CY96F675RBPMC1-GS-UJE2

Please note that Cypress is an Infineon Technologies Company. The document following this cover page is marked as “Cypress” document as this is the company that originally developed the product. Please note that Infineon will continue to offer the product to new and existing customers as part of the Infineon product portfolio. Continuity of document content The fact that Infineon offers the following product as part of the Infineon product portfolio does not lead to any changes to this document. Future revisions will occur when appropriate, and any changes will be set out on the document history page. Continuity of ordering part numbers Infineon continues to support existing part numbers. Please continue to use the ordering part numbers listed in the datasheet for ordering. www.infineon.com CY96670 Series F2MC-16FX 16-Bit Microcontroller CY96670 series is based on Cypress’s advanced F2MC-16FX architecture (16-bit with instruction pipeline for RISC-like performance). The CPU uses the same instruction set as the established F2MC-16LX family thus allowing for easy migration of F2MC-16LX Software to the new F2MC-16FX products. F2MC-16FX product improvements compared to the previous generation include significantly improved performance - even at the same operation frequency, reduced power consumption and faster start-up time. For high processing speed at optimized power consumption an internal PLL can be selected to supply the CPU with up to 32MHz operation frequency from an external 4MHz to 8MHz resonator. The result is a minimum instruction cycle time of 31.2ns going together with excellent EMI behavior. The emitted power is minimized by the on-chip voltage regulator that reduces the internal CPU voltage. A flexible clock tree allows selecting suitable operation frequencies for peripheral resources independent of the CPU speed. Features  Technology  DMA 0.18m CMOS Automatic transfer function independent of CPU, can be assigned freely to resources  CPU  F2MC-16FX CPU instruction set for controller applications (bit, byte, word and long-word data types, 23 different addressing modes, barrel shift, variety of pointers)  8-byte instruction queue  Signed multiply (16-bit × 16-bit) and divide (32-bit/16-bit) instructions available  Interrupts  Fast Interrupt processing programmable priority levels  Non-Maskable Interrupt (NMI)  Optimized 8  CAN  Supports CAN protocol version 2.0 part A and B certified  Bit rates up to 1Mbps  32 message objects  Each message object has its own identifier mask  Programmable FIFO mode (concatenation of message objects)  Maskable interrupt  Disabled Automatic Retransmission mode for Time Triggered CAN applications  Programmable loop-back mode for self-test operation  ISO16845  System clock PLL clock multiplier (1 to 8, 1 when PLL stop) to 8MHz crystal oscillator (maximum frequency when using ceramic resonator depends on Q-factor)  Up to 8MHz external clock for devices with fast clock input feature  32.768kHz subsystem quartz clock  100kHz/2MHz internal RC clock for quick and safe startup, clock stop detection function, watchdog  Clock source selectable from mainclock oscillator, subclock oscillator and on-chip RC oscillator, independently for CPU and 2 clock domains of peripherals  The subclock oscillator is enabled by the Boot ROM program controlled by a configuration marker after a Power or External reset  Low Power Consumption - 13 operating modes (different Run, Sleep, Timer, Stop modes)  On-chip  4MHz  USART  Full duplex USARTs (SCI/LIN) range of baud rate settings using a dedicated reload timer  Special synchronous options for adapting to different synchronous serial protocols  LIN functionality working either as master or slave LIN device  Extended support for LIN-Protocol to reduce interrupt load  Wide  On-chip voltage regulator Internal voltage regulator supports a wide MCU supply voltage range (Min=2.7V), offering low power consumption  I2 C  Low voltage detection function  Up to 400kbps and Slave functionality, 7-bit and 10-bit addressing  Master Reset is generated when supply voltage falls below programmable reference voltage  Code Security Protects Flash Memory content from unintended read-out Cypress Semiconductor Corporation Document Number: 002-04703 Rev. *D • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised June 20, 2019 CY96670 Series  A/D converter  SAR-type  8/10-bit resolution  Signals interrupt on conversion end, single conversion mode, continuous conversion mode, stop conversion mode, activation by software, external trigger, reload timers and PPGs  Range Comparator Function  Scan Disable Function  ADC Pulse Detection Function  Source Clock Timers Three independent clock timers (23-bit RC clock timer, 23-bit Main clock timer, 17-bit Sub clock timer)  Hardware Watchdog Timer  Hardware watchdog timer is active after reset function of Watchdog Timer is used to select the lower window limit of the watchdog interval  Window  Reload Timers  16-bit wide with 1/21, 1/22, 1/23, 1/24, 1/25, 1/26 of peripheral clock frequency  Event count function  Prescaler  Free-Running Timers  Signals an interrupt on overflow with 1, 1/21, 1/22, 1/23, 1/24, 1/25, 1/26, 1/27, 1/28 of peripheral clock frequency  Prescaler  Input Capture Units  16-bit wide an interrupt upon external event  Rising edge, falling edge or both (rising & falling) edges sensitive  Signals  Programmable Pulse Generator  16-bit down counter, cycle and duty setting registers be used as 2 × 8-bit PPG  Interrupt at trigger, counter borrow and/or duty match  PWM operation and one-shot operation  Internal prescaler allows 1, 1/4, 1/16, 1/64 of peripheral clock as counter clock or of selected Reload timer underflow as clock input  Can be triggered by software or reload timer  Can trigger ADC conversion  Timing point capture  Can  Stepping Motor Controller  Stepping Motor Controller with integrated high current output drivers  Four high current outputs for each channel  Two synchronized 8/10-bit PWMs per channel  Internal prescaling for PWM clock: 1, 1/4, 1/5, 1/6, 1/8, 1/10, 1/12, 1/16 of peripheral clock  Dedicated power supply for high current output drivers Document Number: 002-04703 Rev. *D  LCD Controller  LCD controller with up to 4COM × 24SEG or external voltage generation  Duty cycle: Selectable from options: 1/2, 1/3 and 1/4  Fixed 1/3 bias  Programmable frame period  Clock source selectable from four options (main clock, peripheral clock, subclock or RC oscillator clock)  Internal divider resistors or external divider resistors  On-chip data memory for display  LCD display can be operated in Timer Mode  Blank display: selectable  All SEG, COM and V pins can be switched between general and specialized purposes  Internal  Sound Generator  8-bit PWM signal is mixed with tone frequency from 16-bit reload counter  PWM clock by internal prescaler: 1, 1/2, 1/4, 1/8 of peripheral clock  Real Time Clock  Operational on main oscillation (4MHz), sub oscillation (32kHz) or RC oscillation (100kHz/2MHz)  Capable to correct oscillation deviation of Sub clock or RC oscillator clock (clock calibration)  Read/write accessible second/minute/hour registers  Can signal interrupts every half second/second/minute/ hour/day  Internal clock divider and prescaler provide exact 1s clock  External Interrupts  Edge or Level sensitive mask bit per channel  Each available CAN channel RX has an external interrupt for wake-up  Selected USART channels SIN have an external interrupt for wake-up  Interrupt  Non Maskable Interrupt  Disabled after reset, can be enabled by Boot-ROM depending on ROM configuration block  Once enabled, can not be disabled other than by reset  High or Low level sensitive  Pin shared with external interrupt 0  I/O Ports  Most of the external pins can be used as general purpose I/O  All push-pull outputs (except when used as I2C SDA/SCL line)  Bit-wise programmable as input/output or peripheral signal  Bit-wise programmable input enable  One input level per GPIO-pin (either Automotive or CMOS hysteresis)  Bit-wise programmable pull-up resistor Page 2 of 64 CY96670 Series  Built-in On Chip Debugger (OCD)  One-wire debug tool interface  Break function: • Hardware break: 6 points (shared with code event) • Software break: 4096 points  Event function • Code event: 6 points (shared with hardware break) • Data event: 6 points • Event sequencer: 2 levels + reset  Execution time measurement function  Trace function: 42 branches  Security function Document Number: 002-04703 Rev. *D  Flash Memory  Dual operation flash allowing reading of one Flash bank while programming or erasing the other bank  Command sequencer for automatic execution of programming algorithm and for supporting DMA for programming of the Flash Memory  Supports automatic programming, Embedded Algorithm  Write/Erase/Erase-Suspend/Resume commands  A flag indicating completion of the automatic algorithm  Erase can be performed on each sector individually  Sector protection  Flash Security feature to protect the content of the Flash  Low voltage detection during Flash erase or write Page 3 of 64 CY96670 Series Contents 1. Product Lineup ................................................................ 5 2. Block Diagram ................................................................. 6 3. Pin Assignment ............................................................... 7 4. Pin Description ................................................................ 8 5. Pin Circuit Type ............................................................. 10 6. I/O Circuit Type ............................................................. 12 7. Memory Map .................................................................. 18 8. RAMSTART Addresses................................................. 19 9. User ROM Memory Map For Flash Devices ................ 20 10. Serial Programming Communication Interface .......... 21 11. Interrupt Vector Table ................................................... 21 12. Handling Precautions ................................................... 25 12.1 Precautions for Product Design ................................. 25 12.2 Precautions for Package Mounting ............................ 26 12.3 Precautions for Use Environment .............................. 27 13. Handling Devices .......................................................... 28 13.1 Latch-Up Prevention .................................................. 28 13.2 Unused Pins Handling ............................................... 28 13.3 External Clock Usage ................................................ 28 13.4 Notes on PLL Clock Mode Operation ........................ 29 13.5 Power Supply Pins (Vcc/Vss) .................................... 29 13.6 Crystal Oscillator and ceramic resonator Circuit ........ 29 13.7 Turn on Sequence of Power Supply to A/D Converter and Analog Inputs ..................................................... 29 Document Number: 002-04703 Rev. *D 13.8 Pin Handling when not using the A/D Converter ........ 29 13.9 Notes on Power-on .................................................... 29 13.10 Stabilization of Power Supply Voltage ....................... 30 13.11 SMC Power Supply Pins ............................................ 30 13.12 Serial Communication ................................................ 30 13.13 Mode Pin (MD)........................................................... 30 14. Electrical Characteristics.............................................. 31 14.1 Absolute Maximum Ratings ....................................... 31 14.2 Recommended Operating Conditions ........................ 33 14.3 DC Characteristics ..................................................... 34 14.4 AC Characteristics ..................................................... 39 14.5 A/D Converter ............................................................ 47 14.6 High Current Output Slew Rate ................................. 51 14.7 Low Voltage Detection Function Characteristics........ 51 14.8 Flash Memory Write/Erase Characteristics ................ 53 15. Example Characteristics ............................................... 54 16. Ordering Information .................................................... 57 17. Package Dimension ...................................................... 58 18. Major Changes............................................................... 60 Document History ............................................................... 63 Sales, Solutions, and Legal Information ........................... 64 Page 4 of 64 CY96670 Series 1. Product Lineup Features CY96670 Product Type Remark Flash Memory Product Subclock Subclock can be set by software Dual Operation Flash Memory RAM - 64.5KB + 32KB 4KB CY96F673R, CY96F673A 128.5KB + 32KB 4KB CY96F675R, CY96F675A Package LQFP-64 LQG064/LQD064 DMA 2ch USART Product Options R: MCU with CAN A: MCU without CAN 2ch LIN-USART 0/1 with automatic LIN-Header transmission/reception Yes (only 1ch) LIN-USART 0 with 16 byte RX- and TX-FIFO No I2 C 8/10-bit A/D Converter 1ch I2 C 0 12ch AN 8/9/12/13/16 to 23 with Data Buffer No with Range Comparator Yes with Scan Disable Yes with ADC Pulse Detection Yes 16-bit Reload Timer (RLT) 3ch RLT 1/2/6 16-bit Free-Running Timer (FRT) 2ch FRT 0/1 16-bit Input Capture Unit (ICU) 4ch (2 channels for LIN-USART) ICU 0/1/4/5 ICU 0/1 for LIN-USART 8/16-bit Programmable Pulse Generator (PPG) 4ch (16-bit) / 8ch (8-bit) PPG 0 to 3 with Timing point capture Yes with Start delay No with Ramp No CAN Interface 1ch CAN 0 32 Message Buffers Stepping Motor Controller (SMC) 2ch SMC 0/1 External Interrupts (INT) 7ch INT 0 to 4/6/7 Non-Maskable Interrupt (NMI) 1ch Sound Generator (SG) 1ch SG 0 LCD Controller 4COM × 24SEG COM 0 to 3 SEG 3 to 6/8 to 11/19 to 21/23/30/36 to 39/42/45 to 47/54 to 56 Real Time Clock (RTC) 1ch I/O Ports 48 (Dual clock mode) 50 (Single clock mode) Clock Calibration Unit (CAL) 1ch Clock Output Function 2ch Low Voltage Detection Function Yes Hardware Watchdog Timer Yes On-chip RC-oscillator Yes On-chip Debugger Yes Document Number: 002-04703 Rev. *D Low voltage detection function can be disabled by software Page 5 of 64 CY96670 Series Note: All signals of the peripheral function in each product cannot be allocated by limiting the pins of package. It is necessary to use the port relocate function of the general I/O port according to your function use. 2. Block Diagram DEBUG I/F CKOT0_R, CKOT1 CKOTX0 X0, X1 X0A, X1A RSTX MD NMI Flash Memory A Interrupt Controller 16FX CPU OCD Clock & Mode Controller 16FX Core Bus (CLKB) Peripheral Bus Bridge Watchdog AVcc AVss AVRH AN8, AN9 AN12, AN13 AN16 to AN23 ADTG TIN1, TIN1_R, TIN2_R TOT1, TOT1_R, TOT2_R IN0_R, IN1, IN1_R IN4_R, IN5_R INT0 to INT4 INT6, INT7 INT1_R, INT2_R I 2C 1ch 8/10-bit ADC 12ch 16-bit Reload Timer 1/2/6 3ch I/O Timer 0 FRT 0 ICU 0/1 I/O Timer 1 FRT 1 ICU 4/5 External Interrupt 7ch SEG3 to SEG6, SEG8 to SEG11 SEG19 to SEG21, SEG23 SEG30,SEG36 to SEG39 SEG42,SEG45 to SEG47 SEG54 to SEG56 Document Number: 002-04703 Rev. *D RAM CAN Interface 1ch USART 2ch PPG 4ch (16-bit) / 8ch (8-bit) Boot ROM RX0 Voltage Regulator Vcc Vss C TX0 Sound Generator 1ch SGO0 SGA0 SIN0, SIN1 SOT0, SOT1 SCK0, SCK1 TTG1 PPG0_R, PPG1_R, PPG2_R, PPG3 PPG0_B, PPG1_B, PPG2_B, PPG3_B Stepping Motor Controller 2ch Real Time Clock V0 to V3 COM0 to COM3 Peripheral Bus Bridge Peripheral Bus 2 (CLKP2) SDA0 SCL0 Peripheral Bus 1 (CLKP1) DMA Controller DVcc DVss PWM1P0, PWM1P1 PWM1M0, PWM1M1 PWM2P0, PWM2P1 PWM2M0, PWM2M1 WOT_R LCD controller/ driver 4COMÍ24SEG Page 6 of 64 CY96670 Series 3. Pin Assignment 38 37 P04_5 / SCL0*2 39 DEBUG I/F 40 MD 41 P17_0 42 X1 Vss 43 X0 P04_0 / X0A*3 44 P04_1 / X1A*3 45 RSTX 46 P11_0 / COM0 P11_1 / COM1 / PPG0_R 47 P11_7 / SEG3 / IN0_R P11_3 / COM3 / PPG2_R 48 P11_2 / COM2 / PPG1_R P12_0 / SEG4 / IN1_R (Top view) 36 35 34 33 P12_1 / SEG5 / TIN1_R / PPG0_B 49 32 P04_4 / PPG3 / SDA0*2 P12_2 / SEG6 / TOT1_R / PPG1_B 50 31 P13_6 / SCK0 / CKOTX0 / SEG47*1 P12_4 / SEG8 51 30 P13_5 / SOT0 / ADTG / INT7 / SEG46 P12_5 / SEG9 / TIN2_R / PPG2_B 52 29 P13_4 / SIN0 / INT6 / SEG45*1 P12_6 / SEG10 / TOT2_R / PPG3_B 53 28 P08_7 / PWM2M1 / AN23 P12_7 / SEG11 / INT1_R 54 27 P08_6 / PWM2P1 / AN22 P01_1 / SEG21 / CKOT1 55 26 P08_5 / PWM1M1 / AN21 P01_3 / SEG23 56 25 P08_4 / PWM1P1 / AN20 P03_0 / SEG36 / V0 57 24 DVss P03_1 / SEG37 / V1 58 23 DVcc P03_2 / SEG38 / V2 59 22 P08_3 / PWM2M0 / AN19 P03_3 / SEG39 / V3 60 21 P08_2 / PWM2P0 / AN18 P03_4 / RX0 / INT4*1 61 20 P08_1 / PWM1M0 / AN17 P03_5 / TX0 62 19 P08_0 / PWM1P0 / AN16 P03_6 / INT0 / NMI 63 18 P05_5 / AN13 Vcc 64 17 P05_4 / AN12 / INT2_R / WOT_R 8 9 10 11 12 13 14 15 16 P06_6 / TIN1 / SEG55 / IN4_R P06_7 / TOT1 / SEG56 / IN5_R P05_0 / AN8 P05_1 / AN9 AVcc AVRH AVss SEG42*1 7 P06_5 / IN1 / SEG54 / TTG1 P13_0 / INT2 / SOT1 6 P02_2 / SEG30 / CKOT0_R 5 P01_0 / SEG20 / SGA0 4 P00_7 / SEG19 / SGO0 3 P13_1 / INT3 / SCK1 / 2 C Vss 1 P03_7 / INT1 / SIN1*1 LQFP-64 (LQG064/LQD064) *1: CMOS input level only *2: CMOS input level only for I2C *3: Please set ROM Configuration Block (RCB) to use the subclock. Other than those above, general-purpose pins have only Automotive input level. Document Number: 002-04703 Rev. *D Page 7 of 64 CY96670 Series 4. Pin Description Pin Name Feature Description ADTG ADC A/D converter trigger input pin ANn ADC A/D converter channel n input pin AVcc Supply Analog circuits power supply pin AVRH ADC A/D converter high reference voltage input pin AVss Supply Analog circuits power supply pin C Voltage regulator Internally regulated power supply stabilization capacitor pin CKOTn Clock Output function Clock Output function n output pin CKOTn_R Clock Output function Relocated Clock Output function n output pin CKOTXn Clock Output function Clock Output function n inverted output pin COMn LCD LCD Common driver pin DEBUG I/F OCD On Chip Debugger input/output pin DVcc Supply SMC pins power supply DVss Supply SMC pins power supply INn ICU Input Capture Unit n input pin INn_R ICU Relocated Input Capture Unit n input pin INTn External Interrupt External Interrupt n input pin INTn_R External Interrupt Relocated External Interrupt n input pin MD Core Input pin for specifying the operating mode NMI External Interrupt Non-Maskable Interrupt input pin Pnn_m GPIO General purpose I/O pin PPGn PPG Programmable Pulse Generator n output pin (16bit/8bit) PPGn_R PPG Relocated Programmable Pulse Generator n output pin (16bit/8bit) PPGn_B PPG Programmable Pulse Generator n output pin (16bit/8bit) PWMn SMC SMC PWM high current output pin RSTX Core Reset input pin RXn CAN CAN interface n RX input pin SCKn USART USART n serial clock input/output pin SCLn I2 C I2C interface n clock I/O input/output pin SDAn I2 C I2C interface n serial data I/O input/output pin SEGn LCD LCD Segment driver pin SGAn Sound Generator Sound Generator amplitude output pin SGOn Sound Generator Sound Generator sound/tone output pin SINn USART USART n serial data input pin SOTn USART USART n serial data output pin TINn Reload Timer Reload Timer n event input pin TINn_R Reload Timer Relocated Reload Timer n event input pin TOTn Reload Timer Reload Timer n output pin TOTn_R Reload Timer Relocated Reload Timer n output pin TTGn PPG Programmable Pulse Generator n trigger input pin TXn CAN CAN interface n TX output pin Vn LCD LCD voltage reference pin Vcc Supply Power supply pin Vss Supply Power supply pin WOT_R RTC Relocated Real Time clock output pin Document Number: 002-04703 Rev. *D Page 8 of 64 CY96670 Series Pin Name Feature Description X0 Clock Oscillator input pin X0A Clock Subclock Oscillator input pin X1 Clock Oscillator output pin X1A Clock Subclock Oscillator output pin Document Number: 002-04703 Rev. *D Page 9 of 64 CY96670 Series 5. Pin Circuit Type Pin No. I/O Circuit Type* Pin Name 1 Supply Vss 2 F C 3 M P03_7 / INT1 / SIN1 4 H P13_0 / INT2 / SOT1 5 P P13_1 / INT3 / SCK1 / SEG42 6 J P00_7 / SEG19 / SGO0 7 J P01_0 / SEG20 / SGA0 8 J P02_2 / SEG30 / CKOT0_R 9 J P06_5 / IN1 / SEG54 / TTG1 10 J P06_6 / TIN1 / SEG55 / IN4_R 11 J P06_7 / TOT1 / SEG56 / IN5_R 12 K P05_0 / AN8 13 K P05_1 / AN9 14 Supply AVcc 15 G AVRH 16 Supply AVss 17 K P05_4 / AN12 / INT2_R / WOT_R 18 K P05_5 / AN13 19 R P08_0 / PWM1P0 / AN16 20 R P08_1 / PWM1M0 / AN17 21 R P08_2 / PWM2P0 / AN18 22 R P08_3 / PWM2M0 / AN19 23 Supply DVcc 24 Supply DVss 25 R P08_4 / PWM1P1 / AN20 26 R P08_5 / PWM1M1 / AN21 27 R P08_6 / PWM2P1 / AN22 28 R P08_7 / PWM2M1 / AN23 29 P P13_4 / SIN0 / INT6 / SEG45 30 J P13_5 / SOT0 / ADTG / INT7 / SEG46 31 P P13_6 / SCK0 / CKOTX0 / SEG47 32 N P04_4 / PPG3 / SDA0 33 N P04_5 / SCL0 34 O DEBUG I/F 35 H P17_0 36 C MD 37 A X0 38 A X1 39 Supply Vss 40 B P04_0 / X0A 41 B P04_1 / X1A 42 C RSTX 43 J P11_7 / SEG3 / IN0_R 44 J P11_0 / COM0 Document Number: 002-04703 Rev. *D Page 10 of 64 CY96670 Series Pin No. I/O Circuit Type* Pin Name 45 J P11_1 / COM1 / PPG0_R 46 J P11_2 / COM2 / PPG1_R 47 J P11_3 / COM3 / PPG2_R 48 J P12_0 / SEG4 / IN1_R 49 J P12_1 / SEG5 / TIN1_R / PPG0_B 50 J P12_2 / SEG6 / TOT1_R / PPG1_B 51 J P12_4 / SEG8 52 J P12_5 / SEG9 / TIN2_R / PPG2_B 53 J P12_6 / SEG10 / TOT2_R / PPG3_B 54 J P12_7 / SEG11 / INT1_R 55 J P01_1 / SEG21 / CKOT1 56 J P01_3 / SEG23 57 L P03_0 / SEG36 / V0 58 L P03_1 / SEG37 / V1 59 L P03_2 / SEG38 / V2 60 L P03_3 / SEG39 / V3 61 M P03_4 / RX0 / INT4 62 H P03_5 / TX0 63 H P03_6 / INT0 / NMI 64 Supply Vcc *: See “I/O CIRCUIT TYPE” for details on the I/O circuit types. Document Number: 002-04703 Rev. *D Page 11 of 64 CY96670 Series 6. I/O Circuit Type Type Circuit Remarks A X1 R 0 X out High-speed oscillation circuit: • Programmable between oscillation mode (external crystal or resonator connected to X0/X1 pins) and Fast external Clock Input (FCI) mode (external clock connected to X0 pin) • Feedback resistor = approx. 1.0MΩ • The amplitude: 1.8V±0.15V to operate by the internal supply voltage 1 FCI X0 FCI or Osc disable Document Number: 002-04703 Rev. *D Page 12 of 64 CY96670 Series Type Circuit Remarks B Pull-up control P-ch Standby control for input shutdown P-ch Pout N-ch Nout Low-speed oscillation circuit shared with GPIO functionality: • Feedback resistor = approx. 5.0MΩ • GPIO functionality selectable (CMOS level output (IOL = 4mA, IOH = -4mA), Automotive input with input shutdown function and programmable pull-up resistor) R Automotive input X1A R X out 0 1 FCI X0A FCI or Osc disable Pull-up control P-ch Standby control for input shutdown P-ch Pout N-ch Nout R C Document Number: 002-04703 Rev. *D Automotive input CMOS hysteresis input pin Page 13 of 64 CY96670 Series Type Circuit Remarks F Power supply input protection circuit P-ch N-ch • A/D converter ref+ (AVRH) power supply input pin with protection circuit • Without protection circuit against VCC for pins AVRH G P-ch N-ch H Pull-up control P-ch P-ch Pout N-ch Nout • CMOS level output (IOL = 4mA, IOH = -4mA) • Automotive input with input shutdown function • Programmable pull-up resistor R Standby control for input shutdown Automotive input J Pull-up control P-ch P-ch Pout N-ch Nout • CMOS level output (IOL = 4mA, IOH = -4mA) • Automotive input with input shutdown function • Programmable pull-up resistor • SEG or COM output R Automotive input Standby control for input shutdown SEG or COM output Document Number: 002-04703 Rev. *D Page 14 of 64 CY96670 Series Type Circuit Remarks K Pull-up control P-ch P-ch Pout N-ch Nout • CMOS level output (IOL = 4mA, IOH = -4mA) • Automotive input with input shutdown function • Programmable pull-up resistor • Analog input R Automotive input Standby control for input shutdown Analog input L Pull-up control P-ch P-ch Pout N-ch Nout • CMOS level output (IOL = 4mA, IOH = -4mA) • Automotive input with input shutdown function • Programmable pull-up resistor • Vn input or SEG output R Automotive input Standby control for input shutdown Vn input or SEG output M Pull-up control P-ch R P-ch Pout N-ch Nout • CMOS level output (IOL = 4mA, IOH = -4mA) • CMOS hysteresis input with input shutdown function • Programmable pull-up resistor Hysteresis input Standby control for input shutdown Document Number: 002-04703 Rev. *D Page 15 of 64 CY96670 Series Type Circuit Remarks N Pull-up control P-ch P-ch Pout N-ch Nout* R • CMOS level output (IOL = 3mA, IOH = -3mA) • CMOS hysteresis input with input shutdown function • Programmable pull-up resistor *: N-channel transistor has slew rate control according to I2C spec, irrespective of usage. Hysteresis input Standby control for input shutdown • Open-drain I/O • Output 25mA, Vcc = 2.7V • TTL input O N-ch Nout R Standby control for input shutdown TTL input P Pull-up control P-ch P-ch Pout N-ch Nout • CMOS level output (IOL = 4mA, IOH = -4mA) • CMOS hysteresis inputs with input shutdown function • Programmable pull-up resistor • SEG or COM output R Hysteresis input Standby control for input shutdown SEG or COM output Document Number: 002-04703 Rev. *D Page 16 of 64 CY96670 Series Type Circuit Remarks R Pull-up control P-ch N-ch P-ch Pout N-ch Nout • CMOS level output (programmable IOL = 4mA, IOH = -4mA and IOL = 30mA, IOH = -30mA) • Automotive input with input shutdown function • Programmable pull-up / pull-down resistor • Analog input Pull-down control R Automotive input Standby control for input shutdown Analog input Document Number: 002-04703 Rev. *D Page 17 of 64 CY96670 Series 7. Memory Map FF:FFFFH USER ROM*1 DE:0000H DD:FFFFH Reserved 10:0000H 0F:C000H Boot-ROM Peripheral 0E:9000H Reserved 01:0000H 00:8000H RAMSTART0*2 ROM/RAM MIRROR Internal RAM bank0 Reserved 00:0C00H 00:0380H Peripheral 00:0180H GPR*3 00:0100H DMA 00:00F0H Reserved 00:0000H Peripheral *1: For details about USER ROM area, see “User ROM Memory Map For Flash Devices” on the following pages. *2: For RAMSTART addresses, see the table on the next page. *3: Unused GPR banks can be used as RAM area. GPR: General-Purpose Register The DMA area is only available if the device contains the corresponding resource. The available RAM and ROM area depends on the device. Document Number: 002-04703 Rev. *D Page 18 of 64 CY96670 Series 8. RAMSTART Addresses Bank 0 RAM Size Devices CY96F673 CY96F675 4KB Document Number: 002-04703 Rev. *D RAMSTART0 00:7200H Page 19 of 64 CY96670 Series 9. User ROM Memory Map For Flash Devices *: Physical address area of SAS-512B is from DF:0000H to DF:01FFH. Others (from DF:0200H to DF:1FFFH) is mirror area of SAS-512B. Sector SAS contains the ROM configuration block RCBA at CPU address DF:0000H -DF:01FFH. SAS can not be used for E2PROM emulation. Document Number: 002-04703 Rev. *D Page 20 of 64 CY96670 Series 10. Serial Programming Communication Interface USART pins for Flash serial programming (MD = 0, DEBUG I/F = 0, Serial Communication mode) CY96670 Pin Number USART Number Normal Function 29 SIN0 30 USART0 SOT0 31 SCK0 3 SIN1 4 USART1 SOT1 5 SCK1 11. Interrupt Vector Table Vector Number Offset in Vector Table Index in ICR to Program Cleared by DMA Vector Name Description 0 3FCH CALLV0 No - CALLV instruction 1 3F8H CALLV1 No - CALLV instruction 2 3F4H CALLV2 No - CALLV instruction 3 3F0H CALLV3 No - CALLV instruction 4 3ECH CALLV4 No - CALLV instruction 5 3E8H CALLV5 No - CALLV instruction 6 3E4H CALLV6 No - CALLV instruction 7 3E0H CALLV7 No - CALLV instruction 8 3DCH RESET No - Reset vector 9 3D8H INT9 No - INT9 instruction 10 3D4H EXCEPTION No - Undefined instruction execution 11 3D0H NMI No - Non-Maskable Interrupt 12 3CCH DLY No 12 Delayed Interrupt 13 3C8H RC_TIMER No 13 RC Clock Timer 14 3C4H MC_TIMER No 14 Main Clock Timer 15 3C0H SC_TIMER No 15 Sub Clock Timer 16 3BCH LVDI No 16 Low Voltage Detector 17 3B8H EXTINT0 Yes 17 External Interrupt 0 18 3B4H EXTINT1 Yes 18 External Interrupt 1 19 3B0H EXTINT2 Yes 19 External Interrupt 2 20 3ACH EXTINT3 Yes 20 External Interrupt 3 21 3A8H EXTINT4 Yes 21 External Interrupt 4 22 3A4H - - 22 Reserved 23 3A0H EXTINT6 Yes 23 External Interrupt 6 24 39CH EXTINT7 Yes 24 External Interrupt 7 25 398H - - 25 Reserved 26 394H - - 26 Reserved Document Number: 002-04703 Rev. *D Page 21 of 64 CY96670 Series Vector Number Offset in Vector Table Index in ICR to Program Cleared by DMA Vector Name Description 27 390H - - 27 Reserved 28 38CH - - 28 Reserved 29 388H - - 29 Reserved 30 384H - - 30 Reserved 31 380H - - 31 Reserved 32 37CH - - 32 Reserved 33 378H CAN0 No 33 CAN Controller 0 34 374H - - 34 Reserved 35 370H - - 35 Reserved 36 36CH - - 36 Reserved 37 368H - - 37 Reserved 38 364H PPG0 Yes 38 Programmable Pulse Generator 0 39 360H PPG1 Yes 39 Programmable Pulse Generator 1 40 35CH PPG2 Yes 40 Programmable Pulse Generator 2 41 358H PPG3 Yes 41 Programmable Pulse Generator 3 42 354H - - 42 Reserved 43 350H - - 43 Reserved 44 34CH - - 44 Reserved 45 348H - - 45 Reserved 46 344H - - 46 Reserved 47 340H - - 47 Reserved 48 33CH - - 48 Reserved 49 338H - - 49 Reserved 50 334H - - 50 Reserved 51 330H - - 51 Reserved 52 32CH - - 52 Reserved 53 328H - - 53 Reserved 54 324H - - 54 Reserved 55 320H - - 55 Reserved 56 31CH - - 56 Reserved 57 318H - - 57 Reserved 58 314H - - 58 Reserved 59 310H RLT1 Yes 59 Reload Timer 1 60 30CH RLT2 Yes 60 Reload Timer 2 61 308H - - 61 Reserved 62 304H - - 62 Reserved 63 300H - - 63 Reserved 64 2FCH RLT6 Yes 64 Reload Timer 6 65 2F8H ICU0 Yes 65 Input Capture Unit 0 66 2F4H ICU1 Yes 66 Input Capture Unit 1 67 2F0H - - 67 Reserved Document Number: 002-04703 Rev. *D Page 22 of 64 CY96670 Series Vector Number Offset in Vector Table Index in ICR to Program Cleared by DMA Vector Name Description 68 2ECH - - 68 Reserved 69 2E8H ICU4 Yes 69 Input Capture Unit 4 70 2E4H ICU5 Yes 70 Input Capture Unit 5 71 2E0H - - 71 Reserved 72 2DCH - - 72 Reserved 73 2D8H - - 73 Reserved 74 2D4H - - 74 Reserved 75 2D0H - - 75 Reserved 76 2CCH - - 76 Reserved 77 2C8H - - 77 Reserved 78 2C4H - - 78 Reserved 79 2C0H - - 79 Reserved 80 2BCH - - 80 Reserved 81 2B8H - - 81 Reserved 82 2B4H - - 82 Reserved 83 2B0H - - 83 Reserved 84 2ACH - - 84 Reserved 85 2A8H - - 85 Reserved 86 2A4H - - 86 Reserved 87 2A0H - - 87 Reserved 88 29CH - - 88 Reserved 89 298H FRT0 Yes 89 Free-Running Timer 0 90 294H FRT1 Yes 90 Free-Running Timer 1 91 290H - - 91 Reserved 92 28CH - - 92 Reserved 93 288H RTC0 No 93 Real Time Clock 94 284H CAL0 No 94 Clock Calibration Unit 95 280H SG0 No 95 Sound Generator 0 96 27CH IIC0 Yes 96 I2C interface 0 97 278H - - 97 Reserved 98 274H ADC0 Yes 98 A/D Converter 0 99 270H - - 99 Reserved 100 26CH - - 100 Reserved 101 268H LINR0 Yes 101 LIN USART 0 RX 102 264H LINT0 Yes 102 LIN USART 0 TX 103 260H LINR1 Yes 103 LIN USART 1 RX 104 25CH LINT1 Yes 104 LIN USART 1 TX 105 258H - - 105 Reserved 106 254H - - 106 Reserved 107 250H - - 107 Reserved 108 24CH - - 108 Reserved Document Number: 002-04703 Rev. *D Page 23 of 64 CY96670 Series Vector Number Offset in Vector Table Cleared by DMA Vector Name Index in ICR to Program Description 109 248H - - 109 Reserved 110 244H - - 110 Reserved 111 240H - - 111 Reserved 112 23CH - - 112 Reserved 113 238H - - 113 Reserved 114 234H - - 114 Reserved 115 230H - - 115 Reserved 116 22CH - - 116 Reserved 117 228H - - 117 Reserved 118 224H - - 118 Reserved 119 220H - - 119 Reserved 120 21CH - - 120 Reserved 121 218H - - 121 Reserved 122 214H - - 122 Reserved 123 210H - - 123 Reserved 124 20CH - - 124 Reserved 125 208H - - 125 Reserved 126 204H - - 126 Reserved 127 200H - - 127 Reserved 128 1FCH - - 128 Reserved 129 1F8H - - 129 Reserved 130 1F4H - - 130 Reserved 131 1F0H - - 131 Reserved 132 1ECH - - 132 Reserved 133 1E8H FLASHA Yes 133 Flash memory A interrupt 134 1E4H - - 134 Reserved 135 1E0H - - 135 Reserved 136 1DCH - - 136 Reserved 137 1D8H - - 137 Reserved 138 1D4H - - 138 139 1D0H ADCRC0 No 139 140 1CCH ADCPD0 No 140 Reserved A/D Converter 0 - Range Comparator A/D Converter 0 - Pulse detection 141 1C8H - - 141 Reserved 142 1C4H - - 142 Reserved 143 1C0H - - 143 Reserved Document Number: 002-04703 Rev. *D Page 24 of 64 CY96670 Series 12. Handling Precautions Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your Cypress semiconductor devices. 12.1 Precautions for Product Design This section describes precautions when designing electronic equipment using semiconductor devices.  Absolute Maximum Ratings Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings.  Recommended Operating Conditions Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical characteristics are warranted when operated within these ranges. Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their sales representative beforehand.  Processing and Protection of Pins These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output functions. 1. Preventing Over-Voltage and Over-Current Conditions Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at the design stage. 2. Protection of Output Pins Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows. Such conditions if present for extended periods of time can damage the device. Therefore, avoid this type of connection. 3. Handling of Unused Input Pins Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be connected through an appropriate resistance to a power supply pin or ground pin.  Latch-up Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is called latch-up. CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the following: 1. Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal noise, surge levels, etc. 2. Be sure that abnormal current flows do not occur during the power-on sequence.  Observance of Safety Regulations and Standards Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the design of products.  Fail-Safe Design Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Document Number: 002-04703 Rev. *D Page 25 of 64 CY96670 Series  Precautions Related to Usage of Devices Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. 12.2 Precautions for Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you should only mount under Cypress's recommended conditions. For detailed information about mount conditions, contact your sales representative.  Lead Insertion Type Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or mounting by using a socket. Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Cypress recommended mounting conditions. If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be verified before mounting.  Surface Mount Type Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges. You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Cypress ranking of recommended conditions.  Lead-Free Packaging CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength may be reduced under some conditions of use.  Storage of Semiconductor Devices Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following: 1. Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in locations where temperature changes are slight. 2. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C and 30°C. When you open Dry Package that recommends humidity 40% to 70% relative humidity. 3. When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage. 4. Avoid storing packages where they are exposed to corrosive gases or high levels of dust.  Baking Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended conditions for baking. Condition: 125°C/24 h Document Number: 002-04703 Rev. *D Page 26 of 64 CY96670 Series  Static Electricity Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: 1. Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be needed to remove electricity. 2. Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment. 3. Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1 MΩ). Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. 4. Ground all fixtures and instruments, or protect with anti-static measures. 5. Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies. 12.3 Precautions for Use Environment Reliability of semiconductor devices depends on ambient temperature and other conditions as described above. For reliable performance, do the following: 1. Humidity Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are anticipated, consider anti-humidity processing. 2. Discharge of Static Electricity When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases, use anti-static measures or processing to prevent discharges. 3. Corrosive Gases, Dust, or Oil Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices. 4. Radiation, Including Cosmic Radiation Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide shielding as appropriate. 5. Smoke, Flame CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices begin to smoke or burn, there is danger of the release of toxic gases. Customers considering the use of Cypress products in other special environmental conditions should consult with sales representatives. Document Number: 002-04703 Rev. *D Page 27 of 64 CY96670 Series 13. Handling Devices Special Care is Required for the Following when Handling the Device: • • • • • • • • • • • • • Latch-up prevention Unused pins handling External clock usage Notes on PLL clock mode operation Power supply pins (Vcc/Vss) Crystal oscillator and ceramic resonator circuit Turn on sequence of power supply to A/D converter and analog inputs Pin handling when not using the A/D converter Notes on Power-on Stabilization of power supply voltage SMC power supply pins Serial communication Mode Pin (MD) 13.1 Latch-Up Prevention CMOS IC chips may suffer latch-up under the following conditions: • A voltage higher than VCC or lower than VSS is applied to an input or output pin. • A voltage higher than the rated voltage is applied between Vcc pins and Vss pins. • The AVCC power supply is applied before the VCC voltage. Latch-up may increase the power supply current dramatically, causing thermal damages to the device. For the same reason, extra care is required to not let the analog power-supply voltage (AVCC, AVRH) exceed the digital power-supply voltage. 13.2 Unused Pins Handling Unused input pins can be left open when the input is disabled (corresponding bit of Port Input Enable register PIER = 0). Leaving unused input pins open when the input is enabled may result in misbehavior and possible permanent damage of the device. To prevent latch-up, they must therefore be pulled up or pulled down through resistors which should be more than 2k. Unused bidirectional pins can be set either to the output state and be then left open, or to the input state with either input disabled or external pull-up/pull-down resistor as described above. 13.3 External Clock Usage The permitted frequency range of an external clock depends on the oscillator type and configuration. See AC Characteristics for detailed modes and frequency limits. Single and opposite phase external clocks must be connected as follows: 13.3.1 Single Phase External Clock for Main Oscillator When using a single phase external clock for the Main oscillator, X0 pin must be driven and X1 pin left open. And supply 1.8V power to the external clock. X0 X1 Document Number: 002-04703 Rev. *D Page 28 of 64 CY96670 Series 13.3.2 Single Phase External Clock for Sub Oscillator When using a single phase external clock for the Sub oscillator, “External clock mode” must be selected and X0A/P04_0 pin must be driven. X1A/P04_1 pin can be configured as GPIO. 13.3.3 Opposite Phase External Clock When using an opposite phase external clock, X1 (X1A) pins must be supplied with a clock signal which has the opposite phase to the X0 (X0A) pins. Supply level on X0 and X1 pins must be 1.8V. X0 X1 13.4 Notes on PLL Clock Mode Operation If the microcontroller is operated with PLL clock mode and no external oscillator is operating or no external clock is supplied, the microcontroller attempts to work with the free oscillating PLL. Performance of this operation, however, cannot be guaranteed. 13.5 Power Supply Pins (Vcc/Vss) It is required that all VCC-level as well as all VSS-level power supply pins are at the same potential. If there is more than one VCC or VSS level, the device may operate incorrectly or be damaged even within the guaranteed operating range. Vcc and Vss pins must be connected to the device from the power supply with lowest possible impedance. The smoothing capacitor at Vcc pin must use the one of a capacity value that is larger than Cs. Besides this, as a measure against power supply noise, it is required to connect a bypass capacitor of about 0.1F between Vcc and Vss pins as close as possible to Vcc and Vss pins. 13.6 Crystal Oscillator and ceramic resonator Circuit Noise at X0, X1 pins or X0A, X1A pins might cause abnormal operation. It is required to provide bypass capacitors with shortest possible distance to X0, X1 pins and X0A, X1A pins, crystal oscillator (or ceramic resonator) and ground lines, and, to the utmost effort, that the lines of oscillation circuit do not cross the lines of other circuits. It is highly recommended to provide a printed circuit board art work surrounding X0, X1 pins and X0A, X1A pins with a ground area for stabilizing the operation. It is highly recommended to evaluate the quartz/MCU or resonator/MCU system at the quartz or resonator manufacturer, especially when using low-Q resonators at higher frequencies. 13.7 Turn on Sequence of Power Supply to A/D Converter and Analog Inputs It is required to turn the A/D converter power supply (AVCC, AVRH) and analog inputs (ANn) on after turning the digital power supply (VCC) on. It is also required to turn the digital power off after turning the A/D converter supply and analog inputs off. In this case, AVRH must not exceed AVCC . Input voltage for ports shared with analog input ports also must not exceed AVCC (turning the analog and digital power supplies simultaneously on or off is acceptable). 13.8 Pin Handling when not using the A/D Converter If the A/D converter is not used, the power supply pins for A/D converter should be connected such as AVCC = VCC , AVSS = AVRH = VSS. 13.9 Notes on Power-on To prevent malfunction of the internal voltage regulator, supply voltage profile while turning the power supply on should be slower than 50s from 0.2V to 2.7V. Document Number: 002-04703 Rev. *D Page 29 of 64 CY96670 Series 13.10 Stabilization of Power Supply Voltage If the power supply voltage varies acutely even within the operation safety range of the VCC power supply voltage, a malfunction may occur. The VCC power supply voltage must therefore be stabilized. As stabilization guidelines, the power supply voltage must be stabilized in such a way that VCC ripple fluctuations (peak to peak value) in the commercial frequencies (50Hz to 60Hz) fall within 10% of the standard VCC power supply voltage and the transient fluctuation rate becomes 0.1V/s or less in instantaneous fluctuation for power supply switching. 13.11 SMC Power Supply Pins All DVcc /DVss pins must be set to the same level as the Vcc /Vss pins. Note that the SMC I/O pin state is undefined if DVCC is powered on and VCC is below 3V. To avoid this, VCC must always be powered on before DVCC. DVcc/DVss must be applied when using SMC I/O pin as GPIO. 13.12 Serial Communication There is a possibility to receive wrong data due to noise or other causes on the serial communication. Therefore, design a printed circuit board so as to avoid noise. Consider receiving of wrong data when designing the system. For example apply a checksum and retransmit the data if an error occurs. 13.13 Mode Pin (MD) Connect the mode pin directly to Vcc or Vss pin. To prevent the device unintentionally entering test mode due to noise, lay out the printed circuit board so as to minimize the distance from the mode pin to Vcc or Vss pin and provide a low-impedance connection. Document Number: 002-04703 Rev. *D Page 30 of 64 CY96670 Series 14. Electrical Characteristics 14.1 Absolute Maximum Ratings Rating Parameter Symbol Condition Unit Min Remarks Max Power supply voltage*1 VCC - VSS - 0.3 VSS + 6.0 V Analog power supply voltage*1 AVCC - VSS - 0.3 VSS + 6.0 V VCC = AVCC*2 Analog reference voltage*1 AVRH - VSS - 0.3 VSS + 6.0 V AVCC ≥ AVRH, AVRH ≥ AVSS SMC Power supply*1 DVCC - VSS - 0.3 VSS + 6.0 V VCC = AVCC= DVCC*2 V0 to V3 - VSS - 0.3 VSS + 6.0 V V0 to V3 must not exceed VCC VI - VSS - 0.3 VSS + 6.0 V VI ≤ (D)VCC + 0.3V*3 VO - VSS - 0.3 VSS + 6.0 V VO ≤ (D)VCC + 0.3V*3 Maximum Clamp Current ICLAMP - -4.0 +4.0 mA Applicable to general purpose I/O pins *4 Total Maximum Clamp Current Σ|ICLAMP| - - 16 mA Applicable to general purpose I/O pins *4 IOL - - 15 mA Normal port TA= -40°C - 52 mA TA= +25°C - 39 mA TA= +85°C - 32 mA TA= +105°C - 30 mA - - 4 mA TA= -40°C - 40 mA TA= +25°C - 30 mA TA= +85°C - 25 mA LCD power supply voltage*1 Input voltage*1 Output voltage*1 "L" level maximum output current IOLSMC IOLAV "L" level average output current IOLAVSMC High current port Normal port High current port TA= +105°C - 23 mA "L" level maximum overall output current ΣIOL - - 34 mA Normal port ΣIOLSMC - - 180 mA High current port "L" level average overall output current ΣIOLAV - - 17 mA Normal port ΣIOLAVSMC - - 90 mA High current port IOH - - -15 mA Normal port TA= -40°C - -52 mA TA= +25°C - -39 mA TA= +85°C - -32 mA TA= +105°C - -30 mA - - -4 mA TA= -40°C - -40 mA TA= +25°C - -30 mA TA= +85°C - -25 mA TA= +105°C - -23 mA - - -34 mA Normal port - - -180 mA High current port - - -17 mA Normal port - - -90 mA High current port mW °C "H" level maximum output current IOHSMC IOHAV "H" level average output current "H" level maximum overall output current "H" level average overall output current Power consumption*5 Operating ambient temperature Document Number: 002-04703 Rev. *D IOHAVSMC ΣIOH ΣIOHSMC ΣIOHAV ΣIOHAVSMC PD TA= +105°C - 281*6 TA - -40 +105 High current port Normal port High current port Page 31 of 64 CY96670 Series Rating Parameter Symbol Condition Unit Min Storage temperature TSTG This parameter is based on VSS = AVSS = DVSS = 0V. -55 Remarks Max +150 °C *1: *2: AVCC and VCC and DVCC must be set to the same voltage. It is required that AVCC does not exceed VCC, DVCC and that the voltage at the analog inputs does not exceed AVCC when the power is switched on. *3: VI and VO should not exceed VCC + 0.3V. VI should also not exceed the specified ratings. However if the maximum current to/from an input is limited by some means with external components, the ICLAMP rating supersedes the VI rating. Input/Output voltages of high current ports depend on DVCC. Input/Output voltages of standard ports depend on VCC. *4: Applicable to all general purpose I/O pins (Pnn_m). • • • • • • • • • Use within recommended operating conditions. Use at DC voltage (current). The +B signal should always be applied a limiting resistance placed between the +B signal and the microcontroller. The value of the limiting resistance should be set so that when the +B signal is applied the input current to the microcontroller pin does not exceed rated values, either instantaneously or for prolonged periods. Note that when the microcontroller drive current is low, such as in the power saving modes, the +B input potential may pass through the protective diode and increase the potential at the VCC pin, and this may affect other devices. Note that if a +B signal is input when the microcontroller power supply is off (not fixed at 0V), the power supply is provided from the pins, so that incomplete operation may result. Note that if the +B input is applied during power-on, the power supply is provided from the pins and the resulting supply voltage may not be sufficient to operate the Power reset. The DEBUG I/F pin has only a protective diode against VSS. Hence it is only permitted to input a negative clamping current (4mA). For protection against positive input voltages, use an external clamping diode which limits the input voltage to maximum 6.0V. Sample recommended circuits: Protective diode VCC Limiting resistance P-ch +B input (0V to 16V) N-ch R *5: The maximum permitted power dissipation depends on the ambient temperature, the air flow velocity and the thermal conductance of the package on the PCB. The actual power dissipation depends on the customer application and can be calculated as follows: PD = PIO + PINT PIO = Σ (VOL  IOL + VOH  IOH) (I/O load power dissipation, sum is performed on all I/O ports) PINT = VCC  (ICC + IA) (internal power dissipation) ICC is the total core current consumption into VCC as described in the “DC characteristics” and depends on the selected operation mode and clock frequency and the usage of functions like Flash programming. IA is the analog current consumption into AVCC. *6: Worst case value for a package mounted on single layer PCB at specified TA without air flow. WARNING Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. Document Number: 002-04703 Rev. *D Page 32 of 64 CY96670 Series 14.2 Recommended Operating Conditions (VSS = AVSS = DVSS = 0V) Value Parameter Symbol Unit Min Power supply voltage Smoothing capacitor at C pin VCC, AVCC, DVCC CS Typ Remarks Max 2.7 - 5.5 V 2.0 - 5.5 V Maintains RAM data in stop mode F 1.0F (Allowance within ± 50%) 3.9µF (Allowance within ± 20%) Please use the ceramic capacitor or the capacitor of the frequency response of this level. The smoothing capacitor at VCC must use the one of a capacity value that is larger than CS. 0.5 1.0 to 3.9 4.7 WARNING The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand. Document Number: 002-04703 Rev. *D Page 33 of 64 CY96670 Series 14.3 DC Characteristics 14.3.1 Current Rating (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Power supply current in Run modes*1 Power supply current in Sleep modes*1 Symbol Pin Name Value Conditions Unit Min Typ Remarks Max PLL Run mode with CLKS1/2 = CLKB = CLKP1/2 = 32MHz Flash 0 wait (CLKRC and CLKSC stopped) - 25 - mA TA = +25°C ICCPLL - - 34 mA TA = +105°C - 3.5 - mA TA = +25°C ICCMAIN Main Run mode with CLKS1/2 = CLKB = CLKP1/2 = 4MHz Flash 0 wait (CLKPLL, CLKSC and CLKRC stopped) - - 7.5 mA TA = +105°C - 1.7 - mA TA = +25°C ICCRCH RC Run mode with CLKS1/2 = CLKB = CLKP1/2 = CLKRC = 2MHz Flash 0 wait (CLKMC, CLKPLL and CLKSC stopped) - - 5.5 mA TA = +105°C - 0.15 - mA TA = +25°C ICCRCL RC Run mode with CLKS1/2 = CLKB = CLKP1/2 = CLKRC = 100kHz Flash 0 wait (CLKMC, CLKPLL and CLKSC stopped) - - 3.2 mA TA = +105°C - 0.1 - mA TA = +25°C ICCSUB Sub Run mode with CLKS1/2 = CLKB = CLKP1/2 = 32kHz Flash 0 wait (CLKMC, CLKPLL and CLKRC stopped) - - 3 mA TA = +105°C PLL Sleep mode with CLKS1/2 = CLKP1/2 = 32MHz (CLKRC and CLKSC stopped) - 6.5 - mA TA = +25°C ICCSPLL - - 13 mA TA = +105°C - 0.9 - mA TA = +25°C ICCSMAIN Main Sleep mode with CLKS1/2 = CLKP1/2 = 4MHz, SMCR:LPMSS = 0 (CLKPLL, CLKRC and CLKSC stopped) - - 4 mA TA = +105°C - 0.5 - mA TA = +25°C ICCSRCH RC Sleep mode with CLKS1/2 = CLKP1/2 = CLKRC = 2MHz, SMCR:LPMSS = 0 (CLKMC, CLKPLL and CLKSC stopped) - - 3.5 mA TA = +105°C - 0.06 - mA TA = +25°C ICCSRCL RC Sleep mode with CLKS1/2 = CLKP1/2 = CLKRC = 100kHz (CLKMC, CLKPLL and CLKSC stopped) - - 2.7 mA TA = +105°C - 0.04 - mA TA = +25°C ICCSSUB Sub Sleep mode with CLKS1/2 = CLKP1/2 = 32kHz, (CLKMC, CLKPLL and CLKRC stopped) - - 2.5 mA TA = +105°C Vcc Vcc Document Number: 002-04703 Rev. *D Page 34 of 64 CY96670 Series Parameter Symbol Value Pin Name Conditions Unit Min Typ Remarks Max PLL Timer mode with CLKPLL = 32MHz (CLKRC and CLKSC stopped) - 1800 2245 A TA = +25°C ICCTPLL - - 3140 A TA = +105°C - 285 325 A TA = +25°C ICCTMAIN Main Timer mode with CLKMC = 4MHz, SMCR:LPMSS = 0 (CLKPLL, CLKRC and CLKSC stopped) - - 1055 A TA = +105°C - 160 210 A TA = +25°C ICCTRCH RC Timer mode with CLKRC = 2MHz, SMCR:LPMSS = 0 (CLKPLL, CLKMC and CLKSC stopped) - - 970 A TA = +105°C - 30 70 A TA = +25°C ICCTRCL RC Timer mode with CLKRC = 100kHz (CLKPLL, CLKMC and CLKSC stopped) - - 820 A TA = +105°C - 25 55 A TA = +25°C ICCTSUB Sub Timer mode with CLKSC = 32kHz (CLKMC, CLKPLL and CLKRC stopped) - - 800 A TA = +105°C Power supply current in Stop mode*3 - 20 55 A TA = +25°C ICCH - - - 800 A TA = +105°C Flash Power Down current ICCFLASHPD - - 36 70 A - 5 - A TA = +25°C - - 12.5 A TA = +105°C - 12.5 - mA TA = +25°C - - 20 mA TA = +105°C Power supply current in Timer modes*2 Power supply current for active Low Voltage detector*4 ICCLVD Low voltage detector enabled Flash Write/ Erase current*5 ICCFLASH - *1: *2: Vcc The power supply current is measured with a 4MHz external clock connected to the Main oscillator and a 32kHz external clock connected to the Sub oscillator. See chapter “Standby mode and voltage regulator control circuit” of the Hardware Manual for further details about voltage regulator control. Current for "On Chip Debugger" part is not included. Power supply current in Run mode does not include Flash Write / Erase current. The power supply current in Timer mode is the value when Flash is in Power-down / reset mode. When Flash is not in Power-down / reset mode, ICCFLASHPD must be added to the Power supply current. The power supply current is measured with a 4MHz external clock connected to the Main oscillator and a 32kHz external clock connected to the Sub oscillator. The current for "On Chip Debugger" part is not included. *3: The power supply current in Stop mode is the value when Flash is in Power-down / reset mode. When Flash is not in Power-down / reset mode, ICCFLASHPD must be added to the Power supply current. *4: When low voltage detector is enabled, ICCLVD must be added to Power supply current. *5: When Flash Write / Erase program is executed, ICCFLASH must be added to Power supply current. Document Number: 002-04703 Rev. *D Page 35 of 64 CY96670 Series 14.3.2 Pin Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Pin Name Conditions Unit Min VIH "H" level input voltage "L" level input voltage Port inputs Pnn_m Typ Remarks Max - VCC  0.7 - VCC + 0.3 V CMOS Hysteresis input - VCC  0.8 - VCC + 0.3 V AUTOMOTIVE Hysteresis input VD=1.8V±0.15V VIHX0S X0 External clock in "Fast Clock Input mode" VD  0.8 - VD V VIHX0AS X0A External clock in "Oscillation mode" VCC  0.8 - VCC + 0.3 V VIHR RSTX - VCC  0.8 - VCC + 0.3 V CMOS Hysteresis input VIHM MD - VCC - 0.3 - VCC + 0.3 V CMOS Hysteresis input VIHD DEBUG I/F - 2.0 - VCC + 0.3 V TTL Input - VSS - 0.3 - VCC  0.3 V VIL Port inputs Pnn_m CMOS Hysteresis input - VSS - 0.3 - VCC  0.5 V AUTOMOTIVE Hysteresis input VD=1.8V±0.15V VILX0S X0 External clock in "Fast Clock Input mode" VSS - VD  0.2 V VILX0AS X0A External clock in "Oscillation mode" VSS - 0.3 - VCC  0.2 V VILR RSTX - VSS - 0.3 - VCC  0.2 V CMOS Hysteresis input VILM MD - VSS - 0.3 - VSS + 0.3 V CMOS Hysteresis input VILD DEBUG I/F - VSS - 0.3 - 0.8 V TTL Input Document Number: 002-04703 Rev. *D Page 36 of 64 CY96670 Series Value Parameter Symbol Pin Name Conditions Unit Min VOH4 4mA type 4.5V ≤ (D)VCC ≤ 5.5V IOH = -4mA 2.7V ≤ (D)VCC < 4.5V IOH = -1.5mA (D)VCC - 0.5 Typ - (D)VCC V 4.5V ≤ DVCC ≤ 5.5V IOH = -52mA TA = -40°C 2.7V ≤ DVCC < 4.5V IOH = -18mA 4.5V ≤ DVCC ≤ 5.5V IOH = -39mA "H" level output voltage VOH30 High Drive type* 2.7V ≤ DVCC < 4.5V IOH = -16mA 4.5V ≤ DVCC ≤ 5.5V IOH = -32mA TA = +25°C DVCC - 0.5 - DVCC V TA = +85°C 2.7V ≤ DVCC < 4.5V IOH = -14.5mA 4.5V ≤ DVCC ≤ 5.5V IOH = -30mA TA = +105°C 2.7V ≤ DVCC < 4.5V IOH = -14mA VOH3 3mA type VOL4 4mA type 4.5V ≤ VCC ≤ 5.5V IOH = -3mA 2.7V ≤ VCC < 4.5V IOH = -1.5mA 4.5V ≤ (D)VCC ≤ 5.5V IOL = +4mA 2.7V ≤ (D)VCC < 4.5V IOL = +1.7mA VCC - 0.5 - VCC V - - 0.4 V 4.5V ≤ DVCC ≤ 5.5V IOL = +52mA TA = -40°C 2.7V ≤ DVCC < 4.5V IOL = +22mA 4.5V ≤ DVCC ≤ 5.5V IOL = +39mA "L" level output voltage VOL30 High Drive type* 2.7V ≤ DVCC < 4.5V IOL = +18mA 4.5V ≤ DVCC ≤ 5.5V IOL = +32mA TA = +25°C - - 0.5 V TA = +85°C 2.7V ≤ DVCC < 4.5V IOL = +14mA 4.5V ≤ DVCC ≤ 5.5V IOL = +30mA TA = +105°C 2.7V ≤ DVCC < 4.5V IOL = +13.5mA VOL3 3mA type 2.7V ≤ VCC < 5.5V IOL = +3mA - - 0.4 V VOLD DEBUG I/F VCC = 2.7V IOL = +25mA 0 - 0.25 V Document Number: 002-04703 Rev. *D Remarks Max Page 37 of 64 CY96670 Series Value Parameter Symbol Pin Name Conditions Min Typ Unit Remarks Single port pin except high current output I/O for SMC Max Pnn_m VSS < VI < VCC AVSS < VI < AVCC, AVRH -1 - +1 A P08_m DVSS < VI < DVCC AVSS < VI < AVCC, AVRH -3 - +3 A Σ|IILCD| All SEG/ COM pin VCC = 5.0V - 0.5 10 A Internal LCD divide resistance RLCD Between V3 and V2, V2 and V1, V1 and V0 VCC = 5.0V 6.25 12.5 25 k Pull-up resistance value RPU Pnn_m VCC = 5.0V ±10% 25 50 100 k Pull-down resistance value RDOWN P08_m VCC = 5.0V ±10% 25 50 100 k Other than C, Vcc, Vss, DVcc DVss, AVcc, AVss, AVRH, P08_m - - 5 15 pF P08_m - - 15 30 pF Input leak current Total LCD leak current Input capacitance IIL CIN Maximum leakage current of all LCD pins *: In the case of driving stepping motor directly or high current outputs, set "1" to the bit in the Port High Drive Register (PHDRnn:HDx="1"). Document Number: 002-04703 Rev. *D Page 38 of 64 CY96670 Series 14.4 AC Characteristics 14.4.1 Main Clock Input Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VD=1.8V±0.15V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Input frequency fC Value Pin Name Symbol X0, X1 Unit Min - 8 MHz When using a crystal oscillator, PLL off - - 8 MHz When using an opposite phase external clock, PLL off MHz When using a crystal oscillator or opposite phase external clock, PLL on MHz When using a single phase external clock in “Fast Clock Input mode”, PLL off When using a single phase external clock in “Fast Clock Input mode”, PLL on fFCI - - 8 8 X0 4 - 8 MHz Input clock cycle tCYLH - 125 - - ns Input clock pulse width PWH, PWL - 55 - - ns Document Number: 002-04703 Rev. *D Remarks Max 4 4 Input frequency Typ Page 39 of 64 CY96670 Series 14.4.2 Sub Clock Input Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Input frequency Input clock cycle Input clock pulse width fCL tCYLL - Document Number: 002-04703 Rev. *D Value Pin Name Symbol Conditions Unit Min Typ Remarks Max - - 32.768 - kHz When using an oscillation circuit - - - 100 kHz When using an opposite phase external clock X0A - - - 50 kHz When using a single phase external clock - - 10 - - s - PWH/tCYLL, PWL/tCYLL 30 - 70 % X0A, X1A Page 40 of 64 CY96670 Series 14.4.3 Built-in RC Oscillation Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Unit Min Clock frequency fRC RC clock stabilization time 14.4.4 Typ Remarks Max 50 100 200 kHz When using slow frequency of RC oscillator 1 2 4 MHz When using fast frequency of RC oscillator 80 160 320 s When using slow frequency of RC oscillator (16 RC clock cycles) 64 128 256 s When using fast frequency of RC oscillator (256 RC clock cycles) tRCSTAB Internal Clock Timing (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Unit Min Max Internal System clock frequency (CLKS1 and CLKS2) fCLKS1, fCLKS2 - 54 MHz Internal CPU clock frequency (CLKB), Internal peripheral clock frequency (CLKP1) fCLKB, fCLKP1 - 32 MHz Internal peripheral clock frequency (CLKP2) fCLKP2 - 32 MHz 14.4.5 Operating Conditions of PLL (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Unit Min Typ Remarks Max PLL oscillation stabilization wait time tLOCK 1 - 4 ms PLL input clock frequency fPLLI 4 - 8 MHz PLL oscillation clock frequency fCLKVCO 56 - 108 MHz Permitted VCO output frequency of PLL (CLKVCO) PLL phase jitter tPSKEW -5 - +5 ns For CLKMC (PLL input clock) ≥ 4MHz Document Number: 002-04703 Rev. *D For CLKMC = 4MHz Page 41 of 64 CY96670 Series 14.4.6 Reset Input (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Pin Name Unit Min Reset input time tRSTL Rejection of reset input time RSTX Max 10 - s 1 - s tRSTL RSTX 0.2VCC 0.2VCC 14.4.7 Power-on Reset Timing (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Pin Name Unit Min Typ Max Power on rise time tR Vcc 0.05 - 30 ms Power off time tOFF Vcc 1 - - ms Document Number: 002-04703 Rev. *D Page 42 of 64 CY96670 Series 14.4.8 USART Timing (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C, CL=50pF) Parameter Symbol Serial clock cycle time Pin Name 4.5V  VCC 5.5V 2.7V  VCC  4.5V Min Min Conditions Unit Max Max tSCYC SCKn 4tCLKP1 - 4tCLKP1 - ns SCK   SOT delay time tSLOVI SCKn, SOTn - 20 + 20 - 30 + 30 ns SOT  SCK  delay time tOVSHI SCKn, SOTn NtCLKP1 – 20* - NtCLKP1 – 30* - ns SIN  SCK  setup time tIVSHI SCKn, SINn tCLKP1 + 45 - tCLKP1 + 55 - ns SCK   SIN hold time tSHIXI SCKn, SINn 0 - 0 - ns Serial clock "L" pulse width tSLSH SCKn tCLKP1 + 10 - tCLKP1 + 10 - ns Serial clock "H" pulse width tSHSL SCKn tCLKP1 + 10 - tCLKP1 + 10 - ns SCK   SOT delay time tSLOVE SCKn, SOTn - 2tCLKP1 + 45 - 2tCLKP1 + 55 ns SIN  SCK  setup time tIVSHE SCKn, SINn tCLKP1/2 + 10 - tCLKP1/2 + 10 - ns SCK   SIN hold time tSHIXE SCKn, SINn tCLKP1 + 10 - tCLKP1 + 10 - ns SCK fall time tF SCKn - 20 - 20 ns SCK rise time tR SCKn - 20 - 20 ns Internal shift clock mode External shift clock mode Notes: • AC characteristic in CLK synchronized mode. • CL is the load capacity value of pins when testing. • Depending on the used machine clock frequency, the maximum possible baud rate can be limited by some parameters. These parameters are shown in “CY96600 series HARDWARE MANUAL”. • tCLKP1 indicates the peripheral clock 1 (CLKP1), Unit: ns • These characteristics only guarantee the same relocate port number. For example, the combination of SCKn and SOTn_R is not guaranteed. *: Parameter N depends on tSCYC and can be calculated as follows: • If tSCYC = 2  k  tCLKP1, then N = k, where k is an integer > 2 • If tSCYC = (2  k + 1)  tCLKP1, then N = k + 1, where k is an integer > 1 Examples: tSCYC N 4  tCLKP1 2 5  tCLKP1, 6  tCLKP1 3 7  tCLKP1, 8  tCLKP1 4 … … Document Number: 002-04703 Rev. *D Page 43 of 64 CY96670 Series tSCYC VOH SCK VOL VOL tOVSHI tSLOVI VOH SOT VOL tIVSHI SIN tSHIXI VIH VIH VIL VIL Internal shift clock mode SCK tSHSL tSLSH VIH VIH VIL tF SOT VIL VIH tR tSLOVE VOH VOL SIN tIVSHE VIH VIL tSHIXE VIH VIL External shift clock mode Document Number: 002-04703 Rev. *D Page 44 of 64 CY96670 Series 14.4.9 External Input Timing (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Pin Name Unit Min Pnn_m General Purpose I/O ADTG tINH, tINL A/D Converter trigger input 2tCLKP1 +200 (tCLKP1= 1/fCLKP1)* TINn, TINn_R Input pulse width TTGn - ns Input Capture INTn, INTn_R 200 NMI *: tCLKP1 indicates the peripheral clock1 (CLKP1) cycle time except stop when in stop mode. tINH VIH ns External Interrupt Non-Maskable Interrupt tINL VIH VIL Document Number: 002-04703 Rev. *D Reload Timer PPG trigger input INn, INn_R External input timing Remarks Max VIL Page 45 of 64 CY96670 Series 14.4.10 I2C Timing (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Typical Mode Parameter Symbol High-Speed Mode*4 Conditions Unit Min Max Min Max SCL clock frequency fSCL 0 100 0 400 kHz (Repeated) START condition hold time SDA   SCL  tHDSTA 4.0 - 0.6 - s SCL clock "L" width tLOW 4.7 - 1.3 - s SCL clock "H" width tHIGH 4.0 - 0.6 - s (Repeated) START condition setup time SCL   SDA  tSUSTA 4.7 - 0.6 - s Data hold time SCL   SDA   tHDDAT 0 3.45*2 0 0.9*3 s Data setup time SDA    SCL  tSUDAT 250 - 100 - ns STOP condition setup time SCL   SDA  tSUSTO 4.0 - 0.6 - s Bus free time between "STOP condition" and "START condition" tBUS 4.7 - 1.3 - s Pulse width of spikes which will be suppressed by input noise filter tSP 0 (1-1.5) tCLKP1*5 0 (1-1.5) tCLKP1*5 ns CL = 50pF, R = (Vp/IOL)*1 - *1: R and CL represent the pull-up resistance and load capacitance of the SCL and SDA lines, respectively. Vp indicates the power supply voltage of the pull-up resistance and IOL indicates VOL guaranteed current. *2: The maximum tHDDAT only has to be met if the device does not extend the "L" width (tLOW) of the SCL signal. *3: A high-speed mode I2C bus device can be used on a standard mode I2C bus system as long as the device satisfies the requirement of "tSUDAT ≥ 250ns". *4: For use at over 100kHz, set the peripheral clock1 (CLKP1) to at least 6MHz. *5: tCLKP1 indicates the peripheral clock1 (CLKP1) cycle time. SDA tSUDAT tSUSTA tBUS tLOW SCL tHDSTA Document Number: 002-04703 Rev. *D tHDDAT tHIGH tHDSTA tSP tSUSTO Page 46 of 64 CY96670 Series 14.5 A/D Converter 14.5.1 Electrical Characteristics for the A/D Converter (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Pin Name Unit Min Typ Remarks Max Resolution - - - - 10 bit Total error - - - 3.0 - + 3.0 LSB Nonlinearity error - - - 2.5 - + 2.5 LSB Differential Nonlinearity error - - - 1.9 - + 1.9 LSB Typ + 20 mV Zero transition voltage VOT ANn Typ - 20 AVSS + 0.5LSB Full scale transition voltage VFST ANn Typ - 20 AVRH - 1.5LSB Typ + 20 mV Compare time* - - 1.0 - 5.0 s 4.5V ≤ ΑVCC ≤ 5.5V 2.2 - 8.0 s 2.7V ≤ ΑVCC  4.5V 0.5 - - s 4.5V ≤ ΑVCC ≤ 5.5V 1.2 - - s 2.7V ≤ ΑVCC  4.5V - 2.0 3.1 mA A/D Converter active - - 3.3 A A/D Converter not operated - 520 810 A A/D Converter active - - 1.0 A A/D Converter not operated AN8, 9, 12, 13 - - 15.5 pF Normal outputs AN16 to 23 - - 17.4 pF High current outputs - - 1450  4.5V ≤ AVCC ≤ 5.5V - - 2700  2.7V ≤ AVCC < 4.5V AN8, 9, 12, 13 - 1.0 - + 1.0 A AN16 to 23 - 3.0 - + 3.0 A AVSS VAIN  AVCC, AVRH ANn AVSS - AVRH V - AVRH AVCC - 0.1 - AVCC V - ANn - - 4.0 LSB Sampling time* - - IA Power supply current IAH Reference power supply current (between AVRH and AVSS ) IR Analog input capacity CVIN IRH Analog impedance RVIN Analog port input current (during conversion) IAIN Analog input voltage VAIN Reference voltage range Variation between channels *: Time for each channel. Document Number: 002-04703 Rev. *D AVCC AVRH ANn Page 47 of 64 CY96670 Series 14.5.2 Accuracy and Setting of the A/D Converter Sampling Time If the external impedance is too high or the sampling time too short, the analog voltage charged to the internal sample and hold capacitor is insufficient, adversely affecting the A/D conversion precision. To satisfy the A/D conversion precision, a sufficient sampling time must be selected. The required sampling time (Tsamp) depends on the external driving impedance Rext, the board capacitance of the A/D converter input pin Cext and the AVCC voltage level. The following replacement model can be used for the calculation: MCU Rext Analog input RVIN Source Comparator Cext CVIN Sampling switch (During sampling:ON) Rext: External driving impedance Cext: Capacitance of PCB at A/D converter input CVIN: Analog input capacity (I/O, analog switch and ADC are contained) RVIN: Analog input impedance (I/O, analog switch and ADC are contained) The following approximation formula for the replacement model above can be used: Tsamp = 7.62 × (Rext × Cext + (Rext + RVIN) × CVIN) • Do not select a sampling time below the absolute minimum permitted value. (0.5s for 4.5V ≤ AVCC ≤ 5.5V, 1.2s for 2.7V ≤ AVCC < 4.5V) • If the sampling time cannot be sufficient, connect a capacitor of about 0.1F to the analog input pin. • A big external driving impedance also adversely affects the A/D conversion precision due to the pin input leakage current IIL (static current before the sampling switch) or the analog input leakage current IAIN (total leakage current of pin input and comparator during sampling). The effect of the pin input leakage current IIL cannot be compensated by an external capacitor. • The accuracy gets worse as |AVRH - AVSS| becomes smaller. Document Number: 002-04703 Rev. *D Page 48 of 64 CY96670 Series 14.5.3 Definition of A/D Converter Terms • Resolution • Nonlinearity error transition point • • • • : Analog variation that is recognized by an A/D converter. : Deviation of the actual conversion characteristics from a straight line that connects the zero (0b0000000000 ←→ 0b0000000001) to the full-scale transition point (0b1111111110 ←→ 0b1111111111). Differential nonlinearity error : Deviation from the ideal value of the input voltage that is required to change the output code by 1LSB. Total error : Difference between the actual value and the theoretical value. The total error includes zero transition error, full-scale transition error and nonlinearity error. Zero transition voltage : Input voltage which results in the minimum conversion value. Full scale transition voltage: Input voltage which results in the maximum conversion value. Nonlinearity error of digital output N = VNT - {1LSB  (N - 1) + VOT} 1LSB Differential nonlinearity error of digital output N = 1LSB = N VOT VFST VNT : : : : V(N + 1) T - VNT 1LSB [LSB] - 1 [LSB] VFST - VOT 1022 A/D converter digital output value. Voltage at which the digital output changes from 0x000 to 0x001. Voltage at which the digital output changes from 0x3FE to 0x3FF. Voltage at which the digital output changes from 0x(N − 1) to 0xN. Document Number: 002-04703 Rev. *D Page 49 of 64 CY96670 Series 1LSB (Ideal value) = Total error of digital output N = AVRH - AVSS 1024 [V] VNT - {1LSB  (N - 1) + 0.5LSB} 1LSB N : A/D converter digital output value. VNT : Voltage at which the digital output changes from 0x(N + 1) to 0xN. VOT (Ideal value) = AVSS + 0.5LSB[V] VFST (Ideal value) = AVRH - 1.5LSB[V] Document Number: 002-04703 Rev. *D Page 50 of 64 CY96670 Series 14.6 High Current Output Slew Rate (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Pin Name Conditions Unit Min Output rise/fall time tR30, tF30 Outputs driving strength set to "30mA" P08_m Voltage Typ 15 Remarks Max - 75 ns CL=85pF VH=VOL30+0.9 × (V OH30-VOL30) VL=VOL30+0.1 × (V OH30-VOL30) VH VH VL VL tR30 tF30 Time 14.7 Low Voltage Detection Function Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Conditions Unit Min Detected voltage*1 Typ Max VDL0 CILCR:LVL = 0000B 2.70 2.90 3.10 V VDL1 CILCR:LVL = 0001B 2.79 3.00 3.21 V VDL2 CILCR:LVL = 0010B 2.98 3.20 3.42 V VDL3 CILCR:LVL = 0011B 3.26 3.50 3.74 V VDL4 CILCR:LVL = 0100B 3.45 3.70 3.95 V VDL5 CILCR:LVL = 0111B 3.73 4.00 4.27 V VDL6 CILCR:LVL = 1001B 3.91 4.20 4.49 V Power supply voltage change rate*2 dV/dt - - 0.004 - + 0.004 V/s Hysteresis width VHYS CILCR:LVHYS=0 - - 50 mV CILCR:LVHYS=1 80 100 120 mV Stabilization time TLVDSTAB - - - 75 s Detection delay time td - - - 30 s *1: If the power supply voltage fluctuates within the time less than the detection delay time (td), there is a possibility that the low voltage detection will occur or stop after the power supply voltage passes the detection range. *2: In order to perform the low voltage detection at the detection voltage (VDLX), be sure to suppress fluctuation of the power supply voltage within the limits of the change ration of power supply voltage. Document Number: 002-04703 Rev. *D Page 51 of 64 CY96670 Series Voltage Vcc dV Detected Voltage dt VDLX max VDLX min Time RCR:LVDE ···Low voltage detection function enable Document Number: 002-04703 Rev. *D Low voltage detection function disable Stabilization time TLVDSTAB Low voltage detection function enable··· Page 52 of 64 CY96670 Series 14.8 Flash Memory Write/Erase Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Conditions Unit Min Typ Remarks Max Large Sector - - 1.6 7.5 s Small Sector - - 0.4 2.1 s Security Sector - - 0.31 1.65 s Word (16-bit) write time - - 25 400 s Not including system-level overhead time. Chip erase time - - 5.11 25.05 s Includes write time prior to internal erase. Sector erase time Includes write time prior to internal erase. Note: While the Flash memory is written or erased, shutdown of the external power (VCC) is prohibited. In the application system where the external power (VCC) might be shut down while writing or erasing, be sure to turn the power off by using a low voltage detection function. To put it concrete, change the external power in the range of change ration of power supply voltage (-0.004V/s to +0.004V/s) after the external power falls below the detection voltage (VDLX)*1. Write/Erase cycles and data hold time Write/Erase Cycles (Cycle) Data Hold Time (Year) 1,000 20 *2 10,000 10 *2 100,000 5 *2 *1: See "Low Voltage Detection Function Characteristics". *2 : This value comes from the technology qualification (using Arrhenius equation to translate high temperature measurements into normalized value at + 85C). Document Number: 002-04703 Rev. *D Page 53 of 64 CY96670 Series 15. Example Characteristics This characteristic is an actual value of the arbitrary sample. It is not the guaranteed value.  CY96F675 Run Mode (VCC = 5.5V) 100.00 PLL clock (32MHz) 10.00 ICC [mA] Main osc. (4MHz) 1.00 RC clock (2MHz) RC clock (100kHz) 0.10 Sub osc. (32kHz) 0.01 -50 0 50 100 150 TA [ºC] Sleep Mode 100.000 PLL clock (32MHz) 10.000 ICC [mA] (VCC = 5.5V) Main osc. (4MHz) 1.000 RC clock (2MHz) 0.100 RC clock (100kHz) 0.010 Sub osc. (32kHz) 0.001 -50 0 50 100 150 TA [ºC] Document Number: 002-04703 Rev. *D Page 54 of 64 CY96670 Series  CY96F675 Timer Mode (VCC = 5.5V) 10.000 PLL clock (32MHz) 1.000 ICC [mA] Main osc. (4MHz) 0.100 RC clock (2MHz) RC clock (100kHz) 0.010 Sub osc. (32kHz) 0.001 -50 0 50 100 150 TA [ºC] Stop Mode (VCC = 5.5V) 1.000 ICC [mA] 0.100 0.010 0.001 -50 0 50 100 150 TA [ºC] Document Number: 002-04703 Rev. *D Page 55 of 64 CY96670 Series  Used setting Selected Source Clock Mode Run mode Sleep mode Timer mode Stop mode Clock/Regulator and FLASH Settings PLL CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 32MHz Main osc. CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 4MHz RC clock fast CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 2MHz RC clock slow CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 100kHz Sub osc. CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 32kHz PLL CLKS1 = CLKS2 = CLKP1 = CLKP2 = 32MHz Regulator in High Power Mode, (CLKB is stopped in this mode) Main osc. CLKS1 = CLKS2 = CLKP1 = CLKP2 = 4MHz Regulator in High Power Mode, (CLKB is stopped in this mode) RC clock fast CLKS1 = CLKS2 = CLKP1 = CLKP2 = 2MHz Regulator in High Power Mode, (CLKB is stopped in this mode) RC clock slow CLKS1 = CLKS2 = CLKP1 = CLKP2 = 100kHz Regulator in Low Power Mode, (CLKB is stopped in this mode) Sub osc. CLKS1 = CLKS2 = CLKP1 = CLKP2 = 32kHz Regulator in Low Power Mode, (CLKB is stopped in this mode) PLL CLKMC = 4MHz, CLKPLL = 32MHz (System clocks are stopped in this mode) Regulator in High Power Mode, FLASH in Power-down / reset mode Main osc. CLKMC = 4MHz (System clocks are stopped in this mode) Regulator in High Power Mode, FLASH in Power-down / reset mode RC clock fast CLKMC = 2MHz (System clocks are stopped in this mode) Regulator in High Power Mode, FLASH in Power-down / reset mode RC clock slow CLKMC = 100kHz (System clocks are stopped in this mode) Regulator in Low Power Mode, FLASH in Power-down / reset mode Sub osc. CLKMC = 32 kHz (System clocks are stopped in this mode) Regulator in Low Power Mode, FLASH in Power-down / reset mode stopped (All clocks are stopped in this mode) Regulator in Low Power Mode, FLASH in Power-down / reset mode Document Number: 002-04703 Rev. *D Page 56 of 64 CY96670 Series 16. Ordering Information MCU with CAN Controller Part Number Flash Memory CY96F673RBPMC-GS-UJE1 CY96F673RBPMC-GS-UJE2 Flash A (96.5KB) CY96F673RBPMC1-GS-UJE1 Flash A (160.5KB) *: For details about package, see "PACKAGE DIMENSION". CY96F675RBPMC1-GS-UJE2 Package* 64-pin plastic LQFP (LQG064) 64-pin plastic LQFP (LQD064) 64-pin plastic LQFP (LQD064) MCU without CAN Controller Part Number Flash Memory 64-pin plastic LQFP (LQG064) CY96F673ABPMC-GS-UJE2 CY96F673ABPMC1-GS-UJE1 CY96F673ABPMC1-GS-UJE2 Package* Flash A (96.5KB) 64-pin plastic LQFP (LQD064) CY96F673ABPMC1-GS-UKE1 *: For details about package, see "PACKAGE DIMENSION". Document Number: 002-04703 Rev. *D Page 57 of 64 CY96670 Series 17. Package Dimension Package Type Package Code LQFP 64 pin LQG064 D D1 48 4 5 7 33 33 32 49 48 32 49 17 64 E1 E 5 7 4 3 17 64 1 16 e 0.20 1 16 2 5 7 3 BOTTOM VIEW 0.10 C A-B D C A-B D b 0.13 C A-B D 8 TOP VIEW 2 A θ A A' 0.10 C SEATI N G PLA N E 0.2 5 L1 L 9 A1 10 c b SECTION A -A' SIDE VIEW SYM BOL DIM ENSION M IN. NOM . M AX. 1.70 A A1 0.00 b 0.27 0.20 c 0.09 0.32 0.37 0.20 D 14.00 BSC D1 12.00 BSC e 0.65 BSC E 14.00 BSC E1 12.00 BSC L 0.45 0.60 0.75 L1 0.30 0.50 0.70 θ 0° 8° 002-13881 ** PACKAGE OUTLINE, 64 LEAD LQFP 12.0X12.0X1.7 M M LQG064 REV** Document Number: 002-04703 Rev. *D Page 58 of 64 CY96670 Series Package Type Package Code LQFP 64 pin LQD064 4 D D1 48 5 7 33 33 32 49 48 32 49 17 64 5 7 E1 E 4 3 6 17 64 1 16 e 1 16 2 5 7 3 BOTTOM VIEW 0.1 0 C A-B D 0.2 0 C A-B D b 0.0 8 C A-B D 8 TOP VIEW A 2 9 A A' 0.0 8 C SEATING PLAN E L1 0.25 L A1 c b SECTION A-A' 10 SIDE VIEW SYM BOL DIM ENSIONS M IN. NOM . M AX. A 1. 70 A1 0.00 0.20 b 0.15 0.2 c 0.09 0.20 D 12.00 BSC. D1 10.00 BSC. e 0.50 BSC E 12.00 BSC. E1 10.00 BSC. L 0.45 0.60 0.75 L1 0.30 0.50 0.70 002-11499 ** PACKAGE OUTLINE, 64 LEAD LQFP 10.0X10.0X1.7 M M LQD064 Rev** Document Number: 002-04703 Rev. *D Page 59 of 64 CY96670 Series 18. Major Changes Spansion Publication Number: MB96670_DS704-00001 Page Section Change Results Revision 2.0 4 FEATURES Changed the description of “LCD Controller” On-chip drivers for internal divider resistors or external divider resistors → Internal divider resistors or external divider resistors Changed the description of “External Interrupts” Interrupt mask and pending bit per channel → Interrupt mask bit per channel 9 27 to 30 PIN DESCRIPTION Deleted Pin name WOT HANDLING PRECAUTIONS Added a section HANDLING DEVICES Changed the description in “11. SMC power supply pins” To avoid this, VCC must always be powered on before DVCC. → To avoid this, VCC must always be powered on before DVCC. DVcc/DVss must be applied when using SMC I/O pin as GPIO. ELECTRICAL CHARACTERISTICS 1. Absolute Maximum Ratings Changed the annotation *2 It is required that AVCC does not exceed VCC and that the voltage at the analog inputs does not exceed AVCC when the power is switched on. → It is required that AVCC does not exceed VCC, DVCC and that the voltage at the analog inputs does not exceed AVCC when the power is switched on. 3. DC Characteristics (1) Current Rating Changed the Conditions for ICCSRCH CLKS1/2 = CLKB = CLKP1/2 = CLKRC = 2MHz, → CLKS1/2 = CLKP1/2 = CLKRC = 2MHz, 33 35 Changed the Conditions for ICCSRCL CLKS1/2 = CLKB = CLKP1/2 = CLKRC = 100kHz → CLKS1/2 = CLKP1/2 = CLKRC = 100kHz 39 Changed the Conditions for ICCTPLL PLL Timer mode with CLKP1 = 32MHz → PLL Timer mode with CLKPLL = 32MHz Changed the Value of “Power supply current in Timer modes” ICCTPLL Typ: 2480μA → 1800μA (TA = +25°C) Max: 2710μA → 2245μA (TA = +25°C) Max: 3955μA → 3140μA (TA = +105°C) Changed the Conditions for ICCTRCL RC Timer mode with CLKRC = 100kHz, SMCR:LPMSS = 0 (CLKPLL, CLKMC and CLKSC stopped) → RC Timer mode with CLKRC = 100kHz (CLKPLL, CLKMC and CLKSC stopped) Document Number: 002-04703 Rev. *D Page 60 of 64 CY96670 Series Page Section ELECTRICAL CHARACTERISTICS 3. DC Characteristics (1) Current Rating 40 Change Results Changed the annotation *2 Power supply for "On Chip Debugger" part is not included. Power supply current in Run mode does not include Flash Write / Erase current. → The current for "On Chip Debugger" part is not included. Added the description to annotation *2, *3 When Flash is not in Power-down / reset mode, ICCFLASHPD must be added to the Power supply current. 52 4. AC Characteristics (10) I2C timing Added parameter, “Noise filter” and an annotation *5 for it Deleted the unit “[Min]” from approximation formula of Sampling time 54 5. A/D Converter (2) Accuracy and Setting of the A/D Converter Sampling Time 6. High Current Output Slew Rate Changed the condition (VCC = AVCC = DVCC = 2.7V to 5.5V, VD=1.8V±0.15V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) → (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = 40°C to + 105°C) 8. Flash Memory Write/Erase Characteristics Changed the condition (VCC = AVCC = DVCC = 2.7V to 5.5V, VD=1.8V±0.15V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) → (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = 40°C to + 105°C) 57 Added tSP to the figure Changed the Note While the Flash memory is written, shutdown of the external power (VCC) is prohibited. In the application system where the external power (VCC) might be shut down while writing, be sure to turn the power off by using an external voltage detector. → While the Flash memory is written or erased, shutdown of the external power (VCC) is prohibited. In the application system where the external power (VCC) might be shut down while writing or erasing, be sure to turn the power off by using a low voltage detection function. 60 Revision 2.1 - - Company name and layout design change NOTE: Please see “Document History” about later revised information. Page Section Change Results Rev. *B - Marketing Part Numbers changed from an MB prefix to a CY prefix. 6, 8, 62, 63, 64 1. Product Lineup 3. Pin Assignment 16. Ordering Information 17. Package Dimension Document Number: 002-04703 Rev. *D Package description modified to JEDEC description. FPT-64P-M23 → LQG064 FPT-64P-M24 → LQD064 Page 61 of 64 CY96670 Series Page 62 Section 16. Ordering Information Change Results Revised Marketing Part Numbers as follows: Before) MCU with CAN controller MB96F673RBPMC-GSE1 MB96F673RBPMC-GSE2 MB96F673RBPMC1-GSE1 MB96F673RBPMC1-GSE2 MB96F675RBPMC-GSE1 MB96F675RBPMC-GSE2 MB96F675RBPMC1-GSE1 MB96F675RBPMC1-GSE2 MCU without CAN controller MB96F673ABPMC-GSE1 MB96F673ABPMC-GSE2 MB96F673ABPMC1-GSE1 MB96F673ABPMC1-GSE2 MB96F675ABPMC-GSE1 MB96F675ABPMC-GSE2 MB96F675ABPMC1-GSE1 MB96F675ABPMC1-GSE2 After) MCU with CAN controller CY96F673RBPMC-GS-UJE1 CY96F673RBPMC-GS-UJE2 CY96F673RBPMC1-GS-UJE1 CY96F675RBPMC1-GS-UJE2 MCU without CAN controller CY96F673ABPMC-GS-UJE2 CY96F673ABPMC1-GS-UJE1 CY96F673ABPMC1-GS-UJE2 Rev. *C 57 16. Ordering Information Document Number: 002-04703 Rev. *D Added Marketing Part Number as follows: CY96F673ABPMC1-GS-UKE1 Page 62 of 64 CY96670 Series Document History Document Title: CY96670 Series, F2MC-16FX 16-Bit Microcontroller Document Number: 002-04703 Revision ECN Orig. of Change ** - TORS Submission Date Description of Change 01/31/2014 Migrated to Cypress and assigned document number 002-04703. No change to document contents or format. *A 5135634 TORS *B 6002978 MIYH 02/18/2016 Updated to Cypress template. 2 12/22/2017 Updated Document Title to read as “CY96670 Series, F MC-16FX 16-Bit Microcontroller”. Replaced MB96670 Series with CY96670 Series in all instances across the document. Changed the prefix of all MPNs from MB to CY in all instances across the document. Updated Ordering Information. For details, please see 18. Major Changes. *C 6349692 SHUS 10/15/2018 Updated Ordering Information. For details, please see 18. Major Changes. *D 6600222 TORS 06/20/2019 Updated to new template. Document Number: 002-04703 Rev. *D Page 63 of 64 CY96670 Series Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. 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Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 002-04703 Rev. *D Revised June 20, 2019 Page 64 of 64