CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
PSoC® Programmable System-on-Chip™
PSoC® Programmable System-on-Chip™
Features
■
■
Powerful Harvard-architecture processor
❐ M8C processor speeds up to 24 MHz
❐ Low power at high speed
❐ Operating voltage: 2.4 V to 5.25 V
❐ Operating voltages down to 1.0 V using on-chip switch mode
pump (SMP)
❐ Industrial temperature range: –40 °C to +85 °C
■
Versatile analog mux
❐ Common internal analog bus
❐ Simultaneous connection of I/O combinations
❐ Capacitive sensing application capability
■
Additional system resources
2
❐ I C master, slave, and multi-master to 400 kHz
❐ Watchdog and sleep timers
❐ User-configurable low-voltage detection (LVD)
❐ Integrated supervisory circuit
❐ On-chip precision voltage reference
Advanced peripherals (PSoC® blocks)
❐ Four analog Type E PSoC blocks provide:
• Two comparators with digital-to-analog converter (DAC)
references
• Single or dual 10-bit 28 channel analog-to-digital
converters (ADC)
❐ Four digital PSoC blocks provide:
• 8- to 32-bit timers, counters, and pulse width modulators
(PWMs)
• Cyclical redundancy check (CRC) and pseudo random
sequence (PRS) modules
• Full-duplex universal asynchronous receiver transmitter
(UART), serial peripheral interface (SPI) master or slave
• Connectable to all general purpose I/O (GPIO) pins
❐ Complex peripherals by combining blocks
■
Flexible on-chip memory
❐ 8 KB flash program storage 50,000 erase/write cycles
❐ 512 bytes static random access memory (SRAM) data
storage
❐ In-system serial programming (ISSP)
❐ Partial flash updates
❐ Flexible protection modes
❐ EEPROM emulation in flash
■
Complete development tools
❐ Free development software (PSoC Designer™)
❐ Full-featured, in-circuit emulator (ICE) and programmer
❐ Full-speed emulation
❐ Complex breakpoint structure
❐ 128-KB trace memory
■
Precision, programmable clocking
❐ Internal ±2.5% 24- / 48-MHz main oscillator
❐ Internal oscillator for watchdog and sleep
■
Programmable pin configurations
❐ 25-mA sink, 10-mA source on all GPIOs
❐ Pull-up, pull-down, high Z, strong, or open-drain drive modes
on all GPIOs
❐ Up to eight analog inputs on GPIOs
❐ Configurable interrupt on all GPIOs
Cypress Semiconductor Corporation
Document Number: 38-12025 Rev. *X
•
198 Champion Court
Logic Block Diagram
•
San Jose, CA 95134-1709
•
408-943-2600
Revised October 11, 2011
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Contents
PSoC® Programmable System-on-Chip™ ..................... 1
Features ............................................................................. 1
Logic Block Diagram ........................................................ 1
PSoC Functional Overview .............................................. 3
The PSoC Core ........................................................... 3
The Digital System ...................................................... 3
The Analog System ..................................................... 4
Additional System Resources ..................................... 4
PSoC Device Characteristics ...................................... 5
Getting Started .................................................................. 5
Application Notes ........................................................ 5
Development Kits ........................................................ 5
Training ....................................................................... 5
CYPros Consultants .................................................... 5
Solutions Library .......................................................... 5
Technical Support ....................................................... 5
Development Tools .......................................................... 6
PSoC Designer Software Subsystems ........................ 6
Designing with PSoC Designer ....................................... 7
Select User Modules ................................................... 7
Configure User Modules .............................................. 7
Organize and Connect ................................................ 7
Generate, Verify, and Debug ....................................... 7
Pin Information ................................................................. 8
16-Pin Part Pinout ....................................................... 8
20-Pin Part Pinout ....................................................... 9
28-Pin Part Pinout ..................................................... 10
32-Pin Part Pinout ..................................................... 11
56-Pin Part Pinout ..................................................... 13
Register Reference ......................................................... 15
Register Conventions ................................................ 15
Register Mapping Tables .......................................... 15
Document Number: 38-12025 Rev. *X
Electrical Specifications ................................................ 18
Absolute Maximum Ratings ....................................... 18
Operating Temperature ............................................. 19
DC Electrical Characteristics ..................................... 19
AC Electrical Characteristics ..................................... 25
Packaging Information ................................................... 33
Thermal Impedances ................................................. 37
Solder Reflow Specifications ..................................... 37
Development Tool Selection ......................................... 38
Software .................................................................... 38
Development Kits ...................................................... 38
Evaluation Tools ........................................................ 38
Device Programmers ................................................. 39
Accessories (Emulation and Programming) .............. 39
Ordering Information ...................................................... 40
Ordering Code Definitions ......................................... 41
Acronyms ........................................................................ 42
Reference Documents .................................................... 42
Document Conventions ................................................. 43
Units of Measure ....................................................... 43
Numeric Conventions ................................................ 43
Glossary .......................................................................... 43
Document History Page ................................................. 48
Sales, Solutions, and Legal Information ...................... 50
Worldwide Sales and Design Support ....................... 50
Products .................................................................... 50
PSoC Solutions ......................................................... 50
Page 2 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
PSoC Functional Overview
The PSoC family consists of many devices with on-chip
controllers. These devices are designed to replace multiple
traditional MCU-based system components with one low-cost
single-chip programmable component. A PSoC device includes
configurable blocks of analog and digital logic, and
programmable interconnect. This architecture makes it possible
for you to create customized peripheral configurations, to match
the requirements of each individual application. Additionally, a
fast central processing unit (CPU), flash program memory,
SRAM data memory, and configurable I/O are included in a
range of convenient pinouts.
The Digital System
The digital system consists of four digital PSoC blocks. Each
block is an 8-bit resource that is used alone or combined with
other blocks to form 8-, 16-, 24-, and 32-bit peripherals, which
are called user modules. Digital peripheral configurations
include:
■
PWMs (8- to 32-bit)
■
PWMs with dead band (8- to 32-bit)
■
Counters (8- to 32-bit)
■
Timers (8- to 32-bit)
■
UART 8- with selectable parity
■
Serial peripheral interface (SPI) master and slave
■
I2C slave and multi-master
■
CRC/generator (8-bit)
The PSoC Core
■
IrDA
The PSoC core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and internal main
oscillator (IMO) and internal low speed oscillator (ILO). The CPU
core, called the M8C, is a powerful processor with speeds up to
24 MHz. The M8C is a four-million instructions per second
(MIPS) 8-bit Harvard-architecture microprocessor.
■
PRS generators (8-bit to 32-bit)
System resources provide these additional capabilities:
■
Digital clocks for increased flexibility
■
I2C functionality to implement an I2C master and slave
■
An internal voltage reference, multi-master, that provides an
absolute value of 1.3 V to a number of PSoC subsystems
■
A SMP that generates normal operating voltages from a single
battery cell
■
Various system resets supported by the M8C
The digital blocks are connected to any GPIO through a series
of global buses that can route any signal to any pin. The buses
also allow for signal multiplexing and for performing logic
operations. This configurability frees your designs from the
constraints of a fixed peripheral controller.
Digital blocks are provided in rows of four, where the number of
blocks varies by PSoC device family. This allows the optimum
choice of system resources for your application. Family
resources are shown in Table 1 on page 5.
Figure 1. Digital System Block Diagram
Port 3
Port 1
Port 2
Port 0
Digital Clocks To System Bus
From Core
The digital system consists of an array of digital PSoC blocks that
may be configured into any number of digital peripherals. The
digital blocks are connected to the GPIOs through a series of
global buses. These buses can route any signal to any pin,
freeing designs from the constraints of a fixed peripheral
controller.
To Analog
System
DIGITAL SYSTEM
Row Input
Configuration
Digital PSoC Block Array
The analog system consists of four analog PSoC blocks,
supporting comparators, and analog-to-digital conversion up to
10 bits of precision.
4
Row 0
DBB00
DBB01
DCB02
DCB03
4
8
8
8
8
GIE[7:0]
GIO[7:0]
Document Number: 38-12025 Rev. *X
Row Output
Configuration
The PSoC architecture, shown in Figure 1, consists of four main
areas: the core, the system resources, the digital system, and
the analog system. Configurable global bus resources allow
combining all of the device resources into a complete custom
system. Each CY8C21x34 PSoC device includes four digital
blocks and four analog blocks. Depending on the PSoC
package, up to 28 GPIOs are also included. The GPIOs provide
access to the global digital and analog interconnects.
Global Digital
Interconnect
GOE[7:0]
GOO[7:0]
Page 3 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
The Analog System
The Analog Multiplexer System
The analog system consists of four configurable blocks that allow
for the creation of complex analog signal flows. Analog
peripherals are very flexible and can be customized to support
specific application requirements. Some of the common PSoC
analog functions for this device (most available as user modules)
are:
The analog mux bus can connect to every GPIO pin. Pins may
be connected to the bus individually or in any combination. The
bus also connects to the analog system for analysis with
comparators and analog-to-digital converters. An additional 8:1
analog input multiplexer provides a second path to bring Port 0
pins to the analog array.
■
ADCs (single or dual, with 8-bit or 10-bit resolution)
■
Pin-to-pin comparator
■
Single-ended comparators (up to two) with absolute (1.3 V)
reference or 8-bit DAC reference
Switch-control logic enables selected pins to precharge
continuously under hardware control. This enables capacitive
measurement for applications such as touch sensing. Other
multiplexer applications include:
■
Track pad, finger sensing
1.3-V reference (as a system resource)
■
Chip-wide mux that allows analog input from any I/O pin
■
Crosspoint connection between any I/O pin combinations
■
In most PSoC devices, analog blocks are provided in columns of
three, which includes one continuous time (CT) and two switched
capacitor (SC) blocks. The CY8C21x34 devices provide limited
functionality Type E analog blocks. Each column contains one
CT Type E block and one SC Type E block. Refer to the PSoC
Technical Reference Manual for detailed information on the
CY8C21x34’s Type E analog blocks.
Figure 2. Analog System Block Diagram
Array Input
Configuration
ACI0[1:0]
Additional System Resources
System resources, some of which are listed in the previous
sections, provide additional capability useful to complete
systems. Additional resources include a switch-mode pump,
low-voltage detection, and power-on-reset (POR).
■
Digital clock dividers provide three customizable clock
frequencies for use in applications. The clocks may be routed
to both the digital and analog systems. Additional clocks can
be generated using digital PSoC blocks as clock dividers.
■
The I2C module provides 100- and 400-kHz communication
over two wires. Slave, master, and multi-master modes are all
supported.
■
LVD interrupts can signal the application of falling voltage
levels, while the advanced POR circuit eliminates the need for
a system supervisor.
■
An internal 1.3-V reference provides an absolute reference for
the analog system, including ADCs and DACs.
■
An integrated switch-mode pump generates normal operating
voltages from a single 1.2-V battery cell, providing a low cost
boost converter.
■
Versatile analog multiplexer system.
ACI1[1:0]
All I/O
X
X
X
ACOL1MUX
X
Analog Mux Bus
X
Array
ACE00
ACE01
ASE10
ASE11
Document Number: 38-12025 Rev. *X
Page 4 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
PSoC Device Characteristics
Depending on your PSoC device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks and 12, 6, or 4
analog blocks. Table 1 lists the resources available for specific PSoC device groups. The PSoC device covered by this datasheet is
highlighted in Table 1.
Table 1. PSoC Device Characteristics
PSoC Part
Number
Digital
I/O
CY8C29x66
up to 64
CY8C28xxx
up to 44
Digital
Rows
Digital
Blocks
Analog
Inputs
Analog
Outputs
4
16
up to 12
4
up to 3
up to 12
up to 44
up to 4
Analog
Columns
Analog
Blocks
SRAM
Size
Flash
Size
4
12
2K
32 K
up to 6
up to
12 + 4[1]
1K
16 K
CY8C27x43
up to 44
2
8
up to 12
4
4
12
256
16 K
CY8C24x94
up to 56
1
4
up to 48
2
2
6
1K
16 K
CY8C24x23A
up to 24
1
4
up to 12
2
2
6
256
4K
CY8C23x33
up to 26
1
4
up to 12
2
2
4
256
8K
CY8C22x45
up to 38
2
8
up to 38
0
4
6[1]
1K
16 K
CY8C21x45
up to 24
1
4
up to 24
0
4
6[1]
512
8K
CY8C21x34
up to 28
1
4
up to 28
0
2
4[1]
512
8K
CY8C21x23
up to 16
1
4
up to 8
0
2
4[1]
256
4K
[1,2]
CY8C20x34
up to 28
0
0
up to 28
0
0
3
CY8C20xx6
up to 36
0
0
up to 36
0
0
3[1,2]
512
8K
up to
2K
up to
32 K
Getting Started
For in-depth information, along with detailed programming
details, see the PSoC® Technical Reference Manual.
CYPros Consultants
For up-to-date ordering, packaging, and electrical specification
information, see the latest PSoC device datasheets on the web.
Certified PSoC consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC consultant go to the CYPros Consultants web site.
Application Notes
Solutions Library
Cypress application notes are an excellent introduction to the
wide variety of possible PSoC designs.
Visit our growing library of solution focused designs. Here you
can find various application designs that include firmware and
hardware design files that enable you to complete your designs
quickly.
Development Kits
PSoC Development Kits are available online from and through a
growing number of regional and global distributors, which
include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and
Newark.
Training
Technical Support
Technical support – including a searchable Knowledge Base
articles and technical forums – is also available online. If you
cannot find an answer to your question, call our Technical
Support hotline at 1-800-541-4736.
Free PSoC technical training (on demand, webinars, and
workshops), which is available online via www.cypress.com,
covers a wide variety of topics and skill levels to assist you in
your designs.
Notes
1. Limited analog functionality.
2. Two analog blocks and one CapSense®.
Document Number: 38-12025 Rev. *X
Page 5 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Development Tools
PSoC Designer™ is the revolutionary integrated design
environment (IDE) that you can use to customize PSoC to meet
your specific application requirements. PSoC Designer software
accelerates system design and time to market. Develop your
applications using a library of precharacterized analog and digital
peripherals (called user modules) in a drag-and-drop design
environment. Then, customize your design by leveraging the
dynamically generated application programming interface (API)
libraries of code. Finally, debug and test your designs with the
integrated debug environment, including in-circuit emulation and
standard software debug features. PSoC Designer includes:
■
Application editor graphical user interface (GUI) for device and
user module configuration and dynamic reconfiguration
■
Extensive user module catalog
■
Integrated source-code editor (C and assembly)
■
Free C compiler with no size restrictions or time limits
■
Built-in debugger
■
In-circuit emulation
■
Built-in support for communication interfaces:
2
❐ Hardware and software I C slaves and masters
❐ Full-speed USB 2.0
❐ Up to four full-duplex universal asynchronous receiver/transmitters (UARTs), SPI master and slave, and wireless
PSoC Designer supports the entire library of PSoC 1 devices and
runs on Windows XP, Windows Vista, and Windows 7.
PSoC Designer Software Subsystems
Design Entry
In the chip-level view, choose a base device to work with. Then
select different onboard analog and digital components that use
the PSoC blocks, which are called user modules. Examples of
user modules are ADCs, DACs, amplifiers, and filters. Configure
the user modules for your chosen application and connect them
to each other and to the proper pins. Then generate your project.
This prepopulates your project with APIs and libraries that you
can use to program your application.
The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration
makes it possible to change configurations at run time. In
essence, this allows you to use more than 100 percent of PSoC's
resources for an application.
Document Number: 38-12025 Rev. *X
Code Generation Tools
The code generation tools work seamlessly within the
PSoC Designer interface and have been tested with a full range
of debugging tools. You can develop your design in C, assembly,
or a combination of the two.
Assemblers. The assemblers allow you to merge assembly
code seamlessly with C code. Link libraries automatically use
absolute addressing or are compiled in relative mode, and are
linked with other software modules to get absolute addressing.
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices. The
optimizing C compilers provide all of the features of C, tailored
to the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
Debugger
PSoC Designer has a debug environment that provides
hardware in-circuit emulation, allowing you to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow you to read and program and
read and write data memory, and read and write I/O registers.
You can read and write CPU registers, set and clear breakpoints,
and provide program run, halt, and step control. The debugger
also allows you to create a trace buffer of registers and memory
locations of interest.
Online Help System
The online help system displays online, context-sensitive help.
Designed for procedural and quick reference, each functional
subsystem has its own context-sensitive help. This system also
provides tutorials and links to FAQs and an online support Forum
to aid the designer.
In-Circuit Emulator
A low-cost, high-functionality in-circuit emulator (ICE) is
available for development support. This hardware can program
single devices.
The emulator consists of a base unit that connects to the PC
using a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full-speed
(24 MHz) operation.
Page 6 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Designing with PSoC Designer
The development process for the PSoC device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture a
unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
The PSoC development process is summarized in four steps:
1. Select User Modules.
2. Configure User Modules.
3. Organize and Connect.
4. Generate, Verify, and Debug.
Select User Modules
PSoC Designer provides a library of prebuilt, pretested hardware
peripheral components called “user modules.” User modules
make selecting and implementing peripheral devices, both
analog and digital, simple.
Configure User Modules
Each user module that you select establishes the basic register
settings that implement the selected function. They also provide
parameters and properties that allow you to tailor their precise
configuration to your particular application. For example, a PWM
User Module configures one or more digital PSoC blocks, one
for each 8 bits of resolution. The user module parameters permit
you to establish the pulse width and duty cycle. Configure the
parameters and properties to correspond to your chosen
application. Enter values directly or by selecting values from
drop-down menus. All the user modules are documented in
datasheets that may be viewed directly in PSoC Designer or on
the Cypress website. These user module datasheets explain the
internal operation of the user module and provide performance
specifications. Each datasheet describes the use of each user
module parameter, and other information you may need to
successfully implement your design.
Document Number: 38-12025 Rev. *X
Organize and Connect
You build signal chains at the chip level by interconnecting user
modules to each other and the I/O pins. You perform the
selection, configuration, and routing so that you have complete
control over all on-chip resources.
Generate, Verify, and Debug
When you are ready to test the hardware configuration or move
on to developing code for the project, you perform the “Generate
Configuration Files” step. This causes PSoC Designer to
generate source code that automatically configures the device to
your specification and provides the software for the system. The
generated code provides application programming interfaces
(APIs) with high-level functions to control and respond to
hardware events at run-time and interrupt service routines that
you can adapt as needed.
A complete code development environment allows you to
develop and customize your applications in either C, assembly
language, or both.
The last step in the development process takes place inside
PSoC Designer’s debugger (access by clicking the Connect
icon). PSoC Designer downloads the HEX image to the ICE
where it runs at full speed. PSoC Designer debugging
capabilities rival those of systems costing many times more. In
addition to traditional single-step, run-to-breakpoint, and
watch-variable features, the debug interface provides a large
trace buffer and allows you to define complex breakpoint events.
These include monitoring address and data bus values, memory
locations, and external signals.
Page 7 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Pin Information
The CY8C21x34 PSoC device is available in a variety of packages which are listed in the following tables. Every port pin (labeled with
a “P”) is capable of Digital I/O and connection to the common analog bus. However, VSS, VDD, SMP, and XRES are not capable of
Digital I/O.
16-Pin Part Pinout
Figure 3. CY8C21234 16-Pin PSoC Device
A, I, M, P0[7]
1
16
VDD
A, I, M, P0[5]
2
15
P0[6], A, I, M
A, I, M, P0[3]
3
14
P0[4], A, I, M
A, I, M, P0[1]
4
13
P0[2], A, I, M
SMP
5
12
P0[0], A, I, M
VSS
6
11
P1[4], EXTCLK, M
M, I2C SCL, P1[1]
7
10
P1[2], M
VSS
8
9
SOIC
P1[0], I2C SDA, M
Table 2. Pin Definitions – CY8C21234 16-Pin (SOIC)
Pin No.
Type
Digital
Name
Analog
Description
1
I/O
I, M
P0[7]
Analog column mux input
2
I/O
I, M
P0[5]
Analog column mux input
3
I/O
I, M
P0[3]
Analog column mux input, integrating input
4
I/O
I, M
P0[1]
Analog column mux input, integrating input
5
Power
SMP
Switch-mode pump (SMP) connection to required external components
6
Power
VSS
Ground connection
7
I/O
P1[1]
I2C serial clock (SCL), ISSP-SCLK[3]
8
Power
VSS
Ground connection
9
I/O
M
P1[0]
I2C serial data (SDA), ISSP-SDATA[3]
10
I/O
M
P1[2]
11
I/O
M
P1[4]
Optional external clock input (EXTCLK)
12
I/O
I, M
P0[0]
Analog column mux input
13
I/O
I, M
P0[2]
Analog column mux input
14
I/O
I, M
P0[4]
Analog column mux input
15
I/O
I, M
P0[6]
Analog column mux input
16
Power
VDD
Supply voltage
M
LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input.
Note
3. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 38-12025 Rev. *X
Page 8 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
20-Pin Part Pinout
Figure 4. CY8C21334 20-Pin PSoC Device
A, I, M, P0[7]
1
20
VDD
A, I, M, P0[5]
2
19
P0[6], A, I, M
A, I, M, P0[3]
3
18
P0[4], A, I, M
A, I, M, P0[1]
4
17
P0[2], A, I, M
VSS
5
16
P0[0], A, I, M
M, I2C SCL, P1[7]
6
15
XRES
M, I2C SDA, P1[5]
7
14
P1[6], M
M, P1[3]
8
13
P1[4], EXTCLK, M
M, I2C SCL, P1[1]
9
12
P1[2], M
VSS
10
11
P1[0], I2C SDA, M
SSOP
Table 3. Pin Definitions – CY8C21334 20-Pin (SSOP)
Pin No.
Type
Digital
Analog
Name
Description
1
I/O
I, M
P0[7]
Analog column mux input
2
I/O
I, M
P0[5]
Analog column mux input
3
I/O
I, M
P0[3]
Analog column mux input, integrating input
4
I/O
I, M
P0[1]
Analog column mux input, integrating input
5
Power
VSS
Ground connection
6
I/O
M
P1[7]
I2C SCL
7
I/O
M
P1[5]
I2C SDA
8
I/O
M
P1[3]
9
I/O
M
P1[1]
I2C SCL, ISSP-SCLK[4]
10
Power
VSS
Ground connection.
11
I/O
M
P1[0]
I2C SDA, ISSP-SDATA[4]
12
I/O
M
P1[2]
13
I/O
M
P1[4]
14
I/O
M
P1[6]
15
Input
16
I/O
17
I/O
18
19
20
Power
Optional external clock input (EXTCLK)
XRES
Active high external reset with internal pull-down
I, M
P0[0]
Analog column mux input
I, M
P0[2]
Analog column mux input
I/O
I, M
P0[4]
Analog column mux input
I/O
I, M
P0[6]
Analog column mux input
VDD
Supply voltage
LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input.
Note
4. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 38-12025 Rev. *X
Page 9 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
28-Pin Part Pinout
Figure 5. CY8C21534 28-Pin PSoC Device
A, I, M, P0[7]
1
28
VDD
A, I, M, P0[5]
2
27
P0[6], A, I, M
A, I, M, P0[3]
3
26
P0[4], A, I, M
A, I, M, P0[1]
4
25
P0[2], A, I, M
M, P2[7]
5
24
P0[0], A, I, M
M, P2[5]
6
23
P2[6], M
M, P2[3]
7
22
P2[4], M
M, P2[1]
8
21
P2[2], M
VSS
9
20
P2[0], M
M, I2C SCL, P1[7]
10
19
XRES
M, I2C SDA, P1[5]
11
18
P1[6], M
M, P1[3]
12
17
P1[4], EXTCLK, M
M, I2C SCL, P1[1]
13
16
P1[2], M
VSS
14
15
P1[0], I2C SDA, M
SSOP
Table 4. Pin Definitions – CY8C21534 28-Pin (SSOP)
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Type
Digital
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Power
I/O
I/O
I/O
I/O
Power
I/O
I/O
I/O
I/O
Input
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Power
Analog
I, M
I, M
I, M
I, M
M
M
I, M
I, M
M
M
M
M
M
M
M
M
I, M
I, M
M
M
I, M
I, M
I, M
I, M
Name
P0[7]
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
VSS
P1[7]
P1[5]
P1[3]
P1[1]
VSS
P1[0]
P1[2]
P1[4]
P1[6]
XRES
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
VDD
Description
Analog column mux input
Analog column mux input and column output
Analog column mux input and column output, integrating input
Analog column mux input, integrating input
Direct switched capacitor block input
Direct switched capacitor block input
Ground connection
I2C SCL
I2C SDA
I2C SCL, ISSP-SCLK[5]
Ground connection
I2C SDA, ISSP-SDATA[5]
Optional external clock input (EXTCLK)
Active high external reset with internal pull-down
Direct switched capacitor block input
Direct switched capacitor block input
Analog column mux input
Analog column mux input
Analog column mux input
Analog column mux input
Supply voltage
LEGEND A: Analog, I: Input, O = Output, and M = Analog Mux Input.
Note
5. These are the ISSP pins, which are not high Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 38-12025 Rev. *X
Page 10 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
32-Pin Part Pinout
Figure 6. CY8C21434 32-Pin PSoC Device
Figure 9. CY8C21634 32-Pin Sawn PSoC Device Sawn
M, I2C SDA, P1[5]
M, P1[3]
M, I2C SCL, P1[1]
Vss
M, I2C SDA, P1[0]
M, P1[2]
M, EXTCLK, P1[4]
M, P1[6]
Document Number: 38-12025 Rev. *X
A, I, M, P0[1]
M, P2[7]
M, P2[5]
M, P2[3]
M, P2[1]
SMP
Vss
M, I2C SCL, P1[7]
1
2
3
4
5
6
7
8
QFN
(Top View)
24
23
22
21
20
19
18
17
9
10
11
12
13
14
15
16
P0[0], A, I, M
P2[6], M
P2[4], M
P2[2], M
P2[0], M
P3[2], M
P3[0], M
XRES
P0[0], A, I, M
P2[6], M
P2[4], M
P2[2], M
P2[0], M
P3[2], M
P3[0], M
XRES
M, I2C SDA, P1[5]
M, P1[3]
M, I2C SCL, P1[1]
Vss
M, I2C SDA, P1[0]
M, P1[2]
M, EXTCLK, P1[4]
M, P1[6]
QFN
(Top View)
24
23
22
21
20
19
18
17
32
31
30
29
28
27
26
25
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A, I, M, P0[1]
M, P2[7]
M, P2[5]
M, P2[3]
M, P2[1]
M, P3[3]
M, P3[1]
M, I2C SCL, P1[7]
Vss
P0[3], A, I, M
P0[5], A, I, M
P0[7], A, I, M
Vdd
P0[6], A, I, M
P0[4], A, I, M
P0[2], A, I, M
Vss
P0[3], A, I, M
P0[5], A, I, M
P0[7], A, I, M
Vdd
P0[6], A, I, M
P0[4], A, I, M
P0[2], A, I, M
Figure 8. CY8C21434 32-Pin Sawn PSoC Device Sawn
Figure 7. CY8C21634 32-Pin PSoC Device
Page 11 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Table 5. Pin Definitions - CY8C21434/CY8C21634 32-Pin (QFN)[6]
Pin No.
1
2
3
4
5
6
6
7
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Digital
I/O
I/O
I/O
I/O
I/O
I/O
Power
I/O
Power
I/O
I/O
I/O
I/O
Power
I/O
I/O
I/O
I/O
Input
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Power
I/O
I/O
I/O
Power
Type
Analog
I, M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
I, M
I, M
I, M
I, M
I, M
I, M
I, M
Name
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
P3[3]
SMP
P3[1]
VSS
P1[7]
P1[5]
P1[3]
P1[1]
VSS
P1[0]
P1[2]
P1[4]
P1[6]
XRES
P3[0]
P3[2]
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
VDD
P0[7]
P0[5]
P0[3]
VSS
Description
Analog column mux input, integrating input
In CY8C21434 part
SMP connection to required external components in CY8C21634 part
In CY8C21434 part
Ground connection in CY8C21634 part
I2C SCL
I2C SDA
I2C SCL, ISSP-SCLK[7]
Ground connection
I2C SDA, ISSP-SDATA[7]
Optional external clock input (EXTCLK)
Active high external reset with internal pull-down
Analog column mux input
Analog column mux input
Analog column mux input
Analog column mux input
Supply voltage
Analog column mux input
Analog column mux input
Analog column mux input, integrating input
Ground connection
LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input.
Notes
6. The center pad on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground,
it must be electrically floated and not connected to any other signal.
7. These are the ISSP pins, which are not high Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 38-12025 Rev. *X
Page 12 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
56-Pin Part Pinout
The 56-Pin SSOP part is for the CY8C21001 on-chip debug (OCD) PSoC device.
Note This part is only used for in-circuit debugging. It is NOT available for production.
Figure 10. CY8C21001 56-Pin PSoC Device
V ss
P 0[7]
P 0[5]
P 0[3]
P 0[1]
P 2[7]
P 2[5]
P 2[3]
P 2[1]
NC
NC
NC
NC
OCDE
OCDO
SMP
V ss
V ss
P 3[3]
P 3[1]
NC
NC
I2C S C L, P 1[7]
I2C S D A , P 1[5]
NC
P 1[3]
S C LK , I2C S C L, P 1[1]
V ss
A I,
A I,
A I,
A I,
1
2
56
55
3
4
5
6
7
8
9
10
54
53
52
51
18
19
20
21
22
23
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
24
25
33
32
26
27
28
31
30
11
12
13
14
15
16
17
S SO P
29
V dd
P 0[6],
P 0[4],
P 0[2],
P 0[0],
P 2[6]
AI
AI
AI
AI
P 2[4]
P 2[2]
P 2[0]
NC
NC
P 3[2]
P 3[0]
C C LK
H C LK
XR E S
NC
NC
NC
NC
NC
NC
P 1[6]
P 1[4], E XTC LK
P 1[2]
P 1[0], I2C S D A , S D A TA
NC
NC
Table 6. Pin Definitions – CY8C21001 56-Pin (SSOP)
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
Type
Digital
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
OCD
OCD
Power
Power
Power
I/O
Pin Name
Analog
I
I
I
I
I
I
VSS
P0[7]
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
NC
NC
NC
NC
OCDE
OCDO
SMP
VSS
VSS
P3[3]
Document Number: 38-12025 Rev. *X
Description
Ground connection
Analog column mux input
Analog column mux input and column output
Analog column mux input and column output
Analog column mux input
Direct switched capacitor block input
Direct switched capacitor block input
No connection. Pin must be left floating
No connection. Pin must be left floating
No connection. Pin must be left floating
No connection. Pin must be left floating
OCD even data I/O
OCD odd data output
SMP connection to required external components
Ground connection
Ground connection
Page 13 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Table 6. Pin Definitions – CY8C21001 56-Pin (SSOP) (continued)
Type
Pin No.
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
Digital
I/O
I/O
I/O
I/O
I/O
Power
I/O
I/O
I/O
I/O
Input
OCD
OCD
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Power
Pin Name
Analog
I
I
I
I
I
I
P3[1]
NC
NC
P1[7]
P1[5]
NC
P1[3]
P1[1]
VSS
NC
NC
P1[0]
P1[2]
P1[4]
P1[6]
NC
NC
NC
NC
NC
NC
XRES
HCLK
CCLK
P3[0]
P3[2]
NC
NC
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
VDD
Description
No connection. Pin must be left floating
No connection. Pin must be left floating
I2C SCL
I2C SDA
No connection. Pin must be left floating
IFMTEST
I2C SCL, ISSP-SCLK[8]
Ground connection
No connection. Pin must be left floating
No connection. Pin must be left floating
I2C SDA, ISSP-SDATA[8]
VFMTEST
Optional external clock input (EXTCLK)
No connection. Pin must be left floating
No connection. Pin must be left floating
No connection. Pin must be left floating
No connection. Pin must be left floating
No connection. Pin must be left floating
No connection. Pin must be left floating
Active high external reset with internal pull-down
OCD high-speed clock output
OCD CPU clock output
No connection. Pin must be left floating
No connection. Pin must be left floating
Analog column mux input
Analog column mux input and column output
Analog column mux input and column output
Analog column mux input
Supply voltage
LEGEND: A = Analog, I = Input, O = Output, and OCD = On-Chip Debug.
Note
8. These are the ISSP pins, which are not High Z at POR. See the PSoC Technical Reference Manual for details.
Document Number: 38-12025 Rev. *X
Page 14 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Register Reference
This chapter lists the registers of the CY8C21x34 PSoC device. For detailed register information, see the PSoC Technical Reference
Manual.
Register Conventions
The register conventions specific to this section are listed in Table 7.
Table 7. Register Conventions
Convention
R
Description
Read register or bit(s)
W
Write register or bit(s)
L
Logical register or bit(s)
C
Clearable register or bit(s)
#
Access is bit specific
Register Mapping Tables
The PSoC device has a total register address space of 512 bytes. The register space is referred to as I/O space and is divided into
two banks, Bank 0 and Bank 1. The XOI bit in the Flag register (CPU_F) determines which bank the user is currently in. When the
XOI bit is set to 1, the user is in Bank 1.
Note In the following register mapping tables, blank fields are reserved and must not be accessed.
Document Number: 38-12025 Rev. *X
Page 15 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Table 8. Register Map 0 Table: User Space
Name
PRT0DR
PRT0IE
PRT0GS
PRT0DM2
PRT1DR
PRT1IE
PRT1GS
PRT1DM2
PRT2DR
PRT2IE
PRT2GS
PRT2DM2
PRT3DR
PRT3IE
PRT3GS
PRT3DM2
Addr (0,Hex) Access
Name
00
RW
01
RW
02
RW
03
RW
04
RW
05
RW
06
RW
07
RW
08
RW
09
RW
0A
RW
0B
RW
0C
RW
0D
RW
0E
RW
0F
RW
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
DBB00DR0
20
#
AMX_IN
DBB00DR1
21
W
AMUXCFG
DBB00DR2
22
RW
PWM_CR
DBB00CR0
23
#
DBB01DR0
24
#
CMP_CR0
DBB01DR1
25
W
DBB01DR2
26
RW
CMP_CR1
DBB01CR0
27
#
DCB02DR0
28
#
ADC0_CR
DCB02DR1
29
W
ADC1_CR
DCB02DR2
2A
RW
DCB02CR0
2B
#
DCB03DR0
2C
#
TMP_DR0
DCB03DR1
2D
W
TMP_DR1
DCB03DR2
2E
RW
TMP_DR2
DCB03CR0
2F
#
TMP_DR3
30
31
32
ACE00CR1
33
ACE00CR2
34
35
36
ACE01CR1
37
ACE01CR2
38
39
3A
3B
3C
3D
3E
3F
Blank fields are reserved and must not be accessed.
Document Number: 38-12025 Rev. *X
Addr (0,Hex)
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
Access
RW
RW
RW
#
RW
#
#
RW
RW
RW
RW
RW
RW
RW
RW
Name
ASE10CR0
Addr (0,Hex)
80
81
82
83
ASE11CR0
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
RDI0RI
B0
RDI0SYN
B1
RDI0IS
B2
RDI0LT0
B3
RDI0LT1
B4
RDI0RO0
B5
RDI0RO1
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
# Access is bit specific.
Access
RW
Name
RW
CUR_PP
STK_PP
IDX_PP
MVR_PP
MVW_PP
I2C_CFG
I2C_SCR
I2C_DR
I2C_MSCR
INT_CLR0
INT_CLR1
INT_CLR3
INT_MSK3
INT_MSK0
INT_MSK1
INT_VC
RES_WDT
DEC_CR0
DEC_CR1
RW
RW
RW
RW
RW
RW
RW
CPU_F
DAC_D
CPU_SCR1
CPU_SCR0
Addr (0,Hex)
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
Access
RW
RW
RW
RW
RW
RW
#
RW
#
RW
RW
RW
RW
RW
RW
RC
W
RW
RW
RL
RW
#
#
Page 16 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Table 9. Register Map 1 Table: Configuration Space
Name
PRT0DM0
PRT0DM1
PRT0IC0
PRT0IC1
PRT1DM0
PRT1DM1
PRT1IC0
PRT1IC1
PRT2DM0
PRT2DM1
PRT2IC0
PRT2IC1
PRT3DM0
PRT3DM1
PRT3IC0
PRT3IC1
Addr (1,Hex) Access
Name
00
RW
01
RW
02
RW
03
RW
04
RW
05
RW
06
RW
07
RW
08
RW
09
RW
0A
RW
0B
RW
0C
RW
0D
RW
0E
RW
0F
RW
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
DBB00FN
20
RW
CLK_CR0
DBB00IN
21
RW
CLK_CR1
DBB00OU
22
RW
ABF_CR0
23
AMD_CR0
DBB01FN
24
RW
CMP_GO_EN
DBB01IN
25
RW
DBB01OU
26
RW
AMD_CR1
27
ALT_CR0
DCB02FN
28
RW
DCB02IN
29
RW
DCB02OU
2A
RW
2B
CLK_CR3
DCB03FN
2C
RW
TMP_DR0
DCB03IN
2D
RW
TMP_DR1
DCB03OU
2E
RW
TMP_DR2
2F
TMP_DR3
30
31
32
ACE00CR1
33
ACE00CR2
34
35
36
ACE01CR1
37
ACE01CR2
38
39
3A
3B
3C
3D
3E
3F
Blank fields are reserved and must not be accessed.
Document Number: 38-12025 Rev. *X
Addr (1,Hex)
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Name
ASE10CR0
Addr (1,Hex)
80
81
82
83
ASE11CR0
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
RDI0RI
B0
RDI0SYN
B1
RDI0IS
B2
RDI0LT0
B3
RDI0LT1
B4
RDI0RO0
B5
RDI0RO1
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
# Access is bit specific.
Access
RW
Name
RW
GDI_O_IN
GDI_E_IN
GDI_O_OU
GDI_E_OU
MUX_CR0
MUX_CR1
MUX_CR2
MUX_CR3
OSC_GO_EN
OSC_CR4
OSC_CR3
OSC_CR0
OSC_CR1
OSC_CR2
VLT_CR
VLT_CMP
ADC0_TR
ADC1_TR
IMO_TR
ILO_TR
BDG_TR
ECO_TR
RW
RW
RW
RW
RW
RW
RW
CPU_F
FLS_PR1
DAC_CR
CPU_SCR1
CPU_SCR0
Addr (1,Hex)
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
Access
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
R
RW
RW
W
W
RW
W
RL
RW
RW
#
#
Page 17 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8C21x34 PSoC device. For up-to-date electrical specifications,
visit the Cypress web site at http://www.cypress.com.
Specifications are valid for –40 °C ≤ TA ≤ 85 °C and TJ ≤ 100 °C as specified, except where noted.
Refer to Table 21 on page 25 for the electrical specifications for the IMO using SLIMO mode.
Figure 11. Voltage versus CPU Frequency
Figure 14. IMO Frequency Trim Options
Vdd Voltage
lid ng
Va ati
er ion
Op eg
R
4.75
SLIMO Mode = 0
5.25
Vdd Voltage
5.25
4.75
3.60
3.00
3.00
2.40
2.40
93 kHz
12 MHz
3 MHz
24 MHz
93 kHz
SLIMO
Mode=1
SLIMO
Mode=0
SLIMO
Mode=1
SLIMO
Mode=0
SLIMO
Mode=1
SLIMO
Mode=1
6 MHz
12 MHz
24 MHz
IMO Frequency
CPU Frequency
Absolute Maximum Ratings
Symbol
TSTG
Description
Storage temperature
TBAKETEMP
Bake temperature
tBAKETIME
Bake time
TA
VDD
VIO
VIOZ
IMIO
ESD
LU
Ambient temperature with power applied
Supply voltage on VDD relative to VSS
DC input voltage
DC voltage applied to tri-state
Maximum current into any port pin
Electrostatic discharge voltage
Latch-up current
Document Number: 38-12025 Rev. *X
Min
–55
Typ
25
Max
+100
Units
°C
–
125
°C
See
package
label
–40
–0.5
VSS – 0.5
VSS – 0.5
–25
2000
–
–
See
package
label
72
Hours
–
–
–
–
–
–
–
+85
+6.0
VDD + 0.5
VDD + 0.5
+50
–
200
°C
V
V
V
mA
V
mA
Notes
Higher storage temperatures
reduce data retention time.
Recommended storage
temperature is +25 °C ± 25 °C.
Extended duration storage
temperatures above 65 °C
degrade reliability.
Human body model ESD.
Page 18 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Operating Temperature
Symbol
Description
TA
Ambient temperature
TJ
Junction temperature
Min
–40
–40
Typ
–
–
Max
+85
+100
Units
°C
°C
Notes
The temperature rise from ambient to
junction is package specific. See Table
34 on page 37. You must limit the
power consumption to comply with this
requirement.
DC Electrical Characteristics
DC Chip-Level Specifications
Table 10 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively. Typical parameters
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 10. DC Chip-level Specifications
Symbol
Description
VDD
Supply voltage
IDD
Supply current, IMO = 24 MHz
Min
2.40
–
Typ
–
3
Max
5.25
4
Units
V
mA
Notes
See Table 18 on page 23
Conditions are VDD = 5.0 V,
TA = 25 °C, CPU = 3 MHz,
48 MHz disabled. VC1 = 1.5 MHz,
VC2 = 93.75 kHz, VC3 = 0.366 kHz
Conditions are VDD = 3.3 V,
TA = 25 °C, CPU = 3 MHz, clock
doubler disabled. VC1 = 375 kHz,
VC2 = 23.4 kHz, VC3 = 0.091 kHz
Conditions are VDD = 2.55 V,
TA = 25 °C, CPU = 3 MHz, clock
doubler disabled. VC1 = 375 kHz,
VC2 = 23.4 kHz, VC3 = 0.091 kHz
VDD = 2.55 V, 0 °C ≤ TA ≤ 40 °C
IDD3
Supply current, IMO = 6 MHz using
SLIMO mode.
–
1.2
2
mA
IDD27
Supply current, IMO = 6 MHz using
SLIMO mode.
–
1.1
1.5
mA
ISB27
–
2.6
4
µA
–
2.8
5
µA
VDD = 3.3 V, –40 °C ≤ TA ≤ 85 °C
VREF
Sleep (mode) current with POR, LVD,
sleep timer, WDT, and internal slow
oscillator active. Mid temperature range.
Sleep (mode) current with POR, LVD,
Sleep Timer, WDT, and internal slow
oscillator active.
Reference voltage (Bandgap)
1.28
1.30
1.32
V
VREF27
Reference voltage (Bandgap)
1.16
1.30
1.33
V
Trimmed for appropriate VDD
VDD = 3.0 V to 5.25 V
Trimmed for appropriate VDD
VDD = 2.4 V to 3.0 V
AGND
Analog ground
VREF – 0.003
VREF
VREF + 0.003
V
ISB
Document Number: 38-12025 Rev. *X
Page 19 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
DC General-Purpose I/O Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively.
Typical parameters are measured at 5 V, 3.3 V, and 2.7 V at 25 °C and are for design guidance only.
Table 11. 5-V and 3.3-V DC GPIO Specifications
Symbol
Description
Pull-up resistor
RPU
Pull-down resistor
RPD
High output level
VOH
Min
4
4
VDD – 1.0
Typ
5.6
5.6
–
Max
8
8
–
Units
kΩ
kΩ
V
VOL
Low output level
–
–
0.75
V
IOH
High level source current
10
–
–
mA
IOL
Low level sink current
25
–
–
mA
VIL
VIH
VH
IIL
CIN
Input low level
Input high level
Input hysteresis
Input leakage (absolute value)
Capacitive load on pins as input
–
2.1
–
–
–
–
–
60
1
3.5
0.8
–
–
10
V
V
mV
nA
pF
COUT
Capacitive load on pins as output
–
3.5
10
pF
Min
4
4
VDD – 0.4
Typ
5.6
5.6
–
Max
8
8
–
Units
kΩ
kΩ
V
–
–
0.75
V
Notes
IOH = 10 mA, VDD = 4.75 to 5.25 V
(8 total loads, 4 on even port pins (for
example, P0[2], P1[4]), 4 on odd port
pins (for example, P0[3], P1[5])
IOL = 25 mA, VDD = 4.75 to 5.25 V
(8 total loads, 4 on even port pins (for
example, P0[2], P1[4]), 4 on odd port
pins (for example, P0[3], P1[5]))
VOH = VDD – 1.0 V, see the limitations
of the total current in the note for VOH
VOL = 0.75 V, see the limitations of the
total current in the note for VOL
VDD = 3.0 to 5.25
VDD = 3.0 to 5.25
Gross tested to 1 µA
Package and pin dependent
Temp = 25 °C
Package and pin dependent
Temp = 25 °C
Table 12. 2.7-V DC GPIO Specifications
Symbol
Description
RPU
Pull-up resistor
RPD
Pull-down resistor
VOH
High output level
VOL
Low output level
IOH
High level source current
2.5
–
–
mA
IOL
Low level sink current
10
–
–
mA
VIL
VIH
VH
IIL
CIN
Input low level
Input high level
Input hysteresis
Input leakage (absolute value)
Capacitive load on pins as input
–
2.0
–
–
–
–
–
90
1
3.5
0.75
–
–
–
10
V
V
mV
nA
pF
COUT
Capacitive load on pins as output
–
3.5
10
pF
Document Number: 38-12025 Rev. *X
Notes
IOH = 2.5 mA (6.25 Typ), VDD = 2.4 to
3.0 V (16 mA maximum, 50 mA Typ
combined IOH budget)
IOL = 10 mA, VDD = 2.4 to 3.0 V (90 mA
maximum combined IOL budget)
VOH = VDD – 0.4 V, see the limitations
of the total current in the note for VOH
VOL = 0.75 V, see the limitations of the
total current in the note for VOL
VDD = 2.4 to 3.0
VDD = 2.4 to 3.0
Gross tested to 1 µA
Package and pin dependent
Temp = 25 °C
Package and pin dependent
Temp = 25 °C
Page 20 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
DC Operational Amplifier Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively.
Typical parameters are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 13. 5-V DC Operational Amplifier Specifications
Symbol
VOSOA
TCVOSOA
IEBOA
IEBOA00
CINOA
Description
Input offset voltage (absolute value)
Average input offset voltage drift
Input leakage current (Port 0 analog pins 7-to-1)
Input leakage current (Port 0, Pin 0 analog pin)
Input capacitance (Port 0 analog pins)
Min
–
–
–
–
–
Typ
2.5
10
200
50
4.5
Max
15
–
–
–
9.5
Units
mV
µV/°C
pA
nA
pF
VCMOA
Common mode voltage range
0.0
–
VDD – 1.0
V
GOLOA
ISOA
Open loop gain
Amplifier supply current
–
–
80
10
–
30
dB
µA
Min
Typ
Max
Units
Notes
Gross tested to 1 µA
Gross tested to 1 µA
Package and pin dependent.
Temp = 25 °C
Table 14. 3.3-V DC Operational Amplifier Specifications
Symbol
VOSOA
Description
Input offset voltage (absolute value)
Notes
–
2.5
15
mV
TCVOSOA Average input offset voltage drift
–
10
–
µV/°C
IEBOA
Input leakage current (Port 0 analog pins)
–
200
–
pA
Gross tested to 1 µA
IEBOA00
Input leakage current (Port 0, Pin 0 analog pin)
–
50
–
nA
Gross tested to 1 µA
CINOA
Input capacitance (Port 0 analog pins)
–
4.5
9.5
pF
Package and pin dependent.
Temp = 25 °C
VCMOA
Common mode voltage range
0
–
VDD – 1.0
V
GOLOA
Open loop gain
–
80
–
dB
ISOA
Amplifier supply current
–
10
30
µA
Min
Typ
Max
Units
Table 15. 2.7-V DC Operational Amplifier Specifications
Symbol
VOSOA
Description
Input offset voltage (absolute value)
Notes
–
2.5
15
mV
TCVOSOA Average input offset voltage drift
–
10
–
µV/°C
IEBOA
Input leakage current (Port 0 analog pins)
–
200
–
pA
Gross tested to 1 µA
IEBOA00
Input leakage current (Port 0, Pin 0 analog pin)
–
50
–
nA
Gross tested to 1 µA
CINOA
Input capacitance (Port 0 analog pins)
–
4.5
9.5
pF
Package and pin dependent.
Temp = 25 °C
VCMOA
Common mode voltage range
0
–
VDD – 1.0
V
GOLOA
Open loop gain
–
80
–
dB
ISOA
Amplifier supply current
–
10
30
µA
Document Number: 38-12025 Rev. *X
Page 21 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
DC Switch Mode Pump Specifications
Table 16 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively. Typical parameters
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Figure 12. Basic Switch Mode Pump Circuit
D1
Vdd
V PUMP
L1
V BAT
+
SMP
Battery
C1
PSoC
Vss
Table 16. DC Switch Mode Pump (SMP) Specifications
Symbol
Description
Min
Typ
Max
Units
VPUMP5V
5 V output voltage from pump
4.75
5.0
5.25
V
Configured as in Note 9
Average, neglecting ripple
SMP trip voltage is set to 5.0 V
VPUMP3V
3.3 V output voltage from pump
3.00
3.25
3.60
V
Configured as in Note 9
Average, neglecting ripple.
SMP trip voltage is set to 3.25 V
VPUMP2V
2.6 V output voltage from pump
2.45
2.55
2.80
V
Configured as in Note 9
Average, neglecting ripple.
SMP trip voltage is set to 2.55 V
IPUMP
Available output current
VBAT = 1.8 V, VPUMP = 5.0 V
VBAT = 1.5 V, VPUMP = 3.25 V
VBAT = 1.3 V, VPUMP = 2.55 V
5
8
8
–
–
–
–
–
–
mA
mA
mA
VBAT5V
Input voltage range from battery
1.8
–
5.0
V
Configured as in Note 9
SMP trip voltage is set to 5.0 V
VBAT3V
Input voltage range from battery
1.0
–
3.3
V
Configured as in Note 9
SMP trip voltage is set to 3.25 V
VBAT2V
Input voltage range from battery
1.0
–
2.8
V
Configured as in Note 9
SMP trip voltage is set to 2.55 V
VBATSTART
Minimum input voltage from battery to start pump
1.2
–
–
V
Configured as in Note 9
0 °C ≤ TA ≤ 100. 1.25 V at
TA = –40 °C
ΔVPUMP_Line
Line regulation (over Vi range)
–
5
–
%VO
Configured as in Note 9
VO is the “VDD Value for PUMP Trip”
specified by the VM[2:0] setting in
the DC POR and LVD Specification,
Table 18 on page 23
ΔVPUMP_Load
Load regulation
–
5
–
%VO
Configured as in Note 9
VO is the “VDD Value for PUMP Trip”
specified by the VM[2:0] setting in
the DC POR and LVD Specification,
Table 18 on page 23
–
100
–
mVpp
Configured as in Note 9
Load is 5 mA
ΔVPUMP_Ripple Output voltage ripple (depends on cap/load)
Notes
Configured as in Note 9
SMP trip voltage is set to 5.0 V
SMP trip voltage is set to 3.25 V
SMP trip voltage is set to 2.55 V
Note
9. L1 = 2 mH inductor, C1 = 10 mF capacitor, D1 = Schottky diode. See Figure 12.
Document Number: 38-12025 Rev. *X
Page 22 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Table 16. DC Switch Mode Pump (SMP) Specifications (continued)
Symbol
Description
Min
Typ
Max
Units
Notes
E3
Efficiency
35
50
–
%
Configured as in Note 9
Load is 5 mA. SMP trip voltage is set
to 3.25 V
E2
Efficiency
35
80
–
%
For I load = 1mA, VPUMP = 2.55 V,
VBAT = 1.3 V,
10 µH inductor, 1 µF capacitor, and
Schottky diode
FPUMP
Switching frequency
–
1.3
–
MHz
DCPUMP
Switching duty cycle
–
50
–
%
DC Analog Mux Bus Specifications
Table 17 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively. Typical parameters
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 17. DC Analog Mux Bus Specifications
Symbol
RSW
Description
Switch resistance to common analog bus
Min
–
Typ
–
RVDD
Resistance of initialization switch to VDD
–
–
Max
400
800
800
Units
Ω
Notes
VDD ≥ 2.7 V
2.4 V ≤ VDD ≤ 2.7 V
Ω
DC POR and LVD Specifications
Table 18 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively. Typical parameters
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 18. DC POR and LVD Specifications
Symbol
Description
VPPOR0
VPPOR1
VPPOR2
VDD value for PPOR trip
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
VPUMP0
VPUMP1
VPUMP2
VPUMP3
VPUMP4
VPUMP5
VPUMP6
VPUMP7
Min
Typ
Max
Units
Notes
VDD must be greater than or equal to
2.5 V during startup, the reset from
the XRES pin, or reset from
watchdog
–
–
–
2.36
2.82
4.55
2.40
2.95
4.70
V
V
V
VDD value for LVD trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
2.40
2.85
2.95
3.06
4.37
4.50
4.62
4.71
2.45
2.92
3.02
3.13
4.48
4.64
4.73
4.81
2.51[10]
2.99[11]
3.09
3.20
4.55
4.75
4.83
4.95
V
V
V
V
V
V
V
V
VDD value for pump trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
2.45
2.96
3.03
3.18
4.54
4.62
4.71
4.89
2.55
3.02
3.10
3.25
4.64
4.73
4.82
5.00
2.62[12]
3.09
3.16
3.32[13]
4.74
4.83
4.92
5.12
V
V
V
V
V
V
V
V
Notes
10. Always greater than 50 mV above VPPOR (PORLEV = 00) for falling supply.
11. Always greater than 50 mV above VPPOR (PORLEV = 01) for falling supply.
12. Always greater than 50 mV above VLVD0.
13. Always greater than 50 mV above VLVD3.
Document Number: 38-12025 Rev. *X
Page 23 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
DC Programming Specifications
Table 19 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively. Typical parameters
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 19. DC Programming Specifications
Symbol
VDDP
Description
VDD for programming and erase
Min
4.5
Typ
5
Max
5.5
Units
V
VDDLV
Low VDD for verify
2.4
2.5
2.6
V
VDDHV
High VDD for verify
5.1
5.2
5.3
V
VDDIWRITE
Supply voltage for flash write operation
2.7
5.25
V
IDDP
VILP
VIHP
Supply current during programming or verify
Input low voltage during programming or verify
Input high voltage during programming or
verify
Input current when applying VILP to P1[0] or
P1[1] during programming or verify
Input current when applying VIHP to P1[0] or
P1[1] during programming or verify
Output low voltage during programming or
verify
Output high voltage during programming or
verify
Flash endurance (per block)
Flash endurance (total)[15]
Flash data retention
–
–
2.2
5
–
–
25
0.8
–
mA
V
V
–
–
0.2
mA
Driving internal pull-down resistor
–
–
1.5
mA
Driving internal pull-down resistor
–
–
VSS + 0.75
V
VDD – 1.0
–
VDD
V
50,000[14]
1,800,000
10
–
–
–
–
–
–
–
–
Years
IILP
IIHP
VOLV
VOHV
FlashENPB
FlashENT
FlashDR
Notes
This specification applies to the
functional requirements of external
programmer tools
This specification applies to the
functional requirements of external
programmer tools
This specification applies to the
functional requirements of external
programmer tools
This specification applies to this
device when it is executing internal
flash writes
Erase/write cycles per block
Erase/write cycles
DC I2C Specifications
Table 20 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively. Typical parameters
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 20. DC I2C Specifications[16]
Symbol
VILI2C
Input low level
Description
VIHI2C
Input high level
Min
–
–
0.7 × VDD
Typ
–
–
–
Max
0.3 × VDD
0.25 × VDD
–
Units
V
V
V
Notes
2.4 V ≤ VDD ≤ 3.6 V
4.75 V ≤ VDD ≤ 5.25 V
2.4 V ≤ VDD ≤ 5.25 V
Notes
14. The 50,000 cycle flash endurance per block is only guaranteed if the flash is operating within one voltage range. Voltage ranges are 2.4 V to 3.0 V, 3.0 V to 3.6 V,
and 4.75 V to 5.25 V.
15. A maximum of 36 × 50,000 block endurance cycles is allowed. This may be balanced between operations on 36 × 1 blocks of 50,000 maximum cycles each, 36×2
blocks of 25,000 maximum cycles each, or 36 × 4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36 × 50,000 and ensure that no
single block ever sees more than 50,000 cycles). For the full industrial range, you must employ a temperature sensor user module (FlashTemp) and feed the result
to the temperature argument before writing. Refer to the Flash APIs application note AN2015 (Design Aids - Reading and Writing PSoC® Flash) for more information.
16. All GPIO meet the DC GPIO VIL and VIH specifications found in the DC GPIO Specifications sections. The I2C GPIO pins also meet the above specs.
Document Number: 38-12025 Rev. *X
Page 24 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
AC Electrical Characteristics
AC Chip-Level Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively.
Typical parameters are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 21. 5-V and 3.3-V AC Chip-Level Specifications
Symbol
FIMO24
Description
IMO frequency for 24 MHz
Min
23.4
Typ
24
Max
24.6[17,18]
Units
MHz
FIMO6
IMO frequency for 6 MHz
5.5
6
6.5[17,18]
MHz
FCPU1
CPU frequency (5 V nominal)
0.091
24
24.6[17]
MHz
FCPU2
FBLK5
CPU frequency (3.3 V nominal)
Digital PSoC block frequency0(5 V nominal)
0.091
0
12
48
12.3[18]
49.2[17,19]
MHz
MHz
FBLK33
F32K1
F32K_U
Digital PSoC block frequency (3.3 V nominal)
ILO frequency
ILO untrimmed frequency
0
15
5
24
32
–
24.6[19]
64
100
MHz
kHz
kHz
tXRST
DC24M
DCILO
Step24M
Fout48M
External reset pulse width
24 MHz duty cycle
ILO duty cycle
24 MHz trim step size
48 MHz output frequency
10
40
20
–
46.8
–
50
50
50
48.0
–
60
80
–
49.2[17,18]
μs
%
%
kHz
MHz
FMAX
–
–
12.3
MHz
SRPOWER_UP
Maximum frequency of signal on row input or
row output.
Power supply slew rate
–
–
250
V/ms
tPOWERUP
Time from end of POR to CPU executing code
–
16
100
ms
tjit_IMO
24-MHz IMO cycle-to-cycle jitter (RMS)[20]
24-MHz IMO long term N cycle-to-cycle jitter
(RMS)[20]
24-MHz IMO period jitter (RMS)[20]
–
–
200
300
700
900
ps
ps
–
100
400
ps
Notes
Trimmed for 5 V or 3.3 V
operation using factory trim
values. See Figure 14 on
page 18. SLIMO mode = 0
Trimmed for 5 V or 3.3 V
operation using factory trim
values. See Figure 14 on
page 18. SLIMO mode = 1
24 MHz only for
SLIMO mode = 0
SLIMO mode = 0
Refer to AC Digital Block
Specifications on page 28
After a reset and before the
M8C starts to run, the ILO is
not trimmed. See the system
resets section of the PSoC
Technical Reference Manual
for details on this timing
Trimmed. Using factory trim
values
VDD slew rate during
power-up
Power-up from 0 V. See the
System Resets section of the
PSoC Technical Reference
Manual
N = 32
Notes
17. 4.75 V < VDD < 5.25 V.
18. 3.0 V < VDD < 3.6 V. See application note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation
at 3.3 V.
19. See the individual user module datasheets for information on maximum frequencies for user modules.
20. Refer to Cypress Jitter Specifications Application Note AN5054 “Understanding Datasheet Jitter Specifications for Cypress Timing Products” at
www.cypress.com under Application Notes for more information.
Document Number: 38-12025 Rev. *X
Page 25 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Table 22. 2.7-V AC Chip-Level Specifications
Symbol
FIMO12
Description
IMO frequency for 12 MHz
Min
11.5
Typ
120
Max
12.7[21,22]
Units
MHz
FIMO6
IMO frequency for 6 MHz
5.5
6
6.5[21,22]
MHz
FCPU1
CPU frequency (2.7 V nominal)
0.093
3
3.15[21]
MHz
FBLK27
Digital PSoC block frequency (2.7 V nominal)
0
12
12.5[21,22]
MHz
F32K1
F32K_U
ILO frequency
ILO untrimmed frequency
8
5
32
–
96
100
kHz
kHz
tXRST
DCILO
FMAX
10
20
–
–
50
–
–
80
12.3
µs
%
MHz
SRPOWER_UP
External reset pulse width
IILO duty cycle
Maximum frequency of signal on row input or
row output.
Power supply slew rate
–
–
250
V/ms
tPOWERUP
Time from end of POR to CPU executing code
–
16
100
ms
tjit_IMO
12 MHz IMO cycle-to-cycle jitter (RMS)[23]
12 MHz IMO long term N cycle-to-cycle jitter
(RMS)[23]
12 MHz IMO period jitter (RMS)[23]
–
–
400
600
1000
1300
ps
ps
–
100
500
ps
Notes
Trimmed for 2.7 V operation
using factory trim values. See
Figure 14 on page 18. SLIMO
mode = 1
Trimmed for 2.7 V operation
using factory trim values. See
Figure 14 on page 18. SLIMO
mode = 1
12 MHz only for
SLIMO mode = 0
Refer to AC Digital Block
Specifications on page 28
After a reset and before the
M8C starts to run, the ILO is
not trimmed. See the System
Resets section of the PSoC
Technical Reference Manual
for details on this timing
VDD slew rate during
power-up
Power-up from 0 V. See the
System Resets section of the
PSoC Technical Reference
Manual.
N = 32
Notes
21. 2.4 V < VDD < 3.0 V.
22. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” available at http://www.cypress.com for information on
maximum frequency for user modules.
23. Refer to Cypress Jitter Specifications Application Note AN5054 “Understanding Datasheet Jitter Specifications for Cypress Timing Products” at
www.cypress.com under Application Notes for more information.
Document Number: 38-12025 Rev. *X
Page 26 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
AC General Purpose I/O Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively.
Typical parameters are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 23. 5-V and 3.3-V AC GPIO Specifications
Symbol
FGPIO
TRiseF
TFallF
TRiseS
TFallS
Description
GPIO operating frequency
Rise time, normal strong mode, Cload = 50 pF
Fall time, normal strong mode, Cload = 50 pF
Rise time, slow strong mode, Cload = 50 pF
Fall time, slow strong mode, Cload = 50 pF
Min
0
3
2
7
7
Typ
–
–
–
27
22
Max
12
18
18
–
–
Units
MHz
ns
ns
ns
ns
Notes
Normal strong mode
VDD = 4.5 to 5.25 V, 10% to 90%
VDD = 4.5 to 5.25 V, 10% to 90%
VDD = 3 to 5.25 V, 10% to 90%
VDD = 3 to 5.25 V, 10% to 90%
Min
0
6
6
18
18
Typ
–
–
–
40
40
Max
3
50
50
120
120
Units
MHz
ns
ns
ns
ns
Notes
Normal strong mode
VDD = 2.4 to 3.0 V, 10% to 90%
VDD = 2.4 to 3.0 V, 10% to 90%
VDD = 2.4 to 3.0 V, 10% to 90%
VDD = 2.4 to 3.0 V, 10% to 90%
Table 24. 2.7 V AC GPIO Specifications
Symbol
FGPIO
TRiseF
TFallF
TRiseS
TFallS
Description
GPIO operating frequency
Rise time, normal strong mode, Cload = 50 pF
Fall time, normal strong mode, Cload = 50 pF
Rise time, slow strong mode, Cload = 50 pF
Fall time, slow strong mode, Cload = 50 pF
Figure 13. GPIO Timing Diagram
90%
GPIO
Pin
Output
Voltage
10%
TRiseF
TRiseS
TFallF
TFallS
AC Operational Amplifier Specifications
Table 25 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively. Typical parameters
are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 25. AC Operational Amplifier Specifications
Symbol
TCOMP
Description
Comparator mode response time, 50 mV
overdrive
Document Number: 38-12025 Rev. *X
Min
–
Typ
–
Max
100
200
Units
ns
ns
Notes
VDD ≥ 3.0 V
2.4 V < VDD < 3.0 V
Page 27 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
AC Digital Block Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively.
Typical parameters are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 26. 5-V and 3.3-V AC Digital Block Specifications
Function
All functions
Timer
Description
Min
Typ
Max
Unit
VDD ≥ 4.75 V
–
–
49.2
MHz
VDD < 4.75 V
–
–
24.6
MHz
No capture, VDD ≥ 4.75 V
–
–
49.2
MHz
No capture, VDD < 4.75 V
–
–
24.6
MHz
With capture
–
–
24.6
MHz
50[24]
–
–
ns
No enable input, VDD ≥ 4.75 V
–
–
49.2
MHz
No enable input, VDD < 4.75 V
–
–
24.6
MHz
With enable input
–
–
24.6
MHz
50[24]
–
–
ns
20
Input clock frequency
Capture pulse width
Counter
Input clock frequency
Enable input pulse width
Dead Band
Notes
Block input clock frequency
Kill pulse width
Asynchronous restart mode
–
–
ns
Synchronous restart mode
[24]
50
–
–
ns
Disable mode
50[24]
–
–
ns
VDD ≥ 4.75 V
–
–
49.2
MHz
VDD < 4.75 V
–
–
24.6
MHz
VDD ≥ 4.75 V
–
–
49.2
MHz
VDD < 4.75 V
–
–
24.6
MHz
Input clock frequency
CRCPRS
(PRS
Mode)
Input clock frequency
CRCPRS
(CRC
Mode)
Input clock frequency
–
–
24.6
MHz
SPIM
Input clock frequency
–
–
8.2
MHz
The SPI serial clock (SCLK) frequency is equal to
the input clock frequency divided by 2.
SPIS
Input clock (SCLK) frequency
–
–
4.1
MHz
The input clock is the SPI SCLK in SPIS mode.
Width of SS_negated between
transmissions
50[24]
–
–
ns
VDD ≥ 4.75 V, 2 stop bits
–
–
49.2
MHz
VDD ≥ 4.75 V, 1 stop bit
–
–
24.6
MHz
VDD < 4.75 V
–
–
24.6
MHz
Transmitter
Receiver
Input clock frequency
Input clock frequency
The baud rate is equal to the input clock frequency
divided by 8.
The baud rate is equal to the input clock frequency
divided by 8.
VDD ≥ 4.75 V, 2 stop bits
–
–
49.2
MHz
VDD ≥ 4.75 V, 1 stop bit
–
–
24.6
MHz
VDD < 4.75 V
–
–
24.6
MHz
Note
24. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
Document Number: 38-12025 Rev. *X
Page 28 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Table 27. 2.7-V AC Digital Block Specifications
Function
Description
All
functions
Block input clock frequency
Timer
Capture pulse width
Input clock frequency, with or without capture
Counter
Typ
Max
Units
Notes
–
–
12.7
MHz
2.4 V < VDD < 3.0 V
100[25]
–
–
ns
–
–
12.7
MHz
100
–
–
ns
Input clock frequency, no enable input
–
–
12.7
MHz
Input clock frequency, enable input
–
–
12.7
MHz
Asynchronous restart mode
20
–
–
ns
Synchronous restart mode
100
–
–
ns
Disable mode
100
–
–
ns
Input clock frequency
–
–
12.7
MHz
CRCPRS
(PRS Mode)
Input clock frequency
–
–
12.7
MHz
CRCPRS
(CRC Mode)
Input clock frequency
–
–
12.7
MHz
SPIM
Input clock frequency
–
–
6.35
MHz
SPIS
Input clock (SCLK) frequency
–
–
4.1
MHz
Dead Band
Enable input pulse width
Min
Kill pulse width:
Width of SS_ Negated between transmissions
The SPI serial clock (SCLK)
frequency is equal to the input
clock frequency divided by 2.
100
–
–
ns
Transmitter
Input clock frequency
–
–
12.7
MHz
The baud rate is equal to the input
clock frequency divided by 8.
Receiver
Input clock frequency
–
–
12.7
MHz
The baud rate is equal to the input
clock frequency divided by 8.
AC External Clock Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ TA ≤ 85 °C, or 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, respectively. Typical parameters are measured at 5 V,
3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 28. 5-V AC External Clock Specifications
Min
Typ
Max
Units
FOSCEXT
Symbol
Frequency
Description
0.093
–
24.6
MHz
–
High period
20.6
–
5300
ns
–
Low period
20.6
–
–
ns
–
Power-up IMO to switch
150
–
–
µs
Notes
Note
25. 100 ns minimum input pulse width is based on the input synchronizers running at 12 MHz (84 ns nominal period).
Document Number: 38-12025 Rev. *X
Page 29 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Table 29. 3.3-V AC External Clock Specifications
Min
Typ
Max
Units
Notes
FOSCEXT
Symbol
Frequency with CPU clock divide by 1
Description
0.093
–
12.3
MHz
Maximum CPU frequency is 12 MHz
at 3.3 V. With the CPU clock divider
set to 1, the external clock must
adhere to the maximum frequency
and duty cycle requirements
FOSCEXT
Frequency with CPU clock divide by 2 or
greater
0.186
–
24.6
MHz
If the frequency of the external clock
is greater than 12 MHz, the CPU clock
divider must be set to 2 or greater. In
this case, the CPU clock divider
ensures that the fifty percent duty
cycle requirement is met
–
High period with CPU clock divide by 1
41.7
–
5300
ns
–
Low period with CPU clock divide by 1
41.7
–
–
ns
–
Power-up IMO to switch
150
–
–
µs
Min
Typ
Max
Units
Notes
0
Table 30. 2.7-V AC External Clock Specifications
Symbol
Description
FOSCEXT
Frequency with CPU clock divide by 1
0.093
–
3.08
MHz
Maximum CPU frequency is 3 MHz at
2.7 V. With the CPU clock divider set
to 1, the external clock must adhere to
the maximum frequency and duty
cycle requirements
FOSCEXT
Frequency with CPU clock divide
by 2 or greater
0.186
–
6.35
MHz
If the frequency of the external clock
is greater than 3 MHz, the CPU clock
divider must be set to 2 or greater. In
this case, the CPU clock divider
ensures that the fifty percent duty
cycle requirement is met
–
High period with CPU clock divide by 1
160
–
5300
ns
–
Low period with CPU clock divide by 1
160
–
–
ns
–
Power-up IMO to switch
150
–
–
µs
Document Number: 38-12025 Rev. *X
Page 30 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
AC Programming Specifications
Table 31 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C ≤ TA ≤ 85 °C, or 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, respectively. Typical parameters are measured at 5 V, 3.3 V, or 2.7 V
at 25 °C and are for design guidance only.
Table 31. AC Programming Specifications
Symbol
TRSCLK
TFSCLK
TSSCLK
THSCLK
FSCLK
TERASEB
TWRITE
TDSCLK
TDSCLK3
TDSCLK2
TERASEALL
Description
Rise time of SCLK
Fall time of SCLK
Data setup time to falling edge of SCLK
Data hold time from falling edge of SCLK
Frequency of SCLK
Flash erase time (block)
Flash block write time
Data out delay from falling edge of SCLK
Data out delay from falling edge of SCLK
Data out delay from falling edge of SCLK
Flash erase time (Bulk)
Min
1
1
40
40
0
–
–
–
–
–
–
Typ
–
–
–
–
–
10
40
–
–
–
20
Max
20
20
–
–
8
–
–
45
50
70
–
Units
ns
ns
ns
ns
MHz
ms
ms
ns
ns
ns
ms
TPROGRAM_HOT
TPROGRAM_COLD
Flash block erase + flash block write time
Flash block erase + flash block write time
–
–
–
–
100[26]
200[26]
ms
ms
Notes
3.6 < VDD
3.0 ≤ VDD ≤ 3.6
2.4 ≤ VDD ≤ 3.0
Erase all blocks and protection
fields at once
0 °C ≤ Tj ≤ 100 °C
–40 °C ≤ Tj ≤ 0 °C
AC I2C Specifications
The following tables list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C ≤ TA ≤ 85 °C, 3.0 V to 3.6 V and –40 °C ≤ TA ≤ 85 °C, or 2.4 V to 3.0 V and –40 °C ≤ TA ≤ 85 °C, respectively.
Typical parameters are measured at 5 V, 3.3 V, or 2.7 V at 25 °C and are for design guidance only.
Table 32. AC Characteristics of the I2C SDA and SCL Pins for VDD ≥ 3.0 V
Symbol
FSCLI2C
THDSTAI2C
TLOWI2C
THIGHI2C
TSUSTAI2C
THDDATI2C
TSUDATI2C
TSUSTOI2C
TBUFI2C
TSPI2C
Description
SCL clock frequency
Hold time (repeated) start condition. After this
period, the first clock pulse is generated
Low period of the SCL clock
High period of the SCL clock
Setup time for a repeated start condition
Data hold time
Data setup time
Setup time for stop condition
Bus free time between a stop and start condition
Pulse width of spikes suppressed by the input
filter.
Standard Mode
Min
Max
0
100
4.0
–
4.7
4.0
4.7
0
250
4.0
4.7
–
–
–
–
–
–
–
–
–
Fast Mode
Min
Max
0
400
0.6
–
1.3
0.6
0.6
0
100[27]
0.6
1.3
0
–
–
–
–
–
–
–
50
Units
kHz
µs
µs
µs
µs
µs
ns
µs
µs
ns
Notes
26. For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing.
Refer to the Flash APIs application note AN2015 (Design Aids - Reading and Writing PSoC® Flash) for more information.
27. A Fast-Mode I2C-bus device may be used in a Standard-Mode I2C-bus system, but it must meet the requirement TSU;DAT ≥ 250 ns. This is automatically the case if
the device does not stretch the LOW period of the SCL signal. If the device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA
line Trmax + TSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Document Number: 38-12025 Rev. *X
Page 31 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Table 33. 2.7-V AC Characteristics of the I2C SDA and SCL Pins (Fast Mode not Supported)
Symbol
FSCLI2C
THDSTAI2C
TLOWI2C
THIGHI2C
TSUSTAI2C
THDDATI2C
TSUDATI2C
TSUSTOI2C
TBUFI2C
TSPI2C
Description
SCL clock frequency
Hold time (repeated) start condition. After this
period, the first clock pulse is generated.
Low period of the SCL clock
High period of the SCL clock
Setup time for a repeated start condition
Data hold time
Data setup time
Setup time for stop condition
Bus free time between a stop and start
condition
Pulse width of spikes are suppressed by the
input filter.
Standard Mode
Min
Max
0
100
4.0
–
Fast Mode
Min
–
–
Max
–
–
Units
kHz
µs
4.7
4.0
4.7
0
250
4.0
4.7
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
µs
µs
µs
µs
ns
µs
µs
–
–
–
–
ns
Figure 14. Definition for Timing for Fast/Standard Mode on the I2C Bus
I2C_SDA
TSUDATI2C
THDSTAI2C
TSPI2C
THDDATI2CTSUSTAI2C
TBUFI2C
I2C_SCL
THIGHI2C TLOWI2C
S
START Condition
Document Number: 38-12025 Rev. *X
TSUSTOI2C
Sr
Repeated START Condition
P
S
STOP Condition
Page 32 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Packaging Information
This section shows the packaging specifications for the CY8C21x34 PSoC device with the thermal impedances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of
the emulation tools' dimensions, refer to the emulator pod drawings at http://www.cypress.com.
Figure 15. 16-Pin (150-Mil) SOIC
51-85068 *D
Document Number: 38-12025 Rev. *X
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CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Figure 16. 20-Pin (210-Mil) SSOP
51-85077 *E
Figure 17. 28-Pin (210-Mil) SSOP
51-85079 *E
Document Number: 38-12025 Rev. *X
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CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Figure 18. 32-Pin (5 × 5 mm 1.0 Max) Sawn QFN
001-30999 *C
Important Note For information on the preferred dimensions for mounting QFN packages, see the Application Notes for Surface
Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages available at http://www.amkor.com.
Document Number: 38-12025 Rev. *X
Page 35 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
0.400±0.100
PIN 1 I.D
Figure 19. 32-Pin (5 × 5 × 0.4 mm) QFN (Sawn 1.85 × 2.85) EPAD
0.500
0.064
0.25±0.040
0.10 MIN
1
24
PIN#1 (LASER MARKED)
32
25
-0.090
2.85±0.10
PAD
EXPOSED
9
16
8
17
SOLDERABLE
0.400
0.15max
1.85±0.10
TOP VIEW
0.300 MIN
BOTTOM VIEW
BARE COOPER
NOTES:
1. HATCH AREA IS SOLDERABLE EXPOSED PAD.
0.064
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. REFERENCE JEDEC #: MO-220
0.127
001-44368 *B
4. MAXIMUM ALLOWABLE METAL IS 0.0508mm
Figure 20. 32-Pin Thin Sawn QFN Package
001-48913 *B
Document Number: 38-12025 Rev. *X
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CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Figure 21. 56-Pin (300-Mil) SSOP
51-85062 *E
Thermal Impedances
Table 34. Thermal Impedances per Package
Typical θJA [28]
123 °C/W
117 °C/W
96 °C/W
27 °C/W
22 °C/W
48 °C/W
Package
16-Pin SOIC
20-Pin SSOP
28-Pin SSOP
32-Pin QFN[29] 5 × 5 mm 0.60 Max
32-Pin QFN[29] 5 × 5 mm 1.00 Max
56-Pin SSOP
Typical θJC
55 °C/W
41 °C/W
39 °C/W
15 °C/W
12 °C/W
24 °C/W
Solder Reflow Specifications
Table 35 shows the solder reflow temperature limits that must not be exceeded.
Table 35. Solder Reflow Specifications
Package
Maximum Peak Temperature (TC)
Maximum Time above TC – 5 °C
16-Pin SOIC
260 °C
30 seconds
20-Pin SSOP
260 °C
30 seconds
28-Pin SSOP
260 °C
30 seconds
32-Pin QFN
260 °C
30 seconds
56-Pin SSOP
260 °C
30 seconds
Notes
28. TJ = TA + Power × θJA
29. To achieve the thermal impedance specified for the QFN package, refer to Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF)
Packages available at http://www.amkor.com.
30. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5 °C with Sn-Pb or 245 ± 5 °C with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications.
Document Number: 38-12025 Rev. *X
Page 37 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Development Tool Selection
This section presents the development tools available for all
current PSoC device families including the CY8C21x34 family.
Evaluation Tools
Software
All evaluation tools can be purchased from the Cypress Online
Store.
PSoC Designer™
CY3210-MiniProg1
At the core of the PSoC development software suite is
PSoC Designer, used to generate PSoC firmware applications.
PSoC Designer is available free of charge at
http://www.cypress.com and includes a free C compiler.
The CY3210-MiniProg1 kit allows you to program PSoC devices
through the MiniProg1 programming unit. The MiniProg is a
small, compact prototyping programmer that connects to the PC
through a provided USB 2.0 cable. The kit includes:
■
MiniProg programming unit
■
MiniEval socket programming and evaluation board
■
28-Pin CY8C29466-24PXI PDIP PSoC device sample
■
28-Pin CY8C27443-24PXI PDIP PSoC device sample
■
PSoC Designer software CD
■
Getting Started guide
Development Kits
■
USB 2.0 cable
All development kits can be purchased from the Cypress Online
Store.
CY3210-PSoCEval1
PSoC Programmer
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or operates
directly from PSoC Designer. PSoC Programmer software is
compatible with both PSoC ICE-Cube In-Circuit Emulator and
PSoC MiniProg. PSoC programmer is available free of charge at
http://www.cypress.com.
CY3215-DK Basic Development Kit
The CY3215-DK is for prototyping and development with
PSoC Designer. This kit supports in-circuit emulation, and the
software interface allows you to run, halt, and single step the
processor, and view the content of specific memory locations.
Advance emulation features also supported through PSoC
Designer. The kit includes:
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit
includes:
■
Evaluation board with LCD module
■
MiniProg programming unit
■
PSoC Designer software CD
■
Two 28-Pin CY8C29466-24PXI PDIP PSoC device samples
■
ICE-Cube in-circuit emulator
■
PSoC Designer software CD
■
ICE Flex-Pod for CY8C29x66 family
■
Getting Started guide
■
Cat-5 adapter
■
USB 2.0 cable
■
Mini-Eval programming board
CY3214-PSoCEvalUSB
■
110 ~ 240 V power supply, Euro-Plug adapter
■
iMAGEcraft C compiler
■
ISSP cable
■
USB 2.0 cable and Blue Cat-5 cable
■
Two CY8C29466-24PXI 28-PDIP chip samples
The CY3214-PSoCEvalUSB evaluation kit features a
development board for the CY8C24794-24LFXI PSoC device.
The board includes both USB and capacitive sensing
development and debugging support. This evaluation board also
includes an LCD module, potentiometer, LEDs, an enunciator
and plenty of breadboarding space to meet all of your evaluation
needs. The kit includes:
Document Number: 38-12025 Rev. *X
■
PSoCEvalUSB board
■
LCD module
■
MIniProg programming unit
■
Mini USB cable
■
PSoC Designer and example projects CD
■
Getting Started guide
■
Wire pack
Page 38 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Device Programmers
All device programmers can be purchased from the Cypress Online Store.
CY3216 Modular Programmer
CY3207ISSP In-System Serial Programmer (ISSP)
The CY3216 Modular Programmer kit features a modular
programmer and the MiniProg1 programming unit. The modular
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
The CY3207ISSP is a production programmer. It includes
protection circuitry and an industrial case that is more robust than
the MiniProg in a production-programming environment.
■
Modular programmer base
Note CY3207ISSP needs special software and is not compatible
with PSoC Programmer. The kit includes:
■
Three programming module cards
■
CY3207 programmer unit
■
MiniProg programming unit
■
PSoC ISSP software CD
■
PSoC Designer software CD
■
110 ~ 240 V power supply, Euro-Plug adapter
■
Getting Started guide
■
USB 2.0 cable
■
USB 2.0 cable
Accessories (Emulation and Programming)
Table 36. Emulation and Programming Accessories
Part Number
Pin Package
Flex-Pod Kit[31]
Foot Kit[32]
CY8C21234-24SXI
16-Pin SOIC
CY3250-21X34
CY3250-16SOIC-FK
CY8C21334-24PVXI
20-Pin SSOP
CY3250-21X34
CY3250-20SSOP-FK
CY8C21534-24PVXI
28-Pin SSOP
CY3250-21X34
CY3250-28SSOP-FK
Adapter
Adapters can be found at
http://www.emulation.com.
Notes
31. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods.
32. Foot kit includes surface mount feet that can be soldered to the target PCB.
Document Number: 38-12025 Rev. *X
Page 39 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
SRAM
(Bytes)
Switch Mode
Pump
Temperature
Range
Digital
Blocks
Analog
Blocks
Digital I/O
Pins
Analog
Inputs
Analog
Outputs
XRES Pin
16-Pin (150-Mil) SOIC
CY8C21234-24SXI
8K
512
Yes
–40 °C to +85 °C
4
4
12
12[33]
0
No
16-Pin (150-Mil) SOIC
(Tape and Reel)
CY8C21234-24SXIT
8K
512
Yes
–40 °C to +85 °C
4
4
12
12[33]
0
No
20-Pin (210-Mil) SSOP
CY8C21334-24PVXI
8K
512
No
–40 °C to +85 °C
4
4
16
16[33]
0
Yes
[33]
0
Yes
Package
Ordering
Code
Flash
(Bytes)
Ordering Information
20-Pin (210-Mil) SSOP
(Tape and Reel)
CY8C21334-24PVXIT
8K
512
No
–40 °C to +85 °C
4
4
16
16
28-Pin (210-Mil) SSOP
CY8C21534-24PVXI
8K
512
No
–40 °C to +85 °C
4
4
24
24[33]
0
Yes
[33]
0
Yes
28-Pin (210-Mil) SSOP
(Tape and Reel)
CY8C21534-24PVXIT
8K
512
No
–40 °C to +85 °C
4
4
24
24
32-Pin (5 × 5 mm 1.00 max)
Sawn QFN
CY8C21434-24LTXI
8K
512
No
–40 °C to +85 °C
4
4
28
28[33]
0
Yes
32-Pin (5 × 5 mm 1.00 max)
CY8C21434-24LTXIT
Sawn QFN [34] (Tape and Reel)
8K
512
No
–40 °C to +85 °C
4
4
28
28[33]
0
Yes
32-Pin (5 × 5 mm 0.60 max)
Thin Sawn QFN
CY8C21434-24LQXI
8K
512
No
–40 °C to +85 °C
4
4
28
28[33]
0
Yes
32-Pin (5 × 5 mm 0.60 max)
Thin Sawn QFN
(Tape and Reel)
CY8C21434-24LQXIT
8K
512
No
–40 °C to +85 °C
4
4
28
28[33]
0
Yes
32-Pin (5 × 5 mm 1.00 max)
Sawn QFN [34]
CY8C21634-24LTXI
8K
512
Yes
–40 °C to +85 °C
4
4
26
26[33]
0
Yes
32-Pin (5 × 5 mm 1.00 max)
Sawn QFN [34]
(Tape and Reel)
CY8C21634-24LTXIT
8K
512
Yes
–40 °C to +85 °C
4
4
26
26[33]
0
Yes
56-Pin OCD SSOP
CY8C21001-24PVXI
8K
512
Yes
–40 °C to +85 °C
4
4
26
26[33]
0
Yes
Note For Die sales information, contact a local Cypress sales office or Field Applications Engineer (FAE).
Notes
33. All Digital I/O Pins also connect to the common analog mux.
34. Refer to the section 32-Pin Part Pinout on page 11 for pin differences.
Document Number: 38-12025 Rev. *X
Page 40 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Ordering Code Definitions
CY 8 C 21 xxx -24 xx
Package Type:
Thermal Rating:
PX = PDIP Pb-free
C = Commercial
SX = SOIC Pb-free
I = Industrial
PVX = SSOP Pb-free
E = Extended
LFX/LKX/LTX/LCX/LQX = QFN Pb-free
Speed: 24 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress PSoC
Company ID: CY = Cypress
Document Number: 38-12025 Rev. *X
Page 41 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Acronyms
Table 37 lists the acronyms that are used in this document.
Table 37. Acronyms Used in this Datasheet
Acronym
AC
Description
Acronym
Description
alternating current
MIPS
million instructions per second
ADC
analog-to-digital converter
OCD
on-chip debug
API
application programming interface
PCB
printed circuit board
CMOS
complementary metal oxide semiconductor
PDIP
plastic dual-in-line package
CPU
central processing unit
PGA
programmable gain amplifier
CRC
cyclic redundancy check
PLL
phase-locked loop
continuous time
POR
power on reset
CT
DAC
DC
digital-to-analog converter
direct current
PPOR
PRS
precision power on reset
pseudo-random sequence
DTMF
dual-tone multi-frequency
PSoC®
ECO
external crystal oscillator
PWM
pulse width modulator
electrically erasable programmable read-only
memory
QFN
quad flat no leads
general purpose I/O
RTC
real time clock
in-circuit emulator
SAR
successive approximation
EEPROM
GPIO
ICE
IDE
integrated development environment
ILO
internal low speed oscillator
SC
SLIMO
Programmable System-on-Chip
switched capacitor
slow IMO
IMO
internal main oscillator
SMP
switch-mode pump
I/O
input/output
SOIC
small-outline integrated circuit
IrDA
infrared data association
SPITM
serial peripheral interface
ISSP
in-system serial programming
SRAM
static random access memory
LCD
liquid crystal display
SROM
supervisory read only memory
LED
light-emitting diode
SSOP
shrink small-outline package
LPC
low power comparator
UART
LVD
low voltage detect
MAC
MCU
universal asynchronous receiver / transmitter
USB
universal serial bus
multiply-accumulate
WDT
watchdog timer
microcontroller unit
XRES
external reset
Reference Documents
CY8CPLC20, CY8CLED16P01, CY8C29x66, CY8C27x43, CY8C24x94, CY8C24x23, CY8C24x23A, CY8C22x13, CY8C21x34,
CY8C21x23, CY7C64215, CY7C603xx, CY8CNP1xx, and CYWUSB6953 PSoC® Programmable System-on-Chip Technical
Reference Manual (TRM) (001-14463)
Design Aids – Reading and Writing PSoC® Flash - AN2015 (001-40459)
Adjusting PSoC® Trims for 3.3 V and 2.7 V Operation – AN2012 (001-17397)
Understanding Datasheet Jitter Specifications for Cypress Timing Products – AN5054 (001-14503)
Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages – available at http://www.amkor.com.
Document Number: 38-12025 Rev. *X
Page 42 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Document Conventions
Units of Measure
Table 38 lists the units of measures.
Table 38. Units of Measure
Symbol
Unit of Measure
Symbol
µH
Unit of Measure
kB
1024 bytes
micro henry
dB
decibels
µs
microsecond
°C
degree Celsius
ms
millisecond
µF
microfarad
ns
nanosecond
fF
femto farad
ps
picosecond
pF
picofarad
µV
microvolt
kHz
kilohertz
mV
millivolts
MHz
megahertz
mVpp
rt-Hz
root hertz
nV
nano volt
millivolts peak-to-peak
kΩ
kilo ohm
V
volt
Ω
ohm
µW
microwatt
W
watt
µA
microampere
mA
milliampere
mm
nA
nano ampere
ppm
pA
pico ampere
%
mH
millihenry
millimeter
parts per million
percent
Numeric Conventions
Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’).
Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended
lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’ or ‘b’ are decimals.
Glossary
active high
1. A logic signal having its asserted state as the logic 1 state.
2. A logic signal having the logic 1 state as the higher voltage of the two states.
analog blocks
The basic programmable opamp circuits. These are SC (switched capacitor) and CT (continuous
time) blocks. These blocks can be interconnected to provide ADCs, DACs, multi-pole filters, gain
stages, and much more.
analog-to-digital
(ADC)
A device that changes an analog signal to a digital signal of corresponding magnitude. Typically,
an ADC converts a voltage to a digital number. The digital-to-analog (DAC) converter performs
the reverse operation.
Application
programming
interface (API)
A series of software routines that comprise an interface between a computer application and
lower level services and functions (for example, user modules and libraries). APIs serve as
building blocks for programmers that create software applications.
asynchronous
A signal whose data is acknowledged or acted upon immediately, irrespective of any clock signal.
bandgap
reference
A stable voltage reference design that matches the positive temperature coefficient of VT with
the negative temperature coefficient of VBE, to produce a zero temperature coefficient (ideally)
reference.
Document Number: 38-12025 Rev. *X
Page 43 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Glossary (continued)
bandwidth
1. The frequency range of a message or information processing system measured in hertz.
2. The width of the spectral region over which an amplifier (or absorber) has substantial gain (or
loss); it is sometimes represented more specifically as, for example, full width at half maximum.
bias
1. A systematic deviation of a value from a reference value.
2. The amount by which the average of a set of values departs from a reference value.
3. The electrical, mechanical, magnetic, or other force (field) applied to a device to establish a
reference level to operate the device.
block
1. A functional unit that performs a single function, such as an oscillator.
2. A functional unit that may be configured to perform one of several functions, such as a digital
PSoC block or an analog PSoC block.
buffer
1. A storage area for data that is used to compensate for a speed difference, when transferring
data from one device to another. Usually refers to an area reserved for IO operations, into
which data is read, or from which data is written.
2. A portion of memory set aside to store data, often before it is sent to an external device or as
it is received from an external device.
3. An amplifier used to lower the output impedance of a system.
bus
1. A named connection of nets. Bundling nets together in a bus makes it easier to route nets
with similar routing patterns.
2. A set of signals performing a common function and carrying similar data. Typically represented
using vector notation; for example, address[7:0].
3. One or more conductors that serve as a common connection for a group of related devices.
clock
The device that generates a periodic signal with a fixed frequency and duty cycle. A clock is
sometimes used to synchronize different logic blocks.
comparator
An electronic circuit that produces an output voltage or current whenever two input levels simultaneously
satisfy predetermined amplitude requirements.
compiler
A program that translates a high level language, such as C, into machine language.
configuration
space
In PSoC devices, the register space accessed when the XIO bit, in the CPU_F register, is set to
‘1’.
crystal oscillator
An oscillator in which the frequency is controlled by a piezoelectric crystal. Typically a piezoelectric
crystal is less sensitive to ambient temperature than other circuit components.
cyclic redundancy A calculation used to detect errors in data communications, typically performed using a linear
check (CRC)
feedback shift register. Similar calculations may be used for a variety of other purposes such as
data compression.
data bus
A bi-directional set of signals used by a computer to convey information from a memory location
to the central processing unit and vice versa. More generally, a set of signals used to convey
data between digital functions.
debugger
A hardware and software system that allows you to analyze the operation of the system
under development. A debugger usually allows the developer to step through the firmware one
step at a time, set break points, and analyze memory.
dead band
A period of time when neither of two or more signals are in their active state or in transition.
Document Number: 38-12025 Rev. *X
Page 44 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Glossary (continued)
digital blocks
The 8-bit logic blocks that can act as a counter, timer, serial receiver, serial transmitter, CRC
generator, pseudo-random number generator, or SPI.
digital-to-analog
(DAC)
A device that changes a digital signal to an analog signal of corresponding magnitude. The analogto-digital (ADC) converter performs the reverse operation.
duty cycle
The relationship of a clock period high time to its low time, expressed as a percent.
emulator
Duplicates (provides an emulation of) the functions of one system with a different system, so that
the second system appears to behave like the first system.
External Reset
(XRES)
An active high signal that is driven into the PSoC device. It causes all operation of the CPU and
blocks to stop and return to a pre-defined state.
Flash
An electrically programmable and erasable, non-volatile technology that provides you the
programmability and data storage of EPROMs, plus in-system erasability. Non-volatile means
that the data is retained when power is OFF.
Flash block
The smallest amount of Flash ROM space that may be programmed at one time and the smallest
amount of Flash space that may be protected. A Flash block holds 64 bytes.
frequency
The number of cycles or events per unit of time, for a periodic function.
gain
The ratio of output current, voltage, or power to input current, voltage, or power, respectively.
Gain is usually expressed in dB.
I2C
A two-wire serial computer bus by Philips Semiconductors (now NXP Semiconductors). I2C is an
Inter-Integrated Circuit. It is used to connect low-speed peripherals in an embedded system. The
original system was created in the early 1980s as a battery control interface, but it was later used
as a simple internal bus system for building control electronics. I2C uses only two bi-directional
pins, clock and data, both running at +5V and pulled high with resistors. The bus operates at 100
kbits/second in standard mode and 400 kbits/second in fast mode.
ICE
The in-circuit emulator that allows you to test the project in a hardware environment, while
viewing the debugging device activity in a software environment (PSoC Designer).
input/output (I/O) A device that introduces data into or extracts data from a system.
interrupt
A suspension of a process, such as the execution of a computer program, caused by an event
external to that process, and performed in such a way that the process can be resumed.
interrupt service
routine (ISR)
A block of code that normal code execution is diverted to when the M8C receives a hardware
interrupt. Many interrupt sources may each exist with its own priority and individual ISR code
block. Each ISR code block ends with the RETI instruction, returning the device to the point in
the program where it left normal program execution.
jitter
1. A misplacement of the timing of a transition from its ideal position. A typical form of corruption that occurs on
serial data streams.
2. The abrupt and unwanted variations of one or more signal characteristics, such as the interval between
successive pulses, the amplitude of successive cycles, or the frequency or phase of successive cycles.
low-voltage detect A circuit that senses Vdd and provides an interrupt to the system when Vdd falls below a
(LVD)
selected threshold.
Document Number: 38-12025 Rev. *X
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CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Glossary (continued)
M8C
An 8-bit Harvard-architecture microprocessor. The microprocessor coordinates all activity inside
a PSoC by interfacing to the Flash, SRAM, and register space.
master device
A device that controls the timing for data exchanges between two devices. Or when devices are
cascaded in width, the master device is the one that controls the timing for data exchanges
between the cascaded devices and an external interface. The controlled device is called the
slave device.
microcontroller
An integrated circuit chip that is designed primarily for control systems and products. In addition
to a CPU, a microcontroller typically includes memory, timing circuits, and IO circuitry. The reason
for this is to permit the realization of a controller with a minimal quantity of chips, thus
achieving maximal possible miniaturization. This in turn, reduces the volume and the cost of
the controller. The microcontroller is normally not used for general-purpose computation as is a
microprocessor.
mixed-signal
The reference to a circuit containing both analog and digital techniques and components.
modulator
A device that imposes a signal on a carrier.
noise
1. A disturbance that affects a signal and that may distort the information carried by the signal.
2. The random variations of one or more characteristics of any entity such as voltage, current, or data.
oscillator
A circuit that may be crystal controlled and is used to generate a clock frequency.
parity
A technique for testing transmitting data. Typically, a binary digit is added to the data to make the
sum of all the digits of the binary data either always even (even parity) or always odd (odd parity).
Phase-locked
loop (PLL)
An electronic circuit that controls an oscillator so that it maintains a constant phase angle relative
to a reference signal.
pinouts
The pin number assignment: the relation between the logical inputs and outputs of the PSoC
device and their physical counterparts in the printed circuit board (PCB) package. Pinouts
involve pin numbers as a link between schematic and PCB design (both being computer generated
files) and may also involve pin names.
port
A group of pins, usually eight.
Power on reset
(POR)
A circuit that forces the PSoC device to reset when the voltage is below a pre-set level. This is
one type of hardware reset.
PSoC®
Cypress Semiconductor’s PSoC® is a registered trademark and Programmable System-onChip™ is a trademark of Cypress.
PSoC Designer™ The software for Cypress’ Programmable System-on-Chip technology.
pulse width
An output in the form of duty cycle which varies as a function of the applied measurand
modulator (PWM)
RAM
An acronym for random access memory. A data-storage device from which data can be read out
and new data can be written in.
register
A storage device with a specific capacity, such as a bit or byte.
reset
A means of bringing a system back to a know state. See hardware reset and software reset.
Document Number: 38-12025 Rev. *X
Page 46 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Glossary (continued)
ROM
An acronym for read only memory. A data-storage device from which data can be read out, but
new data cannot be written in.
serial
1. Pertaining to a process in which all events occur one after the other.
2. Pertaining to the sequential or consecutive occurrence of two or more related activities in a single device or
channel.
settling time
The time it takes for an output signal or value to stabilize after the input has changed from one
value to another.
shift register
A memory storage device that sequentially shifts a word either left or right to output a stream of
serial data.
slave device
A device that allows another device to control the timing for data exchanges between two
devices. Or when devices are cascaded in width, the slave device is the one that allows another
device to control the timing of data exchanges between the cascaded devices and an external
interface. The controlling device is called the master device.
SRAM
An acronym for static random access memory. A memory device where you can store and
retrieve data at a high rate of speed. The term static is used because, after a value is loaded into an SRAM cell,
it remains unchanged until it is explicitly altered or until power is removed from the device.
SROM
An acronym for supervisory read only memory. The SROM holds code that is used to boot the
device, calibrate circuitry, and perform Flash operations. The functions of the SROM may be
accessed in normal user code, operating from Flash.
stop bit
A signal following a character or block that prepares the receiving device to receive the next
character or block.
synchronous
1. A signal whose data is not acknowledged or acted upon until the next active edge of a clock signal.
2. A system whose operation is synchronized by a clock signal.
tri-state
A function whose output can adopt three states: 0, 1, and Z (high-impedance). The function does
not drive any value in the Z state and, in many respects, may be considered to be disconnected
from the rest of the circuit, allowing another output to drive the same net.
UART
A UART or universal asynchronous receiver-transmitter translates between parallel bits of data
and serial bits.
user modules
Pre-build, pre-tested hardware/firmware peripheral functions that take care of managing and
configuring the lower level Analog and Digital PSoC Blocks. User Modules also provide high
level API (Application Programming Interface) for the peripheral function.
user space
The bank 0 space of the register map. The registers in this bank are more likely to be modified
during normal program execution and not just during initialization. Registers in bank 1 are most
likely to be modified only during the initialization phase of the program.
VDD
A name for a power net meaning "voltage drain." The most positive power supply signal. Usually
5 V or 3.3 V.
VSS
A name for a power net meaning "voltage source." The most negative power supply signal.
watchdog timer
A timer that must be serviced periodically. If it is not serviced, the CPU resets after a specified
period of time.
Document Number: 38-12025 Rev. *X
Page 47 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Document History Page
Document Title: CY8C21234, CY8C21334, CY8C21434, CY8C21534, CY8C21634 PSoC® Programmable System-on-Chip™
Document Number: 38-12025
Revision
ECN
Orig. of
Change
Submission
Date
**
227340
HMT
See ECN
New silicon and document (Revision **).
*A
235992
SFV
See ECN
Updated Overview and Electrical Spec. chapters, along with revisions to the
24-Pin pinout part. Revised the register mapping tables. Added a SSOP
28-Pin part.
*B
248572
SFV
See ECN
Changed title to include all part #s. Changed 28-Pin SSOP from CY8C21434
to CY8C21534. Changed pin 9 on the 28-Pin SSOP from SMP pin to Vss pin.
Added SMP block to architecture diagram. Update Electrical Specifications.
Added another 32-Pin MLF part: CY8C21634.
*C
277832
HMT
See ECN
Verify datasheet standards from SFV memo. Add Analog Input Mux to applicable pin outs. Update PSoC Characteristics table. Update diagrams and
specs. Final.
*D
285293
HMT
See ECN
Update 2.7 V DC GPIO spec. Add Reflow Peak Temp. table.
*E
301739
HMT
See ECN
DC Chip-Level Specification changes. Update links to new CY.com Portal.
*F
329104
HMT
See ECN
Re-add pinout ISSP notation. Fix TMP register names. Clarify ADC feature.
Update Electrical Specifications. Update Reflow Peak Temp. table. Add 32
MLF E-PAD dimensions. Add ThetaJC to Thermal Impedance table. Fix
20-Pin package order number. Add CY logo. Update CY copyright.
*G
352736
HMT
See ECN
Add new color and logo. Add URL to preferred dimensions for mounting MLF
packages. Update Transmitter and Receiver AC Digital Block Electrical Specifications.
*H
390152
HMT
See ECN
Clarify MLF thermal pad connection info. Replace 16-Pin 300-MIL SOIC with
correct 150-MIL.
*I
413404
HMT
See ECN
Update 32-Pin QFN E-Pad dimensions and rev. *A. Update CY branding and
QFN convention.
*J
430185
HMT
See ECN
Add new 32-Pin 5x5 mm 0.60 thickness QFN package and diagram,
CY8C21434-24LKXI. Update thermal resistance data. Add 56-Pin SSOP
on-chip debug non-production part, CY8C21001-24PVXI. Update typical and
recommended Storage Temperature per industrial specs. Update copyright
and trademarks.
*K
677717
HMT
See ECN
Add CapSense SNR requirement reference. Add new Dev. Tool section. Add
CY8C20x34 to PSoC Device Characteristics table. Add Low Power
Comparator (LPC) AC/DC electrical spec. tables. Update rev. of 32-Lead (5x5
mm 0.60 MAX) QFN package diagram.
*L
2147847
UVS/PYRS
02/27/08
Added 32-Pin QFN Sawn pin diagram, package diagram, and ordering information.
*M
2273246
UVS/AESA
04/01/08
Added 32 pin thin sawn package diagram.
*N
2618124
OGNE/PYRS
12/09/08
Added Note in Ordering Information section.
Changed title from PSoC Mixed-Signal Array to PSoC
Programmable System-on-Chip
*O
2684145
SNV/AESA
04/06/2009
Updated 32-Pin Sawn QFN package dimension for CY8C21434-24LTXIT
Updated Getting Started, Development Tools, and Designing with PSoC
Designer Sections
*P
2693024
DPT/PYRS
04/16/2009
Updated 32-Pin Sawn QFN package diagram
*Q
2720594
BRW
06/22/09
Document Number: 38-12025 Rev. *X
Description of Change
Corrected ohm symbol and parenthesis in figure caption (Fig.25)
Removed references to mixed-sginal array from the text.
Updated Development Tools Selection section.
Page 48 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Document History Page (continued)
Document Title: CY8C21234, CY8C21334, CY8C21434, CY8C21534, CY8C21634 PSoC® Programmable System-on-Chip™
Document Number: 38-12025
Revision
ECN
Orig. of
Change
Submission
Date
Description of Change
*R
2762499
JVY
09/11/2009
Updated DC GPIO, AC Chip-Level, and AC Programming Specifications as
follows:
Modified FIMO6 and TWRITE specifications.
Replaced TRAMP (time) specification with SRPOWER_UP (slew rate)
specification.
Added note [11] to Flash Endurance specification.
Added IOH, IOL, DCILO, F32K_U, TPOWERUP, TERASEALL, TPROGRAM_HOT, and
TPROGRAM_COLD specifications.
*S
2900687
MAXK/NJF
03/30/2010
Updated The Analog Multiplexer System.
Updated Cypress website links.
Added TBAKETEMP and TBAKETIME parameters in Absolute Maximum Ratings.
Removed DC Low Power Comparator section.
Updated 5-V and 3.3-V AC Chip-Level Specifications.
Removed AC Low Power Comparator and AC Analog Mux Bus sections.
Updated note in Packaging Information and package diagrams.
Added 56 SSOP values for Thermal Impedances, Solder Reflow Specifications.
Removed Third Party Tools and Build a PSoC Emulator into your Board.
Updated Ordering Code Definitions.
Removed inactive parts from Ordering Information
Removed obsolete package spec 001-06392.
Updated links in Sales, Solutions, and Legal Information.
*T
2937578
VMAD
05/26/2010
Updated content to match current style guide and datasheet template.
No technical updates.
*U
3005573
NJF
09/02/10
Added PSoC Device Characteristics table .
Added DC I2C Specifications table.
Added F32K_U max limit.
Added Tjit_IMO specification, removed existing jitter specifications.
Updated Units of Measure, Acronyms, Glossary, and References sections.
Updated solder reflow specifications.
No specific changes were made to AC Digital Block Specifications table and
I2C Timing Diagram. They were updated for clearer understanding.
Template and styles update.
*V
3068269
ARVM
10/21/2010
Removed pruned parts CY8C21434-24LKXI and CY8C21434-24LKXIT from
Ordering Information.
*W
3281271
VMAD
08/23/2011
Under Table 25 on page 27 “Notes” section, the text “2.4 V < VCC < 3.0 V” is
changed to “2.4 V < VDD < 3.0 V”.
Updated Solder Reflow Specifications.
Changed package diagram from 51-85188 *D to 001-30999 *C for QFN32
package.
*X
3383568
GIR
10/05/2011
The text “Pin must be left floating” is included under Description of NC pin in
Table 6 on page 13.
Changed spec 001-30999 from 32-Pin (5 × 5 mm 0.93 Max) Sawn QFN to
32-Pin (5 × 5 mm 1.0 Max) Sawn QFN
Removed pruned parts CY8C21434-24LCXI and CY8C21434-24LCXIT from
the Ordering Information table.
Document Number: 38-12025 Rev. *X
Page 49 of 50
CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
Automotive
Clocks & Buffers
Interface
Lighting & Power Control
PSoC Solutions
cypress.com/go/automotive
cypress.com/go/clocks
psoc.cypress.com/solutions
cypress.com/go/interface
PSoC 1 | PSoC 3 | PSoC 5
cypress.com/go/powerpsoc
cypress.com/go/plc
Memory
Optical & Image Sensing
cypress.com/go/memory
cypress.com/go/image
PSoC
Touch Sensing
cypress.com/go/psoc
cypress.com/go/touch
USB Controllers
Wireless/RF
cypress.com/go/USB
cypress.com/go/wireless
© Cypress Semiconductor Corporation, 2004-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 38-12025 Rev. *X
Revised October 11, 2011
®
®
Page 50 of 50
PSoC Designer™ and Programmable System-on-Chip™ are trademarks and PSoC and CapSense are registered trademarks of Cypress Semiconductor Corporation.
Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided
that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors.
All products and company names mentioned in this document may be the trademarks of their respective holders.
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