CY2XP22ZXCT

CY2XP22 Crystal to LVPECL Clock Generator Features ■ ■ ■ ■ ■ ■ ■ ■ ■ Pb-free 8-Pin TSSOP package Supply voltage: 3.3 V or 2.5 V Commercial and Industrial temperature ranges One LVPECL output pair Selectable frequency multiplication: x2.5 or x5 External crystal frequency: 25.0 MHz Output frequency: 62.5 MHz or 125 MHz Low RMS phase jitter at 125 MHz, using 25 MHz crystal (1.875 MHz to 20 MHz): 0.4 ps (typical) Phase noise at 125 MHz (typical): Offset 1 kHz 10 kHz 100 kHz 1 MHz Noise Power –117 dBc/Hz –126 dBc/Hz –131 dBc/Hz –131 dBc/Hz Functional Description The CY2XP22 is a PLL (Phase Locked Loop) based high performance clock generator that uses an external reference crystal. It is specifically targeted at FibreChannel and Gigabit Ethernet applications. It produces a selectable output frequency that is 2.5 or 5 times the crystal frequency. With a 25 MHz crystal, the user can select either a 62.5 MHz or 125 MHz output. It uses Cypress’s low noise VCO technology to achieve less than 1 ps typical RMS phase jitter. The CY2XP22 has a crystal oscillator interface input and one LVPECL output pair. Logic Block Diagram XIN External Crystal XOUT CRYSTAL OSCILLATOR LOW -NOISE PLL O UTPUT DIVIDER CLK CLK# F _SEL Pinouts Figure 1. Pin Diagram – 8-Pin TSSOP VDD VSS XOUT XIN Table 1. Pin Definitions – 8-Pin TSSOP Pin Number 1, 8 2 3, 4 5 6,7 Pin Name VDD VSS XOUT, XIN F_SEL CLK#, CLK Power Power I/O Type 1 2 3 4 8 7 6 5 VDD CLK CLK# F_SEL Description 3.3 V or 2.5 V power supply Ground Parallel resonant crystal interface Frequency Select: see Frequency Table Differential clock output XTAL output and input CMOS input LVPECL output Cypress Semiconductor Corporation Document #: 001-10229 Rev. *F • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised April 11, 2011 [+] Feedback CY2XP22 Frequency Table Inputs Crystal Frequency (MHz) 25 F_SEL 0 1 PLL Multiplier Value 5 2.5 Output Frequency (MHz) 125 62.5 Absolute Maximum Conditions Parameter VDD VIN[1] TS TJ ESDHBM UL–94 ΘJA[2] Supply Voltage Input Voltage, DC Temperature, Storage Temperature, Junction ESD Protection, Human Body Model Flammability Rating Thermal Resistance, Junction to Ambient JEDEC STD 22-A114-B At 1/8 in. 0 m/s airflow 1 m/s airflow 2.5 m/s airflow Relative to VSS Non operating Description Conditions Min –0.5 –0.5 –65 – 2000 V–0 100 91 87 °C/W Max 4.4 VDD + 0.5 150 135 – Unit V V °C °C V Operating Conditions Parameter VDD TA TPU 3.3 V Supply Voltage 2.5 V Supply Voltage Ambient Temperature, Commercial Ambient Temperature, Industrial Power up time for all VDD to reach minimum specified voltage (ensure power ramps is monotonic) Description Min 3.135 2.375 0 –40 0.05 Max 3.465 2.625 70 85 500 Unit V V °C °C ms DC Electrical Characteristics Parameter IDD Description Operating Supply Current with output unterminated Test Conditions VDD = 3.465 V, FOUT = 125 MHz, output unterminated VDD = 2.625 V, FOUT = 125 MHz, output unterminated IDDT Operating Supply Current with output terminated VDD = 3.465 V, FOUT = 125 MHz, output terminated VDD = 2.625 V, FOUT = 125 MHz, output terminated VOH VOL LVPECL Output High Voltage LVPECL Output Low Voltage Min – – – – Typ – – – – – – Max 125 120 150 145 VDD –0.75 VDD –1.625 Unit mA mA mA mA V V VDD = 3.3 V or 2.5 V, RTERM = 50Ω to VDD –1.15 VDD – 2.0 V VDD = 3.3 V or 2.5 V, RTERM = 50Ω to VDD – 2.0 V VDD –2.0 Notes 1. The voltage on any input or IO pin cannot exceed the power pin during power up. 2. Simulated using Apache Sentinel TI software. The board is derived from the JEDEC multilayer standard. It measures 76 x 114 x 1.6 mm and has 4-layers of copper (2/1/1/2 oz.). The internal layers are 100% copper planes, while the top and bottom layers have 50% metalization. No vias are included in the model. Document #: 001-10229 Rev. *F Page 2 of 10 [+] Feedback CY2XP22 DC Electrical Characteristics (continued) Parameter VOD1 VOD2 VOCM VIH VIL IIH IIL CIN [3] Description LVPECL Peak-to-Peak Output Voltage Swing LVPECL Output Voltage Swing (VOH - VOL) Test Conditions VDD = 3.3 V or 2.5 V, RTERM = 50Ω to VDD – 2.0 V VDD = 2.5 V, RTERM = 50Ω to VDD – 1.5 V Min 600 500 1.2 0.7*VDD –0.3 Typ – – – – – – – 15 4.5 Max 1000 1000 – VDD + 0.3 0.3*VDD 115 – – – Unit mV mV V V V µA µA pF pF LVPECL Output Common Mode VDD = 2.5 V, RTERM = 50Ω to VDD – Voltage (VOH + VOL)/2 1.5 V Input High Voltage, F_SEL Input Low Voltage, F_SEL Input High Current, F_SEL Input Low Current, F_SEL Input Capacitance, F_SEL Pin Capacitance, XIN & XOUT F_SEL = VDD F_SEL = VSS – –50 – – CINX[3] AC Electrical Characteristics[3] Parameter FOUT TR, TF TJitter(φ) TDC TLOCK Description Output Frequency Output Rise or Fall Time RMS Phase Jitter (Random) Output Duty Cycle Startup Time 20% to 80% of full output swing 125 MHz, (1.875–20 MHz) Measured at zero crossing point Time for CLK to reach valid frequency measured from the time VDD = VDD(min.) Time for CLK to reach valid frequency from F_SEL pin change Conditions Min 62.5 – – 48 – Typ – 0.5 0.4 50 – Max 125 1.0 – 52 5 Unit MHz ns ps % ms TLFS Re-lock Time – – 1 ms Recommended Crystal Specifications[4] Parameter Mode F ESR C0 Mode of Oscillation Frequency Equivalent Series Resistance Shunt Capacitance Description Min 25 – – Max 25 50 7 Unit MHz Ω pF Fundamental Notes 3. Not 100% tested, guaranteed by design and characterization. 4. Characterized using an 18 pF parallel resonant crystal. Document #: 001-10229 Rev. *F Page 3 of 10 [+] Feedback CY2XP22 Parameter Measurements Figure 2. 3.3 V Output Load AC Test Circuit 2V Z = 50Ω SCOPE CLK 50Ω Z = 50Ω CLK# 50Ω -1.3V +/- 0.165V VDD LVPECL VSS Figure 3. 2.5 V Output Load AC Test Circuit 2V Z = 50Ω SCOPE CLK 50Ω Z = 50Ω CLK# 50Ω -0.5V +/- 0.125V VDD LVPECL VSS Figure 4. Output DC Parameters CLK VOD CLK# VA VOCM = (V A + VB)/2 VB Figure 5. Output Rise and Fall Time CLK# 20% TR 80% 80% 20% TF CLK Document #: 001-10229 Rev. *F Page 4 of 10 [+] Feedback CY2XP22 Figure 6. RMS Phase Jitter Phase noise Noise Power Phase noise mask Offset Frequency f1 RMS Jitter = f2 Area Under the Masked Phase Noise Plot Figure 7. Output Duty Cycle CLK TDC = CLK# TPW TPERIOD TPW TPERIOD Document #: 001-10229 Rev. *F Page 5 of 10 [+] Feedback CY2XP22 Application Information Power Supply Filtering Techniques As in any high speed analog circuitry, noise at the power supply pins can degrade performance. To achieve optimum jitter performance, use good power supply isolation practices. Figure 8 illustrates a typical filtering scheme. Since all the current flows through pin 1, the resistance and inductance between this pin and the supply is minimized. A 0.01 or 0.1 µF ceramic chip capacitor is also located close to this pin to provide a short and low impedance AC path to ground. A 1 to 10 µF ceramic or tantalum capacitor is located in the general vicinity of this device and may be shared with other devices. Figure 8. Power Supply Filtering V DD (Pin 8) 3.3V 0.1μF 0.01 µF 10µF Figure 9. LVPECL Output Termination 3.3V 125Ω Z0 = 50Ω 125Ω CLK Z0 = 50Ω 84Ω 84Ω IN CLK# Crystal Interface The CY2XP22 is characterized with 18 pF parallel resonant crystals. The capacitor values shown in Figure 10 are determined using a 25 MHz 18 pF parallel resonant crystal and are chosen to minimize the ppm error. Note that the optimal values for C1 and C2 depend on the parasitic trace capacitance and are thus layout dependent. Figure 10. Crystal Input Interface VDD (Pin 1) Termination for LVPECL Output The CY2XP22 implements its LVPECL driver with a current steering design. For proper operation, it requires a 50 ohm dc termination on each of the two output signals. For 3.3 V operation, this data sheet specifies output levels for termination to VDD–2.0 V. This same termination voltage can also be used for VDD = 2.5 V operation, or it can be terminated to VDD-1.5 V. Note that it is also possible to terminate with 50 ohms to ground (VSS), but the high and low signal levels differ from the data sheet values. Termination resistors are best located close to the destination device. To avoid reflections, trace characteristic impedance (Z0) should match the termination impedance. Figure 9 shows a standard termination scheme. X1 18 pF Parallel Crystal C1 30 pF XIN Device XOUT C2 27 pF Document #: 001-10229 Rev. *F Page 6 of 10 [+] Feedback CY2XP22 Ordering Information Part Number CY2XP22ZXC CY2XP22ZXCT CY2XP22ZXI CY2XP22ZXIT Package Type 8-pin TSSOP 8-pin TSSOP - Tape and Reel 8-pin TSSOP 8-pin TSSOP - Tape and Reel Product Flow Commercial, 0°C to 70°C Commercial, 0°C to 70°C Industrial, -40°C to 85°C Industrial, -40°C to 85°C Ordering Code Definitions CY xx xxx Z X C/I T T = Tape and Reel Temperature Range: C = Commercial, I = Industrial Pb-free Package Type Part Identifier Family Company ID: CY = Cypress Package Drawing and Dimensions Figure 11. 8-Pin Thin Shrunk Small Outline Package (4.40 MM Body) Z8 51-85093 *C Document #: 001-10229 Rev. *F Page 7 of 10 [+] Feedback CY2XP22 Acronyms Table 2. Acronyms Used Acronym CLKOUT CMOS DPM EPROM LVDS LVPECL NTSC OE PAL PD PLL PPM TTL Clock output Complementary metal oxide semiconductor Die pick map Erasable programmable read only memory Low-voltage differential signaling Low voltage positive emitter coupled logic National television system committee Output enable Phase alternate line Power-down Phase locked loop Parts per million Transistor transistor logic Description Document Conventions Table 3. Units of Measure Symbol °C kHz kΩ MHz MΩ µA µs µV µVrms mA mm ms mV nA ns nV Ω kilohertz kilohms megahertz megaohms microamperes microseconds microvolts microvolts root-mean-square milliamperes millimeters milliseconds millivolts nanoamperes nanoseconds nanovolts ohms Unit of Measure degrees Celsius Document #: 001-10229 Rev. *F Page 8 of 10 [+] Feedback CY2XP22 Document History Page Document Title: CY2XP22 Crystal to LVPECL Clock Generator Document Number: 001-10229 Revision ** *A *B ECN 506262 838060 2700242 Orig. of Change RGL RGL KVM/PYRS Submission Date See ECN See ECN 04/30/2009 New Data Sheet Changed status from Advance to Preliminary Reformatted Revised phase noise values Replaced VCC with VDD; VEE with VSS; updated pin names Removed pull-up resistor on F_SEL Corrected temperature range, added industrial temperature range Increased IDD from 120 / 100 mA to 150 / 140 mA Added CINX parameter, revised CIN parameter Revised LVPECL output specs Added thermal resistance information Changed VIL, VIH, IIL & IIH specs Revised suggested crystal load capacitor values Minor ECN to post data sheet to external web Add IDD spec for unterminated outputs Change parameter name for IDD (terminated outputs) from IDD to IDDT Remove IDD footnote about externally dissipated current Add footnote reference to CIN and CINX:not 100% tested Add max limit for TR, TF: 1.0 ns Change TLOCK max from 10 ms to 5 ms Split out parameter TLFS from TLOCK Updated Package Diagram (Figure 11) Changed status from preliminary to final. Template and style updates as per current Cypress standards. Added ordering code definitions, acronyms, and units of measure. Updated package diagram to *C. Description of Change *C *D 2718898 2767298 WWZ KVM 06/15/09 09/22/09 *E *F 2896121 3219081 KVM 04/07/2011 03/19/2010 BASH Document #: 001-10229 Rev. *F Page 9 of 10 [+] Feedback CY2XP22 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products Automotive Clocks & Buffers Interface Lighting & Power Control Memory Optical & Image Sensing PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/plc cypress.com/go/memory cypress.com/go/image cypress.com/go/psoc cypress.com/go/touch cypress.com/go/USB cypress.com/go/wireless PSoC Solutions psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 5 © Cypress Semiconductor Corporation, 2006-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document #: 001-10229 Rev. *F Revised April 11, 2011 Page 10 of 10 All products and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback