CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
18-Mbit DDR-II SRAM 2-Word
Burst Architecture
Features
Functional Description
■
18-Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)
■
300 MHz clock for high bandwidth
■
2-word burst for reducing address bus frequency
■
Double Data Rate (DDR) interfaces
(data transferred at 600 MHz) at 300 MHz
■
Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
■
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
■
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
■
Synchronous internally self-timed writes
■
1.8V core power supply with HSTL inputs and outputs
The CY7C1316BV18, CY7C1916BV18, CY7C1318BV18, and
CY7C1320BV18 are 1.8V Synchronous Pipelined SRAMs
equipped with DDR-II architecture. The DDR-II consists of an
SRAM core with advanced synchronous peripheral circuitry and
a one-bit burst counter. Addresses for read and write are latched
on alternate rising edges of the input (K) clock. Write data is
registered on the rising edges of both K and K. Read data is
driven on the rising edges of C and C if provided, or on the rising
edge of K and K if C/C are not provided. Each address location
is associated with two 8-bit words in the case of CY7C1316BV18
and two 9-bit words in the case of CY7C1916BV18 that burst
sequentially into or out of the device. The burst counter always
starts with a ‘0’ internally in the case of CY7C1316BV18 and
CY7C1916BV18. For CY7C1318BV18 and CY7C1320BV18,
the burst counter takes in the least significant bit of the external
address and bursts two 18-bit words (in the case of
CY7C1318BV18) of two 36-bit words (in the case of
CY7C1320BV18) sequentially into or out of the device.
■
Variable drive HSTL output buffers
■
Expanded HSTL output voltage (1.4V–VDD)
■
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
■
Offered in both Pb-free and non Pb-free packages
■
JTAG 1149.1 compatible test access port
■
Delay Lock Loop (DLL) for accurate data placement
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs, D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need to capture data
separately from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Configurations
CY7C1316BV18 – 2M x 8
CY7C1916BV18 – 2M x 9
CY7C1318BV18 – 1M x 18
CY7C1320BV18 – 512K x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
300 MHz
278 MHz
250 MHz
200 MHz
167 MHz
Unit
300
278
250
200
167
MHz
x8
815
775
705
575
490
mA
x9
820
780
710
580
490
mA
x18
855
805
730
600
510
mA
x36
930
855
775
635
540
mA
Cypress Semiconductor Corporation
Document Number: 38-05621 Rev. *D
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 2, 2008
[+] Feedback
CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Logic Block Diagram (CY7C1316BV18)
Write
Reg
DOFF
Read Add. Decode
CLK
Gen.
K
1M x 8 Array
K
Write
Reg
1M x 8 Array
Address
Register
LD
Write Add. Decode
20
A(19:0)
8
Output
Logic
Control
R/W
C
Read Data Reg.
C
16
VREF
8
Control
Logic
R/W
8
NWS[1:0]
Reg.
Reg. 8
Reg.
8
CQ
CQ
8
DQ[7:0]
Logic Block Diagram (CY7C1916BV18)
Write
Reg
K
CLK
Gen.
DOFF
9
Output
Logic
Control
R/W
C
Read Data Reg.
C
18
VREF
R/W
Read Add. Decode
K
1M x 9 Array
Address
Register
Write
Reg
1M x 9 Array
LD
Write Add. Decode
20
A(19:0)
9
Control
Logic
BWS[0]
Document Number: 38-05621 Rev. *D
9
Reg.
Reg. 9
Reg.
9
CQ
CQ
9
DQ[8:0]
Page 2 of 31
[+] Feedback
CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Logic Block Diagram (CY7C1318BV18)
A(19:1)
LD
Address
Register
K
CLK
Gen.
K
Write Add. Decode
19
DOFF
Write
Reg
Write
Reg
512K x 18 Array
20
512K x 18 Array
A(19:0)
Read Add. Decode
Burst
Logic
A0
18
Output
Logic
Control
R/W
C
Read Data Reg.
C
36
VREF
18
Control
Logic
R/W
18
BWS[1:0]
Reg.
Reg. 18
Reg.
18
CQ
CQ
18
DQ[17:0]
Logic Block Diagram (CY7C1320BV18)
A(18:1)
LD
Address
Register
K
K
CLK
Gen.
DOFF
Write
Reg
Write
Reg
36
Output
Logic
Control
R/W
C
Read Data Reg.
C
72
VREF
R/W
Write Add. Decode
18
256K x 36 Array
19
256K x 36 Array
A(18:0)
Read Add. Decode
Burst
Logic
A0
36
Control
Logic
BWS[3:0]
Document Number: 38-05621 Rev. *D
36
Reg.
Reg. 36
Reg.
36
CQ
CQ
36
DQ[35:0]
Page 3 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Pin Configuration
The pin configuration for CY7C1316BV18, CY7C1916BV18, CY7C1318BV18, and CY7C1320BV18 follow. [1]
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout
CY7C1316BV18 (2M x 8)
1
2
3
4
5
6
7
8
9
10
11
A
CQ
NC/72M
A
R/W
NWS1
K
NC/144M
LD
A
NC/36M
CQ
B
NC
NC
NC
A
NC/288M
K
NWS0
A
NC
NC
DQ3
C
NC
NC
NC
VSS
A
A
A
VSS
NC
NC
NC
D
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
E
NC
NC
DQ4
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
F
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
G
NC
NC
DQ5
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ1
NC
K
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
L
NC
DQ6
NC
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ0
M
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
N
NC
NC
NC
VSS
A
A
A
VSS
NC
NC
NC
P
NC
NC
DQ7
A
A
C
A
A
NC
NC
NC
R
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
CY7C1916BV18 (2M x 9)
1
2
3
4
5
6
7
8
9
10
11
A
CQ
NC/72M
A
R/W
NC
K
NC/144M
LD
A
NC/36M
CQ
B
NC
NC
NC
A
NC/288M
K
BWS0
A
NC
NC
DQ3
C
NC
NC
NC
VSS
A
A
A
VSS
NC
NC
NC
D
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
E
NC
NC
DQ4
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
F
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
G
NC
NC
DQ5
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ1
NC
K
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
L
NC
DQ6
NC
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ0
M
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
N
NC
NC
NC
VSS
A
A
A
VSS
NC
NC
NC
P
NC
NC
DQ7
A
A
C
A
A
NC
NC
DQ8
R
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
Note
1. NC/36M, NC/72M, NC/144M, and NC/288M are not connected to the die and can be tied to any voltage level.
Document Number: 38-05621 Rev. *D
Page 4 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Pin Configuration
(continued)
The pin configuration for CY7C1316BV18, CY7C1916BV18, CY7C1318BV18, and CY7C1320BV18 follow. [1]
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout
CY7C1318BV18 (1M x 18)
1
2
3
4
5
6
7
8
9
10
11
A
CQ
NC/72M
A
R/W
BWS1
K
NC/144M
LD
A
NC/36M
CQ
B
NC
DQ9
NC
A
NC/288M
K
BWS0
A
NC
NC
DQ8
C
NC
NC
NC
VSS
A
A0
A
VSS
NC
DQ7
NC
D
NC
NC
DQ10
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
E
NC
NC
DQ11
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ6
F
NC
DQ12
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ5
G
NC
NC
DQ13
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
NC
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
NC
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ4
NC
K
NC
NC
DQ14
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ3
L
NC
DQ15
NC
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
M
NC
NC
NC
VSS
VSS
VSS
VSS
VSS
NC
DQ1
NC
N
NC
NC
DQ16
VSS
A
A
A
VSS
NC
NC
NC
P
NC
NC
DQ17
A
A
C
A
A
NC
NC
DQ0
R
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
CY7C1320BV18 (512K x 36)
1
2
4
5
6
7
8
9
10
11
R/W
BWS2
K
BWS1
LD
A
NC/72M
CQ
DQ18
A
BWS3
K
BWS0
A
NC
NC
DQ8
DQ28
VSS
A
A0
A
VSS
NC
DQ17
DQ7
DQ19
VSS
VSS
VSS
VSS
VSS
NC
NC
DQ16
DQ20
VDDQ
VSS
VSS
VSS
VDDQ
NC
DQ15
DQ6
DQ21
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ5
DQ22
VDDQ
VDD
VSS
VDD
VDDQ
NC
NC
DQ14
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
DQ32
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ13
DQ4
DQ23
VDDQ
VDD
VSS
VDD
VDDQ
NC
DQ12
DQ3
DQ33
DQ24
VDDQ
VSS
VSS
VSS
VDDQ
NC
NC
DQ2
A
CQ
B
NC
DQ27
C
NC
NC
D
NC
DQ29
E
NC
NC
F
NC
DQ30
G
NC
DQ31
H
DOFF
VREF
J
NC
NC
K
NC
NC
L
NC
3
NC/144M NC/36M
M
NC
NC
DQ34
VSS
VSS
VSS
VSS
VSS
NC
DQ11
DQ1
N
NC
DQ35
DQ25
VSS
A
A
A
VSS
NC
NC
DQ10
P
NC
NC
DQ26
A
A
C
A
A
NC
DQ9
DQ0
R
TDO
TCK
A
A
A
C
A
A
A
TMS
TDI
Document Number: 38-05621 Rev. *D
Page 5 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Pin Definitions
Pin Name
IO
Pin Description
DQ[x:0]
Input Output- Data Input Output Signals. Inputs are sampled on the rising edge of K and K clocks during valid write
Synchronous operations. These pins drive out the requested data during a read operation. Valid data is driven out on
the rising edge of both the C and C clocks during read operations or K and K when in single clock mode.
When read access is deselected, Q[x:0] are automatically tri-stated.
CY7C1316BV18 − DQ[7:0]
CY7C1916BV18 − DQ[8:0]
CY7C1318BV18 − DQ[17:0]
CY7C1320BV18 − DQ[35:0]
LD
InputSynchronous Load. This input is brought LOW when a bus cycle sequence is defined. This definition
Synchronous includes address and read/write direction. All transactions operate on a burst of 2 data.
NWS0,
NWS1
InputNibble Write Select 0, 1 − Active LOW (CY7C1316BV18 only). Sampled on the rising edge of the K
Synchronous and K clocks during write operations. Used to select which nibble is written into the device during the
current portion of the write operations. Nibbles not written remain unaltered.
NWS0 controls D[3:0] and NWS1 controls D[7:4].
All the Nibble Write Selects are sampled on the same edge as the data. Deselecting a Nibble Write Select
ignores the corresponding nibble of data and it is not written into the device.
BWS0,
BWS1,
BWS2,
BWS3
InputByte Write Select 0, 1, 2, and 3 − Active LOW. Sampled on the rising edge of the K and K clocks during
Synchronous write operations. Used to select which byte is written into the device during the current portion of the Write
operations. Bytes not written remain unaltered.
CY7C1916BV18 − BWS0 controls D[8:0]
CY7C1318BV18 − BWS0 controls D[8:0] and BWS1 controls D[17:9].
CY7C1320BV18 − BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18] and BWS3 controls
D[35:27].
All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte Write Select
ignores the corresponding byte of data and it is not written into the device.
A, A0
InputAddress Inputs. These address inputs are multiplexed for both read and write operations. Internally, the
Synchronous device is organized as 2M x 8 (2 arrays each of 1M x 8) for CY7C1316BV18 and 2M x 9 (2 arrays each
of 1M x 9) for CY7C1916BV18, a single 1M x 18 array for CY7C1916BV18, and a single array of 512K x
36 for CY7C1318BV18.
CY7C1316BV18 – Because the least significant bit of the address internally is a ‘0’, only 20 external
address inputs are needed to access the entire memory array.
CY7C1916BV18 – Because the least significant bit of the address internally is a ‘0’, only 20 external
address inputs are needed to access the entire memory array.
CY7C1318BV18 – A0 is the input to the burst counter. These are incremented internally in a linear fashion.
20 address inputs are needed to access the entire memory array.
CY7C1320BV18 – A0 is the input to the burst counter. These are incremented internally in a linear fashion.
19 address inputs are needed to access the entire memory array. All the address inputs are ignored when
the appropriate port is deselected.
R/W
InputSynchronous Read/Write Input. When LD is LOW, this input designates the access type (read when
Synchronous R/W is HIGH, write when R/W is LOW) for the loaded address. R/W must meet the setup and hold times
around the edge of K.
C
Input Clock
Positive Input Clock for Output Data. C is used in conjunction with C to clock out the read data from
the device. C and C can be used together to deskew the flight times of various devices on the board back
to the controller. See Application Example on page 9 for more information.
C
Input Clock
Negative Input Clock for Output Data. C is used in conjunction with C to clock out the read data from
the device. C and C can be used together to deskew the flight times of various devices on the board back
to the controller. See Application Example on page 9 for more information.
K
Input Clock
Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the device
and to drive out data through Q[x:0] when in single clock mode. All accesses are initiated on the rising
edge of K.
K
Input Clock
Negative Input Clock Input. K is used to capture synchronous data being presented to the device and
to drive out data through Q[x:0] when in single clock mode.
Document Number: 38-05621 Rev. *D
Page 6 of 31
[+] Feedback
CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Pin Definitions
Pin Name
(continued)
IO
Pin Description
CQ
Output Clock CQ Referenced with Respect to C. This is a free running clock and is synchronized to the input clock
for output data (C) of the DDR-II. In single clock mode, CQ is generated with respect to K. The timing for
the echo clocks is shown in Switching Characteristics on page 23.
CQ
Output Clock CQ Referenced with Respect to C. This is a free running clock and is synchronized to the input clock
for output data (C) of the DDR-II. In single clock mode, CQ is generated with respect to K. The timing for
the echo clocks is shown in Switching Characteristics on page 23.
ZQ
Input
Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus
impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor connected
between ZQ and ground. Alternatively, this pin can be connected directly to VDDQ, which enables the
minimum impedance mode. This pin cannot be connected directly to GND or left unconnected.
DOFF
Input
DLL Turn Off − Active LOW. Connecting this pin to ground turns off the DLL inside the device. The timing
in the DLL turned off operation is different from that listed in this data sheet.
TDO
Output
TCK
Input
TCK Pin for JTAG.
TDI
Input
TDI Pin for JTAG.
TMS
Input
TMS Pin for JTAG.
NC
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/36M
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/72M
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/144M
N/A
Not Connected to the Die. Can be tied to any voltage level.
NC/288M
N/A
Not Connected to the Die. Can be tied to any voltage level.
VREF
VDD
VSS
VDDQ
InputReference
TDO for JTAG.
Reference Voltage Input. Static input used to set the reference level for HSTL inputs, outputs, and AC
measurement points.
Power Supply Power Supply Inputs to the Core of the Device.
Ground
Ground for the Device.
Power Supply Power Supply Inputs for the Outputs of the Device.
Document Number: 38-05621 Rev. *D
Page 7 of 31
[+] Feedback
CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Functional Overview
The CY7C1316BV18, CY7C1916BV18, CY7C1318BV18, and
CY7C1320BV18 are synchronous pipelined Burst SRAMs
equipped with a DDR interface.
Accesses are initiated on the rising edge of the positive input
clock (K). All synchronous input timing is referenced from the
rising edge of the input clocks (K and K) and all output timing is
referenced to the rising edge of the output clocks (C/C, or K/K
when in single clock mode).
All synchronous data inputs (D[x:0]) pass through input registers
controlled by the rising edge of the input clocks (K and K). All
synchronous data outputs (Q[x:0]) pass through output registers
controlled by the rising edge of the output clocks (C/C, or K/K
when in single-clock mode).
mation presented to D[17:0] is also stored into the write data
register, provided BWS[1:0] are both asserted active. The 36 bits
of data are then written into the memory array at the specified
location. Write accesses can be initiated on every rising edge of
the positive input clock (K). This pipelines the data flow such that
18 bits of data can be transferred into the device on every rising
edge of the input clocks (K and K).
When Write access is deselected, the device ignores all inputs
after the pending write operations are completed.
Byte Write Operations
CY7C1318BV18 is described in the following sections. The
same basic descriptions apply to CY7C1316BV18,
CY7C1916BV18, and CY7C1320BV18.
Byte write operations are supported by the CY7C1318BV18. A
write operation is initiated as described in the Write Operations
section. The bytes that are written are determined by BWS0 and
BWS1, which are sampled with each set of 18-bit data words.
Asserting the appropriate Byte Write Select input during the data
portion of a write latches the data being presented and writes it
into the device. Deasserting the Byte Write Select input during
the data portion of a write enables the data stored in the device
for that byte to remain unaltered. This feature can be used to
simplify read/modify/write operations to a byte write operation.
Read Operations
Single Clock Mode
The CY7C1318BV18 is organized internally as a single array of
1M x 18. Accesses are completed in a burst of two sequential
18-bit data words. Read operations are initiated by asserting
R/W HIGH and LD LOW at the rising edge of the positive input
clock (K). The address presented to address inputs is stored in
the read address register and the least significant bit of the
address is presented to the burst counter. The burst counter
increments the address in a linear fashion. Following the next K
clock rise, the corresponding 18-bit word of data from this
address location is driven onto Q[17:0], using C as the output
timing reference. On the subsequent rising edge of C the next
18-bit data word from the address location generated by the
burst counter is driven onto Q[17:0]. The requested data is valid
0.45 ns from the rising edge of the output clock (C or C, or K and
K when in single clock mode, 200 MHz and 250 MHz device). To
maintain the internal logic, each read access must be allowed to
complete. Read accesses can be initiated on every rising edge
of the positive input clock (K).
The CY7C1318BV18 can be used with a single clock that
controls both the input and output registers. In this mode the
device recognizes only a single pair of input clocks (K and K) that
control both the input and output registers. This operation is
identical to the operation if the device had zero skew between
the K/K and C/C clocks. All timing parameters remain the same
in this mode. To use this mode of operation, tie C and C HIGH at
power on. This function is a strap option and not alterable during
device operation.
All synchronous control (R/W, LD, BWS[0:X]) inputs pass through
input registers controlled by the rising edge of the input clock (K).
The CY7C1318BV18 first completes the pending read transactions, when read access is deselected. Synchronous internal
circuitry automatically tri-states the output following the next
rising edge of the positive output clock (C). This enables a
seamless transition between devices without the insertion of wait
states in a depth expanded memory.
Write Operations
Write operations are initiated by asserting R/W LOW and LD
LOW at the rising edge of the positive input clock (K). The
address presented to address inputs is stored in the write
address register and the least significant bit of the address is
presented to the burst counter. The burst counter increments the
address in a linear fashion. On the following K clock rise the data
presented to D[17:0] is latched and stored into the 18-bit write
data register, provided BWS[1:0] are both asserted active. On the
subsequent rising edge of the negative input clock (K) the infor-
Document Number: 38-05621 Rev. *D
DDR Operation
The CY7C1318BV18 enables high-performance operation
through high clock frequencies (achieved through pipelining) and
double data rate mode of operation. The CY7C1318BV18
requires a single No Operation (NOP) cycle during transition
from a read to a write cycle. At higher frequencies, some applications may require a second NOP cycle to avoid contention.
If a read occurs after a write cycle, address and data for the write
are stored in registers. The write information must be stored
because the SRAM cannot perform the last word write to the
array without conflicting with the read. The data stays in this
register until the next write cycle occurs. On the first write cycle
after the read(s), the stored data from the earlier write is written
into the SRAM array. This is called a posted write.
If a read is performed on the same address on which a write is
performed in the previous cycle, the SRAM reads out the most
current data. The SRAM does this by bypassing the memory
array and reading the data from the registers.
Depth Expansion
Depth expansion requires replicating the LD control signal for
each bank. All other control signals can be common between
banks as appropriate.
Page 8 of 31
[+] Feedback
CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Programmable Impedance
An external resistor, RQ, must be connected between the ZQ pin
on the SRAM and VSS to enable the SRAM to adjust its output
driver impedance. The value of RQ must be 5x the value of the
intended line impedance driven by the SRAM. The allowable
range of RQ to guarantee impedance matching with a tolerance
of ±15% is between 175Ω and 350Ω, with VDDQ = 1.5V. The
output impedance is adjusted every 1024 cycles at power up to
account for drifts in supply voltage and temperature.
Echo Clocks
Echo clocks are provided on the DDR-II to simplify data capture
on high-speed systems. Two echo clocks are generated by the
DDR-II. CQ is referenced with respect to C and CQ is referenced
with respect to C. These are free running clocks and are synchronized to the output clock of the DDR-II. In the single clock mode,
CQ is generated with respect to K and CQ is generated with
respect to K. The timing for the echo clocks is shown in Switching
Characteristics on page 23.
DLL
These chips use a Delay Lock Loop (DLL) that is designed to
function between 120 MHz and the specified maximum clock
frequency. During power up, when the DOFF is tied HIGH, the
DLL is locked after 1024 cycles of stable clock. The DLL can also
be reset by slowing or stopping the input clocks K and K for a
minimum of 30 ns. However, it is not necessary to reset the DLL
to lock it to the desired frequency. The DLL automatically locks
1024 clock cycles after a stable clock is presented. The DLL may
be disabled by applying ground to the DOFF pin. For information
refer to the application note AN5062, DLL Considerations in
QDRII/DDRII/QDRII+/DDRII+.
Application Example
Figure 1 shows two DDR-II used in an application.
Figure 1. Application Example
SRAM#1
DQ
A
DQ
Addresses
Cycle Start#
R/W#
Return CLK
Source CLK
Return CLK#
Source CLK#
Echo Clock1/Echo Clock#1
Echo Clock2/Echo Clock#2
BUS
MASTER
(CPU
or
ASIC)
ZQ
CQ/CQ#
LD# R/W# C C# K K#
R = 250ohms
SRAM#2
DQ
A
ZQ
CQ/CQ#
LD# R/W# C C# K K#
R = 250ohms
Vterm = 0.75V
R = 50ohms
Vterm = 0.75V
Document Number: 38-05621 Rev. *D
Page 9 of 31
[+] Feedback
CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Truth Table
The truth table for the CY7C1316BV18, CY7C1916BV18, CY7C1318BV18, and CY7C1320BV18 follows. [2, 3, 4, 5, 6, 7]
K
LD
R/W
Write Cycle:
Load address; wait one cycle;
input write data on consecutive K and K rising edges.
Operation
L-H
L
L
D(A1) at K(t + 1) ↑ D(A2) at K(t + 1) ↑
Read Cycle:
Load address; wait one and a half cycle;
read data on consecutive C and C rising edges.
L-H
L
H
Q(A1) at C(t + 1)↑ Q(A2) at C(t + 2) ↑
NOP: No Operation
L-H
H
X
High-Z
High-Z
Stopped
X
X
Previous State
Previous State
Standby: Clock Stopped
DQ
DQ
Burst Address Table
(CY7C1318BV18, CY7C1320BV18)
First Address (External)
Second Address (Internal)
X..X0
X..X1
X..X1
X..X0
Write Cycle Descriptions
The write cycle description table for CY7C1316BV18 and CY7C1318BV18 follows. [2, 8]
BWS0/ BWS1/
K
K
L
L–H
–
L
L
–
L
H
L–H
L
H
–
H
L
L–H
H
L
–
H
H
L–H
H
H
–
NWS0
NWS1
L
Comments
During the data portion of a write sequence:
CY7C1316BV18 − both nibbles (D[7:0]) are written into the device.
CY7C1318BV18 − both bytes (D[17:0]) are written into the device.
L-H During the data portion of a write sequence:
CY7C1316BV18 − both nibbles (D[7:0]) are written into the device.
CY7C1318BV18 − both bytes (D[17:0]) are written into the device.
–
During the data portion of a write sequence:
CY7C1316BV18 − only the lower nibble (D[3:0]) is written into the device, D[7:4] remains unaltered.
CY7C1318BV18 − only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.
L–H During the data portion of a write sequence:
CY7C1316BV18 − only the lower nibble (D[3:0]) is written into the device, D[7:4] remains unaltered.
CY7C1318BV18 − only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.
–
During the data portion of a write sequence:
CY7C1316BV18 − only the upper nibble (D[7:4]) is written into the device, D[3:0] remains unaltered.
CY7C1318BV18 − only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.
L–H During the data portion of a write sequence:
CY7C1316BV18 − only the upper nibble (D[7:4]) is written into the device, D[3:0] remains unaltered.
CY7C1318BV18 − only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.
–
No data is written into the devices during this portion of a write operation.
L–H No data is written into the devices during this portion of a write operation.
Notes
2. X = “Don’t Care,” H = Logic HIGH, L = Logic LOW, ↑ represents rising edge.
3. Device powers up deselected with the outputs in a tri-state condition.
4. On CY7C1318BV18 and CY7C1320BV18, “A1” represents address location latched by the devices when transaction was initiated and “A2” represents the addresses
sequence in the burst. On CY7C1316BV18 and CY7C1916BV18, “A1” represents A + ‘0’ and “A2” represents A + ‘1’.
5. “t” represents the cycle at which a read/write operation is started. t + 1 and t + 2 are the first and second clock cycles succeeding the “t” clock cycle.
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode.
7. It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging
symmetrically.
8. Is based on a write cycle that was initiated in accordance with the Write Cycle Descriptions table. NWS0, NWS1, BWS0, BWS1, BWS2, and BWS3 can be altered on
different portions of a write cycle, as long as the setup and hold requirements are achieved.
Document Number: 38-05621 Rev. *D
Page 10 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Write Cycle Descriptions
The write cycle description table for CY7C1916BV18 follows. [2, 8]
BWS0
K
K
Comments
L
L–H
–
During the data portion of a write sequence, the single byte (D[8:0]) is written into the device.
L
–
L–H
During the data portion of a write sequence, the single byte (D[8:0]) is written into the device.
H
L–H
–
No data is written into the device during this portion of a write operation.
H
–
L–H
No data is written into the device during this portion of a write operation.
Write Cycle Descriptions
The write cycle description table for CY7C1320BV18 follows. [2, 8]
BWS0
BWS1
BWS2
BWS3
K
K
Comments
L
L
L
L
L–H
–
During the data portion of a write sequence, all four bytes (D[35:0]) are written into
the device.
L
L
L
L
–
L
H
H
H
L–H
L
H
H
H
–
H
L
H
H
L–H
H
L
H
H
–
H
H
L
H
L–H
H
H
L
H
–
H
H
H
L
L–H
H
H
H
L
–
H
H
H
H
L–H
H
H
H
H
–
Document Number: 38-05621 Rev. *D
L–H During the data portion of a write sequence, all four bytes (D[35:0]) are written into
the device.
–
During the data portion of a write sequence, only the lower byte (D[8:0]) is written
into the device. D[35:9] remains unaltered.
L–H During the data portion of a write sequence, only the lower byte (D[8:0]) is written
into the device. D[35:9] remains unaltered.
–
During the data portion of a write sequence, only the byte (D[17:9]) is written into
the device. D[8:0] and D[35:18] remains unaltered.
L–H During the data portion of a write sequence, only the byte (D[17:9]) is written into
the device. D[8:0] and D[35:18] remains unaltered.
–
During the data portion of a write sequence, only the byte (D[26:18]) is written into
the device. D[17:0] and D[35:27] remains unaltered.
L–H During the data portion of a write sequence, only the byte (D[26:18]) is written into
the device. D[17:0] and D[35:27] remains unaltered.
–
During the data portion of a write sequence, only the byte (D[35:27]) is written into
the device. D[26:0] remains unaltered.
L–H During the data portion of a write sequence, only the byte (D[35:27]) is written into
the device. D[26:0] remains unaltered.
–
No data is written into the device during this portion of a write operation.
L–H No data is written into the device during this portion of a write operation.
Page 11 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
IEEE 1149.1 Serial Boundary Scan (JTAG)
These SRAMs incorporate a serial boundary scan Test Access
Port (TAP) in the FBGA package. This part is fully compliant with
IEEE Standard #1149.1-1900. The TAP operates using JEDEC
standard 1.8V IO logic levels.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternatively
be connected to VDD through a pull up resistor. TDO must be left
unconnected. Upon power up, the device comes up in a reset
state, which does not interfere with the operation of the device.
Test Access Port—Test Clock
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
Test Mode Select (TMS)
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. This pin may be left
unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI pin is used to serially input information into the registers
and can be connected to the input of any of the registers. The
register between TDI and TDO is chosen by the instruction that
is loaded into the TAP instruction register. For information on
loading the instruction register, see the TAP Controller State
Diagram on page 14. TDI is internally pulled up and can be
unconnected if the TAP is unused in an application. TDI is
connected to the most significant bit (MSB) on any register.
Instruction Register
Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the TDI
and TDO pins, as shown in TAP Controller Block Diagram on
page 15. Upon power up, the instruction register is loaded with
the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state, as described
in the previous section.
When the TAP controller is in the Capture-IR state, the two least
significant bits are loaded with a binary “01” pattern to allow for
fault isolation of the board level serial test path.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between TDI
and TDO pins. This enables shifting of data through the SRAM
with minimal delay. The bypass register is set LOW (VSS) when
the BYPASS instruction is executed.
Boundary Scan Register
The boundary scan register is connected to all of the input and
output pins on the SRAM. Several No Connect (NC) pins are also
included in the scan register to reserve pins for higher density
devices.
The boundary scan register is loaded with the contents of the
RAM input and output ring when the TAP controller is in the
Capture-DR state and is then placed between the TDI and TDO
pins when the controller is moved to the Shift-DR state. The
EXTEST, SAMPLE/PRELOAD, and SAMPLE Z instructions can
be used to capture the contents of the input and output ring.
The Boundary Scan Order on page 18 shows the order in which
the bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSB of the register is connected to
TDI, and the LSB is connected to TDO.
Test Data-Out (TDO)
Identification (ID) Register
The TDO output pin is used to serially clock data out from the
registers. The output is active, depending upon the current state
of the TAP state machine (see Instruction Codes on page 17).
The output changes on the falling edge of TCK. TDO is
connected to the least significant bit (LSB) of any register.
The ID register is loaded with a vendor-specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired into
the SRAM and can be shifted out when the TAP controller is in
the Shift-DR state. The ID register has a vendor code and other
information described in Identification Register Definitions on
page 17.
Performing a TAP Reset
A Reset is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This Reset does not affect the operation of the
SRAM and can be performed while the SRAM is operating. At
power up, the TAP is reset internally to ensure that TDO comes
up in a high-Z state.
TAP Registers
Registers are connected between the TDI and TDO pins to scan
the data in and out of the SRAM test circuitry. Only one register
can be selected at a time through the instruction registers. Data
is serially loaded into the TDI pin on the rising edge of TCK. Data
is output on the TDO pin on the falling edge of TCK.
Document Number: 38-05621 Rev. *D
TAP Instruction Set
Eight different instructions are possible with the three-bit
instruction register. All combinations are listed in Instruction
Codes on page 17. Three of these instructions are listed as
RESERVED and must not be used. The other five instructions
are described in detail below.
Instructions are loaded into the TAP controller during the Shift-IR
state when the instruction register is placed between TDI and
TDO. During this state, instructions are shifted through the
instruction register through the TDI and TDO pins. To execute
the instruction after it is shifted in, the TAP controller must be
moved into the Update-IR state.
Page 12 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
IDCODE
The IDCODE instruction loads a vendor-specific, 32-bit code into
the instruction register. It also places the instruction register
between the TDI and TDO pins and shifts the IDCODE out of the
device when the TAP controller enters the Shift-DR state. The
IDCODE instruction is loaded into the instruction register at
power up or whenever the TAP controller is supplied a
Test-Logic-Reset state.
SAMPLE Z
The SAMPLE Z instruction connects the boundary scan register
between the TDI and TDO pins when the TAP controller is in a
Shift-DR state. The SAMPLE Z command puts the output bus
into a High-Z state until the next command is supplied during the
Update IR state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the input and output pins is captured
in the boundary scan register.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because there
is a large difference in the clock frequencies, it is possible that
during the Capture-DR state, an input or output undergoes a
transition. The TAP may then try to capture a signal while in
transition (metastable state). This does not harm the device, but
there is no guarantee as to the value that is captured.
Repeatable results may not be possible.
PRELOAD places an initial data pattern at the latched parallel
outputs of the boundary scan register cells before the selection
of another boundary scan test operation.
The shifting of data for the SAMPLE and PRELOAD phases can
occur concurrently when required, that is, while the data
captured is shifted out, the preloaded data can be shifted in.
BYPASS
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO pins. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
EXTEST
The EXTEST instruction drives the preloaded data out through
the system output pins. This instruction also connects the
boundary scan register for serial access between the TDI and
TDO in the Shift-DR controller state.
EXTEST OUTPUT BUS TRI-STATE
IEEE Standard 1149.1 mandates that the TAP controller be able
to put the output bus into a tri-state mode.
The boundary scan register has a special bit located at bit #47.
When this scan cell, called the “extest output bus tri-state,” is
latched into the preload register during the Update-DR state in
the TAP controller, it directly controls the state of the output
(Q-bus) pins, when the EXTEST is entered as the current
instruction. When HIGH, it enables the output buffers to drive the
output bus. When LOW, this bit places the output bus into a
High-Z condition.
To guarantee that the boundary scan register captures the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller's capture setup plus hold
times (tCS and tCH). The SRAM clock input might not be captured
correctly if there is no way in a design to stop (or slow) the clock
during a SAMPLE/PRELOAD instruction. If this is an issue, it is
still possible to capture all other signals and simply ignore the
value of the CK and CK captured in the boundary scan register.
This bit can be set by entering the SAMPLE/PRELOAD or
EXTEST command, and then shifting the desired bit into that cell,
during the Shift-DR state. During Update-DR, the value loaded
into that shift-register cell latches into the preload register. When
the EXTEST instruction is entered, this bit directly controls the
output Q-bus pins. Note that this bit is pre-set HIGH to enable
the output when the device is powered up, and also when the
TAP controller is in the Test-Logic-Reset state.
After the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO pins.
Reserved
Document Number: 38-05621 Rev. *D
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Page 13 of 31
[+] Feedback
CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
TAP Controller State Diagram
The state diagram for the TAP controller follows. [9]
1
TEST-LOGIC
RESET
0
0
TEST-LOGIC/
IDLE
1
SELECT
DR-SCAN
1
1
SELECT
IR-SCAN
0
0
1
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
1
1
EXIT1-DR
1
EXIT1-IR
0
1
0
PAUSE-DR
0
PAUSE-IR
1
0
1
0
EXIT2-DR
0
EXIT2-IR
1
1
UPDATE-IR
UPDATE-DR
1
0
0
1
0
Note
9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.
Document Number: 38-05621 Rev. *D
Page 14 of 31
[+] Feedback
CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
TAP Controller Block Diagram
0
Bypass Register
2
Selection
Circuitry
TDI
1
0
Selection
Circuitry
Instruction Register
31
30
29
.
.
2
1
0
1
0
TDO
Identification Register
106
.
.
.
.
2
Boundary Scan Register
TCK
TAP Controller
TMS
TAP Electrical Characteristics
Over the Operating Range [10, 11, 12]
Parameter
Description
Test Conditions
Min
Max
Unit
VOH1
Output HIGH Voltage
IOH = −2.0 mA
1.4
V
VOH2
Output HIGH Voltage
IOH = −100 μA
1.6
V
VOL1
Output LOW Voltage
IOL = 2.0 mA
0.4
V
VOL2
Output LOW Voltage
IOL = 100 μA
0.2
V
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IX
Input and Output Load Current
0.65VDD VDD + 0.3
GND ≤ VI ≤ VDD
V
–0.3
0.35VDD
V
–5
5
μA
Notes
10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics Table.
11. Overshoot: VIH(AC) < VDDQ + 0.85V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > −1.5V (Pulse width less than tCYC/2).
12. All Voltage referenced to Ground.
Document Number: 38-05621 Rev. *D
Page 15 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
TAP AC Switching Characteristics
Over the Operating Range [13, 14]
Parameter
Description
Min
Max
Unit
20
MHz
tTCYC
TCK Clock Cycle Time
tTF
TCK Clock Frequency
tTH
TCK Clock HIGH
20
ns
tTL
TCK Clock LOW
20
ns
tTMSS
TMS Setup to TCK Clock Rise
5
ns
tTDIS
TDI Setup to TCK Clock Rise
5
ns
tCS
Capture Setup to TCK Rise
5
ns
tTMSH
TMS Hold after TCK Clock Rise
5
ns
tTDIH
TDI Hold after Clock Rise
5
ns
tCH
Capture Hold after Clock Rise
5
ns
50
ns
Setup Times
Hold Times
Output Times
tTDOV
TCK Clock LOW to TDO Valid
tTDOX
TCK Clock LOW to TDO Invalid
10
0
ns
ns
TAP Timing and Test Conditions
Figure 2 shows the TAP timing and test conditions. [14]
Figure 2. TAP Timing and Test Conditions
0.9V
ALL INPUT PULSES
1.8V
50Ω
0.9V
TDO
0V
Z0 = 50Ω
(a)
CL = 20 pF
tTH
GND
tTL
Test Clock
TCK
tTCYC
tTMSH
tTMSS
Test Mode Select
TMS
tTDIS
tTDIH
Test Data In
TDI
Test Data Out
TDO
tTDOV
tTDOX
Notes
13. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.
14. Test conditions are specified using the load in TAP AC Test Conditions. tR/tF = 1 ns.
Document Number: 38-05621 Rev. *D
Page 16 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Identification Register Definitions
Instruction Field
Value
CY7C1316BV18
CY7C1916BV18
CY7C1318BV18
CY7C1320BV18
000
000
000
000
Revision Number
(31:29)
Cypress Device ID
(28:12)
Cypress JEDEC ID
(11:1)
Description
Version number.
11010100010000101 11010100010001101 11010100010010101 11010100010100101 Defines the type of
SRAM.
00000110100
00000110100
00000110100
00000110100
1
1
1
1
ID Register
Presence (0)
Allows unique
identification of
SRAM vendor.
Indicates the
presence of an ID
register.
Scan Register Sizes
Register Name
Bit Size
Instruction
3
Bypass
1
ID
32
Boundary Scan
107
Instruction Codes
Instruction
Code
Description
EXTEST
000
Captures the input and output ring contents.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operation.
SAMPLE Z
010
Captures the input and output contents. Places the boundary scan register between TDI and
TDO. Forces all SRAM output drivers to a High-Z state.
RESERVED
011
Do not use: This instruction is reserved for future use.
SAMPLE/PRELOAD
100
Captures the input and output ring contents. Places the boundary scan register between TDI
and TDO. Does not affect the SRAM operation.
RESERVED
101
Do not use: This instruction is reserved for future use.
RESERVED
110
Do not use: This instruction is reserved for future use.
BYPASS
111
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operation.
Document Number: 38-05621 Rev. *D
Page 17 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Boundary Scan Order
Bit #
Bump ID
Bit #
Bump ID
Bit #
Bump ID
Bit #
Bump ID
0
6R
27
11H
54
7B
81
3G
1
6P
28
10G
55
6B
82
2G
2
6N
29
9G
56
6A
83
1J
3
7P
30
11F
57
5B
84
2J
4
7N
31
11G
58
5A
85
3K
5
7R
32
9F
59
4A
86
3J
6
8R
33
10F
60
5C
87
2K
7
8P
34
11E
61
4B
88
1K
8
9R
35
10E
62
3A
89
2L
9
11P
36
10D
63
1H
90
3L
10
10P
37
9E
64
1A
91
1M
11
10N
38
10C
65
2B
92
1L
12
9P
39
11D
66
3B
93
3N
13
10M
40
9C
67
1C
94
3M
14
11N
41
9D
68
1B
95
1N
15
9M
42
11B
69
3D
96
2M
16
9N
43
11C
70
3C
97
3P
17
11L
44
9B
71
1D
98
2N
18
11M
45
10B
72
2C
99
2P
19
9L
46
11A
73
3E
100
1P
20
10L
47
Internal
74
2D
101
3R
21
11K
48
9A
75
2E
102
4R
22
10K
49
8B
76
1E
103
4P
23
9J
50
7C
77
2F
104
5P
24
9K
51
6C
78
3F
105
5N
25
10J
52
8A
79
1G
106
5R
26
11J
53
7A
80
1F
Document Number: 38-05621 Rev. *D
Page 18 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Power Up Sequence in DDR-II SRAM
DDR-II SRAMs must be powered up and initialized in a
predefined manner to prevent undefined operations.
Power Up Sequence
■
Apply power and drive DOFF either HIGH or LOW (all other
inputs can be HIGH or LOW).
❐ Apply VDD before VDDQ.
❐ Apply VDDQ before VREF or at the same time as VREF.
❐ Drive DOFF HIGH.
■
Provide stable DOFF (HIGH), power and clock (K, K) for 1024
cycles to lock the DLL.
DLL Constraints
■
DLL uses K clock as its synchronizing input. The input must
have low phase jitter, which is specified as tKC Var.
■
The DLL functions at frequencies down to 120 MHz.
■
If the input clock is unstable and the DLL is enabled, then the
DLL may lock onto an incorrect frequency, causing unstable
SRAM behavior. To avoid this, provide1024 cycles stable clock
to relock to the desired clock frequency.
~
~
Figure 3. Power Up Waveforms
K
K
~
~
Unstable Clock
> 1024 Stable clock
Start Normal
Operation
Clock Start (Clock Starts after V DD / V DDQ Stable)
VDD / VDDQ
DOFF
Document Number: 38-05621 Rev. *D
V DD / V DDQ Stable (< +/- 0.1V DC per 50ns )
Fix High (or tie to VDDQ)
Page 19 of 31
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CY7C1318BV18, CY7C1320BV18
Maximum Ratings
Current into Outputs (LOW) ........................................ 20 mA
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................. –65°C to +150°C
Static Discharge Voltage (MIL-STD-883, M 3015).... >2001V
Latch up Current..................................................... >200 mA
Operating Range
Ambient Temperature with Power Applied.. –55°C to +125°C
Supply Voltage on VDD Relative to GND ........–0.5V to +2.9V
Ambient
Temperature (TA)
Range
Supply Voltage on VDDQ Relative to GND.......–0.5V to +VDD
Commercial
DC Applied to Outputs in High-Z ......... –0.5V to VDDQ + 0.3V
Industrial
DC Input Voltage
[11]
0°C to +70°C
VDD [15]
VDDQ [15]
1.8 ± 0.1V 1.4V to VDD
–40°C to +85°C
.............................. –0.5V to VDD + 0.3V
Electrical Characteristics
DC Electrical Characteristics
Over the Operating Range [12]
Parameter
VDD
VDDQ
VOH
VOL
VOH(LOW)
VOL(LOW)
VIH
VIL
IX
IOZ
VREF
IDD [19]
Description
Power Supply Voltage
IO Supply Voltage
Output HIGH Voltage
Output LOW Voltage
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Leakage Current
Output Leakage Current
Input Reference Voltage [18]
VDD Operating Supply
Test Conditions
Note 16
Note 17
IOH = −0.1 mA, Nominal Impedance
IOL = 0.1 mA, Nominal Impedance
GND ≤ VI ≤ VDDQ
GND ≤ VI ≤ VDDQ, Output Disabled
Typical Value = 0.75V
VDD = Max,
300 MHz
IOUT = 0 mA,
f = fMAX = 1/tCYC
278 MHz
250 MHz
(x8)
(x9)
(x18)
(x36)
(x8)
(x9)
(x18)
(x36)
(x8)
(x9)
(x18)
(x36)
Min
Typ
Max
Unit
1.7
1.8
1.9
V
1.4
1.5
VDD
V
VDDQ/2 – 0.12
VDDQ/2 + 0.12 V
VDDQ/2 – 0.12
VDDQ/2 + 0.12 V
VDDQ – 0.2
VDDQ
V
VSS
0.2
V
VREF + 0.1
VDDQ + 0.3
V
–0.3
VREF – 0.1
V
−5
5
μA
−5
5
μA
0.68
0.75
0.95
V
815
mA
820
855
930
775
mA
780
805
855
705
mA
710
730
775
Notes
15. Power up: assumes a linear ramp from 0V to VDD(min) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
16. Outputs are impedance controlled. IOH = –(VDDQ/2)/(RQ/5) for values of 175Ω < RQ < 350Ω.
17. Outputs are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175Ω < RQ < 350Ω.
18. VREF(min) = 0.68V or 0.46VDDQ, whichever is larger, VREF(max) = 0.95V or 0.54VDDQ, whichever is smaller.
19. The operation current is calculated with 50% read cycle and 50% write cycle.
Document Number: 38-05621 Rev. *D
Page 20 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Electrical Characteristics
(continued)
DC Electrical Characteristics
Over the Operating Range [12]
Parameter
Description
IDD [19]
VDD Operating Supply
Test Conditions
VDD = Max,
200 MHz
IOUT = 0 mA,
f = fMAX = 1/tCYC
167 MHz
ISB1
Automatic Power Down
Current
Max VDD,
Both Ports Deselected,
VIN ≥ VIH or VIN ≤ VIL
f = fMAX = 1/tCYC,
Inputs Static
300 MHz
278 MHz
250 MHz
200 MHz
167 MHz
(x8)
(x9)
(x18)
(x36)
(x8)
(x9)
(x18)
(x36)
(x8)
Min
Typ
Max
575
580
600
635
490
490
510
540
315
(x9)
(x18)
(x36)
(x8)
(x9)
(x18)
(x36)
(x8)
(x9)
(x18)
(x36)
(x8)
(x9)
(x18)
(x36)
(x8)
(x9)
(x18)
(x36)
315
325
350
305
305
315
330
300
300
300
320
285
285
290
300
280
280
285
295
Unit
mA
mA
mA
mA
mA
mA
mA
AC Electrical Characteristics
Over the Operating Range [11]
Parameter
Description
Test Conditions
Min
Typ
Max
Unit
VIH
Input HIGH Voltage
VREF + 0.2
–
–
V
VIL
Input LOW Voltage
–
–
VREF – 0.2
V
Document Number: 38-05621 Rev. *D
Page 21 of 31
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CY7C1318BV18, CY7C1320BV18
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
Test Conditions
Max
Unit
CIN
Input Capacitance
5
pF
CCLK
Clock Input Capacitance
6
pF
CO
Output Capacitance
7
pF
165 FBGA
Package
Unit
18.7
°C/W
4.5
°C/W
TA = 25°C, f = 1 MHz, VDD = 1.8V, VDDQ = 1.5V
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
ΘJA
Thermal Resistance
(Junction to Ambient)
ΘJC
Thermal Resistance
(Junction to Case)
Test Conditions
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
Figure 4. AC Test Loads and Waveforms
VREF = 0.75V
VREF
0.75V
VREF
OUTPUT
Z0 = 50Ω
Device
Under
Test
RL = 50Ω
VREF = 0.75V
ZQ
R = 50Ω
ALL INPUT PULSES
1.25V
0.75V
OUTPUT
Device
Under
Test ZQ
RQ =
250Ω
(a)
0.75V
INCLUDING
JIG AND
SCOPE
5 pF
[20]
0.25V
Slew Rate = 2 V/ns
RQ =
250Ω
(b)
Note
20. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, VREF = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse
levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.
Document Number: 38-05621 Rev. *D
Page 22 of 31
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CY7C1318BV18, CY7C1320BV18
Switching Characteristics
Over the Operating Range [20, 21]
Cypress Consortium
Parameter Parameter
300 MHz
250 MHz
200 MHz
167 MHz
Unit
Min Max Min Max Min Max Min Max Min Max
VDD(Typical) to the First Access [22]
tPOWER
278 MHz
Description
1
–
1
–
1
–
1
–
1
–
ms
tCYC
tKHKH
K Clock and C Clock Cycle Time
3.30
8.4
3.60
8.4
4.0
8.4
5.0
8.4
6.0
8.4
ns
tKH
tKHKL
Input Clock (K/K and C/C) HIGH
1.32
–
1.4
–
1.6
–
2.0
–
2.4
–
ns
tKL
tKLKH
Input Clock (K/K and C/C) LOW
1.32
–
1.4
–
1.6
–
2.0
–
2.4
–
ns
tKHKH
tKHKH
K Clock Rise to K Clock Rise and C 1.49
to C Rise (rising edge to rising edge)
–
1.6
–
1.8
–
2.2
–
2.7
–
ns
tKHCH
tKHCH
K/K Clock Rise t o C/C Clock Rise
(rising edge to rising edge)
0.00 1.45 0.00 1.55 0.00
1.8
0.00
2.2
0.00
2.7
ns
Setup Times
tSA
tAVKH
Address Setup to K Clock Rise
0.4
–
0.4
–
0.5
–
0.6
–
0.7
–
ns
tSC
tIVKH
Control Setup to K Clock Rise
(LD, R/W)
0.4
–
0.4
–
0.5
–
0.6
–
0.7
–
ns
tSCDDR
tIVKH
Double Data Rate Control Setup to
Clock (K/K) Rise
(BWS0, BWS1, BWS2, BWS3)
0.3
–
0.3
–
0.35
–
0.4
–
0.5
–
ns
tSD [23]
tDVKH
D[X:0] Setup to Clock (K and K) Rise 0.3
–
0.3
–
0.35
–
0.4
–
0.5
–
ns
Hold Times
tHA
tKHAX
Address Hold after K Clock Rise
0.4
–
0.4
–
0.5
–
0.6
–
0.7
–
ns
tHC
tKHIX
Control Hold after K Clock Rise
(LD, R/W)
0.4
–
0.4
–
0.5
–
0.6
–
0.7
–
ns
tHCDDR
tKHIX
Double Data Rate Control Hold after 0.3
Clock (K/K) Rise
(BWS0, BWS1, BWS2, BWS3)
–
0.3
–
0.35
–
0.4
–
0.5
–
ns
tHD
tKHDX
D[X:0] Hold after Clock (K/K) Rise
–
0.3
–
0.35
–
0.4
–
0.5
–
ns
0.3
Notes
21. When a part with a maximum frequency above 167 MHz is operating at a lower clock frequency, it requires the input timings of the frequency range in which it is being
operated and outputs data with the output timings of that frequency range.
22. This part has an internal voltage regulator; tPOWER is the time that the power is supplied above VDD minimum initially before a read or write operation can be initiated.
23. For DQ2 data signal on CY7C1916BV18 device, tSD is 0.5 ns for 200 MHz, 250 MHz, 278 MHz, and 300 MHz frequencies.
Document Number: 38-05621 Rev. *D
Page 23 of 31
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CY7C1318BV18, CY7C1320BV18
Switching Characteristics (continued)
Over the Operating Range [20, 21]
Cypress Consortium
Parameter Parameter
300 MHz
278 MHz
250 MHz
200 MHz
167 MHz
Description
Unit
Min Max Min Max Min Max Min Max Min Max
Output Times
tCO
tCHQV
C/C Clock Rise (or K/K in single
clock mode) to Data Valid
tDOH
tCHQX
Data Output Hold after Output C/C –0.45
Clock Rise (Active to Active)
tCCQO
tCHCQV
C/C Clock Rise to Echo Clock Valid
tCQOH
tCHCQX
Echo Clock Hold after C/C Clock
Rise
tCQD
tCQHQV
Echo Clock High to Data Valid
tCQDOH
tCQHQX
Echo Clock High to Data Invalid
tCHZ
tCHQZ
Clock (C/C) Rise to High-Z
(Active to High-Z) [24, 25]
tCLZ
tCHQX1
Clock (C/C) Rise to Low-Z [24, 25]
–
0.45
–
0.45
–
0.45
–
0.45
–
0.50
ns
–
–0.45
–
–0.45
–
–0.45
–
–0.50
–
ns
–
0.45
–
0.45
–
0.45
–
0.45
–
0.50
ns
–0.45
–
–0.45
–
–0.45
–
–0.45
–
–0.50
–
ns
–
0.27
–
0.27
–
0.30
–
0.35
–
0.40
ns
–0.27
–
–0.27
–
–0.30
–
–0.35
–
–0.40
–
ns
–
0.45
–
0.45
–
0.45
–
0.45
–
0.50
ns
–0.45
–
–0.45
–
–0.45
–
–0.45
–
–0.50
–
ns
–
0.20
–
0.20
–
0.20
–
0.20
–
0.20
ns
DLL Timing
tKC Var
tKC Var
Clock Phase Jitter
tKC lock
tKC lock
DLL Lock Time (K, C)
1024
–
1024
–
1024
–
1024
–
1024
–
Cycles
tKC Reset
tKC Reset
K Static to DLL Reset
30
–
30
–
30
–
30
–
30
–
ns
Notes
24. tCHZ, tCLZ are specified with a load capacitance of 5 pF as in (b) of AC Test Loads and Waveforms on page 22. Transition is measured ±100 mV from steady-state voltage.
25. At any voltage and temperature tCHZ is less than tCLZ and tCHZ less than tCO.
Document Number: 38-05621 Rev. *D
Page 24 of 31
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CY7C1318BV18, CY7C1320BV18
Switching Waveforms
Figure 5. Read/Write/Deselect Sequence [26, 27, 28]
READ
2
NOP
1
READ
3
NOP
4
NOP
5
WRITE
6
WRITE
7
READ
8
A3
A4
9
10
K
tKH
tKL
tKHKH
tCYC
K
LD
tSC tHC
R/W
A
A0
tSA
A2
A1
tHD
tHA
tHD
tSD
DQ
Q00
t KHCH
t CLZ
Q01
Q10
Q11
tSD
D20
D21
D30
D31
Q40
Q41
t CQDOH
t CHZ
tDOH
tCO
t CQD
C
t KHCH
tKH
tKL
tCYC
tKHKH
C#
tCQOH
tCCQO
CQ
tCQOH
tCCQO
CQ#
DON’T CARE
UNDEFINED
Notes
26. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, that is, A0 + 1.
27. Outputs are disabled (High-Z) one clock cycle after a NOP.
28. In this example, if address A4 = A3, then data Q40 = D30 and Q41 = D31. Write data is forwarded immediately as read results. This note applies to the whole diagram.
Document Number: 38-05621 Rev. *D
Page 25 of 31
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CY7C1318BV18, CY7C1320BV18
Ordering Information
Not all of the speed, package, and temperature ranges are available. Please contact your local sales representative or
visit www.cypress.com for actual products offered.
Speed
(MHz)
300
Ordering Code
CY7C1316BV18-300BZC
Package
Diagram
Package Type
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Operating
Range
Commercial
CY7C1916BV18-300BZC
CY7C1318BV18-300BZC
CY7C1320BV18-300BZC
CY7C1316BV18-300BZXC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1916BV18-300BZXC
CY7C1318BV18-300BZXC
CY7C1320BV18-300BZXC
CY7C1316BV18-300BZI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
CY7C1916BV18-300BZI
CY7C1318BV18-300BZI
CY7C1320BV18-300BZI
CY7C1316BV18-300BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1916BV18-300BZXI
CY7C1318BV18-300BZXI
CY7C1320BV18-300BZXI
278
CY7C1316BV18-278BZC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Commercial
CY7C1916BV18-278BZC
CY7C1318BV18-278BZC
CY7C1320BV18-278BZC
CY7C1316BV18-278BZXC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1916BV18-278BZXC
CY7C1318BV18-278BZXC
CY7C1320BV18-278BZXC
CY7C1316BV18-278BZI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
CY7C1916BV18-278BZI
CY7C1318BV18-278BZI
CY7C1320BV18-278BZI
CY7C1316BV18-278BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1916BV18-278BZXI
CY7C1318BV18-278BZXI
CY7C1320BV18-278BZXI
Document Number: 38-05621 Rev. *D
Page 26 of 31
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CY7C1318BV18, CY7C1320BV18
Ordering Information
(continued)
Not all of the speed, package, and temperature ranges are available. Please contact your local sales representative or
visit www.cypress.com for actual products offered.
Speed
(MHz)
250
Ordering Code
CY7C1316BV18-250BZC
Package
Diagram
Package Type
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Operating
Range
Commercial
CY7C1916BV18-250BZC
CY7C1318BV18-250BZC
CY7C1320BV18-250BZC
CY7C1316BV18-250BZXC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1916BV18-250BZXC
CY7C1318BV18-250BZXC
CY7C1320BV18-250BZXC
CY7C1316BV18-250BZI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
CY7C1916BV18-250BZI
CY7C1318BV18-250BZI
CY7C1320BV18-250BZI
CY7C1316BV18-250BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1916BV18-250BZXI
CY7C1318BV18-250BZXI
CY7C1320BV18-250BZXI
200
CY7C1316BV18-200BZC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Commercial
CY7C1916BV18-200BZC
CY7C1318BV18-200BZC
CY7C1320BV18-200BZC
CY7C1316BV18-200BZXC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1916BV18-200BZXC
CY7C1318BV18-200BZXC
CY7C1320BV18-200BZXC
CY7C1316BV18-200BZI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
CY7C1916BV18-200BZI
CY7C1318BV18-200BZI
CY7C1320BV18-200BZI
CY7C1316BV18-200BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1916BV18-200BZXI
CY7C1318BV18-200BZXI
CY7C1320BV18-200BZXI
Document Number: 38-05621 Rev. *D
Page 27 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Ordering Information
(continued)
Not all of the speed, package, and temperature ranges are available. Please contact your local sales representative or
visit www.cypress.com for actual products offered.
Speed
(MHz)
167
Ordering Code
CY7C1316BV18-167BZC
Package
Diagram
Package Type
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Operating
Range
Commercial
CY7C1916BV18-167BZC
CY7C1318BV18-167BZC
CY7C1320BV18-167BZC
CY7C1316BV18-167BZXC
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1916BV18-167BZXC
CY7C1318BV18-167BZXC
CY7C1320BV18-167BZXC
CY7C1316BV18-167BZI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Industrial
CY7C1916BV18-167BZI
CY7C1318BV18-167BZI
CY7C1320BV18-167BZI
CY7C1316BV18-167BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
CY7C1916BV18-167BZXI
CY7C1318BV18-167BZXI
CY7C1320BV18-167BZXI
Document Number: 38-05621 Rev. *D
Page 28 of 31
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CY7C1316BV18, CY7C1916BV18
CY7C1318BV18, CY7C1320BV18
Package Diagram
Figure 6. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180
BOTTOM VIEW
PIN 1 CORNER
TOP VIEW
Ø0.05 M C
Ø0.25 M C A B
PIN 1 CORNER
Ø0.50 -0.06
(165X)
+0.14
1
2
3
4
5
6
7
8
9
10
11
11
9
8
7
6
5
4
3
2
1
A
B
B
C
C
1.00
A
D
D
E
F
F
G
G
H
J
14.00
E
15.00±0.10
15.00±0.10
10
H
J
K
L
L
7.00
K
M
M
N
N
P
P
R
R
A
A
1.00
5.00
10.00
B
B
13.00±0.10
13.00±0.10
1.40 MAX.
0.15 C
0.53±0.05
0.25 C
0.15(4X)
NOTES :
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
0.35±0.06
0.36
SEATING PLANE
C
Document Number: 38-05621 Rev. *D
51-85180-*A
Page 29 of 31
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CY7C1318BV18, CY7C1320BV18
Document History Page
Document Title: CY7C1316BV18/CY7C1916BV18/CY7C1318BV18/CY7C1320BV18, 18-Mbit DDR-II SRAM 2-Word Burst Architecture
Document Number: 38-05621
Rev. ECN No.
Submission
Date
Orig, of
Change
Description of Change
**
252474
See ECN
SYT
New data sheet
*A
325581
See ECN
SYT
Removed CY7C1320BV18 from the title
Included 300-MHz Speed Bin
Added Industrial Temperature Grade
Replaced TBDs for IDD and ISB1 specs
Replaced the TBDs on the Thermal Characteristics Table to ΘJA = 28.51°C/W and
ΘJC = 5.91°C/W
Replaced TBDs in the Capacitance Table for the 165 FBGA Package
Changed the package diagram from BB165E (15 x 17 x 1.4 mm) to BB165D
(13 x 15 x 1.4 mm)
Added Lead-Free Product Information
Updated the Ordering Information by Shading and Unshading MPNs as per availability
*B
413997
See ECN
NXR
Converted from Preliminary to Final
Added CY7C1916BV18 part number to the title
Added 278-MHz speed Bin
Changed address of Cypress Semiconductor Corporation on Page# 1 from “3901
North First Street” to “198 Champion Court”
Changed C/C Pin Description in the features section and Pin Description
Added power-up sequence details and waveforms
Added foot notes #15, 16, 17 on page# 19
Replaced Three-state with Tri-state
Changed the description of IX from Input Load Current to Input Leakage Current on
page# 20
Modified the IDD and ISB values
Modified test condition in Footnote #18 on page# 20 from VDDQ < VDD to
VDDQ < VDD
Replaced Package Name column with Package Diagram in the Ordering
Information table
Updated Ordering Information Table
*C
472384
See ECN
NXR
Modified the ZQ Definition from Alternately, this pin can be connected directly to VDD
to Alternately, this pin can be connected directly to VDDQ
Included Maximum Ratings for Supply Voltage on VDDQ Relative to GND
Changed the Maximum Ratings for DC Input Voltage from VDDQ to VDD
Changed tTH and tTL from 40 ns to 20 ns, changed tTMSS, tTDIS, tCS, tTMSH, tTDIH, tCH
from 10 ns to 5 ns and changed tTDOV from 20 ns to 10 ns in TAP AC Switching
Characteristics table
Modified Power-Up waveform
Changed the Maximum rating of Ambient Temperature with Power Applied from
–10°C to +85°C to –55°C to +125°C
Added additional notes in the AC parameter section
Modified AC Switching Waveform
Corrected the typo In the AC Switching Characteristics Table
Updated the Ordering Information Table
Document Number: 38-05621 Rev. *D
Page 30 of 31
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CY7C1318BV18, CY7C1320BV18
Document History Page
Document Title: CY7C1316BV18/CY7C1916BV18/CY7C1318BV18/CY7C1320BV18, 18-Mbit DDR-II SRAM 2-Word Burst Architecture
Document Number: 38-05621
*D
2511674
06/03/08
VKN/PYRS
Updated Logic Block diagrams
Updated IDD/ISB specs
Added footnote# 19 related to IDD
Updated power up sequence waveform and its description
Changed DLL minimum operating frequency from 80 MHz to 120 MHz
Changed ΘJA spec from 28.51 to 18.7
Changed ΘJC spec from 5.91 to 4.5
Changed tCYC maximum spec to 8.4 ns for all speed bins
Modified footnotes 21 and 28
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at cypress.com/sales.
Products
PSoC
Clocks & Buffers
PSoC Solutions
psoc.cypress.com
clocks.cypress.com
General
Low Power/Low Voltage
psoc.cypress.com/solutions
psoc.cypress.com/low-power
Wireless
wireless.cypress.com
Precision Analog
Memories
memory.cypress.com
LCD Drive
psoc.cypress.com/lcd-drive
image.cypress.com
CAN 2.0b
psoc.cypress.com/can
USB
psoc.cypress.com/usb
Image Sensors
psoc.cypress.com/precision-analog
© Cypress Semiconductor Corporation, 2004-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used
for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use
as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 38-05621 Rev. *D
Revised June 2, 2008
Page 31 of 31
DDR RAMs and QDR RAMs comprise a new family of products developed by Cypress, Hitachi, IDT, Micron, NEC, and Samsung. All product and company names mentioned in this document are the
trademarks of their respective holders.
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