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CY74FCT2646ATQCT-CY

CY74FCT2646ATQCT-CY

  • 厂商:

    CYPRESS(赛普拉斯)

  • 封装:

    SSOP24

  • 描述:

    REGISTERED BUS TRANSCEIVER, FCT

  • 数据手册
  • 价格&库存
CY74FCT2646ATQCT-CY 数据手册
CY74FCT2646T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS043C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 D D D D D D D D D D D Q PACKAGE (TOP VIEW) Function and Pinout Compatible With FCT and F Logic Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions 25-Ω Output Series Resistors to Reduce Transmission-Line Reflection Noise Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation Matched Rise and Fall Times ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) Fully Compatible With TTL Input and Output Logic Levels 12-mA Output Sink Current 15-mA Output Source Current Independent Register for A and B Buses 3-State Outputs CPAB SAB DIR A1 A2 A3 A4 A5 A6 A7 A8 GND 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC CPBA SBA G B1 B2 B3 B4 B5 B6 B7 B8 description The CY74FCT2646T consists of a bus transceiver circuit with 3-state, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus is clocked into the registers as the appropriate clock pin goes to a high logic level. Output-enable (G) and direction-control (DIR) inputs determine the transceiver function. On-chip termination resistors at the outputs reduce system noise caused by reflections, so that the CY74FCT2646T can replace the CY74FCT646T in an existing design. In the transceiver mode, data present at the high-impedance port can be stored in either the A or B register, or in both. Select controls (SAB, SBA) can multiplex stored and real-time (transparent mode) data. DIR determines which bus receives data when G is active low. In the isolation mode (G is high), A data can be stored in the B register and/or B data can be stored in the A register. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. PIN DESCRIPTION DESCRIPTION NAME A Data register A inputs, data register B outputs B Data register B inputs, data register A outputs CPAB, CPBA SAB, SBA DIR, G Clock pulse inputs Output data source select inputs Output-enable inputs Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CY74FCT2646T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS043C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 ORDERING INFORMATION SPEED (ns) PACKAGE† TA –40°C 40°C to 85°C QSOP – Q Tape and reel ORDERABLE PART NUMBER 5.4 CY74FCT2646CTQCT TOP-SIDE MARKING FCT2646C QSOP – Q Tape and reel 6.3 CY74FCT2646ATQCT FCT2646A † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE DATA I/O‡ INPUTS OPERATION OR FUNCTION G DIR CPAB CPBA SAB SBA A1–A8 B1–B8 H X H or L H or L X X Input Input H X ↑ ↑ X X Input Input Store A and B data L L X X X L Output Input Real-time B data to A bus L L X H or L X H Output Input Stored B data to A bus L H X X L X Input Output Real-time A data to B bus L H H or L X H X Input Output Stored A data to B bus Isolation H = High logic level, L = Low logic level, X = Don’t care, ↑ = Low-to-high clock transition ‡ The data output functions can be enabled or disabled by various signals at the G or DIR inputs. Data input functions always are enabled, i.e., data at the bus pins is stored on every low-to-high transition of the clock inputs. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY74FCT2646T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS 3 DIR L 21 G L 1 CPAB X 23 CPBA X 2 SAB X BUS B BUS A BUS A BUS B SCCS043C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 22 SBA X 3 DIR H 21 G L 21 1 G L L H CPAB ↑ X ↑ 23 CPBA X ↑ ↑ 2 SAB L 22 SBA X BUS B BUS A BUS A 3 DIR H L X 23 CPBA X REAL-TIME TRANSFER BUS A TO BUS B BUS B REAL-TIME TRANSFER BUS B TO BUS A 1 CPAB X 2 22 3 21 1 23 2 22 SAB SBA CPBA SAB SBA X X X G L L CPAB X X X DIR† L H X H or L H or L X X H H H STORAGE FROM A AND/OR B TRANSFER STORED DATA TO A AND/OR B † Cannot transfer data to A bus and B bus simultaneously. Figure 1. Bus-Management Functions POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CY74FCT2646T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS043C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 logic diagram G DIR CPBA SBA CPAB SAB 21 3 23 22 1 2 D C A1 4 20 B1 D C To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, θJA (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY74FCT2646T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS043C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 recommended operating conditions (see Note 2) MIN NOM MAX UNIT 4.75 5 5.25 V VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 V High-level output current –15 mA IOL TA Low-level output current 12 mA 85 °C High-level input voltage 2 Operating free-air temperature –40 V NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CY74FCT2646T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS043C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK VOH VCC = 4.75, VCC = 4.75, IIN = –18 mA IOH = –15 mA VOL Rout VCC = 4.75, VCC = 4.75, IOL = 12 mA IOL = 12 mA Vhys All inputs MIN 2.4 20 TYP† MAX UNIT –0.7 –1.2 V 3.3 V 0.3 0.55 V 25 40 Ω 0.2 V 25 V VCC = 5 5.25 VIN = VCC VIN = 2.7 V ±1 IIL IOZH IOZL IOS‡ VCC = 5.25 V, VCC = 5.25 V, VIN = 0.5 V VOUT = 2.7 V ±1 µA 10 µA VCC = 5.25 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0 V Ioff ICC VCC = 0 V, VCC = 5.25 V, IIH ∆ICC ICCD¶ IC# 5 –10 µA –225 mA ±1 µA 0.1 0.2 mA 0.5 2 mA 0.06 0.12 mA/ MHz 0.7 1.4 VIN = 3.4 V or GND VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 1.2 3.4 2.8 5.6|| VIN = 3.4 V or GND 5.1 14.6|| 6 10 –60 VOUT = 4.5 V VIN ≤ 0.2 V, VIN ≥ VCC – 0.2 V VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open VCC = 5.25 V, One input switching at 50% duty cycle, Outputs open, G = DIR = GND, GAB = GBA = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 25 V VCC = 5 5.25 V, Outputs open,, G = DIR = GND, GAB = GBA = GND One input switching at f1 = 5 MHz at 50% duty cycle Eight bits switching at f1 = 5 MHz at 50% duty cycle µA VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V Ci –120 mA pF Co 8 12 pF † Typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. § Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND ¶ This parameter is derived for use in total power-supply calculations. # IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY74FCT2646T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS043C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2) CY74FCT2646AT MIN tw tsu Pulse duration, high or low Setup time, high or low Data before CPBA↑ or CPAB↑ th Hold time, high or low Data after CPBA↑ or CPAB↑ MAX CY74FCT2646CT MIN MAX UNIT 5 5 ns 2 2 ns 1.5 1.5 ns switching characteristics over operating free-air temperature range (see Figure 2) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL G A or B tPZH tPZL DIR A or B tPHZ tPLZ G A or B tPHZ tPLZ DIR A or B tPLH tPHL CPAB or CPBA B or A tPLH tPHL SAB or SBA B or A POST OFFICE BOX 655303 CY74FCT2646AT • DALLAS, TEXAS 75265 CY74FCT2646CT MIN MAX MIN MAX 1.5 6.3 1.5 5.4 1.5 6.3 1.5 5.4 1.5 9.8 1.5 7.8 1.5 9.8 1.5 7.8 1.5 9.8 1.5 7.8 1.5 9.8 1.5 7.8 1.5 6.3 1.5 6.3 1.5 6.3 1.5 6.3 1.5 6.3 1.5 6.3 1.5 6.3 1.5 6.3 1.5 6.3 1.5 5.7 1.5 6.3 1.5 5.7 1.5 7.7 1.5 6.2 1.5 7.7 1.5 6.2 UNIT ns ns ns ns ns ns ns 7 CY74FCT2646T 8-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCCS043C – SEPTEMBER 1994 – REVISED NOVEMBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST GND CL = 50 pF (see Note A) 500 Ω S1 500 Ω S1 Open 7V Open tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 Ω LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 2. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74FCT2646ATQCTE4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT2646ATQCT ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74FCT2646ATQCTG4 ACTIVE SSOP/ QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device CY74FCT2646ATQCT Package Package Pins Type Drawing SSOP/ QSOP DBQ 24 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CY74FCT2646ATQCT SSOP/QSOP DBQ 24 2500 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. 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