CY7C0832BV

CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV FLEx18™ 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM Features ■ ■ ■ ■ ■ ■ ■ Functional Description The FLEx18™ family includes 512 Kbit, 1 Mbit, 2 Mbit, 4 Mbit, and 9 Mbit pipelined, synchronous, true dual port static RAMs that are high speed, low power 3.3V CMOS. Two ports are provided, permitting independent, simultaneous access to any location in memory. The result of writing to the same location by more than one port at the same time is undefined. Registers on control, address, and data lines allow for minimal setup and hold time. During a Read operation, data is registered for decreased cycle time. Each port contains a burst counter on the input address register. After externally loading the counter with the initial address, the counter increments the address internally (more details to follow). The internal Write pulse width is independent of the duration of the R/W input signal. The internal Write pulse is self-timed to allow the shortest possible cycle times. A HIGH on CE0 or LOW on CE1 for one clock cycle powers down the internal circuitry to reduce the static power consumption. One cycle with chip enables asserted is required to reactivate the outputs. Additional features include: readback of burst-counter internal address value on address lines, counter-mask registers to control the counter wrap around, counter interrupt (CNTINT) flags, readback of mask register value on address lines, retransmit functionality, interrupt flags for message passing, JTAG for boundary scan, and asynchronous Master Reset (MRST). The CY7C0833AV device in this family has limited features. See Address Counter and Mask Register Operations [16] on page 6 for details. True Dual-Ported Memory Cells that Allow Simultaneous Access of the Same Memory Location Synchronous Pipelined Operation Family of 512 Kbit, 1 Mbit, 2 Mbit, 4 Mbit, and 9 Mbit Devices Pipelined Output Mode Allows Fast Operation 0.18 micron CMOS for Optimum Speed and Power High Speed Clock to Data Access 3.3V Low Power ❐ Active as Low as 225 mA (typ) ❐ Standby as Low as 55 mA (typ) Mailbox Function for Message Passing Global Master Reset Separate Byte Enables on Both Ports Commercial and Industrial Temperature Ranges IEEE 1149.1 Compatible JTAG Boundary Scan 144-Ball FBGA (13 mm × 13 mm) (1.0 mm pitch) 120 TQFP (14 mm x 14 mm x 1.4 mm) Pb-Free Packages Available Counter Wrap Around Control ❐ Internal Mask Register Controls Counter Wrap Around ❐ Counter-Interrupt Flags to Indicate Wrap Around ❐ Memory Block Retransmit Operation Counter Readback on Address Lines Mask Register Readback on Address Lines Dual Chip Enables on Both Ports for Easy Depth Expansion ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Table 1. Product Selection Guide Density Part Number Maximum Speed (MHz) Maximum Access Time Clock to Data (ns) Typical Operating Current (mA) Package 512 Kbit (32K x 18) CY7C0837AV 167 4.0 225 144 FBGA 1 Mbit (64K x 18) CY7C0830AV 167 4.0 225 120 TQFP 144 FBGA 2 Mbit (128K x 18) CY7C0831AV 167 4.0 225 120 TQFP 144 FBGA 167 4.0 225 120 TQFP 144 FBGA 4 Mbit (256K x 18) CY7C0832AV CY7C0832BV [1] 133 4.4 225 120 TQFP 9 Mbit (512K x 18) CY7C0833AV 133 4.7 270 144 FBGA Note 1. CY7C0832AV and CY7C0832BV are functionally identical. Cypress Semiconductor Corporation Document #: 38-06059 Rev. *S • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised March 03, 2009 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Logic Block Diagram [2] OEL R/WL B0L B1L OER R/WR B0R B1R CE0L CE1L CE0R CE1R DQ9L–DQ17L DQ0L–DQ8L 9 9 I/O Control I/O Control 9 9 DQ9R–DQ17R DQ0R–DQ8R Addr. Read Back True Dual-Ported RAM Array Addr. Read Back A0L–A18L CNT/MSKL ADSL CNTENL CNTRSTL CLKL CNTINTL 19 19 Mask Register Counter/ Address Register Mirror Reg TMS TDI TCK Mask Register Counter/ Address Register Mirror Reg A0R–A18R CNT/MSKR ADS CNTEN CNTRSTR CLKR CNTINTR Address Decode Address Decode Interrupt INTL MRST Logic Reset Logic JTAG TDO Interrupt Logic INTR Note 2. CY7C0837AV has 15 address bits, CY7C0830AV has 16 address bits, CY7C0831AV has 17 address bits, CY7C0832AV/CY7C0832BV has 18 address bits and CY7C0833AV has 19 address bits. Document #: 38-06059 Rev. *S Page 2 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Pin Configurations Figure 1. 144-Ball BGA (Top View) CY7C0837AV / CY7C0830AV / CY7C0831AV / CY7C0832AV / CY7C0833AV 1 2 3 4 5 6 7 8 9 10 11 12 A DQ17L DQ16L DQ14L DQ12L DQ10L DQ9L DQ9R DQ10R DQ12R DQ14R DQ16R DQ17R B A0L A1L DQ15L DQ13L DQ11L MRST NC DQ11R DQ13R DQ15R A1R A0R C A2L A3L CE1L [7] INTL CNTINTL [9] ADSL [8] ADSR [8] CNTINTR [9] INTR CE1R [7] A3R A2R D A4L A5L CE0L [8] NC VDD VDD VDD VDD NC CE0R [8] A5R A4R E A6L A7L B1L NC VDD VSS VSS VDD NC B 1R A7R A6R F A8L A9L CL NC VSS VSS VSS VSS NC CR A9R A8R G A10L A11L B0L NC VSS VSS VSS VSS NC B 0R A11R A10R H A12L A13L OEL NC VDD VSS VSS VDD NC OER A13R A12R J A14L A15L [3] RWL NC VDD VDD VDD VDD NC RWR A15R [3] A14R K A16L [4] A17L [5] CNT/MSKL [7] TDO CNTRSTL [7] TCK TMS CNTRSTR [7] TDI CNT/MSKR [7] A17R [5] A16R [4] L A18L [6] NC DQ6L DQ4L DQ2L CNTENL [8] CNTENR [8] DQ2R DQ4R DQ6R NC A18R [6] M DQ8L DQ7L DQ5L DQ3L DQ1L DQ0L DQ0R DQ1R DQ3R DQ5R DQ7R DQ8R Notes 3. Leave this ball unconnected for CY7C0837AV. 4. Leave this ball unconnected for CY7C0837AV and CY7C0830AV. 5. Leave this ball unconnected for CY7C0837AV, CY7C0830AV and CY7C0831AV. 6. Leave this ball unconnected for CY7C0837AV, CY7C0830AV, CY7C0831AV, and CY7C0832AV. 7. These balls are not applicable for CY7C0833AV device. They must be tied to VDD. 8. These balls are not applicable for CY7C0833AV device. They must be tied to VSS. 9. These balls are not applicable for CY7C0833AV device. They must not be connected. Document #: 38-06059 Rev. *S Page 3 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Pin Configurations Figure 2. 120-Pin Thin Quad Flat Pack (TQFP) (Top View) CY7C0830AV / CY7C0831AV / CY7C0832AV / CY7C0832BV DQ15L DQ14L DQ13L VDD VSS DQ12L DQ11L DQ10L DQ9L INTL CNTINTL CNTINTR A1L A0L DQ17L DQ16L DQ12R VSS VDD DQ13R DQ14R DQ15R DQ16R DQ17R A0R A1R 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 INTR DQ9R DQ10R DQ11R A2L A3L VSS VDD A4L A5L A6L A7L CE1L B0L B1L OEL CE0L VDD VSS R/WL CLKL VSS ADSL CNTENL CNTRSTL CNT/MSKL A8L A9L A10L A11L A12L VSS VDD A13L 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 A2R A3R VSS VDD A4R A5R A6R A7R CE1R B0R B1R OER CE0R VDD VSS R/WR CLKR MRST ADSR CNTENR CNTRSTR CNT/MSKR A8R A9R A10R A11R A12R VSS VDD A13R Notes 10. Leave this pin unconnected for CY7C0830AV. 11. Leave this pin unconnected for CY7C0830AV and CY7C0831AV. Document #: 38-06059 Rev. *S VDD DQ4R DQ5R DQ6R DQ7R DQ8R A17R[10] A16R[9] A15R A14R A14L A15L A16L[9] A17L[10] DQ8L DQ7L DQ6L DQ5L DQ4L VDD VSS DQ3L DQ2L DQ1L DQ0L DQ0R DQ1R DQ2R DQ3R VSS 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 Page 4 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Pin Definitions Left Port A0L–A18L[2] ADSL[8] Right Port A0R–A18R[2] ADSR[8] Address Inputs. Address Strobe Input. Used as an address qualifier. This signal should be asserted LOW for the part using the externally supplied address on the address pins and for loading this address into the burst address counter. Active LOW Chip Enable Input. Active HIGH Chip Enable Input. Clock Signal. Maximum clock input rate is fMAX. Counter Enable Input. Asserting this signal LOW increments the burst address counter of its respective port on each rising edge of CLK. The increment is disabled if ADS or CNTRST are asserted LOW. Counter Reset Input. Asserting this signal LOW resets to zero the unmasked portion of the burst address counter of its respective port. CNTRST is not disabled by asserting ADS or CNTEN. Address Counter Mask Register Enable Input. Asserting this signal LOW enables access to the mask register. When tied HIGH, the mask register is not accessible and the address counter operations are enabled based on the status of the counter control signals. Data Bus Input/Output. Output Enable Input. This asynchronous signal must be asserted LOW to enable the DQ data pins during Read operations. Mailbox Interrupt Flag Output. The mailbox permits communications between ports. The upper two memory locations are used for message passing. INTL is asserted LOW when the right port writes to the mailbox location of the left port, and vice versa. An interrupt to a port is deasserted HIGH when it reads the contents of its mailbox. Counter Interrupt Output. This pin is asserted LOW when the unmasked portion of the counter is incremented to all ‘1s.’ Read/Write Enable Input. Assert this pin LOW to write to, or HIGH to Read from the dual port memory array. Byte Select Inputs. Asserting these signals enables Read and Write operations to the corresponding bytes of the memory array. Master Reset Input. MRST is an asynchronous input signal and affects both ports. Asserting MRST LOW performs all of the reset functions as described in the text. A MRST operation is required at power up. JTAG Test Mode Select Input. It controls the advance of JTAG TAP state machine. State machine transitions occur on the rising edge of TCK. JTAG Test Data Input. Data on the TDI input is shifted serially into selected registers. JTAG Test Clock Input. JTAG Test Data Output. TDO transitions occur on the falling edge of TCK. TDO is normally three-stated except when captured data is shifted out of the JTAG TAP. Ground Inputs. Power Inputs. Description CE0L[8] CE1L[7] CLKL CNTENL[8] CE0R[8] CE1R CLKR CNTENR[8] [7] CNTRSTL[7] CNT/MSKL[7] CNTRSTR[7] CNT/MSKR[7] DQ0L–DQ17L OEL INTL DQ0R–DQ17R OER INTR CNTINTL[9] R/WL B0L–B1L CNTINTR[9] R/WR B0R–B1R MRST TMS TDI TCK TDO VSS VDD Byte Select Operation Control Pin B0 B1 Effect DQ0–8 Byte Control DQ9–17 Byte Control Document #: 38-06059 Rev. *S Page 5 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Master Reset The FLEx18 family devices undergo a complete reset by taking its MRST input LOW. The MRST input can switch asynchronously to the clocks. An MRST initializes the internal burst counters to zero, and the counter mask registers to all ones (completely unmasked). MRST also forces the Mailbox Interrupt (INT) flags and the Counter Interrupt (CNTINT) flags HIGH. MRST must be performed on the FLEx18 family devices after power up. The counter register contains the address used to access the RAM array. It is changed only by the Counter Load, Increment, Counter Reset, and by master reset (MRST) operations. The mask register value affects the Increment and Counter Reset operations by preventing the corresponding bits of the counter register from changing. It also affects the counter interrupt output (CNTINT). The mask register is changed only by the Mask Load and Mask Reset operations and by the MRST. The mask register defines the counting range of the counter register. It divides the counter register into two regions: zero or more ‘0s’ in the most significant bits define the masked region, one or more ‘1s’ in the least significant bits define the unmasked region. Bit 0 may also be ‘0,’ masking the least significant counter bit and causing the counter to increment by two instead of one. The mirror register is used to reload the counter register on increment operations (see Retransmit on page 8). It always contains the value last loaded into the counter register, and is changed only by the Counter Load, and by the MRST instructions. Table 3 on page 7 summarizes the operation of these registers and the required input control signals. The MRST control signal is asynchronous. All the other control signals in Table 3 on page 7 (CNT/MSK, CNTRST, ADS, CNTEN) are synchronized to the port’s CLK. All these counter and mask operations are independent of the port’s chip enable inputs (CE0 and CE1). Counter enable (CNTEN) inputs are provided to stall the operation of the address input and use the internal address generated by the internal counter for fast, interleaved memory applications. A port’s burst counter is loaded when the port’s address strobe (ADS) and CNTEN signals are LOW. When the port’s CNTEN is asserted and the ADS is deasserted, the address counter increments on each LOW to HIGH transition of that port’s clock signal. This reads and writes one word from and to each successive address location until CNTEN s deasserted. The counter can address the entire memory array, and loops back to the start. Counter reset (CNTRST) is used to reset the unmasked portion of the burst counter to I/0s. A counter-mask register is used to control the counter wrap. Mailbox Interrupts The upper two memory locations may be used for message passing and permit communications between ports. Table 2 shows the interrupt operation for both ports of CY7C0833AV. The highest memory location, 7FFFF is the mailbox for the right port and 7FFFE is the mailbox for the left port. Table 2 shows that to set the INTR flag, a Write operation by the left port to address 7FFFF asserts INTR LOW. At least one byte has to be active for a Write to generate an interrupt. A valid Read of the 7FFFF location by the right port resets INTR HIGH. At least one byte must be active for a Read to reset the interrupt. When one port Writes to the other port’s mailbox, the INT of the port that the mailbox belongs to is asserted LOW. The INT is reset when the owner (port) of the mailbox Reads the contents of the mailbox. The interrupt flag is set in a flow-through mode (that is, it follows the clock edge of the writing port). Also, the flag is reset in a flow-through mode (that is, it follows the clock edge of the reading port). Each port can read the other port’s mailbox without resetting the interrupt. And each port can write to its own mailbox without setting the interrupt. If an application does not require message passing, INT pins should be left open. Address Counter and Mask Register Operations [16] This section describes the features only apply to 512 Kbit,1 Mbit, 2 Mbit, and 4 Mbit devices. It does not apply to 9 Mbit device. Each port of these devices has a programmable burst address counter. The burst counter contains three registers: a counter register, a mask register, and a mirror register. Table 2. Interrupt Operation Example [2, 12, 13, 14, 15, 17] FUNCTION R/WL Set Right INTR Flag Reset Right INTR Flag Set Left INTL Flag Reset Left INTL Flag Set Right INTR Flag L X X H L LEFT PORT CEL L X X L L RIGHT PORT INTL X X L H X R/WR X H L X X CER X L L X X A0R–A18R X 3FFFF 3FFFE X X INTR L H X X L A0L–A18L 3FFFF X X 3FFFE 3FFFF Notes 12. CE is internal signal. CE = LOW if CE0 = LOW and CE1 = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge. 13. OE is “Don’t Care” for mailbox operation. 14. At least one of BE0, BE1 must be LOW. 15. A18x is a NC for CY7C0832AV/CY7C0832BV, therefore the Interrupt Addresses are 3FFFF and 3FFFE. A18x and A17x are NC for CY7C0831AV, therefore the Interrupt addresses are 1FFFF and 1FFFE; A18x, A17x and A16x are NC for CY7C0830AV, therefore the Interrupt Addresses are FFFF and FFFE;A18x, A17x, A16x and A15x are NC for CY7C0837AV, therefore the Interrupt Addresses are 7FFF and 7FFE. 16. This section describes the CY7C0832AV/CY7C0832BV, CY7C0831AV, CY7C0830AV and CY7C0837AV having 18, 17, 16 and 15 address bits. 17. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. Document #: 38-06059 Rev. *S Page 6 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Counter Reset Operation All unmasked bits of the counter are reset to ‘0.’ All masked bits remain unchanged. The mirror register is loaded with the value of the burst counter. A Mask Reset followed by a Counter Reset resets the counter and mirror registers to 00000, as does master reset (MRST). address counter is then loaded with an initial value of 8h. The base address bits (in this case, the 6th address through the 16th address) are loaded with an address value but do not increment after the counter is configured for increment operation. The counter address starts at address 8h. The counter increments its internal address value until it reaches the mask register value of 3Fh. The counter wraps around the memory block to location 8h at the next count. CNTINT is issued when the counter reaches its maximum value Counter Load Operation The address counter and mirror registers are both loaded with the address value presented at the address lines. Counter Hold Operation The value of all three registers can be constantly maintained unchanged for an unlimited number of clock cycles. Such operation is useful in applications where wait states are needed, or when address is available a few cycles ahead of data in a shared bus interface. Counter Increment Operation When the address counter register is initially loaded with an external address, the counter can internally increment the address value, potentially addressing the entire memory array. Only the unmasked bits of the counter register are incremented. The corresponding bit in the mask register must be a ‘1’ for a counter bit to change. The counter register is incremented by 1 if the least significant bit is unmasked, and by 2 if it is masked. If all unmasked bits are ‘1,’ the next increment wraps the counter back to the initially loaded value. If an Increment results in all the unmasked bits of the counter being ‘1s,’ a counter interrupt flag (CNTINT) is asserted. The next Increment returns the counter register to its initial value, which was stored in the mirror register. The counter address can instead be forced to loop to 00000 by externally connecting CNTINT to CNTRST.[19] An increment that results in one or more of the unmasked bits of the counter being ‘0’ deasserts the counter interrupt flag. The example in Figure 4 on page 10 shows the counter mask register loaded with a mask value of 0003Fh unmasking the first 6 bits with bit ‘0’ as the LSB and bit ‘16’ as the MSB. The maximum value the mask register can be loaded with is 3FFFFh. Setting the mask register to this value allows the counter to access the entire memory space. The Counter Interrupt The counter interrupt (CNTINT) is asserted LOW when an increment operation results in the unmasked portion of the counter register being all ‘1s.’ It is deasserted HIGH when an Increment operation results in any other value. It is also de-asserted by Counter Reset, Counter Load, Mask Reset and Mask Load operations, and by MRST. Counter Readback Operation The internal value of the counter register can be read out on the address lines. Readback is pipelined; the address is valid tCA2 after the next rising edge of the port’s clock. If address readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) are three-stated. Figure 3 on page 9 shows a block diagram of the operation. Table 3. Address Counter and Counter-Mask Register Control Operation (Any Port) [17, 18] CLK X MRST L H H H H H H H H H CNT/MSK X H H H H H L L L L CNTRST X L H H H H L H H H ADS X X L L H H X L L H CNTEN X X L H L H X L H X Operation Master Reset Counter Reset Counter Load Counter Readback Counter Increment Counter Hold Mask Reset Mask Load Mask Readback Reserved Description Reset address counter to all 0s and mask register to all 1s. Reset counter unmasked portion to all 0s. Load counter with external address value presented on address lines. Read out counter internal value on address lines. Internally increment address counter value. Constantly hold the address value for multiple clock cycles. Reset mask register to all 1s. Load mask register with value presented on the address lines. Read out mask register value on address lines. Operation undefined Notes 18. Counter operation and mask register operation is independent of chip enables. 19. CNTINT and CNTRST specs are guaranteed by design to operate properly at speed grade operating frequency when tied together. Document #: 38-06059 Rev. *S Page 7 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Retransmit Retransmit is a feature that allows the Read of a block of memory more than once without the need to reload the initial address. This eliminates the need for external logic to store and route data. It also reduces the complexity of the system design and saves board space. An internal mirror register is used to store the initially loaded address counter value. When the counter unmasked portion reaches its maximum value set by the mask register, it wraps back to the initial value stored in this mirror register. If the counter is continuously configured in increment mode, it increments again to its maximum value and wraps back to the value initially stored into the mirror register. Thus, the repeated access of the same data is allowed without the need for any external logic. Mask Readback Operation The internal value of the mask register can be read out on the address lines. Readback is pipelined; the address is valid tCM2 after the next rising edge of the port’s clock. If mask readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) is three-stated. Figure 3 on page 9 shows a block diagram of the operation. Counting by Two When the least significant bit of the mask register is ‘0,’ the counter increments by two. This may be used to connect the x18 devices as a 36-bit single port SRAM in which the counter of one port counts even addresses and the counter of the other port counts odd addresses. This even-odd address scheme stores one half of the 36-bit data in even memory locations, and the other half in odd memory locations. Mask Reset Operation The mask register is reset to all ‘1s,’ which unmasks every bit of the counter. Master reset (MRST) also resets the mask register to all ‘1s’. Mask Load Operation The mask register is loaded with the address value presented at the address lines. Not all values permit correct increment operations. Permitted values are of the form 2n – 1 or 2n – 2. From the most significant bit to the least significant bit, permitted values have zero or more ‘0s,’ one or more ‘1s,’ or one ‘0.’ Thus 3FFFF, 003FE, and 00001 are permitted values, but 3F0FF, 003FC, and 00000 are not. Document #: 38-06059 Rev. *S Page 8 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Figure 3. Counter, Mask, and Mirror Logic Block Diagram [1] CNT/MSK CNTEN ADS CNTRST MRST Decode Logic Bidirectional Address Lines Mask Register Counter/ Address Register Address Decode RAM Array CLK From Address Lines 17 Mirror Load/Increment Counter 1 1 0 0 To Readback and Address Decode From Mask Register 17 Increment Logic Wrap 17 From Mask From Counter 17 17 +1 1 +2 0 17 Bit 0 Wrap Detect Wrap 1 0 17 To Counter Document #: 38-06059 Rev. *S Page 9 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Figure 4. Programmable Counter-Mask Register Operation [2, 20] Example: Load Counter-Mask Register = 3F CNTINT H 00 216 215 0s 011 1 1 1 1 Mask Register bit-0 26 25 24 23 22 21 20 Unmasked Address Masked Address Load Address Counter = 8 H XX 216 215 Max Address Register L XX 216 215 Max + 1 Address Register H XX 216 215 Xs Xs Xs X00 1 0 0 0 Address Counter bit-0 1 26 25 24 23 22 21 20 X11 1 11 26 25 24 23 22 21 20 X0 0 1 00 0 26 25 24 23 22 21 20 IEEE 1149.1 Serial Boundary Scan (JTAG) [21] The FLEx18 family devices incorporate an IEEE 1149.1 serial boundary scan test access port (TAP). The TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1 compliant TAPs. The TAP operates using JEDEC-standard 3.3V I/O logic levels. It is composed of three input connections and one output connection required by the test logic defined by the standard. Boundary Scan Hierarchy for 9-Mbit Device Internally, the CY7C0833AV have two DIEs. Each DIE contain all the circuitry required to support boundary scan testing. The circuitry includes the TAP, TAP controller, instruction register, and data registers. The circuity and operation of the DIE boundary scan are described in detail below. The scan chain of each DIE are connected serially to form the scan chain of the CY7C0833AV as shown in Figure 5 on page 11. TMS and TCK are connected in parallel to each DIE to drive all TAP controllers in unison. In many cases, each DIE is supplied with the same instruction. In other cases, it might be useful to supply different instructions to each DIE. One example would be testing the device ID of one DIE while bypassing the others. Each pin of FLEx18 family is typically connected to multiple DIEs. For connectivity testing with the EXTEST instruction, it is desirable to check the internal connections between DIEs and the external connections to the package. This is accomplished by merging the netlist of the devices with the netlist of the user’s circuit board. To facilitate boundary scan testing of the devices, Cypress provides the BSDL file for each DIE, the internal netlist of the device, and a description of the device scan chain. The user can use these materials to easily integrate the devices into the board’s boundary scan environment. Further information is found in the Cypress application note Using JTAG Boundary Scan For System in a Package (SIP) Dual-Port SRAMs. Performing a TAP Reset A reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This reset does not affect the operation of the devices, and may be performed while the device is operating. An MRST must be performed on the devices after power up. Performing a Pause/Restart When a SHIFT-DR PAUSE-DR SHIFT-DR is performed the scan chain outputs the next bit in the chain twice. For example, if the value expected from the chain is 1010101, the device outputs a 11010101. This extra bit causes some testers to report an erroneous failure for the devices in a scan test. Therefore the tester should be configured to never enter the PAUSE-DR state. Notes 20. The “X” in this diagram represents the counter upper bits 21. Boundary scan is IEEE 1149.1-compatible. See Performing a Pause/Restart on page 10 for deviation from strict 1149.1 compliance Document #: 38-06059 Rev. *S Page 10 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Figure 5. Scan Chain for 9 Mb Device TDO TDO D2 TDI TDO D1 TDI TDI Table 4. Identification Register Definitions Instruction Field Revision Number (31:28) Cypress Device ID (27:12) 0h C090h C091h C093h C094h Cypress JEDEC ID (11:1) ID Register Presence (0) Table 5. Scan Registers Sizes Register Name Instruction Bypass Identification Boundary Scan Table 6. Instruction Identification Codes Instruction EXTEST BYPASS IDCODE HIGHZ CLAMP SAMPLE/PRELOAD NBSRST RESERVED 0000 1111 1011 0111 0100 1000 1100 All other codes Code Description Captures the Input/Output ring contents. Places the BSR between the TDI and TDO. Places the BYR between TDI and TDO. Loads the IDR with the vendor ID code and places the register between TDI and TDO. Places BYR between TDI and TDO. Forces all device output drivers to a High-Z state. Controls boundary to 1/0. Places BYR between TDI and TDO. Captures the input/output ring contents. Places BSR between TDI and TDO. Resets the non-boundary scan logic. Places BYR between TDI and TDO. Other combinations are reserved. Do not use other than the above. Bit Size 4 1 32 n[22] 034h 1 Value Reserved for version number. Defines Cypress part number for CY7C0832AV/CY7C0832BV Defines Cypress part number for CY7C0831AV Defines Cypress part number for CY7C0830AV Defines Cypress part number for CY7C0837AV. Allows unique identification of the DP family device vendor. Indicates the presence of an ID register. Description Note 22. See details in the device BSDL file. Document #: 38-06059 Rev. *S Page 11 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Maximum Ratings Exceeding maximum ratings[23] may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ................................. –65°C to +150°C Ambient Temperature with Power Applied ............................................ –55°C to +125°C Supply Voltage to Ground Potential................–0.5V to +4.6V DC Voltage Applied to Outputs in High-Z State ......................... –0.5V to VDD + 0.5V DC Input Voltage .............................. –0.5V to VDD + 0.5V[24] Output Current into Outputs (LOW)............................. 20 mA Static Discharge Voltage........................................... > 2000V (JEDEC JESD22-A114-2000B) Latch Up Current .................................................... > 200 mA Operating Range Range Commercial Industrial Ambient Temperature 0°C to +70°C –40°C to +85°C VDD 3.3V±165 mV 3.3V±165 mV Electrical Characteristics Over the Operating Range Parameter VOH VOL VIH VIL IOZ IIX1 IIX2 ICC Description Output HIGH Voltage (VDD = Min., IOH= –4.0 mA) Output LOW Voltage (VDD = Min., IOL= +4.0 mA) Input HIGH Voltage Input LOW Voltage Output Leakage Current Input Leakage Current Except TDI, TMS, MRST Input Leakage Current TDI, TMS, MRST Operating Current for CY7C0837AV (VDD = Max., IOUT = 0 mA), Outputs CY7C0830AV Disabled CY7C0831AV CY7C0832AV CY7C0832BV CY7C0833AV Standby Current (Both Ports TTL Level) CEL and CER ≥ VIH, f = fMAX Standby Current (One Port TTL Level) CEL | CER ≥ VIH, f = fMAX Standby Current (Both Ports CMOS Level) CEL and CER ≥ VDD – 0.2V, f = 0 Standby Current (One Port CMOS Level) CEL | CER ≥ VIH, f = fMAX Operating Current (VDD = Max, IOUT CY7C0833AV = 0 mA, f = 0) Outputs Disabled -167 -133 -100 Unit Min Typ Max Min Typ Max Min Typ Max 2.4 2.4 2.4 V 0.4 0.4 0.4 V 2.0 2.0 2.0 V 0.8 0.8 0.8 V –10 10 –10 10 –10 10 μA –10 10 –10 10 –10 10 μA –0.1 1.0 –0.1 1.0 –0.1 1.0 mA 225 300 225 300 mA ISB1[25] ISB2[25] ISB3[25] ISB4[25] ISB5 90 160 55 160 115 210 75 210 270 90 160 55 160 70 400 115 210 75 210 100 200 90 160 55 160 70 310 115 210 75 210 100 mA mA mA mA mA mA Capacitance Part Number [26] CY7C0837AV/CY7C0830AV/CY7C0831AV CY7C0832AV/CY7C0832BV Parameter Description Input Capacitance CIN COUT CY7C0833AV CIN COUT Output Capacitance Input Capacitance Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VDD = 3.3V Max 13 10 22 20 Unit pF pF pF pF Notes 23. The voltage on any input or I/O pin can not exceed the power pin during power up. 24. Pulse width < 20 ns. 25. ISB1, ISB2, ISB3 and ISB4 are not applicable for CY7C0833AV because it can not be powered down by using chip enable pins. 26. COUT also references CI/O. Document #: 38-06059 Rev. *S Page 12 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Figure 6. AC Test Load and Waveforms 3.3V Z0 = 50Ω OUTPUT C = 10 pF VTH = 1.5V OUTPUT C = 5 pF R2 = 435 Ω R = 50Ω R1 = 590 Ω (a) Normal Load (Load 1) 3.0V 90% ALL INPUT PULSES Vss < 2 ns 10% (b) Three-state Delay (Load 2) 90% 10% < 2 ns Switching Characteristics Over the Operating Range -167 CY7C0837AV CY7C0830AV CY7C0831AV CY7C0832AV Min fMAX2 tCYC2 tCH2 tCL2 tR[27] tF[27] tSA tHA tSB tHB tSC tHC tSW tHW tSD tHD tSAD tHAD tSCN tHCN tSRST tHRST tSCM Maximum Operating Frequency Clock Cycle Time Clock HIGH Time Clock LOW Time Clock Rise Time Clock Fall Time Address Setup Time Address Hold Time Byte Select Setup Time Byte Select Hold Time Chip Enable Setup Time Chip Enable Hold Time R/W Setup Time R/W Hold Time Input Data Setup Time Input Data Hold Time ADS Setup Time ADS Hold Time CNTEN Setup Time CNTEN Hold Time CNTRST Setup Time CNTRST Hold Time CNT/MSK Setup Time 6.0 2.7 2.7 2.0 2.0 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 Max 167 -133 CY7C0837AV CY7C0830AV CY7C0831AV CY7C0833AV CY7C0832AV CY7C0832BV Min Max Min Max 133 133 7.5 7.5 3.0 3.0 3.0 3.0 2.0 2.0 2.0 2.0 2.5 2.5 0.6 0.6 2.5 2.5 0.6 0.6 2.5 NA 0.6 NA 2.5 2.5 0.6 0.6 2.5 2.5 0.6 0.6 2.5 NA 0.6 NA 2.5 NA 0.6 NA 2.5 NA 0.6 NA 2.5 NA -100 Parameter Description CY7C0833AV Unit Min 10 4.0 4.0 Max 100 3.0 3.0 3.0 0.6 3.0 0.6 NA NA 3.0 0.6 3.0 0.6 NA NA NA NA NA NA NA MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Note 27. Except JTAG signals (tr and tf < 10 ns [max.]). Document #: 38-06059 Rev. *S Page 13 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Switching Characteristics Over the Operating Range -167 CY7C0837AV CY7C0830AV CY7C0831AV CY7C0832AV Min 0.6 0 0 Max 4.0 4.0 4.0 4.0 4.0 4.0 4.0 6.7 6.7 5.0 5.0 -133 CY7C0837AV CY7C0830AV CY7C0831AV CY7C0833AV CY7C0832AV CY7C0832BV Min Max Min Max 0.6 NA 4.4 4.7 0 0 4.4 4.7 4.4 4.7 4.4 NA 4.4 NA 1.0 1.0 0 4.4 4.7 1.0 4.4 1.0 4.7 0.5 7.5 0.5 7.5 0.5 7.5 0.5 7.5 0.5 5.7 NA NA 0.5 5.7 NA NA 6.0 7.5 6.0 7.5 10.0 10.0 10.0 10.0 6.0 7.5 6.0 7.5 10.0 NA -100 (continued) Parameter Description CY7C0833AV Unit tHCM CNT/MSK Hold Time Output Enable to Data Valid tOE OE to Low Z tOLZ[28,29] tOHZ[28,29] OE to High Z Clock to Data Valid tCD2 Clock to Counter Address Valid tCA2 tCM2 Clock to Mask Register Readback Valid tDC Data Output Hold After Clock HIGH tCKHZ[28,29] Clock HIGH to Output High Z tCKLZ[28, 29] Clock HIGH to Output Low Z tSINT Clock to INT Set Time tRINT Clock to INT Reset Time tSCINT Clock to CNTINT Set Time tRCINT Clock to CNTINT Reset time Port to Port Delays tCCS Clock to Clock Skew Master Reset Timing tRS Master Reset Pulse Width tRS Master Reset Setup Time Master Reset Recovery Time tRSR tRSF Master Reset to Outputs Inactive tRSCNTINT Master Reset to Counter Interrupt Flag Reset Time Min NA Max 5.0 5.0 5.0 NA NA ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 1.0 0 1.0 0.5 0.5 0.5 0.5 5.2 7.0 6.0 6.0 1.0 1.0 0.5 0.5 NA NA 8.0 10 8.5 10 10.0 NA 5.0 5.0 10 10 NA NA Notes 28. This parameter is guaranteed by design, but is not production tested. 29. Test conditions used are Load 2. Document #: 38-06059 Rev. *S Page 14 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV JTAG Timing and Switching Waveforms Parameter fJTAG tTCYC tTH tTL tTMSS tTMSH tTDIS tTDIH tTDOV tTDOX Description Maximum JTAG TAP Controller Frequency TCK Clock Cycle Time TCK Clock HIGH Time TCK Clock LOW Time TMS Setup to TCK Clock Rise TMS Hold After TCK Clock Rise TDI Setup to TCK Clock Rise TDI Hold After TCK Clock Rise TCK Clock LOW to TDO Valid TCK Clock LOW to TDO Invalid Figure 7. JTAG Switching Waveform tTH tTL 0 100 40 40 10 10 10 10 30 CY7C0837AV/CY7C0830AV CY7C0831AV/CY7C0832AV CY7C0832BV/CY7C0833AV Min Max 10 MHz ns ns ns ns ns ns ns ns ns Unit Test Clock TCK Test Mode Select TMS tTMSS tTCYC tTMSH tTDIS Test Data-In TDI Test Data-Out TDO tTDIH tTDOX tTDOV Document #: 38-06059 Rev. *S Page 15 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Switching Waveforms Figure 8. Master Reset MRST ALL ADDRESS/ DATA LINES ALL OTHER INPUTS TMS CNTINT INT TDO tRSF tRSS tRSR ACTIVE tRS INACTIVE Figure 9. Read Cycle[12, 30, 31, 32, 33] tCH2 CLK tCYC2 tCL2 CE tSC tSB BE0–BE1 tHC tHB tSC tHC R/W tSW tSA ADDRESS DATAOUT An 1 Latency tHW tHA An+1 tCD2 Qn tCKLZ OE tOE An+2 tDC Qn+1 tOHZ An+3 Qn+2 tOLZ Notes 30. OE is asynchronously controlled; all other inputs (excluding MRST and JTAG) are synchronous to the rising clock edge. 31. ADS = CNTEN = LOW, and MRST = CNTRST = CNT/MSK = HIGH. 32. The output is disabled (high-impedance state) by CE = VIH following the next rising edge of the clock. 33. Addresses need not be accessed sequentially because ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. Document #: 38-06059 Rev. *S Page 16 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Switching Waveforms (continued) Figure 10. Bank Select Read[34, 35] tCH2 CLK tSA ADDRESS(B1) tSC CE(B1) tCD2 DATAOUT(B1) tSA ADDRESS(B2) A0 tHA A1 tSC CE(B2) tSC DATAOUT(B2) tCKLZ tHC tCD2 Q2 tCKLZ tCKHZ tCD2 Q4 tSC Q0 tDC A2 tHC tHC tCD2 Q1 tDC A3 A4 tCKLZ A5 tCKHZ tCD2 Q3 tCKHZ A0 tHC tHA A1 A2 A3 A4 A5 tCYC2 tCL2 Figure 11. Read-to-Write-to-Read (OE = LOW)[33, 36, 37, 38, 39] tCH2 CLK tCYC2 tCL2 CE tSC tHC tSW R/W tSW ADDRESS tSA DATAIN An tHA tCD2 Qn tHW An+1 An+2 tHW An+2 tSD tHD An+3 An+4 tCKHZ Dn+2 tCD2 Qn+3 tCKLZ DATAOUT READ NO OPERATION WRITE READ Notes 34. In this depth-expansion example, B1 represents Bank #1 and B2 is Bank #2; each bank consists of one Cypress FLEx18 device from this data sheet. ADDRESS(B1) = ADDRESS(B2). 35. ADS = CNTEN= BE0 – BE1 = OE = LOW; MRST = CNTRST = CNT/MSK = HIGH. 36. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals. 37. During “No Operation,” data in memory at the selected address may be corrupted and should be rewritten to ensure data integrity. 38. CE0 = OE = BE0 – BE1 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 39. CE0 = BE0 – BE1 = R/W = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, because OE = LOW, the Write operation cannot be completed (labelled as no operation). One clock cycle is required to three-state the I/O for the Write operation on the next rising edge of CLK. Document #: 38-06059 Rev. *S Page 17 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Switching Waveforms (continued) Figure 12. Read-to-Write-to-Read (OE Controlled)[33, 36, 38, 39] tCH2 CLK tCYC2 tCL2 CE tSC tHC tSW tHW R/W tSW An tHW An+1 tHA An+2 tSD tHD Dn+2 tCD2 Dn+3 tCD2 Qn tOHZ Qn+4 An+3 An+4 An+5 ADDRESS tSA DATAIN DATAOUT OE READ WRITE READ Figure 13. Read with Address Counter Advance[38] tCH2 CLK tSA ADDRESS tSAD ADS tSAD CNTEN tSCN DATAOUT Qx–1 READ EXTERNAL ADDRESS tHCN Qx tDC READ WITH COUNTER tCD2 Qn tSCN Qn+1 COUNTER HOLD tHCN Qn+2 Qn+3 tHAD An tHAD tHA tCYC2 tCL2 READ WITH COUNTER Document #: 38-06059 Rev. *S Page 18 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Switching Waveforms (continued) Figure 14. Write with Address Counter Advance[39] tCH2 CLK tSA ADDRESS An tHA tCYC2 tCL2 INTERNAL ADDRESS tSAD ADS tHAD An An+1 An+2 An+3 An+4 CNTEN tSCN DATAIN tSD Dn tHD WRITE EXTERNAL ADDRESS tHCN Dn+1 WRITE WITH COUNTER Dn+1 Dn+2 Dn+3 Dn+4 WRITE COUNTER HOLD WRITE WITH COUNTER Figure 15. Counter tCYC2 tCH2 tCL2 CLK Reset[40, 41] tSA ADDRESS INTERNAL ADDRESS An tHA Am Ap Ax tSW tHW 0 1 An Am Ap R/W ADS CNTEN tSRST tHRST CNTRST tSD DATAIN tHD D0 tCD2 tCD2 Q0 Q1 Qn DATAOUT [42] tCKLZ READ ADDRESS 0 COUNTER RESET WRITE ADDRESS 0 READ ADDRESS 1 READ ADDRESS An READ ADDRESS Am Notes 40. CE0 = BE0 – BE1 = LOW; CE1 = MRST = CNT/MSK = HIGH. 41. No dead cycle exists during counter reset. A Read or Write cycle may be coincidental with the counter reset. 42. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value. Document #: 38-06059 Rev. *S Page 19 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Switching Waveforms (continued) Figure 16. Readback State of Address Counter or Mask Register[43, 44, 45, 46] tCYC2 tCH2 tCL2 CLK tSA tHA EXTERNAL ADDRESS A0–A16 INTERNAL ADDRESS tSAD tHAD ADS tSCN tHCN CNTEN tCD2 DATAOUT Qx-2 Qx-1 tCKHZ Qn tCKLZ Qn+1 Qn+2 Qn+3 An tCA2 or tCM2 An* An An+1 An+2 An+3 An+4 LOAD EXTERNAL ADDRESS READBACK COUNTER INTERNAL ADDRESS INCREMENT Notes 43. CE0 = OE = BE0 – BE1 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 44. Address in output mode. Host must not be driving address bus after tCKLZ in next clock cycle. 45. Address in input mode. Host can drive address bus after tCKHZ. 46. An * is the internal value of the address counter (or the mask register depending on the CNT/MSK level) being Read out on the address lines. Document #: 38-06059 Rev. *S Page 20 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Switching Waveforms (continued) Figure 17. Left_Port (L_Port) Write to Right_Port (R_Port) Read[47, 48, 49] tCH2 CLKL tSA L_PORT ADDRESS tSW R/WL tCKHZ tSD Dn tCCS An tHW tHA tCYC2 tCL2 tHD L_PORT DATAIN tCYC2 tCL2 tCH2 tCKLZ CLKR tSA R_PORT ADDRESS An tHA R/WR tCD2 R_PORT DATAOUT tDC Qn Notes 47. CE0 = OE = ADS = CNTEN = BE0 – BE1 = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 48. This timing is valid when one port is writing, and other port is reading the same location at the same time. If tCCS is violated, indeterminate data is Read out. 49. If tCCS < minimum specified value, then R_Port is Read the most recent data (written by L_Port) only (2 * tCYC2 + tCD2) after the rising edge of R_Port's clock. If tCCS > minimum specified value, then R_Port is Read the most recent data (written by L_Port) (tCYC2 + tCD2) after the rising edge of R_Port's clock. Document #: 38-06059 Rev. *S Page 21 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Switching Waveforms (continued) Figure 18. Counter Interrupt and Retransmit [15, 42, 50, 51, 52, 53] tCYC2 tCL2 tCH2 CLK tSCM tHCM CNT/MSK ADS CNTEN COUNTER INTERNAL ADDRESS 3FFFC 3FFFD 3FFFE tSCINT 3FFFF tRCINT Last_Loaded Last_Loaded +1 CNTINT Notes 50. CE0 = OE = BE0 – BE1 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 51. CNTINT is always driven. 52. CNTINT goes LOW when the unmasked portion of the address counter is incremented to the maximum value. 53. The mask register assumed to have the value of 3FFFFh. Document #: 38-06059 Rev. *S Page 22 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Switching Waveforms (continued) Figure 19. MailBox Interrupt Timing [54, 55, 56, 57, 58] tCYC2 tCL2 tCH2 CLKL tSA L_PORT ADDRESS INTR tCYC2 tCL2 tHA An tSINT tRINT An+1 An+2 An+3 7FFFF tCH2 CLKR tSA R_PORT ADDRESS Am tHA Am+1 7FFFF Am+3 Am+4 Table 7. Read/Write and Enable Operation (Any Port) [2, 17, 59, 60, 61] Inputs OE X X X L H X CLK CE0 H X L L L CE1 X L H H H R/W X X L H X Outputs DQ0 – DQ17 High-Z High-Z DIN DOUT High-Z Deselected Deselected Write Read Outputs Disabled Operation Notes 54. CE0 = OE = ADS = CNTEN = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 55. Address “7FFFF” is the mailbox location for R_Port of the 9Mb device. 56. L_Port is configured for Write operation, and R_Port is configured for Read operation. 57. At least one byte enable (BE0 – BE1) is required to be active during interrupt operations. 58. Interrupt flag is set with respect to the rising edge of the Write clock, and is reset with respect to the rising edge of the Read clock. 59. OE is an asynchronous input signal. 60. When CE changes state, deselection and Read happen after one cycle of latency. 61. CE0 = OE = LOW; CE1 = R/W = HIGH. Document #: 38-06059 Rev. *S Page 23 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Ordering Information 512K × 18 (9M) 3.3V Synchronous CY7C0833AV Dual-Port SRAM Speed (MHz) 133 100 Ordering Code CY7C0833AV-133BBC CY7C0833AV-133BBI CY7C0833AV-100BBC CY7C0833AV-100BBI Speed (MHz) 167 Package Diagram Package Type Operating Range Commercial Industrial Commercial Industrial Operating Range Commercial 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch Package Diagram 256K × 18 (4M) 3.3V Synchronous CY7C0832AV/CY7C0832BV Dual-Port SRAM Ordering Code CY7C0832AV-167BBC CY7C0832AV-167AC CY7C0832AV-167AXC 133 CY7C0832AV-133BBC CY7C0832AV-133AC CY7C0832AV-133AXC CY7C0832AV-133BBI CY7C0832BV-133AI CY7C0832AV-133AXI Speed (MHz) 167 Package Diagram Package Type 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85100 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) (Pb-Free) 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85100 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) (Pb-Free) 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85100 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) (Pb-Free) Commercial Industrial 128K × 18 (2M) 3.3V Synchronous CY7C0831AV Dual-Port SRAM Ordering Code CY7C0831AV-167BBC CY7C0831AV-167AC CY7C0831AV-167AXC 133 CY7C0831AV-133BBC CY7C0831AV-133BBXC CY7C0831AV-133AC CY7C0831AV-133AXC CY7C0831AV-133BBI CY7C0831AV-133BBXI CY7C0831AV-133AI CY7C0831AV-133AXI Speed (MHz) 167 133 Package Diagram Package Type Operating Range Commercial 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85100 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) (Pb-Free) 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch (Pb-Free) 51-85100 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) (Pb-Free) 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch (Pb-Free) 51-85100 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) (Pb-Free) Commercial Industrial 64K × 18 (1M) 3.3V Synchronous CY7C0830AV Dual-Port SRAM Ordering Code CY7C0830AV-167BBC CY7C0830AV-167AC CY7C0830AV-133BBC CY7C0830AV-133AC CY7C0830AV-133BBI CY7C0830AV-133AI Package Type Operating Range Commercial Commercial Industrial 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85100 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85100 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85100 120-Pin Thin Quad Flat Pack (14 x 14 x 1.4 mm) Document #: 38-06059 Rev. *S Page 24 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Ordering Information 32K × 18 (512K) 3.3V Synchronous CY7C0837AV Dual-Port SRAM Speed (MHz) 167 133 Ordering Code CY7C0837AV-167BBC CY7C0837AV-133BBC CY7C0837AV-133BBI Package Diagram Package Type Operating Range Commercial Commercial Industrial 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch 51-85141 144-Ball Grid Array (13 x 13 x 1.6 mm) with 1 mm pitch Package Diagrams Figure 20. 144-Ball FBGA (13 x 13 x 1.6 mm) (51-85141) TOP VIEW BOTTOM VIEW Ø0.05 M C A1 CORNER Ø0.25 M C A B +0.10 Ø0.50 (144X) -0.05 1 A B C D E F G H J K L M 2 3 4 5 6 7 8 9 10 11 12 12 11 10 9 8 7 6 5 4 3 21 A B C D E F G H J K L M 13.00±0.10 13.00±0.10 11.00 1.00 5.50 A B A 5.50 1.00 13.00±0.10 11.00 B 13.00±0.10 0.70±0.05 1.60MAX. 0.25 C 0.15 C 0.15(4X) DIMENSIONS IN MILLIMETERS REFERENCE JEDEC: PUBLICATION 95 DESIGN GUIDE 4.14D PKG. WEIGHT: 0.53 gms // SEATING PLANE 0.36 0.40±0.05 C 51-85141-*B Document #: 38-06059 Rev. *S Page 25 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Package Diagrams Figure 21. 120-Pin Thin Quad Flatpack (14 x 14 x 1.4 mm) (51-85100) 51-85100-** Document #: 38-06059 Rev. *S Page 26 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Document History Page Document Title: CY7C0837AV/CY7C0830AV/CY7C0831AV/CY7C0832AV/CY7C0832BV/CY7C0833AV, FLEx18™ 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM Document Number: 38-06059 Rev. ** *A ECN No. 111473 111942 Orig. of Change DSG JFU Submission Date 11/27/01 12/21/01 Description of Change Change from Spec number: 38-01056 to 38-06059 Updated capacitance values Updated switching parameters and ISB3 Updated “Read-to-Write-to-Read (OE Controlled)” waveform Revised static discharge voltage Revised footnote regarding ISB3 Updated Isb values Updated ESD voltage Corrected 0853 pins L3 and L12 Added discussion of Pause/Restart for JTAG boundary scan Revised speed offerings for all densities Power up requirements added to Maximum Ratings Information Revise tcd2, tOE, tOHZ, tCKHZ, tCKLZ for the CY7C0853V to 4.7 ns Separated out 4M and 9M data sheets Updated Isb and ICC values Updated Isb and ICC values Removed “A particular port can write to a certain location while another port is reading that location.” from Functional Description. Removed x36 devices (CY7C0852/CY7C0851) from this datasheet. Added 0.5M, 1M and 9M x18 devices to it. Changed title to FLEx18 3.3V 32K/64K/128K/256K/512K x18 Synchronous Dual-Port RAM. Changed datasheet to accommodate the removals and additions. Removed general JTAG description. Updated JTAG ID codes for all devices. Added 144FBGA package for all devices. Updated selection guide table and moved to the front page. Updated block diagram to reflect x18 configuration. Added preliminary status back due to the addition of the new devices. Minor Change: Correct the revision indicated on the footer. Updated Marketing part numbers Updated tRSF Added Byte Select Operation Table Removed Preliminary status Added ISB5 Changed tRSCNTINT to 10ns Updated Counter reset section to reflect what is loaded into the mirror register Corrected Ordering Codes for 0831 devices in the 133 Mhz speed bin. Added CY7C0833AV-133BBI. Changed VDDIO to VDD (typo) Added lead(Pb)-free parts Corrected typo in DC table Updated Template. Updated ordering information Added CY7C0832BV part Added footnote #1 Updated Ordering information table *B 113741 KRE 04/02/02 *C *D *E *F *G *H *I *J 114704 115336 122307 123636 126053 129443 231993 231813 KRE KRE RBI KRE SPN RAZ YDT WWZ 04/24/02 07/01/02 12/27/02 1/27/03 08/11/03 11/03/03 See ECN See ECN *K *L *M *N 311054 329111 330561 375198 RYQ SPN RUY YDT See ECN See ECN See ECN See ECN *O *P *Q 391525 414109 461113 SPN LIJ YDT See ECN See ECN SEE ECN *R *S 2544945 2668478 VKN/AESA VKN/PYRS 07/29/08 02/04/09 Document #: 38-06059 Rev. *S Page 27 of 28 [+] Feedback CY7C0837AV, CY7C0830AV CY7C0831AV, CY7C0832AV CY7C0832BV, CY7C0833AV Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales. Products PSoC Clocks & Buffers Wireless Memories Image Sensors psoc.cypress.com clocks.cypress.com wireless.cypress.com memory.cypress.com image.cypress.com PSoC Solutions General Low Power/Low Voltage Precision Analog LCD Drive CAN 2.0b USB psoc.cypress.com/solutions psoc.cypress.com/low-power psoc.cypress.com/precision-analog psoc.cypress.com/lcd-drive psoc.cypress.com/can psoc.cypress.com/usb © Cypress Semiconductor Corporation, 2001-2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document #: 38-06059 Rev. *S Revised March 03, 2009 Page 28 of 28 FLEx18 is a trademark of Cypress Semiconductor Corporation. All product and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback