CY8C4125LQI-S412T

CY8C41xx PSoC™ 4 MCU: PS oC™ 4100S Based on Arm® Cortex®-M0+ CPU General description PSoC™ 4 is a scalable and reconfigurable platform architecture for a family of programmable embedded system controllers with an Arm® Cortex®-M0+ CPU. It combines programmable and reconfigurable analog and digital blocks with flexible automatic routing. The PSoC™ 4100S product family is a member of the PSoC™ 4 platform architecture. It is a combination of a microcontroller with standard communication and timing peripherals, a capacitive touch-sensing system (CAPSENSE™) with best-in-class performance, programmable general-purpose continuous-time and switched-capacitor analog blocks, and programmable connectivity. PSoC™ 4100S products are upward compatible with members of the PSoC™ 4 platform for new applications and design needs. Features • 32-bit MCU subsystem - 48-MHz Arm® Cortex®-M0+ CPU with single-cycle multiply - Up to 64 KB of flash with read accelerator - Up to 8 KB of SRAM • Programmable analog - Two opamps with reconfigurable high-drive external and high-bandwidth internal drive and Comparator modes and ADC input buffering capability. Opamps can operate in deep sleep low-power mode. - 12-bit 1-Msps SAR ADC with differential and single-ended modes, and channel sequencer with signal averaging - Single-slope 10-bit ADC function provided by a capacitance sensing block - Two current DACs (IDACs) for general-purpose or capacitive sensing applications on any pin - Two low-power comparators that operate in Deep Sleep low-power mode • Programmable digital - Programmable logic blocks allowing boolean operations to be performed on port inputs and outputs • Low-power 1.71-V to 5.5-V operation - Deep Sleep mode with operational analog and 2.5-µA digital system current • Capacitive sensing - Capacitive sigma-delta provides best-in-class signal-to-noise ratio (SNR) (>5:1) and water tolerance - Infineon-supplied software component makes capacitive sensing design easy - Automatic hardware tuning (SmartSense) • LCD drive capability - LCD segment drive capability on GPIOs • Serial communication - Three independent run-time reconfigurable Serial Communication Blocks (SCBs) with re-configurable I2C, SPI, or UART functionality • Timing and pulse-width modulation - Five 16-bit Timer/Counter/Pulse-width Modulator (TCPWM) blocks - Center-aligned, edge, and pseudo-random modes - Comparator-based triggering of kill signals for motor drive and other high-reliability digital logic applications - Quadrature decoder Datasheet www.infineon.com Please read the Important Notice and Warnings at the end of this document page 1 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Features • Up to 36 programmable GPIO pins - 48-pin TQFP, 44-pin TQFP, 40-pin QFN, 32-pin QFN, and 35-ball WLCSP packages - Any GPIO pin can be CAPSENSE™, analog, or digital - Drive modes, strengths, and slew rates are programmable • Clock sources - 32-kHz watch crystal oscillator (WCO) - ±2% internal main oscillator (IMO) - 32-kHz internal low-power oscillator (ILO) • ModusToolbox™ software - Comprehensive collection of multi-platform tools and software libraries - Includes board support packages (BSPs), peripheral driver library (PDL), and middleware such as CAPSENSE™ • PSoC™ Creator design environment - Integrated development environment (IDE) provides schematic design entry and build, with analog and digital automatic routing - Application programming interface (API) components for all fixed-function and programmable peripherals • Industry-standard tool compatibility - After schematic entry, development can be done with Arm®-based industry-standard development tools Datasheet 2 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Table of contents Table of contents General description ...........................................................................................................................1 Features ...........................................................................................................................................1 Table of contents ...............................................................................................................................3 1 Development ecosystem .................................................................................................................4 1.1 PSoC™ 4 MCU resources .........................................................................................................................................4 1.2 ModusToolbox™ software ......................................................................................................................................5 1.3 PSoC™ Creator ........................................................................................................................................................6 Block diagram...................................................................................................................................7 2 Functional definition.......................................................................................................................9 2.1 CPU and memory subsystem .................................................................................................................................9 2.2 System resources....................................................................................................................................................9 2.3 Analog blocks ........................................................................................................................................................11 2.4 Programmable digital blocks ...............................................................................................................................12 2.5 Fixed function digital ............................................................................................................................................12 2.6 GPIO.......................................................................................................................................................................13 2.7 Special function peripherals ................................................................................................................................14 3 Pinouts ........................................................................................................................................15 3.1 Alternate pin functions .........................................................................................................................................17 4 Power ..........................................................................................................................................19 4.1 Mode 1: 1.8 V to 5.5 V external supply ..................................................................................................................19 4.2 Mode 2: 1.8 V ± 5% external supply ......................................................................................................................20 5 Electrical specifications.................................................................................................................21 5.1 Absolute maximum ratings ..................................................................................................................................21 5.2 Device level specifications....................................................................................................................................22 5.3 Analog peripherals................................................................................................................................................27 5.4 Digital peripherals.................................................................................................................................................37 5.5 Memory..................................................................................................................................................................41 5.6 System resources..................................................................................................................................................42 6 Ordering information ....................................................................................................................46 7 Packaging ....................................................................................................................................49 7.1 Package diagrams.................................................................................................................................................50 8 Acronyms .....................................................................................................................................54 9 Document conventions..................................................................................................................58 9.1 Units of measure ...................................................................................................................................................58 Revision history ..............................................................................................................................59 Datasheet 3 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Development ecosystem 1 Development ecosystem 1.1 PSoC™ 4 MCU resources Infineon provides a wealth of data at www.cypress.com to help you select the right PSoC™ device and quickly and effectively integrate it into your design. The following is an abbreviated, hyperlinked list of resources for PSoC™ 4 MCU: • Overview: PSoC™ Portfolio, PSoC™ Roadmap • Product selectors: PSoC™ 4 MCU • Application notes cover a broad range of topics, from basic to advanced level, and include the following: - AN79953: Getting Started With PSoC™ 4. This application note has a convenient flow chart to help decide which IDE to use: ModusToolbox™ software or PSoC™ Creator. - AN91184: PSoC™ 4 BLE - Designing BLE applications - AN88619: PSoC™ 4 hardware design considerations - AN73854: Introduction to bootloaders - AN89610: Arm® Cortex® code optimization - AN86233: PSoC™ 4 MCU power reduction techniques - AN57821: Mixed signal circuit board layout - AN85951: PSoC™ 4, PSoC™ 6 CAPSENSE™ design guide • Code examples demonstrate product features and usage, and are also available on Infineon GitHub repositories. • Technical Reference Manuals (TRMs) provide detailed descriptions of PSoC™ 4 MCU architecture and registers. • PSoC 4 MCU programming specification provides the information necessary to program PSoC™ 4 MCU non-volatile memory. • Development tools - ModusToolbox™ software enables cross platform code development with a robust suite of tools and software libraries. - PSoC™ Creator is a free Windows-based IDE. It enables concurrent hardware and firmware design of PSoC™ 3, PSoC™ 4, PSoC™ 5LP, and PSoC™ 6 MCU based systems. Applications are created using schematic capture and over 150 pre-verified, production-ready peripheral components. - CY8CKIT-041-41XX PSoC™ 4100S CAPSENSE™ pioneer kit, is an easy-to-use and inexpensive development platform. This kit includes connectors for Arduino™ compatible shields. - MiniProg4 and MiniProg3 all-in-one development programmers and debuggers. - PSoC™ 4 MCU CAD libraries provide footprint and schematic support for common tools. IBIS models are also available. • Training Videos are available on a wide range of topics including the PSoC™ 4 MCU 101 series. • Infineon developer community enables connection with fellow PSoC™ developers around the world, 24 hours a day, 7 days a week, and hosts a dedicated PSoC™ 4 MCU community. Datasheet 4 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Development ecosystem 1.2 ModusToolbox™ software ModusToolbox™ software is Infineon’ comprehensive collection of multi-platform tools and software libraries that enable an immersive development experience for creating converged MCU and wireless systems. It is: • Comprehensive - it has the resources you need • Flexible - you can use the resources in your own workflow • Atomic - you can get just the resources you want Infineon provides a large collection of code repositories on GitHub, including: • Board support packages (BSPs) aligned with Infineon kits • Low-level resources, including a peripheral driver library (PDL) • Middleware enabling industry-leading features such as CAPSENSE™ • An extensive set of thoroughly tested code example applications ModusToolbox™ software is IDE-neutral and easily adaptable to your workflow and preferred development environment. It includes a project creator, peripheral and library configurators, a library manager, as well as the optional Eclipse IDE for ModusToolbox™, as Figure 1 shows. For information on using Infineon tools, refer to the documentation delivered with ModusToolbox™ software, and AN79953: Getting Started with PSoC™ 4. Figure 1 Datasheet ModusToolbox™ software tools 5 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Development ecosystem 1.3 PSoC™ Creator PSoC™ Creator is a free Windows-based IDE. It enables you to design hardware and firmware systems concurrently, based on PSoC™ 4 MCU. As Figure 2 shows, with PSoC™ Creator you can: 1. Explore the library of 200+ components 2. Drag and drop component icons to complete your hardware system design in the main design workspace 3. Configure components using the component configuration tools and the component datasheets 4. Co-design your application firmware and hardware in the PSoC™ Creator IDE or build a project for a third-party IDE 5. Prototype your solution with the PSoC™ 4 pioneer kits. If a design change is needed, PSoC™ Creator and components enable you to make changes on-the-fly without the need for hardware revisions. Figure 2 Datasheet PSoC™ Creator schematic entry and components 6 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Block diagram Block diagram SWD/TC SPCIF Cortex® M0+ 48 MHz FLASH 64 KB SRAM 16 KB ROM 8 KB FAST MUL NVIC, IRQMUX Read Accelerator SRAM Controller ROM Controller AHB-Lite System Resources Lite x1 SARMUX TRNG SAR ADC ( 12-bit) WCO Programmable Analog 2x LP Comparator Test TestMode Entry Digital DFT Analog DFT Peripheral Interconnect (MMIO) PCLK 2x S C B-I2 C/S PI/UA R T Reset Reset Control XRES Peripherals IO S S G PIO (5x ports) Clock Clock Control WDT ILO IMO System Interconnect (Single Layer AHB) CO(wPLL) Power Sleep Control WIC POR REF PWRSYS CAPSENSE ™ (v2) 32-bit CPU Subsystem 5x T C P W M PSoC™ 4100S Architecture CTBm 2 x Opamp High Speed I/O Matrix, 2X Smart I/O Ports Power Modes Active/Sleep DeepSleep 36x GPIOs, LCD I/O Subsystem PSoC™ 4100S devices include extensive support for programming, testing, debugging, and tracing both hardware and firmware. The Arm® serial-wire debug (SWD) interface supports all programming and debug features of the device. Complete debug-on-chip functionality enables full-device debugging in the final system using the standard production device. It does not require special interfaces, debugging pods, simulators, or emulators. Only the standard programming connections are required to fully support debug. The PSoC™ Creator IDE provides fully integrated programming and debug support for the PSoC™ 4100S devices. The SWD interface is fully compatible with industry-standard third-party tools. The PSoC™ 4100S provides a level of security not possible with multi-chip application solutions or with microcontrollers. It has the following advantages: • Allows disabling of debug features • Robust flash protection • Allows customer-proprietary functionality to be implemented in on-chip programmable blocks Datasheet 7 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Block diagram The debug circuits are enabled by default and can be disabled in firmware. If they are not enabled, the only way to re-enable them is to erase the entire device, clear flash protection, and reprogram the device with new firmware that enables debugging. Thus firmware control of debugging cannot be over-ridden without erasing the firmware thus providing security. Additionally, all device interfaces can be permanently disabled (device security) for applications concerned about phishing attacks due to a maliciously reprogrammed device or attempts to defeat security by starting and interrupting flash programming sequences. All programming, debug, and test interfaces are disabled when maximum device security is enabled. Therefore, PSoC™ 4100S, with device security enabled, may not be returned for failure analysis. This is a trade-off the PSoC™ 4100S allows the customer to make. Datasheet 8 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Functional definition 2 Functional definition 2.1 CPU and memory subsystem 2.1.1 CPU The Cortex®-M0+ CPU in the PSoC™ 4100S is part of the 32-bit MCU subsystem, which is optimized for low-power operation with extensive clock gating. Most instructions are 16 bits in length and the CPU executes a subset of the thumb-2 instruction set. It includes a nested vectored interrupt controller (NVIC) block with eight interrupt inputs and also includes a wakeup interrupt controller (WIC). The WIC can wake the processor from Deep Sleep mode, allowing power to be switched off to the main processor when the chip is in Deep Sleep mode. The CPU also includes a debug interface, the serial wire debug (SWD) interface, which is a two-wire form of JTAG. The debug configuration used for PSoC™ 4100S has four breakpoint (address) comparators and two watchpoint (data) comparators. 2.1.2 Flash The PSoC™ 4100S device has a flash module with a flash accelerator, tightly coupled to the CPU to improve average access times from the flash block. The low-power flash block is designed to deliver two wait-state (WS) access time at 48 MHz. The flash accelerator delivers 85% of single-cycle SRAM access performance on average. 2.1.3 SRAM Eight KB of SRAM are provided with zero wait-state access at 48 MHz. 2.1.4 SROM An 8 KB supervisory ROM that contains boot and configuration routines is provided. 2.2 System resources 2.2.1 Power system The power system is described in detail in the section “Power” on page 19. It provides assurance that voltage levels are as required for each respective mode and either delays mode entry (for example, on power-on reset (POR)) until voltage levels are as required for proper functionality, or generates resets (for example, on brown-out detection). The PSoC™ 4100S operates with a single external supply over the range of either 1.8 V ± 5% (externally regulated) or 1.8 to 5.5 V (internally regulated) and has three different power modes, transitions between which are managed by the power system. The PSoC™ 4100S provides Active, Sleep, and Deep Sleep low-power modes. All subsystems are operational in Active mode. The CPU subsystem (CPU, flash, and SRAM) is clock-gated off in Sleep mode, while all peripherals and interrupts are active with instantaneous wake-up on a wake-up event. In Deep Sleep mode, the high-speed clock and associated circuitry is switched off; wake-up from this mode takes 35 µs. The opamps can remain operational in Deep Sleep mode. Datasheet 9 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Functional definition 2.2.2 Clock system The PSoC™ 4100S clock system is responsible for providing clocks to all subsystems that require clocks and for switching between different clock sources without glitching. In addition, the clock system ensures that there are no metastable conditions. The clock system for the PSoC™ 4100S consists of the internal main oscillator (IMO), internal low-frequency oscillator (ILO), a 32 kHz watch crystal oscillator (WCO) and provision for an external clock. Clock dividers are provided to generate clocks for peripherals on a fine-grained basis. Fractional dividers are also provided to enable clocking of higher data rates for UARTs. External Clock HFCLK IMO WCO Divide By 2,4,8 WDC0 16-bits LFCLK WDC1 16-bits ILO WDC2 32-bits WDT Watchdog Counters (WDC) Watchdog Timer (WDT) Prescaler SYSCLK HFCLK Integer Dividers Fractional Dividers Figure 3 6X 16-bit 3X 16.5-bit PSoC™ 4100S MCU clocking architecture The HFCLK signal can be divided down to generate synchronous clocks for the analog and digital peripherals. There are eight clock dividers for the PSoC™ 4100S; two of those are fractional dividers. The 16-bit capability allows flexible generation of fine-grained frequency values and is fully supported in PSoC™ Creator. 2.2.3 IMO clock source The IMO is the primary source of internal clocking in the PSoC™ 4100S. It is trimmed during testing to achieve the specified accuracy.The IMO default frequency is 24 MHz and it can be adjusted from 24 to 48 MHz in steps of 4 MHz. The IMO tolerance with Infineon provided calibration settings is ±2%. 2.2.4 ILO clock source The ILO is a very low power, nominally 40-kHz oscillator, which is primarily used to generate clocks for the watchdog timer (WDT) and peripheral operation in Deep Sleep mode. ILO-driven counters can be calibrated to the IMO to improve accuracy. Infineon provides a software component, which does the calibration. 2.2.5 Watch Crystal Oscillator (WCO) The PSoC™ 4100S clock subsystem also implements a low-frequency (32-kHz watch crystal) oscillator that can be used for precision timing applications. The WCO block allows locking the IMO to the 32-kHz oscillator. 2.2.6 Watchdog timer and counters A watchdog timer is implemented in the clock block running from the ILO; this allows watchdog operation during Deep Sleep and generates a watchdog reset if not serviced before the set timeout occurs. The watchdog reset is recorded in a Reset Cause Register, which is firmware readable. The watchdog counters can be used to implement a real-time clock using the 32-kHz WCO. Datasheet 10 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Functional definition 2.2.7 Reset The PSoC™ 4100S can be reset from a variety of sources including a software reset. Reset events are asynchronous and guarantee reversion to a known state. The reset cause is recorded in a register, which is sticky through reset and allows software to determine the cause of the reset. An XRES pin is reserved for external reset by asserting it active low. The XRES pin has an internal pull-up resistor that is always enabled. 2.3 Analog blocks 2.3.1 12-bit SAR ADC The 12-bit, 1-Msps SAR ADC can operate at a maximum clock rate of 18 MHz and requires a minimum of 18 clocks at that frequency to do a 12-bit conversion. The sample-and-hold (S/H) aperture is programmable allowing the gain bandwidth requirements of the amplifier driving the SAR inputs, which determine its settling time, to be relaxed if required. It is possible to provide an external bypass (through a fixed pin location) for the internal reference amplifier. The SAR is connected to a fixed set of pins through an 8-input sequencer. The sequencer cycles through selected channels autonomously (sequencer scan) with zero switching overhead (that is, aggregate sampling bandwidth is equal to 1 Msps whether it is for a single channel or distributed over several channels). The sequencer switching is effected through a state machine or through firmware driven switching. A feature provided by the sequencer is buffering of each channel to reduce CPU interrupt service requirements. To accommodate signals with varying source impedance and frequency, it is possible to have different sample times programmable for each channel. Also, signal range specification through a pair of range registers (low and high range values) is implemented with a corresponding out-of-range interrupt if the digitized value exceeds the programmed range; this allows fast detection of out-of-range values without the necessity of having to wait for a sequencer scan to be completed and the CPU to read the values and check for out-of-range values in software. The SAR is not available in Deep Sleep mode as it requires a high-speed clock (up to 18 MHz). The SAR operating range is 1.71 V to 5.5 V. AHB System Bus and Programmable Logic Interconnect SAR Sequencer vminus vplus S A R MU X S A R MU X Port (Up to 16 inputs) Sequencing and Control Data and Status Flags POS SARADC NEG Reference Selection VDDA /2 VDDA External Reference and Bypass (optional) VREF Inputs from other Ports Figure 4 Datasheet SAR ADC 11 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Functional definition 2.3.2 Two opamps (continuous-time block; CTB) The PSoC™ 4100S has two opamps with Comparator modes which allow most common analog functions to be performed on-chip eliminating external components; PGAs, Voltage Buffers, Filters, Trans-Impedance Amplifiers, and other functions can be realized, in some cases with external passives. saving power, cost, and space. The on-chip opamps are designed with enough bandwidth to drive the Sample-and-Hold circuit of the ADC without requiring external buffering. 2.3.3 Low-power comparators (LPC) The PSoC™ 4100S has a pair of low-power comparators, which can also operate in Deep Sleep modes. This allows the analog system blocks to be disabled while retaining the ability to monitor external voltage levels during low-power modes. The comparator outputs are normally synchronized to avoid metastability unless operating in an asynchronous power mode where the system wake-up circuit is activated by a comparator switch event. The LPC outputs can be routed to pins. 2.3.4 Current DACs The PSoC™ 4100S has two IDACs, which can drive any of the pins on the chip. These IDACs have programmable current ranges. 2.3.5 Analog multiplexed buses The PSoC™ 4100S has two concentric independent buses that go around the periphery of the chip. These buses (called amux buses) are connected to firmware-programmable analog switches that allow the chip’s internal resources (IDACs, comparator) to connect to any pin on the I/O ports. 2.4 Programmable digital blocks The smart I/O block is a fabric of switches and LUTs that allows boolean functions to be performed in signals being routed to the pins of a GPIO port. The Smart I/O can perform logical operations on input pins to the chip and on signals going out as outputs. 2.5 Fixed function digital 2.5.1 Timer/Counter/PWM (TCPWM) block The TCPWM block consists of a 16-bit counter with user-programmable period length. There is a capture register to record the count value at the time of an event (which may be an I/O event), a period register that is used to either stop or auto-reload the counter when its count is equal to the period register, and compare registers to generate compare value signals that are used as PWM duty cycle outputs. The block also provides true and complementary outputs with programmable offset between them to allow use as dead-band programmable complementary PWM outputs. It also has a kill input to force outputs to a predetermined state; for example, this is used in motor drive systems when an over-current state is indicated and the PWM driving the FETs needs to be shut off immediately with no time for software intervention. There are five TCPWM blocks in the PSoC™ 4100S. Datasheet 12 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Functional definition 2.5.2 Serial Communication Block (SCB) The PSoC™ 4100S has three serial communication blocks, which can be programmed to have SPI, I2C, or UART functionality. I2C Mode: The hardware I2C block implements a full multi-master and slave interface (it is capable of multi-master arbitration). This block is capable of operating at speeds of up to 400 kbps (Fast Mode) and has flexible buffering options to reduce interrupt overhead and latency for the CPU. It also supports EZI2C that creates a mailbox address range in the memory of the PSoC™ 4100S and effectively reduces I2C communication to reading from and writing to an array in memory. In addition, the block supports an 8-deep FIFO for receive and transmit which, by increasing the time given for the CPU to read data, greatly reduces the need for clock stretching caused by the CPU not having read data on time. The I2C peripheral is compatible with the I2C Standard-mode and Fast-mode devices as defined in the NXP I2C-bus specification and user manual (UM10204). The I2C bus I/O is implemented with GPIO in open-drain modes. The PSoC™ 4100S is not completely compliant with the I2C spec in the following respect: • GPIO cells are not over-voltage tolerant and, therefore, cannot be hot-swapped or powered up independently of the rest of the I2C system. UART Mode: This is a full-feature UART operating at up to 1 Mbps. It supports automotive single-wire interface (LIN), infrared interface (IrDA), and SmartCard (ISO7816) protocols, all of which are minor variants of the basic UART protocol. In addition, it supports the 9-bit multiprocessor mode that allows addressing of peripherals connected over common RX and TX lines. Common UART functions such as parity error, break detect, and frame error are supported. An 8-deep FIFO allows much greater CPU service latencies to be tolerated. SPI Mode: The SPI mode supports full Motorola SPI, TI SSP (adds a start pulse used to synchronize SPI Codecs), and National Microwire (half-duplex form of SPI). The SPI block can use the FIFO. 2.6 GPIO The PSoC™ 4100S has up to 36 GPIOs. The GPIO block implements the following: • Eight drive modes: - Analog input mode (input and output buffers disabled) - Input only - Weak pull-up with strong pull-down - Strong pull-up with weak pull-down - Open drain with strong pull-down - Open drain with strong pull-up - Strong pull-up with strong pull-down - Weak pull-up with weak pull-down • Input threshold select (CMOS or LVTTL). • Individual control of input and output buffer enabling/disabling in addition to the drive strength modes • Selectable slew rates for dV/dt related noise control to improve EMI The pins are organized in logical entities called ports, which are 8-bit in width (less for ports 2 and 3). During power-on and reset, the blocks are forced to the disable state so as not to crowbar any inputs and/or cause excess turn-on current. A multiplexing network known as a high-speed I/O matrix is used to multiplex between various signals that may connect to an I/O pin. Data output and pin state registers store, respectively, the values to be driven on the pins and the states of the pins themselves. Every I/O pin can generate an interrupt if so enabled and each I/O port has an interrupt request (IRQ) and interrupt service routine (ISR) vector associated with it (5 for PSoC™ 4100S). Datasheet 13 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Functional definition 2.7 Special function peripherals 2.7.1 CAPSENSE™ CAPSENSE™ is supported in the PSoC™ 4100S through a CAPSENSE™ Sigma-Delta (CSD) block that can be connected to any pins through an analog multiplex bus via analog switches. CAPSENSE™ function can thus be provided on any available pin or group of pins in a system under software control. A PSoC™ Creator component is provided for the CAPSENSE™ block to make it easy for the user. Shield voltage can be driven on another analog multiplex bus to provide water-tolerance capability. Water tolerance is provided by driving the shield electrode in phase with the sense electrode to keep the shield capacitance from attenuating the sensed input. Proximity sensing can also be implemented. The CAPSENSE™ block has two IDACs, which can be used for general purposes if CAPSENSE™ is not being used (both IDACs are available in that case) or if CAPSENSE™ is used without water tolerance (one IDAC is available). The CAPSENSE™ block also provides a 10-bit slope ADC function which can be used in conjunction with the CAPSENSE™ function. The CAPSENSE™ block is an advanced, low-noise, programmable block with programmable voltage references and current source ranges for improved sensitivity and flexibility. It can also use an external reference voltage. It has a full-wave CSD mode that alternates sensing to VDDA and ground to null out power-supply related noise. 2.7.2 LCD segment drive The PSoC™ 4100S has an LCD controller, which can drive up to 4 commons and up to 32 segments. It uses full digital methods to drive the LCD segments requiring no generation of internal LCD voltages. The two methods used are referred to as digital correlation and PWM. Digital correlation pertains to modulating the frequency and drive levels of the common and segment signals to generate the highest RMS voltage across a segment to light it up or to keep the RMS signal to zero. This method is good for STN displays but may result in reduced contrast with TN (cheaper) displays. PWM pertains to driving the panel with PWM signals to effectively use the capacitance of the panel to provide the integration of the modulated pulse-width to generate the desired LCD voltage. This method results in higher power consumption but can result in better results when driving TN displays. LCD operation is supported during Deep Sleep refreshing a small display buffer (4 bits; 1 32-bit register per port). Datasheet 14 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Pinouts 3 Pinouts Table 1 provides the pin list for PSoC™ 4100S for the 48-pin TQFP, 44-pin TQFP, 40-pin QFN, 32-pin QFN, and 35-ball CSP packages. All port pins support GPIO. Table 1 Pin list 48-pin TQFP 44-pin TQFP 40-pin QFN 32-pin QFN 35-ball CSP Pin Name Pin Name Pin Name Pin Name Pin Name 28 P0.0 24 P0.0 22 P0.0 17 P0.0 C3 P0.0 29 P0.1 25 P0.1 23 P0.1 18 P0.1 A5 P0.1 30 P0.2 26 P0.2 24 P0.2 19 P0.2 A4 P0.2 31 P0.3 27 P0.3 25 P0.3 20 P0.3 A3 P0.3 32 P0.4 28 P0.4 26 P0.4 21 P0.4 B3 P0.4 33 P0.5 29 P0.5 27 P0.5 22 P0.5 A6 P0.5 34 P0.6 30 P0.6 28 P0.6 23 P0.6 B4 P0.6 35 P0.7 31 P0.7 29 P0.7 B5 P0.7 36 XRES 32 XRES 30 XRES 24 XRES B6 XRES 37 VCCD 33 VCCD 31 VCCD 25 VCCD A7 VCCD 38 VSSD DN VSSD 26 VSSD B7 VSS 39 VDDD 34 VDDD 32 VDDD C7 VDD 40 VDDA 35 VDDA 33 VDDA 27 VDD C7 VDD 41 VSSA 36 VSSA 34 VSSA 28 VSSA B7 VSS 42 P1.0 37 P1.0 35 P1.0 29 P1.0 C4 P1.0 43 P1.1 38 P1.1 36 P1.1 30 P1.1 C5 P1.1 44 P1.2 39 P1.2 37 P1.2 31 P1.2 C6 P1.2 45 P1.3 40 P1.3 38 P1.3 32 P1.3 D7 P1.3 46 P1.4 41 P1.4 39 P1.4 D4 P1.4 47 P1.5 42 P1.5 D5 P1.5 48 P1.6 43 P1.6 D6 P1.6 1 P1.7/VREF 44 P1.7/VREF E7 P1.7/VREF 1 VSSD 40 P1.7/VREF 1 P1.7/VREF 2 P2.0 2 P2.0 1 P2.0 2 P2.0 3 P2.1 3 P2.1 2 P2.1 3 P2.1 4 P2.2 4 P2.2 3 P2.2 4 P2.2 D3 P2.2 5 P2.3 5 P2.3 4 P2.3 5 P2.3 E4 P2.3 6 P2.4 6 P2.4 5 P2.4 E5 P2.4 7 P2.5 7 P2.5 6 P2.5 6 P2.5 E6 P2.5 8 P2.6 8 P2.6 7 P2.6 7 P2.6 E3 P2.6 9 P2.7 9 P2.7 8 P2.7 8 P2.7 E2 P2.7 10 VSSD 10 VSSD 9 VSSD 12 P3.0 11 P3.0 10 P3.0 9 P3.0 E1 P3.0 13 P3.1 12 P3.1 11 P3.1 10 P3.1 D2 P3.1 Datasheet 15 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Pinouts Table 1 Pin list (continued) 48-pin TQFP 44-pin TQFP 40-pin QFN 32-pin QFN 35-ball CSP Pin Name Pin Name Pin Name Pin Name Pin Name 14 P3.2 13 P3.2 12 P3.2 11 P3.2 D1 P3.2 16 P3.3 14 P3.3 13 P3.3 12 P3.3 C1 P3.3 17 P3.4 15 P3.4 14 P3.4 C2 P3.4 18 P3.5 16 P3.5 15 P3.5 19 P3.6 17 P3.6 16 P3.6 20 P3.7 18 P3.7 17 P3.7 21 VDDD 19 VDDD 22 P4.0 20 P4.0 18 P4.0 13 P4.0 B1 P4.0 23 P4.1 21 P4.1 19 P4.1 14 P4.1 B2 P4.1 24 P4.2 22 P4.2 20 P4.2 15 P4.2 A2 P4.2 25 P4.3 23 P4.3 21 P4.3 16 P4.3 A1 P4.3 Note Pins 11, 15, 26, and 27 are No Connects (NC) on the 48-pin TQFP. Descriptions of the power pins are as follows: VDDD: Power supply for the digital section. VDDA: Power supply for the analog section. VSSD, VSSA: Ground pins for the digital and analog sections respectively. VCCD: Regulated digital supply (1.8 V ± 5%) VDD: Power supply to all sections of the chip VSS: Ground for all sections of the chip Datasheet 16 002-00122 Rev. *P 2023-01-23 Table 2 Alternate pin functions Smart I/O Alternate function 1 Deep Sleep 1 Deep Sleep 2 tcpwm.tr_in[0] scb[2].i2c_scl:0 scb[0].spi_select1:0 tcpwm.tr_in[1] scb[2].i2c_sda:0 scb[0].spi_select2:0 Port/Pin Analog Alternate function 2 Alternate function 3 P0.0 lpcomp.in_p[0] P0.1 lpcomp.in_n[0] P0.2 lpcomp.in_p[1] scb[0].spi_select3:0 P0.3 lpcomp.in_n[1] scb[2].spi_select0 P0.4 wco.wco_in scb[1].uart_rx:0 scb[2].uart_rx:0 scb[1].i2c_scl:0 scb[1].spi_mosi:1 P0.5 wco.wco_out scb[1].uart_tx:0 scb[2].uart_tx:0 scb[1].i2c_sda:0 scb[1].spi_miso:1 scb[2].uart_tx:1 P0.6 srss.ext_clk scb[1].uart_cts:0 P0.7 tcpwm.line[0]:2 scb[1].uart_rts:0 scb[1].spi_clk:1 scb[1].spi_select0:1 17 002-00122 Rev. *P 2023-01-23 P1.0 ctb0_oa0+ tcpwm.line[2]:1 scb[0].uart_rx:1 scb[0].i2c_scl:0 scb[0].spi_mosi:1 P1.1 ctb0_oa0– tcpwm.line_compl[2]:1 scb[0].uart_tx:1 scb[0].i2c_sda:0 scb[0].spi_miso:1 P1.2 ctb0_oa0_out tcpwm.line[3]:1 scb[0].uart_cts:1 tcpwm.tr_in[2] scb[2].i2c_scl:1 scb[0].spi_clk:1 P1.3 ctb0_oa1_out tcpwm.line_compl[3]:1 scb[0].uart_rts:1 tcpwm.tr_in[3] scb[2].i2c_sda:1 scb[0].spi_select0:1 P1.4 ctb0_oa1– scb[0].spi_select1:1 P1.5 ctb0_oa1+ scb[0].spi_select2:1 P1.6 ctb0_oa0+ scb[0].spi_select3:1 P1.7 ctb0_oa1+ sar_ext_vref0 sar_ext_vref1 scb[2].spi_clk P2.0 sarmux[0] SmartIo[0].io[0] tcpwm.line[4]:0 P2.1 sarmux[1] SmartIo[0].io[1] tcpwm.line_compl[4]:0 P2.2 sarmux[2] SmartIo[0].io[2] scb[1].spi_clk:2 P2.3 sarmux[3] SmartIo[0].io[3] scb[1].spi_select0:2 P2.4 sarmux[4] SmartIo[0].io[4] tcpwm.line[0]:1 scb[1].spi_select1:1 P2.5 sarmux[5] SmartIo[0].io[5] tcpwm.line_compl[0]:1 scb[1].spi_select2:1 P2.6 sarmux[6] SmartIo[0].io[6] tcpwm.line[1]:1 scb[1].spi_select3:1 csd.comp tcpwm.tr_in[4] scb[1].i2c_scl:1 scb[1].spi_mosi:2 tcpwm.tr_in[5] scb[1].i2c_sda:1 scb[1].spi_miso:2 PSoC™ 4 MCU: PSoC™ 4100S Each port pin has can be assigned to one of multiple functions; it can, for instance, be an analog I/O, a digital peripheral function, an LCD pin, or a CAPSENSE™ pin. The pin assignments are shown in Table 2. Based on Arm® Cortex®-M0+ CPU Alternate pin functions Pinouts Datasheet 3.1 Deep Sleep 2 lpcomp.comp[0]:1 scb[2].spi_mosi scb[1].uart_rx:1 scb[1].i2c_scl:2 scb[1].spi_mosi:0 tcpwm.line_compl[0]:0 scb[1].uart_tx:1 scb[1].i2c_sda:2 scb[1].spi_miso:0 SmartIo[1].io[2] tcpwm.line[1]:0 scb[1].uart_cts:1 cpuss.swd_data scb[1].spi_clk:0 P3.3 SmartIo[1].io[3] tcpwm.line_compl[1]:0 scb[1].uart_rts:1 cpuss.swd_clk scb[1].spi_select0:0 P3.4 SmartIo[1].io[4] tcpwm.line[2]:0 P3.5 SmartIo[1].io[5] tcpwm.line_compl[2]:0 scb[1].spi_select2:0 P3.6 SmartIo[1].io[6] tcpwm.line[3]:0 scb[1].spi_select3:0 P3.7 SmartIo[1].io[7] tcpwm.line_compl[3]:0 Analog Smart I/O Alternate function 1 P2.7 sarmux[7] SmartIo[0].io[7] tcpwm.line_compl[1]:1 P3.0 SmartIo[1].io[0] tcpwm.line[0]:0 P3.1 SmartIo[1].io[1] P3.2 Alternate function 2 Alternate function 3 scb[1].spi_select1:0 tcpwm.tr_in[6] lpcomp.comp[1]:1 scb[2].spi_miso 18 P4.0 csd.vref_ext scb[0].uart_rx:0 scb[0].i2c_scl:1 scb[0].spi_mosi:0 P4.1 csd.cshieldpads scb[0].uart_tx:0 scb[0].i2c_sda:1 scb[0].spi_miso:0 P4.2 csd.cmodpad scb[0].uart_cts:0 lpcomp.comp[0]:0 scb[0].spi_clk:0 P4.3 csd.csh_tank scb[0].uart_rts:0 lpcomp.comp[1]:0 scb[0].spi_select0:0 PSoC™ 4 MCU: PSoC™ 4100S Deep Sleep 1 Port/Pin Based on Arm® Cortex®-M0+ CPU Alternate pin functions (continued) Pinouts Datasheet Table 2 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Power 4 Power The following power system diagram shows the set of power supply pins as implemented for the PSoC™ 4100S. The system has one regulator in Active mode for the digital circuitry. There is no analog regulator; the analog circuits run directly from the VDD input. VDDA VDDD VDDA VSSA VDDD Analog Domain Digital Domain VSSD 1.8 Volt Regulator Figure 5 VCCD Power supply connections There are two distinct modes of operation. In Mode 1, the supply voltage range is 1.8 V to 5.5 V (unregulated externally; internal regulator operational). In Mode 2, the supply range is 1.8 V ± 5% (externally regulated; 1.71 V to 1.89 V, internal regulator bypassed). 4.1 Mode 1: 1.8 V to 5.5 V external supply In this mode, the PSoC™ 4100S is powered by an external power supply that can be anywhere in the range of 1.8 V to 5.5 V. This range is also designed for battery-powered operation. For example, the chip can be powered from a battery system that starts at 3.5 V and works down to 1.8 V. In this mode, the internal regulator of the PSoC™ 4100S supplies the internal logic and its output is connected to the VCCD pin. The VCCD pin must be bypassed to ground via an external capacitor (0.1 µF; X5R ceramic or better) and must not be connected to anything else. Datasheet 19 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Power 4.2 Mode 2: 1.8 V ± 5% external supply In this mode, the PSoC™ 4100S is powered by an external power supply that must be within the range of 1.71 V to 1.89 V; note that this range needs to include the power supply ripple too. In this mode, the VDD and VCCD pins are shorted together and bypassed. The internal regulator can be disabled in the firmware. Bypass capacitors must be used from VDDD to ground. The typical practice for systems in this frequency range is to use a capacitor in the 1-µF range, in parallel with a smaller capacitor (0.1 µF, for example). Note that these are simply rules of thumb and that, for critical applications, the PCB layout, lead inductance, and the bypass capacitor parasitic should be simulated to design and obtain optimal bypassing. Figure 6 shows an example of a bypass scheme. Power supply bypass connections example 1.8 V to 5.5 V VDD 1 mF PSoCTM 4100S 1.8 V to 5.5 V VDDA 1 mF 0.1 mF 0.1 mF VCCD 0.1 mF VSS Figure 6 Datasheet External supply range from 1.8 V to 5.5 V with internal regulator active 20 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5 Electrical specifications 5.1 Absolute maximum ratings Table 3 Absolute maximum ratings[1] Spec ID Parameter Description Min Typ Max Unit Details/conditions SID1 VDDD_ABS Digital supply relative to VSS –0.5 – 6 SID2 VCCD_ABS Direct digital core voltage input relative to VSS –0.5 – 1.95 SID3 VGPIO_ABS GPIO voltage –0.5 – VDD + 0.5 – SID4 IGPIO_ABS Maximum current per GPIO –25 – 25 – SID5 GPIO injection current, IGPIO_injection Max for VIH > VDDD, and Min for VIL < VSS –0.5 – 0.5 BID44 ESD_HBM Electrostatic discharge human body model 2200 – – BID45 ESD_CDM Electrostatic discharge charged device model 500 – – BID46 LU Pin current for latch-up –140 – 140 – V mA – Current injected per pin – V – mA – Note 1. Usage above the absolute maximum conditions listed in Table 3 may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods of time may affect device reliability. The maximum storage temperature is 150°C in compliance with JEDEC Standard JESD22-A103, High Temperature Storage Life. When used below absolute maximum conditions but above normal operating conditions, the device may not operate to specification. Datasheet 21 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.2 Device level specifications All specifications are valid for –40°C  TA  105°C and TJ  125°C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. Table 4 DC specifications Typical values measured at VDD = 3.3 V and 25 °C. Spec ID Parameter Description Min Typ Max SID53 VDD Power supply input voltage 1.8 – 5.5 SID255 VDD Power supply input voltage (VCCD = VDDD = VDDA) 1.71 – 1.89 SID54 VCCD Output voltage (for core logic) – 1.8 – SID55 CEFC External regulator voltage bypass – 0.1 – SID56 CEXC Power supply bypass capacitor – 1 – Unit Details/conditions Internally regulated supply V Internally unregulated supply – µF X5R ceramic or better Active Mode, VDD = 1.8 V to 5.5 V. Typical values measured at VDD = 3.3 V and 25°C. SID10 IDD5 Execute from flash; CPU at 6 MHz – 1.8 2.7 SID16 IDD8 Execute from flash; CPU at 24 MHz – 3.0 4.75 SID19 IDD11 Execute from flash; CPU at 48 MHz – 5.4 6.85 1.7 2.2 mA Max is at 85°C and 5.5 V Sleep Mode, VDDD = 1.8 V to 5.5 V (Regulator on) SID22 SID25 IDD17 I2C wakeup WDT, and comparators on – IDD20 I2C wakeup, WDT, and comparators on. – mA 6 MHz. Max is at 85°C and 5.5 V. 2.2 2.5 12 MHz. Max is at 85°C and 5.5 V. 6 MHz. Max is at 85°C and 5.5 V. Sleep Mode, VDDD = 1.71 V to 1.89 V (Regulator bypassed) SID28 IDD23 I2C wakeup, WDT, and comparators on – 0.7 0.9 SID28A IDD23A I2C wakeup, WDT, and comparators on – 1 1.2 – 2.5 60 µA Max is at 3.6 V and 85°C. – 2.5 60 µA Max is at 5.5 V and 85°C. Max is at 1.89 V and 85°C. mA 12 MHz. Max is at 85°C and 5.5 V. Deep Sleep Mode, VDD = 1.8 V to 3.6 V (Regulator on) SID31 IDD26 I2C wakeup and WDT on Deep Sleep Mode, VDD = 3.6 V to 5.5 V (Regulator on) SID34 IDD29 I2C wakeup and WDT on Deep Sleep Mode, VDD = VCCD = 1.71 V to 1.89 V (Regulator bypassed) SID37 IDD32 I2C wakeup and WDT on – 2.5 65 µA Supply current while XRES asserted – 2 5 mA – XRES Current SID307 Datasheet IDD_XR 22 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications Table 5 Spec ID SID48 SID49[2] AC specifications Parameter Description Min Typ Max DC – 48 FCPU CPU frequency TSLEEP Wakeup from Sleep mode – 0 – Wakeup from Deep Sleep mode – 35 – SID50[2] TDEEPSLEEP Unit Details/conditions MHz 1.71 VDD 5.5 – µs – Note 2. Guaranteed by characterization. Datasheet 23 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.2.1 GPIO Table 6 GPIO DC specifications Spec ID Parameter Description Min Typ Max – Unit Details/conditions VIH[3] Input voltage high threshold 0.7 VDDD – SID58 VIL Input voltage low threshold – – 0.3 VDDD SID241 VIH[3] LVTTL input, VDDD < 2.7 V 0.7 VDDD – – – SID242 VIL LVTTL input, VDDD < 2.7 V – – 0.3 VDDD – SID243 VIH[3] LVTTL input, VDDD  2.7 V 2.0 – – – SID244 VIL LVTTL input, VDDD  2.7 V – – 0.8 SID59 VOH Output voltage high level VDDD – 0.6 – – IOH = 4 mA, VDDD  3 V SID60 VOH Output voltage high level VDDD – 0.5 – – IOH = 1 mA at 1.8 V VDDD SID61 VOL Output voltage low level – – 0.6 IOL = 4 mA at 1.8 V VDDD SID62 VOL Output voltage low level – – 0.6 IOL = 10 mA, VDDD  3 V SID62A VOL Output voltage low level – – 0.4 IOL = 3 mA, VDDD  3 V SID63 RPULLUP Pull-up resistor 3.5 5.6 8.5 SID64 RPULLDOWN Pull-down resistor 3.5 5.6 8.5 SID65 IIL Input leakage current (absolute value) – – 2 nA 25°C, VDDD = 3.0 V SID66 pF – SID57 CMOS Input V k – – – CIN Input capacitance – – 7 SID67[4] VHYSTTL Input hysteresis LVTTL 25 40 – SID68[4] VHYSCMOS Input hysteresis CMOS 0.05 × VDDD – – 200 – – Current through protection diode to VDD/VSS – – 100 µA Maximum total source or sink chip current – – 200 mA – SID68A[4] VHYSCMOS5V5 Input hysteresis CMOS SID69[4] IDIODE SID69A[4] ITOT_GPIO VDDD  2.7 V mV VDD < 4.5 V – Notes 3. VIH must not exceed VDDD + 0.2 V. 4. Guaranteed by characterization. Datasheet 24 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications Table 7 GPIO AC specifications (Guaranteed by characterization) Spec ID Parameter Description Min Typ Max Unit SID70 TRISEF Rise time in fast strong mode 2 – 12 SID71 TFALLF Fall time in fast strong mode 2 – 12 SID72 TRISES Rise time in slow strong mode 10 – 60 – SID73 TFALLS Fall time in slow strong mode 10 – 60 – SID74 FGPIOUT1 GPIO FOUT; 3.3 V  VDDD 5.5 V Fast strong mode – – 33 SID75 FGPIOUT2 GPIO FOUT; 1.71 VVDDD3.3 V Fast strong mode – – 16.7 SID76 FGPIOUT3 GPIO FOUT; 3.3 V VDDD 5.5 V Slow strong mode – – 7 SID245 FGPIOUT4 GPIO FOUT; 1.71 V VDDD 3.3 V Slow strong mode. – – 3.5 SID246 FGPIOIN GPIO input operating frequency; 1.71 V VDDD 5.5 V – – 48 Datasheet Details/conditions ns 3.3 V VDDD, Cload = 25 pF 90/10%, 25 pF load, 60/40 duty cycle 25 MHz 90/10% VIO 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.2.2 XRES Table 8 XRES DC specifications Spec ID Parameter Description Min Typ Max Unit Details/conditions SID77 VIH Input voltage high threshold 0.7 × VDDD – – SID78 VIL Input voltage low threshold – – 0.3 × VDDD SID79 RPULLUP Pull-up resistor – 60 – kΩ – SID80 CIN Input capacitance – – 7 pF SID81[5] VHYSXRES Input voltage hysteresis – 100 – Typical hysteresis mV is 200 mV for VDD > 4.5 V SID82 Current through protection diode to VDD/VSS – – 100 Min Typ Max Unit 1 – – µs – – 2.7 Table 9 Spec ID SID83[5] IDIODE V CMOS Input – µA – XRES AC specifications Parameter Description TRESETWIDTH Reset pulse width BID194[5] TRESETWAKE Wake-up time from reset release Details/conditions – ms – Note 5. Guaranteed by characterization. Datasheet 26 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.3 Analog peripherals 5.3.1 CTBm Opamp Table 10 CTBm Opamp specifications Spec ID Parameter Description Min Typ Max Unit Details/conditions IDD Opamp block current, external load SID269 IDD_HI Power = High – 1100 1850 SID270 IDD_MED Power = Medium – 550 950 SID271 IDD_LOW Power = Low – 150 350 GBW Load = 20 pF, 0.1 mA VDDA = 2.7 V SID272 GBW_HI Power = High 6 – – SID273 GBW_MED Power = Medium 3 – – SID274 GBW_LO Power = Low – 1 – IOUT_MAX VDDA = 2.7 V, 500 mV from rail SID275 IOUT_MAX_HI Power = High 10 – – SID276 IOUT_MAX_MID Power = Medium 10 – – SID277 IOUT_MAX_LO Power = Low – 5 – IOUT VDDA = 1.71 V, 500 mV from rail SID278 IOUT_MAX_HI Power = High 4 – – SID279 IOUT_MAX_MID Power = Medium 4 – – SID280 IOUT_MAX_LO Power = Low – 2 – IDD_Int Opamp block current, internal load SID269_I IDD_HI_Int Power = High – 1500 1700 SID270_I IDD_MED_Int Power = Medium – 700 900 IDD_LOW_Int Power = Low – – – – GBW VDDA = 2.7 V – – – – GBW_HI_Int Power = High 8 – – – VDDA – 0.2 SID271_I SID272_I – µA – – MHz Input and output are 0.2 V to VDDA – 0.2 V mA Output is 0.5 V to VDDA – 0.5 V mA Output is 0.5 V to VDDA – 0.5 V – µA MHz – Output is 0.25 V to VDDA – 0.25 V General opamp specs for both internal and external modes SID281 SID282 Datasheet VIN Charge-pump on, VDDA = 2.7 V –0.05 VCM Charge-pump on, VDDA = 2.7 V –0.05 – V 27 – VDDA – 0.2 – 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications Table 10 Spec ID CTBm Opamp specifications (continued) Parameter Description Min Typ Max Unit Details/conditions VOUT VDDA = 2.7 V SID283 VOUT_1 Power = High, Iload = 10 mA 0.5 – VDDA – 0.5 – SID284 VOUT_2 Power = High, Iload = 1 mA 0.2 – VDDA – 0.2 – SID285 VOUT_3 Power = Medium, Iload = 1 mA 0.2 – VDDA – 0.2 – SID286 VOUT_4 Power = Low, Iload = 0.1 mA 0.2 – VDDA – 0.2 – SID288 VOS_TR Offset voltage, trimmed –1.0 0.5 1.0 SID288A VOS_TR Offset voltage, trimmed – 1 – SID288B VOS_TR Offset voltage, trimmed – 2 – Low mode, input 0 V to VDDA – 0.2 V SID290 VOS_DR_TR Offset voltage drift, trimmed –10 3 10 High mode SID290A VOS_DR_TR Offset voltage drift, trimmed – 10 – SID290B VOS_DR_TR Offset voltage drift, trimmed – 10 – SID291 CMRR V DC 70 80 High mode, input 0 V to VDDA – 0.2 V mV µV/°C PSRR Input is 0 V to VDDA – 0.2 V, – At 1 kHz, 10-mV ripple 70 85 – Medium mode Low mode dB SID292 Medium mode, input 0 V to VDDA – 0.2 V Output is 0.2 V to VDDA – 0.2 V VDDD = 3.6 V, high-power mode, input is 0.2 V to VDDA – 0.2 V Noise SID294 VN2 Input-referred, 1 kHz, Power = High – 72 – SID295 VN3 Input-referred, 10 kHz, Power = High – 28 – VN4 Input-referred, 100 kHz, Power = High – 15 – SID296 Datasheet 28 Input and output nV/rtHz are at 0.2 V to VDDA – 0.2 V 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications Table 10 Spec ID CTBm Opamp specifications (continued) Parameter Description Min Typ Max Unit Details/conditions CLOAD Stable up to max. load. Performance specs at 50 pF. – – 125 pF – SLEW_RATE Cload = 50 pF, Power = High, VDDA = 2.7 V 6 – – V/µs – SID299 T_OP_WAKE From disable to enable, no external RC dominating – – 25 µs – SID299A OL_GAIN Open Loop Gain – 90 – dB – COMP_MODE Comparator mode; 50 mV drive, Trise = Tfall (approx.) SID300 TPD1 Response time; Power = High – 150 – SID301 TPD2 Response time; Power = Medium – 500 – ns Input is 0.2 V to VDDA – 0.2 V SID302 TPD3 Response time; Power = Low – 2500 – SID303 VHYST_OP Hysteresis – 10 – mV – SID304 WUP_CTB Wake-up time from Enabled to Usable – – 25 µs – Deep Sleep Mode Mode 2 is lowest current range. Mode 1 has higher GBW. SID_DS_1 IDD_HI_M1 Mode 1, high current – 1400 – SID_DS_2 IDD_MED_M1 Mode 1, medium current – 700 – SID_DS_3 IDD_LOW_M1 Mode 1, low current – 200 – SID_DS_4 IDD_HI_M2 Mode 2, high current – 120 – µA 25°C SID_DS_5 IDD_MED_M2 Mode 2, medium current – 60 – SID_DS_6 IDD_LOW_M2 Mode 2, low current – 15 – SID297 SID298 Datasheet 29 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications Table 10 Spec ID CTBm Opamp specifications (continued) Parameter Description Min Typ Max Unit Details/conditions MHz 20-pF load, no DC load 0.2 V to VDDA – 0.2 V mV With trim 25°C, 0.2 V to VDDA – 0.2 V SID_DS_7 GBW_HI_M1 Mode 1, high current – 4 – SID_DS_8 GBW_MED_M1 Mode 1, medium current – 2 – SID_DS_9 GBW_LOW_M1 Mode 1, low current – 0.5 – SID_DS_10 GBW_HI_M2 Mode 2, high current – 0.5 – SID_DS_11 GBW_MED_M2 Mode 2, medium current – 0.2 – SID_DS_12 GBW_Low_M2 Mode 2, low current – 0.1 – SID_DS_13 VOS_HI_M1 Mode 1, high current – 5 – SID_DS_14 VOS_MED_M1 Mode 1, medium current – 5 – SID_DS_15 VOS_LOW_M1 Mode 1, low current – 5 – SID_DS_16 VOS_HI_M2 Mode 2, high current – 5 – SID_DS_17 VOS_MED_M2 Mode 2, medium current – 5 – SID_DS_18 VOS_LOW_M2 Mode 2, low current – 5 – SID_DS_19 IOUT_HI_M1 Mode 1, high current – 10 – SID_DS_20 IOUT_MED_M1 Mode 1, medium current – 10 – SID_DS_21 IOUT_LOW_M1 Mode 1, low current – 4 – SID_DS_22 IOUT_HI_M2 Mode 2, high current – 1 – SID_DS_23 IOUT_MED_M2 Mode 2, medium current – 1 – – SID_DS_24 IOUT_LOW_M2 Mode 2, low current – 0.5 – – Datasheet 30 Output is 0.5 V to VDDA – 0.5 V mA – 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.3.2 Comparator Table 11 Comparator DC specifications Spec ID Parameter Description Min Typ Max SID84 VOFFSET1 Input offset voltage, factory trim – – ±10 SID85 VOFFSET2 Input offset voltage, custom trim – – ±4 SID86 VHYST Hysteresis when enabled – 10 35 SID87 VICM1 Input common mode voltage in normal mode 0 – VDDD – 0.1 SID247 VICM2 Input common mode voltage in low power mode 0 – VDDD SID247A VICM3 Input common mode voltage in ultra low power mode 0 – VDDD – 1.15 SID88 CMRR Common mode rejection ratio 50 – – SID88A CMRR Common mode rejection ratio 42 – – SID89 ICMP1 Block current, normal mode – – 400 SID248 ICMP2 Block current, low power mode – – 100 SID259 ICMP3 Block current in ultra low-power mode – – 6 SID90 ZCMP DC Input impedance of comparator 35 – – Table 12 Spec ID Unit – mV Modes 1 and 2 V dB VDDD ≥ 2.7 V – µA MΩ – Comparator AC specifications Parameter Description Min Typ Max 38 110 Unit SID258 TRESP2 Response time, low power mode, 50 mV overdrive – 70 200 SID92 TRESP3 Response time, ultra-low power mode, 200 mV overdrive – 2.3 15 µs Min Typ Max Unit –5 ±1 5 °C 5.3.3 Temperature Sensor Table 13 Temperature sensor specifications Datasheet – VDDD ≥ 2.2 V at –40°C – SID93 – VDDD ≥ 2.2 V at –40°C Response time, normal mode, 50 mV overdrive Spec ID – – TRESP1 SID91 Details/conditions Parameter TSENSACC Description Temperature sensor accuracy 31 Details/conditions – ns – VDDD ≥ 2.2 V at –40°C Details/conditions –40°C to +85°C 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.3.4 SAR Table 14 SAR specifications Spec ID Parameter Description Min Typ Max Unit Details/conditions SAR ADC DC specifications SID94 A_RES Resolution – – 12 bits – SID95 A_CHNLS_S Number of channels - single ended – – 16 – SID96 A-CHNKS_D Number of channels differential – – 4 Diff inputs use neighboring I/O SID97 A-MONO Monotonicity – – – Yes SID98 A_GAINERR Gain error – – ±0.1 % With external reference. SID99 A_OFFSET Input offset voltage – – 2 mV Measured with 1-V reference SID100 A_ISAR Current consumption – – 1 mA – SID101 A_VINS Input voltage range - single ended VSS – VDDA VSS – VDDA – V SID102 A_VIND Input voltage range differential SID103 A_INRES Input resistance – – 2.2 kΩ – SID104 A_INCAP Input capacitance – – 10 pF – SID260 VREFSAR Trimmed internal reference to SAR 1.188 1.2 1.212 V – 70 – – – SAR ADC AC specifications SID106 A_PSRR Power supply rejection ratio – dB SID107 A_CMRR Common mode rejection ratio 66 – – SID108 A_SAMP Sample rate – – 1 SID109 A_SNR Signal-to-noise and distortion ratio (SINAD) 65 – – SID110 A_BW Input bandwidth without aliasing – – A_samp/2 SID111 A_INL Integral non linearity. VDD = 1.71 V to 5.5 V, 1 Msps –1.7 – 2 SID111A A_INL Integral non linearity. VDDD = 1.71 V to 3.6 V, 1 Msps –1.5 – 1.7 VREF = 1.71 V to VDD SID111B A_INL Integral non linearity. VDD = 1.71 V to 5.5 V, 500 ksps –1.5 – 1.7 VREF = 1 V to VDD SID112 A_DNL Differential non linearity. VDD = 1.71 V to 5.5 V, 1 Msps –1 – 2.2 SID112A A_DNL Differential non linearity. VDD = 1.71 V to 3.6 V, 1 Msps –1 – 2 SID112B A_DNL Differential non linearity. VDD = 1.71 V to 5.5 V, 500 ksps –1 – 2.2 Datasheet 32 Measured at 1 V Msps – dB FIN = 10 kHz kHz – VREF = 1 V to VDD LSB VREF = 1 V to VDD VREF = 1.71 V to VDD VREF = 1 V to VDD 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications Table 14 SAR specifications (continued) Spec ID Parameter Description SID113 A_THD Total harmonic distortion SID261 SAR operating speed FSARINTREF without external reference bypass 5.3.5 CSD and IDAC Table 15 CSD and IDAC specifications Spec ID SYS.PER#3 SYS.PER#16 Parameter VDD_RIPPLE Description Max allowed ripple on power supply, DC to 10 MHz Max allowed ripple on VDD_RIPPLE_1.8 power supply, DC to 10 MHz SID.CSD.BLK ICSD Maximum block current SID.CSD#15 VREF SID.CSD#15A SID.CSD#16 Min – Typ – Max – – 100 ksps 12-bit resolution Max Unit Details/conditions Min Typ – – –65 Unit Details/conditions dB VDD > 2 V (with ripple), 25°C TA, Sensitivity = 0.1 pF ±50 ±25 VDD > 1.75V (with ripple), 25°C TA, Parasitic capacitance (CP) < 20 pF, Sensitivity ≥ 0.4 pF Maximum block current for both IDACs in dynamic (switching) mode including comparators, buffer, and reference generator. mV – – Fin = 10 kHz – – 4000 Voltage reference for CSD and comparator 0.6 1.2 VDDA – 0.6 VREF_EXT External voltage reference for CSD and comparator 0.6 – VDDA – 0.6 IDAC1IDD IDAC1 (7-bits) block current – – 1750 – – 1750 µA VDDA – 0.6 or 4.4, whichever is lower V VDDA – 0.6 or 4.4, whichever is lower – µA SID.CSD#17 IDAC2IDD IDAC2 (7-bits) block current SID308 VCSD Voltage range of operation 1.71 – 5.5 SID308A VCOMPIDAC Voltage compliance range of IDAC 0.6 – VDDA – 0.6 SID309 IDAC1DNL DNL –1 – 1 – SID310 IDAC1INL INL –2 – 2 INL is ±5.5 LSB for VDDA < 2 V SID311 IDAC2DNL DNL –1 – 1 SID312 IDAC2INL INL –2 – 2 Datasheet 33 – V LSB 1.8 V ± 5% or 1.8 V to 5.5 V VDDA – 0.6 or 4.4, whichever is lower – INL is ±5.5 LSB for VDDA < 2 V 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications Table 15 Spec ID CSD and IDAC specifications (continued) Parameter Description SID313 SNR Ratio of counts of finger to noise. Guaranteed by characterization SID314 IDAC1CRT1 SID314A Min Typ Max Unit Details/conditions Capacitance range of 5 to 35 pF, 0.1-pF Ratio sensitivity. All use cases. VDDA > 2 V. 5 – – Output current of IDAC1 (7 bits) in low range 4.2 – 5.4 LSB = 37.5-nA typ. IDAC1CRT2 Output current of IDAC1 (7 bits) in medium range 34 – 41 LSB = 300-nA typ. SID314B IDAC1CRT3 Output current of IDAC1 (7 bits) in high range 275 – 330 LSB = 2.4-µA typ. SID314C IDAC1CRT12 Output current of IDAC1 (7 bits) in low range, 2X mode 8 – 10.5 LSB = 75-nA typ. SID314D IDAC1CRT22 Output current of IDAC1 (7 bits) in medium range, 2X mode 69 – 82 LSB = 600-nA typ. SID314E IDAC1CRT32 Output current of IDAC1 (7 bits) in high range, 2X mode 540 – 660 LSB = 4.8-µA typ. SID315 IDAC2CRT1 Output current of IDAC2 (7 bits) in low range 4.2 – 5.4 LSB = 37.5-nA typ. SID315A IDAC2CRT2 Output current of IDAC2 (7 bits) in medium range 34 – 41 LSB = 300-nA typ. SID315B IDAC2CRT3 Output current of IDAC2 (7 bits) in high range 275 – 330 LSB = 2.4-µA typ. SID315C IDAC2CRT12 Output current of IDAC2 (7 bits) in low range, 2X mode 8 – 10.5 LSB = 75-nA typ. SID315D IDAC2CRT22 Output current of IDAC2 (7 bits) in medium range, 2X mode 69 – 82 LSB = 600-nA typ. SID315E IDAC2CRT32 Output current of IDAC2 (7 bits) in high range, 2X mode 540 – 660 LSB = 4.8-µA typ. SID315F IDAC3CRT13 Output current of IDAC in 8-bit mode in low range 8 – 10.5 LSB = 37.5-nA typ. SID315G IDAC3CRT23 Output current of IDAC in 8-bit mode in medium range 69 – 82 LSB = 300-nA typ. Datasheet 34 µA 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications Table 15 Spec ID SID315H CSD and IDAC specifications (continued) Parameter IDAC3CRT33 Description Min Typ Output current of IDAC in 8-bit mode in high 540 range – Max 660 Unit Details/conditions µA LSB = 2.4-µA typ. Polarity set by Source or Sink. LSB Offset is 2 LSBs for 37.5 nA/LSB mode SID320 IDACOFFSET All zeroes input – – 1 SID321 IDACGAIN Full-scale error less offset – – ±10 SID322 Mismatch between IDACMISMATCH1 IDAC1 and IDAC2 in Low mode – – 9.2 LSB = 37.5-nA typ. SID322A Mismatch between IDACMISMATCH2 IDAC1 and IDAC2 in Medium mode – – 5.6 LSB LSB = 300-nA typ. SID322B Mismatch between IDACMISMATCH3 IDAC1 and IDAC2 in High mode – – 6.8 LSB = 2.4-µA typ. SID323 IDACSET8 Settling time to 0.5 LSB for 8-bit IDAC – – 10 Full-scale transition. No external load. SID324 IDACSET7 Settling time to 0.5 LSB for 7-bit IDAC – – 10 SID325 CMOD External modulator capacitor. – 2.2 – % µs Datasheet 35 nF – Full-scale transition. No external load. 5-V rating, X7R or NP0 cap. 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.3.6 10-bit CapSense ADC Table 16 10-bit CAPSENSE™ ADC specifications Spec ID Parameter Description Min Typ Max Unit Details/conditions bits Auto-zeroing is required every millisecond SIDA94 A_RES Resolution – – 10 SIDA95 A_CHNLS_S Number of channels - single ended – – 16 SIDA97 A-MONO Monotonicity – – – Yes – SIDA98 A_GAINERR Gain error – – ±2 % SIDA99 A_OFFSET Input offset voltage – – 3 In VREF (2.4 V) mode with mV VDDA bypass capacitance of 10 µF SIDA100 A_ISAR Current consumption – – 0.25 SIDA101 A_VINS Input voltage range - single ended VSSA – VDDA SIDA103 A_INRES Input resistance – 2.2 – KΩ – SIDA104 A_INCAP Input capacitance – 20 – pF SIDA106 A_PSRR Power supply rejection ratio – 60 – In VREF (2.4 V) mode with dB VDDA bypass capacitance of 10 µF SIDA107 A_TACQ Sample acquisition time – 1 – A_CONV8 Conversion time for 8-bit resolution at conversion rate = Fhclk/(2^(N+2)). Clock frequency = 48 MHz. SIDA108 – – SIDA109 A_SND Signal-to-noise and Distortion ratio (SINAD) – 61 – SIDA110 A_BW Input bandwidth without aliasing – – 22.4 SIDA111 A_INL Integral Non Linearity. 1 ksps – – 2 A_DNL Differential Non Linearity. 1 ksps – SIDA112 Datasheet 36 V – – 85.3 1 – Does not include acquisition time. Equivalent to 44.8 ksps including acquisition time. Does not include acquisition time. Equivalent to 11.6 ksps including acquisition time. With 10-Hz input sine wave, external 2.4-V dB reference, VREF (2.4 V) mode KHz 8-bit resolution LSB – – – µs A_CONV10 In VREF (2.4 V) mode with VDDA bypass capacitance of 10 µF mA – 21.3 Conversion time for 10-bit resolution at conversion rate = Fhclk/(2^(N+2)). Clock frequency = 48 MHz. SIDA108A Defined by AMUX Bus VREF = 2.4 V or greater – 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.4 5.4.1 Digital peripherals Timer Counter Pulse-width Modulator (TCPWM) Table 17 TCPWM specifications Spec ID Parameter SID.TCPWM.1 ITCPWM1 SID.TCPWM.2 ITCPWM2 SID.TCPWM.2A ITCPWM3 Description Block current consumption at 3 MHz Block current consumption at 12 MHz Block current consumption at 48 MHz Min Typ Max Unit Details/conditions – – 45 – – 155 – – 650 – – Fc 2/Fc – – For all trigger events[6] Minimum possible width of Overflow, Underflow, and CC (Counter equals Compare value) outputs µA All modes (TCPWM) Fc max = CLK_SYS Maximum = 48 MHz SID.TCPWM.3 TCPWMFREQ Operating frequency SID.TCPWM.4 TPWMENEXT Input trigger pulse width TPWMEXT Output trigger pulse widths 2/Fc – – SID.TCPWM.5A TCRES Resolution of counter 1/Fc – – ns Minimum time between successive counts SID.TCPWM.5B PWMRES PWM resolution 1/Fc – – Minimum pulse width of PWM Output SID.TCPWM.5C QRES Quadrature inputs resolution 1/Fc – – Minimum pulse width between Quadrature phase inputs SID.TCPWM.5 MHz Note 6. Trigger events can be Stop, Start, Reload, Count, Capture, or Kill depending on which mode of operation is selected. Datasheet 37 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.4.2 I2C Table 18 Fixed I2C DC specifications[7] Spec ID Parameter Description Min Typ Max SID149 II2C1 Block current consumption at 100 kHz – – 50 SID150 II2C2 Block current consumption at 400 kHz – – 135 SID151 II2C3 Block current consumption at 1 Mbps – – 310 SID152 II2C4 I2C enabled in Deep Sleep mode – – 1.4 Table 19 Fixed I2C AC specifications[7] Spec ID SID153 Parameter FI2C1 Description Bit rate Min Typ Max – – 1 Unit Details/conditions – – µA – – Unit Details/conditions Msps – Note 7. Guaranteed by characterization. Datasheet 38 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.4.3 SPI Table 20 SPI DC specifications[8] Spec ID Parameter Description Min Typ Max SID163 ISPI1 Block current consumption at 1 Mbps – – 360 SID164 ISPI2 Block current consumption at 4 Mbps – – 560 SID165 ISPI3 Block current consumption at 8 Mbps – – 600 Table 21 SPI AC specifications[8] Spec ID SID166 Parameter FSPI Unit Details/conditions – µA – – Description Min Typ Max Unit Details/conditions SPI operating frequency (Master; 6X oversampling) – – 8 MHz SID166 – Fixed SPI Master Mode AC specifications SID167 TDMO MOSI valid after SClock driving edge – – 15 SID168 TDSI MISO valid before SClock capturing edge 20 – – SID169 THMO Previous MOSI data hold time 0 – – Referred to Slave capturing edge – ns Full clock, late MISO sampling Fixed SPI Slave Mode AC specifications SID170 TDMI MOSI valid before Sclock capturing edge 40 – – SID171 TDSO MISO valid after Sclock driving edge – – 42 + (3 × Tcpu) SID171A TDSO_EXT MISO valid after Sclock driving edge in External Clock mode – – 48 SID172 THSO Previous MISO data hold time 0 – – – SID172A TSSELSSCK SSEL valid to first SCK valid edge 100 – – – TCPU = 1/FCPU ns – Note 8. Guaranteed by characterization. Datasheet 39 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.4.4 UART Table 22 UART DC specifications[9] Spec ID SID160 SID161 Parameter Description Min Typ Max IUART1 Block current consumption at 100 Kbps – – 55 IUART2 Block current consumption at 1000 Kbps – SID162 – µA Parameter FUART Description Bit rate 5.4.5 LCD Table 24 LCD direct drive DC specifications[9] Spec ID Details/conditions – 312 – UART AC specifications[9] Table 23 Spec ID Unit Parameter Description Min Typ Max – – 1 Unit Details/conditions Mbps – Min Typ Max Unit Details/conditions SID154 ILCDLOW Operating current in low power mode – 5 – µA 16 × 4 small segment disp. at 50 Hz SID155 CLCDCAP LCD capacitance per segment/common driver – 500 5000 pF – SID156 LCDOFFSET Long-term segment offset – 20 – SID157 ILCDOP1 LCD system operating current Vbias = 5 V – 2 – ILCDOP2 LCD system operating current Vbias = 3.3 V – 2 – Min Typ Max Unit 10 50 150 Hz SID158 SID159 mA 32 × 4 segments. 50 Hz. 25°C 32 × 4 segments. 50 Hz. 25°C LCD direct drive AC specifications[9] Table 25 Spec ID mV – Parameter FLCD Description LCD frame rate Details/conditions – Note 9. Guaranteed by characterization. Datasheet 40 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.5 Memory 5.5.1 Flash Table 26 Flash DC specifications Spec ID SID173 Parameter VPE Table 27 Description Min Typ Max Unit Erase and program voltage 1.71 – 5.5 V Details/conditions – Flash AC specifications Spec ID Parameter Description Min Typ Max Unit Details/conditions SID174 TROWWRITE[10] Row (block) write time (erase and program) – – 20 SID175 TROWERASE[10] Row erase time – – 16 SID176 TROWPROGRAM[10] Row program time after erase – – 4 – SID178 TBULKERASE[10] Bulk erase time (64 KB) – – 35 – SID180[11] TDEVPROG[10] Total device program time – – 7 Seconds – SID181[11] FEND Flash endurance 100 K – – SID182[11] FRET Flash retention. TA  55 °C, 100 K P/E cycles 20 – – – Flash retention. TA  85 °C, 10 K P/E cycles 10 – – SID182B – Flash retention. TA  105 °C, 10K P/E cycles,  three years at TA ≥ 85 °C 10 – 20 SID256 TWS48 Number of Wait states at 48 MHz 2 – – TWS24 Number of Wait states at 24 MHz 1 – – SID182A[11] SID257 Row (block) = 128 bytes ms Cycles – – – Years – Years – CPU execution from flash Notes 10.It can take as much as 20 milliseconds to write to flash. During this time the device should not be Reset, or Flash operations may be interrupted and cannot be relied on to have completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs. Make certain that these are not inadvertently activated. 11.Guaranteed by characterization. Datasheet 41 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.6 System resources 5.6.1 Power-on reset (POR) Table 28 Power-on reset (POR) Spec ID Parameter Description SID.CLK#6 SR_POWER_UP Power supply slew rate Min Typ Max Unit 1 – 67 V/ms SID185[12] VRISEIPOR Rising trip voltage 0.80 – 1.5 VFALLIPOR Falling trip voltage 0.70 – 1.4 Min Typ Max – 1.62 SID186[12] Table 29 Spec ID SID190[12] SID192[12] Parameter Description – V – Unit Details/conditions VFALLPPOR BOD trip voltage in active and sleep modes 1.48 VFALLDPSLP BOD trip voltage in Deep Sleep 1.11 – Min Typ Max 3.3 V  VDD  5.5 V – – 14 – – 7 SWDCLK ≤ 1/3 CPU clock frequency – SWD interface Table 30 SWD interface specifications SID213 At power-up and power-down Brown-out detect (BOD) for VCCD 5.6.2 Spec ID Details/conditions Parameter F_SWDCLK1 Description – V 1.5 – Unit Details/conditions MHz SID214 F_SWDCLK2 1.71 V  VDD  3.3 V SID215[12] T_SWDI_SETUP T = 1/f SWDCLK 0.25 × T – – SID216[12] T_SWDI_HOLD T = 1/f SWDCLK 0.25 × T – – SID217[12] T_SWDO_VALID T = 1/f SWDCLK – – 0.5 × T SID217A[12] T_SWDO_HOLD T = 1/f SWDCLK 1 – – ns SWDCLK ≤ 1/3 CPU clock frequency – – – Note 12.Guaranteed by characterization. Datasheet 42 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.6.3 IMO Table 31 IMO DC specifications (Guaranteed by design) Spec ID SID218 SID219 Parameter Description Min Typ Max – 250 IIMO1 IMO operating current at 48 MHz – IIMO2 IMO operating current at 24 MHz – Table 32 Spec ID – µA – 180 – IMO AC specifications Parameter Description Min SID223[14] – SID223A[13, 14] SID223B[13, 14] Unit Details/conditions – FIMOTOL1 Frequency variation at 24, 32, and 48 MHz (trimmed) SID223C[13, 14] – – SID223D[13, 14] Typ – – – – Max ±2.0 ±2.5 ±2.0 ±1.5 Unit Details/conditions % At –40°C to 85°C, for industrial temperature range and original extended industrial range parts % At –40°C to 105°C, for all extended industrial temperature range parts % At –30°C to 105°C, for enhanced IMO extended industrial temperature range parts % At –20°C to 105°C, for enhanced IMO extended industrial temperature range parts – – ±1.25 % At 0°C to 85°C, for enhanced IMO extended industrial temperature range parts SID226 TSTARTIMO IMO startup time – – 7 µs – SID228 TJITRMSIMO2 RMS jitter at 24 MHz – 145 – ps – Notes 13.The enhanced IMO extended temperature range parts replace the original extended industrial temperature range parts. For details on how to identify enhanced IMO extended temperature range parts, please refer to KBA235887. 14.Evaluated by characterization. Does not take into account soldering or board-level effects. Datasheet 43 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.6.4 ILO Table 33 ILO DC specifications (Guaranteed by design) Spec ID [15] SID231 Parameter IILO1 Table 34 Spec ID [15] SID234 Description ILO operating current Min Typ Max Unit – 0.3 1.05 µA Min Typ Max Unit Details/conditions – ILO AC specifications Parameter Description Details/conditions TSTARTILO1 ILO startup time – – 2 ms – SID236 TILODUTY ILO duty cycle 40 50 60 % – SID237 FILOTRIM1 ILO frequency range 20 40 80 kHz – [15] 5.6.5 WCO Table 35 WCO specifications Spec ID Parameter Description Min Typ Max Unit Details/conditions SID398 FWCO Crystal frequency – 32.768 – SID399 FTOL Frequency tolerance – 50 250 ppm SID400 ESR Equivalent series resistance – 50 – kΩ – SID401 PD Drive level – – 1 µW – SID402 TSTART Startup time – – 500 ms – SID403 CL Crystal load capacitance 6 – 12.5 SID404 C0 Crystal shunt capacitance – 1.35 – SID405 IWCO1 Operating current (high power mode) – – 8 IWCO2 Operating current (low power mode) – SID406 5.6.6 External clock Table 36 External clock specifications Spec ID Parameter kHz – With 20-ppm crystal – pF – – A Description – 1 – Min Typ Max Unit Details/conditions SID305[15] ExtClkFreq External clock input frequency 0 – 48 MHz – SID306[15] ExtClkDuty Duty cycle; measured at VDD/2 45 – 55 % – Note 15.Guaranteed by characterization. Datasheet 44 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Electrical specifications 5.6.7 Block Table 37 Block specs Spec ID Parameter SID262[16] TCLKSWITCH Description System clock source switching time Min Typ Max 3 – 4 5.6.8 Smart I/O Table 38 Smart I/O pass-through time (Delay in Bypass Mode) Spec ID SID252 Parameter PRG_BYPASS Description Max delay added by Smart I/O in Bypass Mode Unit Details/conditions Periods – Min Typ Max Unit – – 1.6 ns Details/conditions – Note 16.Guaranteed by characterization. Datasheet 45 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Ordering information 6 Ordering information The marketing part numbers for the PSoC™ 4100S family are listed in the following table. Ordering information 4124 4125 4126 4145 Datasheet 35-ball WLCSP (0.35mm pitch) 32-pin QFN 40-pin QFN 48-pin TQFP 44-pin TQFP 0 GPIO 1 Smart I/Os 0 SCB Blocks 2 TCPWM Blocks 12-bit SAR ADC 4 LP Comparators 10-bit CSD ADC 16 Package ADC Sample Rate CSD 24 Opamp (CTBm) CY8C4124FNI-S403(T) Flash (KB) MPN SRAM (KB) Category Max CPU speed (MHz) Features 2 5 2 8 31 X – – – – Temperature Range (°C) Table 39 –40°C to 85°C CY8C4124FNI-S413(T) 24 16 4 2 1 1 0 2 5 2 16 31 X – – – – –40°C to 85°C CY8C4124LQI-S412(T) 24 16 4 2 1 1 0 2 5 2 16 27 – X – – – –40°C to 85°C CY8C4124LQI-S413(T) 24 16 4 2 1 1 0 2 5 2 16 34 – – X – –40°C to 85°C CY8C4124AZI-S413(T) 24 16 4 2 1 1 0 2 5 2 16 36 – – – X – –40°C to 85°C CY8C4124FNI-S433(T) 24 16 4 2 1 1 1 2 5 2 16 31 X – – – – –40°C to 85°C –40°C to 105°C 806 ksps CY8C4124FNQ-S433(T) 24 16 4 2 1 1 1 806 ksps 2 5 2 16 31 X – – – – CY8C4124LQI-S432(T) 24 16 4 2 1 1 1 806 ksps 2 5 2 16 27 – X – – – –40°C to 85°C CY8C4124LQI-S433(T) 24 16 4 2 1 1 1 806 ksps 2 5 2 16 34 – – X – – –40°C to 85°C CY8C4124AZI-S433(T) 24 16 4 2 1 1 1 806 ksps 2 5 2 16 36 – – – X – –40°C to 85°C CY8C4125FNI-S423(T) 24 32 4 2 0 1 1 806 ksps 2 5 2 16 31 X – – – – –40°C to 85°C CY8C4125LQI-S422(T) 24 32 4 2 0 1 1 806 ksps 2 5 2 16 27 – X – – – –40°C to 85°C CY8C4125LQI-S423(T) 24 32 4 2 0 1 1 806 ksps 2 5 2 16 34 – – X – – –40°C to 85°C X CY8C4125AZI-S423(T) 24 32 4 2 0 1 1 806 ksps 2 5 2 16 36 – – – CY8C4125AXI-S423 24 32 4 2 0 1 1 806 ksps 2 5 2 16 36 – – – – –40°C to 85°C X –40°C to 85°C CY8C4125FNI-S413(T) 24 32 4 2 1 1 0 2 5 2 16 31 X – – – – –40°C to 85°C CY8C4125LQI-S412(T) 24 32 4 2 1 1 0 2 5 2 16 27 – X – – – –40°C to 85°C CY8C4125LQI-S413(T) 24 32 4 2 1 1 0 2 5 2 16 34 – – X – – –40°C to 85°C CY8C4125AZI-S413(T) 24 32 4 2 1 1 0 2 5 2 16 36 – – – X – –40°C to 85°C CY8C4125FNI-S433(T) 24 32 4 2 1 1 1 2 5 2 16 31 X – – – – –40°C to 85°C –40°C to 105°C 806 ksps CY8C4125FNQ-S433(T) 24 32 4 2 1 1 1 806 ksps 2 5 2 16 31 X – – – – CY8C4125LQI-S432 24 32 4 2 1 1 1 806 ksps 2 5 2 16 27 – X – – – –40°C to 85°C CY8C4125LQQ-S432 24 32 4 2 1 1 1 806 ksps 2 5 2 16 27 – X – – – –40°C to 105°C CY8C4125LQI-S433 24 32 4 2 1 1 1 806 ksps 2 5 2 16 34 – – X – – –40°C to 85°C CY8C4125AZI-S433(T) 24 32 4 2 1 1 1 806 ksps 2 5 2 16 36 – – – X – –40°C to 85°C CY8C4125AZQ-S433 24 32 4 2 1 1 1 806 ksps 2 5 2 16 36 – – – X – –40°C to 105°C CY8C4125AXI-S433 24 32 4 2 1 1 1 806 ksps 2 5 2 16 36 – – – – X –40°C to 85°C CY8C4126AZI-S423(T) 24 64 8 2 0 1 1 806 ksps 2 5 3 16 36 – – – X – –40°C to 85°C CY8C4126AZQ-S423 24 64 8 2 0 1 1 806 ksps 2 5 3 16 36 – – – X – –40°C to 105°C –40°C to 85°C CY8C4126AXI-S423 24 64 8 2 0 1 1 806 ksps 2 5 3 16 36 – – – – X CY8C4126AZI-S433(T) 24 64 8 2 1 1 1 806 ksps 2 5 3 16 36 – – – X – –40°C to 85°C CY8C4126AZQ-S433 24 64 8 2 1 1 1 806 ksps 2 5 3 16 36 – – – X – –40°C to 105°C CY8C4126AXI-S433 24 64 8 2 1 1 1 806 ksps 2 5 3 16 36 – – – – X –40°C to 85°C –40°C to 105°C CY8C4126AXQ-S433 24 64 8 2 1 1 1 806 ksps 2 5 3 16 36 – – – – X CY8C4145AZI-S423(T) 48 32 4 2 0 1 1 1 Msps 2 5 2 16 36 – – – X – –40°C to 85°C CY8C4145AZQ-S433 48 32 4 2 1 1 1 1 Msps 2 5 2 16 36 – – – X – –40°C to 105°C CY8C4145AXI-S423 48 32 4 2 0 1 1 1 Msps 2 5 2 16 36 – – – – X –40°C to 85°C CY8C4145AXI-S433 48 32 4 2 1 1 1 1 Msps 2 5 2 16 36 – – – – X –40°C to 85°C CY8C4145AXQ-S433 48 32 4 2 1 1 1 1 Msps 2 5 2 16 36 – – – – X –40°C to 105°C 46 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Ordering information Ordering information (continued) 4146 Datasheet 5 3 16 31 X – – – – –40°C to 85°C 2 5 3 16 27 – X – – – –40°C to 85°C Temperature Range (°C) 2 1 Msps 44-pin TQFP 35-ball WLCSP (0.35mm pitch) 1 Msps 48-pin TQFP GPIO 1 1 32-pin QFN Smart I/Os 1 1 SCB Blocks 0 0 TCPWM Blocks 2 2 LP Comparators ADC Sample Rate 8 8 10-bit CSD ADC 64 64 CSD 48 48 Opamp (CTBm) CY8C4146FNI-S423(T) Flash (KB) 12-bit SAR ADC Package CY8C4146LQI-S422(T) MPN SRAM (KB) Category Max CPU speed (MHz) Features 40-pin QFN Table 39 CY8C4146LQQ-S422(T) 48 64 8 2 0 1 1 1 Msps 2 5 3 16 27 – X – – – –40°C to 105°C CY8C4146LQI-S423(T) 48 64 8 2 0 1 1 1 Msps 2 5 3 16 34 – – X – – –40°C to 85°C CY8C4146AZI-S423(T) 48 64 8 2 0 1 1 1 Msps 2 5 3 16 36 – – – X – –40°C to 85°C CY8C4146AZQ-S423 48 64 8 2 0 1 1 1 Msps 2 5 3 16 36 – – – X – –40°C to 105°C CY8C4146AXI-S423 48 64 8 2 0 1 1 1 Msps 2 5 3 16 36 – – – – X –40°C to 85°C CY8C4146AXQ-S423 48 64 8 2 0 1 1 1 Msps 2 5 3 16 36 – – – – X –40°C to 105°C CY8C4146FNI-S433(T) 48 64 8 2 1 1 1 1 Msps 2 5 3 16 31 X – – – – –40°C to 85°C CY8C4146FNQ-S433(T) 48 64 8 2 1 1 1 1 Msps 2 5 3 16 31 X – – – – –40°C to 105°C CY8C4146LQI-S432(T) 48 64 8 2 1 1 1 1 Msps 2 5 3 16 27 – X – – – –40°C to 85°C CY8C4146LQQ-S432(T) 48 64 8 2 1 1 1 1 Msps 2 5 3 16 27 – X – – – –40°C to 105°C CY8C4146LQI-S433(T) 48 64 8 2 1 1 1 1 Msps 2 5 3 16 34 – – X – – –40°C to 85°C CY8C4146AZI-S433(T) 48 64 8 2 1 1 1 1 Msps 2 5 3 16 36 – – – X – –40°C to 85°C CY8C4146AZQ-S433 48 64 8 2 1 1 1 1 Msps 2 5 3 16 36 – – – X – –40°C to 105°C CY8C4146AXI-S433 48 64 8 2 1 1 1 1 Msps 2 5 3 16 36 – – – – X –40°C to 85°C CY8C4146AXQ-S433 48 64 8 2 1 1 1 1 Msps 2 5 3 16 36 – – – – X –40°C to 105°C 47 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Ordering information The nomenclature used in the preceding table is based on the following part numbering convention: Field CY8C Description Values Meaning Prefix 4 Architecture 4 PSoC™ 4 A Family 1 4100 Family B CPU speed 2 24 MHz 4 48 MHz 4 16 KB 5 32 KB 6 64 KB 7 128 KB AX TQFP (0.8 mm pitch) AZ TQFP (0.5 mm pitch) LQ QFN PV SSOP FN CSP C Flash capacity DE Package code F Temperature range S Series designator XYZ T Attributes code I Industrial Q Extended Industrial S S-Series M M-Series L L-Series 000-999 Code of feature set in the specific family Tray Package type T Tape and Reel The following is an example of a part number. Example CY8C 4 A B C DE F – S XYZ T Cypress prefix 4: PSoCTM 4 1: 4100 Family 4: 48 MHz Architecture Family within Architecture CPU speed 5: 32 KB Flash capacity AX: TQFP Package code I: Industrial Temperature range Series designator Attributes code Package type Datasheet 48 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Packaging 7 Packaging The PSoC™ 4100S is offered in 48-pin TQFP, 44-pin TQFP, 40-pin QFN, 32-pin QFN, and 35-ball WLCSP packages. Table 40 provides the package dimensions and Infineon drawing numbers. Table 40 Package list Spec ID Package Description Package drawing BID20 48-pin TQFP 7 × 7 × 1.4-mm height with 0.5-mm pitch 51-85135 BID20A 44-pin TQFP 10 × 10 × 1.6-mm height with 0.8-mm pitch 51-85064 BID27 40-pin QFN 6 × 6 × 0.6-mm height with 0.5-mm pitch 001-80659 BID34A 32-pin QFN 5 × 5 × 0.6-mm height with 0.5-mm pitch 001-42168 BID34D 35-ball WLCSP 2.6 × 2.1 × 0.48-mm height with 0.35-mm pitch 002-09958 Table 41 Package thermal characteristics Parameter Description Package Min Typ Max Unit Details/conditions TA Operating ambient temperature – –40 25 105 TJ Operating junction temperature – –40 – 125 – TJA Package θJA 48-pin TQFP – 74.8 – – TJC Package θJC 48-pin TQFP – 35.7 – – TJA Package θJA 44-pin TQFP – 57.2 – – TJC Package θJC 44-pin TQFP – 17.5 – – TJA Package θJA 40-pin QFN – 17.8 – – TJC Package θJC 40-pin QFN – 2.8 – TJA Package θJA 32-pin QFN – 19.9 – TJC Package θJC 32-pin QFN – 4.3 – – TJA Package θJA 35-ball WLCSP – 43 – – TJC Package θJC 35-ball WLCSP – 0.3 – – Table 42 Solder reflow peak temperature – °C °C/W – – Package Maximum peak temperature Maximum time at peak temperature All 260 °C 30 seconds Table 43 Datasheet Package moisture sensitivity level (MSL), IPC/JEDEC J-STD-020 Package MSL All except WLCSP MSL 3 35-ball WLCSP MSL 1 49 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Packaging 7.1 Package diagrams 51-85135 *C Figure 7 48-pin TQFP (7 × 7 × 1.4 mm) package outline, 51-85135 51-85064 *G Figure 8 Datasheet 44-pin TQFP (10 × 10 × 1.4 mm) package outline, 51-85064 50 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Packaging 001-80659 *A Figure 9 Datasheet 40-pin QFN ((6 × 6 × 0.6 mm) 4.6 × 4.6 mm E-Pad (Sawn)) package outline, 001-80659 51 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Packaging SEE NOTE 1 TOP VIEW BOTTOM VIEW SIDE VIEW DIMENSIONS NOTES: 1. SYMBOL MIN. NOM. MAX. HATCH AREA IS SOLDERABLE EXPOSED PAD 2. BASED ON REF JEDEC # MO-248 A 0.50 0.55 0.60 3. PACKAGE WEIGHT: 0.0388g A1 - 0.020 0.045 4. DIMENSIONS ARE IN MILLIMETERS A2 0.15 BSC D 4.90 5.00 5.10 D2 3.40 3.50 3.60 E 4.90 5.00 5.10 E2 3.40 3.50 3.60 L 0.30 0.40 0.50 b 0.18 0.25 0.30 e 0.50 TYP 001-42168 *F Figure 10 Datasheet 32-pin QFN ((5.0 × 5.0 × 0.55 mm) 3.5 × 3.5 mm E-Pad (Sawn)) package outline, 001-42168 52 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Packaging 1 2 3 4 5 6 7 6 7 5 4 3 2 1 A A B B C C D D E E NOTES: DIMENSIONS SYMBOL MIN. NOM. MAX. A - - 0.482 A1 0.141 0.157 0.173 D 2.557 2.582 2.607 E 2.072 2.097 2.122 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. JEDEC PUBLICATION 95; DESIGN GUIDE 4.18. D1 2.10 BSC E1 1.40 BSC MD 7 ME 5 N 35 b 0.19 0.22 0.25 eD - 0.35 - eE - 0.35 - SD 0 SE 0.02 BSC 002-09958 *D Figure 11 Datasheet 35-ball WLCSP (2.582 × 2.097 × 0.482 mm) package outline, 002-09958 53 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Acronyms 8 Acronyms Table 44 Acronyms used in this document Acronym Description abus analog local bus ADC analog-to-digital converter AG analog global AHB AMBA (advanced microcontroller bus architecture) high-performance bus, an Arm® data transfer bus ALU arithmetic logic unit AMUXBUS analog multiplexer bus API application programming interface APSR application program status register Arm® advanced RISC machine, a CPU architecture ATM automatic thump mode BW bandwidth CAN Controller Area Network, a communications protocol CMRR common-mode rejection ratio CPU central processing unit CRC cyclic redundancy check, an error-checking protocol DAC digital-to-analog converter, see also IDAC, VDAC DFB digital filter block DIO digital input/output, GPIO with only digital capabilities, no analog. See GPIO. DMIPS Dhrystone million instructions per second DMA direct memory access, see also TD DNL differential nonlinearity, see also INL DNU do not use DR port write data registers DSI digital system interconnect DWT data watchpoint and trace ECC error correcting code ECO external crystal oscillator EEPROM electrically erasable programmable read-only memory EMI electromagnetic interference EMIF external memory interface EOC end of conversion EOF end of frame EPSR execution program status register ESD electrostatic discharge ETM embedded trace macrocell FIR finite impulse response, see also IIR Datasheet 54 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Acronyms Table 44 Acronyms used in this document (continued) Acronym Description FPB flash patch and breakpoint FS full-speed GPIO general-purpose input/output, applies to a PSoC pin HVI high-voltage interrupt, see also LVI, LVD IC integrated circuit IDAC current DAC, see also DAC, VDAC IDE integrated development environment I2C, or IIC Inter-Integrated Circuit, a communications protocol IIR infinite impulse response, see also FIR ILO internal low-speed oscillator, see also IMO IMO internal main oscillator, see also ILO INL integral nonlinearity, see also DNL I/O input/output, see also GPIO, DIO, SIO, USBIO IPOR initial power-on reset IPSR interrupt program status register IRQ interrupt request ITM instrumentation trace macrocell LCD liquid crystal display LIN Local Interconnect Network, a communications protocol. LR link register LUT lookup table LVD low-voltage detect, see also LVI LVI low-voltage interrupt, see also HVI LVTTL low-voltage transistor-transistor logic MAC multiply-accumulate MCU microcontroller unit MISO master-in slave-out NC no connect NMI nonmaskable interrupt NRZ non-return-to-zero NVIC nested vectored interrupt controller NVL nonvolatile latch, see also WOL opamp operational amplifier PAL programmable array logic, see also PLD PC program counter PCB printed circuit board PGA programmable gain amplifier PHUB peripheral hub PHY physical layer PICU port interrupt control unit Datasheet 55 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Acronyms Table 44 Acronyms used in this document (continued) Acronym Description PLA programmable logic array PLD programmable logic device, see also PAL PLL phase-locked loop PMDD package material declaration data sheet POR power-on reset PRES precise power-on reset PRS pseudo random sequence PS port read data register PSoC™ Programmable System-on-Chip™ PSRR power supply rejection ratio PWM pulse-width modulator RAM random-access memory RISC reduced-instruction-set computing RMS root-mean-square RTC real-time clock RTL register transfer language RTR remote transmission request RX receive SAR successive approximation register SC/CT switched capacitor/continuous time SCL I2C serial clock SDA I2C serial data S/H sample and hold SINAD signal to noise and distortion ratio SIO special input/output, GPIO with advanced features. See GPIO. SOC start of conversion SOF start of frame SPI Serial Peripheral Interface, a communications protocol SR slew rate SRAM static random access memory SRES software reset SWD serial wire debug, a test protocol SWV single-wire viewer TD transaction descriptor, see also DMA THD total harmonic distortion TIA transimpedance amplifier TRM technical reference manual TTL transistor-transistor logic TX transmit UART Universal Asynchronous Transmitter Receiver, a communications protocol Datasheet 56 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Acronyms Table 44 Acronyms used in this document (continued) Acronym Description UDB universal digital block USB Universal Serial Bus USBIO USB input/output, PSoC pins used to connect to a USB port VDAC voltage DAC, see also DAC, IDAC WDT watchdog timer WOL write once latch, see also NVL WRES watchdog timer reset XRES external reset I/O pin XTAL crystal Datasheet 57 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Document conventions 9 Document conventions 9.1 Units of measure Table 45 Units of measure Symbol Unit of measure °C degrees Celsius dB decibel fF femto farad Hz hertz KB 1024 bytes kbps kilobits per second Khr kilohour kHz kilohertz k kilo ohm ksps kilosamples per second LSB least significant bit Mbps megabits per second MHz megahertz M mega-ohm Msps megasamples per second µA microampere µF microfarad µH microhenry µs microsecond µV microvolt µW microwatt mA milliampere ms millisecond mV millivolt nA nanoampere ns nanosecond nV nanovolt  ohm pF picofarad ppm parts per million ps picosecond s second sps samples per second sqrtHz square root of hertz V volt Datasheet 58 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Revision history Revision histor y Document version Date ** 2015-08-28 New datasheet. *A 2015-10-30 Updated Pinouts: Updated Table 1. Updated Electrical specifications: Updated Analog peripherals: Updated Comparator: Updated Table 11. Updated Table 12. Updated 10-bit CapSense ADC: Updated Table 16. Updated Ordering information: Updated part numbers. Completing Sunset Review. *B 2015-12-08 Changed status from Advance to Preliminary. 2015-12-22 Updated Features: Updated description under “32-bit MCU Subsystem” and “Serial Communication”. Updated Pinouts: Updated Table 1. Updated Table 2. Updated Ordering information: No change in part numbers. Replaced “36 WLCSP (0.35 mm pitch)” with “35-WLCSP”. Updated Packaging: Replaced “36-ball WLCSP package” with “35-ball WLCSP package” in all instances. Completing Sunset Review. 2016-02-16 Updated Packaging: Updated Table 41. Replaced TBD with 002-09958 *A. Added Errata. Updated to new template. Completing Sunset Review. 2016-03-15 Updated Electrical specifications: Updated Device level specifications: Updated XRES: Updated Table 8. Updated Table 9. Updated Analog peripherals: Updated CSD and IDAC: Updated Table 15. Updated 10-bit CapSense ADC: Updated Table 16. Updated Memory: Updated Flash: Updated Table 27. Completing Sunset Review. *C *D *E Datasheet Description of changes 59 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Revision history Document version Date Description of changes 2016-07-27 Updated Electrical specifications: Updated Analog peripherals: Updated CSD and IDAC: Updated Table 15. Updated 10-bit CapSense ADC: Updated Table 16. Removed Errata. Completing Sunset Review. 2016-10-13 Added 44-pin TQFP package related information related information in all instances across the document. Updated Packaging: Added 51-85064 *G. *H 2017-01-09 Updated Functional definition: Updated Analog blocks: Updated 12-bit SAR ADC: Updated Figure 4. Updated Programmable digital blocks: Updated description. Updated Pinouts: Updated description. Updated Electrical specifications: Updated Device level specifications: Updated Table 4. Updated Ordering information: Updated part numbers. Completing Sunset Review. *I 2017-04-26 Updated Packaging: spec 002-09958 – Changed revision from *C to *D. Updated to new template. 2018-02-14 Updated Features: Updated description under “Timing and Pulse-Width Modulation”. Added “Clock Sources”. Updated Development ecosystem: Updated description. Updated Block diagram. Updated Functional definition: Updated System resources: Updated Clock system: Updated Figure 3. Updated Pinouts: Updated Table 2. Updated Ordering information: Updated part numbers. Updated Packaging: spec 001-42168 – Changed revision from *E to *F. Updated to new template. *F *G *J Datasheet 60 002-00122 Rev. *P 2023-01-23 PSoC™ 4 MCU: PSoC™ 4100S Based on Arm® Cortex®-M0+ CPU Revision history Document version Date Description of changes 2018-04-03 Updated Functional definition: Updated System resources: Updated Clock system: Updated Figure 3. Updated Watchdog timer and counters: Replaced “Watchdog Timer” with “Watchdog timer and counters” in heading. Updated description. 2018-10-30 Updated Features: Updated description under “32-bit MCU Subsystem”. Updated Block diagram (Corrected typo). Updated Functional definition: Updated System resources: Updated Watch Crystal Oscillator (WCO): Updated description. Updated Electrical specifications: Updated Analog peripherals: Updated CTBm Opamp: Updated Table 10. Updated SAR: Updated Table 14. Updated CSD and IDAC: Updated Table 15. Updated Digital peripherals: Updated SPI: Updated Table 21. Completing Sunset Review. 2019-07-05 Added extended industrial temperature range related information in all instances across the document. Updated Electrical specifications: Updated Memory: Updated Flash: Updated Table 27. Updated Ordering information: Updated part numbers. 2020-11-10 Updated Features: Added “ModusToolbox™ software”. Updated Development ecosystem: Added ModusToolbox™ software. Updated PSoC™ Creator: Updated description. Updated Table 27: Updated SID182B. Updated Table 32: Added SID223A. Updated Ordering information: Updated part numbers. Completing Sunset Review. *O 2022-07-28 Updated Table 32: Updated spec SID223 and SID223A. Added specs SID223B through SID223D. Updated Ordering information: Updated part numbers. Migrated to Infineon template. *P 2023-01-23 Updated the footnotes in IMO AC specifications. *K *L *M *N Datasheet 61 002-00122 Rev. *P 2023-01-23 Please read the Important Notice and Warnings at the end of this document Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2023-01-23 Published by Infineon Technologies AG 81726 Munich, Germany © 2023 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document? Email: erratum@infineon.com Document reference 002-00122 Rev. *P IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.