FM21L16
2-Mbit (128 K × 16) F-RAM Memory
2-Mbit (128 K × 16) F-RAM Memory
Features
2-Mbit ferroelectric random access memory (F-RAM) logically
organized as 128 K × 16
❐ Configurable as 256 K × 8 using UB and LB
14
❐ High-endurance 100 trillion (10 ) read/writes
❐ 151-year data retention (see the Data Retention and
Endurance table)
❐ NoDelay™ writes
❐ Page mode operation to 30-ns cycle time
❐ Advanced high-reliability ferroelectric process
■
SRAM compatible
❐ Industry-standard 128 K × 16 SRAM pinout
❐ 60-ns access time, 110-ns cycle time
■
Advanced features
❐ Software-programmable block write-protect
■
Superior to battery-backed SRAM modules
❐ No battery concerns
❐ Monolithic reliability
❐ True surface mount solution, no rework steps
❐ Superior for moisture, shock, and vibration
■
Low power consumption
❐ Active current 8 mA (typ)
❐ Standby current 90 A (typ)
❐ Sleep mode current 5 A (max)
■
Low-voltage operation: VDD = 2.7 V to 3.6 V
■
Industrial temperature: –40 C to +85 C
44-pin thin small outline package (TSOP) Type II
■
Restriction of hazardous substances (RoHS) compliant
Functional Overview
The FM21L16 is a 128 K × 16 nonvolatile memory that reads and
writes similar to a standard SRAM. A ferroelectric random
access memory or F-RAM is nonvolatile, which means that data
is retained after power is removed. It provides data retention for
over 151 years while eliminating the reliability concerns,
functional disadvantages, and system design complexities of
battery-backed SRAM (BBSRAM). Fast write timing and high
write endurance make the F-RAM superior to other types of
memory.
The FM21L16 operation is similar to that of other RAM devices
and therefore, it can be used as a drop-in replacement for a
standard SRAM in a system. Read and write cycles may be
triggered by CE or simply by changing the address. The F-RAM
memory is nonvolatile due to its unique ferroelectric memory
process. These features make the FM21L16 ideal for nonvolatile
memory applications requiring frequent or rapid writes.
The FM21L16 includes a low voltage monitor that blocks access
to the memory array when VDD drops below VDD min. The
memory is protected against an inadvertent access and data
corruption under this condition. The device also features
software-controlled write protection. The memory array is
divided into 8 uniform blocks, each of which can be individually
write protected.
The device is available in a 400-mil, 44-pin TSOP-II surface
mount package. Device specifications are guaranteed over the
industrial temperature range –40 °C to +85 °C.
For a complete list of related documentation, click here.
A 1-0
16 K x 16 block
16 K x 16 block
16 K x 16 block
16 K x 16 block
16 K x 16 block
16 K x 16 block
16 K x 16 block
16 K x 16 block
...
A 16-2
Block & Row Decoder
A16-0
Address Latch & Write Protect
Logic Block Diagram
...
CE
Column Decoder
WE
Control
Logic
UB, LB
I/O Latch & Bus Driver
DQ15-0
OE
ZZ
Cypress Semiconductor Corporation
Document Number: 001-86191 Rev. *D
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised August 11, 2015
Not recommended for new designs.
■
■
FM21L16
Pinout ................................................................................ 3
Pin Definitions .................................................................. 3
Device Operation .............................................................. 4
Memory Operation ....................................................... 4
Read Operation ........................................................... 4
Write Operation ........................................................... 4
Page Mode Operation ................................................. 4
Pre-charge Operation .................................................. 4
Sleep Mode ................................................................. 4
Software Write Protect ................................................ 5
Software Write-Protect Timing .................................... 7
SRAM Drop-In Replacement ....................................... 8
Maximum Ratings ............................................................. 9
Operating Range ............................................................... 9
DC Electrical Characteristics .......................................... 9
Data Retention and Endurance ..................................... 10
Capacitance .................................................................... 10
Thermal Resistance ........................................................ 10
AC Test Conditions ........................................................ 10
Document Number: 001-86191 Rev. *D
AC Switching Characteristics ....................................... 11
SRAM Read Cycle .................................................... 11
SRAM Write Cycle ..................................................... 12
Power Cycle and Sleep Mode Timing ........................... 16
Functional Truth Table ................................................... 17
Byte Select Truth Table .................................................. 17
Ordering Information ...................................................... 18
Ordering Code Definitions ......................................... 18
Package Diagram ............................................................ 19
Acronyms ........................................................................ 20
Document Conventions ................................................. 20
Units of Measure ....................................................... 20
Document History Page ................................................. 21
Sales, Solutions, and Legal Information ...................... 22
Worldwide Sales and Design Support ....................... 22
Products .................................................................... 22
PSoC® Solutions ...................................................... 22
Cypress Developer Community ................................. 22
Technical Support ..................................................... 22
Page 2 of 22
Not recommended for new designs.
Contents
FM21L16
Pinout
Figure 1. 44-pin TSOP II pinout
A2
A1
A0
CE
DQ0
DQ1
DQ2
DQ3
VDD
VSS
DQ4
DQ5
DQ6
DQ7
WE
A16
A15
A14
A13
A12
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44-pin TSOP II
(× 16)
Top View
(not to scale)
A5
A6
A7
OE
UB
44
43
42
41
40
39
38
37
36
35
34
33
32
31
LB
DQ15
DQ14
DQ13
DQ12
VSS
VDD
DQ11
DQ10
30
29
28
27
26
25
24
23
DQ9
DQ8
ZZ
A8
A9
A10
A11
NC
Pin Definitions
Pin Name
I/O Type
Description
A16–A0
Input
Address inputs: The 17 address lines select one of 128K words in the F-RAM array. The lowest two
address lines A1–A0 may be used for page mode read and write operations.
DQ15–DQ0 Input/Output Data I/O Lines: 16-bit bidirectional data bus for accessing the F-RAM array.
WE
Input
Write Enable: A write cycle begins when WE is asserted. The rising edge causes the FM21L16 to write
the data on the DQ bus to the F-RAM array. The falling edge of WE latches a new column address for
page mode write cycles.
CE
Input
Chip Enable: The device is selected and a new memory access begins on the falling edge of CE. The
entire address is latched internally at this point. Subsequent changes to the A1–A0 address inputs allow
page mode operation.
OE
Input
Output Enable: When OE is LOW, the FM21L16 drives the data bus when the valid read data is
available. Deasserting OE HIGH tristates the DQ pins.
UB
Input
Upper Byte Select: Enables DQ15–DQ8 pins during reads and writes. These pins are HI-Z if UB is HIGH.
If the user does not perform byte writes and the device is not configured as a 256 K × 8, the UB and LB
pins may be tied to ground.
LB
Input
Lower Byte Select: Enables DQ7–DQ0 pins during reads and writes. These pins are HI-Z if LB is HIGH.
If the user does not perform byte writes and the device is not configured as a 256 K × 8, the UB and LB
pins may be tied to ground.
ZZ
Input
Sleep: When ZZ is LOW, the device enters a low-power sleep mode for the lowest supply current
condition. ZZ must be HIGH for a normal read/write operation. If unused, tie ZZ pin to VDD.
VSS
Ground
VDD
NC
Ground for the device. Must be connected to the ground of the system.
Power supply Power supply input to the device.
No connect
No connect. This pin is not connected to the die.
Document Number: 001-86191 Rev. *D
Page 3 of 22
Not recommended for new designs.
A4
A3
Device Operation
The FM21L16 is a word wide F-RAM memory logically organized
as 131,072 × 16 and accessed using an industry-standard
parallel interface. All data written to the part is immediately
nonvolatile with no delay. The device offers page mode
operation, which provides high-speed access to addresses
within a page (row). Access to a different page requires that
either CE transitions LOW or the upper address (A16–A2)
changes. See the Functional Truth Table on page 17 for a
complete description of read and write modes.
Memory Operation
Users access 131,072 memory locations, each with 16 data bits
through a parallel interface. The F-RAM array is organized as
eight blocks, each having 4096 rows. Each row has four column
locations, which allow fast access in page mode operation.
When an initial address is latched by the falling edge of CE,
subsequent column locations may be accessed without the need
to toggle CE. When CE is deasserted HIGH, a pre-charge
operation begins. Writes occur immediately at the end of the
access with no delay. The WE pin must be toggled for each write
operation. The write data is stored in the nonvolatile memory
array immediately, which is a feature unique to F-RAM called
NoDelay writes.
Read Operation
A read operation begins on the falling edge of CE. The falling
edge of CE causes the address to be latched and starts a
memory read cycle if WE is HIGH. Data becomes available on
the bus after the access time is met. When the address is latched
and the access completed, a new access to a random location
(different row) may begin while CE is still LOW. The minimum
cycle time for random addresses is tRC. Note that unlike SRAMs,
the FM21L16's CE-initiated access time is faster than the
address access time.
The FM21L16 will drive the data bus when OE and at least one
of the byte enables (UB, LB) is asserted LOW. The upper data
byte is driven when UB is LOW, and the lower data byte is driven
when LB is LOW. If OE is asserted after the memory access time
is met, the data bus will be driven with valid data. If OE is
asserted before completing the memory access, the data bus will
not be driven until valid data is available. This feature minimizes
supply current in the system by eliminating transients caused by
invalid data being driven to the bus. When OE is deasserted
HIGH, the data bus will remain in a HI-Z state.
Write Operation
In the FM21L16, writes occur in the same interval as reads. The
FM21L16 supports both CE and WE controlled write cycles. In
both cases, the address A16–A2 is latched on the falling edge of
CE.
In a CE-controlled write, the WE signal is asserted before
beginning the memory cycle. That is, WE is LOW when CE falls.
In this case, the device begins the memory cycle as a write. The
FM21L16 will not drive the data bus regardless of the state of OE
as long as WE is LOW. Input data must be valid when CE is
Document Number: 001-86191 Rev. *D
deasserted HIGH. In a WE-controlled write, the memory cycle
begins on the falling edge of CE. The WE signal falls some time
later. Therefore, the memory cycle begins as a read. The data
bus will be driven if OE is LOW; however, it will be HI-Z when WE
is asserted LOW. The CE- and WE-controlled write timing cases
are shown in the page 14.
Write access to the array begins on the falling edge of WE after
the memory cycle is initiated. The write access terminates on the
rising edge of WE or CE, whichever comes first. A valid write
operation requires the user to meet the access time specification
before deasserting WE or CE. The data setup time indicates the
interval during which data cannot change before the end of the
write access (rising edge of WE or CE).
Unlike other nonvolatile memory technologies, there is no write
delay with F-RAM. Because the read and write access times of
the underlying memory are the same, the user experiences no
delay through the bus. The entire memory operation occurs in a
single bus cycle. Data polling, a technique used with EEPROMs
to determine if a write is complete, is unnecessary.
Page Mode Operation
The F-RAM array is organized as eight blocks, each having 4096
rows. Each row has four column-address locations. Address
inputs A1–A0 define the column address to be accessed. An
access can start on any column address, and other column
locations may be accessed without the need to toggle the CE pin.
For fast access reads, after the first data byte is driven to the bus,
the column address inputs A1–A0 may be changed to a new
value. A new data byte is then driven to the DQ pins no later than
tAAP, which is less than half the initial read access time. For fast
access writes, the first write pulse defines the first write access.
While CE is LOW, a subsequent write pulse along with a new
column address provides a page mode write access.
Pre-charge Operation
The pre-charge operation is an internal condition in which the
memory state is prepared for a new access. Pre-charge is
user-initiated by driving the CE signal HIGH. It must remain
HIGH for at least the minimum pre-charge time, tPC.
Pre-charge is also activated by changing the upper addresses,
A16–A2. The current row is first closed before accessing the new
row. The device automatically detects an upper order address
change, which starts a pre-charge operation. The new address
is latched and the new read data is valid within the tAA address
access time; see Figure 9 on page 13. A similar sequence occurs
for write cycles; see Figure 14 on page 14. The rate at which
random addresses can be issued is tRC and tWC, respectively.
Sleep Mode
The device incorporates a sleep mode of operation, which allows
the user to achieve the lowest power supply current condition. It
enters a low-power sleep mode by asserting the ZZ pin LOW.
Read and write operations must complete before the ZZ pin
going LOW. When ZZ is LOW, all pins are ignored except the ZZ
pin. When ZZ is deasserted HIGH, there is some time delay
(tZZEX) before the user can access the device.
If sleep mode is not used, the ZZ pin should be tied to VDD.
Page 4 of 22
Not recommended for new designs.
FM21L16
FM21L16
Power
Applied
CE HIGH,
ZZ HIGH
Standby
ZZ LOW
Table 1. Write Protect Sectors - 16 K × 16 Blocks
Initialize
CE LOW,
ZZ HIGH
CE HIGH,
ZZ HIGH
Sleep
CE LOW,
ZZ HIGH
Normal
Operation
ZZ LOW
ZZ HIGH
Sectors
Blocks
Sector 7
1FFFFh–1C000h
Sector 6
1BFFFh–18000h
Sector 5
17FFFh–14000h
Sector 4
13FFFh–10000h
Sector 3
0FFFFh–0C000h
Sector 2
0BFFFh–08000h
Sector 1
07FFFh–04000h
Sector 0
03FFFh–00000h
The write-protect address sequence follows:
Software Write Protect
The 128 K × 16 address space is divided into eight sectors
(blocks) of 16 K × 16 each. Each sector can be individually
software write-protected and the settings are nonvolatile. A
unique address and command sequence invokes the
write-protect mode.
To modify write protection, the system host must issue six read
commands, three write commands, and a final read command.
The specific sequence of read addresses must be provided to
access the write-protect mode. Following the read address
sequence, the host must write a data byte that specifies the
desired protection state of each sector. For confirmation, the
system must then write the complement of the protection byte
immediately after the protection byte. Any error that occurs
including read addresses in the wrong order, issuing a seventh
read address, or failing to complement the protection value will
leave the write protection unchanged.
The write-protect state machine monitors all addresses, taking
no action until this particular read/write sequence occurs. During
the address sequence, each read will occur as a valid operation
and data from the corresponding addresses will be driven to the
data bus. Any address that occurs out of sequence will cause the
software protection state machine to start over. After the address
sequence is completed, the next operation must be a write cycle.
The lower data byte contains the write-protect settings. This
value will not be written to the memory array, so the address is a
don't-care. Rather it will be held pending the next cycle, which
must be a write of the data complement to the protection settings.
If the complement is correct, the write-protect settings will be
adjusted. Otherwise, the process is aborted and the address
sequence starts over. The data value written after the correct six
addresses will not be entered into the memory.
The protection data byte consists of eight bits, each associated
with the write-protect state of a sector. The data byte must be
driven to the lower eight bits of the data bus, DQ7 - DQ0. Setting
a bit to ‘1’ write-protects the corresponding sector; a ‘0’ enables
writes for that sector. The following table shows the write-protect
sectors with the corresponding bit that controls the write-protect
setting.
Document Number: 001-86191 Rev. *D
1. Read address 12555h
2. Read address 1DAAAh
3. Read address 01333h
4. Read address 0ECCCh
5. Read address 000FFh
6. Read address 1FF00h
7. Write address 1DAAAh
8. Write address 0ECCCh
9. Write address 0FF00h
10.Read address 00000h
Note If CE is LOw entering the sequence, then an address of
00000h must precede 12555h.
The address sequence provides a secure way of modifying the
protection. The write-protect sequence has a one in 3 × 1032
chance of randomly accessing exactly the first six addresses.
The odds are further reduced by requiring three more write
cycles, one that requires an exact inversion of the data byte.
Figure 3 on page 6 shows a flow chart of the entire write-protect
operation. The write-protect settings are nonvolatile. The factory
default: all blocks are unprotected.
For example, the following sequence write-protects addresses
from 0C000h to 13FFFh (sectors 3 and 4):
Address
Data
Read
12555h
–
Read
1DAAAh
–
Read
01333h
–
Read
0ECCCh
–
Read
000FFh
–
Read
1FF00h
–
Write
1DAAAh
18h; bits 3 and 4 = 1
Write
0ECCCh
E7h; complement of 18h
Write
0FF00h
Don’t care
Read
00000h
Page 5 of 22
Not recommended for new designs.
Figure 2. Sleep/Standby State Diagram
FM21L16
Figure 3. Write-Protect State Machine
Any other
operation
Write
1DAAAh?
n
y
Read 12555h?
Hold Data Byte
n
Write
0ECCCh?
n
y
Not recommended for new designs.
Normal Memory
Operation
Read 1AAAAh to
drive write protect
settings
y
n
Read
1DAAAh?
n
Write
0ECCCh?
Read 00000h
y
y
n
Read 01333h?
n
Data
Complement?
y
y
Read
0ECCCh?
n
n
y
Read 000FFh?
Write
0FF00h?
Read 00000h
To enter new
y write
protect settings
n
y
Read 1FF00h?
n
y
Sequence Detector
Document Number: 001-86191 Rev. *D
Change Write Protect
Settings
Read Write Protect
Settings
Page 6 of 22
FM21L16
Software Write-Protect Timing
Figure 4. Sequence to Set Write-Protect Blocks [1]
CE
12555
1DAAA
01333
0ECCC
000FF
1FF00
1DAAA
0ECCC
0FF00
00000
Not recommended for new designs.
A16-0
WE
OE
DQ
15-0
Data
Data
Figure 5. Sequence to Read Write-Protect Settings [1]
CE
A16-0
12555
1DAAA
01333
0ECCC
000FF
1FF00
0ECCC
1AAAA
00000
WE
tCE (read access time)
OE
DQ 15-0
X
Data
Note
1. This sequence requires tAS > 10 ns and address must be stable while CE is LOW.
Document Number: 001-86191 Rev. *D
Page 7 of 22
FM21L16
The FM21L16 is designed to be a drop-in replacement for
standard asynchronous SRAMs. The device does not require CE
to toggle for each new address. CE may remain LOW for as long
as 10 µs. While CE is LOW, the device automatically detects
address changes and a new access begins. It also allows page
mode operation at speeds up to 33 MHz.
the current drawn when WE is LOW is not an issue. A 10-k
resistor draws 330 µA when WE is LOW and VDD = 3.3 V.
Figure 7. Use of Pull-up Resistor on WE
VDD
FM21L16
CE
Figure 6 shows a pull-up resistor on CE, which will keep the pin
HIGH during power cycles, assuming the MCU / MPU pin
tristates during the reset condition. The pull-up resistor value
should be chosen to ensure the CE pin tracks VDD to a high
enough value, so that the current drawn when CE is LOW is not
an issue. A 10-k resistor draws 330 µA when CE is LOW and
VDD = 3.3 V
WE
OE
MCU / MPU
A16-0
DQ15-0
Figure 6. Use of Pull-up Resistor on CE
VDD
FM21L16
CE
WE
MCU / MPU
OE
A 16-0
DQ 15-0
Note that if CE is tied to ground, the user must be sure WE is not
LOW at power-up or power-down events. If CE and WE are both
LOW during power cycles, data will be corrupted. Figure 7 shows
a pull-up resistor on WE, which will keep the pin HIGH during
power cycles, assuming the MCU / MPU pin tristates during the
reset condition.The pull-up resistor value should be chosen to
ensure the WE pin tracks VDD to a high enough value, so that
Note If CE is tied to ground, the user gives up the ability to
perform the software write-protect sequence.
For applications that require the lowest power consumption, the
CE signal should be active (LOW) only during memory accesses.
The FM21L16 draws supply current while CE is LOW, even if
addresses and control signals are static. While CE is HIGH, the
device draws no more than the maximum standby current, ISB.
CE toggling LOW on every address access is perfectly
acceptable in FM21L16.
The UB and LB byte select pins are active for both read and write
cycles. They may be used to allow the device to be wired as a
256 K × 8 memory. The upper and lower data bytes can be tied
together and controlled with the byte selects. Individual byte
enables or the next higher address line A17 may be available
from the system processor.
Figure 8. FM21L16 Wired as 256 K × 8
CE
WE
OE
A
17
A
16-0
Document Number: 001-86191 Rev. *D
UB
LB
A
16-0
ZZ
2-Mbit F-RAM
FM21L16
DQ
15-8
D
DQ
7-0
7-0
Page 8 of 22
Not recommended for new designs.
SRAM Drop-In Replacement
Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. These user guidelines are not tested.
Storage temperature ................................ –55 C to +125 C
Maximum accumulated storage time
At 125 °C ambient temperature ................................. 1000 h
At 85 °C ambient temperature ................................ 10 Years
Ambient temperature
with power applied ................................... –55 °C to +125 °C
Supply voltage on VDD relative to VSS ........–1.0 V to + 4.5 V
Voltage applied to outputs
in High Z state .................................... –0.5 V to VDD + 0.5 V
Input voltage .......... –1.0 V to + 4.5 V and VIN < VDD + 1.0 V
Transient voltage (< 20 ns) on
any pin to ground potential ................. –2.0 V to VCC + 2.0 V
Package power dissipation
capability (TA = 25 °C) ................................................. 1.0 W
Surface mount Pb soldering
temperature (3 seconds) ......................................... +260 C
DC output current (1 output at a time, 1s duration) .... 15 mA
Static discharge voltage
Human Body Model (JEDEC Std JESD22-A114-F) ......... 2.5 kV
Charged Device Model (JEDEC Std JESD22-C101-D) .... 800 V
Machine Model (JEDEC Std JESD22-A115-A) ................. 200 V
Latch-up current ................................................... > 140 mA
Operating Range
Range
Industrial
Ambient Temperature (TA)
VDD
–40 C to +85 C
2.7 V to 3.6 V
DC Electrical Characteristics
Over the Operating Range
Parameter
Description
Test Conditions
Min
Typ [2]
Max
Unit
2.7
3.3
3.6
V
VDD
Power supply voltage
IDD
VDD supply current
VDD = 3.6 V, CE cycling at min. cycle time. All
inputs toggling at CMOS levels
(0.2 V or VDD – 0.2 V), all DQ pins unloaded.
–
8
12
mA
ISB
Standby current
VDD = 3.6 V, CE at VDD,
All other pins are static and at
CMOS levels
(0.2 V or VDD – 0.2 V), ZZ is HIGH
TA = 25 C
–
90
150
µA
TA = 85 C
–
–
270
µA
TA = 25 C
–
–
5
µA
TA = 85 C
–
–
8
µA
IZZ
Sleep mode current
VDD = 3.6 V, ZZ is LOW,
all other inputs at CMOS levels
(0.2 V or VDD – 0.2 V).
ILI
Input leakage current
VIN between VDD and VSS
–
–
+1
µA
ILO
Output leakage current
VOUT between VDD and VSS
–
–
+1
µA
VIH
Input HIGH voltage
2.2
–
VDD + 0.3
V
VIL
Input LOW voltage
– 0.3
–
0.6
V
VOH1
Output HIGH voltage
IOH = –1.0 mA
2.4
–
–
V
VOH2
Output HIGH voltage
IOH = –100 µA
VDD – 0.2
–
–
V
VOL1
Output LOW voltage
IOL = 2.1 mA
–
–
0.4
V
VOL2
Output LOW voltage
IOL = 100 µA
–
–
0.2
V
Note
2. Typical values are at 25 °C, VDD = VDD (typ). Not 100% tested.
Document Number: 001-86191 Rev. *D
Page 9 of 22
Not recommended for new designs.
FM21L16
FM21L16
Parameter
TDR
NVC
Description
Data retention
Endurance
Test condition
Min
Max
Unit
10
–
Years
TA = 75 C
38
–
TA = 65 C
151
–
14
–
Cycles
Max
Unit
8
pF
TA = 85 C
Over operating temperature
10
Capacitance
Parameter
Description
Test Conditions
TA = 25 C, f = 1 MHz, VDD = VDD(Typ)
CI/O
Input/Output capacitance (DQ)
CIN
Input capacitance
6
pF
CZZ
Input capacitance of ZZ pin
8
pF
Thermal Resistance
Parameter
Description
JA
Thermal resistance
(junction to ambient)
JC
Thermal resistance
(junction to case)
Test Conditions
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
44-pin TSOP II Unit
102
C/W
22
C/W
AC Test Conditions
Input pulse levels ...................................................0 V to 3 V
Input rise and fall times (10%–90%) ........................... < 3 ns
Input and output timing reference levels ....................... 1.5 V
Output load capacitance ............................................... 30 pF
Document Number: 001-86191 Rev. *D
Page 10 of 22
Not recommended for new designs.
Data Retention and Endurance
FM21L16
AC Switching Characteristics
Over the Operating Range
Parameters [3]
Cypress
Parameter
Description
Alt Parameter
Min
Max
Unit
–
60
ns
110
–
ns
tCE
tACE
Chip enable access time
tRC
–
Read cycle time
tAA
–
Address access time
–
110
ns
tOH
tOHA
Output hold time
20
–
ns
tAAP
–
Page mode address access time
–
25
ns
tOHP
–
Page mode output hold time
5
–
ns
tCA
–
Chip enable active time
60
10,000
ns
tPC
–
Pre-charge time
50
–
ns
tBA
tBW
UB, LB access time
–
20
ns
tAS
tSA
Address setup time (to CE LOW)
0
–
ns
tAH
tHA
Address hold time (CE Controlled)
60
–
ns
tOE
tDOE
Output enable access time
–
15
ns
tHZ[4, 5]
tHZCE
Chip Enable to output HI-Z
–
10
ns
tOHZ[4, 5]
tHZOE
Output enable HIGH to output HI-Z
–
10
ns
tBHZ[4, 5]
tHZBE
UB, LB HIGHHIGH to output HI-Z
–
10
ns
Notes
3. Test conditions assume a signal transition time of 3 ns or less, timing reference levels of 0.5 × VDD, input pulse levels of 0 to 3 V, output loading of the specified
IOL/IOH and load capacitance shown in AC Test Conditions on page 10.
4. tHZ, tOHZ and tBHZ are specified with a load capacitance of 5 pF. Transition is measured when the outputs enter a high impedance state.
5. This parameter is characterized but not 100% tested.
Document Number: 001-86191 Rev. *D
Page 11 of 22
Not recommended for new designs.
SRAM Read Cycle
FM21L16
AC Switching Characteristics (continued)
Over the Operating Range
Parameters [3]
Cypress
Parameter
Description
Alt Parameter
Min
Max
Unit
tWC
tWC
Write cycle time
110
–
ns
tCA
–
Chip enable active time
60
10,000
ns
tCW
tSCE
Chip enable to write enable HIGH
60
–
ns
tPC
–
Pre-charge time
50
–
ns
tPWC
–
Page mode write enable cycle time
25
–
ns
tWP
tPWE
Write enable pulse width
16
–
ns
tAS
tSA
Address setup time (to CE LOW)
0
–
ns
tASP
–
Page mode address setup time (to WE LOW)
8
–
ns
tAHP
–
Page mode address hold time (to WE LOW)
15
–
ns
tWLC
tPWE
Write enable LOW to chip disabled
25
–
ns
tBLC
tBW
UB, LB LOW to chip disabled
25
–
ns
tWLA
–
Write enable LOW to A16-2 change
25
–
ns
tAWH
–
A16-2 change to write enable HIGH
110
–
ns
tDS
tSD
Data input setup time
14
–
ns
tDH
tHD
Data input hold time
0
–
ns
tWZ[6, 7]
tHZWE
Write enable LOW to output HI-Z
–
10
ns
tWX[7]
–
Write enable HIGH to output driven
10
–
ns
tWS[8]
–
Write enable to CE LOW setup time
0
–
ns
[8]
–
Write enable to CE HIGH hold time
0
–
ns
tWH
Notes
6. tWZ is specified with a load capacitance of 5 pF. Transition is measured when the outputs enter a high impedance state.
7. This parameter is characterized but not 100% tested.
8. The relationship between CE and WE determines if a CE- or WE-controlled write occurs. The parameters tWS and tWH are not tested.
Document Number: 001-86191 Rev. *D
Page 12 of 22
Not recommended for new designs.
SRAM Write Cycle
FM21L16
Figure 9. Read Cycle Timing 1 (CE LOW, OE LOW)
tRC
tRC
A16-0
tAA
tAA
tOH
Previous Data
DQ
15-0
Valid Data
Valid Data
Figure 10. Read Cycle Timing 2 (CE Controlled)
tCA
tPC
CE
tAH
tAS
A 16-0
tOE
OE
tHZ
tCE
tOHZ
tOH
DQ 15-0
tBA
tBHZ
UB / LB
Figure 11. Page Mode Read Cycle Timing [9]
tPC
tCA
CE
tAS
A 16-2
Col 0
A1-0
Col 1
tAAP
tOE
OE
tHZ
tOHZ
tOHP
tCE
DQ15-0
Col 2
Data 0
Data 1
Data 2
Note
9. Although sequential column addressing is shown, it is not required
Document Number: 001-86191 Rev. *D
Page 13 of 22
Not recommended for new designs.
tOH
FM21L16
Figure 12. Write Cycle Timing 1 (WE Controlled) [10]
tCA
tPC
tCW
CE
tAS
tWLC
tWP
tWX
WE
DQ15-0
Not recommended for new designs.
A16-0
tWZ
tDH
tDS
D out
D in
tHZ
D out
Figure 13. Write Cycle Timing 2 (CE Controlled)
tCA
tPC
CE
tBLC
tAS
A16-0
tWS
tWH
WE
tDH
tDS
DQ
15-0
D in
UB/LB
Figure 14. Write Cycle Timing 3 (CE LOW) [10]
tWC
tAWH
A16-0
tWLA
tWX
WE
tWZ
tDS
DQ15-0
D out
D in
tDH
D out
D in
Note
10. OE (not shown) is LOW only to show the effect of WE on DQ pins.
Document Number: 001-86191 Rev. *D
Page 14 of 22
FM21L16
Figure 15. Page Mode Write Cycle Timing
tCA
tPC
tCW
CE
tWLC
tAS
tAHP
A 1-0
Col 0
Not recommended for new designs.
A16-2
tASP
Col 1
Col 2
tPWC
tWP
WE
OE
tDH
tDS
DQ15-0
Data 0
Data 1
Data 2
Note
11. UB and LB to show byte enable and byte masking cases.
Document Number: 001-86191 Rev. *D
Page 15 of 22
FM21L16
Power Cycle and Sleep Mode Timing
Parameter
tPU
Min
Max
Unit
450
–
µs
Last write (WE HIGH) to power down time
0
–
µs
Power-up (after VDD min. is reached) to first access time
tPD
tVR
Description
[12, 13]
VDD power-up ramp rate
50
–
µs/V
tVF[12, 13]
VDD power-down ramp rate
100
–
µs/V
tZZH
ZZ active to DQ HI-Z time
–
20
ns
tWEZZ
Last write to sleep mode entry time
0
–
µs
tZZL
ZZ active LOW time
1
–
µs
tZZEN
Sleep mode entry time (ZZ LOW to CE don’t care)
–
0
µs
–
450
µs
st
tZZEX
Sleep mode exit time (ZZ HIGH to 1 access after wakeup)
Figure 16. Power Cycle and Sleep Mode Timing
VDD
t VR
t PU
CE
VDD min.
VDD min.
t ZZEN
t ZZEX
R/W
Allowed
t ZZEX
R/W
Allowed
t VF
R/W
Allowed
t ZZL
ZZ
t PD
t WEZZ
WE
t ZZH
DQ
D out
D in
Note
12. Slope measured at any point on the VDD waveform.
13. Cypress cannot test or characterize all VDD power ramp profiles. The behavior of the internal circuits is difficult to predict when VDD is below the level of a transistor
threshold voltage. Cypress strongly recommends that VDD power up faster than 100 ms through the range of 0.4 V to 1.0 V.
Document Number: 001-86191 Rev. *D
Page 16 of 22
Not recommended for new designs.
Over the Operating Range
FM21L16
Functional Truth Table
WE
A16-2
A1-0
ZZ
X
X
X
X
L
Sleep Mode
H
X
X
X
H
Standby/Idle
↓
H
H
V
V
V
V
H
H
Read
L
L
H
No Change
Change
H
Page Mode Read
L
H
Change
V
H
Random Read
↓
V
V
V
V
H
H
CE-Controlled Write[15]
L
L
L
L
↓
V
V
H
WE-Controlled Write [15, 16]
L
↓
No Change
V
H
Page Mode Write [17]
↑
X
X
X
X
X
X
H
H
Starts pre-charge
L
Not recommended for new designs.
Operation [14, 15]
CE
Byte Select Truth Table
Operation [18]
WE
OE
LB
UB
H
H
X
X
X
H
H
L
H
L
Read upper byte; HI-Z lower byte
L
H
Read lower byte; HI-Z upper byte
L
L
Read both bytes
H
L
Write upper byte; Mask lower byte
L
H
Write lower byte; Mask upper byte
L
L
Write both bytes
H
L
X
Read; Outputs disabled
Notes
14. H = Logic HIGH, L = Logic LOW, V = Valid Data, X = Don't Care, ↓ = toggle LOW, ↑ = toggle HIGH.
15. For write cycles, data-in is latched on the rising edge of CE or WE, whichever comes first.
16. WE-controlled write cycle begins as a Read cycle and then A16-2 is latched.
17. Addresses A1-0 must remain stable for at least 10 ns during page mode operation.
18. Assumes CE is LOW and ZZ is HIGH for all cases.The UB and LB pins may be grounded if 1) the system does not perform byte writes and 2) the device is not configured
as a 256 K x 8.
Document Number: 001-86191 Rev. *D
Page 17 of 22
FM21L16
Ordering Information
Access time (ns)
60
Ordering Code
FM21L16-60-TG
Package Diagram
Package Type
Operating Range
51-85087
44-pin TSOP II
Industrial
FM21L16-60-TGTR
All the above parts are Pb-free.
FM 21
L
Not recommended for new designs.
Ordering Code Definitions
16 - 60 - TG TR
Option:
blank = Standard; TR = Tape and Reel
Package Type:
TG = 44-pin TSOP II
Access Time: 60 ns
I/O Width: × 16
Voltage: 2.7 V to 3.6 V
2-Mbit Parallel F-RAM
Cypress
Document Number: 001-86191 Rev. *D
Page 18 of 22
FM21L16
Package Diagram
Not recommended for new designs.
Figure 17. 44-pin TSOP Package Outline, 51-85087
51-85087 *E
Document Number: 001-86191 Rev. *D
Page 19 of 22
FM21L16
Acronym
CPU
Document Conventions
Description
Units of Measure
Central Processing Unit
Symbol
Unit of Measure
CMOS
Complementary Metal Oxide Semiconductor
°C
EIA
Electronic Industries Alliance
Hz
hertz
F-RAM
Ferroelectric Random Access Memory
kHz
kilohertz
I/O
Input/Output
k
kilohm
MCU
Microcontroller Unit
MHz
megahertz
MPU
Microprocesser Unit
A
microampere
RoHS
Restriction of Hazardous Substances
F
microfarad
R/W
Read and Write
s
microsecond
SRAM
Static Random Access Memory
mA
milliampere
ms
millisecond
TSOP
Thin Small Outline Package
M
megaohm
ns
nanosecond
ohm
%
percent
pF
picofarad
V
volt
W
watt
Document Number: 001-86191 Rev. *D
degree Celsius
Not recommended for new designs.
Acronyms
Page 20 of 22
FM21L16
Document History Page
Document Title: FM21L16, 2-Mbit (128 K × 16) F-RAM Memory
Document Number: 001-86191
ECN No.
Orig. of
Change
Submission
Date
Description of Change
**
3912933
GVCH
02/25/2013
New spec
*A
4191807
GVCH
11/14/2013
Added watermark as “Not recommended for new designs.”
*B
4274811
GVCH
03/11/2014
Typo fixed: Changed datasheet status from “Preliminary to Final”
Converted to Cypress standard format
Updated Maximum Ratings table
- Removed Moisture Sensitivity Level (MSL)
- Added junction temperature and latch up current
Updated Data Retention and Endurance table
Added Thermal Resistance table
Typo error fixed: Updated Address range from A17-A0 to A16-A0 for Figure 12
and Figure 13
Removed Package Marking Scheme (top mark)
*C
4574376
GVCH
11/19/2014
Added related documentation hyperlink in page 1.
*D
4879990
ZSK / PSR
08/11/2015
Updated Maximum Ratings:
Removed “Maximum junction temperature”.
Added “Maximum accumulated storage time”.
Added “Ambient temperature with power applied”.
Updated to new template.
Document Number: 001-86191 Rev. *D
Page 21 of 22
Not recommended for new designs.
Rev.
FM21L16
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
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closest to you, visit us at Cypress Locations.
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© Cypress Semiconductor Corporation, 2013-2015. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-86191 Rev. *D
Revised August 11, 2015
All products and company names mentioned in this document may be the trademarks of their respective holders.
Page 22 of 22
Not recommended for new designs.
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