CY7C1302DV25
9-Mbit Burst of Two Pipelined SRAMs with QDR™ Architecture
9-Mbit Burst of Two Pipelined SRAMs with QDR™ Architecture
Features
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Functional Description
The CY7C1302DV25 is a 2.5 V Synchronous Pipelined SRAM equipped with QDR™ architecture. QDR architecture consists of two separate ports to access the memory array. The Read port has dedicated data outputs to support Read operations and the Write Port has dedicated data inputs to support Write operations. Access to each port is accomplished through a common address bus. The Read address is latched on the rising edge of the K clock and the Write address is latched on the rising edge of K clock. QDR has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus required with common I/O devices. Accesses to the CY7C1302DV25 Read and Write ports are completely independent of one another. All accesses are initiated synchronously on the rising edge of the positive input clock (K). In order to maximize data throughput, both Read and Write ports are equipped with DDR interfaces. Therefore, data can be transferred into the device on every rising edge of both input clocks (K and K) and out of the device on every rising edge of the output clock (C and C, or K and K in a single clock domain) thereby maximizing performance while simplifying system design. Each address location is associated with two 18-bit words that burst sequentially into or out of the device. Depth expansion is accomplished with a Port Select input for each port. Each Port Select allows each port to operate independently. All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.
Separate independent Read and Write data ports ❐ Supports concurrent transactions 167-MHz clock for high bandwidth ❐ 2.5 ns Clock-to-Valid access time 2-word burst on all accesses Double Data Rate (DDR) interfaces on both Read and Write ports (data transferred at 333 MHz) @ 167 MHz Two input clocks (K and K) for precise DDR timing ❐ SRAM uses rising edges only Two input clocks for output data (C and C) to minimize clock-skew and flight-time mismatches. Single multiplexed address input bus latches address inputs for both Read and Write ports Separate Port Selects for depth expansion Synchronous internally self-timed writes 2.5 V core power supply with HSTL Inputs and Outputs Available in 165-ball FBGA package (13 × 15 × 1.4 mm) Variable drive HSTL output buffers Expanded HSTL output voltage (1.4 V–1.9 V) JTAG Interface
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Configurations
CY7C1302DV25 – 512 K × 18
Cypress Semiconductor Corporation Document Number: 38-05625 Rev. *D
•
198 Champion Court
•
San Jose, CA 95134-1709
• 408-943-2600 Revised May 9, 2011
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CY7C1302DV25
Logic Block Diagram - CY7C1302DV25
D[17:0] 18
Write Data Reg
Write Add. Decode
Read Add. Decode
A(17:0)
Address Register 18
Write Data Reg
K K
CLK Gen.
256Kx18 Memory Array
256Kx18 Memory Array
Address Register
18
A(17:0)
Control Logic
RPS C C
Read Data Reg. 36 Vref WPS BWS0 BWS1 Control Logic 18 18 Reg. Reg. 18
Reg. 18
18 Q[17:0]
Document Number: 38-05625 Rev. *D
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CY7C1302DV25
Contents
Selection Guide ................................................................ 4 Pin Configuration ............................................................. 4 165-ball FBGA (13 × 15 × 1.4 mm) Pinout .................. 4 Pin Definitions .................................................................. 4 Introduction ....................................................................... 5 Functional Overview .................................................... 5 Read Operations ......................................................... 6 Write Operations ......................................................... 6 Byte Write Operations ................................................. 6 Single Clock Mode ...................................................... 6 Concurrent Transactions ............................................. 6 Depth Expansion ......................................................... 6 Programmable Impedance .......................................... 6 Application Example ........................................................ 7 Truth Table ........................................................................ 8 Write Cycle Descriptions ................................................. 8 IEEE 1149.1 Serial Boundary Scan (JTAG) .................... 9 Disabling the JTAG Feature ........................................ 9 Test Access Port—Test Clock ..................................... 9 Test Mode Select ........................................................ 9 Test Data-In (TDI) ....................................................... 9 Test Data-Out (TDO) ................................................... 9 Performing a TAP Reset ............................................. 9 TAP Registers ............................................................. 9 TAP Instruction Set ..................................................... 9 TAP Controller State Diagram ....................................... 11 TAP Controller Block Diagram ...................................... 12 TAP Electrical Characteristics ...................................... 12 TAP AC Switching Characteristics ............................... 13 TAP Timing and Test Conditions .................................. 14 Identification Register Definitions ................................ 14 Scan Register Sizes ....................................................... 15 Instruction Codes ........................................................... 15 Boundary Scan Order .................................................... 16 Maximum Ratings ........................................................... 17 Operating Range ............................................................. 17 Electrical Characteristics ............................................... 17 DC Electrical Characteristics ..................................... 17 AC Input Requirements ............................................. 17 Thermal Resistance ........................................................ 18 Capacitance .................................................................... 18 AC Test Loads and Waveforms ..................................... 18 Switching Characteristics .............................................. 18 Switching Waveforms .................................................... 20 Ordering Information ...................................................... 21 Ordering Code Definitions ......................................... 21 Package Diagram ............................................................ 22 Acronyms ........................................................................ 23 Document Conventions ................................................. 23 Units of Measure ....................................................... 23 Document History Page ................................................. 24 Sales, Solutions, and Legal Information ...................... 25 Worldwide Sales and Design Support ....................... 25 Products .................................................................... 25 PSoC Solutions ......................................................... 25
Document Number: 38-05625 Rev. *D
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CY7C1302DV25
Selection Guide
CY7C1302DV25-167 Maximum Operating Frequency Maximum Operating Current 167 500 Unit MHz mA
Pin Configuration
165-ball FBGA (13 × 15 × 1.4 mm) Pinout CY7C1302DV25 (512 K × 18)
1 A B C D E F G H J K L M N P R NC NC NC NC NC NC NC NC NC NC NC NC NC NC TDO 2 Q9 NC D11 NC Q12 D13 VREF NC NC Q15 NC D17 NC TCK 3 D9 D10 Q10 Q11 D12 Q13 VDDQ D14 Q14 D15 D16 Q16 Q17 A 4 WPS A VSS VSS VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VSS VSS A A 5 BWS1 NC A VSS VSS VDD VDD VDD VDD VDD VSS VSS A A A 6 K K A VSS VSS VSS VSS VSS VSS VSS VSS VSS A C C 7 NC BWS0 A VSS VSS VDD VDD VDD VDD VDD VSS VSS A A A 8 RPS A VSS VSS VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VSS VSS A A 9 NC NC NC NC NC NC VDDQ NC NC NC NC NC NC A 10 NC Q7 NC D6 NC NC VREF Q4 D3 NC Q1 NC D0 TMS 11 NC Q8 D8 D7 Q6 Q5 D5 ZQ D4 Q3 Q2 D2 D1 Q0 TDI Gnd/144M NC/36M NC/18M Gnd/72M
Pin Definitions
Name D[17:0] WPS I/O Description InputData input signals, sampled on the rising edge of K and K clocks during valid Write Synchronous operations. InputWrite Port Select, active LOW. Sampled on the rising edge of the K clock. When asserted active, Synchronous a Write operation is initiated. Deasserting will deselect the Write port. Deselecting the Write port will cause D[17:0] to be ignored. InputByte Write Select 0, 1, active LOW. Sampled on the rising edge of the K and K clocks during Synchronous Write operations. Used to select which byte is written into the device during the current portion of the Write operations. Bytes not written remain unaltered. BWS0 controls D[8:0] and BWS1 controls D[17:9]. All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte Write Select will cause the corresponding byte of data to be ignored and not written into the device. InputAddress Inputs. Sampled on the rising edge of the K (read address) and K (write address) clocks Synchronous for active Read and Write operations. These address inputs are multiplexed for both Read and Write operations. Internally, the device is organized as 512 K × 18 (2 arrays each of 256 K × 18). These inputs are ignored when the appropriate port is deselected. OutputsData Output signals. These pins drive out the requested data during a Read operation. Valid data Synchronous is driven out on the rising edge of both the C and C clocks during Read operations or K and K when in single clock mode. When the Read port is deselected, Q[17:0] are automatically three-stated. Page 4 of 25
BWS0, BWS1
A
Q[17:0]
Document Number: 38-05625 Rev. *D
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Pin Definitions (continued)
Name RPS I/O Description InputRead Port Select, active LOW. Sampled on the rising edge of positive input clock (K). When Synchronous active, a Read operation is initiated. Deasserting will cause the Read port to be deselected. When deselected, the pending access is allowed to complete and the output drivers are automatically three-stated following the next rising edge of the C clock. Each read access consists of a burst of two sequential transfers. Input-Clock Positive Input Clock for Output Data. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board back to the controller. See application example for further details. Negative Input Clock for Output Data. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board cack to the controller. See application example for further details. Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the device and to drive out data through Q[17:0] when in single clock mode. All accesses are initiated on the rising edge of K. Negative Input Clock Input. K is used to capture synchronous inputs being presented to the device and to drive out data through Q[17:0] when in single clock mode. Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus impedance. Q[17:0] output impedance is set to 0.2 × RQ, where RQ is a resistor connected between ZQ and ground. Alternately, this pin can be connected directly to VDDQ, which enables the minimum impedance mode. This pin cannot be connected directly to GND or left unconnected. TDO for JTAG. TCK pin for JTAG. TDI pin for JTAG. TMS pin for JTAG. Address expansion for 18M. This is not connected to the die and so can be tied to any voltage level. Address expansion for 36M. This is not connected to the die and so can be tied to any voltage level. Address expansion for 72M. This must be tied LOW. Address expansion for 144M. This must be tied LOW. Not connected to the die. Can be tied to any voltage level. Reference Voltage Input. Static input used to set the reference level for HSTL inputs and Outputs as well as AC measurement points. Ground for the device.
C
C
Input-Clock
K
Input-Clock
K ZQ
Input-Clock Input
TDO TCK TDI TMS NC/18M NC/36M GND/72M GND/144M NC VREF VDD VSS VDDQ
Output Input Input Input N/A N/A Input Input N/A InputReference Ground
Power Supply Power supply inputs to the core of the device. Power Supply Power supply inputs for the outputs of the device. Accesses for both ports are initiated on the rising edge of the Positive Input Clock (K). All synchronous input timing is referenced from the rising edge of the input clocks (K and K) and all output timing is referenced to the output clocks (C and C, or K and K when in single clock mode). All synchronous data inputs (D[17:0]) pass through input registers controlled by the input clocks (K and K). All synchronous data outputs (Q[17:0]) pass through output registers controlled by the rising edge of the output clocks (C and C, or K and K when in single clock mode). All synchronous control (RPS, WPS, BWS[1:0]) inputs pass through input registers controlled by the rising edge of input clocks (K and K). Page 5 of 25
Introduction
Functional Overview
The CY7C1302DV25 is a synchronous pipelined Burst SRAM equipped with both a Read port and a Write port. The Read port is dedicated to Read operations and the Write port is dedicated to Write operations. Data flows into the SRAM through the Write port and out through the Read port. These devices multiplex the address inputs in order to minimize the number of address pins required. By having separate Read and Write ports, the QDR-I completely eliminates the need to “turn-around” the data bus and avoids any possible data contention, thereby simplifying system design. Document Number: 38-05625 Rev. *D
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Read Operations
The CY7C1302DV25 is organized internally as 2 arrays of 256 K × 18. Accesses are completed in a burst of two sequential 18-bit data words. Read operations are initiated by asserting RPS active at the rising edge of the positive input clock (K). The address is latched on the rising edge of the K clock. Following the next K clock rise the corresponding lower order 18-bit word of data is driven onto the Q[17:0] using C as the output timing reference. On the subsequent rising edge of C the higher order data word is driven onto the Q[17:0]. The requested data will be valid 2.5 ns from the rising edge of the output clock (C and C, or K and K when in single clock mode, 167-MHz device). Synchronous internal circuitry will automatically three-state the outputs following the next rising edge of the positive output clock (C). This will allow for a seamless transition between devices without the insertion of wait states in a depth expanded memory. feature can be used to simplify Read/Modify/Write operations to a Byte Write operation.
Single Clock Mode
The CY7C1302DV25 can be used with a single clock mode. In this mode the device will recognize only the pair of input clocks (K and K) that control both the input and output registers. This operation is identical to the operation if the device had zero skew between the K/K and C/C clocks. All timing parameters remain the same in this mode. To use this mode of operation, the user must tie C and C HIGH at power-up.This function is a strap option and not alterable during device operation.
Concurrent Transactions
The Read and Write ports on the CY7C1302DV25 operate completely independently of one another. Since each port latches the address inputs on different clock edges, the user can Read or Write to any location, regardless of the transaction on the other port. Also, reads and writes can be started in the same clock cycle. If the ports access the same location at the same time, the SRAM will deliver the most recent information associated with the specified address location. This includes forwarding data from a Write cycle that was initiated on the previous K clock rise.
Write Operations
Write operations are initiated by asserting WPS active at the rising edge of the positive input clock (K). On the same K clock rise the data presented to D[17:0] is latched into the lower 18-bit Write Data register provided BWS[1:0] are both asserted active. On the subsequent rising edge of the negative input clock (K), the address is latched and the information presented to D[17:0] is stored into the Write Data register provided BWS[1:0] are both asserted active. The 36 bits of data are then written into the memory array at the specified location. When deselected, the Write port will ignore all inputs after the pending Write operations have been completed.
Depth Expansion
The CY7C1302DV25 has a Port Select input for each port. This allows for easy depth expansion. Both Port Selects are sampled on the rising edge of the Positive Input Clock only (K). Each port select input can deselect the specified port. Deselecting a port will not affect the other port. All pending transactions (Read and Write) will be completed prior to the device being deselected.
Byte Write Operations
Byte Write operations are supported by the CY7C1302DV25. A Write operation is initiated as described in the Write Operation section above. The bytes that are written are determined by BWS0 and BWS1 which are sampled with each set of 18-bit data word. Asserting the appropriate Byte Write Select input during the data portion of a write will allow the data being presented to be latched and written into the device. Deasserting the Byte Write Select input during the data portion of a write will allow the data stored in the device for that byte to remain unaltered. This
Programmable Impedance
An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to allow the SRAM to adjust its output driver impedance. The value of RQ must be 5 × the value of the intended line impedance driven by the SRAM, The allowable range of RQ to guarantee impedance matching with a tolerance of ±15% is between 175 and 350 , with VDDQ = 1.5 V. The output impedance is adjusted every 1024 cycles to account for drifts in supply voltage and temperature.
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Application Example[1]
Note 1. The above application shows 4 QDR-I being used.
Document Number: 38-05625 Rev. *D
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Truth Table[2, 3, 4, 5, 6, 7]
Operation Write Cycle: Load address on the rising edge of K clock; input write data on K and K rising edges. Read Cycle: Load address on the rising edge of K clock; wait one cycle; read data on 2 consecutive C and C rising edges. NOP: No Operation Standby: Clock Stopped K L–H RPS X WPS L DQ D(A+0) at K(t) DQ D(A+1) at K(t)
L–H
L
X
Q(A+0) at C(t+1)
Q(A+1) at C(t+1)
L–H Stopped
H X
H X
D=X Q = High Z Previous State
D=X Q = High Z Previous State
Write Cycle Descriptions[2, 8]
BWS0 L L L L H H H H BWS1 L L H H L L H H K L–H – L–H – L–H – L–H – K – L–H – L–H – L–H – L–H Comments During the Data portion of a Write sequence, both bytes (D[17:0]) are written into the device. During the Data portion of a Write sequence, both bytes (D[17:0]) are written into the device. During the Data portion of a Write sequence, only the lower byte (D[8:0]) is written into the device. D[17:9] remains unaltered. During the Data portion of a Write sequence, only the lower byte (D[8:0]) is written into the device. D[17:9] remains unaltered. During the Data portion of a Write sequence, only the byte (D[17:9]) is written into the device. D[8:0] remains unaltered. During the Data portion of a Write sequence, only the byte (D[17:9]) is written into the device. D[8:0] remains unaltered. No data is written into the device during this portion of a Write operation. No data is written into the device during this portion of a Write operation.
Notes 2. ,X = Don't Care, H = Logic HIGH, L = Logic LOW represents rising edge. 3. Device will power-up deselected and the outputs in a three-state condition. 4. “A” represents address location latched by the devices when transaction was initiated. A+0, A+1 represent the addresses sequence in the burst. 5. “t” represents the cycle at which a Read/Write operation is started. t+1 is the first clock cycle succeeding the “t” clock cycle. 6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode. 7. It is recommended that K = K and C = C when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging symmetrically. 8. Assumes a Write cycle was initiated per the Write Port Cycle Description Truth Table. BWS0, BWS1 can be altered on different portions of a Write cycle, as long as the set-up and hold requirements are achieved.
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CY7C1302DV25
IEEE 1149.1 Serial Boundary Scan (JTAG)
These SRAMs incorporate a serial boundary scan test access port (TAP) in the FBGA package. This part is fully compliant with IEEE Standard #1149.1-1900. The TAP operates using JEDEC standard 2.5 V I/O logic levels. Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins as shown in TAP Controller Block Diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section. When the TAP controller is in the Capture IR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board level serial test path. Bypass Register To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between TDI and TDO pins. This allows data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. Boundary Scan Register The boundary scan register is connected to all of the input and output pins on the SRAM. Several no connect (NC) pins are also included in the scan register to reserve pins for higher density devices. The boundary scan register is loaded with the contents of the RAM Input and Output ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO pins when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the Input and Output ring. The Boundary Scan Order tables show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI, and the LSB is connected to TDO. Identification (ID) Register The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in the Identification Register Definitions table.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left unconnected. Upon power-up, the device will come up in a reset state which will not interfere with the operation of the device.
Test Access Port—Test Clock
The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.
Test Mode Select
The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this pin unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI pin is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see the TAP Controller State Diagram. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) on any register.
Test Data-Out (TDO)
The TDO output pin is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine (see Instruction codes). The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register.
Performing a TAP Reset
A Reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating. At power-up, the TAP is reset internally to ensure that TDO comes up in a high Z state.
TAP Instruction Set
Eight different instructions are possible with the three-bit instruction register. All combinations are listed in the Instruction Code table. Three of these instructions are listed as RESERVED and should not be used. The other five instructions are described in detail below. Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO pins. To execute the instruction once it is shifted in, the TAP controller needs to be moved into the Update-IR state.
TAP Registers
Registers are connected between the TDI and TDO pins and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction registers. Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK.
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IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the instruction register. It also places the instruction register between the TDI and TDO pins and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is loaded into the instruction register upon power-up or whenever the TAP controller is given a test logic reset state. SAMPLE Z The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO pins when the TAP controller is in a Shift-DR state. The SAMPLE Z command puts the output bus into a high Z state until the next command is given during the “Update IR” state. SAMPLE/PRELOAD SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the inputs and output pins is captured in the boundary scan register. The user must be aware that the TAP controller clock can only operate at a frequency up to 10 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output will undergo a transition. The TAP may then try to capture a signal while in transition (metastable state). This will not harm the device, but there is no guarantee as to the value that will be captured. Repeatable results may not be possible. To guarantee that the boundary scan register will capture the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller’s capture set-up plus hold times (tCS and tCH). The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK captured in the boundary scan register. Once the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. PRELOAD allows an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells prior to the selection of another boundary scan test operation. The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in. BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. EXTEST The EXTEST instruction enables the preloaded data to be driven out through the system output pins. This instruction also selects the boundary scan register to be connected for serial access between the TDI and TDO in the shift-DR controller state. EXTEST Output Bus Three-state IEEE Standard 1149.1 mandates that the TAP controller be able to put the output bus into a three-state mode. The boundary scan register has a special bit located at bit #47. When this scan cell, called the “extest output bus three-state”, is latched into the preload register during the “Update-DR” state in the TAP controller, it will directly control the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it will enable the output buffers to drive the output bus. When LOW, this bit will place the output bus into a high Z condition. This bit can be set by entering the SAMPLE/PRELOAD or EXTEST command, and then shifting the desired bit into that cell, during the “Shift-DR” state. During “Update-DR”, the value loaded into that shift-register cell will latch into the preload register. When the EXTEST instruction is entered, this bit will directly control the output Q-bus pins. Note that this bit is pre-set HIGH to enable the output when the device is powered-up, and also when the TAP controller is in the “Test-Logic-Reset” state. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions.
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TAP Controller State Diagram[9]
1 TEST-LOGIC RESET
0
0
TEST-LOGIC/ IDLE
1
SELECT DR-SCAN 0 1 CAPTURE-DR 0 SHIFT-DR 1 EXIT1-DR 0 PAUSE-DR 1 0 EXIT2-DR 1 UPDATE-DR 1 0
1
SELECT IR-SCAN 0 1 CAPTURE-DR 0
1
0
SHIFT-IR 1
0
1
EXIT1-IR 0
1
0
PAUSE-IR 1 0 EXIT2-IR 1 UPDATE-IR 1 0
0
Note 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.
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TAP Controller Block Diagram
0 Bypass Register TDI Selection Circuitry 2 Instruction Register 31 30 29 . . 2 1 0 1 0 Selection Circuitry TDO
Identification Register 106 . . . . 2 1 0 Boundary Scan Register
TCK TMS
TAP Controller
TAP Electrical Characteristics
Over the Operating Range [10, 11, 12] Parameter VOH1 VOH2 VOL1 VOL2 VIH VIL IX Description Output HIGH Voltage Output HIGH Voltage Output LOW Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input and Output Load Current GND VI VDDQ Test Conditions IOH =2.0 mA IOH =100 A IOL = 2.0 mA IOL = 100 A Min 1.7 2.1 – – 1.7 –0.3 –5 Max – – 0.7 0.2 VDD + 0.3 0.7 5 Unit V V V V V V A
Notes 10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics table. 11. Overshoot: VIH(AC) < VDDQ + 0.85 V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > –1.5 V (Pulse width less than tCYC/2). 12. All voltage referenced to Ground.
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TAP AC Switching Characteristics
Over the Operating Range[13, 14] Parameter tTCYC tTF tTH tTL Set-up Times tTMSS tTDIS tCS Hold Times tTMSH tTDIH tCH Output Times tTDOV tTDOX TCK Clock LOW to TDO Valid TCK Clock LOW to TDO Invalid – 0 20 – ns ns TMS Hold after TCK Clock Rise TDI Hold after Clock Rise Capture Hold after Clock Rise 10 10 10 – – – ns ns ns TMS Set-up to TCK Clock Rise TDI Set-up to TCK Clock Rise Capture Set-up to TCK Rise 10 10 10 – – – ns ns ns TCK Clock Cycle Time TCK Clock Frequency TCK Clock HIGH TCK Clock LOW Description Min 50 – 20 20 Max – 20 – – Unit ns MHz ns ns
Notes 13. TCS and TCH refer to the set-up and hold time requirements of latching data from the boundary scan register. 14. Test conditions are specified using the load in TAP AC test conditions. Tr/Tf = 1 ns.
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TAP Timing and Test Conditions[15]
1.25 V 50 TDO Z0 = 50 CL = 20 pF 0V ALL INPUT PULSES 2.5 V 1.25 V
(a)
GND
tTH
tTL
Test Clock TCK
tTMSS tTMSH
tTCYC
Test Mode Select TMS
tTDIS tTDIH
Test Data-In TDI
Test Data-Out TDO
tTDOX
tTDOV
Identification Register Definitions
Instruction Field Revision Number (31:29) Cypress Device ID (28:12) Cypress JEDEC ID (11:1) ID Register Presence (0) Value CY7C1302DV25 000 01011010010010110 00000110100 1 Version number. Defines the type of SRAM. Allows unique identification of SRAM vendor. Indicate the presence of an ID register. Description
Note 15. Test conditions are specified using the load in TAP AC test conditions. Tr/Tf = 1 ns.
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Scan Register Sizes
Register Name Instruction Bypass ID Boundary Scan Bit Size 3 1 32 107
Instruction Codes
Instruction EXTEST IDCODE SAMPLE Z RESERVED SAMPLE/PRELOAD RESERVED RESERVED BYPASS Code 000 001 010 011 100 101 110 111 Description Captures the Input/Output ring contents. Loads the ID register with the vendor ID code and places the register between TDI and TDO. This operation does not affect SRAM operation. Captures the Input/Output contents. Places the boundary scan register between TDI and TDO. Forces all SRAM output drivers to a high Z state. Do Not Use: This instruction is reserved for future use. Captures the Input/Output ring contents. Places the boundary scan register between TDI and TDO. Does not affect the SRAM operation. Do Not Use: This instruction is reserved for future use. Do Not Use: This instruction is reserved for future use. Places the bypass register between TDI and TDO. This operation does not affect SRAM operation.
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Boundary Scan Order
Bit # 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Bump ID 6R 6P 6N 7P 7N 7R 8R 8P 9R 11P 10P 10N 9P 10M 11N 9M 9N 11L 11M 9L 10L 11K 10K 9J 9K 10J 11J Bit # 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 Bump ID 11H 10G 9G 11F 11G 9F 10F 11E 10E 10D 9E 10C 11D 9C 9D 11B 11C 9B 10B 11A Internal 9A 8B 7C 6C 8A 7A Bit # 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Bump ID 7B 6B 6A 5B 5A 4A 5C 4B 3A 1H 1A 2B 3B 1C 1B 3D 3C 1D 2C 3E 2D 2E 1E 2F 3F 1G 1F Bit # 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 Bump ID 3G 2G 1J 2J 3K 3J 2K 1K 2L 3L 1M 1L 3N 3M 1N 2M 3P 2N 2P 1P 3R 4R 4P 5P 5N 5R
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Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Storage Temperature .............................. –65 °C to + 150 °C Ambient Temperature with Power Applied ........................................ –55 °C to + 125 °C Supply Voltage on VDD Relative to GND .....–0.5 V to +3.6 V Supply Voltage on VDDQ Relative to GND .... –0.5 V to +VDD DC Applied to Outputs in high Z .......–0.5 V to VDDQ + 0.5 V DC Input Voltage[16] ............................. –0.5 V to VDD + 0.5 V Current into Outputs (LOW) ........................................ 20 mA Static Discharge Voltage ........................................ > 2001 V (per MIL-STD-883, Method 3015) Latch-up Current ................................................... > 200 mA
Operating Range
Range Commercial Industrial Ambient Temperature (TA) 0 °C to +70 °C –40 °C to +85 °C VDD[17] VDDQ[17] 2.5 ± 0.1 V 1.4 V to 1.9 V
Electrical Characteristics
Over the Operating Range[18]
DC Electrical Characteristics
Over the Operating Range Parameter VDD VDDQ VOH VOL VOH(LOW) VOL(LOW) VIH VIL IX IOZ VREF IDD ISB1 Description Power Supply Voltage I/O Supply Voltage Output HIGH Voltage Output LOW Voltage Output HIGH Voltage Output LOW Voltage Input HIGH Voltage[16] Input LOW Voltage[16, 21] GND VI VDDQ GND VI VDDQ, Output Disabled Typical value = 0.75 V VDD = Max., IOUT = 0 mA, f = fMAX = 1/tCYC Max. VDD, Both Ports Deselected, VIN VIH or VIN VIL, f = fMAX = 1/tCYC, Inputs Static Input Load Current Output Leakage Current Input Reference Voltage[22] VDD Operating Supply Automatic Power-Down Current Note 19 Note 20 IOH = –0.1 mA, Nominal Impedance IOL = 0.1 mA, Nominal Impedance Test Conditions Min 2.4 1.4 VDDQ/2 – 0.12 VDDQ/2 – 0.12 VDDQ – 0.2 VSS VREF + 0.1 –0.3 –5 –5 0.68 – – Typ 2.5 1.5 – – – – – – – – 0.75 – – Max 2.6 1.9 VDDQ/2 + 0.12 VDDQ/2 + 0.12 VDDQ 0.2 VDDQ + 0.3 VREF – 0.1 5 5 0.95 500 240 Unit V V V V V V V V A A V mA mA
AC Input Requirements
Over the Operating Range Parameter VIH VIL Description Input HIGH Voltage Input LOW Voltage Test Conditions Min VREF + 0.2 – Typ – – Max – VREF – 0.2 Unit V V
Notes 16. Overshoot: VIH(AC) < VDDQ + 0.85 V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > –1.5 V (Pulse width less than tCYC/2). 17. Power-up: Assumes a linear ramp from 0 V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD. 18. All voltage referenced to Ground. 19. Output are impedance controlled. IOH = –(VDDQ/2)/(RQ/5) for values of 175 RQ 350 . 20. Output are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175 RQ 350 . 21. This spec is for all inputs except C and C Clock. For C and C Clock, VIL(Max) = VREF – 0.2 V. 22. VREF (Min.) = 0.68 V or 0.46 VDDQ, whichever is larger, VREF (Max) = 0.95 V or 0.54 VDDQ, whichever is smaller.
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Thermal Resistance[23]
Parameter JA JC Description Thermal Resistance (Junction to Ambient) Thermal Resistance (Junction to Case) Test Conditions Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/JESD51. 165-ball FBGA Package 16.7 2.5 Unit C/W C/W
Capacitance[23]
Parameter CIN CCLK CO Description Input Capacitance Clock Input Capacitance Output Capacitance Test Conditions TA = 25 C, f = 1 MHz, VDD = 2.5 V, VDDQ = 1.5 V Max 5 6 7 Unit pF pF pF
AC Test Loads and Waveforms
VREF = 0.75 V VREF OUTPUT Device Under Test Z0 = 50 RL = 50 0.75 V VREF OUTPUT 5 pF 0.25 V Slew Rate = 2 V/ns 0.75 V R = 50 ALL INPUT PULSES 1.25 V 0.75 V
[24]
ZQ
(a)
Device Under VREF = 0.75 V Test ZQ
RQ = 250
RQ = 250 (b)
Switching Characteristics
Over the Operating Range[24] Cypress Parameter tPower[25] Cycle Time tCYC tKH tKL tKHKH tKHCH tSA tSC tSD tKHKH tKHKL tKLKH tKHKH tKHCH tSA tSC tSD K Clock and C Clock Cycle Time Input Clock (K/K and C/C) HIGH Input Clock (K/K and C/C) LOW K/K Clock Rise to K/K Clock Rise and C/C to C/C Rise (rising edge to rising edge) K/K Clock Rise to C/C Clock Rise (rising edge to rising edge) Address Set-up to Clock (K and K) Rise Control Set-up to Clock (K and K) Rise (RPS, WPS, BWS0, BWS1) D[17:0] Set-up to Clock (K and K) Rise 6.0 2.4 2.4 2.7 0.0 0.7 0.7 0.7 – – – 3.3 2.0 – – – ns ns ns ns ns ns ns ns Consortium Parameter Description VCC (typical) to the First Access Read or Write 167 MHz Min 10 Max – Unit s
Set-up Times
Notes 23. Tested initially and after any design or process change that may affect these parameters. 24. Unless otherwise noted, test conditions assume signal transition time of 2 V/ns, timing reference levels of 0.75 V,Vref = 0.75 V, RQ = 250 W, VDDQ = 1.5V , input pulse levels of 0.25 V to 1.25 V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC test loads. 25. This part has a voltage regulator that steps down the voltage internally; tPower is the time power needs to be supplied above VDD minimum initially before a read or write operation can be initiated.
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Switching Characteristics (continued)
Over the Operating Range[24] Cypress Parameter Hold Times tHA tHC tHD tCO tDOH tCHZ tCLZ tHA tHC tHD tCHQV tCHQX tCHZ tCLZ Address Hold after Clock (K and K) Rise Control Signals Hold after Clock (K and K) Rise (RPS, WPS, BWS0, BWS1) D[17:0] Hold after Clock (K and K) Rise C/C Clock Rise (or K/K in single clock mode) to Data Valid Data Output Hold after Output C/C Clock Rise (Active to Active) Clock (C and C) Rise to high Z (Active to high Z)[26, 27] Clock (C and C) Rise to low Z[26, 27] 0.7 0.7 0.7 – 1.2 – 1.2 – – – 2.5 – 2.5 – ns ns ns ns ns ns ns Consortium Parameter Description 167 MHz Min Max Unit
Output Times
Notes 26. tCHZ, tCLZ, are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured ± 100 mV from steady-state voltage. 27. At any given voltage and temperature tCHZ is less than tCLZ and, tCHZ less than tCO.
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Switching Waveforms[28, 29, 30]
READ 1
K tKH K tKL tCYC tKHKH
WRITE 2
READ 3
WRITE 4
READ 5
WRITE 6
NOP 7
WRITE 8
NOP 9 10
RPS tSC WPS A A0 A1 A2 A3 A4 A5 A6 tHC
tSA tHA D D10 D11
tSA tHA D30 tSD D31 tHD D50 D51 tSD D60 tHD D61
Q
Q00
Q01
Q20
Q21
Q40
Q41 tCHZ
tCLZ tKHCH tKHCH tCO tCO
tDOH
tDOH
C tKH C tKL tKHKH tCYC
DON’T CARE
UNDEFINED
Notes 28. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0 i.e., A0 + 1. 29. Outputs are disabled (High Z) one clock cycle after a NOP. 30. In this example, if address A2 = A1 then data Q20 = D10 and Q21 = D11. Write data is forwarded immediately as read results.This note applies to the whole diagram.
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Ordering Information
Cypress offers other versions of this type of product in many different configurations and features. The below table contains only the list of parts that are currently available. For a complete listing of all options, visit the Cypress website at www.cypress.com and refer to the product summary page at http://www.cypress.com/products or contact your local sales representative. Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives and distributors. To find the office closest to you, visit us at t http://www.cypress.com/go/datasheet/offices. Speed (MHz) 167 Ordering Code CY7C1302DV25-167BZC Package Diagram Package Type Operating Range Commercial
51-85180 165-ball Fine-Pitch Ball Grid Array (13 × 15 × 1.4 mm)
Ordering Code Definitions
CY 7C 1302 D V25 - 167 BZ X C Temperature Range: C = Commercial = 0 °C to +70 °C X = Pb-free; X Absent = Leaded Package Type: BZ = 165-ball FBGA Speed: 167 MHz V25 = 2.5 V Process Technology: 90 nm Part Identifier Marketing Code: 7C = SRAM Company ID: CY = Cypress
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Package Diagram
51-85180 *C
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Acronyms
Acronym BWS DDR FBGA HSTL I/O JTAG LSB MSB NC QDR SRAM TAP TCK TDI TDO TMS Description byte write select double data rate fine-pitch ball grid array high-speed transceiver logic Input/output joint test action group least significant bit most significant bit no connect quad data rate static random access memory test access port test clock test data-in test data-out test mode select
Document Conventions
Units of Measure
Symbol °C µA µs mA mm mV mW MHz ns % pF V W degree Celcius micro Amperes micro seconds milli Amperes milli meter milli Volts milli Watts Mega Hertz nano seconds ohms percent pico Farad Volts Watts Unit of Measure
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Document History Page
Document Title: CY7C1302DV25, 9-Mbit Burst of Two Pipelined SRAMs with QDR™ Architecture Document Number: 38-05625 REV. ** *A ECN NO. 253010 436864 Submission Date See ECN See ECN Orig. of Change SYT NXR New Data Sheet Converted from Preliminary to Final Removed 133 MHz & 100 MHz from product offering Included the Industrial Operating Range. Changed C/C Description in the Features Section & Pin Description Table Changed tTCYC from 100 ns to 50 ns, changed tTF from 10 MHz to 20 MHz and changed tTH and tTL from 40 ns to 20 ns in TAP AC Switching Characteristics table Modified the ZQ pin definition as follows: Alternately, this pin can be connected directly to VDDQ, which enables the minimum impedance mode Included Maximum Ratings for Supply Voltage on VDDQ Relative to GND Changed the Maximum Ratings for DC Input Voltage from VDDQ to VDD Modified the Description of IX from Input Load current to Input Leakage Current on page # 13 Modified test condition in note# 14 from VDDQ < VDD to VDDQ VDD Updated the Ordering Information table and replaced the Package Name Column with Package Diagram Removed inactive parts from the Ordering Information table; Updated package diagram. Updated Ordering Information and added Ordering Code Definitions. Added Acronyms and Units of Measure. Minor edits and updated in new template. Updated Ordering Information. Minor edits across the document. Description of Change
*B *C
2896202 3122015
03/19/2010 12/28/2010
NJY NJY
*D
3249352
05/05/2011
NJY
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Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations.
Products
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PSoC Solutions
psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 5
© Cypress Semiconductor Corporation, 2004-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 38-05625 Rev. *D
Revised May 9, 2011
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Quad Data Rate SRAM and QDR SRAM comprise a new family of products developed by Cypress, IDT, NEC, Renesas and Samsung. All products and company names mentioned in this document may be the trademarks of their respective holders.
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