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CYD02S36VA-167BBXC

CYD02S36VA-167BBXC

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    LBGA256

  • 描述:

    IC SRAM 2MBIT PARALLEL 256FBGA

  • 数据手册
  • 价格&库存
CYD02S36VA-167BBXC 数据手册
CYD02S36V/36VA FLEx36™ 3.3 V (64K × 36) Synchronous Dual-Port RAM FLEx36™ 3.3 V (64K × 36) Synchronous Dual-Port RAM Features Functional Description ■ True dual-ported memory cells that enable simultaneous access of the same memory location ■ Synchronous pipelined operation ■ Pipelined output mode allows fast operation ■ 0.18 micron complementary metal oxide semiconductor (CMOS) for optimum speed and power ■ High speed clock to data access ■ 3.3 V low power ❐ Active as low as 225 mA (typ.) ❐ Standby as low as 55 mA (typ.) ■ Mailbox function for message passing ■ Global master reset ■ Separate byte enables on both ports ■ Commercial and industrial temperature ranges ■ IEEE 1149.1-compatible joint test action group (JTAG) boundary scan ■ 256-ball fine-pitch ball grid array (FBGA) (1-mm pitch) ■ Counter wrap around control ❐ Internal mask register controls counter wrap-around ❐ Counter-interrupt flags to indicate wrap-around ❐ Memory block retransmit operation The FLEx36™ family includes 2-Mbit pipelined, synchronous, true dual-port static RAMs that are high speed, low power 3.3 V CMOS. Two ports are provided, permitting independent, simultaneous access to any location in memory. A particular port can write to a certain location while another port is reading that location. The result of writing to the same location by more than one port at the same time is undefined. Registers on control, address, and data lines allow for minimal setup and hold time. During a Read operation, data is registered for decreased cycle time. Each port contains a burst counter on the input address register. After externally loading the counter with the initial address, the counter increments the address internally (more details to follow). The internal Write pulse width is independent of the duration of the R/W input signal. The internal Write pulse is self-timed to allow the shortest possible cycle times. ■ Counter readback on address lines ■ Mask register readback on address lines ■ Dual chip enables on both ports for easy depth expansion ■ Seamless migration to next-generation dual-port family A HIGH on CE0 or LOW on CE1 for one clock cycle powers down the internal circuitry to reduce the static power consumption. One cycle with chip enables asserted is required to reactivate the outputs. Additional features include: readback of burst-counter internal address value on address lines, counter-mask registers to control the counter wrap-around, counter interrupt (CNTINT) flags, readback of mask register value on address lines, retransmit functionality, interrupt flags for message passing, JTAG for boundary scan, and asynchronous Master Reset (MRST). For a complete list of related documentation, click here. Seamless Migration to Next-Generation Dual-Port Family Cypress offers a migration path for all devices in this family to the next-generation devices in the Dual-Port family with a compatible footprint. Please contact Cypress Sales for more details. Product Selection Guide 2-Mbit (64K × 36) Density Part number CYD02S36V/36VA Max. speed (MHz) 167 Max. access time – clock to data (ns) 4.4 Typical operating current (mA) 225 Package Cypress Semiconductor Corporation Document Number: 38-06076 Rev. *N 256 FBGA (17 mm × 17 mm) • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised May 5, 2017 CYD02S36V/36VA Logic Block Diagram FTSELL FTSELR CONFIG Block CONFIG Block PORTSTD[1:0]R PORTSTD[1:0]L DQ [35:0]L BE [3:0]L CE0L CE1L OEL IO Control IO Control DQ [35:0]R BE [3:0]R CE0R CE1R OER R/WR R/WL Dual Ported Array BUSYL A [15:0]L CNT/MSKL ADSL CNTENL CNTRSTL RETL CNTINTL CL Arbitration Logic Address & Counter Logic BUSYR Address & Counter Logic WRPL WRPR JTAG TRST TMS TDI TDO TCK RESET LOGIC MRST READYR LowSPDR Mailboxes INTL INTR READYL LowSPDL Document Number: 38-06076 Rev. *N A [15:0]R CNT/MSKR ADSR CNTENR CNTRSTR RETR CNTINTR CR Page 2 of 33 CYD02S36V/36VA Contents Pin Configurations ........................................................... 4 Pin Definitions .................................................................. 5 Master Reset ..................................................................... 7 Mailbox Interrupts ............................................................ 7 Address Counter and Mask Register Operations .......... 8 Counter Reset Operation ............................................ 9 Counter Load Operation .............................................. 9 Counter Increment Operation ...................................... 9 Counter Hold Operation ............................................ 10 Counter Interrupt ....................................................... 10 Counter Readback Operation .................................... 10 Retransmit ................................................................. 10 Mask Reset Operation ............................................... 10 Mask Load Operation ................................................ 10 Mask Readback Operation ........................................ 10 Counting by Two ....................................................... 10 IEEE 1149.1 Serial Boundary Scan (JTAG)[19] ............. 12 Performing a TAP Reset ........................................... 12 Performing a Pause/Restart ...................................... 12 Identification Register Definitions ................................ 12 Scan Register Sizes ....................................................... 12 Maximum Ratings ........................................................... 13 Operating Range ............................................................. 13 Electrical Characteristics ............................................... 13 Document Number: 38-06076 Rev. *N Capacitance .................................................................... 14 AC Test Loads and Waveforms ..................................... 14 JTAG Timing ................................................................... 15 JTAG Switching Waveform ............................................ 15 Switching Characteristics .............................................. 16 Switching Waveforms .................................................... 18 Read/Write and Enable Operation ................................. 28 Ordering Information ...................................................... 29 2-Mbit (64K × 36) 3.3 V Synchronous CYD02S36V Dual-Port SRAM .................... 29 Ordering Code Definitions ......................................... 29 Package Diagram ............................................................ 30 Acronyms ........................................................................ 31 Document Conventions ................................................. 31 Units of Measure ....................................................... 31 Document History Page ................................................. 32 Sales, Solutions, and Legal Information ...................... 33 Worldwide Sales and Design Support ....................... 33 Products .................................................................... 33 PSoC® Solutions ...................................................... 33 Cypress Developer Community ................................. 33 Technical Support ..................................................... 33 Page 3 of 33 CYD02S36V/36VA Pin Configurations Figure 1. Pin Diagram - 256-ball FBGA (Top View) CYD02S36V/36VA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A DQ32L DQ30L DQ28L DQ26L DQ24L DQ22L DQ20L DQ18L DQ18R DQ20R DQ22R DQ24R DQ26R DQ28R DQ30R DQ32R B DQ33L DQ31L DQ29L DQ27L DQ25L DQ23L DQ21L DQ19L DQ19R DQ21R DQ23R DQ25R DQ27R DQ29R DQ31R DQ33R C DQ34L DQ35L RETL [1, 2] INTL NC [1, 3] NC [1, 3] REVL [1, 4] TRST [1, 3] MRST NC [1, 3] NC [1, 3] NC [1, 3] INTR RETR [1, 2] DQ35R DQ34R D A0L A1L WRPL [1, 2] VREFL [1, 4] FTSELL LOWSP [1, 2] DL [1, 4] VSS VTTL VTTL VREFL [1, 4] WRPR [1, 2] A1R A0R E A2L A3L CE0L CE1L VDDIOL VDDIOL VDDIOL VCORE VCORE VDDIO R F A4L A5L CNTINTL BE3L VDDIOL VSS VSS VSS VSS G A6L A7L BUSYL [1, 3] BE2L REVL [1, 2] VSS VSS VSS H A8L A9L CL VTTL VCORE VSS VSS J A10L A11L VSS PORTST D1L [1, 4] VCORE VSS K A12L A13L OEL BE1L VDDIOL L A14L A15L ADSL BE0L VDDIOL VDDIOL VDDIOL VDDIOL VCORE VCORE VDDIO R M NC [1, 3] NC [1, 3] R/WL REVL [1, 4] N NC [1, 3] NC [1, 3] CNT/ MSKL VREFL [1, 4] PortST D0L [1, 4] VSS LOWSP FTSEL DR [1, 4] R [1, 2] VDDIO R VDDIO R CE1R CE0R A3R A2R VSS VSS VDDIO R BE3R CNTINTR A5R A4R VSS VSS VSS VDDIO R BE2R BUSYR [1, 3] A7R A6R VSS VSS VSS VSS VCORE VTTL CR A9R A8R VSS VSS VSS VSS VSS VCORE PORTSTD 1R [1, 4] VSS A11R A10R VSS VSS VSS VSS VSS VSS VDDIO R BE1R OER A13R A12R VSS VSS VSS VSS VSS VSS VDDIO R BE0R ADSR A15R A14R VDDIO R VDDIO R REVR [1, 4] R/WR NC [1, 3] NC [1, 3] READY R [1, 3] PortST D0R [1, 4] VREFR [1, 4] CNT/ MSKR NC [1, 3] NC [1, 3] READY L [1, 3] REVL [1, 2] VTTL VTTL REVR [1, 2] CNTENL CNTRSTL NC [1, 3] NC [1, 3] TCK TMS TDO TDI P DQ16L DQ17L R DQ15L DQ13L DQ11L DQ9L DQ7L DQ5L DQ3L DQ1L DQ1R DQ3R DQ5R DQ7R DQ9R DQ11R DQ13R DQ15R T DQ14L DQ12L DQ10L DQ8L DQ6L DQ4L DQ2L DQ0L DQ0R DQ2R DQ4R DQ6R DQ8R DQ10R DQ12R DQ14R NC [1, 3] NC [1, 3] CNTRSTR CNTENR DQ17R DQ16R Notes 1. This ball represents a next generation Dual-Port feature. For more information about this feature, contact Cypress Sales. 2. Connect this ball to VDDIO. For more information about this next generation Dual-Port feature contact Cypress Sales. 3. Leave this ball unconnected. For more information about this feature, contact Cypress Sales. 4. Connect this ball to VSS. For more information about this next generation Dual-Port feature, contact Cypress Sales. Document Number: 38-06076 Rev. *N Page 4 of 33 CYD02S36V/36VA Pin Definitions Left Port Right Port A0L–A15L A0R–A15R Description BE0L–BE3L BE0R–BE3R Byte enable inputs. Asserting these signals enables Read and Write operations to the corresponding bytes of the memory array. BUSYL[5, 6] BUSYR[5, 6] Port busy output. When the collision is detected, a BUSY is asserted. CL CR CE0L CE0R Active low chip enable input Active high chip enable input Address inputs Input clock signal CE1L CE1R DQ0L–DQ35L DQ0R–DQ35R OEL OER Output enable input. This asynchronous signal must be asserted LOW to enable the DQ data pins during read operations. INTL INTR Mailbox interrupt flag output. The mailbox permits communications between ports. The upper two memory locations can be used for message passing. INTL is asserted LOW when the right port writes to the mailbox location of the left port, and vice versa. An interrupt to a port is deasserted HIGH when it reads the contents of its mailbox. LowSPDL[5, 8] PORTSTD[1:0]L LowSPDR[5, 8] [5, 8] Data bus input/output. Port low speed select input. PORTSTD[1:0]R[5, 8] Port address/control/data io standard select inputs. R/WL R/WR READYL[5, 6] READYR[5, 6] CNT/MSKL CNT/MSKR ADSL ADSR Read/write enable input. Assert this pin LOW to write to, or HIGH to Read from the dual port memory array. Port ready output. This signal is asserted when a port is ready for normal operation. Port counter/mask select input. Counter control input. Port counter address load strobe input. Counter control input. CNTENL CNTENR CNTRSTL CNTRSTR Port counter reset input. Counter control input. CNTINTL CNTINTR Port counter interrupt output. This pin is asserted LOW when the unmasked portion of the counter is incremented to all “1s”. WRPL[5, 7] WRPR[5, 7] Port counter wrap input. The burst counter wrap control input. RETR[5, 7] FTSELR[5, 7] Port counter retransmit input. Counter control input. VREFL[5, 8] VREFR[5, 8] Port external high-speed io reference input. VDDIOL VDDIOR RETL [5, 7] Port counter enable input. Counter control input. FTSELL REVL [5, 7] [5, 7, 8] REVR [5, 7, 8] MRST TRST[5, 6] Flow-through select. Use this pin to select Flow-Through mode. When is de-asserted, the device is in pipelined mode. Port I/O power supply. Reserved pins for future features. Master reset input. MRST is an asynchronous input signal and affects both ports. A maser reset operation is required at power up. JTAG reset input. Notes 5. This ball represents a next generation Dual-Port feature. For more information about this feature, contact Cypress Sales. 6. Leave this ball unconnected. For more information about this feature, contact Cypress Sales. 7. Connect this ball to VDDIO. For more information about this next generation Dual-Port feature contact Cypress Sales. 8. Connect this ball to VSS. For more information about this next generation Dual-Port feature, contact Cypress Sales. Document Number: 38-06076 Rev. *N Page 5 of 33 CYD02S36V/36VA Pin Definitions (continued) Left Port Right Port Description TMS JTAG test mode select input. It controls the advance of JTAG TAP state machine. State machine transitions occur on the rising edge of TCK. TDI JTAG test data input. Data on the TDI input is shifted serially into selected registers. TCK JTAG test clock input. TDO JTAG test data output. TDO transitions occur on the falling edge of TCK. TDO is normally three-stated except when captured data is shifted out of the JTAG TAP. VSS Ground inputs. VCORE[9] VTTL Core power supply. LVTTl power supply for JTAG IOs Note 9. This family of Dual-Ports does not use VCORE, and these pins are internally NC. The next generation Dual-Port family, the FLEx36-E™, uses VCORE of 1.5 V or 1.8V. Please contact local Cypress FAE for more information. Document Number: 38-06076 Rev. *N Page 6 of 33 CYD02S36V/36VA Master Reset The FLEx36 family devices undergo a complete reset by taking its MRST input LOW. The MRST input can switch asynchronously to the clocks. An MRST initializes the internal burst counters to zero, and the counter mask registers to all ones (completely unmasked). MRST also forces the Mailbox Interrupt (INT) flags and the Counter Interrupt (CNTINT) flags HIGH. MRST must be performed on the FLEx36 family devices after power up. Mailbox Interrupts The upper two memory locations may be used for message passing and permit communications between ports. Table 1 shows the interrupt operation for both ports of CYD02S36V/36VA. The highest memory location, FFFF is the mailbox for the right port and FFFE is the mailbox for the left port. Table 1 shows that to set the INTR flag, a Write operation by the left port to address FFFF asserts INTR LOW. At least one byte must be active for a Write to generate an interrupt. A valid Read of the FFFF location by the right port resets INTR HIGH. At least one byte must be active in order for a Read to reset the interrupt. When one port Writes to the other port’s mailbox, the INT of the port that the mailbox belongs to is asserted LOW. The INT is reset when the owner (port) of the mailbox Reads the contents of the mailbox. The interrupt flag is set in a flow-thru mode (i.e., it follows the clock edge of the writing port). Also, the flag is reset in a flow-thru mode (i.e., it follows the clock edge of the reading port). Each port can read the other port’s mailbox without resetting the interrupt. And each port can write to its own mailbox without setting the interrupt. If an application does not require message passing, INT pins must be left open. Table 1. Interrupt Operation Example [10, 11, 12, 13] Function Left Port Right Port R/WL CEL A0L–15L INTL R/WR CER A0R–15R INTR Set Right INTR Flag L L FFFF X X X X L Reset Right INTR Flag X X X X H L FFFF H Set Left INTL Flag X X X L L L FFFE X Reset Left INTL Flag H L FFFE H X X X X Notes 10. CE is internal signal. CE = LOW if CE0 = LOW and CE1 = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge. 11. OE is “Don’t Care” for mailbox operation. 12. At least one of BE0, BE1, BE2, or BE3 must be LOW. 13. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. Document Number: 38-06076 Rev. *N Page 7 of 33 CYD02S36V/36VA Address Counter and Mask Register Operations contains the value last loaded into the counter register, and is changed only by the Counter Load, and Counter Reset operations, and by the MRST. Each port of these devices has a programmable burst address counter. The burst counter contains three registers: a counter register, a mask register, and a mirror register. Table 2 summarizes the operation of these registers and the required input control signals. The MRST control signal is asynchronous. All the other control signals in Table 2 (CNT/MSK, CNTRST, ADS, CNTEN) are synchronized to the port’s CLK. All these counter and mask operations are independent of the port’s chip enable inputs (CE0 and CE1). The counter register contains the address used to access the RAM array. It is changed only by the Counter Load, Increment, Counter Reset, and by master reset (MRST) operations. The mask register value affects the Increment and Counter Reset operations by preventing the corresponding bits of the counter register from changing. It also affects the counter interrupt output (CNTINT). The mask register is changed only by the Mask Load and Mask Reset operations, and by the MRST. The mask register defines the counting range of the counter register. It divides the counter register into two regions: zero or more “0s” in the most significant bits define the masked region, one or more “1s” in the least significant bits define the unmasked region. Bit 0 may also be “0,” masking the least significant counter bit and causing the counter to increment by two instead of one. The mirror register is used to reload the counter register on increment operations (see “retransmit,” below). It always Counter enable (CNTEN) inputs are provided to stall the operation of the address input and use the internal address generated by the internal counter for fast, interleaved memory applications. A port’s burst counter is loaded when the port’s address strobe (ADS) and CNTEN signals are LOW. When the port’s CNTEN is asserted and the ADS is deasserted, the address counter increments on each LOW to HIGH transition of that port’s clock signal. This Read’s or Write’s one word from/into each successive address location until CNTEN is deasserted. The counter can address the entire memory array, and loops back to the start. Counter reset (CNTRST) is used to reset the unmasked portion of the burst counter to 0s. A counter-mask register is used to control the counter wrap. Table 2. Address Counter and Counter-Mask Register Control Operation (Any Port) [14, 15] CLK MRST CNT/MSK CNTRST ADS CNTEN Operation Description X L X X X X Masterreset Reset address counter to all 0s and mask register to all 1s. H H L X X Counter reset Reset counter unmasked portion to all 0s. H H H L L Counter load Load counter with external address value presented on address lines. H H H L H Counter readback Read out counter internal value on address lines. H H H H L Counter increment Internally increment address counter value. H H H H H Counter hold Constantly hold the address value for multiple clock cycles. H L L X X Mask reset Reset mask register to all 1s. H L H L L Mask load Load mask register with value presented on the address lines. H L H L H Mask readback Read out mask register value on address lines. H L H H X Reserved Operation undefined Notes 14. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. 15. Counter operation and mask register operation is independent of chip enables. Document Number: 38-06076 Rev. *N Page 8 of 33 CYD02S36V/36VA Counter Reset Operation All unmasked bits of the counter and mirror registers are reset to “0.” All masked bits remain unchanged. A Mask Reset followed by a Counter Reset resets the counter and mirror registers to 0000, as does master reset (MRST). Counter Load Operation The address counter and mirror registers are both loaded with the address value presented at the address lines. Counter Increment Operation Once the address counter register is initially loaded with an external address, the counter can internally increment the address value, potentially addressing the entire memory array. Only the unmasked bits of the counter register are incremented. The corresponding bit in the mask register must be a “1” for a counter bit to change. The counter register is incremented by 1 if the least significant bit is unmasked, and by 2 if it is masked. If all unmasked bits are “1,” the next increment wraps the counter back to the initially loaded value. If an Increment results in all the unmasked bits of the counter being “1s,” a counter interrupt flag (CNTINT) is asserted. The next Increment returns the counter register to its initial value, which was stored in the mirror register. The counter address can instead be forced to loop to 0000 by externally connecting CNTINT to CNTRST.[16] An increment that results in one or more of the unmasked bits of the counter being “0” de-asserts the counter interrupt flag. The example in Figure 2 shows the counter mask register loaded with a mask value of 003Fh unmasking the first 6 bits with bit “0” as the LSB and bit “16” as the MSB. The maximum value the mask register can be loaded with is FFFFh. Setting the mask register to this value allows the counter to access the entire memory space. The address counter is then loaded with an initial value of 8h. The base address bits (in this case, the 6th address through the 16th address) are loaded with an address value but do not increment once the counter is configured for increment operation. The counter address starts at address 8h. The counter increments its internal address value till it reaches the mask register value of 3Fh. The counter wraps around the memory block to location 8h at the next count. CNTINT is issued when the counter reaches its maximum value. Figure 2. Programmable Counter-Mask Register Operation [17] Example: Load Counter-Mask Register = 3F CNTINT H 0 0 0s 215 214 H X X Xs 215 214 Max Address Register L X X H X X 215 214 1 1 1 1 Unmasked Address X 0 0 1 0 0 Xs X 1 1 1 1 Mask Register bit-0 0 26 25 24 23 22 21 20 215 214 Max + 1 Address Register 1 26 25 24 23 22 21 20 Masked Address Load Address Counter = 8 0 1 1 1 Address Counter bit-0 26 25 24 23 22 21 20 Xs X 0 0 1 0 0 0 26 25 24 23 22 21 20 Notes 16. CNTINT and CNTRST specs are guaranteed by design to operate properly at speed grade operating frequency when tied together. 17. The “X” in this diagram represents the counter upper bits. Document Number: 38-06076 Rev. *N Page 9 of 33 CYD02S36V/36VA Counter Hold Operation The value of all three registers can be constantly maintained unchanged for an unlimited number of clock cycles. Such operation is useful in applications where wait states are needed, or when address is available a few cycles ahead of data in a shared bus interface. Counter Interrupt The counter interrupt (CNTINT) is asserted LOW when an increment operation results in the unmasked portion of the counter register being all “1s.” It is deasserted HIGH when an Increment operation results in any other value. It is also de-asserted by Counter Reset, Counter Load, Mask Reset and Mask Load operations, and by MRST. Counter Readback Operation The internal value of the counter register can be read out on the address lines. Readback is pipelined; the address is valid tCA2 after the next rising edge of the port’s clock. If address readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) are three-stated. Figure 3 on page 11 shows a block diagram of the operation. Retransmit Retransmit is a feature that allows the Read of a block of memory more than once without the need to reload the initial address. This eliminates the need for external logic to store and route data. It also reduces the complexity of the system design and saves board space. An internal “mirror register” is used to store the initially loaded address counter value. When the counter unmasked portion reaches its maximum value set by the mask register, it wraps back to the initial value stored in this “mirror register.” If the counter is continuously configured in increment mode, it increments again to its maximum value and wraps back Document Number: 38-06076 Rev. *N to the value initially stored into the “mirror register.” Thus, the repeated access of the same data is allowed without the need for any external logic. Mask Reset Operation The mask register is reset to all “1s,” which unmasks every bit of the counter. Master reset (MRST) also resets the mask register to all “1s.” Mask Load Operation The mask register is loaded with the address value presented at the address lines. Not all values permit correct increment operations. Permitted values are of the form 2n – 1 or 2n – 2. From the most significant bit to the least significant bit, permitted values have zero or more “0s,” one or more “1s,” or one “0.” Thus FFFF, 03FE, and 0001 are permitted values, but F0FF, 03FC, and 0000 are not. Mask Readback Operation The internal value of the mask register can be read out on the address lines. Readback is pipelined; the address is valid tCM2 after the next rising edge of the port’s clock. If mask readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) are three-stated. Figure 3 on page 11 shows a block diagram of the operation. Counting by Two When the least significant bit of the mask register is “0,” the counter increments by two. This may be used to connect the ×36 devices as a 72-bit single port SRAM in which the counter of one port counts even addresses and the counter of the other port counts odd addresses. This even-odd address scheme stores one half of the 72-bit data in even memory locations, and the other half in odd memory locations. Page 10 of 33 CYD02S36V/36VA Figure 3. Counter, Mask, and Mirror Logic Block Diagram CNT/MSK CNTEN Decode Logic ADS CNTRST MRST Bidirectional Address Lines Mask Register Counter/ Address Register Address RAM Decode Array CLK From Address Lines Load/Increment 16 Mirror 1 From Mask Register From Mask From Counter Increment Logic Wrap 16 16 16 16 Bit 0 +1 Wrap Detect 1 +2 Wrap 0 1 0 Document Number: 38-06076 Rev. *N To Readback and Address Decode 0 0 16 Counter 1 16 To Counter Page 11 of 33 CYD02S36V/36VA IEEE 1149.1 Serial Boundary Scan (JTAG)[18] The FLEx36 family devices incorporate an IEEE 1149.1 serial boundary scan test access port (TAP). The TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1-compliant TAPs. The TAP operates using JEDEC-standard 3.3V IO logic levels. It is composed of three input connections and one output connection required by the test logic defined by the standard. Performing a TAP Reset devices, and may be performed while the device is operating. An MRST must be performed on the devices after power up. Performing a Pause/Restart When a SHIFT-DR PAUSE-DR SHIFT-DR is performed the scan chain outputs the next bit in the chain twice. For example, if the value expected from the chain is 1010101, the device outputs a 11010101. This extra bit causes some testers to report an erroneous failure for the devices in a scan test. Therefore the tester must be configured to never enter the PAUSE-DR state. A reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This reset does not affect the operation of the Identification Register Definitions Instruction Field Value Revision number (31:28) 0h Cypress device ID (27:12) C001h Cypress JEDEC ID (11:1) 034h ID register presence (0) 1 Description Reserved for version number. Defines Cypress part number for CYD02S36V/36VA Allows unique identification of the DP family device vendor. Indicates the presence of an ID register. Scan Register Sizes Register Name Bit Size Instruction 4 Bypass 1 Identification 32 Boundary Scan n[19] Table 3. Instruction Identification Codes Instruction EXTEST Code Description 0000 Captures the input/output ring contents. Places the BSR between the TDI and TDO. BYPASS 1111 Places the BYR between TDI and TDO. IDCODE 1011 Loads the IDR with the vendor ID code and places the register between TDI and TDO. HIGHZ 0111 Places BYR between TDI and TDO. Forces all device output drivers to a High-Z state. CLAMP 0100 Controls boundary to 1/0. Places BYR between TDI and TDO. SAMPLE/PRELOAD 1000 Captures the input/output ring contents. Places BSR between TDI and TDO. NBSRST 1100 Resets the non-boundary scan logic. Places BYR between TDI and TDO. RESERVED All other codes Other combinations are reserved. Do not use other than the above. Notes 18. Boundary scan is IEEE 1149.1-compatible. See “Performing a Pause/Restart” for deviation from strict 1149.1 compliance. 19. See details in the device BSDL files. Document Number: 38-06076 Rev. *N Page 12 of 33 CYD02S36V/36VA DC Input Voltage ........................... –0.5 V to VDD + 0.5 V[21] Maximum Ratings Exceeding maximum ratings[20] may shorten the useful life of the device. User guidelines are not tested. Storage Temperature ............................... –65 °C to +150 °C Ambient Temperature with Power Applied .................................. –55 °C to +125 °C Output Current into Outputs (LOW) ............................ 20 mA Static Discharge Voltage (JEDEC JESD22-A114-2000B) .............................. > 2000 V Latch-up Current .................................................... > 200 mA Operating Range Supply Voltage to Ground Potential .............–0.5 V to +4.6 V DC Voltage Applied to Outputs in High-Z State ..................................... –0.5 V to VDD +0.5 V Range Ambient Temperature VDDIO/VTTL VCORE[22] Commercial 0 °C to +70 °C 3.3 V ± 165 mV 1.8 V ± 100 mV Electrical Characteristics Over the Operating Range Parameter Description -167 Min Typ Max Unit VOH Output HIGH voltage (VDD = Min, IOH= –4.0 mA) 2.4 – – V VOL Output LOW voltage (VDD = Min, IOL= +4.0 mA) – – 0.4 V VIH Input HIGH voltage 2.0 – – V VIL Input LOW voltage – – 0.8 V IOZ Output leakage current –10 – 10 A IIX1 Input leakage current except TDI, TMS, MRST –10 – 10 A IIX2 Input leakage current TDI, TMS, MRST –1.0 – 0.1 mA ICC Operating current for (VDD = Max., IOUT = 0 mA), outputs disabled – 225 300 mA ISB1 Standby current (both ports TTL level) – 90 115 mA – 160 210 mA – 55 75 mA – 160 210 mA – 0 0 mA CEL and CER  VIH, f = fMAX ISB2 Standby current (one port TTL level) CEL | CER  VIH, f = fMAX ISB3 Standby current (both ports CMOS level) CEL and CER  VDD – 0.2V, f = 0 ISB4 Standby current (one port CMOS level) CEL | CER  VIH, f = fMAX ICORE[22] Core operating current for (VDD = Max, IOUT = 0 mA), outputs disabled Notes 20. The voltage on any input or IO pin cannot exceed the power pin during power-up. 21. Pulse width < 20 ns. 22. This family of Dual-Ports does not use VCORE, and these pins are internally NC. The next generation Dual-Port family, the FLEx36-E™, uses VCORE of 1.5 V or 1.8 V. Please contact local Cypress FAE for more information. Document Number: 38-06076 Rev. *N Page 13 of 33 CYD02S36V/36VA Capacitance Part Number CYD02S36V/36VA Parameter [23] Description CIN Input capacitance COUT Output capacitance Test Conditions Max Unit TA = 25 °C, f = 1 MHz, VDD = 3.3 V 13 pF 10 pF AC Test Loads and Waveforms Figure 4. AC Test Loads and Waveforms Z0 = 50  3.3 V R = 50  R1 = 590  OUTPUT OUTPUT C = 10 pF C = 5 pF VTH = 1.5 V (a) Normal Load (Load 1) 3.0 V ALL INPUT PULSES (b) Three-state Delay (Load 2) 90% 10% Vss < 2 ns R2 = 435  90% 10% < 2 ns Note 23. COUT also references CIO. Document Number: 38-06076 Rev. *N Page 14 of 33 CYD02S36V/36VA JTAG Timing Parameter 167 Description Unit Min Max – 10 MHz fJTAG Maximum JTAG TAP controller frequency tTCYC TCK clock cycle time 100 – ns tTH TCK clock HIGH time 40 – ns tTL TCK clock LOW time 40 – ns tTMSS TMS setup to TCK clock rise 10 – ns tTMSH TMS hold After TCK clock rise 10 – ns tTDIS TDI setup to TCK clock rise 10 – ns tTDIH TDI hold after TCK clock rise 10 – ns tTDOV TCK clock LOW to TDO valid – 30 ns tTDOX TCK clock LOW to TDO invalid 0 – ns JTAG Switching Waveform Figure 5. JTAG Switching Waveform tTH tTL Test Clock TCK tTMSS tTCYC tTMSH Test Mode Select TMS tTDIS tTDIH Test Data-In TDI Test Data-Out TDO tTDOX Document Number: 38-06076 Rev. *N tTDOV Page 15 of 33 CYD02S36V/36VA Switching Characteristics Over the Operating Range -167 Parameter Description CYD02S36V/CYD02S36VA Unit Min Max – 167 MHz Clock cycle time 6.0 – ns tCH2 Clock HIGH time 2.7 – ns tCL2 Clock LOW time 2.7 – ns tR[24] Clock rise time – 2.0 ns tF[24] Clock fall time – 2.0 ns tSA Address setup time 2.3 – ns tHA Address hold time 0.6 – ns tSB Byte select setup time 2.3 – ns tHB Byte select hold time 0.6 – ns tSC Chip enable setup time 2.3 – ns tHC Chip enable hold time 0.6 – ns tSW R/W setup time 2.3 – ns tHW R/W hold time 0.6 – ns tSD Input data setup time 2.3 – ns tHD Input data hold time 0.6 – ns tSAD ADS setup time 2.3 – ns tHAD ADS hold time 0.6 – ns tSCN CNTEN setup time 2.3 – ns tHCN CNTEN hold time 0.6 – ns tSRST CNTRST setup time 2.3 – ns tHRST CNTRST hold time 0.6 – ns tSCM CNT/MSK setup time 2.3 – ns tHCM CNT/MSK hold time 0.6 – ns fMAX2 Maximum operating frequency tCYC2 Note 24. Except JTAG signals (tr and tf < 10 ns [max.]). Document Number: 38-06076 Rev. *N Page 16 of 33 CYD02S36V/36VA Switching Characteristics (continued) Over the Operating Range -167 Parameter Description CYD02S36V/CYD02S36VA Min Max Unit tOE Output enable to data valid – 4.4 ns tOLZ[25, 26] tOHZ[25, 26] OE to Low Z 0 – ns OE to High Z 0 4.0 ns tCD2 Clock to data valid – 4.4 ns tCA2 Clock to counter address valid – 4.0 ns tCM2 Clock to mask register readback valid – 4.0 ns tDC Data output hold after clock HIGH 1.0 – ns tCKHZ[25, 26] Clock HIGH to output high Z 0 4.0 ns tCKLZ[25, 26] Clock HIGH to output low Z 1.0 4.0 ns tSINT Clock to INT set time 0.5 6.7 ns tRINT Clock to INT reset time 0.5 6.7 ns tSCINT Clock to CNTINT set time 0.5 5.0 ns tRCINT Clock to CNTINT reset time 0.5 5.0 ns 5.2 – ns Port to Port Delays tCCS Clock to clock skew Master Reset Timing tRS Master reset pulse width 5.0 – cycle s tRS Master reset setup time 6.0 – ns tRSR Master reset recovery time 5.0 – cycle s tRSF Master reset to outputs inactive – 10.0 ns tRSINT Master reset to counter and mailbox interrupt flag reset time – 10.0 ns Notes 25. This parameter is guaranteed by design, but it is not production tested. 26. Test conditions used are Load 2. Document Number: 38-06076 Rev. *N Page 17 of 33 CYD02S36V/36VA Switching Waveforms Figure 6. Master Reset tRS MRST tRSF ALL ADDRESS/ DATA LINES tRSS ALL OTHER INPUTS TMS tRSR INACTIVE ACTIVE tRSINT CNTINT INT TDO Figure 7. Read Cycle [27, 28, 29, 30, 31] tCH2 tCYC2 tCL2 CLK CE tSC tHC tSB tHB tSW tSA tHW tHA tSC tHC BE0–BE3 R/W ADDRESS DATAOUT An An+1 1 Latency An+2 tDC tCD2 Qn tCKLZ An+3 Qn+1 tOHZ Qn+2 tOLZ OE tOE Notes 27. CE is internal signal. CE = LOW if CE0 = LOW and CE1 = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge. 28. OE is asynchronously controlled; all other inputs (excluding MRST and JTAG) are synchronous to the rising clock edge. 29. ADS = CNTEN = LOW, and MRST = CNTRST = CNT/MSK = HIGH. 30. The output is disabled (high-impedance state) by CE = VIH following the next rising edge of the clock. 31. Addresses do not have to be accessed sequentially since ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. Document Number: 38-06076 Rev. *N Page 18 of 33 CYD02S36V/36VA Switching Waveforms (continued) Figure 8. Bank Select Read [32, 33] tCH2 tCYC2 tCL2 CLK tHA tSA ADDRESS(B1) A0 A1 A3 A2 A4 A5 tHC tSC CE(B1) tCD2 tHC tSC tCD2 tHA tSA A0 ADDRESS(B2) tDC A1 tDC tSC tCKLZ A3 A2 tCKHZ Q3 Q1 Q0 DATAOUT(B1) tCD2 tCKHZ A4 A5 tHC CE(B2) tSC tHC tCD2 DATAOUT(B2) tCKHZ tCD2 Q4 Q2 tCKLZ tCKLZ Notes 32. In this depth-expansion example, B1 represents Bank #1 and B2 is Bank #2; each bank consists of one Cypress FLEx36 device from this data sheet. ADDRESS(B1) = ADDRESS(B2). 33. ADS = CNTEN= BE0 – BE3 = OE = LOW; MRST = CNTRST = CNT/MSK = HIGH. Document Number: 38-06076 Rev. *N Page 19 of 33 CYD02S36V/36VA Switching Waveforms (continued) Figure 9. Read-to-Write-to-Read (OE = LOW) [34, 35, 36, 37, 38] tCH2 tCYC2 tCL2 CLK CE tSC tHC tSW tHW R/W tSW tHW An ADDRESS tSA An+1 An+2 An+2 An+3 tSD tHD tHA DATAIN An+2 tCD2 tDC tCKHZ Dn+2 Qn DATAOUT READ NO OPERATION WRITE Notes 34. Addresses do not have to be accessed sequentially since ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. 35. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals. 36. During “No Operation,” data in memory at the selected address may be corrupted and must be rewritten to ensure data integrity. 37. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 38. CE0 = BE0 – BE3 = R/W = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, since OE = LOW, the Write operation cannot be completed (labelled as no operation). One clock cycle is required to three-state the IO for the Write operation on the next rising edge of CLK. Document Number: 38-06076 Rev. *N Page 20 of 33 CYD02S36V/36VA Switching Waveforms (continued) Figure 10. Read-to-Write-to-Read (OE Controlled) [39, 40, 41, 42] tCH2 tCYC2 tCL2 CLK CE tSC tHC tSW tHW R/W ADDRESS tSW tHW An tSA An+1 An+2 tHA An+3 An+4 An+5 tSD tHD Dn+2 DATAIN Dn+3 tCD2 DATAOUT tCD2 Qn Qn+4 tOHZ OE READ WRITE READ Figure 11. Read with Address Counter Advance [41] tCH2 tCYC2 tCL2 CLK tSA ADDRESS tHA An tSAD tHAD ADS tSAD tHAD tSCN tHCN CNTEN tSCN DATAOUT tHCN Qx–1 tCD2 Qx READ EXTERNAL ADDRESS tDC Qn READ WITH COUNTER Qn+1 COUNTER HOLD Qn+2 Qn+3 READ WITH COUNTER Notes 39. Addresses do not have to be accessed sequentially since ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. 40. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals. 41. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 42. CE0 = BE0 – BE3 = R/W = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, since OE = LOW, the Write operation cannot be completed (labelled as no operation). One clock cycle is required to three-state the IO for the Write operation on the next rising edge of CLK. Document Number: 38-06076 Rev. *N Page 21 of 33 CYD02S36V/36VA Switching Waveforms (continued) Figure 12. Write with Address Counter Advance [43] tCH2 tCYC2 tCL2 CLK tSA tHA An ADDRESS INTERNAL ADDRESS An tSAD tHAD tSCN tHCN An+1 An+2 An+3 An+4 ADS CNTEN Dn DATAIN tSD tHD WRITE EXTERNAL ADDRESS Dn+1 Dn+1 WRITE WITH COUNTER Dn+2 WRITE COUNTER HOLD Dn+3 Dn+4 WRITE WITH COUNTER Note 43. CE0 = BE0 – BE3 = LOW; CE1 = MRST = CNT/MSK = HIGH. Document Number: 38-06076 Rev. *N Page 22 of 33 CYD02S36V/36VA Switching Waveforms (continued) Figure 13. Counter Reset [44, 45] tCYC2 tCH2 tCL2 CLK tSA INTERNAL ADDRESS Ax tSW tHW tSD tHD An 1 0 Ap Am An ADDRESS tHA Ap Am R/W ADS CNTEN tSRST tHRST CNTRST DATAIN D0 tCD2 tCD2 [46] DATAOUT Q0 COUNTER RESET WRITE ADDRESS 0 tCKLZ READ ADDRESS 0 READ ADDRESS 1 Qn Q1 READ ADDRESS An READ ADDRESS Am Notes 44. CE0 = BE0 – BE3 = LOW; CE1 = MRST = CNT/MSK = HIGH. 45. No dead cycle exists during counter reset. A Read or Write cycle may be coincidental with the counter reset. 46. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value. Document Number: 38-06076 Rev. *N Page 23 of 33 CYD02S36V/36VA Switching Waveforms (continued) Figure 14. Readback State of Address Counter or Mask Register [47, 48, 49, 50] tCYC2 tCH2 tCL2 CLK tCA2 or tCM2 tSA tHA EXTERNAL ADDRESS A0–A16 An* An INTERNAL ADDRESS An+1 An An+2 An+3 An+4 tSAD tHAD ADS tSCN tHCN CNTEN tCD2 DATAOUT Qx-2 LOAD EXTERNAL ADDRESS tCKHZ Qx-1 Qn READBACK COUNTER INTERNAL ADDRESS INCREMENT tCKLZ Qn+1 Qn+2 Qn+3 Notes 47. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 48. Address in output mode. Host must not be driving address bus after tCKLZ in next clock cycle. 49. Address in input mode. Host can drive address bus after tCKHZ. 50. An * is the internal value of the address counter (or the mask register depending on the CNT/MSK level) being Read out on the address lines. Document Number: 38-06076 Rev. *N Page 24 of 33 CYD02S36V/36VA Switching Waveforms (continued) Figure 15. Left_Port (L_Port) Write to Right_Port (R_Port) Read [51, 52, 53] tCH2 tCYC2 tCL2 CLKL tHA tSA L_PORT ADDRESS An tSW tHW R/WL tCKHZ tSD L_PORT DATAIN CLKR tHD tCKLZ Dn tCYC2 tCL2 tCCS tCH2 R_PORT ADDRESS tSA tHA An R/WR tCD2 R_PORT Qn DATAOUT tDC Notes 51. CE0 = OE = ADS = CNTEN = BE0 – BE3 = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 52. This timing is valid when one port is writing, and other port is reading the same location at the same time. If tCCS is violated, indeterminate data is Read out. 53. If tCCS < minimum specified value, then R_Port Reads the most recent data (written by L_Port) only (2 * tCYC2 + tCD2) after the rising edge of R_Port's clock. If tCCS > minimum specified value, then R_Port Reads the most recent data (written by L_Port) (tCYC2 + tCD2) after the rising edge of R_Port's clock. Document Number: 38-06076 Rev. *N Page 25 of 33 CYD02S36V/36VA Switching Waveforms (continued) Figure 16. Counter Interrupt and Retransmit [54, 55, 56, 57, 58, 59] tCH2 tCYC2 tCL2 CLK tSCM tHCM CNT/MSK ADS CNTEN COUNTER INTERNAL ADDRESS FFFC FFFD FFFE tSCINT FFFF Last_Loaded Last_Loaded +1 tRCINT CNTINT Notes 54. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. 55. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value. 56. CE0 = OE = BE0 – BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 57. CNTINT is always driven. 58. CNTINT goes LOW when the unmasked portion of the address counter is incremented to the maximum value. 59. The mask register assumed to have the value of FFFFh. Document Number: 38-06076 Rev. *N Page 26 of 33 CYD02S36V/36VA Switching Waveforms (continued) Figure 17. MailBox Interrupt Timing [60, 61, 62, 63, 64] tCH2 tCYC2 tCL2 CLKL tSA L_PORT ADDRESS tHA FFFF An+1 An An+2 An+3 tSINT tRINT INTR tCH2 tCYC2 tCL2 CLKR tSA R_PORT ADDRESS Am tHA Am+1 FFFF Am+3 Am+4 Notes 60. CE0 = OE = ADS = CNTEN = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 61. Address “FFFF” is the mailbox location for R_Port of this device. 62. L_Port is configured for Write operation, and R_Port is configured for Read operation. 63. At least one byte enable (BE0–BE3) is required to be active during interrupt operations. 64. Interrupt flag is set with respect to the rising edge of the Write clock, and is reset with respect to the rising edge of the Read clock. Document Number: 38-06076 Rev. *N Page 27 of 33 CYD02S36V/36VA Read/Write and Enable Operation Table 4. Read/Write and Enable Operation (Any Port) [65, 66, 67, 68] Inputs OE Operation CE0 CE1 R/W DQ0–DQ35 X H X X High-Z Deselected X X L X High-Z Deselected X L H L DIN Write L L H H DOUT Read L H X High-Z Outputs disabled H CLK Outputs X Notes 65. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. 66. OE is an asynchronous input signal. 67. When CE changes state, deselection and Read happen after one cycle of latency. 68. CE0 = OE = LOW; CE1 = R/W = HIGH. Document Number: 38-06076 Rev. *N Page 28 of 33 CYD02S36V/36VA Ordering Information 2-Mbit (64K × 36) 3.3 V Synchronous CYD02S36V Dual-Port SRAM Speed (MHz) 167 Ordering Code CYD02S36VA-167BBC Package Name BB256 CYD02S36VA-167BBXC Package Type 256-ball BGA Operating Range Commercial 256-ball BGA Pb-free Ordering Code Definitions CY D 02 S 36 VA - 167 BB X C Temperature Range: C = Commercial X = Pb-free; blank = non Pb-free Package Type: BB = 256-ball BGA Speed Grade: 167 MHz VA = 3.3 V Width: 36 = × 36 S = Sync Density: 02 = 2 Mb Marketing Code: D = Dual-Port SRAM Company ID: CY = Cypress Document Number: 38-06076 Rev. *N Page 29 of 33 CYD02S36V/36VA Package Diagram Figure 18. 256-ball FBGA (17 × 17 × 1.7 mm) Package Outline, 51-85108 51-85108 *J Document Number: 38-06076 Rev. *N Page 30 of 33 CYD02S36V/36VA Acronyms Acronym Document Conventions Description Units of Measure BGA Ball Grid Array CMOS Complementary Metal Oxide Semiconductor °C degree Celsius FBGA Fine-Pitch Ball Grid Array MHz megahertz I/O Input/Output A microampere JTAG Joint Test Action Group mA milliampere SRAM Static Random Access Memory ns nanosecond  ohm pF picofarad V volt W watt Document Number: 38-06076 Rev. *N Symbol Unit of Measure Page 31 of 33 CYD02S36V/36VA Document History Page Document Title: CYD02S36V/36VA, FLEx36™ 3.3 V (64K × 36) Synchronous Dual-Port RAM Document Number: 38-06076 Rev. ECN No. Orig. of Change Submission Date ** 232012 WWZ See ECN New data sheet. *A 244232 WWZ See ECN Changed pinout Changed FTSEL# to FTSEL in the block diagram *B 313156 YDT See ECN Changed pinout D10 from NC to VSS to reflect test mode pin swap, C10 from rev[2,4] to VSS to reflect SC removal. Changed tRSCNTINT to tRSINT Added tRSINT to the master reset timing diagram Added CYD01S36V to data sheet Added ISB5 and changed IIX2 *C 321033 YDT See ECN Added CYD18S36V-133BBI to the Ordering Information Section *D 327338 AEQ See ECN Change Pinout C10 from VSS to NC[2,5] Change Pinout G5 from VDDIOL to REVL[2,3] *E 365315 YDT See ECN Added note for VCORE Removed preliminary status *F 2193427 NXR / AESA See ECN Changed tCD2 and tOE Spec from 4ns to 4.4ns for -167. Template Update. *G 2623658 VKN / PYRS 12/17/08 Added CYD02S36VA-15AXC part *H 2899734 VKN 03/26/2010 Modified title on page 1 Removed 1M, 4M, 9M, and 18M densities and their related information Modified Logic block diagram and pin configuration Removed Industrial operating grade Removed 133 ns and 100ns speed bins Removed “BB256B” (23 x 23 x 1.7mm) 256-Ball FBGA package Updated Ordering Information table Updated “BB256” (17 x 17 x 1.7mm) 256-Ball FBGA package diagram *I 3110296 ADMU 12/14/2010 Updated Ordering Information. Added Ordering Code Definitions. *J 3202287 ADMU 03/22/2011 Updated notes Added Acronyms and Units of Measure. Updated to new template. *K 3843734 SMCH 12/17/2012 Updated Ordering Information: Updated part numbers. Updated Package Diagram: spec 51-85108 – Changed revision from *H to *I. *L 4336717 ADMU 04/08/2014 Updated to new template. *M 4581625 ADMU 11/27/2014 Updated Functional Description: Added “For a complete list of related documentation, click here.” at the end. *N 5726610 VINI 05/05/2017 Updated Package Diagram: spec 51-85108 – Changed revision from *I to *J. Updated to new template. Completing Sunset Review. Document Number: 38-06076 Rev. *N Description of Change Page 32 of 33 CYD02S36V/36VA Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products ARM® Cortex® Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface Internet of Things Memory cypress.com/clocks cypress.com/interface cypress.com/iot cypress.com/memory Microcontrollers cypress.com/mcu PSoC cypress.com/psoc Power Management ICs Touch Sensing USB Controllers Wireless Connectivity PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Forums | WICED IOT Forums | Projects | Video | Blogs | Training | Components Technical Support cypress.com/support cypress.com/pmic cypress.com/touch cypress.com/usb cypress.com/wireless © Cypress Semiconductor Corporation, 2004–2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document, including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. 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Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 38-06076 Rev. *N FLEx36 and FLEx36-E are trademarks of Cypress Semiconductor Corporation. Revised May 05, 2017 Page 33 of 33
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