CY8C5485PVI-006

PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Programmable System-on-Chip (PSoC®) General Description With its unique array of configurable blocks, PSoC®5 is a true system level solution providing MCU, memory, analog, and digital peripheral functions in a single chip. The CY8C54 family offers a modern method of signal acquisition, signal processing, and control with high accuracy, high bandwidth, and high flexibility. Analog capability spans the range from thermocouples (near DC voltages) to ultrasonic signals. The CY8C54 family can handle dozens of data acquisition channels and analog inputs on every GPIO pin. The CY8C54 family is also a high performance configurable digital system with some part numbers including interfaces such as USB, multi-master I2C, and CAN. In addition to communication interfaces, the CY8C54 family has an easy to configure logic array, flexible routing to all I/O pins, and a high performance 32-bit ARM® Cortex™-M3 microprocessor core. Designers can easily create system level designs using a rich library of prebuilt components and boolean primitives using PSoC® Creator™, a hierarchical schematic design entry tool. The CY8C54 family provides unparalleled opportunities for analog and digital bill of materials integration while easily accommodating last minute design changes through simple firmware updates. Features 32-bit ARM Cortex-M3 CPU core DC to 80 MHz operation Flash program memory, up to 256 KB, 100,000 write cycles, 20 year retention, multiple security features Up to 64 KB SRAM memory 2 KB EEPROM memory, 1 million cycles, 20 years retention 24 channel DMA with multilayer AHB bus access • Programmable chained descriptors and priorities • High bandwidth 32-bit transfer support Low voltage, ultra low power Wide operating voltage range: 0.5V to 5.5V High efficiency boost regulator from 0.5V input to 1.8V to 5.0V output 2 mA at 6 MHz Low power modes including: • 300 nA hibernate mode with RAM retention and LVD • 2 µA sleep mode with real time clock and low voltage reset Versatile I/O system 28 to 72 I/O (62 GPIO, 8 SIO, 2 USBIO[1]) Any GPIO to any digital or analog peripheral routability LCD direct drive from any GPIO, up to 46x16 segments[1] 1.2V to 5.5V I/O interface voltages, up to 4 domains Maskable, independent IRQ on any pin or port Schmitt trigger TTL inputs All GPIO configurable as open drain high/low, pull up/down, High-Z, or strong output Configurable GPIO pin state at power on reset (POR) 25 mA sink on SIO Digital peripherals 20 to 24 programmable PLD based Universal Digital Blocks Full CAN 2.0b 16 RX, 8 TX buffers[1] Full-Speed (FS) USB 2.0 12 Mbps using internal oscillator[1] Four 16-bit configurable timer, counter, and PWM blocks Library of standard peripherals • 8, 16, 24, and 32-bit timers, counters, and PWMs • SPI, UART, I2C • Many others available in catalog Library of advanced peripherals • Cyclic Redundancy Check (CRC) • Pseudo Random Sequence (PRS) generator • LIN Bus 2.0 • Quadrature decoder Analog peripherals (1.71V ≤ Vdda ≤ 5.5V) 1.024V±0.1% internal voltage reference across -40°C to +85°C (14 ppm/°C) Two SAR ADCs, each 12-bit at 1 Msps[1] 80 MHz, 24-bit fixed point digital filter block (DFB) to implement FIR and IIR filters[1] Four 8-bit 8 Msps IDACs or 1 Msps VDACs Four comparators with 75 ns response time Four uncommitted opamps with 25 mA drive capability Four configurable multifunction analog blocks. Example configurations are PGA, TIA. Mixer and Sample and hold Programming, debug, and trace JTAG (4 wire), Serial Wire Debug (SWD) (2 wire), Single Wire Viewer (SWV), and TRACEPORT interfaces Cortex-M3 Flash Patch and Breakpoint (FPB) block Cortex-M3 Embedded Trace Macrocell™ (ETM™) generates an instruction trace stream. Cortex-M3 Data Watchpoint and Trace (DWT) generates data trace information Cortex-M3 Instrumentation Trace Macrocell (ITM) can be used for printf-style debugging DWT, ETM, and ITM blocks communicate with off-chip debug and trace systems via the SWV or TRACEPORT Bootloader programming supportable through I2C, SPI, UART, USB, and other interfaces Precision, programmable clocking 1 to 72 MHz internal ±1% oscillator (over full temperature and voltage range) with PLL 4 to 33 MHz crystal oscillator for crystal PPM accuracy Internal PLL clock generation up to 80 MHz 32.768 kHz watch crystal oscillator Low power internal oscillator at 1 kHz, 100 kHz Temperature and packaging -40°C to +85°C degrees industrial temperature 48-pin SSOP, 68-pin QFN, and 100-pin TQFP package options Note 1. This feature on select devices only. See Ordering Information on page 88 for details. Cypress Semiconductor Corporation Document Number: 001-55036 Rev. *A • 198 Champion Court • San Jose CA 95134-1709 , • 408-943-2600 Revised December 03, 2009 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Content Overview 1. ARCHITECTURAL OVERVIEW ......................................... 3 2. PINOUTS ............................................................................. 5 3. PIN DESCRIPTIONS ........................................................... 9 4. CPU ................................................................................... 10 4.1 ARM Cortex-M3 CPU ............................................... 10 4.2 Cache Controller ...................................................... 12 4.3 DMA and PHUB ....................................................... 12 4.4 Interrupt Controller ................................................... 14 5. MEMORY .......................................................................... 15 5.1 Static RAM ............................................................... 15 5.2 Flash Program Memory ............................................ 15 5.3 Flash Security ........................................................... 15 5.4 EEPROM .................................................................. 16 5.5 External Memory Interface ....................................... 16 5.6 Memory Map ............................................................ 18 6. SYSTEM INTEGRATION .................................................. 19 6.1 Clocking System ....................................................... 19 6.2 Power System .......................................................... 22 6.3 Reset ........................................................................ 25 6.4 I/O System and Routing ........................................... 26 7. DIGITAL SUBSYSTEM ..................................................... 31 7.1 Example Peripherals ................................................ 32 7.2 Universal Digital Block .............................................. 36 7.3 UDB Array Description ............................................. 39 7.4 DSI Routing Interface Description ............................ 40 7.5 CAN .......................................................................... 41 7.6 USB .......................................................................... 43 7.7 Timers, Counters, and PWMs .................................. 44 7.8 I2C ............................................................................ 44 7.9 Digital Filter Block ..................................................... 45 8. ANALOG SUBSYSTEM .................................................... 45 8.1 Analog Routing ......................................................... 46 8.2 Successive Approximation ADCs ............................. 48 8.3 Comparators ............................................................. 48 8.4 Opamps .................................................................... 50 8.5 Programmable SC/CT Blocks .................................. 50 8.6 LCD Direct Drive ...................................................... 51 8.7 CapSense ................................................................. 52 8.8 Temp Sensor ............................................................ 52 8.9 DAC .......................................................................... 52 8.10 Up/Down Mixer ....................................................... 53 8.11 Sample and Hold .................................................... 53 9. PROGRAMMING, DEBUG INTERFACES, RESOURCES ........................................................................ 54 9.1 JTAG Interface ......................................................... 54 9.2 SWD Interface .......................................................... 54 9.3 Debug Features ........................................................ 55 9.4 Trace Features ......................................................... 55 9.5 SWV and TRACEPORT Interfaces .......................... 55 9.6 Programming Features ............................................. 55 9.7 Device Security ........................................................ 55 10. DEVELOPMENT SUPPORT ........................................... 56 10.1 Documentation ....................................................... 56 10.2 Online ..................................................................... 56 10.3 Tools ....................................................................... 56 11. ELECTRICAL SPECIFICATIONS ................................... 57 11.1 Absolute Maximum Ratings .................................... 57 11.2 Device Level Specifications .................................... 58 11.3 Power Regulators ................................................... 60 11.4 Inputs and Outputs ................................................. 61 11.5 Analog Peripherals ................................................. 66 11.6 Digital Peripherals .................................................. 75 11.7 Memory .................................................................. 78 11.8 PSoC System Resources ....................................... 83 11.9 Clocking .................................................................. 85 12. ORDERING INFORMATION ........................................... 88 12.1 Part Numbering Conventions ................................. 89 13. PACKAGING ................................................................... 90 14. REVISION HISTORY ...................................................... 92 15. SALES, SOLUTIONS, AND LEGAL INFORMATION .... 93 Document Number: 001-55036 Rev. *A Page 2 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 1. Architectural Overview Introducing the CY8C54 family of ultra low power, Flash Programmable System-on-Chip (PSoC®) devices, part of a scalable 8-bit PSoC®3 and 32-bit PSoC 5 platform. The CY8C54 family provides configurable blocks of analog, digital, and interconnect circuitry around a CPU subsystem. The combination of a CPU with a very flexible analog subsystem, digital subsystem, routing, and I/O enables a high level of integration in a wide variety of consumer, industrial, and medical applications. Figure 1-1. Simplified Block Diagram Analog Interconnect Digital Interconnect SIO GPIOs SYSTEM WIDE RESOURCES Usage Example for UDB Xtal Osc DIGITAL SYSTEM Universal Digital Block Array (24 x UDB) Sequencer 8- Bit Timer UDB Quadrature Decoder UDB 16- Bit PWM UDB 16- Bit PRS UDB UDB UDB 4- 33 MHz ( Optional ) CAN 2.0 I2C Master / Slave UDB I 2C Slave UDB UDB 8- Bit SPI UDB 12- Bit SPI UDB 8- Bit Timer Logic UDB UDB GPIOs UDB UDB UDB UDB UDB IMO 4x Timer Counter PWM FS USB 2.0 USB PHY D+ D- Clock Tree Logic UDB UART UDB UDB 12- Bit PWM UDB UDB UDB GPIOs 32.768 KHz ( Optional ) RTC Timer SYSTEM BUS MEMORY SYSTEM WDT and Wake GPIOs EEPROM SRAM CPU SYSTEM 8051or Cortex M3 CPU Interrupt Controller Program& Debug Program Debug & Trace GPIOs EMIF ILO FLASH Cache Controller PHUB DMA Boundary Scan Clocking System GPIOs Power Management System SIOs LCD Direct Drive Digital Filter Block ANALOG SYSTEM ADCs 2x SAR ADC + 4x Opamp - POR and LVD Sleep Power 1.71 to 5.5V 1.8V LDO SMP 4 x SC/ CT Blocks (TIA, PGA, Mixer etc ) 3 per Opamp Temperature Sensor CapSense + GPIOs 4 x DAC 4x CMP - 0. 5 to 5.5V ( Optional ) Document Number: 001-55036 Rev. *A Page 3 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 1-1 illustrates the major components of the CY8C54 family. They are: ARM Cortex-M3 CPU Subsystem Nonvolatile Subsystem Programming, Debug, and Test Subsystem Inputs and Outputs Clocking Power Digital Subsystem Analog Subsystem PSoC’s digital subsystem provides half of its unique configurability. It connects a digital signal from any peripheral to any pin through the Digital System Interconnect (DSI). It also provides functional flexibility through an array of small, fast, low power Universal Digital Blocks (UDBs). PSoC Creator provides a library of pre-built and tested standard digital peripherals (UART, SPI, LIN, PRS, CRC, timer, counter, PWM, AND, OR, and so on) that are mapped to the UDB array. The designer can also easily create a digital circuit using boolean primitives by means of graphical design entry. Each UDB contains Programmable Array Logic (PAL)/Programmable Logic Device (PLD) functionality, together with a small state machine engine to support a wide variety of peripherals. In addition to the flexibility of the UDB array, PSoC also provides configurable digital blocks targeted at specific functions. For the CY8C54 family these blocks can include four 16-bit timer, counter, and PWM blocks; I2C slave, master, and multi-master; Full-Speed USB; and Full CAN 2.0b. For more details on the peripherals see the “Example Peripherals” section on page 32 of this data sheet. For information on UDBs, DSI, and other digital blocks, see the “Digital Subsystem” section on page 32 of this data sheet. PSoC’s analog subsystem is the second half of its unique configurability. All analog performance is based on a highly accurate absolute voltage reference with less than 0.1% error over temperature and voltage. The configurable analog subsystem includes: Analog muxes Comparators Analog mixers Voltage references Analog-to-Digital Converters (ADCs) Digital-to-Analog Converters (DACs) Digital Filter Block (DFB) All GPIO pins can route analog signals into and out of the device using the internal analog bus. This allows the device to interface up to 62 discrete analog signals. The CY8C54 family offers two Successive Approximation Register (SAR) ADCs. Featuring 12-bit conversions at up to 1M samples per second, they also offer low nonlinearity and offset errors and SNR better than 70 dB. They are well suited for a variety of higher speed analog applications. The output of either ADC can optionally feed the programmable DFB via Direct Memory Access (DMA) without CPU intervention. The designer can configure the DFB to perform IIR and FIR digital filters and several user defined custom functions. The DFB can implement filters with up to 64 taps. It can perform a 48-bit multiply-accumulate (MAC) operation in one clock cycle. Four high speed voltage or current DACs support 8-bit output signals at waveform frequencies of up to 8 MHz. They can be routed out of any GPIO pin. You can create higher resolution voltage DAC outputs using the UDB array. This can be used to create a pulse width modulated (PWM) DAC of up to 10 bits, at up to 48 kHz. The digital DACs in each UDB support PWM, PRS, or delta-sigma algorithms with programmable widths. In addition to the ADCs, DACs, and DFB, the analog subsystem provides multiple: Comparators Uncommitted opamps Configurable Switched Capacitor/Continuous Time (SC/CT) blocks. These support: Transimpedance amplifiers Programmable gain amplifiers Mixers Other similar analog components See the “Analog Subsystem” section on page 45 of this data sheet for more details. PSoC’s CPU subsystem is built around a 32-bit three-stage pipelined ARM Cortex-M3 processor running at up to 80 MHz. The Cortex-M3 includes a tightly integrated nested vectored interrupt controller (NVIC) and various debug and trace modules. The overall CPU subsystem includes a DMA controller, Flash cache, and RAM. The NVIC provides low latency, nested interrupts, and tail-chaining of interrupts and other features to increase the efficiency of interrupt handling. The DMA controller enables peripherals to exchange data without CPU involvement. This allows the CPU to run slower (saving power) or use those CPU cycles to improve the performance of firmware algorithms. The Flash cache also reduces system power consumption by allowing less frequent Flash access. PSoC’s nonvolatile subsystem consists of Flash, byte-writeable EEPROM, and nonvolatile configuration options. It provides up to 256 KB of on-chip Flash. The CPU can reprogram individual blocks of Flash, enabling boot loaders. The designer can enable an Error Correcting Code (ECC) for high reliability applications. A powerful and flexible protection model secures the user's sensitive information, allowing selective memory block locking for read and write protection. Two KB of byte-writable EEPROM is available on-chip to store application data. Additionally, selected configuration options such as boot speed and pin drive mode are stored in nonvolatile memory. This allows settings to activate immediately after power on reset (POR). The three types of PSoC I/O are extremely flexible. All I/Os have many drive modes that are set at POR. PSoC also provides up to four I/O voltage domains through the Vddio pins. Every GPIO has analog I/O, LCD drive, flexible interrupt generation, slew rate control, and digital I/O capability. The SIOs on PSoC allow Voh to be set independently of Vddio when used as outputs. When Page 4 of 93 Document Number: 001-55036 Rev. *A [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet SIOs are in input mode they are high impedance. This is true even when the device is not powered or when the pin voltage goes above the supply voltage. This makes the SIO ideally suited for use on an I2C bus where the PSoC may not be powered when other devices on the bus are. The SIO pins also have high current sink capability for applications such as LED drives. The programmable input threshold feature of the SIO can be used to make the SIO function as a general purpose analog comparator. For devices with Full-Speed USB the USB physical interface is also provided (USBIO). When not using USB these pins may also be used for limited digital functionality and device programming. All the features of the PSoC I/Os are covered in detail in the “I/O System and Routing” section on page 26 of this data sheet. The PSoC device incorporates flexible internal clock generators, designed for high stability, and factory trimmed for absolute accuracy. The Internal Main Oscillator (IMO) is the master clock base for the system with 1% absolute accuracy at 3 MHz. The IMO can be configured to run from 3 MHz up to 72 MHz. Multiple clock derivatives can be generated from the main clock frequency to meet application needs. The device provides a PLL to generate system clock frequencies up to 79 MHz (80 MHz including +1% tolerance) from the IMO, external crystal, or external reference clock. It also contains a separate, very low power Internal Low Speed Oscillator (ILO) for the sleep and watchdog timers. A 32.768 kHz external watch crystal is also supported for use in Real Time Clock (RTC) applications. The clocks, together with programmable clock dividers, provide the flexibility to integrate most timing requirements. The CY8C54 family supports a wide supply operating range from 1.71 to 5.5V. This allows operation from regulated supplies such as 1.8 ± 5%, 2.5V ±10%, 3.3V ± 10%, or 5.0V ± 10%, or directly from a wide range of battery types. In addition, it provides an integrated high efficiency synchronous boost converter that can power the device from supply voltages as low as 0.5V. This enables the device to be powered directly from a single battery or solar cell. In addition, the designer can use the boost converter to generate other voltages required by the device, such as a 3.3V supply for LCD glass drive. The boost’s output is available on the Vboost pin, allowing other devices in the application to be powered from the PSoC. PSoC supports a wide range of low power modes. These include a 300 nA hibernate mode with RAM retention and a 2 µA sleep mode with real time clock (RTC). In the second mode the optional 32.768 kHz watch crystal runs continuously and maintains an accurate RTC. Power to all major functional blocks, including the programmable digital and analog peripherals, can be controlled independently by firmware. This allows low power background processing when some peripherals are not in use. This, in turn, provides a total device current of only 2 mA when the CPU is running at 6 MHz. The details of the PSoC power modes are covered in the “Power System” section on page 22 of this data sheet. PSoC uses JTAG (4 wire) or Serial Wire Debug (SWD) (2 wire) interfaces for programming, debug, and test. Using these standard interfaces enables the designer to debug or program the PSoC with a variety of hardware solutions from Cypress or third party vendors. The Cortex-M3 debug and trace modules include Flash Patch and Breakpoint (FPB), Data Watchpoint and Trace (DWT), Embedded Trace Macrocell (ETM), and Instrumentation Trace Macrocell (ITM). These modules have many features to help solve difficult debug and trace problems. Details of the programming, test, and debugging interfaces are discussed in the “Programming, Debug Interfaces, Resources” section on page 54 of this data sheet. 2. Pinouts The Vddio pin that supplies a particular set of pins is indicated by the black lines drawn on the pinout diagrams in Figure 2-1 through Figure 2-3. Using the Vddio pins, a single PSoC can support multiple interface voltage levels, eliminating the need for off-chip level shifters. Each Vddio may sink up to 100 mA total to its associated I/O pins and opamps. On the 68 pin and 100 pin devices each set of Vddio associated pins may sink up to 100 mA. The 48 pin device may sink up to 100 mA total for all Vddio0 plus Vddio2 associated I/O pins and 100 mA total for all Vddio1 plus Vddio3 associated I/O pins. Document Number: 001-55036 Rev. *A Page 5 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet [2] Figure 2-1. 48-Pin SSOP Part Pinout (SIO) P12[2] (SIO) P12[3] (OpAmp2out, GPIO) P0[0] (OpAmp0out, GPIO) P0[1] (OpAmp0+, GPIO) P0[2] (OpAmp0-/Extref0, GPIO) P0[3] Vddio0 (OpAmp2+, GPIO) P0[4] (OpAmp2-, GPIO) P0[5] (IDAC0, GPIO) P0[6] (IDAC2, GPIO) P0[7] Vccd Vssd Vddd (TRACECLK, GPIO) P2[3] (TRACEDATA[0], GPIO) P2[4] Vddio2 (TRACEDATA[1], GPIO) P2[5] (TRACEDATA[2], GPIO) P2[6] (TRACEDATA[3], GPIO) P2[7] Vssb Ind Vboost Vbat 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 Lines show Vddio to I/O supply association SSOP Vdda Vssa Vcca P15[3] (GPIO, kHz XTAL: Xi) P15[2] (GPIO, kHz XTAL: Xo) P12[1] (SIO, I2C1: SDA) P12[0] (SIO, I2C1: SCL) Vddio3 P15[1] (GPIO, MHz XTAL: Xi) P15[0] (GPIO, MHz XTAL: Xo) Vccd Vssd Vddd [2] P15[7] (USBIO, D-, SWDCK) [2] P15[6] (USBIO, D+, SWDIO) P1[7] (GPIO) P1[6] (GPIO) Vddio1 P1[5] (GPIO, nTRST) P1[4] (GPIO, TDI) P1[3] (GPIO, TDO, SWV) P1[2] (GPIO, configurable XRES) P1[1] (GPIO, TCK, SWDCK) P1[0] (GPIO, TMS, SWDIO) Figure 2-2. 68-Pin QFN Part Pinout[3] P2[5] (GPIO, TRACEDATA[1]) Vddio2 P2[4] (GPIO, TRACEDATA[0]) P2[3] (GPIO, TRACECLK) P0[5] (GPIO, OpAmp2-) P0[4] (GPIO, OpAmp2+) Vddio0 53 52 68 67 66 65 64 63 62 61 60 59 58 57 56 (TRACEDATA[2], GPIO) P2[6] (TRACEDATA[3], GPIO) P2[7] (I2C0: SCL, SIO) P12[4] (I2C0: SDA, SIO) P12[5] Vssb Ind Vboost Vbat Vssd XRES (TMS, SWDIO, GPIO) P1[0] (TCK, SWDCK, GPIO) P1[1] (configurable XRES, GPIO) P1[2] (TDO, SWV, GPIO) P1[3] (TDI, GPIO) P1[4] (nTRST, GPIO) P1[5] Vddio1 55 54 P0[7] (GPIO, IDAC2) P0[6] (GPIO, IDAC0) P15[5] (GPOI) P15[4] (GPIO) Vddd Vssd Vccd P2[2] (GPIO) P2[1] (GPIO) P2[0] (GPIO) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 51 50 Lines show Vddio to IO supply association 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 31 32 33 34 QFN (Top View) P0[3] (GPIO, OpAmp0-/Extref0) P0[2] (GPIO, OpAmp0+) P0[1] (GPIO, OpAmp0out) P0[0] (GPIO, OpAmp2out) P12[3] (SIO) P12[2] (SIO) Vssd Vdda Vssa Vcca P15[3] (GPIO, kHz XTAL: Xi) P15[2] (GPIO, kHz XTAL: Xo) P12[1] (SIO, I2C1: SDA) P12[0] (SIO, 12C1: SCL) P3[7] (GPIO, OpAmp3out) P3[6] (GPIO, OpAmp1out) Vddio3 18 19 20 21 22 23 24 25 26 27 Vddd Vssd Vccd (MHz XTAL: Xo, GPIO) P15[0] (GPIO) P1[7] (SIO) P12[6] (SIO) P12[7] [2] (USBIO, D+, SWDIO) P15[6] [2] (USBIO, D-, SWDCK) P15[7] (MHz XTAL: Xi, GPIO) P15[1] (IDAC1, GPIO) P3[0] (IDAC3, GPIO) P3[1] (OpAmp3-/Extref1, GPIO) P3[2] 28 29 30 (OpAmp3+, GPIO) P3[3] (OpAmp1-, GPIO) P3[4] Notes 2. Pins are No Connect (NC) on devices without USB. NC means that the pin has no electrical connection. The pin can be left floating or tied to a supply voltage or ground. 3. The center pad on the QFN package should be connected to digital ground (Vssd) for best mechanical, thermal, and electrical performance. If not connected to ground, it should be electrically floated and not connected to any other signal. Document Number: 001-55036 Rev. *A Page 6 of 93 (OpAmp1+, GPIO) P3[5] (GPIO) P1[6] [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 2-3. 100-Pin TQFP Part Pinout P2[4] (GPIO, TRACEDATA[0]) P2[3] (GPIO, TRACECLK]) P2[2] (GPIO) P0[6] (GPIO, IDAC0) P0[5] (GPIO, OpAmp2-) P0[4] (GPIO, OpAmp2+) 77 76 75 74 Lines show Vddio to IO supply association 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 (OpAmp1+, GPIO) P3[5] Vddio3 49 50 Vddio0 P0[3] (GPIO, OpAmp0-/Extref0) P0[2] (GPIO, OpAmp0+) P0[1] (GPIO, OpAmp0out) P0[0] (GPIO, OpAmp2out) P4[1] (GPIO) P4[0] (GPIO) P12[3] (SIO) P12[2] (SIO) Vssd Vdda Vssa Vcca NC NC NC NC NC NC P15[3] (GPIO, kHz XTAL: Xi) P15[2] (GPIO, kHz XTAL: Xo) P12[1] (SIO, I2C1: SDA) P12[0] (SIO, I2C1: SCL) P3[7] (GPIO, OpAmp3out) P3[6] (GPIO, OpAmp1out) 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 46 (TRACEDATA[1], GPIO) P2[5] (TRACEDATA[2], GPIO) P2[6] (TRACEDATA[3], GPIO) P2[7] (I2C0: SCL, SIO) P12[4] (I2C0: SDA, SIO) P12[5] (GPIO) P6[4] (GPIO) P6[5] (GPIO) P6[6] (GPIO) P6[7] Vssb Ind Vboost Vbat Vssd XRES (GPIO) P5[0] (GPIO) P5[1] (GPIO) P5[2] (GPIO) P5[3] (TMS, SWDIO, GPIO) P1[0] (TCK, SWDCK, GPIO) P1[1] (configurable XRES, GPIO) P1[2] (TDO, SWV, GPIO) P1[3] (TDI, GPIO) P1[4] (nTRST, GPIO) P1[5] 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 (GPIO) P5[5] (GPIO) P5[6] (GPIO) P5[7] [2] (USBIO, D+, SWDIO) P15[6] [2] (USBIO, D-, SWDCK) P15[7] (MHz XTAL: Xo, GPIO) P15[0] (MHz XTAL: Xi, GPIO) P15[1] (GPIO) P1[6] (GPIO) P1[7] (SIO) P12[6] (SIO) P12[7] (GPIO) P5[4] Document Number: 001-55036 Rev. *A (IDAC1, GPIO) P3[0] (IDAC3, GPIO) P3[1] (OpAmp3-/Extref1, GPIO) P3[2] (OpAmp3+, GPIO) P3[3] (OpAmp1-, GPIO) P3[4] Vddio1 Vddd Vssd Vccd NC NC 47 48 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 TQFP 79 78 P4[5] (GPIO) P4[4] (GPIO) P4[3] (GPIO) P4[2] (GPIO) P0[7] (GPIO, IDAC2) P2[1] (GPIO) P2[0] (GPIO) P15[5] (GPIO) P15[4] (GPIO) P6[3] (GPIO) P6[2] (GPIO) P6[1] (GPIO) P6[0] (GPIO) Vccd P4[7] (GPIO) P4[6] (GPIO) Vddio2 Vddd Vssd Page 7 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 2-4 and Figure 2-5 show an example schematic and an example PCB layout, for the 100-pin TQFP part, for optimal analog performance on a 2-layer board. The two pins labeled Vddd must be connected together. The two pins labeled Vccd must be connected together, and have capacitors connected between them as shown in Figure 2-4 and Power System on page 22. The trace between the two Vccd pins should be as short as possible. The two pins labeled Vssd must be connected together. Figure 2-4. Example Schematic for 100-Pin TQFP Part with Power Connections Vddd Vddd Vccd Vddd Vddd C1 1uF C2 0.1uF C3 0.1uF C6 0.1uF Vssd Vssd Vddd Vssd Vssd Vssd U2 CY8C55xx Vddio2 P2[4] P2[3] P2[2] P2[1] P2[0] P15[5] P15[4] P6[3] P6[2] P6[1] P6[0] Vddd Vssd Vccd P4[7] P4[6] P4[5] P4[4] P4[3] P4[2] IDAC2, P0[7] IDAC0, P0[6] OA2-, P0[5] OA2+, P0[4] 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 Vdda Vddd 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 C8 0.1uF C13 1uF Vddd Vssd Vssd 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Vddd Vddio1 P1[6] P1[7] P12[6], SIO P12[7], SIO P5[4] P5[5] P5[6] P5[7] USB D+, P15[6] USB D-, P15[7] Vddd Vssd Vccd NC NC P15[0], MHzXout P15[1], MHzXin P3[0], IDAC1 P3[1], IDAC3 P3[2], OA3-, REF1 P3[3], OA3+ P3[4], OA1P3[5], OA1+ Vddio3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 P2[5] P2[6] P2[7] P12[4], SIO P12[5], SIO P6[4] P6[5] P6[6] P6[7] Vssb Ind Vboost Vbat Vssd XRES P5[0] P5[1] P5[2] P5[3] P1[0], SWIO, TMS P1[1], SWDIO, TCK P1[2] P1[3], SWV, TDO P1[4], TDI P1[5], nTRST Vddio0 OA0-, REF0, P0[3] OA0+, P0[2] OA0out, P0[1] OA2out, P0[0] P4[1] P4[0] SIO, P12[3] SIO, P12[2] Vssd Vdda Vssa Vcca NC NC NC NC NC NC kHzXin, P15[3] kHzXout, P15[2] SIO, P12[1] SIO, P12[0] OA3out, P3[7] OA1out, P3[6] Vssd Vssa Vssd Vssd Vdda Vssa Vcca C9 1uF Vdda C10 0.1uF Vssa Vddd C11 0.1uF C12 0.1uF Vssd C16 0.1uF Vssd Vssd Vccd Vddd Vssd C15 1uF Document Number: 001-55036 Rev. *A Page 8 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 2-5. Example PCB Layout for 100-Pin TQFP Part for Optimal Analog Performance VSSA VDDD VSSD VDDA VSSD Plane VSSA Plane 3. Pin Descriptions IDAC0, IDAC1, IDAC2, IDAC3. Low resistance output pin for high current DACs (IDAC). OpAmp0out, OpAmp1out, OpAmp2out, OpAmp3out. High current output of uncommitted opamp[4]. Extref0, Extref1. External reference input to the analog system. OpAmp0-, OpAmp1-, OpAmp2-, OpAmp3-. Inverting input to uncommitted opamp. OpAmp0+, OpAmp1+, OpAmp2+, OpAmp3+. Noninverting input to uncommitted opamp. GPIO. General purpose I/O pin provides interfaces to the CPU, digital peripherals, analog peripherals, interrupts, LCD segment drive, and CapSense®[4]. I2C0: SCL, I2C1: SCL. I2C SCL line providing wake from sleep on an address match. Any I/O pin can be used for I2C SCL if wake from sleep is not required. I2C0: SDA, I2C1: SDA. I C SDA line providing wake from sleep on an address match. Any I/O pin can be used for I2C SDA if wake from sleep is not required. Ind. Inductor connection to boost pump. kHz XTAL: Xo, kHz XTAL: Xi. 32.768 kHz crystal oscillator pin. MHz XTAL: Xo, MHz XTAL: Xi. 4 to 33 MHz crystal oscillator pin. nTRST. Optional JTAG Test Reset programming and debug port connection to reset the JTAG connection. SIO. Special I/O provides interfaces to the CPU, digital peripherals and interrupts with a programmable high threshold voltage, Note 4. GPIOs with OpAmp outputs are not recommended for use with CapSense. analog comparator, high sink current, and high impedance state when the device is unpowered. SWDCK. Serial Wire Debug Clock programming and debug port connection. SWDIO. Serial Wire Debug Input and Output programming and debug port connection. TCK. JTAG Test Clock programming and debug port connection. TDI. JTAG Test Data In programming and debug port connection. TDO. JTAG Test Data Out programming and debug port connection. TMS. JTAG Test Mode Select programming and debug port connection. TRACECLK. Cortex-M3 TRACEDATA pins. TRACEPORT connection, clocks 2 TRACEDATA[3:0]. Cortex-M3 output data. SWV. Single Wire Viewer output. TRACEPORT connections, USBIO, D+. Provides D+ connection directly to a USB 2.0 bus. May be used as a digital I/O pin; it is powered from Vddd instead of from a Vddio. Pins are No Connect (NC) on devices without USB.[2] USBIO, D-. Provides D- connection directly to a USB 2.0 bus. May be used as a digital I/O pin; it is powered from Vddd instead of from a Vddio. Pins are No Connect (NC) on devices without USB.[2] Vboost. Power sense connection to boost pump. Vbat. Battery supply to boost pump. Document Number: 001-55036 Rev. *A Page 9 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Vcca. Output of analog core regulator and input to analog core. Requires a 1 µF capacitor to Vssa. Regulator output not for external use. Vccd. Output of digital core regulator and input to digital core. Requires a capacitor from each Vccd pin to Vssd; see Power System on page 22. Regulator output not for external use. Vdda. Supply for all analog peripherals and analog core regulator. Vdda must be the highest voltage present on the device. All other supply pins must be less than or equal to Vdda. Vddd. Supply for all digital peripherals and digital core regulator. Vddd must be less than or equal to Vdda. Vssa. Ground for all analog peripherals. Vssb. Ground connection for boost pump. Vssd. Ground for all digital logic and I/O pins. Vddio0, Vddio1, Vddio2, Vddio3. Supply for I/O pins. See pinouts for specific I/O pin to Vddio mapping. Vddio must be less than or equal to Vdda. XRES (and configurable XRES). External reset pin. Active low with internal pullup. In 48-pin SSOP parts, P1[2] is configured as XRES. In all other parts the pin is configured as a GPIO. 4. CPU 4.1 ARM Cortex-M3 CPU The CY8C54 family of devices has an ARM Cortex-M3 CPU core. The Cortex-M3 is a low power 32-bit three-stage pipelined Harvard architecture CPU that delivers 1.25 DMIPS/MHz. It is intended for deeply embedded applications that require fast interrupt handling features. Figure 4-1. ARM Cortex-M3 Block Diagram Interrupt Inputs Nested Vectored Interrupt Controller (NVIC) Cortex M3 CPU Core Data Watchpoint and Trace (DWT) Embedded Trace Module (ETM) I- Bus JTAG/SWD D-Bus S-Bus Instrumentation Trace Module (ITM) Trace Port 5 for TRACEPORT or Interface Unit 1 for SWV mode (TPIU) Trace Pins: Debug Block (Serial and JTAG) C-Bus AHB AHB Flash Patch and Breakpoint (FPB) Cortex M3 Wrapper 32 KB SRAM Bus Matrix Bus Matrix Cache 256 KB ECC Flash AHB 32 KB SRAM Bus Matrix AHB Bridge & Bus Matrix PHUB DMA AHB Spokes GPIO & EMIF Prog. Digital Prog. Analog Special Functions Peripherals Document Number: 001-55036 Rev. *A Page 10 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet The Cortex-M3 CPU subsystem includes these features: ARM Cortex-M3 CPU Programmable Nested Vectored Interrupt Controller (NVIC), tightly integrated with the CPU core Full featured debug and trace modules, tightly integrated with the CPU core Up to 256 KB of Flash memory, 2 KB of EEPROM, and 64 KB of SRAM Cache controller Peripheral HUB (PHUB) DMA controller External Memory Interface (EMIF) 4.1.1 Cortex-M3 Features The Cortex-M3 CPU features include: 4 GB address space. Predefined address regions for code, data, and peripherals. Multiple buses for efficient and simultaneous accesses of instructions, data, and peripherals. The Thumb®-2 instruction set, which offers ARM-level performance at Thumb-level code density. This includes 16-bit and 32-bit instructions. Advanced instructions include: Bit-field control Hardware multiply and divide Saturation If-Then Wait for events and interrupts Exclusive access and barrier Special register access The Cortex-M3 does not support ARM instructions. Bit-band support. Atomic bit-level write and read operations. Unaligned data storage and access. Contiguous storage of data of different byte lengths. Operation at two privilege levels (privileged and user) and in two modes (thread and handler). Some instructions can only be executed at the privileged level. There are also two stack pointers: Main (MSP) and Process (PSP). These features support a multitasking operating system running one or more user-level processes. Extensive interrupt and system exception support. 4.1.2 Cortex-M3 Operating Modes The Cortex-M3 operates at either the privileged level or the user level, and in either the thread mode or the handler mode. Because the handler mode is only enabled at the privileged level, there are actually only three states, as shown in Table 4-1. Table 4-1. Operational Level Condition Privileged User At the user level, access to certain instructions, special registers, configuration registers, and debugging components is blocked. Attempts to access them cause a fault exception. At the privileged level, access to all instructions and registers is allowed. The processor runs in the handler mode (always at the privileged level) when handling an exception, and in the thread mode when not. 4.1.3 CPU Registers The Cortex-M3 CPU registers are listed in Table 4-2. Registers R0-R15 are all 32 bits wide. Table 4-2. Cortex M3 CPU Registers Register R0-R12 Description General purpose registers R0-R12 have no special architecturally defined uses. Most instructions that specify a general purpose register specify R0-R12. Low Registers: Registers R0-R7 are accessible by all instructions that specify a general purpose register. High Registers: Registers R8-R12 are accessible by all 32-bit instructions that specify a general purpose register; they are not accessible by all 16-bit instructions. R13 is the stack pointer register. It is a banked register that switches between two 32-bit stack pointers: the Main Stack Pointer (MSP) and the Process Stack Pointer (PSP). The PSP is used only when the CPU operates at the user level in thread mode. The MSP is used in all other privilege levels and modes. Bits[0:1] of the SP are ignored and considered to be 0, so the SP is always aligned to a word (4 byte) boundary. R14 is the Link Register (LR). The LR stores the return address when a subroutine is called. R15 is the Program Counter (PC). Bit 0 of the PC is ignored and considered to be 0, so instructions are always aligned to a half word (2 byte) boundary. The Program status registers are divided into three status registers, which are accessed either together or separately: Application Program Status Register (APSR) holds program execution status bits such as zero, carry, negative, in bits[27:31]. Interrupt Program Status Register (IPSR) holds the current exception number in bits[0:8]. Execution Program Status Register (EPSR) holds control bits for interrupt continuable and IF-THEN instructions in bits[10:15] and [25:26]. Bit 24 is always set to 1 to indicate Thumb mode. Trying to clear it causes a fault exception. R13 R14 R15 xPSR Running an exception Handler mode Running main program Thread mode Not used Thread mode Document Number: 001-55036 Rev. *A Page 11 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Table 4-2. Cortex M3 CPU Registers (continued) Description A 1-bit interrupt mask register. When set, it allows only the nonmaskable interrupt (NMI) and hard fault exception. All other exceptions and interrupts are masked. FAULTMASK A 1-bit interrupt mask register. When set, it allows only the NMI. All other exceptions and interrupts are masked. BASEPRI A register of up to nine bits that define the masking priority level. When set, it disables all interrupts of the same or higher priority value. If set to 0 then the masking function is disabled. CONTROL A 2-bit register for controlling the operating mode. Bit 0: 0 = privileged level in thread mode, 1 = user level in thread mode. Bit 1: 0 = default stack (MSP) is used, 1 = alternate stack is used. If in thread mode or user level then the alternate stack is the PSP. There is no alternate stack for handler mode; the bit must be 0 while in handler mode. Register PRIMASK Table 4-3. PHUB Spokes and Peripherals PHUB Spokes Peripherals 0 1 2 SRAM IOs, PICU, EMIF PHUB local configuration, Power manager, Clocks, IC, SWV, EEPROM, Flash programming interface Analog interface and trim, Decimator USB, CAN, I2C, Timers, Counters, and PWMs DFB UDBs group 1 UDBs group 2 3 4 5 6 7 4.3.2 DMA Features 24 DMA channels Each channel has one or more Transaction Descriptors (TDs) to configure channel behavior. Up to 128 total TDs can be defined TDs can be dynamically updated Eight levels of priority per channel Any digitally routable signal, the CPU, or another DMA channel, can trigger a transaction Each channel can generate up to two interrupts per transfer Transactions can be stalled or canceled Supports transaction size of infinite or 1 to 64k bytes Large transactions may be broken into smaller bursts of 1 to 127 bytes TDs may be nested and/or chained for complex transactions 4.3.3 Priority Levels The CPU always has higher priority than the DMA controller when their accesses require the same bus resources. Due to the system architecture, the CPU can never starve the DMA. DMA channels of higher priority (lower priority number) may interrupt current DMA transfers. In the case of an interrupt, the current transfer is allowed to complete its current transaction. To ensure latency limits when multiple DMA accesses are requested simultaneously, a fairness algorithm guarantees an interleaved minimum percentage of bus bandwidth for priority levels 2 through 7. Priority levels 0 and 1 do not take part in the fairness algorithm and may use 100% of the bus bandwidth. If a tie occurs on two DMA requests of the same priority level, a simple round robin method is used to evenly share the allocated bandwidth. The round robin allocation can be disabled for each DMA channel, allowing it to always be at the head of the line. Priority levels 2 to 7 are guaranteed the minimum bus bandwidth shown in Table 4-4 after the CPU and DMA priority levels 0 and 1 have satisfied their requirements. When the fairness algorithm is disabled, DMA access is granted based solely on the priority level; no bus bandwidth guarantees are made. 4.2 Cache Controller The CY8C54 family adds an instruction cache between the CPU and the Flash memory. This guarantees a faster instruction execution rate. The Flash cache also reduces system power consumption by requiring less frequent Flash access. 4.3 DMA and PHUB The PHUB and the DMA controller are responsible for data transfer between the CPU and peripherals, and also data transfers between peripherals. The PHUB and DMA also control device configuration during boot. The PHUB consists of: A central hub that includes the DMA controller, arbiter, and router Multiple spokes that radiate outward from the hub to most peripherals There are two PHUB masters: the CPU and the DMA controller. Both masters may initiate transactions on the bus. The DMA channels can handle peripheral communication without CPU intervention. The arbiter in the central hub determines which DMA channel is the highest priority if there are multiple requests. 4.3.1 PHUB Features CPU and DMA controller are both bus masters to the PHUB Eight Multi-layer AHB Bus parallel access paths (spokes) for peripheral access Simultaneous CPU and DMA access to peripherals located on different spokes Simultaneous DMA source and destination burst transactions on different spokes Supports 8, 16, 24, and 32-bit addressing and data Document Number: 001-55036 Rev. *A Page 12 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Table 4-4. Priority Levels Priority Level % Bus Bandwidth 0 1 2 3 4 5 6 7 100.0 100.0 50.0 25.0 12.5 6.2 3.1 1.5 the peripheral and writes that value into a subsequent TD in the chain. This modifies the TD chain on the fly. When the “address fetch” TD completes it moves on to the next TD, which has the new address information embedded in it. This TD then carries out the data transfer with the address location required by the external master. 4.3.4.6 Scatter Gather DMA In the case of scatter gather DMA, there are multiple noncontiguous sources or destinations that are required to effectively carry out an overall DMA transaction. For example, a packet may need to be transmitted off of the device and the packet elements, including the header, payload, and trailer, exist in various noncontiguous locations in memory. Scatter gather DMA allows the segments to be concatenated together by using multiple TDs in a chain. The chain gathers the data from the multiple locations. A similar concept applies for the reception of data onto the device. Certain parts of the received data may need to be scattered to various locations in memory for software processing convenience. Each TD in the chain specifies the location for each discrete element in the chain. 4.3.4.7 Packet Queuing DMA Packet queuing DMA is similar to scatter gather DMA but specifically refers to packet protocols. With these protocols, there may be separate configuration, data, and status phases associated with sending or receiving a packet. For instance, to transmit a packet, a memory mapped configuration register can be written inside a peripheral, specifying the overall length of the ensuing data phase. The CPU can set up this configuration information anywhere in system memory and copy it with a simple TD to the peripheral. After the configuration phase, a data phase TD (or a series of data phase TDs) can begin (potentially using scatter gather). When the data phase TD(s) finish, a status phase TD can be invoked that reads some memory mapped status information from the peripheral and copies it to a location in system memory specified by the CPU for later inspection. Multiple sets of configuration, data, and status phase “subchains” can be strung together to create larger chains that transmit multiple packets in this way. A similar concept exists in the opposite direction to receive the packets. 4.3.4.8 Nested DMA One TD may modify another TD, as the TD configuration space is memory mapped similar to any other peripheral. For example, a first TD loads a second TD’s configuration and then calls the second TD. The second TD moves data as required by the application. When complete, the second TD calls the first TD, which again updates the second TD’s configuration. This process repeats as often as necessary. 4.3.4 Transaction Modes Supported The flexible configuration of each DMA channel and the ability to chain multiple channels allow the creation of both simple and complex use cases. General use cases include, but are not limited to: 4.3.4.1 Simple DMA In a simple DMA case, a single TD transfers data between a source and sink (peripherals or memory location). 4.3.4.2 Auto Repeat DMA Auto repeat DMA is typically used when a static pattern is repetitively read from system memory and written to a peripheral. This is done with a single TD that chains to itself. 4.3.4.3 Ping Pong DMA A ping pong DMA case uses double buffering to allow one buffer to be filled by one client while another client is consuming the data previously received in the other buffer. In its simplest form, this is done by chaining two TDs together so that each TD calls the opposite TD when complete. 4.3.4.4 Circular DMA Circular DMA is similar to ping pong DMA except it contains more than two buffers. In this case there are multiple TDs; after the last TD is complete it chains back to the first TD. 4.3.4.5 Indexed DMA In an indexed DMA case, an external master requires access to locations on the system bus as if those locations were shared memory. As an example, a peripheral may be configured as an SPI or I2C slave where an address is received by the external master. That address becomes an index or offset into the internal system bus memory space. This is accomplished with an initial “address fetch” TD that reads the target address location from Document Number: 001-55036 Rev. *A Page 13 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 4.4 Interrupt Controller The Cortex-M3 NVIC supports 16 system exceptions and 32 interrupts from peripherals, as shown in Table 4-5. Table 4-5. Cortex-M3 Exceptions and Interrupts Exception Number Exception Type Priority Exception Table Address Offset 0x00 0x04 0x08 0x0C Function 1 2 3 Reset NMI Hard fault -3 (highest) -2 -1 4 5 6 7 – 10 11 12 13 14 15 16 – 47 MemManage Bus fault Usage fault SVC Debug monitor PendSV SYSTICK IRQ Programmable Programmable Programmable Programmable Programmable Programmable Programmable Programmable 0x10 0x14 0x18 0x1C – 0x28 0x2C 0x30 0x34 0x38 0x3C 0x40 – 0x3FC Starting value of R13 / MSP Reset Non maskable interrupt All classes of fault, when the corresponding fault handler cannot be activated because it is currently disabled or masked Memory management fault, for example, instruction fetch from a nonexecutable region Error response received from the bus system; caused by an instruction prefetch abort or data access error Typically caused by invalid instructions or trying to switch to ARM mode Reserved System service call via SVC instruction Debug monitor Reserved Deferred request for system service System tick timer Peripheral interrupt request #0 - #31 Bit 0 of each exception vector indicates whether the exception is executed using ARM or Thumb instructions. Because the Cortex-M3 only supports Thumb instructions, this bit must always be 1. The Cortex-M3 non maskable interrupt (NMI) input can be routed to any pin, via the DSI, or disconnected from all pins. See “DSI Routing Interface Description” section on page 40. The Nested Vectored Interrupt Controller (NVIC) handles interrupts from the peripherals, and passes the interrupt vectors to the CPU. It is closely integrated with the CPU for low latency interrupt handling. Features include: 32 interrupts. Multiple sources for each interrupt. Configurable number of priority levels: from 3 to 8. Dynamic reprioritization of interrupts. Priority Grouping. This allows selection of preempting and non preempting interrupt levels. Table 4-6. Interrupt Vector Table Interrupt # 0 1 2 3 4 5 Cortex-M3 Exception # 16 17 18 19 20 21 Fixed Function Low voltage detect (LVD) Cache/ECC Reserved Sleep (Pwr Mgr) PICU[0] PICU[1] Support for tail-chaining, and late arrival, of interrupts. This enables back-to-back interrupt processing without the overhead of state saving and restoration between interrupts. Processor state automatically saved on interrupt entry, and restored on interrupt exit, with no instruction overhead. If the same priority level is assigned to two or more interrupts, the interrupt with the lower vector number is executed first. Each interrupt vector may choose from three interrupt sources: Fixed Function, DMA, and UDB. The fixed function interrupts are direct connections to the most common interrupt sources and provide the lowest resource cost connection. The DMA interrupt sources provide direct connections to the two DMA interrupt sources provided per DMA channel. The third interrupt source for vectors is from the UDB digital routing array. This allows any digital signal available to the UDB array to be used as an interrupt source. All interrupt sources may be routed to any interrupt vector using the UDB interrupt source connections. DMA phub_termout0[0] phub_termout0[1] phub_termout0[2] phub_termout0[3] phub_termout0[4] phub_termout0[5] UDB udb_intr[0] udb_intr[1] udb_intr[2] udb_intr[3] udb_intr[4] udb_intr[5] Document Number: 001-55036 Rev. *A Page 14 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Table 4-6. Interrupt Vector Table (continued) Interrupt # 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Cortex-M3 Exception # 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 Fixed Function PICU[2] PICU[3] PICU[4] PICU[5] PICU[6] PICU[12] PICU[15] Comparator Int Switched Cap Int I2C CAN Timer/Counter0 Timer/Counter1 Timer/Counter2 Timer/Counter3 USB SOF Int USB Arb Int USB Bus Int USB Endpoint[0] USB Endpoint Data Reserved Reserved DFB Int Decimator Int phub_err_int eeprom_fault_int DMA phub_termout0[6] phub_termout0[7] phub_termout0[8] phub_termout0[9] phub_termout0[10] phub_termout0[11] phub_termout0[12] phub_termout0[13] phub_termout0[14] phub_termout0[15] phub_termout1[0] phub_termout1[1] phub_termout1[2] phub_termout1[3] phub_termout1[4] phub_termout1[5] phub_termout1[6] phub_termout1[7] phub_termout1[8] phub_termout1[9] phub_termout1[10] phub_termout1[11] phub_termout1[12] phub_termout1[13] phub_termout1[14] phub_termout1[15] UDB udb_intr[6] udb_intr[7] udb_intr[8] udb_intr[9] udb_intr[10] udb_intr[11] udb_intr[12] udb_intr[13] udb_intr[14] udb_intr[15] udb_intr[16] udb_intr[17] udb_intr[18] udb_intr[19] udb_intr[20] udb_intr[21] udb_intr[22] udb_intr[23] udb_intr[24] udb_intr[25] udb_intr[26] udb_intr[27] udb_intr[28] udb_intr[29] udb_intr[30] udb_intr[31] 5. Memory 5.1 Static RAM CY8C54 Static RAM (SRAM) is used for temporary data storage. Code can be executed at full speed from the portion of SRAM that is located in the code space. This process is slower from SRAM above 0x20000000. The device provides up to 64 KB of SRAM. The CPU or the DMA controller can access all of SRAM. The SRAM can be accessed simultaneously by the Cortex-M3 CPU and the DMA controller if accessing different 32 KB blocks. higher CPU performance. If ECC is enabled, the cache controller also performs error checking and correction. Flash programming is performed through a special interface and preempts code execution out of Flash. Code execution out of cache may continue during Flash programming as long as that code is contained inside the cache. The Flash programming interface performs Flash erasing, programming and setting code protection levels. Flash In System Serial Programming (ISSP), typically used for production programming, is possible through both the SWD and JTAG interfaces. In-system programming, typically used for bootloaders, is also possible using serial interfaces such as I2C, USB, UART, and SPI, or any communications protocol. 5.2 Flash Program Memory Flash memory in PSoC devices provides nonvolatile storage for user firmware, user configuration data, bulk data storage, and optional ECC data. The main Flash memory area contains up to 256 KB of user program space. Up to an additional 32 KB of Flash space is available for Error Correcting Codes (ECC). If ECC is not used this space can store device configuration data and bulk user data. User code may not be run out of the ECC Flash memory section. ECC can correct one bit error and detect two bit errors per 8 bytes of firmware memory; an interrupt can be generated when an error is detected. The Flash output is 9 bytes wide with 8 bytes of data and 1 byte of ECC data. The CPU or DMA controller read both user code and bulk data located in Flash through the cache controller. This provides Document Number: 001-55036 Rev. *A 5.3 Flash Security All PSoC devices include a flexible Flash protection model that prevents access and visibility to on-chip Flash memory. This prevents duplication or reverse engineering of proprietary code. Flash memory is organized in blocks, where each block contains 256 bytes of program or data and 32 bytes of ECC or configuration data. The device offers the ability to assign one of four protection levels to each row of Flash. Table 5-1 lists the protection modes available. Flash protection levels can only be changed by performing a complete Flash erase. The Full Protection and Field Upgrade settings disable external access (through a debugging Page 15 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet tool such as PSoC Creator, for example). If your application requires code update through a boot loader, then use the Field Upgrade setting. Use the Unprotected setting only when no security is needed in your application. The PSoC device also offers an advanced security feature called Device Security which permanently disables all test, programming, and debug ports, protecting your application from external access (see the “Device Security” section on page 55). For more information on how to take full advantage of the security features in PSoC, see the PSoC 5 TRM. Table 5-1. Flash Protection Protection Setting Allowed Not Allowed their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Cypress is willing to work with the customer who is concerned about the integrity of their code. Code protection is constantly evolving. We at Cypress are committed to continuously improving the code protection features of our products. 5.4 EEPROM PSoC EEPROM memory is a byte addressable nonvolatile memory. The CY8C54 has 2 KB of EEPROM memory to store user data. Reads from EEPROM are random access at the byte level. Reads are done directly; writes are done by sending write commands to an EEPROM programming interface. CPU code execution can continue from Flash during EEPROM writes. EEPROM is erasable and writeable at the row level. The EEPROM is divided into two sections, each containing 64 rows of 16 bytes each. The CPU can not execute out of EEPROM. There is no ECC hardware associated with EEPROM. If ECC is required it must be handled in firmware. Unprotected Factory Upgrade External read and write + internal read and write External write + internal read and write External read External read and write External read and write + internal write Field Upgrade Internal read and write Full Protection Internal read 5.5 External Memory Interface CY8C54 provides an External Memory Interface (EMIF) for connecting to external memory devices. The connection allows read and write accesses to external memories. The EMIF operates in conjunction with UDBs, I/O ports, and other hardware to generate external memory address and control signals. Figure 5-1 is the EMIF block diagram. The EMIF supports synchronous and asynchronous memories. The CY8C54 only supports one type of external memory device at a time. External memory is located in the Cortex-M3 external RAM space; it can use up to 24 address bits. See “Memory Map” section on page 18. The memory can be 8 or 16 bits wide. Cortex-M3 instructions can be fetched/executed from external memory, although at a slower rate than from Flash. Disclaimer Note the following details of the Flash code protection features on Cypress devices. Cypress products meet the specifications contained in their particular Cypress data sheets. Cypress believes that its family of products is one of the most secure families of its kind on the market today, regardless of how they are used. There may be methods, unknown to Cypress, that can breach the code protection features. Any of these methods, to our knowledge, would be dishonest and possibly illegal. Neither Cypress nor any other semiconductor manufacturer can guarantee the security of Document Number: 001-55036 Rev. *A Page 16 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 5-1. EMIF Block Diagram Address Signals External MEM_ ADDR[23:0] _ IO PORTs Data, Address, and Control Signals IO IF Data Signals External MEM_ DATA[15:0] _ IO PORTs Control Signals PHUB Data, Address, and Control Signals IO PORTs Control DSI Dynamic Output Control UDB DSI to Port Data, Address, and Control Signals EM Control Signals Other Control Signals EMIF Document Number: 001-55036 Rev. *A Page 17 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 5.6 Memory Map The Cortex-M3 has a fixed address map, which allows peripherals to be accessed by simple memory access instructions. 5.6.1 Address Map The 4 GB address space is divided into the ranges shown in Table 5-2: Table 5-2. Address Map Address Range Size Use Table 5-3. Peripheral Data Address Map (continued) Address Range Purpose 0x40004F00 – 0x40004FFF Fixed Timer, Counter, PWMs 0x40005000 – 0x400051FF General Purpose I/Os 0x40005300 – 0x4000530F Output Port Select Register 0x40005400 – 0x400054FF External Memory Interface (EMIF) Control Registers 0x40005800 – 0x40005FFF Analog Subsystem Interface 0x40006000 – 0x400060FF USB Controller 0x40006400 – 0x40006FFF UDB Configuration 0x40007000 – 0x40007FFF PHUB Configuration 0x40008000 – 0x400087FF EEPROM 0x4000A000 – 0x4000A400 CAN 0x4000C000 – 0x4000C800 Digital Filter Block 0x40010000 – 0x4001FFFF Digital Interconnect Configuration 0x60000000 – 0x60FFFFFF External Memory Interface (EMIF) 0x80000000 – 0x800007FFF Flash ECC Bytes 0xE0000000 – 0xE00FFFFF Cortex-M3 PPB Registers, including NVIC, debug, and trace 0x00000000 – 0x1FFFFFFF 0.5 GB Program code. This includes the exception vector table at power up, which starts at address 0. Static RAM. This includes a 1 MByte bit-band region starting at 0x20000000 and a 32 Mbyte bit-band alias region starting at 0x22000000. Peripherals. This includes a 1 MByte bit-band region starting at 0x40000000 and a 32 Mbyte bit-band alias region starting at 0x42000000. External RAM. External peripherals. Internal peripherals, including the NVIC and debug and trace modules. 0x20000000 – 0x3FFFFFFF 0.5 GB 0x40000000 – 0x5FFFFFFF 0.5 GB 0x60000000 – 0x9FFFFFFF 0xA0000000 – 0xDFFFFFFF 0xE0000000 – 0xFFFFFFFF 1 GB 1 GB 0.5 GB The bit-band feature allows individual bits in words in the bit-band region to be read or written as atomic operations. This is done by reading or writing bit 0 of corresponding words in the bit-band alias region. For example, to set bit 3 in the word at address 0x20000000, write a 1 to address 0x2200000C. To test the value of that bit, read address 0x2200000C and the result is either 0 or 1 depending on the value of the bit. Most memory accesses done by the Cortex-M3 are aligned, that is, done on word (4-byte) boundary addresses. Unaligned accesses of words and 16-bit half-words on nonword boundary addresses can also be done, although they are less efficient. 5.6.2 Address Map and Cortex-M3 Buses The ICode and DCode buses are used only for accesses within the Code address range, 0 - 0x1FFFFFFF. The System bus is used for data accesses and debug accesses within the ranges 0x20000000 - 0xDFFFFFFF and 0xE0100000 - 0xFFFFFFFF. Instruction fetches can also be done within the range 0x20000000 - 0x3FFFFFFF, although these can be slower than instruction fetches via the ICode bus. The Private Peripheral Bus (PPB) is used within the Cortex-M3 to access system control registers and debug and trace module registers. Table 5-3. Peripheral Data Address Map Address Range Purpose 0x00000000 – 0x0003FFFF 256K Flash 0x1FFF8000 – 0x1FFFFFFF 32K SRAM in Code region 0x20000000 – 0x20007FFF 32K SRAM in SRAM region 0x40004000 – 0x400042FF Clocking, PLLs, and oscillators 0x40004300 – 0x400043FF Power management 0x40004500 – 0x400045FF Ports interrupt control 0x40004700 – 0x400047FF System performance controller 0x40004800 – 0x400048FF Cache controller 0x40004900 – 0x400049FF I2C controller 0x40004E00 – 0x40004EFF Decimator Document Number: 001-55036 Rev. *A Page 18 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 6. System Integration 6.1 Clocking System The clocking system generates, divides, and distributes clocks throughout the PSoC system. For the majority of systems, no external crystal is required. The IMO and PLL can generate up to a 80 MHz clock, accurate to ±1% over voltage and temperature. Additional internal and external clock sources allow each design to optimize accuracy, power, and cost. All of the system clock sources can be used to generate other clock frequencies in the 16-bit clock dividers and throughout the device for anything the user wants, for example a UART baud rate generator. Clock generation and distribution is automatically configured through the PSoC Creator IDE graphical interface. This is based on the complete system’s requirements. It greatly speeds the design process. PSoC Creator allows designers to build clocking systems with minimal input. The designer can specify desired clock frequencies and accuracies, and the software locates or builds a clock that meets the required specifications. This is possible because of the programmability inherent PSoC. Key features of the clocking system include: Seven general purpose clock sources 3 to 80 MHz IMO ±1% at 3 MHz 4 to 33 MHz External Crystal Oscillator (MHzECO) DSI signal from an external I/O pin or other logic 24 to 80 MHz fractional Phase-Locked Loop (PLL) sourced from IMO, MHzECO, or DSI Clock Doubler 1 kHz, 33 kHz, 100 kHz ILO for Watch Dog Timer (WDT) and Sleep Timer 32.768 kHz External Crystal Oscillator (kHzECO) for Real Time Clock (RTC) 36 MHz fixed clock (available only during test mode) Dedicated 48 MHz Internal Oscillator for USB that auto locks to USB bus clock requiring no external crystal for USB. (USB equipped parts only) Independently sourced clock dividers in all clocks Eight 16-bit clock dividers for the digital system Four 16-bit clock dividers for the analog system Dedicated 16-bit divider for the CPU bus and CPU clock Automatic clock configuration in PSoC Creator Table 6-1. Oscillator Summary Source Fmin Tolerance at Fmin Fmax Tolerance at Fmax Startup Time IMO MHzECO DSI PLL Doubler ILO kHzECO 3 MHz 4 MHz 0 MHz 24 MHz 12 MHz 1 kHz 32 kHz ±1% over voltage and temperature Crystal dependent Input dependent Input dependent Input dependent -30%, +65% Crystal dependent 80 MHz 33 MHz 33 MHz 80 MHz 48 MHz 100 kHz 32 kHz ±5% Crystal dependent Input dependent Input dependent Input dependent -20%, +30% Crystal dependent 10 µs max 5 ms typ, max is crystal dependent Input dependent 250 µs max 1 µs max 1000 µs max 500 ms typ, max is crystal dependent Document Number: 001-55036 Rev. *A Page 19 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 6-1. Clocking Subsystem External IO or DSI 0-33 MHz 3-72 MHz IMO 4-33 MHz ECO 32 kHz ECO 1,33,100 kHz ILO 12-72 MHz Doubler 24-67 MHz PLL System Clock Mux Bus/CPU Clock Divider 16 bit s k e w s k e w s k e w s k e w Digital Clock Divider 16 bit Digital Clock Divider 16 bit Analog Clock Divider 16 bit Digital Clock Divider 16 bit 7 Digital Clock Divider 16 bit Digital Clock Divider 16 bit 7 Digital Clock Divider 16 bit Analog Clock Divider 16 bit Analog Clock Divider 16 bit Digital Clock Divider 16 bit Digital Clock Divider 16 bit Analog Clock Divider 16 bit 6.1.1 Internal Oscillators 6.1.1.1 Internal Main Oscillator In most designs the IMO is the only clock source required, due to its ±1% accuracy. The IMO operates with no external components and outputs a stable clock. A factory trim for each frequency range is stored in the device. With the factory trim, tolerance varies from ±1% at 3 MHz, up to ±10% at 72 MHz. The IMO, in conjunction with the PLL, allows generation of up to a 66 MHz clock with ±1% accuracy. The IMO provides clock outputs at 3, 6, 12, 24, 48, and 72 MHz. 6.1.1.2 Clock Doubler The clock doubler outputs a clock at twice the frequency of the input clock. The doubler works for input frequency ranges of 6 to 24 MHz (providing 12 to 72 MHz at the output). It can be configured to use a clock from the IMO, MHzECO, or the DSI (external pin). 6.1.1.3 Phase-Locked Loop The PLL allows low frequency, high accuracy clocks to be multiplied to higher frequencies. This is a tradeoff between higher clock frequency and accuracy and, higher power consumption and increased startup time. The PLL block provides a mechanism for generating clock frequencies based upon a variety of input sources. The PLL outputs clock frequencies in the range of 24 to 80 MHz. Its input Document Number: 001-55036 Rev. *A and feedback dividers supply 4032 discrete ratios to create almost any desired system clock frequency. The most common PLL use is to multiply the IMO clock at 3 MHz, where it is most accurate to generate the CPU and system clocks up to the device’s maximum frequency. The PLL achieves phase lock within 250 µs (verified by bit setting). It can be configured to use a clock from the IMO, MHzECO, DSI (external pin), or doubler. The PLL clock source can be used until lock is complete and signaled with a lock bit. Disable the PLL before entering low power modes. 6.1.1.4 Internal Low Speed Oscillator The ILO provides clock frequencies for low power consumption, including the watchdog timer, and sleep timer. The ILO generates up to three different clocks: 1 kHz, 33 kHz, and 100 kHz. The 1 kHz clock (CLK1K) is typically used for a background ‘heartbeat’ timer. This clock inherently lends itself to low power supervisory operations such as the watchdog timer and long sleep intervals using the central timewheel (CTW). The central timewheel is a 1 kHz, free running, 13-bit counter clocked by the ILO. The central timewheel is always enabled except in hibernate mode and when the CPU is stopped during debug on chip mode. It can be used to generate periodic interrupts for timing purposes or to wake the system from a low power mode. Firmware can reset the central timewheel. Page 20 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet The central timewheel can be programmed to wake the system periodically and optionally issue an interrupt. This enables flexible, periodic wakeups from low power modes or coarse timing applications. Systems that require accurate timing should use the Real Time Clock capability instead of the central timewheel. The 100 kHz clock (CLK100K) works as a low power system clock to run the CPU. It can also generate time intervals such as fast sleep intervals using the fast timewheel. The fast timewheel is a 100 kHz, 5-bit counter clocked by the ILO that can also be used to wake the system. The fast timewheel settings are programmable, and the counter automatically resets when the terminal count is reached. This enables flexible, periodic wakeups of the CPU at a higher rate than is allowed using the central timewheel. The fast timewheel can generate an optional interrupt each time the terminal count is reached. The 33 kHz clock (CLK33K) comes from a divide-by-3 operation on CLK100K. This output can be used as a reduced accuracy version of the 32.768 kHz ECO clock with no need for a crystal. 6.1.2 External Oscillators 6.1.2.5 MHz External Crystal Oscillator The MHzECO provides high frequency, high precision clocking using an external crystal. It supports a wide variety of crystal types, in the range of 4 to 33 MHz. When used in conjunction with the PLL, it can synthesize a wide range of precise clock frequencies up to 80 MHz. The GPIO pins connecting to the external crystal and capacitors are fixed. MHzECO accuracy depends on the crystal chosen. 6.1.2.6 Digital System Interconnect The DSI provides routing for clocks taken from external clock oscillators connected to I/O. The oscillators can also be generated within the device in the digital system and Universal Digital Blocks. While the primary DSI clock input provides access to all clocking resources, up to eight other DSI clocks (internally or externally generated) may be routed directly to the eight digital clock dividers. This is only possible if there are multiple precision clock sources. 6.1.2.7 32.768 kHz ECO The 32.768 kHz External Crystal Oscillator (32kHzECO) provides precision timing with minimal power consumption using an external 32.768 kHz watch crystal. The 32kHzECO also connects directly to the sleep timer and provides the source for the Real Time Clock (RTC). The RTC uses a 1 second interrupt to implement the RTC functionality in firmware. The oscillator works in two distinct power modes. This allows users to trade off power consumption with noise immunity from neighboring circuits. The GPIO pins connected to the external crystal and capacitors are fixed. 6.1.3 Clock Distribution All seven clock sources are inputs to the central clock distribution system. The distribution system is designed to create multiple high precision clocks. These clocks are customized for the design’s requirements and eliminate the common problems found with limited resolution prescalers attached to peripherals. The clock distribution system generates several types of clock trees. The system clock is used to select and supply the fastest clock in the system for general system clock requirements and clock synchronization of the PSoC device. Bus Clock 16-bit divider uses the system clock to generate the system’s bus clock used for data transfers and the CPU. The CPU clock is directly derived from the bus clock. Eight fully programmable 16-bit clock dividers generate digital system clocks for general use in the digital system, as configured by the design’s requirements. Digital system clocks can generate custom clocks derived from any of the seven clock sources for any purpose. Examples include baud rate generators, accurate PWM periods, and timer clocks, and many others. If more than eight digital clock dividers are required, the Universal Digital Blocks (UDBs) and fixed function Timer/Counter/PWMs can also generate clocks. Four 16-bit clock dividers generate clocks for the analog system components that require clocking, such as ADCs and mixers. The analog clock dividers include skew control to ensure that critical analog events do not occur simultaneously with digital switching events. This is done to reduce analog system noise. Each clock divider consists of an 8-input multiplexer, a 16-bit clock divider (divide by 2 and higher) that generates ~50% duty cycle clocks, system clock resynchronization logic, and deglitch logic. The outputs from each digital clock tree can be routed into the digital system interconnect and then brought back into the clock system as an input, allowing clock chaining of up to 32 bits. 6.1.4 USB Clock Domain The USB clock domain is unique in that it operates largely asynchronously from the main clock network. The USB logic contains a synchronous bus interface to the chip, while running on an asynchronous clock to process USB data. The USB logic requires a 48 MHz frequency. This frequency can be generated from different sources, including DSI clock at 48 MHz or doubled value of 24 MHz from internal oscillator, DSI signal, or crystal oscillator. Document Number: 001-55036 Rev. *A Page 21 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 6.2 Power System The power system consists of separate analog, digital, and I/O supply pins, labeled Vdda, Vddd, and Vddiox, respectively. It also includes two internal 1.8V regulators that provide the digital (Vccd) and analog (Vcca) supplies for the internal core logic. The output pins of the regulators (Vccd and Vcca) and the Vddio pins must have capacitors connected as shown in Figure 6-2. One of the Vccd pins must have a 1 µF ±10% X5R capacitor connected to Vssd. The other Vccd pin should have a 0.1 µF ±10% X5R capacitor connected to Vssd. Also, a trace that is as short as possible must run between the two Vccd pins. The power system also contains a sleep regulator, an I2C regulator, and a hibernate regulator. Figure 6-2. PSoC Power System Vddio2 1 µF Vddd 0.1µF Vddd Vccd Vssd Vddio2 Vddio0 I/ O Supply I/ O Supply Vddio0 0.1µF I2C Regulator Digital Domain Sleep Regulator Vdda Vssd Vdda Digital Regulators Analog Regulator Vcca 1 µF Vssa . Analog Domain Hibernate Regulator Vddio1 Vccd I/O Supply Vddd Vssd I/O Supply Vddio3 Vddio3 0.1µF 0.1µF Vddio1 Vddd 0.1µF 6.2.1 Power Modes PSoC 5 devices have four different power modes. The power modes allow a design to easily provide required functionality and processing power while simultaneously minimizing power consumption and maximizing battery life in low power and portable devices. PSoC 5 power modes, in order of decreasing power consumption are: Active Alternate Active Sleep Hibernate Active is the main processing mode. Its functionality is configurable. Each power controllable subsystem is enabled or disabled by using separate power configuration template registers. In alternate active mode, fewer subsystems are enabled, reducing power. In sleep mode most resources are disabled regardless of the template settings. Sleep mode is optimized to provide timed sleep intervals and Real Time Clock functionality. The lowest power mode is hibernate, which retains register and SRAM state, but no clocks, and allows wakeup only from I/O pins. Figure 6-3 illustrates the allowable transitions between power modes. Document Number: 001-55036 Rev. *A Page 22 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Table 6-2. Power Modes Power Modes Description Entry Condition Wakeup Source Active Clocks Regulator Active Primary mode of operation, all Wakeup, reset, peripherals available (program- manual register entry mable) Manual register Similar to Active mode, and is entry typically configured to have fewer peripherals active to reduce power. One possible configuration is to turn off the CPU and Flash, and run peripherals at full speed All subsystems automatically disabled Manual register entry Any interrupt Any (programmable) All regulators available. Digital and analog regulators can be disabled if external regulation used. All regulators available. Digital and analog regulators can be disabled if external regulation used. Alternate Active Any interrupt Any (programmable) Sleep PICU, ILO/ECO32K comparator, I2C, RTC, CTW, XRES_N, WDR, PPOR, HBR PICU, XRES_N, HBR Both digital and analog regulators buzzed. Digital and analog regulators can be disabled if external regulation used. Only hibernate regulator active. Hibernate Manual register All subsystems automatically entry disabled Lowest power consuming mode with all peripherals and internal regulators disabled, except hibernate regulator is enabled Configuration and memory contents retained Table 6-3. Power Modes Wakeup Time and Power Consumption Sleep Modes Wakeup Time Power (Typ) Code Execution Digital Resources Analog Resources Clock Sources Available Wakeup Sources Reset Sources Active Alternate Active Sleep 3.6V Vdda Vddd Vddio Ind 22 µF 0. 1 µF 10 µH SMP PSoC Vbat 22 µF Vssb Vssa Vssd The boost converter can be operated in two different modes: active and standby. Active mode is the normal mode of operation where the boost regulator actively generates a regulated output voltage. In standby mode, most boost functions are disabled, thus reducing power consumption of the boost circuit. The converter can be configured to provide low power, low current regulation in the standby mode. The external 32 kHz crystal can be used to generate inductor boost pulses on the rising and falling edge of the clock when the output voltage is less than the programmed value. This is called automatic thump mode (ATM). The boost typically draws 200 µA in active mode and 12 µA in standby mode. The boost operating modes must be used in conjunction with chip power modes to minimize the total chip power consumption. Table 6-4 lists the boost power modes available in different chip power modes. Table 6-4. Chip and Boost Power Modes Compatibility Chip Power Modes Boost Power Modes Chip -Active mode Chip -Sleep mode Boost can be operated in either active or standby mode. Boost can be operated in either active or standby mode. However, it is recommended to operate boost in standby mode for low power consumption Boost can only be operated in active mode. However, it is recommended not to use boost in chip hibernate mode due to high current consumption in boost active mode Chip-Hibernate mode The switching frequency can be set to 100 kHz, 400 kHz, 2 MHz, or 32 kHz to optimize efficiency and component cost. The 100 kHz, 400 kHz, and 2 MHz switching frequencies are generated using oscillators internal to the boost converter block. When the 32 kHz switching frequency is selected, the clock is derived from a 32 kHz external crystal oscillator. The 32 kHz external clock is primarily intended for boost standby mode. If the boost converter is not used in a given application, tie the Vbat, Vssb, and Vboost pins to ground and leave the Ind pin unconnected. Document Number: 001-55036 Rev. *A Page 24 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 6.3 Reset CY8C54 has multiple internal and external reset sources available. The reset sources are: Power source monitoring - The analog and digital power voltages, Vdda, Vddd, Vcca, and Vccd are monitored in several different modes during power up, normal operation, and sleep and hibernate states. If any of the voltages goes outside predetermined ranges then a reset is generated. The monitors are programmable to generate an interrupt to the processor under certain conditions before reaching the reset thresholds. External - The device can be reset from an external source by pulling the reset pin (XRES) low. The XRES pin includes an internal pull up to Vddio1. Vddd, Vdda, and Vddio1 must all have voltage applied before the part comes out of reset. Watchdog timer - A watchdog timer monitors the execution of instructions by the processor. If the watchdog timer is not reset by firmware within a certain period of time, the watchdog timer generates a reset. Software - The device can be reset under program control. Figure 6-5. Resets Vddd Vdda corresponding internal regulators. The trip level is not precise. It is set to a voltage below the lowest specified operating voltage but high enough for the internal circuits to be reset and to hold their reset state. The monitor generates a reset pulse that is at least 100 ns wide. It may be much wider if one or more of the voltages ramps up slowly. To save power the IPOR circuit is disabled when the internal digital supply is stable. Voltage supervision is then handed off to the precise low voltage reset (PRES) circuit. When the voltage is high enough for PRES to release, the IMO starts. PRES - Precise Low Voltage Reset This circuit monitors the outputs of the analog and digital internal regulators after power up. The regulator outputs are compared to a precise reference voltage of 1.6V ±0.02V. The response to a PRES trip is identical to an IPOR reset. In normal operating mode, the program cannot disable the digital PRES circuit. The analog regulator can be disabled, which also disables the analog portion of the PRES. The PRES circuit is disabled automatically during sleep and hibernate modes, with one exception: During sleep mode the regulators are periodically activated (buzzed) to provide supervisory services and to reduce wakeup time. At these times the PRES circuit is also buzzed to allow periodic voltage monitoring. HRES - Hibernate/Sleep Low Voltage Reset This circuit monitors internal voltage and issues a reset if the voltage drops below a point where state information may be lost. The response to a HRES trip is identical to an IPOR reset. This circuit is ultra low power. It is enabled at all times but its output only causes a reset when the device is in hibernate or sleep mode. Power Voltage Level Monitors Reset Pin External Reset Reset Controller Processor Interrupt System Reset ALVI, DLVI, AHVI - Analog/Digital Low Voltage Interrupt, Analog High Voltage Interrupt Interrupt circuits are available to detect when Vdda and Vddd go outside a voltage range. For AHVI, Vdda is compared to a fixed trip level. For ALVI and DLVI, Vdda and Vddd are compared to trip levels that are programmable, as listed in Table 6-5. Table 6-5. Analog/Digital Low Voltage Interrupt, Analog High Voltage Interrupt Interrupt Supply Normal Voltage Range Available Trip Accuracy Settings Watchdog Timer Software Reset Register DLVI The term system reset indicates that the processor as well as analog and digital peripherals and registers are reset. A reset status register holds the source of the most recent reset or power voltage monitoring interrupt. The program may examine this register to detect and report exception conditions. This register is cleared after a power on reset. 6.3.1 Reset Sources 6.3.1.1 Power Voltage Level Monitors IPOR - Initial Power on Reset At initial power on, IPOR monitors the power voltages Vddd and Vdda, both directly at the pins and at the outputs of the Document Number: 001-55036 Rev. *A Vddd 1.71V-5.5V 1.70V-5.45V in 250 mV increments 1.71V-5.5V 1.70V-5.45V in 250 mV increments 1.71V-5.5V 5.75V ±2% ALVI Vdda ±2% AHVI Vdda ±2% The monitors are disabled until after IPOR. During sleep mode these circuits are periodically activated (buzzed). If an interrupt occurs during buzzing then the system first enters its wakeup sequence. The interrupt is then recognized and may be serviced. Page 25 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet be used for analog input, CapSense[4], and LCD segment drive, while SIO pins are used for voltages in excess of Vdda and for programmable output voltages. Features supported by both GPIO and SIO: User programmable port reset state Separate I/O supplies and voltages for up to four groups of I/O Digital peripherals use DSI to connect the pins Input or output or both for CPU and DMA Eight drive modes Every pin can be an interrupt source configured as rising edge, falling edge or both edges. If required, level sensitive interrupts are supported through the DSI Dedicated port interrupt vector for each port Slew rate controlled digital output drive mode Access port control and configuration registers on either port basis or pin basis Separate port read (PS) and write (DR) data registers to avoid read modify write errors Special functionality on a pin by pin basis Additional features only provided on the GPIO pins: LCD segment drive on LCD equipped devices CapSense on CapSense equipped devices[4] Analog input and output capability Continuous 100 µA clamp current capability Standard drive strength down to 1.71V Additional features only provided on SIO pins: Higher drive strength than GPIO Hot swap capability (5V tolerance at any operating Vdd) Programmable and regulated high input and output drive levels down to 1.2V No analog input or LCD capability Over voltage tolerance up to 5.5V SIO can act as a general purpose analog comparator USBIO features: Full speed USB 2.0 compliant I/O Highest drive strength for general purpose use Input, output, or both for CPU and DMA Input, output, or both for digital peripherals Digital output (CMOS) drive mode Each pin can be an interrupt source configured as rising edge, falling edge, or both edges 6.3.1.2 Other Reset Sources XRES - External Reset CY8C54 has either a single GPIO pin that is configured as an external reset or a dedicated XRES pin. Either the dedicated XRES pin or the GPIO pin, if configured, holds the part in reset while held active (low). The response to an XRES is the same as to an IPOR reset. The external reset is active low. It includes an internal pull up resistor. XRES is active during sleep and hibernate modes. SRES - Software Reset A reset can be commanded under program control by setting a bit in the software reset register. This is done either directly by the program or indirectly by DMA access. The response to a SRES is the same as after an IPOR reset. Another register bit exists to disable this function. WRES - Watchdog Timer Reset The watchdog reset detects when the software program is no longer being executed correctly. To indicate to the watchdog timer that it is running correctly, the program must periodically reset the timer. If the timer is not reset before a user-specified amount of time, then a reset is generated. Note IPOR disables the watchdog function. The program must enable the watchdog function at an appropriate point in the code by setting a register bit. When this bit is set, it cannot be cleared again except by an IPOR power on reset event. 6.4 I/O System and Routing PSoC I/Os are extremely flexible. Every GPIO has analog and digital I/O capability. All I/Os have a large number of drive modes, which are set at POR. PSoC also provides up to four individual I/O voltage domains through the Vddio pins. There are two types of I/O pins on every device; those with USB provide a third type. Both General Purpose I/O (GPIO) and Special I/O (SIO) provide similar digital functionality. The primary differences are their analog capability and drive strength. Devices that include USB also provide two USBIO pins that support specific USB functionality as well as limited GPIO capability. All I/O pins are available for use as digital inputs and outputs for both the CPU and digital peripherals. In addition, all I/O pins can generate an interrupt. The flexible and advanced capabilities of the PSoC I/O, combined with any signal to any pin routability, greatly simplify circuit design and board layout. All GPIO pins can Document Number: 001-55036 Rev. *A Page 26 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 6-6. GPIO Block Diagram Digital Input Path PRT[x]CTL PRT[x]DBL_SYNC_IN PRT[x]PS Digital System Input PICU[x]INTTYPE[y] PICU[x]INTSTAT Pin Interrupt Signal PICU[x]INTSTAT Interrupt Logic Input Buffer Disable Naming Convention ‘x’ = Port Number ‘y’ = Pin Number Digital Output Path PRT[x]SLW PRT[x]SYNC_OUT PRT[x]DR Digital System Output PRT[x]BYP PRT[x]DM2 PRT[x]DM1 PRT[x]DM0 Bidirectional Control PRT[x]BIE Drive Logic Slew Cntl 0 Vio Vio In 1 Vio PIN OE Analog 1 0 1 0 1 Capsense Global Control CAPS[x]CFG1 PRT[x]AG Analog Global Enable PRT[x]AMUX Analog Mux Enable Switches LCD PRT[x]LCD_COM_SEG PRT[x]LCD_EN LCD Bias Bus 5 Display Data Logic & MUX Document Number: 001-55036 Rev. *A Page 27 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 6-7. SIO Input/Output Block Diagram Digital Input Path PRT[x]SIO_HYST_EN PRT[x]SIO_DIFF Reference Level PRT[x]DBL_SYNC_IN PRT[x]PS Digital System Input PICU[x]INTTYPE[y] PICU[x]INTSTAT Pin Interrupt Signal PICU[x]INTSTAT Interrupt Logic Input Buffer Disable Buffer Thresholds Naming Convention ‘x’ = Port Number ‘y’ = Pin Number Digital Output Path Reference Level PRT[x]SIO_CFG PRT[x]SLW PRT[x]SYNC_OUT PRT[x]DR Digital System Output PRT[x]BYP PRT[x]DM2 PRT[x]DM1 PRT[x]DM0 Bidirectional Control PRT[x]BIE Drive Logic 0 Driver Vhigh In 1 Slew Cntl PIN OE Figure 6-8. USBIO Block Diagram Digital Input Path USB Receiver Circuitry PRT[x]DBL_SYNC_IN USBIO_CR1[0,1] Digital System Input PICU[x]INTTYPE[y] PICU[x]INTSTAT Pin Interrupt Signal PICU[x]INTSTAT Interrupt Logic Naming Convention ‘x’ = Port Number ‘y’ = Pin Number Digital Output Path PRT[x]SYNC_OUT USBIO_CR1[7] USB SIE Control for USB Mode USBIO_CR1[4,5] Digital System Output PRT[x]BYP 0 D+ pin only USB or I/O Vio Vio 3.3V Vio In 1 Drive Logic 5k 1.5k PIN USBIO_CR1[2] USBIO_CR1[3] USBIO_CR1[6] D+ 1.5k D+D- 5k Open Drain Document Number: 001-55036 Rev. *A Page 28 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 6.4.1 Drive Modes Each GPIO and SIO pin is individually configurable into one of the eight drive modes listed in Table 6-6. Three configuration bits are used for each pin (DM[2:0]) and set in the PRTxDM[2:0] registers. Figure 6-9 depicts a simplified pin view based on each of the eight drive modes. Table 6-6 shows the I/O pin’s drive state based on the port data register value or digital array signal if bypass mode is selected. Note that the actual I/O pin voltage is determined by a combination of the selected drive mode and the load at the pin. For example, if a GPIO pin is configured for resistive pull up mode and driven high while the pin is floating, the voltage measured at the pin is a high logic state. If the same GPIO pin is externally tied to ground then the voltage unmeasured at the pin is a low logic state. Figure 6-9. Drive Mode Vio Vio DR PS Pin DR PS Pin DR PS Pin DR PS Pin 0. High Impedance Analog 1. High Impedance Digital Vio 2. Resistive Pull Up Vio 3. Resistive Pull Down Vio DR PS Pin DR PS Pin DR PS Pin DR PS Pin 4. Open Drain , Drives Low 5. Open Drain , Drives High 6. Strong Drive 7. Resistive Pull Up and Down Table 6-6. Drive Modes Diagram Drive Mode PRTxDM2 PRTxDM1 PRTxDM0 PRTxDR = 1 PRTxDR = 0 0 1 2 3 4 5 6 7 High impedence analog High Impedance digital Resistive pull up Resistive pull down Open drain, drives low Open drain, drive high Strong drive Resistive pull up and pull down 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 High-Z High-Z Res High (5K) Strong High High-Z Strong High Strong High Res High (5K) High-Z High-Z Strong Low Res Low (5K) Strong Low High-Z Strong Low Res Low (5K) High Impedance Analog The default reset state with both the output driver and digital input buffer turned off. This prevents any current from flowing in the I/O’s digital input buffer due to a floating voltage. This state is recommended for pins that are floating or that support an analog voltage. High impedance analog pins do not provide digital input functionality. To achieve the lowest chip current in sleep modes, all I/Os must either be configured to the high impedance analog mode, or have their pins driven to a power supply rail by the PSoC device or by external circuitry. High Impedance Digital The input buffer is enabled for digital signal input. This is the standard high impedance (HiZ) state recommended for digital inputs. Resistive Pull Up or Resistive Pull Down Resistive pull up or pull down, respectively, provides a series resistance in one of the data states and strong drive in the Page 29 of 93 Document Number: 001-55036 Rev. *A [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet other. Pins can be used for digital input and output in these modes. Interfacing to mechanical switches is a common application for these modes. Open Drain, Drives High and Open Drain, Drives Low Open drain modes provide high impedance in one of the data states and strong drive in the other. Pins can be used for digital input and output in these modes. A common application for these modes is driving the I2C bus signal lines. Strong Drive Provides a strong CMOS output drive in either high or low state. This is the standard output mode for pins. Strong Drive mode pins must not be used as inputs under normal circumstances. This mode is often used to drive digital output signals or external FETs. Resistive Pull Up and Pull Down Similar to the resistive pull up and resistive pull down modes except the pin is always in series with a resistor. The high data state is pull up while the low data state is pull down. This mode is most often used when other signals that may cause shorts can drive the bus. 6.4.2 Pin Registers Registers to configure and interact with pins come in two forms that may be used interchangeably. All I/O registers are available in the standard port form, where each bit of the register corresponds to one of the port pins. This register form is efficient for quickly reconfiguring multiple port pins at the same time. I/O registers are also available in pin form, which combines the eight most commonly used port register bits into a single register for each pin. This enables very fast configuration changes to individual pins with a single register write. 6.4.3 Bidirectional Mode High speed bidirectional capability allows pins to provide both the high impedance digital drive mode for input signals and a second user selected drive mode such as strong drive (set using PRTxDM[2:0] registers) for output signals on the same pin, based on the state of an auxiliary control bus signal. The bidirectional capability is useful for processor busses and communications interfaces such as the SPI Slave MISO pin that requires dynamic hardware control of the output buffer. The auxiliary control bus routes up to 16 UDB or digital peripheral generated output enable signals to one or more pins. 6.4.4 Slew Rate Limited Mode GPIO and SIO pins have fast and slow output slew rate options for strong and open drain drive modes, not resistive drive modes. Because it results in reduced EMI, the slow edge rate option is recommended for signals that are not speed critical, generally less than 1 MHz. The fast slew rate is for signals between 1 MHz and 33 MHz. The slew rate is individually configurable for each pin, and is set by the PRTxSLW registers. 6.4.5 Pin Interrupts All GPIO and SIO pins are able to generate interrupts to the system. All eight pins in each port interface to their own Port Interrupt Control Unit (PICU) and associated interrupt vector. Document Number: 001-55036 Rev. *A Each pin of the port is independently configurable to detect rising edge, falling edge, both edge interrupts, or to not generate an interrupt. Depending on the configured mode for each pin, each time an interrupt event occurs on a pin, its corresponding status bit of the interrupt status register is set to “1” and an interrupt request is sent to the interrupt controller. Each PICU has its own interrupt vector in the interrupt controller and the pin status register providing easy determination of the interrupt source down to the pin level. Port pin interrupts remain active in all sleep modes allowing the PSoC device to wake from an externally generated interrupt. While level sensitive interrupts are not directly supported; Universal Digital Blocks (UDB) provide this functionality to the system when needed. 6.4.6 Input Buffer Mode GPIO and SIO input buffers can be configured at the port level for the default CMOS input thresholds or the optional LVTTL input thresholds. All input buffers incorporate Schmitt triggers for input hysteresis. Additionally, individual pin input buffers can be disabled in any drive mode. 6.4.7 I/O Power Supplies Up to four I/O pin power supplies are provided depending on the device and package. Each I/O supply must be less than or equal to the voltage on the chip’s analog (Vdda) pin. This feature allows users to provide different I/O voltage levels for different pins on the device. Refer to the specific device package pinout to determine Vddio capability for a given port and pin. The SIO port pins support an additional regulated high output capability, as described in Adjustable Output Level. 6.4.8 Analog Connections These connections apply only to GPIO pins. All GPIO pins may be used as analog inputs or outputs. The analog voltage present on the pin must not exceed the Vddio supply voltage to which the GPIO belongs. Each GPIO may connect to one of the analog global busses or to one of the analog mux buses to connect any pin to any internal analog resource such as ADC or comparators. In addition, select pins provide direct connections to specific analog features such as the high current DACs or uncommitted opamps. 6.4.9 CapSense This section applies only to GPIO pins. All GPIO pins may be used to create CapSense buttons and sliders[4]. See the “CapSense” section on page 52 for more information. 6.4.10 LCD Segment Drive This section applies only to GPIO pins. All GPIO pins may be used to generate Segment and Common drive signals for direct glass drive of LCD glass. See the “LCD Direct Drive” section on page 51 for details. 6.4.11 Adjustable Output Level This section applies only to SIO pins. SIO port pins support the ability to provide a regulated high output level for interface to external signals that are lower in voltage than the SIO’s respective Vddio. SIO pins are individually configurable to output Page 30 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet either the standard Vddio level or the regulated output, which is based on an internally generated reference. Typically a voltage DAC (VDAC) is used to generate the reference. The “DAC” section on page 52 has more details on VDAC use and reference routing to the SIO pins. 6.4.12 Adjustable Input Level This section applies only to SIO pins. SIO pins by default support the standard CMOS and LVTTL input levels but also support a differential mode with programmable levels. SIO pins are grouped into pairs. Each pair shares a reference generator block which, is used to set the digital input buffer reference level for interface to external signals that differ in voltage from Vddio. The reference sets the pins voltage threshold for a high logic level. Available input thresholds are: 0.5 × Vddio 0.4 × Vddio 0.5 × Vref Vref Typically a voltage DAC (VDAC) generates the Vref reference. “DAC” section on page 52 has more details on VDAC use and reference routing to the SIO pins. 6.4.13 SIO as Comparator This section applies only to SIO pins. The adjustable input level feature of the SIOs as explained in the Adjustable Input Level section can be used to construct a comparator. The threshold for the comparator is provided by the SIO's reference generator. The reference generator has the option to set the analog signal routed through the analog global line as threshold for the comparator. Note that a pair of SIO pins share the same threshold. The digital input path in Figure 6-7 on page 28 illustrates this functionality. In the figure, ‘Reference level’ is the analog signal routed through the analog global. The hysteresis feature can also be enabled for the input buffer of the SIO, which increases noise immunity for the comparator. 6.4.14 Hot Swap This section applies only to SIO pins. SIO pins support ‘hot swap’ capability to plug into an application without loading the signals that are connected to the SIO pins even when no power is applied to the PSoC device. This allows the unpowered PSoC to maintain a high impedance load to the external device while also preventing the PSoC from being powered through a GPIO pin’s protection diode. 6.4.15 Over Voltage Tolerance All I/O pins provide an over voltage (Vddio < Vin < Vdda) tolerance feature at any operating Vdd. There are no current limitations for the SIO pins as they present a high impedance load to the external circuit. The GPIO pins must be limited to 100 µA using a current limiting resistor. GPIO pins clamp the pin voltage to approximately one diode above the Vddio supply. In case of a GPIO pin configured for analog input/output, the analog voltage on the pin must not exceed the Vddio supply voltage to which the GPIO belongs. A common application for this feature is connection to a bus such as I2C where different devices are running from different supply voltages. In the I2C case, the PSoC chip is configured into the Open Drain, Drives Low mode for the SIO pin. This allows an external pull up to pull the I2C bus voltage above the PSoC pin supply. For example, the PSoC chip could operate at 1.8V, and an external device could run from 5V. Note that the SIO pin’s VIH and VIL levels are determined by the associated Vddio supply pin. The I/O pin must be configured into a high impedance drive mode, open drain low drive mode, or pull down drive mode, for over voltage tolerance to work properly. Absolute maximum ratings for the device must be observed for all I/O pins. 6.4.16 Reset Configuration By default all I/Os reset to the High Impedance Analog state but are reprogrammable on a port-by-port basis. They can be reset as High Impedance Analog, Pull Down, or Pull Up, based on the application’s requirements. To ensure correct reset operation, the port reset configuration data is stored in special nonvolatile registers. The stored reset data is automatically transferred to the port reset configuration registers at PPOR release. 6.4.17 Low Power Functionality In all low power modes the I/O pins retain their state until the part is awakened and changed or reset. To awaken the part, use a pin interrupt, because the port interrupt logic continues to function in all low power modes. 6.4.18 Special Pin Functionality Some pins on the device include additional special functionality in addition to their GPIO or SIO functionality. The specific special function pins are listed in “Pinouts” on page 5. The special features are: Digital 4 to 33 MHz crystal oscillator 32.768 kHz crystal oscillator Wake from sleep on I2C address match. Any pin can be used for I2C if wake from sleep is not required. JTAG interface pins SWD interface pins SWV interface pins External reset Analog Opamp inputs and outputs High current IDAC outputs External reference inputs 6.4.19 JTAG Boundary Scan The device supports standard JTAG boundary scan chains on all pins for board level test. Document Number: 001-55036 Rev. *A Page 31 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 7. Digital Subsystem The digital programmable system creates application specific combinations of both standard and advanced digital peripherals and custom logic functions. These peripherals and logic are then interconnected to each other and to any pin on the device, providing a high level of design flexibility and IP security. The features of the digital programmable system are outlined here to provide an overview of capabilities and architecture. Designers do not need to interact directly with the programmable digital system at the hardware and register level. PSoC Creator provides a high level schematic capture graphical interface to automatically place and route resources similar to PLDs. The main components of the digital programmable system are: Universal Digital Blocks (UDB) - These form the core functionality of the digital programmable system. UDBs are a collection of uncommitted logic (PLD) and structural logic (Datapath) optimized to create all common embedded peripherals and customized functionality that are application or design specific. Universal Digital Block Array - UDB blocks are arrayed within a matrix of programmable interconnect. The UDB array structure is homogeneous and allows for flexible mapping of digital functions onto the array. The array supports extensive and flexible routing interconnects between UDBs and the Digital System Interconnect. Digital System Interconnect (DSI) - Digital signals from Universal Digital Blocks (UDBs), fixed function peripherals, I/O pins, interrupts, DMA, and other system core signals are attached to the Digital System Interconnect to implement full featured device connectivity. The DSI allows any digital function to any pin or other feature routability when used with the Universal Digital Block Array. Figure 7-1. CY8C54 Digital Programmable Architecture Digital Core System and Fixed Function Peripherals IO Port IO Port DSI Routing Interface UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB UDB Array UDB Array UDB UDB UDB UDB UDB UDB UDB UDB IO Port DSI Routing Interface IO Port Digital Core System and Fixed Function Peripherals 7.1 Example Peripherals The flexibility of the CY8C54 family’s Universal Digital Blocks (UDBs) and Analog Blocks allow the user to create a wide range of components (peripherals). The most common peripherals were built and characterized by Cypress and are shown in the PSoC Creator component catalog, however, users may also create their own custom components using PSoC Creator. Using PSoC Creator, users may also create their own components for reuse within their organization, for example sensor interfaces, proprietary algorithms, and display interfaces. The number of components available through PSoC Creator is too numerous to list in the data sheet, and the list is always growing. An example of a component available for use in CY8C54 family, but, not explicitly called out in this data sheet is the UART component. Document Number: 001-55036 Rev. *A Page 32 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 7.1.1 Example Digital Components The following is a sample of the digital components available in PSoC Creator for the CY8C54 family. The exact amount of hardware resources (UDBs, routing, RAM, Flash) used by a component varies with the features selected in PSoC Creator for the component. Communications I2C (1 to 3 UDBs) UART (1 to 3 UDBs) Functions EMIF (External Memory Interface, 1 UDB) Logic (x CPLD product terms per logic function) NOT OR XOR AND 7.1.2 Example Analog Components The following is a sample of the analog components available in PSoC Creator for the CY8C54 family. The exact amount of hardware resources (SC/CT blocks, routing, RAM, Flash) used by a component varies with the features selected in PSoC Creator for the component. Amplifiers TIA PGA opamp ADCs Successive Approximation (SAR) DACs Current Voltage PWM Comparators Mixers 7.1.3 Example System Function Components The following is a sample of the system function components available in PSoC Creator for the CY8C54 family. The exact amount of hardware resources (UDBs, DFB taps, SC/CT blocks, routing, RAM, Flash) used by a component varies with the features selected in PSoC Creator for the component. CapSense LCD Drive LCD Control Filters 7.1.4 Designing with PSoC Creator 7.1.4.1 More Than a Typical IDE A successful design tool allows for the rapid development and deployment of both simple and complex designs. It reduces or eliminates any learning curve. It makes the integration of a new design into the production stream straightforward. PSoC Creator is that design tool. PSoC Creator is a full featured Integrated Development Environment (IDE) for hardware and software design. It is optimized specifically for PSoC devices and combines a modern, powerful software development platform with a sophisticated graphical design tool. This unique combination of tools makes PSoC Creator the most flexible embedded design platform available. Graphical design entry simplifies the task of configuring a particular part. You can select the required functionality from an extensive catalog of components and place it in your design. All components are parameterized and have an editor dialog that allows you to tailor functionality to your needs. Document Number: 001-55036 Rev. *A Page 33 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet PSoC Creator automatically configures clocks and routes the I/O to the selected pins and then generates APIs to give the application complete control over the hardware. Changing the PSoC device configuration is as simple as adding a new component, setting its parameters, and rebuilding the project. At any stage of development you are free to change the hardware configuration and even the target processor. To retarget your application (hardware and software) to new devices, even from 8- to 32-bit families, just select the new device and rebuild. You also have the ability to change the C compiler and evaluate an alternative. Components are designed for portability and are validated against all devices, from all families, and against all supported tool chains. Switching compilers is as easy as editing the from the project options and rebuilding the application with no errors from the generated APIs or boot code. Figure 7-2. PSoC Creator Framework Document Number: 001-55036 Rev. *A Page 34 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 7.1.4.2 Component Catalog Figure 7-3. Component Catalog 7.1.4.4 Software Development Figure 7-4. Code Editor Anchoring the tool is a modern, highly customizable user interface. It includes project management and integrated editors for C and assembler source code, as well the design entry tools. Project build control leverages compiler technology from top commercial vendors such as ARM® Limited, Keil™, and CodeSourcery (GNU). Free versions of Keil C51 and GNU C Compiler (GCC) for ARM, with no restrictions on code size or end product distribution, are included with the tool distribution. Upgrading to more optimizing compilers is a snap with support for the professional Keil C51 product and ARM RealView™ compiler. 7.1.4.5 Nonintrusive Debugging Figure 7-5. PSoC Creator Debugger The component catalog is a repository of reusable design elements that select device functionality and customize your PSoC device. It is populated with an impressive selection of content; from simple primitives such as logic gates and device registers, through the digital timers, counters and PWMs, plus analog components such as ADCs, DACs, and filters, and communication protocols, such as I2C, USB and CAN. See “Example Peripherals” section on page 32 for more details about available peripherals. All content is fully characterized and carefully documented in datasheets with code examples, AC/DC specifications, and user code ready APIs. 7.1.4.3 Design Reuse The symbol editor gives you the ability to develop reusable components that can significantly reduce future design time. Just draw a symbol and associate that symbol with your proven design. PSoC Creator allows for the placement of the new symbol anywhere in the component catalog along with the content provided by Cypress. You can then reuse your content as many times as you want, and in any number of projects, without ever having to revisit the details of the implementation. With JTAG (4-wire) and SWD (2-wire) debug connectivity available on all devices, the PSoC Creator debugger offers full control over the target device with minimum intrusion. Breakpoints and code execution commands are all readily available from toolbar buttons and an impressive lineup of windows—register, locals, watch, call stack, memory and peripherals—make for an unparalleled level of visibility into the system. Document Number: 001-55036 Rev. *A Page 35 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet PSoC Creator contains all the tools necessary to complete a design, and then to maintain and extend that design for years to come. All steps of the design flow are carefully integrated and optimized for ease-of-use and to maximize productivity. of compare configurations and condition generation. This block also contains input/output FIFOs, which are the primary parallel data interface between the CPU/DMA system and the UDB. Status and Control Module - The primary role of this block is to provide a way for CPU firmware to interact and synchronize with UDB operation. Clock and Reset Module - This block provides the UDB clocks and reset selection and control. 7.2.1 PLD Module The primary purpose of the PLD blocks is to implement logic expressions, state machines, sequencers, look up tables, and decoders. In the simplest use model, consider the PLD blocks as a standalone resource onto which general purpose RTL is synthesized and mapped. The more common and efficient use model is to create digital functions from a combination of PLD and datapath blocks, where the PLD implements only the random logic and state portion of the function while the datapath (ALU) implements the more structured elements. Figure 7-7. PLD 12C4 Structure PT0 PT1 PT2 PT3 PT4 PT5 PT6 PT7 7.2 Universal Digital Block The Universal Digital Block (UDB) represents an evolutionary step to the next generation of PSoC embedded digital peripheral functionality. The architecture in first generation PSoC digital blocks provides coarse programmability in which a few fixed functions with a small number of options are available. The new UDB architecture is the optimal balance between configuration granularity and efficient implementation. A cornerstone of this approach is to provide the ability to customize the devices digital operation to match application requirements. To achieve this, UDBs consist of a combination of uncommitted logic (PLD), structured logic (Datapath), and a flexible routing scheme to provide interconnect between these elements, I/O connections, and other peripherals. UDB functionality ranges from simple self contained functions that are implemented in one UDB, or even a portion of a UDB (unused resources are available for other functions), to more complex functions that require multiple UDBs. Examples of basic functions are timers, counters, CRC generators, PWMs, dead band generators, and communications functions, such as UARTs, SPI, and I2C. Also, the PLD blocks and connectivity provide full featured general purpose programmable logic within the limits of the available resources. Figure 7-6. UDB Block Diagram IN0 IN1 IN2 IN3 IN4 IN5 IN6 IN7 TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC TC AND Array PLD Chaining Clock and Reset Control PLD 12C4 (8 PTs) PLD 12C4 (8 PTs) IN8 IN9 IN10 IN11 SELIN (carry in) OUT0 MC0 MC1 MC2 MC3 T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T Status and Control OUT1 Datapath Datapath Chaining OUT2 OUT3 SELOUT (carry out) OR Array Routing Channel The main component blocks of the UDB are: PLD blocks - There are two small PLDs per UDB. These blocks take inputs from the routing array and form registered or combinational sum-of-products logic. PLDs are used to implement state machines, state bits, and combinational logic equations. PLD configuration is automatically generated from graphical primitives. Datapath Module - This 8-bit wide datapath contains structured logic to implement a dynamically configurable ALU, a variety One 12C4 PLD block is shown in Figure 7-7. This PLD has 12 inputs, which feed across eight product terms. Each product term (AND function) can be from 1 to 12 inputs wide, and in a given product term, the true (T) or complement (C) of each input can be selected. The product terms are summed (OR function) to create the PLD outputs. A sum can be from 1 to 8 product terms wide. The 'C' in 12C4 indicates that the width of the OR gate (in this case 8) is constant across all outputs (rather than variable as in a 22V10 device). This PLA like structure gives maximum flexibility and insures that all inputs and outputs are permutable for ease of allocation by the software tools. There are two 12C4 PLDs in each UDB. Document Number: 001-55036 Rev. *A Page 36 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 7.2.2 Datapath Module The datapath contains an 8-bit single cycle ALU, with associated compare and condition generation logic. This datapath block is optimized to implement embedded functions, such as timers, counters, integrators, PWMs, PRS, CRC, shifters and dead band generators and many others. Figure 7-8. Datapath Top Level PHUB System Bus R/W Access to All Registers F1 FIFOs Conditions: 2 Compares, 2 Zero Detect, 2 Ones Detect Overflow Detect Input from Programmable Routing Input Muxes 6 F0 A0 A1 D0 D1 Output Muxes 6 Datapath Control Control Store RAM 8 Word X 16 Bit Output to Programmable Routing D1 Data Registers D0 A1 Accumulators A0 PI Parallel Input/Output (to/from Programmable Routing) PO To/From Previous Datapath Chaining To/From Next Datapath ALU Shift Mask 7.2.2.6 Working Registers The datapath contains six primary working registers, which are accessed by CPU firmware or DMA during normal operation. Table 7-1. Working Datapath Registers Name Function Description 7.2.2.7 Dynamic Datapath Configuration RAM Dynamic configuration is the ability to change the datapath function and internal configuration on a cycle-by-cycle basis, under sequencer control. This is implemented using the 8-word x 16-bit configuration RAM, which stores eight unique 16-bit wide configurations. The address input to this RAM controls the sequence, and can be routed from any block connected to the UDB routing matrix, most typically PLD logic, I/O pins, or from the outputs of this or other datapath blocks. ALU A0 and A1 Accumulators These are sources and sinks for the ALU and also sources for the compares. These are sources for the ALU and sources for the compares. These are the primary interface to the system bus. They can be a data source for the data registers and accumulators or they can capture data from the accumulators or ALU. Each FIFO is four bytes deep. D0 and D1 Data Registers F0 and F1 FIFOs The ALU performs eight general purpose functions. They are: Increment Decrement Add Subtract Logical AND Logical OR Logical XOR Document Number: 001-55036 Rev. *A Page 37 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Independent of the ALU operation, these functions are available: Shift left Shift right Nibble swap Bitwise OR mask 7.2.2.8 Conditionals Each datapath has two compares, with bit masking options. Compare operands include the two accumulators and the two data registers in a variety of configurations. Other conditions include zero detect, all ones detect, and overflow. These conditions are the primary datapath outputs, a selection of which can be driven out to the UDB routing matrix. Conditional computation can use the built in chaining to neighboring UDBs to operate on wider data widths without the need to use routing resources. 7.2.2.9 Variable MSB The most significant bit of an arithmetic and shift function can be programmatically specified. This supports variable width CRC and PRS functions, and in conjunction with ALU output masking, can implement arbitrary width timers, counters and shift blocks. 7.2.2.10 Built in CRC/PRS The datapath has built in support for single cycle Cyclic Redundancy Check (CRC) computation and Pseudo Random Sequence (PRS) generation of arbitrary width and arbitrary polynomial. CRC/PRS functions longer than 8 bits may be implemented in conjunction with PLD logic, or built in chaining may be use to extend the function into neighboring UDBs. 7.2.2.11 Input/Output FIFOs Each datapath contains two four-byte deep FIFOs, which can be independently configured as an input buffer (system bus writes to the FIFO, datapath internal reads the FIFO), or an output buffer (datapath internal writes to the FIFO, the system bus reads from the FIFO). The FIFOs generate status that are selectable as datapath outputs and can therefore be driven to the routing, to interact with sequencers, interrupts, or DMA. Figure 7-9. Example FIFO Configurations System Bus System Bus F0 F0 F1 D0/D1 A0/A1/ALU A0/A1/ALU A0/A1/ALU D0 A0 D1 A1 F1 F0 F1 System Bus TX/RX System Bus Dual Capture Dual Buffer 7.2.2.12 Chaining The datapath can be configured to chain conditions and signals such as carries and shift data with neighboring datapaths to create higher precision arithmetic, shift, CRC/PRS functions. 7.2.2.13 Time Multiplexing In applications that are over sampled, or do not need high clock rates, the single ALU block in the datapath can be efficiently shared with two sets of registers and condition generators. Carry and shift out data from the ALU are registered and can be selected as inputs in subsequent cycles. This provides support for 16-bit functions in one (8-bit) datapath. 7.2.2.14 Datapath I/O There are six inputs and six outputs that connect the datapath to the routing matrix. Inputs from the routing provide the configuration for the datapath operation to perform in each cycle, and the serial data inputs. Inputs can be routed from other UDB blocks, other device peripherals, device I/O pins, and so on. The outputs to the routing can be selected from the generated conditions, and the serial data outputs. Outputs can be routed to other UDB blocks, device peripherals, interrupt and DMA controller, I/O pins, and so on. Document Number: 001-55036 Rev. *A Page 38 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 7.2.3 Status and Control Module The primary purpose of this circuitry is to coordinate CPU firmware interaction with internal UDB operation. Figure 7-10. Status and Control Registers System Bus 7.3 UDB Array Description Figure 7-11 shows an example of a 16 UDB array. In addition to the array core, there are a DSI routing interfaces at the top and bottom of the array. Other interfaces that are not explicitly shown include the system interfaces for bus and clock distribution. The UDB array includes multiple horizontal and vertical routing channels each comprised of 96 wires. The wire connections to UDBs, at horizontal/vertical intersection and at the DSI interface are highly permutable providing efficient automatic routing in PSoC Creator. Additionally the routing allows wire by wire segmentation along the vertical and horizontal routing to further increase routing flexibility and capability. Figure 7-11. Digital System Interface Structure System Connections 8-bit Status Register (Read Only) 8-bit Control Register (Write/Read) Routing Channel HV B HV A HV B HV A The bits of the control register, which may be written to by the system bus, are used to drive into the routing matrix, and thus provide firmware with the opportunity to control the state of UDB processing. The status register is read-only and it allows internal UDB state to be read out onto the system bus directly from internal routing. This allows firmware to monitor the state of UDB processing. Each bit of these registers has programmable connections to the routing matrix and routing connections are made depending on the requirements of the application. 7.2.3.15 Usage Examples As an example of control input, a bit in the control register can be allocated as a function enable bit. There are multiple ways to enable a function. In one method the control bit output would be routed to the clock control block in one or more UDBs and serve as a clock enable for the selected UDB blocks. A status example is a case where a PLD or datapath block generated a condition, such as a “compare true” condition that is captured and latched by the status register and then read (and cleared) by CPU firmware. 7.2.3.16 Clock Generation Each subcomponent block of a UDB including the two PLDs, the datapath, and Status and Control, has a clock selection and control block. This promotes a fine granularity with respect to allocating clocking resources to UDB component blocks and allows unused UDB resources to be used by other functions for maximum system efficiency. UDB UDB UDB UDB HV A HV B HV A HV B UDB UDB UDB UDB UDB UDB UDB UDB HV B HV A HV B HV A UDB UDB UDB UDB HV A HV B HV A HV B System Connections 7.3.1 UDB Array Programmable Resources Figure 7-12 shows an example of how functions are mapped into a bank of 16 UDBs. The primary programmable resources of the UDB are two PLDs, one datapath and one status/control register. These resources are allocated independently, because they have independently selectable clocks, and therefore unused blocks are allocated to other unrelated functions. An example of this is the 8-bit Timer in the upper left corner of the array. This function only requires one datapath in the UDB, and therefore the PLD resources may be allocated to another function. A function such as a Quadrature Decoder may require more PLD logic than one UDB can supply and in this case can utilize the unused PLD blocks in the 8-bit Timer UDB. Programmable resources in the UDB array are generally homogeneous so functions can be mapped to arbitrary boundaries in the array. Document Number: 001-55036 Rev. *A Page 39 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 7-12. Function Mapping Example in a Bank of UDBs Sequencer 8-Bit Timer Quadrature Decoder 16-Bit PWM UDB 16-Bit PYRS Figure 7-13. Digital System Interconnect Timer Counters Interrupt Controller DMA Controller IO Port Pins IO Port Pins CAN I2C UDB UDB UDB HV A HV B HV A HV B Digital System Routing I/F UDB I2C Slave UDB UDB UDB 8-Bit SPI 12-Bit SPI UDB UDB UDB UDB 8-Bit Timer Logic UDB ARRAY HV B HV A Logic HV B HV A Digital System Routing I/F UDB UART UDB UDB 12-Bit PWM UDB Global Clocks Global Clocks EMIF SAR ADC SC Blocks DACS Comparators 7.4 DSI Routing Interface Description The DSI routing interface is a continuation of the horizontal and vertical routing channels at the top and bottom of the UDB array core. It provides general purpose programmable routing between device peripherals, including UDBs, I/Os, analog peripherals, interrupts, DMA and fixed function peripherals. Figure 7-13 illustrates the concept of the digital system interconnect, which connects the UDB array routing matrix with other device peripherals. Any digital core or fixed function peripheral that needs programmable routing is connected to this interface. Signals in this category include: Interrupt requests from all digital peripherals in the system. DMA requests from all digital peripherals in the system. Digital peripheral data signals that need flexible routing to I/Os. Digital peripheral data signals that need connections to UDBs. Connections to the interrupt and DMA controllers. Connection to I/O pins. Connection to analog system digital signals. Interrupt and DMA routing is very flexible in the CY8C54 programmable architecture. In addition to the numerous fixed function peripherals that can generate interrupt requests, any data signal in the UDB array routing can also be used to generate a request. A single peripheral may generate multiple independent interrupt requests simplifying system and firmware design. Figure 7-14 shows the structure of the IDMUX (Interrupt/DMA Multiplexer). Figure 7-14. Interrupt and DMA Processing in the IDMUX Interrupt and DMA Processing in IDMUX Fixed Function IRQs 0 1 IRQs Interrupt Controller 2 Edge Detect DRQs DMA termout (IRQs) 0 3 UDB Array Fixed Function DRQs 1 Edge Detect 2 DMA Controller Document Number: 001-55036 Rev. *A Page 40 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 7.4.1 I/O Port Routing There are a total of 20 DSI routes to a typical 8-bit I/O port, 16 for data and four for drive strength control. When an I/O pin is connected to the routing, there are two primary connections available, an input and an output. In conjunction with drive strength control, this can implement a bidirectional I/O pin. A data output signal has the option to be single synchronized (pipelined) and a data input signal has the option to be double synchronized. The synchronization clock is the system clock (see Figure 6-1). Normally all inputs from pins are synchronized as this is required if the CPU interacts with the signal or any signal derived from it. Asynchronous inputs have rare uses. An example of this is a feed through of combinational PLD logic from input pins to output pins. There are four more DSI connections to a given I/O port to implement dynamic output enable control of pins. This connectivity gives a range of options, from fully ganged 8-bits controlled by one signal, to up to four individually controlled pins. The output enable signal is useful for creating tri-state bidirectional pins and buses. Figure 7-17. I/O Pin Output Enable Connectivity 4 IO Control Signal Connections from UDB Array Digital System Interface Figure 7-15. I/O Pin Synchronization Routing DO OE PIN 0 OE PIN1 OE PIN2 OE PIN3 OE PIN4 OE PIN5 OE PIN6 OE PIN7 DI Port i Figure 7-16. I/O Pin Output Connectivity 8 IO Data Output Connections from the UDB Array Digital System Interface 7.5 CAN The CAN peripheral is a fully functional Controller Area Network (CAN) supporting communication baud rates up to 1 Mbps. The CAN controller implements the CAN2.0A and CAN2.0B specifications as defined in the Bosch specification and conforms to the ISO-11898-1 standard. The CAN protocol was originally designed for automotive applications with a focus on a high level of fault detection. This ensures high communication reliability at a low cost. Because of its success in automotive applications, CAN is used as a standard communication protocol for motion oriented machine control networks (CANOpen) and factory automation applications (DeviceNet). The CAN controller features allow the efficient implementation of higher level protocols without affecting the performance of the microcontroller CPU. Full configuration support is provided in PSoC Creator. DO PIN 0 DO PIN1 DO PIN2 DO PIN3 DO PIN4 DO PIN5 DO PIN6 DO PIN7 Port i Document Number: 001-55036 Rev. *A Page 41 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 7-18. CAN Bus System Implementation CAN Node 1 PSoC CAN Drivers CAN Controller CAN Node 2 CAN Node n En Tx Rx CAN Transceiver CAN_H CAN_L CAN_H CAN_L CAN Bus CAN_H CAN_L 7.5.1 CAN Features CAN2.0A/B protocol implementation - ISO 11898 compliant Standard and extended frames with up to 8 bytes of data per frame Message filter capabilities Remote Transmission Request (RTR) support Programmable bit rate up to 1 Mbps Listen Only mode SW readable error counter and indicator Sleep mode: Wake the device from sleep with activity on the Rx pin Supports two or three wire interface to external transceiver (Tx, Rx, and Enable). The three-wire interface is compatible with the Philips PHY; the PHY is not included on-chip. The three wires can be routed to any I/O Enhanced interrupt controller CAN receive and transmit buffers status CAN controller error status including BusOff Receive path 16 receive buffers each with its own message filter Enhanced hardware message filter implementation that covers the ID, IDE and RTR DeviceNet addressing support Multiple receive buffers linkable to build a larger receive message array Automatic transmission request (RTR) response handler Lost received message notification Transmit path Eight transmit buffers Programmable transmit priority Round robin Fixed priority Message transmissions abort capability 7.5.2 Software Tools Support CAN Controller configuration integrated into PSoC Creator: CAN Configuration walkthrough with bit timing analyzer Receive filter setup Document Number: 001-55036 Rev. *A Page 42 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 7-19. CAN Controller Block Diagram TxMessage0 TxReq TxAbort Tx Buffer Status TxReq Pending TxMessage1 TxReq TxAbort Priority Arbiter Bit Timing Tx Tx CAN Framer CRC Generator TxInterrupt Request (if enabled) TxMessage6 TxReq TxAbort TxMessage7 TxReq TxAbort RTR RxMessages 0-15 Error Status Error Active Error Passive Bus Off Tx Error Counter Rx Error Counter Rx Buffer Status RxMessage Available RxMessage0 RxMessage1 Acceptance Code 0 Acceptance Code 1 Acceptance Mask 0 Acceptance Mask 1 RxMessage Handler Rx CAN Framer CRC Check Rx RxMessage14 RxInterrupt Request (if enabled) RxMessage15 Acceptance Code 14 Acceptance Code 15 Acceptance Mask 14 Acceptance Mask 15 ErrInterrupt Request (if enabled) Error Detection CRC Form ACK Bit Stuffing Bit Error Overload Arbitration WakeUp Request 7.6 USB PSoC includes a dedicated Full-Speed (12 Mbps) USB 2.0 transceiver supporting all four USB transfer types: control, interrupt, bulk, and isochronous. The maximum data payload size is 64 bytes for control, interrupt, and bulk endpoints and 1023 bytes for isochronous. PSoC Creator provides full configuration support. USB interfaces to hosts through two dedicated USBIO pins, which are detailed in the “I/O System and Routing” section on page 26. USB includes the following features: Eight unidirectional data endpoints One bidirectional control endpoint 0 (EP0) Shared 512-byte buffer for the eight data endpoints Dedicated 8-byte buffer for EP0 Three memory modes Manual Memory Management with No DMA Access Manual Memory Management with Manual DMA Access Automatic Memory Management with Automatic DMA Access Internal 3.3V regulator for transceiver Document Number: 001-55036 Rev. *A Internal 48 MHz oscillator that auto locks to USB bus clock, requiring no external crystal for USB (USB equipped parts only) Interrupts on bus and each endpoint event, with device wakeup USB Reset, Suspend, and Resume operations Bus powered and self powered modes Figure 7-20. USB Arbiter System Bus 512 X 8 SRAM SIE (Serial Interface Engine) Interrupts 48 MHz IMO USB IO D+ D- Page 43 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 7.8 I2C The I2C peripheral provides a synchronous two wire interface designed to interface the PSoC device with a two wire I2C serial communication bus. The bus is compliant with Philips ‘The I2C Specification’ version 2.1. Additional I2C interfaces can be instantiated using Universal Digital Blocks (UDBs) in PSoC Creator, as required. To eliminate the need for excessive CPU intervention and overhead, I2C specific support is provided for status detection and generation of framing bits. I2C operates as a slave, a master, or multimaster (Slave and Master). In slave mode, the unit always listens for a start condition to begin sending or receiving data. Master mode supplies the ability to generate the Start and Stop conditions and initiate transactions. Multimaster mode provides clock synchronization and arbitration to allow multiple masters on the same bus. If Master mode is enabled and Slave mode is not enabled, the block does not generate interrupts on externally generated Start conditions. I2C interfaces through the DSI routing and allows direct connections to any GPIO or SIO pins. I2C provides hardware address detect of a 7-bit address without CPU intervention. Additionally the device can wake from low power modes on a 7-bit hardware address match. If wakeup functionality is required, I2C pin connections are limited to the two special sets of SIO pins. I2C features include: Slave and Master, Transmitter, and Receiver operation Byte processing for low CPU overhead Interrupt or polling CPU interface Support for bus speeds up to 1 Mbps (3.4 Mbps in UDBs) 7 or 10-bit addressing (10-bit addressing requires firmware support) SMBus operation (through firmware support - SMBus supported in hardware in UDBs) 7-bit hardware address compare Wake from low power modes on address match 7.7 Timers, Counters, and PWMs The Timer/Counter/PWM peripheral is a 16-bit dedicated peripheral providing three of the most common embedded peripheral features. As almost all embedded systems use some combination of timers, counters, and PWMs. Four of them have been included on this PSoC device family. Additional and more advanced functionality timers, counters, and PWMs can also be instantiated in Universal Digital Blocks (UDBs) as required. PSoC Creator allows designers to choose the timer, counter, and PWM features that they require. The tool set utilizes the most optimal resources available. The Timer/Counter/PWM peripheral can select from multiple clock sources, with input and output signals connected through the DSI routing. DSI routing allows input and output connections to any device pin and any internal digital signal accessible through the DSI. Each of the four instances has a compare output, terminal count output (optional complementary compare output), and programmable interrupt request line. The Timer/Counter/PWMs are configurable as free running, one shot, or Enable input controlled. The peripheral has timer reset and capture inputs, and a kill input for control of the comparator outputs. The peripheral supports full 16-bit capture. Timer/Counter/PWM features include: 16-bit Timer/Counter/PWM (down count only) Selectable clock source PWM comparator (configurable for LT, LTE, EQ, GTE, GT) Period reload on start, reset, and terminal count Interrupt on terminal count, compare true, or capture Dynamic counter reads Timer capture mode Count while enable signal is asserted mode Free run mode One Shot mode (stop at end of period) Complementary PWM outputs with deadband PWM output kill Figure 7-21. Timer/Counter/PWM Clock Reset Enable Capture Kill Timer / Counter / PWM 16-bit IRQ TC / Compare! Compare Document Number: 001-55036 Rev. *A Page 44 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 8. Analog Subsystem The analog programmable system creates application specific combinations of both standard and advanced analog signal processing blocks. These blocks are then interconnected to each other and also to any pin on the device, providing a high level of design flexibility and IP security. The features of the analog subsystem are outlined here to provide an overview of capabilities and architecture. Flexible, configurable analog routing architecture provided by analog globals, analog mux bus, and analog local buses Two successive approximation (SAR) ADCs Four 8-bit DACs that provide either voltage or current output Four comparators with optional connection to configurable LUT outputs Four configurable switched capacitor/continuos time (SC/CT) blocks for functions that include opamp, unity gain buffer, programmable gain amplifier, transimpedance amplifier, and mixer Four opamps for internal use and connection to GPIO that can be used as high current output buffers CapSense subsystem to enable capacitive touch sensing Precision reference for generating an accurate analog voltage for internal analog blocks 7.9 Digital Filter Block Some devices in the CY8C54 family of devices have a dedicated HW accelerator block used for digital filtering. The DFB has a dedicated multiplier and accumulator that calculates a 24-bit by 24-bit multiply accumulate in one system clock cycle. This enables the mapping of a direct form FIR filter that approaches a computation rate of one FIR tap for each clock cycle. The MCU can implement any of the functions performed by this block, but at a slower rate that consumes significant MCU bandwidth. The PSoC Creator interface provides a wizard to implement FIR and IIR digital filters with coefficients for LPF, BPF, HPF, Notch and arbitrary shape filters. 64 pairs of data and coefficients are stored. This enables a 64 tap FIR filter or up to 4 16 tap filters of either FIR or IIR formulation. Figure 7-22. DFB Application Diagram (pwr/gnd not shown) BUSCLK read_data write_data addr Digital Filter Block System Bus Data Source (PHUB) Digital Routing Data Dest (PHUB) DMA Request DMA CTRL The typical use model is for data to be supplied to the DFB over the system bus from another on-chip system data source such as an ADC. The data typically passes through main memory or is directly transferred from another chip resource through DMA. The DFB processes this data and passes the result to another on chip resource such as a DAC or main memory through DMA on the system bus. Data movement in or out of the DFB is typically controlled by the system DMA controller but can be moved directly by the MCU. Document Number: 001-55036 Rev. *A Page 45 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 8-1. Analog Subsystem Block Diagram S AR SAR DAC DAC Op amp G PIO Port A N A L O G DAC Precision Reference DAC SC/CT Block SC/CT Block Op amp A N A L O G GPIO Port SC/CT Block SC/CT Block R O U T I N G C om parators CM P CM P CM P CM P R O U T I N G Op amp Op amp CapSense Subsystem A nalog Interface Config & Status Registers AHB PHUB CPU DSI Array Clock Distribution The PSoC Creator software program provides a user friendly interface to configure the analog connections between the GPIO and various analog resources and also connections from one analog resource to another. PSoC Creator also provides component libraries that allow you to configure the various analog blocks to perform application specific functions (PGA, transimpedance amplifier, voltage DAC, current DAC, and so on). The tool also generates API interface libraries that allow you to write firmware that allows the communication between the analog peripheral and CPU/Memory. Each GPIO is connected to one analog global and one analog mux bus 8 Analog local buses (abus) to route signals between the different analog blocks Multiplexers and switches for input and output selection of the analog blocks 8.1.2 Functional Description Analog globals (AGs) and analog mux buses (AMUXBUS) provide analog connectivity between GPIOs and the various analog blocks. There are 16 AGs in the CY8C38 family. The analog routing architecture is divided into four quadrants as shown in Figure 8-2. Each quadrant has four analog globals (AGL[0..3], AGL[4..7], AGR[0..3], AGR[4..7]). Each GPIO is connected to the corresponding AG through an analog switch. The analog mux bus is a shared routing resource that connects to every GPIO through an analog switch. There are two AMUXBUS routes in CY8C38, one in the left half (AMUXBUSL) and one in the right half (AMUXBUSR), as shown in Figure 8-2. 8.1 Analog Routing The CY8C38 family of devices has a flexible analog routing architecture that provides the capability to connect GPIOs and different analog blocks, and also route signals between different analog blocks. One of the strong points of this flexible routing architecture is that it allows dynamic routing of input and output connections to the different analog blocks. 8.1.1 Features Flexible, configurable analog routing architecture 16 Analog globals (AG) and two analog mux buses (AMUXBUS) to connect GPIOs and the analog blocks Document Number: 001-55036 Rev. *A Page 46 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 8-2. CY8C54 Analog Interconnect Vssio Vdab SIO P12[2] SIO P12[3] GPIO P4[0] GPIO P4[1] GPIO P0[0] GPIO P0[1] GPIO P0[2] GPIO P0[3] Vdda Vsab Vssa Vcca Vssd AMUXBUSL AGL[4] AGL[5] AGL[6] AGL[7] AGL[4] AGL[5] AGL[6] AGL[7] ExVrefL ExVrefL1 opamp0 opamp2 AMUXBUSR AGR[4] AGR[5] AGR[6] AGR[7] 44 * * AMUXBUSL ExVrefL2 opamp3 opamp1 GPIO P0[4] GPIO P0[5] GPIO P0[6] GPIO P0[7] GPIO P4[2] GPIO P4[3] GPIO P4[4] GPIO P4[5] GPIO P4[6] GPIO P4[7] Vccd Vssd Vssio Vddd 01 2 3 4 56 7 0123 3210 76543210 * * i0 i2 1.024V in0 out0 LPF 5 in1 out1 comp1 1.024V + comp0 1.024V + 1.024V COMPARATOR + comp2 90 comp3 + 0.256V vda, vda/2 1.024V 1.2V - out ref in refbufl Vssa CAPSENSE refbufr out ref in sc1 Vin Vref out Vin Vref out sc3 Vssa 1.024V 1.2V AGR[7] AGR[6] AGR[5] 1.024V ABUSL0 ABUSL1 ABUSL2 ABUSL3 v0 i0 v2 i2 0.256V ABUSR0 ABUSR1 ABUSR2 ABUSR3 v1 i1 v3 i3 AGL[1] AGL[2] AGL[3] Vio2 AMUXBUSL AGL[0] : AUX ADC VBE VSS ref LPF AGL[3] AGL[2] AGL[1] AGL[0] AMUXBUSL 13 AGR[3] AGR[2] AGR[1] AGR[0] AMUXBUSR * GPIO P2[5] GPIO P2[6] GPIO P2[7] SIO P12[4] SIO P12[5] GPIO P6[4] GPIO P6[5] GPIO P6[6] GPIO P6[7] GPIO P5[0] GPIO P5[1] GPIO P5[2] GPIO P5[3] GPIO P1[0] GPIO P1[1] GPIO P1[2] GPIO P1[3] GPIO P1[4] GPIO P1[5] Connection Ind 93/122 Large (lower z) Vb 266 Small (higher z) Other: DFT 24 Small LCD 15 Small XRES_N # Size Notes: * Denotes pins on all packages LCD signals are not shown. Vssio Vssb Vssd Vbat Vio1 Mux Group Switch Group * * * * Document Number: 001-55036 Rev. *A AGR[0] AMUXBUSR AGR[3] AGR[2] AGR[1] GPIO P6[0] GPIO P6[1] GPIO P6[2] GPIO P6[3] GPIO P15[4] GPIO P15[5] GPIO P2[0] GPIO P2[1] GPIO P2[2] GPIO P2[3] * GPIO P2[4] * VIDAC 36 0.8V 0.7V 1.2V 1.024V vpwra, vpwra/2 Vssa vda, vda/4 CY8C55 only 1.2V 1.024V vda, vda/2 Vp (+) Vn (-) SAR0 Vrefhi_out refs ExVrefL1 AMUXBUSL SAR ADC (+) Vp SAR1 (-) Vn Vrefhi_out refs vda, vda/2 1.2V 1.024V ExVrefL2 01 23456 7 0123 ANALOG ANALOG GLOBALS BUS 3210 76543210 ANALOG ANALOG BUS GLOBALS AMUXBUSR Rev #43 22-Apr-2009 * 104 * Vin Vref out sc2 SC/CT 1.024V * sc0 Vin Vref out AGR[4] AMUXBUSR * * * * * * * * * * * * * GPIO P3[6] GPIO P3[7] SIO P12[0] SIO P12[1] GPIO P15[2] GPIO P15[3] * * * * * * * * Vio0 Vio3 * ExVrefR i3 i1 GPIO P3[5] GPIO P3[4] GPIO P3[3] GPIO P3[2] GPIO P3[1] GPIO P3[0] GPXT *P15[1] GPXT *P15[0] * * * * * * Vccd Vssio Vssd Vddd Vusb * P15[7] * P15[6] GPIO P5[7] GPIO P5[6] GPIO P5[5] GPIO P5[4] SIO P12[7] SIO P12[6] GPIO *P1[7] GPIO *P1[6] USB IO USB IO Page 47 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Analog local buses (abus) are routing resources located within the analog subsystem and are used to route signals between different analog blocks. There are eight abus routes in CY8C38, four in the left half (abusl [0:3]) and four in the right half (abusr [0:3]) as shown in Figure 8-2. Using the abus saves the analog globals and analog mux buses from being used for interconnecting the analog blocks. Multiplexers and switches exist on the various buses to direct signals into and out of the analog blocks. A multiplexer can have only one connection on at a time, whereas a switch can have multiple connections on simultaneously. In Figure 8-2, multiplexers are indicated by grayed ovals and switches are indicated by transparent ovals. 8.2.2 Conversion Signals Writing a start bit or assertion of a Start of Frame (SOF) signal is used to start a conversion. SOF can be used in applications where the sampling period is longer than the conversion time, or when the ADC needs to be synchronized to other hardware. This signal is optional and does not need to be connected if the SAR ADC is running in a continuous mode. A digital clock or UDB output can be used to drive this input. When the SAR is first powered up or awakened from any of the sleeping modes, there is a power up wait time of 10 µs before it is ready to start the first conversion. When the conversion is complete, a status bit is set and the output signal End of Frame (EOF) asserts and remains asserted until the value is read by either the DMA controller or the CPU. The EOF signal may be used to trigger an interrupt or a DMA request. 8.2 Successive Approximation ADCs The CY8C54 family of devices has two Successive Approximation (SAR) ADCs. These ADCs are 12-bit at up to 1 Msps, with single-ended or differential inputs, making them useful for a wide variety of sampling and control applications. 8.2.3 Operational Modes A ONE_SHOT control bit is used to set the SAR ADC conversion mode to either continuous or one conversion per SOF signal. DMA transfer of continuous samples, without CPU intervention, is supported. 8.2.1 Functional Description In a SAR ADC an analog input signal is sampled and compared with the output of a DAC. A binary search algorithm is applied to the DAC and used to determine the output bits in succession from MSB to LSB. A block diagram of one SAR ADC is shown in Figure 8-3. Figure 8-3. SAR ADC Block Diagram 8.3 Comparators The CY8C54 family of devices contains four comparators. Comparators have these features: Input offset factory trimmed to less than 5 mV Rail-to-rail common mode input range (Vssa to Vcca) vin vrefp vrefn S/H DAC array D0:D11 comparator SAR digital D0:D11 Speed and power can be traded off by using one of three modes: fast, slow, or ultra low power Comparator outputs can be routed to look up tables to perform simple logic functions and then can also be routed to digital blocks The positive input of the comparators may be optionally passed through a low pass filter. Two filters are provided Comparator inputs can be connections to GPIO, DAC outputs and SC block outputs autozero reset clock clock POWER GROUND power filtering vrefp vrefn 8.3.1 Input and Output Interface The input is connected to the analog globals and muxes. The frequency of the clock is 16 times the sample rate; the maximum clock rate is 16 MHz. The positive and negative inputs to the comparators come from the analog global buses, the analog mux line, the analog local bus and precision reference through multiplexers. The output from each comparator could be routed to any of the two input LUTs. The output of that LUT is routed to the UDB Digital System Interface. Document Number: 001-55036 Rev. *A Page 48 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 8-4. Analog Comparator From Analog Routing + comp0 _ ANAIF + comp1 _ From Analog Routing From Analog Routing comp2 + _ comp3 + _ From Analog Routing 4 4 4 4 4 4 4 4 LUT0 LUT1 LUT2 LUT3 UDBs 8.3.2 LUT The CY8C54 family of devices contains four LUTs. The LUT is a two input, one output lookup table that is driven by any one or two of the comparators in the chip. The output of any LUT is routed to the digital system interface of the UDB array. From the digital system interface of the UDB array, these signals can be connected to UDBs, DMA controller, I/O, or the interrupt controller. The LUT control word written to a register sets the logic function on the output. The available LUT functions and the associated control word is shown in Table 8-1. Table 8-1. LUT Function vs. Program Word and Inputs Control Word Output (A and B are LUT inputs) FALSE (‘0’) A AND B A AND (NOT B) Table 8-1. LUT Function vs. Program Word and Inputs (conControl Word Output (A and B are LUT inputs) 0100b 0101b 0110b 0111b 1000b 1001b 1010b 1011b 1100b 1101b 1110b 1111b (NOT A) AND B B A XOR B A OR B A NOR B A XNOR B NOT B A OR (NOT B) NOT A (NOT A) OR B A NAND B TRUE (‘1’) 0000b 0001b 0010b 0011b A Document Number: 001-55036 Rev. *A Page 49 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 8.4 Opamps The CY8C54 family of devices contain four general purpose opamps. Figure 8-5. Opamp GPIO Analog Global Bus Analog Global Bus VREF Analog Internal Bus GPIO The opamp has three speed modes, slow, medium, and fast. The slow mode consumes the least amount of quiescent power and the fast mode consumes the most power. The inputs are able to swing rail-to-rail. The output swing is capable of rail-to-rail operation at low current output, within 50 mV of the rails. When driving high current loads (about 25 mA) the output voltage may only get within 500 mV of the rails. 8.5 Programmable SC/CT Blocks Opamp GPIO The CY8C54 family of devices contains four switched capacitor/continuous time (SC/CT) blocks. Each switched capacitor/continuous time block is built around a single rail-to-rail high bandwidth opamp. Switched capacitor is a circuit design technique that uses capacitors plus switches instead of resistors to create analog functions. These circuits work by moving charge between capacitors by opening and closing different switches. Nonoverlapping in phase clock signals control the switches, so that not all switches are ON simultaneously. The PSoC Creator tool offers a user friendly interface, which allows you to easily program the SC/CT blocks. Switch control and clock phase control configuration is done by PSoC Creator so users only need to determine the application use parameters such as gain, amplifier polarity, vref connection, and so on. The same opamps and block interfaces are also connectable to an array of resistors which allows the construction of a variety of continuous time functions. The opamp and resistor array is programmable to perform various analog functions including Naked Operational Amplifier - Continuous Mode = Analog Switch The opamp is uncommitted and can be configured as a gain stage or voltage follower on external or internal signals. See Figure 8-6. In any configuration, the input and output signals can all be connected to the internal global signals and monitored with an ADC, or comparator. The configurations are implemented with switches between the signals and GPIO pins. Figure 8-6. Opamp Configurations a) Voltage Follower Opamp Vin Vout to Pin Unity-Gain Buffer - Continuous Mode Programmable Gain Amplifier (PGA) - Continuous Mode Transimpedance Amplifier (TIA) - Continuous Mode b) External Uncommitted Opamp Up/Down Mixer - Continuous Mode Sample and Hold Mixer (NRZ S/H) - Switched Cap Mode First Order Analog to Digital Modulator - Switched Cap Mode Opamp Vout to GPIO 8.5.1 Naked Opamp The Naked Opamp presents both inputs and the output for connection to internal or external signals. The opamp has a unity gain bandwidth greater than 6.0 MHz and output drive current up to 650 µA. This is sufficient for buffering internal signals (such as DAC outputs) and driving external loads greater than 7.5 kohms. Vp to GPIO Vn to GPIO 8.5.2 Unity Gain c) Internal Uncommitted Opamp The Unity Gain buffer is a Naked Opamp with the output directly connected to the inverting input for a gain of 1.00. It has a -3 dB bandwidth greater than 6.0 MHz. Vn To Internal Signals 8.5.3 PGA Opamp Vout to Pin Vp GPIO Pin The PGA amplifies an external or internal signal. The PGA can be configured to operate in inverting mode or noninverting mode. The PGA function may be configured for both positive and negative gains as high as 50 and 49 respectively. The gain is adjusted by changing the values of R1 and R2 as illustrated in Figure 8-7. The schematic in Figure 8-7 shows the configuration Page 50 of 93 Document Number: 001-55036 Rev. *A [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet and possible resistor settings for the PGA. The gain is switched from inverting and non inverting by changing the shared select value of the both the input muxes. The bandwidth for each gain case is listed in Table 8-2. Table 8-2. Bandwidth Gain Bandwidth Figure 8-8. Continuous Time TIA Schematic R fb 1 24 48 50 6.0 MHz 340 kHz 220 kHz 215 kHz I in V ref V out Figure 8-7. PGA Resistor Settings R1 R2 Vin Vref S Vref Vin 0 1 20k or 40k 20k to 980k The TIA configuration is used for applications where an external sensor's output is current as a function of some type of stimulus such as temperature, light, magnetic flux etc. In a common application, the voltage DAC output can be connected to the VREF TIA input to allow calibration of the external sensor bias current by adjusting the voltage DAC output voltage. 8.6 LCD Direct Drive 0 1 The PGA is used in applications where the input signal may not be large enough to achieve the desired resolution in the ADC, or dynamic range of another SC/CT block such as a mixer. The gain is adjustable at runtime, including changing the gain of the PGA prior to each ADC sample. The PSoC Liquid Crystal Display (LCD) driver system is a highly configurable peripheral designed to allow PSoC to directly drive a broad range of LCD glass. All voltages are generated on chip, eliminating the need for external components. With a high multiplex ratio of up to 1/16, the CY8C54 family LCD driver system can drive a maximum of 736 segments. The PSoC LCD driver module was also designed with the conservative power budget of portable devices in mind, enabling different LCD drive modes and power down modes to conserve power. PSoC Creator provides an LCD segment drive component. The component wizard provides easy and flexible configuration of LCD resources. You can specify pins for segments and commons along with other options. The software configures the device to meet the required specifications. This is possible because of the programmability inherent to PSoC devices. Key features of the PSoC LCD segment system are: LCD panel direct driving Type A (standard) and Type B (low power) waveform support Wide operating voltage range support (2V to 5V) for LCD panels Static, 1/2, 1/3, 1/4, 1/5 bias voltage levels Internal bias voltage generation through internal resistor ladder Up to 62 total common and segment outputs Up to 1/16 multiplex for a maximum of 16 backplane/common outputs Up to 62 front plane/segment outputs for direct drive Drives up to 736 total segments (16 backplane x 46 front plane) Up to 128 levels of software controlled contrast Ability to move display data from memory buffer to LCD driver through DMA (without CPU intervention) Adjustable LCD refresh rate from 10 Hz to 150 Hz 8.5.4 TIA The Transimpedance Amplifier (TIA) converts an internal or external current to an output voltage. The TIA uses an internal feedback resistor in a continuous time configuration to convert input current to output voltage. For an input current Iin, the output voltage is Iin x Rfb +Vref, where Vref is the value placed on the non inverting input. The feedback resistor Rfb is programmable between 20 KΩ and 1 MΩ through a configuration register. Table 8-3 shows the possible values of Rfb and associated configuration settings. Table 8-3. Feedback Resistor Settings Configuration Word Nominal Rfb (KΩ) 000b 001b 010b 011b 100b 101b 110b 111b 20 30 40 60 120 250 500 1000 Document Number: 001-55036 Rev. *A Page 51 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Ability to invert LCD display for negative image Three LCD driver drive modes, allowing power optimization LCD driver configurable to be active when PSoC is in limited active mode Figure 8-9. LCD System LCD DAC also produces a DMA request to initiate the transfer of the next frame of LCD data. 8.6.4 LCD DAC The LCD DAC generates the contrast control and bias voltage for the LCD system. The LCD DAC produces up to five LCD drive voltages plus ground, based on the selected bias ratio. The bias voltages are driven out to GPIO pins on a dedicated LCD bias bus, as required. Global Clock 8.7 CapSense The CapSense system provides a versatile and efficient means for measuring capacitance in applications such as touch sense buttons, sliders, proximity detection, etc. The CapSense system uses a configuration of system resources, including a few hardware functions primarily targeted for CapSense, to realize various sensing algorithms. Specific resource usage is detailed in the CapSense component in PSoC Creator. A capacitive sensing method using a Delta-Sigma Modulator (CSD) is used. It provides capacitance sensing using a switched capacitor technique with a delta-sigma modulator to convert the sensing current to a digital code. UDB LCD Driver Block DMA Display RAM PIN 8.8 Temp Sensor PHUB 8.6.1 LCD Segment Pin Driver Each GPIO pin contains an LCD driver circuit. The LCD driver buffers the appropriate output of the LCD DAC to directly drive the glass of the LCD. A register setting determines whether the pin is a common or segment. The pin’s LCD driver then selects one of the six bias voltages to drive the I/O pin, as appropriate for the display data. Die temperature is used to establish programming parameters for writing Flash. Die temperature is measured using a dedicated sensor based on a forward biased transistor. The temperature sensor has its own auxiliary ADC. 8.9 DAC The CY8C54 parts contain four Digital to Analog Convertors (DACs). Each DAC is 8-bit and can be configured for either voltage or current output. The DACs support CapSense, power supply regulation, and waveform generation. Each DAC has the following features. Adjustable voltage or current output in 255 steps Programmable step size (range selection) Eight bits of calibration to correct ± 25% of gain error Source and sink option for current output 8 Msps conversion rate for current output 1 Msps conversion rate for voltage output Monotonic in nature 8.6.2 Display Data Flow The LCD segment driver system reads display data and generates the proper output voltages to the LCD glass to produce the desired image. Display data resides in a memory buffer in the system SRAM. Each time you need to change the common and segment driver voltages, the next set of pixel data moves from the memory buffer into the Port Data Registers via DMA. 8.6.3 UDB and LCD Segment Control A UDB is configured to generate the global LCD control signals and clocking. This set of signals is routed to each LCD pin driver through a set of dedicated LCD global routing channels. In addition to generating the global LCD control signals, the UDB Document Number: 001-55036 Rev. *A Page 52 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 8-10. DAC Block Diagram I source  Range  1x , 8x , 64x   Reference  Source  Scaler   Vout  R    3R     I sink  Range     1x , 8x , 64x    Iout    8.9.1 Current DAC The current DAC (IDAC) can be configured for the ranges 0 to 32 µA, 0 to 256 µA, and 0 to 2.048 mA. The IDAC can be configured to source or sink current. Figure 8-11. Mixer Configuration C2 = 1.7 pF 8.9.2 Voltage DAC For the voltage DAC (VDAC), the current DAC output is routed through resistors. The two ranges available for the VDAC are 0 to 1.024V and 0 to 4.096V. In voltage mode any load connected to the output of a DAC should be purely capacitive (the output of the VDAC is not buffered). C1 = 850 fF Rmix 0 20k or 40k Rmix 0 20k or 40k Vin 0 sc_clk Vout 8.10 Up/Down Mixer In continuous time mode, the SC/CT block components are used to build an up or down mixer. Any mixing application contains an input signal frequency and a local oscillator frequency. The polarity of the clock, Fclk, switches the amplifier between inverting or noninverting gain. The output is the product of the input and the switching function from the local oscillator, with frequency components at the local oscillator plus and minus the signal frequency (Fclk + Fin and Fclk - Fin) and reduced-level frequency components at odd integer multiples of the local oscillator frequency. The local oscillator frequency is provided by the selected clock source for the mixer. Continuous time up and down mixing works for applications with input signals and local oscillator frequencies up to 1 MHz. Vref sc_clk 1 8.11 Sample and Hold The main application for a sample and hold, is to hold a value stable while an ADC is performing a conversion. Some applications require multiple signals to be sampled simultaneously, such as for power calculations (V and I). Document Number: 001-55036 Rev. *A Page 53 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Figure 8-12. Sample and Hold Topology (Φ1 and Φ2 are opposite phases of a clock) Φ1 Vi C1 Φ1 Φ2 C2 Φ1 n V ref Φ2 Φ2 V out PSoC devices include extensive support for programming, testing, debugging, and tracing both hardware and firmware. Four interfaces are available: JTAG, SWD, SWV, and TRACEPORT. JTAG and SWD support all programming and debug features of the device. JTAG also supports standard JTAG scan chains for board level test and chaining multiple JTAG devices for programming or testing. The SWV and TRACEPORT provide trace output from the DWT, ETM, and ITM. TRACEPORT is faster but uses more pins. SWV is slower but uses only one pin. Cortex-M3 debug and trace functionality enables full device debugging in the final system using the standard production device. It does not require special interfaces, debugging pods, simulators, or emulators. Only the standard programming connections are required to fully support debug. Φ1 Φ1 Φ2 Φ1 V ref Φ2 C3 C4 Φ2 Vref 8.11.1 Down Mixer The S+H can be used as a mixer to down convert an input signal. This circuit is a high bandwidth passive sample network that can sample input signals up to 14 MHz. This sampled value is then held using the opamp with a maximum clock rate of 4 MHz. The output frequency is at the difference between the input frequency and the highest integer multiple of the Local Oscillator that is less than the input. The PSoC Creator IDE software provides fully integrated programming and debug support for PSoC devices. The low cost MiniProg3 programmer and debugger is designed to provide full programming and debug support of PSoC devices in conjunction with the PSoC Creator IDE. PSoC JTAG, SWD, and SWV interfaces are fully compatible with industry standard third party tools. All Cortex-M3 debug and trace modules are disabled by default and can only be enabled in firmware. If not enabled, the only way to reenable them is to erase the entire device, clear Flash protection, and reprogram the device with new firmware that enables them. Disabling debug and trace features, robust Flash protection, and hiding custom analog and digital functionality inside the PSoC device provide a level of security not possible with multichip application solutions. Additionally, all device interfaces can be permanently disabled (Device Security) for applications concerned about phishing attacks due to a maliciously reprogrammed device. Permanently disabling interfaces is not recommended in most applications because the designer then cannot access the device. Because all programming, debug, and test interfaces are disabled when Device Security is enabled, PSoCs with Device Security enabled may not be returned for failure analysis. 8.11.2 First Order Modulator - SC Mode A first order modulator is constructed by placing the switched capacitor block in an integrator mode and using a comparator to provide a 1-bit feedback to the input. Depending on this bit, a reference voltage is either subtracted or added to the input signal. The block output is the output of the comparator and not the integrator in the modulator case. The signal is downshifted and buffered and then processed by a decimator to make a delta-sigma converter or a counter to make an incremental converter. The accuracy of the sampled data from the first-order modulator is determined from several factors. The main application for this modulator is for a low frequency ADC with high accuracy. Applications include strain gauges, thermocouples, precision voltage, and current measurement 9.1 JTAG Interface The IEEE 1149.1 compliant JTAG interface exists on four or five pins (the nTRST pin is optional). The JTAG clock frequency can be up to 8 MHz. By default, the JTAG pins are enabled on new devices but the JTAG interface can be disabled, allowing these pins to be used as General Purpose I/O (GPIO) instead. The JTAG interface is used for programming the Flash memory, debugging, I/O scan chains, and JTAG device chaining. 9. Programming, Debug Interfaces, Resources The Cortex-M3 has internal debugging components, tightly integrated with the CPU, providing the following features: JTAG or SWD access Flash Patch and Breakpoint (FPB) block for implementing breakpoints and code patches Data Watchpoint and Trigger (DWT) block for implementing watchpoints, trigger resources, and system profiling Embedded Trace Macrocell (ETM) for instruction trace Instrumentation Trace Macrocell (ITM) for support of printf-style debugging 9.2 SWD Interface The SWD interface is the preferred alternative to the JTAG interface. It requires only two pins instead of the four or five needed by JTAG. SWD provides all of the programming and debugging features of JTAG at the same speed. SWD does not provide access to scan chains or device chaining. SWD uses two pins, either two of the JTAG pins (TMS and TCK) or the USBIO D+ and D- pins. The USBIO pins are useful for in system programming of USB solutions that would otherwise require a separate programming connector. One pin is used for the data clock and the other is used for data input and output. SWD can be enabled on only one of the pin pairs at a time. This only happens if, within 8 µs (key window) after reset, that pin pair Document Number: 001-55036 Rev. *A Page 54 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet (JTAG or USB) receives a predetermined sequence of 1s and 0s. SWD is used for debugging or for programming the Flash memory. The SWD interface can be enabled from the JTAG interface or disabled, allowing its pins to be used as GPIO. Unlike JTAG, the SWD interface can always be reacquired on any device during the key window. It can then be used to reenable the JTAG interface, if desired. When using SWD or JTAG pins as standard GPIO, make sure that the GPIO functionality and PCB circuits do not interfere with SWD or JTAG use. SWD may be used with either SWV or TRACEPORT, or JTAG may be used with TRACEPORT, as shown in Table 9-1. Table 9-1. Debug Configurations Debug and Trace Configuration All debug and trace disabled JTAG SWD SWV TRACEPORT JTAG + TRACEPORT SWD + SWV SWD + TRACEPORT GPIO Pins Used 0 4 or 5 2 1 5 9 or 10 3 7 9.3 Debug Features The CY8C54 supports the following debug features: Halt and single-step the CPU View and change CPU and peripheral registers, and RAM addresses Six program address breakpoints and two literal access breakpoints Data watchpoint events to CPU Patch and remap instruction from Flash to SRAM Debugging at the full speed of the CPU Debug operations are possible while the device is reset, or in low power modes Compatible with PSoC Creator and MiniProg3 programmer and debugger Standard JTAG programming and debugging interfaces make CY8C54 compatible with other popular third-party tools (for example, ARM / Keil) 9.6 Programming Features The JTAG and SWD interfaces provide full programming support. The entire device can be erased, programmed, and verified. Designers can increase Flash protection levels to protect firmware IP. Flash protection can only be reset after a full device erase. Individual Flash blocks can be erased, programmed, and verified, if block security settings permit. 9.7 Device Security PSoC 5 offers an advanced security feature called device security, which permanently disables all test, programming, and debug ports, protecting your application from external access. The device security is activated by programming a 32-bit key (0x50536F43) to a Write Once Latch (WOL). The Write Once Latch is a type of nonvolatile latch (NVL). The cell itself is an NVL with additional logic wrapped around it. Each WOL device contains four bytes (32 bits) of data. The wrapper outputs a ‘1’ if a super-majority (28 of 32) of its bits match a pre-determined pattern (0x50536F43); it outputs a ‘0’ if this majority is not reached. When the output is 1, the Write Once NV latch locks the part out of Debug and Test modes; it also permanently gates off the ability to erase or alter the contents of the latch. Matching all bits is intentionally not required, so that single (or few) bit failures do not deassert the WOL output. The state of the NVL bits after wafer processing is truly random with no tendency toward 1 or 0. The WOL only locks the part after the correct 32-bit key (0x50536F43) is loaded into the NVL's volatile memory, programmed into the NVL's nonvolatile cells, and the part is reset. The output of the WOL is only sampled on reset and used to disable the access. This precaution prevents anyone from reading, erasing, or altering the contents of the internal memory. The user can write the key into the WOL to lock out external access only if no Flash protection is set (see “Flash Security” section on page 15). However, after setting the values in the WOL, a user still has access to the part until it is reset. Therefore, a user can write the key into the WOL, program the Flash protection data, and then reset the part to lock it. If the device is protected with a WOL setting, Cypress cannot perform failure analysis and, therefore, cannot accept RMAs 9.4 Trace Features The following trace features are supported: Instruction trace Data watchpoint on access to data address, address range, or data value Trace trigger on data watchpoint Debug exception trigger Code profiling Counters for measuring clock cycles, folded instructions, load/store operations, sleep cycles, cycles per instruction, interrupt overhead Interrupt events trace Software event monitoring, “printf-style” debugging 9.5 SWV and TRACEPORT Interfaces The SWV and TRACEPORT interfaces provide trace data to a debug host via the Cypress MiniProg3 or an external trace port analyzer. The 5 pin TRACEPORT is used for rapid transmission of large trace streams. The single pin SWV mode is used to minimize the number of trace pins. SWV is shared with a JTAG pin. If debugging and tracing are done at the same time then Document Number: 001-55036 Rev. *A Page 55 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 10. Development Support The CY8C54 family has a rich set of documentation, development tools, and online resources to assist you during your development process. Visit psoc.cypress.com/getting-started to find out more. from customers. The WOL can be read out via Serial Wire Debug (SWD) port to electrically identify protected parts. The user can write the key in WOL to lock out external access only if no Flash protection is set. For more information on how to take full advantage of the security features in PSoC see the PSoC 5 TRM. Disclaimer Note the following details of the Flash code protection features on Cypress devices. Cypress products meet the specifications contained in their particular Cypress data sheets. Cypress believes that its family of products is one of the most secure families of its kind on the market today, regardless of how they are used. There may be methods, unknown to Cypress, that can breach the code protection features. Any of these methods, to our knowledge, would be dishonest and possibly illegal. Neither Cypress nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Cypress is willing to work with the customer who is concerned about the integrity of their code. Code protection is constantly evolving. We at Cypress are committed to continuously improving the code protection features of our products. 10.1 Documentation A suite of documentation, to ensure that you can find answers to your questions quickly, supports the CY8C54 family. This section contains a list of some of the key documents. Software User Guide: A step-by-step guide for using PSoC Creator. The software user guide shows you how the PSoC Creator build process works in detail, how to use source control with PSoC Creator, and much more. Component Data Sheets: The flexibility of PSoC allows the creation of new peripherals (components) long after the device has gone into production. Component data sheets provide all of the information needed to select and use a particular component, including a functional description, API documentation, example code, and AC/DC specifications. Application Notes: PSoC application notes discuss a particular application of PSoC in depth; examples include brushless DC motor control and on-chip filtering. Application notes often include example projects in addition to the application note document. Technical Reference Manual: PSoC Creator makes designing with PSoC as easy as dragging a peripheral onto a schematic, but, when low level details of the PSoC device are required, use the technical reference manual (TRM) as your guide. Note Visit www.arm.com for detailed documentation about the Cortex-M3 CPU. 10.2 Online In addition to print documentation, the Cypress PSoC forums connect you with fellow PSoC users and experts in PSoC from around the world, 24 hours a day, 7 days a week. 10.3 Tools With industry standard cores, programming, and debugging interfaces, the CY8C54 family is part of a development tool ecosystem. Visit us at www.cypress.com/go/psoccreator for the latest information on the revolutionary, easy to use CyDesign IDE, supported third party compilers, programmers, debuggers, and development kits. Document Number: 001-55036 Rev. *A Page 56 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11. Electrical Specifications Specifications are valid for -40°C ≤ Ta ≤ 85°C and Tj ≤ 100°C, except where noted. Specifications are valid for 1.71V to 5.5V, except where noted. The unique flexibility of the PSoC UDBs and analog blocks enable many functions to be implemented in PSoC Creator components, see the component data sheets for full AC/DC specifications of individual functions. See the “Example Peripherals” section on page 32 for further explanation of PSoC Creator components. 11.1 Absolute Maximum Ratings Table 11-1. Absolute Maximum Ratings DC Specifications Parameter Tstorag Description Storage temperature Conditions Recommended storage temperature is 0°C - 50°C. Exposure to storage temperatures above 85°C for extended periods may affect device reliability. Min -55 Typ 25 Max 125 Units °C Vdda Vddd Vddio Vcca Vccd Vssa Vgpio[6] Vsio Vind Vbat Ivddio LU ESDHBM ESDCDM Analog supply voltage relative to Vssa Digital supply voltage relative to Vssd I/O supply voltage relative to Vssd Direct analog core voltage input Direct digital core voltage input Analog ground voltage DC input voltage on GPIO DC input voltage on SIO Voltage at boost converter input Boost converter supply Current per Vddio supply pin Latch up current Electro-static discharge voltage Electro-static discharge voltage Human Body Model Charge Device Model Includes signals sourced by Vdda and routed internal to the pin. Output disabled Output enabled -0.5 -0.5 -0.5 -0.5 -0.5 Vssd -0.5 Vssd -0.5 Vssd -0.5 Vssd -0.5 0.5 Vssd -0.5 -200 2000 500 - 6 6 6 1.95 1.95 Vssd + 0.5 Vddio + 0.5 7 6 5.5 5.5 100 200 - V V V V V V V V V V V mA mA V V Note Usage above the absolute maximum conditions listed in Table 11-1 may cause permanent damage to the device. Exposure to maximum conditions for extended periods of time may affect device reliability. When used below maximum conditions but above normal operating conditions the device may not operate to specification. Note 6. The Vddio supply voltage must be greater than the maximum analog voltage on the associated GPIO pins. Maximum analog voltage on GPIO pin ≤ Vddio ≤ Vdda. Document Number: 001-55036 Rev. *A Page 57 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11.2 Device Level Specifications Specifications are valid for -40°C ≤ Ta ≤ 85°C and Tj ≤ 100°C, except where noted. Specifications are valid for 1.71V to 5.5V, except where noted. 11.2.1 Device Level Specifications Table 11-2. DC Specifications Parameter Vdda Vdda Vddd Vddd Vddio[6] Vcca Vccd Vbat Idd[8] Description Conditions Min 1.8 1.71 1.8 1.71 1.71 Analog core regulator disabled Digital core regulator disabled 1.71 1.71 0.5 1.8 1.8 1.8 1.8 Typ Max 5.5 1.89 Vdda 1.89 Vdda 1.89 1.89 5.5 Units V V V V V V V V mA 2 mA mA µA µA µA µA 2 µA µA µA µA µA nA nA nA nA 300 nA nA nA nA nA Analog supply voltage and input to Analog core regulator enabled analog core regulator Analog supply voltage, analog regulator bypassed Digital supply voltage relative to Vssd Digital supply voltage, digital regulator bypassed I/O supply voltage relative to Vssio Direct analog core voltage input (Analog regulator bypass) Direct digital core voltage input (Digital regulator bypass) Voltage supplied to boost converter Active Mode, VDD = 1.71V - 5.5V Execute from Flash, CPU at 6 MHz T= -40°C T= 25°C T= 85°C Sleep Mode[7] CPU OFF RTC = ON (= ECO32K ON, in low power mode) WDT = OFF I2C wake = OFF Comparator = OFF POR = ON Boost = OFF SIO pins in single ended input, unregulated output mode Hibernate Mode[7] VDD = VDDIO = 4.5 - 5.5V T= -40°C T= 25°C Hibernate mode current All regulators and oscillators off. SRAM retention GPIO interrupts are active Boost = OFF SIO pins in single ended input, unregulated output mode T= 85°C VDD = VDDIO = 2.7 - 3.6V T= -40°C T= 25°C T= 85°C VDD = VDDIO = 1.71 1.95V T= -40°C T= 25°C T= 85°C Note 7. If Vccd and Vcca are externally regulated, the voltage difference between Vccd and Vcca must be less than 50 mV. Analog core regulator disabled Digital core regulator enabled Digital core regulator disabled VDD = VDDIO = 4.5 - 5.5V T= -40°C T= 25°C T= 85°C VDD = VDDIO = 2.7 - 3.6V T= -40°C T= 25°C T= 85°C VDD = VDDIO = 1.71 1.95V T= -40°C T= 25°C T= 85°C Document Number: 001-55036 Rev. *A Page 58 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Table 11-3. AC Specifications[9] Parameter FCPU Fbusclk Svdd Tio_init Description CPU frequency Bus frequency Vdd ramp rate Time from Vddd/Vdda/Vccd/Vcca ≥ IPOR to I/O ports set to their reset states Vcca/Vdda = regulated from Vdda/Vddd, no PLL used, fast boot Time from Vddd/Vdda/Vccd/Vcca ≥ mode PPOR to CPU executing code at Vcca/Vccd = regulated from reset vector Vdda/Vddd, no PLL used, slow boot mode Wakeup from limited active mode Application of external interrupt to beginning of execution of next CPU instruction Conditions 1.71V ≤ Vddd ≤ 5.5V 1.71V ≤ Vddd ≤ 5.5V Min DC DC 1.00E-04 Typ Max 80 80 1.00E+06 10 Units MHz MHz V/ms µs - - 9 µs Tstartup - - 36 µs Tsleep - - 12 µs Thibernate Wakeup form hibernate mode Application of external interrupt to beginning of execution of next CPU instruction External reset pulse width - - 100 µs 1 - - µs Notes 8. The current consumption of additional peripherals that are implemented only in programmed logic blocks can be found in their respective data sheets, available in PSoC Creator, the integrated design environment. To compute total current, find CPU current at frequency of interest and add peripheral currents for your particular system from the device data sheet and component data sheets. 9. Based on device characterization (Not production tested). Document Number: 001-55036 Rev. *A Page 59 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11.3 Power Regulators Specifications are valid for -40°C ≤ Ta ≤ 85°C and Tj ≤ 100°C, except where noted. Specifications are valid for 1.71V to 5.5V, except where noted. 11.3.1 Digital Core Regulator Table 11-4. Digital Core Regulator DC Specifications Parameter Description Vddd Input voltage Vccd Output voltage Regulator output capacitance Conditions Min 1.8 Typ 1.80 1.1 Max 5.5 Units V V µF Total capacitance on the two Vccd pins. Each capacitor is ±10%, X5R ceramic or better, see Power System on page 22 11.3.2 Analog Core Regulator Table 11-5. Analog Core Regulator DC Specifications Parameter Description Vdda Input voltage Vcca Output voltage Regulator output capacitor Conditions Min 1.8 Typ 1.80 1 Max 5.5 Units V V µF ±10%, X5R ceramic or better 11.3.3 Inductive Boost Regulator Table 11-6. Inductive Boost Regulator DC Specifications Parameter Description Vbat Input voltage Conditions Includes startup Vin=1.6-5.5V, Vout=1.6-5.0V, external diode Vin=1.6-3.6V, Vout=1.6-3.6V, internal diode Vin=0.8-1.6V, Vout=1.6-3.6V, internal diode Vin=0.8-1.6V, Vout=3.6-5.0V, external diode Vin=0.5-0.8V, Vout=1.6-3.6V, internal diode 10 µH spec'd 22 µF || 0.1 µF spec'd External Schottky diode is required for Vboost > 3.6V External Schottky diode is required for Vboost > 3.6V Boost active mode Boost standby mode, 32 khz external crystal oscillator, Iboost < 1 µA Min 0.5 4.7 10 1 20 Typ 10 22 200 12 Max 5.5 50 75 30 20 15 47 47 700 Units V mA mA mA mA mA µH µF A V mA µA µA Iboost Load current [10, 11] Lboost Cboost If Vr Ilpk Boost inductor Filter capacitor[9] External Schottky diode average forward current External Schottky diode peak reverse voltage Inductor peak current Quiescent current Notes 10. For output voltages above 3.6V, an external diode is required. 11. Maximum output current applies for output voltages ≤ 4x input voltage. Document Number: 001-55036 Rev. *A Page 60 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Table 11-6. Inductive Boost Regulator DC Specifications (continued) Parameter Description Boost output voltage range[9] 1.8V 1.9V 2.0V 2.4V 2.7V 3.0V 3.3V 3.6V 5.0V Efficiency Conditions Min 1.71 1.81 1.90 2.28 2.57 2.85 3.14 3.42 4.75 90 Typ 1.80 1.90 2.00 2.40 2.70 3.00 3.30 3.60 5.00 Max 1.89 2.00 2.10 2.52 2.84 3.15 3.47 3.8 5.25 Units V V V V V V V V V % Vboost External diode required Vbat = 2.4 V, Vout = 2.7 V, Iout = 10 mA, Fsw = 400 kHz Table 11-7. Inductive Boost Regulator AC Specifications Parameter Vripple Fsw Description Ripple voltage (peak-to-peak) Switching frequency Duty cycle Conditions Vout = 1.8V, Fsw = 400 kHz, Iout = 10 mA Min 20 Typ 0.1, 0.4, or 2 Max 100 80 Units mV MHz % 11.4 Inputs and Outputs Specifications are valid for -40°C ≤ Ta ≤ 85°C and Tj ≤ 100°C, except where noted. Specifications are valid for 1.71V to 5.5V, except where noted. 11.4.1 GPIO Table 11-8. GPIO DC Specifications Parameter Vih Vil Vih Vih Vil Vil Voh Vol Rpullup Rpulldown Iil Description Input voltage high threshold Input voltage low threshold Input voltage high threshold Input voltage high threshold Input voltage low threshold Input voltage low threshold Output voltage high Output voltage low Pull up resistor Pull down resistor Input leakage current (absolute value)[9] 25°C, Vddio = 3.0V Conditions CMOS Input, PRT[x]CTL = 0 CMOS Input, PRT[x]CTL = 0 Min 0.7 × Vddio Typ 5.6 5.6 Max 0.3 × Vddio 0.3 x Vddio 0.8 0.6 0.6 8 8 2 Units V V V V V V V V V V kΩ kΩ nA LVTTL Input, PRT[x]CTL = 1,Vddio 0.7 x Vddio < 2.7V LVTTL Input, PRT[x]CTL = 1, Vddio ≥ 2.7V LVTTL Input, PRT[x]CTL = 1,Vddio < 2.7V LVTTL Input, PRT[x]CTL = 1, Vddio ≥ 2.7V Ioh = 4 mA at 3.3 Vddio Ioh = 1 mA at 1.8 Vddio Iol = 8 mA at 3.3 Vddio Iol = 4 mA at 1.8 Vddio 2.0 Vddio - 0.6 Vddio - 0.5 4 4 - Document Number: 001-55036 Rev. *A Page 61 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Table 11-8. GPIO DC Specifications (continued) Parameter Cin Vh Idiode Rglobal Rmux Description Input capacitance [9] Conditions GPIOs without OpAmp outputs GPIOs with OpAmp outputs Min - Typ 40 240 130 Max 7 18 100 - Units pF pF mV µA Input voltage hysteresis (Schmitt-Trigger)[9] Current through protection diode to Vddio and Vssio Resistance pin to analog global bus 25°C, Vddio = 3.0V Resistance pin to analog mux bus 25°C, Vddio = 3.0V Ω Ω Table 11-9. GPIO AC Specifications Parameter TriseF TfallF TriseS TfallS Description Rise time in Fast Strong Mode [9] Conditions 3.3V Vddio Cload = 25 pF 3.3V Vddio Cload = 25 pF 3.3V Vddio Cload = 25 pF 3.3V Vddio Cload = 25 pF 90/10% Vddio into 25 pF 90/10% Vddio into 25 pF 90/10% Vddio into 25 pF Min 2 2 10 10 - Typ - Max 12 12 60 60 33 20 7 3.5 Units ns ns ns ns MHz MHz MHz MHz Fall time in Fast Strong Mode[9] Rise time in Slow Strong Mode [9] Fall time in Slow Strong Mode[9] GPIO output operating frequency 3.3V < Vddio < 5.5V, fast strong drive mode Fgpioout 1.71V < Vddio < 3.3V, fast strong drive mode 3.3V < Vddio < 5.5V, slow strong drive mode 1.71V < Vddio < 3.3V, slow strong 90/10% Vddio into 25 pF drive mode Fgpioin GPIO input operating frequency 1.71V < Vddio < 5.5V 90/10% Vddio - - 79 MHz 11.4.2 SIO Table 11-10. SIO DC Specifications Parameter Vinref Description Input voltage reference (Differential input mode) Output voltage reference (Regulated output mode) Voutref Input voltage high threshold Vih GPIO mode Differential input mode Input voltage low threshold Vil GPIO mode Differential input mode Output voltage high Voh Unregulated mode Regulated mode Regulated mode Ioh = 4 mA, Vddio = 3.3V Ioh = 1 mA Ioh = 0.1 mA Vddio - 0.4 Voutref-0.6 Voutref-0.25 Voutref+0.2 Voutref+0.2 V V V CMOS input With hysteresis 0.3 × Vddio Vinref-0.05 V V CMOS input With hysteresis 0.7 × Vddio Vinref+0.05 V V Vddio > 3.7 Vddio < 3.7 1 1 Vddio-1 Vddio - 0.5 V V Conditions Min 0.5 Typ Max 0.52 ×Vddio Units V Document Number: 001-55036 Rev. *A Page 62 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Table 11-10. SIO DC Specifications (continued) Parameter Vol Rpullup Rpulldown Iil Pull up resistor Pull down resistor Input leakage current (absolute value)[9] Vih < Vddsio Vih > Vddsio Cin Vh Idiode Input Capacitance[9] Input voltage hysteresis (Schmitt-Trigger)[9] Current through protection diode to Vssio Single ended mode (GPIO mode) Differential mode 25°C, Vddsio = 3.0V, Vih = 3.0V 25°C, Vddsio = 0V, Vih = 3.0V 40 50 14 10 7 100 nA µA pF mV mV µA Description Output voltage low Vddio = 3.30V, Iol = 25 mA Vddio = 1.80V, Iol = 4 mA 4 4 5.6 5.6 0.8 0.4 8 8 V V kΩ kΩ Conditions Min Typ Max Units Table 11-11. SIO AC Specifications Parameter TriseF TfallF TriseS TfallS Description Rise time in Fast Strong Mode (90/10%)[9] Fall time in Fast Strong Mode (90/10%)[9] Rise time in Slow Strong Mode (90/10%)[9] Fall time in Slow Strong Mode (90/10%)[9] SIO output operating frequency 3.3V < Vddio < 5.5V, Unregulated output (GPIO) mode, fast strong drive mode 90/10% Vddio into 25 pF 33 MHz Conditions Cload = 25 pF, Vddio = 3.3V Cload = 25 pF, Vddio = 3.3V Cload = 25 pF, Vddio = 3.0V Cload = 25 pF, Vddio = 3.0V Min 1 1 10 10 Typ Max 12 12 75 60 Units ns ns ns ns 1.71V < Vddio < 3.3V, Unregulated 90/10% Vddio into 25 pF output (GPIO) mode, fast strong drive mode 3.3V < Vddio < 5.5V, Unregulated output (GPIO) mode, slow strong drive mode 90/10% Vddio into 25 pF - - 16 MHz - - 5 MHz Fsioout 1.71V < Vddio < 3.3V, Unregulated 90/10% Vddio into 25 pF output (GPIO) mode, slow strong drive mode 3.3V < Vddio < 5.5V, Regulated Output continuously switching into output mode, fast strong drive mode 25 pF 1.71V < Vddio < 3.3V, Regulated Output continuously switching into output mode, fast strong drive mode 25 pF 1.71V < Vddio < 5.5V, Regulated output mode, slow strong drive mode Output continuously switching into 25 pF - - 4 MHz - - 20 10 2.5 MHz MHz MHz Fsioin SIO input operating frequency 1.71V < Vddio < 5.5V 90/10% Vddio 79 MHz 11.4.3 USBIO Document Number: 001-55036 Rev. *A Page 63 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Table 11-12. USBIO DC Specifications Parameter Rusbi Rusba Vohusb Volusb Vohgpio Volgpio Vdi Vcm Vse Rps2 Rext Zo Cin Iil Description USB D+ pull up resistance USB D+ pull up resistance Static output high Static output low Output voltage high, GPIO mode Output voltage low, GPIO mode Differential input sensitivity Differential input common mode range Single ended receiver threshold PS/2 pull up resistance External USB series resistor USB driver output impedance USB transceiver input capacitance Input leakage current (absolute value) 25°C, Vddio = 3.0V In PS/2 mode, with PS/2 pull up enabled In series with each USB pin Including Rext Conditions With idle bus While receiving traffic 15 kΩ ±5% to Vss, internal pull up enabled 15 kΩ ±5% to Vss, internal pull up enabled Ioh = 4 mA, Vddio ≥ 3V Iol = 4 mA, Vddio ≥ 3V |(D+)-(D-)| Min 0.900 1.425 2.8 2.4 0.8 0.8 3 21.78 (-1%) 28 Typ 22 Max 1.575 3.090 3.6 0.3 0.3 0.2 2.5 2 7 22.22 (+1%) 44 20 2 Units kΩ kΩ V V V V V V V kΩ Ω Ω pF nA Document Number: 001-55036 Rev. *A Page 64 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet Table 11-13. USBIO AC Specifications Parameter Tdrate Tjr1 Tjr2 Tdj1 Tdj2 Tfdeop Tfeopt Tfeopr Tfst Fgpio_out Tr_gpio Tf_gpio Description Full-speed data rate average bit rate Receiver data jitter tolerance to next transition Receiver data jitter tolerance to pair transition Driver differential jitter to next transition Driver differential jitter to pair transition Source jitter for differential transition to SE0 transition Source SE0 interval of EOP Receiver SE0 interval of EOP Width of SE0 interval during differential transition GPIO mode output operating frequency 3V ≤ Vddd ≤ 5.5V Vddd = 1.71V Rise time, GPIO mode, 10%/90% Vddd Vddd > 3V, 25 pF load Vddd = 1.71V, 25 pF load Fall time, GPIO mode, 90%/10% Vddd Vddd > 3V, 25 pF load Vddd = 1.71V, 25 pF load Table 11-14. USB Driver AC Specifications Parameter Tr Tf TR Vcrs Description Transition rise time Transition fall time Rise/fall time matching Output signal crossover voltage Conditions Min 4 4 90% 1.3 Typ Max 20 20 111% 2 V Units ns ns Conditions Min 12 - 0.25% -8 -5 -3.5 -4 -2 160 82 1 4 1 4 Typ 12 Max 12 + 0.25% 8 5 3.5 4 5 175 14 20 6 12 40 12 40 Units MHz ns ns ns ns ns ns ns ns MHz MHz ns ns ns ns 11.4.4 XRES Table 11-15. XRES DC Specifications Parameter Vih Vil Rpullup Cin Vh Idiode Description Input voltage high threshold Input voltage low threshold Pull up resistor Input capacitance[9] Input voltage hysteresis (Schmitt-Trigger)[9] Current through protection diode to Vddio and Vssio Conditions CMOS Input, PRT[x]CTL = 0 CMOS Input, PRT[x]CTL = 0 Min 0.7 × Vddio 4 Typ 5.6 3 100 100 Max 0.3 × Vddio 8 Units V V kΩ pF mV µA Table 11-16. XRES AC Specifications Parameter Treset Description Reset pulse width Conditions Min 1 Typ Max Units µs Document Number: 001-55036 Rev. *A Page 65 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11.5 Analog Peripherals Specifications are valid for -40°C ≤ Ta ≤ 85°C and Tj ≤ 100°C, except where noted. Specifications are valid for 1.71V to 5.5V, except where noted. 11.5.1 Opamp Table 11-17. Opamp DC Specifications Parameter Vioff Vioff TCVos Ge1 Vi Vo Iout Description Input offset voltage Input offset voltage Input offset voltage drift with temperature Gain error, unity gain buffer mode Quiescent current Input voltage range Output voltage range Output current Output load = 1 mA Output voltage is between Vssa +500 mV and Vdda -500 mV, and Vdda > 2.7V Output voltage is between Vssa +500 mV and Vdda -500 mV, and Vdda > 1.7V and Vdda < 2.7V Rload = 1 kΩ T = 25 °C Conditions Min Vssa Vssa + 50 25 Typ 0.5 12 900 Max 2 0.1 Vdda Vdda - 50 Units mV mV µv/°C % µA mV mV mA Output current Iout CMRR Common mode rejection ratio[9] 16 - - mA 70 - - dB Table 11-18. Opamp AC Specifications Parameter GBW Gain BW[9] Tslew Description Conditions 100 mV pk-pk, load capacitance 200 pF Load capacitance 200 pF Min 3 3 Typ 38 Max Units MHz V/µs nv/sqrtHz Slew rate[9] Input noise density[9] Document Number: 001-55036 Rev. *A Page 66 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11.5.2 Voltage Reference Table 11-19. Voltage Reference Specifications Parameter Vref Description Precision reference Conditions Min 1.023 (-0.1%) Typ 1.024 Max 1.025 (+0.1%) Units V 11.5.3 SAR ADC Table 11-20. SAR ADC DC Specifications Parameter Resolution Number of channels - single ended Number of channels - differential Monotonicity[9] Gain error Input offset voltage Current consumption Input voltage range - single ended[9] Input voltage range - differential Input resistance[9] Cin Input capacitance[9] [9] Description Conditions Min - Typ 8 Max 12 No of GPIO No of GPIO/2 ±0.1 ±0.2 500 Vdda Vdda 2 9 Units bits Differential pair is formed using a pair of neighboring GPIO. Yes Vssa Vssa 7 % mV µA V V KΩ pF Table 11-21. SAR ADC AC Specifications Parameter PSRR CMRR SNR INL DNL THD Description Sample & hold droop[9] Power supply rejection ratio[9] Common mode rejection ratio Sample rate[9] Signal-to-noise ratio (SNR)[9] Input bandwidth [9] Conditions Min 80 80 70 - Typ 500 - Max 1 1 ±1 ±1 Units µV/µs dB dB Msps dB KHz LSB LSB % Integral non linearity[9] Differential non linearity [9] Internal reference Internal reference - Total harmonic distortion[9] 0.005 Document Number: 001-55036 Rev. *A Page 67 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11.5.4 Analog Globals Table 11-22. Analog Globals AC Specifications Parameter Rppag Rppmuxbus BWag CMRRag Description Resistance pin-to-pin through analog global[12] Resistance pin-to-pin through analog mux bus[12] 3 dB bandwidth of analog globals Common mode rejection for differential signals Conditions Vdda = 3.0V Vdda = 1.65V Vdda = 3.0V Vdda = 1.65V Vdda = 3.0V Vdda = 1.65V Vdda = 3.0V Vdda = 1.65V Min 24 36 85 87 Typ 939 633 721 515 39 56 91 93 Max 1461 1012 1135 843 Units Ω Ω Ω Ω MHz MHz dB dB 11.5.5 Comparator Table 11-23. Comparator DC Specifications Parameter Vioff Vioff Vioff Vhyst Vicm CMRR Icmp Description Input offset voltage in fast mode Input offset voltage in slow mode Input offset voltage in fast mode Input offset voltage in ultra low power mode Hysteresis Input common mode voltage Common mode rejection ratio High current mode/fast mode[9] Low current mode/slow mode[9] Ultra low power mode [9] [12] Conditions Factory trim Factory trim Custom trim Min - Typ ±12 10 6 Max ±5 ±4 Units mV mV mV mV mV mV V V dB µA µA µA ±3 ±2 32 Vdda-0.1 Vdda 400 100 - Input offset voltage in slow mode[12] Custom trim Hysteresis enable mode Fast mode Slow mode 0 0 55 - Table 11-24. Comparator AC Specifications Parameter Description Response time, high current mode[9] Tresp Conditions 50 mV overdrive, measured pin-to-pin Min Typ 75 145 55 Max TBD TBD Units ns ns µs Response time, low current mode[9] 50 mV overdrive, measured pin-to-pin Response time, ultra low power mode[9] 50 mV overdrive, measured pin-to-pin Note 12. The resistance of the analog global and analog mux bus is high if Vdda ≤ 2.7V, and the chip is in either sleep or hibernate mode. Use of analog global and analog mux bus under these conditions is not recommended. 13. The recommended procedure for using a custom trim value for the on-chip comparators may be found in the TRM. Document Number: 001-55036 Rev. *A Page 68 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11.5.6 IDAC Table 11-25. IDAC (Current Digital-to-Analog Converter) DC Specifications Parameter Iout High[9] Medium[9] Low INL DNL Ezs Eg IDAC_ICC IDAC_ICC [9] Description Output current Conditions Code = 255, Vdda ≥ 2.7V, RL 600Ω Code = 255, Vdda ≤ 2.7V, RL 300Ω Code = 255, RL 600Ω Code = 255, RL 600Ω RL 600Ω, CL=15 pF RL 600Ω, CL=15 pF Uncompensated Temperature compensated [9] Min - Typ 0 - Max 2.048 2.048 256 32 ±1 ±0.5 ±1 Units mA mA µA µA LSB LSB LSB % % µA µA Integral non linearity Differential non linearity Zero scale error Gain error DAC current low speed mode 2.5 TBD 100 500 Code = 0 Code = 0 DAC current high speed mode[9] Table 11-26. IDAC (Current Digital-to-Analog Converter) AC Specifications Parameter Fdac Description Update rate Settling time to 0.5LSB Tsettle Fast mode Slow mode Full scale transition, 600Ω load, CL = 15 pF Independent of IDAC range setting (Iout) Independent of IDAC range setting (Iout) 100 1000 ns ns Conditions Min Typ Max 8 Units Msps Document Number: 001-55036 Rev. *A Page 69 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11.5.7 VDAC Table 11-27. VDAC (Voltage Digital-to-Analog Converter) DC Specifications Parameter Rout High Low Output voltage range[9] Vout INL DNL Ezs Eg VDAC_ICC VDAC_ICC High Low Integral non linearity Differential non linearity Zero scale error Gain error DAC current low speed mode[9] DAC current high speed mode[9] Uncompensated Temperature compensated Code = 0 Code = 0 Code = 255, Vdda > 5V Code = 255 CL=15 pF CL=15 pF 4 1 ±1.6 ±1 ±1 Description Output resistance [9] Conditions Vout = 4V Vout = 1V Min - Typ 16 4 Max - Units kΩ kΩ V V LSB LSB LSB % % µA µA 3 TBD 100 500 Table 11-28. VDAC (Voltage Digital-to-Analog Converter) AC Specifications Parameter Fdac Description Update rate[9] Update rate High[9] Low[9] [9] Conditions 1V mode 4V mode Full scale transition, CL = 15 pF Vout = 4V Vout = 1V Min - Typ - Max 1 250 4000 1000 Units Msps Ksps ns ns Settling time to 0.5LSB[9] Tsettle 11.5.8 Discrete Time Mixer The discrete time mixer is used for modulating (shifting signals in frequency down) where the output frequency of the mixer is equal to the difference of the input frequency and the local oscillator frequency. The discrete time mixer is created using a SC/CT Analog Block, see the Mixer component data sheet in PSoC Creator for full AC/DC specifications, and APIs and example code. Table 11-29. Discrete Time Mixer DC Specifications Parameter Description Conditions 4 MHz clock rate Input voltage [14] Min Vssa - Typ. 10 30 900 Max Vdda 10 - Units µV µV V mV µA Analog input noise injection (RMS) 1 MHz clock rate Input offset voltage Quiescent current Table 11-30. Discrete Time Mixer AC Specifications Parameter LO Description Local oscillator frequency [9] Conditions Min 0 0 Typ - Max 4 14 Units MHz MHz Input signal frequency for down mixing[9] Note 14. Bandwidth is guaranteed for input common mode between 0.3V and Vdda-1.2V and for output that is between 0.05V and Vdda-0.05V. Document Number: 001-55036 Rev. *A Page 70 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11.5.9 Continuous Time Mixer The continuous time mixer is used for modulating (shift) frequencies up or down, to a limit of 1.0 MHz. The continuous time mixer is created using a SC/CT Analog Block, see the Mixer component data sheet in PSoC Creator for full AC/DC specifications, and APIs and example code. Table 11-31. Continuous Time Mixer DC Specifications Parameter Description Input voltage[14] Input offset voltage Quiescent current Table 11-32. Continuous Time Mixer AC Specifications Parameter LO Description Local oscillator frequency[9] Input signal frequency [9] Conditions Min Vssa - Typ 900 Max 10 Vdda 10 - Units µV V mV µA Analog input noise injection (RMS) No input signal Conditions Min - Typ - Max 1 1 Units MHz MHz 11.5.10 Transimpedance Amplifier The TIA is created using a SC/CT Analog Block, see the TIA component data sheet in PSoC Creator for full AC/DC specifications, and APIs and example code. Table 11-33. Transimpedance Amplifier (TIA) DC Specifications Parameter Vioff Description Input offset voltage Conversion resistance R = 20K R = 30K R = 40K Rconv R = 80K R = 120K R = 250K R= 500K R = 1M Quiescent current Table 11-34. Transimpedance Amplifier (TIA) AC Specifications Parameter R = 20K R = 120K R = 1M Input bandwidth (3 dB) - 40 pF load R = 20K R = 120K R = 1M 1500 300 46 kHz kHz kHz Description Input bandwidth (-3 dB) - 20 pF load [14] [15] Conditions Min - Typ 900 Max 10 +30 +30 +30 +30 +30 +30 +30 +30 - Units mV % % % % % % % % µA 40 pF load 40 pF load 40 pF load 40 pF load 40 pF load 40 pF load 40 pF load 40 pF load -20 -20 -20 -20 -20 -20 -20 -20 - Conditions Min 1800 330 47 Typ - Max - Units kHz kHz kHz Note 15. Conversion resistance values are not calibrated. Calibrated values and details about calibration are provided in PSoC Creator component data sheets. External precision resistors can also be used. Document Number: 001-55036 Rev. *A Page 71 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11.5.11 Programmable Gain Amplifier The PGA is created using a SC/CT Analog Block, see the PGA component data sheet in PSoC Creator for full AC/DC specifications, and APIs and example code. Table 11-35. PGA DC Specifications Parameter Vos Description Input offset voltage[9] [9] Conditions Min 69 38 35 Vssa + 0.15 - Typ ±30 - Max 10 250 ±0.15 ±1 ±1.03 ±1.23 ±2.5 ±5 ±5 Units mV µV/°C µA dB dB MΩ % % % % % % % % of FSR V mA DeltaV/DeltaTa Input offset voltage drift PSRR Zin Ge1 Ge2 Ge4 Ge8 Ge16 Ge32 Ge50 Vonl Voh, Vol Output current source capability[9] Drive setting 3, Vdda = 1.71V Power supply rejection ratio Input impedance Gain Error[9] Gain = 1 Gain = 2 Gain = 4 Gain = 8 Gain = 16 Gain = 32 Gain = 50 DC output non linearity G = 1[9] Output voltage swing Quiescent current[9] Table 11-36. PGA AC Specifications Parameter BW1 BW24 BW48 Gain = 1 Gain = 24 Gain = 48 Slew Rate[9] SR1 SR24 SR48 eni1 eni24 eni48 Gain = 1 Gain = 24 Gain = 48 Input Noise Voltage Density Gain = 1 Gain = 24 Gain = 48 [9] [9] [9] 100 kHz 1 MHz For non inverting inputs Non inverting mode, reference = Vssa Rin of 40K Rin of 40K Rin of 40K Rin of 40K Rin of 40K Rin of 40K Rin of 40K 0.01 Vdda 0.15 1.65 Description -3 db Bandwidth[9] Conditions Noninverting mode, 300 mV ≤ Vin ≤ Vdda - 1.2V, Cl ≤ 25 pF Noninverting mode, 300 mV ≤ Vin ≤ Vdda - 1.2V, Cl ≤ 25 pF Noninverting mode, 300 mV ≤ Vin ≤ Vdda - 1.2V, Cl ≤ 25 pF Vdda = 1.71V 5% to 90% FS output RC limited RC limited 10 kHz 10 kHz 10 kHz Min 7 360 215 Typ - Max - Units MHz kHz kHz 3 0.5 0.5 - 38 38 38 - V/µs V/µs V/µs nV/sqrtHz nV/sqrtHz nV/sqrtHz Document Number: 001-55036 Rev. *A Page 72 of 93 [+] Feedback PRELIMINARY PSoC®5: CY8C54 Family Data Sheet 11.5.12 Unity Gain Buffer The Unity Gain Buffer is created using a SC/CT Analog Block. See the Unity Gain Buffer component data sheet in PSoC Creator for full AC/DC specifications, and APIs and example code. Table 11-37. Unity Gain Buffer DC Specifications Parameter Vos Description Input offset voltage Offset voltage drift Input voltage range Voh, Vol Output voltage range Output current source capability[9] Drive setting 3, Vdda = 1.71V Quiescent current Table 11-38. Unity Gain Buffer AC Specifications Parameter Description Bandwidth[9, 14] Slew rate[9] Input noise spectral density[9] Conditions Noninverting mode, 300 mV ≤ Vin ≤ Vdda - 1.2V, Cl ≤ 25 pF Vdda = 1.71V 5% to 90% FS output, CL = 50 pF Min 7 3 Typ 38 Max Units MHz V/µs nV/sqrtHz [9] Conditions Min Vssa Vssa + 0.15 - Typ 900 Max 10 30 Vdda Vdda 0.15 250 - Units mV µv/°C V V µA µA 11.5.13 Temperature Sensor Table 11-39. Temperature Sensor Specifications Parameter Description Temp sensor accuracy Conditions -40 to +140 range Min Typ ±5 Max Units °C 11.5.14 LCD Direct Drive Table 11-40. LCD Direct Drive DC Specifications Parameter Icc Vbias Description LCD operating current LCD bias range LCD bias step size LCD capacitance per segment/common driver Long term segment offset Iout per segment driver Strong drive Weak drive Weak drive 2 Icc per segment driver Strong drive Weak drive Weak drive 2 No drive Document Number: 001-55036 Rev. *A Conditions 32x4 segment display at 30 Hz. Segment capacitance is < 500 pF[17]. Vdda must be 3V or higher Drivers may be combined. Min 2.048 120 220 - Typ 15 25.8 500 160 0.5 1 260 11 22