CY8C4247LTI-M475

PSoC® 4: PSoC 4200M Family Datasheet ® Programmable System-on-Chip (PSoC ) General Description PSoC® 4 is a scalable and reconfigurable platform architecture for a family of programmable embedded system controllers with an ARM® Cortex™-M0 CPU. It combines programmable and reconfigurable analog and digital blocks with flexible automatic routing. The PSoC 4200M product family, based on this platform architecture, is a combination of a microcontroller with digital programmable logic, programmable analog, programmable interconnect, high-performance analog-to-digital conversion, opamps with comparator mode, and standard communication and timing peripherals. The PSoC 4200M products will be fully compatible with members of the PSoC 4 platform for new applications and design needs. The programmable analog and digital subsystems allow flexibility and in-field tuning of the design. Features 32-bit MCU Subsystem Serial Communication ■ 48 MHz ARM Cortex-M0 CPU with single-cycle multiply ■ Up to 128 kB of flash with Read Accelerator ■ Up to 16 kB of SRAM ■ DMA engine Programmable Analog ■ Four opamps that operate in Deep Sleep mode at very low current levels ■ All opamps have reconfigurable high current pin-drive, high-bandwidth internal drive, ADC input buffering, and Comparator modes with flexible connectivity allowing input connections to any pin ■ Four current DACs (IDACs) for general-purpose or capacitive sensing applications on any pin ■ Two low-power comparators that operate in Deep Sleep mode ■ 12-bit SAR ADC with 1-Msps conversion rate Programmable Digital ■ Four programmable logic blocks, each with 8 Macrocells and an 8-bit data path (called universal digital blocks or UDBs) ■ Cypress-provided peripheral component library, user-defined state machines, and Verilog input Low Power 1.71 to 5.5 V Operation ■ Four independent run-time reconfigurable serial communication blocks (SCBs) with reconfigurable I2C, SPI, or UART functionality ■ Two independent CAN blocks for industrial and automotive networking Timing and Pulse-Width Modulation ■ Eight 16-bit timer/counter pulse-width modulator (TCPWM) blocks ■ Center-aligned, Edge, and Pseudo-random modes ■ Comparator-based triggering of Kill signals for motor drive and other high-reliability digital logic applications Package Options ■ 68-pin QFN, 64-pin TQFP wide and narrow pitch, and 48-pin and 44-pin TQFP packages ■ Up to 55 programmable GPIOs ■ GPIO pins can be CapSense, LCD, analog, or digital ■ Drive modes, strengths, and slew rates are programmable Extended Industrial Temperature Operation ■ ■ 20-nA Stop Mode with GPIO pin wakeup ■ Hibernate and Deep Sleep modes allow wakeup-time versus power trade-offs –40 °C to +105 °C operation PSoC Creator Design Environment ■ Integrated Development Environment (IDE) provides schematic design entry and build (with analog and digital automatic routing) ■ Applications Programming Interface (API component) for all fixed-function and programmable peripherals Capacitive Sensing ■ Cypress Capacitive Sigma-Delta (CSD) technique provides best-in-class SNR (>5:1) and water tolerance ■ Cypress-supplied software component makes capacitive sensing design easy Industry-Standard Tool Compatibility ■ Automatic hardware tuning (SmartSense™) ■ After schematic entry, development can be done with ARM-based industry-standard development tools Segment LCD Drive ■ LCD drive supported on all pins (common or segment) ■ Operates in Deep Sleep mode with 4 bits per pin memory Cypress Semiconductor Corporation Document Number: 001-93963 Rev. *G • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised August 19, 2016 PSoC® 4: PSoC 4200M Family Datasheet More Information Cypress provides a wealth of data at www.cypress.com to help you to select the right PSoC device for your design, and to help you to quickly and effectively integrate the device into your design. For a comprehensive list of resources, see the knowledge base article KBA86521, How to Design with PSoC 3, PSoC 4, and PSoC 5LP. Following is an abbreviated list for PSoC 4: ■ ■ ■ Overview: PSoC Portfolio, PSoC Roadmap Product Selectors: PSoC 1, PSoC 3, PSoC 4, PSoC 5LP In addition, PSoC Creator includes a device selection tool. Application notes: Cypress offers a large number of PSoC application notes covering a broad range of topics, from basic to advanced level. Recommended application notes for getting started with PSoC 4 are: ❐ AN79953: Getting Started With PSoC 4 ❐ AN88619: PSoC 4 Hardware Design Considerations ❐ AN86439: Using PSoC 4 GPIO Pins ❐ AN57821: Mixed Signal Circuit Board Layout ❐ AN81623: Digital Design Best Practices ❐ AN73854: Introduction To Bootloaders ❐ AN89610: ARM Cortex Code Optimization ■ Technical Reference Manual (TRM) is in two documents: ❐ Architecture TRM details each PSoC 4 functional block. ❐ Registers TRM describes each of the PSoC 4 registers. Development Kits: ❐ CY8CKIT-042, PSoC 4 Pioneer Kit, is an easy-to-use and inexpensive development platform. This kit includes connectors for Arduino™ compatible shields and Digilent® Pmod™ daughter cards. ❐ CY8CKIT-049 is a very low-cost prototyping platform. It is a low-cost alternative to sampling PSoC 4 devices. ❐ CY8CKIT-001 is a common development platform for any one of the PSoC 1, PSoC 3, PSoC 4, or PSoC 5LP families of devices. The MiniProg3 device provides an interface for flash programming and debug. ■ PSoC Creator PSoC Creator is a free Windows-based Integrated Design Environment (IDE). It enables concurrent hardware and firmware design of PSoC 3, PSoC 4, and PSoC 5LP based systems. Create designs using classic, familiar schematic capture supported by over 100 pre-verified, production-ready PSoC Components; see the list of component datasheets. With PSoC Creator, you can: 1. Drag and drop component icons to build your hardware 3. Configure components using the configuration tools system design in the main design workspace 4. Explore the library of 100+ components 2. Codesign your application firmware with the PSoC hardware, 5. Review component datasheets using the PSoC Creator IDE C compiler Figure 1. Multiple-Sensor Example Project in PSoC Creator Document Number: 001-93963 Rev. *G Page 2 of 42 PSoC® 4: PSoC 4200M Family Datasheet Contents PSoC 4200M Block Diagram............................................ 4 Functional Definition........................................................ 5 CPU and Memory Subsystem ..................................... 5 System Resources ...................................................... 5 Analog Blocks.............................................................. 6 Programmable Digital.................................................. 7 Fixed Function Digital.................................................. 8 GPIO ........................................................................... 9 Special Function Peripherals....................................... 9 Pinouts ............................................................................ 10 Power............................................................................... 14 Unregulated External Supply..................................... 14 Regulated External Supply........................................ 14 Development Support .................................................... 15 Documentation .......................................................... 15 Online ........................................................................ 15 Tools.......................................................................... 15 Electrical Specifications ................................................ 16 Absolute Maximum Ratings....................................... 16 Device Level Specifications....................................... 16 Document Number: 001-93963 Rev. *G Analog Peripherals .................................................... Digital Peripherals ..................................................... Memory ..................................................................... System Resources .................................................... Ordering Information...................................................... Part Numbering Conventions .................................... Packaging........................................................................ Acronyms ........................................................................ Document Conventions ................................................. Units of Measure ....................................................... Revision History ............................................................. Sales, Solutions, and Legal Information ...................... Worldwide Sales and Design Support....................... Products .................................................................... PSoC® Solutions ...................................................... Cypress Developer Community................................. Technical Support ..................................................... 20 25 27 28 32 33 34 38 40 40 41 42 42 42 42 42 42 Page 3 of 42 PSoC® 4: PSoC 4200M Family Datasheet PSoC 4200M Block Diagram CPU Subsystem PSoC 4200M SWD/ TC SPCIF Cortex M0 48 MHz 32-bit AHB- Lite FLASH 128 KB FAST MUL NVIC, IRQMX SRAM 16 KB Read Accelerator ROM 8 KB SRAM Controller DataWire/ DMA ROM Controller Initiator/ MMIO System Resources Test DFT Logic DFT Analog x1 SMX CTBm 2 x Opamp UDB x4 x2 WCO ... 2x CAN UDB 2x LP Comparator SAR ADC ( 12- bit) LCD Programmable Digital 4x SCB-I2C/SPI/UART Programmable Analog 2x Capsense Reset Reset Control XRES Peripheral Interconnect (MMIO) PCLK 8x TCPWM Clock Clock Control WDT IMO ILO System Interconnect ( Multi Layer AHB) Peripherals IOSS GPIO (8x ports) Power Sleep Control WIC POR LVD REF BOD PWRSYS NVLatches Port Interface &Digital System Interconnect (DSI) High Speed I/O Matrix Power Modes Active/ Sleep Deep Sleep Hibernate 37x GPIO, 14x GPIO OVT I/O Subsystem The PSoC 4200-M devices include extensive support for programming, testing, debugging, and tracing both hardware and firmware. The ARM Serial_Wire Debug (SWD) interface supports all programming and debug features of the device. Complete debug-on-chip functionality enables full-device debugging in the final system using the standard production device. It does not require special interfaces, debugging pods, simulators, or emulators. Only the standard programming connections are required to fully support debug. The PSoC Creator Integrated Development Environment (IDE) provides fully integrated programming and debug support for PSoC 4200-M devices. The SWD interface is fully compatible with industry-standard third-party tools. The PSoC 4200-M family provides a level of security not possible with multi-chip application solutions or with microcontrollers. This is due to its ability to disable debug features, robust flash protection, and because it allows customer-proprietary functionality to be implemented in on-chip programmable blocks. Document Number: 001-93963 Rev. *G The debug circuits are enabled by default and can only be disabled in firmware. If not enabled, the only way to re-enable them is to erase the entire device, clear flash protection, and reprogram the device with new firmware that enables debugging. Additionally, all device interfaces can be permanently disabled (device security) for applications concerned about phishing attacks due to a maliciously reprogrammed device or attempts to defeat security by starting and interrupting flash programming sequences. Because all programming, debug, and test interfaces are disabled when maximum device security is enabled, PSoC 4200-M with device security enabled may not be returned for failure analysis. This is a trade-off the PSoC 4200-M allows the customer to make. Page 4 of 42 PSoC® 4: PSoC 4200M Family Datasheet Functional Definition CPU and Memory Subsystem CPU The Cortex-M0 CPU in the PSoC 4200-M is part of the 32-bit MCU subsystem, which is optimized for low-power operation with extensive clock gating. Most instructions are 16 bits in length and execute a subset of the Thumb-2 instruction set. The Cypress implementation includes a hardware multiplier that provides a 32-bit result in one cycle. It includes a nested vectored interrupt controller (NVIC) block with 32 interrupt inputs and also includes a Wakeup Interrupt Controller (WIC), which can wake the processor up from the Deep Sleep mode allowing power to be switched off to the main processor when the chip is in the Deep Sleep mode. The Cortex-M0 CPU provides a Non-Maskable Interrupt (NMI) input, which is made available to the user when it is not in use for system functions requested by the user. The CPU also includes a debug interface, the serial wire debug (SWD) interface, which is a 2-wire form of JTAG; the debug configuration used for PSoC 4200-M has four break-point (address) comparators and two watchpoint (data) comparators. Clock System The PSoC 4200-M clock system is responsible for providing clocks to all subsystems that require clocks and for switching between different clock sources without glitching. In addition, the clock system ensures that no meta-stable conditions occur. The clock system for the PSoC 4200-M consists of a Watch Crystal Oscillator (WCO) running at 32 kHz, the IMO (3 to 48 MHz) and the ILO (32-kHz nominal) internal oscillators, and provision for an external clock. Figure 2. PSoC 4200M MCU Clocking Architecture IMO clk_hf clk_ext dsi_in[0] dsi_in[1] dsi_in[2] dsi_in[3] dsi_out[3:0] Flash The PSoC 4200-M has a flash module with a flash accelerator, tightly coupled to the CPU to improve average access times from the flash block. The flash accelerator delivers 85% of single-cycle SRAM access performance on average. Part of the flash module can be used to emulate EEPROM operation if required. ILO clk_lf A supervisory ROM that contains boot and configuration routines is provided. The clk_hf signal can be divided down to generate synchronous clocks for the UDBs, and the analog and digital peripherals. There are a total of 16 clock dividers for the PSoC 4200-M, each with 16-bit divide capability; this allows 12 to be used for the fixed-function blocks and four for the UDBs. The analog clock leads the digital clocks to allow analog events to occur before digital clock-related noise is generated. The 16-bit capability allows a lot of flexibility in generating fine-grained frequency values and is fully supported in PSoC Creator. DMA IMO Clock Source A DMA engine, with eight channels, is provided that can do 32-bit transfers and has chainable ping-pong descriptors. The IMO is the primary source of internal clocking in the PSoC 4200M. It is trimmed during testing to achieve the specified accuracy. Trim values are stored in nonvolatile memory. Trimming can also be done on the fly to allow in-field calibration. The IMO default frequency is 24 MHz and it can be adjusted between 3 to 48 MHz in steps of 1 MHz. IMO tolerance with Cypress-provided calibration settings is ±2%. SRAM SRAM memory is retained during Hibernate. SROM System Resources Power System The power system is described in detail in the section Power on page 14. It provides assurance that voltage levels are as required for each respective mode and either delay mode entry (on power-on reset (POR), for example) until voltage levels are as required for proper function or generate resets (brown-out detect (BOD)) or interrupts (low voltage detect (LVD)). The PSoC 4200M operates with a single external supply over the range of 1.71 to 5.5 V and has five different power modes, transitions between which are managed by the power system. The PSoC 4200M provides Sleep, Deep Sleep, Hibernate, and Stop low-power modes. Document Number: 001-93963 Rev. *G ILO Clock Source The ILO is a very low power oscillator, nominally 32 kHz, which is primarily used to generate clocks for peripheral operation in Deep Sleep mode. ILO-driven counters can be calibrated to the IMO to improve accuracy. Cypress provides a software component, which does the calibration. Crystal Oscillator The PSoC 4200M clock subsystem also includes a low-frequency crystal oscillator (32-kHz WCO) that is available during the Deep Sleep mode and can be used for Real-Time Clock (RTC) and Watchdog Timer applications. Page 5 of 42 PSoC® 4: PSoC 4200M Family Datasheet VREF (nominally 1.024 V) as well as an external reference through a GPIO pin. The Sample-and-Hold (S/H) aperture is programmable allowing the gain bandwidth requirements of the amplifier driving the SAR inputs, which determine its settling time, to be relaxed if required. The system performance will be 65 dB for true 12-bit precision if appropriate references are used and system noise levels permit. To improve performance in noisy conditions, it is possible to provide an external bypass (through a fixed pin location) for the internal reference amplifier. Watchdog Timer A watchdog timer is implemented in the clock block running from the low-frequency clock; this allows watchdog operation during Deep Sleep and generates a watchdog reset or an interrupt if not serviced before the timeout occurs. The watchdog reset is recorded in the Reset Cause register. Reset The PSoC 4200M can be reset from a variety of sources including a software reset. Reset events are asynchronous and guarantee reversion to a known state. The reset cause is recorded in a register, which is sticky through reset and allows software to determine the cause of the reset. An XRES pin is reserved for external reset to avoid complications with configuration and multiple pin functions during power-on or reconfiguration. The SAR is connected to a fixed set of pins through an 8-input sequencer (expandable to 16 inputs). The sequencer cycles through selected channels autonomously (sequencer scan) and does so with zero switching overhead (that is, the aggregate sampling bandwidth is equal to 1 Msps, whether it is for a single channel or distributed over several channels). The sequencer switching is effected through a state machine or through firmware-driven switching. A feature provided by the sequencer is buffering of each channel to reduce CPU interrupt service requirements. To accommodate signals with varying source impedance and frequency, it is possible to have different sample times programmable for each channel. In addition, the signal range specification through a pair of range registers (low and high range values) is implemented with a corresponding out-of-range interrupt if the digitized value exceeds the programmed range; this allows fast detection of out-of-range values without the necessity of having to wait for a sequencer scan to be completed and the CPU to read the values and check for out-of-range values in software. Voltage Reference The PSoC 4200M reference system generates all internally required references. A 1% voltage reference spec is provided for the 12-bit ADC. To allow better signal-to-noise ratios (SNR) and better absolute accuracy, it is possible to add an external bypass capacitor to the internal reference using a GPIO pin or to use an external reference for the SAR. Analog Blocks 12-bit SAR ADC The SAR is able to digitize the output of the on-board temperature sensor for calibration and other temperature-dependent functions. The SAR is not available in Deep Sleep and Hibernate modes as it requires a high-speed clock (up to 18 MHz). The SAR operating range is 1.71 to 5.5 V. The 12-bit 1 MSample/second SAR ADC can operate at a maximum clock rate of 18 MHz and requires a minimum of 18 clocks at that frequency to do a 12-bit conversion. The block functionality is augmented for the user by adding a reference buffer to it (trimmable to ±1%) and by providing the choice of three internal voltage references: VDD, VDD/2, and Figure 3. SAR ADC System Diagram AHB System Bus and Programmable Logic Interconnect SARSEQ vminus vplus P7 Port 2 (8 inputs) SARMUX P0 Sequencing and Control Data and Status Flags POS SARADC NEG External Reference and Bypass (optional) Reference Selection VDD/2 VDDD VREF Inputs from other Ports Document Number: 001-93963 Rev. *G Page 6 of 42 PSoC® 4: PSoC 4200M Family Datasheet Analog Multiplex Bus The PSoC 4200M has two concentric analog buses (Analog Mux Bus A and Analog Mux Bus B) that circumnavigate the periphery of the chip. These buses can transport analog signals from any pin to various analog blocks (including the opamps) and to the CapSense blocks allowing, for instance, the ADC to monitor any pin on the chip. These buses are independent and can also be split into three independent sections. This allows one section to be used for CapSense purposes, one for general analog signal processing, and the third for general-purpose digital peripherals and GPIO. Four Opamps The PSoC 4200M has four opamps with comparator modes, which allow most common analog functions to be performed on-chip eliminating external components; PGAs, voltage buffers, filters, trans-impedance amplifiers, and other functions can be realized with external passives saving power, cost, and space. The on-chip opamps are designed with enough bandwidth to drive the Sample-and-Hold circuit of the ADC without requiring external buffering. The opamps can operate in the Deep Sleep mode at very low power levels. The following diagram shows one of two identical opamp pairs of the opamp subsystem. Temperature Sensor The PSoC 4200M has one on-chip temperature sensor. This consists of a diode, which is biased by a current source that can be disabled to save power. The temperature sensor is connected to the ADC, which digitizes the reading and produces a temperature value using Cypress-supplied software that includes calibration and linearization. Low-power Comparators The PSoC 4200M has a pair of low-power comparators, which can also operate in the Deep Sleep and Hibernate modes. This allows the analog system blocks to be disabled while retaining the ability to monitor external voltage levels during low-power modes. The comparator outputs are normally synchronized to avoid meta-stability unless operating in an asynchronous power mode (Hibernate) where the system wake-up circuit is activated by a comparator switch event. To SAR ADC Universal Digital Blocks (UDBs) and Port Interfaces OA0 + P0 The opamps operate in Deep Sleep mode at very low currents allowing analog circuits to remain operational during Deep Sleep. Programmable Digital To SAR ADC Analog Mux Bus B Analog Mux Bus A Figure 4. Identical Opamp Pairs in Opamp Subsystem to any pin on the chip. Analog switch connectivity is controllable by user firmware as well as user-defined programmable digital state machines (implemented via UDBs). - The PSoC 4200M has four UDBs; the UDB array also provides a switched Digital System Interconnect (DSI) fabric that allows signals from peripherals and ports to be routed to and through the UDBs for communication and control. The UDB array is shown in the following figure. 10x 1x Figure 5. UDB Array Internal Out0 AHB Bridge CPUSS Dig CLKS P1 8 to 32 P2 UDBIF OA1 - P6 + BUS IF 1x 10x Internal Out1 P7 The ovals in Figure 4 represent analog switches, which may be controlled via user firmware, the SAR sequencer, or user-defined programmable logic. The opamps (OA0 and OA1) are configurable via these switches to perform all standard opamp functions with appropriate feedback components. The opamps (OA0 and OA1) are programmable and reconfigurable to provide standard opamp functionality via switchable feedback components, unity gain functionality for driving pins directly, or for internal use (such as buffering SAR ADC inputs as indicated in the diagram), or as true comparators. The opamp inputs provide highly flexible connectivity and can connect directly to dedicated pins or, via the analog mux buses, Document Number: 001-93963 Rev. *G Other Digital Signals in Chip P5 DSI IRQ IF CLK IF Port IF IF Port Port IF DSI UDB UDB UDB UDB High -Speed I/O Matrix P3 P4 4 to 8 Scalable array of UDBs (max=16) Routing Channels DSI DSI Programmable Digital Subsystem Page 7 of 42 PSoC® 4: PSoC 4200M Family Datasheet UDBs can be clocked from a clock divider block, from a port interface (required for peripherals such as SPI), and from the DSI network directly or after synchronization. as SPI to operate at higher clock speeds by eliminating the delay for the port input to be routed over DSI and used to register other inputs. The port interface is shown in Figure 6. A port interface is defined, which acts as a register that can be clocked with the same source as the PLDs inside the UDB array. This allows faster operation because the inputs and outputs can be registered at the port interface close to the I/O pins and at the edge of the array. The port interface registers can be clocked by one of the I/Os from the same port. This allows interfaces such The UDBs can generate interrupts (one UDB at a time) to the interrupt controller. The UDBs can connect to any pin on Ports 0, 1, 2, and 3 (each port interconnect requires one UDB) through the DSI. Figure 6. Port Interface High Speed I/O Matrix To Clock Tree 8 Input Registers 7 Digital GlobalClocks 3 DSI Signals , 1 I/O Signal 6 Clock Selector Block from UDB 0 ... 2 Fixed Function Digital Timer/Counter/PWM (TCPWM) Block The TCPWM block uses a16-bit counter with user-programmable period length. There is a Capture register to record the count value at the time of an event (which may be an I/O event), a period register which is used to either stop or auto-reload the counter when its count is equal to the period register, and compare registers to generate compare value signals, which are used as PWM duty cycle outputs. The block also provides true and complementary outputs with programmable offset between them to allow use as deadband programmable complementary PWM outputs. It also has a Kill input to force outputs to a predetermined state; for example, this is used in motor drive systems when an overcurrent state is indicated and the PWMs driving the FETs need to be shut off immediately with no time for software intervention. The PSoC 4200M has eight TCPWM blocks. Serial Communication Blocks (SCB) The PSoC 4200M has four SCBs, which can each implement an I2C, UART, or SPI interface. I2C Mode: The hardware I2C block implements a full multi-master and slave interface (it is capable of multimaster arbitration). This block is capable of operating at speeds of up to 1 Mbps (Fast Mode Plus) and has flexible buffering options to reduce interrupt overhead and latency for the CPU. It also supports EzI2C that creates a mailbox address range in the memory of the PSoC 4200M and effectively reduces I2C communication to reading from and writing to an array in memory. In 0 3 2 1 0 [1] 4 8 [1] [0] To DSI Document Number: 001-93963 Rev. *G 6 Enables [1] 8 Reset Selector Block from UDB 7 [0] 2 4 Output Registers ... 9 4 8 8 From DSI [1] From DSI addition, the block supports an 8-deep FIFO for receive and transmit which, by increasing the time given for the CPU to read data, greatly reduces the need for clock stretching caused by the CPU not having read data on time. The FIFO mode is available in all channels and is very useful in the absence of DMA. The I2C peripheral is compatible with the I2C Standard-mode, Fast-mode, and Fast-mode Plus devices as defined in the NXP I2C-bus specification and user manual (UM10204). The I2C bus I/O is implemented with GPIO in open-drain modes. UART Mode: This is a full-feature UART operating at up to 1 Mbps. It supports automotive single-wire interface (LIN), infrared interface (IrDA), and SmartCard (ISO7816) protocols, all of which are minor variants of the basic UART protocol. In addition, it supports the 9-bit multiprocessor mode that allows addressing of peripherals connected over common RX and TX lines. Common UART functions such as parity error, break detect, and frame error are supported. An 8-deep FIFO allows much greater CPU service latencies to be tolerated. SPI Mode: The SPI mode supports full Motorola SPI, TI SSP (essentially adds a start pulse used to synchronize SPI Codecs), and National Microwire (half-duplex form of SPI). The SPI block can use the FIFO and also supports an EzSPI mode in which data interchange is reduced to reading and writing an array in memory. CAN Blocks There are two independent CAN 2.0B blocks, which are certified CAN conformant. Page 8 of 42 PSoC® 4: PSoC 4200M Family Datasheet GPIO The PSoC 4200M has 55 GPIOs in the 68-pin QFN package. The GPIO block implements the following: ■ Eight drive strength modes including strong push-pull, resistive pull-up and pull-down, weak (resistive) pull-up and pull-down, open drain and open source, input only, and disabled ■ Input threshold select (CMOS or LVTTL) ■ Individual control of input and output disables ■ Hold mode for latching previous state (used for retaining I/O state in Deep Sleep mode and Hibernate modes) ■ Selectable slew rates for dV/dt related noise control to improve EMI The pins are organized in logical entities called ports, which are 8-bit in width. During power-on and reset, the blocks are forced to the disable state so as not to crowbar any inputs and/or cause excess turn-on current. A multiplexing network known as a high-speed I/O matrix is used to multiplex between various signals that may connect to an I/O pin. Pin locations for fixed-function peripherals are also fixed to reduce internal multiplexing complexity (these signals do not go through the DSI network). DSI signals are not affected by this and any pin on Ports 0, 1, 2, and 3 may be routed to any UDB through the DSI network. Only pins on Ports 0, 1, 2, and 3 may be routed through DSI signals. Data output and pin state registers store, respectively, the values to be driven on the pins and the states of the pins themselves. Every I/O pin can generate an interrupt if so enabled and each I/O port has an interrupt request (IRQ) and interrupt service routine (ISR) vector associated with it (8 for PSoC 4200M). The Pins of Port 6 (up to 6 depending on the package) are overvoltage tolerant (VIN can exceed VDD). The overvoltage cells will not sink more than 10 µA when their inputs exceed VDDIO in compliance with I2C specifications. Special Function Peripherals The two methods used are referred to as digital correlation and PWM. Digital correlation pertains to modulating the frequency and levels of the common and segment signals to generate the highest RMS voltage across a segment to light it up or to keep the RMS signal zero. This method is good for STN displays but may result in reduced contrast with TN (cheaper) displays. PWM pertains to driving the panel with PWM signals to effectively use the capacitance of the panel to provide the integration of the modulated pulse-width to generate the desired LCD voltage. This method results in higher power consumption but can result in better results when driving TN displays. LCD operation is supported during Deep Sleep refreshing a small display buffer (4 bits; 1 32-bit register per port). CapSense CapSense is supported on all pins in the PSoC 4200M through a CapSense Sigma-Delta (CSD) block that can be connected to any pin through an analog mux bus that any GPIO pin can be connected to via an Analog switch. CapSense functionality can thus be provided on any pin or group of pins in a system under software control. A component is provided for the CapSense block, which provides automatic hardware tuning (Cypress SmartSense™), to make it easy for the user. Shield voltage can be driven on another Mux Bus to provide water tolerance capability. Water tolerance is provided by driving the shield electrode in phase with the sense electrode to keep the shield capacitance from attenuating the sensed input. Each CSD block has two IDACs which can be used for general purposes if CapSense is not being used.(both IDACs are available in that case) or if CapSense is used without water tolerance (one IDAC is available). The PSoC 4200M has two CSD blocks which can be used independently; one for CapSense and one providing two IDACs. The two CapSense blocks are referred to as CSD0 and CSD1. Capacitance sensing inputs on Ports 0, 1, 2, 3, 4, 6, and 7 are sensed by CSD0. Capacitance sensing inputs on Port 5 are sensed by CSD1. LCD Segment Drive The PSoC 4200M has an LCD controller, which can drive up to four commons and up to 51 segments. Any pin can be either a common or a segment pin. It uses full digital methods to drive the LCD segments requiring no generation of internal LCD voltages. Document Number: 001-93963 Rev. *G Page 9 of 42 PSoC® 4: PSoC 4200M Family Datasheet Pinouts The following is the pin list for the PSoC 4200M. This shows the power supply and port pins (for example, P0.0 is Pin 0 of Port 0). 68-QFN 64-TQFP 48-TQFP 44-TQFP Pin Name Pin Name Pin Name Pin Name 42 P0.0 39 P0.0 28 P0.0 24 P0.0 43 P0.1 40 P0.1 29 P0.1 25 P0.1 44 P0.2 41 P0.2 30 P0.2 26 P0.2 45 P0.3 42 P0.3 31 P0.3 27 P0.3 46 P0.4 43 P0.4 32 P0.4 28 P0.4 47 P0.5 44 P0.5 33 P0.5 29 P0.5 48 P0.6 45 P0.6 34 P0.6 30 P0.6 49 P0.7 46 P0.7 35 P0.7 31 P0.7 50 XRES 47 XRES 36 XRES 32 XRES 51 VCCD 48 VCCD 37 VCCD 33 VCCD 52 VSSD 49 VSSD 38 VSSD DN VSSD 53 VDDD 50 VDDD 39 VDDD 34 VDDD 40 VDDA 35 VDDA 54 P5.0 51 P5.0 55 P5.1 52 P5.1 56 P5.2 53 P5.2 57 P5.3 54 P5.3 58 P5.4 59 P5.5 55 P5.5 60 VDDA 56 VDDA 40 VDDA 35 VDDA 61 VSSA 57 VSSA 41 VSSA 36 VSSA 62 P1.0 58 P1.0 42 P1.0 37 P1.0 63 P1.1 59 P1.1 43 P1.1 38 P1.1 64 P1.2 60 P1.2 44 P1.2 39 P1.2 65 P1.3 61 P1.3 45 P1.3 40 P1.3 66 P1.4 62 P1.4 46 P1.4 41 P1.4 67 P1.5 63 P1.5 47 P1.5 42 P1.5 68 P1.6 64 P1.6 48 P1.6 43 P1.6 1 P1.7/VREF 1 P1.7/VREF 1 P1.7/VREF 44 P1.7/VREF 1 VSSD 2 P2.0 2 P2.0 2 P2.0 2 P2.0 3 P2.1 3 P2.1 3 P2.1 3 P2.1 4 P2.2 4 P2.2 4 P2.2 4 P2.2 5 P2.3 5 P2.3 5 P2.3 5 P2.3 6 P2.4 6 P2.4 6 P2.4 6 P2.4 7 P2.5 7 P2.5 7 P2.5 7 P2.5 Document Number: 001-93963 Rev. *G Page 10 of 42 PSoC® 4: PSoC 4200M Family Datasheet 68-QFN 64-TQFP 48-TQFP 44-TQFP Pin Name Pin Name Pin Name Pin Name 8 P2.6 8 P2.6 8 P2.6 8 P2.6 9 P2.7 9 P2.7 9 P2.7 9 P2.7 10 VSSA 10 VSSA 10 VSSD 10 VSSD 11 VDDA 11 VDDA 12 P6.0 12 P6.0 13 P6.1 13 P6.1 14 P6.2 14 P6.2 15 P6.3 16 P6.4 15 P6.4 17 P6.5 16 P6.5 18 VSSIO 17 VSSIO 10 VSSD 10 VSSD 19 P3.0 18 P3.0 12 P3.0 11 P3.0 20 P3.1 19 P3.1 13 P3.1 12 P3.1 21 P3.2 20 P3.2 14 P3.2 13 P3.2 22 P3.3 21 P3.3 16 P3.3 14 P3.3 23 P3.4 22 P3.4 17 P3.4 15 P3.4 24 P3.5 23 P3.5 18 P3.5 16 P3.5 25 P3.6 24 P3.6 19 P3.6 17 P3.6 26 P3.7 25 P3.7 20 P3.7 18 P3.7 27 VDDIO 26 VDDIO 21 VDDIO 19 VDDD 28 P4.0 27 P4.0 22 P4.0 20 P4.0 29 P4.1 28 P4.1 23 P4.1 21 P4.1 30 P4.2 29 P4.2 24 P4.2 22 P4.2 31 P4.3 30 P4.3 25 P4.3 23 P4.3 32 P4.4 31 P4.4 33 P4.5 32 P4.5 34 P4.6 33 P4.6 35 P4.7 39 P7.0 37 P7.0 26 P7.0 40 P7.1 38 P7.1 27 P7.1 41 P7.2 The pins of Port 6 are overvoltage-tolerant. Pins 36, 37, and 38 are No-Connects on the 68-pin QFN. Pins 34, 35, and 36 are No-Connects on the 64-pin TQFP. Pins 11 and 15 are No-connects in the 48-pin TQFP. All VSS pins must be tied together. The output drivers of I/O Ports P0 and P7 are connected to VDDD. Output drivers of I/O Ports 1, 2, and 5 are connected to VDDA. Output drivers of I/O Ports 3, 4, and 6 are connected to VDDIO. Document Number: 001-93963 Rev. *G Page 11 of 42 PSoC® 4: PSoC 4200M Family Datasheet Each of the pins shown in the previous table can have multiple programmable functions as shown in the following table. Column headings refer to Analog and Alternate pin functions.: Port/Pin Analog P0.0 lpcomp.in_p[0] Alt. Function 1 Alt. Function 2 Alt. Function 3 can[1].can_rx:0 Alt. Function 4 scb[0].spi_select1:0 Alt. Function 5 P0.1 lpcomp.in_n[0] can[1].can_tx:0 scb[0].spi_select2:0 P0.2 lpcomp.in_p[1] P0.3 lpcomp.in_n[1] scb[0].spi_select3:0 P0.4 wco_in scb[1].uart_rx:0 scb[1].i2c_scl:0 scb[1].spi_mosi:1 P0.5 wco_out scb[1].uart_tx:0 scb[1].i2c_sda:0 scb[1].spi_miso:1 wakeup scb[1].spi_select0:1 scb[2].i2c_scl:0 scb[2].spi_mosi:0 scb[2].spi_miso:0 P0.6 ext_clk:0 P0.7 scb[1].uart_cts:0 scb[1].uart_rts:0 scb[2].uart_rx:0 scb[1].spi_clk:1 can[1].can_tx_enb_n:0 P5.0 ctb1.oa0.inp tcpwm.line[4]:2 P5.1 ctb1.oa0.inm tcpwm.line_compl[4]:2 scb[2].uart_tx:0 scb[2].i2c_sda:0 P5.2 ctb1.oa0.out tcpwm.line[5]:2 scb[2].uart_cts:0 lpcomp.comp[0]:1 scb[2].spi_clk:0 P5.3 ctb1.oa1.out tcpwm.line_compl[5]:2 scb[2].uart_rts:0 lpcomp.comp[1]:1 scb[2].spi_select0:0 P5.4 ctb1.oa1.inm tcpwm.line[6]:2 scb[2].spi_select1:0 P5.5 ctb1.oa1.inp tcpwm.line_compl[6]:2 scb[2].spi_select2:0 P5.6 ctb1.oa0.inp_alt tcpwm.line[7]:0 scb[2].spi_select3:0 P5.7 ctb1.oa1.inp_alt tcpwm.line_compl[7]:0 P1.0 ctb0.oa0.inp tcpwm.line[2]:1 scb[0].uart_rx:1 scb[0].i2c_scl:0 scb[0].spi_mosi:1 P1.1 ctb0.oa0.inm tcpwm.line_compl[2]:1 scb[0].uart_tx:1 scb[0].i2c_sda:0 scb[0].spi_miso:1 P1.2 ctb0.oa0.out tcpwm.line[3]:1 scb[0].uart_cts:1 scb[0].spi_clk:1 P1.3 ctb0.oa1.out tcpwm.line_compl[3]:1 scb[0].uart_rts:1 scb[0].spi_select0:1 P1.4 ctb0.oa1.inm tcpwm.line[6]:1 scb[0].spi_select1:1 P1.5 ctb0.oa1.inp tcpwm.line_compl[6]:1 scb[0].spi_select2:1 P1.6 ctb0.oa0.inp_alt tcpwm.line[7]:1 scb[0].spi_select3:1 P1.7 ctb0.oa1.inp_alt tcpwm.line_compl[7]:1 P2.0 sarmux.0 tcpwm.line[4]:1 scb[1].i2c_scl:1 scb[1].spi_mosi:2 P2.1 sarmux.1 tcpwm.line_compl[4]:1 scb[1].i2c_sda:1 scb[1].spi_miso:2 P2.2 sarmux.2 tcpwm.line[5]:1 scb[1].spi_clk:2 P2.3 sarmux.3 tcpwm.line_compl[5]:1 scb[1].spi_select0:2 P2.4 sarmux.4 tcpwm.line[0]:1 scb[1].spi_select1:1 P2.5 sarmux.5 tcpwm.line_compl[0]:1 scb[1].spi_select2:1 P2.6 sarmux.6 tcpwm.line[1]:1 scb[1].spi_select3:1 Document Number: 001-93963 Rev. *G Page 12 of 42 PSoC® 4: PSoC 4200M Family Datasheet Port/Pin Analog Alt. Function 1 P2.7 sarmux.7 tcpwm.line_compl[1]:1 P6.0 tcpwm.line[4]:0 P6.1 P6.2 P6.3 Alt. Function 2 Alt. Function 3 Alt. Function 4 Alt. Function 5 scb[3].spi_select0:1 scb[3].uart_rx:0 can[0].can_tx_enb_n:0 scb[3].i2c_scl:0 scb[3].spi_mosi:0 tcpwm.line_compl[4]:0 scb[3].uart_tx:0 can[0].can_rx:0 scb[3].i2c_sda:0 scb[3].spi_miso:0 tcpwm.line[5]:0 scb[3].uart_cts:0 can[0].can_tx:0 tcpwm.line_compl[5]:0 scb[3].uart_rts:0 scb[3].spi_clk:0 scb[3].spi_select0:0 P6.4 tcpwm.line[6]:0 P6.5 tcpwm.line_compl[6]:0 scb[3].spi_select1:0 P3.0 tcpwm.line[0]:0 scb[1].uart_rx:1 scb[1].i2c_scl:2 scb[1].spi_mosi:0 P3.1 tcpwm.line_compl[0]:0 scb[1].uart_tx:1 scb[1].i2c_sda:2 scb[1].spi_miso:0 P3.2 tcpwm.line[1]:0 scb[1].uart_cts:1 swd_data scb[1].spi_clk:0 P3.3 tcpwm.line_compl[1]:0 scb[1].uart_rts:1 swd_clk scb[1].spi_select0:0 P3.4 tcpwm.line[2]:0 scb[1].spi_select1:0 P3.5 tcpwm.line_compl[2]:0 scb[1].spi_select2:0 P3.6 tcpwm.line[3]:0 scb[1].spi_select3:0 P3.7 tcpwm.line_compl[3]:0 scb[3].spi_select2:0 P4.0 scb[0].uart_rx:0 can[0].can_rx:1 scb[0].i2c_scl:1 scb[0].spi_mosi:0 P4.1 scb[0].uart_tx:0 can[0].can_tx:1 scb[0].i2c_sda:1 scb[0].spi_miso:0 can[0].can_tx_enb_n:1 lpcomp.comp[0]:0 scb[0].spi_clk:0 lpcomp.comp[1]:0 scb[0].spi_select0:0 P4.2 csd[0].c_mod scb[0].uart_cts:0 P4.3 csd[0].c_sh_tank scb[0].uart_rts:0 P4.4 can[1].can_tx_enb_n:1 scb[0].spi_select1:2 P4.5 can[1].can_rx:1 scb[0].spi_select2:2 P4.6 can[1].can_tx:1 scb[0].spi_select3:2 P4.7 P7.0 tcpwm.line[0]:2 scb[3].uart_rx:1 scb[3].i2c_scl:1 scb[3].spi_mosi:1 P7.1 tcpwm.line_compl[0]:2 scb[3].uart_tx:1 scb[3].i2c_sda:1 scb[3].spi_miso:1 P7.2 tcpwm.line[1]:2 scb[3].uart_cts:1 scb[3].spi_clk:1 Descriptions of the power pin functions are as follows: VSSA: Analog ground pin where package pins allow; shorted to VSS otherwise VDDD: Power supply for both analog and digital sections (where there is no VDDA pin). VSS: Ground pin. VDDA: Analog VDD pin where package pins allow; shorted to VDDD otherwise. Port Pins can all be used as LCD Commons, LCD Segment drivers, or CSD sense and shield pins can be connected to AMUXBUS A or B or can all be used as GPIO pins that can be driven by firmware or DSI signals. VDDIO: I/O pin power domain. Document Number: 001-93963 Rev. *G VCCD: Regulated Digital supply (1.8 V ±5%). Page 13 of 42 PSoC® 4: PSoC 4200M Family Datasheet Power The supply voltage range is 1.71 to 5.5 V with all functions and circuits operating over that range. The PSoC 4200M family allows two distinct modes of power supply operation: Unregulated External Supply and Regulated External Supply modes. Unregulated External Supply In this mode, the PSoC 4200M is powered by an External Power Supply that can be anywhere in the range of 1.8 to 5.5 V. This range is also designed for battery-powered operation, for instance, the chip can be powered from a battery system that starts at 3.5V and works down to 1.8 V. In this mode, the internal regulator of the PSoC 4200M supplies the internal logic and the VCCD output of the PSoC 4200M must be bypassed to ground via an external Capacitor (in the range of 1 to 1.6 µF; X5R ceramic or better). Power Supply VDDD–VSS and VDDIO-VSS VDDA–VSSA VCCD–VSS VREF–VSSA (optional) Bypass Capacitors 0.1 µF ceramic at each pin plus bulk capacitor 1 to 10 µF. 0.1 µF ceramic at pin. Additional 1 µF to 10 µF bulk capacitor 1 µF ceramic capacitor at the VCCD pin The internal bandgap may be bypassed with a 1 µF to 10 µF capacitor for better ADC performance. Regulated External Supply In this mode, the PSoC 4200M is powered by an external power supply that must be within the range of 1.71 to 1.89 V (1.8 ±5%); note that this range needs to include power supply ripple. VCCD and VDDD pins are shorted together and bypassed. The internal regulator is disabled in firmware. The grounds, VSSA and VSS, must be shorted together. Bypass capacitors must be used from VDDD and VDDA to ground, typical practice for systems in this frequency range is to use a capacitor in the 1 µF range in parallel with a smaller capacitor (0.1 µF, for example). Note that these are simply rules of thumb and that, for critical applications, the PCB layout, lead inductance, and the Bypass capacitor parasitic should be simulated to design and obtain optimal bypassing. Document Number: 001-93963 Rev. *G Page 14 of 42 PSoC® 4: PSoC 4200M Family Datasheet Development Support The PSoC 4200M family has a rich set of documentation, development tools, and online resources to assist you during your development process. Visit www.cypress.com/go/psoc4 to find out more. Documentation A suite of documentation supports the PSoC 4200M family to ensure that you can find answers to your questions quickly. This section contains a list of some of the key documents. Software User Guide: A step-by-step guide for using PSoC Creator. The software user guide shows you how the PSoC Creator build process works in detail, how to use source control with PSoC Creator, and much more. Component Datasheets: The flexibility of PSoC allows the creation of new peripherals (components) long after the device has gone into production. Component data sheets provide all of the information needed to select and use a particular component, including a functional description, API documentation, example code, and AC/DC specifications. Document Number: 001-93963 Rev. *G Application Notes: PSoC application notes discuss a particular application of PSoC in depth; examples include brushless DC motor control and on-chip filtering. Application notes often include example projects in addition to the application note document. Technical Reference Manual: The Technical Reference Manual (TRM) contains all the technical detail you need to use a PSoC device, including a complete description of all PSoC registers. Online In addition to print documentation, the Cypress PSoC forums connect you with fellow PSoC users and experts in PSoC from around the world, 24 hours a day, 7 days a week. Tools With industry standard cores, programming, and debugging interfaces, the PSoC 4200M family is part of a development tool ecosystem. Visit us at www.cypress.com/go/psoccreator for the latest information on the revolutionary, easy to use PSoC Creator IDE, supported third party compilers, programmers, debuggers, and development kits. Page 15 of 42 PSoC® 4: PSoC 4200M Family Datasheet Electrical Specifications Absolute Maximum Ratings Table 1. Absolute Maximum Ratings[1] Spec ID# Parameter Description Min Typ Max Units Details/Conditions SID1 VDD_ABS Analog or digital supply relative to VSS (VSSD = VSSA) –0.5 – 6 V Absolute maximum SID2 VCCD_ABS Direct digital core voltage input relative to VSSD –0.5 – 1.95 V Absolute maximum SID3 VGPIO_ABS GPIO voltage; VDDD or VDDA –0.5 – VDD+0.5 V Absolute maximum SID4 IGPIO_ABS Current per GPIO –25 – 25 mA Absolute maximum Absolute maximum SID5 IG-PIO_injection GPIO injection current per pin –0.5 – 0.5 mA BID44 ESD_HBM Electrostatic discharge human body model 2200 – – V BID45 ESD_CDM Electrostatic discharge charged device model 500 – – V BID46 LU Pin current for latch-up –140 – 140 mA Device Level Specifications All specifications are valid for -40 °C  TA  105 °C and TJ  125 °C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. Table 2. DC Specifications Spec ID# Parameter Description Min Typ Max Units Details / Conditions SID53 VDD Power Supply Input Voltage (VDDA = VDDD = VDD) 1.8 – 5.5 V With regulator enabled SID255 VDDD Power Supply Input Voltage unregulated 1.71 1.8 1.89 V Internally unregulated Supply SID54 VCCD Output voltage (for core logic) – 1.8 – V SID55 CEFC External Regulator voltage bypass 1 1.3 1.6 µF X5R ceramic or better SID56 CEXC Power supply decoupling capacitor – 1 – µF X5R ceramic or better Active Mode, VDD = 1.71 V to 5.5 V, –40 °C to +105 °C SID6 IDD1 Execute from Flash; CPU at 6 MHz – 2.2 2.8 mA SID7 IDD2 Execute from Flash; CPU at 12 MHz – 3.7 4.2 mA SID8 IDD3 Execute from Flash; CPU at 24 MHz – 6.7 7.2 mA SID9 IDD4 Execute from Flash; CPU at 48 MHz – 13 13.8 mA Sleep Mode, –40 °C to +105 °C SID21 IDD16 I2C wakeup, WDT, and Comparators on. Regulator Off. – 1.75 2.1 mA VDD = 1.71 to 1.89, 6 MHz SID22 IDD17 I2C wakeup, WDT, and Comparators on. – 1.7 2.1 mA VDD = 1.8 to 5.5, 6 MHz SID23 IDD18 I2C wakeup, WDT, and Comparators on. Regulator Off. – 2.35 2.8 mA VDD = 1.71 to 1.89, 12 MHz SID24 IDD19 I2C wakeup, WDT, and Comparators on. – 2.25 2.8 mA VDD = 1.8 to 5.5, 12 MHz Note 1. Usage above the absolute maximum conditions listed in Table 1 may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods of time may affect device reliability. The maximum storage temperature is 150 °C in compliance with JEDEC Standard JESD22-A103, High Temperature Storage Life. When used below absolute maximum conditions but above normal operating conditions, the device may not operate to specification. Document Number: 001-93963 Rev. *G Page 16 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 2. DC Specifications (continued) Spec ID# Parameter Description Min Typ Max Units Details / Conditions Deep Sleep Mode, –40 °C to + 60 °C SID30 IDD25 I2C wakeup and WDT on. Regulator Off. – 1.55 20 µA VDD = 1.71 to 1.89 SID31 IDD26 I2C wakeup and WDT on. – 1.35 15 µA VDD = 1.8 to 3.6 I C wakeup and WDT on. – 1.5 15 µA VDD = 3.6 to 5.5 I2C wakeup and WDT on. Regulator Off. – – 60 µA VDD = 1.71 to 1.89 SID32 IDD27 2 Deep Sleep Mode, +85 °C SID33 IDD28 2 SID34 IDD29 I C wakeup and WDT on. – – 45 µA VDD = 1.8 to 3.6 SID35 IDD30 I2C wakeup and WDT on. – – 30 µA VDD = 3.6 to 5.5 Deep Sleep Mode, +105 °C SID33Q IDD28Q I2C wakeup and WDT on. Regulator Off. – – 135 µA VDD = 1.71 to 1.89 SID34Q IDD29Q I2C wakeup and WDT on. – – 180 µA VDD = 1.8 to 3.6 SID35Q IDD30Q I2C wakeup and WDT on. – – 140 µA VDD = 3.6 to 5.5 – 150 3000 nA VDD = 1.71 to 1.89 Hibernate Mode, –40 °C to + 60 °C Regulator Off. SID39 IDD34 SID40 IDD35 – 150 1000 nA VDD = 1.8 to 3.6 SID41 IDD36 – 150 1100 nA VDD = 3.6 to 5.5 Hibernate Mode, +85 °C SID42 IDD37 – – 4500 nA VDD = 1.71 to 1.89 SID43 IDD38 – – 3500 nA VDD = 1.8 to 3.6 SID44 IDD39 – – 3500 nA VDD = 3.6 to 5.5 – – 19.4 µA VDD = 1.71 to 1.89 Regulator Off. Hibernate Mode, +105 °C SID42Q IDD37Q Regulator Off. SID43Q IDD38Q – – 17 µA VDD = 1.8 to 3.6 SID44Q IDD39Q – – 16 µA VDD = 3.6 to 5.5 Stop Mode SID304 IDD43A Stop Mode current; VDD = 3.6 V – 35 85 nA T = –40 °C to +60 °C SID304A IDD43B Stop Mode current; VDD = 3.6 V – – 1450 nA T = +85 °C Stop Mode current; VDD = 3.6 V – – 5645 nA Supply current while XRES asserted – 2 5 mA Stop Mode, +105 °C SID304Q IDD43AQ XRES current SID307 IDD_XR Document Number: 001-93963 Rev. *G Page 17 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 3. AC Specifications Spec ID# Parameter Description Min Typ Max Units Details/ Conditions SID48 FCPU CPU frequency DC – 48 MHz 1.71 VDD 5.5 SID49 TSLEEP Wakeup from sleep mode – 0 – µs Guaranteed by characterization SID50 TDEEPSLEEP Wakeup from Deep Sleep mode – – 25 µs 24 MHz IMO. Guaranteed by characterization SID51 THIBERNATE Wakeup from Hibernate mode – – 0.7 ms Guaranteed by characterization SID51A TSTOP Wakeup from Stop mode – – 2 ms Guaranteed by characterization SID52 TRESETWIDTH External reset pulse width 1 – – µs Guaranteed by characterization Min 0.7 × VDDD – Typ – Max – Units V – 10 µA Per I2C Spec – – V CMOS Input – 0.3 × VDDD – GPIO Table 4. GPIO DC Specifications Spec ID# SID57 Parameter VIH[2] Description Input voltage high threshold SID57A IIHS SID58 VIL Input current when Pad > VDDIO for OVT inputs Input voltage low threshold SID241 VIH[2] LVTTL input, VDDD < 2.7 V SID242 VIL LVTTL input, VDDD < 2.7 V 0.7× VDDD – SID243 VIH[2] LVTTL input, VDDD  2.7 V 2.0 SID244 VIL LVTTL input, VDDD  2.7 V – SID59 VOH Output voltage high level SID60 VOH Output voltage high level SID61 VOL SID62 – Details/Conditions CMOS Input V – 0.3 × VDDD – V V – 0.8 V – – V – – V Output voltage low level VDDD –0.6 VDDD –0.5 – – 0.6 V VOL Output voltage low level – – 0.6 V SID62A VOL Output voltage low level – – 0.4 V SID63 RPULLUP Pull-up resistor 3.5 5.6 8.5 kΩ SID64 RPULLDOWN Pull-down resistor 3.5 5.6 8.5 kΩ SID65 IIL Input leakage current (absolute value) – – 2 nA SID65A IIL_CTBM – – 4 nA SID66 CIN Input leakage current (absolute value) for CTBM pins Input capacitance – – 7 pF SID67 VHYSTTL Input hysteresis LVTTL 25 40 – mV IOH = 4 mA at 3-V VDDD IOH = 1 mA at 1.8-V VDDD IOL = 4 mA at 1.8-V VDDD IOL = 8 mA at 3-V VDDD IOL = 3 mA at 3-V VDDD 25 °C, VDDD = 3.0 V. Guaranteed by Characterization Guaranteed by Characterization VDDD  2.7 V Note 2. VIH must not exceed VDDD + 0.2 V. Document Number: 001-93963 Rev. *G Page 18 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 4. GPIO DC Specifications (continued) Spec ID# SID68 Parameter VHYSCMOS SID69 IDIODE SID69A ITOT_GPIO Description Input hysteresis CMOS Current through protection diode to VDD/Vss Maximum Total Source or Sink Chip Current Min 0.05 × VDDD – Typ – Max – Units mV – 100 µA – – 200 mA Details/Conditions Guaranteed by characterization Guaranteed by characterization Table 5. GPIO AC Specifications (Guaranteed by Characterization)[3] Spec ID# SID70 Parameter TRISEF Description Rise time in fast strong mode Min 2 Typ – Max 12 Units Details/Conditions ns 3.3 V VDDD, Cload = 25 pF ns 3.3 V VDDD, Cload = 25 pF ns 3.3 V VDDD, Cload = 25 pF ns 3.3 V VDDD, Cload = 25 pF MHz 90/10%, 25-pF load, 60/40 duty cycle MHz 90/10%, 25-pF load, 60/40 duty cycle MHz 90/10%, 25-pF load, 60/40 duty cycle MHz 90/10%, 25-pF load, 60/40 duty cycle MHz 90/10% VIO SID71 TFALLF Fall time in fast strong mode 2 – 12 SID72 TRISES Rise time in slow strong mode 10 – 60 SID73 TFALLS Fall time in slow strong mode 10 – 60 SID74 FGPIOUT1 – – 33 SID75 FGPIOUT2 – – 16.7 SID76 FGPIOUT3 – – 7 SID245 FGPIOUT4 – – 3.5 SID246 FGPIOIN GPIO Fout;3.3 V  VDDD 5.5 V. Fast strong mode. GPIO Fout;1.7 VVDDD3.3 V. Fast strong mode. GPIO Fout;3.3 V VDDD 5.5 V. Slow strong mode. GPIO Fout;1.7 V VDDD 3.3 V. Slow strong mode. GPIO input operating frequency; 1.71 V VDDD 5.5 V – – 48 Min 0.7 × VDDD – Typ – Max – Units V – V 3.5 5.6 0.3 × VDDD 8.5 XRES Table 6. XRES DC Specifications Spec ID# SID77 Parameter VIH Description Input voltage high threshold SID78 VIL Input voltage low threshold SID79 RPULLUP Pull-up resistor SID80 CIN Input capacitance – 3 – pF SID81 VHYSXRES Input voltage hysteresis – 100 – mV SID82 IDIODE Current through protection diode to VDDD/VSS – – 100 µA Min 1 Typ – Max – Units µs Details/ Conditions CMOS Input CMOS Input kΩ Guaranteed by characterization Guaranteed by characterization Table 7. XRES AC Specifications Spec ID# SID83 Parameter TRESETWIDTH Description Reset pulse width Details/ Conditions Guaranteed by characterization Note 3. Simultaneous switching transitions on many fully-loaded GPIO pins may cause ground perturbations depending on several factors including PCB and decoupling capacitor design. For applications that are very sensitive to ground perturbations, the slower GPIO slew rate setting may be used. Document Number: 001-93963 Rev. *G Page 19 of 42 PSoC® 4: PSoC 4200M Family Datasheet Analog Peripherals Opamp Table 8. Opamp Specifications (Guaranteed by Characterization) Spec ID# Parameter Description Min Typ Max Units IDD Opamp block current. No load. – – – – SID269 IDD_HI Power = high – 1100 1850 µA SID270 IDD_MED Power = medium – 550 950 µA SID271 IDD_LOW Power = low – 150 350 µA Details/ Conditions GBW Load = 20 pF, 0.1 mA. VDDA = 2.7 V – – – – SID272 GBW_HI Power = high 6 – – MHz SID273 GBW_MED Power = medium 4 – – MHz SID274 GBW_LO Power = low – 1 – MHz IOUT_MAX VDDA  2.7 V, 500 mV from rail – – – – SID275 IOUT_MAX_HI Power = high 10 – – mA SID276 IOUT_MAX_MID Power = medium 10 – – mA SID277 IOUT_MAX_LO Power = low – 5 – mA IOUT VDDA = 1.71 V, 500 mV from rail – – – – SID278 IOUT_MAX_HI Power = high 4 – – mA SID279 IOUT_MAX_MID Power = medium 4 – – mA SID280 IOUT_MAX_LO Power = low – 2 – mA SID281 VIN Input voltage range –0.05 – VDDA – 0.2 V Charge-pump on, VDDA 2.7 V SID282 VCM Input common mode voltage –0.05 – VDDA – 0.2 V Charge-pump on, VDDA 2.7 V VOUT VDDA  2.7 V – – – SID283 VOUT_1 Power = high, Iload=10 mA 0.5 – VDDA – 0.5 V SID284 VOUT_2 Power = high, Iload=1 mA 0.2 – VDDA – 0.2 V SID285 VOUT_3 Power = medium, Iload=1 mA 0.2 – VDDA – 0.2 V SID286 VOUT_4 Power = low, Iload=0.1mA 0.2 – VDDA – 0.2 V SID288 VOS_TR Offset voltage, trimmed 1 ±0.5 1 mV High mode SID288A VOS_TR Offset voltage, trimmed – ±1 – mV Medium mode SID288B VOS_TR Offset voltage, trimmed – ±2 – mV Low mode SID290 VOS_DR_TR Offset voltage drift, trimmed –10 ±3 10 µV/°C High mode. TA ≤ 85 °C. SID290Q VOS_DR_TR Offset voltage drift, trimmed 15 ±3 15 µV/°C High mode. TA ≤ 105 °C SID290A VOS_DR_TR Offset voltage drift, trimmed – ±10 – µV/°C Medium mode SID290B VOS_DR_TR Offset voltage drift, trimmed – ±10 – µV/°C Low mode SID291 CMRR DC Common mode rejection ratio. High-power mode. Common Model voltage range from 0.5 V to VDDA - 0.5 V. 60 70 – dB Document Number: 001-93963 Rev. *G VDDD = 3.6 V Page 20 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 8. Opamp Specifications (Guaranteed by Characterization) (continued) Spec ID# SID292 Parameter PSRR Description At 1 kHz, 100-mV ripple Noise Min Typ Max Units 70 85 – dB – – – – – 94 – µVrms SID293 VN1 Input referred, 1 Hz - 1 GHz, power = high SID294 VN2 Input referred, 1 kHz, power = high – 72 – nV/rtHz SID295 VN3 Input referred, 10kHz, power = high – 28 – nV/rtHz SID296 VN4 Input referred, 100kHz, power = high – 15 – nV/rtHz SID297 Cload Stable up to maximum load. Performance specs at 50 pF. – – 125 pF SID298 Slew_rate Cload = 50 pF, Power = High, VDDA  2.7 V 6 – – V/µs SID299 T_op_wake From disable to enable, no external RC dominating – 25 – µs SID299A OL_GAIN Open Loop Gain – 90 – dB Comp_mode Comparator mode; 50 mV drive, Trise = Tfall (approx.) – – – SID300 TPD1 Response time; power = high – 150 – ns SID301 TPD2 Response time; power = medium – 400 – ns SID302 TPD3 Response time; power = low – 2000 – ns SID303 Vhyst_op Hysteresis – 10 – mV Details/ Conditions VDDD = 3.6 V Deep Sleep Mode Mode 2 is lowest current range. Mode 1 has higher GBW. Deep Sleep mode. VDDA  2.7 V. SID_DS_1 IDD_HI_M1 Mode 1, High current – 1400 – uA 25 °C SID_DS_2 IDD_MED_M1 Mode 1, Medium current – 700 – uA 25 °C SID_DS_3 IDD_LOW_M1 Mode 1, Low current – 200 – uA 25 °C SID_DS_4 IDD_HI_M2 Mode 2, High current – 120 – uA 25 °C SID_DS_5 IDD_MED_M2 Mode 2, Medium current – 60 – uA 25 °C SID_DS_6 IDD_LOW_M2 Mode 2, Low current – 15 – uA 25 °C SID_DS_7 GBW_HI_M1 Mode 1, High current – 4 – MHz 25 °C SID_DS_8 GBW_MED_M1 Mode 1, Medium current – 2 – MHz 25 °C SID_DS_9 GBW_LOW_M1 Mode 1, Low current – 0.5 – MHz 25 °C – 0.5 – MHz 20-pF load, no DC load 0.2 V to VDDA-1.5 V SID_DS_11 GBW_MED_M2 Mode 2, Medium current – 0.2 – MHz 20-pF load, no DC load 0.2 V to VDDA-1.5 V SID_DS_12 GBW_LOW_M2 Mode 2, Low current – 0.1 – MHz 20-pF load, no DC load 0.2 V to VDDA-1.5 V SID_DS_13 VOS_HI_M1 – 5 – mV With trim 25 °C, 0.2 V to VDDA-1.5 V – 5 – mV With trim 25 °C, 0.2 V to VDDA-1.5 V SID_DS_10 GBW_HI_M2 Mode 2, High current Mode 1, High current SID_DS_14 VOS_MED_M1 Mode 1, Medium current Document Number: 001-93963 Rev. *G Page 21 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 8. Opamp Specifications (Guaranteed by Characterization) (continued) Spec ID# Parameter Description Details/ Conditions Min Typ Max Units SID_DS_15 VOS_LOW_M1 Mode 1, Low current – 5 – mV With trim 25 °C, 0.2 V to VDDA-1.5 V SID_DS_16 VOS_HI_M2 – 5 – mV With trim 25 °C, 0.2 V to VDDA-1.5 V SID_DS_17 VOS_MED_M2 Mode 2, Medium current – 5 – mV With trim 25 °C, 0.2 V to VDDA-1.5 V SID_DS_18 VOS_LOW_M2 Mode 2, Low current – 5 – mV With trim 25 °C, 0.2 V to VDDA-1.5 V SID_DS_19 IOUT_HI_M1 – 10 – mA Output is 0.5 V to VDDA-0.5 V SID_DS_20 IOUT_MED_M1 Mode 1, Medium current – 10 – mA Output is 0.5 V to VDDA-0.5 V SID_DS_21 IOUT_LOW_M1 Mode 1, Low current – 4 – mA Output is 0.5 V to VDDA-0.5 V SID_DS_22 IOUT_HI_M2 – 1 – mA Output is 0.5 V to VDDA-0.5 V SID_DS_23 IOUT_MED_M2 Mode 2, Medium current – 1 – mA Output is 0.5 V to VDDA-0.5 V SID_DS_24 IOUT_LOW_M2 Mode 2, Low current – 0.5 – mA Output is 0.5 V to VDDA-0.5 V Mode 2, High current Mode 1, High current Mode 2, High current Comparator Table 9. Comparator DC Specifications Spec ID# Parameter Description Min Typ Max Units Details/ Conditions SID85 VOFFSET2 Input offset voltage, Common Mode voltage range from 0 to VDD-1 – – ±4 mV SID85A VOFFSET3 Input offset voltage. Ultra low-power mode (VDDD ≥ 2.2 V for Temp < 0 °C, VDDD ≥ 1.8 V for Temp > 0 °C) – ±12 – mV SID86 VHYST Hysteresis when enabled, Common Mode voltage range from 0 to VDD -1. – 10 35 mV Guaranteed by characterization SID87 VICM1 Input common mode voltage in normal mode 0 – VDDD – 0.1 V Modes 1 and 2. SID247 VICM2 Input common mode voltage in low power mode (VDDD ≥ 2.2 V for Temp < 0 °C, VDDD ≥ 1.8 V for Temp > 0 °C) 0 – VDDD V SID247A VICM3 Input common mode voltage in ultra low power mode 0 – VDDD – 1.15 V SID88 CMRR Common mode rejection ratio 50 – – dB VDDD  2.7 V. Guaranteed by characterization SID88A CMRR Common mode rejection ratio 42 – – dB VDDD  2.7 V. Guaranteed by characterization SID89 ICMP1 Block current, normal mode – – 400 µA Guaranteed by characterization Document Number: 001-93963 Rev. *G Page 22 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 9. Comparator DC Specifications (continued) Spec ID# Parameter Description Min Typ Max Units Details/ Conditions SID248 ICMP2 Block current, low power mode – – 100 µA Guaranteed by characterization SID259 ICMP3 Block current, ultra low power mode (VDDD ≥ 2.2 V for Temp < 0 °C, VDDD ≥ 1.8 V for Temp > 0 °C) – 6 28 µA Guaranteed by characterization SID90 ZCMP DC input impedance of comparator 35 – – MΩ Guaranteed by characterization Typ Max Units Table 10. Comparator AC Specifications (Guaranteed by Characterization) Spec ID# Parameter Description Min Details/Conditions SID91 TRESP1 Response time, normal mode – – 110 ns 50-mV overdrive SID258 TRESP2 Response time, low power mode – – 200 ns 50-mV overdrive SID92 TRESP3 Response time, ultra low power mode (VDDD ≥ 2.2 V for Temp < 0 °C, VDDD ≥ 1.8 V for Temp > 0 °C) – – 15 µs 200-mV overdrive Min Typ Max Units Details/Conditions –5 ±1 +5 °C –40 to +85 °C Details/Conditions Temperature Sensor Table 11. Temperature Sensor Specifications Spec ID# SID93 Parameter TSENSACC Description Temperature sensor accuracy SAR ADC Table 12. SAR ADC DC Specifications Spec ID# Parameter Min Typ Max Units Resolution – – 12 bits A_CHNIS_S Number of channels - single ended – – 16 8 full speed A-CHNKS_D Number of channels - differential – – 8 Diff inputs use neighboring I/O SID97 A-MONO Monotonicity – – – Yes. Based on characterization SID98 A_GAINERR Gain error – – ±0.1 % SID99 A_OFFSET Input offset voltage – – 2 mV SID100 A_ISAR Current consumption – – 1 mA SID101 A_VINS Input voltage range - single ended VSS – VDDA V Based on device characterization SID102 A_VIND Input voltage range - differential VSS – VDDA V Based on device characterization SID103 A_INRES Input resistance – – 2.2 KΩ Based on device characterization SID104 A_INCAP Input capacitance – – 10 pF Based on device characterization SID94 A_RES SID95 SID96 Description Document Number: 001-93963 Rev. *G With external reference. Measured with 1-V VREF. Page 23 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 13. SAR ADC AC Specifications (Guaranteed by Characterization) Spec ID# SID106 Parameter A_PSRR Description Power supply rejection ratio Min 70 Typ – Max – SID107 SID108 SID108A A_SAMP_2 SID108B A_SAMP_3 Units dB A_CMRR Common mode rejection ratio 66 – – dB A_SAMP_1 – – 1 Msps – – 1 Msps – – 100 Ksps Details/Conditions Measured at 1 V SID109 A_SNDR Sample rate with external reference bypass cap Sample rate with no bypass cap. Reference = VDD Sample rate with no bypass cap. Internal reference Signal-to-noise and distortion ratio (SINAD) 66 – – dB SID111 A_INL Integral non linearity –1.4 – +1.4 LSB SID111A A_INL Integral non linearity –1.4 – +1.4 LSB SID111B A_INL Integral non linearity –1.4 – +1.4 LSB SID112 A_DNL Differential non linearity –0.9 – +1.35 LSB SID112A A_DNL Differential non linearity –0.9 – +1.35 LSB SID112B A_DNL Differential non linearity –0.9 – +1.35 LSB SID113 A_THD Total harmonic distortion – – –65 dB VDD = 1.71 to 5.5, 1 Msps, Vref = 1 to 5.5. VDDD = 1.71 to 3.6, 1 Msps, Vref = 1.71 to VDDD. VDDD = 1.71 to 5.5, 500 ksps, Vref = 1 to 5.5. VDDD = 1.71 to 5.5, 1 Msps, Vref = 1 to 5.5. VDDD = 1.71 to 3.6, 1 Msps, Vref = 1.71 to VDDD. VDDD = 1.71 to 5.5, 500 ksps, Vref = 1 to 5.5. FIN = 10 kHz. Min Typ Max Units Details/Conditions FIN = 10 kHz CSD Table 14. CSD Block Specification Spec ID# Parameter Description CSD Specification SID308 VCSD Voltage range of operation 1.71 – 5.5 V SID309 IDAC1 DNL for 8-bit resolution –1 – 1 LSB SID310 IDAC1 INL for 8-bit resolution –3 – 3 LSB SID311 IDAC2 DNL for 7-bit resolution –1 – 1 LSB SID312 IDAC2 INL for 7-bit resolution –3 – 3 LSB SID313 SNR Ratio of counts of finger to noise. Guaranteed by characterization 5 – – Ratio SID314 IDAC1_CRT1 Output current of Idac1 (8-bits) in High range – 612 – µA SID314A IDAC1_CRT2 Output current of Idac1(8-bits) in Low range – 306 – µA SID315 IDAC2_CRT1 Output current of Idac2 (7-bits) in High range – 304.8 – µA SID315A IDAC2_CRT2 Output current of Idac2 (7-bits) in Low range – 152.4 – µA Document Number: 001-93963 Rev. *G Capacitance range of 9 to 35 pF, 0.1-pF sensitivity Page 24 of 42 PSoC® 4: PSoC 4200M Family Datasheet Digital Peripherals The following specifications apply to the Timer/Counter/PWM peripheral in timer mode. Timer/Counter/PWM Table 15. TCPWM Specifications (Guaranteed by Characterization) Spec ID Parameter Description Min Typ Max Units SID.TCPWM.1 ITCPWM1 Block current consumption at 3 MHz – – 45 µA SID.TCPWM.2 ITCPWM2 Block current consumption at 12 MHz – – 155 µA SID.TCPWM.2A ITCPWM3 Block current consumption at 48 MHz – – 650 µA – – Fc MHz SID.TCPWM.3 TCPWMFREQ Operating frequency SID.TCPWM.4 TPWMENEXT Input Trigger Pulse Width for all Trigger Events 2/Fc – – ns SID.TCPWM.5 TPWMEXT Output Trigger Pulse widths 2/Fc – – ns SID.TCPWM.5A TCRES Resolution of Counter 1/Fc – – ns SID.TCPWM.5B PWMRES PWM Resolution 1/Fc – – ns SID.TCPWM.5C QRES Quadrature inputs resolution 1/Fc – – ns Details/Conditions All modes (Timer/Counter/PWM) All modes (Timer/Counter/PWM) All modes (Timer/Counter/PWM) Fc max = Fcpu. Maximum = 24 MHz Trigger Events can be Stop, Start, Reload, Count, Capture, or Kill depending on which mode of operation is selected. Minimum possible width of Overflow, Underflow, and CC (Counter equals Compare value) trigger outputs Minimum time between successive counts Minimum pulse width of PWM Output Minimum pulse width between Quadrature phase inputs. I2C Table 16. Fixed I2C DC Specifications (Guaranteed by Characterization) Spec ID SID149 Parameter II2C1 Description Block current consumption at 100 kHz Min – Typ – Max 50 Units µA SID150 II2C2 Block current consumption at 400 kHz – – 135 µA SID151 II2C3 Block current consumption at 1 Mbps – – 310 µA II2C4 I2C – – 1.4 µA Min – Typ – Max 1 Units Mbps SID152 enabled in Deep Sleep mode Details/Conditions Table 17. Fixed I2C AC Specifications (Guaranteed by Characterization) Spec ID SID153 Parameter FI2C1 Description Bit rate Document Number: 001-93963 Rev. *G Details/Conditions Page 25 of 42 PSoC® 4: PSoC 4200M Family Datasheet LCD Direct Drive Table 18. LCD Direct Drive DC Specifications (Guaranteed by Characterization) Spec ID SID154 Parameter ILCDLOW SID155 CLCDCAP SID156 LCDOFFSET SID157 ILCDOP1 SID158 ILCDOP2 Description Operating current in low power mode Min – Typ 5 Max – Units Details/Conditions µA 16 × 4 small segment disp. at 50 Hz pF Guaranteed by Design LCD capacitance per segment/common driver Long-term segment offset – 500 5000 – 20 – mV PWM Mode current. 5-V bias. 24-MHz IMO PWM Mode current. 3.3-V bias. 24-MHz IMO. – 0.6 – mA – 0.5 – mA Min 10 Typ 50 Max 150 Units Hz 32 × 4 segments. 50 Hz, 25 °C 32 × 4 segments. 50 Hz, 25 °C Table 19. LCD Direct Drive AC Specifications (Guaranteed by Characterization) Spec ID SID159 Parameter FLCD Description LCD frame rate Details/Conditions Table 20. Fixed UART DC Specifications (Guaranteed by Characterization) Min Typ Max Units SID160 Spec ID IUART1 Parameter Block current consumption at 100 Kbps Description – – 55 µA SID161 IUART2 Block current consumption at 1000 Kbps – – 312 µA Min Typ Max Units – – 1 Mbps Description Min Typ Max Units Details/Conditions Table 21. Fixed UART AC Specifications (Guaranteed by Characterization) Spec ID SID162 Parameter FUART Description Bit rate Details/Conditions SPI Specifications Table 22. Fixed SPI DC Specifications (Guaranteed by Characterization) Spec ID Parameter SID163 ISPI1 Block current consumption at 1 Mbps – – 360 µA SID164 ISPI2 Block current consumption at 4 Mbps – – 560 µA SID165 ISPI3 Block current consumption at 8 Mbps – – 600 µA Min Typ Max Units – – 8 MHz Details/Conditions Table 23. Fixed SPI AC Specifications (Guaranteed by Characterization) Spec ID SID166 Parameter FSPI Description SPI operating frequency (master; 6X oversampling) Document Number: 001-93963 Rev. *G Details/Conditions Page 26 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 24. Fixed SPI Master mode AC Specifications (Guaranteed by Characterization) Description Min Typ Max Units SID167 Spec ID TDMO Parameter MOSI valid after Sclock driving edge – – 15 ns SID168 TDSI MISO valid before Sclock capturing edge. Full clock, late MISO Sampling used 20 – – ns SID169 THMO Previous MOSI data hold time with respect to capturing edge at Slave 0 – – ns Min Typ Max Units Details/Conditions Table 25. Fixed SPI Slave mode AC Specifications (Guaranteed by Characterization) Spec ID Parameter Description Details/Conditions SID170 TDMI MOSI valid before Sclock capturing edge 40 – – ns SID171 TDSO MISO valid after Sclock driving edge – – 42 + 3 × (1/FCPU) ns SID171A TDSO_ext MISO valid after Sclock driving edge in Ext. Clock mode – – 48 ns SID172 THSO Previous MISO data hold time 0 – – ns SID172A TSSELSCK SSEL Valid to first SCK Valid edge 100 – – ns Min Typ Max Units 1.71 – 5.5 V Description Min Typ Max Units Details/Conditions Row (block) = 128 bytes Memory Table 26. Flash DC Specifications Spec ID SID173 Parameter VPE Description Erase and program voltage Details/Conditions Table 27. Flash AC Specifications Spec ID Parameter SID174 TROWWRITE Row (block) write time (erase and program) – – 20 ms SID175 TROWERASE Row erase time – – 13 ms SID176 TROWPROGRAM Row program time after erase – – 7 ms SID178 TBULKERASE Bulk erase time (128 KB) – – 35 ms SID179 TSECTORERASE Sector erase time (8 KB) – – 15 ms SID180 TDEVPROG Total device program time – – 15 SID181 FEND Flash endurance 100 K – – cycles Guaranteed by characterization SID182 FRET Flash retention. TA  55 °C, 100 K P/E cycles 20 – – years Guaranteed by characterization Flash retention. TA  85 °C, 10 K P/E cycles 10 – – years Guaranteed by characterization Flash retention. TA  105 °C, 10K P/E cycles,  three years at TA ≥ 85 °C 10 20 – years Guaranteed by characterization. SID182A SID182B FRETQ Document Number: 001-93963 Rev. *G seconds Guaranteed by characterization Page 27 of 42 PSoC® 4: PSoC 4200M Family Datasheet System Resources Power-on-Reset (POR) with Brown Out Table 28. Imprecise Power On Reset (PRES) Min Typ Max Units SID185 Spec ID VRISEIPOR Parameter Rising trip voltage Description 0.80 – 1.45 V Guaranteed by characterization Details/Conditions SID186 VFALLIPOR Falling trip voltage 0.75 – 1.4 V Guaranteed by characterization SID187 VIPORHYST Hysteresis 15 – 200 mV Guaranteed by characterization Table 29. Precise Power On Reset (POR) Min Typ Max Units SID190 Spec ID VFALLPPOR Parameter BOD trip voltage in active and sleep modes Description 1.64 – – V Guaranteed by characterization Details/Conditions SID192 VFALLDPSLP BOD trip voltage in Deep Sleep 1.4 – – V Guaranteed by characterization Voltage Monitors Table 30. Voltage Monitors DC Specifications Spec ID SID195 Parameter VLVI1 Description LVI_A/D_SEL[3:0] = 0000b Min 1.71 Typ 1.75 Max 1.79 Units V SID196 VLVI2 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 V SID197 VLVI3 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 V SID198 VLVI4 LVI_A/D_SEL[3:0] = 0011b 1.95 2.00 2.05 V SID199 VLVI5 LVI_A/D_SEL[3:0] = 0100b 2.05 2.10 2.15 V SID200 VLVI6 LVI_A/D_SEL[3:0] = 0101b 2.15 2.20 2.26 V SID201 VLVI7 LVI_A/D_SEL[3:0] = 0110b 2.24 2.30 2.36 V SID202 VLVI8 LVI_A/D_SEL[3:0] = 0111b 2.34 2.40 2.46 V SID203 VLVI9 LVI_A/D_SEL[3:0] = 1000b 2.44 2.50 2.56 V SID204 VLVI10 LVI_A/D_SEL[3:0] = 1001b 2.54 2.60 2.67 V SID205 VLVI11 LVI_A/D_SEL[3:0] = 1010b 2.63 2.70 2.77 V SID206 VLVI12 LVI_A/D_SEL[3:0] = 1011b 2.73 2.80 2.87 V SID207 VLVI13 LVI_A/D_SEL[3:0] = 1100b 2.83 2.90 2.97 V SID208 VLVI14 LVI_A/D_SEL[3:0] = 1101b 2.93 3.00 3.08 V SID209 VLVI15 LVI_A/D_SEL[3:0] = 1110b 3.12 3.20 3.28 V SID210 VLVI16 LVI_A/D_SEL[3:0] = 1111b 4.39 4.50 4.61 V SID211 LVI_IDD Block current – – 100 µA Min Typ Max Units – – 1 µs Details/Conditions Guaranteed by characterization Table 31. Voltage Monitors AC Specifications Spec ID SID212 Parameter TMONTRIP Description Voltage monitor trip time Document Number: 001-93963 Rev. *G Details/Conditions Guaranteed by characterization Page 28 of 42 PSoC® 4: PSoC 4200M Family Datasheet SWD Interface Table 32. SWD Interface Specifications Spec ID Parameter Description Min Typ Max Units Details/Conditions SID213 F_SWDCLK1 3.3 V  VDD  5.5 V – – 14 MHz SWDCLK ≤ 1/3 CPU clock frequency SID214 F_SWDCLK2 1.71 V  VDD  3.3 V – – 7 MHz SWDCLK ≤ 1/3 CPU clock frequency SID215 T_SWDI_SETUP T = 1/f SWDCLK 0.25*T – – ns Guaranteed by characterization SID216 T_SWDI_HOLD 0.25*T – – ns Guaranteed by characterization SID217 T_SWDO_VALID T = 1/f SWDCLK – – 0.5*T ns Guaranteed by characterization SID217A T_SWDO_HOLD T = 1/f SWDCLK 1 – – ns Guaranteed by characterization Description Min Typ Max Units T = 1/f SWDCLK Internal Main Oscillator Table 33. IMO DC Specifications (Guaranteed by Design) Spec ID Parameter SID218 IIMO1 IMO operating current at 48 MHz – – 1000 µA SID219 IIMO2 IMO operating current at 24 MHz – – 325 µA SID220 IIMO3 IMO operating current at 12 MHz – – 225 µA SID221 IIMO4 IMO operating current at 6 MHz – – 180 µA SID222 IIMO5 IMO operating current at 3 MHz – – 150 µA Details/Conditions Table 34. IMO AC Specifications Min Typ Max Units Details/Conditions SID223 Spec ID FIMOTOL1 Parameter Frequency variation from 3 to 48 MHz Description – – ±2 % ±3% if TA > 85 °C and IMO frequency < 24 MHz SID226 TSTARTIMO IMO startup time – – 12 µs SID227 TJITRMSIMO1 RMS Jitter at 3 MHz – 156 – ps SID228 TJITRMSIMO2 RMS Jitter at 24 MHz – 145 – ps SID229 TJITRMSIMO3 RMS Jitter at 48 MHz – 139 – ps Min – Typ 0.3 Max 1.05 Units µA – 2 15 nA Internal Low-Speed Oscillator Table 35. ILO DC Specifications (Guaranteed by Design) Spec ID SID231 Parameter IILO1 Description ILO operating current at 32 kHz SID233 IILOLEAK ILO leakage current Document Number: 001-93963 Rev. *G Details/Conditions Guaranteed by Characterization Guaranteed by Design Page 29 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 36. ILO AC Specifications Spec ID Parameter Description Min Typ Max Units Details/Conditions SID234 TSTARTILO1 ILO startup time – – 2 ms Guaranteed by characterization SID236 TILODUTY ILO duty cycle 40 50 60 % Guaranteed by characterization SID237 FILOTRIM1 32 kHz trimmed frequency 15 32 50 kHz Max ILO frequency is 70 kHz if TA > 85 °C Table 37. External Clock Specifications Spec ID Parameter Description Min Typ Max Units Details/Conditions SID305 ExtClkFreq External Clock input Frequency 0 – 48 MHz Guaranteed by characterization SID306 ExtClkDuty Duty cycle; Measured at VDD/2 45 – 55 % Guaranteed by characterization Table 38. Watch Crystal Oscillator (WCO) Specifications Spec Id# Parameter Description Min Typ Max Units Details / Conditions IMO WCO-PLL calibrated mode SID330 IMOWCO1 Frequency variation with IMO set to 3 MHz –0.6 – 0.6 % Does not include WCO tolerance SID331 IMOWCO2 Frequency variation with IMO set to 5 MHz –0.4 – 0.4 % Does not include WCO tolerance SID332 IMOWCO3 Frequency variation with IMO set to 7 MHz or 9 MHz –0.3 – 0.3 % Does not include WCO tolerance SID333 IMOWCO4 All other IMO frequency settings –0.2 – 0.2 % Does not include WCO tolerance WCO Specifications SID398 FWCO Crystal frequency – 32.768 – kHz SID399 FTOL Frequency tolerance – 50 250 ppm SID400 ESR Equivalent series resistance – 50 – kΩ SID401 PD Drive level – – 1 µW SID402 TSTART Startup time – – 500 ms SID403 CL Crystal load capacitance 6 – 12.5 pF SID404 C0 Crystal shunt capacitance – 1.35 – pF SID405 IWCO1 Operating current (high power mode) – – 8 uA With 20-ppm crystal. Table 39. UDB AC Specifications (Guaranteed by Characterization) Spec ID Parameter Description Min Typ Max Units Details/Conditions Datapath performance SID249 FMAX-TIMER Max frequency of 16-bit timer in a UDB pair – – 48 MHz SID250 FMAX-ADDER Max frequency of 16-bit adder in a UDB pair – – 48 MHz Document Number: 001-93963 Rev. *G Page 30 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 39. UDB AC Specifications (Guaranteed by Characterization) (continued) Spec ID SID251 Parameter FMAX_CRC Description Min Typ Max Units Max frequency of 16-bit CRC/PRS in a UDB pair – – 48 MHz Max frequency of 2-pass PLD function in a UDB pair – – 48 MHz Details/Conditions PLD Performance in UDB SID252 FMAX_PLD Clock to Output Performance SID253 TCLK_OUT_UDB1 Prop. delay for clock in to data out at 25 °C, Typ. – 15 – ns SID254 TCLK_OUT_UDB2 Prop. delay for clock in to data out, Worst case. – 25 – ns Table 40. Block Specs Spec ID SID256* Parameter TWS48* Description Number of wait states at 48 MHz Min 2 Typ – Max – SID257 TWS24* Number of wait states at 24 MHz 1 – – SID260 VREFSAR Trimmed internal reference to SAR –1 – +1 SID261 FSARINTREF SAR operating speed without external reference bypass – – 100 SID262 TCLKSWITCH Clock switching from clk1 to clk2 in clk1 periods 3 – 4 Units Details/Conditions CPU execution from Flash CPU execution from Flash % Percentage of Vbg (1.024 V). Guaranteed by characterization ksps 12-bit resolution. Guaranteed by characterization Periods . Guaranteed by design * Tws48 and Tws24 are guaranteed by Design Table 41. UDB Port Adaptor Specifications (Based on LPC Component Specs, Guaranteed by Characterization -10-pF load, 3-V VDDIO and VDDD) Spec ID Parameter Description Min Typ Max Units Details/Conditions SID263 TLCLKDO LCLK to output delay – – 18 ns SID264 TDINLCLK Input setup time to LCLCK rising edge – – 7 ns SID265 TDINLCLKHLD Input hold time from LCLK rising edge 0 – – ns SID266 TLCLKHIZ LCLK to output tristated – – 28 ns SID267 TFLCLK LCLK frequency – – 33 MHz SID268 TLCLKDUTY LCLK duty cycle (percentage high) 40 – 60 % Table 42. CAN Specifications Min Typ Max SID420 SPEC ID# IDD_CAN Parameter Block current consumption Description – – 200 uA SID421 CAN_bits CAN Bit rate (Min 8-MHZ clock) – – 1 Mbps Document Number: 001-93963 Rev. *G Units Details /Conditions Page 31 of 42 PSoC® 4: PSoC 4200M Family Datasheet Ordering Information The PSoC 4200M family part numbers and features are listed in the following table. 4246 4247 IDAC (1X7-Bit, 1-8-Bit) Direct LCD Drive 12-bit SAR ADC LP Comparators TCPWM Blocks SCB Blocks CAN GPIO 48-TQFP 64-TQFP (0.5-mm pitch) 64-TQFP (0.8-mm pitch) 68-QFN 4 4 2 – – – 1000 ksps 2 8 4 – 38 ✔ – – – 4 4 2 ✔ – ✔ 1000 ksps 2 8 4 – 38 ✔ – – – CY8C4245AZI-M445 48 32 4 4 2 ✔ – ✔ 1000 ksps 2 8 4 – 51 – ✔ – – CY8C4245LTI-M445 48 32 4 4 2 ✔ – ✔ 1000 ksps 2 8 4 – 55 – – – ✔ CY8C4245AXI-M445 48 32 4 4 2 ✔ – ✔ 1000 ksps 2 8 4 – 51 – – ✔ – Flash (KB) Opamp (CTBm) 32 32 UDB 48 48 SRAM (KB) CY8C4245AZI-M433 Max CPU Speed (MHz) CSD 4245 Packages CY8C4245AZI-M443 MPN Category Features CY8C4246AZI-M443 48 64 8 4 2 ✔ – ✔ 1000 ksps 2 8 4 – 38 ✔ – – – CY8C4246AZI-M445 48 64 8 4 2 ✔ – ✔ 1000 ksps 2 8 4 – 51 – ✔ – – CY8C4246AZI-M475 48 64 8 4 4 – ✔ – 1000 ksps 2 8 4 – 51 – ✔ – – CY8C4246LTI-M445 48 64 8 4 2 ✔ – ✔ 1000 ksps 2 8 4 – 55 – – – ✔ CY8C4246LTI-M475 48 64 8 4 4 – ✔ – 1000 ksps 2 8 4 – 55 – – – ✔ CY8C4246AXI-M445 48 64 8 4 2 ✔ – ✔ 1000 ksps 2 8 4 – 51 – – ✔ – CY8C4247LTI-M475 48 128 16 4 4 ✔ ✔ – 1000 ksps 2 8 4 – 55 – – – ✔ CY8C4247AZI-M475 48 128 16 4 4 – ✔ – 1000 ksps 2 8 4 – 51 – ✔ – – CY8C4247AZI-M485 48 128 16 4 4 ✔ ✔ ✔ 1000 ksps 2 8 4 ✔ 51 – ✔ – – CY8C4247AXI-M485 48 128 16 4 4 ✔ ✔ ✔ 1000 ksps 2 8 4 ✔ 51 – – ✔ – CY8C4247LTQ-M475 48 128 16 4 4 ✔ ✔ ✔ 1000 ksps 2 8 4 – 55 – – – ✔ The nomenclature used in the preceding table is based on the following part numbering convention: Field Description CY8C 4 A B Cypress Prefix Architecture Family CPU Speed C Flash Capacity DE Package Code Values Meaning 4 2 4 4 5 6 7 AX, AZ LT BU FD PSoC 4 4200 Family 48 MHz 16 KB 32 KB 64 KB 128 KB TQFP QFN BGA CSP Document Number: 001-93963 Rev. *G Page 32 of 42 PSoC® 4: PSoC 4200M Family Datasheet Field Description F Temperature Range S Silicon Family XYZ Attributes Code Values Meaning I Q N/A L BL M 000-999 Industrial Extended Industrial PSoC 4 Base Series PSoC 4 L-Series PSoC 4 BLE PSoC 4 M-Series Code of feature set in the specific family Part Numbering Conventions The part number fields are defined as follows. CY8C 4 A B C D E F - S XYZ Cypress Prefix Architecture Family Group within Architecture Speed Grade Flash Capacity Package Code Temperature Range Silicon Family Attributes Code Document Number: 001-93963 Rev. *G Page 33 of 42 PSoC® 4: PSoC 4200M Family Datasheet Packaging The description of the PSoC4200M package dimensions follows. Spec ID# Package Description Package Dwg # PKG_1 68-pin QFN 68-pin QFN, 8 mm x 8 mm x 1.0 mm height with 0.4 mm pitch 001-09618 PKG_2 64-pin TQFP 64-pin TQFP, 10 mm x10 mm x 1.4 mm height with 0.5 mm pitch 51-85051 PKG_4 64-pin TQFP 64-pin TQFP, 14 mm x14 mm x 1.4 mm height with 0.8 mm pitch 51-85046 PKG_5 48-pin TQFP 48-pin TQFP, 7 mm x 7 mm x 1.4 mm height with 0.5 mm pitch 51-85135 PKG_6 44-pin TQFP 44-pin TQFP, 10 mm x 10 mm x 1.4 mm height with 0.8 mm pitch 51-85064 Table 43. Package Characteristics Min Typ Max Units TA Parameter Operating ambient temperature Description Conditions –40 25 85 °C TJ Operating junction temperature –40 100 °C TJA Package θJA (68-pin QFN) – 16.8 – °C/Watt TJC Package θJC (68-pin QFN) – 2.9 – °C/Watt TJA Package θJA (64-pin TQFP, 0.5-mm pitch) – 56 – °C/Watt TJC Package θJC (64-pin TQFP, 0.5-mm pitch) – 19.5 – °C/Watt TJA Package θJA (64-pin TQFP, 0.8-mm pitch) – 66.4 – °C/Watt TJC Package θJC (64-pin TQFP, 0.8-mm pitch) – 18.2 – °C/Watt TJA Package θJA (48-pin TQFP, 0.5-mm pitch) – 67.3 – °C/Watt TJC Package θJC (48-pin TQFP, 0.5-mm pitch) – 30.4 – °C/Watt TJA Package θJA (44-pin TQFP, 0.8-mm pitch) – 57 – °C/Watt TJC Package θJC (44-pin TQFP, 0.8-mm pitch) – 25.9 – °C/Watt Table 44. Solder Reflow Peak Temperature Package Maximum Peak Temperature Maximum Time at Peak Temperature All packages 260 °C 30 seconds Table 45. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Package All packages Document Number: 001-93963 Rev. *G MSL MSL 3 Page 34 of 42 PSoC® 4: PSoC 4200M Family Datasheet Figure 7. 68-Pin QFN 8 × 8 × 1.0 mm Package Outline 001-09618 *E Figure 8. 64-Pin TQFP 10 × 10 × 1.4 mm Package Outline 51-85051 *D Document Number: 001-93963 Rev. *G Page 35 of 42 PSoC® 4: PSoC 4200M Family Datasheet Figure 9. 64-Pin 14 × 14 × 1.4 mm TQFP Package Outline 51-85046 *G Figure 10. 48-Pin 7 × 7 × 1.4 mm TQFP Package Outline 51-85135 *C Document Number: 001-93963 Rev. *G Page 36 of 42 PSoC® 4: PSoC 4200M Family Datasheet Figure 11. 44-Pin 10 × 10 × 1.4 mm TQFP Package Outline 51-85064 *G Document Number: 001-93963 Rev. *G Page 37 of 42 PSoC® 4: PSoC 4200M Family Datasheet Acronyms Table 46. Acronyms Used in this Document (continued) Table 46. Acronyms Used in this Document ETM embedded trace macrocell FIR finite impulse response, see also IIR flash patch and breakpoint Acronym Acronym Description Description abus analog local bus FPB ADC analog-to-digital converter FS full-speed AG analog global GPIO AHB AMBA (advanced microcontroller bus architecture) high-performance bus, an ARM data transfer bus general-purpose input/output, applies to a PSoC pin HVI high-voltage interrupt, see also LVI, LVD IC integrated circuit IDAC current DAC, see also DAC, VDAC IDE integrated development environment ALU arithmetic logic unit AMUXBUS analog multiplexer bus API application programming interface APSR application program status register ARM® advanced RISC machine, a CPU architecture IIR ATM automatic thump mode ILO internal low-speed oscillator, see also IMO BW bandwidth IMO internal main oscillator, see also ILO CAN Controller Area Network, a communications protocol INL integral nonlinearity, see also DNL CMRR common-mode rejection ratio I/O input/output, see also GPIO, DIO, SIO, USBIO CPU central processing unit IPOR initial power-on reset CRC cyclic redundancy check, an error-checking protocol IPSR interrupt program status register IRQ interrupt request DAC digital-to-analog converter, see also IDAC, VDAC ITM instrumentation trace macrocell DFB digital filter block LCD liquid crystal display DIO digital input/output, GPIO with only digital capabilities, no analog. See GPIO. LIN Local Interconnect Network, a communications protocol. DMIPS Dhrystone million instructions per second LR link register DMA direct memory access, see also TD LUT lookup table DNL differential nonlinearity, see also INL LVD low-voltage detect, see also LVI DNU do not use LVI low-voltage interrupt, see also HVI DR port write data registers LVTTL low-voltage transistor-transistor logic DSI digital system interconnect MAC multiply-accumulate DWT data watchpoint and trace MCU microcontroller unit ECC error correcting code MISO master-in slave-out ECO external crystal oscillator NC no connect electrically erasable programmable read-only memory NMI nonmaskable interrupt NRZ non-return-to-zero EMI electromagnetic interference NVIC nested vectored interrupt controller EMIF external memory interface NVL nonvolatile latch, see also WOL EOC end of conversion opamp operational amplifier EOF end of frame PAL programmable array logic, see also PLD EPSR execution program status register PC program counter ESD electrostatic discharge PCB printed circuit board EEPROM Document Number: 001-93963 Rev. *G 2C, I or IIC Inter-Integrated Circuit, a communications protocol infinite impulse response, see also FIR Page 38 of 42 PSoC® 4: PSoC 4200M Family Datasheet Table 46. Acronyms Used in this Document (continued) Acronym Description Table 46. Acronyms Used in this Document (continued) Acronym Description PGA programmable gain amplifier THD total harmonic distortion PHUB peripheral hub TIA transimpedance amplifier PHY physical layer TRM technical reference manual PICU port interrupt control unit TTL transistor-transistor logic PLA programmable logic array TX transmit PLD programmable logic device, see also PAL UART PLL phase-locked loop Universal Asynchronous Transmitter Receiver, a communications protocol PMDD package material declaration data sheet UDB universal digital block POR power-on reset USB Universal Serial Bus PRES precise power-on reset USBIO PRS pseudo random sequence USB input/output, PSoC pins used to connect to a USB port PS port read data register VDAC voltage DAC, see also DAC, IDAC PSoC® Programmable System-on-Chip™ WDT watchdog timer PSRR power supply rejection ratio PWM pulse-width modulator RAM random-access memory RISC reduced-instruction-set computing RMS root-mean-square RTC real-time clock RTL register transfer language RTR remote transmission request RX receive SAR successive approximation register SC/CT switched capacitor/continuous time SCL I2C serial clock SDA I2C serial data S/H sample and hold SINAD signal to noise and distortion ratio SIO special input/output, GPIO with advanced features. See GPIO. SOC start of conversion SOF start of frame SPI Serial Peripheral Interface, a communications protocol SR slew rate SRAM static random access memory SRES software reset SWD serial wire debug, a test protocol SWV single-wire viewer TD transaction descriptor, see also DMA Document Number: 001-93963 Rev. *G WOL write once latch, see also NVL WRES watchdog timer reset XRES external reset I/O pin XTAL crystal Page 39 of 42 PSoC® 4: PSoC 4200M Family Datasheet Document Conventions Units of Measure Table 47. Units of Measure Symbol Unit of Measure °C degrees Celsius dB decibel fF femto farad Hz hertz KB 1024 bytes kbps kilobits per second Khr kilohour kHz kilohertz k kilo ohm ksps kilosamples per second LSB least significant bit Mbps megabits per second MHz megahertz M mega-ohm Msps megasamples per second µA microampere µF microfarad µH microhenry µs microsecond µV microvolt µW microwatt mA milliampere ms millisecond mV millivolt nA nanoampere ns nanosecond nV nanovolt  ohm pF picofarad ppm parts per million ps picosecond s second sps samples per second sqrtHz square root of hertz V volt Document Number: 001-93963 Rev. *G Page 40 of 42 PSoC® 4: PSoC 4200M Family Datasheet Revision History Description Title: PSoC® 4: PSoC 4200M Family Datasheet Programmable System-on-Chip (PSoC®) Document Number: 001-93963 Orig. of Submission Revision ECN Description of Change Change Date *B 4765455 WKA 06/03/2015 Release to web. *C 4815539 WKA 06/29/2015 Removed note regarding hardware handshaking in the UART Mode section. Changed max value of SID51A to 2 ms. Added “Guaranteed by characterization” note for SID65 and SID65A Updated Ordering Information. Removed the Errata section. *D 4828234 WKA 07/08/2015 Corrected Block Diagram *E 4941619 WKA 09/30/2015 Updated CapSense section. Updated the note at the end of the Pinout table. Removed Conditions for spec SID237. Updated Ordering Information. *F 5026805 WKA 11/25/2015 Added Comparator ULP mode range restrictions and corrected typos. *G 5408936 WKA 08/19/2016 Added extended industrial temperature range. Added specs SID290Q, SID182A, and SID299A. Updated conditions for SID290, SID223, and SID237. Added 44-pin TQFP package details. Updated Ordering Information. Document Number: 001-93963 Rev. *G Page 41 of 42 PSoC® 4: PSoC 4200M Family Datasheet Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products ARM® Cortex® Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface Lighting & Power Control Memory cypess.com/clocks cypress.com/interface cypress.com/powerpsoc cypress.com/memory PSoC cypress.com/psoc Touch Sensing PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training Technical Support cypress.com/support cypress.com/touch USB Controllers Wireless/RF cypress.com/psoc cypress.com/usb cypress.com/wireless © Cypress Semiconductor Corporation 2014-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document, including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. 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Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 001-93963 Rev. *G Revised August 19, 2016 Page 42 of 42