CY7C1011CV33-10ZXCT

CY7C1011CV33 2-Mbit (128K x 16) Static RAM Features Functional Description • Pin equivalent to CY7C1011BV33 The CY7C1011CV33 is a high-performance CMOS Static RAM organized as 131,072 words by 16 bits. • High speed Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is written into the location specified on the address pins (A0 through A16). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A16). — tAA = 10 ns • Low active power — 360 mW (max.) • Data Retention at 2.0 • Automatic power-down when deselected • Independent control of upper and lower bits • Easy memory expansion with CE and OE features • Available in Pb-free and non Pb-free 44-pin TSOP II, 44-pin TQFP and non Pb-free 48-ball VFBGA packages Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O8 to I/O15. See the truth table at the back of this data sheet for a complete description of read and write modes. The input/output pins (I/O0 through I/O15) are placed in a high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), the BHE and BLE are disabled (BHE, BLE HIGH), or during a write operation (CE LOW, and WE LOW). The CY7C1011CV33 is available in a standard 44-pin TSOP II package with center power and ground pinout, a 44-pin Thin Plastic Quad Flatpack (TQFP), as well as a 48-ball fine-pitch ball grid array (VFBGA) package. Logic Block Diagram Pin Configuration TSOP II Top View 128K x 16 ARRAY SENSE AMPS A0 A1 A2 A3 A4 A5 A6 A7 A8 ROW DECODER INPUT BUFFER A4 A3 A2 A1 A0 CE I/O0 I/O1 I/O2 I/O3 VCC VSS I/O4 I/O5 I/O6 I/O7 WE A16 A15 A14 A13 A12 I/O0–I/O7 I/O8–I/O15 A9 A10 A 11 A 12 A 13 A 14 A 15 A 16 COLUMN DECODER BHE WE CE OE BLE Cypress Semiconductor Corporation Document #: 38-05232 Rev. *E • 198 Champion Court • 1 44 2 3 43 42 4 41 40 39 38 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A5 A6 A7 OE BHE BLE I/O15 I/O14 I/O13 I/O12 VSS VCC I/O11 I/O10 I/O9 I/O8 NC A8 A9 A10 A11 NC San Jose, CA 95134-1709 • 408-943-2600 Revised October 6, 2006 CY7C1011CV33 Selection Guide –10 –12 –15 Unit 10 12 15 ns mA Maximum Access Time Maximum Operating Current Com’l 90 85 80 Ind’l 100 95 90 10 10 10 Maximum CMOS Standby Current Com’l/Ind’l mA Pin Configurations A11 A10 A9 OE BHE BLE 39 38 37 36 35 34 A12 40 A13 A14 A15 A16 44-pin TQFP (Top View) 42 41 43 44 1 1 33 I/O15 I/O0 2 32 I/O14 I/O1 3 31 I/O13 I/O2 4 30 I/O12 I/O3 5 29 VSS 6 28 VCC I/O11 CE VCC 20 21 22 A6 A7 A8 NC 19 23 A5 11 18 I/O7 17 I/O8 A4 10 NC I/O6 16 I/O9 A3 25 24 14 9 15 I/O5 A1 I/O10 A2 26 13 8 12 7 I/O4 WE A0 VSS 27 48-ball VFBGA (Top View) Document #: 38-05232 Rev. *E 1 2 3 4 5 6 BLE OE A0 A1 A2 NC A I/O8 BHE A3 A4 CE I/O0 B I/O9 I/O10 A5 A6 I/O1 I/O2 C VSS I/O11 NC A7 I/O3 VCC D VCC I/O12 NC A16 I/O4 VSS E I/O14 I/O13 A14 A15 I/O5 I/O6 F I/O15 NC A12 A13 WE I/O7 G NC A8 A9 A10 A11 NC H Page 2 of 11 CY7C1011CV33 Maximum Ratings Current into Outputs (LOW)......................................... 20 mA (Above which the useful life may be impaired. For user guidelines, not tested.) Static Discharge Voltage............................................ >2001V (per MIL-STD-883, Method 3015) Storage Temperature ................................. –65°C to +150°C Latch-up Current...................................................... >200 mA Ambient Temperature with Power Applied............................................. –55°C to +125°C Operating Range [1] Supply Voltage on VCC to Relative GND DC Voltage Applied to Outputs in High-Z State[1] ....................................–0.5V to VCC + 0.5V .... –0.5V to +4.6V Range Ambient Temperature VCC Commercial 0°C to +70°C 3.3V ± 0.3V DC Input Voltage[1] .................................–0.5V to VCC + 0.5V Industrial –40°C to +85°C DC Electrical Characteristics Over the Operating Range –10 Parameter Description Test Conditions Min. –12 Max. 2.4 Min. –15 Max. VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA VIH Input HIGH Voltage 2.0 VCC + 0.3 2.0 VCC + 0.3 VIL Input LOW Voltage[1] –0.3 0.8 –0.3 IIX Input Leakage Current –1 +1 IOZ Output Leakage Current GND < VOUT < VCC, Output Disabled –1 +1 ICC VCC Operating Supply Current VCC = Max., f = fMAX = 1/tRC ISB1 Automatic CE Power-down Current —TTL Inputs Max. VCC, CE > VIH VIN > VIH or VIN < VIL, f = fMAX ISB2 Automatic CE Power-down Current —CMOS Inputs Max. VCC, CE > VCC – 0.3V, VIN > VCC – 0.3V, or VIN < 0.3V, f = 0 Max. 2.4 0.4 GND < VI < VCC Min. Unit V 0.4 0.4 V 2.0 VCC + 0.3 V 0.8 –0.3 0.8 V –1 +1 –1 +1 µA –1 +1 –1 +1 µA Com’l 90 85 80 mA Ind’l 100 95 90 mA 40 40 40 mA 10 10 10 mA Com’l/ Ind’l Capacitance[2] Parameter Description CIN Input Capacitance COUT I/O Capacitance Test Conditions Max. Unit 8 pF 8 pF TA = 25°C, f = 1 MHz, VCC = 3.3V Thermal Resistance[2] Parameter Description ΘJA Thermal Resistance (Junction to Ambient) ΘJC Thermal Resistance (Junction to Case) Test Conditions Still Air, soldered on a 3 × 4.5 inch, four-layer printed circuit board TSOP II TQFP VFBGA Unit 44.56 42.66 46.98 °C/W 10.75 14.64 9.63 °C/W Notes: 1. VIL (min.) = –2.0V for pulse durations of less than 20 ns. 2. Tested initially and after any design or process changes that may affect these parameters. Document #: 38-05232 Rev. *E Page 3 of 11 CY7C1011CV33 AC Test Loads and Waveforms[3] 12-, 15-ns devices: 10-ns devices: Z = 50Ω 50 Ω * CAPACITIVE LOAD CONSISTS OF ALL COMPONENTS OF THE TEST ENVIRONMENT R 317Ω 3.3V OUTPUT OUTPUT 30 pF* R2 351Ω 30 pF 1.5V (b) (a) High-Z characteristics: R 317Ω 3.3V ALL INPUT PULSES 3.0V 90% 90% GND OUTPUT 10% 10% (c) Rise Time: 1 V/ns R2 351Ω 5 pF Fall Time: 1 V/ns (d) AC Switching Characteristics Over the Operating Range[4] –10 Parameter Description Min. –12 Max. Min. –15 Max. Min. Max. Unit Read Cycle tpower[5] VCC(typical) to the first access 1 tRC Read Cycle Time 10 tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE LOW to Data Valid tDOE OE LOW to Data Valid tLZOE OE LOW to Low-Z 1 12 10 3 15 12 3 10 ns 15 3 12 5 0 µs 1 6 0 ns ns 15 ns 7 ns 0 ns OE HIGH to High-Z[6, 7] CE LOW to Low-Z[7] tHZCE CE HIGH to High-Z[6, 7] tPU CE LOW to Power-up tPD CE HIGH to Power-down 10 12 15 ns tDBE Byte Enable to Data Valid 5 6 7 ns tLZBE Byte Enable to Low-Z tHZBE Byte Disable to High-Z tHZOE tLZCE 5 3 6 3 5 0 3 6 0 0 7 ns ns 0 6 ns ns 0 0 6 7 ns 7 ns Notes: 3. AC characteristics (except High-Z) for all 10-ns parts are tested using the load conditions shown in (a). All other speeds are tested using the Thevenin load shown in (b). High-Z characteristics are tested for all speeds using the test load shown in (d). 4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V. 5. tPOWER gives the minimum amount of time that the power supply should be at typical VCC values until the first memory access is performed. 6. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (d) of AC Test Loads. Transition is measured ± 500 mV from steady-state voltage. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. Document #: 38-05232 Rev. *E Page 4 of 11 CY7C1011CV33 AC Switching Characteristics Over the Operating Range[4] (continued) –10 Parameter Description Min. –12 Max. Min. –15 Max. Min. Max. Unit [8, 9] Write Cycle tWC Write Cycle Time 10 12 15 ns tSCE CE LOW to Write End 7 8 10 ns tAW Address Set-up to Write End 7 8 10 ns tHA Address Hold from Write End 0 0 0 ns tSA Address Set-up to Write Start 0 0 0 ns tPWE WE Pulse Width 7 8 10 ns tSD Data Set-up to Write End 5 6 7 ns tHD Data Hold from Write End 0 0 0 ns Low-Z[7] tLZWE WE HIGH to tHZWE WE LOW to High-Z[6, 7] 3 tBW Byte Enable to End of Write 3 5 7 3 6 ns 7 8 10 ns ns Data Retention Waveform DATA RETENTION MODE 3.0V VCC VDR > 2V 3.0V tR tCDR CE Switching Waveforms Read Cycle No. 1[10, 11] tRC ADDRESS tAA tOHA DATA OUT PREVIOUS DATA VALID DATA VALID Notes: 8. The internal write time of the memory is defined by the overlap of CE LOW, and WE LOW. CE and WE must be LOW to initiate a write, and the transition of either of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write. 9. The minimum write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD. 10. Device is continuously selected. OE, CE, BHE and/or BHE = VIL. 11. WE is HIGH for read cycle. Document #: 38-05232 Rev. *E Page 5 of 11 CY7C1011CV33 Switching Waveforms (continued) Read Cycle No. 2 (OE Controlled)[11, 12] ADDRESS tRC CE tACE OE tHZOE tDOE BHE, BLE tLZOE tHZCE tDBE tLZBE DATA OUT tHZBE HIGH IMPEDANCE DATA VALID tLZCE VCC SUPPLY CURRENT HIGH IMPEDANCE tPD tPU IICC CC 50% 50% IISB SB Write Cycle No. 1 (CE Controlled)[13, 14] tWC ADDRESS CE tSA tSCE tAW tHA tPWE WE tBW BHE, BLE tSD tHD DATAI/O Notes: 12. Address valid prior to or coincident with CE transition LOW. 13. Data I/O is high-impedance if OE or BHE and/or BLE = VIH. 14. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. Document #: 38-05232 Rev. *E Page 6 of 11 CY7C1011CV33 Switching Waveforms (continued) Write Cycle No. 2 (BLE or BHE Controlled) tWC ADDRESS tSA BHE, BLE tBW tAW tHA tPWE WE tSCE CE tSD tHD DATAI/O Write Cycle No. 3 (WE Controlled, OE LOW) tWC ADDRESS tSCE CE tAW tHA tSA tPWE WE tBW BHE, BLE tHZWE tSD tHD DATA I/O tLZWE Document #: 38-05232 Rev. *E Page 7 of 11 CY7C1011CV33 Truth Table CE OE WE BLE BHE I/O0–I/O7 I/O8–I/O15 Mode Power H X X X X High-Z High-Z Power-down Standby (ISB) L L H L L Data Out Data Out Read All Bits Active (ICC) L L H L H Data Out High-Z Read Lower Bits Only Active (ICC) L L H H L High-Z Data Out Read Upper Bits Only Active (ICC) L X L L L Data In Data In Write All Bits Active (ICC) L X L L H Data In High-Z Write Lower Bits Only Active (ICC) L X L H L High-Z Data In Write Upper Bits Only Active (ICC) L H H X X High-Z High-Z Selected, Outputs Disabled Active (ICC) Ordering Information Speed (ns) 10 12 15 Ordering Code CY7C1011CV33-10ZC CY7C1011CV33-10ZXC CY7C1011CV33-10ZXI CY7C1011CV33-10BVI CY7C1011CV33-12ZC CY7C1011CV33-12ZXC CY7C1011CV33-12ZI CY7C1011CV33-12ZXI CY7C1011CV33-12AXI CY7C1011CV33-12BVI CY7C1011CV33-15ZXC CY7C1011CV33-15AI Document #: 38-05232 Rev. *E Package Name 51-85087 51-85150 51-85087 51-85064 51-85150 51-85087 51-85064 Package Type 44-pin TSOP II 44-pin TSOP II (Pb-Free) 44-pin TSOP II (Pb-Free) 48-ball (6 x 8 x 1 mm) VFBGA 44-pin TSOP II 44-pin TSOP II (Pb-Free) 44-pin TSOP II 44-pin TSOP II (Pb-Free) 44-pin TQFP (Pb-Free) 48-ball (6 x 8 x 1 mm) VFBGA 44-pin TSOP II (Pb-Free) 44-pin TQFP Operating Range Commercial Industrial Commercial Industrial Commercial Industrial Page 8 of 11 CY7C1011CV33 Package Diagrams 44-Pin TSOP II (51-85087) 51-85087-*A 44-pin Thin Plastic Quad Flat Pack (51-85064) 12.00±0.25 SQ 10.00±0.10 SQ 44 34 0° MIN. 1 33 0.37±0.05 R. 0.08 MIN. 0.20 MAX. STAND-OFF 0.05 MIN. 0.15 MAX. 0.25 GAUGE PLANE R. 0.08 MIN. 0.20 MIN. 0-7° 0.20 MIN. 0.60±0.15 1.00 REF. 11 0.80 B.S.C. 23 DETAIL 12 A 22 NOTE: 1. JEDEC STD REF MS-026 SEATING PLANE 1.60 MAX. 12°±1° (8X) 1.40±0.05 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS 0.10 0.20 MAX. 51-85064-*C SEE DETAIL Document #: 38-05232 Rev. *E A Page 9 of 11 CY7C1011CV33 Package Diagrams (continued) 48-ball VFBGA (6 x 8 x 1 mm) (51-85150) BOTTOM VIEW TOP VIEW A1 CORNER Ø0.05 M C Ø0.25 M C A B A1 CORNER Ø0.30±0.05(48X) 2 3 4 5 6 6 4 5 3 2 1 C C E F G D E 2.625 D 0.75 A B 5.25 A B 8.00±0.10 8.00±0.10 1 F G H H A 1.875 A B 0.75 6.00±0.10 3.75 6.00±0.10 0.15(4X) 0.10 C 0.21±0.05 0.25 C 0.55 MAX. B 51-85150-*D C 1.00 MAX 0.26 MAX. SEATING PLANE All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05232 Rev. *E Page 10 of 11 © Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C1011CV33 Document History Page Document Title: CY7C1011CV33, 2-Mbit (128K x 16) Static RAM Document Number: 38-05232 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 117132 07/31/02 HGK New Data Sheet *A 118057 08/19/02 HGK Pin configuration for 48-ball FBGA correction *B 119702 10/11/02 DFP Updated FBGA to VFBGA; updated package code on page 8 to BV48A. Updated address pinouts on page 1 to A0 to A16. Updated CMOS standby current on page 1 from 8 to 10 mA *C 386106 See ECN PCI Added lead-free parts in Ordering Information Table *D 498501 See ECN NXR Corrected typo in the Logic Block Diagram on page# 1 Incuded the Maximum Ratings for Static Discharge Voltage and Latch up Current on page# 3 Changed the description of IIX from Input Load Current to Input Leakage Current in DC Electrical Characteristics table Updated the Ordering Information Table *E 522620 See ECN VKN Added Thermal Resistance Table Document #: 38-05232 Rev. *E Page 11 of 11