CY23FS04-2
Failsafe™ 2.5V/3.3V Zero Delay Buffer
Features
Functional Description
■
Internal DCXO for Continuous Glitch-free Operation
■
Zero Input-Output Propagation Delay
■
Low-Jitter (35 ps max RMS) Outputs
■
Low Output-to-Output Skew (200 ps max)
The CY23FS04-2 is a FailSafe™ zero delay buffer with two
reference clock inputs and four phase-aligned outputs. The
device provides an optimum solution for applications where
continuous operation is required in the event of a primary clock
failure.
■
4.17 MHz to 50 MHz Reference Input
■
Supports Industry Standard Input Crystals
■
4.17 MHz to 50 MHz Outputs
■
5V-Tolerant Inputs
■
Phase-Locked Loop (PLL) Bypass Mode
■
Dual Reference Inputs
■
16-Pin TSSOP
■
2.5V or 3.3V Output Power Supplies
■
3.3V Core Power Supply
The continuous, glitch-free operation is achieved by using a
DCXO, which serves as a redundant clock source in the event of
a reference clock failure by maintaining the last frequency and
phase information of the reference clock.
The unique feature of the CY23FS04-2 is that the DCXO is in fact
the primary clocking source, which is synchronized
(phase-aligned) to the external reference clock. When this
external clock is restored, the DCXO automatically resynchronizes to the external clock.
The frequency of the crystal that is connected to the DCXO must
be an integer factor of the frequency of the reference clock. This
factor is set by two select lines: S[2:1], see Table 2. The output
power supply VDD can be connected to either 2.5V or 3.3V.
VDDC is the power supply pin for internal circuits and must be
connected to 3.3V.
Logic Block Diagram
XIN XOUT
REFSEL
DCXO
REF1
2
FailsafeTM
REF2
Block
PLL
2
CLKA[1:2]
CLKB[1:2]
FBK
Decoder
FAIL# /SAFE
2
S[2:1]
Cypress Semiconductor Corporation
Document Number: 38-07671 Rev. *B
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 29, 2010
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CY23FS04-2
Contents
Features ............................................................................. 1
Functional Description ..................................................... 1
Logic Block Diagram ........................................................ 1
Contents ............................................................................ 2
Pin Configuration ............................................................. 3
FailSafe Function .............................................................. 4
XTAL Selection Criteria and Application Example ...... 7
Absolute Maximum Conditions ....................................... 9
Recommended Pullable Crystal Specifications ............ 9
Operating Conditions for FailSafe Devices .................... 9
Document Number: 38-07671 Rev. *B
Electrical Characteristics for FailSafe Devices ........... 10
Switching Characteristics for FailSafe Devices .......... 10
Ordering Information ...................................................... 10
Package Diagram ............................................................ 11
Document History Page ................................................. 12
Sales, Solutions, and Legal Information ...................... 12
Worldwide Sales and Design Support ....................... 12
Products .................................................................... 12
PSoC Solutions ......................................................... 12
Page 2 of 12
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CY23FS04-2
Pin Configuration
Figure 1. 16-Pin TSSOP
Table 1. Pin Definition
Pin No.
Pin Name
Description
5V-tolerant.[4]
1,2
REF[1:2]
Reference clock inputs.
3,4
CLKB[1:2]
Bank B clock outputs.[1,2]
14,13
CLKA[1:2]
Bank A clock outputs.[1,2]
15
FBK
Feedback input to the PLL.[1,4]
12,5
S[1:2]
Frequency select pins and PLL and DCXO bypass mode.[3]
8
XIN
Reference crystal input.
9
XOUT
Reference crystal output.
10
FAIL#/SAFE
Valid reference indicator. A high level indicates a valid reference input.
11
VDD
2.5V or 3.3V power supply.
7
VDDC
3.3V power supply.
6
VSS
Ground.
16
REFSEL
Reference select. Selects the active reference clock from either REF1 or REF2. REFSEL = 1,
REF1 is selected; REFSEL = 0, REF2 is selected.
Table 2. Configuration Table
S[2:1]
XTAL (MHz)
REF (MHz)
OUT (MHz)
REF:XTAL
Ratio
Out:XTAL
Ratio
x1
1/2
1/2
x1
2
2
1
1
Max
Min
Max
Min
01
8.33
30.00
4.17
15.00
4.17
15.00
10
8.00
25.00
16.00
50.00
16.00
50.00
11
8.33
30.00
8.33
30.00
8.33
30.00
x1
00
Max
REF:OUT
Ratio
Min
PLL and DCXO Bypass Mode
Notes
1. For normal operation, connect either one of the four clock outputs to the FBK input.
2. Weak pull downs on all outputs.
3. Weak pull ups on these inputs.
4. Weak pull down on these inputs
Document Number: 38-07671 Rev. *B
Page 3 of 12
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CY23FS04-2
FailSafe Function
The CY23FS04-2 is targeted at clock distribution applications
that require continued operation should the main reference clock
fail. Existing approaches to this requirement have used multiple
reference clocks with either internal or external methods to
switch between references. The problem with this technique is
that it leads to interruptions (or glitches) when transitioning from
one reference to another, often requiring complex external
circuitry or software to maintain system stability. The technique
implemented in this design completely eliminates any switching
of references to the PLL, greatly simplifying system design.
The CY23FS04-2 PLL is driven by the crystal oscillator, which is
phase-aligned to an external reference clock so that the output
of the device is effectively phase-aligned to the reference via the
external feedback loop. This is accomplished by using a digitally
controlled capacitor array to pull the crystal frequency over an
approximate range of +300 ppm from its nominal frequency.
In this mode, if the reference frequency fails (stop or disappear),
the DCXO maintains its last setting and a flag signal
(FAIL#/SAFE) is set to indicate failure of the reference clock.
The CY23FS04-2 provides two select bits, S1 and S2, to control
the reference-to-crystal frequency ratio. The DCXO is internally
tuned to the phase and frequency of the external reference only
when the reference frequency divided by this ratio is within the
DCXO capture range. If the frequency is out of range, a flag is
set on the FAIL#/SAFE pin notifying the system that the selected
reference is not valid. If the reference moves in range, then the
flag is cleared, indicating to the system that the selected
reference is valid.
Figure 2. Fail#/Safe Timing for Input Reference Failing Catastrophically
REF
OUT
Fail#/S afe
t FSH
t FSL
Figure 3. Fail#/Safe Timing Formula
t F S L (m a x )
= 2 ( tR E F x n )
+ 25ns
n = F R E F = 4 ( in a b o v e e x a m p le )
F XTAL
t F S H ( m in ) =
12(
tR E F x n
)
+
25ns
Table 3. FailSafe Timing Table
Parameter
Description
Conditions
tFSL
Fail#/Safe Assert Delay
Measured at 80% to 20%, Load = 15 pF
tFSH
Fail#/Safe Deassert Delay
Measured at 80% to 20%, Load = 15 pF
Document Number: 38-07671 Rev. *B
Min
See Figure 3
Max
Unit
See Figure 3
ns
ns
Page 4 of 12
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CY23FS04-2
Figure 4. FailSafe Timing Diagram: Input Reference Slowly Drifting Out of FailSafe Capture Range
Reference + 300 ppm
Reference
Reference - 300 ppm
Frequency
Reference Off
Output + 300 ppm
Output
Output - 300 ppm
Volt
Fail#/Safe
tFSH
tFSL
Time
Figure 5. FailSafe Reference Switching Behavior
Document Number: 38-07671 Rev. *B
Page 5 of 12
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CY23FS04-2
Because of the DCXO architecture, the CY23FS04-2 has a much lower bandwidth than a typical PLL-based clock generator. This is
shown in Figure 6. This low bandwidth makes the CY23FS04-2 also useful as a jitter attenuator. The loop bandwidth curve is also
known as the jitter transfer curve.
Figure 6. FailSafe Effective Loop Bandwidth (min)
Figure 7. Duty Cycle
= t1 / t2
Duty Cycle - t DC
VDD/2
VDD/2
VDD/2
VDD
0V
t1
t2
Figure 8. Input Slew Rate
70%
VDD
70%
30%
30%
0V
t SR(I)
t SR(I)
Figure 9. Output Slew Rate
80%
VDD
80%
20%
20%
0V
tSR(O)
Document Number: 38-07671 Rev. *B
tSR(O)
Page 6 of 12
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CY23FS04-2
Figure 10. Output to Output Skew and Intrabank Skew
VDD/2
VDD/2
t SK
Figure 11. Part to Part Skew
FBK,
Part 1
VDD/2
FBK,
Part 2
VDD/2
tSK(PP)
Figure 12. Phase Offset
REF
VDD/2
FBK
VDD/2
t(φ)
XTAL Selection Criteria and Application Example
C0 is the XTAL shunt capacitance (3 pF to 7 pF typ).
Choosing the appropriate XTAL ensures the FailSafe device is
able to span an appropriate frequency of operation. Also, the
XTAL parameters determine the holdover frequency stability.
Critical parameters are given here. Cypress recommends that
you choose:
C1 is the XTAL motional capacitance (10 fF to 30 fF typ).
■
Low C0/C1 ratio (240 or less) so that the XTAL has enough
range of pullability
■
Low temperature frequency variation
■
Low manufacturing frequency tolerance
■
Low aging
The capacitive load as “seen” by the XTAL is across its terminals.
It is named CLOADMIN (for minimum value), and CLOADMAX (for
maximum value).These are used to calculate the pull range.
Note that the CLOAD range “center” is approximately 20 pF, but
you may not want a XTAL calibrated to that load. This is because
the pullability is not linear, as represented in the equation above.
Plotting the pullability of the XTAL shows this expected behavior
as shown in Figure 13. In this example, specifying a XTAL
calibrated to 14 pF load provides a balanced ppm pullability
range around the nominal frequency.
Example:
CLOADMIN = (12 pF IC input cap + 0 pF pulling cap + 6 pF trace cap on board) / 2 = 9 pF
CLOADMAX = (12 pF IC input cap + 48 pF pulling cap + 6 pF trace cap on board) / 2 = 33 pF
Pull Range = (fCLOADMIN – fCLOADMAX) / fCLOADMIN = (C1 / 2) * [(1 / (C0 + CLOADMIN)) – (1 / (C0 + CLOADMAX))]
Pull Range in ppm = (C1 / 2) * [(1 / (C0 + CLOADMIN)) – (1 / (C0 + CLOADMAX))] * 106
Document Number: 38-07671 Rev. *B
Page 7 of 12
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CY23FS04-2
Figure 13. Frequency vs. CLOAD Behavior for Example XTAL
Pullability Range vs CLOAD
(Normalized to 14pF CLOAD )
Delta Freq. from nominal (PPM)
400
300
200
100
C0/C1 = 200
0
C0/C1 = 300
-100
C0/C1 = 400
-200
-300
-400
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34
CLOAD (pF)
Table 4. Pullability Range of XTAL with Different C0/C1 Ratio
Pullability
Range
C0/C1 Ratio
CLOAD(min)
CLOAD(max)
200
8.0
32.0
–385
333
300
8.0
32.0
–256
222
400
8.0
32.0
–192
166
Calculating the capture range involves subtracting error
tolerances as follows:
Parameter...........................................................f error (ppm)
Manufacturing frequency tolerance ...................................15
Temperature stability ..........................................................30
Aging ................................................................................... 3
Board/trace variation ........................................................... 5
Calculated value of the pullability range for the XTAL with C0/C1
ratio of 200, 300, and 400 are shown in Table 4. For this calculation CLOAD(min) = 8 pF and CLOAD(max)= 32 pF is used. Using
a XTAL that has a nominal frequency specified at load capacitance of 14 pF, almost symmetrical pullability range is obtained.
Total ....................................................................................53
Next, it is important to calculate the pullability range including
error tolerances. This is the capture range of the input reference
frequency that the FailSafe device and XTAL combination can
reliably span.
It is important to note that the XTAL with lower C0/C1 ratio has
wider pullability/capture range as compared to the higher C0/C1
ratio. This helps to select the appropriate XTAL for use in the
FailSafe application.
Document Number: 38-07671 Rev. *B
Example: Capture Range for XTAL with C0/C1 Ratio of 200
Negative Capture Range= –385 ppm + 53 ppm = –332 ppm
Positive Capture Range = 333 ppm – 53 ppm = +280 ppm
Page 8 of 12
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CY23FS04-2
Absolute Maximum Conditions
Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested.
Parameter
Description
Condition
Min
Max
Unit
VDD
Supply Voltage
VIN
Input Voltage
TS
TJ
ESDHBM
ESD Protection (Human Body Model)
MIL-STD-883, Method 3015
ØJC
Dissipation, Junction to Case
Mil-Spec 883E Method 1012.1
29.87
°C/W
ØJA
Dissipation, Junction to Ambient
JEDEC (JESD 51)
120.11
°C/W
UL–94
Flammability Rating
At 1/8 in.
MSL
Moisture Sensitivity Level
–0.5
4.6
V
Relative to VSS
–0.5
VDD+0.5
VDC
Temperature, Storage
Non Functional
–65
150
°C
Temperature, Junction
Functional
–
125
°C
2000
–
V
V–0
1
Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power up. Power supply sequencing is NOT required.
Recommended Pullable Crystal Specifications[5]
Parameter
Name
Comments
Min
Typ
Max
Unit
8.00
–
30.00
MHz
FNOM
Nominal crystal frequency
CLOADNOM
Nominal load capacitance
–
14
–
pF
R1
Equivalent series resistance (ESR)
Fundamental mode
–
–
25
Ω
R3/R1
Ratio of third overtone mode ESR to
fundamental mode ESR
Ratio used because typical R1 values
are much less than the maximum spec
3
–
–
DL
Crystal drive level
No external series resistor assumed
–
0.5
2
mW
F3SEPLI
Third overtone separation from 3*FNOM High side
300
–
–
ppm
F3SEPLO
Third overtone separation from 3*FNOM Low side
–
–
–150
ppm
C0
Crystal shunt capacitance
–
–
7
pF
Parallel resonance, fundamental
mode, AT cut
C0 / C1
Ratio of shunt to motional capacitance
180
–
250
C1
Crystal motional capacitance
14.4
18
21.6
fF
Operating Conditions for FailSafe Devices
Parameter
Description
Min
Max
Unit
VDDC
3.3V Supply Voltage
3.135
3.465
V
VDD
2.5V Supply Voltage Range
2.375
2.625
V
3.3V Supply Voltage Range
3.135
3.465
V
TA
Ambient Operating Temperature, Commercial
0
70
°C
CL
Output Load Capacitance
–
30
pF
CIN
Input Capacitance (except XIN)
–
7
pF
CXIN
Crystal Input Capacitance (all internal caps off)
TPU
Power up time for all VDDs to reach minimum specified voltage (power ramps
must be monotonic)
10
13
pF
0.05
500
ms
Note
5. Ecliptek ECX-5788-13.500M, ECX-5807-19.440M, ECX-5872-19.53125M, ECX-6362-18.432M, ECX-5808-27.000M, ECX-5884-17.664M, ECX-5883-16.384M,
ECX-5882-19.200M, ECX-5880-24.576M meet these specifications.
Document Number: 38-07671 Rev. *B
Page 9 of 12
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CY23FS04-2
Electrical Characteristics for FailSafe Devices
Parameter
Description
VIL
Input Low Voltage
Min
Typ
Max
Unit
CMOS Levels, 30% of VDD
Test Conditions
–
–
0.3 × VDD
V
µA
VIH
Input High Voltage
CMOS Levels, 70% of VDD
0.7 × VDD
–
IIL
Input Low Current
VIN = VSS (100k pull up only)
–
–
50
IIH
Input High Current
VIN = VDD (100k pull down only)
–
–
50
µA
IOL
Output Low Current
VOL = 0.5V, VDD = 2.5V
–
18
–
mA
VOL = 0.5V, VDD = 3.3V
–
20
–
mA
IOH
Output High Current
VOH = VDD – 0.5V, VDD = 2.5V
–
18
–
mA
VOH = VDD – 0.5V, VDD = 3.3V
–
20
–
mA
IDDQ
Quiescent Current
All inputs grounded, PLL and DCXO in bypass
mode, Reference Input = 0
–
–
250
µA
V
Switching Characteristics for FailSafe Devices
Parameter[7]
Description
Test Conditions
Min
Max
Unit
fREF
Reference Frequency
Commercial/Industrial Grades
4.17
50
MHz
fOUT
Output Frequency
30 pF Load, Commercial Grade
4.17
50
MHz
fXIN
DCXO Frequency
8.0
30
MHz
tDC
Duty Cycle
Measured at VDD/2
47
53
%
tSR(I)
Input Slew Rate
Measured on REF1 Input, 30% to 70% of VDD
0.5
4.0
V/ns
tSR(O)
Output Slew Rate
Measured from 20% to 80% of VDD = 3.3V, 15 pF
Load
0.8
4.0
V/ns
Measured from 20% to 80% of VDD = 2.5V, 15 pF
Load
0.4
3.0
V/ns
All outputs equally loaded, measured at VDD/2
–
200
ps
tSK(O)
Output to Output Skew
tSK(PP)
Part to Part Skew
Measured at VDD/2
–
500
ps
t(φ)[6]
Static Phase Offset
Measured at VDD/2
–
250
ps
tD(φ)
[6]
tJ(CC)
Dynamic Phase Offset
Measured at VDD/2
–
200
ps
Cycle-to-Cycle Jitter
Load = 15 pF, fOUT ≥ 6.25 MHz
–
200
ps
–
35
psRMS
Ordering Information
Part Number
Package Type
Product Flow
Pb-free
CY23FS04ZXC-2
16-Pin TSSOP
Commercial, 0°C to 70°C
CY23FS04ZXC-2T
16-Pin TSSOP – Tape and Reel
Commercial, 0°C to 70°C
Notes
6. The t(φ) reference feedback input delay is guaranteed for a maximum 4:1 input edge ratio between the two signals as long as tSR(I) is maintained.
7. Parameters guaranteed by design and characterization, not 100% tested in production.
Document Number: 38-07671 Rev. *B
Page 10 of 12
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CY23FS04-2
Package Diagram
Figure 14. 16-Pin TSSOP 4.40 mm Body
PIN 1 ID
DIMENSIONS IN MM[INCHES] MIN.
MAX.
1
REFERENCE JEDEC MO-153
PACKAGE WEIGHT 0.05gms
6.25[0.246]
6.50[0.256]
4.30[0.169]
4.50[0.177]
16
0.65[0.025]
BSC.
0.19[0.007]
0.30[0.012]
1.10[0.043] MAX.
0.25[0.010]
BSC
GAUGE
PLANE
0°-8°
0.076[0.003]
0.85[0.033]
0.95[0.037]
4.90[0.193]
5.10[0.200]
0.05[0.002]
0.15[0.006]
SEATING
PLANE
0.50[0.020]
0.70[0.027]
0.09[[0.003]
0.20[0.008]
51-85091 *B
Document Number: 38-07671 Rev. *B
Page 11 of 12
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CY23FS04-2
Document History Page
Document Title: CY23FS04-2 Failsafe™ 2.5V/3.3V Zero Delay Buffer
Document Number: 38-07671
Rev.
ECN No.
Submission
Date
Orig. of
Change
**
224423
See ECN
RGL
*A
276753
See ECN
*B
2865337
01/25/2010
Description of Change
New data sheet
RGL/ZJX Removed (TLOCK) Lock Time Specification
CXQ
Updated format.
Added “Contents” section on page 2.
Removed previous Figures 5 and 6.
Added / separated Figures 7 through 12.
Changed references of “Cl” to “CLOAD”.
Removed extra TA reference in Absolute Maximum Conditions.
Removed industrial temperature range from TA.
Removed CL spec for fOUT > 100 MHz (fOUT max is 50 MHz for -2 devices).
Changed table captions for Tables 4, 5, and 6 to section headings.
Removed note 5 regarding programming cap array.
Replaced crystal ECX–5806–18.432M with ECX–6362–18.432M in Note 6.
Changed test condition from 15 pF to 30 pF for fOUT spec.
Removed industrial temp range devices from Ordering Information.
Removed unreferenced Note 9.
Updated package drawing specification to rev *B.
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© Cypress Semiconductor Corporation, 2003-2010. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 38-07671 Rev. *B
Revised January 29, 2010
Page 12 of 12
2
FailSafe™ is a trademark of Cypress Semiconductor Corporation. Purchase of I C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C
Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors
has a new trade name - NXP Semiconductors. All products and company names mentioned in this document may be the trademarks of their respective holders.
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