CY8C20XX6A/S
®
1.8 V Programmable CapSense Controller
with SmartSense™ Auto-tuning
1–33 Buttons, 0–6 Sliders
1.8 V Programmable CapSense® Controller with SmartSense™ Auto-tuning 1–33 Buttons, 0–6 Sliders
Features
■
Low power CapSense® block with SmartSense Auto-tuning
❐ Patented CSA_EMC, CSD sensing algorithms
❐ SmartSense_EMC Auto-Tuning
• Sets and maintains optimal sensor performance during run
time
• Eliminates system tuning during development and
production
• Compensates for variations in manufacturing process Low
average power consumption – 28 µA/sensor in run time
(wake-up and scan once every 125 ms)
■
Powerful Harvard-architecture processor
❐ M8C CPU with a max speed of 24 MHz
■
Operating Range: 1.71 V to 5.5 V
❐ Standby Mode 1.1 μA (Typ)
❐ Deep Sleep 0.1 μA (Typ)
■
Operating Temperature range: –40 °C to +85 °C
■
Flexible on-chip memory
❐ 8 KB flash, 1 KB SRAM
❐ 16 KB flash, 2 KB SRAM
❐ 32 KB flash, 2 KB SRAM
❐ Read while Write with EEPROM emulation
❐ 50,000 flash erase/write cycles
❐ In-system programming simplifies manufacturing process
■
Four Clock Sources
❐ Internal main oscillator (IMO): 6/12/24 MHz
❐ Internal low-speed oscillator (ILO) at 32 kHz for watchdog
and sleep timers
❐ External 32 KHz Crystal Oscillator
❐ External Clock Input
■
Programmable pin configurations
❐ Up to 36 general-purpose I/Os (GPIOs) configurable as
buttons or sliders
❐ Dual mode GPIO (Analog inputs and Digital I/O supported)
❐ High sink current of 25 mA per GPIO
• Max sink current 120 mA for all GPIOs
❐ Source Current
• 5 mA on ports 0 and 1
• 1 mA on ports 2,3 and 4
❐ Configurable internal pull-up, high-Z and open drain modes
❐ Selectable, regulated digital I/O on port 1
❐ Configurable input threshold on port 1
■
Versatile Analog functions
❐ Internal analog bus supports connection of multiple sensors
to form ganged proximity sensor
❐ Internal Low-Dropout voltage regulator for high power supply
rejection ratio (PSRR)
■
Full-Speed USB
❐ 12 Mbps USB 2.0 compliant
■
Additional system resources
❐ I2C Slave:
• Selectable to 50 kHz, 100 kHz, or 400 kHz
❐ Configurable up to 12 MHz SPI master and slave
❐ Three 16-bit timers
❐ Watchdog and sleep timers
❐ Integrated supervisory circuit
❐ 10-bit incremental analog-to-digital converter (ADC) with
internal voltage reference
❐ Two general-purpose high speed, low power analog
comparators
■
Complete development tools
❐ Free development tool (PSoC Designer™)
■
Sensor and Package options
❐ 10 Sensors – QFN 16, 24
❐ 16 Sensors – QFN 24
❐ 22 / 25 Sensors – QFN 32
❐ 24 Sensors - WLCSP 30
❐ 31 Sensors – SSOP 48
❐ 33 Sensors – QFN 48
Errata: For information on silicon errata, see “Errata” on page 46. Details include trigger conditions, devices affected, and proposed workaround.
Cypress Semiconductor Corporation
Document Number: 001-54459 Rev. *Y
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised May 18, 2017
CY8C20XX6A/S
Logic Block Diagram
Port 4
Port 3
Port 2
Port 1
Port 0
1.8/2.5/3V
LDO
PWRSYS[1]
(Regulator)
PSoC CORE
SYSTEM BUS
Global Analog Interconnect
1K/2K
SRAM
Supervisory ROM (SROM)
Interrupt
Controller
8K/16K/32K Flash
Nonvolatile Memory
Sleep and
Watchdog
CPU Core (M8C)
6/12/24 MHz Internal Main Oscillator
(IMO)
Internal Low Speed Oscillator (ILO)
Multiple Clock Sources
CAPSENSE
SYSTEM
Two
Comparators
Analog
Reference
CapSense
Module
Analog
Mux
SYSTEM BUS
USB
I2C
Slave
Internal
Voltage
References
System
Resets
POR
and
LVD
SPI
Master/
Slave
Three 16-Bit
Programmable
Timers
Digital
Clocks
SYSTEM RESOURCES
Note
1. Internal voltage regulator for internal circuitry
Document Number: 001-54459 Rev. *Y
Page 2 of 53
CY8C20XX6A/S
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right PSoC device for your design, and to help you
to quickly and effectively integrate the device into your design. For a comprehensive list of resources, see the knowledge base article
KBA92181, Resources Available for CapSense® Controllers. Following is an abbreviated list for CapSense devices:
■
■
■
■
Overview: CapSense Portfolio, CapSense Roadmap
Product Selectors: CapSense, CapSense Plus, CapSense
Express, PSoC3 with CapSense, PSoC5 with CapSense,
PSoC4. In addition, PSoC Designer offers a device selection
tool at the time of creating a new project.
Application notes: Cypress offers CapSense application notes
covering a broad range of topics, from basic to advanced level.
Recommended application notes for getting started with
CapSense are:
❐ AN64846: Getting Started With CapSense
®
❐ AN73034: CY8C20xx6A/H/AS CapSense Design Guide
❐ AN2397: CapSense® Data Viewing Tools
Technical Reference Manual (TRM):
❐ PSoC® CY8C20xx6A/AS/L Family Technical Reference
Manual
Development Kits:
❐ CY3280-20x66 Universal CapSense Controller Kit features
a predefined control circuitry and plug-in hardware to make
prototyping and debugging easy. Programming and
I2C-to-USB Bridge hardware are included for tuning and data
acquisition.
❐ CY3280-BMM Matrix Button Module Kit consists of eight
CapSense sensors organized in a 4x4 matrix format to form
16 physical buttons and eight LEDs. This module connects
to any CY3280 Universal CapSense Controller Board,
including CY3280-20x66 Universal CapSense Controller.
❐ CY3280-BSM Simple Button Module Kit consists of ten
CapSense buttons and ten LEDs. This module connects to
any CY3280 Universal CapSense Controller Board, including
CY3280-20x66 Universal CapSense Controller.
The CY3217-MiniProg1 and CY8CKIT-002 PSoC® MiniProg3
device provides an interface for flash programming.
■
PSoC Designer
PSoC Designer is a free Windows-based Integrated Design Environment (IDE). It enables concurrent hardware and firmware design
of systems based on CapSense (see Figure 1). With PSoC Designer, you can:
1. Drag and drop User Modules to build your hardware system
3. Configure User Module
design in the main design workspace
4. Explore the library of user modules
2. Codesign your application firmware with the PSoC hardware,
5. Review user module datasheets
using the PSoC Designer IDE C compiler
Figure 1. PSoC Designer Features
1
2
3
4
5
Document Number: 001-54459 Rev. *Y
Page 3 of 53
CY8C20XX6A/S
Contents
PSoC® Functional Overview ............................................ 5
PSoC Core .................................................................. 5
CapSense System ....................................................... 5
Additional System Resources ..................................... 6
Getting Started .................................................................. 7
CapSense Design Guides ........................................... 7
Silicon Errata ............................................................... 7
Development Kits ........................................................ 7
Training ....................................................................... 7
CYPros Consultants .................................................... 7
Solutions Library .......................................................... 7
Technical Support ....................................................... 7
Development Tools .......................................................... 8
PSoC Designer Software Subsystems ........................ 8
Designing with PSoC Designer ....................................... 9
Select User Modules ................................................... 9
Configure User Modules .............................................. 9
Organize and Connect ................................................ 9
Generate, Verify, and Debug ....................................... 9
Pinouts ............................................................................ 10
16-pin QFN (10 Sensing Inputs)[3, 4] ....................... 10
24-pin QFN (17 Sensing Inputs) [8] ........................... 11
24-pin QFN (15 Sensing Inputs (With USB)) [13] ...... 12
30-ball WLCSP (24 Sensing Inputs) [18] ................... 13
32-pin QFN (25 Sensing Inputs) [22] ......................... 14
32-pin QFN (22 Sensing Inputs (With USB)) [27] ...... 15
48-pin SSOP (31 Sensing Inputs) [32] ...................... 16
48-pin QFN (33 Sensing Inputs) [36] ......................... 17
48-pin QFN (33 Sensing Inputs (With USB)) [41] ...... 18
48-pin QFN (OCD) (33 Sensing Inputs) [46] ............. 19
Electrical Specifications ................................................ 20
Absolute Maximum Ratings ....................................... 20
Operating Temperature ............................................. 20
DC Chip-Level Specifications .................................... 21
DC GPIO Specifications ............................................ 22
DC Analog Mux Bus Specifications ........................... 24
DC Low Power Comparator Specifications ............... 24
Comparator User Module
Electrical Specifications .................................................... 25
ADC Electrical Specifications .................................... 25
DC POR and LVD Specifications .............................. 26
Document Number: 001-54459 Rev. *Y
DC Programming Specifications ............................... 26
DC I2C Specifications ............................................... 27
DC Reference Buffer Specifications .......................... 27
DC IDAC Specifications ............................................ 27
AC Chip-Level Specifications .................................... 28
AC GPIO Specifications ............................................ 29
AC Comparator Specifications .................................. 30
AC External Clock Specifications .............................. 30
AC Programming Specifications ................................ 31
AC I2C Specifications ................................................ 32
Packaging Information ................................................... 35
Thermal Impedances ................................................. 38
Capacitance on Crystal Pins ..................................... 38
Solder Reflow Specifications ..................................... 38
Development Tool Selection ......................................... 39
Software .................................................................... 39
Development Kits ...................................................... 39
Evaluation Tools ........................................................ 39
Device Programmers ................................................. 39
Accessories (Emulation and Programming) .............. 40
Third Party Tools ....................................................... 40
Build a PSoC Emulator into Your Board .................... 40
Ordering Information ...................................................... 41
Ordering Code Definitions ......................................... 43
Acronyms ........................................................................ 44
Reference Documents .................................................... 44
Document Conventions ................................................. 44
Units of Measure ....................................................... 44
Numeric Naming ........................................................ 45
Glossary .......................................................................... 45
Errata ............................................................................... 46
Qualification Status ................................................... 46
Errata Summary ........................................................ 46
Document History Page ................................................. 49
Sales, Solutions, and Legal Information ...................... 53
Worldwide Sales and Design Support ....................... 53
Products .................................................................... 53
PSoC®Solutions ....................................................... 53
Cypress Developer Community ................................. 53
Technical Support ..................................................... 53
Page 4 of 53
CY8C20XX6A/S
PSoC® Functional Overview
The PSoC family consists of on-chip controller devices, which
are designed to replace multiple traditional microcontroller unit
(MCU)-based components with one, low cost single-chip
programmable component. A PSoC device includes
configurable analog and digital blocks, and programmable
interconnect. This architecture allows the user to create
customized peripheral configurations, to match the requirements
of each individual application. Additionally, a fast CPU, Flash
program memory, SRAM data memory, and configurable I/O are
included in a range of convenient pinouts.
The architecture for this device family, as shown in the Logic
Block Diagram on page 2, consists of three main areas:
■
The Core
■
CapSense Analog System
■
System Resources (including a full-speed USB port).
A common, versatile bus allows connection between I/O and the
analog system.
required tuning parameters. SmartSense allows engineers to go
from prototyping to mass production without re-tuning for
manufacturing variations in PCB and/or overlay material
properties.
SmartSense_EMC
In addition to the SmartSense auto tuning algorithm to remove
manual tuning of CapSense applications, SmartSense_EMC
user module incorporates a unique algorithm to improve
robustness of capacitive sensing algorithm/circuit against high
frequency conducted and radiated noise. Every electronic device
must comply with specific limits for radiated and conducted
external noise and these limits are specified by regulatory bodies
(for example, FCC, CE, U/L and so on). A very good PCB layout
design, power supply design and system design is a mandatory
for a product to pass the conducted and radiated noise tests. An
ideal PCB layout, power supply design or system design is not
often possible because of cost and form factor limitations of the
product. SmartSense_EMC with superior noise immunity is well
suited and handy for such applications to pass radiated and
conducted noise test.
Figure 2. CapSense System Block Diagram
Each CY8C20XX6A/S PSoC device includes a dedicated
CapSense block that provides sensing and scanning control
circuitry for capacitive sensing applications. Depending on the
PSoC package, up to 36 GPIO are also included. The GPIO
provides access to the MCU and analog mux.
CS1
IDAC
The PSoC Core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and IMO and
ILO. The CPU core, called the M8C, is a powerful processor with
speeds up to 24 MHz. The M8C is a 4-MIPS, 8-bit
Harvard-architecture microprocessor.
CSN
Vr
Reference
Buffer
CapSense System
The analog system contains the capacitive sensing hardware.
Several hardware algorithms are supported. This hardware
performs capacitive sensing and scanning without requiring
external components. The analog system is composed of the
CapSense PSoC block and an internal 1 V or 1.2 V analog
reference, which together support capacitive sensing of up to
33 inputs [2]. Capacitive sensing is configurable on each GPIO
pin. Scanning of enabled CapSense pins are completed quickly
and easily across multiple ports.
Comparator
Cinternal
Cexternal (P0[1]
or P0[3])
Mux
Mux
Refs
Cap Sense Counters
CSCLK
SmartSense
SmartSense is an innovative solution from Cypress that removes
manual tuning of CapSense applications. This solution is easy to
use and provides a robust noise immunity. It is the only
auto-tuning solution that establishes, monitors, and maintains all
CS2
Analog Global Bus
PSoC Core
IMO
CapSense
Clock Select
Oscillator
Note
2. 36 GPIOs = 33 pins for capacitive sensing + 2 pins for I2C + 1 pin for modulator capacitor.
Document Number: 001-54459 Rev. *Y
Page 5 of 53
CY8C20XX6A/S
Analog Multiplexer System
Additional System Resources
The Analog Mux Bus can connect to every GPIO pin. Pins are
connected to the bus individually or in any combination. The bus
also connects to the analog system for analysis with the
CapSense block comparator.
System resources provide additional capability, such as
configurable USB and I2C slave, SPI master/slave
communication interface, three 16-bit programmable timers, and
various system resets supported by the M8C.
Switch control logic enables selected pins to precharge
continuously under hardware control. This enables capacitive
measurement for applications such as touch sensing. Other
multiplexer applications include:
These system resources provide additional capability useful to
complete systems. Additional resources include low voltage
detection and power on reset. The merits of each system
resource are listed here:
■
Complex capacitive sensing interfaces, such as sliders and
touchpads.
■
Chip-wide mux that allows analog input from any I/O pin.
■
Crosspoint connection between any I/O pin combinations.
Document Number: 001-54459 Rev. *Y
■
The I2C slave/SPI master-slave module provides
50/100/400 kHz communication over two wires. SPI
communication over three or four wires runs at speeds of
46.9 kHz to 3 MHz (lower for a slower system clock).
■
Low-voltage detection (LVD) interrupts can signal the
application of falling voltage levels, while the advanced
power-on-reset (POR) circuit eliminates the need for a system
supervisor.
■
An internal reference provides an absolute reference for
capacitive sensing.
■
A register-controlled bypass mode allows the user to disable
the LDO regulator.
Page 6 of 53
CY8C20XX6A/S
Getting Started
The quickest way to understand PSoC silicon is to read this
datasheet and then use the PSoC Designer Integrated
Development Environment (IDE). This datasheet is an overview
of the PSoC integrated circuit and presents specific pin, register,
and electrical specifications.
For in depth information, along with detailed programming
details, see the Technical Reference Manual for the
CY8C20XX6A/S PSoC devices.
For up-to-date ordering, packaging, and electrical specification
information, see the latest PSoC device datasheets on the web
at www.cypress.com/psoc.
CapSense Design Guides
Design Guides are an excellent introduction to the wide variety
of possible CapSense designs. They are located at
www.cypress.com/go/CapSenseDesignGuides.
Development Kits
PSoC Development Kits are available online from and through a
growing number of regional and global distributors, which
include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and
Newark.
Training
Free PSoC technical training (on demand, webinars, and
workshops), which is available online via www.cypress.com,
covers a wide variety of topics and skill levels to assist you in
your designs.
CYPros Consultants
Certified PSoC consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC consultant go to the CYPros Consultants web site.
Solutions Library
Refer Getting Started with CapSense design guide for
information on CapSense design and CY8C20XX6A/H/AS
CapSense® Design Guide for specific information on
CY8C20XX6A/AS CapSense controllers.
Visit our growing library of solution focused designs. Here you
can find various application designs that include firmware and
hardware design files that enable you to complete your designs
quickly.
Silicon Errata
Technical Support
Errata documents known issues with silicon including errata
trigger conditions, scope of impact, available workarounds and
silicon revision applicability. Refer to Silicon Errata for the PSoC®
CY8C20x36A/46A/66A/96A/46AS/66AS/36H/46H
families
available at http://www.cypress.com/?rID=56239 for errata
information on CY8C20xx6A/AS/H family of device. Compare
errata document with datasheet for a complete functional
description of device.
Technical support – including a searchable Knowledge Base
articles and technical forums – is also available online. If you
cannot find an answer to your question, call our Technical
Support hotline at 1-800-541-4736.
Document Number: 001-54459 Rev. *Y
Page 7 of 53
CY8C20XX6A/S
Development Tools
PSoC Designer™ is the revolutionary integrated design
environment (IDE) that you can use to customize PSoC to meet
your specific application requirements. PSoC Designer software
accelerates system design and time to market. Develop your
applications using a library of precharacterized analog and digital
peripherals (called user modules) in a drag-and-drop design
environment. Then, customize your design by leveraging the
dynamically generated application programming interface (API)
libraries of code. Finally, debug and test your designs with the
integrated debug environment, including in-circuit emulation and
standard software debug features. PSoC Designer includes:
Code Generation Tools
The code generation tools work seamlessly within the
PSoC Designer interface and have been tested with a full range
of debugging tools. You can develop your design in C, assembly,
or a combination of the two.
Assemblers. The assemblers allow you to merge assembly
code seamlessly with C code. Link libraries automatically use
absolute addressing or are compiled in relative mode, and linked
with other software modules to get absolute addressing.
■
Application editor graphical user interface (GUI) for device and
user module configuration and dynamic reconfiguration
■
Extensive user module catalog
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices. The
optimizing C compilers provide all of the features of C, tailored
to the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
■
Integrated source-code editor (C and assembly)
Debugger
■
Free C compiler with no size restrictions or time limits
■
Built-in debugger
■
In-circuit emulation
PSoC Designer has a debug environment that provides
hardware in-circuit emulation, allowing you to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow you to read and program and
read and write data memory, and read and write I/O registers.
You can read and write CPU registers, set and clear breakpoints,
and provide program run, halt, and step control. The debugger
also lets you to create a trace buffer of registers and memory
locations of interest.
Built-in support for communication interfaces:
2
❐ Hardware and software I C slaves and masters
❐ Full-speed USB 2.0
❐ Up
to
four
full-duplex
universal
asynchronous
receiver/transmitters (UARTs), SPI master and slave, and
wireless
PSoC Designer supports the entire library of PSoC 1 devices and
runs on Windows XP, Windows Vista, and Windows 7.
■
PSoC Designer Software Subsystems
Design Entry
In the chip-level view, choose a base device to work with. Then
select different onboard analog and digital components that use
the PSoC blocks, which are called user modules. Examples of
user modules are analog-to-digital converters (ADCs),
digital-to-analog converters (DACs), amplifiers, and filters.
Configure the user modules for your chosen application and
connect them to each other and to the proper pins. Then
generate your project. This prepopulates your project with APIs
and libraries that you can use to program your application.
The tool also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic
reconfiguration makes it possible to change configurations at run
time. In essence, this lets you to use more than 100 percent of
PSoC’s resources for an application.
Document Number: 001-54459 Rev. *Y
Online Help System
The online help system displays online, context-sensitive help.
Designed for procedural and quick reference, each functional
subsystem has its own context-sensitive help. This system also
provides tutorials and links to FAQs and an Online Support
Forum to aid the designer.
In-Circuit Emulator
A low-cost, high-functionality in-circuit emulator (ICE) is
available for development support. This hardware can program
single devices.
The emulator consists of a base unit that connects to the PC
using a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full-speed
(24 MHz) operation.
Page 8 of 53
CY8C20XX6A/S
Designing with PSoC Designer
The development process for the PSoC device differs from that
of a traditional fixed-function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture a
unique flexibility that pays dividends in managing specification
change during development and lowering inventory costs. These
configurable resources, called PSoC blocks, have the ability to
implement a wide variety of user-selectable functions. The PSoC
development process is:
6. Select user modules.
7. Configure user modules.
8. Organize and connect.
9. Generate, verify, and debug.
Select User Modules
PSoC Designer provides a library of prebuilt, pretested hardware
peripheral components called “user modules”. User modules
make selecting and implementing peripheral devices, both
analog and digital, simple.
Configure User Modules
Each user module that you select establishes the basic register
settings that implement the selected function. They also provide
parameters and properties that allow you to tailor their precise
configuration to your particular application. For example, a PWM
User Module configures one or more digital PSoC blocks, one
for each eight bits of resolution. Using these parameters, you can
establish the pulse width and duty cycle. Configure the
parameters and properties to correspond to your chosen
application. Enter values directly or by selecting values from
drop-down menus. All of the user modules are documented in
datasheets that may be viewed directly in PSoC Designer or on
the Cypress website. These user module datasheets explain the
internal operation of the user module and provide performance
specifications. Each datasheet describes the use of each user
module parameter, and other information that you may need to
successfully implement your design.
Document Number: 001-54459 Rev. *Y
Organize and Connect
Build signal chains at the chip level by interconnecting user
modules to each other and the I/O pins. Perform the selection,
configuration, and routing so that you have complete control over
all on-chip resources.
Generate, Verify, and Debug
When you are ready to test the hardware configuration or move
on to developing code for the project, perform the “Generate
Configuration Files” step. This causes PSoC Designer to
generate source code that automatically configures the device to
your specification and provides the software for the system. The
generated code provides APIs with high-level functions to control
and respond to hardware events at run time, and interrupt
service routines that you can adapt as needed.
A complete code development environment lets you to develop
and customize your applications in C, assembly language, or
both.
The last step in the development process takes place inside
PSoC Designer’s Debugger (accessed by clicking the Connect
icon). PSoC Designer downloads the HEX image to the ICE
where it runs at full-speed. PSoC Designer debugging
capabilities rival those of systems costing many times more. In
addition to traditional single-step, run-to-breakpoint, and
watch-variable features, the debug interface provides a large
trace buffer. It lets you to define complex breakpoint events that
include monitoring address and data bus values, memory
locations, and external signals.
Page 9 of 53
CY8C20XX6A/S
Pinouts
The CY8C20XX6A/S PSoC device is available in a variety of packages, which are listed and illustrated in the following tables. Every
port pin (labeled with a “P”) is capable of Digital I/O and connection to the common analog bus. However, VSS, VDD, and XRES are
not capable of Digital I/O.
16-pin QFN (10 Sensing Inputs)[3, 4]
Table 1. Pin Definitions – CY8C20236A, CY8C20246A, CY8C20246AS PSoC Device
Crystal output (XOut)
I/O
I
P2[3]
Crystal input (XIn)
3
IOHR
I
P1[7]
I2C SCL, SPI SS
4
IOHR
I
P1[5]
I2C
5
IOHR
I
P1[3]
SPI CLK
6
IOHR
I
P1[1]
ISSP CLK[5], I2C SCL, SPI MOSI
7
Power
VSS
8
IOHR
I
P1[0]
9
IOHR
I
P1[2]
10
IOHR
I
11
12
13
Input
IOH
P1[4]
SDA, SPI MISO
Ground connection[7]
ISSP DATA[5], I2C SDA, SPI CLK[6]
Optional external clock (EXTCLK)
XRES Active high external reset with
internal pull-down
I
P0[4]
Power
VDD
Supply voltage
14
IOH
I
P0[7]
15
IOH
I
P0[3]
Integrating input
16
IOH
I
P0[1]
Integrating input
AI , XOut, P2[5]
AI, XIn, P2[3]
AI, I2 C SCL, SPI SS, P1[7]
AI , I2 C SDA, SPI MISO, P1[5]
1
2
14
13
2
P0[1], AI
P0[3], AI
P0[7], AI
Vdd
P2[5]
16
15
I
12
3
4
QFN
( Top View) 11
10
9
5
6
7
8
I/O
Figure 3. CY8C20236A, CY8C20246A, CY8C20246AS
P0[4] , AI
XRES
P1[4] , EXTCLK, AI
P1[2] , AI
AI, SPI CLK , P1[3]
AI, ISSP CLK, SPI MOSI, P1[1]
Vss
[5,6]
AI, ISSP DATA , I2C SDA, SPI CLK , P1[0]
1
Description
[5]
Type
Pin
No. Digital Analog Name
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes
3. 13 GPIOs = 10 pins for capacitive sensing + 2 pins for I2C + 1 pin for modulation capacitor.
4. No Center Pad.
5. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
6. Alternate SPI clock.
7. All VSS pins should be brought out to one common GND plane.
Document Number: 001-54459 Rev. *Y
Page 10 of 53
CY8C20XX6A/S
24-pin QFN (17 Sensing Inputs) [8]
Table 2. Pin Definitions – CY8C20336A, CY8C20346A, CY8C20346AS [9]
P1[3]
SPI CLK
P1[1]
ISSP CLK[10], I2C SCL, SPI
MOSI
IOHR
I
8
9
Power
NC
No connection
VSS
Ground connection[12]
10
IOHR
I
P1[0]
11
IOHR
I
P1[2]
12
IOHR
I
P1[4]
13
IOHR
I
P1[6]
14
Input
XRES
15
I/O
I
P2[0]
16
IOH
I
P0[0]
17
IOH
I
P0[2]
18
IOH
I
P0[4]
19
IOH
I
P0[6]
20
Power
VDD
ISSP DATA[10], I2C SDA, SPI
CLK[11]
Optional external clock input
(EXTCLK)
IOH
I
P0[7]
IOH
I
P0[5]
23
IOH
I
P0[3]
Integrating input
24
IOH
I
P0[1]
Integrating input
VSS
P0[5], AI
P0[7], AI
Vdd
P0[6], AI
22
21
20
19
3
QFN
4
(T o p V ie w )
16
15
5
14
6
13
Supply voltage
22
Power
P 2 [1 ]
P 1 [7 ]
P 1 [5 ]
P 1 [3 ]
P 0 [4 ], A I
P 0 [2 ], A I
P 0 [0 ], A I
P 2 [0 ], A I
XRES
P 1 [6 ], A I
Active high external reset with
internal pull-down
21
CP
A I,
A I, I2 C S C L , S P I S S ,
A I, I2 C S D A , S P I M IS O ,
A I, S P I C L K ,
17
[10,
7
SDA, SPI MISO
18
12
P1[5]
I
2
AI, EXTCLK, P1[4]
I
IOHR
1
11
IOHR
6
A I, X O u t, P 2 [5]
A I, X In , P 2 [3 ]
AI, P1[2]
5
I2C
9
I2C SCL, SPI SS
10
P1[7]
Vss
P2[1]
I
2
I
IOHR
AI, ISSP DATA , I2C SDA, SPI CLK, P1[0]
I/O
4
P0[1], AI
3
P0[3], AI
Crystal input (XIn)
24
Crystal output (XOut)
P2[3]
23
P2[5]
I
8
I
I/O
Figure 4. CY8C20336A, CY8C20346A, CY8C20346AS
7
I/O
2
Description
NC
1
Name
2
Analog
SPI MOSI, P1[1]
Digital
AI, ISSP CLK , I2C SCL
Type
Pin
No.
Center pad must be
connected to ground
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes
8. 20 GPIOs = 17 pins for capacitive sensing + 2 pins for I2C + 1 pin for modulation capacitor.
9. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
10. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
11. Alternate SPI clock.
12. All VSS pins should be brought out to one common GND plane.
Document Number: 001-54459 Rev. *Y
Page 11 of 53
CY8C20XX6A/S
24-pin QFN (15 Sensing Inputs (With USB)) [13]
Table 3. Pin Definitions – CY8C20396A [14]
Digital
Analog
1
I/O
I
P2[5]
2
I/O
I
P2[3]
3
I/O
I
P2[1]
4
IOHR
I
P1[7]
I2C SCL, SPI SS
Description
IOHR
I
P1[1]
ISSP CLK[15], I2C SCL, SPI
MOSI
Power
9
I/O
10
I/O
11
I
I
Power
VSS
Ground[17]
D+
USB D+
D-
USB D-
VDD
Supply
ISSP DATA[15], I2C SDA, SPI
CLK[16]
12
IOHR
I
P1[0]
13
IOHR
I
P1[2]
14
IOHR
I
P1[4]
15
IOHR
I
P1[6]
16
RESET INPUT
XRES
17
IOH
I
P0[0]
18
IOH
I
P0[2]
19
IOH
I
P0[4]
20
IOH
I
P0[6]
21
IOH
I
P0[7]
22
IOH
I
P0[5]
23
IOH
I
P0[3]
Integrating input
24
IOH
I
P0[1]
Integrating input
CP
Power
VSS
Optional external clock input
(EXTCLK)
Active high external reset with
internal pull-down
P2[1], AI
AI, I 2 C SCL, SPI SS,P1[7]
AI, I2C SDA , SPI MISO,P1[5]
AI, SPI CLK ,P1[3]
19
21
20
22
24
23
QFN
3
16
4
(Top View) 15
5
14
6
13
AI, ISSP DATA, I2C SDA, SPI CLK, P1[0]
7
SDA, SPI MISO
11
12
SPI CLK
P0[2], AI
P0[0], AI
XRES
P1[6], AI
P1[4] , AI, EXTCLK
P1[2 ], AI
[15,
P1[3]
9
10
P1[5]
I
18
17
2
8
I
IOHR
1
7
IOHR
6
P2[5], AI
P2[3], AI
AI, ISSP CLK, I2C SCL, SPI MOSI, P1[1]
Vss
D+
DVDD
5
I2C
8
Figure 5. CY8C20396A
P0[1], AI
P0[3], AI
P0[5], AI
P0[7], AI
P0[6], AI
P0[4], AI
Name
[1
Type
Pin
No.
Center pad must be connected
to Ground
LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output
Notes
13. 20 GPIOs = 15 pins for capacitive sensing + 2 pins for I2C + 2 pins for USB + 1 pin for modulation capacitor.
14. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
15. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
16. Alternate SPI clock.
17. All VSS pins should be brought out to one common GND plane.
Document Number: 001-54459 Rev. *Y
Page 12 of 53
CY8C20XX6A/S
30-ball WLCSP (24 Sensing Inputs) [18]
Table 4. Pin Definitions – CY8C20766A, CY8C20746A 30-ball WLCSP
Type
Pin
No.
Digital
Analog
A1
IOH
I
P0[2]
A2
IOH
I
P0[6]
A3
Power
Name
Description
Figure 6. CY8C20766A 30-ball WLCSP
Bottom View
VDD
Supply voltage
Integrating Input
A4
IOH
I
P0[1]
A5
I/O
I
P2[7]
B1
I/O
I
P2[6]
B2
IOH
I
P0[0]
B3
IOH
I
P0[4]
B4
IOH
I
P0[3]
Integrating Input
B5
I/O
I
P2[5]
Crystal Output (Xout)
C1
I/O
I
P2[2]
C2
I/O
I
P2[4]
C3
IOH
I
P0[7]
C4
IOH
I
P0[5]
C5
I/O
I
P2[3]
D1
I/O
I
P2[0]
D2
I/O
I
P3[0]
D3
I/O
I
P3[1]
D4
I/O
I
P3[3]
D5
I/O
I
P2[1]
E1
Input
XRES
2
1
A
D
E
F
Top View
Crystal Input (Xin)
1
2
3
4
5
A
B
Active high external reset with
internal pull-down
C
D
I
P1[6]
E3
IOHR
I
P1[4]
Optional external clock input
(EXT CLK)
E4
IOHR
I
P1[7]
I2C
E5
IOHR
I
P1[5]
I2C SDA, SPI MISO
F1
IOHR
I
P1[2]
F2
IOHR
I
P1[0]
VSS
3
C
IOHR
Power
4
B
E2
F3
5
SCL, SPI SS
E
F
ISSP DATA[19], I2C SDA, SPI
CLK[20]
Supply ground[21]
F4
IOHR
I
P1[1]
ISSP CLK[19], I2C SCL, SPI
MOSI
F5
IOHR
I
P1[3]
SPI CLK
Notes
18. 27 GPIOs = 24 pins for capacitive sensing + 2 pins for I2C + 1 pin for modulation capacitor.
19. On power-up , the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
20. Alternate SPI clock.
21. All VSS pins should be brought out to one common GND plane.
Document Number: 001-54459 Rev. *Y
Page 13 of 53
CY8C20XX6A/S
32-pin QFN (25 Sensing Inputs) [22]
Table 5. Pin Definitions – CY8C20436A, CY8C20446A, CY8C20446AS, CY8C20466A, CY8C20466AS[23]
P2[5]
Crystal output (XOut)
4
I/O
I
P2[3]
Crystal input (XIn)
5
I/O
I
P2[1]
6
I/O
I
P3[3]
7
I/O
I
P3[1]
8
IOHR
I
P1[7]
I2C SCL, SPI SS
9
IOHR
I
P1[5]
I2C SDA, SPI MISO
10
IOHR
I
P1[3]
SPI CLK.
11
IOHR
I
P1[1]
ISSP CLK[24], I2C SCL, SPI MOSI.
12
Power
VSS
13
IOHR
I
P1[0]
14
IOHR
I
P1[2]
15
IOHR
I
P1[4]
16
IOHR
I
P1[6]
17
Input
XRES
I/O
I
P3[0]
19
I/O
I
P3[2]
20
I/O
I
P2[0]
21
I/O
I
P2[2]
22
I/O
I
P2[4]
23
I/O
I
P2[6]
24
IOH
I
P0[0]
25
IOH
I
P0[2]
26
IOH
I
P0[4]
27
IOH
I
P0[6]
ISSP DATA[24], I2C SDA,
SPI CLK[25]
Optional external clock input
(EXTCLK)
Active high external reset with
internal pull-down
32
31
Vss
P0 [3], AI
P0 [5], AI
Ground connection[26]
9
1
2
3
4
5
6
7
8
QFN
(Top View)
24
23
22
21
20
19
18
17
P0[0] , AI
P2[6] , AI
P2[4] , AI
P2[2] , AI
P2[0] , AI
P3[2] , AI
P3[0] , AI
XRES
[24]
18
AI , P0[1]
AI , P2[7]
AI, XOut, P2[5]
AI , XIn, P2[3]
AI , P2[1]
AI , P3[3]
AI , P3[1]
AI , I2 C SCL, SPI SS, P1[7]
P0 [4], AI
P0 [2], AI
P2[7]
I
26
25
I
I/O
15
16
I/O
3
AI, E XTCLK, P 1[4]
AI, P 1[6]
2
CY8C20466A, CY8C20466AS
Integrating input
P0 [7], AI
Vd d
P0 [6], AI
P0[1]
28
27
I
Figure 7. CY8C20436A, CY8C20446A, CY8C20446AS,
13
14
IOH
Description
30
29
1
Name
A I,ISSP CLK , I2C SCL, SPI MOSI, P1[1]
Vss
[24]
AI , ISSP DATA , I2C SDA, SPI CLK, P1[0]
AI, P 1[2]
Analog
10
11
12
Digital
AI, I2C SDA, SPI MISO, P 1[5]
AI, SPI CLK, P 1[3]
Type
Pin
No.
28
Power
VDD
29
IOH
I
P0[7]
30
IOH
I
P0[5]
31
IOH
I
P0[3]
Supply voltage
Integrating input
32
Power
VSS
Ground connection[26]
CP
Power
VSS
Center pad must be connected to
ground
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes
22. 28 GPIOs = 25 pins for capacitive sensing + 2 pins for I2C + 1 pin for modulation capacitor.
23. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
24. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
25. Alternate SPI clock.
26. All VSS pins should be brought out to one common GND plane.
Document Number: 001-54459 Rev. *Y
Page 14 of 53
CY8C20XX6A/S
32-pin QFN (22 Sensing Inputs (With USB)) [27]
Table 6. Pin Definitions – CY8C20496A[28]
P2[1]
5
IOHR
I
P1[7]
IOHR
I
P1[5]
I C SDA, SPI MISO
7
IOHR
I
P1[3]
SPI CLK
8
IOHR
I
P1[1]
ISSP CLK[29], I2C SCL, SPI MOSI
Ground Pin[31]
9
Power
VSS
10
I
I
D+
USB D+
11
D-
USB D-
12
Power
VDD
Power pin
ISSP DATA[29], I2C SDA, SPI
CLKI[30]
13
IOHR
I
P1[0]
14
IOHR
I
P1[2]
15
IOHR
I
P1[4]
16
IOHR
I
P1[6]
17
Input
XRES
18
I/O
I
P3[0]
19
I/O
I
P3[2]
20
I/O
I
P2[0]
21
I/O
I
P2[2]
22
I/O
I
P2[4]
23
I/O
I
P2[6]
24
IOH
I
P0[0]
25
IOH
I
P0[2]
26
IOH
I
P0[4]
27
IOH
I
P0[6]
28
Power
VDD
29
IOH
I
P0[7]
30
IOH
I
P0[5]
31
IOH
I
P0[3]
32
Power
VSS
Vss
P0 [3], AI
P0 [5], AI
SPI CLK , P1 [3]
[29]
ISSP CLK, I2C SCL, SPI MOSI,P1 [ 1 ]
Optional external clock input
(EXTCLK)
Active high external reset with
internal pull-down
QFN
(Top View)
32
9
6
XTAL IN , P2 [ 3 ]
AI , P2[ 1 ]
I2C SCL, SPI SS , P 1[ 7]
I2C SDA, SPI MISO , P 1[ 5]
10
11
12
2
1
2
3
4
5
6
7
8
Vss
I2C SCL, SPI SS
AI , P 0[ 1]
XTAL OUT, P 2 [ 5]
P0 [4], AI
P0 [2], AI
I
26
25
I/O
24
23
22
21
20
19
18
17
15
16
4
AI, P 1[2]
XTAL In
P0[0] , AI
P2[6] , AI
P2[4] , AI
P2[2] , AI
P2[0] , AI
P3[2] , AI
P3[0] , AI
XRES
AI, E XTCLK, P 1[4]
AI, P 1[6]
XTAL Out
P2[3]
P0 [7], AI
Vd d
P0 [6], AI
P2[5]
I
29
I
I/O
28
27
I/O
3
Integrating Input
13
14
2
P0[1]
30
I
Vdd
ISSP
, DATA, I2C SDA, SPI CLK, P1[0]
IOH
Figure 8. CY8C20496A
Description
USB D-
1
Name
[29, 30]
Analog
31
Digital
USB PHY, D+
Type
Pin
No.
Power Pin
Integrating Input
Ground Pin[31]
LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes
27. 27 GPIOs = 22 pins for capacitive sensing + 2 pins for I2C + 2 pins for USB + 1 pin for modulation capacitor.
28. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
29. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
30. Alternate SPI clock.
31. All VSS pins should be brought out to one common GND plane.
Document Number: 001-54459 Rev. *Y
Page 15 of 53
CY8C20XX6A/S
48-pin SSOP (31 Sensing Inputs) [32]
Table 7. Pin Definitions – CY8C20536A, CY8C20546A, and CY8C20566A[33]
Figure 9. CY8C20536A, CY8C20546A, and CY8C20566A
Pin
No.
Digital
Analog
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
IOH
IOH
IOH
IOH
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
IOHR
IOHR
IOHR
IOHR
I
I
I
I
25
IOHR
I
P1[0]
26
IOHR
I
P1[2]
27
IOHR
I
P1[4]
28
29
30
31
IOHR
I
P1[6]
NC
NC
NC
No connection
No connection
No connection
32
NC
No connection
Pin
No.
Digital
33
34
NC
NC
41
42
I/O
I/O
I
I
P2[2]
P2[4]
35
XRES
No connection
No connection
Active high external reset with
internal pull-down
43
I/O
I
P2[6]
44
45
46
47
48
IOH
IOH
IOH
IOH
Power
I
I
I
I
P0[0]
P0[2]
P0[4]
P0[6]
VDD
36
37
38
39
40
I/O
I/O
I
I
I/O
I/O
I/O
I/O
I
I
I
I
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
Name
P0[7]
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
NC
NC
P4[3]
P4[1]
NC
P3[7]
P3[5]
P3[3]
P3[1]
NC
NC
P1[7]
P1[5]
P1[3]
P1[1]
VSS
Description
AI, P0[7]
AI, P0[5]
AI, P0[3]
AI P0[1]
AI , P2[7]
XTALOUT, P2[5]
XTALIN, P2[3]
AI , P2[1]
NC
NC
AI, P4[3]
AI, P4[1]
NC
AI, P3[7]
AI, P3[5]
AI, P3[3]
AI, P3[1]
NC
NC
I2 C SCL, SPI SS, P1[7]
I2 C SDA, SPI MISO, P1[5 ]
SPI CLK, P1[3]
[33]
ISSP CLK, I2 C SCL, SPI MOSI, P1[1 ]
VSS
Integrating Input
Integrating Input
XTAL Out
XTAL In
No connection
No connection
No connection
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
SSOP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VDD
P0[6] , AI
P0[4] , AI
P0[2] , AI
P0[0] , AI
P2[6] , AI
P2[4] , AI
P2[2] , AI
P2[0] , AI
P3[6] , AI
P3[4] , AI
P3[2] , AI
P3[0] , AI
XRES
NC
NC
NC
NC
NC
NC
P1[6] , AI
P1[4] , EXT CLK
P1[2] , AI
[33, 34]
P1[0] , ISSP DATA, I2C SDA, SPI CLK
No connection
No connection
I2C SCL, SPI SS
I2C SDA, SPI MISO
SPI CLK
ISSP CLK[33], I2C SCL, SPI MOSI
Ground Pin[35]
ISSP DATA[33], I2C SDA, SPI
CLK[34]
Optional external clock input
(EXT CLK)
P3[0]
P3[2]
P3[4]
P3[6]
P2[0]
Analog
Name
Description
VREF
Power Pin
LEGEND A = Analog, I = Input, O = Output, NC = No Connection, H = 5 mA High Output Drive, R = Regulated Output Option.
Notes
32. 34 GPIOs = 31 pins for capacitive sensing + 2 pins for I2C + 1 pin for modulation capacitor.
33. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
34. Alternate SPI clock.
35. All VSS pins should be brought out to one common GND plane.
Document Number: 001-54459 Rev. *Y
Page 16 of 53
CY8C20XX6A/S
48-pin QFN (33 Sensing Inputs) [36]
Table 8. Pin Definitions – CY8C20636A[37, 38]
17
18
19
20
21
I
I
I
I
I
I
I
I
I
I
I
I
IOHR
I
NC
P2[7]
P2[5]
P2[3]
P2[1]
P4[3]
P4[1]
P3[7]
P3[5]
P3[3]
P3[1]
P1[7]
P1[5]
NC
NC
P1[3]
IOHR
I
P1[1]
Power
VSS
DNU
DNU
VDD
Power
22
IOHR
I
P1[0]
23
IOHR
I
P1[2]
24
IOHR
I
P1[4]
25
IOHR
I
P1[6]
26
Input
XRES
No connection
P0[1], AI
Vss
P0[3], AI
P0[5 ], AI
P0[7], AI
NC
NC
Vdd
P0[6], AI
P0[4], AI
P0[2], AI
P0[0], AI
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
IOHR
IOHR
Figure 10. CY8C20636A
Description
Crystal output (XOut)
Crystal input (XIn)
NC
AI ,P2[7]
AI , XOut,P2[5]
AI , XIn ,P2[3]
AI ,P2[1]
AI ,P4[3]
AI ,P4[1]
AI ,P3[7]
AI ,P3[5]
AI ,P3[3]
AI P3[1]
AI ,I2 C SCL, SPI SS,P1[7]
I2C SCL, SPI SS
I2C SDA, SPI MISO
No connection
No connection
SPI CLK
ISSP CLK[37], I2C SCL, SPI
MOSI
Ground connection[40]
48
47
46
45
44
43
42
41
40
39
38
37
Name
1
2
3
4
5
6
7
8
9
10
11
12
QFN
(Top View)
13
14
15
16
17
18
19
20
21
22
23
24
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Digital Analog
36
35
34
33
32
31
30
29
28
27
26
25
P2[6] ,AI
P2[4] AI
,
P2[2] ,AI
P2[0] AI
,
P4[2] ,AI
P4[0] ,AI
P3[6] ,AI
P3[4] , AI
P3[2] ,AI
P3[0] , AI
XRES
P1[6] , AI
I2C SDA, SPI MISO, A I, P1[5]
NC
NC
SPI CLK, AI, P1[3]
[37]
AI, ISSP CLK, I2C SCL, SPI MOSI, P1[1]
Vss
DNU
DNU
[37, 39]
Vdd
AI, ISSP DATA1 , I2C SDA, SPI CLK, P1[0]
AI, P 1[2]
AI, EXTCLK, P1[4]
Pin
No.
Supply voltage
ISSP DATA[37], I2C SDA, SPI
CLK[39]
Optional external clock input
(EXTCLK)
Active high external reset with
internal pull-down
27
28
I/O
I/O
I
I
P3[0]
P3[2]
29
I/O
I
P3[4]
Pin
No.
30
31
32
33
34
35
36
37
38
39
I/O
I/O
I/O
I/O
I/O
I/O
I/O
IOH
IOH
IOH
I
I
I
I
I
I
I
I
I
I
P3[6]
P4[0]
P4[2]
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
40
41
42
43
44
45
46
47
48
CP
Digital
IOH
IOH
IOH
IOH
Analog
I
Power
I
I
I
Power
IOH
I
Power
Name
P0[6]
VDD
NC
NC
P0[7]
P0[5]
P0[3]
VSS
P0[1]
VSS
Description
Supply voltage
No connection
No connection
Integrating input
Ground connection[40]
Center pad must be connected to ground
LEGEND A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive, R = Regulated Output.
Notes
36. 36 GPIOs = 33 pins for capacitive sensing + 2 pins for I2C + 1 pin for modulation capacitor.
37. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use
alternate pins if you encounter issues.
38. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal
39. Alternate SPI clock.
40. All VSS pins should be brought out to one common GND plane.
Document Number: 001-54459 Rev. *Y
Page 17 of 53
CY8C20XX6A/S
48-pin QFN (33 Sensing Inputs (With USB)) [41]
Table 9. Pin Definitions – CY8C20646A, CY8C20646AS, CY8C20666A, CY8C20666AS [42, 43]
Pin
Figure 11. CY8C20646A, CY8C20646AS, CY8C20666A,
Name
Description
No. Digital Analog
CY8C20666AS
P1[0]
23
IOHR
I
P1[2]
24
IOHR
I
P1[4]
25
IOHR
I
P1[6]
26
Input
XRES
Crystal output (XOut)
Crystal input (XIn)
NC
AI , P2[7]
AI , XOut, P2[5]
AI , XIn , P2[3]
AI , P2[1]
AI , P4[3]
AI , P4[1]
AI , P3[7]
AI , P3[5]
AI , P3[3]
AI , P3[1]
AI , I2 C SCL, SPI SS, P1[7]
I2C SCL, SPI SS
I2C SDA, SPI MISO
No connection
No connection
SPI CLK
ISSP CLK[42], I2C SCL, SPI MOSI
Ground connection[45]
USB D+
USB DSupply voltage
ISSP DATA[42], I2C SDA, SPI
CLK[44]
Vss
P0[3], AI
P0[5 ], AI
P0[7], AI
NC
NC
Vdd
P0[6], AI
P0[4], AI
P0[2], AI
P0[0], AI
I
P0[1], AI
IOHR
No connection
48
47
46
45
44
43
42
41
40
39
38
37
22
I
I
I
I
I
I
I
I
I
I
I
I
1
2
3
4
5
6
7
8
9
10
11
12
QFN
(Top View)
13
14
15
16
17
18
19
20
21
22
23
24
IOHR
I
IOHR
I
Power
I/O
I/O
Power
NC
P2[7]
P2[5]
P2[3]
P2[1]
P4[3]
P4[1]
P3[7]
P3[5]
P3[3]
P3[1]
P1[7]
P1[5]
NC
NC
P1[3]
P1[1]
VSS
D+
DVDD
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
IOHR
IOHR
36
35
34
33
32
31
30
29
28
27
26
25
P2[6] , AI
P2[4] ,AI
P2[2] ,AI
P2[0] ,AI
P4[2] ,AI
P4[0] ,AI
P3[6] ,AI
P3[4] , AI
P3[2] ,AI
P3[0] , AI
XRES
P1[6] , AI
I2C SDA, SPI MISO, A I, P1[5]
NC
NC
SPI CLK, A I, P1[3]
[42]
AI,ISSP CLK , I2C SCL, SPI MOSI, P1[1]
Vss
D+
DVdd
[42, 44]
AI,ISSP DATA, I2C SDA, SPI CLK, P1[0]
AI, P1[2]
AI, EXTCLK, P1[4]
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Optional external clock input
(EXTCLK)
Active high external reset with
internal pull-down
27
28
I/O
I/O
I
I
P3[0]
P3[2]
29
I/O
I
P3[4]
Pin
No.
30
31
32
33
34
35
36
37
38
39
I/O
I/O
I/O
I/O
I/O
I/O
I/O
IOH
IOH
IOH
I
I
I
I
I
I
I
I
I
I
P3[6]
P4[0]
P4[2]
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
40
41
42
43
44
45
46
47
48
CP
Digital
IOH
IOH
IOH
IOH
Analog
I
Power
I
I
I
Power
IOH
I
Power
Name
P0[6]
VDD
NC
NC
P0[7]
P0[5]
P0[3]
VSS
P0[1]
VSS
Description
Supply voltage
No connection
No connection
Integrating input
Ground connection[45]
Center pad must be connected to ground
LEGEND A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive, R = Regulated Output.
Notes
41. 38 GPIOs = 33 pins for capacitive sensing + 2 pins for I2C + 2 pins for USB + 1 pin for modulation capacitor.
42. On Power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to High impedance state. On reset, after XRES de- asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. In both cases, a pull-up resistance on these lines combines with the pull-down resistance
(5.6K ohm) and form a potential divider. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use alternate pins if you encounter issues.
43. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
44. Alternate SPI clock.
45. All VSS pins should be brought out to one common GND plane.
Document Number: 001-54459 Rev. *Y
Page 18 of 53
CY8C20XX6A/S
48-pin QFN (OCD) (33 Sensing Inputs) [46]
17
IOHR
I
P1[1]
18
19
20
21
I/O
I/O
22
IOHR
I
P1[0]
23
IOHR
I
P1[2]
24
IOHR
I
P1[4]
25
IOHR
I
P1[6]
Power
VSS
D+
DVDD
Power
26
Input
XRES
27
28
29
30
31
32
33
34
35
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
I
P3[0]
P3[2]
P3[4]
P3[6]
P4[0]
P4[2]
P2[0]
P2[2]
P2[4]
36
I/O
I
P2[6]
Crystal output (XOut)
Crystal input (XIn)
OCDO
A E
, P2[7]
I
AI , XOut, P2[5]
AI , XIn , P2[3]
AI , P2[1]
AI , P4[3]
AI , P4[1]
AI , P3[7]
AI , P3[5]
AI , P3[3]
AI , P3[1]
AI , I2 C SCL, SPI SS, P1[7]
I2C SCL, SPI SS
I2C SDA, SPI MISO
OCD CPU clock output
OCD high speed clock output
SPI CLK.
ISSP CLK[50], I2C SCL, SPI
MOSI
Ground connection[52]
USB D+
USB DSupply voltage
ISSP DATA[50], I2C SDA, SPI
CLK[51]
Optional external clock input
(EXTCLK)
Active high external reset with
internal pull-down
OCDO
Vdd
P0[6], AI
P0[4], AI
P0[2], AI
P0[0], AI
I
OCD mode direction pin
Vss
P0[3], AI
P0[5 ], AI
P0[7], AI
OCDE
IOHR
OCDOE
P2[7]
P2[5]
P2[3]
P2[1]
P4[3]
P4[1]
P3[7]
P3[5]
P3[3]
P3[1]
P1[7]
P1[5]
CCLK
HCLK
P1[3]
48
47
46
45
44
43
42
41
40
39
38
37
I
I
I
I
I
I
I
I
I
I
I
I
1
2
3
4
5
6
7
8
9
10
11
12
QFN
(Top View)
13
14
15
16
17
18
19
20
21
22
23
24
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
IOHR
IOHR
36
35
34
33
32
31
30
29
28
27
26
25
P2[6] , AI
P2[4] , AI
P2[2] , AI
P2[0] , AI
P4[2] , AI
P4[0] , AI
P3[6] , AI
P3[4] , AI
P3[2] , AI
P3[0] , AI
XRES
P1[6] , AI
I2C SDA, SPI MISO, AI, P1[5]
CCLK
HCLK
SPI CLK, A I, P1[3]
[50]
AI,ISSP CLK6, I2C SCL, SPI MOSI, P1[1]
Vss
D+
DVdd
[50, 51]
AI,ISSP DATA1 , I2C SDA, SPI CLK, P1[0]
AI, P1[2]
AI, EXTCLK, P1[4]
No.
1[49]
2
3
4
5
6
7
8
9
10
11
12
13
14[49]
15[49]
16
P0[1], AI
The 48-pin QFN part is for the CY8C20066A On-Chip Debug (OCD). Note that this part is only used for in-circuit debugging.
Table 10. Pin Definitions – CY8C20066A [47, 48]
Pin
Figure 12. CY8C20066A
Digital Analog
Name
Description
Pin
No.
37
Digital
Analog
IOH
I
P0[0]
38
39
IOH
IOH
I
I
P0[2]
P0[4]
40
41
42[49]
43[49]
44
45
46
47
48
CP
IOH
I
P0[6]
VDD
OCDO
OCDE
P0[7]
P0[5]
P0[3]
VSS
P0[1]
VSS
Power
IOH
IOH
IOH
I
I
I
Power
IOH
I
Power
Name
Description
Supply voltage
OCD even data I/O
OCD odd data output
Integrating input
Ground connection[52]
Center pad must be connected to
ground
LEGEND A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive, R = Regulated Output.
Notes
46. 38 GPIOs = 33 pins for capacitive sensing + 2 pins for I2C + 2 pins for USB + 1 pin for modulation capacitor.
47. This part is available in limited quantities for In-Circuit Debugging during prototype development. It is not available in production volumes.
48. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
49. This pin (associated with OCD part only) is required for connecting the device to ICE-Cube In-Circuit Emulator for firmware debugging purpose. To know more about
the usage of ICE-Cube, refer to CY3215-DK PSoC® IN-CIRCUIT EMULATOR KIT GUIDE.
50. On Power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives
resistive low for 512 sleep clock cycles and both the pins transition to High impedance state. On reset, after XRES de- asserts, the SDA and the SCL lines drive
resistive low for 8 sleep clock cycles and transition to high impedance state. In both cases, a pull-up resistance on these lines combines with the pull-down resistance
(5.6K ohm) and form a potential divider. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use alternate pins if you encounter issues.
51. Alternate SPI clock.
52. All VSS pins should be brought out to one common GND plane.
Document Number: 001-54459 Rev. *Y
Page 19 of 53
CY8C20XX6A/S
Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8C20XX6A/S PSoC devices. For the latest electrical specifications, confirm that you have the most recent datasheet by visiting the web at http://www.cypress.com/psoc.
Figure 13. Voltage versus CPU Frequency
5.5V
Vdd Voltage
li d ng
Va rati n
e io
Op Reg
1.71V
750 kHz
3 MHz
CPU
24 MHz
Frequency
Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested.
Table 11. Absolute Maximum Ratings
Symbol
Description
Conditions
Min
Typ
Max
Units
Higher storage temperatures reduce data
retention time. Recommended Storage
Temperature is +25 °C ± 25 °C. Extended
duration storage temperatures above 85 °C
degrades reliability.
–55
+25
+125
°C
TSTG
Storage temperature
VDD
Supply voltage relative to VSS
–
–0.5
–
+6.0
V
VIO
DC input voltage
–
VSS – 0.5
–
VDD + 0.5
V
VIOZ[53]
DC voltage applied to tristate
–
VSS – 0.5
–
VDD + 0.5
V
IMIO
Maximum current into any port pin
–
–25
–
+50
mA
ESD
Electrostatic discharge voltage
Human body model ESD
2000
–
–
V
LU
Latch-up current
In accordance with JESD78 standard
–
–
200
mA
Operating Temperature
Table 12. Operating Temperature
Conditions
Min
Typ
Max
Units
TA
Symbol
Ambient temperature
–
–40
–
+85
°C
TC
Commercial temperature range
–
0
–
70
°C
The temperature rise from ambient to junction is package
specific. Refer the Thermal Impedances on page 38. The
user must limit the power consumption to comply with this
requirement.
–40
–
+100
°C
TJ
Description
Operational die temperature
Note
53. Port1 pins are hot-swap capable with I/O configured in High-Z mode, and pin input voltage above VDD.
Document Number: 001-54459 Rev. *Y
Page 20 of 53
CY8C20XX6A/S
DC Chip-Level Specifications
Table 13 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 13. DC Chip-Level Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
1.71
–
5.50
V
VDD[54, 55, 56, 57]
Supply voltage
No USB activity. Refer the table “DC
POR and LVD Specifications” on
page 26
VDDUSB[54, 55, 56, 57]
Operating voltage
USB activity, USB regulator enabled
4.35
–
5.25
V
USB activity, USB regulator bypassed
3.15
3.3
3.60
V
IDD24
Conditions are VDD 3.0 V, TA = 25 °C,
Supply current, IMO = 24 MHz CPU = 24 MHz. CapSense running at
12 MHz, no I/O sourcing current
–
2.88
4.00
mA
IDD12
Conditions are VDD 3.0 V, TA = 25 °C,
Supply current, IMO = 12 MHz CPU = 12 MHz. CapSense running at
12 MHz, no I/O sourcing current
–
1.71
2.60
mA
IDD6
Conditions are VDD 3.0 V, TA = 25 °C,
Supply current, IMO = 6 MHz CPU = 6 MHz. CapSense running at
6 MHz, no I/O sourcing current
–
1.16
1.80
mA
IDDAVG10
Average supply current per
sensor
One sensor scanned at 10 mS rate
–
250
–
A
IDDAVG100
Average supply current per
sensor
One sensor scanned at 100 mS rate
–
25
–
A
IDDAVG500
Average supply current per
sensor
One sensor scanned at 500 mS rate
–
7
–
A
ISB0[58, 59, 60, 61, 62, 63]
Deep sleep current
VDD 3.0 V, TA = 25 °C, I/O regulator
turned off
–
0.10
1.05
A
ISB1[58, 59, 60, 61, 62, 63]
Standby current with POR,
LVD and sleep timer
VDD 3.0 V, TA = 25 °C, I/O regulator
turned off
–
1.07
1.50
A
ISBI2C[58, 59, 60, 61, 62, 63]
Standby current with I2C
enabled
Conditions are VDD = 3.3 V, TA = 25 °C
and CPU = 24 MHz
–
1.64
–
A
Notes
54. When VDD remains in the range from 1.71 V to 1.9 V for more than 50 µs, the slew rate when moving from the 1.71 V to 1.9 V range to greater than 2 V must be
slower than 1 V/500 µs to avoid triggering POR. The only other restriction on slew rates for any other voltage range or transition is the SRPOWER_UP parameter.
55. If powering down in standby sleep mode, to properly detect and recover from a VDD brown out condition any of the following actions must be taken:
a.Bring the device out of sleep before powering down.
b.Assure that VDD falls below 100 mV before powering back up.
c.Set the No Buzz bit in the OSC_CR0 register to keep the voltage monitoring circuit powered during sleep.
d.Increase the buzz rate to assure that the falling edge of VDD is captured. The rate is configured through the PSSDC bits in the SLP_CFG register.
For the referenced registers, refer to the CY8C20X36 Technical Reference Manual. In deep sleep mode, additional low power voltage monitoring circuitry allows
VDD brown out conditions to be detected for edge rates slower than 1V/ms.
56. For USB mode, the VDD supply for bus-powered application should be limited to 4.35 V–5.35 V. For self-powered application, VDD should be 3.15 V–3.45 V.
57. For proper CapSense block functionality, if the drop in VDD exceeds 5% of the base VDD, the rate at which VDD drops should not exceed 200 mV/s. Base VDD can
be between 1.8 V and 5.5 V.
58. Errata: When the device is put to sleep in Standby or I2C_USB Mode and the bandgap circuit is refreshed less frequently than every 8 ms (default), the device may
not come out of sleep when a sleep-ending input is received. For more information, see the “Errata” on page 46.
59. Errata: The I2C block exhibits occasional data and bus corruption errors when the I2C master initiates transactions while the device is in or out of transition of sleep
mode. For more information, see the “Errata” on page 46.
60. Errata: When programmable timer 0 is used in “one-shot” mode by setting bit 1 of register 0,B0h (PT0_CFG), and the timer interrupt is used to wake the device from
sleep, the interrupt service routine (ISR) may be executed twice. For more information, see the “Errata” on page 47.
61. Errata: When in sleep mode, if a GPIO interrupt happens simultaneously with a Timer0 or Sleep Timer interrupt, the GPIO interrupt may be missed, and the
corresponding GPIO ISR not run. For more information, see the “Errata” on page 47.
62. Errata: If an interrupt is posted a short time (within 2.5 CPU cycles) before firmware commands the device to sleep, the interrupt will be missed. For more information,
see the “Errata” on page 48.
63. Errata: Device wakes up from sleep when an analog interrupt is trigger. For more information, see the “Errata” on page 48.
Document Number: 001-54459 Rev. *Y
Page 21 of 53
CY8C20XX6A/S
DC GPIO Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0 V to 5.5 V and
–40 °C TA 85 °C, 2.4 V to 3.0 V and –40 °C TA 85 °C, or 1.71 V to 2.4 V and –40 °C TA 85 °C, respectively. Typical
parameters apply to 5 V and 3.3 V at 25 C and are for design guidance only.
Table 14. 3.0 V to 5.5 V DC GPIO Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
–
RPU
Pull-up resistor
4
5.60
8
k
VOH1
High output voltage
Port 2 or 3 or 4 pins
IOH < 10 A, maximum of 10 mA source
current in all I/Os
VDD – 0.20
–
–
V
VOH2
High output voltage
Port 2 or 3 or 4 pins
IOH = 1 mA, maximum of 20 mA source
current in all I/Os
VDD – 0.90
–
–
V
VOH3
High output voltage
Port 0 or 1 pins with LDO regulator
Disabled for port 1
IOH < 10 A, maximum of 10 mA source
current in all I/Os
VDD – 0.20
–
–
V
VOH4
High output voltage
Port 0 or 1 pins with LDO regulator
Disabled for port 1
IOH = 5 mA, maximum of 20 mA source
current in all I/Os
VDD – 0.90
–
–
V
VOH5
High output voltage
Port 1 Pins with LDO Regulator Enabled IOH < 10 A, VDD > 3.1 V, maximum of 4 I/Os
all sourcing 5 mA
for 3 V out
2.85
3.00
3.30
V
VOH6
High output voltage
Port 1 pins with LDO regulator enabled for IOH = 5 mA, VDD > 3.1 V, maximum of 20 mA
source current in all I/Os
3 V out
2.20
–
–
V
VOH7
High output voltage
IOH < 10 A, VDD > 2.7 V, maximum of 20 mA
Port 1 pins with LDO enabled for 2.5 V out source current in all I/Os
2.35
2.50
2.75
V
VOH8
High output voltage
IOH = 2 mA, VDD > 2.7 V, maximum of 20 mA
Port 1 pins with LDO enabled for 2.5 V out source current in all I/Os
1.90
–
–
V
VOH9
High output voltage
IOH < 10 A, VDD > 2.7 V, maximum of 20 mA
Port 1 pins with LDO enabled for 1.8 V out source current in all I/Os
1.60
1.80
2.10
V
VOH10
High output voltage
IOH = 1 mA, VDD > 2.7 V, maximum of 20 mA
Port 1 pins with LDO enabled for 1.8 V out source current in all I/Os
1.20
–
–
V
–
–
0.75
V
VOL
Low output voltage
IOL = 25 mA, VDD > 3.3 V, maximum of
60 mA sink current on even port pins (for
example, P0[2] and P1[4]) and 60 mA sink
current on odd port pins (for example, P0[3]
and P1[5])
VIL
Input low voltage
–
–
–
0.80
V
VIH
Input high voltage
–
2.00
–
–
V
VH
Input hysteresis voltage
–
–
80
–
mV
IIL
Input leakage (Absolute Value)
–
–
0.001
1
A
0.50
1.70
7
pF
CPIN
Pin capacitance
Package and pin dependent
Temp = 25 °C
VILLVT3.3
Input Low Voltage with low threshold
enable set, Enable for Port1
Bit3 of IO_CFG1 set to enable low threshold
voltage of Port1 input
0.8
V
–
–
VIHLVT3.3
Input High Voltage with low threshold
enable set, Enable for Port1
Bit3 of IO_CFG1 set to enable low threshold
voltage of Port1 input
1.4
–
–
V
VILLVT5.5
Input Low Voltage with low threshold
enable set, Enable for Port1
Bit3 of IO_CFG1 set to enable low threshold
voltage of Port1 input
0.8
V
–
–
VIHLVT5.5
Input High Voltage with low threshold
enable set, Enable for Port1
Bit3 of IO_CFG1 set to enable low threshold
voltage of Port1 input
1.7
–
–
V
Document Number: 001-54459 Rev. *Y
Page 22 of 53
CY8C20XX6A/S
Table 15. 2.4 V to 3.0 V DC GPIO Specifications
Symbol
Description
Conditions
Min
Typ
4
5.60
8
k
IOH < 10 A, maximum of 10 mA source
current in all I/Os
VDD – 0.20
–
–
V
High output voltage
Port 2 or 3 or 4 pins
IOH = 0.2 mA, maximum of 10 mA source
current in all I/Os
VDD – 0.40
–
–
V
VOH3
High output voltage
Port 0 or 1 pins with LDO regulator
Disabled for port 1
IOH < 10 A, maximum of 10 mA source
current in all I/Os
VDD – 0.20
–
–
V
VOH4
High output voltage
Port 0 or 1 pins with LDO regulator
Disabled for Port 1
IOH = 2 mA, maximum of 10 mA source
current in all I/Os
VDD – 0.50
–
–
V
VOH5A
High output voltage
IOH < 10 A, VDD > 2.4 V, maximum of
Port 1 pins with LDO enabled for 1.8 V out 20 mA source current in all I/Os
1.50
1.80
2.10
V
VOH6A
High output voltage
IOH = 1 mA, VDD > 2.4 V, maximum of 20 mA
Port 1 pins with LDO enabled for 1.8 V out source current in all I/Os
1.20
–
–
V
–
–
0.75
V
0.72
RPU
Pull-up resistor
–
VOH1
High output voltage
Port 2 or 3 or 4 pins
VOH2
IOL = 10 mA, maximum of 30 mA sink
current on even port pins (for example,
P0[2] and P1[4]) and 30 mA sink current on
odd port pins (for example, P0[3] and P1[5])
Max Units
VOL
Low output voltage
VIL
Input low voltage
–
–
–
VIH
Input high voltage
–
1.40
–
VH
Input hysteresis voltage
–
–
80
–
mV
IIL
Input leakage (absolute value)
–
–
1
1000
nA
CPIN
Capacitive load on pins
Package and pin dependent
Temp = 25 C
0.50
1.70
7
pF
VILLVT2.5
Input Low Voltage with low threshold
enable set, Enable for Port1
Bit3 of IO_CFG1 set to enable low threshold
voltage of Port1 input
0.7
V
–
VIHLVT2.5
Input High Voltage with low threshold
enable set, Enable for Port1
Bit3 of IO_CFG1 set to enable low threshold
voltage of Port1 input
1.2
V
V
–
V
Table 16. 1.71 V to 2.4 V DC GPIO Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
–
4
RPU
Pull-up resistor
5.60
8
k
VOH1
High output voltage
Port 2 or 3 or 4 pins
IOH = 10 A, maximum of 10 mA
VDD – 0.20
source current in all I/Os
–
–
V
VOH2
High output voltage
Port 2 or 3 or 4 pins
IOH = 0.5 mA, maximum of 10 mA
VDD – 0.50
source current in all I/Os
–
–
V
VOH3
High output voltage
Port 0 or 1 pins with LDO regulator
Disabled for Port 1
IOH = 100 A, maximum of 10 mA
VDD – 0.20
source current in all I/Os
–
–
V
VOH4
High output voltage
Port 0 or 1 Pins with LDO Regulator
Disabled for Port 1
IOH = 2 mA, maximum of 10 mA source
VDD – 0.50
current in all I/Os
–
–
V
VOL
Low output voltage
IOL = 5 mA, maximum of 20 mA sink
current on even port pins (for example,
P0[2] and P1[4]) and 30 mA sink
current on odd port pins (for example,
P0[3] and P1[5])
–
–
0.40
V
VIL
Input low voltage
–
–
–
0.30 × VDD
V
Document Number: 001-54459 Rev. *Y
Page 23 of 53
CY8C20XX6A/S
Table 16. 1.71 V to 2.4 V DC GPIO Specifications (continued)
Symbol
Description
Conditions
Min
Typ
Max
Units
VIH
Input high voltage
–
0.65 × VDD
–
–
V
VH
Input hysteresis voltage
–
–
80
–
mV
IIL
Input leakage (absolute value)
–
–
1
1000
nA
0.50
1.70
7
pF
CPIN
Capacitive load on pins
Package and pin dependent
temp = 25 °C
Table 17. DC Characteristics – USB Interface
Symbol
Description
Conditions
Min
Typ
Max
Units
900
–
1575
1425
–
3090
2.8
–
3.6
V
–
–
–
0.3
V
–
0.2
–
–
0.8
–
2.5
V
–
0.8
–
2.0
V
RUSBI
USB D+ pull-up resistance
With idle bus
RUSBA
USB D+ pull-up resistance
While receiving traffic
VOHUSB
Static output high
VOLUSB
Static output low
VDI
Differential input sensitivity
VCM
Differential input common mode range
VSE
Single ended receiver threshold
CIN
Transceiver capacitance
IIO
High Z state data line leakage
RPS2
PS/2 pull-up resistance
REXT
External USB series resistor
–
–
–
–
50
pF
–10
–
+10
A
3000
5000
7000
21.78
22.0
22.22
On D+ or D- line
–
In series with each USB pin
V
DC Analog Mux Bus Specifications
Table 18 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 18. DC Analog Mux Bus Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
RSW
Switch resistance to common analog bus
–
–
–
800
RGND
Resistance of initialization switch to VSS
–
–
–
800
The maximum pin voltage for measuring RSW and RGND is 1.8 V
DC Low Power Comparator Specifications
Table 19 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 19. DC Comparator Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
Maximum voltage limited to VDD
0.0
–
1.8
V
VLPC
Low power comparator (LPC) common
mode
ILPC
LPC supply current
–
–
10
40
A
VOSLPC
LPC voltage offset
–
–
3
30
mV
Document Number: 001-54459 Rev. *Y
Page 24 of 53
CY8C20XX6A/S
Comparator User Module Electrical Specifications
Table 20 lists the guaranteed maximum and minimum specifications. Unless stated otherwise, the specifications are for the entire
device voltage and temperature operating range: –40 °C TA 85 °C, 1.71 V VDD 5.5 V.
Table 20. Comparator User Module Electrical Specifications
Symbol
Min
Typ
Max
Units
50 mV overdrive
–
70
100
ns
Offset
Valid from 0.2 V to VDD – 0.2 V
–
2.5
30
mV
Current
Average DC current, 50 mV
overdrive
–
20
80
µA
Supply voltage > 2 V
Power supply rejection ratio
–
80
–
dB
Supply voltage < 2 V
Power supply rejection ratio
–
40
–
dB
1.5
V
tCOMP
PSRR
Description
Comparator response time
Conditions
Input range
–
0
ADC Electrical Specifications
Table 21. ADC User Module Electrical Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
–
0
–
VREFADC
V
–
–
–
5
pF
Input
VIN
Input voltage range
CIIN
Input capacitance
RIN
Input resistance
Equivalent switched cap input
resistance for 8-, 9-, or 10-bit
resolution
1/(500fF × 1/(400fF × 1/(300fF ×
data clock) data clock) data clock)
Reference
VREFADC
ADC reference voltage
–
1.14
–
1.26
V
2.25
–
6
MHz
Conversion Rate
FCLK
Data clock
Source is chip’s internal main
oscillator. See AC Chip-Level
Specifications for accuracy
S8
8-bit sample rate
Data clock set to 6 MHz. sample rate
= 0.001/ (2^Resolution/Data Clock)
–
23.43
–
ksps
S10
10-bit sample rate
Data clock set to 6 MHz. sample rate
= 0.001/ (2^resolution/data clock)
–
5.85
–
ksps
RES
Resolution
Can be set to 8-, 9-, or 10-bit
8
–
10
bits
DNL
Differential nonlinearity
–
–1
–
+2
LSB
INL
Integral nonlinearity
–
–2
–
+2
LSB
EOFFSET
Offset error
EGAIN
Gain error
DC Accuracy
8-bit resolution
0
3.20
19.20
LSB
10-bit resolution
0
12.80
76.80
LSB
For any resolution
–5
–
+5
%FSR
–
Power
IADC
PSRR
Operating current
Power supply rejection ratio
Document Number: 001-54459 Rev. *Y
–
2.10
2.60
mA
PSRR (VDD > 3.0 V)
–
24
–
dB
PSRR (VDD < 3.0 V)
–
30
–
dB
Page 25 of 53
CY8C20XX6A/S
DC POR and LVD Specifications
Table 22 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 22. DC POR and LVD Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
1.61
1.66
1.71
V
–
2.36
2.41
V
–
2.60
2.66
V
–
2.82
2.95
V
2.45 V selected in PSoC Designer
2.40
2.45
2.51
V
2.71 V selected in PSoC Designer
2.64[64]
2.71
2.78
V
VLVD2
2.92 V selected in PSoC Designer
2.85[65]
2.92
2.99
V
VLVD3
3.02 V selected in PSoC Designer
2.95[66]
3.02
3.09
V
VLVD4
3.13 V selected in PSoC Designer
3.06
3.13
3.20
V
VLVD5
1.90 V selected in PSoC Designer
1.84
1.90
2.32
V
VLVD6
1.80 V selected in PSoC Designer
1.75[67]
1.80
1.84
V
VLVD7
4.73 V selected in PSoC Designer
4.62
4.73
4.83
V
VPOR0
1.66 V selected in PSoC Designer
VPOR1
2.36 V selected in PSoC Designer
VPOR2
2.60 V selected in PSoC Designer
VPOR3
2.82 V selected in PSoC Designer
VLVD0
VLVD1
VDD must be greater than or equal
to 1.71 V during startup, reset
from the XRES pin, or reset from
watchdog.
–
DC Programming Specifications
Table 23 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 23. DC Programming Specifications
Symbol
VOLP
Description
Supply voltage for flash write
operations
Supply current during
programming or verify
Input low voltage during
programming or verify
Input high voltage during
programming or verify
Input current when Applying VILP
to P1[0] or P1[1] during
programming or verify
Input current when applying VIHP
to P1[0] or P1[1] during
programming or verify
Output low voltage during
programming or verify
VOHP
Output high voltage during
programming or verify
FlashENPB
Flash write endurance
FlashDR
Flash data retention
VDDIWRITE
IDDP
VILP
VIHP
IILP
IIHP
Conditions
Min
Typ
Max
Units
–
1.71
–
5.25
V
–
–
5
25
mA
–
–
VIL
V
VIH
–
–
V
Driving internal pull-down resistor
–
–
0.2
mA
Driving internal pull-down resistor
–
–
1.5
mA
–
–
VSS + 0.75
V
VOH
–
VDD
V
50,000
–
–
–
20
–
–
Years
See the appropriate DC
Specifications on page 22
See the appropriate “DC
Specifications” on page 22
GPIO
GPIO
–
See
appropriate
DC
GPIO
Specifications on page 22. For
VDD > 3 V use VOH4 in Table 12 on
page 20.
Erase/write cycles per block
Following maximum Flash write
cycles; ambient temperature of 55 °C
Notes
64. Always greater than 50 mV above VPPOR1 voltage for falling supply.
65. Always greater than 50 mV above VPPOR2 voltage for falling supply.
66. Always greater than 50 mV above VPPOR3 voltage for falling supply.
67. Always greater than 50 mV above VPPOR0 voltage for falling supply.
Document Number: 001-54459 Rev. *Y
Page 26 of 53
CY8C20XX6A/S
DC I2C Specifications
Table 24 list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0 V to 5.5 V and –40 °C
TA 85 °C, 2.4 V to 3.0 V and –40 °C TA 85 °C, or 1.71 V to 2.4 V and –40 °C TA 85 °C, respectively. Typical parameters apply
to 5 V and 3.3 V at 25 °C and are for design guidance only.
Table 24. DC I2C Specifications
Symbol
VILI2C
VIHI2C
Description
Input low level
Input high level
Conditions
Min
Typ
Max
Units
3.1 V ≤ VDD ≤ 5.5 V
–
–
0.25 × VDD
V
2.5 V ≤ VDD ≤ 3.0 V
–
–
0.3 × VDD
V
1.71 V ≤ VDD ≤ 2.4 V
–
–
0.3 × VDD
V
1.71 V ≤ VDD ≤ 5.5 V
0.65 × VDD
–
–
V
DC Reference Buffer Specifications
Table 25 list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0 V to 5.5 V and –40 °C
TA 85 °C, 2.4 V to 3.0 V and –40 °C TA 85 °C, or 1.71 V to 2.4 V and –40 °C TA 85 °C, respectively. Typical parameters apply
to 5 V and 3.3 V at 25 °C and are for design guidance only.
Table 25. DC Reference Buffer Specifications
Symbol
VRef
Description
Reference buffer output
Conditions
1.7 V ≤ VDD ≤ 5.5 V
Min
1
Typ
–
Max
1.05
Units
V
VRefHi
Reference buffer output
1.7 V ≤ VDD ≤ 5.5 V
1.2
–
1.25
V
DC IDAC Specifications
Table 26 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 26. DC IDAC Specifications
Symbol
IDAC_DNL
IDAC_INL
IDAC_Gain
(Source)
Description
Differential nonlinearity
Integral nonlinearity
Range = 0.5x
Range = 1x
Range = 2x
Range = 4x
Range = 8x
Document Number: 001-54459 Rev. *Y
Min
–4.5
–5
6.64
14.5
42.7
91.1
184.5
Typ
–
–
–
–
–
–
–
Max
+4.5
+5
22.46
47.8
92.3
170
426.9
Units
LSB
LSB
µA
µA
µA
µA
µA
Notes
–
–
DAC setting = 128 dec.
Not recommended for CapSense
applications.
DAC setting = 128 dec
DAC setting = 128 dec
Page 27 of 53
CY8C20XX6A/S
AC Chip-Level Specifications
Table 27 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 27. AC Chip-Level Specifications
Conditions
Min
Typ
Max
Units
FIMO24
Symbol
IMO frequency at 24 MHz Setting
–
22.8
24
25.2
MHz
FIMO12
IMO frequency at 12 MHz setting
–
11.4
12
12.6
MHz
FIMO6
IMO frequency at 6 MHz setting
–
5.7
6.0
6.3
MHz
FCPU
CPU frequency
–
0.75
–
25.20
MHz
F32K1
ILO frequency
–
15
32
50
kHz
F32K_U
ILO untrimmed frequency
–
13
32
82
kHz
DCIMO
Duty cycle of IMO
–
40
50
60
%
DCILO
ILO duty cycle
–
40
50
60
%
SRPOWER_UP
Power supply slew rate
–
–
250
V/ms
tXRST
External reset pulse width at power-up After supply voltage is valid
1
–
–
ms
tXRST2
External reset pulse width after
power-up[68]
10
–
–
s
tOS
Startup time of ECO
–
–
1
–
s
6 MHz IMO cycle-to-cycle jitter (RMS)
–
0.7
6.7
ns
6 MHz IMO long term N (N = 32)
cycle-to-cycle jitter (RMS)
–
4.3
29.3
ns
6 MHz IMO period jitter (RMS)
–
0.7
3.3
ns
12 MHz IMO cycle-to-cycle jitter (RMS)
–
0.5
5.2
ns
12 MHz IMO long term N (N = 32)
cycle-to-cycle jitter (RMS)
–
2.3
5.6
ns
12 MHz IMO period jitter (RMS)
–
0.4
2.6
ns
24 MHz IMO cycle-to-cycle jitter (RMS)
–
1.0
8.7
ns
24 MHz IMO long term N (N = 32)
cycle-to-cycle jitter (RMS)
–
1.4
6.0
ns
24 MHz IMO period jitter (RMS)
–
0.6
4.0
ns
tJIT_IMO[69]
Description
N=32
VDD slew rate during power-up
Applies after part has booted
Notes
68. The minimum required XRES pulse length is longer when programming the device (see Table 33 on page 31).
69. Refer to Cypress Jitter Specifications application note, Understanding Datasheet Jitter Specifications for Cypress Timing Products – AN5054 for more information.
Document Number: 001-54459 Rev. *Y
Page 28 of 53
CY8C20XX6A/S
AC GPIO Specifications
Table 28 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 28. AC GPIO Specifications
Symbol
FGPIO
tRISE23
tRISE23L
tRISE01
tRISE01L
tFALL
tFALLL
Description
Conditions
GPIO operating frequency
Min
Typ
0
–
0
–
VDD = 3.0 to 3.6 V, 10% to 90%
15
–
80
ns
VDD = 1.71 to 3.0 V, 10% to 90%
15
–
80
ns
10
–
50
ns
10
–
80
ns
VDD = 3.0 to 3.6 V, 10% to 90%
10
–
50
ns
VDD = 1.71 to 3.0 V, 10% to 90%
10
–
70
ns
Normal strong mode Port 0, 1
Rise time, strong mode, Cload = 50 pF
Port 2 or 3 or 4 pins
Rise time, strong mode low supply,
Cload = 50 pF, Port 2 or 3 or 4 pins
Rise time, strong mode, Cload = 50 pF
Ports 0 or 1
Rise time, strong mode low supply,
Cload = 50 pF, Ports 0 or 1
Fall time, strong mode, Cload = 50 pF
all ports
Fall time, strong mode low supply,
Cload = 50 pF, all ports
VDD = 3.0 to 3.6 V, 10% to 90%
LDO enabled or disabled
VDD = 1.71 to 3.0 V, 10% to 90%
LDO enabled or disabled
Max
Units
6 MHz for
MHz
1.71 V Evaluation Boards.
Build a PSoC Emulator into Your Board
For details on how to emulate your circuit before going to volume production using an on-chip debug (OCD) non-production PSoC
device, refer Application Note Debugging - Build a PSoC Emulator into Your Board – AN2323.
Notes
75. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods.
76. Foot kit includes surface mount feet that can be soldered to the target PCB.
77. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters can be found at
http://www.emulation.com.
Document Number: 001-54459 Rev. *Y
Page 40 of 53
CY8C20XX6A/S
Ordering Information
Table 41 lists the CY8C20XX6A/S PSoC devices' key package features and ordering codes.
Table 41. PSoC Device Key Features and Ordering Information
Package
16-pin (3 × 3 × 0.6 mm) QFN
(no E-Pad)
16-pin (3 × 3 × 0.6 mm) QFN
(no E-Pad) (Tape and Reel)
16-pin (3 × 3 × 0.6 mm) QFN
(no E-Pad)
16-pin (3 × 3 × 0.6 mm) QFN
(no E-Pad)
16-pin (3 × 3 × 0.6 mm) QFN
(no E-Pad) (Tape and Reel)
16-pin (3 × 3 × 0.6 mm) QFN
(no E-Pad) (Tape and Reel)
24-pin (4 × 4 × 0.6 mm) QFN
24-pin (4 × 4 × 0.6 mm) QFN
(Tape and Reel)
Ordering Code
Flash SRAM CapSense Digital
Analog XRES USB ADC
(Bytes) (Bytes) Blocks I/O Pins Inputs [78] Pin
CY8C20236A-24LKXI
8K
1K
1
13
13
Yes
No
Yes
CY8C20236A-24LKXIT
8K
1K
1
13
13
Yes
No
Yes
CY8C20246A-24LKXI
16K
2K
1
13
13
Yes
No
Yes
CY8C20246AS-24LKXI
16K
2K
1
13
13
Yes
No
Yes
CY8C20246A-24LKXIT
16K
2K
1
13
13
Yes
No
Yes
CY8C20246AS-24LKXIT
16K
2K
1
13
13
Yes
No
Yes
CY8C20336A-24LQXI
8K
1K
1
20
20
Yes
No
Yes
CY8C20336A-24LQXIT
8K
1K
1
20
20
Yes
No
Yes
CY8C20346A-24LQXI
16K
2K
1
20
20
Yes
No
Yes
CY8C20346A-24LQXIT
16K
2K
1
20
20
Yes
No
Yes
CY8C20346AS-24LQXIT
16K
2K
1
20
20
Yes
No
Yes
CY8C20396A-24LQXI
16K
2K
1
19
19
Yes
Yes Yes
CY8C20396A-24LQXIT
16K
2K
1
19
19
Yes
Yes Yes
CY8C20436A-24LQXI
8K
1K
1
28
28
Yes
No
Yes
CY8C20436A-24LQXIT
8K
1K
1
28
28
Yes
No
Yes
32-pin (5 × 5 × 0.6 mm) QFN
CY8C20446A-24LQXI
16K
2K
1
28
28
Yes
No
Yes
32-pin (5 × 5 × 0.6 mm) QFN
CY8C20446AS-24LQXI
16K
2K
1
28
28
Yes
No
Yes
CY8C20446A-24LQXIT
16K
2K
1
28
28
Yes
No
Yes
CY8C20446AS-24LQXIT
16K
2K
1
28
28
Yes
No
Yes
32-pin (5 × 5 × 0.6 mm) QFN
CY8C20466A-24LQXI
32K
2K
1
28
28
Yes
No
Yes
32-pin (5 × 5 × 0.6 mm) QFN
CY8C20466AS-24LQXI
32K
2K
1
28
28
Yes
No
Yes
CY8C20466A-24LQXIT
32K
2K
1
28
28
Yes
No
Yes
CY8C20466AS-24LQXIT
32K
2K
1
28
28
Yes
No
Yes
32-pin (5 × 5 × 0.6 mm) QFN
CY8C20496A-24LQXI
16K
2K
1
25
25
Yes
Yes Yes
32-pin (5 × 5 × 0.6 mm) QFN
(Tape and Reel)
CY8C20496A-24LQXIT
16K
2K
1
25
25
Yes
Yes Yes
24-pin (4 × 4 × 0.6 mm) QFN
24-pin (4 × 4 × 0.6 mm) QFN
(Tape and Reel)
24-pin (4 × 4 × 0.6 mm) QFN
(Tape and Reel)
24-pin (4 × 4 × 0.6 mm) QFN
24-pin (4 × 4 × 0.6 mm) QFN
(Tape and Reel)
32-pin (5 × 5 × 0.6 mm) QFN
32-pin (5 × 5 × 0.6 mm) QFN
(Tape and Reel)
32-pin (5 × 5 × 0.6 mm) QFN
(Tape and Reel)
32-pin (5 × 5 × 0.6 mm) QFN
(Tape and Reel)
32-pin (5 × 5 × 0.6 mm) QFN
(Tape and Reel)
32-pin (5 × 5 × 0.6 mm) QFN
(Tape and Reel)
Note
78. Dual-function Digital I/O Pins also connect to the common analog mux.
Document Number: 001-54459 Rev. *Y
Page 41 of 53
CY8C20XX6A/S
Table 41. PSoC Device Key Features and Ordering Information (continued)
Package
48-pin SSOP [79]
CY8C20536A-24PVXI [79]
48-pin SSOP (Tape and Reel) [79]
48-pin SSOP
Flash SRAM CapSense Digital
Analog XRES USB ADC
(Bytes) (Bytes) Blocks I/O Pins Inputs [78] Pin
Ordering Code
[79]
[79]
CY8C20536A-24PVXIT
CY8C20546A-24PVXI
[79]
48-pin SSOP (Tape and Reel) [79] CY8C20546A-24PVXIT [79]
48-pin SSOP
[79]
CY8C20566A-24PVXI
[79]
[79]
8K
1K
1
34
34
Yes
No
Yes
8K
1K
1
34
34
Yes
No
Yes
16K
2K
1
34
34
Yes
No
Yes
16K
2K
1
34
34
Yes
No
Yes
32K
2K
1
34
34
Yes
No
Yes
32K
2K
1
34
34
Yes
No
Yes
48-pin SSOP (Tape and Reel) [79]
CY8C20566A-24PVXIT
48-pin (6 × 6 × 0.6 mm) QFN
CY8C20636A-24LQXI
8K
1K
1
36
36
Yes
No
Yes
48-pin (6 × 6 × 0.6 mm) QFN
(Tape and Reel)
CY8C20636A-24LQXIT
8K
1K
1
36
36
Yes
No
Yes
48-pin (7 × 7 × 1.0 mm) QFN [79] CY8C20636A-24LTXI [79]
8K
1K
1
36
36
Yes
No
Yes
48-pin (7 × 7 × 1.0 mm) QFN
(Tape and Reel) [79]
CY8C20636A-24LTXIT [79]
8K
1K
1
36
36
Yes
No
Yes
48-pin (6 × 6 × 0.6 mm) QFN
CY8C20646A-24LQXI
16K
2K
1
36
36
Yes
Yes Yes
48-pin (6 × 6 × 0.6 mm) QFN
(Tape and Reel)
CY8C20646A-24LQXIT
16K
2K
1
36
36
Yes
Yes Yes
48-pin (7 × 7 × 1.0 mm) QFN [79] CY8C20646A-24LTXI [79]
16K
2K
1
36
36
Yes
Yes Yes
48-pin (7 × 7 × 1.0 mm) QFN
(Tape and Reel) [79]
CY8C20646A-24LTXIT [79]
16K
2K
1
36
36
Yes
Yes Yes
48-pin (6 × 6 × 0.6 mm) QFN
CY8C20666A-24LQXI
32K
2K
1
36
36
Yes
Yes Yes
48-pin (6 × 6 × 0.6 mm) QFN
(Tape and Reel)
CY8C20666A-24LQXIT
32K
2K
1
36
36
Yes
Yes Yes
48-pin (7 × 7 × 1.0 mm) QFN [79] CY8C20666A-24LTXI [79]
32K
2K
1
36
36
Yes
Yes Yes
[79]
32K
2K
1
36
36
Yes
Yes Yes
48-pin (7 × 7 × 1.0 mm) QFN
(Tape and Reel) [79]
48-pin (7 × 7 × 1.0 mm) QFN
(Tape and Reel) [79]
48-pin (7 × 7 × 1.0 mm) QFN
(OCD) [80]
CY8C20666A-24LTXIT [79]
32K
2K
1
36
36
Yes
Yes Yes
CY8C20666AS-24LTXIT [79]
32K
2K
1
36
36
Yes
Yes Yes
CY8C20066A-24LTXI [80]
32K
2K
1
36
36
Yes
Yes Yes
30-ball WLCSP
CY8C20746A-24FDXC
16K
1K
1
27
27
Yes
No
Yes
30-ball WLCSP (Tape and Reel) CY8C20746A-24FDXCT
16K
1K
1
27
27
Yes
No
Yes
30-ball WLCSP
32K
2K
1
27
27
Yes
No
Yes
30-ball WLCSP (Tape and Reel) CY8C20766A-24FDXCT
32K
2K
1
27
Yes
No
Yes
32-pin (5 × 5 × 0.6 mm) QFN
32-pin (5 × 5 × 0.6 mm) QFN
(Tape and Reel)
16-pin (3 × 3 × 0.6 mm) QFN
(no E-Pad)
16-pin (3 × 3 × 0.6 mm) QFN
(no E-Pad, Tape and Reel)
24-pin (4 × 4 × 0.6 mm) QFN
(Tape and Reel)
CY8C20436AN-24LQXI
8K
1K
1
28
27
28
Yes
No
No
CY8C20436AN-24LQXIT
8K
1K
1
28
28
Yes
No
No
CY8C20246AS-24LKXI
16K
2K
1
13
13
Yes
No
Yes
CY8C20246AS-24LKXIT
16K
2K
1
13
13
Yes
No
Yes
CY8C20346AS-24LQXIT
16K
2K
1
20
20
Yes
No
Yes
48-pin (7 × 7 × 1.0 mm) QFN
[79]
CY8C20666AS-24LTXI
CY8C20766A-24FDXC
Notes
79. Not Recommended for New Designs.
80. Dual-function Digital I/O Pins also connect to the common analog mux.
Document Number: 001-54459 Rev. *Y
Page 42 of 53
CY8C20XX6A/S
Table 41. PSoC Device Key Features and Ordering Information (continued)
Package
32-pin (5 × 5 × 0.6 mm) QFN
32-pin (5 × 5 × 0.6 mm) QFN
(Tape and Reel)
32-pin (5 × 5 × 0.6 mm) QFN
32-pin (5 × 5 × 0.6 mm) QFN
(Tape and Reel)
48-pin (6 × 6 × 0.6 mm) QFN
48-pin (6 × 6 × 0.6 mm) QFN
(Tape and Reel)
48-pin (7 × 7 × 1.0 mm) QFN [81]
48-pin (7 × 7 × 1.0 mm) QFN
(Tape and Reel) [81]
48-pin (6 × 6 × 0.6 mm) QFN
48-pin (6 × 6 × 0.6 mm) QFN
(Tape and Reel)
48-pin (7 × 7 × 1.0 mm) QFN [81]
48-pin (7 × 7 × 1.0 mm) QFN
(Tape and Reel) [81]
Flash SRAM CapSense Digital
Analog XRES USB ADC
(Bytes) (Bytes) Blocks I/O Pins Inputs [78] Pin
Ordering Code
CY8C20446AS-24LQXI
16K
2K
1
28
28
Yes
No
Yes
CY8C20446AS-24LQXIT
16K
2K
1
28
28
Yes
No
Yes
CY8C20466AS-24LQXI
32K
2K
1
28
28
Yes
No
Yes
CY8C20466AS-24LQXIT
32K
2K
1
28
28
Yes
No
Yes
CY8C20666AS-24LQXI
32K
2K
1
36
36
Yes
Yes Yes
32K
2K
1
36
36
Yes
Yes Yes
32K
2K
1
36
36
Yes
Yes Yes
CY8C20666AS-24LTXIT [81]
32K
2K
1
36
36
Yes
Yes Yes
CY8C20646AS-24LQXI
16K
2K
1
36
36
Yes
Yes Yes
CY8C20646AS-24LQXIT
16K
2K
1
36
36
Yes
Yes Yes
16K
2K
1
36
36
Yes
Yes Yes
16K
2K
1
36
36
Yes
Yes Yes
CY8C20666AS-24LQXIT
CY8C20666AS-24LTXI
[81]
CY8C20646AS-24LTXI [81]
CY8C20646AS-24LTXIT
[81]
Ordering Code Definitions
CY
8
C
20 XX6AX - 24
XX
X
X
T
Tape and Reel
Temperature range: X = C or I
C = Commercial; I = Industrial
Pb-free
Package Type: XX = LK or LQ or PV or LT or FD
LK = 16-pin QFN (no E-Pad)
LQ = 24-pin QFN, 32-pin QFN, 48-pin (6 × 6 × 0.6 mm) QFN
PV = 48-pin SSOP
LT = 48-pin (7 × 7 × 1.0 mm) QFN
FD = 30-ball WLCSP
Speed Grade: 24 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = PSoC
Company ID: CY = Cypress
Note
81. Not Recommended for New Designs.
Document Number: 001-54459 Rev. *Y
Page 43 of 53
CY8C20XX6A/S
Acronyms
Reference Documents
Table 42. Acronyms Used in this Document
Acronym
Description
AC
alternating current
ADC
analog-to-digital converter
API
application programming interface
CMOS
complementary metal oxide semiconductor
CPU
central processing unit
DAC
digital-to-analog converter
DC
direct current
EOP
end of packet
FSR
full scale range
GPIO
general purpose input/output
GUI
graphical user interface
I 2C
inter-integrated circuit
ICE
in-circuit emulator
IDAC
digital analog converter current
ILO
internal low speed oscillator
IMO
internal main oscillator
I/O
input/output
ISSP
in-system serial programming
LCD
liquid crystal display
LDO
low dropout (regulator)
LSB
least-significant bit
LVD
low voltage detect
MCU
micro-controller unit
MIPS
mega instructions per second
MISO
master in slave out
MOSI
master out slave in
MSB
most-significant bit
OCD
on-chip debugger
POR
power on reset
PPOR
precision power on reset
PSRR
power supply rejection ratio
PWRSYS power system
PSoC®
Programmable System-on-Chip
SLIMO
slow internal main oscillator
SRAM
static random access memory
SNR
signal to noise ratio
QFN
quad flat no-lead
SCL
serial I2C clock
SDA
serial I2C data
SDATA
serial ISSP data
SPI
serial peripheral interface
SS
slave select
SSOP
shrink small outline package
TC
test controller
USB
universal serial bus
USB D+
USB Data+
USB D–
USB Data–
WLCSP
wafer level chip scale package
XTAL
crystal
■
Technical Reference Manual for CY8C20xx6 devices
■
In-system Serial Programming (ISSP) protocol for 20xx6
(AN2026C)
■
Host Sourced Serial Programming for 20xx6 devices
(AN59389)
Document Number: 001-54459 Rev. *Y
Document Conventions
Units of Measure
Table 43. Units of Measure
Symbol
°C
dB
fF
g
Hz
KB
Kbit
KHz
Ksps
k
MHz
M
A
F
H
s
W
mA
ms
mV
nA
nF
ns
nV
W
pA
pF
pp
ppm
ps
sps
s
V
W
Unit of Measure
degree Celsius
decibels
femtofarad
gram
hertz
1024 bytes
1024 bits
kilohertz
kilo samples per second
kilohm
megahertz
megaohm
microampere
microfarad
microhenry
microsecond
microwatt
milliampere
millisecond
millivolt
nanoampere
nanofarad
nanosecond
nanovolt
ohm
picoampere
picofarad
peak-to-peak
parts per million
picosecond
samples per second
sigma: one standard deviation
volt
watt
Page 44 of 53
CY8C20XX6A/S
Numeric Naming
Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’).
Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended
lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal.
Glossary
Crosspoint connection
Connection between any GPIO combination via analog multiplexer bus.
Differential non-linearity
Ideally, any two adjacent digital codes correspond to output analog voltages that are exactly
one LSB apart. Differential non-linearity is a measure of the worst case deviation from the
ideal 1 LSB step.
Hold time
Hold time is the time following a clock event during which the data input to a latch or flip-flop
must remain stable in order to guarantee that the latched data is correct.
I2C
It is a serial multi-master bus used to connect low speed peripherals to MCU.
Integral nonlinearity
It is a term describing the maximum deviation between the ideal output of a DAC/ADC and
the actual output level.
Latch-up current
Current at which the latch-up test is conducted according to JESD78 standard (at 125
degree Celsius)
Power supply rejection ratio (PSRR)
The PSRR is defined as the ratio of the change in supply voltage to the corresponding
change in output voltage of the device.
Scan
The conversion of all sensor capacitances to digital values.
Setup time
Period required to prepare a device, machine, process, or system for it to be ready to
function.
Signal-to-noise ratio
The ratio between a capacitive finger signal and system noise.
SPI
Serial peripheral interface is a synchronous serial data link standard.
Document Number: 001-54459 Rev. *Y
Page 45 of 53
CY8C20XX6A/S
Errata
This section describes the errata for the PSoC® CY8C20x36A/46A/66A/96A/46AS/66AS/36H/46H families. Details include errata
trigger conditions, scope of impact, available workarounds, and silicon revision applicability. Contact your local Cypress Sales Representative if you have questions.
Qualification Status
Product Status: Production released.
Errata Summary
The following Errata items apply to CY8C20x36A/46A/66A/96A/46AS/66AS/36H/46H families.
1. Wakeup from sleep may intermittently fail
■
Problem Definition
When the device is put to sleep in Standby or I2C_USB Mode and the bandgap circuit is refreshed less frequently than every 8 ms
(default), the device may not come out of sleep when a sleep-ending input is received.
■
Parameters Affected
None
■
Trigger Condition(S)
By default, when the device is in the Standby or I2C_USB sleep modes, the bandgap circuit is powered-up approximately every 8
ms to facilitate detection of POR or LVD events. This interval can be lengthened or the periodic power-up disabled to reduce sleep
current by setting the ALT_BUZZ bits in the SLP_CFG2 register or the Disable Buzz bit in the OSC_CR0 register respectively. If
the bandgap circuit refresh interval is set longer than the default 8 ms, the device may fail to wakeup from sleep and enter a locked
up state that can only be recovered by Watchdog Reset, XRES, or POR.
■
Scope of Impact
The trigger conditions outlined above may cause the device to never wakeup.
■
Workaround
Prior to entering Standby or I2C_USB sleep modes, do not lengthen or disable the bandgap refresh interval by manipulating the
ALT_BUZZ bits in the SLP_CFG2 register or the Disable Buzz bit in the OSC_CR0 register respectively.
■
Fix Status
This issue will not be corrected in the next silicon revision.
2. I2C Errors
■
Problem Definition
The I2C block exhibits occasional data and bus corruption errors when the I2C master initiates transactions while the device is
transitioning in to or out of sleep mode.
■
Parameters Affected
Affects reliability of I2C communication to device, and between I2C master and third party I2C slaves.
■
Trigger Condition(S)
Triggered by transitions into and out of the device’s sleep mode.
■
Scope of Impact
Data errors result in incorrect data reported to the I2C master, or incorrect data received from the master by the device. Bus
corruption errors can corrupt data in transactions between the I2C master and third party I2C slaves.
■
Workaround
Firmware workarounds are available in firmware. Generally the workaround consists of disconnecting the I2C block from the bus
prior to going to sleep modes. I2C transactions during sleep are supported by a protocol in which the master wakes the device prior
to the I2C transaction.
■
Fix Status
■
Changes
None
To be fixed in future silicon.
Document Number: 001-54459 Rev. *Y
Page 46 of 53
CY8C20XX6A/S
3. DoubleTimer0 ISR
■
Problem Definition
When programmable timer 0 is used in “one-shot” mode by setting bit 1 of register 0,B0h (PT0_CFG), and the timer interrupt is
used to wake the device from sleep, the interrupt service routine (ISR) may be executed twice.
■
Parameters Affected
No datasheet parameters are affected.
■
Trigger Condition(S)
Triggered by enabling one-shot mode in the timer, and using the timer to wake from sleep mode.
■
Scope of Impact
The ISR may be executed twice.
■
Workaround
In the ISR, firmware should clear the one-shot bit with a statement such as “and reg[B0h], FDh”
■
Fix Status
Will not be fixed
■
Changes
None
4. Missed GPIO Interrupt
■
Problem Definition
When in sleep mode, if a GPIO interrupt happens simultaneously with a Timer0 or Sleep Timer interrupt, the GPIO interrupt may
be missed, and the corresponding GPIO ISR not run.
■
Parameters Affected
No datasheet parameters are affected.
■
Trigger Condition(S)
Triggered by enabling sleep mode, then having GPIO interrupt occur simultaneously with a Timer 0 or Sleep Timer interrupt.
■
Scope of Impact
The GPIO interrupt service routine will not be run.
■
Workaround
The system should be architected such that a missed GPIO interrupt may be detected. For example, if a GPIO is used to wake
the system to perform some function, the system should detect if the function is not performed, and re-issue the GPIO interrupt.
Alternatively, if a GPIO interrupt is required to wake the system, then firmware should disable the Sleep Timer and Timer0.
Alternatively, the ISR’s for Sleep Timer and Timer0 should manually check the state of the GPIO to determine if the host system
has attempted to generate a GPIO interrupt.
■
Fix Status
Will not be fixed
■
Changes
None
Document Number: 001-54459 Rev. *Y
Page 47 of 53
CY8C20XX6A/S
5. Missed Interrupt During Transition to Sleep
■
Problem Definition
If an interrupt is posted a short time (within 2.5 CPU cycles) before firmware commands the device to sleep, the interrupt will be
missed.
■
Parameters Affected
No datasheet parameters are affected.
■
Trigger Condition(S)
Triggered by enabling sleep mode just prior to an interrupt.
■
Scope of Impact
The relevant interrupt service routine will not be run.
■
Workaround
None.
■
Fix Status
Will not be fixed
■
Changes
None
6. Wakeup from sleep with analog interrupt
■
Problem Definition
Device wakes up from sleep when an analog interrupt is trigger
■
Parameters Affected
No datasheet parameters are affected.
■
Trigger Condition(S)
Triggered by enabling analog interrupt during sleep mode when device operating temperature is 50 °C or above
■
Scope of Impact
Device unexpectedly wakes up from sleep
■
Workaround
Disable the analog interrupt before entering sleep and turn it back on upon wakeup.
■
Fix Status
Will not be fixed
■
Changes
None
Document Number: 001-54459 Rev. *Y
Page 48 of 53
CY8C20XX6A/S
Document History Page
Document Title: CY8C20XX6A/S, 1.8 V Programmable CapSense® Controller with SmartSense™ Auto-tuning 1–33 Buttons,
0–6 Sliders
Document Number: 001-54459
Orig. of
Submission
Revision
ECN
Description of Change
Change
Date
2737924
SNV
07/14/2009 New silicon and document
**
*A
2764528
MATT
09/16/2009 Updated AC Chip Level Specifications
Updated ADC User Module Electrical Specifications table
Added Note 5.
Added SRPOWER_UP parameter.
Updated Ordering information.
Updated Capacitance on Crystal Pins
*B
2803229
VZD
11/10/2009 Added “Contents” on page 4. Added Note 6 on page 20. Edited Features section
to include reference to Incremental ADC.
*C
2846083
DST /
01/12/2010 Updated “AC Programming Specifications” on page 31 per CDT 56531.
KEJO
Updated Idd typical values in “DC Chip-Level Specifications” on page 21.
Added 30-pin WLCSP pin and package details.
Added Contents on page 2.
*D
2935141 KEJO / ISW 03/05/2010 Updated “Features” on page 1. Added “SmartSense” on page 5.
/ SSHH
Updated “PSoC® Functional Overview” on page 5.
Removed SNR statement regarding on page 4 (Analog Multiplexer section).
Updated Additional System Resources on page 6 with the I2C enhanced slave
interface point.
Removed references to “system level” in “Designing with PSoC Designer” on
page 9.
Changed TC CLK and TC DATA to ISSP CLK and ISSP DATA respectively in all
the pinouts.
Modified notes in Pinouts.
Updated 30-ball pin diagram.
Removed IMO frequency trim options diagram in “Electrical Specifications” on
page 20.
Updated and formatted values in DC and AC specifications.
Updated Ordering information table.
Updated 48-pin SSOP package diagram. Added 30-Ball WLCSP package spec
001-50669.
Removed AC Analog Mux Bus Specifications section.
Added SPI Master and Slave mode diagrams.
Modified Definition for Timing for Fast/Standard Mode on the I2C Bus on page 28.
Updated “Thermal Impedances” on page 38.
Combined Development Tools with “Development Tool Selection” on page 39.
Removed references to “system level”.
Updated “Evaluation Tools” on page 39.
Added “Ordering Code Definitions” on page 43.
Updated “Acronyms” on page 44.
Added Glossary and “Reference Documents” on page 44.
Changed datasheet status from Preliminary to Final
*E
3043291
SAAC
09/30/2010 Change: Added the line “Supports SmartSense” in the “Low power CapSense®
block” bullet in the Features section.
Impact: Helps to know that this part has the feature of Auto Tuning.
Change: Replaced pod MPNs.
Areas affected: Foot kit column of table 37.
Change: Template and Styles update.
Areas affected: Entire datasheet.
Impact: Datasheet adheres to Cypress standards.
*F
3071632
JPX
10/26/2010 In Table 36 on page 34, modified tLOW and tHIGH min values to 42. Updated
tSS_HIGH min value to 50; removed max value.
Document Number: 001-54459 Rev. *Y
Page 49 of 53
CY8C20XX6A/S
Document History Page (continued)
Document Title: CY8C20XX6A/S, 1.8 V Programmable CapSense® Controller with SmartSense™ Auto-tuning 1–33 Buttons,
0–6 Sliders
Document Number: 001-54459
Orig. of
Submission
Revision
ECN
Description of Change
Change
Date
*G
3247491 TTO / JPM / 06/16/2011 Add 4 new parameters to Table 14 on page 22, and 2 new parameters to Table
ARVM / BVI
15 on page 23.
Changed Typ values for the following parameters: IDD24, IDD12, IDD6, VOSLPC.
Added footnote # 49 and referred it to pin numbers 1, 14, 15, 42, and 43 under
Table 10 on page 19.
Added footnote # 53 and referred it to parameter VIOZ under Table 11 on page 20.
Added “tJIT_IMO” parameter to Table 27 on page 28.
Included footnote # 69 and added reference to tJIT_IMO specification under Table
27 on page 28.
Updated Solder Reflow Specifications on page 38 as per specs 25-00090 and
25-00103.
ISB0 Max value changed from 0.5 µA to 1.1 µA in Table 13 on page 21.
Added Table 26 on page 27.
Updated part numbers for “SmartSense_EMC” enabled CapSense controller.
3367332
BTK /
09/09/2011 Added parameter “tOS” to Table 27 on page 28.
*H
SSHH /
Added parameter “ISBI2C” to Table 13 on page 21.
Added Table 24 on page 27.
JPM / TTO /
Added Table 25 on page 27.
VMAD
Replaced text “Port 2 or 3 pins” with “Port 2 or 3 or 4 pins” in Table 14, Table 15,
Table 16, and Table 28.
*I
3371807
MATT
09/30/2011 Updated Packaging Information (Updated the next revision package outline for
Figure 21, Figure 24 and included a new package outline Figure 26).
Updated Ordering Information (Added new part numbers CY8C20636A-24LQXI,
CY8C20636A-24LQXIT, CY8C20646A-24LQXI, CY8C20646A-24LQXIT,
CY8C20666A-24LQXI, CY8C20666A-24LQXIT, CY8C20666AS-24LQXI,
CY8C20666AS-24LQXIT, CY8C20646AS-24LQXI and
CY8C20646AS-24LQXIT).
Updated to new template.
*J
3401666
MATT
10/11/2011 No technical updates.
*K
3414479
KPOL
10/19/2011 Removed clock stretching feature on page 1.
Removed I2C enhanced slave interface point from Additional System Resources.
*L
3452591 BVI / UDYG 12/01/2011 Changed document title.
Updated DC Chip-Level Specifications table.
Updated Solder Reflow Specifications section.
Updated Getting Started and Designing with PSoC Designer sections.
Included Development Tools section.
Updated Software under Development Tool Selection section.
*M
3473330
ANBA
12/22/2011 Updated DC Chip-Level Specifications under Electrical Specifications (updated
maximum value of ISB0 parameter from 1.1 µA to 1.05 µA).
*N
3587003
DST
04/16/2012 Added note for WLCSP package on page 1.
Added Sensing inputs to pin table captions.
Updated Conditions for DC Reference Buffer Specifications.
Updated tJIT_IMO description in AC Chip-Level Specifications.
Added note for tVDDWAIT, tVDDXRES, tACQ, and tXRESINI specs.
Removed WLCSP package outline.
*O
3638569
BVI
06/06/2012 Updated FSCLK parameter in the Table 36, “SPI Slave AC Specifications,” on
page 34.
Changed tOUT_HIGH to tOUT_H in Table 35, “SPI Master AC Specifications,” on
page 33.
Updated package diagram 001-57280 to *C revision.
Document Number: 001-54459 Rev. *Y
Page 50 of 53
CY8C20XX6A/S
Document History Page (continued)
Document Title: CY8C20XX6A/S, 1.8 V Programmable CapSense® Controller with SmartSense™ Auto-tuning 1–33 Buttons,
0–6 Sliders
Document Number: 001-54459
Orig. of
Submission
Revision
ECN
Description of Change
Change
Date
*P
3774062
UBU
10/11/2012 Updated Electrical Specifications:
Updated AC Chip-Level Specifications:
Updated Table 27:
Changed minimum value of F32K1 parameter from 19 kHz to 15 kHz.
Updated Packaging Information:
spec 001-09116 – Changed revision from *F to *G.
spec 001-13937 – Changed revision from *D to *E.
spec 51-85061 – Changed revision from *E to *F.
spec 001-13191 – Changed revision from *F to *G.
spec 001-57280 – Changed revision from *C to *D.
*Q
3807186
PKS
15/11/2012 No content update; appended to EROS document.
*R
3836626
SRLI
01/03/2013 Updated Document Title to read as “CY8C20XX6A/S, 1.8 V Programmable
CapSense® Controller with SmartSense™ Auto-tuning 1–33 Buttons, 0–6
Sliders”.
Updated Features.
Updated PSoC® Functional Overview:
Replaced “CY8C20X36A/46A/66A/96A/46AS/66AS” with “CY8C20XX6A/S”.
Updated Getting Started:
Replaced “CY8C20X36A/46A/66A/96A/46AS/66AS” with “CY8C20XX6A/S”.
Updated Pinouts:
Updated 16-pin QFN (10 Sensing Inputs)[3, 4]:
Replaced “12 Sensing Inputs” with “10 Sensing Inputs” in heading, added Note
3 only.
Updated 24-pin QFN (17 Sensing Inputs) [8]:
Replaced “12 Sensing Inputs” with “17 Sensing Inputs” in heading, added Note
8 only.
Updated 24-pin QFN (15 Sensing Inputs (With USB)) [13]:
Replaced “18 Sensing Inputs” with “15 Sensing Inputs” in heading, added Note
13 only.
Updated 30-ball WLCSP (24 Sensing Inputs) [18]:
Replaced “26 Sensing Inputs” with “24 Sensing Inputs” in heading, added Note
18 only.
Updated 32-pin QFN (25 Sensing Inputs) [22]:
Replaced “27 Sensing Inputs” with “25 Sensing Inputs” in heading, added Note
22 only.
updated 32-pin QFN (22 Sensing Inputs (With USB)) [27]:
Replaced “24 Sensing Inputs” with “22 Sensing Inputs” in heading, added Note
27 only.
Updated 48-pin SSOP (31 Sensing Inputs) [32]:
Replaced “33 Sensing Inputs” with “31 Sensing Inputs” in heading, added Note
32 only.
Updated 48-pin QFN (33 Sensing Inputs) [36]:
Replaced “35 Sensing Inputs” with “33 Sensing Inputs” in heading, added Note
36 only.
Updated 48-pin QFN (33 Sensing Inputs (With USB)) [41]:
Replaced “35 Sensing Inputs” with “33 Sensing Inputs” in heading, added Note
41 only.
Updated 48-pin QFN (OCD) (33 Sensing Inputs) [46]:
Added “33 Sensing Inputs” in heading, added Note 46 only.
Updated Packaging Information:
spec 001-42168 – Changed revision from *D to *E.
spec 001-57280 – Changed revision from *D to *E.
*S
3997568
BVI
05/11/2013 Added Errata.
*T
4044148
BVI
06/28/2013 Added Errata Footnotes.
Updated Packaging Information:
spec 001-09116 – Changed revision from *G to *H.
Updated to new template.
Document Number: 001-54459 Rev. *Y
Page 51 of 53
CY8C20XX6A/S
Document History Page (continued)
Document Title: CY8C20XX6A/S, 1.8 V Programmable CapSense® Controller with SmartSense™ Auto-tuning 1–33 Buttons,
0–6 Sliders
Document Number: 001-54459
Orig. of
Submission
Revision
ECN
Description of Change
Change
Date
*U
4185313
BVI
11/07/2013 Updated Features.
Updated Packaging Information:
spec 001-09116 – Changed revision from *H to *I.
*V
4622119
SSHH
01/13/2015 Added More Information.
*W
4825924
SSHH
07/07/2015 Updated Pinouts:
Updated 16-pin QFN (10 Sensing Inputs)[3, 4]:
Updated Table 1:
Added Note 7 and referred the same note in description of VSS pin.
Updated 24-pin QFN (17 Sensing Inputs) [8]:
Updated Table 2:
Added Note 12 and referred the same note in description of VSS pin.
Updated 24-pin QFN (15 Sensing Inputs (With USB)) [13]:
Updated Table 3:
Added Note 17 and referred the same note in description of VSS pin.
Updated 30-ball WLCSP (24 Sensing Inputs) [18]:
Updated Table 4:
Added Note 21 and referred the same note in description of VSS pin.
Updated 32-pin QFN (25 Sensing Inputs) [22]:
Updated Table 5:
Added Note 26 and referred the same note in description of VSS pin.
Updated 32-pin QFN (22 Sensing Inputs (With USB)) [27]:
Updated Table 6:
Added Note 31 and referred the same note in description of VSS pin.
Updated 48-pin SSOP (31 Sensing Inputs) [32]:
Updated Table 7:
Added Note 35 and referred the same note in description of VSS pin.
Updated 48-pin QFN (33 Sensing Inputs) [36]:
Updated Table 8:
Added Note 40 and referred the same note in description of VSS pin.
Updated 48-pin QFN (33 Sensing Inputs (With USB)) [41]:
Updated Table 9:
Added Note 45 and referred the same note in description of VSS pin.
Updated 48-pin QFN (OCD) (33 Sensing Inputs) [46]:
Updated Table 10:
Added Note 52 and referred the same note in description of VSS pin.
Updated Ordering Information:
Updated Table 41:
Updated part numbers.
Updated Packaging Information:
spec 001-13937 – Changed revision from *E to *F.
spec 001-13191 – Changed revision from *G to *H.
*X
5394582
SSHH
08/08/2016 Updated to new template.
Completing Sunset Review.
*Y
5741602
SSHH
05/18/2017 Updated Development Tool Selection:
Updated Accessories (Emulation and Programming):
Updated Table 40:
Updated part numbers.
Updated Ordering Information:
Updated Table 41:
Updated part numbers.
Updated to new template.
Document Number: 001-54459 Rev. *Y
Page 52 of 53
CY8C20XX6A/S
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© Cypress Semiconductor Corporation, 2009–2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation
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TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 001-54459 Rev. *Y
2
Revised May 18, 2017
Page 53 of 53
2
Purchase of I C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I C Patent Rights to use these components in an I2C system, provided
that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors.
