CY7C64343-32LQXI

CY7C6431x CY7C6434x, CY7C6435x enCoRe™ V Full Speed USB Controller Features Powerful Harvard Architecture Processor ❐ M8C processor speeds running up to 24 MHz ❐ Low power at high processing speeds ❐ Interrupt controller ❐ 3.0V to 5.5V operating voltage without USB ❐ Operating voltage with USB enabled: • 3.15V to 3.45V when supply voltage is around 3.3V • 4.35V to 5.25V when supply voltage is around 5.0V ❐ Commercial temperature range: 0°C to +70°C ❐ Industrial temperature range: -40°C to +85°C ■ Flexible On-Chip Memory ❐ Up to 32K Flash program storage: • 50,000 erase and write cycles • Flexible protection modes ❐ Up to 2048 bytes SRAM data storage ❐ In-System Serial Programming (ISSP) ■ Complete Development Tools ❐ Free development tool (PSoC Designer™) ❐ Full featured, in-circuit emulator and programmer ❐ Full speed emulation ❐ Complex breakpoint structure ❐ 128K trace memory ■ Precision, Programmable Clocking ❐ Crystal-less oscillator with support for an external crystal or resonator ❐ Internal ±5.0% 6, 12, or 24 MHz main oscillator: • 0.25% accuracy with Oscillator Lock to USB data, no external components required • Internal low speed oscillator at 32 kHz for watchdog and sleep. The frequency range is 19 to 50 kHz with a 32 kHz typical value ■ ■ ■ ■ Programmable Pin Configurations ❐ Up to 36 GPIO (Depending on Package) ❐ 25 mA sink current on all GPIO ❐ Pull Up, High Z, Open Drain, CMOS drive modes on all GPIO ❐ CMOS Drive Mode (5 mA Source Current) on Ports 0 and 1: • 20 mA (at 3.0V) Total Source Current ❐ Low dropout voltage regulator for Port 1 pins: • Programmable to output 3.0, 2.5, or 1.8V ❐ Selectable, regulated digital I/O on Port 1 ❐ Configurable input threshold for Port 1 ❐ Hot-swappable Capability on Port 1 Full-Speed USB (12 Mbps) ❐ Eight unidirectional endpoints ❐ One bidirectional control endpoint ❐ USB 2.0 compliant ❐ Dedicated 512 bytes buffer ❐ No external crystal required Additional System Resources ❐ Configurable communication speeds 2 ❐ I C slave: • Selectable to 50 kHz, 100 kHz, or 400 kHz • Implementation requires no clock stretching • Implementation during sleep modes with less than 100 μA • Hardware address detection ❐ SPI master and SPI slave: • Configurable between 46.9 kHz and 12 MHz ❐ Three 16-bit timers ❐ 10-bit ADC used to monitor battery voltage or other signals with external components ❐ Watchdog and sleep timers ❐ Integrated supervisory circuit enCoRe V Block Diagram enCoRe V CORE Port 4 Port 3 Port 2 Port 1 Port 0 Prog. LDO System Bus SRAM 2048 Bytes Interrupt Controller SROM 8K/16K/32K Flash Sleep and Watchdog CPU Core (M8C) 6/12/24 MHz Internal Main Oscillator ADC 3 16-Bit Timers I2C Slave/SPI Master-Slave POR and LVD System Resets Full Speed USB SYSTEM RESOURCES Cypress Semiconductor Corporation Document Number: 001-12394 Rev *I • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised September 15, 2009 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Functional Overview The enCoRe V family of devices are designed to replace multiple traditional full-speed USB microcontroller system components with one, low cost single-chip programmable component. Communication peripherals (I2C/SPI), a fast CPU, Flash program memory, SRAM data memory, and configurable I/O are included in a range of convenient pinouts. The architecture for this device family, as illustrated in the “enCoRe V Block Diagram” on page 1, consists of two main areas: the CPU core and the system resources. Depending on the enCoRe V package, up to 36 general purpose I/O (GPIO) are also included. This product is an enhanced version of Cypress’s successful full speed-USB peripheral controllers. Enhancements include faster CPU at lower voltage operation, lower current consumption, twice the RAM and Flash, hot-swappable I/Os, I2C hardware address recognition, new very low current sleep mode, and new package options. TEN TD RECEIVERS PDN RD Figure 1. USB Transceiver Regulator VOLTAGE REGULATOR 5V 3.3V 1.5K 5K PS2 Pull Up DP DM TRANSMITTER DPO RSE0 DMO The enCoRe V Core The enCoRe V Core is a powerful engine that supports a rich instruction set. It encompasses SRAM for data storage, an interrupt controller, sleep and watchdog timers, and IMO (internal main oscillator) and ILO (internal low speed oscillator). The CPU core, called the M8C, is a powerful processor with speeds up to 24 MHz. The M8C is a four-MIPS, 8-bit Harvard architecture microprocessor. System resources provide additional capability, such as a configurable I2C slave and SPI master-slave communication interface and various system resets supported by the M8C. At the enCoRe V system level, the full-speed USB system resource interfaces to the rest of the enCoRe V by way of the M8C's register access instructions and to the outside world by way of the two USB pins. The SIE supports nine endpoints including a bidirectional control endpoint (endpoint 0) and eight unidirectional data endpoints (endpoints 1 to 8). The unidirectional data endpoints are individually configurable as either IN or OUT. The USB Serial Interface Engine (SIE) allows the enCoRe V device to communicate with the USB host at full speed data rates (12 Mb/s). The SIE simplifies the interface to USB traffic by automatically handling the following USB processing tasks without firmware intervention: ■ ■ ■ ■ ■ ■ ■ Full-Speed USB The enCoRe V USB system resource adheres to the USB 2.0 Specification for full speed devices operating at 12 Mb/second with one upstream port and one USB address. enCoRe V USB consists of these components: ■ ■ ■ ■ Serial Interface Engine (SIE) block. PSoC Memory Arbiter (PMA) block. 512 bytes of dedicated SRAM. A full-speed USB Transceiver with internal regulator and two dedicated USB pins. Translates the encoded received data and formats the data to be transmitted on the bus. Generates and checks CRCs. Incoming packets failing checksum verification are ignored. Checks addresses. Ignores all transactions not addressed to the device. Sends appropriate ACK/NAK/Stall handshakes. Identifies token type (SETUP, IN, OUT) and sets the appropriate token bit once a valid token in received. Identifies Start-of-Frame (SOF) and saves the frame count. Sends data to or retrieves data from the USB SRAM, by way of the PSoC Memory Arbiter (PMA). Document Number: 001-12394 Rev *I Page 2 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Firmware is required to handle various parts of the USB interface. The SIE issues interrupts after key USB events to direct firmware to appropriate tasks: ■ ■ ■ ■ ■ Input Mux or the temperature sensor with an input voltage range of 0V to 1.3 V, where 1.3V is 72 percent of full scale. In the ADC only configuration (the ADC MUX selects the Analog Mux Bus, not the default temperature sensor connection), an external voltage can be connected to the input of the modulator for voltage conversion. The ADC is run for a number of cycles set by the timer, depending upon the desired resolution of the ADC. A counter counts the number of trips by the comparator, which is proportional to the input voltage. The Temp Sensor block clock speed is 36 MHz and is divided down to 1 to 12 MHz for ADC operation. Fill and empty the USB data buffers in USB SRAM. Enable PMA channels appropriately. Coordinate enumeration by decoding USB device requests. Suspend and resume coordination. Verify and select data toggle values. 10-bit ADC The ADC on enCoRe V device is an independent block with a state machine interface to control accesses to the block. The ADC is housed together with the temperature sensor core and can be connected to this or the Analog Mux Bus. As a default operation, the ADC is connected to the temperature sensor diodes to give digital values of the temperature. Figure 2. ADC System Performance Block Diagram VIN SPI The Serial Peripheral Interconnect (SPI) 3-wire protocol uses both edges of the clock to enable synchronous communication without the need for stringent setup and hold requirements. Figure 3. Basic SPI Configuration SPI Master SPI Slave Data is output by Data is registered at the both the Master input of both devices on the and Slave on opposite edge of the clock. one edge of the clock. SCLK MOSI MISO TEMP SENSOR/ ADC TEMP DIODES ADC A device can be a master or slave. A master outputs clock and data to the slave device and inputs slave data. A slave device inputs clock and data from the master device and outputs data for input to the master. Together, the master and slave are essentially a circular Shift register, where the master generates the clocking and initiates data transfers. A basic data transfer occurs when the master sends eight bits of data, along with eight clocks. In any transfer, both master and slave transmit and receive simultaneously. If the master only sends data, the received data from the slave is ignored. If the master wishes to receive data from the slave, the master must send dummy bytes to generate the clocking for the slave to send data back. Figure 4. SPI Block Diagram SYSTEM BUS INTERFACE BLOCK COMMAND/ STATUS SPI Block MOSI, MISO SCLK DATA_IN DATA_OUT CLK_IN SYSCLK CLK_OUT INT MOSI, MISO SCLK Interface to the M8 C ( Processor ) Core SS_ Registers The ADC User Module contains an integrator block and one comparator with positive and negative input set by the MUXes. The input to the integrator stage comes from the Analog Global CONFIGURATION[7:0] TRANSMIT[7:0] CONTROL[7:0] RECEIVE[7:0] Document Number: 001-12394 Rev *I Page 3 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x SPI configuration register (SPI_CFG) sets master/slave functionality, clock speed, and interrupt select. SPI control register (SPI_CR) provides four control bits and four status bits for device interfacing and synchronization. The SPIM hardware has no support for driving the Slave Select (SS_) signal. The behavior and use of this signal is dependent on the application and enCoRe V device and, if required, must be implemented in firmware. There is an additional data input in the SPIS, Slave Select (SS_), which is an active low signal. SS_ must be asserted to enable the SPIS to receive and transmit. SS_ has two high level functions: ■ ■ ■ ■ ■ ■ Interrupt or polling CPU interface. Support for clock rates of up to 400 kHz. 7- or 10-bit addressing (through firmware support). SMBus operation (through firmware support). Support for 7-bit hardware address compare. Flexible data buffering schemes. A "no bus stalling" operating mode. A low power bus monitoring mode. Enhanced features of the I2C Slave Enhanced Module include: ■ ■ ■ ■ To allow for the selection of a given slave in a multi-slave environment. To provide additional clocking for TX data queuing in SPI modes 0 and 1. I2C Slave The I2C slave enhanced communications block is a serial-to-parallel processor, designed to interface the enCoRe V device to a two-wire I2C serial communications bus. To eliminate the need for excessive CPU intervention and overhead, the block provides I2C-specific support for status detection and generation of framing bits. By default, the I2C Slave Enhanced module is firmware compatible with the previous generation of I2C slave functionality. However, this module provides new features that are configurable to implement significant flexibility for both internal and external interfacing. The basic I2C features include: ■ ■ The I2C block controls the data (SDA) and the clock (SCL) to the external I2C interface through direct connections to two dedicated GPIO pins. When I2C is enabled, these GPIO pins are not available for general purpose use. The enCoRe V CPU firmware interacts with the block through I/O register reads and writes, and firmware synchronization is implemented through polling and/or interrupts. In the default operating mode, which is firmware compatible with previous versions of I2C slave modules, the I2C bus is stalled upon every received address or byte, and the CPU is required to read the data or supply data as required before the I2C bus continues. However, this I2C Slave Enhanced module provides new data buffering capability as an enhanced feature. In the EZI2C buffering mode, the I2C slave interface appears as a 32-byte RAM buffer to the external I2C master. Using a simple predefined protocol, the master controls the read and write pointers into the RAM. When this method is enabled, the slave never stalls the bus. In this protocol, the data available in the RAM (this is managed by the CPU) is valid. Slave, transmitter, and receiver operation. Byte processing for low CPU overhead. Figure 5. I2C Block Diagram I2C Plus Slave I2C Core SDA_IN I2C Basic Configuration I2C_CFG I2C_SCR I2C_DR Buffer Module CPU Port I2C_BUF System Bus To/From GPIO Pins SCL_IN SDA_OUT SCL_OUT I2C_EN 32 Byte RAM HW Addr Cmp I2C_ADDR Buffer Ctl I2C_BP SYSCLK STANDBY Plus Features I2C_XCFG I2C_XSTAT I2C_CP MCU_BP MCU_CP Document Number: 001-12394 Rev *I Page 4 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Additional System Resources System resources, some of which have been previously listed, provide additional capability useful to complete systems. Additional resources include low voltage detection and power on reset. The following statements describe the merits of each system resource. ■ Development Kits Development Kits are available online from Cypress at www.cypress.com/shop and through a growing number of regional and global distributors, which include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and Newark. Under Product Categories, click USB (Universal Serial Bus) to view a current list of available items. Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR (power on reset) circuit eliminates the need for a system supervisor. The 5V maximum input, 1.8, 2.5, or 3V selectable output, low dropout regulator (LDO) provides regulation for I/Os. A register controlled bypass mode enables the user to disable the LDO. Standard Cypress PSoC IDE tools are available for debugging the enCoRe V family of parts. Technical Training Modules Free technical training (on demand, webinars, and workshops) is available online at www.cypress.com/training. The training covers a wide variety of topics and skill levels to assist you in your designs. ■ ■ Consultants Certified USB consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC Consultant go to www.cypress.com/cypros. Getting Started The quickest path to understanding the enCoRe V silicon is by reading this data sheet and using the PSoC Designer Integrated Development Environment (IDE). This data sheet is an overview of the enCoRe V integrated circuit and presents specific pin, register, and electrical specifications. For in-depth information, along with detailed programming information, reference the PSoC Programmable System-on-Chip Technical Reference Manual, which can be found on http://www.cypress.com/psoc. For up-to-date Ordering, Packaging, and Electrical Specification information, reference the latest enCoRe V device data sheets on the web at http://www.cypress.com. Technical Support For assistance with technical issues, search KnowledgeBase articles and forums at www.cypress.com/support. If you cannot find an answer to your question, call technical support at 1-800-541-4736. Application Notes Application notes are an excellent introduction to the wide variety of possible PSoC designs. They are located here: www.cypress.com/psoc. Select Application Notes under the Documentation tab. Document Number: 001-12394 Rev *I Page 5 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Development Tools PSoC Designer™ is a Microsoft® Windows-based, integrated development environment for the enCoRe and PSoC devices. The PSoC Designer IDE and application runs on Windows XP and Windows Vista. This system provides design database management by project, an integrated debugger with In-Circuit Emulator, in-system programming support, and built-in support for third-party assemblers and C compilers. PSoC Designer also supports C language compilers developed specifically for the devices in the enCoRe and PSoC families. Assemblers. The assemblers allow assembly code to be merged seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compilers. C language compilers are available that support the enCoRe and PSoC families of devices. The products enable you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all the features of C tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. Debugger PSoC Designer has a debug environment that provides hardware in-circuit emulation, allowing you to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow the designer to read and program flash, read and write data memory, read and write I/O registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also allows the designer to create a trace buffer of registers and memory locations of interest. Online Help System The online help system displays online, context-sensitive help for the user. Designed for procedural help and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer in getting started. In-Circuit Emulator A low cost, high functionality In-Circuit Emulator (ICE) is available for development support. This hardware has the capability to program single devices. The emulator consists of a base unit that connects to the PC by way of a USB port. The base unit is universal and operates with all enCoRe and PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full speed (24 MHz) operation. PSoC Designer Software Subsystems Chip-Level View The chip-level view is a traditional integrated development environment (IDE) based on PSoC Designer 4.4. You choose a base device to work with and then select different onboard analog and digital components called user modules that use the PSoC blocks. Examples of user modules are ADCs, DACs, Amplifiers, and Filters. You configure the user modules for your chosen application and connect them to each other and to the proper pins. Then you generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration allows for changing configurations at run time. System-Level View The system-level view is a drag-and-drop visual embedded system design environment based on PSoC Designer. Hybrid Designs You can begin in the system-level view, allow it to choose and configure your user modules, routing, and generate code, then switch to the chip-level view to gain complete control over on-chip resources. All views of the project share common code editor, builder, and common debug, emulation, and programming tools. Code Generation Tools PSoC Designer supports multiple third-party C compilers and assemblers. The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range of debugging tools. The choice is yours. Document Number: 001-12394 Rev *I Page 6 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Designing with PSoC Designer The development process for the enCoRe V device differs from that of a traditional fixed function microprocessor. Powerful PSoC Designer tools get the core of your design up and running in minutes instead of hours. The development process can be summarized in the following four steps: 1. Select Components 2. Configure Components 3. Organize and Connect 4. Generate, Verify, and Debug Generate, Verify, and Debug When you are ready to test the hardware configuration or move on to developing code for the project, you perform the “Generate Configuration Files” step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the software for the system. Both system-level and chip-level designs generate software based on your design. The chip-level design provides application programming interfaces (APIs) with high level functions to control and respond to hardware events at run time and interrupt service routines that you can adapt as needed. The system-level design also generates a C main() program that completely controls the chosen application and contains placeholders for custom code at strategic positions allowing you to further refine the software without disrupting the generated code. A complete code development environment allows you to develop and customize your applications in C, assembly language, or both. The last step in the development process takes place inside PSoC Designer’s Debugger (access by clicking the Connect icon). PSoC Designer downloads the HEX image to the In-Circuit Emulator (ICE) where it runs at full speed. PSoC Designer debugging capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint and watch-variable features, the debug interface provides a large trace buffer and allows you to define complex breakpoint events that include monitoring address and data bus values, memory locations and external signals. Select Components The chip-level view provides a library of pre-built, pre-tested hardware peripheral components. These components are called “user modules.” User modules make selecting and implementing peripheral devices simple, and come in analog, digital, and mixed-signal varieties. Configure Components Each of the components you select establishes the basic register settings that implement the selected function. They also provide parameters and properties that allow you to tailor their precise configuration to your particular application. The chip-level user modules are documented in data sheets that are viewed directly in PSoC Designer. These data sheets explain the internal operation of the component and provide performance specifications. Each data sheet describes the use of each user module parameter and contains other information you may need to successfully implement your design. Organize and Connect You build signal chains at the chip level by interconnecting user modules to each other and the I/O pins, or connect system-level inputs, outputs, and communication interfaces to each other with valuator functions. In the chip-level view, you perform the selection, configuration, and routing so that you have complete control over the use of all on-chip resources. Document Number: 001-12394 Rev *I Page 7 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Document Conventions Acronyms Used The following table lists the acronyms that are used in this document. Acronym API CPU GPIO ICE ILO IMO IO LSb LVD MSb POR PPOR PSoC® SLIMO SRAM Description application programming interface central processing unit general purpose IO in-circuit emulator internal low speed oscillator internal main oscillator input/output least significant bit low voltage detect most significant bit power on reset precision power on reset Programmable System-on-Chip™ slow IMO static random access memory Units of Measure A units of measure table is located in the Electrical Specifications section. Table 7 on page 16 lists all the abbreviations used to measure the enCoRe V devices. Numeric Naming Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal. Document Number: 001-12394 Rev *I Page 8 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Pin Configuration The enCoRe V USB device is available in a variety of packages which are listed and illustrated in the subsequent tables. 16-Pin Part Pinout Figure 6. CY7C64315/CY7C64316 16-Pin enCoRe V USB Device P0[1] 15 P0[3] 14 16 P2[5] 13 P0[7] P2[3] P1[7] P1[5] P1[1] 1 2 3 4 12 QFN 11 (Top View) 10 9 6 7 D– Vdd D+ 8 P0[4] XRES P1[4] P1[0] Table 1. 16-Pin Part Pinout (QFN) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Type I/O IOHR IOHR IOHR Power USB line USB line Power IOHR IOHR Input IOH IOH IOH IOH I/O Name P2[3] P1[7] P1[5] P1[1](1, 2) Vss D+ D– Vdd P1[0](1, 2) P1[4] XRES P0[4] P0[7] P0[3] P0[1] P2[5] Description Digital I/O, Crystal Input (Xin) Digital I/O, SPI SS, I2C SCL Digital I/O, SPI MISO, I2C SDA Digital I/O, ISSP CLK, 12C SCL, SPI MOSI Ground connection USB PHY USB PHY Supply Digital I/O, ISSP DATA, I2C SDA, SPI CLK Digital I/O, optional external clock input (EXTCLK) Active high external reset with internal pull down Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O, Crystal Output (Xout) LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output Notes 1. During power up or reset event, device P1[0] and P1[1] may disturb the I2C bus. Use alternate pins if issues are encountered. 2. These are the in-system serial programming (ISSP) pins that are not High Z at power on reset (POR). Document Number: 001-12394 Rev *I Vss 5 Page 9 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x 32-Pin Part Pinout Figure 7. CY7C64343/CY7C64345 32-Pin enCoRe V USB Device P0[3] P0[5] P0[7] P0[6] P0[4] 26 P0[2] 25 24 23 22 21 20 19 18 11 12 13 14 15 16 17 Vss Vdd 32 31 30 29 P0[1] P2[5] P2[3] P2[1] P1[7] P1[5] P1[3] P1[1] 1 2 3 4 5 6 9 10 7 8 28 27 P0[0] P2[6] P2[4] P2[2] P2[0] P3[2] P3[0] XRES QFN ( Top View ) P1[2] P1[4] Table 2. 32-Pin Part Pinout (QFN) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 CP Type IOH I/O I/O I/O IOHR IOHR IOHR IOHR Power I/O I/O Power IOHR IOHR IOHR IOHR Reset I/O I/O I/O I/O I/O I/O IOH IOH IOH IOH Power IOH IOH IOH Power Power Name P0[1] P2[5] P2[3] P2[1] P1[7] P1[5] P1[3] P1[1](1, 2) Vss D+ D– Vdd P1[0](1, 2) P1[2] P1[4] P1[6] XRES P3[0] P3[2] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd P0[7] P0[5] P0[3] Vss Vss Description Digital I/O Digital I/O, Crystal Output (Xout) Digital I/O, Crystal Input (Xin) Digital I/O Digital I/O, I2C SCL, SPI SS Digital I/O, I2C SDA, SPI MISO Digital I/O, SPI CLK Digital I/O, ISSP CLK, I2C SCL, SPI MOSI Ground USB PHY USB PHY Supply voltage Digital I/O, ISSP DATA, I2C SDA, SPI CLK Digital I/O Digital I/O, optional external clock input (EXTCLK) Digital I/O Active high external reset with internal pull down Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Supply voltage Digital I/O Digital I/O Digital I/O Ground Ensure the center pad is connected to ground LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output Document Number: 001-12394 Rev *I P1[0] P1[6] Vdd Vss D+ D– Page 10 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x 48-Pin Part Pinout Figure 8. CY7C64355/CY7C64356 48-Pin enCoRe V USB Device P0[1] Vss P0[3] Vdd P0[6] P0[4] P0[2] 39 P0[5] P0[7] P0[0] NC NC 43 48 47 46 45 44 42 41 40 38 37 NC P2[7] P2[5] P2[3] P2[1] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P1[7] 1 2 36 35 34 33 32 31 30 29 28 27 3 4 5 6 7 8 9 10 11 12 13 14 15 16 QFN (Top View) 17 18 19 20 21 P1[5] P1[3] Table 3. 48-Pin Part Pinout (QFN) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Type NC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O IOHR IOHR NC NC IOHR IOHR Power I/O I/O Power IOHR IOHR IOHR IOHR NC P2[7] P2[5] P2[3] P2[1] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P1[7] P1[5] NC NC P1[3] P1[1](1, 2) Vss D+ D– Vdd P1[0](1, 2) P1[2] P1[4] P1[6] Pin Name No connection Digital I/O Digital I/O, Crystal Out (Xout) Digital I/O, Crystal In (Xin) Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O, I2C SCL, SPI SS Digital I/O, I2C SDA, SPI MISO No connection No connection Digital I/O, SPI CLK Digital I/O, ISSP CLK, I2C SCL, SPI MOSI Supply ground USB USB Supply voltage Digital I/O, ISSP DATA, I2C SDA, SPI CLK Digital I/O, Digital I/O, optional external clock input (EXTCLK) Digital I/O Page 11 of 32 Description Document Number: 001-12394 Rev *I P1[1] P1[0] P1[2] P1[4] NC NC D+ DVdd Vss 22 23 24 26 25 P2[6] P2[4] P2[2] P2[0] P4[2] P4[0] P3[6] P3[4] P3[2] P3[0] XRES P1[6] [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Table 3. 48-Pin Part Pinout (QFN) (continued) Pin No. 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 CP Type XRES I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O IOH IOH IOH IOH Power NC NC IOH IOH IOH Power IOH Power Pin Name Ext Reset P3[0] P3[2] P3[4] P3[6] P4[0] P4[2] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd NC NC P0[7] P0[5] P0[3] Vss P0[1] Vss Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Supply voltage No connection No connection Digital I/O Digital I/O Digital I/O Supply ground Digital I/O Ensure the center pad is connected to ground Description Active high external reset with internal pull down LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output Document Number: 001-12394 Rev *I Page 12 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Register Reference The section discusses the registers of the enCoRe V device. It lists all the registers in mapping tables, in address order. Register Conventions The register conventions specific to this section are listed in the following table. Table 4. Register Conventions Convention R W L C # Description Read register or bits Write register or bits Logical register or bits Clearable register or bits Access is bit specific Register Mapping Tables The enCoRe V device has a total register address space of 512 bytes. The register space is also referred to as IO space and is broken into two parts: Bank 0 (user space) and Bank 1 (configuration space). The XIO bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XIO bit is set, the user is said to be in the “extended” address space or the “configuration” registers. Document Number: 001-12394 Rev *I Page 13 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Table 5. Register Map Bank 0 Table: User Space Name PRT0DR PRT0IE Addr (0,Hex) Access Name 00 RW EP1_CNT0 01 RW EP1_CNT1 02 EP2_CNT0 03 EP2_CNT1 PRT1DR 04 RW EP3_CNT0 PRT1IE 05 RW EP3_CNT1 06 EP4_CNT0 07 EP4_CNT1 PRT2DR 08 RW EP5_CNT0 PRT2IE 09 RW EP5_CNT1 0A EP6_CNT0 0B EP6_CNT1 PRT3DR 0C RW EP7_CNT0 PRT3IE 0D RW EP7_CNT1 0E EP8_CNT0 0F EP8_CNT1 PRT4DR 10 RW PRT4IE 11 RW 12 13 14 15 16 17 18 PMA0_DR 19 PMA1_DR 1A PMA2_DR 1B PMA3_DR 1C PMA4_DR 1D PMA5_DR 1E PMA6_DR 1F PMA7_DR 20 21 22 23 24 PMA8_DR 25 PMA9_DR 26 PMA10_DR 27 PMA11_DR 28 PMA12_DR SPI_TXR 29 W PMA13_DR SPI_RXR 2A R PMA14_DR SPI_CR 2B # PMA15_DR 2C TMP_DR0 2D TMP_DR1 2E TMP_DR2 2F TMP_DR3 30 USB_SOF0 31 R USB_SOF1 32 R USB_CR0 33 RW USBIO_CR0 34 # USBIO_CR1 35 # EP0_CR 36 # EP0_CNT0 37 # EP0_DR0 38 RW EP0_DR1 39 RW EP0_DR2 3A RW EP0_DR3 3B RW EP0_DR4 3C RW EP0_DR5 3D RW EP0_DR6 3E RW EP0_DR7 3F RW Gray fields are reserved; do not access these fields. Addr (0,Hex) Access 40 # 41 RW 42 # 43 RW 44 # 45 RW 46 # 47 RW 48 # 49 RW 4A # 4B RW 4C # 4D RW 4E # 4F RW 50 51 52 53 54 55 56 57 58 RW 59 RW 5A RW 5B RW 5C RW 5D RW 5E RW 5F RW 60 61 62 63 64 RW 65 RW 66 RW 67 RW 68 RW 69 RW 6A RW 6B RW 6C RW 6D RW 6E RW 6F RW 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F # Access is bit specific. Name Addr (0,Hex) 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF Access Name Addr (0,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF Access I2C_XCFG I2C_XSTAT I2C_ADDR I2C_BP I2C_CP CPU_BP CPU_CP I2C_BUF CUR_PP STK_PP IDX_PP MVR_PP MVW_PP I2C_CFG I2C_SCR I2C_DR INT_CLR0 INT_CLR1 INT_CLR2 INT_CLR3 INT_MSK2 INT_MSK1 INT_MSK0 INT_SW_EN INT_VC RES_WDT INT_MSK3 RW R RW R R RW R RW RW RW RW RW RW RW # RW RW RW RW RW RW RW RW RW RC W RW PT0_CFG PT0_DATA1 PT0_DATA0 PT1_CFG PT1_DATA1 PT1_DATA0 PT2_CFG PT2_DATA1 PT2_DATA0 RW RW RW RW RW RW RW RW RW CPU_F RL CPU_SCR1 CPU_SCR0 # # Document Number: 001-12394 Rev *I Page 14 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Table 6. Register Map Bank 1 Table: Configuration Space Name PRT0DM0 PRT0DM1 Addr (1,Hex) Access Name Addr (1,Hex) Access 00 RW PMA4_RA 40 RW 01 RW PMA5_RA 41 RW 02 PMA6_RA 42 RW 03 PMA7_RA 43 RW PRT1DM0 04 RW PMA8_WA 44 RW PRT1DM1 05 RW PMA9_WA 45 RW 06 PMA10_WA 46 RW 07 PMA11_WA 47 RW PRT2DM0 08 RW PMA12_WA 48 RW PRT2DM1 09 RW PMA13_WA 49 RW 0A PMA14_WA 4A RW 0B PMA15_WA 4B RW PRT3DM0 0C RW PMA8_RA 4C RW PRT3DM1 0D RW PMA9_RA 4D RW 0E PMA10_RA 4E RW 0F PMA11_RA 4F RW PRT4DM0 10 RW PMA12_RA 50 RW PRT4DM1 11 RW PMA13_RA 51 RW 12 PMA14_RA 52 RW 13 PMA15_RA 53 RW 14 EP1_CR0 54 # 15 EP2_CR0 55 # 16 EP3_CR0 56 # 17 EP4_CR0 57 # 18 EP5_CR0 58 # 19 EP6_CRO 59 # 1A EP7_CR0 5A # 1B EP8_CR0 5B # 1C 5C 1D 5D 1E 5E 1F 5F 20 60 21 61 22 62 23 63 24 64 25 65 26 66 27 67 28 68 SPI_CFG 29 RW 69 2A 6A 2B 6B 2C TMP_DR0 6C RW 2D TMP_DR1 6D RW 2E TMP_DR2 6E RW 2F TMP_DR3 6F RW USB_CR1 30 # 70 31 71 32 72 USBIO_CR2 33 RW 73 PMA0_WA 34 RW 74 PMA1_WA 35 RW 75 PMA2_WA 36 RW 76 PMA3_WA 37 RW 77 PMA4_WA 38 RW 78 PMA5_WA 39 RW 79 PMA6_WA 3A RW 7A PMA7_WA 3B RW 7B PMA0_RA 3C RW 7C PMA1_RA 3D RW 7D PMA2_RA 3E RW 7E PMA3_RA 3F RW 7F Gray fields are reserved; do not access these fields. # Access is bit specific. Name Addr (1,Hex) Access Name 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C IO_CFG 9D OUT_P1 9E 9F A0 OSC_CR0 A1 ECO_CFG A2 OSC_CR2 A3 VLT_CR A4 VLT_CMP A5 A6 A7 A8 IMO_TR A9 ILO_TR AA AB SLP_CFG AC SLP_CFG2 AD SLP_CFG3 AE AF B0 B1 B2 B3 B4 B5 B6 B7 CPU_F B8 B9 BA BB BC BD BE BF Addr (1,Hex) C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF Access RW RW RW # RW RW R W W RW RW RW RL Document Number: 001-12394 Rev *I Page 15 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Electrical Specifications This section presents the DC and AC electrical specifications of the enCoRe V USB devices. For the most up to date electrical specifications, verify that you have the most recent data sheet available by visiting the company web site at http://www.cypress.com Figure 9. Voltage versus CPU Frequency 5.5V 5.5V Figure 10. IMO Frequency Trim Options lid ng Va rati n e io Op eg R Vdd Voltage 3.0V 3.0V 5.7 MHz CPU Frequency Vdd Voltage SLIMO Mode = 01 SLIMO Mode = 00 SLIMO Mode = 10 24 MHz 750 kHz 3 MHz 6 MHz 12 MHz 24 MHz IMO Frequency The following table lists the units of measure that are used in this section. Table 7. Units of Measure Symbol oC dB fF Hz KB Kbit kHz kΩ MHz MΩ μA μF μH μs μV μVrms Unit of Measure degree Celsius decibels femto farad hertz 1024 bytes 1024 bits kilohertz kilohm megahertz megaohm microampere microfarad microhenry microsecond microvolts microvolts root-mean-square Symbol μW mA ms mV nA ns nV Ω pA pF pp ppm ps sps σ V Unit of Measure microwatts milli-ampere milli-second milli-volts nanoampere nanosecond nanovolts ohm picoampere picofarad peak-to-peak parts per million picosecond samples per second sigma: one standard deviation volts Document Number: 001-12394 Rev *I Page 16 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x Absolute Maximum Ratings Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Table 8. Absolute Maximum Ratings Symbol TSTG Description Storage Temperature [3] Conditions Higher storage temperatures reduces data retention time. Recommended Storage Temperature is +25°C ± 25°C. Extended duration storage temperatures above 85oC degrades reliability. Min –55 Typ +25 Max +125 Units °C Vdd VIO VIOZ IMIO ESD LU Supply Voltage Relative to Vss DC Input Voltage DC Voltage Applied to Tristate Maximum Current into any Port Pin Electro Static Discharge Voltage Latch up Current Human Body Model ESD In accordance with JESD78 standard –0.5 Vss – 0.5 Vss –0.5 –25 2000 – – – – – – – +6.0 Vdd + 0.5 Vdd + 0.5 +50 – 200 V V V mA V mA Operating Temperature Table 9. Operating Temperature Symbol TAI TAC TJI Description Ambient Industrial Temperature Ambient Commercial Temperature Operational Industrial Die Temperature[4] The temperature rise from ambient to junction is package specific. Refer the table “Thermal Impedances per Package” on page 29. The user must limit the power consumption to comply with this requirement. The temperature rise from ambient to junction is package specific. Refer the table “Thermal Impedances per Package” on page 29. The user must limit the power consumption to comply with this requirement. Conditions Min –40 0 Typ – Max +85 +70 Units °C °C –40 – +100 °C TJC Operational Commercial Die Temperature 0 +85 °C Notes 3. Higher storage temperatures reduce data retention time. Recommended storage temperature is +25°C ± 25°C. Extended duration storage temperatures above 85oC degrade reliability. 4. The temperature rise from ambient to junction is package specific. See Package Handling on page 29. The user must limit the power consumption to comply with this requirement. Document Number: 001-12394 Rev *I Page 17 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x DC Electrical Characteristics DC Chip Level Specifications Table 10 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 10.DC Chip Level Specifications Symbol Vdd IDD24,3 IDD12,3 IDD6,3 ISB1,3 ISB0,3 VddUSB IDD24,5 IDD12,5 IDD6,5 ISB1,5 ISB0,5 Description Operating Voltage Supply Current, CPU= 24 MHz Conditions No USB Activity. Conditions are Vdd = 3.0V, TA = 25oC, CPU = 24 MHz, No USB/I2C/SPI. Conditions are Vdd = 3.0V, TA = 25oC, CPU = 12 MHz, No USB/I2C/SPI. Conditions are Vdd = 3.0V, TA = 25oC, CPU = 6 MHz, No USB/I2C/SPI. Vdd = 3.0V, TA = 25oC, I/O regulator turned off. Vdd = 3.0V, TA = 25oC, I/O regulator turned off. USB Activity Conditions are Vdd = 5.0V, TA = 25oC, CPU = 24 MHz, IMO = 24 MHz USB Active, No I2C/SPI. Conditions are Vdd = 5.0V, TA = 25oC, CPU = 12 MHz, IMO = 24 MHz USB Active, No I2C/SPI. Conditions are Vdd = 5.0V, TA = 25oC, CPU = 6 MHz, IMO = 24 MHz USB Active, No I2C/SPI Vdd = 5.0V, TA = 25oC, I/O regulator turned off. Vdd = 5.0V, TA = 25oC, I/O regulator turned off. Min 3.0 – Typ – 2.9 Max 5.5 4.0 Units V mA Supply Current, CPU= 12 MHz – 1.7 2.6 mA Supply Current, CPU= 6 MHz – 1.2 1.8 mA Standby Current with POR, LVD, and Sleep Timer Deep Sleep Current Operating Voltage Supply Current, CPU= 24 MHz – – 4.35 – 1.1 0.1 – 7.1 1.5 – 5.25 – μA μA V mA Supply Current, CPU= 12 MHz – 6.2 – mA Supply Current, CPU= 6 MHz – 5.8 – mA Standby Current with POR, LVD, and Sleep Timer Deep Sleep Current – – 1.1 0.1 – – μA μA Table 11.DC Characteristics – USB Interface Symbol Rusbi Rusba Vohusb Volusb Vdi Vcm Vse Cin Iio Rps2 Rext Description USB D+ Pull Up Resistance USB D+ Pull Up Resistance Static Output High Static Output Low Differential Input Sensitivity Differential Input Common Mode Range Single Ended Receiver Threshold Transceiver Capacitance High Z State Data Line Leakage PS/2 Pull Up Resistance External USB Series Resistor In series with each USB pin On D+ or D- line -10 3 21.78 0.2 0.8 0.8 With idle bus While receiving traffic Conditions Min 0.900 1.425 2.8 Typ 5 22.0 Max 1.575 3.090 3.6 0.3 – 2.5 2.0 50 +10 7 22.22 Units kΩ kΩ V V V V V pF μA kΩ Ω Document Number: 001-12394 Rev *I Page 18 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x ADC Electrical Specifications Table 12. ADC User Module Electrical Specifications Symbol Input VIN CIIN RIN Reference VREFADC Conversion Rate FCLK S8 Data Clock Source is chip’s internal main oscillator. See AC Chip-Level Specifications for accuracy Data Clock set to 6 MHz. Sample Rate = 0.001/ (2^Resolution/Data Clock) Data Clock set to 6 MHz. Sample Rate = 0.001/ (2^Resolution/Data Clock) Can be set to 8-, 9-, or 10-bit 8 -1 -2 8-bit resolution 10-bit resolution Egain Power IADC PSRR Operating Current Power Supply Rejection Ratio PSRR (Vdd>3.0V) PSRR (Vdd 3.1V, maximum of 4 I/Os all sourcing 5 mA IOH = 5 mA, Vdd > 3.1V, maximum of 20 mA source current in all I/Os IOH < 10 μA, Vdd > 3.0V, maximum of 20 mA source current in all I/Os IOH = 2 mA, Vdd > 3.0V, maximum of 20 mA source current in all I/Os IOH < 10 μA, Vdd > 3.0V, maximum of 20 mA source current in all I/Os IOH = 1 mA, Vdd > 3.0V, maximum of 20 mA source current in all I/Os IOL = 25 mA, Vdd > 3.3V, maximum of 60 mA sink current on even port pins (for example, P0[2] and P1[4]) and 60 mA sink current on odd port pins (for example, P0[3] and P1[5]). 2.85 Conditions Typ 5.6 – – – Max 8 – – – Units kΩ V V V – – V 3.00 3.3 V 2.20 – – V 2.35 2.50 2.75 V 1.90 – – V 1.60 1.80 2.1 V 1.20 – – V – – 0.75 V VIL VIH VH IIL CPIN Input Low Voltage Input High Voltage Input Hysteresis Voltage Input Leakage (Absolute Value) Pin Capacitance Package and pin dependent. Temp = 25oC. – 2.0 – 0.5 – – 80 0.001 1.7 0.8 1 5 V V mV µA pF Document Number: 001-12394 Rev *I Page 20 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x DC POR and LVD Specifications Table 14 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 14. DC POR and LVD Specifications Symbol VPPOR VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 VLVD7 Description Vdd Value for PPOR Trip PORLEV[1:0] = 10b, HPOR = 1 Vdd Value for LVD Trip VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b [5] Conditions Min – – 2.85 2.95 3.06 –– 4.62 Typ 2.82 – – 2.92 3.02 3.13 – – 4.73 Max 2.95 – – 2.99 3.09 3.20 – – 4.83 Units V V V V V V V V V DC Programming Specifications Table 15 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 15. DC Programming Specifications Symbol Description Conditions Min VddIWRITE Supply Voltage for Flash Write Opera1.71 tions IDDP Supply Current During Programming or – Verify VILP Input Low Voltage During Programming See appropriate DC General – or Verify Purpose IO Specifications table VIHP Input High Voltage During Programming 0.65xVddIWRITE or Verify IILP Input Current when Applying Vilp to – P1[0] or P1[1] During Programming or Verify[6] IIHP Input Current when Applying Vihp to – P1[0] or P1[1] During Programming or Verify[6] VOLP Output Low Voltage During – Programming or Verify VOHP Output High Voltage During VddIWRITE Programming or Verify 0.9V FlashENPB Flash Write Endurance[7] 50,000 FlashDR Flash Data Retention[8] 10 Typ – 5 – – – Max 5.25 25 VIL – 0.2 Units V mA V V mA – 1.5 mA – – – 20 Vss + 0.75 VddIWRITE – – V V Cycle s Years Notes 5. Always greater than 50 mV above VPPOR (PORLEV = 10) for falling supply. 6. Driving internal pull down resistor. 7. Erase/write cycles per block. 8. Following maximum Flash write cycles at Tamb = 55C and Tj = 70C. Document Number: 001-12394 Rev *I Page 21 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x AC Electrical Characteristics AC Chip Level Specifications The following tables list guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 16. AC Chip Level Specifications Symbol FCPU F32K1 F32K_U Description Conditions Processing Frequency[9] Internal Low Speed Oscillator Frequency Trimmed[10] Internal Low Speed Oscillator (ILO) Untrimmed Frequency) F32K2 Internal Low Speed Oscillator Frequency Untrimmed FIMO24 Internal Main Oscillator Stability for 24 MHz ± 5%(12) FIMO12 Internal Main Oscillator Stability for 12 MHz[10] FIMO6 Internal Main Oscillator Stability for 6 MHz[10] DCIMO Duty Cycle of IMO DCILO Internal Low Speed Oscillator Duty Cycle SRPOWER_UP Power Supply Slew Rate TXRST External Reset Pulse Width at Power Up After supply voltage is valid [11] Applies after part TXRST2 External Reset Pulse Width after Power Up has booted Table 17.AC Characteristics – USB Data Timings Symbol Tdrate Tdjr1 Tdjr2 Tudj1 Tudj2 Tfdeop Tfeopt Tfeopr Tfst Description Full speed data rate Receiver data jitter tolerance Receiver data jitter tolerance Driver differential jitter Driver differential jitter Source jitter for differential transition Source SE0 interval of EOP Receiver SE0 interval of EOP Width of SE0 interval during differential transition Conditions Average bit rate To next transition To pair transition To next transition To pair transition To SE0 transition Min 11.97 -18.5 -9 -3.5 -4.0 -2 160 82 – Typ 12 – – – – – – – – 14 Max 12.03 18.5 9 3.5 4.0 5 175 Units MHz ns ns ns ns ns ns ns ns Min 5.7 19 13 13 22.8 11.4 5.7 40 40 – 1 10 Typ – 32 32 32 24 12 6.0 50 50 – – – Max 25.2 50 82 82 25.2 12.6 6.3 60 60 250 – – Units MHz kHz kHz kHz MHz MHz MHz % % V/ms ms μs Table 18.AC Characteristics – USB Driver Symbol Tr Tf TR Vcrs Description Transition rise time Transition fall time Rise/fall time matching Output signal crossover voltage Conditions 50 pF 50 pF Min 4 4 90.00 1.3 Typ – – – – Max 20 20 111.1 2.0 Units ns ns % V Notes 9. Vdd = 3.0V and TJ = 85oC, CPU speed. 10. Trimmed for 3.3V operation using factory trim values. 11. The minimum required XRES pulse length is longer when programming the device (see Table 21 on page 24). Page 22 of 32 Document Number: 001-12394 Rev *I [+] Feedback CY7C6431x CY7C6434x, CY7C6435x AC General Purpose I/O Specifications Table 19 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 19. AC GPIO Specifications Symbol FGPIO TRise23 TRise01 TFall Description GPIO Operating Frequency Rise Time, Strong Mode Ports 2, 3 Rise Time, Strong Mode Ports 0, 1 Fall Time, Strong Mode All Ports Conditions Normal Strong Mode, Ports 0, 1 Vdd = 3.0 to 3.6V, 10% - 90% Vdd = 3.0 to 3.6V, 10% - 90% Vdd = 3.0 to 3.6V, 10% - 90% Min 15 10 10 Typ – – – – Max 12 80 50 50 Units MHz ns ns ns Figure 11. GPIO Timing Diagram 90% GPIO Pin Output Voltage 10% TRise23 TRise01 TFall AC External Clock Specifications Table 20 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 20. AC External Clock Specifications Symbol FOSCEXT – – – Frequency High Period Low Period Power Up IMO to Switch Description Conditions Min 0.750 20.6 20.6 150 Typ – – – – Max 25.2 5300 – – Units MHz ns ns μs Document Number: 001-12394 Rev *I Page 23 of 32 [+] Feedback CY7C6431x CY7C6434x, CY7C6435x AC Programming Specifications Table 21 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 21. AC Programming Specifications Symbol TRSCLK TFSCLK TSSCLK THSCLK FSCLK TERASEB TWRITE TDSCLK1 TDSCLK2 TXRST3 Description Rise Time of SCLK Fall Time of SCLK Data Setup Time to Falling Edge of SCLK Data Hold Time from Falling Edge of SCLK Frequency of SCLK Flash Erase Time (Block) Flash Block Write Time Data Out Delay from Falling Edge of SCLK, Data Out Delay from Falling Edge of SCLK External Reset Pulse Width after Power Up Conditions Min 1 1 40 40 0 – – – – 263 Typ – – – – – – – – – – Max 20 20 – – 8 18 25 60 85 – Units ns ns ns ns MHz ms ms ns ns μs Vdd > 3.6V 3.0V