CY2305C CY2309C
3.3V Zero Delay Clock Buffer
Features
■ ■ ■ ■ ■ ■ ■ ■
10 MHz to 100-133 MHz operating range Zero input and output propagation delay Multiple low skew outputs One input drives five outputs (CY2305C) One input drives nine outputs, grouped as 4 + 4 + 1 (CY2309C) 50 ps typical cycle-cycle jitter (15 pF, 66 MHz) Test Mode to bypass phase locked loop (PLL) (CY2309C) only, see “Select Input Decoding for CY2309C” on page 3 Available in space saving 16-pin 150 Mil SOIC or 4.4 mm TSSOP packages (CY2309C), and 8-pin, 150 Mil SOIC package (CY2305C) 3.3V operation Commercial, Industrial and Automotive-A flows available
skew clocks. The -1H versions of each device operate up to 100-133 MHz frequencies and have higher drive than the -1 devices. All parts have on-chip PLLs which lock to an input clock on the REF pin. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The CY2309C has two banks of four outputs each that are controlled by the select inputs as shown in the “Select Input Decoding for CY2309C” on page 3. If all output clocks are not required, BankB is three-stated. The input clock is directly applied to the outputs by the select inputs for chip and system testing purposes. The CY2305C and CY2309C PLLs enter a power down mode when there are no rising edges on the REF input. In this state, the outputs are three-stated and the PLL is turned off. This results in less than 12.0 μA of current draw for commercial temperature devices and 25.0 μA for industrial and automotive-A temperature parts. The CY2309C PLL shuts down in one additional case as shown in the “Select Input Decoding for CY2309C” on page 3. In the special case when S2:S1 is 1:0, the PLL is bypassed and REF is output from DC to the maximum allowable frequency. The part behaves as a non-zero delay buffer in this mode and the outputs are not three-stated. The CY2305C or CY2309C is available in two or three different configurations as shown in the “Ordering Information” on page 9. The CY2305C-1 or CY2309C-1 is the base part. The CY2305-1H or CY2309-1H is the high drive version of the -1. Its rise and fall times are much faster than the -1.
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Functional Description
The CY2305C and CY2309C are die replacement parts for CY2305 and CY2309. The CY2309C is a low cost 3.3V zero delay buffer designed to distribute high speed clocks and is available in a 16-pin SOIC or TSSOP package. The CY2305C is an 8-pin version of the CY2309C. It accepts one reference input and drives out five low
Logic Block Diagram for CY2305C
REF
PLL
CLKOUT CLK1 CLK2 CLK3 CLK4
Cypress Semiconductor Corporation Document Number: 38-07672 Rev. *H
•
198 Champion Court
•
San Jose, CA 95134-1709 • 408-943-2600 Revised August 27, 2008
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CY2305C CY2309C
Logic Block Diagram for CY2309C
PLL
REF MUX CLKOUT CLKA1 CLKA2 CLKA3 CLKA4 S2 Select Input Decoding S1 CLKB1 CLKB2 CLKB3 CLKB4
Pinouts
CY2305C
Figure 1. Pin Diagram - 8 Pin SOIC Top View
REF CLK2 CLK1 GND
1 2 3 4
CY2305C
8 7 6 5
CLKOUT CLK4 V DD CLK3
Table 1. Pin Description - 8 Pin SOIC Pin 1 2 3 4 5 6 7 8 REF[1] CLK2[2] CLK1[2] GND CLK3[2] VDD CLK4[2] CLKOUT[2] Signal Input reference frequency Buffered clock output Buffered clock output Ground Buffered clock output 3.3V supply Buffered clock output Buffered clock output, internal feedback on this pin Description
Notes 1. Weak pull down. 2. Weak pull down on all outputs.
Document Number: 38-07672 Rev. *H
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CY2305C CY2309C
CY2309C
Figure 2. Pin Diagram - 16 Pin SOIC/TSSOP Top View
REF CLKA1 CLKA2 VDD GND CLKB1 CLKB2 S2
1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9
CY2309C
CLKOUT CLKA4 CLKA3 VDD GND CLKB4 CLKB3 S1
Table 2. Pin Definition - 16 Pin SOIC/TSSOP Pin Signal 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 REF[1] CLKA1[2] CLKA2[2] VDD GND CLKB1[2] CLKB2[2] S2[3] S1[3] CLKB3[2] CLKB4[2] GND VDD CLKA3[2] CLKA4[2] CLKOUT[2] Input reference frequency Buffered clock output, Bank A Buffered clock output, Bank A 3.3V supply Ground Buffered clock output, Bank B Buffered clock output, Bank B Select input, bit 2 Select input, bit 1 Buffered clock output, Bank B Buffered clock output, Bank B Ground 3.3V supply Buffered clock output, Bank A Buffered clock output, Bank A
Description
Buffered output, internal feedback on this pin
Table 3. Select Input Decoding for CY2309C S2 0 0 1 1 S1 0 1 0 1 CLOCK A1–A4 Three state Driven Driven Driven CLOCK B1–B4 Three state Three state Driven Driven CLKOUT[4] Driven Driven Driven Driven Output Source PLL PLL Reference PLL PLL Shutdown N N Y N
Zero Delay and Skew Control
All outputs must be uniformly loaded to achieve Zero Delay between the input and output. Since the CLKOUT pin is the internal feedback to the PLL, its relative loading can adjust the input or output delay. For applications requiring zero input or output delay, all outputs including CLKOUT are equally loaded. Even if CLKOUT is not used, it must have a capacitive load equal to that on other outputs for obtaining zero input or output delay. For zero output or output skew, all outputs are loaded equally. For further information refer to the application note entitled “CY2305 and CY2309 as PCI and SDRAM Buffers”.
Notes 3. Weak pull ups on these inputs. 4. This output is driven and has an internal feedback for the PLL. The load on this output is adjusted to change the skew between the reference and output.
Document Number: 38-07672 Rev. *H
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CY2305C CY2309C
Absolute Maximum Conditions
Supply Voltage to Ground Potential................–0.5V to +4.6V DC Input Voltage (Except REF) ............ –0.5V to VDD + 0.5V DC Input Voltage REF ........................... –0.5V to VDD + 0.5V Storage Temperature ................................. –65°C to +150°C Junction Temperature ................................................. 150°C Static Discharge Voltage (per MIL-STD-883, Method 3015) ........................... > 2,000V
Operating Conditions for CY2305CSXC-XX and CY2309CSXC-XX
Operating Conditions table for CY2305CSXC-XX and CY2309CSXC-XX Commercial Temperature Devices. Parameter VDD TA CL CL CIN tPU Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance, below 100 MHz Load Capacitance, from 100 MHz to 133 MHz Input Capacitance Power up time for all VDDs to reach minimum specified voltage (power ramps are monotonic) 0.05 Description Min 3.0 0 Max 3.6 70 30 10 7 50 Unit V °C pF pF pF ms
Operating Conditions for CY2305CSXI-XX, CY2305CSXA-XX and CY2309CSXI-XX
Operating conditions table for CY2305CSXI-XX, CY2305CSXA-XX and CY2309CSXI-XX Industrial / Automotive-A Temperature Devices. Parameter VDD TA CL CL CIN tPU Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance, below 100 MHz Load Capacitance, from 100 MHz to 133 MHz Input Capacitance Power up time for all VDDs to reach minimum specified voltage (power ramps are monotonic) Description Min 3.0 –40 – – – 0.05 Max 3.6 85 30 10 7 50 Unit V °C pF pF pF ms
Electrical Characteristics for CY2305CSXC-XX and CY2309CSXC-XX
Electrical Characteristics table for CY2305CSXC-XX and CY2309CSXC-XX Commercial Temperature Devices. Parameter VIL VIH IIL IIH VOL VOH IDD (PD mode) IDD Description Input LOW Voltage
[5] [5]
Test Conditions
Min –0.3 2.0
Max 0.8 VDD + 0.3 50 100 0.4 – 12 32
Unit V V μA μA V V μA mA
Input HIGH Voltage Input LOW Current
VIN = 0V VIN = VDD
[6]
– – – 2.4 – –
Input HIGH Current Output LOW Voltage
IOL = 8 mA (–1) IOH = 12 mA (–1H) IOH = –8 mA (–1) IOL = –12 mA (–1H) REF = 0 MHz Unloaded outputs at 66.67 MHz, SEL inputs at VDD
Output HIGH Voltage[6] Power Down Supply Current Supply Current
Notes 5. .REF input has a threshold voltage of VDD/2. 6. Parameter is guaranteed by design and characterization. Not 100% tested in production.
Document Number: 38-07672 Rev. *H
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CY2305C CY2309C
Electrical Characteristics for CY2305CSXI-XX, CY2305CSXA-XX and CY2309CSXI-XX
Electrical characteristics table for CY2305CSXI-XX, CY2305CSXA-XX and CY2309CSXI-XX Industrial / Automotive-A Temperature Devices. Parameter VIL VIH IIL IIH VOL VOH Description Input LOW Voltage[5] Input HIGH Voltage Input LOW Current Input HIGH Current Output LOW Voltage[6] Output HIGH Voltage[6]
[5]
Test Conditions
Min –0.3 2.0
Max 0.8 VDD + 0.3 50 100 0.4 – 25 35
Unit V V μA μA V V μA mA
VIN = 0V VIN = VDD IOL = 8 mA (–1) IOH =12 mA (–1H) IOH = –8 mA (–1) IOL = –12 mA (–1H) REF = 0 MHz Unloaded outputs at 66.67 MHz, SEL inputs at VDD
– – – 2.4 – –
IDD (PD mode) Power down Supply Current IDD Supply Current
Switching Characteristics for CY2305CSXC-XX and CY2309CSXC-XX
Switching characteristics table for CY2305CSXC-1 and CY2309CSXC-1 Commercial Temperature Devices. All parameters are specified with loaded outputs. Parameter Name Test Conditions Min Typ Max Unit t1 tDC t3 t4 t5 t6A t6B t7 tJ tLOCK Output Frequency 30 pF load 10 pF load Measured at 1.4V, Fout ≤ 50 MHz Rise Time[6] Fall Time[6] Output to Output Skew[6] Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded 10 10 40 45 – – – – 1 – – – – 50 50 – – – 0 5 0 50 – 100 133.33 60 55 2.25 2.25 200 ±350 8.7 700 175 1.0 MHz MHz % % ns ns ps ps ns ps ps ms
Output Duty Cycle[6] = t2 ÷ t1 Measured at 1.4V, Fout > 50 MHz
Delay, REF Rising Edge to Measured at VDD/2 CLKOUT Rising Edge[6] Delay, REF Rising Edge to Measured at VDD/2. Measured in PLL CLKOUT Rising Edge[6] Bypass Mode, CY2309C device only. Device to Device Skew[6] Measured at VDD/2 on the CLKOUT pins of devices Stable power supply, valid clock presented on REF pin
Cycle to Cycle Jitter, peak[6] Measured at 66.67 MHz, loaded outputs PLL Lock Time[6]
Switching characteristics table for CY2305CSXC-1H and CY2309CSXC-1H Commercial Temperature Devices. All parameters are specified with loaded outputs. Parameter t1 tDC t3 t4 t5 Name Output Frequency 30-pF load 10-pF load Measured at 1.4V, Fout ≤ 50 MHz Rise Time[6] Skew[6] Measured between 0.8V and 2.0V Measured between 0.8V and 2.0V All outputs equally loaded Fall Time[6] Output to Output Description Min 10 10 40 45 – – – Typ – 50 50 – – – Max 100 133.33 60 55 1.5 1.5 200 Unit MHz MHz % % ns ns ps
Output Duty Cycle[6] = t2 ÷ t1 Measured at 1.4V, Fout > 50 MHz
Document Number: 38-07672 Rev. *H
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CY2305C CY2309C
Switching characteristics table for CY2305CSXC-1H and CY2309CSXC-1H Commercial Temperature Devices. All parameters are specified with loaded outputs. Parameter t6A t6B t7 t8 tJ tLOCK Name Description Min – 1 – 1 – – Typ 0 5 0 – – – Max ±350 8.7 700 – 175 1.0 Unit ps ns ps V/ns ps ms Delay, REF Rising Edge to Measured at VDD/2 CLKOUT Rising Edge[6] Delay, REF Rising Edge to Measured at VDD/2. Measured in PLL CLKOUT Rising Edge[6] Bypass Mode, CY2309C device only. Device to Device Skew[6] Output Slew Rate[6] Measured at VDD/2 on the CLKOUT pins of devices Measured between 0.8V and 2.0V using Test Circuit #2 Stable power supply, valid clock presented on REF pin
Cycle to Cycle Jitter, peak[6] Measured at 66.67 MHz, loaded outputs PLL Lock Time[6]
Switching Characteristics for CY2305CSXI-XX, CY2305CSXA-XX and CY2309CSXI-XX
Switching characteristics table for CY2305CSXI-1, CY2305CSXA-1, and CY2309CSXI-1 Industrial Temperature Devices. All parameters are specified with loaded outputs. Parameter t1 tDC t3 t4 t5 t6A t6B t7 tJ tLOCK Name Output Frequency 30 pF load 10 pF load Measured at 1.4V, Fout 50 MHz
Cycle to Cycle Jitter, peak[6] Measured at 66.67 MHz, loaded outputs PLL Lock Time[6]
Switching characteristics table for CY2305CSXI-1H, CY2305CSXA-1H and CY2309CSXI-1H Industrial / Automotive-A Temperature Device. All parameters are specified with loaded outputs. Parameter t1 tDC t3 t4 t5 t6A Name Output Frequency 30 pF load 10 pF load Measured at 1.4V, Fout 50 MHz
Document Number: 38-07672 Rev. *H
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CY2305C CY2309C
Switching characteristics table for CY2305CSXI-1H, CY2305CSXA-1H and CY2309CSXI-1H Industrial / Automotive-A Temperature Device. All parameters are specified with loaded outputs. Parameter t6B t7 t8 tJ tLOCK Name Delay, REF Rising Edge to CLKOUT Rising Edge[6] Device to Device Skew[6] Output Slew Rate[6] Description Measured at VDD/2. Measured in PLL Bypass Mode, CY2309C device only. Measured at VDD/2 on the CLKOUT pins of devices Measured between 0.8V and 2.0V using Test Circuit #2 Stable power supply, valid clock presented on REF pin Min 1 – 1 – – Typ 5 0 – – – 175 1.0 Max 8.7 700 Unit ns ps V/ns ps ms
Cycle to Cycle Jitter, peak[6] Measured at 66.67 MHz, loaded outputs PLL Lock Time
[6]
Switching Waveforms
Figure 3. Duty Cycle Timing
t1 t2 1.4V 1.4V 1.4V
Figure 4. All Outputs Rise/Fall Time
2.0V 0.8V t3 2.0V 0.8V t4 3.3V 0V
OUTPUT
Figure 5. Output-Output Skew
1.4V
OUTPUT
OUTPUT t5
1.4V
Document Number: 38-07672 Rev. *H
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CY2305C CY2309C
Figure 6. Input-Output Propagation Delay
VDD/2
INPUT
OUTPUT t6
VDD/2
Figure 7. Device-Device Skew
VDD/2
CLKOUT, Device 1
CLKOUT, Device 2 t7
VDD/2
Test Circuits
Test Circuit # 1 V DD 0.1 μ F CLK OUTPUTS C LOAD V DD 0.1 μ F GND GND 0.1 μ F V DD GND GND out 0.1 μ F Test Circuit # 2 V DD OUTPUTS 1 kΩ 10 pF 1 kΩ
For parameter t8 (output slew rate) on -1H devices
Document Number: 38-07672 Rev. *H
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CY2305C CY2309C
Ordering Information
Ordering Code Pb-Free - CY2305C CY2305CSXC-1 CY2305CSXC-1T CY2305CSXC-1H CY2305CSXC-1HT CY2305CSXI-1 CY2305CSXI-1T CY2305CSXI-1H CY2305CSXI-1HT CY2305CSXA-1H CY2305CSXA-1HT CY2305CSXA-1 CY2305CSXA-1T Pb-Free- CY2309C CY2309CSXC-1 CY2309CSXC-1T CY2309CSXC-1H CY2309CSXC-1HT CY2309CSXI-1 CY2309CSXI-1T CY2309CSXI-1H CY2309CSXI-1HT CY2309CZXC-1 CY2309CZXC-1T CY2309CZXC-1H CY2309CZXC-1HT CY2309CZXI-1 CY2309CZXI-1T CY2309CZXI-1H CY2309CZXI-1HT 16-pin 150 Mil SOIC 16-pin 150 Mil SOIC – Tape and Reel 16-pin 150 Mil SOIC 16-pin 150 Mil SOIC – Tape and Reel 16-pin 150 Mil SOIC 16-pin 150 Mil SOIC – Tape and Reel 16-pin 150 Mil SOIC 16-pin 150 Mil SOIC – Tape and Reel 16-pin 4.4 mm TSSOP 16-pin 4.4 mm TSSOP – Tape and Reel 16-pin 4.4 mm TSSOP 16-pin 4.4 mm TSSOP – Tape and Reel 16-pin 4.4 mm TSSOP 16-pin 4.4 mm TSSOP – Tape and Reel 16-pin 4.4 mm TSSOP 16-pin 4.4 mm TSSOP – Tape and Reel Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial 8-pin 150 Mil SOIC 8-pin 150 Mil SOIC – Tape and Reel 8-pin 150 Mil SOIC 8-pin 150 Mil SOIC – Tape and Reel 8-pin 150 Mil SOIC 8-pin 150 Mil SOIC – Tape and Reel 8-pin 150 Mil SOIC 8-pin 150 Mil SOIC – Tape and Reel 8-pin 150 Mil SOIC 8-pin 150 Mil SOIC – Tape and Reel 8-pin 150 Mil SOIC 8-pin 150 Mil SOIC – Tape and Reel Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Automotive-A Automotive-A Automotive-A Automotive-A Package Type Operating Range
Document Number: 38-07672 Rev. *H
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CY2305C CY2309C
Package Drawing and Dimensions
Figure 8. 8-Pin (150 Mil) SOIC S8
PIN 1 ID
4
1
1. DIMENSIONS IN INCHES[MM] MIN. MAX. 2. PIN 1 ID IS OPTIONAL, ROUND ON SINGLE LEADFRAME RECTANGULAR ON MATRIX LEADFRAME 3. REFERENCE JEDEC MS-012
0.230[5.842] 0.244[6.197]
0.150[3.810] 0.157[3.987]
4. PACKAGE WEIGHT 0.07gms
PART # S08.15 STANDARD PKG. 5 8 SZ08.15 LEAD FREE PKG.
0.189[4.800] 0.196[4.978]
SEATING PLANE
0.010[0.254] 0.016[0.406]
X 45°
0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.004[0.102] 0.0098[0.249] 0°~8° 0.016[0.406] 0.035[0.889] 0.0075[0.190] 0.0098[0.249]
0.0138[0.350] 0.0192[0.487]
51-85066-*C
Figure 9. 16-Pin (150 Mil) SOIC S16
PIN 1 ID
8
1 DIMENSIONS IN INCHES[MM] MIN. MAX. REFERENCE JEDEC MS-012
0.150[3.810] 0.157[3.987] 0.230[5.842] 0.244[6.197]
PACKAGE WEIGHT 0.15gms
PART # S16.15 STANDARD PKG. SZ16.15 LEAD FREE PKG. 9 16
0.386[9.804] 0.393[9.982]
SEATING PLANE
0.010[0.254] 0.016[0.406]
X 45°
0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.0138[0.350] 0.0192[0.487] 0.004[0.102] 0.0098[0.249]
0°~8°
0.016[0.406] 0.035[0.889]
0.0075[0.190] 0.0098[0.249]
51-85068-*B
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CY2305C CY2309C
Figure 10. 16-Pin TSSOP 4.40 MM Body Z16.173
PIN 1 ID
1
DIMENSIONS IN MM[INCHES] MIN. MAX. REFERENCE JEDEC MO-153
6.25[0.246] 6.50[0.256] 4.30[0.169] 4.50[0.177]
PACKAGE WEIGHT 0.05gms
16
0.65[0.025] BSC.
0.19[0.007] 0.30[0.012]
1.10[0.043] MAX.
0.25[0.010] BSC GAUGE PLANE 0°-8°
0.076[0.003] 0.85[0.033] 0.95[0.037] 0.05[0.002] 0.15[0.006] SEATING PLANE 0.50[0.020] 0.70[0.027] 0.09[[0.003] 0.20[0.008] 51-85091-*A
4.90[0.193] 5.10[0.200]
Document Number: 38-07672 Rev. *H
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CY2305C CY2309C
Document History Page
Document Title: CY2305C CY2309C 3.3V Zero Delay Clock Buffer Document Number: 38-07672 REV. ** *A *B *C *D *E *F ECN NO. 224421 268571 276453 303063 318315 344815 1279889 Issue Date See ECN See ECN See ECN See ECN See ECN See ECN See ECN Orig. of Change RGL RGL RGL RGL RGL RGL KVM New data sheet Added bullet for 5V tolerant inputs in the features Minor Change: Moved one sentence from the features to the Functional Description Updated data sheet as per characterization data Data sheet rewrite Minor Error: Corrected the header of all the AC/DC tables with the right part numbers. Changed title from “Low Cost 3.3V Zero Delay Buffer” to “3.3V Zero Delay Clock Buffer” Specified the VIL minimum value to -0.3V Specified the VIH maximum value to VDD + 0.3V Changed DC Input Voltage (REF) maximum value in Absolute Maximum section Removed references to 5V tolerant inputs (pages 1 and 2) Removed Pentium compatibility reference Added CY2305C block diagram Added “peak” to the jitter specifications Changed typical jitter from 75 ps to 50 ps for standard drive devices For standard drive devices, tightened rise/fall times from 2.5 ns to 2.25 ns Tightened cycle-to-cycle jitter from 200 ps to 175 ps Tightened output-to-output skew from 250 ps to 200 ps Description of Change
*G
1561504
See ECN
KVM/NSI Added CY2305C Automotive-A grade devices /AESA Extended duty cycle specs to cover entire frequency range Changed from Preliminary to Final KVM/AESA Added CY2305CSXA-1 and CY2305CSXA-1T parts in Ordering Information table under Pb-free CY2305C
*H
2558537
08/27/08
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Document Number: 38-07672 Rev. *H
Revised August 27, 2008
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PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. All products and company names mentioned in this document may be the trademarks of their respective holders.
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