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CY7C1318CV18-278BZXC

CY7C1318CV18-278BZXC

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    FBGA165_15X17MM

  • 描述:

    IC SRAM 18MBIT PARALLEL 165FBGA

  • 数据手册
  • 价格&库存
CY7C1318CV18-278BZXC 数据手册
CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY 18-Mbit DDR-II SRAM 2-Word Burst Architecture Features Functional Description • 18-Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36) • 300-MHz clock for high bandwidth • 2-Word burst for reducing address bus frequency • Double Data Rate (DDR) interfaces (data transferred at 600 MHz) @ 300 MHz • Two input clocks (K and K) for precise DDR timing — SRAM uses rising edges only • Two input clocks for output data (C and C) to minimize clock-skew and flight-time mismatches • Echo clocks (CQ and CQ) simplify data capture in high-speed systems • Synchronous internally self-timed writes • DDR-II operates with 1.5 cycle read latency when the DLL is enabled • Operates like a DDR-I device with 1 cycle read latency in DLL off mode • 1.8V core power supply with HSTL inputs and outputs • Variable drive HSTL output buffers • Expanded HSTL output voltage (1.4V–VDD) • Available in 165-ball FBGA package (13 x 15 x 1.4 mm) • Offered in both lead-free and non lead-free packages The CY7C1316CV18, CY7C1916CV18, CY7C1318CV18 and CY7C1320CV18 are 1.8V Synchronous Pipelined SRAM equipped with DDR-II architecture. The DDR-II consists of an SRAM core with advanced synchronous peripheral circuitry and a 1-bit burst counter. Addresses for Read and Write are latched on alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K and K. Read data is driven on the rising edges of C and C if provided, or on the rising edge of K and K if C/C are not provided. Each address location is associated with two 8-bit words in the case of CY7C1316CV18 and two 9-bit words in the case of CY7C1916CV18 that burst sequentially into or out of the device. The burst counter always starts with a “0” internally in the case of CY7C1316CV18 and CY7C1916CV18. On CY7C1318CV18 and CY7C1320CV18, the burst counter takes in the least significant bit of the external address and bursts two 18-bit words in the case of CY7C1318CV18 and two 36-bit words in the case of CY7C1320CV18 sequentially into or out of the device. Asynchronous inputs include output impedance matching input (ZQ). Synchronous data outputs (Q, sharing the same physical pins as the data inputs D) are tightly matched to the two output echo clocks CQ/CQ, eliminating the need for separately capturing data from each individual DDR SRAM in the system design. Output data clocks (C/C) enable maximum system clocking and data synchronization flexibility. All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry. • JTAG 1149.1-compatible test access port • Delay Lock Loop (DLL) for accurate data placement Configurations CY7C1316CV18 – 2M x 8 CY7C1916CV18 – 2M x 9 CY7C1318CV18 – 1M x 18 CY7C1320CV18 – 512K x 36 Selection Guide 300 MHz 278 MHz 250 MHz 200 MHz 167 MHz Unit Maximum Operating Frequency 300 278 250 200 167 MHz Maximum Operating Current 600 580 550 500 450 mA Cypress Semiconductor Corporation Document Number: 001-07160 Rev. *B • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised September 20, 2006 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY K K CLK Gen. DOFF Write Reg Read Add. Decode LD Write Reg 1M x 8 Array 20 Address Register 1M x 8 Array A(19:0) Write Add. Decode Logic Block Diagram (CY7C1316CV18) 8 Output Logic Control R/W C C Read Data Reg. 16 VREF R/W NWS[1:0] CQ 8 Reg. Control Logic 8 Reg. CQ 8 Reg. DQ[7:0] 8 LD K K DOFF CLK Gen. Read Add. Decode Address Register Write Reg 1M x 9 Array 20 Write Reg 1M x 9 Array A(19:0) Write Add. Decode Logic Block Diagram (CY7C1916CV18) 9 Output Logic Control R/W C C Read Data Reg. VREF R/W BWS[0] 18 Control Logic CQ 9 Reg. 9 Reg. 9 Reg. CQ DQ[8:0] 9 Document Number: 001-07160 Rev. *B Page 2 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Logic Block Diagram (CY7C1318CV18) Burst A0 Write Reg Write Add. Decode Address A(19:1) Register LD K K CLK Gen. DOFF Write Reg Read Add. Decode 19 20 A(19:0) Logic 1M x 18 Array 18 Output Logic Control R/W C C Read Data Reg. CQ 36 VREF R/W BWS[1:0] 18 CQ Reg. Control Logic 18 Reg. Reg. 18 DQ[17:0] 18 Logic Block Diagram (CY7C1320CV18) Burst Logic Write Reg Address A(18:1) Register LD K K DOFF CLK Gen. Write Add. Decode 18 19 A(18:0) Write Reg Read Add. Decode A0 512K x 36 Array 36 R/W Output Logic Control C C Read Data Reg. VREF R/W BWS[3:0] 72 Control Logic CQ 36 Reg. 36 Reg. 36 Reg. CQ 36 DQ[35:0] 36 Document Number: 001-07160 Rev. *B Page 3 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Pin Configurations 165-ball FBGA (13 x 15 x 1.4 mm) Pinout CY7C1316CV18 (2M x 8) A B C D E F G H J K L M N P R 1 2 3 CQ NC NC/72M A 4 5 NC NC R/W A NC NC NC NC NC NC VSS VSS NC NC DQ4 VDDQ NC NC NC VDDQ NC DOFF NC NC VREF NC DQ5 VDDQ NC VDDQ VDDQ VDDQ NC NC NC NC DQ6 NC NC 6 7 NWS1 NC/288M K K NC/144M A VSS 8 9 10 11 LD A A NC/36M CQ NC NC DQ3 A VSS NWS0 A VSS VSS VSS NC NC NC NC NC NC VSS VSS VSS VDDQ NC NC DQ2 VDD VSS VDD VDDQ NC NC NC VDD VDD VDD VSS VSS VSS VDD VDD VDD VDDQ VDDQ VDDQ NC VDDQ NC NC VREF DQ1 NC ZQ NC VDDQ VDD VSS VDD VDDQ NC NC NC NC VDDQ VSS VSS VSS VDDQ NC NC DQ0 NC NC NC NC VSS VSS VSS A VSS A VSS A VSS VSS NC NC NC NC NC NC NC NC DQ7 A A C A A NC NC NC TDO TCK A A A C A A A TMS TDI 6 7 8 9 10 11 CY7C1916CV18 (2M x 9) A B C D E F G H J K L M N P R 1 2 3 4 CQ NC NC/72M A R/W NC K NC/144M LD A NC/36M CQ NC NC A NC/288M K BWS0 A NC NC DQ3 NC NC NC NC NC NC VSS VSS A VSS A VSS A VSS VSS VSS NC NC NC NC NC NC NC NC DQ4 VDDQ VSS VSS VSS VDDQ NC NC DQ2 NC NC DOFF NC 5 NC NC VDDQ VDD VSS VDD VDDQ NC DQ5 VDDQ NC VDDQ VDDQ VDDQ VDD VDD VDD VSS VSS VSS VDD VDD VDD VDDQ VDDQ VDDQ NC NC VDDQ NC NC NC VREF NC NC VREF DQ1 NC ZQ NC NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC NC DQ6 NC VDDQ VSS VSS VSS VDDQ NC NC DQ0 NC NC NC NC NC NC VSS VSS VSS A VSS A VSS A VSS VSS NC NC NC NC NC NC NC NC DQ7 A A C A A NC NC DQ8 TDO TCK A A A C A A A TMS TDI Document Number: 001-07160 Rev. *B Page 4 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Pin Configurations (continued) 165-ball FBGA (13 x 15 x 1.4 mm) Pinout CY7C1318CV18 (1M x 18) A B C D E F G H J K L M N P R 1 2 3 4 5 6 7 8 9 10 11 CQ NC NC/72M A NC/144M NC/36M CQ K NC NC DQ8 NC NC NC NC NC A VSS A0 VSS VSS VSS NC DQ10 VSS VSS BWS0 A VSS LD A A NC BWS1 NC/288M K DQ9 R/W A NC DQ7 NC NC NC NC NC DQ11 VDDQ VSS VSS VSS VDDQ NC NC DQ6 NC DQ12 NC VDDQ VDD VSS VDD VDDQ NC NC DQ5 NC NC VREF NC DQ13 VDDQ NC VDDQ VDDQ VDDQ VDD VDD VDD VSS VSS VSS VDD VDD VDD VDDQ VDDQ VDDQ NC VDDQ NC NC VREF DQ4 NC ZQ NC NC NC DQ14 VDDQ VDD VSS VDD VDDQ NC NC DQ3 NC DQ15 NC VDDQ VSS VSS VSS VDDQ NC NC DQ2 NC NC NC NC NC DQ16 VSS VSS VSS A VSS A VSS A VSS VSS NC NC DQ1 NC NC NC NC NC DQ17 A A C A A NC NC DQ0 TDO TCK A A A C A A A TMS TDI 11 DOFF NC CY7C1320CV18 (512K x 36) 1 A B C D E F G H J K L M N P R 2 3 NC/144M NC/36M 4 5 6 7 8 9 10 BWS2 K LD A A NC/72M CQ K NC NC DQ8 VSS VSS NC NC DQ17 NC DQ7 DQ16 DQ27 DQ18 R/W A NC NC NC DQ29 DQ28 DQ19 VSS VSS BWS3 A VSS A0 VSS BWS1 BWS0 A VSS NC NC DQ20 VDDQ VSS VSS VSS VDDQ NC DQ15 DQ6 NC NC DQ30 DQ21 VDDQ VSS VSS VSS VDDQ VDDQ VDDQ NC NC VDDQ NC NC VDDQ VDDQ VDDQ VDD VDD VDD VDD VDDQ DQ22 VDDQ DQ32 VDD VDD VDD VDD VSS DQ31 VREF NC NC VREF DQ13 DQ5 DQ14 ZQ DQ4 CQ NC DOFF NC NC NC DQ23 VDDQ VDD VSS VDD VDDQ NC DQ12 DQ3 NC DQ33 DQ24 VDDQ VSS VSS VSS VDDQ NC NC DQ2 NC NC NC DQ35 DQ34 DQ25 VSS VSS VSS A VSS A VSS A VSS VSS NC NC DQ11 NC DQ1 DQ10 NC NC DQ26 A A C A A NC DQ9 DQ0 TDO TCK A A A C A A A TMS TDI Document Number: 001-07160 Rev. *B Page 5 of 28 PRELIMINARY CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 Pin Definitions Pin Name I/O Pin Description DQ[x:0] Input/Output- Data Input/Output signals. Inputs are sampled on the rising edge of K and K clocks during valid Synchronous Write operations. These pins drive out the requested data during a Read operation. Valid data is driven out on the rising edge of both the C and C clocks during Read operations or K and K when in single clock mode. When read access is deselected, Q[x:0] are automatically tri-stated. CY7C1316CV18 − DQ[7:0] CY7C1916CV18 − DQ[8:0] CY7C1318CV18 − DQ[17:0] CY7C1320CV18 − DQ[35:0] LD InputSynchronous Load. This input is brought LOW when a bus cycle sequence is to be defined. Synchronous This definition includes address and Read/Write direction. All transactions operate on a burst of 2 data. NWS0, NWS1 InputNibble Write Select 0, 1 − active LOW (CY7C1316CV18 only). Sampled on the rising edge of Synchronous the K and K clocks during Write operations. Used to select which nibble is written into the device during the current portion of the Write operations. Nibbles not written remain unaltered. NWS0 controls D[3:0] and NWS1 controls D[7:4]. All the Nibble Write Selects are sampled on the same edge as the data. Deselecting a Nibble Write Select will cause the corresponding nibble of data to be ignored and not written into the device. BWS0, BWS1, InputByte Write Select 0, 1, 2, and 3 − active LOW. Sampled on the rising edge of the K and K clocks BWS2, BWS3 Synchronous during Write operations. Used to select which byte is written into the device during the current portion of the Write operations. Bytes not written remain unaltered. CY7C1916CV18 − BWS0 controls D[8:0] CY7C1318CV18 − BWS0 controls D[8:0] and BWS1 controls D[17:9]. CY7C1320CV18 − BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18] and BWS3 controls D[35:27]. All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte Write Select will cause the corresponding byte of data to be ignored and not written into the device. A, A0 InputAddress Inputs. These address inputs are multiplexed for both Read and Write operations. Synchronous Internally, the device is organized as 2M x 8 (2 arrays each of 1M x 8) for CY7C1316CV18 and 2M x 9 (2 arrays each of 1M x 9) for CY7C1916CV18, a single 1M x 18 array for CY7C1318CV18, and a single array of 512K x 36 for CY7C1320CV18. CY7C1316CV18 – Since the least significant bit of the address internally is a “0,” only 20 external address inputs are needed to access the entire memory array. CY7C1916CV18 – Since the least significant bit of the address internally is a “0,” only 20 external address inputs are needed to access the entire memory array. CY7C1318CV18 – A0 is the input to the burst counter. These are incremented in a linear fashion internally. 20 address inputs are needed to access the entire memory array. CY7C1320CV18 – A0 is the input to the burst counter. These are incremented in a linear fashion internally. 19 address inputs are needed to access the entire memory array. All the address inputs are ignored when the appropriate port is deselected. R/W InputSynchronous Read/Write Input. When LD is LOW, this input designates the access type (Read Synchronous when R/W is HIGH, Write when R/W is LOW) for loaded address. R/W must meet the set-up and hold times around edge of K. C InputClock Positive Input Clock for Output Data. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board back to the controller. See application example for further details. C InputClock Negative Input Clock for Output Data. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board back to the controller. See application example for further details. K InputClock Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the device and to drive out data through Q[x:0] when in single clock mode. All accesses are initiated on the rising edge of K. K InputClock Negative Input Clock Input. K is used to capture synchronous data being presented to the device and to drive out data through Q[x:0] when in single clock mode. Document Number: 001-07160 Rev. *B Page 6 of 28 PRELIMINARY CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 Pin Definitions (continued) Pin Name I/O Pin Description CQ Output-Clock CQ is referenced with respect to C. This is a free running clock and is synchronized to the input clock for output data (C) of the DDR-II. In the single clock mode, CQ is generated with respect to K. The timings for the echo clocks are shown in the AC Timing table. CQ Output-Clock CQ is referenced with respect to C. This is a free running clock and is synchronized to the input clock for output data (C) of the DDR-II. In the single clock mode, CQ is generated with respect to K. The timings for the echo clocks are shown in the AC Timing table. ZQ Input Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor connected between ZQ and ground. Alternatively, this pin can be connected directly to VDDQ, which enables the minimum impedance mode. This pin cannot be connected directly to GND or left unconnected. DOFF Input DLL Turn Off - Active LOW. Connecting this pin to ground will turn off the DLL inside the device. The timings in the DLL turned off operation will be different from those listed in this data sheet. For normal operation, this pin can be connected to a pull-up through a 10-Kohm or less pull-up resistor. The device will behave in DDR-I mode when the DLL is turned off. In this mode, the device can be operated at a frequency of up to 167 MHz with DDR-I timing. TDO Output TDO for JTAG. TCK Input TCK pin for JTAG. TDI Input TDI pin for JTAG. TMS Input TMS pin for JTAG. NC N/A Not connected to the die. Can be tied to any voltage level. NC/36M N/A Not connected to the die. Can be tied to any voltage level. NC/72M N/A Not connected to the die. Can be tied to any voltage level. NC/144M N/A Not connected to the die. Can be tied to any voltage level. NC/288M N/A Not connected to the die. Can be tied to any voltage level. VREF VDD VSS VDDQ InputReference Reference Voltage Input. Static input used to set the reference level for HSTL inputs and Outputs as well as AC measurement points. Power Supply Power supply inputs to the core of the device. Ground Ground for the device. Power Supply Power supply inputs for the outputs of the device. Functional Overview The CY7C1316CV18, CY7C1916CV18, CY7C1318CV18, and CY7C1320CV18 are synchronous pipelined Burst SRAMs equipped with a DDR interface which operates with a read latency of one and half cycles when DOFF pin is tied HIGH. When DOFF pin is set LOW or connected to VSS the device will behave in DDR-I mode with a read latency of one clock cycle. Accesses are initiated on the rising edge of the positive input clock (K). All synchronous input timing is referenced from the rising edge of the input clocks (K and K) and all output timing is referenced to the rising edge of the output clocks (C/C or K/K when in single clock mode). All synchronous data inputs (D[x:0]) pass through input registers controlled by the rising edge of the input clocks (K and K). All synchronous data outputs (Q[x:0]) pass through output registers controlled by the rising edge of the output clocks (C/C or K/K when in single-clock mode). Document Number: 001-07160 Rev. *B All synchronous control (R/W, LD, BWS[0:X]) inputs pass through input registers controlled by the rising edge of the input clock (K). CY7C1318CV18 is described in the following sections. The same basic descriptions apply to CY7C1316CV18, CY7C1916CV18, and CY7C1320CV18. Read Operations The CY7C1318CV18 is organized internally as a single array of 1M x 18. Accesses are completed in a burst of two sequential 18-bit data words. Read operations are initiated by asserting R/W HIGH and LD LOW at the rising edge of the positive input clock (K). The address presented to Address inputs is stored in the Read address register and the least significant bit of the address is presented to the burst counter. The burst counter increments the address in a linear fashion. Following the next K clock rise the corresponding 18-bit word of data from this address location is driven onto the Q[17:0] using C as the output timing reference. On the subsequent rising edge of C the next 18-bit data word from the address location generated by the burst counter is driven onto the Q[17:0]. The requested data will be valid 0.45 ns from the rising Page 7 of 28 PRELIMINARY CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 edge of the output clock (C or C, or K and K when in single clock mode, 200-MHz and 250-MHz device). In order to maintain the internal logic, each read access must be allowed to complete. Read accesses can be initiated on every rising edge of the positive input clock (K). and double data rate mode of operation. The CY7C1318CV18 requires a single No Operation (NOP) cycle when transitioning from a Read to a Write cycle. At higher frequencies, some applications may require a second NOP cycle to avoid contention. When Read access is deselected, the CY7C1318CV18 will first complete the pending Read transactions. Synchronous internal circuitry will automatically tri-state the outputs following the next rising edge of the positive output clock (C). This will allow for a seamless transition between devices without the insertion of wait states in a depth expanded memory. If a Read occurs after a Write cycle, address and data for the Write are stored in registers. The Write information must be stored because the SRAM cannot perform the last word Write to the array without conflicting with the Read. The data stays in this register until the next Write cycle occurs. On the first Write cycle after the Read(s), the stored data from the earlier Write will be written into the SRAM array. This is called a Posted Write. Write Operations Write operations are initiated by asserting R/W LOW and LD LOW at the rising edge of the positive input clock (K). The address presented to Address inputs is stored in the Write address register and the least significant bit of the address is presented to the burst counter. The burst counter increments the address in a linear fashion. On the following K clock rise the data presented to D[17:0] is latched and stored into the 18-bit Write Data register provided BWS[1:0] are both asserted active. On the subsequent rising edge of the Negative Input Clock (K) the information presented to D[17:0] is also stored into the Write Data register provided BWS[1:0] are both asserted active. The 36 bits of data are then written into the memory array at the specified location. Write accesses can be initiated on every rising edge of the positive input clock (K). Doing so will pipeline the data flow such that 18 bits of data can be transferred into the device on every rising edge of the input clocks (K and K). When Write access is deselected, the device will ignore all inputs after the pending Write operations have been completed. Byte Write Operations Byte Write operations are supported by the CY7C1318CV18. A Write operation is initiated as described in the Write Operations section above. The bytes that are written are determined by BWS0 and BWS1 which are sampled with each set of 18-bit data word. Asserting the appropriate Byte Write Select input during the data portion of a Write will allow the data being presented to be latched and written into the device. Deasserting the Byte Write Select input during the data portion of a write will allow the data stored in the device for that byte to remain unaltered. This feature can be used to simplify Read/Modify/Write operations to a Byte Write operation. Single Clock Mode The CY7C1318CV18 can be used with a single clock that controls both the input and output registers. In this mode the device will recognize only a single pair of input clocks (K and K) that control both the input and output registers. This operation is identical to the operation if the device had zero skew between the K/K and C/C clocks. All timing parameters remain the same in this mode. To use this mode of operation, the user must tie C and C HIGH at power-on. This function is a strap option and not alterable during device operation. DDR Operation If a Read is performed on the same address on which a Write is performed in the previous cycle, the SRAM reads out the most current data. The SRAM does this by bypassing the memory array and reading the data from the registers. Depth Expansion Depth expansion requires replicating the LD control signal for each bank. All other control signals can be common between banks as appropriate. Programmable Impedance An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to allow the SRAM to adjust its output driver impedance. The value of RQ must be 5x the value of the intended line impedance driven by the SRAM, The allowable range of RQ to guarantee impedance matching with a tolerance of ±15% is between 175Ω and 350Ω, with VDDQ = 1.5V. The output impedance is adjusted every 1024 cycles upon power-up to account for drifts in supply voltage and temperature. Echo Clocks Echo clocks are provided on the DDR-II to simplify data capture on high-speed systems. Two echo clocks are generated by the DDR-II. CQ is referenced with respect to C and CQ is referenced with respect to C. These are free-running clocks and are synchronized to the output clock of the DDR-II. In the single clock mode, CQ is generated with respect to K and CQ is generated with respect to K. The timings for the echo clocks are shown in the AC Timing table. DLL These chips utilize a Delay Lock Loop (DLL) that is designed to function between 80 MHz and the specified maximum clock frequency. During power-up, when the DOFF is tied HIGH, the DLL gets locked after 1024 cycles of stable clock. The DLL can also be reset by slowing or stopping the input clock K and K for a minimum of 30 ns. However, it is not necessary for the DLL to be specifically reset in order to lock the DLL to the desired frequency. The DLL will automatically lock 1024 clock cycles after a stable clock is presented. The DLL may be disabled by applying ground to the DOFF pin. When the DLL is turned off, the device will behave in DDR-I mode (with one cycle latency and a longer access time). For information refer to the application note “DLL Considerations in QDRII™/DDRII”. The CY7C1318CV18 enables high-performance operation through high clock frequencies (achieved through pipelining) Document Number: 001-07160 Rev. *B Page 8 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Application Example[1] DQ A DQ Addresses Cycle Start# R/W# Return CLK Source CLK Return CLK# Source CLK# Echo Clock1/Echo Clock#1 Echo Clock2/Echo Clock#2 BUS MASTER (CPU or ASIC) ZQ CQ/CQ# LD# R/W# C C# K K# SRAM#1 DQ A R = 250ohms ZQ CQ/CQ# LD# R/W# C C# K K# SRAM#2 R = 250ohms Vterm = 0.75V R = 50ohms Vterm = 0.75V Truth Table[2, 3, 4, 5, 6, 7] K LD R/W Write Cycle: Load address; wait one cycle; input write data on consecutive K and K rising edges. Operation L-H L L D(A1) at K(t + 1) ↑ D(A2) at K(t + 1) ↑ Read Cycle: Load address; wait one and a half cycle; read data on consecutive C and C rising edges. L-H L H Q(A1) at C(t + 1)↑ Q(A2) at C(t + 2) ↑ NOP: No Operation L-H H X High-Z High-Z Stopped X X Previous State Previous State Standby: Clock Stopped DQ DQ Burst Address Table (CY7C1318CV18, CY7C1320CV18) First Address (External) Second Address (Internal) X..X0 X..X1 X..X1 X..X0 Notes: 1. The above application shows two DDR-II used. 2. X = “Don’t Care,” H = Logic HIGH, L = Logic LOW, ↑ represents rising edge. 3. Device will power-up deselected and the outputs in a tri-state condition. 4. On CY7C1318CV18 and CY7C1320CV18, “A1” represents address location latched by the devices when transaction was initiated and A2 represents the addresses sequence in the burst. On CY7C1316CV18, “A1” represents A + ‘0’ and A2 represents A + ‘1’. 5. “t” represents the cycle at which a Read/Write operation is started. t + 1 and t + 2 are the first and second clock cycles succeeding the “t” clock cycle. 6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode. 7. It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging symmetrically. Document Number: 001-07160 Rev. *B Page 9 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Write Cycle Descriptions (CY7C1316CV18 and CY7C1318CV18) [2, 8] BWS0,NWS0 BWS1,NWS1 K K – L L L-H L L – L H L-H L H – H L L-H H L – H H L-H H H – Comments During the Data portion of a Write sequence: CY7C1316CV18 − both nibbles (D[7:0]) are written into the device, CY7C1318CV18 − both bytes (D[17:0]) are written into the device. L-H During the Data portion of a Write sequence: CY7C1316CV18 − both nibbles (D[7:0]) are written into the device, CY7C1318CV18 − both bytes (D[17:0]) are written into the device. – During the Data portion of a Write sequence: CY7C1316CV18 − only the lower nibble (D[3:0]) is written into the device. D[7:4] will remain unaltered, CY7C1318CV18 − only the lower byte (D[8:0]) is written into the device. D[17:9] will remain unaltered. L-H During the Data portion of a Write sequence: CY7C1316CV18 − only the lower nibble (D[3:0]) is written into the device. D[7:4] will remain unaltered, CY7C1318CV18 − only the lower byte (D[8:0]) is written into the device. D[17:9] will remain unaltered. – During the Data portion of a Write sequence: CY7C1316CV18 − only the upper nibble (D[7:4]) is written into the device. D[3:0] will remain unaltered, CY7C1318CV18 − only the upper byte (D[17:9]) is written into the device. D[8:0] will remain unaltered. L-H During the Data portion of a Write sequence: CY7C1316CV18 − only the upper nibble (D[7:4]) is written into the device. D[3:0] will remain unaltered, CY7C1318CV18 − only the upper byte (D[17:9]) is written into the device. D[8:0] will remain unaltered. – No data is written into the devices during this portion of a Write operation. L-H No data is written into the devices during this portion of a Write operation. Note: 8. Assumes a Write cycle was initiated per the Write Port Cycle Description Truth Table. NWS0, NWS1, BWS0, BWS1, BWS2, and BWS3 can be altered on different portions of a Write cycle, as long as the set-up and hold requirements are achieved. Document Number: 001-07160 Rev. *B Page 10 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Write Cycle Descriptions (CY7C1320CV18) [2, 8] BWS0 BWS1 BWS2 BWS2 K K Comments L L L L L-H – During the Data portion of a Write sequence, all four bytes (D[35:0]) are written into the device. L L L L – L-H During the Data portion of a Write sequence, all four bytes (D[35:0]) are written into the device. L H H H L-H – During the Data portion of a Write sequence, only the lower byte (D[8:0]) is written into the device. D[35:9] will remain unaltered. L H H H – L-H During the Data portion of a Write sequence, only the lower byte (D[8:0]) is written into the device. D[35:9] will remain unaltered. H L H H L-H – During the Data portion of a Write sequence, only the byte (D[17:9]) is written into the device. D[8:0] and D[35:18] will remain unaltered. H L H H – L-H During the Data portion of a Write sequence, only the byte (D[17:9]) is written into the device. D[8:0] and D[35:18] will remain unaltered. H H L H L-H – During the Data portion of a Write sequence, only the byte (D[26:18]) is written into the device. D[17:0] and D[35:27] will remain unaltered. H H L H – L-H During the Data portion of a Write sequence, only the byte (D[26:18]) is written into the device. D[17:0] and D[35:27] will remain unaltered. H H H L L-H H H H L – H H H H L-H – No data is written into the device during this portion of a Write operation. H H H H – L-H No data is written into the device during this portion of a Write operation. During the Data portion of a Write sequence, only the byte (D[35:27]) is written into the device. D[26:0] will remain unaltered. L-H During the Data portion of a Write sequence, only the byte (D[35:27]) is written into the device. D[26:0] will remain unaltered. Write Cycle Descriptions[2, 8](CY7C1916CV18) BWS0 K K L L-H – During the Data portion of a Write sequence, the single byte (D[8:0]) is written into the device. L – L-H During the Data portion of a Write sequence, the single byte (D[8:0]) is written into the device. H L-H – No data is written into the device during this portion of a Write operation. H – L-H No data is written into the device during this portion of a Write operation. Comments Document Number: 001-07160 Rev. *B Page 11 of 28 PRELIMINARY IEEE 1149.1 Serial Boundary Scan (JTAG) These SRAMs incorporate a serial boundary scan test access port (TAP) in the FBGA package. This part is fully compliant with IEEE Standard #1149.1-2001. The TAP operates using JEDEC standard 1.8V I/O logic levels. Disabling the JTAG Feature It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left unconnected. Upon power-up, the device will come up in a reset state which will not interfere with the operation of the device. CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 TDI and TDO pins as shown in TAP Controller Block Diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section. When the TAP controller is in the Capture IR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board level serial test path. Bypass Register To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between TDI and TDO pins. This allows data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. Test Access Port—Test Clock Boundary Scan Register The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK. The boundary scan register is connected to all of the input and output pins on the SRAM. Several no connect (NC) pins are also included in the scan register to reserve pins for higher density devices. Test Mode Select The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this pin unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level. Test Data-In (TDI) The TDI pin is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see the TAP Controller State Diagram. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) on any register. Test Data-Out (TDO) The TDO output pin is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine (see Instruction codes). The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. Performing a TAP Reset A Reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating. At power-up, the TAP is reset internally to ensure that TDO comes up in a high-Z state. TAP Registers Registers are connected between the TDI and TDO pins and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction registers. Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the Document Number: 001-07160 Rev. *B The boundary scan register is loaded with the contents of the RAM Input and Output ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO pins when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the Input and Output ring. The Boundary Scan Order tables show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI, and the LSB is connected to TDO. Identification (ID) Register The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in the Identification Register Definitions table. TAP Instruction Set Eight different instructions are possible with the three-bit instruction register. All combinations are listed in the Instruction Code table. Three of these instructions are listed as RESERVED and should not be used. The other five instructions are described in detail below. Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO pins. To execute the instruction once it is shifted in, the TAP controller needs to be moved into the Update-IR state. IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the instruction register. It also places the instruction register between the TDI and TDO pins and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction Page 12 of 28 PRELIMINARY is loaded into the instruction register upon power-up or whenever the TAP controller is given a test logic reset state. SAMPLE Z The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO pins when the TAP controller is in a Shift-DR state. The SAMPLE Z command puts the output bus into a High-Z state until the next command is given during the “Update IR” state. SAMPLE/PRELOAD SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the inputs and output pins is captured in the boundary scan register. The user must be aware that the TAP controller clock can only operate at a frequency up to 20 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output will undergo a transition. The TAP may then try to capture a signal while in transition (metastable state). This will not harm the device, but there is no guarantee as to the value that will be captured. Repeatable results may not be possible. To guarantee that the boundary scan register will capture the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller's capture set-up plus hold times (tCS and tCH). The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK captured in the boundary scan register. Once the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. PRELOAD allows an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells prior to the selection of another boundary scan test operation. CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. EXTEST The EXTEST instruction enables the preloaded data to be driven out through the system output pins. This instruction also selects the boundary scan register to be connected for serial access between the TDI and TDO in the shift-DR controller state. EXTEST Output Bus Tri-State IEEE Standard 1149.1 mandates that the TAP controller be able to put the output bus into a tri-state mode. The boundary scan register has a special bit located at bit #47. When this scan cell, called the “extest output bus tri-state”, is latched into the preload register during the “Update-DR” state in the TAP controller, it will directly control the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it will enable the output buffers to drive the output bus. When LOW, this bit will place the output bus into a High-Z condition. This bit can be set by entering the SAMPLE/PRELOAD or EXTEST command, and then shifting the desired bit into that cell, during the “Shift-DR” state. During “Update-DR”, the value loaded into that shift-register cell will latch into the preload register. When the EXTEST instruction is entered, this bit will directly control the output Q-bus pins. Note that this bit is pre-set HIGH to enable the output when the device is powered-up, and also when the TAP controller is in the “Test-Logic-Reset” state. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in. Document Number: 001-07160 Rev. *B Page 13 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY TAP Controller State Diagram[9] 1 TEST-LOGIC RESET 0 0 TEST-LOGIC/ IDLE 1 1 1 SELECT DR-SCAN SELECT IR-SCAN 0 0 1 1 CAPTURE-DR CAPTURE-IR 0 0 0 SHIFT-DR 0 SHIFT-IR 1 1 1 EXIT1-DR 1 EXIT1-IR 0 0 PAUSE-DR 0 0 PAUSE-IR 1 1 0 0 EXIT2-DR EXIT2-IR 1 1 UPDATE-DR 1 0 UPDATE-IR 1 0 Note: 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-07160 Rev. *B Page 14 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY TAP Controller Block Diagram 0 Bypass Register Selection Circuitry 2 TDI 1 0 1 0 Selection Circuitry TDO Instruction Register 31 30 29 . . 2 Identification Register 106 . . . . 2 1 0 Boundary Scan Register TCK TAP Controller TMS TAP Electrical Characteristics Over the Operating Range[10, 13, 14] Parameter Description Test Conditions Min. IOH = −2.0 mA 1.4 Output HIGH Voltage IOH = −100 µA 1.6 Output LOW Voltage IOL = 2.0 mA VOL2 Output LOW Voltage IOL = 100 µA VIH Input HIGH Voltage VIL Input LOW Voltage IX Input and OutputLoad Current VOH1 Output HIGH Voltage VOH2 VOL1 GND ≤ VI ≤ VDD Max. Unit V V 0.4 V 0.2 V 0.65VDD VDD + 0.3 V –0.3 0.35VDD V −5 5 µA TAP AC Switching Characteristics Over the Operating Range[11, 12] Parameter Description Min. Max. Unit tTCYC TCK Clock Cycle Time tTF TCK Clock Frequency tTH TCK Clock HIGH 20 ns tTL TCK Clock LOW 20 ns 50 ns 20 MHz Notes: 10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics Table. 11. tCS and tCH refer to the set-up and hold time requirements of latching data from the boundary scan register. 12. Test conditions are specified using the load in TAP AC test conditions. tR/tF = 1 ns. 13. Overshoot: VIH(AC) < VDD+0.85V (Pulse width less than tTCYC/2); Undershoot VIL(AC) > –1.5V (Pulse width less than tTCYC/2). 14. All voltage referenced to ground. Document Number: 001-07160 Rev. *B Page 15 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY TAP AC Switching Characteristics Over the Operating Range[11, 12] (continued) Parameter Description Min. Max. Unit Set-up Times tTMSS TMS Set-up to TCK Clock Rise 5 ns tTDIS TDI Set-up to TCK Clock Rise 5 ns tCS Capture Set-up to TCK Rise 5 ns Hold Times tTMSH TMS Hold after TCK Clock Rise 5 ns tTDIH TDI Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns Output Times tTDOV TCK Clock LOW to TDO Valid tTDOX TCK Clock LOW to TDO Invalid 10 0 ns ns TAP Timing and Test Conditions[12] 0.9V 50Ω ALL INPUT PULSES TDO 1.8V Z0 = 50Ω 0.9V CL = 20 pF 0V tTH (a) tTL GND Test Clock TCK tTCYC tTMSS tTMSH Test Mode Select TMS tTDIS tTDIH Test Data-In TDI Test Data-Out TDO tTDOV Document Number: 001-07160 Rev. *B tTDOX Page 16 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Identification Register Definitions Value Instruction Field CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 Description Revision Number (31:29) 001 001 001 001 Version number. Cypress Device ID (28:12) 11010100010000101 Cypress JEDEC ID (11:1) 00000110100 00000110100 00000110100 00000110100 Allows unique identification of SRAM vendor. 1 1 1 1 Indicate the presence of an ID register. ID Register Presence (0) 11010100010001101 11010100010010101 11010100010100101 Defines the type of SRAM. Scan Register Sizes Register Name Bit Size Instruction 3 Bypass 1 ID 32 Boundary Scan 107 Instruction Codes Instruction Code Description EXTEST 000 Captures the Input/Output ring contents. IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO. This operation does not affect SRAM operation. SAMPLE Z 010 Captures the Input/Output contents. Places the boundary scan register between TDI and TDO. Forces all SRAM output drivers to a High-Z state. RESERVED 011 Do Not Use: This instruction is reserved for future use. SAMPLE/PRELOAD 100 Captures the Input/Output ring contents. Places the boundary scan register between TDI and TDO. Does not affect the SRAM operation. RESERVED 101 Do Not Use: This instruction is reserved for future use. RESERVED 110 Do Not Use: This instruction is reserved for future use. BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 001-07160 Rev. *B Page 17 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Boundary Scan Order Bit # Bump ID Bit # Bump ID Bit # Bump ID Bit # Bump ID 0 6R 28 10G 56 6A 84 2J 1 6P 29 9G 57 5B 85 3K 2 6N 30 11F 58 5A 86 3J 3 7P 31 11G 59 4A 87 2K 4 7N 32 9F 60 5C 88 1K 5 7R 33 10F 61 4B 89 2L 6 8R 34 11E 62 3A 90 3L 7 8P 35 10E 63 1H 91 1M 8 9R 36 10D 64 1A 92 1L 9 11P 37 9E 65 2B 93 3N 10 10P 38 10C 66 3B 94 3M 11 10N 39 11D 67 1C 95 1N 12 9P 40 9C 68 1B 96 2M 13 10M 41 9D 69 3D 97 3P 14 11N 42 11B 70 3C 98 2N 15 9M 43 11C 71 1D 99 2P 16 9N 44 9B 72 2C 100 1P 17 11L 45 10B 73 3E 101 3R 18 11M 46 11A 74 2D 102 4R 19 9L 47 Internal 75 2E 103 4P 20 10L 48 9A 76 1E 104 5P 21 11K 49 8B 77 2F 105 5N 22 10K 50 7C 78 3F 106 5R 23 9J 51 6C 79 1G 24 9K 52 8A 80 1F 25 10J 53 7A 81 3G 26 11J 54 7B 82 2G 27 11H 55 6B 83 1J Document Number: 001-07160 Rev. *B Page 18 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Power-up Sequence in DDR-II SRAM[15] DDR-II SRAMs must be powered up and initialized in a predefined manner to prevent undefined operations. DLL Constraints • DLL uses K clock as its synchronizing input. The input should have low phase jitter, which is specified as tKC Var. • The DLL will function at frequencies down to 80 MHz. Power-up Sequence • Apply power and drive DOFF LOW (All other inputs can be HIGH or LOW) — Apply VDD before VDDQ • If the input clock is unstable and the DLL is enabled, then the DLL may lock onto an incorrect frequency, causing unstable SRAM behavior. To avoid this, provide 1024 cycles stable clock to relock to the desired clock frequency — Apply VDDQ before VREF or at the same time as VREF • After the power and clock (K, K) are stable take DOFF HIGH • The additional 1024 cycles of clocks are required for the DLL to lock. ~ ~ Power-up Waveforms K K ~ ~ Unstable Clock > 1024 Stable clock Start Normal Operation Clock Start (Clock Starts after V DD / V DDQ Stable) VDD / VDDQ DOFF V DD / V DDQ Stable (< +/- 0.1V DC per 50ns ) Fix High (or tied to VDDQ) Note: 15. During Power-Up, when the DOFF is tied HIGH, the DLL gets locked after 1024 cycles of stable clock. Document Number: 001-07160 Rev. *B Page 19 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Maximum Ratings Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage (MIL-STD-883, M 3015).... >2001V (Above which the useful life may be impaired.) Latch-up Current..................................................... >200 mA Storage Temperature ................................. –65°C to +150°C Operating Range Ambient Temperature with Power Applied .... –10°C to +85°C Supply Voltage on VDD Relative to GND........ –0.5V to +2.9V Range Supply Voltage on VDDQ Relative to GND ...... –0.5V to +VDD Com’l DC Applied to Outputs in High-Z......... –0.5V to VDDQ + 0.3V Ind’l DC Input Voltage[13] ...............................–0.5V to VDD + 0.3V Ambient Temperature VDD[16] VDDQ[16] 0°C to +70°C 1.8 ± 0.1V 1.4V to VDD –40°C to +85°C Electrical Characteristics Over the Operating Range[14] DC Electrical Characteristics Over the Operating Range Parameter Description VDD Power Supply Voltage Test Conditions Min. Typ. Max. Unit 1.7 1.8 1.9 V 1.4 1.5 VDDQ I/O Supply Voltage VDD V VOH Output HIGH Voltage Note 17 VDDQ/2 – 0.12 VDDQ/2 + 0.12 V VOL Output LOW Voltage Note 18 VDDQ/2 – 0.12 VDDQ/2 + 0.12 V VOH(LOW) Output HIGH Voltage IOH = –0.1 mA, Nominal Impedance VDDQ – 0.2 VDDQ V IOL = 0.1 mA, Nominal Impedance VOL(LOW) Output LOW Voltage VIH Input HIGH Voltage VIL Input LOW Voltage IX Input Leakage Current GND ≤ VI ≤ VDDQ IOZ Output Leakage Current GND ≤ VI ≤ VDDQ, Output Disabled VREF Input Reference Voltage[19] Typical Value = 0.75V IDD VDD Operating Supply ISB1 Automatic Power-down Current Input HIGH Voltage Input LOW Voltage[13] V V –0.3 VREF – 0.1 V –5 5 µA 5 µA V VDD = Max., IOUT = 0 mA, 167 MHz f = fMAX = 1/tCYC 200 MHz 450 mA 500 mA 250 MHz 550 mA 278 MHz 580 mA –5 0.68 0.75 300 MHz 600 mA Max. VDD, Both Ports 167 MHz Deselected, VIN ≥ VIH or 200 MHz VIN ≤ VIL f = fMAX = 250 MHz 1/tCYC, Inputs Static 278 MHz 200 mA 220 mA 240 mA 250 mA 300 MHz 260 mA Max. Unit Test Conditions [13] VIL 0.2 VDDQ + 0.3 0.95 AC Input Requirements Over the Operating Range Parameter Description VIH VSS VREF + 0.1 Min. Typ. VREF + 0.2 – – V – – VREF – 0.2 V Capacitance[20] Parameter Description CIN Input Capacitance CCLK Clock Input Capacitance CO Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VDD = 1.8V VDDQ = 1.5V Max. Unit 5 pF 6 pF 7 pF Notes: 16. Power-up: Assumes a linear ramp from 0V to VDD(Min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD. 17. Outputs are impedance controlled. IOH = –(VDDQ/2)/(RQ/5) for values of 175Ω < RQ < 350Ω. 18. Outputs are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175Ω < RQ < 350Ω. 19. VREF (Min.) = 0.68V or 0.46VDDQ, whichever is larger, VREF (Max.) = 0.95V or 0.54VDDQ, whichever is smaller. 20. Tested initially and after any design or process change that may affect these parameters. Document Number: 001-07160 Rev. *B Page 20 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Thermal Resistance[20] Parameter ΘJA ΘJC Description Thermal Resistance (Junction to Ambient) Thermal Resistance (Junction to Case) Test Conditions Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA / JESD51. 165 FBGA Package 28.51 Unit °C/W 5.91 °C/W AC Test Loads and Waveforms VREF = 0.75V VREF 0.75V VREF OUTPUT Z0 = 50Ω Device Under Test RL = 50Ω VREF = 0.75V ZQ R = 50Ω ALL INPUT PULSES 1.25V 0.75V OUTPUT Device Under Test ZQ RQ = 250Ω (a) 0.75V INCLUDING JIG AND SCOPE 5 pF [21] 0.25V Slew Rate = 2 V/ns RQ = 250Ω (b) Note: 21. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, VREF = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads. Document Number: 001-07160 Rev. *B Page 21 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Switching Characteristics Over the Operating Range [21, 22] Cypress Consortium Parameter Parameter 300 MHz Description VDD(Typical) to the first Access[23] tPOWER 278 MHz 250 MHz 200 MHz 167 MHz Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. 1 – 1 – 1 1 1 Unit ms tCYC tKHKH K Clock and C Clock Cycle 3.30 5.25 3.60 5.25 Time 4.0 6.3 5.0 7.9 6.0 8.4 ns tKH tKHKL Input Clock (K/K and C/C) HIGH 1.32 – 1.4 – 1.6 – 2.0 – 2.4 – ns tKL tKLKH Input Clock (K/K and C/C) LOW 1.32 – 1.4 – 1.6 – 2.0 – 2.4 – ns tKHKH tKHKH 1.49 K Clock Rise to K Clock Rise and C to C Rise (rising edge to rising edge) – 1.6 – 1.8 – 2.2 – 2.7 – ns tKHCH tKHCH K/K Clock Rise to C/C Clock 0.00 1.45 0.00 1.55 Rise (rising edge to rising edge) 0.0 1.8 0.0 2.2 0.0 2.7 ns Set-up Times tSA tAVKH Address Set-up to K Clock Rise 0.4 – 0.4 – 0.5 – 0.6 – 0.7 – ns tSC tIVKH Control Set-up to Clock (K, K) Rise (LD, R/W) 0.4 – 0.4 – 0.5 – 0.6 – 0.7 – ns tSCDDR tIVKH Double Data Rate Control Set-up to Clock (K, K) Rise (BWS0, BWS1, BWS2, BWS3) 0.3 – 0.3 – 0.35 – 0.4 – 0.5 – ns tSD[24] tDVKH D[X:0] Set-up to Clock (K and K) Rise 0.3 – 0.3 – 0.35 – 0.4 – 0.5 – ns tHA tKHAX Address Hold after Clock (K and K) Rise 0.4 – 0.4 – 0.5 – 0.6 – 0.7 – ns tHC tKHIX Control Hold after Clock (K and K) Rise (LD, R/W) 0.4 – 0.4 – 0.5 – 0.6 – 0.7 – ns tHCDDR tKHIX Double Data Rate Control Hold after Clock (K and K) Rise (BWS0, BWS1, BWS2, BWS3) 0.3 – 0.3 – 0.35 – 0.4 – 0.5 – ns tHD tKHDX D[X:0] Hold after Clock (K and K) Rise 0.3 – 0.3 – 0.35 – 0.4 – 0.5 – ns – 0.45 – 0.45 – 0.45 – 0.45 – 0.50 ns Hold Times Output Times tCO tCHQV C/C Clock Rise (or K/K in single clock mode) to Data Valid tDOH tCHQX Data Output Hold after Output C/C Clock Rise (Active to Active) –0.45 – –0.45 – –0.45 – –0.45 – –0.50 – ns tCCQO tCHCQV C/C Clock Rise to Echo Clock Valid – 0.45 – 0.45 – 0.45 – 0.45 – 0.50 ns Notes: 22. All devices can operate at clock frequencies as low as 119 MHz. When a part with a maximum frequency above 133 MHz is operating at a lower clock frequency, it requires the input timings of the frequency range in which it is being operated and will output data with the output timings of that frequency range. 23. This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD minimum initially before a read or write operation can be initiated. 24. For DQ2 data signal on CY7C1916CV18 device, tSD is 0.5ns for 200MHz, 250MHz, 278MHz and 300MHz frequencies. Document Number: 001-07160 Rev. *B Page 22 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Switching Characteristics Over the Operating Range (continued)[21, 22] Cypress Consortium Parameter Parameter 300 MHz Description 278 MHz 250 MHz 200 MHz 167 MHz Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. tCQOH tCHCQX Echo Clock Hold after C/C –0.45 Clock Rise tCQD tCQHQV Echo Clock High to Data Valid tCQDOH tCQHQX tCQH Unit – –0.45 – –0.45 – –0.45 – –0.50 – ns – 0.27 – 0.27 – 0.30 – 0.35 – 0.40 ns Echo Clock High to Data Invalid –0.27 – –0.27 – –0.30 – –0.35 – –0.40 – ns tCQHCQL Output Clock (CQ/CQ) HIGH[25] 1.24 – 1.35 – 1.55 – 1.95 – 2.45 – ns tCQHCQH tCQHCQH CQ Clock Rise to CQ Clock 1.24 Rise[25] (rising edge to rising edge) – 1.35 – 1.55 – 1.95 – 2.45 – ns tCHZ tCHQZ Clock (C and C) Rise to High-Z (Active to High-Z)[26, 27] – 0.45 – 0.45 – 0.45 – 0.45 – 0.50 ns tCLZ tCHQX1 Clock (C and C) Rise to Low-Z[26, 27] –0.45 – –0.45 – –0.45 – –0.45 – –0.50 – ns tKC Var tKC Var Clock Phase Jitter – 0.20 – 0.20 – 0.20 – 0.20 – 0.20 ns tKC lock tKC lock DLL Lock Time (K, C) 1024 – 1024 – 1024 – 1024 – 1024 – Cycles tKC Reset tKC Reset K Static to DLL Reset 30 – 30 – 30 DLL Timing 30 30 ns Notes: 25. These parameters are extrapolated from the input timing parameters (tKHKH - 250 ps, where 250 ps is the internal jitter. An input jitter of 200 ps (tKC Var) ia already included in the tKHKH). These parameters are only guaranteed by design and are not tested in production. 26. tCHZ, tCLZ, are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured ± 100 mV from steady-state voltage. 27. At any given voltage and temperature tCHZ is less than tCLZ and tCHZ less than tCO. Document Number: 001-07160 Rev. *B Page 23 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Switching Waveforms[28, 29, 30] READ 2 NOP 1 READ 3 NOP 4 NOP 5 WRITE 6 WRITE 7 READ 8 A3 A4 9 10 K tKH tKL tKHKH tCYC K LD tSC tHC R/W A A0 tSA A2 A1 tHD tHA tHD tSD DQ Q00 t KHCH t CLZ Q01 Q10 Q11 tSD D20 D21 D30 D31 Q40 Q41 t CQDOH t CHZ tDOH tCO t CQD C t KHCH tKH tKL tCYC tKHKH C# tCQOH tCCQO CQ tCQOH tCCQO tCQH tCQHCQH CQ# DON’T CARE UNDEFINED Notes: 28. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, i.e., A0 + 1. 29. Outputs are disabled (High-Z) one clock cycle after a NOP. 30. In this example, if address A2 = A1,then data Q20 = D10 and Q21 = D11. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 001-07160 Rev. *B Page 24 of 28 PRELIMINARY CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 Ordering Information “Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered”. Speed (MHz) 300 Ordering Code CY7C1316CV18-300BZC Package Diagram Operating Range Package Type 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial CY7C1318CV18-300BZC CY7C1320CV18-300BZC CY7C1916CV18-300BZC 300 CY7C1316CV18-300BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free Commercial CY7C1318CV18-300BZXC CY7C1320CV18-300BZXC CY7C1916CV18-300BZXC 300 CY7C1316CV18-300BZI 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Industrial 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free Industrial CY7C1318CV18-300BZI CY7C1320CV18-300BZI CY7C1916CV18-300BZI 300 CY7C1316CV18-300BZXI CY7C1318CV18-300BZXI CY7C1320CV18-300BZXI CY7C1916CV18-300BZXI 278 CY7C1316CV18-278BZC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial CY7C1318CV18-278BZC CY7C1320CV18-278BZC CY7C1916CV18-278BZC 278 CY7C1316CV18-278BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free Commercial CY7C1318CV18-278BZXC CY7C1320CV18-278BZXC CY7C1916CV18-278BZXC 278 CY7C1316CV18-278BZI 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Industrial 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free Industrial CY7C1318CV18-278BZI CY7C1320CV18-278BZI CY7C1916CV18-278BZI 278 CY7C1316CV18-278BZXI CY7C1318CV18-278BZXI CY7C1320CV18-278BZXI CY7C1916CV18-278BZXI 250 CY7C1316CV18-250BZC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial CY7C1318CV18-250BZC CY7C1320CV18-250BZC CY7C1916CV18-250BZC 250 CY7C1316CV18-250BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free Commercial CY7C1318CV18-250BZXC CY7C1320CV18-250BZXC CY7C1916CV18-250BZXC Document Number: 001-07160 Rev. *B Page 25 of 28 PRELIMINARY CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 Ordering Information (continued) “Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered”. Speed (MHz) 250 Ordering Code CY7C1316CV18-250BZI Package Diagram Operating Range Package Type 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Industrial 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free Industrial CY7C1318CV18-250BZI CY7C1320CV18-250BZI CY7C1916CV18-250BZI 250 CY7C1316CV18-250BZXI CY7C1318CV18-250BZXI CY7C1320CV18-250BZXI CY7C1916CV18-250BZXI 200 CY7C1316CV18-200BZC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial CY7C1318CV18-200BZC CY7C1320CV18-200BZC CY7C1916CV18-200BZC 200 CY7C1316CV18-200BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free Commercial CY7C1318CV18-200BZXC CY7C1320CV18-200BZXC CY7C1916CV18-200BZXC 200 CY7C1316CV18-200BZI 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Industrial 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free Industrial CY7C1318CV18-200BZI CY7C1320CV18-200BZI CY7C1916CV18-200BZI 200 CY7C1316CV18-200BZXI CY7C1318CV18-200BZXI CY7C1320CV18-200BZXI CY7C1916CV18-200BZXI 167 CY7C1316CV18-167BZC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial CY7C1318CV18-167BZC CY7C1320CV18-167BZC CY7C1916CV18-167BZC 167 CY7C1316CV18-167BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free Commercial CY7C1318CV18-167BZXC CY7C1320CV18-167BZXC CY7C1916CV18-167BZXC 167 CY7C1316CV18-167BZI 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Industrial 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free Industrial CY7C1318CV18-167BZI CY7C1320CV18-167BZI CY7C1916CV18-167BZI 167 CY7C1316CV18-167BZXI CY7C1318CV18-167BZXI CY7C1320CV18-167BZXI CY7C1916CV18-167BZXI Document Number: 001-07160 Rev. *B Page 26 of 28 CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 PRELIMINARY Package Diagram 165 FBGA FBGA 13 x 15(13 x 1.40 BB165D/BW165D 165-ball x 15MM x 1.4 mm) (51-85180) BOTTOM VIEW PIN 1 CORNER BOTTOM VIEW TOP VIEW PIN 1 CORNER TOP VIEW Ø0.05 M C Ø0.25 MØ0.05 CAB MC PIN 1 CORNER Ø0.25 M C A B Ø0.50 -0.06 (165X) PIN 1 CORNER 1 2 1 +0.14 4 2 5 3 6 4 7 5 8 6 9 7 10 11 8 9 11 10 11 10 9 11 8 10 7 9 6 8 5 7 Ø0.50 -0.06 (165X) 4 6 1 3 +0.14 2 5 4 3 2 1A B A C B C B D C D C E D F 1.00 A 1.00 B F E G F G F H G H G J H K J L K M L N M P N P N R P R P 7.00 7.00 14.00 D E 14.00 15.00±0.10 E 15.00±0.10 15.00±0.10 A 15.00±0.10 3 J H K J L K M L N M R R A A A 1.00 5.00 A 1.00 5.00 10.00 10.00 B B 13.00±0.10 B 13.00±0.10 B 13.00±0.10 13.00±0.10 SEATING PLANE NOTES : NOTES : SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD) PACKAGE WEIGHT SOLDER PAD: 0.475g TYPE : NON-SOLDER MASK DEFINED (NSMD) JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE WEIGHT : 0.475g PACKAGE CODE : BB0AC : MO-216 / DESIGN 4.6C JEDEC REFERENCE PACKAGE CODE : BB0AC 51-85180-*A 0.35±0.06 C 0.35±0.06 0.36 0.36 SEATING PLANE C 0.15 C 1.40 MAX. 1.40 MAX. 0.15(4X) 0.15 C 0.53±0.05 0.53±0.05 0.25 C 0.25 C 0.15(4X) 51-85180-*A QDR™ RAMs and Quad Data Rate™ RAMs comprise a new family of products developed by Cypress, IDT, NEC, Renesas, and Samsung. All product and company names mentioned in this document are the trademarks of their respective holders. Document Number: 001-07160 Rev. *B Page 27 of 28 © Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. PRELIMINARY CY7C1316CV18 CY7C1916CV18 CY7C1318CV18 CY7C1320CV18 Document History Page Document Title: CY7C1316CV18/CY7C1916CV18/CY7C1318CV18/CY7C1320CV18 18-Mbit DDR-II SRAM 2-Word Burst Architecture Document Number: 001-07160 REV. ECN No. Issue Date Orig. of Change Description of Change ** 433284 See ECN NXR New data sheet *A 462615 See ECN NXR Changed tTH and tTL from 40 ns to 20 ns, changed tTMSS, tTDIS, tCS, tTMSH, tTDIH, tCH from 10 ns to 5 ns and changed tTDOV from 20 ns to 10 ns in TAP AC Switching Characteristics table Modified Power-Up waveform *B 503690 See ECN VKN Minor change: Moved data sheet to web Document Number: 001-07160 Rev. *B Page 28 of 28
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