CY7C199C-15VXC

CY7C199C 256K (32K x 8) Static RAM Features General Description • Fast access time: 12 ns The CY7C199C is a high-performance CMOS Asynchronous SRAM organized as 32K by 8 bits that supports an asynchronous memory interface. The device features an automatic power-down feature that significantly reduces power consumption when deselected. • Wide voltage range: 5.0V ± 10% (4.5V to 5.5V) • CMOS for optimum speed/power • TTL–compatible Inputs and Outputs See the Truth Table in this data sheet for a complete description of read and write modes • 2.0V Data Retention • Low CMOS standby power • Automated Power-down when deselected • Available in Pb-free and non Pb-free 28-pin (300-Mil) Molded SOJ, 28-pin (300-Mil) DIP and 28-pin TSOP I packages Logic Block Diagram 32K x 8 RAM Array ARRAY Sense Amps Row Decoder Input Buffer I/Ox CE Column Decoder WE Power Down Circuit OE X A X Product Portfolio 12 ns 15 ns 20 ns Maximum Access Time 12 15 20 ns Maximum Operating Current 85 80 75 mA Maximum CMOS Standby Current (L) 500 Unit µA Note: 1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com. Cypress Semiconductor Corporation Document #: 38-05408 Rev. *C • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised August 3, 2006 CY7C199C Pin Layout and Specifications 28 DIP (6.9 x 35.6 x 3.5 mm) OE A1 A2 A3 A4 WE VCC A5 A6 A7 A8 A9 A10 A11 A5 1 28 VCC A6 2 27 WE A7 3 26 A4 A8 4 25 A3 A9 5 24 A2 A10 6 23 A1 A11 7 22 OE A12 8 21 A0 A13 9 20 CE A14 10 19 I/O7 I/O0 11 18 I/O6 I/O1 12 17 I/O5 I/O2 13 16 I/O4 VSS 14 15 I/O3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 TSOP I (8 x 13.4 mm) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 A0 CE I/O7 I/O6 I/O5 I/O4 I/O3 VSS I/O2 I/O1 I/O0 A14 A13 A12 28 SOJ Document #: 38-05408 Rev. *C A5 1 28 VCC A6 2 27 WE A7 3 26 A4 A8 4 25 A3 A9 5 24 A2 A10 6 23 A1 A11 7 22 OE A12 8 21 A0 A13 9 20 CE A14 10 19 I/O7 I/O0 11 18 I/O6 I/O1 12 17 I/O5 I/O2 13 16 I/O4 VSS 14 15 I/O3 Page 2 of 13 CY7C199C Pin Description Pin Type Description DIP SOJ TSOP I 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 21, 23, 24, 25, 26 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 21, 23, 24, 25, 26 2, 3, 4, 5, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 28 AX Input Address Inputs CE Control Chip Enable 20 20 27 I/OX Input or Output Data Input/Outputs 11, 12, 13, 15, 16, 17, 18, 19 11, 12, 13, 15, 16, 17, 18, 19 18, 19, 20, 22, 23, 24, 25, 26 OE Control Output Enable 22 22 1 VCC Supply Power (5.0V) 28 28 7 VSS Supply Ground 14 14 21 WE Control Write Enable 27 27 6 Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Parameter Description Value Unit TSTG Storage Temperature –65 to +150 °C TAMB Ambient Temperature with Power Applied (i.e., case temperature) –55 to +125 °C VCC Core Supply Voltage Relative to VSS –0.5 to +7.0 V VIN, VOUT DC Voltage Applied to any Pin Relative to VSS –0.5 to VCC + 0.5 IOUT Output Short-Circuit Current 20 VESD Static Discharge Voltage (per MIL-STD-883, Method 3015) > 2001 V ILU Latch-up Current > 200 mA V mA Operating Range Range Ambient Temperature (TA) Voltage Range (VCC) 0°C to 70°C 5.0V ± 10% –40°C to 85°C 5.0V ± 10% Commercial Industrial DC Electrical Characteristics Over the Operating Range [2] 12 ns Parameter Description Condition 15 ns 20 ns Min. Max. Min. Max. Min. Max. Unit VIH Input HIGH Voltage 2.2 VCC + 0.3 2.2 VCC + 0.3 2.2 VCC + 0.3 V VIL Input LOW Voltage –0.5 0.8 –0.5 0.8 –0.5 0.8 V VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA IIX Input Leakage Current GND ≤ VI ≤ VCC –5 +5 –5 +5 IOZ Output Leakage Current GND ≤ VI ≤ VCC, Output Disabled –5 +5 –5 +5 ICC VCC Operating Supply Current VCC = Max., IOUT = 0 mA, f = FMAX = 1/tRC 85 ISB1 Automatic CE Max. VCC, CE ≥ VIH, VIN ≥ Power-down Current VIH or VIN ≤ VIL, f = FMAX TTL Inputs 30 ISB2 Automatic CE Max. VCC, CE ≥ VCC – 0.3V, Power-down Current VIN ≥ VCC – 0.3V, or VIN ≤ 0.3V, f = 0 CMOS Inputs 2.4 0.4 L 0.4 V 0.4 V –5 +5 µA –5 +5 µA 80 75 mA 30 30 mA 10 10 L 2.4 10 500 mA 10 mA µA Note: 2. VIL (min) = –2.0V for pulse durations of less than 20 ns. Document #: 38-05408 Rev. *C Page 3 of 13 CY7C199C Capacitance[3] Max. Parameter Description CIN Input Capacitance COUT Output Capacitance Conditions ALL – PACKAGES Unit TA = 25°C, f = 1 MHz, VCC = 5.0V 8 pF 8 Thermal Resistance[4] Parameter Description ΘJA Thermal Resistance (Junction to Ambient) ΘJC Thermal Resistance (Junction to Case) Conditions Still Air, soldered on a 3 × 4.5 square inch, two–layer printed circuit board TSOP I SOJ DIP Unit 88.6 79 69.33 °C/W 21.94 41.42 31.62 AC Test Loads and Waveforms R1 VCC C1 INCLUDING JIG AND SCOPE output load R1 VCC C2 R2 INCLUDING JIGAND SCOPE (a) ALL INPUT PULSES 3.0V R2 GND 10% 90% 90% 10% ≤ 1V/ns ≤ 1V/ns (b) output load for tHZOE, tHZCE, tHZWE Equivalent to: OUTPUT THÉVENIN EQUIVALENT Rth VT Notes: 3. Tested initially and after any design or process change that may affect these parameters. 4. Test Conditions assume a transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V. Document #: 38-05408 Rev. *C Page 4 of 13 CY7C199C AC Test Conditions C1 C2 R1 Parameter Capacitor 1 Capacitor 2 Resistor 1 Description Nom. 30 5 480 R2 RTH VTH Resistor 2 Resistor Thevenin Voltage Thevenin 255 167 1.73 Unit pF Ω V AC Electrical Characteristics[5, 6, 7] 12 ns Parameter Description Min 15 ns Max 12 Min 20 ns Max 15 Min Max tRC Read Cycle Time tAA Address to Data Valid tOHA Data Hold from Addres Change tACE CE to Data Valid tDOE OE to Data Valid tLZOE OE to Low Z tHZOE OE to High Z tLZCE CE to Low Z tHZCE CE to High Z tPU CE to Power-up tPD CE to Power-down tWC Write Cycle Time 12 15 20 ns tSCE CE to Write End 9 10 15 ns tAW Address Set-up to Write End 9 10 15 ns tHA Address Hold from Write End 0 0 0 ns tSA Address Set-up to Write Start 0 0 0 ns tPWE WE Pulse Width 8 9 15 ns tSD Data Set-up to Write End 8 9 10 ns tHD Data Hold from Write End 0 0 0 ns tHZWE WE LOW to High Z tLZWE WE HIGH to Low Z 12 3 15 3 12 3 7 0 5 3 7 5 ns ns ns ns 20 10 3 ns ns 9 7 3 9 0 15 7 ns 9 7 12 20 3 0 ns ns 0 3 0 ns 20 15 5 0 3 20 Unit ns ns ns Notes: 5. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 6. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. CE and WE must be LOW to initiate a write, and the transition of any of these signals can terminate the write. The input data set–up and hold timing should be referenced to the leading edge of the signal that terminates the write. 7. tHZOE, tHZCE, tHZWE are specified as in part (b) of the A/C Test Loads. Transitions are measured ± 200 mV from steady state voltage. Document #: 38-05408 Rev. *C Page 5 of 13 CY7C199C Data Retention Characteristics[8] ALL Parameter Description VDR VCC for Data Retention ICCDR Data Retention Current tCDR Chip Deselect to Data Retention Time tR Operation Recovery Time Condition VCC = VDR=2.0V, CE ≥ VCC – 0.3V, VIN ≥ VCC – 0.3V or VIN ≤ 0.3V Min. Max. Unit 2.0 – V – 150 µA 0 – ns 200 – µs Timing Waveforms Data Retention Waveform VCC DATA RETENTION MODE tCDR tR CE Read Cycle No. 1[11, 10] tRC Address tAA tOHA Data Out Previous Data Valid Data Valid Notes: 8. L-version only. 9. Device is continuously selected. OE = VIL = CE. 10. WE is HIGH for Read Cycle. Document #: 38-05408 Rev. *C Page 6 of 13 CY7C199C Timing Waveforms (continued) Read Cycle No. 2[11, 12] tRC Address CE tHZCE tACE OE tDOE tHZOE tLZOE High Z High Z Data Out VCC Current Data Valid tLZCE tPU ICC tPD 50% ISB 50% Write Cycle No. 1 (WE Controlled)[13, 14, 15] tWC Address tSCE CE tAW tSA tHA tPWE WE OE tHD tHZOE Data In/Out Undefined see footnotes tSD Data-In Valid Notes: 11. This cycle is OE Controlled and WE is HIGH read cycle. 12. Address valid prior to or coincident with CE transition LOW. 13. This cycle is WE controlled, OE is HIGH during write. 14. Data In/Out is high impedance if OE = VIH. 15. During this period the I/Os are in output state and input signals should not be applied. Document #: 38-05408 Rev. *C Page 7 of 13 CY7C199C Timing Waveforms (continued) Write Cycle No. 2 (CE Controlled)[14, 16, 17] tWC Address tSCE CE tSA tHA tAW WE tSD Data In/Out High Z tHD High Z Data-In Valid Write Cycle No. 3 (WE Controlled, OE Low)[18] t WC Address tSCE CE tAW tHA tPWE tSA WE tSD Data In/Out Undefined tHD Undefined See Footnotes Data-In Valid see footnotes tHZWE tLZWE Notes: 16. This cycle is CE controlled. 17. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. 18. The cycle is WE controlled, OE LOW. The minimum write cycle time is the sum of tHZWE and tSD. Document #: 38-05408 Rev. *C Page 8 of 13 CY7C199C Truth Table CE WE OE Input/Output Mode Power H X X High Z Deselect/Power-Down Standby (ISB) L H L Data Out Read Active (ICC) L L X Data In Write Active (ICC) L H H High Z Deselect Active (ICC) Ordering Information Speed 12 Ordering Code CY7C199C–12VC Package Name 51-85031 CY7C199C–12VXC 15 28-pin (300-Mil) Molded SOJ Operating Range Commercial 28-pin (300-Mil) Molded SOJ (Pb-Free) CY7C199C–12ZXC 51-85071 28-pin TSOP I (Pb-Free) CY7C199C–12VI 51-85031 28-pin (300-Mil) Molded SOJ Industrial CY7C199C–15PC 51-85014 28-pin (300-Mil) DIP Commercial CY7C199C–15PXC CY7C199C–15ZC 28-pin (300-Mil) DIP (Pb-Free) 51-85071 CY7C199C–15ZXC CY7C199C–15VC 20 Package Type 28-pin TSOP I 28-pin TSOP I (Pb-Free) 51-85031 28-pin (300-Mil) Molded SOJ CY7C199C–15VXC 28-pin (300-Mil) Molded SOJ (Pb-Free) CY7C199CL–15VC 28-pin (300-Mil) Molded SOJ CY7C199CL–15VXC 28-pin (300-Mil) Molded SOJ (Pb-Free) CY7C199C–15VI 51-85031 28-pin (300-Mil) Molded SOJ Industrial CY7C199C–20ZXI 51-85071 28-pin TSOP I (Pb-Free) Industrial Document #: 38-05408 Rev. *C Page 9 of 13 CY7C199C Package Diagrams 28-pin TSOP 1 (8 x 13.4 mm) (51-85071) 51-85071-*G Document #: 38-05408 Rev. *C Page 10 of 13 CY7C199C Package Diagrams (continued) 28-pin (300-Mil) Molded SOJ (51-85031) NOTE : 1. JEDEC STD REF MO088 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.006 in (0.152 mm) PER SIDE MIN. MAX. 3. DIMENSIONS IN INCHES DETAIL A EXTERNAL LEAD DESIGN PIN 1 ID 14 1 0.291 0.300 15 0.330 0.350 0.013 0.019 28 OPTION 1 0.697 0.713 A Document #: 38-05408 Rev. *C 0.014 0.020 OPTION 2 SEATING PLANE 0.120 0.140 0.050 TYP. 0.026 0.032 0.007 0.013 0.004 0.025 MIN. 0.262 0.272 51-85031-*C Page 11 of 13 CY7C199C Package Diagrams (continued) 28-pin (300-Mil) PDIP (51-85014) SEE LEAD END OPTION 14 1 DIMENSIONS IN INCHES [MM] MIN. MAX. REFERENCE JEDEC MO-095 0.260[6.60] 0.295[7.49] 15 PACKAGE WEIGHT: 2.15 gms 28 0.030[0.76] 0.080[2.03] SEATING PLANE 1.345[34.16] 1.385[35.18] 0.290[7.36] 0.325[8.25] 0.120[3.05] 0.140[3.55] 0.140[3.55] 0.190[4.82] 0.115[2.92] 0.160[4.06] 0.015[0.38] 0.060[1.52] 0.090[2.28] 0.110[2.79] 0.009[0.23] 0.012[0.30] 0.055[1.39] 0.065[1.65] 3° MIN. 0.310[7.87] 0.385[9.78] 0.015[0.38] 0.020[0.50] SEE LEAD END OPTION LEAD END OPTION 51-85014-*D (LEAD #1, 14, 15 & 28) All product and company names mentioned in this document may be the trademarks of their respective holders. Document #: 38-05408 Rev. *C Page 12 of 13 © Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C199C Document History Page Document Title: CY7C199C 256K (32K x 8) Static RAM Document Number: 38-05408 REV. ECN No. Issue Date Orig. of Change Description of Change ** 129233 09/11/03 HGK New Data Sheet *A 129697 09/15/03 KKV Minor change: Move Product Portfolio from page 4 to page 1 Move Truth table from page 9 to page 3 *B 341574 See ECN PCI Added Lead-Free part to Ordering info on Page #10 *C 492500 See ECN NXR Removed 25 ns speed bin Changed the description of IIX from Input Load Current to Input Leakage Current in DC Electrical Characteristics table Removed IOS parameter from DC Electrical Characteristics table Updated the ordering information table Document #: 38-05408 Rev. *C Page 13 of 13