2:0] 000b 0 SSC1_2 [2] 7:6 SSC1_2 [1:0] 5:3 SSC1_1 [2:0] 000b 2:0 SSC1_0 [2:0] 000b 7 FS1_7 0b 6 FS1_6 0b 5 FS1_5 0b 4 FS1_4 0b 3 FS1_3 0b 2 FS1_2 0b 1 FS1_1 0b 0 FS1_0 0b 7 MUX1 1b 6 M2 1b 5:4 M3 10b 3:2 Y2Y3_ST1 11b 1:0 Y2Y3_ST0 01b 7 Y2Y3_7 0b 6 Y2Y3_6 0b 5 Y2Y3_5 0b 4 Y2Y3_4 0b 3 Y2Y3_3 0b 2 Y2Y3_2 0b 1 Y2Y3_1 1b 0 Y2Y3_0 0b 7 SSC1DC 0b 6:0 Pdiv2 01h 7 — 0b 6:0 Pdiv3 01h BIT (2) 000b 000b DESCRIPTION SSC1: PLL1 SSC Selection (Modulation Amount) (4) Down 000 (off) 001 – 0.25% 010 – 0.5% 011 – 0.75% 100 – 1.0% 101 – 1.25% 110 – 1.5% 111 – 2.0% Center 000 (off) 001 ± 0.25% 010 ± 0.5% 011 ± 0.75% 100 ± 1.0% 101 ± 1.25% 110 ± 1.5% 111 ± 2.0% FS1_x: PLL1 Frequency Selection(4) 0 – fVCO1_0 (predefined by PLL1_0 – Multiplier/Divider value) 1 – fVCO1_1 (predefined by PLL1_1 – Multiplier/Divider value) PLL1 Multiplexer: 0 – PLL1 1 – PLL1 Bypass (PLL1 is in power down) Output Y2 Multiplexer: 0 – Pdiv1 1 – Pdiv2 Output Y3 Multiplexer: 00 – 01 – 10 – 11 – Y2, Y3State0/1definition: 00 – Y2/Y3 disabled to 3-State (PLL1 is in power down) 01 – Y2/Y3 disabled to 3-State (PLL1 on) 10–Y2/Y3 disabled to low (PLL1 on) 11 – Y2/Y3 enabled (normal operation, PLL1 on) Pdiv1-Divider Pdiv2-Divider Pdiv3-Divider reserved Y2Y3_x Output State Selection(4) 0 – state0 (predefined by Y2Y3_ST0) 1 – state1 (predefined by Y2Y3_ST1) PLL1 SSC down/center selection: 0 – down 1 – center 7-Bit Y2-Output-Divider Pdiv2: 0 – reset and stand-by 1-to-127 – divider value Reserved – do not write others than 0 7-Bit Y3-Output-Divider Pdiv3: 0 – reset and stand-by 1-to-127 – divider value Writing data beyond 50h may adversely affect device function. All data is transferred MSB-first. Unless a custom setting is used The user can predefine up to eight different control settings. In normal device operation, these settings can be selected by the external control pins, S0, S1, and S2. Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 21 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com Table 10. PLL1 Configuration Register (continued) OFFSET (1) BIT (2) ACRONYM DEFAULT (3) 18h 7:0 PLL1_0N [11:4 19h 7:4 PLL1_0N [3:0] 3:0 PLL1_0R [8:5] 7:3 PLL1_0R[4:0] 2:0 PLL1_0Q [5:3] 7:5 PLL1_0Q [2:0] 4:2 PLL1_0P [2:0] 010b 1:0 VCO1_0_RANGE 00b 1Ch 7:0 PLL1_1N [11:4] 1Dh 7:4 PLL1_1N [3:0] 3:0 PLL1_1R [8:5] 7:3 PLL1_1R[4:0] 2:0 PLL1_1Q [5:3] 7:5 PLL1_1Q [2:0] 4:2 PLL1_1P [2:0] 010b 1:0 VCO1_1_RANGE 00b 1Ah 1Bh 004h DESCRIPTION PLL1_0 (5): 30-Bit Multiplier/Divider value for frequency fVCO1_0 (for more information, see PLL Frequency Planning) 000h 10h fVCO1_0 range selection: 1Eh 1Fh 004h fVCO1_0 < 125 MHz 125 MHz ≤ fVCO1_0 < 150 MHz 150 MHz ≤ fVCO1_0 < 175 MHz fVCO1_0 ≥ 175 MHz PLL1_1 (5): 30-Bit Multiplier/Divider value for frequency fVCO1_1 (for more information, see PLL Frequency Planning). 000h 10h fVCO1_1 range selection: (5) 00 – 01 – 10 – 11 – 00 – 01 – 10 – 11 – fVCO1_1 < 125 MHz 125 MHz ≤ fVCO1_1 < 150 MHz 150 MHz ≤ fVCO1_1 < 175 MHz fVCO1_1 ≥ 175 MHz PLL settings limits: 16 ≤ q ≤ 63, 0 ≤ p ≤ 7, 0 ≤ r ≤ 511, 0 < N < 4096 Table 11. PLL2 Configuration Register OFFSET (1) BIT (2) ACRONYM DEFAULT (3) 20h 7:5 SSC2_7 [2:0] 000b 4:2 SSC2_6 [2:0] 000b 1:0 SSC2_5 [2:1] 7 SSC2_5 [0] 6:4 SSC2_4 [2:0] 000b 3:1 SSC2_3 [2:0] 000b 0 SSC2_2 [2] 7:6 SSC2_2 [1:0] 5:3 SSC2_1 [2:0] 000b 2:0 SSC2_0 [2:0] 000b 7 FS2_7 0b 6 FS2_6 0b 5 FS2_5 0b 4 FS2_4 0b 3 FS2_3 0b 2 FS2_2 0b 1 FS2_1 0b 0 FS2_0 0b 21h 22h 23h (1) (2) (3) (4) 22 000b 000b DESCRIPTION SSC2: PLL2 SSC Selection (Modulation Amount) (4) Down 000 (off) 001 – 0.25% 010 – 0.5% 011 – 0.75% 100 – 1.0% 101 – 1.25% 110 – 1.5% 111 – 2.0% Center 000 (off) 001 ± 0.25% 010 ± 0.5% 011 ± 0.75% 100 ± 1.0% 101 ± 1.25% 110 ± 1.5% 111 ± 2.0% FS2_x: PLL2 Frequency Selection(4) 0 – fVCO2_0 (predefined by PLL2_0 – Multiplier/Divider value) 1 – fVCO2_1 (predefined by PLL2_1 – Multiplier/Divider value) Writing data beyond 50h may adversely affect device function. All data is transferred MSB-first. Unless a custom setting is used The user can predefine up to eight different control settings. In normal device operation, these settings can be selected by the external control pins, S0, S1, and S2. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 Table 11. PLL2 Configuration Register (continued) OFFSET 24h (1) BIT (2) ACRONYM DEFAULT (3) 7 MUX2 1b 6 M4 1b 5:4 M5 10b 3:2 Y4Y5_ST1 11b 1:0 Y4Y5_ST0 01b 7 Y4Y5_7 0b 6 Y4Y5_6 0b 5 Y4Y5_5 0b 4 Y4Y5_4 0b 3 Y4Y5_3 0b 2 Y4Y5_2 0b 1 Y4Y5_1 1b 0 Y4Y5_0 0b 7 SSC2DC 0b 6:0 Pdiv4 01h 7 — 0b 6:0 Pdiv5 01h 28h 7:0 PLL2_0N [11:4 29h 7:4 PLL2_0N [3:0] 3:0 PLL2_0R [8:5] 7:3 PLL2_0R[4:0] 2:0 PLL2_0Q [5:3] 7:5 PLL2_0Q [2:0] 4:2 PLL2_0P [2:0] 010b 1:0 VCO2_0_RANGE 00b 2Ch 7:0 PLL2_1N [11:4] 2Dh 7:4 PLL2_1N [3:0] 3:0 PLL2_1R [8:5] 7:3 PLL2_1R[4:0] 2:0 PLL2_1Q [5:3] 7:5 PLL2_1Q [2:0] 4:2 PLL2_1P [2:0] 010b 1:0 VCO2_1_RANGE 00b 25h 26h 27h 2Ah 2Bh 004h DESCRIPTION PLL2 Multiplexer: 0 – PLL2 1 – PLL2 Bypass (PLL2 is in power down) Output Y4 Multiplexer: 0 – Pdiv2 1 – Pdiv4 Output Y5 Multiplexer: 00 – 01 – 10 – 11 – Y4, Y5State0/1definition: 00 – Y4/Y5 disabled to 3-State (PLL2 is in power down) 01 – Y4/Y5 disabled to 3-State (PLL2 on) 10–Y4/Y5 disabled to low (PLL2 on) 11 – Y4/Y5 enabled (normal operation, PLL2 on) Pdiv2-Divider Pdiv4-Divider Pdiv5-Divider reserved Y4Y5_x Output State Selection(4) 0 – state0 (predefined by Y4Y5_ST0) 1 – state1 (predefined by Y4Y5_ST1) PLL2 SSC down/center selection: 0 – down 1 – center 7-Bit Y4-Output-Divider Pdiv4: 0 – reset and stand-by 1-to-127 – divider value Reserved – do not write others than 0 7-Bit Y5-Output-Divider Pdiv5: PLL2_0 (5): 30-Bit Multiplier/Divider value for frequency fVCO2_0 (for more information, see PLL Frequency Planning). 000h 10h fVCO2_0 range selection: 2Eh 2Fh 004h 00 – 01 – 10 – 11 – fVCO2_0 < 125 MHz 125 MHz ≤ fVCO2_0 < 150 MHz 150 MHz ≤ fVCO2_0 < 175 MHz fVCO2_0 ≥ 175 MHz PLL2_1 (5): 30-Bit Multiplier/Divider value for frequency fVCO1_1 (for more information, see PLL Frequency Planning). 000h 10h fVCO2_1 range selection: (5) 0 – reset and stand-by 1-to-127 – divider value 00 – 01 – 10 – 11 – fVCO2_1 < 125 MHz 125 MHz ≤ fVCO2_1 < 150 MHz 150 MHz ≤ fVCO2_1 < 175 MHz fVCO2_1 ≥ 175 MHz PLL settings limits: 16 ≤ q ≤ 63, 0 ≤ p ≤ 7, 0 ≤ r ≤ 511, 0 < N < 4096 Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 23 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com Table 12. PLL3 Configuration Register OFFSET 30h 31h 32h 33h 34h 35h 36h 37h (1) (2) (3) (4) 24 (1) ACRONYM DEFAULT (3) 7:5 SSC3_7 [2:0] 000b 4:2 SSC3_6 [2:0] 000b 1:0 SSC3_5 [2:1] 7 SSC3_5 [0] 6:4 SSC3_4 [2:0] 000b 3:1 SSC3_3 [2:0] 000b 0 SSC3_2 [2] 7:6 SSC3_2 [1:0] 5:3 SSC3_1 [2:0] 000b 2:0 SSC3_0 [2:0] 000b 7 FS3_7 0b 6 FS3_6 0b 5 FS3_5 0b 4 FS3_4 0b 3 FS3_3 0b 2 FS3_2 0b 1 FS3_1 0b 0 FS3_0 0b 7 MUX3 1b 6 M6 1b 5:4 M7 10b 3:2 Y6Y7_ST1 11b 1:0 Y6Y7_ST0 01b 7 Y6Y7_7 0b 6 Y6Y7_6 0b 5 Y6Y7_5 0b 4 Y6Y7_4 0b 3 Y6Y7_3 0b 2 Y6Y7_2 0b 1 Y6Y7_1 1b 0 Y6Y7_0 0b 7 SSC3DC 0b 6:0 Pdiv6 01h 7 — 0b 6:0 Pdiv7 01h BIT (2) 000b 000b DESCRIPTION SSC3: PLL3 SSC Selection (Modulation Amount) (4) Down 000 (off) 001 – 0.25% 010 – 0.5% 011 – 0.75% 100 – 1.0% 101 – 1.25% 110 – 1.5% 111 – 2.0% Center 000 (off) 001 ± 0.25% 010 ± 0.5% 011 ± 0.75% 100 ± 1.0% 101 ± 1.25% 110 ± 1.5% 111 ± 2.0% FS3_x: PLL3 Frequency Selection(4) 0 – fVCO3_0 (predefined by PLL3_0 – Multiplier/Divider value) 1 – fVCO3_1 (predefined by PLL3_1 – Multiplier/Divider value) PLL3 Multiplexer: 0 – PLL3 1 – PLL3 Bypass (PLL3 is in power down) Output Y6 Multiplexer: 0 – Pdiv4 1 – Pdiv6 Output Y7 Multiplexer: 00 – 01 – 10 – 11 – Y6, Y7State0/1definition: 00 – Y6/Y7 disabled to 3-State (PLL3 is in power down) 01 – Y6/Y7 disabled to 3-State (PLL3 on) 10 –Y6/Y7 disabled to low (PLL3 on) 11 – Y6/Y7 enabled (normal operation, PLL3 on) Pdiv4-Divider Pdiv6-Divider Pdiv7-Divider reserved Y6Y7_x Output State Selection(4) 0 – state0 (predefined by Y6Y7_ST0) 1 – state1 (predefined by Y6Y7_ST1) PLL3 SSC down/center selection: 0 – down 1 – center 7-Bit Y6-Output-Divider Pdiv6: 0 – reset and stand-by 1-to-127 – divider value Reserved – do not write others than 0 7-Bit Y7-Output-Divider Pdiv7: 0 – reset and stand-by 1-to-127 – divider value Writing data beyond 50h may adversely affect device function. All data is transferred MSB-first. Unless a custom setting is used The user can predefine up to eight different control settings. In normal device operation, these settings can be selected by the external control pins, S0, S1, and S2. Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 Table 12. PLL3 Configuration Register (continued) OFFSET (1) BIT (2) ACRONYM DEFAULT (3) 38h 7:0 PLL3_0N [11:4 39h 7:4 PLL3_0N [3:0] 3:0 PLL3_0R [8:5] 7:3 PLL3_0R[4:0] 2:0 PLL3_0Q [5:3] 7:5 PLL3_0Q [2:0] 4:2 PLL3_0P [2:0] 010b 1:0 VCO3_0_RANGE 00b 3Ch 7:0 PLL3_1N [11:4] 3Dh 7:4 PLL3_1N [3:0] 3:0 PLL3_1R [8:5] 7:3 PLL3_1R[4:0] 2:0 PLL3_1Q [5:3] 7:5 PLL3_1Q [2:0] 4:2 PLL3_1P [2:0] 010b 1:0 VCO3_1_RANGE 00b 3Ah 3Bh 004h DESCRIPTION PLL3_0 (5): 30-Bit Multiplier/Divider value for frequency fVCO3_0 (for more information, see PLL Frequency Planning). 000h 10h fVCO3_0 range selection: 3Eh 3Fh 004h fVCO3_0 < 125 MHz 125 MHz ≤ fVCO3_0 < 150 MHz 150 MHz ≤ fVCO3_0 < 175 MHz fVCO3_0 ≥ 175 MHz PLL3_1 (5): 30-Bit Multiplier/Divider value for frequency fVCO3_1 (for more information, see PLL Frequency Planning). 000h 10h fVCO3_1 range selection: (5) 00 – 01 – 10 – 11 – 00 – 01 – 10 – 11 – fVCO3_1 < 125 MHz 125 MHz ≤ fVCO3_1 < 150 MHz 150 MHz ≤ fVCO3_1 < 175 MHz fVCO3_1 ≥ 175 MHz PLL settings limits: 16 ≤ q ≤ 63, 0 ≤ p ≤ 7, 0 ≤ r ≤ 511, 0 < N < 4096 Table 13. PLL4 Configuration Register OFFSET (1) BIT (2) ACRONYM DEFAULT (3) 40h 7:5 SSC4_7 [2:0] 000b 4:2 SSC4_6 [2:0] 000b 1:0 SSC4_5 [2:1] 7 SSC4_5 [0] 6:4 SSC4_4 [2:0] 000b 3:1 SSC4_3 [2:0] 000b 0 SSC4_2 [2] 7:6 SSC4_2 [1:0] 5:3 SSC4_1 [2:0] 000b 2:0 SSC4_0 [2:0] 000b 7 FS4_7 0b 6 FS4_6 0b 5 FS4_5 0b 4 FS4_4 0b 3 FS4_3 0b 2 FS4_2 0b 1 FS4_1 0b 0 FS4_0 0b 41h 42h 43h (1) (2) (3) (4) 000b 000b DESCRIPTION SSC4: PLL4 SSC Selection (Modulation Amount) (4) Down 000 (off) 001 – 0.25% 010 – 0.5% 011 – 0.75% 100 – 1.0% 101 – 1.25% 110 – 1.5% 111 – 2.0% Center 000 (off) 001 ± 0.25% 010 ± 0.5% 011 ± 0.75% 100 ± 1.0% 101 ± 1.25% 110 ± 1.5% 111 ± 2.0% FS4_x: PLL4 Frequency Selection(4) 0 – fVCO4_0 (predefined by PLL4_0 – Multiplier/Divider value) 1 – fVCO4_1 (predefined by PLL4_1 – Multiplier/Divider value) Writing data beyond 50h may adversely affect device function. All data is transferred MSB-first. Unless a custom setting is used The user can predefine up to eight different control settings. In normal device operation, these settings can be selected by the external control pins, S0, S1, and S2. Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 25 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com Table 13. PLL4 Configuration Register (continued) OFFSET 44h (1) BIT (2) ACRONYM DEFAULT (3) 7 MUX4 1b 6 M8 1b 5:4 M9 10b 3:2 Y8Y9_ST1 11b 1:0 Y8Y9_ST0 01b 7 Y8Y9_7 0b 6 Y8Y9_6 0b 5 Y8Y9_5 0b 4 Y8Y9_4 0b 3 Y8Y9_3 0b 2 Y8Y9_2 0b 1 Y8Y9_1 1b 0 Y8Y9_0 0b 7 SSC4DC 0b 6:0 Pdiv8 01h 7 — 0b 6:0 Pdiv9 01h 48h 7:0 PLL4_0N [11:4 49h 7:4 PLL4_0N [3:0] 3:0 PLL4_0R [8:5] 7:3 PLL4_0R[4:0] 2:0 PLL4_0Q [5:3] 7:5 PLL4_0Q [2:0] 4:2 PLL4_0P [2:0] 010b 1:0 VCO4_0_RANGE 00b 4Ch 7:0 PLL4_1N [11:4] 4Dh 7:4 PLL4_1N [3:0] 3:0 PLL4_1R [8:5] 7:3 PLL4_1R[4:0] 2:0 PLL4_1Q [5:3] 7:5 PLL4_1Q [2:0] 4:2 PLL4_1P [2:0] 010b 1:0 VCO4_1_RANGE 00b 45h 46h 47h 4Ah 4Bh 004h DESCRIPTION PLL4 Multiplexer: 0 – PLL4 1 – PLL4 Bypass (PLL4 is in power down) Output Y8 Multiplexer: 0 – Pdiv6 1 – Pdiv8 Output Y9 Multiplexer: 00 – 01 – 10 – 11 – Y8, Y9State0/1definition: 00 – Y8/Y9 disabled to 3-State (PLL4 is in power down) 01 – Y8/Y9 disabled to 3-State (PLL4 on) 10 –Y8/Y9 disabled to low (PLL4 on) 11 – Y8/Y9 enabled (normal operation, PLL4 on) Y8Y9_x Output State Selection(4) 0 – state0 (predefined by Y8Y9_ST0) 1 – state1 (predefined by Y8Y9_ST1) PLL4 SSC down/center selection: 0 – down 1 – center 7-Bit Y8-Output-Divider Pdiv8: 4Fh 7-Bit Y9-Output-Divider Pdiv9: 26 0 – reset and stand-by 1-to-127 – divider value PLL4_0 (5): 30-Bit Multiplier/Divider value for frequency fVCO4_0 (for more information, see PLL Frequency Planning). 000h 10h 004h 00 – 01 – 10 – 11 – fVCO4_0 < 125 MHz 125 MHz ≤ fVCO4_0 < 150 MHz 150 MHz ≤ fVCO4_0 < 175 MHz fVCO4_0 ≥ 175 MHz PLL4_1 (5): 30-Bit Multiplier/Divider value for frequency fVCO4_1 (for more information, see PLL Frequency Planning). 000h 10h fVCO4_1 range selection: (5) 0 – reset and stand-by 1-to-127 – divider value Reserved – do not write others than 0 fVCO4_0 range selection: 4Eh Pdiv6-Divider Pdiv8-Divider Pdiv9-Divider reserved 00 – 01 – 10 – 11 – fVCO4_1 < 125 MHz 125 MHz ≤ fVCO4_1 < 150 MHz 150 MHz ≤ fVCO4_1 < 175 MHz fVCO4_1 ≥ 175 MHz PLL settings limits: 16 ≤ q ≤ 63, 0 ≤ p ≤7, 0 ≤ r ≤ 511, 0 < N < 4096 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information The CDCEx949 device is an easy-to-use high-performance, programmable CMOS clock synthesizer. it can be used as a crystal buffer, clock synthesizer with separate output supply pin. The CDCEx949 features an on-chip loop filter and Spread-spectrum modulation. Programming can be done through SPI, pin-mode, or using on-chip EEPROM. This section shows some examples of using CDCEx949 in various applications. 10.2 Typical Application Figure 15 shows the use of the CDCEx949 devices for replacement of crystals and crystal oscillators on a Gigabit Ethernet Switch application. Crystals + Oscillators 1 x Crystal + 1 x Clock Crystals:4 Oscillators: 2 Clock: None Crystals: 1 Oscillators: None Clock: 1 40 MHz DP838xx 10/100 PHY WiFi 25 MHz DP838xx 10/100 PHY CDCE(L)9xx Clock WiFi 25 MHz 100 MHz 25 MHz FPGA USB Controller FPGA 25 MHz USB Controller 48 MHz Copyright © 2016, Texas Instruments Incorporated Figure 15. Crystal and Oscillator Replacement Example 10.2.1 Design Requirements CDCEx949 supports spread spectrum clocking (SSC) with multiple control parameters: • Modulation amount (%) • Modulation frequency (>20 kHz) • Modulation shape (triangular) • Center spread / down spread (± or –) Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 27 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com Typical Application (continued) Figure 16. Modulation Frequency (fm) and Modulation Amount 10.2.2 Detailed Design Procedure 10.2.2.1 Spread Spectrum Clock (SSC) Spread spectrum modulation is a method to spread emitted energy over a larger bandwidth. In clocking, spread spectrum can reduce Electromagnetic Interference (EMI) by reducing the level of emission from clock distribution network. CDCS502 with a 25-MHz Crystal, FS = 1, Fout = 100 MHz, and 0%, ±0.5, ±1%, and ±2% SSC Figure 17. Comparison Between Typical Clock Power Spectrum and Spread-Spectrum Clock 10.2.2.2 PLL Frequency Planning At a given input frequency (ƒIN), the output frequency (ƒOUT) of the CDCEx949 are calculated with Equation 1. ƒ N ƒOUT = IN ´ Pdiv M where • • M (1 to 511) and N (1 to 4095) are the multiplier/divide values of the PLL Pdiv (1 to 127) is the output divider The target VCO frequency (ƒVCO) of each PLL is calculated with Equation 2. N ƒ VCO = ƒIN ´ M 28 Submit Documentation Feedback (1) (2) Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 Typical Application (continued) The PLL internally operates as fractional divider and needs the following multiplier/divider settings: • N • P = 4 – int(log2N/M; if P < 0 then P = 0 • Q = int(N'/M) • R = N′ – M × Q where N′ = N × 2P N ≥ M; 80 MHz ≤ ƒVCO ≤ 230 MHz 16 ≤ Q ≤ 63 0≤P≤4 0 ≤ R ≤ 51 Example: for ƒIN = 27 MHz; M = 1; N = 4; Pdiv = 2 for ƒIN = 27 MHz; M = 2; N = 11; Pdiv = 2 → fOUT = 54 MHz → fOUT = 74.25 MHz → fVCO = 108 MHz → fVCO = 148.50 MHz → P = 4 – int(log24) = 4 – 2 = 2 → P = 4 – int(log25.5) = 4 – 2 = 2 2 → N' = 4 × 2 = 16 → N' = 11 × 22 = 44 → Q = int(16) = 16 → Q = int(22) = 22 → R = 16 – 16 = 0 → R = 44 – 44 = 0 The values for P, Q, R, and N’ are automatically calculated when using TI Pro-Clock™ software. 10.2.2.3 Crystal Oscillator Start-Up When the CDCEx949 is used as a crystal buffer, crystal oscillator start-up dominates the start-up time compared to the internal PLL lock time. The following diagram shows the oscillator start-up sequence for a 27-MHz crystal input with an 8-pF load. The start-up time for the crystal is in the order of approximately 250 µs compared to approximately 10 µs of lock time. In general, lock time is an order of magnitude less compared to the crystal start-up time. Figure 18. Crystal Oscillator Start-Up vs PLL Lock Time Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 29 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com Typical Application (continued) 10.2.2.4 Frequency Adjustment With Crystal Oscillator Pulling The frequency for the CDCEx949 is adjusted for media and other applications with the VCXO control input VCtrl. If a PWM modulated signal is used as a control signal for the VCXO, an external filter is needed. LP PWM control signal Vctrl CDCEx949 Xin/CLK Xout Figure 19. Frequency Adjustment Using PWM Input to the VCXO Control 10.2.2.5 Unused Inputs and Outputs If VCXO pulling functionality is not required, VCtrl should be left floating. All other unused inputs should be set to GND. Unused outputs should be left floating. If one output block is not used, TI recommends disabling it. However, TI always recommends providing the supply for the second output block even if it is disabled. 10.2.2.6 Switching Between XO and VCXO Mode When the CDCEx949 is in crystal oscillator or in VCXO configuration, the internal capacitors require different internal capacitance. The following steps are recommended to switch to VCXO mode when the configuration for the on-chip capacitor is still set for XO mode. To center the output frequency to 0 ppm: 1. While in XO mode, put Vctrl = Vdd/2 2. Switch from X0 mode to VCXO mode 3. Program the internal capacitors to obtain 0 ppm at the output. 10.2.3 Application Curves Figure 20, Figure 21, Figure 22, and Figure 23 show CDCEx949 measurements with the SSC feature enabled. Device configuration: 27-MHz input, 27-MHz output. Figure 20. fOUT = 27 MHz, VCO Frequency < 125 MHz, SSC (2% Center) 30 Submit Documentation Feedback Figure 21. fOUT = 27 MHz, VCO Frequency > 175 MHz, SSC (1%, Center) Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 Typical Application (continued) Figure 22. Output Spectrum With SSC Off Figure 23. Output Spectrum With SSC On, 2% Center 11 Power Supply Recommendations There is no restriction on the power-up sequence. In case the VDDOUT is applied first, TI recommends grounding the VDD. In case the VDDOUT is powered while VDD is floating, there is a risk of high current flowing on the VDDOUT. The device has a power-up control that is connected to the 1.8-V supply. This keeps the whole device disabled until the 1.8-V supply reaches a sufficient voltage level. Then the device switches on all internal components, including the outputs. If there is a 3.3-V VDDOUT available before the 1.8-V, the outputs stay disabled until the 1.8V supply reaches a certain level. 12 Layout 12.1 Layout Guidelines When the CDCEx949 is used as a crystal buffer, any parasitics across the crystal affects the pulling range of the VCXO. Therefore, take care placing the crystal units on the board. Crystals must be placed as close to the device as possible, ensuring that the routing lines from the crystal terminals to XIN and XOUT have the same length. If possible, cut out both ground plane and power plane under the area where the crystal and the routing to the device are placed. In this area, always avoid routing any other signal line, as it could be a source of noise coupling. Additional discrete capacitors can be required to meet the load capacitance specification of certain crystal. For example, a 10.7-pF load capacitor is not fully programmable on the chip, because the internal capacitor can range from 0 pF to 20 pF with steps of 1 pF. The 0.7-pF capacitor therefore can be discretely added on top of an internal 10-pF capacitor. To minimize the inductive influence of the trace, TI recommends placing this small capacitor as close to the device as possible and symmetrically with respect to XIN and XOUT. Figure 24 shows a conceptual layout detailing recommended placement of power supply bypass capacitors on the basis of CDCEx949. For component side mounting, use 0402 body size capacitors to facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the device as short as possible. Ground the other side of the capacitor using a low-impedance connection to the ground plane. Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 31 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com 12.2 Layout Example 1 4 3 2 1 3 Place crystal with associated load caps as close to the chip Place bypass caps close to the device pins, ensure wide freq. range 2 Place series termination resistors at Clock outputs to improve signal integrity 4 Use ferrite beads to isolate the device supply pins from board noise sources Figure 24. Annotated Layout 32 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 CDCE949, CDCEL949 www.ti.com SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 13 Device and Documentation Support 13.1 Device Support 13.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 13.1.2 Development Support For development support see the following: • SMBus • I2C Bus 13.2 Related Documentation For related documentation see the following: VCXO Application Guideline for CDCE(L)9xx Family (SCAA085) 13.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 14. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY CDCE949 Click here Click here Click here Click here Click here CDCEL949 Click here Click here Click here Click here Click here 13.4 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 13.5 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 13.6 Trademarks TI-DaVinci, OMAP, Pro-Clock, E2E are trademarks of Texas Instruments. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Ethernet is a trademark of Xerox Corporation. All other trademarks are the property of their respective owners. Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 Submit Documentation Feedback 33 CDCE949, CDCEL949 SCAS844F – AUGUST 2007 – REVISED OCTOBER 2016 www.ti.com 13.7 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.8 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 34 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated Product Folder Links: CDCE949 CDCEL949 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) CDCE949PW ACTIVE TSSOP PW 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CDCE949 CDCE949PWG4 ACTIVE TSSOP PW 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CDCE949 CDCE949PWR ACTIVE TSSOP PW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CDCE949 CDCE949PWRG4 ACTIVE TSSOP PW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CDCE949 CDCEL949PW ACTIVE TSSOP PW 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CDCEL949 CDCEL949PWR ACTIVE TSSOP PW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CDCEL949 CDCEL949PWRG4 ACTIVE TSSOP PW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CDCEL949 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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