CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
72-Mbit (2M × 36/4M × 18/1M × 72)
Pipelined SRAM with NoBL™ Architecture
72-Mbit (2M × 36/4M × 18/1M × 72) Pipelined SRAM with NoBL™ Architecture
Features
Functional Description
■
Pin-compatible and functionally equivalent to ZBT™
■
Supports 250 MHz bus operations with zero wait states
❐ Available speed grades are 250, 200, and 167 MHz
■
Internally self timed output buffer control to eliminate the need
to use asynchronous OE
■
Fully registered (inputs and outputs) for pipelined operation
■
Byte Write capability
■
Single 3.3 V power supply
■
3.3 V/2.5 V I/O power supply
■
Fast clock-to-output time
❐ 3.0 ns (for 250 MHz device)
■
Clock Enable (CEN) pin to suspend operation
■
Synchronous self timed writes
■
CY7C1470BV33,
CY7C1472BV33
available
in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and
non-Pb-free 165-ball FBGA package. CY7C1474BV33
available in Pb-free and non-Pb-free 209-ball FBGA package
■
IEEE 1149.1 JTAG Boundary Scan compatible
■
Burst capability – linear or interleaved burst order
■
“ZZ” Sleep Mode option and Stop Clock option
The CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33
are 3.3 V, 2M × 36/4M × 18/1M × 72 Synchronous pipelined burst
SRAMs with No Bus Latency™ (NoBL™) logic, respectively.
They are designed to support unlimited true back-to-back read
or write operations with no wait states. The CY7C1470BV33,
CY7C1472BV33, and CY7C1474BV33 are equipped with the
advanced (NoBL) logic required to enable consecutive read or
write operations with data being transferred on every clock cycle.
This feature dramatically improves the throughput of data in
systems that require frequent read or write transitions. The
CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33 are pin
compatible and functionally equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock. The clock
input is qualified by the Clock Enable (CEN) signal, which when
deasserted suspends operation and extends the previous clock
cycle.
Write operations are controlled by the Byte Write Selects
(BWa–BWd
for
CY7C1470BV33,
BWa–BWb
for
CY7C1472BV33, and BWa–BWh for CY7C1474BV33) and a
Write Enable (WE) input. All writes are conducted with on-chip
synchronous self timed write circuitry.
Three synchronous Chip Enables (CE1, CE2, CE3) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence.
For a complete list of related documentation, click here.
Selection Guide
Description
250 MHz
3.0
500
120
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Cypress Semiconductor Corporation
Document Number: 001-15031 Rev. *O
•
198 Champion Court
•
200 MHz
3.0
500
120
167 MHz
3.4
450
120
Unit
ns
mA
mA
San Jose, CA 95134-1709
•
408-943-2600
Revised February 7, 2018
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Logic Block Diagram – CY7C1470BV33
A0, A1, A
ADDRESS
REGISTER 0
A1
A1'
D1
Q1
A0
A0'
BURST
D0
Q0
LOGIC
MODE
CLK
CEN
ADV/LD
C
C
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
ADV/LD
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
BW a
BW b
BW c
BW d
WRITE
DRIVERS
O
U
T
P
U
T
S
E
N
S
E
MEMORY
ARRAY
R
E
G
I
S
T
E
R
S
A
M
P
S
WE
S
T
E
E
R
I
N
G
E
INPUT
REGISTER 1
OE
CE1
CE2
CE3
ZZ
INPUT
REGISTER 0
E
O
U
T
P
U
T
D
A
T
A
B
U
F
F
E
R
S
DQ s
DQ Pa
DQ Pb
DQ Pc
DQ Pd
E
E
READ LOGIC
SLEEP
CONTROL
Logic Block Diagram – CY7C1472BV33
A0, A1, A
ADDRESS
REGISTER 0
A1
A1'
D1
Q1
A0
A0'
BURST
D0
Q0
LOGIC
MODE
CLK
CEN
ADV/LD
C
C
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
S
E
N
S
E
ADV/LD
BW a
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
WRITE
DRIVERS
MEMORY
ARRAY
A
M
P
S
BW b
WE
O
U
T
P
U
T
R
E
G
I
S
T
E
R
S
O
U
T
P
U
T
D
A
T
A
B
U
F
F
E
R
S
S
T
E
E
R
I
N
G
E
INPUT
REGISTER 1
OE
CE1
CE2
CE3
ZZ
Document Number: 001-15031 Rev. *O
E
DQ s
DQ Pa
DQ Pb
E
INPUT
REGISTER 0
E
READ LOGIC
Sleep
Control
Page 2 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Logic Block Diagram – CY7C1474BV33
A0, A1, A
ADDRESS
REGISTER 0
A1
A1'
D1
Q1
A0
A0'
BURST
D0
Q0
LOGIC
MODE
CLK
CEN
ADV/LD
C
C
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
S
E
N
S
E
ADV/LD
BW a
BW b
BW c
BW d
BW e
BW f
BW g
BW h
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
WRITE
DRIVERS
MEMORY
ARRAY
A
M
P
S
O
U
T
P
U
T
R
E
G
I
S
T
E
R
S
O
U
T
P
U
T
D
A
T
A
B
U
F
F
E
R
S
S
T
E
E
R
I
N
G
E
E
DQ s
DQ Pa
DQ Pb
DQ Pc
DQ Pd
DQ Pe
DQ Pf
DQ Pg
DQ Ph
WE
INPUT
REGISTER 1
OE
CE1
CE2
CE3
ZZ
Document Number: 001-15031 Rev. *O
E
INPUT
REGISTER 0
E
READ LOGIC
Sleep
Control
Page 3 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Contents
Pin Configurations ........................................................... 5
Pin Definitions .................................................................. 8
Functional Overview ........................................................ 9
Single Read Accesses ................................................ 9
Burst Read Accesses .................................................. 9
Single Write Accesses ................................................. 9
Burst Write Accesses ................................................ 10
Sleep Mode ............................................................... 10
Interleaved Burst Address Table ............................... 10
Linear Burst Address Table ....................................... 10
ZZ Mode Electrical Characteristics ............................ 10
Truth Table ...................................................................... 11
Partial Write Cycle Description ..................................... 12
IEEE 1149.1 Serial Boundary Scan (JTAG) .................. 13
Disabling the JTAG Feature ...................................... 13
Test Access Port (TAP) ............................................. 13
PERFORMING A TAP RESET .................................. 13
TAP REGISTERS ...................................................... 13
TAP Instruction Set ................................................... 14
TAP Controller State Diagram ....................................... 15
TAP Controller Block Diagram ...................................... 16
TAP Timing ...................................................................... 17
TAP AC Switching Characteristics ............................... 18
3.3 V TAP AC Test Conditions ....................................... 19
3.3 V TAP AC Output Load Equivalent ......................... 19
2.5 V TAP AC Test Conditions ....................................... 19
2.5 V TAP AC Output Load Equivalent ......................... 19
TAP DC Electrical Characteristics
and Operating Conditions ............................................. 19
Document Number: 001-15031 Rev. *O
Identification Register Definitions ................................ 20
Scan Register Sizes ....................................................... 20
Identification Codes ....................................................... 20
Boundary Scan Exit Order ............................................. 21
Boundary Scan Exit Order ............................................. 21
Boundary Scan Exit Order ............................................. 22
Maximum Ratings ........................................................... 23
Operating Range ............................................................. 23
Neutron Soft Error Immunity ......................................... 23
Electrical Characteristics ............................................... 23
Capacitance .................................................................... 25
Thermal Resistance ........................................................ 25
AC Test Loads and Waveforms ..................................... 25
Switching Characteristics .............................................. 26
Switching Waveforms .................................................... 27
Ordering Information ...................................................... 29
Ordering Code Definitions ......................................... 29
Package Diagrams .......................................................... 30
Acronyms ........................................................................ 33
Document Conventions ................................................. 33
Units of Measure ....................................................... 33
Document History Page ................................................. 34
Sales, Solutions, and Legal Information ...................... 35
Worldwide Sales and Design Support ....................... 35
Products .................................................................... 35
PSoC® Solutions ...................................................... 35
Cypress Developer Community ................................. 35
Technical Support ..................................................... 35
Page 4 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Pin Configurations
CY7C1470BV33
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
CY7C1472BV33
(4M × 18)
A
NC
NC
VDDQ
VSS
NC
DQPa
DQa
DQa
VSS
VDDQ
DQa
DQa
VSS
NC
VDD
ZZ
DQa
DQa
VDDQ
VSS
DQa
DQa
NC
NC
VSS
VDDQ
NC
NC
NC
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
Document Number: 001-15031 Rev. *O
A
A
A
A
A
A
A
A
VSS
VDD
A
NC(288)
NC(144)
A
A
A
A
A
A
A
A
A
VSS
VDD
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
NC
DQPb
NC
DQb
NC
DQb
VDDQ VDDQ
VSS
VSS
NC
DQb
DQb
NC
DQb
DQb
DQb
DQb
VSS
VSS
VDDQ VDDQ
DQb
DQb
DQb
DQb
NC
VSS
VDD
NC
NC
VDD
VSS
ZZ
DQb
DQa
DQa
DQb
VDDQ VDDQ
VSS
VSS
DQa
DQb
DQa
DQb
DQa DQPb
NC
DQa
VSS
VSS
VDDQ VDDQ
NC
DQa
DQa
NC
DQPa
NC
MODE
A
A
A
A
A1
A0
(2M × 36)
NC(288)
NC(144)
DQc
DQc
NC
VDD
NC
VSS
DQd
DQd
VDDQ
VSS
DQd
DQd
DQd
DQd
VSS
VDDQ
DQd
DQd
DQPd
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
VSS
DQc
DQc
DQc
DQc
VSS
VDDQ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
MODE
A
A
A
A
A1
A0
DQPc
DQc
DQc
VDDQ
A
A
A
A
CE1
CE2
NC
NC
BWb
BWa
CE3
VDD
VSS
CLK
WE
CEN
OE
ADV/LD
A
A
A
A
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
A
A
CE1
CE2
BWd
BWc
BWb
BWa
CE3
VDD
VSS
CLK
WE
CEN
OE
ADV/LD
A
A
Figure 1. 100-pin TQFP (14 × 20 × 1.4 mm) pinout
Page 5 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Pin Configurations (continued)
Figure 2. 165-ball FBGA (15 × 17 × 1.4 mm) pinout
CY7C1470BV33 (2M × 36)
1
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
NC/576M
A
3
NC/1G
A
DQPc
DQc
NC
DQc
VDDQ
VDDQ
VSS
VDD
DQc
DQc
VDDQ
R
CE1
CE2
4
5
6
7
8
9
10
11
A
NC
BWc
BWb
CE3
ADV/LD
BWd
BWa
VSS
CLK
CEN
WE
A
OE
A
A
NC
VSS
VSS
VSS
VSS
VSS
VDD
VDDQ
VSS
VDDQ
NC
DQb
DQPb
DQb
VDD
VSS
VSS
VSS
VDD
VDDQ
DQb
DQb
DQc
DQc
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQb
DQb
DQc
NC
DQd
DQc
NC
DQd
VDDQ
NC
VDDQ
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD
VDDQ
NC
VDDQ
DQb
NC
DQa
DQb
ZZ
DQa
DQd
DQd
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQa
DQa
DQd
DQd
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQa
DQa
DQd
DQPd
DQd
NC
VDDQ
VDDQ
VDD
VSS
VSS
NC
VSS
NC
VSS
NC
VDD
VSS
VDDQ
VDDQ
DQa
NC
DQa
DQPa
NC/144M
A
A
A
TDI
A1
TDO
A
A
A
MODE
A
A
A
TMS
A0
TCK
A
A
A
A
NC/288M
CY7C1472BV33 (4M × 18)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
2
3
4
5
6
7
8
9
10
11
NC/576M
A
CE1
CE2
BWb
NC
NC
CE3
CLK
CEN
ADV/LD
A
A
A
OE
VSS
VDD
A
NC
VDDQ
VSS
WE
VSS
VSS
A
VSS
VSS
VDDQ
NC
NC
DQPa
DQa
NC/1G
A
NC
NC
NC
DQb
VDDQ
VDDQ
VSS
VDD
NC
DQb
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
NC
DQa
NC
DQb
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
NC
DQa
NC
NC
DQb
DQb
NC
NC
VDDQ
NC
VDDQ
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD
VDDQ
NC
VDDQ
NC
NC
DQa
DQa
ZZ
NC
DQb
NC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQa
NC
DQb
NC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQa
NC
DQb
DQPb
NC
NC
VDDQ
VDDQ
VDD
VSS
VSS
NC
VSS
NC
VSS
NC
VDD
VSS
VDDQ
VDDQ
DQa
NC
NC
NC
NC/144M
A
A
A
TDI
A1
TDO
A
A
A
MODE
A
A
A
TMS
A0
TCK
A
A
A
Document Number: 001-15031 Rev. *O
BWa
VSS
NC/288M
A
Page 6 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Pin Configurations (continued)
Figure 3. 209-ball FBGA (14 × 22 × 1.76 mm) pinout
CY7C1474BV33 (1M × 72)
1
2
3
4
5
6
7
8
9
10
11
A
DQg
DQg
A
CE2
A
ADV/LD
A
CE3
A
DQb
DQb
B
DQg
DQg
BWSc
BWSg
NC
WE
A
BWSb
BWSf
DQb
DQb
C
DQg
DQg
BWSh
BWSd
NC/576M
CE1
NC
BWSe
BWSa
DQb
DQb
D
DQg
DQg
VSS
NC
NC/1G
OE
NC
NC
VSS
DQb
DQb
E
DQPg
DQPc
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPf
DQPb
F
DQc
DQc
VSS
VSS
VSS
NC
VSS
VSS
VSS
DQf
DQf
G
DQc
DQc
VDDQ
VDDQ
VDD
NC
VDD
VDDQ
VDDQ
DQf
DQf
H
DQc
DQc
VSS
VSS
VSS
NC
VSS
VSS
VSS
DQf
DQf
J
DQc
DQc
VDDQ
VDDQ
VDD
NC
VDD
VDDQ
VDDQ
DQf
DQf
K
NC
NC
CLK
NC
VSS
CEN
VSS
NC
NC
NC
NC
L
DQh
DQh
VDDQ
VDDQ
VDD
NC
VDD
VDDQ
VDDQ
DQa
DQa
M
DQh
DQh
VSS
VSS
VSS
NC
VSS
VSS
VSS
DQa
DQa
N
DQh
DQh
VDDQ
VDDQ
VDD
NC
VDD
VDDQ
VDDQ
DQa
DQa
P
DQh
DQh
VSS
VSS
VSS
ZZ
VSS
VSS
VSS
DQa
DQa
R
DQPd
DQPh
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPa
DQPe
T
DQd
DQd
VSS
NC
NC
MODE
NC
NC
VSS
DQe
DQe
U
DQd
DQd
NC/144M
A
A
A
A
A
NC/288M
DQe
DQe
V
DQd
DQd
A
A
A
A1
A
A
A
DQe
DQe
W
DQd
DQd
TMS
TDI
A
A0
A
TDO
TCK
DQe
DQe
Document Number: 001-15031 Rev. *O
Page 7 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Pin Definitions
Pin Name
I/O Type
Pin Description
A0, A1, A
InputAddress Inputs Used to Select One of the Address Locations. Sampled at the rising edge of the
Synchronous CLK.
BWa, BWb,
BWc, BWd,
BWe, BWf,
BWg, BWh
InputByte Write Select Inputs, Active LOW. Qualified with WE to conduct writes to the SRAM. Sampled
Synchronous on the rising edge of CLK. BWa controls DQa and DQPa, BWb controls DQb and DQPb, BWc controls
DQc and DQPc, BWd controls DQd and DQPd, BWe controls DQe and DQPe, BWf controls DQf and
DQPf, BWg controls DQg and DQPg, BWh controls DQh and DQPh.
WE
InputWrite Enable Input, Active LOW. Sampled on the rising edge of CLK if CEN is active LOW. This
Synchronous signal must be asserted LOW to initiate a write sequence.
ADV/LD
InputAdvance/Load Input Used to Advance the On-chip Address Counter or Load a New Address.
Synchronous When HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new
address can be loaded into the device for an access. After being deselected, ADV/LD must be driven
LOW to load a new address.
CLK
InputClock
Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN. CLK
is only recognized if CEN is active LOW.
CE1
InputChip Enable 1 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2
Synchronous and CE3 to select or deselect the device.
CE2
InputChip Enable 2 Input, Active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
Synchronous CE1 and CE3 to select or deselect the device.
CE3
InputChip Enable 3 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1
Synchronous and CE2 to select or deselect the device.
OE
InputOutput Enable, Active LOW. Combined with the synchronous logic block inside the device to control
Asynchronous the direction of the I/O pins. When LOW, the I/O pins are enabled to behave as outputs. When
deasserted HIGH, I/O pins are tri-stated, and act as input data pins. OE is masked during the data
portion of a write sequence, during the first clock when emerging from a deselected state and when
the device has been deselected.
CEN
InputClock Enable Input, Active LOW. When asserted LOW the clock signal is recognized by the SRAM.
Synchronous When deasserted HIGH the clock signal is masked. Since deasserting CEN does not deselect the
device, CEN can be used to extend the previous cycle when required.
DQS
I/OBidirectional Data I/O Lines. As inputs, they feed into an on-chip data register that is triggered by
Synchronous the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified
by A[17:0] during the previous clock rise of the read cycle. The direction of the pins is controlled by OE
and the internal control logic. When OE is asserted LOW, the pins can behave as outputs. When
HIGH, DQa–DQd are placed in a tri-state condition. The outputs are automatically tri-stated during the
data portion of a write sequence, during the first clock when emerging from a deselected state, and
when the device is deselected, regardless of the state of OE.
DQPX
I/OBidirectional Data Parity I/O Lines. Functionally, these signals are identical to DQX. During write
Synchronous sequences, DQPa is controlled by BWa, DQPb is controlled by BWb, DQPc is controlled by BWc, and
DQPd is controlled by BWd, DQPe is controlled by BWe, DQPf is controlled by BWf, DQPg is controlled
by BWg, DQPh is controlled by BWh.
MODE
Input Strap Pin Mode Input. Selects the burst order of the device. Tied HIGH selects the interleaved burst order.
Pulled LOW selects the linear burst order. MODE must not change states during operation. When left
floating MODE defaults HIGH, to an interleaved burst order.
TDO
JTAG Serial Serial Data Out to the JTAG Circuit. Delivers data on the negative edge of TCK.
Output
Synchronous
TDI
JTAG Serial Serial Data In to the JTAG Circuit. Sampled on the rising edge of TCK.
Input
Synchronous
Document Number: 001-15031 Rev. *O
Page 8 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Pin Definitions (continued)
Pin Name
TMS
TCK
VDD
VDDQ
I/O Type
Pin Description
This pin Controls the Test Access Port State Machine. Sampled on the rising edge of TCK.
Test Mode
Select
Synchronous
JTAG Clock
Clock Input to the JTAG Circuitry.
Power Supply Power Supply Inputs to the Core of the Device.
I/O Power
Supply
Power Supply for the I/O Circuitry.
VSS
Ground
NC
–
No Connects. This pin is not connected to the die.
NC(144M,
288M,
576M, 1G)
–
These Pins are Not Connected. They are used for expansion to the 144M, 288M, 576M, and 1G
densities.
ZZ
Ground for the Device. Should be connected to ground of the system.
InputZZ “Sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition
Asynchronous with data integrity preserved. During normal operation, this pin must be LOW or left floating. ZZ pin
has an internal pull-down.
Functional Overview
The CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33
are synchronous-pipelined Burst NoBL SRAMs designed
specifically to eliminate wait states during read or write
transitions. All synchronous inputs pass through input registers
controlled by the rising edge of the clock. The clock signal is
qualified with the Clock Enable input signal (CEN). If CEN is
HIGH, the clock signal is not recognized and all internal states
are maintained. All synchronous operations are qualified with
CEN. All data outputs pass through output registers controlled by
the rising edge of the clock. Maximum access delay from the
clock rise (tCO) is 3.0 ns (250 MHz device).
Accesses can be initiated by asserting all three Chip Enables
(CE1, CE2, CE3) active at the rising edge of the clock. If CEN is
active LOW and ADV/LD is asserted LOW, the address
presented to the device is latched. The access can either be a
read or write operation, depending on the status of the Write
Enable (WE). BW[x] can be used to conduct Byte Write
operations.
Write operations are qualified by the Write Enable (WE). All
writes are simplified with on-chip synchronous self timed write
circuitry.
Three synchronous Chip Enables (CE1, CE2, CE3) and an
asynchronous Output Enable (OE) simplify depth expansion. All
operations (reads, writes, and deselects) are pipelined. ADV/LD
must be driven LOW after the device has been deselected to
load a new address for the next operation.
Single Read Accesses
A read access is initiated when the following conditions are
satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2,
and CE3 are ALL asserted active, (3) the input signal WE is
deasserted HIGH, and (4) ADV/LD is asserted LOW. The
address presented to the address inputs is latched into the
Address Register and presented to the memory core and control
logic. The control logic determines that a read access is in
progress and allows the requested data to propagate to the input
Document Number: 001-15031 Rev. *O
of the output register. At the rising edge of the next clock the
requested data is allowed to propagate through the output
register and onto the data bus within 3.0 ns (250 MHz device)
provided OE is active LOW. After the first clock of the read
access the output buffers are controlled by OE and the internal
control logic. OE must be driven LOW to drive out the requested
data. During the second clock, a subsequent operation (read,
write, or deselect) can be initiated. Deselecting the device is also
pipelined. Therefore, when the SRAM is deselected at clock rise
by one of the chip enable signals, its output tri-states following
the next clock rise.
Burst Read Accesses
The CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33
have an on-chip burst counter that enables the user to supply a
single address and conduct up to four reads without reasserting
the address inputs. ADV/LD must be driven LOW to load a new
address into the SRAM, as described in the section Single Read
Accesses. The sequence of the burst counter is determined by
the MODE input signal. A LOW input on MODE selects a linear
burst mode, a HIGH selects an interleaved burst sequence. Both
burst counters use A0 and A1 in the burst sequence, and wraps
around when incremented sufficiently. A HIGH input on ADV/LD
increments the internal burst counter regardless of the state of
chip enables inputs or WE. WE is latched at the beginning of a
burst cycle. Therefore, the type of access (read or write) is
maintained throughout the burst sequence.
Single Write Accesses
Write accesses are initiated when the following conditions are
satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2,
and CE3 are all asserted active, and (3) the signal WE is asserted
LOW. The address presented to the address inputs is loaded into
the Address Register. The write signals are latched into the
Control Logic block.
On the subsequent clock rise the data lines are automatically
tri-stated regardless of the state of the OE input signal. This
allows the external logic to present the data on DQ and DQP
(DQa,b,c,d/DQPa,b,c,d for CY7C1470BV33, DQa,b/DQPa,b for
Page 9 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
CY7C1472BV33, and DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for
CY7C1474BV33). In addition, the address for the subsequent
access (read, write, or deselect) is latched into the Address
Register (provided the appropriate control signals are asserted).
Accesses on page 9. When ADV/LD is driven HIGH on the
subsequent clock rise, the Chip Enables (CE1, CE2, and CE3)
and WE inputs are ignored and the burst counter is incremented.
The correct BW (BWa,b,c,d for CY7C1470BV33, BWa,b for
CY7C1472BV33, and BWa,b,c,d,e,f,g,h for CY7C1474BV33)
inputs must be driven in each cycle of the burst write to write the
correct bytes of data.
On the next clock rise the data presented to DQ and DQP
(DQa,b,c,d/DQPa,b,c,d for CY7C1470BV33, DQa,b/DQPa,b for
CY7C1472BV33, and DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for
CY7C1474BV33) (or a subset for byte write operations, see
Partial Write Cycle Description on page 12 for details) inputs is
latched into the device and the write is complete.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ places
the SRAM in a power conservation “sleep” mode. Two clock
cycles are required to enter into or exit from this “sleep” mode.
While in this mode, data integrity is guaranteed. Accesses
pending when entering the “sleep” mode are not considered valid
nor is the completion of the operation guaranteed. The device
must be deselected before entering the “sleep” mode. CE1, CE2,
and CE3, must remain inactive for the duration of tZZREC after the
ZZ input returns LOW.
The data written during the Write operation is controlled by BW
(BWa,b,c,d for CY7C1470BV33, BWa,b for CY7C1472BV33, and
for
CY7C1474BV33)
signals.
The
BWa,b,c,d,e,f,g,h
CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33
provides Byte Write capability that is described in Partial Write
Cycle Description on page 12. Asserting the Write Enable input
(WE) with the selected BW input selectively writes to only the
desired bytes. Bytes not selected during a Byte Write operation
remain unaltered. A synchronous self timed write mechanism
has been provided to simplify the write operations. Byte Write
capability has been included to greatly simplify read, modify, or
write sequences, which can be reduced to simple Byte Write
operations.
Interleaved Burst Address Table
(MODE = Floating or VDD)
Because the CY7C1470BV33, CY7C1472BV33, and
CY7C1474BV33 are common I/O devices, data must not be
driven into the device while the outputs are active. The OE can
be deasserted HIGH before presenting data to the DQ and DQP
(DQa,b,c,d/DQPa,b,c,d for CY7C1470BV33, DQa,b/DQPa,b for
CY7C1472BV33, and DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for
CY7C1474BV33) inputs. Doing so tri-states the output drivers.
As a safety precaution, DQ and DQP (DQa,b,c,d/DQPa,b,c,d for
CY7C1470BV33, DQa,b/DQPa,b for CY7C1472BV33, and
DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for CY7C1474BV33) are
automatically tri-stated during the data portion of a write cycle,
regardless of the state of OE.
First
Address
A1:A0
Second
Address
A1:A0
Third
Address
A1:A0
Fourth
Address
A1:A0
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
Fourth
Address
A1:A0
Linear Burst Address Table
(MODE = GND)
Burst Write Accesses
The CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33
has an on-chip burst counter that enables the user to supply a
single address and conduct up to four write operations without
reasserting the address inputs. ADV/LD must be driven LOW to
load the initial address, as described in the section Single Write
First
Address
A1:A0
Second
Address
A1:A0
Third
Address
A1:A0
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
ZZ Mode Electrical Characteristics
Parameter
Description
Test Conditions
Min
Max
Unit
IDDZZ
Sleep mode standby current
ZZ VDD 0.2 V
–
120
mA
tZZS
Device operation to ZZ
ZZVDD 0.2 V
–
2tCYC
ns
tZZREC
ZZ recovery time
ZZ 0.2 V
2tCYC
–
ns
tZZI
ZZ active to sleep current
This parameter is sampled
–
2tCYC
ns
tRZZI
ZZ Inactive to exit sleep current
This parameter is sampled
0
–
ns
Document Number: 001-15031 Rev. *O
Page 10 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Truth Table
The truth table for CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33 follows. [1, 2, 3, 4, 5, 6, 7]
Operation
Address Used CE ZZ ADV/LD WE BWx OE CEN CLK
DQ
Deselect Cycle
None
H
L
L
X
X
X
L
L–H
Tri-State
Continue Deselect Cycle
None
X
L
H
X
X
X
L
L–H
Tri-State
Read Cycle (Begin Burst)
External
L
L
L
H
X
L
L
L–H Data Out (Q)
Read Cycle (Continue Burst)
Next
X
L
H
X
X
L
L
L–H Data Out (Q)
NOP/Dummy Read (Begin Burst)
External
L
L
L
H
X
H
L
L–H
Tri-State
Dummy Read (Continue Burst)
Next
X
L
H
X
X
H
L
L–H
Tri-State
Write Cycle (Begin Burst)
External
L
L
L
L
L
X
L
L–H
Data In (D)
Write Cycle (Continue Burst)
Next
X
L
H
X
L
X
L
L–H
Data In (D)
NOP/Write Abort (Begin Burst)
None
L
L
L
L
H
X
L
L–H
Tri-State
Write Abort (Continue Burst)
Next
X
L
H
X
H
X
L
L–H
Tri-State
Ignore Clock Edge (Stall)
Current
X
L
X
X
X
X
H
L–H
-
Sleep Mode
None
X
H
X
X
X
X
X
X
Tri-State
Notes
1. X = “Don't Care”, H = Logic HIGH, L = Logic LOW, CE stands for ALL Chip Enables active. BWx = 0 signifies at least one Byte Write Select is active, BWx = Valid
signifies that the desired byte write selects are asserted, see Partial Write Cycle Description on page 12 for details.
2. Write is defined by WE and BW[a:d]. See Partial Write Cycle Description on page 12 for details.
3. When a write cycle is detected, all IOs are tri-stated, even during Byte Writes.
4. The DQ and DQP pins are controlled by the current cycle and the OE signal.
5. CEN = H inserts wait states.
6. Device powers up deselected with the IOs in a tri-state condition, regardless of OE.
7. OE is asynchronous and is not sampled with the clock rise. It is masked internally during Write cycles. During a read cycle DQs and DQP[a:d] = tri-state when OE is
inactive or when the device is deselected, and DQs= data when OE is active.
Document Number: 001-15031 Rev. *O
Page 11 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Partial Write Cycle Description
The partial write cycle description for CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33 follows. [8, 9, 10, 11]
Function (CY7C1470BV33)
WE
BWd
BWc
BWb
BWa
Read
H
X
X
X
X
Write – No bytes written
L
H
H
H
H
Write Byte a – (DQa and DQPa)
L
H
H
H
L
Write Byte b – (DQb and DQPb)
L
H
H
L
H
Write Bytes b, a
L
H
H
L
L
Write Byte c – (DQc and DQPc)
L
H
L
H
H
Write Bytes c, a
L
H
L
H
L
Write Bytes c, b
L
H
L
L
H
Write Bytes c, b, a
L
H
L
L
L
Write Byte d – (DQd and DQPd)
L
L
H
H
H
Write Bytes d, a
L
L
H
H
L
Write Bytes d, b
L
L
H
L
H
Write Bytes d, b, a
L
L
H
L
L
Write Bytes d, c
L
L
L
H
H
Write Bytes d, c, a
L
L
L
H
L
Write Bytes d, c, b
L
L
L
L
H
Write All Bytes
L
L
L
L
L
Function (CY7C1472BV33)
WE
BWb
BWa
Read
H
x
x
Write – No Bytes Written
L
H
H
Write Byte a – (DQa and DQPa)
L
H
L
Write Byte b – (DQb and DQPb)
L
L
H
Write Both Bytes
L
L
L
Function (CY7C1474BV33)
WE
BWx
Read
H
x
Write – No Bytes Written
L
H
Write Byte X(DQx and DQPx)
L
L
Write All Bytes
L
All BW = L
Notes
8. X = “Don't Care”, H = Logic HIGH, L = Logic LOW, CE stands for ALL Chip Enables active. BWx = 0 signifies at least one Byte Write Select is active, BWx = Valid
signifies that the desired byte write selects are asserted, see Partial Write Cycle Description on page 12 for details.
9. Write is defined by WE and BW[a:d]. See Partial Write Cycle Description on page 12 for details.
10. When a write cycle is detected, all IOs are tri-stated, even during Byte Writes.
11. Table lists only a partial listing of the Byte Write combinations. Any combination of BW[a:d] is valid. Appropriate Write is based on which Byte Write is active.
Document Number: 001-15031 Rev. *O
Page 12 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
IEEE 1149.1 Serial Boundary Scan (JTAG)
The CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33
incorporates a serial boundary scan test access port (TAP). This
port operates in accordance with IEEE Standard 1149.1-1990
but does not have the set of functions required for full 1149.1
compliance. These functions from the IEEE specification are
excluded because their inclusion places an added delay in the
critical speed path of the SRAM. Note that the TAP controller
functions in a manner that does not conflict with the operation of
other devices using 1149.1 fully compliant TAPs. The TAP
operates using JEDEC-standard 3.3 V or 2.5 V I/O logic levels.
The CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33
contains a TAP controller, instruction register, boundary scan
register, bypass register, and ID register.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are
internally pulled up and may be unconnected. They may
alternately be connected to VDD through a pull up resistor. TDO
must be left unconnected. During power up, the device comes
up in a reset state, which does not interfere with the operation of
the device.
Test Access Port (TAP)
Test Clock (TCK)
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
Test Mode Select (TMS)
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. It is allowable to leave
this ball unconnected if the TAP is not used. The ball is pulled up
internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI ball is used to serially input information into the registers
and can be connected to the input of any of the registers. The
register between TDI and TDO is chosen by the instruction that
is loaded into the TAP instruction register. For information about
loading the instruction register, see the TAP Controller State
Diagram. TDI is internally pulled up and can be unconnected if
the TAP is unused in an application. TDI is connected to the most
significant bit (MSB) of any register.
Test Data-Out (TDO)
The TDO output ball is used to serially clock data-out from the
registers. The output is active depending upon the current state
of the TAP state machine. The output changes on the falling edge
of TCK. TDO is connected to the least significant bit (LSB) of any
register.
Document Number: 001-15031 Rev. *O
Performing a TAP Reset
A RESET is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This RESET does not affect the operation of the
SRAM and may be performed while the SRAM is operating.
During power up, the TAP is reset internally to ensure that TDO
comes up in a High Z state.
TAP Registers
Registers are connected between the TDI and TDO balls and
scans data into and out of the SRAM test circuitry. Only one
register can be selected at a time through the instruction register.
Data is serially loaded into the TDI ball on the rising edge of TCK.
Data is output on the TDO ball on the falling edge of TCK.
Instruction Register
Three bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the TDI
and TDO balls as shown in the TAP Controller Block Diagram on
page 16. During power up, the instruction register is loaded with
the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as described
in the previous section.
When the TAP controller is in the Capture-IR state, the two least
significant bits are loaded with a binary ‘01’ pattern to enable fault
isolation of the board-level serial test data path.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single bit register that can be placed between the
TDI and TDO balls. This shifts data through the SRAM with
minimal delay. The bypass register is set LOW (VSS) when the
BYPASS instruction is executed.
Boundary Scan Register
The boundary scan register is connected to all the input and
bidirectional balls on the SRAM.
The boundary scan register is loaded with the contents of the
RAM I/O ring when the TAP controller is in the Capture-DR state
and is then placed between the TDI and TDO balls when the
controller is moved to the Shift-DR state. The EXTEST,
SAMPLE/PRELOAD and SAMPLE Z instructions can be used to
capture the contents of the I/O ring.
The Boundary Scan Order tables show the order in which the bits
are connected. Each bit corresponds to one of the bumps on the
SRAM package. The MSB of the register is connected to TDI and
the LSB is connected to TDO.
Identification (ID) Register
The ID register is loaded with a vendor-specific, 32 bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired into
the SRAM and can be shifted out when the TAP controller is in
the Shift-DR state. The ID register has a vendor code and other
information described in Identification Register Definitions on
page 20.
Page 13 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
TAP Instruction Set
Overview
Eight different instructions are possible with the three bit
instruction register. All combinations are listed in Identification
Codes on page 20. Three of these instructions are listed as
RESERVED and must not be used. The other five instructions
are described in this section in detail.
The TAP controller used in this SRAM is not fully compliant to the
1149.1 convention because some of the mandatory 1149.1
instructions are not fully implemented.
The TAP controller cannot be used to load address data or
control signals into the SRAM and cannot preload the I/O buffers.
The SRAM does not implement the 1149.1 commands EXTEST
or INTEST or the PRELOAD portion of SAMPLE/PRELOAD;
rather, it performs a capture of the I/O ring when these
instructions are executed.
Instructions are loaded into the TAP controller during the Shift-IR
state when the instruction register is placed between TDI and
TDO. During this state, instructions are shifted through the
instruction register through the TDI and TDO balls. To execute
the instruction after it is shifted in, the TAP controller is moved
into the Update-IR state.
EXTEST
EXTEST is a mandatory 1149.1 instruction which is executed
whenever the instruction register is loaded with all 0s. EXTEST
is not implemented in this SRAM TAP controller, and therefore
this device is not compliant to 1149.1. The TAP controller does
recognize an all-0 instruction.
When an EXTEST instruction is loaded into the instruction
register, the SRAM responds as if a SAMPLE/PRELOAD
instruction has been loaded. There is one difference between the
two instructions. Unlike the SAMPLE/PRELOAD instruction,
EXTEST places the SRAM outputs in a High Z state.
IDCODE
The IDCODE instruction loads a vendor-specific, 32 bit code into
the instruction register. It also places the instruction register
between the TDI and TDO balls and shifts the IDCODE out of the
device when the TAP controller enters the Shift-DR state.
The IDCODE instruction is loaded into the instruction register
during power up or whenever the TAP controller is in a test logic
reset state.
SAMPLE Z
The SAMPLE Z instruction connects the boundary scan register
between the TDI and TDO balls when the TAP controller is in a
Document Number: 001-15031 Rev. *O
Shift-DR state. It also places all SRAM outputs into a High Z
state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. The
PRELOAD portion of this instruction is not implemented, so the
device TAP controller is not fully 1149.1 compliant.
When the SAMPLE/PRELOAD instruction is loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the inputs and bidirectional balls is
captured in the boundary scan register.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because there
is a large difference in the clock frequencies, it is possible that
during the Capture-DR state, an input or output may undergo a
transition. The TAP may then try to capture a signal while in
transition (metastable state). This does not harm the device, but
there is no guarantee as to the value that is captured.
Repeatable results may not be possible.
To guarantee that the boundary scan register captures the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller’s capture setup plus hold
time (tCS plus tCH).
The SRAM clock input might not be captured correctly if there is
no way in a design to stop (or slow) the clock during a
SAMPLE/PRELOAD instruction. If this is an issue, it is still
possible to capture all other signals and simply ignore the value
of the CLK captured in the boundary scan register.
After the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO balls.
Note that since the PRELOAD part of the command is not
implemented, putting the TAP to the Update-DR state while
performing a SAMPLE/PRELOAD instruction has the same
effect as the Pause-DR command.
BYPASS
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO balls. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Page 14 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
TAP Controller State Diagram
1
TEST-LOGIC
RESET
0
0
RUN-TEST/
IDLE
1
SELECT
DR-SCA N
1
SELECT
IR-SCAN
0
1
0
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
1
1
EXIT1-IR
0
1
0
PAUSE-DR
0
PAUSE-IR
1
0
1
EXIT2-DR
0
EXIT2-IR
1
1
UPDATE-DR
1
0
1
EXIT1-DR
0
1
0
UPDATE-IR
1
0
The 0/1 next to each state represents the value of TMS at the rising edge of TCK.
Document Number: 001-15031 Rev. *O
Page 15 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
TAP Controller Block Diagram
0
Bypass Register
2 1 0
TDI
Selection
Circuitry
Instruction Register
Selection
Circuitry
TDO
31 30 29 . . . 2 1 0
Identification Register
x . . . . . 2 1 0
Boundary Scan Register
TCK
TM S
Document Number: 001-15031 Rev. *O
TAP CONTROLLER
Page 16 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
TAP Timing
Figure 4. TAP Timing
1
2
3
4
5
6
Test Clock
(TCK )
t TH
t TM SS
t TM SH
t TDIS
t TDIH
t
TL
t CY C
Test M ode Select
(TM S)
Test Data-In
(TDI)
t TDOV
t TDOX
Test Data-Out
(TDO)
DON’T CA RE
Document Number: 001-15031 Rev. *O
UNDEFINED
Page 17 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
TAP AC Switching Characteristics
Over the Operating Range
Parameter [12, 13]
Description
Min
Max
Unit
Clock
tTCYC
TCK Clock Cycle Time
50
–
ns
tTF
TCK Clock Frequency
–
20
MHz
tTH
TCK Clock HIGH time
20
–
ns
tTL
TCK Clock LOW time
20
–
ns
tTDOV
TCK Clock LOW to TDO Valid
–
10
ns
tTDOX
TCK Clock LOW to TDO Invalid
0
–
ns
tTMSS
TMS Setup to TCK Clock Rise
5
–
ns
tTDIS
TDI Setup to TCK Clock Rise
5
–
ns
tCS
Capture Setup to TCK Rise
5
–
ns
tTMSH
TMS Hold after TCK Clock Rise
5
–
ns
tTDIH
TDI Hold after Clock Rise
5
–
ns
tCH
Capture Hold after Clock Rise
5
–
ns
Output Times
Setup Times
Hold Times
Notes
12. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.
13. Test conditions are specified using the load in TAP AC Test Conditions. tR/tF = 1 ns.
Document Number: 001-15031 Rev. *O
Page 18 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
3.3 V TAP AC Test Conditions
2.5 V TAP AC Test Conditions
Input pulse levels ...............................................VSS to 3.3 V
Input pulse levels ............................................... VSS to 2.5 V
Input rise and fall times ...................................................1 ns
Input rise and fall time ....................................................1 ns
Input timing reference levels ......................................... 1.5 V
Input timing reference levels ....................................... 1.25 V
Output reference levels ................................................ 1.5 V
Output reference levels .............................................. 1.25 V
Test load termination supply voltage ............................ 1.5 V
Test load termination supply voltage .......................... 1.25 V
3.3 V TAP AC Output Load Equivalent
2.5 V TAP AC Output Load Equivalent
1.25V
1.5V
50Ω
50Ω
TDO
TDO
Z O= 50Ω
Z O= 50Ω
20pF
20pF
TAP DC Electrical Characteristics and Operating Conditions
(0 °C < TA < +70 °C; VDD = 3.135 V to 3.6 V unless otherwise noted)
Parameter [14]
VOH1
VOH2
VOL1
VOL2
VIH
VIL
IX
Description
Output HIGH Voltage
Output HIGH Voltage
Output LOW Voltage
Output LOW Voltage
Test Conditions
Min
Max
Unit
IOH = –4.0 mA,VDDQ = 3.3 V
2.4
–
V
IOH = –1.0 mA,VDDQ = 2.5 V
2.0
–
V
IOH = –100 µA
VDDQ = 3.3 V
2.9
–
V
VDDQ = 2.5 V
2.1
–
V
IOL = 8.0 mA
VDDQ = 3.3 V
–
0.4
V
IOL = 1.0 mA
VDDQ = 2.5 V
–
0.4
V
IOL = 100 µA
VDDQ = 3.3 V
–
0.2
V
VDDQ = 2.5 V
–
0.2
V
VDDQ = 3.3 V
2.0
VDD + 0.3
V
VDDQ = 2.5 V
1.7
VDD + 0.3
V
VDDQ = 3.3 V
–0.3
0.8
V
VDDQ = 2.5 V
–0.3
0.7
V
–5
5
µA
Input HIGH Voltage
Input LOW Voltage
Input Load Current
GND < VIN < VDDQ
Note
14. All voltages refer to VSS (GND).
Document Number: 001-15031 Rev. *O
Page 19 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Identification Register Definitions
CY7C1470BV33 CY7C1472BV33 CY7C1474BV33
(2M × 36)
(4M × 18)
(1M × 72)
Instruction Field
Revision Number (31:29)
Description
000
000
000
01011
01011
01011
Reserved for internal use
Architecture/Memory Type(23:18)
001000
001000
001000
Defines memory type and
architecture
Bus Width/Density(17:12)
100100
010100
110100
Defines width and density
00000110100
00000110100
00000110100
Enables unique identification of
SRAM vendor
1
1
1
Indicates the presence of an ID
register
Device Depth (28:24)
[15]
Cypress JEDEC ID Code (11:1)
ID Register Presence Indicator (0)
Describes the version number
Scan Register Sizes
Register Name
Bit Size (× 36)
Bit Size (× 18)
Bit Size (× 72)
Instruction
3
3
3
Bypass
1
1
1
ID
32
32
32
Boundary Scan Order – 165-ball FBGA
71
52
–
Boundary Scan Order – 209-ball FBGA
–
–
110
Identification Codes
Instruction
Code
Description
EXTEST
000
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces
all SRAM outputs to High Z state. This instruction is not 1149.1 compliant.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operations.
SAMPLE Z
010
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces
all SRAM output drivers to a High Z state.
RESERVED
011
Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD
100
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Does
not affect SRAM operation. This instruction does not implement 1149.1 preload function and
is therefore not 1149.1 compliant.
RESERVED
101
Do Not Use: This instruction is reserved for future use.
Note
15. Bit #24 is “1” in the ID Register Definitions for both 2.5 V and 3.3 V versions of this device.
Document Number: 001-15031 Rev. *O
Page 20 of 35
CY7C1470BV33
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CY7C1474BV33
Boundary Scan Exit Order
(2M × 36)
Bit #
165-ball ID
Bit #
165-ball ID
Bit #
165-ball ID
Bit #
165-ball ID
1
C1
21
R3
2
D1
22
P2
41
J11
61
B7
42
K10
62
B6
3
E1
23
R4
43
J10
63
A6
4
D2
24
P6
44
H11
64
B5
5
E2
25
R6
45
G11
65
A5
6
F1
26
R8
46
F11
66
A4
7
G1
27
P3
47
E11
67
B4
8
F2
28
P4
48
D10
68
B3
9
G2
29
P8
49
D11
69
A3
10
J1
30
P9
50
C11
70
A2
11
K1
31
P10
51
G10
71
B2
12
L1
32
R9
52
F10
13
J2
33
R10
53
E10
14
M1
34
R11
54
A9
15
N1
35
N11
55
B9
16
K2
36
M11
56
A10
17
L2
37
L11
57
B10
18
M2
38
M10
58
A8
19
R1
39
L10
59
B8
20
R2
40
K11
60
A7
165-ball ID
Bit #
165-ball ID
Boundary Scan Exit Order
(4M × 18)
Bit #
165-ball ID
Bit #
165-ball ID
Bit #
1
D2
14
R4
27
L10
40
B10
2
E2
15
P6
28
K10
41
A8
3
F2
16
R6
29
J10
42
B8
4
G2
17
R8
30
H11
43
A7
5
J1
18
P3
31
G11
44
B7
6
K1
19
P4
32
F11
45
B6
7
L1
20
P8
33
E11
46
A6
8
M1
21
P9
34
D11
47
B5
9
N1
22
P10
35
C11
48
A4
10
R1
23
R9
36
A11
49
B3
11
R2
24
R10
37
A9
50
A3
12
R3
25
R11
38
B9
51
A2
13
P2
26
M10
39
A10
52
B2
Document Number: 001-15031 Rev. *O
Page 21 of 35
CY7C1470BV33
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Boundary Scan Exit Order
(1M × 72)
Bit #
209-ball ID
Bit #
209-ball ID
Bit #
209-ball ID
Bit #
209-ball ID
1
A1
29
T1
57
U10
85
B11
2
A2
30
T2
58
T11
86
B10
3
B1
31
U1
59
T10
87
A11
4
B2
32
U2
60
R11
88
A10
5
C1
33
V1
61
R10
89
A7
6
C2
34
V2
62
P11
90
A5
7
D1
35
W1
63
P10
91
A9
8
D2
36
W2
64
N11
92
U8
9
E1
37
T6
65
N10
93
A6
10
E2
38
V3
66
M11
94
D6
11
F1
39
V4
67
M10
95
K6
12
F2
40
U4
68
L11
96
B6
13
G1
41
W5
69
L10
97
K3
14
G2
42
V6
70
P6
98
A8
15
H1
43
W6
71
J11
99
B4
16
H2
44
V5
72
J10
100
B3
17
J1
45
U5
73
H11
101
C3
18
J2
46
U6
74
H10
102
C4
19
L1
47
W7
75
G11
103
C8
20
L2
48
V7
76
G10
104
C9
21
M1
49
U7
77
F11
105
B9
22
M2
50
V8
78
F10
106
B8
23
N1
51
V9
79
E10
107
A4
24
N2
52
W11
80
E11
108
C6
25
P1
53
W10
81
D11
109
B7
26
P2
54
V11
82
D10
110
A3
27
R2
55
V10
83
C11
28
R1
56
U11
84
C10
Document Number: 001-15031 Rev. *O
Page 22 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Maximum Ratings
Operating Range
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Range
Ambient
Temperature
VDD
VDDQ
0 °C to +70 °C
3.3 V– 5% /
+10%
2.5 V – 5% to
VDD
Storage Temperature ............................... –65 °C to +150 °C
Commercial
Ambient Temperature with
Power Applied ......................................... –55 °C to +125 °C
Industrial
Supply Voltage on VDD Relative to GND .....–0.5 V to +4.6 V
Neutron Soft Error Immunity
Supply Voltage on VDDQ Relative to GND .... –0.5 V to +VDD
DC to Outputs in Tri-State .................–0.5 V to VDDQ + 0.5 V
DC Input Voltage ................................ –0.5 V to VDD + 0.5 V
Parameter
–40 °C to +85 °C
Description
Test
Conditions Typ
Max*
Unit
LSBU
Logical Single
Bit Upsets
25 °C
361
394
FIT/
Mb
Static Discharge Voltage
(MIL-STD-883, Method 3015) .................................. > 2001V
LMBU
Logical Multi
Bit Upsets
25 °C
0
0.01
FIT/
Mb
Latch Up Current ................................................... > 200 mA
SEL
Single Event
Latch up
85 °C
0
0.1
FIT/
Dev
Current into Outputs (LOW) ........................................ 20 mA
* No LMBU or SEL events occurred during testing; this column represents a
statistical 2, 95% confidence limit calculation. For more details refer to Application
Note AN54908 “Accelerated Neutron SER Testing and Calculation of Terrestrial
Failure Rates”.
Electrical Characteristics
Over the Operating Range
Parameter [16, 17]
Description
VDD
Power supply voltage
VDDQ
I/O supply voltage
VOH
VOL
VIH
VIL
IX
Min
Max
Unit
3.135
3.6
V
For 3.3 V I/O
3.135
VDD
V
For 2.5 V I/O
2.375
2.625
V
For 3.3 V I/O, IOH =4.0 mA
2.4
–
V
For 2.5 V I/O, IOH=1.0 mA
2.0
–
V
For 3.3 V I/O, IOL=8.0 mA
–
0.4
V
For 2.5 V I/O, IOL=1.0 mA
–
0.4
V
For 3.3 V I/O
2.0
VDD + 0.3
V
For 2.5 V I/O
1.7
VDD + 0.3
V
For 3.3 V I/O
–0.3
0.8
V
For 2.5 V I/O
–0.3
0.7
V
Input leakage current except ZZ GND VI VDDQ
and MODE
–5
5
A
Input current of MODE
Input = VSS
–30
–
A
Input = VDD
–
5
A
Input = VSS
–5
–
A
Input = VDD
–
30
A
GND VI VDDQ, output disabled
–5
5
A
Output HIGH voltage
Output LOW voltage
Input HIGH voltage
[16]
Input LOW voltage
[16]
Input current of ZZ
IOZ
Test Conditions
Output leakage current
Notes
16. Overshoot: VIH(AC) < VDD + 1.5 V (pulse width less than tCYC/2). Undershoot: VIL(AC) > –2 V (pulse width less than tCYC/2).
17. Tpower up: assumes a linear ramp from 0 V to VDD(min) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
Document Number: 001-15031 Rev. *O
Page 23 of 35
CY7C1470BV33
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CY7C1474BV33
Electrical Characteristics (continued)
Over the Operating Range
Parameter [16, 17]
IDD
[18]
ISB1
Description
VDD Operating Supply
Automatic CE power-down
current – TTL Inputs
Test Conditions
VDD = Max, IOUT = 0 mA,
f = fMAX = 1/tCYC
Max VDD, Device Deselected,
VIN VIH or VIN VIL,
f = fMAX = 1/tCYC
Min
Max
Unit
4.0-ns cycle,
250 MHz
–
500
mA
5.0-ns cycle,
200 MHz
–
500
mA
6.0-ns cycle,
167 MHz
–
450
mA
4.0-ns cycle,
250 MHz
–
245
mA
5.0-ns cycle,
200 MHz
–
245
mA
6.0-ns cycle,
167 MHz
–
245
mA
ISB2
Automatic CE power-down
current – CMOS Inputs
Max VDD, Device Deselected,
All speed
VIN 0.3 V or VIN > VDDQ 0.3 V, grades
f=0
–
120
mA
ISB3
Automatic CE power-down
current – CMOS Inputs
Max VDD, Device Deselected,
4.0-ns cycle,
VIN 0.3 V or VIN > VDDQ 0.3 V, 250 MHz
f = fMAX = 1/tCYC
5.0-ns cycle,
200 MHz
–
245
mA
–
245
mA
6.0-ns cycle,
167 MHz
–
245
mA
All speed
grades
–
135
mA
ISB4
Automatic CE Power Down
Current – TTL Inputs
Max VDD, Device Deselected,
VIN VIH or VIN VIL, f = 0
Note
18. The operation current is calculated with 50% read cycle and 50% write cycle.
Document Number: 001-15031 Rev. *O
Page 24 of 35
CY7C1470BV33
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CY7C1474BV33
Capacitance
Parameter [19]
Description
CADDRESS
Address input capacitance
CDATA
Data input capacitance
CCTRL
Control input capacitance
CCLK
CIO
Test Conditions
100-pin TQFP 165-ball FBGA 209-ball FBGA Unit
Max
Max
Max
TA = 25 C, f = 1 MHz,
VDD = 3.3 V, VDDQ = 2.5 V
6
6
6
pF
5
5
5
pF
8
8
8
pF
Clock input capacitance
6
6
6
pF
I/O capacitance
5
5
5
pF
Thermal Resistance
Parameter [19]
Description
JA
Thermal resistance
(junction to ambient)
JC
Thermal resistance
(junction to case)
Test Conditions
100-pin TQFP 165-ball FBGA 209-ball FBGA
Unit
Package
Package
Package
Test
conditions
follow
standard test methods and
procedures for measuring
thermal impedance, per
EIA/JESD51.
24.63
16.3
15.2
C/W
2.28
2.1
1.7
C/W
AC Test Loads and Waveforms
Figure 5. AC Test Loads and Waveforms
3.3 V I/O Test Load
R = 317
3.3 V
OUTPUT
OUTPUT
RL = 50
Z0 = 50
GND
5 pF
R = 351
VL = 1.5 V
INCLUDING
JIG AND
SCOPE
(a)
2.5 V I/O Test Load
OUTPUT
RL = 50
Z0 = 50
INCLUDING
JIG AND
SCOPE
1 ns
1 ns
(c)
ALL INPUT PULSES
VDDQ
GND
5 pF
90%
10%
90%
(b)
R = 1538
VL = 1.25 V
(a)
10%
R = 1667
2.5 V
OUTPUT
ALL INPUT PULSES
VDDQ
(b)
10%
90%
10%
90%
1 ns
1 ns
(c)
Note
19. Tested initially and after any design or process changes that may affect these parameters.
Document Number: 001-15031 Rev. *O
Page 25 of 35
CY7C1470BV33
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Switching Characteristics
Over the Operating Range
Parameter [20, 21]
tPower[22]
-250
Description
VCC(typical) to the first access read or
write
-200
-167
Unit
Min
Max
Min
Max
Min
Max
1
–
1
–
1
–
4.0
–
5.0
–
6.0
–
ns
–
250
–
200
–
167
MHz
ms
Clock
tCYC
Clock cycle time
FMAX
Maximum operating frequency
tCH
Clock HIGH
2.0
–
2.0
–
2.2
–
ns
tCL
Clock LOW
2.0
–
2.0
–
2.2
–
ns
Output Times
tCO
Data output valid after CLK rise
–
3.0
–
3.0
–
3.4
ns
tOEV
OE LOW to output valid
–
3.0
–
3.0
–
3.4
ns
tDOH
Data output hold after CLK rise
1.3
–
1.3
–
1.5
–
ns
[23, 24, 25]
tCHZ
Clock to high Z
tCLZ
Clock to low Z [23, 24, 25]
tEOHZ
tEOLZ
OE HIGH to output high Z
OE LOW to output low Z
[23, 24, 25]
[23, 24, 25]
–
3.0
–
3.0
–
3.4
ns
1.3
–
1.3
–
1.5
–
ns
–
3.0
–
3.0
–
3.4
ns
0
–
0
–
0
–
ns
Setup Times
tAS
Address setup before CLK rise
1.4
–
1.4
–
1.5
–
ns
tDS
Data input setup before CLK rise
1.4
–
1.4
–
1.5
–
ns
tCENS
CEN setup before CLK rise
1.4
–
1.4
–
1.5
–
ns
tWES
WE, BWx setup before CLK rise
1.4
–
1.4
–
1.5
–
ns
tALS
ADV/LD setup before CLK rise
1.4
–
1.4
–
1.5
–
ns
tCES
Chip select setup
1.4
–
1.4
–
1.5
–
ns
tAH
Address hold after CLK rise
0.4
–
0.4
–
0.5
–
ns
tDH
Data input hold after CLK rise
0.4
–
0.4
–
0.5
–
ns
tCENH
CEN hold after CLK rise
0.4
–
0.4
–
0.5
–
ns
tWEH
WE, BWx hold after CLK rise
0.4
–
0.4
–
0.5
–
ns
tALH
ADV/LD hold after CLK rise
0.4
–
0.4
–
0.5
–
ns
tCEH
Chip select hold after CLK rise
0.4
–
0.4
–
0.5
–
ns
Hold Times
Notes
20. Timing reference is 1.5 V when VDDQ = 3.3 V and is 1.25 V when VDDQ = 2.5 V.
21. Test conditions shown in (a) of Figure 5 on page 25 unless otherwise noted.
22. This part has an internal voltage regulator; tpower is the time power is supplied above VDD minimum initially, before a read or write operation can be initiated.
23. tCHZ, tCLZ, tEOLZ, and tEOHZ are specified with AC test conditions shown in (b) of Figure 5 on page 25. Transition is measured ±200 mV from steady-state voltage.
24. At any voltage and temperature, tEOHZ is less than tEOLZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus.
These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High
Z before Low Z under the same system conditions.
25. This parameter is sampled and not 100% tested.
Document Number: 001-15031 Rev. *O
Page 26 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Switching Waveforms
Figure 6. Read/Write Timing [26, 27, 28]
1
2
3
t CYC
4
5
6
A3
A4
7
8
9
A5
A6
10
CLK
t CENS
t CENH
t CES
t CEH
t CL
t CH
CEN
CE
ADV/LD
WE
BW x
A1
ADDRESS
A2
A7
t CO
t AS
t DS
t AH
Data
In-Out (DQ)
t DH
D(A1)
t CLZ
D(A2)
D(A2+1)
t DOH
Q(A3)
t OEV
Q(A4)
t CHZ
Q(A4+1)
D(A5)
Q(A6)
t OEHZ
t DOH
t OELZ
OE
WRITE
D(A1)
WRITE
D(A2)
BURST
WRITE
D(A2+1)
READ
Q(A3)
DON’T CARE
READ
Q(A4)
BURST
READ
Q(A4+1)
WRITE
D(A5)
READ
Q(A6)
WRITE
D(A7)
DESELECT
UNDEFINED
Notes
26. For this waveform ZZ is tied LOW.
27. When CE is LOW, CE1 is LOW, CE2 is HIGH, and CE3 is LOW. When CE is HIGH, CE1 is HIGH, CE2 is LOW or CE3 is HIGH.
28. Order of the Burst sequence is determined by the status of the MODE (0 = Linear, 1= Interleaved). Burst operations are optional.
Document Number: 001-15031 Rev. *O
Page 27 of 35
CY7C1470BV33
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Switching Waveforms (continued)
Figure 7. NOP, STALL and DESELECT Cycles [29, 30, 31]
1
2
A1
A2
3
4
5
A3
A4
6
7
8
9
10
CLK
CEN
CE
ADV/LD
WE
BWx
ADDRESS
A5
t CHZ
D(A1)
Data
Q(A2)
D(A4)
Q(A3)
Q(A5)
In-Out (DQ)
WRITE
D(A1)
READ
Q(A2)
STALL
READ
Q(A3)
WRITE
D(A4)
STALL
DON’T CARE
NOP
READ
Q(A5)
DESELECT
CONTINUE
DESELECT
UNDEFINED
Figure 8. ZZ Mode Timing [32, 33]
CLK
t ZZ
ZZ
I
t
t ZZREC
ZZI
SUPPLY
I DDZZ
t RZZI
A LL INPUTS
(except ZZ)
Outputs (Q)
DESELECT or READ Only
High-Z
DON’T CARE
Notes
29. For this waveform ZZ is tied LOW.
30. When CE is LOW, CE1 is LOW, CE2 is HIGH, and CE3 is LOW. When CE is HIGH, CE1 is HIGH, CE2 is LOW or CE3 is HIGH.
31. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrated CEN being used to create a pause. A Write is not performed during this cycle.
32. Device must be deselected when entering ZZ mode. See Truth Table on page 11 for all possible signal conditions to deselect the device.
33. IOs are in High Z when exiting ZZ sleep mode.
Document Number: 001-15031 Rev. *O
Page 28 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Ordering Information
The table below contains only the parts that are currently available. If you don’t see what you are looking for, please contact your local
sales representative. For more information, visit the Cypress website at www.cypress.com and refer to the product summary page at
http://www.cypress.com/products.
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives and distributors. To find the office
closest to you, visit us at http://www.cypress.com/go/datasheet/offices.
Speed
(MHz)
167
Ordering Code
Package
Diagram
Part and Package Type
CY7C1470BV33-167AXC
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free
CY7C1470BV33-167BZXC
51-85165 165-ball FBGA (15 × 17 × 1.4 mm) Pb-free
CY7C1470BV33-167AXI
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free
Operating
Range
Commercial
lndustrial
CY7C1472BV33-167AXI
200
250
CY7C1470BV33-167BZI
51-85165 165-ball FBGA (15 × 17 × 1.4 mm)
CY7C1470BV33-200AXC
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free
CY7C1472BV33-200BZXC
51-85165 165-ball FBGA (15 × 17 × 1.4 mm) Pb-free
CY7C1474BV33-200BGXC
51-85167 209-ball FBGA (14 × 22 × 1.76 mm) Pb-free
CY7C1470BV33-200AXI
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free
CY7C1470BV33-200BZXI
51-85165 165-ball FBGA (15 × 17 × 1.4 mm) Pb-free
CY7C1470BV33-250BZXC
51-85165 165-ball FBGA (15 × 17 × 1.4 mm) Pb-free
Commercial
lndustrial
Commercial
Ordering Code Definitions
CY 7
C
14XX
B
V33 - XXX XX X X
Temperature Range: X = C or I
C = Commercial; I = Industrial
Pb-free
Package Type: XX = A or BZ or BG
A = 100-pin TQFP
BZ = 165-ball FBGA
BG = 209-ball FBGA
Speed Grade: XXX = 167 MHz or 200 MHz or 250 MHz
V33 = 3.3 V
Die Revision
Part Identifier: 14XX = 1470 or 1472 or 1474
Technology Code: C = CMOS
Marketing Code: 7 = SRAM
Company ID: CY = Cypress
Document Number: 001-15031 Rev. *O
Page 29 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Package Diagrams
Figure 9. 100-pin TQFP (14 × 20 × 1.4 mm) A100RA Package Outline, 51-85050
ș2
ș1
ș
SYMBOL
DIMENSIONS
MIN. NOM. MAX.
A
1.60
A1
0.05
A2
1.35 1.40 1.45
0.15
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. BODY LENGTH DIMENSION DOES NOT
INCLUDE MOLD PROTRUSION/END FLASH.
D
15.80 16.00 16.20
MOLD PROTRUSION/END FLASH SHALL
D1
13.90 14.00 14.10
E
21.80 22.00 22.20
NOT EXCEED 0.0098 in (0.25 mm) PER SIDE.
BODY LENGTH DIMENSIONS ARE MAX PLASTIC
E1
19.90 20.00 20.10
R1
0.08
0.20
R2
0.08
0.20
ș
0°
7°
ș1
0°
ș2
11°
13°
12°
0.20
c
b
0.22 0.30 0.38
L
0.45 0.60 0.75
L1
L2
L3
e
BODY SIZE INCLUDING MOLD MISMATCH.
3. JEDEC SPECIFICATION NO. REF: MS-026.
1.00 REF
0.25 BSC
0.20
0.65 TYP
51-85050 *G
Document Number: 001-15031 Rev. *O
Page 30 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Package Diagrams (continued)
Figure 10. 165-ball FBGA (15 × 17 × 1.40 mm) (0.45 Ball Diameter) Package Outline, 51-85165
51-85165 *E
Document Number: 001-15031 Rev. *O
Page 31 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Package Diagrams (continued)
Figure 11. 209-ball FBGA (14 × 22 × 1.76 mm) BB209A Package Outline, 51-85167
51-85167 *C
Document Number: 001-15031 Rev. *O
Page 32 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Acronyms
Acronym
Document Conventions
Description
Units of Measure
CMOS
Complementary Metal Oxide Semiconductor
EIA
Electronic Industries Alliance
°C
degree Celsius
FBGA
Fine-Pitch Ball Grid Array
MHz
megahertz
I/O
Input/Output
µA
microampere
JTAG
Joint Test Action Group
µs
microsecond
LSB
Least Significant Bit
mA
milliampere
LMBU
Logical Multi Bit Upsets
mm
millimeter
LSBU
Logical Single Bit Upsets
ms
millisecond
MSB
Most Significant Bit
ns
nanosecond
OE
Output Enable
SEL
Single Event Latch-up
SRAM
Static Random Access Memory
TAP
Test Access Port
TCK
Test Clock
TDI
Test Data-In
TDO
Test Data-Out
TMS
Test Mode Select
TQFP
Thin Quad Flat Pack
TTL
Transistor-Transistor Logic
WE
Write Enable
Document Number: 001-15031 Rev. *O
Symbol
Unit of Measure
ohm
%
percent
pF
picofarad
V
volt
W
watt
Page 33 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Document History Page
Document Title: CY7C1470BV33/CY7C1472BV33/CY7C1474BV33, 72-Mbit (2M × 36/4M × 18/1M × 72) Pipelined SRAM with
NoBL™ Architecture
Document Number: 001-15031
Revision
ECN
Orig. of
Change
Submission
Date
**
1032642
VKN /
KKVTMP
05/02/2007
New data sheet.
*A
1897447
VKN /
AESA
01/09/2008
Updated Electrical Characteristics (Added Note 18 and referred the same note
in IDD parameter).
Description of Change
*B
2082487
VKN
02/11/2008
Changed status from Preliminary to Final.
*C
2159486
VKN /
PYRS
03/03/2008
Minor Change (Post to external web).
*D
2755901
VKN
08/25/2009
Added Neutron Soft Error Immunity.
Updated Ordering Information (Updated part numbers; and modified the
disclaimer for the Ordering information).
Updated Package Diagrams:
spec 51-85165 – Changed revision from *A to *B.
*E
2903057
VKN
04/01/2010
Updated Ordering Information (Updated part numbers).
Updated Package Diagrams:
spec 51-85050 – Changed revision from *B to *C.
spec 51-85167 – Changed revision from ** to *A.
*F
2953769
YHB
06/16/2010
Updated Ordering Information (Updated part numbers).
*G
3052861
NJY
10/08/2010
Updated Ordering Information:
Updated part numbers.
Added Ordering Code Definitions.
*H
3253430
NJY
05/10/2011
Updated Ordering Information (Updated part numbers).
Updated Package Diagrams
spec 51-85050 – Changed revision from *C to *D.
Added Acronyms and Units of Measure.
Updated to new template.
Completing Sunset Review.
*I
3425159
VIDB
11/11/2011
Updated Ordering Information (Updated part numbers).
Updated Package Diagrams
spec 51-85165 – Changed revision from *B to *D.
spec 51-85167 – Changed revision from *A to *B.
*J
3593603
PRIT /
GOPA
04/26/2012
Updated Ordering Information (Updated part numbers).
Completing Sunset Review.
*K
4010294
PRIT
05/24/2013
Updated Package Diagrams:
spec 51-85167 – Changed revision from *B to *C.
Completing Sunset Review.
*L
4396527
PRIT
06/02/2014
Updated Package Diagrams:
spec 51-85050 – Changed revision from *D to *E.
Updated to new template.
Completing Sunset Review.
*M
4575272
PRIT
11/20/2014
Updated Functional Description:
Added “For a complete list of related documentation, click here.” at the end.
*N
4810937
PRIT
06/25/2015
Updated Package Diagrams:
spec 51-85165 – Changed revision from *D to *E.
Updated to new template.
Completing Sunset Review.
*O
6058890
CNX
02/07/2018
Updated Package Diagrams:
spec 51-85050 – Changed revision from *E to *G.
Updated to new template.
Document Number: 001-15031 Rev. *O
Page 34 of 35
CY7C1470BV33
CY7C1472BV33
CY7C1474BV33
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
PSoC® Solutions
Products
Arm® Cortex® Microcontrollers
Automotive
cypress.com/arm
cypress.com/automotive
Clocks & Buffers
Interface
cypress.com/clocks
cypress.com/interface
Internet of Things
Memory
cypress.com/iot
cypress.com/memory
Microcontrollers
cypress.com/mcu
PSoC
cypress.com/psoc
Power Management ICs
Cypress Developer Community
Community | Projects | Video | Blogs | Training | Components
Technical Support
cypress.com/support
cypress.com/pmic
Touch Sensing
cypress.com/touch
USB Controllers
Wireless Connectivity
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 MCU
cypress.com/usb
cypress.com/wireless
© Cypress Semiconductor Corporation, 2007-2018. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation
of the Software is prohibited.
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 001-15031 Rev. *O
Revised February 7, 2018
NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc.
Page 35 of 35
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