CY7C60445, CY7C6045x
enCoRe™ V Low Voltage Microcontroller
Features
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Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 1.71V to 3.6V operating voltage ❐ Temperature range: 0°C to 70°C Flexible On-Chip Memory ❐ Up to 32K Flash program storage 50,000 Erase/write cycles ❐ Up to 2048 bytes SRAM data storage ❐ Flexible protection modes ❐ In-System Serial Programming (ISSP) Complete Development Tools ❐ Free development tool (PSoC Designer™) ❐ Full featured, in-circuit emulator and programmer ❐ Full speed emulation ❐ Complex breakpoint structure ❐ 128K trace memory Precision, Programmable Clocking ❐ Crystal-less oscillator with support for an external crystal or resonator ❐ Internal ±5.0% 6, 12, or 24 MHz main oscillator ❐ Internal low speed oscillator at 32 kHz for watchdog and sleep.The frequency range is 19–50 kHz with a 32 kHz typical value
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Programmable Pin Configurations ❐ 25 mA sink current on all GPIO ❐ Pull Up, High Z, Open Drain, CMOS drive modes on all GPIO ❐ Configurable inputs on all GPIO ❐ Low dropout voltage regulator for Port 1 pins. Programmable to output 3.0, 2.5, or 1.8V at the I/O pins ❐ Selectable, regulated digital IO on Port 1 • Configurable input threshold for Port 1 • 3.0V, 20 mA total Port 1 source current • Hot-swappable ❐ 5 mA strong drive mode on Ports 0 and 1 Additional System Resources ❐ Configurable communication speeds 2 ❐ I C™ Slave • Selectable to 50 kHz, 100 kHz, or 400 kHz • Implementation requires no clock stretching • Implementation during sleep modes with less than 100 mA • Hardware address detection ❐ SPI™ master and SPI slave • Configurable between 93.75 kHz and 12 MHz ❐ Three 16-bit timers ❐ 8-bit ADC used to monitor battery voltage or other signals with external components ❐ Watchdog and sleep timers ❐ Integrated supervisory circuit
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enCoRe V LV Block Diagram
enCoRe V Low Voltage CORE
Port 4 Port 3 Port 2 Port 1 Port 0 Prog. LDO
System Bus
SRAM 2048 Bytes Interrupt Controller SROM Flash 32K Sleep and Watchdog
CPU Core (M8C)
6/12/24 MHz Internal Main Oscillator
3 16-Bit Timers
I2C Slave/SPI Master-Slave
POR and LVD System Resets
SYSTEM RESOURCES
Cypress Semiconductor Corporation Document Number: 001-12395 Rev. *G
•
198 Champion Court
•
San Jose, CA 95134-1709 • 408-943-2600 Revised October 7, 2008
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Functional Overview
The enCoRe V LV family of devices are designed to replace multiple traditional low voltage microcontroller system components with one, low cost single chip programmable component. Communication peripherals (I2C/SPI), a fast CPU, Flash program memory, SRAM data memory, and configurable IO are included in a range of convenient pinouts. The architecture for this device family, as illustrated in enCoRe V LV Block Diagram, is comprised of two main areas: the CPU core and the system resources. Depending on the enCoRe V LV package, up to 36 general purpose IO (GPIO) are also included. Enhancements over the Cypress’ legacy low voltage microcontrollers include faster CPU at lower voltage operation, lower current consumption, twice the RAM and Flash, hot-swapable IOs, I2C hardware address recognition, new very low current sleep mode, and new package options.
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The 5V maximum input, 1.8, 2.5, or 3V selectable output, low dropout regulator (LDO) provides regulation for IOs. A register controlled bypass mode allows the user to disable the LDO. Standard Cypress PSoC IDE tools are available for debugging the enCoRe V LV family of parts.
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Getting Started
The quickest path to understanding the PSoC silicon is by reading this data sheet and using the PSoC Designer Integrated Development Environment (IDE). This data sheet is an overview of the PSoC integrated circuit and presents specific pin, register, and electrical specifications. For in-depth information, along with detailed programming information, reference the PSoC Mixed-Signal Array Technical Reference Manual, which can be found on http://www.cypress.com/psoc. For up-to-date Ordering, Packaging, and Electrical Specification information, reference the latest PSoC device data sheets on the web at http://www.cypress.com.
The enCoRe V LV Core
The enCoRe V LV Core is a powerful engine that supports a rich instruction set. It encompasses SRAM for data storage, an interrupt controller, sleep and watchdog timers, and IMO (internal main oscillator) and ILO (internal low speed oscillator). The CPU core, called the M8C, is a powerful processor with speeds up to 24 MHz. The M8C is a four-MIPS, 8-bit Harvard architecture microprocessor. System Resources provide additional capability, such as a configurable I2C slave and SPI master-slave communication interface and various system resets supported by the M8C.
Development Kits
Development Kits are available from the following distributors: Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store contains development kits, C compilers, and all accessories for PSoC development. Go to the Cypress Online Store web site at http://www.cypress.com/shop/. Under Product Categories click PSoC® Mixed Signal Arrays to view a current list of available items.
Technical Training Modules
Free PSoC technical training modules are available for users new to PSoC. Training modules cover designing, debugging, advanced analog and CapSense. Go to http://www.cypress.com/techtrain.
Additional System Resources
System Resources, some of which have been previously listed, provide additional capability useful to complete systems. Additional resources include low voltage detection and power on reset. Brief statements describing the merits of each system resource are presented below.
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Consultants
Certified PSoC Consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC Consultant go to http://www.cypress.com, click on Support located at the top of the web page, and select CYPros Consultants.
10-bit on-chip ADC shared between System Performance manager (used to calculate parameters based on temperature for flash write operations) and the user. The I2C slave and SPI master-slave module provides 50, 100, or 400 kHz communication over two wires. SPI communication over 3 or 4 wires runs at speeds of 46.9 kHz to 3 MHz (lower for a slower system clock). In I2C slave mode the hardware address recognition feature reduces the already low power consumption by eliminating the need for CPU intervention until a packet addressed to the target device has been received. Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR (Power On Reset) circuit eliminates the need for a system supervisor.
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Technical Support
PSoC application engineers take pride in fast and accurate response. They can be reached with a four hour guaranteed response at http://www.cypress.com/support.
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Application Notes
A long list of application notes assists you in every aspect of your design effort. To view the PSoC application notes, go to the http://www.cypress.com web site and select Application Notes under the Documentation list located at the top of the web page.
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Document Number: 001-12395 Rev. *G
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Development Tools
PSoC Designer™ is a Microsoft® Windows-based, integrated development environment for the Programmable System-on-Chip (PSoC) devices. The PSoC Designer IDE and application runs on Windows XP and Windows Vista. This system provides design database management by project, an integrated debugger with In-Circuit Emulator, in-system programming support, and built-in support for third-party assemblers and C compilers. PSoC Designer also supports C language compilers developed specifically for the devices in the PSoC family. Code Generation Tools PSoC Designer supports multiple third-party C compilers and assemblers. The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range of debugging tools. The choice is yours. Assemblers. The assemblers allow assembly code to be merged seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compilers. C language compilers are available that support the PSoC family of devices. The products allow you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all the features of C tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. Debugger PSoC Designer has a debug environment that provides hardware in-circuit emulation, allowing you to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow the designer to read and program and read and write data memory, read and write IO registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also allows the designer to create a trace buffer of registers and memory locations of interest. Online Help System The online help system displays online, context-sensitive help for the user. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer in getting started. In-Circuit Emulator A low cost, high functionality ICE (In-Circuit Emulator) is available for development support. This hardware has the capability to program single devices. The emulator consists of a base unit that connects to the PC by way of a USB port. The base unit is universal and operates with all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full speed (24 MHz) operation.
PSoC Designer Software Subsystems
System-Level View The system-level view is a drag-and-drop visual embedded system design environment based on PSoC Express. In this view you solve design problems the same way you might think about the system. Select input and output devices based upon system requirements. Add a communication interface and define the interface to the system (registers). Define when and how an output device changes state based upon any/all other system devices. Based upon the design, PSoC Designer automatically selects one or more PSoC Mixed-Signal Controllers that match your system requirements. PSoC Designer generates all embedded code, then compiles and links it into a programming file for a specific PSoC device. Chip-Level View The chip-level view is a more traditional integrated development environment (IDE) based on PSoC Designer 4.x. You choose a base device to work with and then select different onboard analog and digital components called user modules that use the PSoC blocks. Examples of user modules are ADCs, DACs, Amplifiers, and Filters. You configure the user modules for your chosen application and connect them to each other and to the proper pins. Then you generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration allows for changing configurations at run time. Hybrid Designs You can begin in the system-level view, allow it to choose and configure your user modules, routing, and generate code, then switch to the chip-level view to gain complete control over on-chip resources. All views of the project share common code editor, builder, and common debug, emulation, and programming tools.
Document Number: 001-12395 Rev. *G
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Designing with PSoC Designer
The development process for the PSoC device differs from that of a traditional fixed function microprocessor. The configurable analog and digital hardware blocks give the PSoC architecture a unique flexibility that pays dividends in managing specification change during development and by lowering inventory costs. These configurable resources, called PSoC Blocks, have the ability to implement a wide variety of user-selectable functions. The PSoC development process can be summarized in the following four steps: 1. Select Components 2. Configure Components 3. Organize and Connect 4. Generate, Verify, and Debug
Organize and Connect
You build signal chains at the chip level by interconnecting user modules to each other and the IO pins, or connect system-level inputs, outputs, and communication interfaces to each other with valuator functions. In the system-level view selecting a potentiometer driver to control a variable speed fan driver and setting up the valuators to control the fan speed based on input from the pot selects, places, routes, and configures a programmable gain amplifier (PGA) to buffer the input from the potentiometer, an analog-to-digital converter (ADC) to convert the potentiometer’s output to a digital signal, and a PWM to control the fan. In the chip-level view, you perform the selection, configuration, and routing so that you have complete control over the use of all on-chip resources.
Select Components
Both the system-level and chip-level views provide a library of pre-built, pre-tested hardware peripheral components. In the system-level view these components are called “drivers” and correspond to inputs (a thermistor, for example), outputs (a brushless DC fan, for example), communication interfaces (I2C-bus, for example), and the logic to control how they interact with one another (called valuators). In the chip-level view the components are called “user modules.” User modules make selecting and implementing peripheral devices simple, and come in analog, digital, and mixed-signal varieties.
Generate, Verify, and Debug
When you are ready to test the hardware configuration or move on to developing code for the project, you perform the “Generate Configuration Files” step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the software for the system. Both system-level and chip-level designs generate software based on your design. The chip-level design provides application programming interfaces (APIs) with high-level functions to control and respond to hardware events at run time and interrupt service routines that you can adapt as needed. The system-level design also generates a C main() program that completely controls the chosen application and contains placeholders for custom code at strategic positions allowing you to further refine the software without disrupting the generated code. A complete code development environment allows you to develop and customize your applications in C, assembly language, or both. The last step in the development process takes place inside PSoC Designer’s Debugger (access by clicking the Connect icon). PSoC Designer downloads the HEX image to the In-Circuit Emulator (ICE) where it runs at full speed. PSoC Designer debugging capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint and watch-variable features, the debug interface provides a large trace buffer and allows you to define complex breakpoint events that include monitoring address and data bus values, memory locations and external signals.
Configure Components
Each of the components you select establishes the basic register settings that implement the selected function. They also provide parameters and properties that allow you to tailor their precise configuration to your particular application. For example, a Pulse Width Modulator (PWM) User Module configures one or more digital PSoC blocks, one for each 8 bits of resolution. The user module parameters permit you to establish the pulse width and duty cycle. Configure the parameters and properties to correspond to your chosen application. Enter values directly or by selecting values from drop-down menus. Both the system-level drivers and chip-level user modules are documented in data sheets that are viewed directly in PSoC Designer. These data sheets explain the internal operation of the component and provide performance specifications. Each data sheet describes the use of each user module parameter or driver property, and other information you may need to successfully implement your design.
Document Number: 001-12395 Rev. *G
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Document Conventions
Acronyms Used
The following table lists the acronyms that are used in this document. Acronym API CPU GPIO GUI ICE ILO IMO IO LSb LVD MSb POR PPOR PSoC® SLIMO SRAM Description application programming interface central processing unit general purpose IO graphical user interface in-circuit emulator internal low speed oscillator internal main oscillator input/output least significant bit low voltage detect most significant bit power on reset precision power on reset Programmable System-on-Chip™ slow IMO static random access memory
Units of Measure
A units of measure table is located in the Electrical Specifications section. Table 6 on page 13 lists all the abbreviations used to measure the enCoRe V LV devices.
Numeric Naming
Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal.
Document Number: 001-12395 Rev. *G
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Pin Configuration
32-Pin Part Pinout
Figure 1. CY7C60445 32-Pin enCoRe V LV Device
P0[3]
P0[5]
P0[7]
Vdd P0[6] 28 27
P0[4] 26
32 31
30
29
P 0[1] P2[7] P2[5] P2[3] P2[1] P3[3] P3[1] P1[7]
1 2
25
P0[2]
Vss
24 23
P0[0] P2[6] P2[4] P2[2] P2[0] P3[2] P3[0] XRES
9 10
11
12
13 14
15 P1[4]
P1[5]
P1[1]
P1[3]
P1[0]
Vss
P1[2]
Table 1. 32-Pin Part Pinout (QFN) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Type IOH IO IO IO IO IO IO IOHR IOHR IOHR IOHR Power IOHR IOHR IOHR IOHR Reset Input IO IO IO IO Name P0[1] P2[7] P2[5] P2[3] P2[1] P3[3] P3[1] P1[7] P1[5] P1[3] P1[1](1, 2) Vss P1[0](1, 2) P1[2] P1[4] P1[6] XRES P3[0] P3[2] P2[0] P2[2] Digital IO Digital IO Digital IO, Crystal Out (Xout) Digital IO, Crystal In (Xin) Digital IO Digital IO Digital IO Digital IO, I2C SCL, SPI SS Digital IO, I2C SDA, SPI MISO Digital IO, SPI CLK Digital IO, ISSP CLK, I2C SCL, SPI MOSI Ground connection Digital IO, ISSP DATA, I2C SDA, SPI CLK Digital IO Digital IO, optional external clock input (EXTCLK) Digital IO Active high external reset with internal pull down Digital IO Digital IO Digital IO Digital IO Page 6 of 28 Description
Document Number: 001-12395 Rev. *G
P1[6]
16
3 4 5 6 7 8
QFN
(Top View)
22 21 20 19 18 17
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Table 1. 32-Pin Part Pinout (QFN) (continued) Pin No. 22 23 24 25 26 27 28 29 30 31 32 CP Type IO IO IOH IOH IOH IOH Power IOH IOH IOH Power Power Name P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd P0[7] P0[5] P0[3] Vss Vss Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Supply voltage Digital IO Digital IO Digital IO Ground connection Center pad must be connected to ground Description
LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes 1. During power up or reset event, device P1[0] and P1[1] may disturb the I2C bus. Use alternate pins if issues are encountered. 2. These are the in-system serial programming (ISSP) pins, that are not High Z at power on reset (POR)
Document Number: 001-12395 Rev. *G
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48-Pin Part Pinout
Figure 2. CY7C60455/CY7C60456 48-Pin enCoRe V LV Device
P0[4] 39
P0[2] 38
P0[3]
P0[5]
P0[7]
P0[1]
48
47
46
45
44
43
42 41
NC NC
40
P0[6]
37
P0[0]
Vdd
Vss
NC P2[7] P2[5] P2[3] P2[1] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P1[7]
1 2 3 4 5 6 7 8 9
36 35 34 33 32
P2[6] P2[4] P2[2] P2[0] P4[2] P4[0] P3[6] P3[4] P3[2] P3[0] XRES P1[6]
QFN
(Top View)
31 30 29 28 27 26 25
10 11 12 13 14 15 16 17 18 19 20 21 22 P1[0] 23 24 P1[2]
P1[3]
P1[1]
P1[5]
Table 2. 48-Pin Part Pinout (QFN) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Type NC IO IO IO IO IO IO IO IO IO IO IOHR IOHR NC NC IOHR IOHR NC P2[7] P2[5] P2[3] P2[1] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P1[7] P1[5] NC NC P1[3] P1[1]
(1, 2)
Name No connection Digital IO
Description
Digital IO, Crystal Out (Xout) Digital IO, Crystal In (Xin) Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO, I2C SCL, SPI SS Digital IO, I2C SDA, SPI MISO No connection No connection Digital IO, SPI CLK Digital IO, ISSP CLK, I2C SCL, SPI MOSI
Document Number: 001-12395 Rev. *G
P1[4]
NC
NC
Vss
NC
Vdd
NC
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Table 2. 48-Pin Part Pinout (QFN) (continued) Pin No. 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 CP Type Power NC NC Power IOHR IOHR IOHR IOHR XRES IO IO IO IO IO IO IO IO IO IO IOH IOH IOH IOH Power NC NC IOH IOH IOH Power IOH Power NC NC Vdd P1[0] P1[2] P1[4] P1[6] Ext Reset P3[0] P3[2] P3[4] P3[6] P4[0] P4[2] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd NC NC P0[7] P0[5] P0[3] Vss P0[1] Vss
(1, 2)
Name Vss Supply ground No connection No connection Supply voltage
Description
Digital IO, ISSP DATA, I2C SDA, SPI CLK Digital IO Digital IO, optional external clock input (EXTCLK) Digital IO Active high external reset with internal pull down Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Digital IO Supply voltage No connection No connection Digital IO Digital IO Digital IO Supply ground Digital IO Center pad must be connected to ground
LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output
Document Number: 001-12395 Rev. *G
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Register Reference
The section discusses the registers of the enCoRe V LV device. It lists all the registers in mapping tables, in address order.
Register Conventions
The register conventions specific to this section are listed in the following table. Table 3. Register Conventions Convention R W O L C # Description Read register or bits Write register or bits Only a read/write register or bits Logical register or bits Clearable register or bits Access is bit specific
Register Mapping Tables
The enCoRe V LV device has a total register address space of 512 bytes. The register space is also referred to as IO space and is broken into two parts: Bank 0 (user space) and Bank 1 (configuration space). The XIO bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XIO bit is set, the user is said to be in the “extended” address space or the “configuration” registers.
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Table 4. Register Map Bank 0 Table: User Space
Name PRT0DR PRT0IE Addr (0,Hex) 00 01 02 03 PRT1DR PRT1IE 04 05 06 07 PRT2DR PRT2IE 08 09 0A 0B PRT3DR PRT3IE 0C 0D 0E 0F PRT4DR PRT4IE 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 20 21 22 23 24 25 26 27 28 SPI_TXR SPI_RXR SPI_CR 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F Gray fields are reserved and should not be accessed. W R # RW RW RW RW RW RW RW RW Access RW RW Name Addr (0,Hex) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F # Access is bit specific. PT0_CFG PT0_DATA1 PT0_DATA0 PT1_CFG PT1_DATA1 PT1_DATA0 PT2_CFG PT2_DATA1 PT2_DATA0 Access Name Addr (0,Hex) 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF CPU_SCR1 CPU_SCR0 RW RW RW RW RW RW RW RW RW CPU_F INT_CLR0 INT_CLR1 INT_CLR2 INT_CLR3 INT_MSK2 INT_MSK1 INT_MSK0 INT_SW_EN INT_VC RES_WDT INT_MSK3 IDX_PP MVR_PP MVW_PP I2C_CFG I2C_SCR I2C_DR I2C_XCFG I2C_XSTAT I2C_ADDR I2C_BP I2C_CP CPU_BP CPU_CP I2C_BUF CUR_PP STK_PP Access Name Addr (0,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF # # RL RW RW RW RW RW RW RW RW RC W RW RW RW RW RW # RW RW R RW R R RW R RW RW RW Access
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Table 5. Register Map Bank 1 Table: Configuration Space
Name PRT0DM0 PRT0DM1 Addr (1,Hex) 00 01 02 03 PRT1DM0 PRT1DM1 04 05 06 07 PRT2DM0 PRT2DM1 08 09 0A 0B PRT3DM0 PRT3DM1 0C 0D 0E 0F PRT4DM0 PRT4DM1 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 20 21 22 23 24 25 26 27 28 SPI_CFG 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F Gray fields are reserved and should not be accessed. TMP_DR0 TMP_DR1 TMP_DR2 TMP_DR3 RW RW RW RW RW RW RW RW RW Access RW RW Name Addr (1,Hex) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F # Access is bit specific. RW RW RW RW Access Name Addr (1,Hex) 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF CPU_F SLP_CFG SLP_CFG2 SLP_CFG3 IMO_TR ILO_TR OSC_CR0 ECO_CFG OSC_CR2 VLT_CR VLT_CMP IO_CFG OUT_P1 Access Name Addr (1,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF RL RW RW RW W W RW # RW RW R RW RW Access
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Electrical Specifications
This section presents the DC and AC electrical specifications of the enCoRe V LV devices. For the most up to date electrical specifications, verify that you have the most recent data sheet available by visiting the company web site at http://www.cypress.com. Figure 3. Voltage versus CPU Frequency
3.6V
Figure 4. IMO Frequency Trim Options
3.6V
lid ng Va rati n pe gio Re O
Vdd Voltage
Vdd Voltage
SLIMO Mode = 01
SLIMO Mode = 00
SLIMO Mode = 10
1.71V
1.71V
750 kHz
3 MHz CPU Frequency
24 MHz
750 kHz
3 MHz
6 MHz 12 MHz 24 MHz
IMO Frequency
The following table lists the units of measure that are used in this chapter. Table 6. Units of Measure Symbol oC dB fF Hz KB Kbit kHz kΩ MHz MΩ µA µF µH µs µV µVrms Unit of Measure degree Celsius decibels femto farad hertz 1024 bytes 1024 bits kilohertz kilohm megahertz megaohm microampere microfarad microhenry microsecond microvolts microvolts root-mean-square Symbol µW mA ms mV nA ns nV Ω pA pF pp ppm ps sps s V Unit of Measure microwatts milli-ampere milli-second milli-volts nanoampere nanosecond nanovolts ohm picoampere picofarad peak-to-peak parts per million picosecond samples per second sigma: one standard deviation volts
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ADC Electrical Specifications
Table 7. ADC Electrical Specifications Symbol Input Input Voltage Range Input Capacitance Resolution 8-Bit Sample Rate 10-Bit Sample Rate DC Accuracy DNL INL Offset Error Operating Current Data Clock Monotonicity Power Supply Rejection Ration PSRR (Vdd>3.0V) PSRR (2.2 < Vdd < 3.0) PSRR (2.0 < Vdd < 2.2) PSRR (Vdd < 2.0) Gain Error Input Resistance 1 24 30 12 0 dB dB dB dB 5 %FSR For any resolution Ω Equivalent switched cap input resistance for 8-, 9-, or 10-bit resolution. 2.25 -1 -2 0 15 275 +2 +2 90 350 12 LSB LSB mV µA MHz Source is chip’s internal main oscillator. See device data sheet of accuracy. Not guaranteed. See DNL For any configuration For any configuration 8 23.4375 5.859 Vss 1.3 5 10 Volts pF Bits ksps ksps Settings 8, 9, or 10 Data Clock set to 6 MHz. Sample Rate = 0.001/(2^Resolution/Data clock) Data Clock set to 6 MHz. Sample Rate = 0.001/(2^Resolution/Data clock) This gives 72% of maximum code Description Min Typ Max Units Conditions
1/(500fF*D 1/(400fF*D 1/(300fF*D ata-Clock) ata-Clock) ata-Clock)
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Electrical Characteristics
Absolute Maximum Ratings
Storage Temperature (TSTG) (3) ............................................. ...................................................... -55oC to 125oC (Typical +25oC) Supply Voltage Relative to Vss (Vdd) .................................... ................................................................................. -0.5V to +4.0V DC Input Voltage (VIO)........................................................... ................................................................. Vss - 0.5V to Vdd + 0.5V DC Voltage Applied to Tri-state (VIOZ) ................................... ................................................................. Vss - 0.5V to Vdd + 0.5V Maximum Current into any Port Pin (IMIO)............................. ............................................................................ -25mA to +50 mA Electro Static Discharge Voltage (ESD) (4) ............................ .............................................................................................. 2000V Latch-up Current (LU) (5) ....................................................... ............................................................................................ 200 mA
Operating Conditions
Ambient Temperature (TA) ..................................................... .....................................................................................0oC to 70oC Operational Die Temperature (TJ)(6) ...................................... .....................................................................................0oC to 85oC
DC Electrical Characteristics
DC Chip Level Specifications
Table 8 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 8. DC Chip Level Specifications Parameter Vdd IDD24 IDD12 IDD6 ISB0 ISB1 Description Supply Voltage Supply Current, IMO = 24 MHz Conditions See table titled DC POR and LVD Specifications on page 19. Conditions are Vdd = 3.0V, TA = 25oC, CPU = 24 MHz No I2C/SPI Conditions are Vdd = 3.0V, TA = 25oC, CPU = 12 MHz No I2C/SPI Conditions are Vdd = 3.0V, TA = 25oC, CPU = 6 MHz No I2C/SPI Vdd = 3.0V, TA = 25oC, IO regulator turned off Vdd = 3.0V, TA = 25oC, IO regulator turned off Min 1.71 – Typ – – Max 3.6 3.1 Units V mA
Supply Current, IMO = 12 MHz
–
–
2.0
mA
Supply Current, IMO = 6 MHz
–
–
1.5
mA
Deep Sleep Current Standby Current with POR, LVD, and Sleep Timer
– –
0.1 –
– 1.5
µA µA
Notes 3. Higher storage temperatures reduce data retention time. Recommended storage temperature is +25°C ± 25°C. Extended duration storage temperatures above 85°C degrade reliability. 4. Human Body Model ESD. 5. According to JESD78 standard. 6. The temperature rise from ambient to junction is package specific. See Thermal Impedances on page 26. The user must limit the power consumption to comply with this requirement.
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DC General Purpose IO Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 1.71V to 3.6V and 0°C ≤ TA ≤ 70°C. Typical parameters apply to 3.3V at 25°C. These are for design guidance only. Table 9. 3.0V to 3.6V DC GPIO Specifications Symbol RPU VOH1 VOH2 VOH3 VOH4 VOH5 VOH6 VOH7 VOH8 VOH9 VOH10 VOL Description Pull Up Resistor High Output Voltage Port 2 or 3 Pins High Output Voltage Port 2 or 3 Pins High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 High Output Voltage Port 1 Pins with LDO Regulator Enabled for 3V Out High Output Voltage Port 1 Pins with LDO Regulator Enabled for 3V Out IOH < 10 µA, maximum of 10 mA source current in all IOs IOH = 1 mA, maximum of 20 mA source current in all IOs IOH < 10 µA, maximum of 10 mA source current in all IOs IOH = 5 mA, maximum of 20 mA source current in all IOs IOH < 10 µA, Vdd > 3.1V, maximum of 4 IOs all sourcing 5 mA IOH = 5 mA, Vdd > 3.1V, maximum of 20 mA source current in all IOs Conditions Min 4 Vdd - 0.2 Vdd - 0.9 Vdd - 0.2 Typ 5.6 – – – Max 8 – – – Units kΩ V V V
Vdd - 0.9
–
–
V
2.85
3.00
3.3
V
2.20
–
–
V
High Output Voltage IOH < 10 µA, Vdd > 2.7V, maximum of 20 Port 1 Pins with LDO Enabled for 2.5V mA source current in all IOs Out High Output Voltage IOH = 2 mA, Vdd > 2.7V, maximum of 20 Port 1 Pins with LDO Enabled for 2.5V mA source current in all IOs Out IOH < 10 µA, Vdd > 2.7V, maximum of 20 High Output Voltage Port 1 Pins with LDO Enabled for 1.8V mA source current in all IOs Out High Output Voltage IOH = 1 mA, Vdd > 2.7V, maximum of 20 Port 1 Pins with LDO Enabled for 1.8V mA source current in all IOs Out Low Output Voltage IOL = 25 mA, Vdd > 3.3V, maximum of 60 mA sink current on even port pins (for example, P0[2] and P1[4]) and 60 mA sink current on odd port pins (for example, P0[3] and P1[5])
2.35
2.50
2.75
V
1.90
–
–
V
1.60
1.80
2.1
V
1.20
–
–
V
–
–
0.75
V
VIL VIH VH IIL CPIN
Input Low Voltage Input High Voltage Input Hysteresis Voltage Input Leakage (Absolute Value) Pin Capacitance Package and pin dependent Temp = 25oC
– 2.00 – – 0.5
– – 80 0.001 1.7
0.80 – 1 5
V V mV µA pF
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Table 10. 2.4V to 3.0V DC GPIO Specifications Symbol RPU VOH1 VOH2 VOH3 VOH4 VOH5A VOH6A VOL Description Pull Up Resistor High Output Voltage Port 2 or 3 Pins High Output Voltage Port 2 or 3 Pins High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 High Output Voltage Port 1 Pins with LDO Enabled for 1.8V Out High Output Voltage Port 1 Pins with LDO Enabled for 1.8V Out Low Output Voltage Conditions Min 4 Vdd - 0.2 Typ 5.6 – – – Max 8 – – – Units kΩ V V V
IOH < 10 µA, maximum of 10 mA source current in all IOs IOH = 0.2 mA, maximum of 10 mA source Vdd - 0.4 current in all IOs IOH < 10 µA, maximum of 10 mA source Vdd - 0.2 current in all IOs IOH = 2 mA, maximum of 10 mA source current in all IOs IOH < 10 µA, Vdd > 2.4V, maximum of 20 mA source current in all IOs. IOH = 1 mA, Vdd > 2.4V, maximum of 20 mA source current in all IOs IOL = 10 mA, maximum of 30 mA sink current on even port pins (for example, P0[2] and P1[4]) and 30 mA sink current on odd port pins (for example, P0[3] and P1[5]) Vdd - 0.5
–
–
V
1.50
1.80
2.10
V
1.20
–
–
V
–
–
0.75
V
VIL VIH VH IIL CPIN
Input Low Voltage Input High Voltage Input Hysteresis Voltage Input Leakage (Absolute Value) Capacitive Load on Pins
Package and pin dependent Temp = 25oC
– 1.6 – – 0.5
– – 80 0.001 1.7
0.72 – 1 5
V V mV µA pF
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Table 11. 1.71V to 2.4V DC GPIO Specifications Symbol RPU VOH1 VOH2 VOH3 VOH4 VOL Description Pull Up Resistor High Output Voltage Port 2 or 3 Pins High Output Voltage Port 2 or 3 Pins High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 High Output Voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 Low Output Voltage IOH = 10 µA, maximum of 10 mA source current in all IOs IOH = 0.5 mA, maximum of 10 mA source current in all IOs IOH = 100 µA, maximum of 10 mA source current in all IOs IOH = 2 mA, maximum of 10 mA source current in all IOs IOL = 5 mA, maximum of 20 mA sink current on even port pins (for example, P0[2] and P1[4]) and 30 mA sink current on odd port pins (for example, P0[3] and P1[5]) Conditions Min 4 Vdd - 0.2 Vdd - 0.5 Vdd - 0.2 Typ 5.6 – – – Max 8 – – – Units kΩ V V V
Vdd - 0.5
–
–
V
–
–
0.4
V
VIL VIH VH IIL CPIN
Input Low Voltage Input High Voltage Input Hysteresis Voltage Input Leakage (Absolute Value) Capacitive Load on Pins Package and pin dependent. Temp = 25oC
– 0.65 x Vdd – – 0.5
– – 80 0.001 1.7
0.3 x Vdd – 1 5
V V mV µA pF
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DC POR and LVD Specifications
Table 12 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 12. DC POR and LVD Specifications Symbol VPPOR0 VPPOR1 VPPOR2 VPPOR3 VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 Description Vdd Value for PPOR Trip PORLEV[1:0] = 00b, HPOR = 0 PORLEV[1:0] = 00b, HPOR = 1 PORLEV[1:0] = 01b, HPOR = 1 PORLEV[1:0] = 10b, HPOR = 1 Vdd Value for LVD Trip VM[2:0] = 000b(8) VM[2:0] = 001b(9) VM[2:0] = 010b(10) VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b(11)
(7)
Min 1.61
Typ 1.66 2.36 2.60 2.82 2.45 2.71 2.92 3.02 3.13 1.9 1.8
Max 1.71 2.41 2.66 2.95 2.51 2.78 2.99 3.09 3.20 2.32 1.84
Units V V V V V V V V
2.40 2.64 2.85 2.95 3.06 1.84 1.75
DC Programming Specifications
Table 13 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 13. DC Programming Specifications Symbol VddIWRITE IDDP VILP VIHP IILP IIHP VOLV VOHV FlashENPB FlashDR Description Supply Voltage for Flash Write Operations Supply Current During Programming or Verify Input Low Voltage During Programming or Verify Input High Voltage During Programming or Verify Input Current when Applying Vilp to P1[0] or P1[1] During Programming or Verify(12) Input Current when Applying Vihp to P1[0] or P1[1] During Programming or Verify(12) Output Low Voltage During Programming or Verify Output High Voltage During Programming or Verify Flash Write Endurance(14) Flash Data Retention(15) Min 1.71 – – VIH – – – VOH 50,000 10
(13)
Typ – 5 – – – – – – – 20
Max – 25 VIL – 0.2 1.5 Vss + 0.75 Vdd – –
Units V mA V V mA mA V V Cycles Years
Notes 7. Vdd must be greater than or equal to 1.71V during startup, reset from the XRES pin, or reset from watchdog. 8. Always greater than 50 mV above VPPOR1 for falling supply. 9. Always greater than 50 mV above VPPOR2 for falling supply. 10. Always greater than 50 mV above VPPOR3 for falling supply. 11. Always greater than 50 mV above VPPOR0 voltage for falling supply. 12. Driving internal pull down resistor. 13. See appropriate DC General Purpose IO Specifications table. For Vdd > 3V use VOH4 in Table 9 on page 14. Erase/write cycles per block. 15. Following maximum Flash write cycles at Tamb = 55C and Tj = 70C.
16
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AC Electrical Characteristics
AC Chip Level Specifications
Table 14 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 14. AC Chip Level Specifications Symbol FMAX FCPU F32K1 FIMO24 FIMO12 FIMO6 DCIMO TRAMP Description Maximum Operating Frequency(16) Maximum Processing Frequency(17) Internal Low Speed Oscillator Frequency Internal Main Oscillator Stability for 24 MHz ± 5%(18) Internal Main Oscillator Stability for 12 MHz(18) Internal Main Oscillator Stability for 6 MHz(18) Duty Cycle of IMO Supply Ramp Time Min 24 24 19 22.8 11.4 5.7 40 0 Typ – – 32 24 12 6.0 50 – Max – – 50 25.2 12.6 6.3 60 – Units MHz MHz kHz MHz MHz MHz % µs
AC General Purpose IO Specifications
Table 15 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 15. AC GPIO Specifications Symbol FGPIO Description GPIO Operating Frequency Conditions Normal Strong Mode, Port 0, 1 Min 0 0 Normal Strong Mode, Port 2, 3 0 Typ – – Max 6 MHz for 1.71V
