CY7C53120

CY7C53150 CY7C53120 Neuron® Chip Network Processor Features • Three 8-bit pipelined processors for concurrent processing of application code and network traffic • 11-pin IO port programmable in 34 modes for fast application program development • Two 16-bit timer/counters for measuring and generating IO device waveforms • 5-pin communication port that supports direct connect and network transceiver interfaces • Programmable pull ups on IO4–IO7 and 20 mA sink current on IO0–IO3 • Unique 48-bit ID number in every device to facilitate network installation and management • Low operating current; sleep mode operation for reduced current consumption[1] • 0.35 μm Flash process technology • 5.0V operation • On-chip LVD circuit to prevent nonvolatile memory corruption during voltage drops • 2,048 bytes of SRAM for buffering network data, system, and application data storage • 512 bytes (CY7C53150), 2048 bytes (CY7C53120E2), 4096 bytes (CY7C53120E4) of Flash memory with on-chip charge pump for flexible storage of configuration data and application code • Addresses up to 58 KB of external memory (CY7C53150) • 10 KB (CY7C53120E2), 12 KB (CY7C53120E4) of ROM containing LonTalk® network protocol firmware • Maximum input clock operation of 20 MHz (CY7C53150), 10 MHz (CY7C53120E2), 40 MHz (CY7C53120E4) over a –40°C to 85°C[2] temperature range • 64-pin TQFP package (CY7C53150) • 32-pin SOIC or 44-pin TQFP package (CY7C53120) Functional Description The CY7C531x0 Neuron® chip implements a node for LonWorks® distributed intelligent control networks. It incorporates, on a single chip, the necessary communication and control functions, both in hardware and firmware, that facilitate the design of a LonWorks node. The CY7C531x0 contains a very flexible 5-pin communication port that can be configured to interface with a wide variety of media transceivers at a wide range of data rates. The most common transceiver types are twisted-pair, powerline, RF, IR, fiber-optics, and coaxial. The CY7C531x0 is manufactured using state of the art 0.35-μm Flash technology, providing to designers the most cost-effective Neuron chip solution. Services at every layer of the OSI networking reference model are implemented in the LonTalk firmware based protocol stored in 10-KB ROM (CY7C53120E2), 12-KB ROM (CY7C53120E4), or off-chip memory (CY7C53150). The Logic Block Diagram Media Access Control Processor Network Processor Application Processor 2 KB RAM Internal Data Bus (0:7) Internal Address Bus (0:15) Communications Port IO Block 2 Timer/ Counters CLK1 CLK2 SERVICE RESET External Address/Data Bus (CY7C53150) CP4 CP0 IO10 IO0 Oscillator, Clock, and Control Flash ROM (CY7C53120) Notes 1. Rare combinations of wake-up events occurring during the go to sleep sequence could produce unexpected sleep behavior. For details, refer to Cypress’s Neuron Metastability Description application note. 2. Maximum Junction Temperature is 105°C. TJunction = TAmbient + V•I•θJA. 32-pin SOIC θJA = 51C/W. 44-pin TQFP θJA = 43C/W. 64-pin TQFP θJA = 44C/W. Cypress Semiconductor Corporation Document #: 38-10001 Rev. *E • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised March 14, 2007 [+] [+] Feedback CY7C53150 CY7C53120 firmware also contains 34 preprogrammed IO drivers, greatly simplifying application programming. The application program is stored in the Flash memory (CY7C53120) and/or off-chip memory (CY7C53150), and may be updated by downloading over the network. The CY7C53150 incorporates an external memory interface that can address up to 64 KB with 6 KB of the address space mapped internally. LonWorks nodes that require large appli. cation programs can take advantage of this external memory capability. The CY7C53150 Neuron chip is an exact replacement for the Motorola MC143150Bx and Toshiba TMPN3150B1 devices. The CY7C53120E2 Neuron chip is an exact replacement for the Motorola MC143120E2 device since it contains the same firmware in ROM. Pin Configurations CY7C53150 64-lead Thin Quad Flat Pack NC[4] A15 E R/W VDD D0 D1 VDD VDD VSS D2 D3 D4 D5 D6 D7 NC[4] A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 49 31 50 30 51 29 52 28 53 27 54 26 55 25 56 24 57 CY7C53150-20AI 23 58 22 59 21 60 20 61 19 62 18 63 17 64 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CP4 CP3 CP2 CP1 CP0 NC[4] VDD VSS CLK1 CLK2 VDD VSS VDD VSS NC[4] SERVICE IO0 IO1 IO2 IO3 RESET VDD Vss Vpp IO4 IO5 IO6 IO7 IO8 IO9 Notes 3. The smaller dimple at the bottom left of the marking indicates pin 1. 4. No Connect (NC) — Must not be used. (These pins may be used for internal testing.) Document #: 38-10001 Rev. *E NC[4] IO10 Pin 1 Indicator [3] Page 2 of 14 [+] [+] Feedback CY7C53150 CY7C53120 Pin Configurations (continued) 44-lead QFP NC[4] NC[4] NC[4] 23 IO10 CP4 25 CP3 24 VDD VSS 26 IO7 32 IO8 31 IO9 30 32-lead SOIC 33 29 28 RESET VDD IO4 IO3 IO2 IO1 IO0 SERVICE VSS Vpp VDD VDD VSS CLK2 CLK1 VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VDD VSS IO5 IO6 IO7 IO8 IO9 VDD IO10 VSS CP4 CP3 CP1 CP0 VDD CP2 27 NC[4] IO6 IO5 VSS VDD NC [4] 34 35 36 37 38 39 40 41 42 43 44 10 1 11 2 3 4 5 6 7 8 9 22 21 20 19 18 17 16 15 14 13 12 NC[4] CP1 CP0 VDD CP2 NC[4] VSS CLK1 CLK2 VSS NC[4] CY7C53120Ex-yySI CY7C53120Ex-yyAI RESET VDD IO4 IO3 NC[4] IO2 IO1 IO0 SERVICE VSS Vpp VDD NC[4] NC[4] VDD Document #: 38-10001 Rev. *E NC[4] PIN 1 INDICATOR Page 3 of 14 [+] [+] Feedback CY7C53150 CY7C53120 Pin Descriptions Pin Name CLK1 CLK2 IO Input Output Pin Function Oscillator connection or external clock input. Oscillator connection. Leave open when external clock is input to CLK1. Maximum of one external load. Reset pin (active LOW). Note The allowable external capacitance connected to the RESET pin is 100–1000 pF. Service pin (active LOW). Alternates between input and output at a 76-Hz rate. Large current-sink capacity (20 mA). General IO port. The output of timer/ counter 1 may be routed to IO0. The output of Timer/Counter 2 may be routed to IO1. General IO port. The input to Timer/Counter 1 may be derived from one of IO4–IO7. The input to Timer/Counter 2 may be derived from IO4. General IO port. May be used for serial communication under firmware control. Bidirectional memory data bus. Read/write control output for external memory. Enable clock control output for external memory. Memory address output port. CY7C53150 CY7C53120xx CY7C53120xx TQFP-64 Pin No. SOIC-32 Pin No. TQFP-44 Pin No. 24 23 15 14 15 14 RESET IO (Built-In Pull up) IO (Built-In Configurable Pull up) IO 6 1 40 SERVICE 17 8 5 IO0–IO3 2, 3, 4, 5 7, 6, 5, 4 4, 3, 2, 43 IO4–IO7 IO (Built-In Configurable Pull ups) IO IO Output Output Output 10, 11, 12, 13 3, 30, 29, 28 42, 36, 35, 32 IO8–IO10 D0–D7 R/W E A0–A15 14, 15, 16 43, 42, 38, 37, 36, 35, 34, 33 45 46 64, 63, 62, 61, 60, 59, 58, 57, 56, 55, 54, 53, 52, 51, 50, 47 7, 20, 22, 26, 40, 41, 44 8,19, 21, 25, 39 9 27, 26, 24 N/A N/A N/A N/A 31, 30, 27 N/A N/A N/A N/A VDD VSS Vpp Input Input Input Power input (5V nom). All VDD pins must be connected together externally. Power input (0V, GND). All VSS pins must be connected together externally. In-circuit test mode control. If Vpp is high when RESET is asserted, the IO, address and data buses become Hi-Z. 2, 11, 12, 18, 25, 32 9, 13, 16, 23, 31 10 9, 10, 19, 29, 38, 41 7,13, 16, 26, 37 8 CP0–CP4 Communication Bidirectional port supporting communi- 28, 29, 30, 31, 32 19, 20, 17, 21, 22 20, 21, 18, 24, 25 cations in three modes. Network Interface NC — No connect. Must not be connected on the 1, 18, 27, 48, 49 user’s PC board, since they may be connected internal to the chip. N/A 1, 6, 11, 12, 17, 22, 23, 28, 33, 34, 39, 44 Document #: 38-10001 Rev. *E Page 4 of 14 [+] [+] Feedback CY7C53150 CY7C53120 Memory Usage All Neuron chips require system firmware to be present when they are powered up. In the case of the CY7C53120 family, this firmware is preprogrammed in the factory in an on-chip ROM. In the case of the CY7C53150, the system firmware must be present in the first 16 KB of an off-chip nonvolatile memory such as Flash, EPROM, EEPROM, or NVRAM. These devices must be programmed in a device programmer before board assembly. Because the system firmware implements the network protocol, it cannot itself be downloaded over the network. For the CY7C53120 family, the user application program is stored in on-chip Flash memory. It may be programmed using a device programmer before board assembly, or may be downloaded and updated over the LonTalk network from an external network management tool. For the CY7C53150, the user application program is stored in on-chip Flash Memory and also in off-chip memory. The user program may initially be programmed into the off-chip memory device using a device programmer. 40 MHz 3120 Operation The CY7C53120E4-40 device was designed to run at frequencies up to 40 MHz using an external clock oscillator. It is important to note that external oscillators may typically take on the order of 5 ms to stabilize after power-up. The Neuron chip must be held in reset until the CLK1 input is stable. With some oscillators, this may require the use of a reset-stretching Low-Voltage Detection chip/circuit. Check the oscillator vendor’s specification for more information about start-up stabilization times. Low-Voltage Inhibit Operation The on-chip Low-voltage Inhibit circuit trips the Neuron chip whenever the VDD input is less than 4.1 ± 0.3V. This feature prevents the corruption of nonvolatile memory during voltage drops. Communications Port The Neuron chip includes a versatile 5-pin communications port that can be configured in three different ways. In Single-Ended Mode, pin CP0 is used for receiving serial data, pin CP1 for transmitting serial data, and pin CP2 enables an external transceiver. Data is communicated using Differential Manchester encoding. In Special Purpose Mode, pin CP0 is used for receiving serial data, pin CP1 for transmitting serial data, pin CP2 transmits a bit clock, and pin CP4 transmits a frame clock for use by an external intelligent transceiver. In this mode, the external transceiver is responsible for encoding and decoding the data stream. In Differential Mode, pins CP0 and CP1 form a differential receiver with built-in programmable hysteresis and low pass filtering. Pins CP2 and CP3 form a differential driver. Serial data is communicated using Differential Manchester encoding. The following tables describe the communications port when used in Differential Mode. Flash Memory Retention and Endurance Data and code stored in Flash Memory is guaranteed to be retained for at least 10 years for programming temperature range of –25°C to 85°C. The Flash Memory can typically be written 100,000 times without any data loss.[5] An erase/write cycle takes 20 ms. The system firmware extends the effective endurance of Flash memory in two ways. If the data being written to a byte of Flash memory is the same as the data already present in that byte, the firmware does not perform the physical write. So for example, an application that sets its own address in Flash memory after every reset does not use up any write cycles if the address has not changed. In addition, system firmware version 13.1 or higher is able to aggregate writes to eight successive address locations into a single write for CY7C53120E4 devices. For example, if 4 KB of code is downloaded over the network, the firmware would execute only 512 writes rather than 4,096. Note 5. For detailed information about data retention after 100K cycles, see the Cypress qualification report. Document #: 38-10001 Rev. *E Page 5 of 14 [+] [+] Feedback CY7C53150 CY7C53120 Programmable Hysteresis Values (Expressed as differential peak-to-peak voltages in terms of VDD) Hysteresis[6] 0 1 2 3 4 5 6 7 Vhys Min. 0.019 VDD 0.040 VDD 0.061 VDD 0.081 VDD 0.101 VDD 0.121 VDD 0.142 VDD 0.162 VDD Vhys Typ. 0.027 VDD 0.054 VDD 0.081 VDD 0.108 VDD 0.135 VDD 0.162 VDD 0.189 VDD 0.216 VDD Vhys Max. 0.035 VDD 0.068 VDD 0.101 VDD 0.135 VDD 0.169 VDD 0.203 VDD 0.236 VDD 0.270 VDD Receiver[8] (End-to-End) Absolute Asymmetry (Worst case across hysteresis) Filter (F) 0 1 2 3 Max ( ⎢tPLH – tPHL⎜) 35 150 250 400 Unit ns ns ns ns Figure 1. Receiver Input Waveform ⎮CP0 – CP1⎮ ≥ Vhys + 200 mV CP0 VDD/2 CP1 Programmable Glitch Filter Values[7] (Receiver (end-to-end) filter values expressed as transient pulse suppression times) Filter (F) 0 1 2 3 Min. 10 120 240 480 Typ. 75 410 800 1500 Max. 140 700 1350 2600 Unit ns ns ns ns ≤ 3 ns Differential Receiver (End-to-End) Absolute Symmetry[9, 10] Filter (F) 0 Hysteresis (H) 0 Max ( ⎢tPLH – tPHL⎜) Unit 24 ns Notes 6. Hysteresis values are on the condition that the input signal swing is 200 mV greater than the programmed value. 7. Must be disabled if data rate is 1.25 Mbps or greater. 8. Receiver input, VD = VCP0 – VCP1, at least 200 mV greater than hysteresis levels. See Figure 1. 9. CPO and CP1 inputs each 0.60 Vp – p, 1.25 MHz sine wave 180° out of phase with each other as shown in Figure 8. VDD = 5.00 V ± 5%. 10. tPLH: Time from input switching states from low to high to output switching states. tPHL: Time from input switching states from high to low to output switching states. Document #: 38-10001 Rev. *E Page 6 of 14 [+] [+] Feedback CY7C53150 CY7C53120 Electrical Characteristics (VDD = 4.5V–5.5V) Parameter VIL Description Input Low Voltage IO0–IO10, CP0, CP3, CP4, SERVICE, D0-D7, RESET CP0, CP1 (Differential) Input High Voltage IO0–IO10, CP0, CP3, CP4, SERVICE, D0-D7, RESET CP0, CP1 (Differential) Low-Level Output Voltage Iout < 20 μA Standard Outputs (IOL = 1.4 mA)[11] High Sink (IO0–IO3), SERVICE, RESET (IOL = 20 mA) High Sink (IO0–IO3), SERVICE, RESET (IOL = 10 mA) Maximum Sink (CP2, CP3) (IOL = 40 mA) Maximum Sink (CP2, CP3) (IOL = 15 mA) High-Level Output Voltage Iout < 20 μA Standard Outputs (IOH = –1.4 mA)[11] High Sink (IO0 – IO3), SERVICE (IOH = –1.4 mA) Maximum Source (CP2, CP3) (IOH = –40 mA) Maximum Source (CP2, CP3) (IOH = –15 mA) Hysteresis (Excluding CLK1) Input Current (Excluding Pull Ups) (VSS to Operating Mode Supply 20-MHz Clock 10-MHz Clock 5-MHz Clock 2.5-MHz Clock 1.25-MHz Clock 0.625-MHz Clock[14] VDD)[12] Clock[14] Pull Up Source Current (Vout = 0 V, Output = High-Z)[12] Current[13]40-MHz Min. — — 2.0 Programmable — — — — — — VDD – 0.1 VDD – 0.4 VDD – 0.4 VDD – 1.0 VDD – 0.4 175 — 60 — — — — — — — — Typ. — — — — — — — — — — — — — — — — — — — — — — — — — — Max. 0.8 Programmable V — — V 0.1 0.4 0.8 0.4 1.0 0.4 V — — — — — — ±10 260 55 32 20 12 8 7 3 100 mV μA μA mA Unit V VIH VOL VOH Vhys Iin Ipu IDD IDDsleep Sleep Mode Supply Current[1, 13] μA LVI Trip Point (VDD) Part Number CY7C53120E2, CY7C53120E4, and CY7C53150 Min. 3.8 Typ. 4.1 Max. 4.4 Unit V Notes 11. Standard outputs are IO4–IO10, CP0, CP1, and CP4. (RESET is an open drain input/output. CLK2 must have < 15 pF load.) For CY7C53150, standard outputs also include A0–A15, D0–D7, E, and R/W. 12. IO4–IO7 and SERVICE have configurable pull ups. RESET has a permanent pull up. 13. Supply current measurement conditions: VDD = 5V, all outputs under no-load conditions, all inputs < 0.2V or > (VDD – 0.2V), configurable pull ups off, crystal oscillator clock input, differential receiver disabled. The differential receiver adds approximately 200 µA typical and 600 µA maximum when enabled. It is enabled on either of the following conditions: • Neuron chip in Operating mode and Comm Port in Differential mode. • Neuron chip in Sleep mode and Comm Port in Differential mode and Comm Port Wake-up not masked. 14. Supported through an external oscillator only. Document #: 38-10001 Rev. *E Page 7 of 14 [+] [+] Feedback CY7C53150 CY7C53120 External Memory Interface Timing — CY7C53150, VDD ± 10% (VDD = 4.5V to 5.5 V, TA = –40°C to+ 85°C [2]) Parameter tcyc PWEH PWEL tAD tAH tRD tRH tWR tWH tDSR tDHR tDHW tDDW tDHZ tDDZ tacc Pulse Width, E High Pulse Width, E Low [16] Description Memory Cycle Time (System Clock Period)[15] [16] Min. 100 tcyc/2 – 5 tcyc/2 – 5 — 10 — 5 — 5 15 0 10 — 0 — 50 Max. 3200 tcyc/2 + 5 tcyc/2 + 5 35 — 25 — 25 — — — — 12 — 42 — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Delay, E High to Address Valid[20] Address Hold Time After E High [20] Delay, E High to R/W Valid Read[20] R/W Hold Time Read After E High Delay, E High to R/W Valid Write R/W Hold Time Write After E High Read Data Setup Time to E High Data Hold Time Read After E High Data Hold Time Write After E High[17, 18] Delay, E Low to Data Valid Data Three State Hold Time After E Low[19] Delay, E High to Data Three-State[18] External Memory Access Time (tacc = tcyc – tAD – tDSR) at 20-MHz input clock Differential Transceiver Electrical Characteristics Characteristic Receiver Common Mode Voltage Range to maintain Input Offset Voltage Propagation Delay (F = 0, VID = Vhys/2 + 200 mV) Input Resistance Wake-up Time Differential Output Impedance for CP2 and CP3 [22] Min. hysteresis[21] 1.2 0.9 –0.05Vhys – 35 — 5 — Max. VDD – 2.2 VDD – 1.75 0.05Vhys + 35 230 ns — 10 35 Unit V V mV ns MΩ μs Ω Receiver Common Mode Range to operate with unspecified hysteresis Figure 2. Signal Loading for Timing Specifications Unless Otherwise Specified TEST SIGNAL CL = 20 pF for E CL = 30 pF for A0–A15, D0–D7, and R/W CL CL = 50 pF for all other signals Figure 3. Test Point Levels for E Pulse Width Measurements PWEH 2.0V 0.8V PWEL 2.0V Notes 15. tcyc = 2(1/f), where f is the input clock (CLK1) frequency (20, 10, 5, 2.5, 1.25, or 0.625 MHz). 16. Refer to Figure 3 for detailed measurement information. 17. The data hold parameter, tDHW, is measured to the disable levels shown in Figure 5, rather than to the traditional data invalid levels. 18. Refer to Figure 6 and Figure 5 for detailed measurement information. 19. The three-state condition is when the device is not actively driving data. Refer to Figure 2 and Figure 5 for detailed measurement information. 20. To meet the timing above for 20-MHz operation, the loading on A0–A15, D0–D7, and R/W is 30 pF. Loading on E is 20 pF. 21. Common mode voltage is defined as the average value of the waveform at each input at the time switching occurs. 22. Z0 = |V[CP2]-V[CP3] |/40 mA for 4.75 < VDD < 5.25V. Document #: 38-10001 Rev. *E Page 8 of 14 [+] Feedback CY7C53150 CY7C53120 Figure 4. Drive Levels and Test Point Levels for Timing Specifications Unless Otherwise Specified DRIVE TO 2.4V DRIVE TO 0.4V 2.0V 0.8V A B 2.0V 0.8V A — Signal valid-to-signal valid specification (maximum or minimum) B — Signal valid-to-signal invalid specification (maximum or minimum) Figure 5. Test Point Levels for Driven-to-Three-State Time Measurements VOH – 0.5 V VOL + 0.5 V VOH – Measured high output drive level VOL – Measured low output drive level Figure 6. Signal Loading for Driven-to-Three-State Time Measurements TEST SIGNAL CL = 30 pF VDD/2 ILOAD = 1.4 mA Figure 7. External Memory Interface Timing Diagram tcyc E 20 pF Load PWEH PWEL Address (A0 – A15) 30 pF Load tAD Address tAD Address tAH tAD Address tAH tAD Address tAH tAH tRD R/W 30 pF Load tRH tWR tWH tDSR Data (In) (D0 – D7) Data In tDHR tDSR Data In tDHR tDDW tDHZ tDHW Data Out tDDZ tDDW tDDZ tDHZ tDHW Data Out Data (Out) (D0 – D7) 30 pF Load Memory READ Memory READ Memory WRITE Memory WRITE Document #: 38-10001 Rev. *E Page 9 of 14 [+] [+] Feedback CY7C53150 CY7C53120 Figure 8. Differential Receiver Input Hysteresis Voltage Measurement Waveforms V o lta g e 5 4 V (C P 0 ) 3 V cm V (C P 1 ) 2 V (C P 0 )-V (C P 1 ) 1 T im e Vh -1 V trip + V trip - N e u ro n C h ip 's In te rn a l C o m p a ra to r 5V 0V C o m m o n -M o d e vo lta g e : V c m = ( V (C P 0 ) + V (C P 1 ) ) / 2 H ys te re s is V o lta g e : V h = [V trip + ] - [V trip -] Ordering Information[23] Part Number CY7C53150-20AXI CY7C53150-20AXIT CY7C53120E2-10SXI[24] CY7C53120E4-40SXI[26] CY7C53120E4-40SXIT CY7C53120E2-10AXI[24] CY7C53120E4-40AXI [26] Flash (KB) 0.5 0.5 2 4 4 2 4 ROM (KB) 0 0 10 12 12 10 12 Firmware Version N/A N/A 6 12 12 6 12 Max. Input Clock (MHz) 20[25] 20[25] 10 40 40 10 40 Package Name A64SA A64SA S32.45 S32.45 S32.45 A44 A44 Package Type 64-lead Thin Plastic Quad Flat Pack 64-lead Thin Plastic Quad Flat Pack Tape and Reel 32-lead (450 mil) Molded SOIC 32-lead (450 mil) Molded SOIC 32-lead (450 mil) Molded SOIC Tape and Reel 44-lead Thin Plastic Quad Flat Pack 44-lead Thin Plastic Quad Flat Pack Notes 23. All parts contain 2 KB of SRAM. 24. CY7C53120E2 firmware is bit-for-bit identical with Motorola MC143120E2 firmware. 25. CY7C53150 may be used with 20-MHz input clock only if the firmware in external memory is version 13 or later. 26. CY7C53120E4 requires upgraded LonBuilder® and NodeBuilder® software. Document #: 38-10001 Rev. *E Page 10 of 14 [+] [+] Feedback CY7C53150 CY7C53120 Package Diagrams Figure 9. 44-Lead Thin Plastic Quad Flat Pack A44 12.00±0.25 SQ 10.00±0.10 SQ 44 34 0° MIN. 1 33 0.37±0.05 STAND-OFF 0.05 MIN. 0.15 MAX. R. 0.08 MIN. 0.20 MAX. 0.25 GAUGE PLANE R. 0.08 MIN. 0.20 MIN. 0.20 MIN. 0-7° 0.60±0.15 1.00 REF. 11 23 0.80 B.S.C. DETAIL A 12 22 NOTE: 1. JEDEC STD REF MS-026 SEATING PLANE 1.60 MAX. 12°±1° (8X) 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS 1.40±0.05 0.10 0.20 MAX. 51-85064-*C SEE DETAIL A Document #: 38-10001 Rev. *E Page 11 of 14 [+] [+] Feedback CY7C53150 CY7C53120 Package Diagrams (continued) Figure 10. 64-Lead Thin Plastic Quad Flat Pack (14 x 14 x 1.4 mm) A64SA 16.00±0.25 SQ NOTE: 14.00±0.05 SQ 64 49 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS 1 48 0.35±0.05 0.80 TYP. 0° MIN. 16 33 R 0.08 MIN. 0.20 MAX. 0.25 GAUGE PLANE STAND-OFF 0.05 MIN. 0.15 MAX. R 0.08 MIN. 0.20 MAX. 1.40±0.05 0.20 MIN. 17 SEATING PLANE 1.60 MAX. 12°±1° (8X) 32 0°-7° 0.60±0.15 0.10 1.00 REF. 0.20 MAX DETAIL A 51-85046-*C SEE DETAIL A Document #: 38-10001 Rev. *E Page 12 of 14 [+] [+] Feedback CY7C53150 CY7C53120 Package Diagrams (continued) Figure 11. 32-Lead (450-Mil) SOIC S32.45 32 LD (450 Mil) SOIC 16 1 0.546[13.868] 0.566[14.376] 0.440[11.176] 0.450[11.430] DIMENSIONS IN INCHES[MM] PACKAGE WEIGHT 1.42gms PART # S32.45 STANDARD PKG. SZ32.45 LEAD FREE PKG. MIN. MAX. 17 32 0.793[20.142] 0.817[20.751] 0.006[0.152] 0.012[0.304] 0.101[2.565] 0.111[2.819] 0.118[2.997] MAX. 0.004[0.102] 0.047[1.193] 0.063[1.600] 0.023[0.584] 0.039[0.990] 0.050[1.270] BSC. 0.004[0.102] MIN. 0.014[0.355] 0.020[0.508] SEATING PLANE 51-85081-*B LonWorks, LonTalk, LonBuilder, NodeBuilder, and Neuron are registered trademarks of Echelon Corporation. All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-10001 Rev. *E Page 13 of 14 © Cypress Semiconductor Corporation, 2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. [+] [+] Feedback CY7C53150 CY7C53120 Document History Page Document Title: CY7C53150/CY7C53120 Neuron® Chip Network Processor Document Number: 38-10001 REV. ** *A ECN NO. Issue Date 111472 111990 11/28/01 02/06/02 Orig. of Change DSG CFB Description of Change Change from Spec number: 38-00891 to 38-10001 Changed the max. cur rent values Specified the Flash endurance of “100K typical” with reference to qual report Fixed some incorrect footnotes and figure numbering Added Sleep Metastability footnote Added Junction Temperature footnote Added maximum sleep current footnote Changed “EEPROM” references to “Flash Memory” Repositioned Note 3 Removed Note 2 regarding data retention Removed Note 16 regarding max sleep current Changed the system image firmware version from V12 to V13.1 Implemented new template. Modified the Ordering Information table; added an “X” to indicate the part numbers are Pb-free; two tape-and-reel options are available now. *B 114465 04/24/02 KBO *C *D 115269 124450 04/26/02 03/25/03 KBO KBO *E 837840 3/14/07 BOO Document #: 38-10001 Rev. *E Page 14 of 14 [+] [+] Feedback