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CY8C3866LTI-030T

CY8C3866LTI-030T

  • 厂商:

    CYPRESS(赛普拉斯)

  • 封装:

    VFQFN68

  • 描述:

    IC MCU 8BIT 64KB FLASH 68QFN

  • 详情介绍
  • 数据手册
  • 价格&库存
CY8C3866LTI-030T 数据手册
Please note that Cypress is an Infineon Technologies Company. The document following this cover page is marked as “Cypress” document as this is the company that originally developed the product. Please note that Infineon will continue to offer the product to new and existing customers as part of the Infineon product portfolio. Continuity of document content The fact that Infineon offers the following product as part of the Infineon product portfolio does not lead to any changes to this document. Future revisions will occur when appropriate, and any changes will be set out on the document history page. Continuity of ordering part numbers Infineon continues to support existing part numbers. Please continue to use the ordering part numbers listed in the datasheet for ordering. www.infineon.com PSoC® 3: CY8C38 Family Datasheet ® Programmable System-on-Chip (PSoC ) General Description PSoC® 3 is a true programmable embedded system-on-chip, integrating configurable analog and digital peripherals, memory, and a microcontroller on a single chip. The PSoC 3 architecture boosts performance through:  8051 core plus DMA controller and digital filter processor, at up to 67 MHz  Ultra low power with industry's widest voltage range  Programmable digital and analog peripherals enable custom functions  Flexible routing of any analog or digital peripheral function to any pin PSoC devices employ a highly configurable system-on-chip architecture for embedded control design. They integrate configurable analog and digital circuits, controlled by an on-chip microcontroller. A single PSoC device can integrate as many as 100 digital and analog peripheral functions, reducing design time, board space, power consumption, and system cost while improving system quality. Features  Operating characteristics  Analog peripherals Voltage range: 1.71 to 5.5 V, up to six power domains [1]  Temperature range (ambient) –40 to 85 °C  DC to 67-MHz operation  Power modes • Active mode 1.2 mA at 6 MHz, and 12 mA at 48 MHz • 1-µA sleep mode • 200-nA hibernate mode with RAM retention  Boost regulator from 0.5-V input up to 5-V output Configurable 8- to 20-bit delta-sigma ADC Up to four 8-bit DACs  Up to four comparators  Up to four opamps  Up to four programmable analog blocks, to create: • Programmable gain amplifier (PGA) • Transimpedance amplifier (TIA) • Mixer • Sample and hold circuit ®  CapSense support, up to 62 sensors  1.024 V ±0.1% internal voltage reference     Performance 8-bit 8051 CPU, 32 interrupt inputs 24-channel direct memory access (DMA) controller  24-bit 64-tap fixed-point digital filter processor (DFB)    Versatile I/O system 29 to 72 I/O pins – up to 62 general-purpose I/Os (GPIOs) Up to eight performance I/O (SIO) pins • 25 mA current sink • Programmable input threshold and output high voltages • Can act as a general-purpose comparator • Hot swap capability and overvoltage tolerance  Two USBIO pins that can be used as GPIOs  Route any digital or analog peripheral to any GPIO  LCD direct drive from any GPIO, up to 46 × 16 segments  CapSense support from any GPIO  1.2-V to 5.5-V interface voltages, up to four power domains   Memories  Up to 64 KB program flash, with cache and security features Up to 8 KB additional flash for error correcting code (ECC)  Up to 8 KB RAM  Up to 2 KB EEPROM    Digital peripherals Four 16-bit timer, counter, and PWM (TCPWM) blocks I2C, 1 Mbps bus speed  USB 2.0 certified Full-Speed (FS) 12 Mbps peripheral interface (TID#40770053) using internal oscillator[2]  Full CAN 2.0b, 16 Rx, 8 Tx buffers  16 to 24 universal digital blocks (UDB), programmable to create any number of functions: • 8-, 16-, 24-, and 32-bit timers, counters, and PWMs • I2C, UART, SPI, I2S, LIN 2.0 interfaces • Cyclic redundancy check (CRC) • Pseudo random sequence (PRS) generators • Quadrature decoders • Gate-level logic functions    Programming and debug JTAG (4-wire), serial wire debug (SWD) (2-wire), and single wire viewer (SWV) interfaces 2  Bootloader programming through I C, SPI, UART, USB, and other interfaces   Package options: 48-pin SSOP, 48-pin QFN, 68-pin QFN, 100-pin TQFP, and 72-pin WLCSP  Development support with free PSoC Creator™ tool  Programmable clocking Schematic and firmware design support Over 100 PSoC Components™ integrate multiple ICs and system interfaces into one PSoC. Components are free embedded ICs represented by icons. Drag and drop component icons to design systems in PSoC Creator.  Includes free Keil 8051 compiler  Supports device programming and debugging  3- to 62-MHz internal oscillator, 1% accuracy at 3 MHz  4- to 25-MHz external crystal oscillator  Internal PLL clock generation up to 67 MHz  Low-power internal oscillator at 1, 33, and 100 kHz  32.768-kHz external watch crystal oscillator  12 clock dividers routable to any peripheral or I/O   Notes 1. The maximum storage temperature is 150 °C in compliance with JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. This feature on select devices only. See Ordering Information on page 123 for details. Cypress Semiconductor Corporation Document Number: 001-11729 Rev. AH • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised December 3, 2019 PSoC® 3: CY8C38 Family Datasheet More Information Cypress provides a wealth of data at www.cypress.com to help you to select the right PSoC device for your design, and to help you to quickly and effectively integrate the device into your design. For a comprehensive list of resources, see the knowledge base article KBA86521, How to Design with PSoC 3, PSoC 4, and PSoC 5LP. Following is an abbreviated list for PSoC 3:  Overview: PSoC Portfolio, PSoC Roadmap  Product Selectors: PSoC 1, PSoC 3, PSoC 4, PSoC 5LP In addition, PSoC Creator includes a device selection tool.  Application notes: Cypress offers a large number of PSoC application notes and code examples covering a broad range of topics, from basic to advanced level. Recommended application notes for getting started with PSoC 3 are:  AN54181: Getting Started With PSoC 3  AN61290: Hardware Design Considerations  AN57821: Mixed Signal Circuit Board Layout  AN58304: Pin Selection for Analog Designs  AN81623: Digital Design Best Practices  AN73854: Introduction To Bootloaders  Development Kits: CY8CKIT-030 is designed for analog performance, for developing high-precision analog, low-power, and low-voltage applications.  CY8CKIT-001 provides a common development platform for any one of the PSoC 1, PSoC 3, PSoC 4, or PSoC 5LP families of devices.  The MiniProg3 device provides an interface for flash programming and debug.   Technical Reference Manuals (TRM) Architecture TRM Registers TRM  Programming Specification   PSoC Creator PSoC Creator is a free Windows-based Integrated Design Environment (IDE). It enables concurrent hardware and firmware design of PSoC 3, PSoC 4, and PSoC 5LP based systems. Create designs using classic, familiar schematic capture supported by over 100 pre-verified, production-ready PSoC Components; see the list of component datasheets. With PSoC Creator, you can: 1. Drag and drop component icons to build your hardware 3. Configure components using the configuration tools system design in the main design workspace 4. Explore the library of 100+ components 2. Codesign your application firmware with the PSoC hardware, 5. Review component datasheets using the PSoC Creator IDE C compiler Figure 1. Multiple-Sensor Example Project in PSoC Creator Document Number: 001-11729 Rev. AH Page 2 of 140 PSoC® 3: CY8C38 Family Datasheet Contents 1. Architectural Overview ..................................................... 4 2. Pinouts ............................................................................... 6 3. Pin Descriptions .............................................................. 12 4. CPU ................................................................................... 13 4.1 8051 CPU ................................................................. 13 4.2 Addressing Modes .................................................... 13 4.3 Instruction Set .......................................................... 14 4.4 DMA and PHUB ....................................................... 18 4.5 Interrupt Controller ................................................... 19 5. Memory ............................................................................. 23 5.1 Static RAM ............................................................... 23 5.2 Flash Program Memory ............................................ 23 5.3 Flash Security ........................................................... 23 5.4 EEPROM .................................................................. 23 5.5 Nonvolatile Latches (NVLs) ...................................... 24 5.6 External Memory Interface ....................................... 25 5.7 Memory Map ............................................................ 26 6. System Integration .......................................................... 28 6.1 Clocking System ....................................................... 28 6.2 Power System .......................................................... 31 6.3 Reset ........................................................................ 35 6.4 I/O System and Routing ........................................... 37 7. Digital Subsystem ........................................................... 44 7.1 Example Peripherals ................................................ 44 7.2 Universal Digital Block .............................................. 46 7.3 UDB Array Description ............................................. 49 7.4 DSI Routing Interface Description ............................ 49 7.5 CAN .......................................................................... 51 7.6 USB .......................................................................... 53 7.7 Timers, Counters, and PWMs .................................. 53 7.8 I2C ............................................................................ 54 7.9 Digital Filter Block ..................................................... 56 8. Analog Subsystem .......................................................... 56 8.1 Analog Routing ......................................................... 57 8.2 Delta-sigma ADC ...................................................... 59 8.3 Comparators ............................................................. 60 8.4 Opamps .................................................................... 61 8.5 Programmable SC/CT Blocks .................................. 61 8.6 LCD Direct Drive ...................................................... 62 8.7 CapSense ................................................................. 63 8.8 Temp Sensor ............................................................ 63 8.9 DAC .......................................................................... 64 8.10 Up/Down Mixer ....................................................... 64 8.11 Sample and Hold .................................................... 64 Document Number: 001-11729 Rev. AH 9. Programming, Debug Interfaces, Resources ................ 65 9.1 JTAG Interface ......................................................... 65 9.2 Serial Wire Debug Interface ..................................... 67 9.3 Debug Features ........................................................ 68 9.4 Trace Features ......................................................... 68 9.5 Single Wire Viewer Interface .................................... 68 9.6 Programming Features ............................................. 68 9.7 Device Security ........................................................ 68 9.8 CSP Package Bootloader ......................................... 69 10. Development Support ................................................... 70 10.1 Documentation ....................................................... 70 10.2 Online ..................................................................... 70 10.3 Tools ....................................................................... 70 11. Electrical Specifications ............................................... 71 11.1 Absolute Maximum Ratings .................................... 71 11.2 Device Level Specifications .................................... 72 11.3 Power Regulators ................................................... 76 11.4 Inputs and Outputs ................................................. 80 11.5 Analog Peripherals ................................................. 88 11.6 Digital Peripherals ................................................ 108 11.7 Memory ................................................................ 112 11.8 PSoC System Resources ..................................... 116 11.9 Clocking ................................................................ 119 12. Ordering Information ................................................... 123 12.1 Part Numbering Conventions ............................... 124 13. Packaging ..................................................................... 125 14. Acronyms ..................................................................... 129 15. Reference Documents ................................................. 130 16. Document Conventions .............................................. 131 16.1 Units of Measure .................................................. 131 17. Revision History ......................................................... 132 18. Sales, Solutions, and Legal Information ................... 140 Worldwide Sales and Design Support.......................... 140 Products ....................................................................... 140 PSoC® Solutions ......................................................... 140 Cypress Developer Community.................................... 140 Technical Support ........................................................ 140 Page 3 of 140 PSoC® 3: CY8C38 Family Datasheet 1. Architectural Overview Introducing the CY8C38 family of ultra low-power, flash Programmable System-on-Chip (PSoC®) devices, part of a scalable 8-bit PSoC 3 and 32-bit PSoC 5 platform. The CY8C38 family provides configurable blocks of analog, digital, and interconnect circuitry around a CPU subsystem. The combination of a CPU with a flexible analog subsystem, digital subsystem, routing, and I/O enables a high level of integration in a wide variety of consumer, industrial, and medical applications. Figure 1-1. Simplified Block Diagram Analog Interconnect Quadrature Decoder UDB UDB UDB UDB 8-bit SPI I 2C Slave UDB UDB Sequencer Usage Example for UDB Universal Digital Block Array (24 x UDB) 8-bit Timer 16-bit PWM UDB UDB UDB UDB UDB UDB 8-bit Timer Logic UDB UDB UDB UDB UDB UDB UDB 12-bit SPI UDB I 2C CAN 2.0 16-bit PRS Master/ Slave FS USB 2.0 4x Timer Counter PWM Logic UDB UDB UART UDB UDB USB PHY 22 Ω GPIOs GPIOs IMO Clock Tree 32.768 KHz ( Optional) Digital System System Wide Resources Xtal Osc SIO 4 to 25 MHz (Optional) GPIOs Digital Interconnect 12-bit PWM RTC Timer System Bus Memory System EEPROM SRAM CPU System 8051 or Cortex M3CPU Interrupt Controller Program & Debug Program GPIOs WDT and Wake GPIOs Debug & Trace EMIF PHUB DMA FLASH ILO Boundary Scan Power Management System LCD Direct Drive Digital Filter Block POR and LVD ADC + 4x Opamp - 4 x SC/CT Blocks (TIA, PGA, Mixer etc) 1.8V LDO Temperature Sensor SMP CapSense 4 x DAC 1x Del Sig ADC + 4x CMP - 3 per Opamp GPIOs 1.71 V to 5.5 V Sleep Power Analog System GPIOs SIOs Clocking System 0 .5 V to 5.5 V ( Optional) Figure 1-1 illustrates the major components of the CY8C38 family. They are:  8051 CPU subsystem  Nonvolatile subsystem  Programming, debug, and test subsystem  Inputs and outputs  Clocking  Power  Digital subsystem  Analog subsystem Document Number: 001-11729 Rev. AH PSoC’s digital subsystem provides half of its unique configurability. It connects a digital signal from any peripheral to any pin through the digital system interconnect (DSI). It also provides functional flexibility through an array of small, fast, low-power UDBs. PSoC Creator provides a library of prebuilt and tested standard digital peripherals (UART, SPI, LIN, PRS, CRC, timer, counter, PWM, AND, OR, and so on) that are mapped to the UDB array. You can also easily create a digital circuit using boolean primitives by means of graphical design entry. Each UDB contains programmable array logic (PAL)/programmable logic device (PLD) functionality, together with a small state machine engine to support a wide variety of peripherals. In addition to the flexibility of the UDB array, PSoC also provides configurable digital blocks targeted at specific functions. For the CY8C38 family these blocks can include four 16-bit timers, counters, and PWM blocks; I2C slave, master, and multimaster; FS USB; and Full CAN 2.0b. Page 4 of 140 PSoC® 3: CY8C38 Family Datasheet For more details on the peripherals see the “Example Peripherals” section on page 44 of this data sheet. For information on UDBs, DSI, and other digital blocks, see the “Digital Subsystem” section on page 44 of this data sheet. PSoC’s analog subsystem is the second half of its unique configurability. All analog performance is based on a highly accurate absolute voltage reference with less than 0.1-percent error over temperature and voltage. The configurable analog subsystem includes:  Analog muxes  Comparators  Voltage references  Analog-to-digital converter (ADC)  Digital-to-analog converters (DACs)  Digital filter block (DFB) All GPIO pins can route analog signals into and out of the device using the internal analog bus. This allows the device to interface up to 62 discrete analog signals. The heart of the analog subsystem is a fast, accurate, configurable delta-sigma ADC with these features:  Less than 100 µV offset  A gain error of 0.2 percent  INL less than ±2 LSB  DNL less than ±1 LSB  SINAD better than 84 dB in 16-bit mode This converter addresses a wide variety of precision analog applications, including some of the most demanding sensors. The output of the ADC can optionally feed the programmable DFB through the DMA without CPU intervention. You can configure the DFB to perform IIR and FIR digital filters and several user-defined custom functions. The DFB can implement filters with up to 64 taps. It can perform a 48-bit multiply-accumulate (MAC) operation in one clock cycle. Four high-speed voltage or current DACs support 8-bit output signals at an update rate of up to 8 Msps. They can be routed out of any GPIO pin. You can create higher resolution voltage PWM DAC outputs using the UDB array. This can be used to create a pulse width modulated (PWM) DAC of up to 10 bits, at up to 48 kHz. The digital DACs in each UDB support PWM, PRS, or delta-sigma algorithms with programmable widths. In addition to the ADC, DACs, and DFB, the analog subsystem provides multiple:  Uncommitted opamps  Configurable switched capacitor/continuous time (SC/CT) blocks. These support:  Transimpedance amplifiers  Programmable gain amplifiers  Mixers  Other similar analog components See the “Analog Subsystem” section on page 56 of this data sheet for more details. PSoC’s 8051 CPU subsystem is built around a single cycle pipelined 8051 8-bit processor running at up to 67 MHz. The CPU subsystem includes a programmable nested vector interrupt controller, DMA controller, and RAM. PSoC’s nested vector interrupt controller provides low latency by allowing the CPU to vector directly to the first address of the interrupt service routine, bypassing the jump instruction required by other architectures. The DMA controller enables peripherals to exchange data without CPU involvement. This allows the CPU to run slower (saving power) or use those CPU cycles to improve the performance of firmware algorithms. The single cycle 8051 CPU runs ten times faster than a standard 8051 processor. The processor speed itself is configurable, allowing you to tune active power consumption for specific applications. PSoC’s nonvolatile subsystem consists of flash, byte-writeable EEPROM, and nonvolatile configuration options. It provides up to 64 KB of on-chip flash. The CPU can reprogram individual blocks of flash, enabling bootloaders. You can enable an error correcting code (ECC) for high reliability applications. A powerful and flexible protection model secures the user's sensitive information, allowing selective memory block locking for read and write protection. Up to 2 KB of byte-writeable EEPROM is available on-chip to store application data. Additionally, selected configuration options such as boot speed and pin drive mode are stored in nonvolatile memory. This allows settings to activate immediately after POR. The three types of PSoC I/O are extremely flexible. All I/Os have many drive modes that are set at POR. PSoC also provides up to four I/O voltage domains through the VDDIO pins. Every GPIO has analog I/O, LCD drive[3], CapSense[4], flexible interrupt generation, slew rate control, and digital I/O capability. The SIOs on PSoC allow VOH to be set independently of Vddio when used as outputs. When SIOs are in input mode they are high impedance. This is true even when the device is not powered or when the pin voltage goes above the supply voltage. This makes the SIO ideally suited for use on an I2C bus where the PSoC may not be powered when other devices on the bus are. The SIO pins also have high current sink capability for applications such as LED drives. The programmable input threshold feature of the SIO can be used to make the SIO function as a general purpose analog comparator. For devices with Full-Speed USB the USB physical interface is also provided (USBIO). When not using USB these pins may also be used for limited digital functionality and device programming. All of the features of the PSoC I/Os are covered in detail in the “I/O System and Routing” section on page 37 of this data sheet. The PSoC device incorporates flexible internal clock generators, designed for high stability and factory trimmed for high accuracy. The internal main oscillator (IMO) is the clock base for the system, and has 1-percent accuracy at 3 MHz. The IMO can be configured to run from 3 MHz up to 62 MHz. Multiple clock derivatives can be generated from the main clock frequency to meet application needs. The device provides a PLL to generate clock frequencies up to 67 MHz from the IMO, external crystal, or external reference clock. Notes 3. This feature on select devices only. See Ordering Information on page 123 for details. 4. GPIOs with opamp outputs are not recommended for use with CapSense. Document Number: 001-11729 Rev. AH Page 5 of 140 PSoC® 3: CY8C38 Family Datasheet It also contains a separate, very low-power internal low-speed oscillator (ILO) for the sleep and watchdog timers. A 32.768-kHz external watch crystal is also supported for use in real-time clock (RTC) applications. The clocks, together with programmable clock dividers, provide the flexibility to integrate most timing requirements. The CY8C38 family supports a wide supply operating range from 1.71 V to 5.5 V. This allows operation from regulated supplies such as 1.8 V ± 5%, 2.5 V ±10%, 3.3 V ± 10%, or 5.0 V ± 10%, or directly from a wide range of battery types. In addition, it provides an integrated high efficiency synchronous boost converter that can power the device from supply voltages as low as 0.5 V. This enables the device to be powered directly from a single battery or solar cell. In addition, you can use the boost converter to generate other voltages required by the device, such as a 3.3-V supply for LCD glass drive. The boost’s output is available on the VBOOST pin, allowing other devices in the application to be powered from the PSoC. PSoC supports a wide range of low-power modes. These include a 200-nA hibernate mode with RAM retention and a 1-µA sleep mode with RTC. In the second mode, the optional 32.768-kHz watch crystal runs continuously and maintains an accurate RTC. Power to all major functional blocks, including the programmable digital and analog peripherals, can be controlled independently by firmware. This allows low-power background processing when some peripherals are not in use. This, in turn, provides a total device current of only 1.2 mA when the CPU is running at 6 MHz, or 0.8 mA running at 3 MHz. The details of the PSoC power modes are covered in the “Power System” section on page 31 of this data sheet. PSoC uses JTAG (4-wire) or SWD (2-wire) interfaces for programming, debug, and test. The 1-wire SWV may also be used for ‘printf’ style debugging. By combining SWD and SWV, you can implement a full debugging interface with just three pins. Using these standard interfaces you can debug or program the PSoC with a variety of hardware solutions from Cypress or third party vendors. PSoC supports on-chip break points and 4-KB instruction and data race memory for debug. Details of the programming, test, and debugging interfaces are discussed in the “Programming, Debug Interfaces, Resources” section on page 65 of this data sheet. 2. Pinouts Each VDDIO pin powers a specific set of I/O pins. (The USBIOs are powered from VDDD.) Using the VDDIO pins, a single PSoC can support multiple voltage levels, reducing the need for off-chip level shifters. The black lines drawn on the pinout diagrams in Figure 2-3 through Figure 2-6, as well as Table 2-1, show the pins that are powered by each VDDIO. Each VDDIO may source up to 100 mA total to its associated I/O pins, as shown in Figure 2-1. Figure 2-1. VDDIO Current Limit IDDIO X mA VDDIO X I/O Pins PSoC Conversely, for the 100-pin and 68-pin devices, the set of I/O pins associated with any VDDIO may sink up to 100 mA total, as shown in Figure 2-2. Figure 2-2. I/O Pins Current Limit Ipins VDDIO X mA I/O Pins PSoC VSSD For the 48-pin devices, the set of I/O pins associated with VDDIO0 plus VDDIO2 may sink up to 100 mA total. The set of I/O pins associated with VDDIO1 plus VDDIO3 may sink up to a total of 100 mA. Document Number: 001-11729 Rev. AH Page 6 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 2-3. 48-pin SSOP Part Pinout (SIO) P12[2] (SIO) P12[3] (Opamp2OUT, GPIO) P0[0] (Opamp0OUT, GPIO) P0[1] (Opamp0+, GPIO) P0[2] (Opamp0-/Extref0, GPIO) P0[3] VDDIO0 (Opamp2+, GPIO) P0[4] (Opamp2-, GPIO) P0[5] (IDAC0, GPIO) P0[6] (IDAC2, GPIO) P0[7] VCCD VSSD VDDD (GPIO) P2[3] (GPIO) P2[4] VDDIO2 (GPIO) P2[5] (GPIO) P2[6] (GPIO) P2[7] VSSB IND VBOOST VBAT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 Lines show 46 VDDIO to I/O 45 supply association 44 43 42 41 40 39 38 37 SSOP 36 35 34 33 32 31 30 29 28 27 26 25 VDDA VSSA VCCA P15[3] (GPIO, KHZ XTAL: XI) P15[2] (GPIO, KHZ XTAL: XO) P12[1] (SIO, I2C1: SDA) P12[0] (SIO, I2C1: SCL) VDDIO3 P15[1] (GPIO, MHZ XTAL: XI) P15[0] (GPIO, MHZ XTAL: XO) VCCD VSSD VDDD [5] P15[7] (USBIO, D-, SWDCK) [5] P15[6] (USBIO, D+, SWDIO) P1[7] (GPIO) P1[6] (GPIO) VDDIO1 P1[5] (GPIO, nTRST) P1[4] (GPIO, TDI) P1[3] (GPIO, TDO, SWV) P1[2] (GPIO, Configurable XRES) P1[1] (GPIO, TCK, SWDCK) P1[0] (GPIO, TMS, SWDIO) P0[4] (Opamp2+, GPIO) QFN 36 35 34 33 32 31 30 29 28 27 26 25 P0[3] (Opamp0-/Extref0, GPIO) P0[2] (Opamp0+, GPIO) P0[1] (Opamp0OUT, GPIO) P0[0] (Opamp2OUT, GPIO) P12[3] (SIO) P12[2] (SIO) VDDA VSSA VCCA P15[3] (GPIO, KHZ XTAL: XI) P15[2] (GPIO, KHZ XTAL: XO) P12[1] (SIO, I2C1: SDA) (SIO, I2C1: SCL) P12[0] (GPIO, MHZ XTAL: XI) P15[1] VDDIO3 (GPIO, MHZ XTAL: XO) P15[0] 17 18 19 20 21 22 23 24 VDDD VSSD VCCD (GPIO) P1[7] [5] (USBIO, D+, SWDIO) P15[6] [5] (USBIO, D-, SWDCK) P15[7] 13 14 15 16 (Top View) 7 8 9 10 11 12 VDDIO0 38 37 P0[6] (IDAC0, GPIO) P0[5] (Opamp2-, GPIO) VCCD P0[7] (IDAC2, GPIO) 41 40 39 42 VDDD VSSD 43 P2[4] (GPIO) P2[3] (GPIO) 46 45 44 Lines show VDDIO to I/O supply association VDDIO1 VSSB IND VBOOST VBAT (GPIO, TMS, SWDIO) P1[0] (GPIO, TCK, SWDCK) P1[1] (GPIO, Configurable XRES) P1[2] (GPIO, TDO, SWV) P1[3] (GPIO, TDI) P1[4] (GPIO, nTRST) P1[5] 1 2 3 4 5 6 (GPIO) P1[6] (GPIO) P2[6] (GPIO) P2[7] 48 P2[5] (GPIO) 47 VDDIO2 Figure 2-4. 48-pin QFN Part Pinout[6] Notes 5. Pins are Do Not Use (DNU) on devices without USB. The pin must be left floating. 6. The center pad on the QFN package should be connected to digital ground (VSSD) for best mechanical, thermal, and electrical performance. If not connected to ground, it should be electrically floated and not connected to any other signal. For more information, see AN72845, Design Guidelines for QFN Devices. Document Number: 001-11729 Rev. AH Page 7 of 140 PSoC® 3: CY8C38 Family Datasheet P15[5] (GPOI) P15[4] (GPIO) VDDD VSSD VCCD P0[7] (GPIO, IDAC2) P0[6] (GPIO, IDAC0) P0[5] (GPIO, Opamp2-) P0[4] (GPIO, Opamp2+) VDDIO0 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 P2[5] (GPIO) VDDIO2 P2[4] (GPIO) P2[3] (GPIO) P2[2] (GPIO) P2[1] (GPIO) P2[0] (GPIO) Figure 2-5. 68-pin QFN Part Pinout[7] (GPIO) P2[6] (GPIO) P2[7] (I2C0: SCL, SIO) P12[4] (I2C0: SDA, SIO) P12[5] VSSB IND VBOOST VBAT VSSD XRES (TMS, SWDIO, GPIO) P1[0] (TCK, SWDCK, GPIO) P1[1] (Configurable XRES, GPIO) P1[2] 51 50 LINES SHOW VDDIO TO I/O SUPPLY ASSOCIATION QFN (TOP VIEW) 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 P0[3] (GPIO, P0[2] (GPIO, P0[1] (GPIO, P0[0] (GPIO, Opamp0-/EXTREF0) Opamp0+) Opamp0OUT) Opamp2OUT) P12[3] (SIO) P12[2] (SIO) VSSD VDDA VSSA VCCA P15[3] (GPIO, KHZ XTAL: XI) P15[2] (GPIO, KHZ XTAL: XO) P12[1] (SIO, I2C1: SDA) P12[0] (SIO, 12C1: SCL) P3[7] (GPIO, Opamp3OUT) P3[6] (GPIO, Opamp1OUT) VDDIO3 (GPIO) P1[6] (GPIO) P1[7] (SIO) P12[6] (SIO) P12[7] [8] (USBIO, D+, SWDIO) P15[6] [8] (USBIO, D-, SWDCK) P15[7] VDDD VSSD VCCD (MHZ XTAL: XO, GPIO) P15[0] (MHZ XTAL: XI, GPIO) P15[1] (IDAC1, GPIO) P3[0] (IDAC3, GPIO) P3[1] (OpAmp3-/Extref1, GPIO) P3[2] (Opamp3+, GPIO) P3[3] Opamp(1-, GPIO) P3[4] (Opamp1+, GPIO) P3[5] 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 (TDO, SWV, GPIO) P1[3] (TDI, GPIO) P1[4] (nTRST, GPIO) P1[5] VDDIO1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Notes 7. The center pad on the QFN package should be connected to digital ground (VSSD) for best mechanical, thermal, and electrical performance. If not connected to ground, it should be electrically floated and not connected to any other signal. For more information, see AN72845, Design Guidelines for QFN Devices 8. Pins are Do Not Use (DNU) on devices without USB. The pin must be left floating. Document Number: 001-11729 Rev. AH Page 8 of 140 PSoC® 3: CY8C38 Family Datasheet P0[6] (GPIO, IDAC0) P0[5] (GPIO, Opamp2-) P0[4] (GPIO, Opamp2+) 77 76 P4[5] (GPIO) P4[4] (GPIO) P4[3] (GPIO) P4[2] (GPIO) P0[7] (GPIO, IDAC2) VCCD P4[7] (GPIO) P4[6] (GPIO) VDDD VSSD 87 86 85 84 83 82 81 80 79 78 90 89 88 P15[4] (GPIO) P6[3] (GPIO) P6[2] (GPIO) P6[1] (GPIO) P6[0] (GPIO) P2[1] (GPIO) P2[0] (GPIO) P15[5] (GPIO) 98 97 96 95 94 93 92 91 VDDA VSSA VCCA NC NC NC NC NC NC P15[3] (GPIO, KHZ XTAL: XI) P15[2] (GPIO, KHZ XTAL: XO) P12[1] (SIO, I2C1: SDA) P12[0] (SIO, I2C1: SCL) P3[7] (GPIO, Opamp3OUT) P3[6] (GPIO, Opamp1OUT) (Opamp1+, GPIO) P3[5] VDDIO3 (IDAC1, GPIO) P3[0] (IDAC3, GPIO) P3[1] (OpampP3-/Extref1, GPIO) P3[2] (Opamp3+, GPIO) P3[3] (Opamp1-, GPIO) P3[4] (MHZ XTAL: XO, GPIO) P15[0] (MHZ XTAL: XI, GPIO) P15[1] NC NC 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 [9] (TDI, GPIO) P1[4] (nTRST, GPIO) P1[5] 54 53 52 51 (USBIO, D-, SWDCK) P15[7] VDDD VSSD VCCD (TCK, SWDCK, GPIO) P1[1] (Configurable XRES, GPIO) P1[2] (TDO, SWV, GPIO) P1[3] VDDIO0 P0[3] (GPIO, Opamp0-/Extref0) P0[2] (GPIO, Opamp0+) P0[1] (GPIO, Opamp0OUT) P0[0] (GPIO, Opamp2OUT) P4[1] (GPIO) P4[0] (GPIO) P12[3] (SIO) P12[2] (SIO) VSSD [9] (GPIO) P5[2] (GPIO) P5[3] (TMS, SWDIO, GPIO) P1[0] TQFP (GPIO) P5[5] (GPIO) P5[6] (GPIO) P5[7] (USBIO, D+, SWDIO) P15[6] VSSD XRES (GPIO) P5[0] (GPIO) P5[1] 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 Lines show VDDIO to I/O supply association 26 27 28 29 30 31 32 33 34 35 VSSB IND VBOOST VBAT 75 74 VDDIO1 (I2C0: SCL, SIO) P12[4] (I2C0: SDA, SIO) P12[5] (GPIO) P6[4] (GPIO) P6[5] (GPIO) P6[6] (GPIO) P6[7] 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 (GPIO) P1[6] (GPIO) P1[7] (SIO) P12[6] (SIO) P12[7] (GPIO) P5[4] (GPIO) P2[5] (GPIO) P2[6] (GPIO) P2[7] 100 99 VDDIO2 P2[4] (GPIO) P2[3] (GPIO) P2[2] (GPIO) Figure 2-6. 100-pin TQFP Part Pinout Table 2-1. VDDIO and Port Pin Associations VDDIO Port Pins VDDIO0 P0[7:0], P4[7:0], P12[3:2] VDDIO1 P1[7:0], P5[7:0], P12[7:6] VDDIO2 P2[7:0], P6[7:0], P12[5:4], P15[5:4] VDDIO3 P3[7:0], P12[1:0], P15[3:0] VDDD P15[7:6] (USB D+, D-) Note 9. Pins are Do Not Use (DNU) on devices without USB. The pin must be left floating. Document Number: 001-11729 Rev. AH Page 9 of 140 PSoC® 3: CY8C38 Family Datasheet Table 2-2 shows the pinout for the 72-pin CSP package. Since there are four VDDIO pins, the set of I/O pins associated with any VDDIO may sink up to 100 mA total, same as for the 100-pin and 68-pin devices. Table 2-2. CSP Pinout Ball Name Ball Name Ball Name G6 P2[5] F1 VDDD A5 VDDA E5 P2[6] E1 VSSD A6 VSSD F5 P2[7] E2 VCCD B6 P12[2] J7 P12[4] C1 P15[0] C6 P12[3] H6 P12[5] C2 P15[1] A7 P0[0] J6 VSSB D2 P3[0] B7 P0[1] J5 Ind D3 P3[1] B5 P0[2] H5 VBOOST D4 P3[2] C5 P0[3] J4 VBAT D5 P3[3] A8 VIO0 H4 VSSD B4 P3[4] D6 P0[4] J3 XRES_N B3 P3[5] D7 P0[5] H3 P1[0] A1 VIO3 C7 P0[6] G3 P1[1] B2 P3[6] C8 P0[7] H2 P1[2] A2 P3[7] E8 VCCD J2 P1[3] C3 P12[0] F8 VSSD G4 P1[4] C4 P12[1] G8 VDDD G5 P1[5] E3 P15[2] E7 P15[4] J1 VIO1 E4 F4 P1[6] P15[3] F7 P15[5] B1 [10] NC G7 P2[0] [10] F3 P1[7] B8 NC H7 P2[1] H1 P12[6] D1[10] NC H8 P2[2] G1 P12[7] [10] NC F6 P2[3] G2 P15[6] A3 VCCA E6 P2[4] F2 P15[7] A4 VSSA J8 VIO2 D8 Figure 2-7 and Figure 2-8 show an example schematic and an example PCB layout, for the 100-pin TQFP part, for optimal analog performance on a two-layer board.  The two pins labeled VDDD must be connected together.  The two pins labeled VCCD must be connected together, with capacitance added, as shown in Figure 2-7 and Power System on page 31. The trace between the two VCCD pins should be as short as possible.  The two pins labeled VSSD must be connected together. For information on circuit board layout issues for mixed signals, refer to the application note, AN57821 - Mixed Signal Circuit Board Layout Considerations for PSoC® 3 and PSoC 5. Note 10. These pins are Do Not Use (DNU); they must be left floating. Document Number: 001-11729 Rev. AH Page 10 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 2-7. Example Schematic for 100-pin TQFP Part with Power Connections VDDD C1 1uF VDDD VSSD VSSD VDDD 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 VDDA C8 0.1uF VSSD VSSD VDDA VSSA VCCA C17 1uF VSSA VDDA C9 1uF C10 0.1uF VSSA VDDD C11 0.1uF VCCD VDDD VSSD C12 0.1uF VSSD VDDD VDDIO0 OA0-, REF0, P0[3] OA0+, P0[2] OA0OUT, P0[1] OA2OUT, P0[0] P4[1] P4[0] SIO, P12[3] SIO, P12[2] VSSD VDDA VSSA VCCA NC NC NC NC NC NC KHZXIN, P15[3] KHZXOUT, P15[2] SIO, P12[1] SIO, P12[0] OA3OUT, P3[7] OA1OUT, P3[6] VDDIO1 P1[6] P1[7] P12[6], SIO P12[7], SIO P5[4] P5[5] P5[6] P5[7] P15[6], USB D+ P15[7], USB DVDDD VSSD VCCD NC NC P15[0], MHZXOUT P15[1], MHZXIN P3[0], IDAC1 P3[1], IDAC3 P3[2], OA3-, REF1 P3[3], OA3+ P3[4], OA1P3[5], OA1+ VDDIO3 P2[5] P2[6] P2[7] P12[4], SIO P12[5], SIO P6[4] P6[5] P6[6] P6[7] VSSB IND VBOOST VBAT VSSD XRES P5[0] P5[1] P5[2] P5[3] P1[0], SWIO, TMS P1[1], SWDIO, TCK P1[2] P1[3], SWV, TDO P1[4], TDI P1[5], NTRST 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 VSSD VCCD VSSD VDDIO2 P2[4] P2[3] P2[2] P2[1] P2[0] P15[5] P15[4] P6[3] P6[2] P6[1] P6[0] VDDD VSSD VCCD P4[7] P4[6] P4[5] P4[4] P4[3] P4[2] IDAC2, P0[7] IDAC0, P0[6] OA2-, P0[5] OA2+, P0[4] VSSD VSSD C2 0.1uF 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 C6 0.1uF VDDD VDDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 VDDD C15 1uF C16 0.1uF VSSD VSSD Note The two VCCD pins must be connected together with as short a trace as possible. A trace under the device is recommended, as shown in Figure 2-8 on page 12. For more information on pad layout, refer to http://www.cypress.com/cad-resources/psoc-3-cad-libraries. Document Number: 001-11729 Rev. AH Page 11 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 2-8. Example PCB Layout for 100-pin TQFP Part for Optimal Analog Performance VSSA VDDD VSSD VDDA VSSA Plane VSSD Plane 3. Pin Descriptions IDAC0, IDAC1, IDAC2, IDAC3 Low resistance output pin for high current DACs (IDAC). Opamp0OUT, Opamp1OUT, Opamp2OUT, Opamp3OUT High current output of uncommitted opamp[11]. kHz XTAL: Xo, kHz XTAL: Xi 32.768-kHz crystal oscillator pin. MHz XTAL: Xo, MHz XTAL: Xi 4- to 25-MHz crystal oscillator pin. nTRST Extref0, Extref1 Optional JTAG test reset programming and debug port connection to reset the JTAG connection. External reference input to the analog system. SIO Opamp0–, Opamp1–, Opamp2–, Opamp3– Opamp0+, Opamp1+, Opamp2+, Opamp3+ Special I/O provides interfaces to the CPU, digital peripherals and interrupts with a programmable high threshold voltage, analog comparator, high sink current, and high impedance state when the device is unpowered. Noninverting input to uncommitted opamp. SWDCK GPIO Serial wire debug clock programming and debug port connection. Inverting input to uncommitted opamp. General purpose I/O pin provides interfaces to the CPU, digital peripherals, analog peripherals, interrupts, LCD segment drive, and CapSense[11]. I2C0: SCL, I2C1: SCL I2C SCL line providing wake from sleep on an address match. Any I/O pin can be used for I2C SCL if wake from sleep is not required. SWDIO Serial wire debug input and output programming and debug port connection. SWV Single wire viewer debug output. I2C0: SDA, I2C1: SDA TCK I2C JTAG test clock programming and debug port connection. SDA line providing wake from sleep on an address match. Any I/O pin can be used for I2C SDA if wake from sleep is not required. IND Inductor connection to boost pump. TDI JTAG test data in programming and debug port connection. TDO JTAG test data out programming and debug port connection. Note 11. GPIOs with opamp outputs are not recommended for use with CapSense. Document Number: 001-11729 Rev. AH Page 12 of 140 PSoC® 3: CY8C38 Family Datasheet TMS VDDIO0, VDDIO1, VDDIO2, VDDIO3 JTAG test mode select programming and debug port connection. Supply for I/O pins. Each VDDIO must be tied to a valid operating voltage (1.71 V to 5.5 V), and must be less than or equal to VDDA. USBIO, D+ Provides D+ connection directly to a USB 2.0 bus. May be used as a digital I/O pin; it is powered from VDDD instead of from a VDDIO. Pins are Do Not Use (DNU) on devices without USB. USBIO, D– Provides D– connection directly to a USB 2.0 bus. May be used as a digital I/O pin; it is powered from VDDD instead of from a VDDIO. Pins are Do Not Use (DNU) on devices without USB. VBOOST Power sense connection to boost pump. VBAT Battery supply to boost pump. VCCA. Output of the analog core regulator or the input to the analog core. Requires a 1uF capacitor to VSSA. The regulator output is not designed to drive external circuits. Note that if you use the device with an external core regulator (externally regulated mode), the voltage applied to this pin must not exceed the allowable range of 1.71 V to 1.89 V. When using the internal core regulator, (internally regulated mode, the default), do not tie any power to this pin. For details see Power System on page 31. VCCD. Output of the digital core regulator or the input to the digital core. The two VCCD pins must be shorted together, with the trace between them as short as possible, and a 1uF capacitor to VSSD. The regulator output is not designed to drive external circuits. Note that if you use the device with an external core regulator (externally regulated mode), the voltage applied to this pin must not exceed the allowable range of 1.71 V to 1.89 V. When using the internal core regulator (internally regulated mode, the default), do not tie any power to this pin. For details see Power System on page 31. VDDA Supply for all analog peripherals and analog core regulator. VDDA must be the highest voltage present on the device. All other supply pins must be less than or equal to VDDA. VDDD Supply for all digital peripherals and digital core regulator. VDDD must be less than or equal to VDDA. VSSA Ground for all analog peripherals. VSSB Ground connection for boost pump. VSSD Ground for all digital logic and I/O pins. XRES (and configurable XRES) External reset pin. Active low with internal pull-up. Pin P1[2] may be configured to be a XRES pin; see “Nonvolatile Latches (NVLs)” on page 24. 4. CPU 4.1 8051 CPU The CY8C38 devices use a single cycle 8051 CPU, which is fully compatible with the original MCS-51 instruction set. The CY8C38 family uses a pipelined RISC architecture, which executes most instructions in 1 to 2 cycles to provide peak performance of up to 33 MIPS with an average of 2 cycles per instruction. The single cycle 8051 CPU runs ten times faster than a standard 8051 processor. The 8051 CPU subsystem includes these features:  Single cycle 8051 CPU  Up to 64 KB of flash memory, up to 2 KB of EEPROM, and up to 8 KB of SRAM  512-byte instruction cache between CPU and flash  Programmable nested vector interrupt controller  DMA controller  Peripheral HUB (PHUB)  External memory interface (EMIF) 4.2 Addressing Modes The following addressing modes are supported by the 8051:  Direct Addressing: The operand is specified by a direct 8-bit address field. Only the internal RAM and the SFRs can be accessed using this mode.  Indirect Addressing: The instruction specifies the register which contains the address of the operand. The registers R0 or R1 are used to specify the 8-bit address, while the data pointer (DPTR) register is used to specify the 16-bit address.  Register Addressing: Certain instructions access one of the registers (R0 to R7) in the specified register bank. These instructions are more efficient because there is no need for an address field.  Register Specific Instructions: Some instructions are specific to certain registers. For example, some instructions always act on the accumulator. In this case, there is no need to specify the operand.  Immediate Constants: Some instructions carry the value of the constants directly instead of an address.  Indexed Addressing: This type of addressing can be used only for a read of the program memory. This mode uses the Data Pointer as the base and the accumulator value as an offset to read a program memory.  Bit Addressing: In this mode, the operand is one of 256 bits. Document Number: 001-11729 Rev. AH Page 13 of 140 PSoC® 3: CY8C38 Family Datasheet 4.3 Instruction Set  Data transfer instructions The 8051 instruction set is highly optimized for 8-bit handling and Boolean operations. The types of instructions supported include:  Boolean instructions  Program branching instructions  Arithmetic instructions  Logical instructions 4.3.1 Instruction Set Summary 4.3.1.1 Arithmetic Instructions Arithmetic instructions support the direct, indirect, register, immediate constant, and register-specific instructions. Arithmetic modes are used for addition, subtraction, multiplication, division, increment, and decrement operations. Table 4-1 lists the different arithmetic instructions. Table 4-1. Arithmetic Instructions Mnemonic Description Bytes Cycles ADD A,Rn Add register to accumulator 1 1 ADD A,Direct Add direct byte to accumulator 2 2 ADD A,@Ri Add indirect RAM to accumulator 1 2 ADD A,#data Add immediate data to accumulator 2 2 ADDC A,Rn Add register to accumulator with carry 1 1 ADDC A,Direct Add direct byte to accumulator with carry 2 2 ADDC A,@Ri Add indirect RAM to accumulator with carry 1 2 ADDC A,#data Add immediate data to accumulator with carry 2 2 SUBB A,Rn Subtract register from accumulator with borrow 1 1 SUBB A,Direct Subtract direct byte from accumulator with borrow 2 2 SUBB A,@Ri Subtract indirect RAM from accumulator with borrow 1 2 SUBB A,#data Subtract immediate data from accumulator with borrow 2 2 INC A Increment accumulator 1 1 INC Rn Increment register 1 2 INC Direct Increment direct byte 2 3 INC @Ri Increment indirect RAM 1 3 DEC A Decrement accumulator 1 1 DEC Rn Decrement register 1 2 DEC Direct Decrement direct byte 2 3 DEC @Ri Decrement indirect RAM 1 3 INC DPTR Increment data pointer 1 1 MUL Multiply accumulator and B 1 2 DIV Divide accumulator by B 1 6 DAA Decimal adjust accumulator 1 3 Document Number: 001-11729 Rev. AH Page 14 of 140 PSoC® 3: CY8C38 Family Datasheet 4.3.1.2 Logical Instructions The logical instructions perform Boolean operations such as AND, OR, XOR on bytes, rotate of accumulator contents, and swap of nibbles in an accumulator. The Boolean operations on the bytes are performed on the bit-by-bit basis. Table 4-2 shows the list of logical instructions and their description. Table 4-2. Logical Instructions Mnemonic Description Bytes Cycles ANL A,Rn AND register to accumulator 1 1 ANL A,Direct AND direct byte to accumulator 2 2 ANL A,@Ri AND indirect RAM to accumulator 1 2 ANL A,#data AND immediate data to accumulator 2 2 ANL Direct, A AND accumulator to direct byte 2 3 ANL Direct, #data AND immediate data to direct byte 3 3 ORL A,Rn OR register to accumulator 1 1 ORL A,Direct OR direct byte to accumulator 2 2 ORL A,@Ri OR indirect RAM to accumulator 1 2 ORL A,#data OR immediate data to accumulator 2 2 ORL Direct, A OR accumulator to direct byte 2 3 ORL Direct, #data OR immediate data to direct byte 3 3 XRL A,Rn XOR register to accumulator 1 1 XRL A,Direct XOR direct byte to accumulator 2 2 XRL A,@Ri XOR indirect RAM to accumulator 1 2 XRL A,#data XOR immediate data to accumulator 2 2 XRL Direct, A XOR accumulator to direct byte 2 3 XRL Direct, #data XOR immediate data to direct byte 3 3 CLR A Clear accumulator 1 1 CPL A Complement accumulator 1 1 RL A Rotate accumulator left 1 1 RLC A Rotate accumulator left through carry 1 1 RR A Rotate accumulator right 1 1 RRC A Rotate accumulator right though carry 1 1 SWAP A Swap nibbles within accumulator 1 1 4.3.1.3 Data Transfer Instructions The data transfer instructions are of three types: the core RAM, xdata RAM, and the lookup tables. The core RAM transfer includes transfer between any two core RAM locations or SFRs. These instructions can use direct, indirect, register, and immediate addressing. The xdata RAM transfer includes only the transfer between the accumulator and the xdata RAM location. It can use only indirect addressing. The lookup tables involve nothing but the read of program memory using the Indexed Document Number: 001-11729 Rev. AH addressing mode. Table 4-3 lists the various data transfer instructions available. 4.3.1.4 Boolean Instructions The 8051 core has a separate bit-addressable memory location. It has 128 bits of bit addressable RAM and a set of SFRs that are bit addressable. The instruction set includes the whole menu of bit operations such as move, set, clear, toggle, OR, and AND instructions and the conditional jump instructions. Table 4-4 lists the available Boolean instructions. Page 15 of 140 PSoC® 3: CY8C38 Family Datasheet Table 4-3. Data Transfer Instructions Mnemonic Description Bytes Cycles 1 1 MOV A,Rn Move register to accumulator MOV A,Direct Move direct byte to accumulator 2 2 MOV A,@Ri Move indirect RAM to accumulator 1 2 MOV A,#data Move immediate data to accumulator 2 2 MOV Rn,A Move accumulator to register 1 1 MOV Rn,Direct Move direct byte to register 2 3 MOV Rn, #data Move immediate data to register 2 2 MOV Direct, A Move accumulator to direct byte 2 2 MOV Direct, Rn Move register to direct byte 2 2 MOV Direct, Direct Move direct byte to direct byte 3 3 MOV Direct, @Ri Move indirect RAM to direct byte 2 3 MOV Direct, #data Move immediate data to direct byte 3 3 MOV @Ri, A Move accumulator to indirect RAM 1 2 MOV @Ri, Direct Move direct byte to indirect RAM 2 3 MOV @Ri, #data Move immediate data to indirect RAM 2 2 MOV DPTR, #data16 Load data pointer with 16 bit constant 3 3 Move code byte relative to DPTR to accumulator 1 5 MOVC A, @A + PC Move code byte relative to PC to accumulator 1 4 MOVX A,@Ri Move external RAM (8-bit) to accumulator 1 4 MOVX A, @DPTR Move external RAM (16-bit) to accumulator 1 3 MOVX @Ri, A Move accumulator to external RAM (8-bit) 1 5 MOVX @DPTR, A Move accumulator to external RAM (16-bit) 1 4 PUSH Direct Push direct byte onto stack 2 3 POP Direct Pop direct byte from stack 2 2 XCH A, Rn Exchange register with accumulator 1 2 XCH A, Direct Exchange direct byte with accumulator 2 3 XCH A, @Ri Exchange indirect RAM with accumulator 1 3 Exchange low order indirect digit RAM with accumulator 1 3 Bytes Cycles MOVC A, @A+DPTR XCHD A, @Ri Table 4-4. Boolean Instructions Mnemonic Description CLR C Clear carry 1 1 CLR bit Clear direct bit 2 3 SETB C Set carry 1 1 SETB bit Set direct bit 2 3 CPL C Complement carry 1 1 CPL bit Complement direct bit 2 3 ANL C, bit AND direct bit to carry 2 2 Document Number: 001-11729 Rev. AH Page 16 of 140 PSoC® 3: CY8C38 Family Datasheet Table 4-4. Boolean Instructions (continued) Mnemonic Bytes Cycles AND complement of direct bit to carry 2 2 ORL C, bit OR direct bit to carry 2 2 ORL C, /bit OR complement of direct bit to carry 2 2 ANL C, /bit Description MOV C, bit Move direct bit to carry 2 2 MOV bit, C Move carry to direct bit 2 3 JC Jump if carry is set 2 3 Jump if no carry is set 2 3 rel JNC rel JB Jump if direct bit is set 3 5 JNB bit, rel bit, rel Jump if direct bit is not set 3 5 JBC bit, rel Jump if direct bit is set and clear bit 3 5 4.3.1.5 Program Branching Instructions The 8051 supports a set of conditional and unconditional jump instructions that help to modify the program execution flow. Table 4-5 shows the list of jump instructions. Table 4-5. Jump Instructions Mnemonic Description Bytes Cycles ACALL addr11 Absolute subroutine call 2 4 LCALL addr16 Long subroutine call 3 4 RET Return from subroutine 1 4 RETI Return from interrupt 1 4 AJMP addr11 Absolute jump 2 3 LJMP addr16 Long jump 3 4 SJMP rel Short jump (relative address) 2 3 JMP @A + DPTR Jump indirect relative to DPTR 1 5 JZ rel Jump if accumulator is zero 2 4 JNZ rel Jump if accumulator is nonzero 2 4 CJNE A,Direct, rel Compare direct byte to accumulator and jump if not equal 3 5 CJNE A, #data, rel Compare immediate data to accumulator and jump if not equal 3 4 CJNE Rn, #data, rel Compare immediate data to register and jump if not equal 3 4 CJNE @Ri, #data, rel Compare immediate data to indirect RAM and jump if not equal 3 5 DJNZ Rn,rel Decrement register and jump if not zero 2 4 DJNZ Direct, rel Decrement direct byte and jump if not zero 3 5 NOP No operation 1 1 Document Number: 001-11729 Rev. AH Page 17 of 140 PSoC® 3: CY8C38 Family Datasheet 4.4 DMA and PHUB  Transactions can be stalled or canceled The PHUB and the DMA controller are responsible for data transfer between the CPU and peripherals, and also data transfers between peripherals. The PHUB and DMA also control device configuration during boot. The PHUB consists of:  Supports transaction size of infinite or 1 to 64 KB  A central hub that includes the DMA controller, arbiter, and router  Multiple spokes that radiate outward from the hub to most peripherals There are two PHUB masters: the CPU and the DMA controller. Both masters may initiate transactions on the bus. The DMA channels can handle peripheral communication without CPU intervention. The arbiter in the central hub determines which DMA channel is the highest priority if there are multiple requests. 4.4.1 PHUB Features  CPU and DMA controller are both bus masters to the PHUB  Eight multi-layer AHB bus parallel access paths (spokes) for peripheral access  Simultaneous CPU and DMA access to peripherals located on different spokes  Simultaneous DMA source and destination burst transactions on different spokes  Supports 8-, 16-, 24-, and 32-bit addressing and data Table 4-6. PHUB Spokes and Peripherals PHUB Spokes Peripherals 0 SRAM 1 IOs, PICU, EMIF 2 PHUB local configuration, Power manager, Clocks, IC, SWV, EEPROM, Flash programming interface  TDs may be nested and/or chained for complex transactions 4.4.3 Priority Levels The CPU always has higher priority than the DMA controller when their accesses require the same bus resources. Due to the system architecture, the CPU can never starve the DMA. DMA channels of higher priority (lower priority number) may interrupt current DMA transfers. In the case of an interrupt, the current transfer is allowed to complete its current transaction. To ensure latency limits when multiple DMA accesses are requested simultaneously, a fairness algorithm guarantees an interleaved minimum percentage of bus bandwidth for priority levels 2 through 7. Priority levels 0 and 1 do not take part in the fairness algorithm and may use 100 percent of the bus bandwidth. If a tie occurs on two DMA requests of the same priority level, a simple round robin method is used to evenly share the allocated bandwidth. The round robin allocation can be disabled for each DMA channel, allowing it to always be at the head of the line. Priority levels 2 to 7 are guaranteed the minimum bus bandwidth shown in Table 4-7 after the CPU and DMA priority levels 0 and 1 have satisfied their requirements. Table 4-7. Priority Levels Priority Level % Bus Bandwidth 0 100.0 1 100.0 2 50.0 3 25.0 4 12.5 5 6.2 6 3.1 7 1.5 3 Analog interface and trim, Decimator 4 USB, CAN, I2C, Timers, Counters, and PWMs 5 DFB When the fairness algorithm is disabled, DMA access is granted based solely on the priority level; no bus bandwidth guarantees are made. 6 UDBs group 1 7 UDBs group 2 4.4.4 Transaction Modes Supported 4.4.2 DMA Features  24 DMA channels  Each channel has one or more transaction descriptors (TD) to configure channel behavior. Up to 128 total TDs can be defined  TDs can be dynamically updated  Eight levels of priority per channel  Any digitally routable signal, the CPU, or another DMA channel, The flexible configuration of each DMA channel and the ability to chain multiple channels allow the creation of both simple and complex use cases. General use cases include, but are not limited to: 4.4.4.1 Simple DMA In a simple DMA case, a single TD transfers data between a source and sink (peripherals or memory location). The basic timing diagrams of DMA read and write cycles are shown in Figure 4-1. For more description on other transfer modes, refer to the Technical Reference Manual. can trigger a transaction  Each channel can generate up to two interrupts per transfer Document Number: 001-11729 Rev. AH Page 18 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 4-1. DMA Timing Diagram ADDRESS Phase DATA Phase ADDRESS Phase CLK DATA Phase CLK ADDR 16/32 A ADDR 16/32 B WRITE A B WRITE DATA (A) DATA READY DATA (A) DATA READY Basic DMA Write Transfer without wait states Basic DMA Read Transfer without wait states 4.4.4.2 Auto Repeat DMA Auto repeat DMA is typically used when a static pattern is repetitively read from system memory and written to a peripheral. This is done with a single TD that chains to itself. 4.4.4.3 Ping Pong DMA A ping pong DMA case uses double buffering to allow one buffer to be filled by one client while another client is consuming the data previously received in the other buffer. In its simplest form, this is done by chaining two TDs together so that each TD calls the opposite TD when complete. phase TD(s) finish, a status phase TD can be invoked that reads some memory mapped status information from the peripheral and copies it to a location in system memory specified by the CPU for later inspection. Multiple sets of configuration, data, and status phase ‘subchains’ can be strung together to create larger chains that transmit multiple packets in this way. A similar concept exists in the opposite direction to receive the packets. 4.4.4.7 Nested DMA Circular DMA is similar to ping pong DMA except it contains more than two buffers. In this case there are multiple TDs; after the last TD is complete it chains back to the first TD. One TD may modify another TD, as the TD configuration space is memory mapped similar to any other peripheral. For example, a first TD loads a second TD’s configuration and then calls the second TD. The second TD moves data as required by the application. When complete, the second TD calls the first TD, which again updates the second TD’s configuration. This process repeats as often as necessary. 4.4.4.5 Scatter Gather DMA 4.5 Interrupt Controller In the case of scatter gather DMA, there are multiple noncontiguous sources or destinations that are required to effectively carry out an overall DMA transaction. For example, a packet may need to be transmitted off of the device and the packet elements, including the header, payload, and trailer, exist in various noncontiguous locations in memory. Scatter gather DMA allows the segments to be concatenated together by using multiple TDs in a chain. The chain gathers the data from the multiple locations. A similar concept applies for the reception of data onto the device. Certain parts of the received data may need to be scattered to various locations in memory for software processing convenience. Each TD in the chain specifies the location for each discrete element in the chain. The interrupt controller provides a mechanism for hardware resources to change program execution to a new address, independent of the current task being executed by the main code. The interrupt controller provides enhanced features not found on original 8051 interrupt controllers: 4.4.4.4 Circular DMA 4.4.4.6 Packet Queuing DMA Packet queuing DMA is similar to scatter gather DMA but specifically refers to packet protocols. With these protocols, there may be separate configuration, data, and status phases associated with sending or receiving a packet. For instance, to transmit a packet, a memory mapped configuration register can be written inside a peripheral, specifying the overall length of the ensuing data phase. The CPU can set up this configuration information anywhere in system memory and copy it with a simple TD to the peripheral. After the configuration phase, a data phase TD (or a series of data phase TDs) can begin (potentially using scatter gather). When the data Document Number: 001-11729 Rev. AH  Thirty-two interrupt vectors  Jumps directly to ISR anywhere in code space with dynamic vector addresses  Multiple sources for each vector  Flexible interrupt to vector matching  Each interrupt vector is independently enabled or disabled  Each interrupt can be dynamically assigned one of eight priorities  Eight level nestable interrupts  Multiple I/O interrupt vectors  Software can send interrupts  Software can clear pending interrupts Figure 4-2 on page 20 represents typical flow of events when an interrupt triggered. Figure 4-3 on page 21 shows the interrupt structure and priority polling. Page 19 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 4-2. Interrupt Processing Timing Diagram 1 2 3 4 5 6 7 8 9 10 11 S Arrival of new Interrupt S Pend bit is set on next clock active edge POST and PEND bits cleared after IRQ is sleared S Interrupt is posted to ascertain the priority S IRQ cleared after receiving IRA Interrupt request sent to core for processing NA NA 0x0010 S S The active interrupt number is posted to core The active interrupt ISR address is posted to core S S NA S S Interrupt generation and posting to CPU CPU Response Int. State Clear S Completing current instruction and branching to vector address Complete ISR and return Notes  1: Interrupt triggered asynchronous to the clock  2: The PEND bit is set on next active clock edge to indicate the interrupt arrival  3: POST bit is set following the PEND bit  4: Interrupt request and the interrupt number sent to CPU core after evaluation priority (Takes 3 clocks)  5: ISR address is posted to CPU core for branching  6: CPU acknowledges the interrupt request  7: ISR address is read by CPU for branching  8, 9: PEND and POST bits are cleared respectively after receiving the IRA from core  10: IRA bit is cleared after completing the current instruction and starting the instruction execution from ISR location (Takes 7 cycles)  11: IRC is set to indicate the completion of ISR, Active int. status is restored with previous status The total interrupt latency (ISR execution) = POST + PEND + IRQ + IRA + Completing current instruction and branching = 1+1+1+2+7 cycles = 12 cycles Document Number: 001-11729 Rev. AH Page 20 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 4-3. Interrupt Structure Interrupt Polling logic Interrupts form Fixed function blocks, DMA and UDBs Highest Priority Interrupt Enable/ Disable, PEND and POST logic Interrupts 0 to 31 from UDBs 0 Interrupts 0 to 31 from Fixed Function Blocks 1 IRQ 8 Level Priority decoder for all interrupts Polling sequence Interrupt routing logic to select 32 sources Interrupt 2 to 30 Interrupts 0 to 31 from DMA Individual Enable Disable bits 0 to 31 ACTIVE_INT_NUM [15:0] INT_VECT_ADDR IRA IRC 31 Global Enable disable bit When an interrupt is pending, the current instruction is completed and the program counter is pushed onto the stack. Code execution then jumps to the program address provided by the vector. After the ISR is completed, a RETI instruction is executed and returns execution to the instruction following the previously interrupted instruction. To do this the RETI instruction pops the program counter from the stack. If the same priority level is assigned to two or more interrupts, the interrupt with the lower vector number is executed first. Each interrupt vector may choose from three interrupt sources: Fixed Function, DMA, and UDB. The fixed function interrupts are Document Number: 001-11729 Rev. AH Lowest Priority direct connections to the most common interrupt sources and provide the lowest resource cost connection. The DMA interrupt sources provide direct connections to the two DMA interrupt sources provided per DMA channel. The third interrupt source for vectors is from the UDB digital routing array. This allows any digital signal available to the UDB array to be used as an interrupt source. Fixed function interrupts and all interrupt sources may be routed to any interrupt vector using the UDB interrupt source connections. Page 21 of 140 PSoC® 3: CY8C38 Family Datasheet Table 4-8. Interrupt Vector Table # Fixed Function DMA UDB 0 LVD phub_termout0[0] udb_intr[0] 1 Cache/ECC phub_termout0[1] udb_intr[1] 2 Reserved phub_termout0[2] udb_intr[2] 3 Sleep (Pwr Mgr) phub_termout0[3] udb_intr[3] 4 PICU[0] phub_termout0[4] udb_intr[4] 5 PICU[1] phub_termout0[5] udb_intr[5] 6 PICU[2] phub_termout0[6] udb_intr[6] 7 PICU[3] phub_termout0[7] udb_intr[7] 8 PICU[4] phub_termout0[8] udb_intr[8] 9 PICU[5] phub_termout0[9] udb_intr[9] 10 PICU[6] phub_termout0[10] udb_intr[10] 11 PICU[12] phub_termout0[11] udb_intr[11] 12 PICU[15] phub_termout0[12] udb_intr[12] 13 Comparators Combined phub_termout0[13] udb_intr[13] 14 Switched Caps Combined phub_termout0[14] udb_intr[14] phub_termout0[15] udb_intr[15] 2 15 I C 16 CAN phub_termout1[0] udb_intr[16] 17 Timer/Counter0 phub_termout1[1] udb_intr[17] 18 Timer/Counter1 phub_termout1[2] udb_intr[18] 19 Timer/Counter2 phub_termout1[3] udb_intr[19] 20 Timer/Counter3 phub_termout1[4] udb_intr[20] 21 USB SOF Int phub_termout1[5] udb_intr[21] 22 USB Arb Int phub_termout1[6] udb_intr[22] 23 USB Bus Int phub_termout1[7] udb_intr[23] 24 USB Endpoint[0] phub_termout1[8] udb_intr[24] 25 USB Endpoint Data phub_termout1[9] udb_intr[25] 26 Reserved phub_termout1[10] udb_intr[26] 27 LCD phub_termout1[11] udb_intr[27] 28 DFB Int phub_termout1[12] udb_intr[28] 29 Decimator Int phub_termout1[13] udb_intr[29] 30 PHUB Error Int phub_termout1[14] udb_intr[30] 31 EEPROM Fault Int phub_termout1[15] udb_intr[31] Document Number: 001-11729 Rev. AH Page 22 of 140 PSoC® 3: CY8C38 Family Datasheet 5. Memory 5.1 Static RAM CY8C38 SRAM is used for temporary data storage. Up to 8 KB of SRAM is provided and can be accessed by the 8051 or the DMA controller. See Memory Map on page 26. Simultaneous access of SRAM by the 8051 and the DMA controller is possible if different 4-KB blocks are accessed. 5.2 Flash Program Memory Flash memory in PSoC devices provides nonvolatile storage for user firmware, user configuration data, bulk data storage, and optional ECC data. The main flash memory area contains up to 64 KB of user program space. Up to an additional 8 KB of flash space is available for ECC. If ECC is not used this space can store device configuration data and bulk user data. User code may not be run out of the ECC flash memory section. ECC can correct one bit error and detect two bit errors per 8 bytes of firmware memory; an interrupt can be generated when an error is detected. The CPU reads instructions located in flash through a cache controller. This improves instruction execution rate and reduces system power consumption by requiring less frequent flash access. The cache has 8 lines at 64 bytes per line for a total of 512 bytes. It is fully associative, automatically controls flash power, and can be enabled or disabled. If ECC is enabled, the cache controller also performs error checking and correction, and interrupt generation. Flash programming is performed through a special interface and preempts code execution out of flash. The flash programming interface performs flash erasing, programming and setting code protection levels. Flash in-system serial programming (ISSP), typically used for production programming, is possible through both the SWD and JTAG interfaces. In-system programming, typically used for bootloaders, is also possible using serial interfaces such as I2C, USB, UART, and SPI, or any communications protocol. 5.3 Flash Security All PSoC devices include a flexible flash-protection model that prevents access and visibility to on-chip flash memory. This prevents duplication or reverse engineering of proprietary code. Flash memory is organized in blocks, where each block contains 256 bytes of program or data and 32 bytes of ECC or configuration data. A total of up to 256 blocks is provided on 64-KB flash devices. The device offers the ability to assign one of four protection levels to each row of flash. Table 5-1 lists the protection modes available. Flash protection levels can only be changed by performing a complete flash erase. The Full Protection and Field Upgrade settings disable external access (through a debugging tool such as PSoC Creator, for example). If your application requires code update through a bootloader, then use the Field Upgrade setting. Use the Unprotected setting only when no security is needed in your application. The PSoC device also offers an advanced security feature called Device Security which permanently disables all test, programming, and debug ports, protecting your application from external access (see the “Device Security” section on page 68). For more information Document Number: 001-11729 Rev. AH about how to take full advantage of the security features in PSoC, see the PSoC 3 TRM. Table 5-1. Flash Protection Protection Setting Allowed Not Allowed Unprotected External read and write – + internal read and write Factory Upgrade External write + internal read and write External read Field Upgrade Internal read and write External read and write Full Protection Internal read External read and write + internal write Disclaimer Note the following details of the flash code protection features on Cypress devices. Cypress products meet the specifications contained in their particular Cypress data sheets. Cypress believes that its family of products is one of the most secure families of its kind on the market today, regardless of how they are used. There may be methods, unknown to Cypress, that can breach the code protection features. Any of these methods, to our knowledge, would be dishonest and possibly illegal. Neither Cypress nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as ‘unbreakable’. Cypress is willing to work with the customer who is concerned about the integrity of their code. Code protection is constantly evolving. We at Cypress are committed to continuously improving the code protection features of our products. 5.4 EEPROM PSoC EEPROM memory is a byte-addressable nonvolatile memory. The CY8C38 has up to 2 KB of EEPROM memory to store user data. Reads from EEPROM are random access at the byte level. Reads are done directly; writes are done by sending write commands to an EEPROM programming interface. CPU code execution can continue from flash during EEPROM writes. EEPROM is erasable and writeable at the row level. The EEPROM is divided into 128 rows of 16 bytes each. The factory default values of all EEPROM bytes are 0. Because the EEPROM is mapped to the 8051 xdata space, the CPU can not execute out of EEPROM. There is no ECC hardware associated with EEPROM. If ECC is required it must be handled in firmware. It can take as much as 20 milliseconds to write to EEPROM or flash. During this time the device should not be reset, or unexpected changes may be made to portions of EEPROM or flash. Reset sources (see Section 6.3.1) include XRES pin, software reset, and watchdog; care should be taken to make sure that these are not inadvertently activated. In addition, the low voltage detect circuits should be configured to generate an interrupt instead of a reset. Page 23 of 140 PSoC® 3: CY8C38 Family Datasheet 5.5 Nonvolatile Latches (NVLs) PSoC has a 4-byte array of nonvolatile latches (NVLs) that are used to configure the device at reset. The NVL register map is shown in Table 5-2. Table 5-2. Device Configuration NVL Register Map Register Address 7 6 5 4 3 2 1 0 0x00 PRT3RDM[1:0] PRT2RDM[1:0] PRT1RDM[1:0] PRT0RDM[1:0] 0x01 PRT12RDM[1:0] PRT6RDM[1:0] PRT5RDM[1:0] PRT4RDM[1:0] 0x02 XRESMEN 0x03 DBGEN DIG_PHS_DLY[3:0] PRT15RDM[1:0] ECCEN DPS[1:0] CFGSPEED The details for individual fields and their factory default settings are shown in Table 5-3:. Table 5-3. Fields and Factory Default Settings Field Description Settings PRTxRDM[1:0] Controls reset drive mode of the corresponding IO 00b (default) - high impedance analog port. See “Reset Configuration” on page 43. All pins 01b - high impedance digital of the port are set to the same mode. 10b - resistive pull up 11b - resistive pull down XRESMEN Controls whether pin P1[2] is used as a GPIO or as 0 (default for 68-pin, 72-pin, and 100-pin parts) - GPIO 1 (default for 48-pin parts) - external reset an external reset. See “Pin Descriptions” on page 12, XRES description. DBGEN Debug Enable allows access to the debug system, 0 - access disabled for third-party programmers. 1 (default) - access enabled CFGSPEED Controls the speed of the IMO-based clock during 0 (default) - 12 MHz IMO the device boot process, for faster boot or 1 - 48 MHz IMO low-power operation DPS[1:0] Controls the usage of various P1 pins as a debug 00b - 5-wire JTAG 01b (default) - 4-wire JTAG port. See “Programming, Debug Interfaces, 10b - SWD Resources” on page 65. 11b - debug ports disabled ECCEN Controls whether ECC flash is used for ECC or for 0 - ECC disabled general configuration and data storage. See “Flash 1 (default) - ECC enabled Program Memory” on page 23. DIG_PHS_DLY[3:0] Selects the digital clock phase delay. See the TRM for details. Although PSoC Creator provides support for modifying the device configuration NVLs, the number of NVL erase / write cycles is limited – see “Nonvolatile Latches (NVL))” on page 113. Document Number: 001-11729 Rev. AH Page 24 of 140 PSoC® 3: CY8C38 Family Datasheet 5.6 External Memory Interface CY8C38 provides an EMIF for connecting to external memory devices. The connection allows read and write accesses to external memories. The EMIF operates in conjunction with UDBs, I/O ports, and other hardware to generate external memory address and control signals. At 33 MHz, each memory access cycle takes four bus clock cycles. Figure 5-1 is the EMIF block diagram. The EMIF supports synchronous and asynchronous memories. The CY8C38 supports only one type of external memory device at a time. External memory can be accessed through the 8051 xdata space; up to 24 address bits can be used. See “xdata Space” section on page 27. The memory can be 8 or 16 bits wide. Figure 5-1. EMIF Block Diagram Address Signals External_ MEM_ ADDR[23:0] I/O PORTs Data Signals External_ MEM_ DATA[15:0] I/O PORTs Control Signals I/O PORTs Data, Address, and Control Signals IO IF PHUB Data, Address, and Control Signals Control DSI Dynamic Output Control UDB DSI to Port Data, Address, and Control Signals EM Control Signals Other Control Signals EMIF Document Number: 001-11729 Rev. AH Page 25 of 140 PSoC® 3: CY8C38 Family Datasheet 5.7 Memory Map Figure 5-2. 8051 Internal Data Space The CY8C38 8051 memory map is very similar to the MCS-51 memory map. 0x00 4 Banks, R0-R7 Each 0x1F 0x20 5.7.1 Code Space Bit-Addressable Area 0x2F The CY8C38 8051 code space is 64 KB. Only main flash exists in this space. See the Flash Program Memory on page 23. 0x30 5.7.2 Internal Data Space Lower Core RAM Shared with Stack Space (direct and indirect addressing) 0x7F The CY8C38 8051 internal data space is 384 bytes, compressed within a 256-byte space. This space consists of 256 bytes of RAM (in addition to the SRAM mentioned in Static RAM on page 23) and a 128-byte space for special function registers (SFR). See Figure 5-2. The lowest 32 bytes are used for 4 banks of registers R0-R7. The next 16 bytes are bit-addressable. 0x80 0xFF Upper Core RAM Shared with Stack Space (indirect addressing) SFR Special Function Registers (direct addressing) In addition to the register or bit address modes used with the lower 48 bytes, the lower 128 bytes can be accessed with direct or indirect addressing. With direct addressing mode, the upper 128 bytes map to the SFRs. With indirect addressing mode, the upper 128 bytes map to RAM. Stack operations use indirect addressing; the 8051 stack space is 256 bytes. See the “Addressing Modes” section on page 13. 5.7.3 SFRs The SFR space provides access to frequently accessed registers. The memory map for the SFR memory space is shown in Table 5-4. Table 5-4. SFR Map Address 0×F8 0/8 SFRPRT15DR 1/9 SFRPRT15PS 2/A SFRPRT15SEL 3/B – 4/C – 5/D – 6/E – 7/F – 0×F0 B – SFRPRT12SEL – – – – – 0×E8 SFRPRT12DR SFRPRT12PS MXAX – – – – – 0×E0 ACC – – – – – – – 0×D8 SFRPRT6DR SFRPRT6PS SFRPRT6SEL – – – – – 0×D0 PSW – – – – – – – 0×C8 SFRPRT5DR SFRPRT5PS SFRPRT5SEL – – – – – 0×C0 SFRPRT4DR SFRPRT4PS SFRPRT4SEL – – – – – – – – – – 0×B8 0×B0 SFRPRT3DR SFRPRT3PS SFRPRT3SEL – – – – – 0×A8 IE – – – – – – – 0×A0 P2AX – SFRPRT1SEL – – – – – 0×98 SFRPRT2DR SFRPRT2PS SFRPRT2SEL – – – – – 0×90 SFRPRT1DR SFRPRT1PS – DPX0 – DPX1 – – 0×88 – SFRPRT0PS SFRPRT0SEL – – – – – 0×80 SFRPRT0DR SP DPL0 DPH0 DPL1 DPH1 DPS – The CY8C38 family provides the standard set of registers found on industry standard 8051 devices. In addition, the CY8C38 devices add SFRs to provide direct access to the I/O ports on the device. The following sections describe the SFRs added to the CY8C38 family. Document Number: 001-11729 Rev. AH Page 26 of 140 PSoC® 3: CY8C38 Family Datasheet 5.7.4 XData Space Access SFRs 5.7.5.1 xdata Space The 8051 core features dual DPTR registers for faster data transfer operations. The data pointer select SFR, DPS, selects which data pointer register, DPTR0 or DPTR1, is used for the following instructions: The 8051 xdata space is 24-bit, or 16 MB in size. The majority of this space is not ‘external’—it is used by on-chip components. See Table 5-5. External, that is, off-chip, memory can be accessed using the EMIF. See External Memory Interface on page 25.  MOVX @DPTR, A  MOVX A, @DPTR  MOVC A, @A+DPTR  JMP @A+DPTR  INC DPTR  MOV DPTR, #data16 The extended data pointer SFRs, DPX0, DPX1, MXAX, and P2AX, hold the most significant parts of memory addresses during access to the xdata space. These SFRs are used only with the MOVX instructions. During a MOVX instruction using the DPTR0/DPTR1 register, the most significant byte of the address is always equal to the contents of DPX0/DPX1. During a MOVX instruction using the R0 or R1 register, the most significant byte of the address is always equal to the contents of MXAX, and the next most significant byte is always equal to the contents of P2AX. 5.7.5 I/O Port SFRs The I/O ports provide digital input sensing, output drive, pin interrupts, connectivity for analog inputs and outputs, LCD, and access to peripherals through the DSI. Full information on I/O ports is found in I/O System and Routing on page 37. I/O ports are linked to the CPU through the PHUB and are also available in the SFRs. Using the SFRs allows faster access to a limited set of I/O port registers, while using the PHUB allows boot configuration and access to all I/O port registers. Table 5-5. XDATA Data Address Map Address Range 0×00 0000 – 0×00 1FFF SRAM 0×00 4000 – 0×00 42FF Clocking, PLLs, and oscillators 0×00 4300 – 0×00 43FF Power management 0×00 4400 – 0×00 44FF Interrupt controller 0×00 4500 – 0×00 45FF Ports interrupt control 0×00 4700 – 0×00 47FF Flash programming interface 0×00 4800 - 0×00 48FF Cache controller 0×00 4900 – 0×00 49FF I2C controller 0×00 4E00 – 0×00 4EFF Decimator 0×00 4F00 – 0×00 4FFF Fixed timer/counter/PWMs 0×00 5000 – 0×00 51FF I/O ports control 0×00 5400 – 0×00 54FF EMIF control registers 0×00 5800 – 0×00 5FFF Analog subsystem interface 0×00 6000 – 0×00 60FF USB controller 0×00 6400 – 0×00 6FFF UDB Working Registers 0×00 7000 – 0×00 7FFF PHUB configuration 0×00 8000 – 0×00 8FFF EEPROM 0×00 A000 – 0×00 A400 CAN 0×00 C000 – 0×00 C800 DFB 0×01 0000 – 0×01 FFFF Digital Interconnect configuration 0×05 0220 – 0×05 02F0 Debug controller 0×08 0000 – 0×08 1FFF Flash ECC bytes 0×80 0000 – 0×FF FFFF External memory interface Each SFR supported I/O port provides three SFRs:  SFRPRTxDR sets the output data state of the port (where × is port number and includes ports 0–6, 12 and 15).  The SFRPRTxSEL selects whether the PHUB PRTxDR Purpose register or the SFRPRTxDR controls each pin’s output buffer within the port. If a SFRPRTxSEL[y] bit is high, the corresponding SFRPRTxDR[y] bit sets the output state for that pin. If a SFRPRTxSEL[y] bit is low, the corresponding PRTxDR[y] bit sets the output state of the pin (where y varies from 0 to 7).  The SFRPRTxPS is a read only register that contains pin state values of the port pins. Document Number: 001-11729 Rev. AH Page 27 of 140 PSoC® 3: CY8C38 Family Datasheet 6. System Integration Key features of the clocking system include:  Seven general purpose clock sources 6.1 Clocking System The clocking system generates, divides, and distributes clocks throughout the PSoC system. For the majority of systems, no external crystal is required. The IMO and PLL together can generate up to a 66 MHz clock, accurate to ±1 percent over voltage and temperature. Additional internal and external clock sources allow each design to optimize accuracy, power, and cost. Any of the clock sources can be used to generate other clock frequencies in the 16-bit clock dividers and UDBs for anything the user wants, for example a UART baud rate generator. Clock generation and distribution is automatically configured through the PSoC Creator IDE graphical interface. This is based on the complete system’s requirements. It greatly speeds the design process. PSoC Creator allows you to build clocking systems with minimal input. You can specify desired clock frequencies and accuracies, and the software locates or builds a clock that meets the required specifications. This is possible because of the programmability inherent in PSoC. 3- to 62-MHz IMO, ±1% at 3 MHz 4- to 25-MHz external crystal oscillator (MHzECO)  Clock doubler provides a doubled clock frequency output for the USB block, see USB Clock Domain on page 30.  DSI signal from an external I/O pin or other logic  24- to 67-MHz fractional PLL sourced from IMO, MHzECO, or DSI  1-kHz, 33-kHz, 100-kHz ILO for WDT and sleep timer  32.768-kHz external crystal oscillator (kHzECO) for RTC  IMO has a USB mode that auto locks to the USB bus clock requiring no external crystal for USB (USB equipped parts only)    Independently sourced clock in all clock dividers  Eight 16-bit clock dividers for the digital system  Four 16-bit clock dividers for the analog system  Dedicated 16-bit divider for the bus clock  Dedicated 4-bit divider for the CPU clock  Automatic clock configuration in PSoC Creator Table 6-1. Oscillator Summary Source Fmin Tolerance at Fmin Fmax Tolerance at Fmax Startup Time IMO 3 MHz ±1% over voltage and temperature 62 MHz ±7% 13 µs max MHzECO 4 MHz Crystal dependent 25 MHz Crystal dependent 5 ms typ, max is crystal dependent DSI 0 MHz Input dependent 33 MHz Input dependent Input dependent PLL 24 MHz Input dependent 67 MHz Input dependent 250 µs max Doubler 48 MHz Input dependent 48 MHz Input dependent 1 µs max ILO 1 kHz –50%, +100% 100 kHz –55%, +100% 15 ms max in lowest power mode kHzECO 32 kHz Crystal dependent 32 kHz 500 ms typ, max is crystal dependent Crystal dependent Figure 6-1. Clocking Subsystem 3-62 MHz IMO 4-25 MHz ECO External IO or DSI 0-33 MHz 32 kHz ECO 1,33,100 kHz ILO CPU Clock CPU Clock Divider 4 bit 48 MHz Doubler for USB 24-67 MHz PLL Master Mux Bus Clock Divider 16 bit 7 Digital Clock Divider 16 bit Digital Clock Divider 16 bit Analog Clock Divider 16 bit s k e w Digital Clock Divider 16 bit Digital Clock Divider 16 bit Analog Clock Divider 16 bit s k e w Digital Clock Divider 16 bit Digital Clock Divider 16 bit Analog Clock Divider 16 bit s k e w Digital Clock Divider 16 bit Digital Clock Divider 16 bit Analog Clock Divider 16 bit s k e w 7 Document Number: 001-11729 Rev. AH Bus Clock Page 28 of 140 PSoC® 3: CY8C38 Family Datasheet 6.1.1 Internal Oscillators Figure 6-1 shows that there are two internal oscillators. They can be routed directly or divided. The direct routes may not have a 50% duty cycle. Divided clocks have a 50% duty cycle. 6.1.1.1 Internal Main Oscillator In most designs the IMO is the only clock source required, due to its ±1-percent accuracy. The IMO operates with no external components and outputs a stable clock. A factory trim for each frequency range is stored in the device. With the factory trim, tolerance varies from ±1 percent at 3 MHz, up to ±7 percent at 62 MHz. The IMO, in conjunction with the PLL, allows generation of other clocks up to the device's maximum frequency (see PLL). The IMO provides clock outputs at 3, 6, 12, 24, 48, and 62 MHz. 6.1.1.2 Clock Doubler The clock doubler outputs a clock at twice the frequency of the input clock. The doubler works at input frequency of 24 MHz, providing 48 MHz for the USB. It can be configured to use a clock from the IMO, MHzECO, or the DSI (external pin). 6.1.1.3 PLL The PLL allows low-frequency, high-accuracy clocks to be multiplied to higher frequencies. This is a trade off between higher clock frequency and accuracy and, higher power consumption and increased startup time. The PLL block provides a mechanism for generating clock frequencies based upon a variety of input sources. The PLL outputs clock frequencies in the range of 24 to 67 MHz. Its input and feedback dividers supply 4032 discrete ratios to create almost any desired clock frequency. The accuracy of the PLL output depends on the accuracy of the PLL input source. The most common PLL use is to multiply the IMO clock at 3 MHz, where it is most accurate, to generate the other clocks up to the device’s maximum frequency. The PLL achieves phase lock within 250 µs (verified by bit setting). It can be configured to use a clock from the IMO, MHzECO or DSI (external pin). The PLL clock source can be used until lock is complete and signaled with a lock bit. The lock signal can be routed through the DSI to generate an interrupt. Disable the PLL before entering low-power modes. 6.1.1.4 Internal Low-Speed Oscillator The ILO provides clock frequencies for low-power consumption, including the watchdog timer, and sleep timer. The ILO generates up to three different clocks: 1 kHz, 33 kHz, and 100 kHz. The 1-kHz clock (CLK1K) is typically used for a background ‘heartbeat’ timer. This clock inherently lends itself to low-power supervisory operations such as the watchdog timer and long sleep intervals using the central timewheel (CTW). The central timewheel is a 1-kHz, free running, 13-bit counter clocked by the ILO. The central timewheel is always enabled, except in hibernate mode and when the CPU is stopped during debug on chip mode. It can be used to generate periodic interrupts for timing purposes or to wake the system from a low-power mode. Firmware can reset the central timewheel. Systems that require accurate timing should use the RTC capability instead of the central timewheel. Document Number: 001-11729 Rev. AH The 100-kHz clock (CLK100K) can be used as a low power master clock. It can also generate time intervals using the fast timewheel. The fast timewheel is a 5-bit counter, clocked by the 100-kHz clock. It features programmable settings and automatically resets when the terminal count is reached. An optional interrupt can be generated each time the terminal count is reached. This enables flexible, periodic interrupts of the CPU at a higher rate than is allowed using the central timewheel. The 33-kHz clock (CLK33K) comes from a divide-by-3 operation on CLK100K. This output can be used as a reduced accuracy version of the 32.768-kHz ECO clock with no need for a crystal. 6.1.2 External Oscillators Figure 6-1 shows that there are two external oscillators. They can be routed directly or divided. The direct routes may not have a 50% duty cycle. Divided clocks have a 50% duty cycle. 6.1.2.1 MHz External Crystal Oscillator The MHzECO provides high frequency, high precision clocking using an external crystal (see Figure 6-2). It supports a wide variety of crystal types, in the range of 4 to 25 MHz. When used in conjunction with the PLL, it can generate other clocks up to the device's maximum frequency (see PLL). The GPIO pins connecting to the external crystal and capacitors are fixed. MHzECO accuracy depends on the crystal chosen. Figure 6-2. MHzECO Block Diagram 4 - 25 MHz Crystal Osc Xi (Pin P15[1]) External Components XCLK_MHZ Xo (Pin P15[0]) 4 –25 MHz crystal Capacitors 6.1.2.2 32.768-kHz ECO The 32.768-kHz external crystal oscillator (32kHzECO) provides precision timing with minimal power consumption using an external 32.768-kHz watch crystal (see Figure 6-3). The 32kHzECO also connects directly to the sleep timer and provides the source for the RTC. The RTC uses a 1-second interrupt to implement the RTC functionality in firmware. The oscillator works in two distinct power modes. This allows users to trade off power consumption with noise immunity from neighboring circuits. The GPIO pins connected to the external crystal and capacitors are fixed. Page 29 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 6-3. 32kHzECO Block Diagram XCLK32K 32 kHz Crystal Osc The clock distribution system generates several types of clock trees.  The master clock is used to select and supply the fastest clock in the system for general clock requirements and clock synchronization of the PSoC device.  Bus clock 16-bit divider uses the master clock to generate the bus clock used for data transfers. Bus clock is the source clock for the CPU clock divider. Xi (Pin P15[3]) External Components Xo (Pin P15[2]) 32 kHz crystal Capacitors It is recommended that the external 32.768-kHz watch crystal have a load capacitance (CL) of 6 pF or 12.5 pF. Check the crystal manufacturer's datasheet. The two external capacitors, CL1 and CL2, are typically of the same value, and their total capacitance, CL1CL2 / (CL1 + CL2), including pin and trace capacitance, should equal the crystal CL value. For more information, refer to application note AN54439: PSoC 3 and PSoC 5 External Oscillators. See also pin capacitance specifications in the “GPIO” section on page 80. 6.1.2.3 Digital System Interconnect The DSI provides routing for clocks taken from external clock oscillators connected to I/O. The oscillators can also be generated within the device in the digital system and UDBs. While the primary DSI clock input provides access to all clocking resources, up to eight other DSI clocks (internally or externally generated) may be routed directly to the eight digital clock dividers. This is only possible if there are multiple precision clock sources. 6.1.3 Clock Distribution All seven clock sources are inputs to the central clock distribution system. The distribution system is designed to create multiple high precision clocks. These clocks are customized for the design’s requirements and eliminate the common problems found with limited resolution prescalers attached to peripherals. Document Number: 001-11729 Rev. AH  Eight fully programmable 16-bit clock dividers generate digital system clocks for general use in the digital system, as configured by the design’s requirements. Digital system clocks can generate custom clocks derived from any of the seven clock sources for any purpose. Examples include baud rate generators, accurate PWM periods, and timer clocks, and many others. If more than eight digital clock dividers are required, the UDBs and fixed function timer/counter/PWMs can also generate clocks.  Four 16-bit clock dividers generate clocks for the analog system components that require clocking, such as ADC and mixers. The analog clock dividers include skew control to ensure that critical analog events do not occur simultaneously with digital switching events. This is done to reduce analog system noise. Each clock divider consists of an 8-input multiplexer, a 16-bit clock divider (divide by 2 and higher) that generates ~50 percent duty cycle clocks, master clock resynchronization logic, and deglitch logic. The outputs from each digital clock tree can be routed into the digital system interconnect and then brought back into the clock system as an input, allowing clock chaining of up to 32 bits. 6.1.4 USB Clock Domain The USB clock domain is unique in that it operates largely asynchronously from the main clock network. The USB logic contains a synchronous bus interface to the chip, while running on an asynchronous clock to process USB data. The USB logic requires a 48 MHz frequency. This frequency can be generated from different sources, including DSI clock at 48 MHz or doubled value of 24 MHz from internal oscillator, DSI signal, or crystal oscillator. Page 30 of 140 PSoC® 3: CY8C38 Family Datasheet 6.2 Power System VDDIO pins must have capacitors connected as shown in Figure 6-4. The two VCCD pins must be shorted together, with as short a trace as possible, and connected to a 1-µF ±10-percent X5R capacitor. The power system also contains a sleep regulator, an I2C regulator, and a hibernate regulator. The power system consists of separate analog, digital, and I/O supply pins, labeled VDDA, VDDD, and VDDIOX, respectively. It also includes two internal 1.8-V regulators that provide the digital (VCCD) and analog (VCCA) supplies for the internal core logic. The output pins of the regulators (VCCD and VCCA) and the Figure 6-4. PSoC Power System VDDD 1 µF VDDIO2 VDDD I/O Supply VSSD VCCD VDDIO 2 VDDIO0 0.1 µF 0.1 µF I/O Supply VDDIO0 0.1 µF I2C Regulator Sleep Regulator Digital Domain VDDA VDDA Analog Regulator Digital Regulators VSSB VCCA 0.1 µF 1 µF . VSSA Analog Domain 0.1 µF I/O Supply VDDIO3 VDDD VSSD I/O Supply VCCD VDDIO1 Hibernate Regulator 0.1 µF 0.1 µF VDDIO1 VDDD VDDIO3 Notes  The two VCCD pins must be connected together with as short a trace as possible. A trace under the device is recommended, as shown in Figure 2-8 on page 12.  It is good practice to check the datasheets for your bypass capacitors, specifically the working voltage and the DC bias specifications. With some capacitors, the actual capacitance can decrease considerably when the DC bias (VDDX or VCCX in Figure 6-4) is a significant percentage of the rated working voltage.  You can power the device in internally regulated mode, where the voltage applied to the VDDx pins is as high as 5.5 V, and the internal regulators provide the core voltages. In this mode, do not apply power to the VCCx pins, and do not tie the VDDx pins to the VCCx pins.  You can also power the device in externally regulated mode, that is, by directly powering the VCCD and VCCA pins. In this configuration, the VDDD pins should be shorted to the VCCD pins and the VDDA pin should be shorted to the VCCA pin. The allowed supply range in this configuration is 1.71 V to 1.89 V. After power up in this configuration, the internal regulators are on by default, and should be disabled to reduce power consumption. Document Number: 001-11729 Rev. AH Page 31 of 140 PSoC® 3: CY8C38 Family Datasheet 6.2.1 Power Modes PSoC 3 devices have four different power modes, as shown in Table 6-2 and Table 6-3. The power modes allow a design to easily provide required functionality and processing power while simultaneously minimizing power consumption and maximizing battery life in low-power and portable devices. PSoC 3 power modes, in order of decreasing power consumption are:  Active  Alternate Active  Sleep Active is the main processing mode. Its functionality is configurable. Each power controllable subsystem is enabled or disabled by using separate power configuration template registers. In alternate active mode, fewer subsystems are enabled, reducing power. In sleep mode most resources are disabled regardless of the template settings. Sleep mode is optimized to provide timed sleep intervals and Real Time Clock functionality. The lowest power mode is hibernate, which retains register and SRAM state, but no clocks, and allows wakeup only from I/O pins. Figure 6-5 on page 33 illustrates the allowable transitions between power modes. Sleep and hibernate modes should not be entered until all VDDIO supplies are at valid voltage levels.  Hibernate Table 6-2. Power Modes Power Modes Description Active Primary mode of operation, all peripherals available (programmable) Alternate Active Entry Condition Wakeup Source Active Clocks Regulator Wakeup, reset, Any interrupt Any All regulators available. manual register (programmable) Digital and analog entry regulators can be disabled if external regulation used. Manual register Any interrupt Any All regulators available. entry (programmable) Digital and analog regulators can be disabled if external regulation used. Similar to Active mode, and is typically configured to have fewer peripherals active to reduce power. One possible configuration is to use the UDBs for processing, with the CPU turned off All subsystems automatically Manual register disabled entry Sleep Manual register All subsystems automatically entry disabled Lowest power consuming mode with all peripherals and internal regulators disabled, except hibernate regulator is enabled Configuration and memory contents retained Hibernate Comparator, ILO/kHzECO PICU, I2C, RTC, CTW, LVD PICU Both digital and analog regulators buzzed. Digital and analog regulators can be disabled if external regulation used. Only hibernate regulator active. Table 6-3. Power Modes Wakeup Time and Power Consumption Sleep Modes Active Alternate Active Sleep Wakeup Time Current (typ) Code Execution Digital Resources Analog Resources Clock Sources Available Wakeup Sources Reset Sources – 1.2 mA[12] Yes All All All – All – – User defined All All All – All 3.6 V – – – – – – – – – – – – – 0.2 0.5 4.1 0.2 0.2 3.2 0.2 0.3 3.3 0.3 1.4 1.1 0.7 1.5 1.5 5.3 1.5 1.5 4.2 1.5 1.5 4.3 0.6 3.3 3.1 3.1 VDD = VDDIO = 2.7 V – 3.6 V VDD = VDDIO = 1.71 V – 1.95 V[30] VDD = VDDIO = 4.5 V - 5.5 V µA µA mA mA mA mA Notes 28. If VCCD and VCCA are externally regulated, the voltage difference between VCCD and VCCA must be less than 50 mV. 29. Sleep timer generates periodic interrupts to wake up the CPU. This specification applies only to those times that the CPU is off. 30. Externally regulated mode. 31. Based on device characterization (not production tested). 32. Based on device characterization (not production tested). USBIO pins tied to ground (VSSD). Document Number: 001-11729 Rev. AH Page 73 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-1. Active Mode Current vs FCPU, VDD = 3.3 V, Temperature = 25 °C Figure 11-2. Active Mode Current vs Temperature and FCPU, VDD = 3.3 V Figure 11-3. Active Mode Current vs VDD and Temperature, FCPU = 24 MHz Document Number: 001-11729 Rev. AH Page 74 of 140 PSoC® 3: CY8C38 Family Datasheet Table 11-3. AC Specifications[33] Parameter Description Conditions Min Typ Max Units FCPU CPU frequency 1.71 V ≤ VDDD ≤ 5.5 V DC – 67.01 MHz FBUSCLK Bus frequency 1.71 V ≤ VDDD ≤ 5.5 V DC – 67.01 MHz Svdd VDD ramp rate – – 0.066 V/µs TIO_INIT Time from VDDD/VDDA/VCCD/VCCA ≥ IPOR to I/O ports set to their reset states – – 10 µs TSTARTUP Time from VDDD/VDDA/VCCD/VCCA VCCA/VDDA = regulated from ≥ PRES to CPU executing code at VDDA/VDDD, no PLL used, fast IMO reset vector boot mode (48 MHz typ.) – – 40 µs – – 74 µs VCCA/VCCD = regulated from VDDA/VDDD, no PLL used, slow IMO boot mode (12 MHz typ.) TSLEEP Wakeup from sleep mode – Application of non-LVD interrupt to beginning of execution of next CPU instruction – – 15 µs THIBERNATE Wakeup from hibernate mode – Application of external interrupt to beginning of execution of next CPU instruction – – 100 µs Figure 11-4. FCPU vs. VDD Vdd Voltage 5.5 V Valid Operating Region 3.3 V 1.71 V Valid Operating Region with SMP 0.5 V 0V DC 1 MHz 10 MHz 67 MHz CPU Frequency Note 33. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 75 of 140 PSoC® 3: CY8C38 Family Datasheet 11.3 Power Regulators Specifications are valid for –40 °C ≤ TA ≤ 85 °C and TJ ≤ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.3.1 Digital Core Regulator Table 11-4. Digital Core Regulator DC Specifications Parameter Description VDDD Input voltage VCCD Output voltage Regulator output capacitor Conditions ±10%, X5R ceramic or better. The two VCCD pins must be shorted together, with as short a trace as possible, see Power System on page 31 Figure 11-5. Regulators VCC vs VDD Min 1.8 – 0.9 Typ – 1.80 1 Max 5.5 – 1.1 Units V V µF Figure 11-6. Digital Regulator PSRR vs Frequency and VDD 11.3.2 Analog Core Regulator Table 11-5. Analog Core Regulator DC Specifications Parameter Description VDDA Input voltage VCCA Output voltage Regulator output capacitor Conditions ±10%, X5R ceramic or better Min 1.8 – 0.9 Typ – 1.80 1 Max 5.5 – 1.1 Units V V µF Figure 11-7. Analog Regulator PSRR vs Frequency and VDD Document Number: 001-11729 Rev. AH Page 76 of 140 PSoC® 3: CY8C38 Family Datasheet 11.3.3 Inductive Boost Regulator Unless otherwise specified, operating conditions are: VBAT = 0.5 V–3.6 V, VOUT = 1.8 V–5.0 V, IOUT = 0 mA–50 mA, LBOOST = 4.7 µH–22 µH, CBOOST = 22 µF || 3 × 1.0 µF || 3 × 0.1 µF, CBAT = 22 µF, IF = 1.0 A. Unless otherwise specified, all charts and graphs show typical values. Table 11-6. Inductive Boost Regulator DC Specifications Parameter Description voltage[34] VOUT Boost output VBAT Input voltage to boost[35] IOUT Output current Conditions Min Typ Max Units vsel = 1.8 V in register BOOST_CR0 vsel = 1.9 V in register BOOST_CR0 vsel = 2.0 V in register BOOST_CR0 vsel = 2.4 V in register BOOST_CR0 vsel = 2.7 V in register BOOST_CR0 vsel = 3.0 V in register BOOST_CR0 vsel = 3.3 V in register BOOST_CR0 vsel = 3.6 V in register BOOST_CR0 vsel = 5.0 V in register BOOST_CR0 IOUT = 0 mA–5 mA vsel = 1.8 V–2.0 V, TA = 0 °C–70 °C 1.71 1.81 1.90 2.16 2.43 2.70 2.97 3.24 4.50 0.5 1.8 1.90 2.00 2.40 2.70 3.00 3.30 3.60 5.00 – 1.89 2.00 2.10 2.64 2.97 3.30 3.63 3.96 5.50 0.8 V V V V V V V V V V IOUT = 0 mA–15 mA vsel = 1.8 V–5.0 V[36], TA = –10 °C–85 °C 1.6 – 3.6 V IOUT = 0 mA–25 mA vsel = 1.8 V–2.7 V, TA = –10 °C–85 °C 0.8 – 1.6 V IOUT = 0 mA–50 mA vsel = 1.8 V–3.3 V[36], TA = –40 °C–85 °C 1.8 – 2.5 V vsel = 1.8 V–3.3 V[36], TA = –10 °C–85 °C 1.3 – 2.5 V vsel = 2.5 V–5.0 V[36], TA = –10 °C–85 °C 2.5 – 3.6 V TA = 0 °C–70 °C VBAT = 0.5 V–0.8 V 0 – 5 mA TA = –10 °C–85 °C VBAT = 1.6 V–3.6 V 0 – 15 mA VBAT = 0.8 V–1.6 V 0 – 25 mA VBAT = 1.3 V–2.5 V 0 – 50 mA VBAT = 2.5 V–3.6 V 0 – 50 mA VBAT = 1.8 V–2.5 V 0 – 50 mA TA = –40 °C–85 °C ILPK Inductor peak current IQ Quiescent current – – 700 mA – – 250 25 – – µA µA RegLOAD Load regulation – – 10 % RegLINE Line regulation – – 10 % Boost active mode Boost sleep mode, IOUT < 1 µA Notes 34. Listed vsel options are characterized. Additional vsel options are valid and guaranteed by design. 35. The boost will start at all valid VBAT conditions including down to VBAT = 0.5 V. 36. If VBAT is greater than or equal to VOUT boost setting, then VOUT will be less than VBAT due to resistive losses in the boost circuit. Document Number: 001-11729 Rev. AH Page 77 of 140 PSoC® 3: CY8C38 Family Datasheet Table 11-7. Recommended External Components for Boost Circuit Parameter LBOOST Description Conditions Boost inductor Min Typ Max Units 4.7 µH nominal 3.7 4.7 5.7 µH 10 µH nominal 8.0 10.0 12.0 µH 17.0 22.0 27.0 µH CBOOST Total capacitance sum of VDDD, VDDA, VDDIO[37] 22 µH nominal 17.0 26.0 31.0 µF CBAT Battery filter capacitor 17.0 22.0 27.0 µF IF Schottky diode average forward current 1.0 – – A VR Schottky reverse voltage 20.0 – – V Figure 11-8. TA range over VBAT and VOUT Figure 11-9. IOUT range over VBAT and VOUT   ± µ& ± ƒ& P$  ± ± ƒ&  & 9%$79 9%$79     P$   P$ 1R%RRVW    P$     1R%RRVW  ±ƒ&   92879   P$       92879  Figure 11-10. LBOOST values over VBAT and VOUT  —+ —+ ,287  P$—+—+ ,287  P$—+ 9%$79  —+ —+ —+   —+ —+    —+ —+ 1R%RRVW —+       92879  Note 37. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 78 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-11. Efficiency vs VBAT, LBOOST = 4.7 µH [38] Figure 11-12. Efficiency vs VBAT, LBOOST = 10 µH [38] 100% 95% Vout = 1.8 V 95% 90% Vout = 2.4 V 90% 85% Vout = 3.3 V 85% 80% % Efficiency % Efficiency 100% Vout = 5.0 V 80% 75% Vout = 1.8 V 70% Vout = 2.4 V 65% 65% Vout = 3 3.3 3V 60% 60% Vout = 5.0 V 55% 55% 75% 70% 50% 50% 0 0.5 1 1.5 2 2.5 3 3.5 0 4 0.5 1 1.5 2 2.5 3 3.5 4 VBAT, V VBAT, V Figure 11-13. Efficiency vs VBAT, LBOOST = 22 µH [38] Figure 11-14. VRIPPLE vs VBAT [38] 100% 300 95% 250 90% 200 VRIPPLE, mV % Efficiency 85% 80% Vout = 1.8 V 75% Vout = 2.4 V 70% 150 Lboost = 4.7 uH 100 Lboost = 10 uH Vout = 3.3 V 65% Lboost = 22 uH 50 60% 55% 0 0 50% 0 0.5 1 1.5 2 2.5 3 3.5 4 0.5 1 1.5 2 2.5 3 3.5 4 VBAT, V VBAT, V Note 38. Typical example. Actual values may vary depending on external component selection, PCB layout, and other design parameters. Document Number: 001-11729 Rev. AH Page 79 of 140 PSoC® 3: CY8C38 Family Datasheet 11.4 Inputs and Outputs Specifications are valid for –40 °C ≤ TA ≤ 85 °C and TJ ≤ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. Unless otherwise specified, all charts and graphs show typical values. When the power supplies ramp up, the pin voltages are indeterminate until both VDDIO and VDDA reach the IPOR voltage, which can be as high as 1.45 V. At that point, the pins change to their normal NVL settings. 11.4.1 GPIO Table 11-9. GPIO DC Specifications Parameter Description Conditions Min Typ Max Units VIH Input voltage high threshold CMOS Input, PRT[×]CTL = 0 0.7 × VDDIO – – V VIL Input voltage low threshold CMOS Input, PRT[×]CTL = 0 – – 0.3 × VDDIO V VIH Input voltage high threshold LVTTL Input, PRT[×]CTL = 1, VDDIO < 2.7 V 0.7 × VDDIO – – V VIH Input voltage high threshold LVTTL Input, PRT[×]CTL = 1, VDDIO ≥ 2.7V 2.0 – – V VIL Input voltage low threshold LVTTL Input, PRT[×]CTL = 1, VDDIO < 2.7 V – – 0.3 × VDDIO V VIL Input voltage low threshold LVTTL Input, PRT[×]CTL = 1, VDDIO ≥ 2.7V – – 0.8 V VOH Output voltage high IOH = 4 mA at 3.3 VDDIO VDDIO – 0.6 – – V IOH = 1 mA at 1.8 VDDIO VDDIO – 0.5 – – V IOL = 8 mA at 3.3 VDDIO – – 0.6 V IOL = 4 mA at 1.8 VDDIO – – 0.6 V VOL Output voltage low IOL = 3 mA at 3.3 VDDIO Rpullup Pull-up resistor Rpulldown Pull-down resistor IIL Input leakage current (absolute CIN Input capacitance[39] value)[39] – – 0.4 V 3.5 5.6 8.5 kΩ 3.5 5.6 8.5 kΩ 25 °C, VDDIO = 3.0 V – – 2 nA GPIOs not shared with opamp outputs, MHz ECO or kHzECO – 4 7 pF GPIOs shared with MHz ECO or kHzECO[40] – 5 7 pF GPIOs shared with opamp outputs – – 18 pF VH Input voltage hysteresis (Schmitt-Trigger)[39] – 40 – mV Idiode Current through protection diode to VDDIO and VSSIO – – 100 µA Rglobal Resistance pin to analog global bus 25 °C, VDDIO = 3.0 V – 320 – Ω Rmux Resistance pin to analog mux bus 25 °C, VDDIO = 3.0 V – 220 – Ω Notes 39. Based on device characterization (Not production tested). 40. For information on designing with PSoC oscillators, refer to the application note, AN54439 - PSoC® 3 and PSoC 5 External Oscillator. Document Number: 001-11729 Rev. AH Page 80 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-15. GPIO Output High Voltage and Current Figure 11-16. GPIO Output Low Voltage and Current Table 11-10. GPIO AC Specifications Parameter TriseF TfallF TriseS TfallS Fgpioout Fgpioin Description Rise time in Fast Strong Mode[41] Fall time in Fast Strong Mode[41] Rise time in Slow Strong Mode[41] Fall time in Slow Strong Mode[41] GPIO output operating frequency 2.7 V < VDDIO < 5.5 V, fast strong drive mode 1.71 V < VDDIO < 2.7 V, fast strong drive mode 3.3 V < VDDIO < 5.5 V, slow strong drive mode 1.71 V < VDDIO < 3.3 V, slow strong drive mode GPIO input operating frequency 1.71 V < VDDIO < 5.5 V Conditions 3.3 V VDDIO Cload = 25 pF 3.3 V VDDIO Cload = 25 pF 3.3 V VDDIO Cload = 25 pF 3.3 V VDDIO Cload = 25 pF Min – – – – Typ – – – – Max 6 6 60 60 Units ns ns ns ns 90/10% VDDIO into 25 pF 90/10% VDDIO into 25 pF 90/10% VDDIO into 25 pF 90/10% VDDIO into 25 pF – – – – – – – – 33 20 7 3.5 MHz MHz MHz MHz 90/10% VDDIO – – 33 MHz Note 41. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 81 of 140 PSoC® 3: CY8C38 Family Datasheet 11.4.2 SIO Table 11-11. SIO DC Specifications Parameter Description Conditions Min Typ Max Units All allowed values of VDDIO and VDDD, see Section 11.1 – – 5.5 V 0.5 – 0.52 × VDDIO V VDDIO > 3.7 1 – VDDIO – 1 V VDDIO < 3.7 1 – VDDIO – 0.5 V GPIO mode CMOS input 0.7 × VDDIO – – V Differential input mode[42] Hysteresis disabled SIO_ref + 0.2 – – V Vinmax Maximum input voltage Vinref Input voltage reference (Differential input mode) Output voltage reference (Regulated output mode) Voutref Input voltage high threshold VIH Input voltage low threshold VIL GPIO mode CMOS input – – 0.3 × VDDIO V Differential input mode[42] Hysteresis disabled – – SIO_ref – 0.2 V VDDIO – 0.4 – – V Output voltage high VOH Unregulated mode Regulated mode[42] Regulated mode[42] VOL Output voltage low IOH = 4 mA, VDDIO = 3.3 V IOH = 1 mA SIO_ref – 0.65 – SIO_ref + 0.2 V IOH = 0.1 mA SIO_ref – 0.3 – SIO_ref + 0.2 V VDDIO = 3.30 V, IOL = 25 mA – – 0.8 V VDDIO = 3.30 V, IOL = 20 mA – – 0.4 V VDDIO = 1.80 V, IOL = 4 mA Rpullup Rpulldown IIL – – 0.4 V Pull-up resistor 3.5 5.6 8.5 kΩ Pull-down resistor 3.5 5.6 8.5 kΩ – – 14 nA Input leakage current (Absolute value)[43] VIH < Vddsio 25 °C, Vddsio = 3.0 V, VIH = 3.0 V VIH > Vddsio 25 °C, Vddsio = 0 V, VIH = 3.0 V CIN Input Capacitance[43] VH Input voltage hysteresis (Schmitt-Trigger)[43] Idiode – – 10 µA – – 7 pF Single ended mode (GPIO mode) – 40 – mV Differential mode – 35 – mV – – 100 µA Current through protection diode to VSSIO Notes 42. See Figure 6-10 on page 39 and Figure 6-13 on page 43 for more information on SIO reference. 43. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 82 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-17. SIO Output High Voltage and Current, Unregulated Mode Figure 11-18. SIO Output Low Voltage and Current, Unregulated Mode Figure 11-19. SIO Output High Voltage and Current, Regulated Mode Table 11-12. SIO AC Specifications Parameter TriseF TfallF TriseS TfallS Description Rise time in fast strong mode (90/10%)[44] Fall time in fast strong mode (90/10%)[44] Rise time in slow strong mode (90/10%)[44] Fall time in slow strong mode (90/10%)[44] Conditions Cload = 25 pF, VDDIO = 3.3 V Min – Typ – Max 12 Units ns Cload = 25 pF, VDDIO = 3.3 V – – 12 ns Cload = 25 pF, VDDIO = 3.0 V – – 75 ns Cload = 25 pF, VDDIO = 3.0 V – – 60 ns Note 44. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 83 of 140 PSoC® 3: CY8C38 Family Datasheet Table 11-12. SIO AC Specifications (continued) Parameter Fsioout Fsioin Description SIO output operating frequency 2.7 V < VDDIO < 5.5 V, Unregulated output (GPIO) mode, fast strong drive mode 1.71 V < VDDIO < 2.7 V, Unregulated output (GPIO) mode, fast strong drive mode 3.3 V < VDDIO < 5.5 V, Unregulated output (GPIO) mode, slow strong drive mode 1.71 V < VDDIO < 3.3 V, Unregulated output (GPIO) mode, slow strong drive mode 2.7 V < VDDIO < 5.5 V, Regulated output mode, fast strong drive mode 1.71 V < VDDIO < 2.7 V, Regulated output mode, fast strong drive mode 1.71 V < VDDIO < 5.5 V, Regulated output mode, slow strong drive mode SIO input operating frequency 1.71 V < VDDIO < 5.5 V Conditions Min Typ Max Units 90/10% VDDIO into 25 pF – – 33 MHz 90/10% VDDIO into 25 pF – – 16 MHz 90/10% VDDIO into 25 pF – – 5 MHz 90/10% VDDIO into 25 pF – – 4 MHz Output continuously switching into 25 pF – – 20 MHz Output continuously switching into 25 pF – – 10 MHz Output continuously switching into 25 pF – – 2.5 MHz 90/10% VDDIO – – 33 MHz Figure 11-20. SIO Output Rise and Fall Times, Fast Strong Mode, VDDIO = 3.3 V, 25 pF Load Document Number: 001-11729 Rev. AH Figure 11-21. SIO Output Rise and Fall Times, Slow Strong Mode, VDDIO = 3.3 V, 25 pF Load Page 84 of 140 PSoC® 3: CY8C38 Family Datasheet Table 11-13. SIO Comparator Specifications[45] Parameter Vos Description Conditions Min Typ Max Units VDDIO = 2 V – – 68 mV VDDIO = 2.7 V – – 72 Offset voltage VDDIO = 5.5 V TCVos Offset voltage drift with temp CMRR Common mode rejection ratio Tresp – – 82 – – 250 μV/°C VDDIO = 2 V 30 – – dB VDDIO = 2.7 V 35 – – VDDIO = 5.5 V 40 – – – – 30 ns Response time 11.4.3 USBIO For operation in GPIO mode, the standard range for VDDD applies, see Device Level Specifications on page 72. Table 11-14. USBIO DC Specifications Parameter Rusbi Description USB D+ pull-up resistance Min Typ Max Units With idle bus Conditions 0.900 – 1.575 kΩ Rusba USB D+ pull-up resistance While receiving traffic 1.425 – 3.090 kΩ Vohusb Static output high 15 kΩ ±5% to Vss, internal pull-up enabled 2.8 – 3.6 V Volusb Static output low 15 kΩ ±5% to Vss, internal pull-up enabled – – 0.3 V Vihgpio Input voltage high, GPIO mode VDDD ≥ 3 V 2 – – V Vilgpio Input voltage low, GPIO mode VDDD ≥ 3 V – – 0.8 V Vohgpio Output voltage high, GPIO mode IOH = 4 mA, VDDD ≥ 3 V 2.4 – – V Volgpio Output voltage low, GPIO mode IOL = 4 mA, VDDD ≥ 3 V – – 0.3 V Vdi Differential input sensitivity |(D+) – (D–)| – – 0.2 V Vcm Differential input common mode range – 0.8 – 2.5 V 0.8 – 2 V 3 – 7 kΩ 21.78 (–1%) 22 22.22 (+1%) Ω Ω Vse Single ended receiver threshold – Rps2 PS/2 pull-up resistance In PS/2 mode, with PS/2 pull-up enabled External USB series resistor In series with each USB pin Zo USB driver output impedance Including Rext 28 – 44 CIN USB transceiver input capacitance – – – 20 pF IIL[45] Input leakage current (absolute value) 25 °C, VDDD = 3.0 V – – 2 nA Rext Note 45. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 85 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-22. USBIO Output High Voltage and Current, GPIO Mode Figure 11-23. USBIO Output Low Voltage and Current, GPIO Mode Table 11-15. USBIO AC Specifications Parameter Description Tdrate Full-speed data rate average bit rate Tjr1 Receiver data jitter tolerance to next transition Tjr2 Receiver data jitter tolerance to pair transition Tdj1 Driver differential jitter to next transition Tdj2 Driver differential jitter to pair transition Tfdeop Source jitter for differential transition to SE0 transition Tfeopt Source SE0 interval of EOP Tfeopr Receiver SE0 interval of EOP Tfst Width of SE0 interval during differential transition Fgpio_out GPIO mode output operating frequency Tr_gpio Rise time, GPIO mode, 10%/90% VDDD Tf_gpio Fall time, GPIO mode, 90%/10% VDDD Document Number: 001-11729 Rev. AH Conditions 3 V ≤ VDDD ≤ 5.5 V VDDD = 1.71 V VDDD > 3 V, 25 pF load VDDD = 1.71 V, 25 pF load VDDD > 3 V, 25 pF load VDDD = 1.71 V, 25 pF load Min 12 – 0.25% –8 Typ 12 – Max 12 + 0.25% 8 Units MHz ns –5 – 5 ns –3.5 –4 –2 – – – 3.5 4 5 ns ns ns 160 82 – – – – 175 – 14 ns ns ns – – – – – – – – – – – – 20 6 12 40 12 40 MHz MHz ns ns ns ns Page 86 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-24. USBIO Output Rise and Fall Times, GPIO Mode, VDDD = 3.3 V, 25 pF Load Table 11-16. USB Driver AC Specifications Parameter Description Tr Transition rise time Tf Transition fall time TR Rise/fall time matching Vcrs Output signal crossover voltage Document Number: 001-11729 Rev. AH Conditions VUSB_5, VUSB_3.3, see USB DC Specifications on page 111 Min – – 90% Typ – – – Max 20 20 111% Units ns ns 1.3 – 2 V Page 87 of 140 PSoC® 3: CY8C38 Family Datasheet 11.4.4 XRES Table 11-17. XRES DC Specifications Parameter VIH VIL Rpullup CIN VH Idiode Description Input voltage high threshold Input voltage low threshold Pull-up resistor Input capacitance[46] Input voltage hysteresis (Schmitt-Trigger)[46] Current through protection diode to VDDIO and VSSIO Conditions Min 0.7 × VDDIO – 3.5 – – Typ – – 5.6 3 100 Max – 0.3 × VDDIO 8.5 – – Units V V kΩ pF mV – – 100 µA Min 1 Typ – Max – Units µs Table 11-18. XRES AC Specifications Parameter Description TRESET Reset pulse width Conditions 11.5 Analog Peripherals Specifications are valid for –40 °C ≤ TA ≤ 85 °C and TJ ≤ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.5.1 Opamp Table 11-19. Opamp DC Specifications Parameter Description Conditions Min Typ Max Units VI Input voltage range VSSA – VDDA V VOS Input offset voltage – – 2.5 mV Operating temperature –40 °C to 70 °C – – 2 mV TCVOS Input offset voltage drift with temperature Power mode = high – – ±30 µV/ °C Ge1 Gain error, unity gain buffer mode Rload = 1 kΩ – – ±0.1 % CIN Input capacitance Routing from pin VO Output voltage range 1 mA, source or sink, power mode = high IOUT Output current capability, source or sink IDD Quiescent current CMRR Common mode rejection ratio PSRR Power supply rejection ratio IIB Input bias current[46] – – 18 pF VSSA + 0.05 – VDDA – 0.05 V VSSA + 500 mV ≤ Vout ≤ VDDA –500 mV, VDDA > 2.7 V 25 – – mA VSSA + 500 mV ≤ Vout ≤ VDDA –500 mV, 1.7 V = VDDA ≤ 2.7 V 16 – – mA Power mode = min – 250 400 uA Power mode = low – 250 400 uA Power mode = med – 330 950 uA Power mode = high – 1000 2500 uA 80 – – dB VDDA ≥ 2.7 V 85 – – dB VDDA < 2.7 V 70 – – dB 25 °C – 10 – pA Note 46. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 88 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-25. Opamp Voffset Histogram, 3388 samples/847 parts, 25 °C, VDDA = 5 V Figure 11-26. Opamp Voffset vs Temperature, VDDA = 5V Figure 11-27. Opamp Voffset vs Vcommon and VDDA, 25 °C Figure 11-28. Opamp Output Voltage vs Load Current and Temperature, High Power Mode, 25 °C, VDDA = 2.7 V Figure 11-29. Opamp Operating Current vs VDDA and Power Mode Document Number: 001-11729 Rev. AH Page 89 of 140 PSoC® 3: CY8C38 Family Datasheet . Table 11-20. Opamp AC Specifications Parameter GBW SR en Description Gain-bandwidth product Slew rate, 20% - 80% Input noise density Conditions Min Typ Max Units Power mode = minimum, 15 pF load 1 – – MHz Power mode = low, 15 pF load 2 – – MHz Power mode = medium, 200 pF load 1 – – MHz Power mode = high, 200 pF load 3 – – MHz Power mode = low, 15 pF load 1.1 – – V/µs Power mode = medium, 200 pF load 0.9 – – V/µs Power mode = high, 200 pF load 3 – – V/µs Power mode = high, VDDA = 5 V, at 100 kHz – 45 – nV/sqrtHz Figure 11-30. Opamp Noise vs Frequency, Power Mode = High, VDDA = 5V Figure 11-31. Opamp Step Response, Rising Figure 11-32. Opamp Step Response, Falling Document Number: 001-11729 Rev. AH Page 90 of 140 PSoC® 3: CY8C38 Family Datasheet 11.5.2 Delta-sigma ADC Unless otherwise specified, operating conditions are:  Operation in continuous sample mode  fclk = 3.072 MHz for resolution = 16 to 20 bits; fclk = 6.144 MHz for resolution = 8 to 15 bits  Reference = 1.024 V internal reference bypassed on P3.2 or P0.3  Unless otherwise specified, all charts and graphs show typical values Table 11-21. 20-bit Delta-sigma ADC DC Specifications Parameter Description Conditions Resolution Number of channels, single ended Number of channels, differential Monotonic Ge Gain error Gd Gain drift Vos Input offset voltage TCVos Temperature coefficient, input offset voltage Input voltage range, single ended[47] Input voltage range, differential unbuffered[47] Input voltage range, differential, buffered[47] Differential pair is formed using a pair of GPIOs. Yes Buffered, buffer gain = 1, Range = ±1.024 V, 16-bit mode, 25 °C Buffered, buffer gain = 1, Range = ±1.024 V, 16-bit mode Buffered, 16-bit mode, full voltage range Buffered, 16-bit mode, VDDA = 1.8 V ±5%, 25 °C Buffer gain = 1, 16-bit, Range = ±1.024 V Buffer gain = 1, 16-bit, Range = ±1.024 V Buffer gain = 1, 16 bit, [47] CMRRb Common mode rejection ratio, buffered Range = ±1.024 V INL20 Integral non linearity[47] Range = ±1.024 V, unbuffered DNL20 Differential non linearity[47] Range = ±1.024 V, unbuffered INL16 Integral non linearity[47] Range = ±1.024 V, unbuffered [47] DNL16 Differential non linearity Range = ±1.024 V, unbuffered INL12 Integral non linearity[47] Range = ±1.024 V, unbuffered DNL12 Differential non linearity[47] Range = ±1.024 V, unbuffered INL8 Integral non linearity[47] Range = ±1.024 V, unbuffered [47] DNL8 Differential non linearity Range = ±1.024 V, unbuffered Rin_Buff ADC input resistance Input buffer used Input buffer bypassed, 16-bit, Range Rin_ADC16 ADC input resistance = ±1.024 V Input buffer bypassed, 12 bit, Range Rin_ADC12 ADC input resistance = ±1.024 V Rin_ExtRef ADC external reference input resistance PSRRb Power supply rejection ratio, buffered[47] Min 8 Typ – Units bits – Max 20 No. of GPIO No. of GPIO/2 – – – – – – – – ±0.2 % – – 50 ppm/° C – – ±0.2 mV – – ±0.1 mV – – 1 µV/°C VSSA – VDDA V VSSA – VDDA V VSSA – VDDA – 1 V 90 – – dB 85 – – dB – – – – – – – – 10 – – – – – – – – – ±32 ±1 ±2 ±1 ±1 ±1 ±1 ±1 – LSB LSB LSB LSB LSB LSB LSB LSB MΩ – 74[48] – kΩ – 148[48] – kΩ – 70[48, 49] – kΩ – – – Notes 47. Based on device characterization (not production tested). 48. By using switched capacitors at the ADC input an effective input resistance is created. Holding the gain and number of bits constant, the resistance is proportional to the inverse of the clock frequency. This value is calculated, not measured. For more information see the Technical Reference Manual. 49. Recommend an external reference device with an output impedance 2.7 V, VIN ≥ 0.5 V Input offset voltage in slow mode Factory trim, Vin ≥ 0.5 V Min – – Max Units 10 mV 9 mV – 4 mV – – 4 mV – ±12 – mV – 10 32 mV Input offset voltage in fast mode[55] Custom trim – Input offset voltage in slow mode[55] Custom trim Input offset voltage in ultra low-power mode VDDA ≤ 4.6 V VHYST Hysteresis Hysteresis enable mode VICM Input common mode voltage VOS Typ High current / fast mode VSSA – VDDA V Low current / slow mode VSSA – VDDA V Ultra low-power mode VDDA ≤ 4.6 V VSSA – VDDA – 1.15 V CMRR Common mode rejection ratio – 50 – dB ICMP High current mode/fast mode[56] – – 400 µA – – 100 µA – 6 – µA Min Typ Max Units Low current mode/slow mode[56] Ultra low-power mode[56] VDDA ≤ 4.6 V Table 11-31. Comparator AC Specifications Parameter TRESP Description Conditions Response time, high current mode[56] 50 mV overdrive, measured pin-to-pin – 75 110 ns Response time, low current mode[56] 50 mV overdrive, measured pin-to-pin – 155 200 ns Response time, ultra low-power mode[56] 50 mV overdrive, measured pin-to-pin, VDDA ≤ 4.6 V – 55 – µs Notes 54. The resistance of the analog global and analog mux bus is high if VDDA ≤ 2.7 V, and the chip is in either sleep or hibernate mode. Use of analog global and analog mux bus under these conditions is not recommended. 55. The recommended procedure for using a custom trim value for the on-chip comparators can be found in the TRM. 56. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 96 of 140 PSoC® 3: CY8C38 Family Datasheet 11.5.6 Current Digital-to-analog Converter (IDAC) All specifications are based on use of the low-resistance IDAC output pins (see Pin Descriptions on page 12 for details). See the IDAC component data sheet in PSoC Creator for full electrical specifications and APIs. Unless otherwise specified, all charts and graphs show typical values. Table 11-32. IDAC DC Specifications Parameter Description Conditions Min Typ Max Units – – 8 bits Range = 2.04 mA, code = 255, VDDA ≥ 2.7 V, Rload = 600 Ω – 2.04 – mA Range = 2.04 mA, high speed mode, code = 255, VDDA ≤ 2.7 V, Rload = 300 Ω – 2.04 – mA Range = 255 µA, code = 255, Rload = 600 Ω – 255 – µA Range = 31.875 µA, code = 255, Rload = 600 Ω – 31.875 – µA – – Yes Resolution IOUT Output current at code = 255 Monotonicity Ezs Zero scale error Eg Gain error TC_Eg INL DNL Vcompliance Temperature coefficient of gain error Integral nonlinearity Differential nonlinearity Dropout voltage, source or sink mode Document Number: 001-11729 Rev. AH Range = 2.04 mA, 25 °C – 0 ±1 LSB – – ±2.5 % Range = 255 µA, 25 ° C – – ±2.5 % Range = 31.875 µA, 25 ° C – – ±3.5 % Range = 2.04 mA – – 0.04 % / °C Range = 255 µA – – 0.04 % / °C Range = 31.875 µA – – 0.05 % / °C Sink mode, range = 255 µA, Codes 8 – 255, Rload = 2.4 kΩ, Cload = 15 pF – ±0.9 ±1 LSB Source mode, range = 255 µA, Codes 8 – 255, Rload = 2.4 kΩ, Cload = 15 pF – ±1.2 ±1.6 LSB Sink mode, range = 255 µA, Rload = 2.4 kΩ, Cload = 15 pF – ±0.3 ±1 LSB Source mode, range = 255 µA, Rload = 2.4 kΩ, Cload = 15 pF – ±0.3 ±1 LSB Voltage headroom at max current, Rload to VDDA or Rload to VSSA, Vdiff from VDDA 1 – – V Page 97 of 140 PSoC® 3: CY8C38 Family Datasheet Table 11-32. IDAC DC Specifications (continued) Parameter IDD Description Operating current, code = 0 Conditions Min Typ Max Units Low speed mode, source mode, range = 31.875 µA – 44 100 µA Low speed mode, source mode, range = 255 µA, – 33 100 µA Low speed mode, source mode, range = 2.04 mA – 33 100 µA Low speed mode, sink mode, range = 31.875 µA – 36 100 µA Low speed mode, sink mode, range = 255 µA – 33 100 µA Low speed mode, sink mode, range = 2.04 mA – 33 100 µA High speed mode, source mode, range = 31.875 µA – 310 500 µA High speed mode, source mode, range = 255 µA – 305 500 µA High speed mode, source mode, range = 2.04 mA – 305 500 µA High speed mode, sink mode, range = 31.875 µA – 310 500 µA High speed mode, sink mode, range = 255 µA – 300 500 µA High speed mode, sink mode, range = 2.04 mA – 300 500 µA Figure 11-41. IDAC INL vs Input Code, Range = 255 µA, Source Mode Document Number: 001-11729 Rev. AH Figure 11-42. IDAC INL vs Input Code, Range = 255 µA, Sink Mode Page 98 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-43. IDAC DNL vs Input Code, Range = 255 µA, Source Mode Figure 11-44. IDAC DNL vs Input Code, Range = 255 µA, Sink Mode Figure 11-45. IDAC INL vs Temperature, Range = 255 µA, High speed mode Figure 11-46. IDAC DNL vs Temperature, Range = 255 µA, High speed mode Figure 11-47. IDAC Full Scale Error vs Temperature, Range = 255 µA, Source Mode Figure 11-48. IDAC Full Scale Error vs Temperature, Range = 255 µA, Sink Mode Document Number: 001-11729 Rev. AH Page 99 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-49. IDAC Operating Current vs Temperature, Range = 255 µA, Code = 0, Source Mode Figure 11-50. IDAC Operating Current vs Temperature, Range = 255 µA, Code = 0, Sink Mode Table 11-33. IDAC AC Specifications Parameter Description Conditions Min Typ Max Units FDAC Update rate – – 8 Msps TSETTLE Settling time to 0.5 LSB Range = 31.875 µA or 255 µA, full scale transition, High speed mode, 600 Ω 15-pF load – – 125 ns Current noise Range = 255 µA, source mode, High speed mode, VDDA = 5 V, 10 kHz – 340 – pA/sqrtHz Figure 11-51. IDAC Step Response, Codes 0x40 - 0xC0, 255 µA Mode, Source Mode, High speed mode, VDDA = 5 V Document Number: 001-11729 Rev. AH Figure 11-52. IDAC Glitch Response, Codes 0x7F - 0x80, 255 µA Mode, Source Mode, High speed mode, VDDA = 5 V Page 100 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-53. IDAC PSRR vs Frequency Figure 11-54. IDAC Current Noise, 255 µA Mode, Source Mode, High speed mode, VDDA = 5 V 60 50 PSRR, dB P 40 30 20 10 0 0.1 1 10 100 1000 10000 Frequency, kHz 255 ȝA, code 0x7F 255 ȝA, code 0xFF 11.5.7 Voltage Digital to Analog Converter (VDAC) See the VDAC component datasheet in PSoC Creator for full electrical specifications and APIs. Unless otherwise specified, all charts and graphs show typical values. Table 11-34. VDAC DC Specifications Parameter Description Conditions Resolution VOUT Output voltage range, code = 255 Min Typ Max Units – 8 – bits 1 V scale – 1.02 – V 4 V scale, VDDA = 5 V – 4.08 – V INL1 Integral nonlinearity 1 V scale – ±2.1 ±2.5 LSB INL4 Integral nonlinearity[57] 4 V scale – ±2.1 ±2.5 LSB DNL1 Differential nonlinearity 1 V scale – ±0.3 ±1 LSB DNL4 Differential nonlinearity[57] 4 V scale – ±0.3 ±1 LSB Rout Output resistance 1 V scale – 4 – kΩ 4 V scale – 16 – kΩ Monotonicity – – Yes – VOS Zero scale error – 0 ±0.9 LSB Eg Gain error TC_Eg IDD 1 V scale, – – ±2.5 % 4 V scale – – ±2.5 % Temperature coefficient, gain error 1 V scale, – – 0.03 %FSR / °C 4 V scale – – 0.03 %FSR / °C Low speed mode – – 100 µA High speed mode – – 500 µA Operating current Note 57. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 101 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-55. VDAC INL vs Input Code, 1 V Mode Figure 11-56. VDAC DNL vs Input Code, 1 V Mode Figure 11-57. VDAC INL vs Temperature, 1 V Mode Figure 11-58. VDAC DNL vs Temperature, 1 V Mode Figure 11-59. VDAC Full Scale Error vs Temperature, 1 V Mode Figure 11-60. VDAC Full Scale Error vs Temperature, 4 V Mode Document Number: 001-11729 Rev. AH Page 102 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-61. VDAC Operating Current vs Temperature, 1V Mode, Low speed mode Figure 11-62. VDAC Operating Current vs Temperature, 1 V Mode, High speed mode Table 11-35. VDAC AC Specifications Parameter Description Conditions FDAC Update rate 1 V scale TsettleP Settling time to 0.1%, step 25% to 1 V scale, Cload = 15 pF 75% 4 V scale, Cload = 15 pF Settling time to 0.1%, step 75% to 1 V scale, Cload = 15 pF 25% 4 V scale TsettleN Voltage noise Typ Max Units – – 1000 ksps – – 250 ksps – 0.45 1 µs – 0.8 3.2 µs – 0.45 1 µs 4 V scale, Cload = 15 pF – 0.7 3 µs Range = 1 V, High speed mode, VDDA = 5 V, 10 kHz – 750 – nV/sqrtHz Figure 11-63. VDAC Step Response, Codes 0x40 - 0xC0, 1 V Mode, High speed mode, VDDA = 5 V Document Number: 001-11729 Rev. AH Min Figure 11-64. VDAC Glitch Response, Codes 0x7F - 0x80, 1 V Mode, High speed mode, VDDA = 5 V Page 103 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-65. VDAC PSRR vs Frequency Figure 11-66. VDAC Voltage Noise, 1 V Mode, High speed mode, VDDA = 5 V 50 PSRR, dB P 40 30 20 10 0 0.1 1 10 Frequency, kHz 4 V, code 0x7F 100 1000 4 V, code 0xFF 11.5.8 Mixer The mixer is created using a SC/CT analog block; see the Mixer component data sheet in PSoC Creator for full electrical specifications and APIs. Table 11-36. Mixer DC Specifications Parameter VOS G Description Conditions Min Typ Max Units Input offset voltage – – 15 mV Quiescent current – 0.9 2 mA Gain – 0 – dB Min Typ Max Units Table 11-37. Mixer AC Specifications Parameter Description Conditions fLO Local oscillator frequency Down mixer mode – – 4 MHz fin Input signal frequency Down mixer mode – – 14 MHz fLO Local oscillator frequency Up mixer mode – – 1 MHz fin Input signal frequency Up mixer mode – – 1 MHz SR Slew rate 3 – – V/µs Document Number: 001-11729 Rev. AH Page 104 of 140 PSoC® 3: CY8C38 Family Datasheet 11.5.9 Transimpedance Amplifier The TIA is created using a SC/CT analog block; see the TIA component data sheet in PSoC Creator for full electrical specifications and APIs. Table 11-38. Transimpedance Amplifier (TIA) DC Specifications Parameter VIOFF Rconv Description Conditions Min Typ Max Units – – 10 mV R = 20K; 40 pF load –25 – +35 % R = 30K; 40 pF load –25 – +35 % R = 40K; 40 pF load –25 – +35 % R = 80K; 40 pF load –25 – +35 % R = 120K; 40 pF load –25 – +35 % R = 250K; 40 pF load –25 – +35 % Input offset voltage Conversion resistance[58] R= 500K; 40 pF load –25 – +35 % R = 1M; 40 pF load –25 – +35 % – 1.1 2 mA Quiescent current Table 11-39. Transimpedance Amplifier (TIA) AC Specifications Parameter BW Description Input bandwidth (–3 dB) Min Typ Max Units R = 20K; –40 pF load Conditions 1500 – – kHz R = 120K; –40 pF load 240 – – kHz R = 1M; –40 pF load 25 – – kHz Note 58. Conversion resistance values are not calibrated. Calibrated values and details about calibration are provided in PSoC Creator component data sheets. External precision resistors can also be used. Document Number: 001-11729 Rev. AH Page 105 of 140 PSoC® 3: CY8C38 Family Datasheet 11.5.10 Programmable Gain Amplifier The PGA is created using a SC/CT analog block; see the PGA component data sheet in PSoC Creator for full electrical specifications and APIs. Unless otherwise specified, operating conditions are:  Operating temperature = 25 °C for typical values  Unless otherwise specified, all charts and graphs show typical values Table 11-40. PGA DC Specifications Parameter Description Conditions Min Typ Max Units Vssa – VDDA V Vin Input voltage range Power mode = minimum Vos Input offset voltage Power mode = high, gain = 1 – – 10 mV TCVos Input offset voltage drift with temperature Power mode = high, gain = 1 – – ±30 µV/°C Ge1 Gain error, gain = 1 – – ±0.15 % Ge16 Gain error, gain = 16 – – ±2.5 % Ge50 Gain error, gain = 50 – – ±5 % Vonl DC output nonlinearity – – ±0.01 % of FSR Cin Input capacitance – – 7 pF Voh Output voltage swing Power mode = high, gain = 1, Rload = 100 kΩ to VDDA / 2 VDDA – 0.15 – – V Vol Output voltage swing Power mode = high, gain = 1, Rload = 100 kΩ to VDDA / 2 – – VSSA + 0.15 V Vsrc Output voltage under load Iload = 250 µA, VDDA ≥ 2.7V, power mode = high – – 300 mV Idd Operating current Power mode = high – 1.5 1.65 mA PSRR Power supply rejection ratio 48 – – dB Gain = 1 Figure 11-67. PGA Voffset Histogram, 4096 samples/ 1024 parts Document Number: 001-11729 Rev. AH Page 106 of 140 PSoC® 3: CY8C38 Family Datasheet Table 11-41. PGA AC Specifications Parameter Description Conditions Min Typ Max Units 6.7 8 – MHz Power mode = high, gain = 1, 20% to 80% 3 – – V/µs Power mode = high, VDDA = 5 V, at 100 kHz – 43 – nV/sqrtHz BW1 –3 dB bandwidth Power mode = high, gain = 1, input = 100 mV peak-to-peak SR1 Slew rate en Input noise density Figure 11-68. Bandwidth vs. Temperature, at Different Gain Settings, Power Mode = High Figure 11-69. Noise vs. Frequency, VDDA = 5 V, Power Mode = High BW, MHz 10 1 0.1 -40 -20 0 20 40 60 80 Temperature, °C Gain = 1 Gain = 24 Gain = 48 11.5.11 Temperature Sensor Table 11-42. Temperature Sensor Specifications Parameter Description Temp sensor accuracy Conditions Range: –40 °C to +85 °C Min Typ Max Units – ±5 – °C 11.5.12 LCD Direct Drive Table 11-43. LCD Direct Drive DC Specifications Conditions Min Typ Max Units ICC Parameter LCD system operating current Description Device sleep mode with wakeup at 400-Hz rate to refresh LCDs, bus clock = 3 MHz, VDDIO = VDDA = 3 V, 4 commons, 16 segments, 1/4 duty cycle, 50 Hz frame rate, no glass connected – 38 – μA ICC_SEG Current per segment driver Strong drive mode – 260 – µA VBIAS LCD bias range (VBIAS refers to the VDDA ≥ 3 V and VDDA ≥ VBIAS main output voltage(V0) of LCD DAC) 2 – 5 V VDDA ≥ 3 V and VDDA ≥ VBIAS – 9.1 × VDDA – mV Drivers may be combined – 500 5000 pF – – 20 mV 355 – 710 µA LCD bias step size LCD capacitance per segment/common driver Long term segment offset IOUT Output drive current per segment driver) Document Number: 001-11729 Rev. AH VDDIO = 5.5V, strong drive mode Page 107 of 140 PSoC® 3: CY8C38 Family Datasheet Table 11-44. LCD Direct Drive AC Specifications Parameter fLCD Description Conditions LCD frame rate Min Typ Max Units 10 50 150 Hz 11.6 Digital Peripherals Specifications are valid for –40 °C ≤ TA ≤ 85 °C and TJ ≤ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.6.1 Timer The following specifications apply to the Timer/Counter/PWM peripheral in timer mode. Timers can also be implemented in UDBs; for more information, see the Timer component data sheet in PSoC Creator. Table 11-45. Timer DC Specifications Parameter Description Block current consumption Conditions 16-bit timer, at listed input clock frequency 3 MHz 12 MHz 48 MHz 67 MHz Min – Typ – Max – Units µA – – – – 15 60 260 350 – – – – µA µA µA µA Min DC 15 30 15 15 30 15 30 Typ – – – – – – – – Max 67.01 – – – – – – – Units MHz ns ns ns ns ns ns ns Table 11-46. Timer AC Specifications Parameter Description Operating frequency Capture pulse width (Internal) Capture pulse width (external) Timer resolution Enable pulse width Enable pulse width (external) Reset pulse width Reset pulse width (external) Document Number: 001-11729 Rev. AH Conditions Page 108 of 140 PSoC® 3: CY8C38 Family Datasheet 11.6.2 Counter The following specifications apply to the Timer/Counter/PWM peripheral, in counter mode. Counters can also be implemented in UDBs; for more information, see the Counter component data sheet in PSoC Creator. Table 11-47. Counter DC Specifications Parameter Description Block current consumption Conditions 16-bit counter, at listed input clock frequency 3 MHz 12 MHz 48 MHz 67 MHz Min – Typ – Max – Units µA – – – – 15 60 260 350 – – – – µA µA µA µA Min DC 15 15 15 30 15 30 15 30 Typ – – – – Max 67.01 – – – – – – – – – – – Units MHz ns ns ns ns ns ns ns ns Table 11-48. Counter AC Specifications Parameter Description Operating frequency Capture pulse Resolution Pulse width Pulse width (external) Enable pulse width Enable pulse width (external) Reset pulse width Reset pulse width (external) Conditions 11.6.3 Pulse Width Modulation The following specifications apply to the Timer/Counter/PWM peripheral, in PWM mode. PWM components can also be implemented in UDBs; for more information, see the PWM component data sheet in PSoC Creator. Table 11-49. PWM DC Specifications Parameter Description Block current consumption Conditions 16-bit PWM, at listed input clock frequency Min Typ Max Units – – – µA 3 MHz – 15 – µA 12 MHz – 60 – µA 48 MHz – 260 – µA 67 MHz – 350 – µA Table 11-50. Pulse Width Modulation (PWM) AC Specifications Parameter Min Typ Max Units Operating frequency Description Conditions DC – 67.01 MHz Pulse width 15 – – ns Pulse width (external) 30 – – ns Kill pulse width 15 – – ns Kill pulse width (external) 30 – – ns Enable pulse width 15 – – ns Enable pulse width (external) 30 – – ns Reset pulse width 15 – – ns Reset pulse width (external) 30 – – ns Document Number: 001-11729 Rev. AH Page 109 of 140 PSoC® 3: CY8C38 Family Datasheet 11.6.4 I2C Table 11-51. Fixed I2C DC Specifications Parameter Description Block current consumption – – Conditions Enabled, configured for 100 kbps Enabled, configured for 400 kbps Wake from sleep mode Min – – – Typ – – – Max 250 260 30 Units µA µA µA Min Typ Max Units – – 1 Mbps Conditions Min – Typ – Max 200 Units µA Conditions Minimum 8 MHz clock Min – Typ – Max 1 Units Mbit Table 11-52. Fixed I2C AC Specifications Parameter Description Conditions Bit rate 11.6.5 Controller Area Network Table 11-53. CAN DC Specifications[59] Parameter IDD Description Block current consumption Table 11-54. CAN AC Specifications[59] Parameter Description Bit rate 11.6.6 Digital Filter Block Table 11-55. DFB DC Specifications Parameter Description DFB operating current Conditions Min Typ Max Units 500 kHz (6.7 ksps) – 0.16 0.27 mA 1 MHz (13.4 ksps) – 0.33 0.53 mA 64-tap FIR at FDFB 10 MHz (134 ksps) – 3.3 5.3 mA 48 MHz (644 ksps) – 15.7 25.5 mA 67 MHz (900 ksps) – 21.8 35.6 mA Min Typ Max Units DC – 67.01 MHz Table 11-56. DFB AC Specifications Parameter FDFB Description DFB operating frequency Conditions Note 59. Refer to ISO 11898 specification for details. Document Number: 001-11729 Rev. AH Page 110 of 140 PSoC® 3: CY8C38 Family Datasheet 11.6.7 USB Table 11-57. USB DC Specifications Parameter Description Min Typ Max Units USB configured, USB regulator enabled 4.35 – 5.25 V VUSB_3.3 USB configured, USB regulator bypassed 3.15 – 3.6 V VUSB_3 USB configured, USB regulator bypassed[60] 2.85 – 3.6 V – 10 – mA – 8 – mA VDDD = 5 V, connected to USB host, PICU configured to wake on USB resume signal – 0.5 – mA VDDD = 5 V, disconnected from USB host – 0.3 – mA VDDD = 3.3 V, connected to USB host, PICU configured to wake on USB resume signal – 0.5 – mA VDDD = 3.3 V, disconnected from USB host – 0.3 – mA VUSB_5 Device supply (VDDD) for USB operation IUSB_Configured Conditions Device supply current in device VDDD = 5 V, FCPU = 1.5 MHz active mode, bus clock and IMO = V DDD = 3.3 V, FCPU = 1.5 MHz 24 MHz IUSB_Suspended Device supply current in device sleep mode 11.6.8 Universal Digital Blocks (UDBs) PSoC Creator provides a library of prebuilt and tested standard digital peripherals (UART, SPI, LIN, PRS, CRC, timer, counter, PWM, AND, OR, and so on) that are mapped to the UDB array. See the component data sheets in PSoC Creator for full AC/DC specifications, APIs, and example code. Table 11-58. UDB AC Specifications Parameter Description Conditions Min Typ Max Units FMAX_TIMER Maximum frequency of 16-bit timer in a UDB pair – – 67.01 MHz FMAX_ADDER Maximum frequency of 16-bit adder in a UDB pair – – 67.01 MHz – – 67.01 MHz – – 67.01 MHz Datapath Performance FMAX_CRC Maximum frequency of 16-bit CRC/PRS in a UDB pair PLD Performance FMAX_PLD Maximum frequency of a two-pass PLD function in a UDB pair Clock to Output Performance tCLK_OUT Propagation delay for clock in to data 25 °C, VDDD ≥ 2.7 V out, see Figure 11-70. – 20 25 ns tCLK_OUT Propagation delay for clock in to data Worst-case placement, routing, out, see Figure 11-70. and pin selection – – 55 ns Note 60. Rise/fall time matching (TR) not guaranteed, see USB Driver AC Specifications on page 87. Document Number: 001-11729 Rev. AH Page 111 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-70. Clock to Output Performance 11.7 Memory Specifications are valid for –40 °C ≤ TA ≤ 85 °C and TJ ≤ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.7.1 Flash Table 11-59. Flash DC Specifications Parameter Description Erase and program voltage Conditions VDDD pin Min Typ Max Units 1.71 – 5.5 V Min Typ Max Units Table 11-60. Flash AC Specifications Parameter Description Conditions TWRITE Row write time (erase + program) – 15 20 ms TERASE Row erase time – 10 13 ms TBULK Row program time – 5 7 ms Bulk erase time (16 KB to 64 KB) – – 35 ms Sector erase time (8 KB to 16 KB) TPROG Total device programming time No overhead[61] Flash data retention time, retention Average ambient temp. period measured from last erase TA ≤ 55 °C, 100 K erase/program cycles cycle Average ambient temp. TA ≤ 85 °C, 10 K erase/program cycles – – 15 ms – 1.5 2 seconds 20 – – years 10 – – Note 61. See PSoC® 3 Device Programming Specifications for a description of a low-overhead method of programming PSoC 3 flash. Document Number: 001-11729 Rev. AH Page 112 of 140 PSoC® 3: CY8C38 Family Datasheet 11.7.2 EEPROM Table 11-61. EEPROM DC Specifications Parameter Description Conditions Erase and program voltage Min Typ Max Units 1.71 – 5.5 V Table 11-62. EEPROM AC Specifications Parameter TWRITE Min Typ Max Units Single row erase/write cycle time Description Conditions – 10 20 ms EEPROM data retention time, Average ambient temp, TA ≤ 25 °C, retention period measured from last 1M erase/program cycles erase cycle Average ambient temp, TA ≤ 55 °C, 100 K erase/program cycles 20 – – years 20 – – Average ambient temp. TA ≤ 85 °C, 10 K erase/program cycles 10 – – Conditions Min Typ Max Units 1.71 – 5.5 V Min Typ Max Units 11.7.3 Nonvolatile Latches (NVL)) Table 11-63. NVL DC Specifications Parameter Description Erase and program voltage VDDD pin Table 11-64. NVL AC Specifications Parameter Description NVL endurance NVL data retention time Conditions Programmed at 25 °C 1K – – program/erase cycles Programmed at 0 °C to 70 °C 100 – – program/erase cycles Average ambient temp. TA ≤ 55 °C 20 – – years Average ambient temp. TA ≤ 85 °C 10 – – years Conditions Min Typ Max Units 1.2 – – V Min Typ Max Units DC – 67.01 MHz 11.7.4 SRAM Table 11-65. SRAM DC Specifications Parameter VSRAM Description SRAM retention voltage Table 11-66. SRAM AC Specifications Parameter FSRAM Description SRAM operating frequency Document Number: 001-11729 Rev. AH Conditions Page 113 of 140 PSoC® 3: CY8C38 Family Datasheet 11.7.5 External Memory Interface Figure 11-71. Asynchronous Write and Read Cycle Timing, No Wait States Tbus_clock Bus Clock EM_Addr EM_CE EM_WE EM_OE Twr_setup Trd_hold Trd_setup EM_Data Write Cycle Read Cycle Minimum of 4 bus clock cycles between successive EMIF accesses Table 11-67. Asynchronous Write and Read Timing Specifications[62] Parameter Description frequency[63] Fbus_clock Bus clock Tbus_clock Bus clock period[64] Twr_Setup Conditions Min Typ Max Units – – 33 MHz 30.3 – – ns Time from EM_data valid to rising edge of EM_WE and EM_CE Tbus_clock – 10 – – ns Trd_setup Time that EM_data must be valid before rising edge of EM_OE 5 – – ns Trd_hold Time that EM_data must be valid after rising edge of EM_OE 5 – – ns Notes 62. Based on device characterization (Not production tested). 63. EMIF signal timings are limited by GPIO frequency limitations. See “GPIO” section on page 80. 64. EMIF output signals are generally synchronized to bus clock, so EMIF signal timings are dependent on bus clock frequency. Document Number: 001-11729 Rev. AH Page 114 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 11-72. Synchronous Write and Read Cycle Timing, No Wait States Tbus_clock Bus Clock EM_Clock EM_Addr EM_CE EM_ADSC EM_WE EM_OE Twr_setup Trd_hold Trd_setup EM_Data Write Cycle Read Cycle Minimum of 4 bus clock cycles between successive EMIF accesses Table 11-68. Synchronous Write and Read Timing Specifications[65] Parameter Fbus_clock Description Bus clock frequency[66] period[67] Conditions Min Typ Max Units – – 33 MHz 30.3 – – ns Tbus_clock Bus clock Twr_Setup Time from EM_data valid to rising edge of EM_Clock Tbus_clock – 10 – – ns Trd_setup Time that EM_data must be valid before rising edge of EM_OE 5 – – ns Trd_hold Time that EM_data must be valid after rising edge of EM_OE 5 – – ns Notes 65. Based on device characterization (Not production tested). 66. EMIF signal timings are limited by GPIO frequency limitations. See “GPIO” section on page 80. 67. EMIF output signals are generally synchronized to bus clock, so EMIF signal timings are dependent on bus clock frequency. Document Number: 001-11729 Rev. AH Page 115 of 140 PSoC® 3: CY8C38 Family Datasheet 11.8 PSoC System Resources Specifications are valid for –40 °C ≤ TA ≤ 85 °C and TJ ≤ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. 11.8.1 POR with Brown Out For brown out detect in regulated mode, VDDD and VDDA must be ≥ 2.0 V. Brown out detect is not available in externally regulated mode. Table 11-69. Precise Low-Voltage Reset (PRES) with Brown Out DC Specifications Parameter Description PRESR Rising trip voltage PRESF Falling trip voltage Conditions Factory trim Min Typ Max Units 1.64 – 1.68 V 1.62 – 1.66 V Min Typ Max Units – – 0.5 µs – 5 – V/sec Min Typ Max Units 1.68 1.89 2.14 2.38 2.62 2.87 3.11 3.35 3.59 3.84 4.08 4.32 4.56 4.83 5.05 5.30 5.57 1.73 1.95 2.20 2.45 2.71 2.95 3.21 3.46 3.70 3.95 4.20 4.45 4.70 4.98 5.21 5.47 5.75 1.77 2.01 2.27 2.53 2.79 3.04 3.31 3.56 3.81 4.07 4.33 4.59 4.84 5.13 5.37 5.63 5.92 V V V V V V V V V V V V V V V V V Min Typ Max Units – – 1 µs Table 11-70. Power On Reset (POR) with Brown Out AC Specifications Parameter Description Conditions PRES_TR Response time VDDD/VDDA droop rate Sleep mode 11.8.2 Voltage Monitors Table 11-71. Voltage Monitors DC Specifications Parameter Description LVI Trip voltage LVI_A/D_SEL[3:0] = 0000b LVI_A/D_SEL[3:0] = 0001b LVI_A/D_SEL[3:0] = 0010b LVI_A/D_SEL[3:0] = 0011b LVI_A/D_SEL[3:0] = 0100b LVI_A/D_SEL[3:0] = 0101b LVI_A/D_SEL[3:0] = 0110b LVI_A/D_SEL[3:0] = 0111b LVI_A/D_SEL[3:0] = 1000b LVI_A/D_SEL[3:0] = 1001b LVI_A/D_SEL[3:0] = 1010b LVI_A/D_SEL[3:0] = 1011b LVI_A/D_SEL[3:0] = 1100b LVI_A/D_SEL[3:0] = 1101b LVI_A/D_SEL[3:0] = 1110b LVI_A/D_SEL[3:0] = 1111b HVI Trip voltage Conditions Table 11-72. Voltage Monitors AC Specifications Parameter Description Response time[68] Conditions Note 68. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 116 of 140 PSoC® 3: CY8C38 Family Datasheet 11.8.3 Interrupt Controller Table 11-73. Interrupt Controller AC Specifications Parameter Description Conditions Delay from interrupt signal input to ISR Includes worse case completion of code execution from ISR code longest instruction DIV with 6 cycles Min Typ Max Units – – 25 Tcy CPU 11.8.4 JTAG Interface Figure 11-73. JTAG Interface Timing (1/f_TCK) TCK T_TDI_setup T_TDI_hold TDI T_TDO_valid T_TDO_hold TDO T_TMS_setup T_TMS_hold TMS Table 11-74. JTAG Interface AC Specifications[69] Parameter f_TCK Description TCK frequency Conditions 3.3 V ≤ VDDD ≤ 5 V 1.71 V ≤ VDDD < 3.3 V T_TDI_setup TDI setup before TCK high T_TMS_setup TMS setup before TCK high T_TDI_hold TDI, TMS hold after TCK high T = 1/f_TCK max Min Typ Max Units – – 14[70] MHz MHz ns – – 7[70] (T/10) – 5 – – T/4 – – T/4 – – T_TDO_valid TCK low to TDO valid T = 1/f_TCK max – – 2T/5 T_TDO_hold TDO hold after TCK high T = 1/f_TCK max T/4 – – Notes 69. Based on device characterization (Not production tested). 70. f_TCK must also be no more than 1/3 CPU clock frequency. Document Number: 001-11729 Rev. AH Page 117 of 140 PSoC® 3: CY8C38 Family Datasheet 11.8.5 SWD Interface Figure 11-74. SWD Interface Timing (1/f_SW DCK) SW DCK T_SW DI_setup T_SW D I_hold SW DIO (PSoC input) T_SW D O _valid T_SW DO _hold SW DIO (PSoC output) Table 11-75. SWD Interface AC Specifications[71] Parameter Description Conditions Min Typ Max Units MHz 3.3 V ≤ VDDD ≤ 5 V – – 14[72] 1.71 V ≤ VDDD < 3.3 V – – 7[72] MHz – – 5.5[72] MHz T_SWDI_setup SWDIO input setup before SWDCK high T = 1/f_SWDCK max T/4 – – T_SWDI_hold T = 1/f_SWDCK max T/4 – – T = 1/f_SWDCK max – – 2T/5 Min Typ Max Units – – 33 Mbit f_SWDCK SWDCLK frequency 1.71 V ≤ VDDD < 3.3 V, SWD over USBIO pins SWDIO input hold after SWDCK high T_SWDO_valid SWDCK high to SWDIO output 11.8.6 SWV Interface Table 11-76. SWV Interface AC Specifications[71] Parameter Description SWV mode SWV bit rate Conditions Notes 71. Based on device characterization (Not production tested). 72. f_SWDCK must also be no more than 1/3 CPU clock frequency. Document Number: 001-11729 Rev. AH Page 118 of 140 PSoC® 3: CY8C38 Family Datasheet 11.9 Clocking Specifications are valid for –40 °C ≤ TA ≤ 85 °C and TJ ≤ 100 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. Unless otherwise specified, all charts and graphs show typical values. 11.9.1 Internal Main Oscillator Table 11-77. IMO DC Specifications[73] Parameter Description Conditions Min Typ Max Units Supply current 62.6 MHz – – 600 µA 48 MHz – – 500 µA 24 MHz – USB mode 24 MHz – non USB mode With oscillator locking to USB bus – – 500 µA – – 300 µA 12 MHz – – 200 µA 6 MHz – – 180 µA 3 MHz – – 150 µA Figure 11-75. IMO Current vs. Frequency Note 73. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 119 of 140 PSoC® 3: CY8C38 Family Datasheet Table 11-78. IMO AC Specifications Parameter Description Conditions Min Typ Max Units 62.6 MHz –7 – 7 % 48 MHz –5 – 5 % 24 MHz – Non USB mode –4 – 4 % –0.25 – 0.25 % –3 – 3 % –2 – 2 % –1 – 1 % IMO frequency stability (with factory trim) 24 MHz – USB mode FIMO[74] With oscillator locking to USB bus 12 MHz 6 MHz 3 MHz 0 °C to 70 °C –1.5 – 1.5 % 3 MHz frequency stability after typical PCB assembly post-reflow. –40 °C to 85 °C Typical (non-optimized) board layout and 250 °C solder reflow. Device may be calibrated after assembly to improve performance. – ±2 – % Startup time[75] From enable (during normal system operation) – – 13 µs F = 24 MHz – 0.9 – ns F = 3 MHz – 1.6 – ns F = 24 MHz – 0.9 – ns F = 3 MHz – 12 – ns Jitter (peak to peak)[75] Jp–p Jitter (long Jperiod term)[75] Figure 11-76. IMO Frequency Variation vs. Temperature Figure 11-77. IMO Frequency Variation vs. VCC Notes 74. FIMO is measured after packaging, and thus accounts for substrate and die attach stresses. 75. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 120 of 140 PSoC® 3: CY8C38 Family Datasheet 11.9.2 Internal Low-Speed Oscillator Table 11-79. ILO DC Specifications Parameter Description Operating current[76] ICC Conditions Min Typ Max Units FOUT = 1 kHz – – 1.7 µA FOUT = 33 kHz – – 2.6 µA FOUT = 100 kHz – – 2.6 µA Power down mode – – 15 nA Min Typ Max Units – – 2 ms 100 kHz 45 100 200 kHz 1 kHz 0.5 1 2 kHz Leakage current[76] Table 11-80. ILO AC Specifications[77] Parameter Description Startup time, all frequencies FILO Conditions Turbo mode ILO frequencies Figure 11-78. ILO Frequency Variation vs. Temperature Figure 11-79. ILO Frequency Variation vs. VDD 11.9.3 MHz External Crystal Oscillator For more information on crystal or ceramic resonator selection for the MHzECO, refer to application note AN54439: PSoC 3 and PSoC 5 External Oscillators. . Table 11-81. MHzECO DC Specifications Parameter ICC Description Operating current[77] Conditions 13.56 MHz crystal Min Typ Max Units – 3.8 – mA Min Typ Max Units 4 – 25 MHz Table 11-82. MHzECO AC Specifications Parameter F Description Crystal frequency range Conditions Note 76. This value is calculated, not measured. 77. Based on device characterization (Not production tested). Document Number: 001-11729 Rev. AH Page 121 of 140 PSoC® 3: CY8C38 Family Datasheet 11.9.4 kHz External Crystal Oscillator Table 11-83. kHzECO DC Specifications[78] Parameter Description ICC Operating current DL Drive level Conditions Low-power mode; CL = 6 pF Min Typ Max Units – 0.25 1.0 µA – – 1 µW Min Typ Max Units – 32.768 – kHz – 1 – s Min Typ Max Units Table 11-84. kHzECO AC Specifications Parameter Description F Frequency TON Startup time Conditions High power mode 11.9.5 External Clock Reference Table 11-85. External Clock Reference AC Specifications[78] Parameter Description Conditions External frequency range 0 – 33 MHz 30 50 70 % 0.51 – – V/ns Min Typ Max Units In = 3 MHz, Out = 67 MHz – 400 – µA In = 3 MHz, Out = 24 MHz – 200 – µA Min Typ Max Units 1 – 48 MHz 1 – 3 MHz Input duty cycle range Measured at VDDIO/2 Input edge rate VIL to VIH 11.9.6 Phase-Locked Loop Table 11-86. PLL DC Specifications Parameter IDD Description PLL operating current Conditions Table 11-87. PLL AC Specifications Parameter Fpllin Description PLL input PLL intermediate frequency[80] Fpllout Conditions frequency[79] Output of prescaler PLL output frequency[79] 24 – 67 MHz Lock time at startup – – 250 µs (rms)[78] – – 250 ps Jperiod-rms Jitter Notes 78. Based on device characterization (Not production tested). 79. This specification is guaranteed by testing the PLL across the specified range using the IMO as the source for the PLL. 80. PLL input divider, Q, must be set so that the input frequency is divided down to the intermediate frequency range. Value for Q ranges from 1 to 16. Document Number: 001-11729 Rev. AH Page 122 of 140 PSoC® 3: CY8C38 Family Datasheet 12. Ordering Information In addition to the features listed in Table 12-1, every CY8C38 device includes: a precision on-chip voltage reference, precision oscillators, flash, ECC, DMA, a fixed function I2C, 4 KB trace RAM, JTAG/SWD programming and debug, external memory interface, and more. In addition to these features, the flexible UDBs and analog subsection support a wide range of peripherals. To assist you in selecting the ideal part, PSoC Creator makes a part recommendation after you choose the components required by your application. All CY8C38 derivatives incorporate device and flash security in user-selectable security levels; see the TRM for details. Table 12-1. CY8C38 Family with Single Cycle 8051 I/O[83] SRAM (KB) EEPROM (KB) LCD Segment Drive ADC DAC Comparator SC/CT Analog Blocks[81] Opamps DFB CapSense UDBs[82] 16-bit Timer/PWM FS USB CAN 2.0b Total I/O GPIO SIO USBIO Digital Flash (KB) Analog CPU Speed (MHz) MCU Core CY8C3865AXI-019 67 32 4 1 ✔ 20-bit Del-Sig 4 4 4 4 ✔ ✔ 20 4 ✔ – 72 62 8 2 100-pin TQFP 0×1E013069 CY8C3865LTI-014 67 32 4 1 ✔ 20-bit Del-Sig 4 4 4 4 ✔ ✔ 20 4 ✔ – 48 38 8 2 68-pin QFN 0×1E00E069 CY8C3866LTI-067 67 64 8 2 ✔ 20-bit Del-Sig 4 4 4 2 ✔ ✔ 24 4 ✔ – 31 25 4 2 48-pin QFN 0×1E043069 CY8C3866PVI-021 67 64 8 2 ✔ 20-bit Del-Sig 4 4 4 2 ✔ ✔ 24 4 ✔ – 31 25 4 2 48-pin SSOP 0×1E015069 CY8C3866AXI-035 67 64 8 2 ✔ 20-bit Del-Sig 4 4 4 4 ✔ ✔ 24 4 – ✔ 70 62 8 0 100-pin TQFP 0x1E023069 ✔ – Part Number JTAG ID[84] Package 32 KB Flash 64 KB Flash CY8C3866AXI-039 67 64 8 2 ✔ 20-bit Del-Sig 4 4 4 4 ✔ 24 4 ✔ 72 62 8 2 100-pin TQFP 0×1E027069 CY8C3866LTI-030 67 64 8 2 ✔ 20-bit Del-Sig 4 4 4 4 ✔ ✔ 24 4 ✔ – 48 38 8 2 68-pin QFN 0×1E01E069 CY8C3866LTI-068 67 64 8 2 ✔ 20-bit Del-Sig 4 4 4 2 ✔ ✔ 24 4 ✔ ✔ 31 25 4 2 48-pin QFN 0×1E044069 20-bit Del-Sig 4 4 4 4 ✔ ✔ 24 4 ✔ ✔ 72 62 8 2 100-pin TQFP 0×1E028069 CY8C3866AXI-040 67 64 8 2 ✔ CY8C3866PVI-070 67 64 8 2 ✔ 20-bit Del-Sig 4 4 4 2 ✔ ✔ 24 4 – ✔ 29 25 4 0 48-pin SSOP 0×1E046069 CY8C3866AXI-206 67 64 8 2 ✔ 20-bit Del-Sig 2 2 0 2 ✔ ✔ 20 4 ✔ – 72 62 8 2 100-pin TQFP 0x1E0CE069 CY8C3866LTI-207 67 64 8 2 ✔ 20-bit Del-Sig 2 2 0 2 ✔ ✔ 20 4 ✔ – 48 38 8 2 68-pin QFN 0x1E0CF069 CY8C3866AXI-208 67 64 8 2 ✔ 20-bit Del-Sig 2 2 2 2 ✔ ✔ 24 4 ✔ ✔ 72 62 8 2 100-pin TQFP 0x1E0D0069 CY8C3866FNI-210 67 64 8 2 ✔ 20-bit Del-Sig 4 4 4 4 ✔ ✔ 24 4 ✔ ✔ 48 38 8 2 72 WLCSP 0x1E0D2069 Notes 81. Analog blocks support a variety of functionality including TIA, PGA, and mixers. See the Example Peripherals on page 44 for more information on how analog blocks can be used. 82. UDBs support a variety of functionality including SPI, LIN, UART, timer, counter, PWM, PRS, and others. Individual functions may use a fraction of a UDB or multiple UDBs. Multiple functions can share a single UDB. See the Example Peripherals on page 44 for more information on how UDBs can be used. 83. The I/O Count includes all types of digital I/O: GPIO, SIO, and the two USB I/O. See the I/O System and Routing on page 37 for details on the functionality of each of these types of I/O. 84. The JTAG ID has three major fields. The most significant nibble (left digit) is the version, followed by a 2 byte part number and a 3 nibble manufacturer ID. Document Number: 001-11729 Rev. AH Page 123 of 140 PSoC® 3: CY8C38 Family Datasheet 12.1 Part Numbering Conventions PSoC 3 devices follow the part numbering convention described here. All fields are single character alphanumeric (0, 1, 2, …, 9, A, B, …, Z) unless stated otherwise. CY8Cabcdefg-xxx  a: Architecture  ef: Package code 3: PSoC 3  5: PSoC 5 Two character alphanumeric AX: TQFP  LT: QFN  PV: SSOP  FN: CSP     b: Family group within architecture 4: CY8C34 family 6: CY8C36 family  8: CY8C38 family    g: Temperature range C: commercial I: industrial  A: automotive   c: Speed grade    4: 48 MHz 6: 67 MHz  xxx: Peripheral set  d: Flash capacity  4: 16 KB  5: 32 KB  6: 64 KB   Three character numeric No meaning is associated with these three characters. Examples CY8C 3 8 6 6 P V I - x x x Cypress Prefix 3: PSoC 3 8: CY8C38 Family Architecture Family Group within Architecture 6: 67 MHz Speed Grade 6: 64 KB Flash Capacity PV: SSOP Package Code I: Industrial Temperature Range Peripheral Set Tape and reel versions of these devices are available and are marked with a "T" at the end of the part number. All devices in the PSoC 3 CY8C38 family comply to RoHS-6 specifications, demonstrating the commitment by Cypress to lead-free products. Lead (Pb) is an alloying element in solders that has resulted in environmental concerns due to potential toxicity. Cypress uses nickel-palladium-gold (NiPdAu) technology for the majority of leadframe-based packages. A high-level review of the Cypress Pb-free position is available on our website. Specific package information is also available. Package Material Declaration data sheets (PMDDs) identify all substances contained within Cypress packages. PMDDs also confirm the absence of many banned substances. The information in the PMDDs will help Cypress customers plan for recycling or other “end of life” requirements. Document Number: 001-11729 Rev. AH Page 124 of 140 PSoC® 3: CY8C38 Family Datasheet 13. Packaging Table 13-1. Package Characteristics Parameter Description Conditions Min Typ Max Units TA Operating ambient temperature –40 25.00 85 °C TJ Operating junction temperature –40 – 100 °C TJA Package θJA (48-pin SSOP) – 49 – °C/Watt TJA Package θJA (48-pin QFN) – 14 – °C/Watt TJA Package θJA (68-pin QFN) – 15 – °C/Watt TJA Package θJA (100-pin TQFP) – 34 – °C/Watt TJC Package θJC (48-pin SSOP) – 24 – °C/Watt TJC Package θJC (48-pin QFN) – 15 – °C/Watt TJC Package θJC (68-pin QFN) – 13 – °C/Watt TJC Package θJC (100-pin TQFP) – 10 – °C/Watt TJA Package θJA (72-pin CSP) – 18 – °C/Watt TJC Package θJC (72-pin CSP) – 0.13 – °C/Watt Table 13-2. Solder Reflow Peak Temperature Package Maximum Peak Temperature Maximum Time at Peak Temperature 48-pin SSOP 260 °C 30 seconds 48-pin QFN 260 °C 30 seconds 68-pin QFN 260 °C 30 seconds 100-pin TQFP 260 °C 30 seconds 72-pin CSP 260 °C 30 seconds Table 13-3. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Package MSL 48-pin SSOP MSL 3 48-pin QFN MSL 3 68-pin QFN MSL 3 100-pin TQFP MSL 3 72-pin CSP MSL 1 Document Number: 001-11729 Rev. AH Page 125 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 13-1. 48-pin (300 mil) SSOP Package Outline 51-85061 *F Figure 13-2. 48-pin QFN Package Outline 001-45616 *F Document Number: 001-11729 Rev. AH Page 126 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 13-3. 68-pin QFN 8×8 with 0.4 mm Pitch Package Outline (Sawn Version) 001-09618 *E Figure 13-4. 100-pin TQFP (14 × 14 × 1.4 mm) Package Outline 51-85048 *K Document Number: 001-11729 Rev. AH Page 127 of 140 PSoC® 3: CY8C38 Family Datasheet Figure 13-5. WLCSP Package (4.25 × 4.98 × 0.60 mm) TOP VIEW 1 2 3 4 5 6 7 SIDE VIEW 8 A BOTTOM VIEW 8 7 6 5 4 3 2 1 A B B C C D D E E F F G G H H J J NOTES: 1. JEDEC Publication 95; Design Guide 4.18 2. ALL DIMENSIONS ARE IN MILLIMETERS Document Number: 001-11729 Rev. AH 001-82897 ** Page 128 of 140 PSoC® 3: CY8C38 Family Datasheet 14. Acronyms Table 14-1. Acronyms Used in this Document (continued) Table 14-1. Acronyms Used in this Document Acronym Description Acronym Description FIR finite impulse response, see also IIR FPB flash patch and breakpoint FS full-speed GPIO general-purpose input/output, applies to a PSoC pin HVI high-voltage interrupt, see also LVI, LVD abus analog local bus ADC analog-to-digital converter AG analog global AHB AMBA (advanced microcontroller bus architecture) high-performance bus, an ARM data transfer bus IC integrated circuit ALU arithmetic logic unit IDAC current DAC, see also DAC, VDAC AMUXBUS analog multiplexer bus IDE integrated development environment application programming interface I2C, API APSR application program status register ARM® advanced RISC machine, a CPU architecture ATM automatic thump mode BW bandwidth CAN Controller Area Network, a communications protocol CMRR or IIC Inter-Integrated Circuit, a communications protocol IIR infinite impulse response, see also FIR ILO internal low-speed oscillator, see also IMO IMO internal main oscillator, see also ILO INL integral nonlinearity, see also DNL I/O input/output, see also GPIO, DIO, SIO, USBIO common-mode rejection ratio IPOR initial power-on reset CPU central processing unit IPSR interrupt program status register CRC cyclic redundancy check, an error-checking protocol IRQ interrupt request DAC digital-to-analog converter, see also IDAC, VDAC ITM instrumentation trace macrocell DFB digital filter block LCD liquid crystal display DIO digital input/output, GPIO with only digital capabilities, no analog. See GPIO. LIN Local Interconnect Network, a communications protocol. DMA direct memory access, see also TD LR link register DNL differential nonlinearity, see also INL DNU do not use DR port write data registers DSI digital system interconnect DWT data watchpoint and trace ECC error correcting code ECO external crystal oscillator EEPROM electrically erasable programmable read-only memory EMI electromagnetic interference EMIF external memory interface EOC end of conversion EOF end of frame EPSR execution program status register ESD electrostatic discharge ETM embedded trace macrocell Document Number: 001-11729 Rev. AH LUT lookup table LVD low-voltage detect, see also LVI LVI low-voltage interrupt, see also HVI LVTTL low-voltage transistor-transistor logic MAC multiply-accumulate MCU microcontroller unit MISO master-in slave-out NC no connect NMI nonmaskable interrupt NRZ non-return-to-zero NVIC nested vectored interrupt controller NVL nonvolatile latch, see also WOL opamp operational amplifier PAL programmable array logic, see also PLD PC program counter PCB printed circuit board PGA programmable gain amplifier Page 129 of 140 PSoC® 3: CY8C38 Family Datasheet Table 14-1. Acronyms Used in this Document (continued) Acronym Description Table 14-1. Acronyms Used in this Document (continued) Acronym Description PHUB peripheral hub SOF start of frame PHY physical layer SPI PICU port interrupt control unit Serial Peripheral Interface, a communications protocol PLA programmable logic array SR slew rate PLD programmable logic device, see also PAL SRAM static random access memory PLL phase-locked loop SRES software reset PMDD package material declaration data sheet SWD serial wire debug, a test protocol POR power-on reset SWV single-wire viewer PRES precise low-voltage reset TD transaction descriptor, see also DMA PRS pseudo random sequence THD total harmonic distortion PS port read data register PSoC® Programmable System-on-Chip™ PSRR power supply rejection ratio PWM pulse-width modulator RAM random-access memory RISC reduced-instruction-set computing RMS root-mean-square RTC real-time clock RTL register transfer language RTR RX TIA transimpedance amplifier TRM technical reference manual TTL transistor-transistor logic TX transmit UART Universal Asynchronous Transmitter Receiver, a communications protocol UDB universal digital block USB Universal Serial Bus USBIO USB input/output, PSoC pins used to connect to a USB port remote transmission request VDAC voltage DAC, see also DAC, IDAC receive WDT watchdog timer SAR successive approximation register WOL write once latch, see also NVL SC/CT switched capacitor/continuous time WRES watchdog timer reset SCL I2C XRES external reset I/O pin SDA I2C serial data XTAL crystal S/H sample and hold SINAD signal to noise and distortion ratio SIO special input/output, GPIO with advanced features. See GPIO. SOC start of conversion serial clock Document Number: 001-11729 Rev. AH 15. Reference Documents PSoC® 3, PSoC® 5 Architecture TRM PSoC® 3 Registers TRM Page 130 of 140 PSoC® 3: CY8C38 Family Datasheet 16. Document Conventions 16.1 Units of Measure Table 16-1. Units of Measure Symbol Unit of Measure °C degrees Celsius dB decibels fF femtofarads Hz hertz KB 1024 bytes kbps kilobits per second Khr kilohours kHz kilohertz kΩ kilohms ksps kilosamples per second LSB least significant bit Mbps megabits per second MHz megahertz MΩ megaohms Msps megasamples per second µA microamperes µF microfarads µH microhenrys µs microseconds µV microvolts µW microwatts mA milliamperes ms milliseconds mV millivolts nA nanoamperes ns nanoseconds nV nanovolts Ω ohms pF picofarads ppm parts per million ps picoseconds s seconds sps samples per second sqrtHz square root of hertz V volts Document Number: 001-11729 Rev. AH Page 131 of 140 PSoC® 3: CY8C38 Family Datasheet 17. Revision History Description Title: PSoC® 3: CY8C38 Family Datasheet Programmable System-on-Chip (PSoC®) Document Number: 001-11729 Submission Revision ECN Description of Change Date ** 571504 See ECN New data sheet for new device Part Number family. *A 754416 See ECN Prepare Preliminary for PR1. *B 2253366 See ECN Prepare Preliminary2 for PR3--total rewrite. *C 2350209 See ECN Minor change: Added “Confidential” watermark. Corrected typo on 68QFN pinout: pin 13 XREF to XRES. *D 2481747 See ECN Changed part numbers and data sheet title. *E 2521877 See ECN Prelim3 release–extensive spec, writing, and formatting changes *F 2660161 02/16/09 Reorganized content to be consistent with the TRM. Added Xdata Space Access SFRs and DAC sections. Updated Boost Converter section and Conversion Signals section. Classified Ordering Information according to CPU speed; added information on security features and ROHS compliance Added a section on XRES Specifications under Electrical Specification. Updated Analog Subsystem and CY8C35/55 Architecture block diagrams. Updated Electrical Specifications. Renamed CyDesigner as PSoC Creator *G 2712468 05/29/09 Updates to Electrical Specifications. Added Analog Routing section Updates to Ordering Information table *H 2758970 09/02/09 Updated Part Numbering Conventions. Added Section 11.7.5 (EMIF Figures and Tables). Updated GPIO and SIO AC specifications. Updated XRES Pin Description and Xdata Address Map specifications. Updated DFB and Comparator specifications. Updated PHUB features section and RTC in sleep mode. Updated IDAC and VDAC DC and Analog Global specifications Updated USBIO AC and Delta Sigma ADC specifications. Updated PPOR and Voltage Monitors DC specifications. Updated Drive Mode diagram Added 48-QFN Information. Updated other electrical specifications *I 2824546 12/09/09 Updated I2C section to reflect 1 Mbps. Updated Table 11-6 and 11- 7 (Boost AC and DC specs); also added Shottky Diode specs. Changed current for sleep/hibernate mode to include SIO; Added footnote to analog global specs. Updated Figures 1-1, 6-2, 7-14, and 8-1. Updated Table 6-2 and Table 6-3 (Hibernate and Sleep rows) and Power Modes section. Updated GPIO and SIO AC specifications. Updated Gain error in IDAC and VDAC specifications. Updated description of VDDA spec in Table 11-1 and removed GPIO Clamp Current parameter. Updated number of UDBs on page 1. Moved FILO from ILO DC to AC table. Added PCB Layout and PCB Schematic diagrams. Updated Fgpioout spec (Table 11-9). Added duty cycle frequency in PLL AC spec table. Added note for Sleep and Hibernate modes and Active Mode specs in Table 11-2. Linked URL in Section 10.3 to PSoC Creator site. Updated Ja and Jc values in Table 13-1. Updated Single Sample Mode and Fast FIR Mode sections. Updated Input Resistance specification in Del-Sig ADC table. Added Tio_init parameter. Updated PGA and UGB AC Specs. Removed SPC ADC. Updated Boost Converter section. Added section 'SIO as Comparator'; updated Hysteresis spec (differential mode) in Table 11-10. Updated VBAT condition and deleted Vstart parameter in Table 11-6. Added 'Bytes' column for Tables 4-1 to 4-5. *J 2873322 02/04/10 Changed maximum value of PPOR_TR to '1'. Updated VBIAS specification. Updated PCB Schematic. Updated Figure 8-1 and Figure 6-3. Updated Interrupt Vector table, Updated Sales links. Updated JTAG and SWD specifications. Removed Jp-p and Jperiod from ECO AC Spec table. Added note on sleep timer in Table 11-2. Updated ILO AC and DC specifications. Added Resolution parameter in VDAC and IDAC tables. Updated IOUT typical and maximum values. Changed Temperature Sensor range to –40 °C to +85 °C. Removed Latchup specification from Table 11-1. Document Number: 001-11729 Rev. AH Page 132 of 140 PSoC® 3: CY8C38 Family Datasheet Description Title: PSoC® 3: CY8C38 Family Datasheet Programmable System-on-Chip (PSoC®) (continued) Document Number: 001-11729 Submission Revision ECN Description of Change Date *K 2903576 04/01/2010 Updated Vb pin in PCB Schematic. Updated Tstartup parameter in AC Specifications table. Added Load regulation and Line regulation parameters to Inductive Boost Regulator DC Specifications table. Updated ICC parameter in LCD Direct Drive DC Specs table. In page 1, updated internal oscillator range under Precision programmable clocking to start from 3 MHz. Updated IOUT parameter in LCD Direct Drive DC Specs table. Updated Table 6-2 and Table 6-3. Added bullets on CapSense in page 1; added CapSense column in Section 12. Removed some references to footnote [1]. Changed INC_Rn cycles from 3 to 2 (Table 4-1). Added footnote in PLL AC Specification table. Added PLL intermediate frequency row with footnote in PLL AC Specs table. Added UDBs subsection under 11.6 Digital Peripherals. Updated Figure 2-6 (PCB Layout). Updated Pin Descriptions section and modified Figures 6-6, 6-8, 6-9. Updated LVD in Tables 6-2 and 6-3; modified Low-power modes bullet in page 1. Added note to Figures 2-5 and 6-2; Updated Figure 6-2 to add capacitors for VDDA and VDDD pins. Updated boost converter section (6.2.2). Updated Tstartup values in Table 11-3. Removed IPOR rows from Table 11-68. Updated 6.3.1.1, Power Voltage Level Monitors. Updated section 5.2 and Table 11-2 to correct suggestion of execution from flash. Updated VREF specs in Table 11-21. Updated IDAC uncompensated gain error in Table 11-25. Updated Delay from Interrupt signal input to ISR code execution from ISR code in Table11-72. Removed other line in table. Added sentence to last paragraph of section 6.1.1.3. Updated TRESP, high and low-power modes, in Table 11-24. Updated f_TCK values in Table 11-73 and f_SWDCK values in Table 11-74. Updated SNR condition in Table 11-20. Corrected unit of measurement in Table 11-21. Updated sleep wakeup time in Table 6-3 and Tsleep in Table 11-3. Added 1.71 V
CY8C3866LTI-030T
物料型号:PSoC® 3: CY8C38系列。

器件简介:PSoC 3是一款可编程的嵌入式片上系统(System-on-Chip),集成了可配置的模拟和数字外设、存储器和微控制器。PSoC 3架构通过以下特性提升性能: - 8051核心加上DMA控制器和数字滤波器处理器,运行频率高达67 MHz。 - 行业最宽的电压范围下的超低功耗。 - 可编程的数字和模拟外设可实现自定义功能。 - 任何模拟或数字外设功能的灵活路由到任何引脚。

引脚分配:文档中提供了详细的引脚分配图,包括不同封装类型的PSoC 3设备,如48引脚SSOP、48引脚QFN、68引脚QFN、100引脚TQFP和72引脚WLCSP。

参数特性:PSoC 3的工作特性包括: - 电压范围:1.71至5.5伏,多达六个电源域。 - 温度范围(环境):-40至85°C。 - 直流至67-MHz操作。 - 电源模式:包括活动模式、1微安的睡眠模式和200纳安的休眠模式,具有RAM保持功能。

功能详解:PSoC 3集成了多种功能,包括但不限于: - 8位8051 CPU,32个中断输入。 - 24通道直接内存访问(DMA)控制器。 - 24位64-tap定点数字滤波器处理器(DFB)。 - 多达64 KB的程序闪存,具有缓存和安全特性。 - 多达8 KB的额外闪存,用于错误校正码(ECC)。 - 多达8 KB的RAM。 - 多达2 KB的EEPROM。

应用信息:PSoC 3适用于广泛的嵌入式控制设计,能够将多达100个数字和模拟外设功能集成到单个设备中,从而减少设计时间、板空间、功耗和系统成本,同时提高系统质量。

封装信息:PSoC 3提供多种封装选项,以适应不同的应用需求。
CY8C3866LTI-030T 价格&库存

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