CY2XP22
Crystal to LVPECL Clock Generator
Crystal to LVPECL Clock Generator
Features
Functional Description
■
One LVPECL output pair
■
Selectable frequency multiplication: × 2.5 or × 5
■
External crystal frequency: 25.0 MHz
■
Output frequency: 62.5 MHz or 125 MHz
■
Low RMS phase jitter at 125 MHz, using 25 MHz crystal
(1.875 MHz to 20 MHz): 0.4 ps (typical)
■
Phase noise at 125 MHz (typical):
Offset
Noise Power
1 kHz
–117 dBc/Hz
10 kHz
–126 dBc/Hz
100 kHz
–131 dBc/Hz
1 MHz
–131 dBc/Hz
The CY2XP22 is a PLL (Phase Locked Loop) based high
performance clock generator that uses an external reference
crystal. It is specifically targeted at FibreChannel and Gigabit
Ethernet applications. It produces a selectable output frequency
that is 2.5 or 5 times the crystal frequency. With a 25 MHz crystal,
the user can select either a 62.5 MHz or 125 MHz output. It uses
Cypress’s low noise VCO technology to achieve less than 1 ps
typical RMS phase jitter. The CY2XP22 has a crystal oscillator
interface input and one LVPECL output pair.
For a complete list of related documentation, click here.
■
Pb-free 8-pin TSSOP package
■
Supply voltage: 3.3 V or 2.5 V
■
Commercial and Industrial temperature range
Logic Block Diagram
XIN
External
Crystal
CRYSTAL
OSCILLATOR
LOW -NOISE
PLL
OUTPUT
DIVIDER
CLK
CLK#
XOUT
F _SEL
Cypress Semiconductor Corporation
Document Number: 001-10229 Rev. *I
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised April 12, 2018
CY2XP22
Contents
Pinouts .............................................................................. 3
Pin Definitions .................................................................. 3
Frequency Table ............................................................... 3
Application Information ................................................... 4
Power Supply Filtering Techniques ............................. 4
Termination for LVPECL Output .................................. 4
Crystal Interface .......................................................... 4
Absolute Maximum Conditions ....................................... 5
Operating Conditions ....................................................... 5
DC Electrical Characteristics .......................................... 6
AC Electrical Characteristics .......................................... 7
Recommended Crystal Specifications ........................... 7
Parameter Measurements ................................................ 8
Document Number: 001-10229 Rev. *I
Ordering Information ...................................................... 10
Ordering Code Definitions ......................................... 10
Package Diagram ............................................................ 11
Acronyms ........................................................................ 12
Document Conventions ................................................. 12
Units of Measure ....................................................... 12
Document History Page ................................................. 13
Sales, Solutions, and Legal Information ...................... 15
Worldwide Sales and Design Support ....................... 15
Products .................................................................... 15
PSoC® Solutions ...................................................... 15
Cypress Developer Community ................................. 15
Technical Support ..................................................... 15
Page 2 of 15
CY2XP22
Pinouts
Figure 1. 8-pin TSSOP pinout
VDD
VSS
XOUT
XIN
1
2
3
4
8
7
6
5
VDD
CLK
CLK#
F_SEL
Pin Definitions
8-pin TSSOP
Pin Number
Pin Name
I/O Type
Description
1, 8
VDD
Power
3.3 V or 2.5 V power supply
2
VSS
Power
Ground
3, 4
XOUT, XIN
5
F_SEL
CMOS input
6, 7
CLK#, CLK
LVPECL output
XTAL output and input Parallel resonant crystal interface
Frequency Select: see Frequency Table
Differential clock output
Frequency Table
Inputs
PLL Multiplier Value
Output Frequency (MHz)
0
5
125
1
2.5
62.5
Crystal Frequency (MHz)
F_SEL
25
Document Number: 001-10229 Rev. *I
Page 3 of 15
CY2XP22
Application Information
Figure 3. LVPECL Output Termination
3.3V
Power Supply Filtering Techniques
As in any high speed analog circuitry, noise at the power supply
pins can degrade performance. To achieve optimum jitter
performance, use good power supply isolation practices.
Figure 2 illustrates a typical filtering scheme. Since all the current
flows through pin 1, the resistance and inductance between this
pin and the supply is minimized. A 0.01 or 0.1 µF ceramic chip
capacitor is also located close to this pin to provide a short and
low impedance AC path to ground. A 1 to 10 µF ceramic or
tantalum capacitor is located in the general vicinity of this device
and may be shared with other devices.
Figure 2. Power Supply Filtering
3.3V
F
0.01 µF
125
CLK
CLK#
IN
Z0 = 50
84
84
Crystal Interface
V DD
(Pin 8)
VDD
(Pin 1)
125
Z0 = 50
10µF
The CY2XP22 is characterized with 18 pF parallel resonant
crystals. The capacitor values shown in Figure 4 are determined
using a 25 MHz 18 pF parallel resonant crystal and are chosen
to minimize the ppm error. Note that the optimal values for C1
and C2 depend on the parasitic trace capacitance and are thus
layout dependent.
Figure 4. Crystal Input Interface
XIN
Termination for LVPECL Output
The CY2XP22 implements its LVPECL driver with a current
steering design. For proper operation, it requires a 50 ohm dc
termination on each of the two output signals. For 3.3 V
operation, this data sheet specifies output levels for termination
to VDD – 2.0 V. This same termination voltage can also be used
for VDD = 2.5 V operation, or it can be terminated to VDD – 1.5 V.
Note that it is also possible to terminate with 50 ohms to ground
(VSS), but the high and low signal levels differ from the data sheet
values. Termination resistors are best located close to the
destination device. To avoid reflections, trace characteristic
impedance (Z0) should match the termination impedance.
Figure 3 shows a standard termination scheme.
Document Number: 001-10229 Rev. *I
X1
18 pF Parallel
Crystal
C1
30 pF
Device
XOUT
C2
27 pF
Page 4 of 15
CY2XP22
Absolute Maximum Conditions
Parameter
Description
Min
Max
Unit
–0.5
4.4
V
Relative to VSS
–0.5
VDD + 0.5
V
Non operating
–65
150
C
–
135
C
ESD Protection, Human Body
Model
JEDEC STD 22-A114-B
2000
–
V
UL–94
Flammability Rating
At 1/8 in.
JA[2]
Thermal Resistance, Junction to 0 m/s airflow
Ambient
1 m/s airflow
VDD
Supply Voltage
VIN[1]
Input Voltage, DC
TS
Temperature, Storage
TJ
Temperature, Junction
ESDHBM
Conditions
V–0
C/W
100
91
2.5 m/s airflow
87
Operating Conditions
Parameter
VDD
TA
TPU
Description
Min
Max
Unit
3.3 V Supply Voltage
3.135
3.465
V
2.5 V Supply Voltage
2.375
2.625
V
0
70
C
Ambient Temperature, Industrial
–40
85
C
Power up time for all VDD to reach minimum specified voltage (ensure power ramps
is monotonic)
0.05
500
ms
Ambient Temperature, Commercial
Notes
1. The voltage on any input or IO pin cannot exceed the power pin during power up.
2. Simulated using Apache Sentinel TI software. The board is derived from the JEDEC multilayer standard. It measures 76 x 114 x 1.6 mm and has 4-layers of copper
(2/1/1/2 oz.). The internal layers are 100% copper planes, while the top and bottom layers have 50% metalization. No vias are included in the model.
Document Number: 001-10229 Rev. *I
Page 5 of 15
CY2XP22
DC Electrical Characteristics
Parameter
IDD
IDDT
Description
Operating Supply Current with
output unterminated
Operating Supply Current with
output terminated
Test Conditions
Min
Typ
Max
Unit
VDD = 3.465 V, FOUT = 125 MHz,
output unterminated
–
–
125
mA
VDD = 2.625 V, FOUT = 125 MHz,
output unterminated
–
–
120
mA
VDD = 3.465 V, FOUT = 125 MHz,
output terminated
–
–
150
mA
VDD = 2.625 V, FOUT = 125 MHz,
output terminated
–
–
145
mA
VOH
LVPECL Output High Voltage
VDD = 3.3 V or 2.5 V,
RTERM = 50 to VDD – 2.0 V
VDD – 1.15
–
VDD – 0.75
V
VOL
LVPECL Output Low Voltage
VDD = 3.3 V or 2.5 V,
RTERM = 50 to VDD – 2.0 V
VDD – 2.0
–
VDD – 1.625
V
VOD1
LVPECL Peak-to-Peak Output
Voltage Swing
VDD = 3.3 V or 2.5 V,
RTERM = 50 to VDD – 2.0 V
600
–
1000
mV
VOD2
LVPECL Output Voltage Swing
(VOH – VOL)
VDD = 2.5 V,
RTERM = 50 to VDD – 1.5 V
500
–
1000
mV
VOCM
1.2
–
–
V
VIH
LVPECL Output Common Mode VDD = 2.5 V,
Voltage (VOH + VOL)/2
RTERM = 50 to VDD – 1.5 V
Input High Voltage, F_SEL
0.7 × VDD
–
VDD + 0.3
V
VIL
Input Low Voltage, F_SEL
–0.3
–
0.3 × VDD
V
IIH
Input High Current, F_SEL
F_SEL = VDD
–
–
115
µA
IIL
Input Low Current, F_SEL
F_SEL = VSS
–50
–
–
µA
CIN[3]
Input Capacitance, F_SEL
–
15
–
pF
CINX[3]
Pin Capacitance, XIN & XOUT
–
4.5
–
pF
Note
3. Not 100% tested, guaranteed by design and characterization.
Document Number: 001-10229 Rev. *I
Page 6 of 15
CY2XP22
AC Electrical Characteristics
Parameter [4]
Description
Min
Typ
Max
Unit
62.5
–
125
MHz
20% to 80% of full output swing
–
0.5
1.0
ns
RMS Phase Jitter (Random)
125 MHz, (1.875–20 MHz)
–
0.4
–
ps
TDC
Output Duty Cycle
Measured at zero crossing point
48
50
52
%
TLOCK
Startup Time
Time for CLK to reach valid
frequency measured from the time
VDD = VDD(min.)
–
–
5
ms
TLFS
Re-lock Time
Time for CLK to reach valid
frequency from F_SEL pin change
–
–
1
ms
Min
Max
Unit
FOUT
Output Frequency
TR, TF
Output Rise or Fall Time
TJitter()
Conditions
Recommended Crystal Specifications
Parameter [5]
Mode
Description
Mode of Oscillation
Fundamental
F
Frequency
25
25
MHz
ESR
Equivalent Series Resistance
–
50
C0
Shunt Capacitance
–
7
pF
Notes
4. Not 100% tested, guaranteed by design and characterization.
5. Characterized using an 18 pF parallel resonant crystal.
Document Number: 001-10229 Rev. *I
Page 7 of 15
CY2XP22
Parameter Measurements
Figure 5. 3.3 V Output Load AC Test Circuit
2V
Z = 50
VDD
SCOPE
CLK
50
LVPECL
Z = 50
VSS
CLK#
50
-1.3V +/- 0.165V
Figure 6. 2.5 V Output Load AC Test Circuit
2V
VDD
SCOPE
Z = 50
CLK
Z = 50
CLK#
50
LVPECL
VSS
50
-0.5V +/- 0.125V
Figure 7. Output DC Parameters
VA
CLK
VOD
VOCM = (V A + VB)/2
CLK#
VB
Figure 8. Output Rise and Fall Time
CLK#
CLK
80%
20%
20%
TR
Document Number: 001-10229 Rev. *I
80%
TF
Page 8 of 15
CY2XP22
Parameter Measurements (continued)
Figure 9. RMS Phase Jitter
Phase noise
Noise
Power
Phase noise mask
Offset Frequency
f2
f1
RMS Jitter =
Area Under the Masked Phase Noise Plot
Figure 10. Output Duty Cycle
CLK
TDC =
CLK#
TPW
TPERIOD
TPW
TPERIOD
Document Number: 001-10229 Rev. *I
Page 9 of 15
CY2XP22
Ordering Information
Part Number
Package Type
Product Flow
CY2XP22ZXI
8-pin TSSOP
Industrial, –40 C to 85 C
CY2XP22ZXIT
8-pin TSSOP – Tape and Reel
Industrial, –40 C to 85 C
Ordering Code Definitions
CY 2X P22 Z
X
I
X
X = blank or T
blank = Tube; T = Tape and Reel
Temperature Range: I = Industrial
Pb-free
Package Type: Z = 8-pin TSSOP
Part Identifier
Family
Company ID: CY = Cypress
Document Number: 001-10229 Rev. *I
Page 10 of 15
CY2XP22
Package Diagram
Figure 11. 8-pin TSSOP (4.40 mm Body) Package Outline, 51-85093
51-85093 *E
Document Number: 001-10229 Rev. *I
Page 11 of 15
CY2XP22
Acronyms
Acronym
Document Conventions
Description
Units of Measure
CLKOUT
Clock Output
CMOS
Complementary Metal Oxide Semiconductor
°C
degree Celsius
DPM
Die Pick Map
kHz
kilohertz
EPROM
Erasable Programmable Read Only Memory
k
kilohm
LVDS
Low-Voltage Differential Signaling
MHz
megahertz
LVPECL
Low-Voltage Positive Emitter Coupled Logic
M
megaohm
NTSC
National Television System Committee
µA
microampere
OE
Output Enable
PAL
Phase Alternate Line
PD
Power-Down
PLL
Phase Locked Loop
TTL
Transistor-Transistor Logic
Document Number: 001-10229 Rev. *I
Symbol
Unit of Measure
µs
microsecond
µV
microvolt
µVrms
microvolts root-mean-square
mA
milliampere
mm
millimeter
ms
millisecond
mV
millivolt
nA
nanoampere
ns
nanosecond
nV
nanovolt
ohm
ppm
parts per million
V
volt
Page 12 of 15
CY2XP22
Document History Page
Document Title: CY2XP22, Crystal to LVPECL Clock Generator
Document Number: 001-10229
Revision
ECN
Orig. of
Change
Submission
Date
**
506262
RGL
09/27/2006
Description of Change
New data sheet
*A
838060
RGL
03/12/2007
Changed status from Advance to Preliminary
*B
2700242
KVM /
PYRS
04/30/2009
Updated Features:
Updated details under “Phase Noise at 125 MHz”.
Updated Pinouts:
Replaced VCCA with VDD.
Replaced VEE with VSS.
Replaced VCC with VDD.
Updated Pin Definitions:
Replaced VCCA with VDD.
Replaced VCC with VDD.
Replaced VEE with VSS.
Updated details in “I/O Type” and “Description” columns for all pins.
Updated Frequency Table:
Added a column “PLL Multiplier Value” and added details in that column.
Updated Application Information:
Updated Power Supply Filtering Techniques:
Updated Figure 2.
Updated description.
Removed “Termination for 3.3V LVPECL Output”.
Added “Termination for LVPECL Output”.
Updated Crystal Interface:
Updated description.
Updated Absolute Maximum Conditions:
Replaced VCC with VDD.
Changed maximum value of TJ parameter from 125 °C to 135 °C.
Added JA parameter and its details.
Updated Operating Conditions:
Replaced VCC, VCCA with VDD.
Added Industrial Temperature Range corresponding to TA parameter.
Removed IEE, CIN, RUP parameters and their details.
Removed “Electrical Characteristics for F_SEL”.
Removed “DC Electrical Characteristics for LVPECL”.
Added DC Electrical Characteristics.
Updated AC Electrical Characteristics:
Removed Note “Refer to Figure 4 on page 4” and its reference.
Removed Note “Refer to Figure 2 on page 4” and its reference.
Removed Note “Refer to Figure 3 on page 4” and its reference.
Updated details in “Min”, “Typ” and “Max” columns corresponding to FOUT
parameter.
Changed typical value of TR, TF parameter from 550 ps to 500 ps.
Added details in “Test Conditions” column corresponding to tDC parameter.
Added TLOCK parameter and its details.
Updated Recommended Crystal Specifications:
Removed “Resonance Type” parameter and its details.
Document Number: 001-10229 Rev. *I
Page 13 of 15
CY2XP22
Document History Page (continued)
Document Title: CY2XP22, Crystal to LVPECL Clock Generator
Document Number: 001-10229
Revision
ECN
Orig. of
Change
Submission
Date
*B (cont.)
2700242
KVM /
PYRS
04/30/2009
Updated Parameter Measurements:
Removed figure “Output Load Test Circuit”.
Removed figure “Output Duty Cycle/Pulse Width/Period”.
Removed figure “Output Rise/Fall Time and Peak-PeakVoltage Swing”.
Added Figure 5.
Added Figure 6.
Added Figure 7.
Added Figure 8.
Added Figure 10.
Updated Ordering Information:
Updated part numbers.
Updated to new template.
*C
2718898
WWZ
06/15/2009
Minor Change:
Post to external web.
*D
2767298
KVM
09/22/2009
Updated DC Electrical Characteristics:
Replaced IDD with IDDT in “Parameter” column (for terminated outputs).
Add IDD parameter and its details (for unterminated outputs).
Removed Note “IDD includes approximately 24 mA of current that is dissipated
externally in the output termination resistors.” and its reference.
Added Note 3 and referred the same note in CIN and CINX parameters.
Updated AC Electrical Characteristics:
Added 1.0 ns under “Max” column corresponding to TR, TF parameter.
Updated details in “Test Conditions” column corresponding to TLOCK
parameter.
Changed maximum value of TLOCK parameter from 10 ms to 5 ms.
Added TLFS parameter and its details.
*E
2896121
KVM
03/19/2010
Updated Package Diagram:
spec 51-85093 – Changed revision from *A to *B.
*F
3219081
BASH
04/07/2011
Changed status from Preliminary to Final.
Updated Ordering Information:
No change in part numbers.
Added Ordering Code Definitions.
Updated Package Diagram:
spec 51-85093 – Changed revision from *B to *C.
Added Acronyms and Units of Measure.
Updated to new template.
Completing Sunset Review.
*G
4336622
XHT
05/02/2014
Updated Package Diagram:
spec 51-85093 – Changed revision from *C to *D.
Updated to new template.
Completing Sunset Review.
*H
4570097
XHT
11/14/2014
Updated Functional Description:
Added “For a complete list of related documentation, click here.” at the end.
Updated Ordering Information:
Updated part numbers.
Updated Package Diagram:
spec 51-85093 – Changed revision from *D to *E.
*I
6135134
XHT
04/12/2018
Updated to new template.
Completing Sunset Review.
Document Number: 001-10229 Rev. *I
Description of Change
Page 14 of 15
CY2XP22
Sales, Solutions, and Legal Information
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closest to you, visit us at Cypress Locations.
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© Cypress Semiconductor Corporation, 2006-2018. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation
of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. No computing
device can be absolutely secure. Therefore, despite security measures implemented in Cypress hardware or software products, Cypress does not assume any liability arising out of any security breach,
such as unauthorized access to or use of a Cypress product. In addition, the products described in these materials may contain design defects or errors known as errata which may cause the product
to deviate from published specifications. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any
liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming
code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this
information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons
systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances
management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device
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shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from
and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 001-10229 Rev. *I
Revised April 12, 2018
Page 15 of 15