IBIS4-A-6600

ADVANCE INFORMATION IBIS4-A-6600 CYII4SM6600AB 6.6 MP CMOS Image Sensor Table 1. Key Performance Parameters (continued) Parameter Operating temperature Color Filter Array Packaging Typical Value –30 °C to +65 °C Mono, RGB Bayer Pattern 68-pins LCC Description The IBIS4-6600 is a solid -state CMOS image sensor that integrates the functionality of complete analog image acquisition, digitizer and digital signal processing system on a single chip. The image sensor compromises a 6.6 MPixel resolution with 2210x3002 active pixels. The image size is fully programmable to user-defined windows of interest. The pixels are on a 3.5-µm pitch. The sensor is available in a Monochrome version or Bayer (RGB) patterned color filter array. User-programmable row and column start/stop positions allow windowing down to 2x1 pixel window for digital zoom. Sub sampling reduces resolution while maintaining the constant field of view. The analog video output of the pixel array is processed by an on-chip analog signal pipeline. Double Sampling (DS) eliminates the fixed pattern noise. The programmable gain and offset amplifier maps the signal swing to the ADC input range. A 10-bit ADC converts the analog data to a 10-bit digital word stream. The sensor uses a 3-wire Serial-Parallel (SPI) interface. It operates with a single 2.5V power supply and requires only one master clock for operation up to 40 MHz. It is housed in a 68-pin ceramic LCC package. This data sheet allows the user to develop a camera system based on the described timing and interfacing. Features Table 1. Key Performance Parameters Parameter Active Pixels Pixel Size Optical format Active Imager Size Shutter Type Maximum Data Rate/Master Clock Frame rate ADC resolution Sensitivity (@ 650 nm) Dynamic Range Full Well Charge Temporal Noise Dark current High Dynamic Range Modes Supply Voltage Power consumption Typical Value 2210 (H) x 3002 (V) 3.5 µm x 3.5 µm 1 inch 7.74 mm x 10.51 mm Electronic Rolling Shutter 40 MPS/40 MHz 5 fps (2210 x 3002) 89 fps (640 x 480) ADC resolution 411 V.m2/W.s, 4.83 V/lux.s 59 dB Full Well Charge 24 e3.37 mV/s Double Slope, Non Destructive Read out (NDR). Analog: 2.5V-3.3V, Digital: 2.5V, I/O: 2.5V 190 mWatt • Applications • Machine vision • Biometry • Document scanning Cypress Semiconductor Corporation Document Number: 001-02366 Rev. *D 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised January 2, 2007 [+] [+] Feedback ADVANCE INFORMATION TABLE OF CONTENTS IBIS4-A-6600 CYII4SM6600AB Features .............................................................................................................................1 Description ........................................................................................................................1 Applications ......................................................................................................................1 Specifications ....................................................................................................................5 General Specifications ...................................................................................................5 Electro-optical specifications .........................................................................................5 Features and General Specifications ............................................................................7 Electrical Specifications .................................................................................................8 Sensor Architecture and Operation ................................................................................9 Floor Plan ......................................................................................................................9 Pixel ...............................................................................................................................10 Pixel Rate ......................................................................................................................11 Region of Interest (ROI) Read Out ................................................................................11 Output Amplifier .............................................................................................................12 Analog to Digital Converter ............................................................................................13 Subsample Modes .........................................................................................................14 Electronic Shutter ..........................................................................................................18 High Dynamic Range Modes .........................................................................................18 Sequencer and Registers ..............................................................................................20 Timing diagrams ...............................................................................................................26 Sequencer Control Signals ............................................................................................26 Basic Frame and Line Timing ........................................................................................26 Pixel Output Timing .......................................................................................................27 Pin List ...............................................................................................................................29 Packaging ..........................................................................................................................32 Bare Die .........................................................................................................................32 Package Drawing ..........................................................................................................33 Glass Lid Specifications ................................................................................................37 Storage and Handling .......................................................................................................37 Storage Conditions ........................................................................................................37 Handling and Soldering Conditions ...............................................................................37 RoHS (lead free) Compliance ........................................................................................38 Ordering Information ........................................................................................................39 Disclaimer ..........................................................................................................................39 Document History Page ...................................................................................................40 Document Number: 001-02366 Rev. *D Page 2 of 40 [+] [+] Feedback ADVANCE INFORMATION LIST OF FIGURES IBIS4-A-6600 CYII4SM6600AB Spectral Response Curve ...................................................................................................6 Electro-voltaic Response Curve ..........................................................................................7 Floor Plan ............................................................................................................................9 3T Pixel Architecture ...........................................................................................................10 RGB Bayer Alignment .........................................................................................................10 Typical Response Curve of the RGB Filters .......................................................................10 Floor Plan Pixel Array .........................................................................................................11 Output Amplifier Architecture ..............................................................................................12 Offset for the Two Channels through DAC_RAW and DAC_FINE .....................................13 ADC resistor ladder .............................................................................................................14 X-subsampling ....................................................................................................................15 Y-subsampling ....................................................................................................................16 Pixel Readout in Various Subsample Modes ......................................................................17 Electronic Rolling Shutter Operation ...................................................................................18 Double Slope Response .....................................................................................................19 Principle of Non-destructive Readout .................................................................................19 Syncing of the Y-shift Registers. .........................................................................................23 SPI Interface .......................................................................................................................25 Relative Timing of the 3 Control Signals .............................................................................26 Basic Frame and Line Timing .............................................................................................27 Pixel Output Timing using Two Analog Outputs .................................................................27 Pixel Output Timing Multiplexing to One Analog Output .....................................................28 ADC Timing using Two Analog Outputs .............................................................................28 ADC Timing using One Analog Output ...............................................................................28 Bare Die Dimensions ..........................................................................................................32 Package Top View (all dimensions in inch) ........................................................................33 Package Side View (all dimensions in inch) .......................................................................34 Package Back View (all dimensions in inch) .......................................................................35 Bonding Scheme of the IBIS4-A-6600 in the LCC Package ...............................................36 Transmittance Curve of the D263 Cover Glass Lid ............................................................37 Reflow Soldering Temperature Profile ................................................................................38 Document Number: 001-02366 Rev. *D Page 3 of 40 [+] [+] Feedback ADVANCE INFORMATION LIST OF TABLES IBIS4-A-6600 CYII4SM6600AB Key Performance Parameters .............................................................................................1 General Specifications. .......................................................................................................5 Electro-optical Specifications ..............................................................................................5 Features and General Specifications ..................................................................................7 Absolute Maximum Ratings ................................................................................................8 Recommended Operating Conditions .................................................................................8 DC Electrical Conditions .....................................................................................................8 Frame Rate vs. Resolution .................................................................................................11 PGA Gain Settings ..............................................................................................................12 ADC specifications ..............................................................................................................13 ADC resistor values ............................................................................................................14 Subsample Patterns ............................................................................................................14 Frame Rate vs. Subsample Mode ......................................................................................16 Pros and Cons of NDR .......................................................................................................19 List of Internal Registers .....................................................................................................20 Overview of NDR Modes. ...................................................................................................22 Granularity of X-Sequencer Clock and Corresponding Row Blanking Time (for NDR = 0). 23 Delay added by Changing the Settings of the DELAY Register .........................................24 Delay added by Changing the Settings of the DELAY_CLK_AMP Bits ..............................24 Pin List ................................................................................................................................29 Package Side View Dimensions. ........................................................................................34 Storage conditions. .............................................................................................................37 The Chemical Substances and Information about Any Intentional Content ........................38 Ordering Information. ...........................................................................................................39 Document Number: 001-02366 Rev. *D Page 4 of 40 [+] [+] Feedback ADVANCE INFORMATION Specifications General Specifications Table 2. General Specifications. Parameter Pixel architecture Pixel size Resolution Pixel rate Shutter type Full frame rate Electro-optical specifications Overview Table 3. Electro-optical Specifications Parameter FPN (local) PRNU (local) Conversion gain Output signal amplitude Saturation charge Sensitivity (peak) Sensitivity (visible) Peak QE * FF Peak Spectral Resp. Fill factor Dark current Dark Signal Non Uniformity Temporal noise S/N Ratio Spectral sensitivity range Optical cross talk Power dissipation