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CYT2B6 Datasheet
32-bit Arm® Cortex®-M4F Microcontroller
Traveo™ II Family
General Description
CYT2B6 is a family of Traveo™ II microcontrollers targeted at automotive systems such as body control units. CYT2B6 has an
Arm® Cortex®-M4 CPU for primary processing and an Arm Cortex-M0+ CPU for peripheral and security processing. These devices
contain embedded peripherals supporting Controller Area Network with Flexible Data rate (CAN FD), and Local Interconnect Network
(LIN). Traveo II devices are manufactured on an advanced 40-nm process. CYT2B6 incorporates Cypress' low-power flash memory,
multiple high-performance analog and digital peripherals, and enables the creation of a secure computing platform.
Features
■
■
■
■
Dual CPU Subsystem
❐ 80-MHz (max) 32-bit Arm Cortex-M4F CPU with
• Single-cycle multiply
• Single-precision floating point unit (FPU)
• Memory Protection Unit (MPU)
❐ 80-MHz (max) 32-bit Arm Cortex M0+ CPU with
• Single-cycle multiply
• Memory Protection Unit
❐ Inter-processor communication in hardware
❐ Three DMA controllers
• Peripheral DMA controller #0 (P-DMA0) with 54 channels
• Peripheral DMA controller #1 (P-DMA1) with 26 channels
• Memory DMA controller #0 (M-DMA0) with 2 channels
Integrated Memories
❐ 576 KB of code-flash with an additional 64 KB of work-flash
• Read-While-Write (RWW) allows updating the
code-flash/work-flash while executing from it
• Single- and dual-bank modes (specifically for Firmware
update Over The Air [FOTA])
• Flash programming through SWD/JTAG interface
❐ 64 KB of SRAM with selectable retention granularity
Crypto Engine[1]
❐ Supports Enhanced Secure Hardware Extension (eSHE)
and Hardware Security Module (HSM)
❐ Secure boot and authentication
• Using digital signature verification
• Using fast secure boot
❐ AES: 128-bit blocks, 128-/192-/256-bit keys
[2]
❐ 3DES : 64-bit blocks, 64-bit key
[2]
❐ Vector unit supporting asymmetric key cryptography such
as Rivest-Shamir-Adleman (RSA) and Elliptic Curve (ECC)
[2]
❐ SHA-1/2/3 : SHA-512, SHA-256, SHA-160 with variable
length input data
[2]
❐ CRC : supports CCITT CRC16 and IEEE-802.3 CRC32
❐ True random number generator (TRNG) and pseudo random
number generator (PRNG)
❐ Galois/Counter Mode (GCM)
Watchdog timer (WDT)
Multi-counter watchdog timer (MCWDT)
❐ Low-voltage detector (LVD)
❐ Brown-out detector (BOD)
❐ Overvoltage detection (OVD)
❐ Clock supervisor (CSV)
❐ Hardware error correction (SECDED ECC) on all
safety-critical memories (SRAM, flash)
❐
❐
■
Low-Power 2.7-V to 5.5-V Operation
❐ Low-power Active, Sleep, Low-power Sleep, DeepSleep,
and Hibernate modes for fine-grained power management
❐ Configurable options for robust BOD
• Two threshold levels (2.7 V and 3.0 V) for BOD on VDDD
and VDDA
• One threshold level (1.1 V) for BOD on VCCD
■
Wakeup Support
❐ A GPIO pin to wakeup from Hibernate mode
❐ Up to 78 GPIO pins to wakeup from Sleep modes
❐ Event Generator, SCB, Watchdog Timer, RTC alarms to
wake from DeepSleep modes
■
Clock Sources
❐ Internal main oscillator (IMO)
❐ Internal low-speed oscillator (ILO)
❐ External crystal oscillator (ECO)
❐ Watch crystal oscillator (WCO)
❐ Phase-locked loop (PLL)
❐ Frequency-locked loop (FLL)
■
Communication Interfaces
❐ Up to four CAN FD channels
• Increased data rate (up to 8 Mbps) compared to classic
CAN, limited by physical layer topology and transceivers
• Compliant to ISO 11898-1:2015
• Supports all the requirements of Bosch CAN FD
Specification V1.0 for non-ISO CAN FD
• ISO 16845:2015 certificate available
❐ Up to six runtime-reconfigurable SCB (serial communication
block) channels, each configurable as I2C, SPI, or UART
❐ Up to five independent LIN channels
• LIN protocol compliant with ISO 17987
Functional Safety for ASIL-B
❐ Memory protection unit (MPU)
❐ Shared memory protection unit (SMPU)
❐ Peripheral protection unit (PPU)
Notes
1. The Crypto engine features are available on select MPNs.
2. This feature is not available in “eSHE only” parts; for more information, refer to Ordering Information.
Cypress Semiconductor Corporation
Document Number: 002-25756 Rev. *B
•
198 Champion Court
•
San Jose, CA 95134-1709
• 408-943-2600
Revised July 8, 2021
CYT2B6 Datasheet
■
■
Timers
❐ Up to 50 16-bit and two 32-bit Timer/Counter Pulse-Width
Modulator (TCPWM) blocks
• Up to four 16-bit counters for motor control
• Up to 46 16-bit counters and two 32-bit counters for regular
operations
• Supports timer, capture, quadrature decoding, pulse-width
modulation (PWM), PWM with dead time (PWM_DT),
pseudo-random PWM (PWM_PR), and shift-register (SR)
modes
❐ Up to 11 Event Generation (EVTGEN) timers supporting
cyclic wakeup from DeepSleep
• Events trigger a specific device operation (such as
execution of an interrupt handler, a SAR ADC conversion,
and so on)
Real Time Clock (RTC)
❐ Year/Month/Date, Day-of-week, Hour:Minute:Second fields
❐ 12- and 24-hour formats
❐ Automatic leap-year correction
■
I/O
❐ Up to 78 programmable I/Os
❐ Two I/O types
• GPIO Standard (GPIO_STD)
• GPIO Enhanced (GPIO_ENH)
■
Regulators
❐ Generates 1.1-V nominal core supply from a 2.7-V to 5.5-V
input supply
❐ Two types of regulators
• DeepSleep
• Core internal
■
Each ADC supports 12-bit resolution and sampling rates of
up to 1 Msps
❐ Each ADC also supports up to six internal analog inputs like
• Bandgap reference to establish absolute voltage levels
• Calibrated diode for junction temperature calculations
• Two AMUXBUS inputs and two direct connections to
monitor supply levels
❐ Each ADC supports addressing of external multiplexers
❐ Each ADC has a sequencer supporting autonomous
scanning of configured channels
❐ Synchronized sampling of all ADCs for motor-sense
applications
❐
■
Smart I/O™
❐ Up to three Smart I/O blocks, which can perform Boolean
operations on signals going to and from I/Os
❐ Up to 16 I/Os (GPIO_STD) supported
■
Debug interface
❐ JTAG controller and interface compliant to
IEEE-1149.1-2001
❐ Arm SWD (Serial Wire Debug) port
❐ Supports Arm Embedded Trace Macrocell (ETM) Trace
• Data trace using SWD
• Instruction and data trace using JTAG
■
Compatible with industry-standard tools
❐ GHS/MULTI or IAR EWARM for code development and
debugging
■
Packages
❐ 64-LQFP, 10 × 10 × 1.7 mm (max), 0.5-mm lead pitch
❐ 80-LQFP, 12 × 12 × 1.7 mm (max). 0.5-mm lead pitch
❐ 100-LQFP, 14 × 14 × 1.7 mm (max), 0.5-mm lead pitch
Programmable Analog
❐ Three SAR A/D converters with up to 35 external channels
(32 I/Os + 3 I/Os for motor control)
• ADC0 supports 11 logical channels, with 11 + 1 physical
connections
• ADC1 supports 13 logical channels, with 13 + 1 physical
connections
• ADC2 supports 8 logical channels, with 8 + 1 physical
connections
• Any external channel can be connected to any logical
channel in the respective SAR
Document Number: 002-25756 Rev. *B
Page 2 of 139
CYT2B6 Datasheet
Contents
Features List ..................................................................... 4
Communication Peripheral Instance List..................... 5
Blocks and Functionality ................................................. 6
Functional Description..................................................... 7
CPU Subsystem .......................................................... 7
System Resources ...................................................... 7
Peripherals .................................................................. 9
I/Os............................................................................ 11
CYT2B6 Address Map .................................................... 12
Flash Base Address Map ............................................... 13
Peripheral I/O Map .......................................................... 14
CYT2B6 Clock Diagram.................................................. 16
CYT2B6 CPU Start-up Sequence .................................. 17
Pin Assignment .............................................................. 18
High-Speed I/O Matrix Connections ............................. 24
Electrical Specifications ................................................ 72
Absolute Maximum Ratings....................................... 72
Device-Level Specifications ...................................... 74
DC Specifications ...................................................... 75
Reset Specifications.................................................. 79
I/O.............................................................................. 80
Analog Peripherals .................................................... 86
AC Specifications ...................................................... 90
Digital Peripherals ..................................................... 91
Memory ................................................................... 101
System Resources .................................................. 102
Debug...................................................................... 111
Clock Specifications ................................................ 113
Ordering Information.................................................... 119
Part Number Nomenclature..................................... 119
Packaging...................................................................... 121
Power Pin Assignments................................................. 28
Appendix ....................................................................... 125
Bootloading or End-of-line Programming ................ 125
External IP Revisions .............................................. 126
Alternate Function Pin Assignments............................ 29
Acronyms ...................................................................... 127
Interrupts and Wake-up Assignments.......................... 34
Errata .............................................................................
Document History Page ...............................................
Revision History Change Log..................................
Sales, Solutions, and Legal Information ....................
Worldwide Sales and Design Support.....................
Products ..................................................................
PSoC® Solutions ....................................................
Cypress Developer Community...............................
Technical Support ...................................................
Package Pin List and Alternate Functions................... 25
Core Interrupt Types ...................................................... 40
Trigger Multiplexer ......................................................... 41
Triggers Group Inputs.................................................... 42
Triggers Group Outputs................................................. 51
Triggers One-to-One ...................................................... 52
Peripheral Clocks ........................................................... 56
129
134
135
139
139
139
139
139
139
Faults ............................................................................... 58
Peripheral Protection Unit Fixed Structure Pairs ........ 61
Bus Masters .................................................................... 69
Miscellaneous Configuration ........................................ 70
Development Support .................................................... 71
Documentation .......................................................... 71
Tools.......................................................................... 71
Document Number: 002-25756 Rev. *B
Page 3 of 139
CYT2B6 Datasheet
1. Features List
Table 1-1. CYT2B6 Feature List for All Packages
Features
CPU
Core
Functional safety
Operating voltage
Core voltage
Operating frequency
MPU, PPU
FPU
DSP-MUL/DIV/MAC
Memory
Code-flash
Work-flash
SRAM (configurable for retention)
ROM
Communication Interfaces
CAN 0 (CAN FD: Up to 8 Mbps)
CAN 1 (CAN FD: Up to 8 Mbps)
CAN RAM
Serial communication block (SCB/UART)
Serial communication block (SCB/I2C)
Serial communication block (SCB/SPI)
LIN0
Timers
RTC
TCPWM (16-bit) (Motor Control)
TCPWM (16-bit)
TCPWM (32-bit)
External Interrupts
Analog
12-bit, 1 Msps SAR ADC
Motor Control Input
Security
Flash Security (program/work read protection)
Flash Chip erase enable
eSHE
Packages
64-LQFP
80-LQFP
100-LQFP
32-bit Arm Cortex-M4F CPU and 32-bit Arm Cortex M0+ CPU
ASIL-B
2.7 V to 5.5 V
1.05 V to 1.15 V
Arm Cortex-M4 80 MHz (max) and Arm Cortex-M0+ 80 MHz (max), related
by integer frequency ratio (that is, 1:1, 1:2, 1:3, and so on)
Supported
Single precision (32-bit)
Supported by Arm Cortex-M4F CPU
576 KB (448 KB + 128 KB)
64 KB (48 KB + 16 KB)
64 KB
32 KB
2 ch
1 ch
5 ch
3 ch
49
2 ch
24 KB per instance (2 ch), 48 KB in total
6 ch
6 ch
6 ch
5 ch
1 ch
4 ch
46 ch
2 ch
63
78
3 Units (SAR0/11, SAR1/13, SAR2/8 logical channels)
22 external channels
28 external channels
32 external channels
(SAR0 8 ch, SAR1 7 ch,
(SAR0 10 ch,
(SAR0 11 ch, SAR1 13 ch,
SAR2 7 ch)
SAR1 10 ch, SAR2 8 ch)
SAR2 8 ch)
18 ch (6 per ADC) Internal sampling
3 ch (synchronous sampling of one channel on each of the 3 ADCs)
Supported
Configurable
By separate firmware[3]
Note
3. Enhanced Secure Hardware Extension (eSHE) is enabled by third-party firmware.
Document Number: 002-25756 Rev. *B
Page 4 of 139
CYT2B6 Datasheet
Table 1-1. CYT2B6 Feature List for All Packages (continued)
Features
Packages
80-LQFP
64-LQFP
100-LQFP
System
P-DMA0 with 54 channels (16 general purpose), P-DMA1 with 26 channels
(8 general purpose), and M-DMA0 with 2 channels
8 MHz
32.768 kHz (nominal)
Input frequency: 3.988 to 33.34 MHz, PLL output frequency: up to 80 MHz
Input frequency: 0.25 to 80 MHz, FLL output frequency: up to 80 MHz
Supported
Supported
Supported
45
59
74
4
3 blocks,
3 blocks,
3 blocks,
9 I/Os
14 I/Os
16 I/Os
Two, 26 selectable levels
105 °C for S-grade and 125 °C for E-grade
SWD/JTAG
Arm Cortex-M4 ETB size of 8 KB, Arm Cortex M0+ MTB size of 4 KB
DMA Controller
Internal main oscillator
Internal low-speed oscillator
PLL
FLL
Watchdog timer and multi-counter watchdog timer
Clock supervisor
Cyclic wakeup from DeepSleep
GPIO_STD
GPIO_ENH
Smart I/O (Blocks)
Low-voltage detect
Maximum ambient temperature
Debug interface
Debug trace
1.1 Communication Peripheral Instance List
The following table lists the instances supported under each package for communication peripherals, based on the minimum pins
needed for the functionality.
Table 1-2. Peripheral Instance List
Module
64-LQFP
80-LQFP
100-LQFP
Minimum Pin Functions
CAN0
0/1
0/1
0/1
TX, RX
CAN1
0
0/1
0/1
TX, RX
LIN0
0/1/2/3/4
0/1/2/3/4
0/1/2/3/4
TX, RX
SCB/UART
0/1/3/4/5/7
0/1/3/4/5/7
0/1/3/4/5/7
TX, RX
SCB/I2C
0/3/4/5/7
0/1/3/4/5/7
0/1/3/4/5/7
SCL, SDA
SCB/SPI
0/3/4
0/1/3/4/5/7
0/1/3/4/5/7
MISO, MOSI, SCK, SELECT0
Document Number: 002-25756 Rev. *B
Page 5 of 139
CYT2B6 Datasheet
2. Blocks and Functionality
Figure 2-1.Block Diagram
CPU Subsystem
CYT2B6
SWJ/ETM/ITM/CTI
SWJ/MTB/CTI
CRYPTO
M-DMA0
2 Channel
8 KB $
8 KB $
Flash Controller
26 Channel
FPU, NVIC, MPU
Power
Sleep Control
POR
BOD
OVD
LVD
REF
64 KB
P-DMA1
System Resources
80 MHz
SRAM0
54 Channel
Arm Cortex-M4
eCT Flash
576 KB Code Flash +
64 KB Work Flash
P-DMA0
MXS40-HT
ASIL-B
SRAM Controller
ROM
Arm
Cortex-M0+
AES, SHA, CRC,
TRNG, RSA,
ECC
32 KB
80 MHz
Initiator/MMIO
ROM Controller
MUL, NVIC, MPU
System Interconnect (Multi Layer AHB, IPC, MPU/SMPU)
PWRSYS-HT
LDO
1024 bit
eFuse
EVTGEN
Event Generator
CAN-FD Interface
Up to 4x CANFD
I2C, SPI, UART
Up to 5x SCB
SARMUX
32 ch
Power Modes
Active/Sleep
LowePowerActive/Sleep
High Speed I/O Matrix, Smart I/O, Boundary Scan
DeepSleep
Up to 74x GPIO_STD, 4x GPIO_ENH
Hibernate
1x SCB
I2C, SPI, UART
LIN/UART
x3
Up to 5x LIN
SAR
ADC
(12-bit)
52x TCPWM
TIMER,CTR,QD, PWM
WCO
RTC
Prog.
Analog
IOSS GPIO
Reset
Reset Control
XRES
Test
TestMode Entry
Digital DFT
Analog DFT
Peripheral Interconnect (MMIO, PPU)
PCLK
Clock
Clock Control
2xILO
WDT
IMO
ECO
FLL
CSV
1xPLL
3x Smart I/O
I/O Subsystem
Figure 2-1. shows the CYT2B6 architecture block diagram,
giving a simplified view of the interconnection between
subsystems and blocks. CYT2B6 has four major subsystems:
CPU, system resources, peripherals, and I/O[4, 5]. The
color-coding shows the lowest power mode where the particular
block is still functional.
The JTAG interface is fully compatible with industry-standard
third-party probes such as I-jet, J-Link, and GHS.
CYT2B6 provides extensive support for programming, testing,
debugging, and tracing of both hardware and firmware.
Additionally, each device interface can be permanently disabled
for applications concerned with phishing attacks from a
maliciously reprogrammed device or attempts to defeat security
by starting and interrupting flash programming sequences. All
programming, debug, and test interfaces are disabled when
maximum device security is enabled.
Debug-on-chip functionality enables in-system debugging using
the production device. It does not require special interfaces,
debugging pods, simulators, or emulators.
The debug circuits are enabled by default.
CYT2B6 provides a high level of security with robust flash
protection and the ability to disable features such as debug.
Notes
4. GPIO_STD supporting 2.7 V to 5.5 V VDDIO range.
5. GPIO_ENH supporting 2.7 V to 5.5 V VDDIO range with higher currents at lower voltages.
Document Number: 002-25756 Rev. *B
Page 6 of 139
CYT2B6 Datasheet
3. Functional Description
3.1 CPU Subsystem
3.1.1 CPU
The CYT2B6 CPU subsystem contains a 32-bit Arm Cortex-M0+
CPU with MPU and a 32-bit Arm Cortex-M4F CPU with MPU,
and single-precision FPU. This subsystem also includes
P-/M-DMA controllers, a cryptographic accelerator, 576 KB of
code-flash, 64 KB of work-flash, 64 KB of SRAM, and 32 KB of
ROM.
The Cortex-M0+ CPU provides a secure, un-interruptible boot
function. This guarantees that, following completion of the boot
function, system integrity is valid and privileges are enforced.
Shared resources (flash, SRAM, peripherals, and so on) can be
accessed through bus arbitration, and exclusive accesses are
supported by an inter-processor communication (IPC)
mechanism using hardware semaphores.
3.1.2 DMA Controllers
CYT2B6 has three DMA controllers: P-DMA0 with 16
general-purpose and 38 dedicated channels, P-DMA1 with 8
general-purpose and 18 dedicated channels, and M-DMA0 with
two channels. P-DMA is used for peripheral-to-memory and
memory-to-peripheral data transfers and provides low latency for
a large number of channels. Each P-DMA controller uses a
single data-transfer engine that is shared by the associated
channels. General-purpose channels have a rich interconnect
matrix including P-DMA cross triggering, which enables
demanding data-transfer scenarios. Dedicated channels have a
single triggering input (such as an ADC channel) to handle
common transfer needs. M-DMA is used for memory-to-memory
data transfers and provides high memory bandwidth for a small
number of channels. M-DMA uses a dedicated data-transfer
engine for each channel. They support independent accesses to
peripherals using the AHB multi-layer bus.
3.1.3 Flash
CYT2B6 has 576 KB (448 KB with a 32-KB sector size, and
128 KB with an 8-KB sector size) of code-flash with an additional
work-flash of up to 64 KB (48 KB with 2-KB sector size, and
16 KB with 128-B sectors size). Work-flash is optimized for
reprogramming many more times than code-flash. Code-flash
supports Read-While-Write (RWW) operation allowing flash to
be updated while the CPU is active. Both the code-flash and
work-flash areas support dual-bank operation for over-the-air
(OTA) programming.
3.1.4 SRAM
CYT2B6 has 64 KB of SRAM. The SRAM0 controller provides
DeepSleep retention in 32-KB increments.
3.1.5 ROM
CYT2B6 has 32-KB ROM that contains boot and configuration
routines. This ROM enables secure boot and authentication of
user flash to guarantee a secure system.
Document Number: 002-25756 Rev. *B
3.1.6 Cryptography Accelerator for Security
The cryptography accelerator implements (3)DES block cipher,
AES block cipher, SHA hash, cyclic redundancy check, pseudo
random number generation, true random number generation,
galois/counter mode, and a vector unit to support asymmetric
key cryptography such as RSA and ECC.
Depending on the part number, this block is either completely or
partially available or not available at all. See Ordering
Information for more details.
3.2 System Resources
3.2.1 Power System
The power system ensures that the supply voltage levels meet
the requirements of each power mode, and provides a
full-system reset when these levels are not valid. Internal
power-on reset (POR) guarantees full-chip reset during the initial
power ramp.
Three Brown-Out Detection (BOD) circuits monitor the external
supply voltages (VDDD, VDDA, VCCD). The BOD on VDDD and
VCCD are initially enabled and cannot be disabled. The BOD on
VDDA is initially disabled and can be enabled by the user. For the
external supplies VDDD and VDDA, BOD circuits are software
configurable with two settings; a 2.7-V minimum voltage that is
robust for all internal signaling and a 3.0-V minimum voltage,
which is also robust for all I/O specifications (which are
guaranteed at 2.7 V). The BOD on VCCD is provided as a safety
measure and is not a robust detector.
Three overvoltage detection (OVD) circuits are provided for
monitoring external supplies (VDDD, VDDA, VCCD), and
overcurrent detection circuits (OCD) for monitoring internal and
external regulators. OVD thresholds on VDDD and VDDA are
configurable with two settings; a 5.0-V and 5.5-V maximum
voltage. Two voltage-detection circuits are provided to monitor
the external supply voltage (VDDD) for falling and rising levels,
each configurable for one of the 26 selectable levels.
All BOD, OVD, and OCD circuits on VDDD and VCCD generate a
reset, because these protect the CPUs and fault logic. The BOD
and OVD circuits on VDDA can be configured to generate either
a reset or a fault.
3.2.2 Regulators
CYT2B6 contains two regulators that provide power to the
low-voltage core transistors: DeepSleep and core internal.
These regulators accept a 2.7–5.5-V VDDD supply and provide a
low-noise 1.1-V supply to various parts of the device. These
regulators are automatically enabled and disabled by hardware
and firmware when switching between power modes. The core
internal and core external regulators operate in active mode, and
provide power to the CPU subsystem and associated
peripherals.
DeepSleep
The DeepSleep regulator is used to maintain power to a small
number of blocks when in DeepSleep mode. These blocks
include the ILO and WDT timers, BOD detector, SCB0, SRAM
memories, Smart I/O, and other configuration memories. The
DeepSleep regulator is enabled when in DeepSleep mode,
and the core internal regulator is disabled. It is disabled when
XRES_L is asserted (LOW) and when the core internal
regulator is disabled.
Page 7 of 139
CYT2B6 Datasheet
Core internal
The core internal regulator supports load currents up to
150 mA, and is operational during device start-up (boot
process) and in Active/Sleep modes.
counter determine the frequency of the reference clock as well
as the upper and lower frequency limits of the monitored clock.
If the frequency range comparator detects a stopped clock or a
clock outside the specified frequency range, an abnormal state
is signaled and either a reset or an interrupt is generated.
3.2.3 Clock System
EXT_CLK
The CYT2B6 clock system provides clocks to all subsystems that
require them, and glitch-free switching between different clock
sources. In addition, the clock system ensures that no
metastable conditions occur.
One of the two GPIO_STD I/Os can be used to provide an
external clock input of up to 80 MHz. This clock can be used as
the source clock for either the PLL or FLL, or can be used directly
by the CLK_HF domain.
The clock system for CYT2B6 consists of the 8-MHz IMO, two
ILOs, three watchdog timers, a PLL, an FLL, five clock
supervisors (CSV), a 3.988- to 33.34 MHz ECO, and a
32.768-kHz WCO.
ECO
The clock system supports two main clock domains: CLK_HF
and CLK_LF.
■
CLK_HFx are the Active mode clocks. Each can use any of the
high-frequency clock sources including IMO, EXT_CLK, ECO,
FLL, or PLL
■
CLK_LF is a DeepSleep domain clock and provides a reference
clock for the MCWDT or RTC modules. The reference clock for
the CLK_LF domain is either disabled or selectable from ILO0,
ILO1, or WCO
Table 3-1. CLK_HF Destinations
Name
Description
CLK_HF0
CPUSS clocks, PERI, and AHB infrastructure
CLK_HF1
Event Generator, also available in HSIOM as an output
IMO Clock Source
The IMO is the frequency reference in CYT2B6 when no external
reference is available or enabled. The IMO operates at a
frequency of 8 MHz ±1%. The internal trim settings for the IMO
can be dynamically updated to provide a tolerance = 4 and multiply of 4,
Excludes system overhead time
SID598
Over current detection
Details/Conditions
range in Active/Sleep mode
(None)
Guaranteed by Design
Added condition
SID599
Over current detection
Details/Conditions
range in DeepSleep mode
(None)
Guaranteed by Design
Added condition
SID332
Feedback resistor value for Details/Conditions
ECO
(None)
Guaranteed by Design
Added condition
Added spec
Added spec
SID349C
PFD frequency
Min
4 MHz
3.988 MHz
Updated spec
SID350A
FLL wake up time
SID
Parameter
Max
SID350
tFLL_WAKE
Max: TBD
SID350A
tFLL_WAKE_A
Max: 3.5 us
Updated spec
SID412
Minimum WDT timeout
Details/Conditions
When using the ILO (32.768 kHz + 5%) When using the ILO (32.768 kHz +
5%) and 32-bit WDT counter.
and 16-bit WDT counter.
Guaranteed by Design.
Guaranteed by Design.
Updated condition
SID413
Maximum WDT timeout
Details/Conditions
When using the ILO (32.768 kHz - 5%) When using the ILO (32.768 kHz and 16-bit WDT counter.
5%) and 32-bit WDT counter.
Guaranteed by Design.
Guaranteed by Design.
Updated condition
Document Number: 002-25756 Rev. *B
Page 137 of 139
CYT2B6 Datasheet
Rev *B Electrical Specification Updates (continued)
Spec ID
SID414
Description
Default WDT timeout
Changed Item
Typ
Details/Conditions
Document Number: 002-25756 Rev. *B
Current Spec (Rev *A)
Typ: 125 ms
Details/Conditions:
When using the ILO and 32-bit WDT
counter at 0x1000 (default value).
Guaranteed by Design.
New Spec (Rev *B)
Reason for Change
Updated spec
Typ: 1000 ms
Details/Conditions:
When using the ILO and 32-bit WDT
counter at 0x8000 (default value).
Guaranteed by Design.
Page 138 of 139
CYT2B6 Datasheet
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Page 139 of 139