MB95F656LWQN-G-SNE1

The following document contains information on Cypress products. The document has the series name, product name, and ordering part numbering with the prefix “MB”. However, Cypress will offer these products to new and existing customers with the series name, product name, and ordering part number with the prefix “CY”. How to Check the Ordering Part Number 1. Go to www.cypress.com/pcn. 2. Enter the keyword (for example, ordering part number) in the SEARCH PCNS field and click Apply. 3. Click the corresponding title from the search results. 4. Download the Affected Parts List file, which has details of all changes For More Information Please contact your local sales office for additional information about Cypress products and solutions. About Cypress Cypress is the leader in advanced embedded system solutions for the world's most innovative automotive, industrial, smart home appliances, consumer electronics and medical products. Cypress' microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable, high-performance memories help engineers design differentiated products and get them to market first. Cypress is committed to providing customers with the best support and development resources on the planet enabling them to disrupt markets by creating new product categories in record time. To learn more, go to www.cypress.com. MB95650L Series New 8FX 8-bit Microcontrollers The MB95650L Series is a series of general-purpose, single-chip microcontrollers. In addition to a compact instruction set, the microcontrollers of this series contain a variety of peripheral functions. Features F2MC-8FX CPU core I2C bus interface  2 channels (One of the two channels can be used either as an I2C bus interface channel or as a UART/SIO channel.) Instruction set optimized for controllers ■ Multiplication and division instructions ■ 16-bit arithmetic operations ■ Bit test branch instructions ■ Bit manipulation instructions, etc. ■ Selectable main clock source ❐ Main oscillation clock (up to 16.25 MHz, maximum machine clock frequency: 8.125 MHz) ❐ External clock (up to 32.5 MHz, maximum machine clock frequency: 16.25 MHz) ❐ Main CR clock (4 MHz 2%) ❐ Main CR PLL clock • The main CR PLL clock frequency becomes 8 MHz 2% when the PLL multiplication rate is 2. • The main CR PLL clock frequency becomes 10 MHz 2% when the PLL multiplication rate is 2.5. • The main CR PLL clock frequency becomes 12 MHz 2% when the PLL multiplication rate is 3. • The main CR PLL clock frequency becomes 16 MHz 2% when the PLL multiplication rate is 4. ❐ Main PLL clock (maximum machine clock frequency: 16 MHz) Selectable subclock source Suboscillation clock (32.768 kHz) ❐ External clock (32.768 kHz) ❐ Sub-CR clock (Typ: 100 kHz, Min: 50 kHz, Max: 150 kHz) ❐ Timer ■ 8/16-bit composite timer  2 channels ■ Time-base timer  1 channel ■ Watch prescaler  1 channel Supports Standard-mode and Fast-mode (400 kHz). ■ Built-in wake-up function LIN-UART Clock ■ ■ ■ Full duplex double buffer ■ Capable of clock asynchronous serial data transfer and clock synchronous serial data transfer External interrupt  6 channels ■ Interrupt by edge detection (rising edge, falling edge, and both edges can be selected) ■ Can be used to wake up the device from different low power consumption (standby) modes 8/12-bit A/D converter  6 channels 8-bit or 12-bit resolution can be selected. Low power consumption (standby) modes There are four standby modes as follows: ■ Stop mode ■ Sleep mode ■ Watch mode ■ Time-base timer mode I/O port ■ MB95F652E/F653E/F654E/F656E (number of I/O ports: 21) General-purpose I/O ports (CMOS I/O) : 17 ❐ General-purpose I/O ports (N-ch open drain) :4 ❐ ■ MB95F652L/F653L/F654L/F656L (number of I/O ports: 20) General-purpose I/O ports (CMOS I/O) : 17 ❐ General-purpose I/O ports (N-ch open drain) :3 ❐ UART/SIO  1 channel (The channel can be used either as a UART/SIO channel or as an I2C bus interface channel.) On-chip debug ■ 1-wire serial control ■ The function of this channel can be switched between UART/SIO and I2C bus interface. ■ Serial writing supported (asynchronous mode) ■ Full duplex double buffer Hardware/software watchdog timer ■ Capable of clock asynchronous (UART) serial data transfer and clock synchronous (SIO) serial data transfer ■ Built-in hardware watchdog timer ■ Built-in software watchdog timer Cypress Semiconductor Corporation Document Number: 002-04696 Rev. *B • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised August 7, 2017 MB95650L Series Power-on reset Clock supervisor counter A power-on reset is generated when the power is switched on. Built-in clock supervisor counter Low-voltage detection reset circuit and low-voltage detection interrupt circuit (only available on MB95F652E/F653E/F654E/F656E) Dual operation Flash memory Built-in low-voltage detection function The program/erase operation and the read operation can be executed in different banks (upper bank/lower bank) simultaneously. Flash memory security function Protects the content of the Flash memory. Document Number: 002-04696 Rev. *B Page 2 of 105 MB95650L Series Contents Product Line-up ................................................................ 4 Packages and Corresponding Products ........................ 6 Differences among Products and Notes on Product Selection ............................................. 7 Pin Assignment ................................................................ 8 Pin Functions .................................................................... 9 I/O Circuit Type ............................................................... 12 Handling Precautions ..................................................... 15 Precautions for Product Design ................................. 15 Precautions for Package Mounting ........................... 16 Precautions for Use Environment .............................. 17 Notes On Device Handling ............................................. 18 Pin Connection ............................................................... 19 Block Diagram ................................................................ 20 CPU Core ......................................................................... 21 Memory Space ................................................................ 22 Areas for Specific Applications .................................... 24 I/O Map ............................................................................. 25 Document Number: 002-04696 Rev. *B I/O Ports ........................................................................... 29 Port 0 ......................................................................... 30 Port 1 ......................................................................... 36 Port 6 ......................................................................... 42 Port F ......................................................................... 46 Port G ........................................................................ 50 Interrupt Source Table ................................................... 53 Pin States in each Mode ................................................ 54 Electrical Characteristics ............................................... 56 Absolute Maximum Ratings ....................................... 56 Recommended Operating Conditions ....................... 58 DC Characteristics .................................................... 59 AC Characteristics ..................................................... 62 A/D Converter ............................................................ 86 Flash Memory Program/Erase Characteristics .......... 90 Sample Characteristics .................................................. 91 Mask Options .................................................................. 98 Ordering Information ...................................................... 99 Package Dimension ...................................................... 100 Major Changes .............................................................. 103 Document History ......................................................... 104 Page 3 of 105 MB95650L Series 1. Product Line-up Part number MB95F652E MB95F653E MB95F654E MB95F656E MB95F652L MB95F653L MB95F654L MB95F656L Parameter Type Clock supervisor counter Flash memory product It supervises the main clock oscillation and the subclock oscillation. Flash memory capacity 8 Kbyte 12 Kbyte 20 Kbyte 36 Kbyte 8 Kbyte 12 Kbyte 20 Kbyte 36 Kbyte RAM capacity 256 bytes 512 bytes 1024 bytes 1024 bytes 256 bytes 512 bytes 1024 bytes 1024 bytes Power-on reset Yes Low-voltage detection reset Reset input Yes No Selected through software With dedicated reset input CPU functions • • • • • • Number of basic instructions Instruction bit length Instruction length Data bit length Minimum instruction execution time Interrupt processing time : 136 : 8 bits : 1 to 3 bytes : 1, 8 and 16 bits : 61.5 ns (machine clock frequency = 16.25 MHz) : 0.6 µs (machine clock frequency = 16.25 MHz) General-purpose I/O • I/O port • CMOS I/O • N-ch open drain Time-base timer Interval time: 0.256 ms to 8.3 s (external clock frequency = 4 MHz) : 21 : 17 :4 • I/O port • CMOS I/O • N-ch open drain : 20 : 17 :3 • Reset generation cycle Hardware/software Main oscillation clock at 10 MHz: 105 ms (Min) watchdog timer • The sub-CR clock can be used as the source clock of the software watchdog timer. Wild register It can be used to replace 3 bytes of data. LIN-UART • • • • 8/12-bit A/D converter A wide range of communication speed can be selected by a dedicated reload timer. It has a full duplex double buffer. Both clock synchronous serial data transfer and clock asynchronous serial data transfer are enabled. The LIN function can be used as a LIN master or a LIN slave. 6 channels 8-bit or 12-bit resolution can be selected. 2 channels 8/16-bit composite timer • • • • The timer can be configured as an “8-bit timer × 2 channels” or a “16-bit timer × 1 channel”. It has the following functions: interval timer function, PWC function, PWM function and input capture function. Count clock: it can be selected from internal clocks (seven types) and external clocks. It can output square wave. 6 channels External interrupt On-chip debug • Interrupt by edge detection (The rising edge, falling edge, and both edges can be selected.) • It can be used to wake up the device from different standby modes. • 1-wire serial control • It supports serial writing (asynchronous mode). (Continued) Document Number: 002-04696 Rev. *B Page 4 of 105 MB95650L Series (Continued) Part number MB95F652E MB95F653E MB95F654E MB95F656E MB95F652L MB95F653L MB95F654L MB95F656L Parameter 1 channel (The channel can be used either as a UART/SIO channel or as an I2C bus interface channel.) UART/SIO I2C bus interface • Data transfer with UART/SIO is enabled. • It has a full duplex double buffer, variable data length (5/6/7/8 bits), an internal baud rate generator and an error detection function. • It uses the NRZ type transfer format. • LSB-first data transfer and MSB-first data transfer are available to use. • Both clock asynchronous (UART) serial data transfer and clock synchronous (SIO) serial data transfer are enabled. 2 channels (One of the two channels can be used either as an I2C bus interface channel or as a UART/SIO channel.) • Master/slave transmission and reception • It has the following functions: bus error function, arbitration function, transmission direction detection function, wake-up function, and functions of generating and detecting repeated START conditions. Watch prescaler Eight different time intervals can be selected. Flash memory • It supports automatic programming (Embedded Algorithm), and program/erase/erase-suspend/erase-resume commands. • It has a flag indicating the completion of the operation of Embedded Algorithm. • Flash security feature for protecting the content of the Flash memory Number of program/erase cycles Data retention time Standby mode 1000 20 years 10000 10 years 100000 5 years There are four standby modes as follows: • Stop mode • Sleep mode • Watch mode • Time-base timer mode Package Document Number: 002-04696 Rev. *B FPT-24P-M10 FPT-24P-M34 LCC-32P-M19 Page 5 of 105 MB95650L Series 2. Packages and Corresponding Products Part number MB95F652E MB95F653E MB95F654E MB95F656E MB95F652L MB95F653L MB95F654L MB95F656L Package FPT-24P-M10         FPT-24P-M34         LCC-32P-M19         : Available Document Number: 002-04696 Rev. *B Page 6 of 105 MB95650L Series 3. Differences among Products and Notes on Product Selection Current consumption When using the on-chip debug function, take account of the current consumption of Flash memory program/erase. For details of current consumption, see “18. Electrical Characteristics”. Package For details of information on each package, see “2. Packages and Corresponding Products” and “22. Package Dimension”. Operating voltage The operating voltage varies, depending on whether the on-chip debug function is used or not. For details of operating voltage, see “18. Electrical Characteristics”. On-chip debug function The on-chip debug function requires that VCC, VSS and one serial wire be connected to an evaluation tool. For details of the connection method, refer to “Chapter 20 Example Of Serial Programming Connection” in “New 8FX MB95650L Series Hardware Manual”. Document Number: 002-04696 Rev. *B Page 7 of 105 MB95650L Series 4. Pin Assignment PF0/X0 PF1/X1 Vss PG2/X1A PG1/X0A 24 23 P12/DBG/EC0 P07/INT07/TO10 3 4 (TOP VIEW) 22 21 P06/INT06/TO01 P05/INT05/AN05/TO00 5 6 TSSOP24 FPT-24P-M10 20 19 P04/INT04/AN04/SIN/EC0 P03/INT03/AN03/SOT 18 P02/INT02/AN02/SCK 17 P01/AN01 16 P00/AN00 15 P64/EC1 14 P14/SDA0 13 P15/SCL0 7 8 9 10 11 12 SOP24 FPT-24P-M34 32 31 30 29 28 27 26 25 PF0/X0 PF1/X1 NC NC NC NC P07/INT07/TO10 P12/DBG/EC0 Vcc C PF2/RST P17/SCL1/UI0 P16/SDA1/UO0 P62/TO10/UCK0 P63/TO11 1 2 Vss PG2/X1A 1 2 PG1/X0A Vcc 3 4 C 5 6 Document Number: 002-04696 Rev. *B QFN32 LCC-32P-M19 9 10 11 12 13 14 15 16 P15/SCL0 7 8 P63/TO11 P62/TO10/UCK0 NC NC NC NC P14/SDA0 PF2/RST P17/SCL1/UI0 P16/SDA1/UO0 (TOP VIEW) 24 23 22 21 P06/INT06/TO01 P05/INT05/AN05/TO00 P04/INT04/AN04/SIN/EC0 P03/INT03/AN03/SOT 20 19 18 17 P02/INT02/AN02/SCK P01/AN01 P00/AN00 P64/EC1 Page 8 of 105 MB95650L Series 5. Pin Functions Pin no. SOP24*1, TSSOP24*2 QFN32*3 1 32 2 31 3 1 Pin name PF0 X0 PF1 X1 VSS PG2 I/O circuit type*4 B B — General-purpose I/O port Main clock input oscillation pin General-purpose I/O port Main clock I/O oscillation pin Power supply pin (GND) General-purpose I/O port Input Output OD*5 PU*6 Hysteresis CMOS — — Hysteresis CMOS — — — — — — Hysteresis CMOS —  Hysteresis CMOS —  4 2 5 3 6 4 VCC — Power supply pin — — — — 7 5 C — Decoupling capacitor connection pin — — — — Hysteresis CMOS  — CMOS CMOS —/*7 — CMOS CMOS —/*7 — Hysteresis CMOS —  Hysteresis CMOS —  CMOS CMOS  — CMOS CMOS  — Hysteresis CMOS —  X1A PG1 X0A C I/O type Function C PF2 8 6 RST 10 11 7 8 10 SCL1 A 9 J 16 14 15 15 17 Reset pin Dedicated reset pin on MB95F652L/F653L/F654L/F656L I2C bus interface ch. 1 clock I/O pin UI0 UART/SIO ch. 0 data input pin P16 General-purpose I/O port SDA1 J I2C bus interface ch. 1 data I/O pin UO0 UART/SIO ch. 0 data output pin P62 General-purpose I/O port High-current pin TO10 D P63 P15 SCL0 P14 SDA0 D General-purpose I/O port High-current output 8/16-bit composite timer ch. 1 output pin I I P64 EC1 8/16-bit composite timer ch. 1 output pin UART/SIO ch. 0 clock I/O pin TO11 13 Subclock input oscillation pin General-purpose I/O port UCK0 12 General-purpose I/O port General-purpose I/O port P17 9 Subclock I/O oscillation pin General-purpose I/O port I2C bus interface ch. 0 clock I/O pin General-purpose I/O port I2C bus interface ch. 0 data I/O pin General-purpose I/O port D 8/16-bit composite timer ch. 1 clock input pin (Continued) Document Number: 002-04696 Rev. *B Page 9 of 105 MB95650L Series Pin no. SOP24*1, TSSOP24*2 QFN32*3 16 18 17 18 Pin name P00 AN00 P01 AN01 I/O circuit type*4 E E P02 18 19 20 21 20 21 22 23 INT02 AN02 24 E General-purpose I/O port 8/12-bit A/D converter analog input pin External interrupt input pin 8/12-bit A/D converter analog input pin LIN-UART clock I/O pin P03 General-purpose I/O port INT03 AN03 E External interrupt input pin 8/12-bit A/D converter analog input pin SOT LIN-UART data output pin P04 General-purpose I/O port INT04 External interrupt input pin AN04 8/12-bit A/D converter analog input pin SIN F LIN-UART data input pin EC0 8/16-bit composite timer ch. 0 clock input pin P05 General-purpose I/O port High-current pin INT05 K External interrupt input pin AN05 8/12-bit A/D converter analog input pin TO00 8/16-bit composite timer ch. 0 output pin INT06 D INT07 TO10 Output OD*5 PU*6 Hysteresis/ analog CMOS —  Hysteresis/ analog CMOS —  Hysteresis/ analog CMOS —  Hysteresis/ analog CMOS —  CMOS/ analog CMOS —  Hysteresis/ analog CMOS —  General-purpose I/O port High-current pin External interrupt input pin Hysteresis CMOS —  Hysteresis CMOS —  8/16-bit composite timer ch. 0 output pin P07 26 8/12-bit A/D converter analog input pin SCK TO01 23 General-purpose I/O port Input General-purpose I/O port P06 22 I/O type Function K General-purpose I/O port High-current pin External interrupt input pin 8/16-bit composite timer ch. 1 output pin (Continued) Document Number: 002-04696 Rev. *B Page 10 of 105 MB95650L Series (Continued) Pin no. 1 SOP24* , TSSOP24*2 QFN32*3 Pin name P12 24 25 DBG I/O type I/O circuit type*4 Function Input Output OD*5 PU*6 Hysteresis CMOS  — — — — — General-purpose I/O port H EC0 DBG input pin 8/16-bit composite timer ch. 0 clock input pin 11 12 13 — 14 27 NC — It is an internally connected pin. Always leave it unconnected. 28 29 30 : Available *1: FPT-24P-M34 *2: FPT-24P-M10 *3: LCC-32P-M19 *4: For the I/O circuit types, see “6. I/O Circuit Type”. *5: N-ch open drain *6: Pull-up *7: In I2C mode, the pin becomes an N-ch open drain pin. Document Number: 002-04696 Rev. *B Page 11 of 105 MB95650L Series 6. I/O Circuit Type Type Circuit Remarks Reset input / Hysteresis input A Reset output / Digital output • N-ch open drain output • Hysteresis input • Reset output N-ch P-ch Port select Digital output N-ch Digital output Standby control Hysteresis input Clock input X1 B X0 • CMOS output • Hysteresis input Standby control / Port select P-ch • Oscillation circuit • High-speed side Feedback resistance: approx. 1 M Port select Digital output N-ch Digital output Standby control Hysteresis input Port select R Pull-up control P-ch P-ch Digital output N-ch Digital output Standby control Hysteresis input Clock input X1A C • Oscillation circuit • Low-speed side Feedback resistance: approx. 5 M • CMOS output • Hysteresis input • Pull-up control X0A Standby control / Port select Port select R Pull-up control Digital output P-ch Digital output N-ch Digital output Standby control Hysteresis input (Continued) Document Number: 002-04696 Rev. *B Page 12 of 105 MB95650L Series Type Circuit Remarks Pull-up control R P-ch D Digital output P-ch Digital output N-ch • • • • CMOS output Hysteresis input Pull-up control High current output • • • • CMOS output Hysteresis input Pull-up control Analog input • • • • CMOS output CMOS input Pull-up control Analog input Standby control Hysteresis input Pull-up control R P-ch Digital output P-ch Digital output E N-ch Analog input A/D control Standby control Hysteresis input Pull-up control R P-ch Digital output P-ch F Digital output N-ch Analog input A/D control Standby control CMOS input Standby control Hysteresis input H • N-ch open drain output • Hysteresis input Digital output N-ch Digital output I N-ch Standby control • N-ch open drain output • CMOS input CMOS input (Continued) Document Number: 002-04696 Rev. *B Page 13 of 105 MB95650L Series (Continued) Type Circuit Remarks I2C mode control Digital output J P-ch Digital output • CMOS output • CMOS input • N-ch open drain output in I2C mode N-ch Standby control CMOS input Pull-up control R P-ch Digital output P-ch K Digital output N-ch Analog input • • • • • CMOS output Hysteresis input Pull-up control Analog input High current output A/D control Standby control Hysteresis input Document Number: 002-04696 Rev. *B Page 14 of 105 MB95650L Series 7. Handling Precautions Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your Cypress semiconductor devices. 7.1 Precautions for Product Design This section describes precautions when designing electronic equipment using semiconductor devices. Absolute Maximum Ratings Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings. Recommended Operating Conditions Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical characteristics are warranted when operated within these ranges. Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their sales representative beforehand. Processing and Protection of Pins These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output functions. 1. Preventing Over-Voltage and Over-Current Conditions Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at the design stage. 2. Protection of Output Pins Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows. Such conditions if present for extended periods of time can damage the device. Therefore, avoid this type of connection. 3. Handling of Unused Input Pins Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be connected through an appropriate resistance to a power supply pin or ground pin. Latch-up Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is called latch-up. CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the following: 1. Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal noise, surge levels, etc. 2. Be sure that abnormal current flows do not occur during the power-on sequence. Observance of Safety Regulations and Standards Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the design of products. Fail-Safe Design Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Document Number: 002-04696 Rev. *B Page 15 of 105 MB95650L Series Precautions Related to Usage of Devices Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. 7.2 Precautions for Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you should only mount under Cypress’s recommended conditions. For detailed information about mount conditions, contact your sales representative. Lead Insertion Type Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or mounting by using a socket. Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Cypress recommended mounting conditions. If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be verified before mounting. Surface Mount Type Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges. You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Cypress ranking of recommended conditions. Lead-Free Packaging CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength may be reduced under some conditions of use. Storage of Semiconductor Devices Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following: 1. Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in locations where temperature changes are slight. 2. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C and 30°C. When you open Dry Package that recommends humidity 40% to 70% relative humidity. 3. When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage. 4. Avoid storing packages where they are exposed to corrosive gases or high levels of dust. Baking Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended conditions for baking. Condition: 125°C/24 h Document Number: 002-04696 Rev. *B Page 16 of 105 MB95650L Series Static Electricity Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: 1. Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be needed to remove electricity. 2. Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment. 3. Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1 MΩ). Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. 4. Ground all fixtures and instruments, or protect with anti-static measures. 5. Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies. 7.3 Precautions for Use Environment Reliability of semiconductor devices depends on ambient temperature and other conditions as described above. For reliable performance, do the following: 1. Humidity Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are anticipated, consider anti-humidity processing. 2. Discharge of Static Electricity When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases, use anti-static measures or processing to prevent discharges. 3. Corrosive Gases, Dust, or Oil Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices. 4. Radiation, Including Cosmic Radiation Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide shielding as appropriate. 5. Smoke, Flame CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices begin to smoke or burn, there is danger of the release of toxic gases. Customers considering the use of Cypress products in other special environmental conditions should consult with sales representatives. Document Number: 002-04696 Rev. *B Page 17 of 105 MB95650L Series 8. Notes On Device Handling Preventing latch-ups When using the device, ensure that the voltage applied does not exceed the maximum voltage rating. In a CMOS IC, if a voltage higher than VCC or a voltage lower than VSS is applied to an input/output pin that is neither a medium-withstand voltage pin nor a high-withstand voltage pin, or if a voltage out of the rating range of power supply voltage mentioned in “18.1 Absolute Maximum Ratings” of “18. Electrical Characteristics” is applied to the VCC pin or the VSS pin, a latch-up may occur. When a latch-up occurs, power supply current increases significantly, which may cause a component to be thermally destroyed. Stabilizing supply voltage Supply voltage must be stabilized. A malfunction may occur when power supply voltage fluctuates rapidly even though the fluctuation is within the guaranteed operating range of the VCC power supply voltage. As a rule of voltage stabilization, suppress voltage fluctuation so that the fluctuation in VCC ripple (p-p value) at the commercial frequency (50 Hz/60 Hz) does not exceed 10% of the standard VCC value, and the transient fluctuation rate does not exceed 0.1 V/ms at a momentary fluctuation such as switching the power supply. Notes on using the external clock When an external clock is used, oscillation stabilization wait time is required for power-on reset, wake-up from subclock mode or stop mode. Document Number: 002-04696 Rev. *B Page 18 of 105 MB95650L Series 9. Pin Connection Treatment of unused pins If an unused input pin is left unconnected, a component may be permanently damaged due to malfunctions or latch-ups. Always pull up or pull down an unused input pin through a resistor of at least 2 k. Set an unused input/output pin to the output state and leave it unconnected, or set it to the input state and treat it the same as an unused input pin. If there is an unused output pin, leave it unconnected. Power supply pins To reduce unnecessary electro-magnetic emission, prevent malfunctions of strobe signals due to an increase in the ground level, and conform to the total output current standard, always connect the VCC pin and the VSS pin to the power supply and ground outside the device. In addition, connect the current supply source to the VCC pin and the VSS pin with low impedance. It is also advisable to connect a ceramic capacitor of approximately 1.0 µF as a bypass capacitor between the VCC pin and the VSS pin at a location close to this device. DBG pin Connect the DBG pin to an external pull-up resistor of 2 k or above. After power-on, ensure that the DBG pin does not stay at “L” level until the reset output is released. The DBG pin becomes a communication pin in debug mode. Since the actual pull-up resistance depends on the tool used and the interconnection length, refer to the tool document when selecting a pull-up resistor. RST pin Connect the RST pin to an external pull-up resistor of 2 k or above. To prevent the device from unintentionally entering the reset mode due to noise, minimize the interconnection length between a pull-up resistor and the RST pin and that between a pull-up resistor and the VCC pin when designing the layout of the printed circuit board. The PF2/RST pin functions as the reset input/output pin after power-on. In addition, the reset output of the PF2/RST pin can be enabled by the RSTOE bit in the SYSC register, and the reset input function and the general purpose I/O function can be selected by the RSTEN bit in the SYSC register. C pin Use a ceramic capacitor or a capacitor with equivalent frequency characteristics. The decoupling capacitor for the VCC pin must have a capacitance equal to or larger than the capacitance of CS. For the connection to a decoupling capacitor CS, see the diagram below. To prevent the device from unintentionally entering a mode to which the device is not set to transit due to noise, minimize the distance between the C pin and CS and the distance between CS and the VSS pin when designing the layout of a printed circuit board. DBG/RST/C pins connection diagram DBG C RST Cs Note on serial communication In serial communication, reception of wrong data may occur due to noise or other causes. Therefore, design a printed circuit board to prevent noise from occurring. Taking account of the reception of wrong data, take measures such as adding a checksum to the end of data in order to detect errors. If an error is detected, retransmit the data. Document Number: 002-04696 Rev. *B Page 19 of 105 MB95650L Series 10. Block Diagram F2MC-8FX CPU PF2*1/RST*2 Reset with LVD Dual operation Flash with security function (36/20/12/8 Kbyte) PF0/X0*2 PF1/X1*2 PG1/X0A*2 Oscillator circuit CR oscillator RAM (1024/512/256 bytes) PG2/X1A*2 (P05/TO00) Clock control 8/16-bit composite timer ch. 0 (P06/TO01) (P04/EC0), P12*1/EC0 On-chip debug Wild register P02/INT02 to P07/INT07 External interrupt C (P00/AN00 to P05*3/AN05) (P62*3/TO10), P62*3/TO10 8/16-bit composite timer ch. 1 P63*3/TO11 P64/EC1 I2C bus interface ch. 0 8/12-bit A/D converter I2C bus interface ch. 1 (P04/SIN) (P03/SOT) Internal bus (P12*1/DBG) P14*1/SDA0 P15*1/SCL0 (P16/SDA1) (P17/SCL1) LIN-UART (P02/SCK) P17/UI0 UART/SIO ch. 0 P16/UO0 P62/UCK0 Port Port Vcc Vss *1: P12, P14, P15 and PF2 are N-ch open drain pins. *2: Software select *3: P05 to P07, P62 and P63 are high-current pins. Note: Pins in parentheses indicate that those pins are shared among different peripheral functions. Document Number: 002-04696 Rev. *B Page 20 of 105 MB95650L Series 11. CPU Core Memory space The memory space of the MB95650L Series is 64 Kbyte in size, and consists of an I/O area, an extended I/O area, a data area, and a program area. The memory space includes areas intended for specific purposes such as general-purpose registers and a vector table. The memory maps of the MB95650L Series are shown below. Memory maps MB95F652E/F652L 0x0000 0x0080 0x0090 0x0100 0x0190 I/O area Access prohibited RAM 256 bytes Registers MB95F653E/F653L 0x0000 0x0080 0x0090 0x0100 0x0200 I/O area Access prohibited RAM 512 bytes Registers MB95F654E/F654L 0x0000 0x0080 0x0090 0x0100 0x0200 I/O area Access prohibited RAM 1024 bytes Registers MB95F656E/F656L 0x0000 0x0080 0x0090 0x0100 0x0200 I/O area Access prohibited RAM 1024 bytes Registers 0x0290 Access prohibited Access prohibited 0x0490 0x0490 Access prohibited 0x0F80 0x0F80 0x0F80 Flash memory 4 Kbyte Flash memory 4 Kbyte Flash memory 4 Kbyte 0x2000 0x2000 0x2000 0x2000 Extended I/O area 0x1000 0x1000 0x1000 Flash memory 4 Kbyte 0x0F80 Extended I/O area Extended I/O area Extended I/O area 0x1000 Access prohibited Access prohibited Access prohibited 0x8000 Access prohibited Access prohibited 0xC000 Flash memory 32 Kbyte Flash memory 16 Kbyte 0xE000 Flash memory 8 Kbyte 0xF000 Flash memory 4 Kbyte 0xFFFF 0xFFFF Document Number: 002-04696 Rev. *B 0xFFFF 0xFFFF Page 21 of 105 MB95650L Series 12. Memory Space The memory space of the MB95650L Series is 64 Kbyte in size, and consists of an I/O area, an extended I/O area, a data area, and a program area. The memory space includes areas for specific applications such as general-purpose registers and a vector table. I/O area (addresses: 0x0000 to 0x007F) • This area contains the control registers and data registers for built-in peripheral functions. • As the I/O area forms part of the memory space, it can be accessed in the same way as the memory. It can also be accessed at high-speed by using direct addressing instructions. Extended I/O area (addresses: 0x0F80 to 0x0FFF) • This area contains the control registers and data registers for built-in peripheral functions. • As the extended I/O area forms part of the memory space, it can be accessed in the same way as the memory. Data area • • • • • • • • • Static RAM is incorporated in the data area as the internal data area. The internal RAM size varies according to product. The RAM area from 0x0090 to 0x00FF can be accessed at high-speed by using direct addressing instructions. In MB95F656E/F656L, the area from 0x0090 to 0x047F is an extended direct addressing area. It can be accessed at high-speed by direct addressing instructions with a direct bank pointer set. In MB95F654E/F654L, the area from 0x0090 to 0x047F is an extended direct addressing area. It can be accessed at high-speed by direct addressing instructions with a direct bank pointer set. In MB95F653E/F653L, the area from 0x0090 to 0x028F is an extended direct addressing area. It can be accessed at high-speed by direct addressing instructions with a direct bank pointer set. In MB95F652E/F652L, the area from 0x0090 to 0x018F is an extended direct addressing area. It can be accessed at high-speed by direct addressing instructions with a direct bank pointer set. In MB95F653E/F653L/F654E/F654L/F656E/F656L, the area from 0x0100 to 0x01FF can be used as a general-purpose register area. In MB95F652E/F652L, the area from 0x0100 to 0x018F can be used as a general-purpose register area. Program area • • • • The Flash memory is incorporated in the program area as the internal program area. The Flash memory size varies according to product. The area from 0xFFC0 to 0xFFFF is used as the vector table. The area from 0xFFBB to 0xFFBF is used to store data of the non-volatile register. Document Number: 002-04696 Rev. *B Page 22 of 105 MB95650L Series Memory space map 0x0000 0x0080 0x0090 0x0100 I/O area Direct addressing area Access prohibited Registers (General-purpose register area) Extended direct addressing area 0x0200 Data area 0x047F 0x048F 0x0490 Access prohibited 0x0F80 0x0FFF 0x1000 Extended I/O area Program area 0xFFC0 0xFFFF Document Number: 002-04696 Rev. *B Vector table area Page 23 of 105 MB95650L Series 13. Areas for Specific Applications The general-purpose register area and vector table area are used for the specific applications. General-purpose register area (Addresses: 0x0100 to 0x01FF*1) • This area contains the auxiliary registers used for 8-bit arithmetic operations, transfer, etc. • As this area forms part of the RAM area, it can also be used as conventional RAM. • When the area is used as general-purpose registers, general-purpose register addressing enables high-speed access with short instructions. Non-volatile register data area (Addresses: 0xFFBB to 0xFFBF) • The area from 0xFFBB to 0xFFBF is used to store data of the non-volatile register. For details, refer to “Chapter 23 Non-volatile Register (NVR) Interface” in “New 8FX MB95650L Series Hardware Manual”. Vector table area (Addresses: 0xFFC0 to 0xFFFF) • This area is used as the vector table for vector call instructions (CALLV), interrupts, and resets. • The top of the Flash memory area is allocated to the vector table area. The start address of a service routine is set to an address in the vector table in the form of data. “16. Interrupt Source Table” lists the vector table addresses corresponding to vector call instructions, interrupts, and resets. For details, refer to “Chapter 4 Reset”, “Chapter 5 Interrupts” and “A.2 Special Instruction Special Instruction CALLV #vct” in “New 8FX MB95650L Series Hardware Manual”. Direct bank pointer and access area Direct bank pointer (DP[2:0]) Operand-specified dir Access area 0bXXX (It does not affect mapping.) 0x0000 to 0x007F 0x0000 to 0x007F 0b000 (Initial value) 0x0090 to 0x00FF 0x0090 to 0x00FF 0b001 0x0100 to 0x017F 0b010 0x0180 to 0x01FF*1 0b011 0b100 0x0200 to 0x027F 0x0080 to 0x00FF 0x0280 to 0x02FF*2 0b101 0x0300 to 0x037F 0b110 0x0380 to 0x03FF 0b111 0x0400 to 0x047F *1: Due to the memory size limit, the available access area is up to “0x018F” in MB95F652E/F652L. *2: Due to the memory size limit, the available access area is up to “0x028F” in MB95F653E/F653L. Document Number: 002-04696 Rev. *B Page 24 of 105 MB95650L Series 14. I/O Map Address Register abbreviation 0x0000 PDR0 0x0001 0x0002 0x0003 R/W Initial value Port 0 data register R/W 0b00000000 DDR0 Port 0 direction register R/W 0b00000000 PDR1 Port 1 data register R/W 0b00000000 DDR1 Port 1 direction register R/W 0b00000000 0x0004 — 0x0005 WATR Register name — — Oscillation stabilization wait time setting register (Disabled) R/W 0b11111111 0x0006 PLLC PLL control register R/W 0b000X0000 0x0007 SYCC System clock control register R/W 0bXXX11011 0x0008 STBC Standby control register R/W 0b00000000 0x0009 RSRR Reset source register R/W 0b000XXXXX 0x000A TBTC Time-base timer control register R/W 0b00000000 0x000B WPCR Watch prescaler control register R/W 0b00000000 0x000C WDTC Watchdog timer control register R/W 0b00XX0000 0x000D SYCC2 System clock control register 2 R/W 0bXXXX0011 0x000E to 0x0015 — — — 0x0016 PDR6 Port 6 data register R/W 0b00000000 0x0017 DDR6 Port 6 direction register R/W 0b00000000 0x0018 to 0x0027 — — — 0x0028 PDRF Port F data register R/W 0b00000000 0x0029 DDRF Port F direction register R/W 0b00000000 (Disabled) (Disabled) 0x002A PDRG Port G data register R/W 0b00000000 0x002B DDRG Port G direction register R/W 0b00000000 0x002C PUL0 Port 0 pull-up register R/W 0b00000000 0x002D to 0x0032 — — — 0x0033 PUL6 R/W 0b00000000 0x0034 — — — (Disabled) Port 6 pull-up register (Disabled) 0x0035 PULG Port G pull-up register R/W 0b00000000 0x0036 T01CR1 8/16-bit composite timer 01 status control register 1 R/W 0b00000000 0x0037 T00CR1 8/16-bit composite timer 00 status control register 1 R/W 0b00000000 0x0038 T11CR1 8/16-bit composite timer 11 status control register 1 R/W 0b00000000 0x0039 T10CR1 8/16-bit composite timer 10 status control register 1 R/W 0b00000000 0x003A to 0x0048 — — — (Disabled) (Continued) Document Number: 002-04696 Rev. *B Page 25 of 105 MB95650L Series Address Register abbreviation 0x0049 EIC10 0x004A 0x004B 0x004C to 0x004E — 0x004F LVDC 0x0050 0x0051 0x0052 0x0053 0x0054 Register name R/W Initial value External interrupt circuit control register ch. 2/ch. 3 R/W 0b00000000 EIC20 External interrupt circuit control register ch. 4/ch. 5 R/W 0b00000000 EIC30 External interrupt circuit control register ch. 6/ch. 7 R/W 0b00000000 — — LVD control register R/W 0b00000100 SCR LIN-UART serial control register R/W 0b00000000 SMR LIN-UART serial mode register R/W 0b00000000 R/W 0b00001000 R/W 0b00000000 (Disabled) SSR LIN-UART serial status register RDR LIN-UART receive data register TDR LIN-UART transmit data register ESCR LIN-UART extended status control register R/W 0b00000100 0x0055 ECCR LIN-UART extended communication control register R/W 0b000000XX 0x0056 SMC10 UART/SIO serial mode control register 1 ch. 0 R/W 0b00000000 0x0057 SMC20 UART/SIO serial mode control register 2 ch. 0 R/W 0b00100000 0x0058 SSR0 UART/SIO serial status and data register ch. 0 R/W 0b00000001 R/W 0b00000000 R 0b00000000 — — R/W 0b00000000 0x0059 TDR0 UART/SIO serial output data register ch. 0 0x005A RDR0 UART/SIO serial input data register ch. 0 0x005B to 0x005F — 0x0060 IBCR00 0x0061 0x0062 IBCR10 IBSR0 (Disabled) I2C bus control register 0 ch. 0 I 2C bus control register 1 ch. 0 R/W 0b00000000 I 2C bus status register ch. 0 R/W 0b00000000 2C 0x0063 IDDR0 I data register ch. 0 R/W 0b00000000 0x0064 IAAR0 I2C address register ch. 0 R/W 0b00000000 0x0065 0x0066 ICCR0 IBCR01 I 2C clock control register ch. 0 R/W 0b00000000 I 2C bus control register 0 ch. 1 R/W 0b00000000 2C bus control register 1 ch. 1 R/W 0b00000000 R/W 0b00000000 0x0067 IBCR11 I 0x0068 IBSR1 I2C bus status register ch. 1 0x0069 0x006A IDDR1 IAAR1 I 2C data register ch. 1 R/W 0b00000000 I 2C address register ch. 1 R/W 0b00000000 2C clock control register ch. 1 0x006B ICCR1 I R/W 0b00000000 0x006C ADC1 8/12-bit A/D converter control register 1 R/W 0b00000000 0x006D ADC2 8/12-bit A/D converter control register 2 R/W 0b00000000 0x006E ADDH 8/12-bit A/D converter data register (upper) R/W 0b00000000 0x006F ADDL 8/12-bit A/D converter data register (lower) R/W 0b00000000 0x0070 ADC3 8/12-bit A/D converter control register 3 R/W 0b01111100 (Continued) Document Number: 002-04696 Rev. *B Page 26 of 105 MB95650L Series Address Register abbreviation 0x0071 FSR2 Register name R/W Initial value R/W 0b00000000 Flash memory status register R/W 0b000X0000 Flash memory sector write control register 0 R/W 0b00000000 Flash memory status register 2 0x0072 FSR 0x0073 SWRE0 0x0074 FSR3 Flash memory status register 3 R 0b000XXXXX 0x0075 FSR4 Flash memory status register 4 R/W 0b00000000 0x0076 WREN Wild register address compare enable register R/W 0b00000000 0x0077 WROR Wild register data test setting register R/W 0b00000000 0x0078 — — — 0x0079 ILR0 Interrupt level setting register 0 R/W 0b11111111 0x007A ILR1 Interrupt level setting register 1 R/W 0b11111111 0x007B ILR2 Interrupt level setting register 2 R/W 0b11111111 0x007C ILR3 Interrupt level setting register 3 R/W 0b11111111 0x007D ILR4 Interrupt level setting register 4 R/W 0b11111111 0x007E ILR5 Interrupt level setting register 5 R/W 0b11111111 0x007F — — — 0x0F80 WRARH0 Wild register address setting register (upper) ch. 0 R/W 0b00000000 0x0F81 WRARL0 Wild register address setting register (lower) ch. 0 R/W 0b00000000 0x0F82 WRDR0 Wild register data setting register ch. 0 R/W 0b00000000 0x0F83 WRARH1 Wild register address setting register (upper) ch. 1 R/W 0b00000000 0x0F84 WRARL1 Wild register address setting register (lower) ch. 1 R/W 0b00000000 0x0F85 WRDR1 Wild register data setting register ch. 1 R/W 0b00000000 0x0F86 WRARH2 Wild register address setting register (upper) ch. 2 R/W 0b00000000 0x0F87 WRARL2 Wild register address setting register (lower) ch. 2 R/W 0b00000000 0x0F88 WRDR2 Wild register data setting register ch. 2 R/W 0b00000000 0x0F89 to 0x0F91 — — — 0x0F92 T01CR0 8/16-bit composite timer 01 status control register 0 R/W 0b00000000 0x0F93 T00CR0 8/16-bit composite timer 00 status control register 0 R/W 0b00000000 0x0F94 T01DR 8/16-bit composite timer 01 data register R/W 0b00000000 0x0F95 T00DR 8/16-bit composite timer 00 data register R/W 0b00000000 0x0F96 TMCR0 8/16-bit composite timer 00/01 timer mode control register R/W 0b00000000 0x0F97 T11CR0 8/16-bit composite timer 11 status control register 0 R/W 0b00000000 0x0F98 T10CR0 8/16-bit composite timer 10 status control register 0 R/W 0b00000000 0x0F99 T11DR 8/16-bit composite timer 11 data register R/W 0b00000000 0x0F9A T10DR 8/16-bit composite timer 10 data register R/W 0b00000000 0x0F9B TMCR1 8/16-bit composite timer 10/11 timer mode control register R/W 0b00000000 Mirror of register bank pointer (RP) and direct bank pointer (DP) (Disabled) (Disabled) (Continued) Document Number: 002-04696 Rev. *B Page 27 of 105 MB95650L Series (Continued) Address Register abbreviation Register name R/W Initial value 0x0F9C to 0x0FBB — (Disabled) — — 0x0FBC BGR1 LIN-UART baud rate generator register 1 R/W 0b00000000 0x0FBD BGR0 LIN-UART baud rate generator register 0 R/W 0b00000000 0x0FBE PSSR0 UART/SIO dedicated baud rate generator prescaler select register ch. 0 R/W 0b00000000 0x0FBF BRSR0 UART/SIO dedicated baud rate generator baud rate setting register ch. 0 R/W 0b00000000 0x0FC0 to 0x0FC2 — — — 0x0FC3 AIDRL R/W 0b00000000 0x0FC4 to 0x0FE3 — — — 0x0FE4 CRTH Main CR clock trimming register (upper) R/W 0b000XXXXX 0x0FE5 CRTL Main CR clock trimming register (lower) R/W 0b000XXXXX 0x0FE6 SYSC2 System configuration register 2 R/W 0b00000000 0x0FE7 CRTDA Main CR clock temperature dependent adjustment register R/W 0b000XXXXX 0x0FE8 SYSC System configuration register R/W 0b00111111 (Disabled) A/D input disable register (lower) (Disabled) 0x0FE9 CMCR Clock monitoring control register R/W 0b00000000 0x0FEA CMDR Clock monitoring data register R 0b00000000 0x0FEB WDTH Watchdog timer selection ID register (upper) R 0bXXXXXXXX 0x0FEC WDTL Watchdog timer selection ID register (lower) R 0bXXXXXXXX 0x0FED to 0x0FFF — — — (Disabled) R/W access symbols R/W R : Readable/Writable : Read only Initial value symbols 0 1 X : The initial value of this bit is “0”. : The initial value of this bit is “1”. : The initial value of this bit is undefined. Note: Do not write to an address that is “(Disabled)”. If a “(Disabled)” address is read, an indeterminate value is returned. Document Number: 002-04696 Rev. *B Page 28 of 105 MB95650L Series 15. I/O Ports List of port registers Read/Write Initial value Port 0 data register Register name PDR0 R, RM/W 0b00000000 Port 0 direction register DDR0 R/W 0b00000000 Port 1 data register PDR1 R, RM/W 0b00000000 Port 1 direction register DDR1 R/W 0b00000000 Port 6 data register PDR6 R, RM/W 0b00000000 Port 6 direction register DDR6 R/W 0b00000000 Port F data register PDRF R, RM/W 0b00000000 Port F direction register DDRF R/W 0b00000000 Port G data register PDRG R, RM/W 0b00000000 Port G direction register DDRG R/W 0b00000000 Port 0 pull-up register PUL0 R/W 0b00000000 Port 6 pull-up register PUL6 R/W 0b00000000 Port G pull-up register PULG R/W 0b00000000 A/D input disable register (lower) AIDRL R/W 0b00000000 R/W : Readable/writable (The read value is the same as the write value.) R, RM/W : Readable/writable (The read value is different from the write value. The write value is read by the read-modify-write (RMW) type of instruction.) Document Number: 002-04696 Rev. *B Page 29 of 105 MB95650L Series 15.1 Port 0 Port 0 is a general-purpose I/O port. This section focuses on its functions as a general-purpose I/O port. For details of peripheral functions, refer to their respective chapters in “New 8FX MB95650L Series Hardware Manual”. 15.1.1 Port 0 configuration Port 0 is made up of the following elements. • General-purpose I/O pins/peripheral function I/O pins • Port 0 data register (PDR0) • Port 0 direction register (DDR0) • Port 0 pull-up register (PUL0) • A/D input disable register (lower) (AIDRL) 15.1.2 Block diagrams of port 0 P00/AN00 pin This pin has the following peripheral function: • 8/12-bit A/D converter analog input pin (AN00) P01/AN01 pin This pin has the following peripheral function: • 8/12-bit A/D converter analog input pin (AN01) Block diagram of P00/AN00 and P01/AN01 A/D analog input Hysteresis 0 Pull-up 1 PDR0 read PDR0 Pin PDR0 write Internal bus Executing bit manipulation instruction DDR0 read DDR0 DDR0 write Stop mode, watch mode (SPL = 1) PUL0 read PUL0 PUL0 write AIDRL read AIDRL AIDRL write Document Number: 002-04696 Rev. *B Page 30 of 105 MB95650L Series P02/INT02/AN02/SCK pin This pin has the following peripheral functions: • External interrupt input pin (INT02) • 8/12-bit A/D converter analog input pin (AN02) • LIN-UART clock I/O pin (SCK) P03/INT03/AN03/SOT pin This pin has the following peripheral functions: • External interrupt input pin (INT03) • 8/12-bit A/D converter analog input pin (AN03) • LIN-UART data output pin (SOT) P05/INT05/AN05/TO00 pin This pin has the following peripheral functions: • External interrupt input pin (INT05) • 8/12-bit A/D converter analog input pin (AN05) • 8/16-bit composite timer ch. 0 output pin (TO00) Block diagram of P02/INT02/AN02/SCK, P03/INT03/AN03/SOT and P05/INT05/AN05/TO00 Peripheral function input Peripheral function input enable (INT02, INT03 and INT05) Peripheral function output enable Peripheral function output A/D analog input Hysteresis Pull-up 0 1 PDR0 read 1 PDR0 0 Pin PDR0 write Internal bus Executing bit manipulation instruction DDR0 read DDR0 DDR0 write Stop mode, watch mode (SPL = 1) PUL0 read PUL0 PUL0 write AIDRL read AIDRL AIDRL write Document Number: 002-04696 Rev. *B Page 31 of 105 MB95650L Series P04/INT04/AN04/SIN/EC0 pin This pin has the following peripheral functions: • External interrupt input pin (INT04) • 8/12-bit A/D converter analog input pin (AN04) • LIN-UART data input pin (SIN) • 8/16-bit composite timer ch. 0 clock input pin (EC0) Block diagram of P04/INT04/AN04/SIN/EC0 Peripheral function input Peripheral function input enable (INT04) A/D analog input 0 1 Pull-up CMOS PDR0 read PDR0 Pin PDR0 write Internal bus Executing bit manipulation instruction DDR0 read DDR0 DDR0 write Stop mode, watch mode (SPL = 1) PUL0 read PUL0 PUL0 write AIDRL read AIDRL AIDRL write Document Number: 002-04696 Rev. *B Page 32 of 105 MB95650L Series P06/INT06/TO01 pin This pin has the following peripheral functions: • External interrupt input pin (INT06) • 8/16-bit composite timer ch. 0 output pin (TO01) P07/INT07/TO10 pin This pin has the following peripheral functions: • External interrupt input pin (INT07) • 8/16-bit composite timer ch. 1 output pin (TO10) Block diagram of P06/INT06/TO01 and P07/INT07/TO10 Peripheral function input Peripheral function input enable (INT06 and INT07) Peripheral function output enable Peripheral function output Hysteresis Pull-up 0 1 PDR0 read 1 PDR0 0 Pin PDR0 write Internal bus Executing bit manipulation instruction DDR0 read DDR0 DDR0 write Stop mode, watch mode (SPL = 1) PUL0 read PUL0 PUL0 write Document Number: 002-04696 Rev. *B Page 33 of 105 MB95650L Series 15.1.3 Port 0 registers Port 0 register functions Register abbreviation PDR0 DDR0 PUL0 AIDRL Data Read Read by read-modify-write (RMW) instruction Write 0 Pin state is “L” level. PDR0 value is “0”. As output port, outputs “L” level. 1 Pin state is “H” level. PDR0 value is “1”. As output port, outputs “H” level. 0 Port input enabled 1 Port output enabled 0 Pull-up disabled 1 Pull-up enabled 0 Analog input enabled 1 Port input enabled Correspondence between registers and pins for port 0 Correspondence between related register bits and pins Pin name P07 P06 bit7 bit6 - - P05 P04 P03 P02 P01 P00 bit5 bit4 bit3 bit2 bit1 bit0 PDR0 DDR0 PUL0 AIDRL Document Number: 002-04696 Rev. *B Page 34 of 105 MB95650L Series 15.1.4 Port 0 operations Operation as an output port • • • • • A pin becomes an output port if the bit in the DDR0 register corresponding to that pin is set to “1”. For a pin shared with other peripheral functions, disable the output of such peripheral functions. When a pin is used as an output port, it outputs the value of the PDR0 register to external pins. If data is written to the PDR0 register, the value is stored in the output latch and is output to the pin set as an output port as it is. Reading the PDR0 register returns the PDR0 register value. Operation as an input port • A pin becomes an input port if the bit in the DDR0 register corresponding to that pin is set to “0”. • For a pin shared with other peripheral functions, disable the output of such peripheral functions. • When using a pin shared with the analog input function as an input port, set the corresponding bit in the A/D input disable register (lower) (AIDRL) to “1”. • If data is written to the PDR0 register, the value is stored in the output latch but is not output to the pin set as an input port. • Reading the PDR0 register returns the pin value. However, if the read-modify-write (RMW) type of instruction is used to read the PDR0 register, the PDR0 register value is returned. Operation as a peripheral function output pin • A pin becomes a peripheral function output pin if the peripheral output function is enabled by setting the output enable bit of a peripheral function corresponding to that pin. • The pin value can be read from the PDR0 register even if the peripheral function output is enabled. Therefore, the output value of a peripheral function can be read by the read operation on the PDR0 register. However, if the read-modify-write (RMW) type of instruction is used to read the PDR0 register, the PDR0 register value is returned. Operation as a peripheral function input pin • To set a pin as an input port, set the bit in the DDR0 register corresponding to the input pin of a peripheral function to “0”. • When using a pin shared with the analog input function as another peripheral function input pin, configure it as an input port by setting the bit in the AIDRL register corresponding to that pin to “1”. • Reading the PDR0 register returns the pin value, regardless of whether the peripheral function uses that pin as its input pin. However, if the read-modify-write (RMW) type of instruction is used to read the PDR0 register, the PDR0 register value is returned. Operation at reset If the CPU is reset, all bits in the DDR0 register are initialized to “0” and port input is enabled. As for a pin shared with analog input, its port input is disabled because the AIDRL register is initialized to “0”. Operation in stop mode and watch mode • If the pin state setting bit in the standby control register (STBC:SPL) is set to “1” and the device transits to stop mode or watch mode, the pin is compulsorily made to enter the high impedance state regardless of the DDR0 register value. The input of that pin is locked to “L” level and blocked in order to prevent leaks due to input open. However, if the interrupt input is enabled for the external interrupt (INT02 to INT07), the input is enabled and not blocked. • If the pin state setting bit is “0”, the state of the port I/O or that of the peripheral function I/O remains unchanged and the output level is maintained. Operation as an analog input pin • Set the bit in the DDR0 register bit corresponding to the analog input pin to “0” and the bit corresponding to that pin in the AIDRL register to “0”. • For a pin shared with other peripheral functions, disable the output of such peripheral functions. In addition, set the corresponding bit in the PUL0 register to “0”. Operation as an external interrupt input pin • Set the bit in the DDR0 register corresponding to the external interrupt input pin to “0”. • For a pin shared with other peripheral functions, disable the output of such peripheral functions. • The pin value is always input to the external interrupt circuit. When using a pin for a function other than the interrupt, disable the external interrupt function corresponding to that pin. Operation of the pull-up register Setting the bit in the PUL0 register to “1” makes the pull-up resistor be internally connected to the pin. When the pin output is “L” level, the pull-up resistor is disconnected regardless of the value of the PUL0 register. Document Number: 002-04696 Rev. *B Page 35 of 105 MB95650L Series 15.2 Port 1 Port 1 is a general-purpose I/O port. This section focuses on its functions as a general-purpose I/O port. For details of peripheral functions, refer to their respective chapters in “New 8FX MB95650L Series Hardware Manual”. 15.2.1 Port 1 configuration Port 1 is made up of the following elements. • General-purpose I/O pins/peripheral function I/O pins • Port 1 data register (PDR1) • Port 1 direction register (DDR1) 15.2.2 (2)Block diagrams of port 1 P12/DBG/EC0 pin This pin has the following peripheral functions: • DBG input pin (DBG) • 8/16-bit composite timer ch. 0 clock input pin (EC0) Block diagram of P12/DBG/EC0 Peripheral function input Hysteresis 0 1 PDR1 read Internal bus PDR1 Pin OD PDR1 write Executing bit manipulation instruction DDR1 read DDR1 DDR1 write Stop mode, watch mode (SPL = 1) Document Number: 002-04696 Rev. *B Page 36 of 105 MB95650L Series P14/SDA0 pin This pin has the following peripheral function: • I2C bus interface ch. 0 data I/O pin (SDA0) P15/SCL0 pin This pin has the following peripheral function: • I2C bus interface ch. 0 clock I/O pin (SCL0) Block diagram of P14/SDA0 and P15/SCL0 Peripheral function input Peripheral function input enable Peripheral function output enable Peripheral function output CMOS 0 1 PDR1 read Internal bus Pin 1 PDR1 0 OD PDR1 write Executing bit manipulation instruction DDR1 read DDR1 DDR1 write Stop mode, watch mode (SPL = 1) Document Number: 002-04696 Rev. *B Page 37 of 105 MB95650L Series P16/SDA1/UO0 pin This pin has the following peripheral functions: • I2C bus interface ch. 1 data I/O pin (SDA1) • UART/SIO ch. 0 data output pin (UO0) Block diagram of P16/SDA1/UO0 I2C_SEL bit in SYSC2 register UART/SIO function output enable UART/SIO function output I2C function input I2C function input enable I2C function output enable I2C function output 0 Peripheral function input enable Peripheral function output enable Peripheral function output 1 Peripheral function input 0 1 PDR1 read PDR1 Internal bus CMOS 1 P-ch 0 Pin PDR1 write Executing bit manipulation instruction N-ch DDR1 read DDR1 DDR1 write Stop mode, watch mode (SPL = 1) Document Number: 002-04696 Rev. *B Page 38 of 105 MB95650L Series P17/SCL1/UI0 pin This pin has the following peripheral functions: • I2C bus interface ch. 1 clock I/O pin (SCL1) • UART/SIO ch. 0 data input pin (UI0) Block diagram of P17/SCL1/UI0 I2C_SEL bit in SYSC2 register UART/SIO function input UART/SIO function input enable 0 Peripheral function input enable Peripheral function output enable Peripheral function output I2C function input I2C function input enable I2Cfunction output enable I2C function output 1 Peripheral function input 0 1 PDR1 read PDR1 Internal bus CMOS 1 P-ch 0 Pin PDR1 write Executing bit manipulation instruction N-ch DDR1 read DDR1 DDR1 write Stop mode, watch mode (SPL = 1) Document Number: 002-04696 Rev. *B Page 39 of 105 MB95650L Series 15.2.3 Port 1 registers Port 1 register functions Register abbreviation PDR1 DDR1 Data Read Read by read-modify-write (RMW) instruction Write 0 Pin state is “L” level. PDR1 value is “0”. As output port, outputs “L” level. 1 Pin state is “H” level. PDR1 value is “1”. As output port, outputs “H” level.* 0 Port input enabled 1 Port output enabled *: If the pin is an N-ch open drain pin, the pin state becomes Hi-Z. Correspondence between registers and pins for port 1 Correspondence between related register bits and pins Pin name PDR1 DDR1 P17 P16 P15 P14 - P12 - - bit7 bit6 bit5 bit4 - bit2 - - Document Number: 002-04696 Rev. *B Page 40 of 105 MB95650L Series 15.2.4 Port 1 operations Operation as an output port • • • • • A pin becomes an output port if the bit in the DDR1 register corresponding to that pin is set to “1”. For a pin shared with other peripheral functions, disable the output of such peripheral functions. When a pin is used as an output port, it outputs the value of the PDR1 register to external pins. If data is written to the PDR1 register, the value is stored in the output latch and is output to the pin set as an output port as it is. Reading the PDR1 register returns the PDR1 register value. Operation as an input port • • • • A pin becomes an input port if the bit in the DDR1 register corresponding to that pin is set to “0”. For a pin shared with other peripheral functions, disable the output of such peripheral functions. If data is written to the PDR1 register, the value is stored in the output latch but is not output to the pin set as an input port. Reading the PDR1 register returns the pin value. However, if the read-modify-write (RMW) type of instruction is used to read the PDR1 register, the PDR1 register value is returned. Operation as a peripheral function output pin • A pin becomes a peripheral function output pin if the peripheral output function is enabled by setting the output enable bit of a peripheral function corresponding to that pin. • The pin value can be read from the PDR1 register even if the peripheral function output is enabled. Therefore, the output value of a peripheral function can be read by the read operation on the PDR1 register. However, if the read-modify-write (RMW) type of instruction is used to read the PDR1 register, the PDR1 register value is returned. Operation as a peripheral function input pin • To set a pin as an input port, set the bit in the DDR1 register corresponding to the input pin of a peripheral function to “0”. • Reading the PDR1 register returns the pin value, regardless of whether the peripheral function uses that pin as its input pin. However, if the read-modify-write (RMW) type of instruction is used to read the PDR1 register, the PDR1 register value is returned. Operation at reset If the CPU is reset, all bits in the DDR1 register are initialized to “0” and port input is enabled. Operation in stop mode and watch mode • If the pin state setting bit in the standby control register (STBC:SPL) is set to “1” and the device transits to stop mode or watch mode, the pin is compulsorily made to enter the high impedance state regardless of the DDR1 register value. The input of that pin is locked to “L” level and blocked in order to prevent leaks due to input open. • If the pin state setting bit is “0”, the state of the port I/O or that of the peripheral function I/O remains unchanged and the output level is maintained. Document Number: 002-04696 Rev. *B Page 41 of 105 MB95650L Series 15.3 Port 6 Port 6 is a general-purpose I/O port. This section focuses on its functions as a general-purpose I/O port. For details of peripheral functions, refer to their respective chapters in “New 8FX MB95650L Series Hardware Manual”. 15.3.1 Port 6 configuration Port 6 is made up of the following elements. • General-purpose I/O pins/peripheral function I/O pins • Port 6 data register (PDR6) • Port 6 direction register (DDR6) • Port 6 pull-up register (PUL6) 15.3.2 Block diagrams of port 6 P62/TO10/UCK0 pin This pin has the following peripheral functions: • 8/16-bit composite timer ch. 1 output pin (TO10) • UART/SIO ch. 0 clock I/O pin (UCK0) P63/TO11 pin This pin has the following peripheral function: • 8/16-bit composite timer ch. 1 output pin (TO11) Block diagram of P62/TO10/UCK0 and P63/TO11 Peripheral function input Peripheral function input enable Peripheral function output enable Peripheral function output Hysteresis Pull-up 0 1 PDR6 read 1 PDR6 0 Pin PDR6 write Internal bus Executing bit manipulation instruction DDR6 read DDR6 DDR6 write Stop mode, watch mode (SPL = 1) PUL6 read PUL6 PUL6 write Document Number: 002-04696 Rev. *B Page 42 of 105 MB95650L Series P64/EC1 pin This pin has the following peripheral function: • 8/16-bit composite timer ch. 1 clock input pin (EC1) Block diagram of P64/EC1 Peripheral function input Hysteresis 0 1 PDR6 read Internal bus PDR6 Pin PDR6 write Executing bit manipulation instruction DDR6 read DDR6 DDR6 write Stop mode, watch mode (SPL = 1) Document Number: 002-04696 Rev. *B Page 43 of 105 MB95650L Series 15.3.3 Port 6 registers Port 6 register functions Register abbreviation PDR6 DDR6 PUL6 Data Read Read by read-modify-write (RMW) instruction Write 0 Pin state is “L” level. PDR6 value is “0”. As output port, outputs “L” level. 1 Pin state is “H” level. PDR6 value is “1”. As output port, outputs “H” level.* 0 Port input enabled 1 Port output enabled 0 Pull-up disabled 1 Pull-up enabled *: If the pin is an N-ch open drain pin, the pin state becomes Hi-Z. Correspondence between registers and pins for port 6 Correspondence between related register bits and pins Pin name - - - P64 P63 P62 - - - - - bit4 bit3 bit2 - - PDR6 DDR6 PUL6 Document Number: 002-04696 Rev. *B Page 44 of 105 MB95650L Series 15.3.4 Port 6 operations Operation as an output port • • • • • A pin becomes an output port if the bit in the DDR6 register corresponding to that pin is set to “1”. For a pin shared with other peripheral functions, disable the output of such peripheral functions. When a pin is used as an output port, it outputs the value of the PDR6 register to external pins. If data is written to the PDR6 register, the value is stored in the output latch and is output to the pin set as an output port as it is. Reading the PDR6 register returns the PDR6 register value. Operation as an input port • • • • A pin becomes an input port if the bit in the DDR6 register corresponding to that pin is set to “0”. For a pin shared with other peripheral functions, disable the output of such peripheral functions. If data is written to the PDR6 register, the value is stored in the output latch but is not output to the pin set as an input port. Reading the PDR6 register returns the pin value. However, if the read-modify-write (RMW) type of instruction is used to read the PDR6 register, the PDR6 register value is returned. Operation as a peripheral function output pin • A pin becomes a peripheral function output pin if the peripheral output function is enabled by setting the output enable bit of a peripheral function corresponding to that pin. • The pin value can be read from the PDR6 register even if the peripheral function output is enabled. Therefore, the output value of a peripheral function can be read by the read operation on the PDR6 register. However, if the read-modify-write (RMW) type of instruction is used to read the PDR6 register, the PDR6 register value is returned. Operation as a peripheral function input pin • To set a pin as an input port, set the bit in the DDR6 register corresponding to the input pin of a peripheral function to “0”. • Reading the PDR6 register returns the pin value, regardless of whether the peripheral function uses that pin as its input pin. However, if the read-modify-write (RMW) type of instruction is used to read the PDR6 register, the PDR6 register value is returned. Operation at reset If the CPU is reset, all bits in the DDR6 register are initialized to “0” and port input is enabled. Operation in stop mode and watch mode • If the pin state setting bit in the standby control register (STBC:SPL) is set to “1” and the device transits to stop mode or watch mode, the pin is compulsorily made to enter the high impedance state regardless of the DDR6 register value. The input of that pin is locked to “L” level and blocked in order to prevent leaks due to input open. • If the pin state setting bit is “0”, the state of the port I/O or that of the peripheral function I/O remains unchanged and the output level is maintained. Operation of the pull-up register Setting the bit in the PUL6 register to “1” makes the pull-up resistor be internally connected to the pin. When the pin output is “L” level, the pull-up resistor is disconnected regardless of the value of the PUL6 register. Document Number: 002-04696 Rev. *B Page 45 of 105 MB95650L Series 15.4 Port F Port F is a general-purpose I/O port. This section focuses on its functions as a general-purpose I/O port. For details of peripheral functions, refer to their respective chapters in “New 8FX MB95650L Series Hardware Manual”. 15.4.1 Port F configuration Port F is made up of the following elements. • General-purpose I/O pins/peripheral function I/O pins • Port F data register (PDRF) • Port F direction register (DDRF) 15.4.2 Block diagrams of port F PF0/X0 pin This pin has the following peripheral function: • Main clock input oscillation pin (X0) PF1/X1 pin This pin has the following peripheral function: • Main clock I/O oscillation pin (X1) Block diagram of PF0/X0 and PF1/X1 Hysteresis 0 1 PDRF read Internal bus PDRF Pin PDRF write Executing bit manipulation instruction DDRF read DDRF DDRF write Stop mode, watch mode (SPL = 1) Document Number: 002-04696 Rev. *B Page 46 of 105 MB95650L Series PF2/RST pin This pin has the following peripheral function: • Reset pin (RST) Block diagram of PF2/RST Reset input Reset input enable Reset output enable Reset output Hysteresis 0 1 PDRF read Internal bus Pin 1 PDRF 0 OD PDRF write Executing bit manipulation instruction DDRF read DDRF DDRF write Stop mode, watch mode (SPL = 1) Document Number: 002-04696 Rev. *B Page 47 of 105 MB95650L Series 15.4.3 Port F registers Port F register functions Register abbreviation PDRF DDRF Data Read Read by read-modify-write (RMW) instruction Write 0 Pin state is “L” level. PDRF value is “0”. As output port, outputs “L” level. 1 Pin state is “H” level. PDRF value is “1”. As output port, outputs “H” level.* 0 Port input enabled 1 Port output enabled *: If the pin is an N-ch open drain pin, the pin state becomes Hi-Z. Correspondence between registers and pins for port F Correspondence between related register bits and pins Pin name PDRF DDRF - - - - - PF2* PF1 PF0 - - - - - bit2 bit1 bit0 *: PF2/RST is the dedicated reset pin on MB95F652L/F653L/F654L/F656L. Document Number: 002-04696 Rev. *B Page 48 of 105 MB95650L Series 15.4.4 Port F operations Operation as an output port • • • • • A pin becomes an output port if the bit in the DDRF register corresponding to that pin is set to “1”. For a pin shared with other peripheral functions, disable the output of such peripheral functions. When a pin is used as an output port, it outputs the value of the PDRF register to external pins. If data is written to the PDRF register, the value is stored in the output latch and is output to the pin set as an output port as it is. Reading the PDRF register returns the PDRF register value. Operation as an input port • • • • A pin becomes an input port if the bit in the DDRF register corresponding to that pin is set to “0”. For a pin shared with other peripheral functions, disable the output of such peripheral functions. If data is written to the PDRF register, the value is stored in the output latch but is not output to the pin set as an input port. Reading the PDRF register returns the pin value. However, if the read-modify-write (RMW) type of instruction is used to read the PDRF register, the PDRF register value is returned. Operation at reset If the CPU is reset, all bits in the DDRF register are initialized to “0” and port input is enabled. Operation in stop mode and watch mode • If the pin state setting bit in the standby control register (STBC:SPL) is set to “1” and the device transits to stop mode or watch mode, the pin is compulsorily made to enter the high impedance state regardless of the DDRF register value. The input of that pin is locked to “L” level and blocked in order to prevent leaks due to input open. • If the pin state setting bit is “0”, the state of the port I/O or that of the peripheral function I/O remains unchanged and the output level is maintained. Document Number: 002-04696 Rev. *B Page 49 of 105 MB95650L Series 15.5 Port G Port G is a general-purpose I/O port. This section focuses on its functions as a general-purpose I/O port. For details of peripheral functions, refer to their respective chapters in “New 8FX MB95650L Series Hardware Manual”. 15.5.1 Port G configuration Port G is made up of the following elements. • General-purpose I/O pins/peripheral function I/O pins • Port G data register (PDRG) • Port G direction register (DDRG) • Port G pull-up register (PULG) 15.5.2 Block diagram of port G PG1/X0A pin This pin has the following peripheral function: • Subclock input oscillation pin (X0A) PG2/X1A pin This pin has the following peripheral function: • Subclock I/O oscillation pin (X1A) Block diagram of PG1/X0A and PG2/X1A Hysteresis 0 Pull-up 1 PDRG read PDRG Pin PDRG write Internal bus Executing bit manipulation instruction DDRG read DDRG DDRG write Stop mode, watch mode (SPL = 1) PULG read PULG PULG write Document Number: 002-04696 Rev. *B Page 50 of 105 MB95650L Series 15.5.3 Port G registers Port G register functions Register abbreviation PDRG DDRG PULG Data Read Read by read-modify-write (RMW) instruction Write 0 Pin state is “L” level. PDRG value is “0”. As output port, outputs “L” level. 1 Pin state is “H” level. PDRG value is “1”. As output port, outputs “H” level. 0 Port input enabled 1 Port output enabled 0 Pull-up disabled 1 Pull-up enabled Correspondence between registers and pins for port G Correspondence between related register bits and pins Pin name - - - - - PG2 PG1 - - - - - - bit2 bit1 - PDRG DDRG PULG Document Number: 002-04696 Rev. *B Page 51 of 105 MB95650L Series 15.5.4 Port G operations Operation as an output port • A pin becomes an output port if the bit in the DDRG register corresponding to that pin is set to “1”. • For a pin shared with other peripheral functions, disable the output of such peripheral functions. • When a pin is used as an output port, it outputs the value of the PDRG register to external pins. • If data is written to the PDRG register, the value is stored in the output latch and is output to the pin set as an output port as it is. • Reading the PDRG register returns the PDRG register value. Operation as an input port • A pin becomes an input port if the bit in the DDRG register corresponding to that pin is set to “0”. • For a pin shared with other peripheral functions, disable the output of such peripheral functions. • If data is written to the PDRG register, the value is stored in the output latch but is not output to the pin set as an input port. • Reading the PDRG register returns the pin value. However, if the read-modify-write (RMW) type of instruction is used to read the PDRG register, the PDRG register value is returned. Operation at reset If the CPU is reset, all bits in the DDRG register are initialized to “0” and port input is enabled. Operation in stop mode and watch mode • If the pin state setting bit in the standby control register (STBC:SPL) is set to “1” and the device transits to stop mode or watch mode, the pin is compulsorily made to enter the high impedance state regardless of the DDRG register value. The input of that pin is locked to “L” level and blocked in order to prevent leaks due to input open. • If the pin state setting bit is “0”, the state of the port I/O or that of the peripheral function I/O remains unchanged and the output level is maintained. Operation of the pull-up register Setting the bit in the PULG register to “1” makes the pull-up resistor be internally connected to the pin. When the pin output is “L” level, the pull-up resistor is disconnected regardless of the value of the PULG register. Document Number: 002-04696 Rev. *B Page 52 of 105 MB95650L Series 16. Interrupt Source Table Interrupt source Interrupt request number level setting Priority order of interrupt Vector table address Interrupt register sources of the same level (occurring Upper Lower Register Bit simultaneously) External interrupt ch. 4 IRQ00 0xFFFA 0xFFFB ILR0 L00 [1:0] External interrupt ch. 5 IRQ01 0xFFF8 0xFFF9 ILR0 L01 [1:0] IRQ02 0xFFF6 0xFFF7 ILR0 L02 [1:0] IRQ03 0xFFF4 0xFFF5 ILR0 L03 [1:0] IRQ04 0xFFF2 0xFFF3 ILR1 L04 [1:0] 8/16-bit composite timer ch. 0 (lower) IRQ05 0xFFF0 0xFFF1 ILR1 L05 [1:0] 8/16-bit composite timer ch. 0 (upper) IRQ06 0xFFEE 0xFFEF ILR1 L06 [1:0] LIN-UART (reception) IRQ07 0xFFEC 0xFFED ILR1 L07 [1:0] LIN-UART (transmission) IRQ08 0xFFEA 0xFFEB ILR2 L08 [1:0] IRQ09 0xFFE8 0xFFE9 ILR2 L09 [1:0] External interrupt ch. 2 External interrupt ch. 6 External interrupt ch. 3 External interrupt ch. 7 Low-voltage detection interrupt circuit UART/SIO ch. 0 — I 2C bus interface ch. 1 IRQ10 0xFFE6 0xFFE7 ILR2 L10 [1:0] — IRQ11 0xFFE4 0xFFE5 ILR2 L11 [1:0] — IRQ12 0xFFE2 0xFFE3 ILR3 L12 [1:0] — IRQ13 0xFFE0 0xFFE1 ILR3 L13 [1:0] 8/16-bit composite timer ch. 1 (upper) — I 2C bus interface ch. 0 — IRQ14 0xFFDE 0xFFDF ILR3 L14 [1:0] IRQ15 0xFFDC 0xFFDD ILR3 L15 [1:0] IRQ16 0xFFDA 0xFFDB ILR4 L16 [1:0] IRQ17 0xFFD8 0xFFD9 ILR4 L17 [1:0] 8/12-bit A/D converter IRQ18 0xFFD6 0xFFD7 ILR4 L18 [1:0] Time-base timer IRQ19 0xFFD4 0xFFD5 ILR4 L19 [1:0] Watch prescaler IRQ20 0xFFD2 0xFFD3 ILR5 L20 [1:0] IRQ21 0xFFD0 0xFFD1 ILR5 L21 [1:0] — 8/16-bit composite timer ch. 1 (lower) IRQ22 0xFFCE 0xFFCF ILR5 L22 [1:0] Flash memory IRQ23 0xFFCC 0xFFCD ILR5 L23 [1:0] Document Number: 002-04696 Rev. *B High Low Page 53 of 105 MB95650L Series 17. Pin States in each Mode Pin name Normal operation Sleep mode Oscillation input Oscillation input PF0/X0 I/O port*1 I/O port*1 Oscillation input Oscillation input PF1/X1 PF2/RST I/O port*1 I/O port*1 Reset input Reset input I/O port*1 I/O port*1 Oscillation input Oscillation input PG1/X0A I/O port*1 I/O port*1 Oscillation input Oscillation input Stop mode Watch mode SPL=0 SPL=1 SPL=0 SPL=1 Hi-Z Hi-Z Hi-Z Hi-Z - Previous state - Hi-Z kept - Input - Input blocked*1, *2 1, 2 blocked* * Hi-Z Hi-Z - Previous state - Hi-Z kept - Input - Input blocked*1, *2 1, *2 blocked* Reset input Reset input - Previous state - Hi-Z kept - Input - Input blocked*1, *2 1, *2 blocked* Hi-Z Hi-Z - Previous state - Hi-Z kept - Input - Input blocked*1, *2 1, *2 blocked* Hi-Z Hi-Z I/O port*1 I/O port*1 - Previous state - Hi-Z kept - Input - Input blocked*1, *2 1, *2 blocked* I/O port/ P03/INT03/ peripheral AN03/SOT function I/O/ P04/INT04/ analog input AN04/SIN/ EC0 I/O port/ peripheral function I/O/ analog input - Previous state - Hi-Z*6 kept - Input - Input blocked*2, *5 blocked*2, *5 PG2/X1A - Previous state - Hi-Z kept - Input - Input blocked*1, *2 1, 2 blocked* * Hi-Z Hi-Z - Previous state - Hi-Z kept - Input - Input blocked*1, *2 1, *2 blocked* Reset input Reset input - Previous state - Hi-Z kept - Input - Input blocked*1, *2 1, *2 blocked* Hi-Z Hi-Z - Previous state - Hi-Z kept - Input - Input blocked*1, *2 1, *2 blocked* Hi-Z Hi-Z On reset — - Hi-Z - Input enabled*3 (However, it does not function.) — - Hi-Z - Input enabled*3 (However, it does not function.) Reset input*4 - Hi-Z - Input enabled*3 (However, it does not function.) — - Hi-Z - Input enabled*3 (However, it does not function.) — - Previous state - Hi-Z kept - Input - Input blocked*1, *2 1, *2 blocked* - Hi-Z - Input enabled*3 (However, it does not function.) - Previous state - Hi-Z*6 kept - Input - Input blocked*2, *5 blocked*2, *5 - Hi-Z - Input blocked*2 P00/AN00 P01/AN01 P02/INT02/ AN02/SCK P05/INT05/ AN05/TO00 Document Number: 002-04696 Rev. *B Page 54 of 105 MB95650L Series Pin name Normal operation P06/INT06/ I/O port/ TO01 peripheral P07/INT07/ function I/O TO10 Sleep mode Stop mode SPL=0 Watch mode SPL=1 SPL=0 SPL=1 On reset - Previous state - Hi-Z*6 kept - Input - Input blocked*2, *5 2, 5 blocked* * - Previous state - Hi-Z*6 kept - Input - Input blocked*2, *5 2, 5 blocked* * - Hi-Z - Input blocked*2 - Previous state I/O port/ I/O port/ - Hi-Z P16/SDA1/ peripheral func- peripheral func- kept - Input - Input UO0 tion I/O tion I/O blocked*2, *7 blocked*2, *7 P17/SCL1/ UI0 - Previous state - Hi-Z kept - Input - Input blocked*2, *7 blocked*2, *7 - Hi-Z - Input enabled*3 (However, it does not function.) - Previous state - Hi-Z kept - Input - Input blocked*2 blocked*2 - Hi-Z - Input enabled*3 (However, it does not function.) I/O port/ peripheral function I/O P14/SDA0 P15/SCL0 P12/DBG/ EC0 P62/TO10/ I/O port/ peripheral UCK0 function I/O P63/TO11 I/O port/ peripheral function I/O - Previous state - Hi-Z kept - Input - Input blocked*2 blocked*2 P64/EC1 SPL: Pin state setting bit in the standby control register (STBC:SPL) Hi-Z: High impedance *1: The pin stays at the state shown when configured as a general-purpose I/O port. *2: “Input blocked” means direct input gate operation from the pin is disabled. *3: “Input enabled” means that the input function is enabled. While the input function is enabled, perform a pull-up or pull-down operation in order to prevent leaks due to external input. If a pin is used as an output port, its pin state is the same as that of other ports. *4: The PF2/RST pin stays at the state shown when configured as a reset pin. *5: Though input is blocked, an external interrupt can be input when the external interrupt request is enabled. *6: The pull-up control setting is still effective. *7: The I2C bus interface can wake up the MCU in stop mode or watch mode when its MCU standby mode wakeup function is enabled. For details of the MCU standby mode wakeup function, refer to “Chapter 19 I2c Bus Interface” in “New 8FX MB95650L Series Hardware Manual”. Document Number: 002-04696 Rev. *B Page 55 of 105 MB95650L Series 18. Electrical Characteristics 18.1 Absolute Maximum Ratings Parameter Power supply voltage*1 1 Input voltage* Output voltage* 1 Maximum clamp current Total maximum clamp current “L” level maximum output current Symbol Rating Unit Max VCC VSS 0.3 VSS  6 V VI VSS 0.3 VSS  6 V *2 VO VSS 0.3 VSS  6 V *2 ICLAMP 2 2 mA Applicable to specific pins*3 |ICLAMP| — 20 mA Applicable to specific pins*3 IOL — 15 mA IOLAV1 “L” level average current 4 — IOLAV2 mA 12 “L” level total maximum output current IOL — 100 mA “L” level total average output current IOLAV — 37 mA IOH — 15 mA “H” level maximum output current Remarks Min 4 IOHAV1 “H” level average current — mA 8 IOHAV2 “H” level total maximum output current IOH — 100 mA “H” level total average output current IOHAV — 47 mA Power consumption Pd — 320 mW Operating temperature TA 40 85 Storage temperature Tstg 55 150 C C Other than P05 to P07, P62 and P63 Average output current = operating current  operating ratio (1 pin) P05 to P07, P62 and P63 Average output current = operating current  operating ratio (1 pin) Total average output current = operating current  operating ratio (Total number of pins) Other than P05 to P07, P62 and P63 Average output current = operating current  operating ratio (1 pin) P05 to P07, P62 and P63 Average output current = operating current  operating ratio (1 pin) Total average output current = operating current  operating ratio (Total number of pins) *1: These parameters are based on the condition that VSS is 0.0 V. *2: V1 and V0 must not exceed VCC  0.3 V. V1 must not exceed the rated voltage. However, if the maximum current to/from an input is limited by means of an external component, the ICLAMP rating is used instead of the VI rating. (Continued) Document Number: 002-04696 Rev. *B Page 56 of 105 MB95650L Series (Continued) *3: Specific pins: P00 to P07, P14, P15, P62 to P64, PF0, PF1, PG1, PG2 • Use under recommended operating conditions. • Use with DC voltage (current). • The HV (High Voltage) signal is an input signal exceeding the VCC voltage. Always connect a limiting resistor between the HV (High Voltage) signal and the microcontroller before applying the HV (High Voltage) signal. • The value of the limiting resistor should be set to a value at which the current to be input to the microcontroller pin when the HV (High Voltage) signal is input is below the standard value, irrespective of whether the current is transient current or stationary current. • When the microcontroller drive current is low, such as in low power consumption modes, the HV (High Voltage) input potential may pass through the protective diode to increase the potential of the VCC pin, affecting other devices. • If the HV (High Voltage) signal is input when the microcontroller power supply is off (not fixed at 0 V), since power is supplied from the pins, incomplete operations may be executed. • If the HV (High Voltage) input is input after power-on, since power is supplied from the pins, the voltage of power supply may not be sufficient to enable a power-on reset. • Do not leave the HV (High Voltage) input pin unconnected. • Example of a recommended circuit: Input/Output equivalent circuit Protective diode VCC P-ch Limiting resistor HV(High Voltage) input (0 V to 16 V) N-ch R WARNING: Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings. Document Number: 002-04696 Rev. *B Page 57 of 105 MB95650L Series 18.2 Recommended Operating Conditions (VSS = 0.0 V) Parameter Symbol Value Min Max Unit Remarks Power supply voltage VCC 1.8*1 5.5 V In normal operation Decoupling capacitor CS 0.2 10 µF A capacitor of about 1.0 µF is recommended. *2 Operating temperature TA 40 85 Other than on-chip debug mode 5 35 C On-chip debug mode *1: The minimum power supply voltage becomes 2.18 V when a product with the low-voltage detection reset is used or when the on-chip debug mode is used. *2: Use a ceramic capacitor or a capacitor with equivalent frequency characteristics. For the connection to a decoupling capacitor CS, see the diagram below. To prevent the device from unintentionally entering an unknown mode due to noise, minimize the distance between the C pin and CS and the distance between CS and the VSS pin when designing the layout of a printed circuit board. DBG / RST / C pins connection diagram * DBG C RST Cs *: Connect the DBG pin to an external pull-up resistor of 2 k or above. After power-on, ensure that the DBG pin does not stay at “L” level until the reset output is released. The DBG pin becomes a communication pin in debug mode. Since the actual pull-up resistance depends on the tool used and the interconnection length, refer to the tool document when selecting a pull-up resistor. WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated under these conditions. Any use of semiconductor devices will be under their recommended operating condition. Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device failure. No warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. If you are considering application under any conditions other than listed herein, please contact sales representatives beforehand. Document Number: 002-04696 Rev. *B Page 58 of 105 MB95650L Series 18.3 DC Characteristics Parameter “H” level input voltage “L” level input voltage Open-drain output application voltage “H” level output voltage “L” level output voltage Input leak current (Hi-Z output leak current) Internal pull-up resistor Input capacitance Symbol (VCC = 3.0 V10%, VSS = 0.0 V, TA = 40 °C to 85 °C) Pin name Condition Value Min Typ Max Unit Remarks VIHI1 P04, P16, P17 *1 0.7 VCC — VCC  0.3 V CMOS input level VIHI2 P14, P15 *1 0.7 VCC — VCC  5.5 V CMOS input level VIHS P00 to P03, P05 to P07, P12, P62 to P64, PF0, PF1, PG1, PG2 *1 0.8 VCC — VCC  0.3 V Hysteresis input VIHM PF2 — 0.8 VCC — VCC  0.3 V Hysteresis input VILI P04, P14 to P17 *1 VSS 0.3 — 0.3 VCC V CMOS input level VILS P00 to P03, P05 to P07, P12, P62 to P64, PF0, PF1, PG1, PG2 *1 VSS 0.3 — 0.2 VCC V Hysteresis input VILM PF2 — VSS 0.3 — 0.2 VCC V Hysteresis input VD1 P12, PF2 — VSS 0.3 — VSS  5.5 V VD2 P14, P15 — VSS 0.3 — VSS  5.5 V VD3 P16, P17 — VSS 0.3 — VSS  5.5 V In I2C mode VOH1 Output pins other than P05 to P07, P12, P62, P63 IOH = 4 mA*2 VCC 0.5 — — V VOH2 P05 to P07, P62, P63 IOH = 8 mA*3 VCC 0.5 — — V VOL1 Output pins other than P05 to P07, P62, P63 IOL = 4 mA*4 — — 0.4 V VOL2 P05 to P07, P62, P63 IOL = 12 mA*5 — — 0.4 V ILI All input pins 0.0 V < VI < VCC 5 — 5 µA When the internal pull-up resistor is disabled RPULL P00 to P07, P62 to P64, PG1, PG2 VI = 0 V 75 100 150 k When the internal pull-up resistor is enabled Other than VCC and VSS f = 1 MHz — 5 15 pF CIN (Continued) Document Number: 002-04696 Rev. *B Page 59 of 105 MB95650L Series (VCC = 3.0 V10%, VSS = 0.0 V, TA = 40 °C to 85 °C) Parameter Symbol Pin name Remarks 6.8 mA Except during Flash memory programming and erasing 9.3 14.7 mA During Flash memory programming and erasing — 6 10 mA At A/D conversion FCH = 32 MHz FMP = 16 MHz Main sleep mode (divided by 2) — 1.7 3 mA FCL = 32 kHz FMPL = 16 kHz Subclock mode (divided by 2) TA = 25 °C — 35 60 µA ICCLS FCL = 32 kHz FMPL = 16 kHz Subsleep mode (divided by 2) TA = 25 °C — 2 7 µA ICCT FCL = 32 kHz Watch mode Main stop mode TA = 25 °C — 1 6 µA FMCRPLL = 16 MHz FMP = 16 MHz Main CR PLL clock mode (multiplied by 4) — 4.3 7.7 mA FMPLL = 16 MHz FMP = 16 MHz Main PLL clock mode (multiplied by 4) — 4.1 7 mA ICCMCR FCRH = 4 MHz FMP = 4 MHz Main CR clock mode — 1.5 3 mA ICCSCR Sub-CR clock mode (divided by 2) TA = 25 °C — 50 100 µA FCH = 32 MHz FMP = 16 MHz Main clock mode (divided by 2) ICC ICCS Power supply current*7 Value Unit ICCL VCC (External clock operation) ICCMCRPLL ICCMPLL Condition VCC Min Typ*1 Max*6 — 4.2 — (Continued) Document Number: 002-04696 Rev. *B Page 60 of 105 MB95650L Series (VCC = 3.0 V10%, VSS = 0.0 V, TA = 40 °C to 85 °C) Parameter Symbol Pin name Value Unit Min Typ*1 Max*6 FCH = 32 MHz Time-base timer mode TA = 25 °C — 450 500 µA Substop mode TA = 25 °C — 0.7 5 µA IPLVD Current consumption of the low-voltage detection reset circuit in operation — 6 26 µA IILVD Current consumption of the low-voltage detection interrupt circuit operating in normal mode — 6 14 µA IILVDL Current consumption of the low-voltage detection interrupt circuit operating in low power consumption mode — 3 10 µA ICRH Current consumption of the main CR oscillator — 270 320 µA ICRL Current consumption of the sub-CR oscillator oscillating at 100 kHz — 5 20 µA ISOSC Current consumption of the suboscillator — 0.8 7 µA ICCTS ICCH VCC (External clock operation) Power supply current*7 *1: *2: *3: *4: *5: *6: *7: Condition VCC Remarks VCC = 3.0 V, TA = 25 °C When VCC is smaller than 4.5 V, the condition becomes IOH = 2 mA. When VCC is smaller than 4.5 V, the condition becomes IOH = 4 mA. When VCC is smaller than 4.5 V, the condition becomes IOL = 2 mA. When VCC is smaller than 4.5 V, the condition becomes IOH = 6 mA. VCC = 3.3 V, TA = 85 °C (unless otherwise specified) • The power supply current is determined by the external clock. When the low-voltage detection reset circuit is selected, the power supply current is the sum of adding the current consumption of the low-voltage detection reset circuit (IPLVD) to one of the values from ICC to ICCH. In addition, when the low-voltage detection reset circuit and a CR oscillator are selected, the power supply current is the sum of adding up the current consumption of the low-voltage detection reset circuit (IPLVD), the current consumption of the CR oscillator (ICRH or ICRL) and one of the values from ICC to ICCH. In on-chip debug mode, the main CR oscillator (ICRH) and the low-voltage detection reset circuit are always in operation, and current consumption therefore increases accordingly. • See “18.4. AC Characteristics 18.4.1. Clock Timing” for FCH, FCL, FCRH, FMCRPLL and FMPLL. • See “18.4. AC Characteristics 18.4.2. Source Clock/Machine Clock” for FMP and FMPL. • The power supply current in subclock mode is determined by the external clock. In subclock mode, current consumption in using the crystal oscillator is higher than that in using the external clock. When the crystal oscillator is used, the power supply current is the sum of adding ISOSC (current consumption of the suboscillator) to the power supply current in using the external clock. For details of controlling the subclock, refer to “Chapter 3 Clock Controller” And “chapter 24 System Configuration Register” in “New 8FX MB95650L Series Hardware Manual”. Document Number: 002-04696 Rev. *B Page 61 of 105 MB95650L Series 18.4 AC Characteristics 18.4.1 Clock Timing Parameter (VCC = 1.8 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Symbol FCH FCRH Pin name Condition FMPLL Typ Max Unit Remarks X0, X1 — 1 — 16.25 MHz When the main oscillation circuit is used X0 — 1 — 32.5 MHz When the main external clock is used X0, X1 — — 4 — 3.92 4 4.08 Operating conditions MHz • The main CR clock is used. • 0C TA 70C — — Clock frequency FMCRPLL Value Min — — 3.8 4 4.2 Operating conditions • The main CR clock is used. MHz • 40C  TA  0C, 70C  TA  85C 7.84 8 8.16 Operating conditions MHz • PLL multiplication rate: 2 • 0C TA 70C 7.6 8 8.4 Operating conditions • PLL multiplication rate: 2 MHz • 40C  TA  0C, 70C  TA  85C 9.8 10 10.2 Operating conditions MHz • PLL multiplication rate: 2.5 • 0C TA 70C 9.5 10 10.5 Operating conditions • PLL multiplication rate: 2.5 MHz • 40C  TA  0C, 70C  TA  85C 11.76 12 12.24 Operating conditions MHz • PLL multiplication rate: 3 • 0C TA 70C — — MHz When the main PLL clock is used 11.4 12 12.6 Operating conditions • PLL multiplication rate: 3 MHz • 40C  TA  0C, 70C  TA  85C 15.68 16 16.32 Operating conditions MHz • PLL multiplication rate: 4 • 0C TA 70C Operating conditions • PLL multiplication rate: 4 MHz • 40C  TA  0C, 70C  TA  85C 15.2 16 16.8 8 — 16 MHz When the main PLL clock is used (Continued) Document Number: 002-04696 Rev. *B Page 62 of 105 MB95650L Series (Continued) Parameter Clock frequency (VCC = 1.8 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Symbol Pin name — 32.768 — kHz — 32.768 — kHz When the sub-external clock is used — 50 100 150 X0, X1 — 61.5 — 1000 ns When the main oscillation circuit is used X0 — 30.8 — 1000 ns When an external clock is used X0, X1 — — 250 — ns When the main PLL clock is used X0A, X1A — — 30.5 — µs When the subclock is used X0 — 12.4 — — ns When an external clock is used, the duty ratio should range between 40% and 60%. X0, X1 — — 125 — ns When the main PLL clock is used — — 15.2 — µs When an external clock is used, the duty ratio should range between 40% and 60%. tCR, tCF X0, X0A — — — 5 ns When an external clock is used tCRHWK — — — — 50 µs When the main CR clock is used tCRLWK — — — — 30 µs When the sub-CR clock is used µs When the main CR PLL clock is used FCL tHCYL tWH1, tWL1 X0A, X1A — tWH2, tWL2 X0A PLL oscillation start time Remarks Max Input clock pulse width CR oscillation start time Unit Typ tLCYL Input clock rising time and falling time Value Min FCRL Clock cycle time Condition tMCRPLLWK — Document Number: 002-04696 Rev. *B — — — — 100 When the suboscillation circuit is used kHz When the sub-CR clock is used Page 63 of 105 MB95650L Series Input waveform generated when an external clock (main clock) is used tHCYL tWH1 tWL1 tCR tCF 0.8 VCC 0.8 VCC X0, X1 0.2 VCC 0.2 VCC 0.2 VCC Figure of main clock input port external connection When a crystal oscillator or a ceramic oscillator is used X0 When an external clock is used X0 X1 FCH FCH Input waveform generated when an external clock (subclock) is used tLCYL tWH2 tCR tWL2 tCF 0.8 VCC 0.8 VCC X0A 0.2 VCC 0.2 VCC 0.2 VCC Figure of subclock input port external connection When a crystal oscillator or a ceramic oscillator is used X0A X1A When an external clock is used X0A FCL FCL Document Number: 002-04696 Rev. *B Page 64 of 105 MB95650L Series Input waveform generated when an internal clock (main CR clock) is used tCRHWK 1/FCRH Main CR clock Oscillation starts Oscillation stabilizes Input waveform generated when an internal clock (sub-CR clock) is used tCRLWK 1/FCRL Sub-CR clock Oscillation starts Oscillation stabilizes Input waveform generated when an internal clock (main CR PLL clock) is used 1/FMCRPLL tMCRPLLWK Main CR PLL clock Oscillation starts Document Number: 002-04696 Rev. *B Oscillation stabilizes Page 65 of 105 MB95650L Series 18.4.2 Source Clock/Machine Clock Parameter Source clock cycle time*1 Symbol tSCLK Pin name — FSPL Machine clock cycle time*2 (minimum instruction execution time) tMCLK Value Unit Remarks Min Typ Max 61.5 — 2000 ns When the main external clock is used Min: FCH = 32.5 MHz, divided by 2 Max: FCH = 1 MHz, divided by 2 — 250 — ns When the main CR clock is used 62.5 — 250 ns When the main PLL clock is used Min: FCH = 4 MHz, multiplied by 4 Max: FCH = 4 MHz, no division 62.5 — 250 ns When the main CR PLL clock is used Min: FCRH = 4 MHz, multiplied by 4 Max: FCRH = 4 MHz, no division — 61 — µs When the suboscillation clock is used FCL = 32.768 kHz, divided by 2 — 20 — µs When the sub-CR clock is used FCRL = 100 kHz, divided by 2 0.5 — 16.25 — 4 — MHz When the main CR clock is used 4 — 16 MHz When the main PLL clock is used 4 — 16 MHz When the main CR PLL clock is used — 16.384 — kHz When the suboscillation clock is used — 50 — kHz When the sub-CR clock is used FCRL = 100 kHz, divided by 2 61.5 — 32000 ns When the main oscillation clock is used Min: FSP = 16.25 MHz, no division Max: FSP = 0.5 MHz, divided by 16 250 — 4000 ns When the main CR clock is used Min: FSP = 4 MHz, no division Max: FSP = 4 MHz, divided by 16 62.5 — 4000 ns When the main PLL clock is used Min: FSP = 4 MHz, multiplied by 4 Max: FSP = 4 MHz, divided by 16 62.5 — 4000 ns When the main CR PLL clock is used Min: FSP = 4 MHz, multiplied by 4 Max: FSP = 4 MHz, divided by 16 61 — 976.5 µs When the suboscillation clock is used Min: FSPL = 16.384 kHz, no division Max: FSPL = 16.384 kHz, divided by 16 20 — 320 µs When the sub-CR clock is used Min: FSPL = 50 kHz, no division Max: FSPL = 50 kHz, divided by 16 — FSP Source clock frequency (VCC = 1.8 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) MHz When the main oscillation clock is used — (Continued) Document Number: 002-04696 Rev. *B Page 66 of 105 MB95650L Series (Continued) Parameter (VCC = 1.8 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Symbol Pin name FMP Machine clock frequency — FMPL Value Min Unit Remarks Typ Max 0.031 — 16.25 0.25 — 4 MHz When the main CR clock is used 0.25 — 16 MHz When the main PLL clock is used 0.25 — 16 MHz When the main CR PLL clock is used 1.024 — 16.384 kHz When the suboscillation clock is used 3.125 — 50 kHz When the sub-CR clock is used FCRL = 100 kHz MHz When the main oscillation clock is used *1: This is the clock before it is divided according to the division ratio set by the machine clock division ratio select bits (SYCC:DIV[1:0]). This source clock is divided to become a machine clock according to the division ratio set by the machine clock division ratio select bits (SYCC:DIV[1:0]). In addition, a source clock can be selected from the following. • • • • • • Main clock divided by 2 PLL multiplication of main clock (Select a multiplication rate from 2, 2.5, 3 and 4.) Main CR clock PLL multiplication of main CR clock (Select a multiplication rate from 2, 2.5, 3 and 4.) Subclock divided by 2 Sub-CR clock divided by 2 *2: This is the operating clock of the microcontroller. A machine clock can be selected from the following. • • • • Source clock (no division) Source clock divided by 4 Source clock divided by 8 Source clock divided by 16 Document Number: 002-04696 Rev. *B Page 67 of 105 MB95650L Series Schematic diagram of the clock generation block FCH (Main oscillation clock) Divided by 2 FMPLL (Main PLL clock) FCRH (Main CR clock) SCLK (Source clock) FMCRPLL (Main CR PLL clock) FCL (Suboscillation clock) Divided by 2 FCRL (Sub-CR clock) Divided by 2 Division circuit × 1 × 1/4 × 1/8 × 1/16 MCLK (Machine clock) Machine clock divide ratio select bits (SYCC:DIV[1:0]) Clock mode select bits (SYCC:SCS[2:0]) Operating voltage - Operating frequency (TA = 40 °C to 85 °C) 5.5 5.0 Operating voltage (V) 4.5 4.0 A/D converter operation range 3.5 3.0 2.5 2.0 1.8 1.5 ≈ 0.0 16 kHz 3 MHz 10 MHz 16.25 MHz Source clock frequency (FSP/FSPL) Document Number: 002-04696 Rev. *B Page 68 of 105 MB95650L Series 18.4.3 External Reset Parameter (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Symbol RST “L” level pulse width tRSTL Value Min Max 2 tMCLK*  Unit Remarks ns *: See “18.4.2. Source Clock/Machine Clock” for tMCLK. tRSTL RST 0.2 VCC Document Number: 002-04696 Rev. *B 0.2 VCC Page 69 of 105 MB95650L Series 18.4.4 Power-on Reset Parameter (VSS = 0.0 V, TA = 40 °C to 85 °C) Symbol Value Pin name Min Typ Max Unit Remarks Power supply rising time dV/dt 0.1 — — V/ms Power supply cutoff time Toff 1 — — ms Reset release voltage Vdeth 1.44 1.60 1.76 V At voltage rise Reset detection voltage Vdetl 1.39 1.55 1.71 V At voltage fall Reset release delay time Tond — — 10 ms dV/dt  0.1 mV/µs Reset detection delay time Toffd — — 0.4 ms dV/dt  0.04 mV/µs VCC Toff Vdeth Vdetl VCC dV 0.2 V dt Power-on reset Document Number: 002-04696 Rev. *B Tond 0.2 V Toffd Page 70 of 105 MB95650L Series 18.4.5 Peripheral Input Timing Parameter (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Symbol Peripheral input “H” pulse width tILIH Peripheral input “L” pulse width tIHIL Value Pin name INT02 to INT07, EC0, EC1 Min Max 2 tMCLK*   2 tMCLK* Unit ns ns *: See “18.4.2. Source Clock/Machine Clock” for tMCLK. tILIH INT02 to INT07, EC0, EC1 Document Number: 002-04696 Rev. *B 0.8 VCC tIHIL 0.8 VCC 0.2 VCC 0.2 VCC Page 71 of 105 MB95650L Series 18.4.6 LIN-UART Timing Sampling is executed at the rising edge of the sampling clock*1, and serial clock delay is disabled*2. (ESCR register : SCES bit = 0, ECCR register : SCDE bit = 0) (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Parameter Symbol Serial clock cycle time SCK  SOT delay time Pin name tSCYC SCK tSLOVI SCK, SOT Valid SIN  SCK tIVSHI SCK, SIN SCK  valid SIN hold time tSHIXI SCK, SIN Serial clock “L” pulse width Serial clock “H” pulse width tSLSH tSHSL Condition Internal clock operation output pin: CL = 80 pF  1 TTL Value Max 5 tMCLK*3 — ns 50 50 ns tMCLK*  80 — ns 0 — ns R — ns  10 — ns 3 *3t SCK 3 tMCLK SCK tMCLK*3 SCK  SOT delay time tSLOVE SCK, SOT Valid SIN  SCK tIVSHE SCK, SIN SCK  valid SIN hold time tSHIXE SCK, SIN External clock operation output pin: CL = 80 pF  1 TTL Unit Min — 2 tMCLK *3  60 ns 30 — ns tMCLK*3  30 — ns SCK fall time tF SCK — 10 ns SCK rise time tR SCK — 10 ns *1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling edge of the serial clock. *2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock. *3: See “18.4.2. Source Clock/Machine Clock” for tMCLK. Document Number: 002-04696 Rev. *B Page 72 of 105 MB95650L Series Internal shift clock mode tSCYC 0.8 VCC SCK 0.2 VCC 0.2 VCC tSLOVI 0.8 VCC SOT 0.2 VCC tIVSHI tSHIXI 0.7 VCC 0.7 VCC SIN 0.3 VCC 0.3 VCC External shift clock mode tSLSH tSHSL 0.8 VCC 0.8 VCC 0.8 VCC SCK 0.2 VCC tF 0.2 VCC tR tSLOVE 0.8 VCC SOT 0.2 VCC tIVSHE tSHIXE 0.7 VCC 0.7 VCC SIN 0.3 VCC 0.3 VCC Document Number: 002-04696 Rev. *B Page 73 of 105 MB95650L Series Sampling is executed at the falling edge of the sampling clock*1, and serial clock delay is disabled*2. (ESCR register : SCES bit = 1, ECCR register : SCDE bit = 0) (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Parameter Symbol Pin name tSCYC SCK SCK  SOT delay time tSHOVI SCK, SOT Valid SIN  SCK tIVSLI SCK, SIN SCK valid SIN hold time tSLIXI SCK, SIN Serial clock cycle time Serial clock “H” pulse width Serial clock “L” pulse width tSHSL tSLSH SCK, SOT Valid SIN  SCK tIVSLE SCK, SIN SCK, SIN Value Max 5 tMCLK*3 — ns 50 50 ns tMCLK*3  80 — ns 0 — ns — ns tMCLK*  10 — ns — 2 tMCLK*3  60 ns 30 — ns — ns 3 tMCLK* tR 3 External clock operation output pin: CL = 80 pF  1 TTL Unit Min 3 SCK tSHOVE tSLIXE Internal clock operation output pin: CL = 80 pF  1 TTL SCK SCK  SOT delay time SCK valid SIN hold time Condition tMCLK*3  30 SCK fall time tF SCK — 10 ns SCK rise time tR SCK — 10 ns *1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling edge of the serial clock. *2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock. *3: See “18.4.2. Source Clock/Machine Clock” for tMCLK. Document Number: 002-04696 Rev. *B Page 74 of 105 MB95650L Series Internal shift clock mode tSCYC 0.8 VCC 0.8 VCC SCK 0.2 VCC tSHOVI 0.8 VCC SOT 0.2 VCC tIVSLI tSLIXI 0.7 VCC 0.7 VCC SIN 0.3 VCC 0.3 VCC External shift clock mode tSHSL 0.8 VCC tSLSH 0.8 VCC SCK 0.2 VCC tR tF 0.2 VCC 0.2 VCC tSHOVE 0.8 VCC SOT 0.2 VCC tIVSLE tSLIXE 0.7 VCC 0.7 VCC SIN 0.3 VCC 0.3 VCC Document Number: 002-04696 Rev. *B Page 75 of 105 MB95650L Series Sampling is executed at the rising edge of the sampling clock*1, and serial clock delay is enabled*2. (ESCR register : SCES bit = 0, ECCR register : SCDE bit = 1) (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Parameter Symbol Pin name Serial clock cycle time tSCYC SCK SCK SOT delay time tSHOVI SCK, SOT Valid SIN  SCK tIVSLI SCK, SIN SCK valid SIN hold time tSLIXI SCK, SIN SOT  SCKdelay time Value Condition Internal clock operation output pin: CL = 80 pF  1 TTL Max 5 tMCLK*3 — ns 50 50 ns tMCLK*3  80 — ns 0 — ns — ns 3 3tMCLK* 70 SCK, SOT tSOVLI Unit Min *1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling edge of the serial clock. *2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock. *3: See “18.4.2. Source Clock/Machine Clock” for tMCLK. tSCYC 0.8 VCC SCK 0.2 VCC SOT 0.8 VCC 0.8 VCC 0.2 VCC 0.2 VCC tIVSLI SIN Document Number: 002-04696 Rev. *B 0.2 VCC tSHOVI tSOVLI tSLIXI 0.7 VCC 0.7 VCC 0.3 VCC 0.3 VCC Page 76 of 105 MB95650L Series Sampling is executed at the falling edge of the sampling clock*1, and serial clock delay is enabled*2. (ESCR register : SCES bit = 1, ECCR register : SCDE bit = 1) (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Parameter Symbol Pin name Serial clock cycle time tSCYC SCK SCK  SOT delay time tSLOVI SCK, SOT Valid SIN  SCK tIVSHI SCK, SIN SCK  valid SIN hold time tSHIXI SCK, SIN SOT  SCKdelay time Value Condition Internal clock operation output pin: CL = 80 pF  1 TTL Max 5 tMCLK*3 — ns 50 50 ns tMCLK*3  80 — ns 0 — ns — ns 3 3tMCLK* 70 SCK, SOT tSOVHI Unit Min *1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling edge of the serial clock. *2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock. *3: See “18.4.2. Source Clock/Machine Clock” for tMCLK. tSCYC 0.8 VCC SCK 0.8 VCC 0.2 VCC tSOVHI SOT tSLOVI 0.8 VCC 0.8 VCC 0.2 VCC 0.2 VCC tIVSHI SIN Document Number: 002-04696 Rev. *B tSHIXI 0.7 VCC 0.7 VCC 0.3 VCC 0.3 VCC Page 77 of 105 MB95650L Series 18.4.7 Low-vo ltage Detection Normal mode Parameter (VCC = 1.8 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Symbol Value Min Typ Max Unit Remarks Reset release voltage VPDL 1.88 2.03 2.18 V At power supply rise Reset detection voltage VPDL 1.8 1.93 2.06 V At power supply fall Interrupt release voltage 0 VIDL0 2.13 2.3 2.47 V At power supply rise Interrupt detection voltage 0 VIDL0 2.05 2.2 2.35 V At power supply fall Interrupt release voltage 1 VIDL1 2.41 2.6 2.79 V At power supply rise Interrupt detection voltage 1 VIDL1 2.33 2.5 2.67 V At power supply fall Interrupt release voltage 2 VIDL2 2.69 2.9 3.11 V At power supply rise Interrupt detection voltage 2 VIDL2 2.61 2.8 2.99 V At power supply fall Interrupt release voltage 3 VIDL3 3.06 3.3 3.54 V At power supply rise Interrupt detection voltage 3 VIDL3 2.98 3.2 3.42 V At power supply fall Interrupt release voltage 4 VIDL4 3.43 3.7 3.97 V At power supply rise Interrupt detection voltage 4 VIDL4 3.35 3.6 3.85 V At power supply fall Interrupt release voltage 5 VIDL5 3.81 4.1 4.39 V At power supply rise Interrupt detection voltage 5 VIDL5 3.73 4 4.27 V At power supply fall Power supply start voltage Voff — — 1.6 V Power supply end voltage Von 4.39 — — V Power supply voltage change time (at power supply rise) tr 697.5 — — µs Slope of power supply that the reset release signal generates within the rating (VPDL/VIDL) Power supply voltage change time (at power supply fall) tf 697.5 — — µs Slope of power supply that the reset release signal generates within the rating (VPDL/VIDL) Reset release delay time tdp1 — — 30 µs Reset detection delay time tdp2 — — 30 µs Interrupt release delay time tdi1 — — 30 µs Interrupt detection delay time tdi2 — — 30 µs LVD reset threshold voltage transition stabilization time tstb — — 30 µs Document Number: 002-04696 Rev. *B Page 78 of 105 MB95650L Series Low power consumption mode Parameter (VCC = 1.8 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Symbol Value Min Typ Max Unit Remarks Interrupt release voltage 0 VIDLL0 2.06 2.3 2.54 V At power supply rise Interrupt detection voltage 0 VIDLL0 1.98 2.2 2.42 V At power supply fall Interrupt release voltage 1 VIDLL1 2.33 2.6 2.87 V At power supply rise Interrupt detection voltage 1 VIDLL1 2.25 2.5 2.75 V At power supply fall Interrupt release voltage 2 VIDLL2 2.6 2.9 3.2 V At power supply rise Interrupt detection voltage 2 VIDLL2 2.52 2.8 3.08 V At power supply fall Interrupt release voltage 3 VIDLL3 2.96 3.3 3.64 V At power supply rise Interrupt detection voltage 3 VIDLL3 2.88 3.2 3.52 V At power supply fall Interrupt release voltage 4 VIDLL4 3.32 3.7 4.08 V At power supply rise Interrupt detection voltage 4 VIDLL4 3.24 3.6 3.96 V At power supply fall Interrupt release voltage 5 VIDLL5 3.68 4.1 4.52 V At power supply rise Interrupt detection voltage 5 VIDLL5 3.6 4 4.4 V At power supply fall Power supply start voltage VoffL — — 1.6 V Power supply end voltage VonL 4.52 — — V Power supply voltage change time (at power supply rise) trL 7300 — — µs Slope of power supply that the interrupt release signal generates within the rating (VIDLL) Power supply voltage change time (at power supply fall) tfL 7300 — — µs Slope of power supply that the interrupt detection signal generates within the rating (VIDLL) Interrupt release delay time tdiL1 — — 400 µs Interrupt detection delay time tdiL2 — — 400 µs Interrupt threshold voltage transition stabilization time tstbL — — 400 µs Interrupt low-voltage detection mode switch time tmdsw — — 400 µs Normal mode  Low power consumption mode Note: When used for interrupt, the low-voltage detection circuit can be switched between the normal mode and the low power consumption mode. Compared with the normal mode, while the low power consumption mode has lower detection voltage accuracy and lower release voltage accuracy, it has the lower power consumption. See “18.3 DC Characteristics” for the difference in current consumption between the normal mode and the low power consumption mode. For details of the method for switching between the normal mode and the low power consumption mode, refer to “Chapter 17 Low-voltage Detection Circuit” in “New 8FX MB95650L Series Hardware Manual”. Document Number: 002-04696 Rev. *B Page 79 of 105 MB95650L Series VCC Von/VonL Voff/VoffL Time tf/tfL tr/trL VPDL+/VIDL+ VPDL−/VIDL− Internal reset signal or interrupt signal Time tdp2/tdi2/tdiL2 Document Number: 002-04696 Rev. *B tdp1/tdi1/tdiL1 Page 80 of 105 MB95650L Series 18.4.8 I2C Bus Interface Timing (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Value Parameter Symbol Pin name Condition Standard-mode Fast-mode Min Max Min Max Unit fSCL SCL0, SCL1 0 100 0 400 kHz tHD;STA SCL0, SCL1, SDA0, SDA1 4.0 — 0.6 — µs SCL clock “L” width tLOW SCL0, SCL1 4.7 — 1.3 — µs SCL clock “H” width tHIGH SCL0, SCL1 4.0 — 0.6 — µs (Repeated) START condition setup time SCL  SDA  tSU;STA SCL0, SCL1, SDA0, SDA1 4.7 — 0.6 — µs Data hold time SCL  SDA  tHD;DAT R = 1.7 k, SCL0, SCL1, C = 50 pF*1 SDA0, SDA1 0 3.45*2 0 0.9*3 µs Data setup time SDA  SCL  tSU;DAT SCL0, SCL1, SDA0, SDA1 0.25 — 0.1 — µs STOP condition setup time SCL   SDA  tSU;STO SCL0, SCL1, SDA0, SDA1 4 — 0.6 — µs tBUF SCL0, SCL1, SDA0, SDA1 4.7 — 1.3 — µs SCL clock frequency (Repeated) START condition hold time SDA  SCL  Bus free time between STOP condition and START condition *1: R represents the pull-up resistor of the SCL0/1 and SDA0/1 lines, and C the load capacitor of the SCL0/1 and SDA0/1 lines. *2: The maximum tHD;DAT in the Standard-mode is applicable only when the time during which the device is holding the SCL signal at “L” (tLOW) does not extend. *3: A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, provided that the condition of tSU;DAT  250 ns is fulfilled. tWAKEUP SDA0, SDA1 tLOW SCL0, SCL1 tHD;DAT tHD;STA Document Number: 002-04696 Rev. *B tHIGH tSU;DAT fSCL tHD;STA tSU;STA tBUF tSU;STO Page 81 of 105 MB95650L Series (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Parameter Symbol Pin name Condition Value*2 Min Max Unit Remarks SCL clock “L” width tLOW SCL0, SCL1 (2  nm/2)tMCLK  20 — ns Master mode SCL clock “H” width tHIGH SCL0, SCL1 (nm/2)tMCLK  20 (nm/2)tMCLK  20 ns Master mode (-1  nm/2)tMCLK  20 (-1  nm)tMCLK  20 ns Master mode Maximum value is applied when m, n = 1, 8. Otherwise, the minimum value is applied. (1  nm/2)tMCLK  20 (1  nm/2)tMCLK  20 ns Master mode SCL0, SCL1, tSU;STA SDA0, SDA1 (1  nm/2)tMCLK  20 (1  nm/2)tMCLK  20 ns Master mode SCL0, SCL1, SDA0, SDA1 (2 nm  4) tMCLK  20 — ns 3 tMCLK  20 — ns START condition hold time SCL0, SCL1, tHD;STA SDA0, SDA1 STOP condition setup time SCL0, SCL1, tSU;STO SDA0, SDA1 START condition setup time Bus free time between STOP condition and START condition Data hold time tBUF R = 1.7 k, C = 50 pF*1 SCL0, SCL1, tHD;DAT SDA0, SDA1 Master mode (Continued) Document Number: 002-04696 Rev. *B Page 82 of 105 MB95650L Series (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Parameter Symbol Pin name Condition SCL0, SCL1, Data setup time tSU;DAT SDA0, SDA1 Setup time between clearing interrupt and SCL rising tSU;INT SCL0, SCL1 SCL clock “L” width tLOW SCL0, SCL1 SCL clock “H” width tHIGH SCL0, SCL1 START condition detection SCL0, SCL1, tHD;STA SDA0, SDA1 STOP condition detection SCL0, SCL1, tSU;STO SDA0, SDA1 RESTART condition detection condition SCL0, SCL1, tSU;STA SDA0, SDA1 Value*2 Min (-2  nm/2) tMCLK  20 R = 1.7 k, C = 50 pF*1 Max (-1  nm/2) tMCLK  20 Unit Remarks ns Master mode It is assumed that “L” of SCL is not extended. The minimum value is applied to the first bit of continuous data. Otherwise, the maximum value is applied. (nm/2) tMCLK  20 (1  nm/2) tMCLK  20 ns The minimum value is applied to the interrupt at the ninth SCL. The maximum value is applied to the interrupt at the eighth SCL. 4 tMCLK  20 — ns At reception 4 tMCLK  20 — ns At reception ns No START condition is detected when 1 tMCLK is used at reception. ns No STOP condition is detected when 1 tMCLK is used at reception. ns No RESTART condition is detected when 1 tMCLK is used at reception. 2 tMCLK  20 2 tMCLK  20 2 tMCLK  20 — — — (Continued) Document Number: 002-04696 Rev. *B Page 83 of 105 MB95650L Series (Continued) Parameter (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Symbol Pin name Condition Value*2 Unit Remarks Min Max tBUF SCL0, SCL1, SDA0, SDA1 2 tMCLK  20 — ns At reception tHD;DAT SCL0, SCL1, SDA0, SDA1 2 tMCLK  20 — ns At slave transmission mode tSU;DAT SCL0, SCL1, SDA0, SDA1 tLOW  3 tMCLK  20 — ns At slave transmission mode tHD;DAT SCL0, SCL1, SDA0, SDA1 0 — ns At reception Data setup time tSU;DAT SCL0, SCL1, SDA0, SDA1 tMCLK  20 — ns At reception SDA  SCL (with wakeup function in use) SCL0, SCL1, tWAKEUP SDA0, SDA1 Oscillation stabilization wait time 2 tMCLK  20 — ns Bus free time Data hold time Data setup time Data hold time R = 1.7 k, C = 50 pF*1 *1: R represents the pull-up resistor of the SCL0/SCL1 and SDA0/SDA1 lines, and C the load capacitor of the SCL0/SCL1 and SDA0/SDA1 lines. *2: • See “18.4.2. Source Clock/Machine Clock” for tMCLK. • m represents the CS[4:3] bits in the I2C clock control register ch. 0/ch. 1 (ICCR0/ICCR1). • n represents the CS[2:0] bits in the I2C clock control register ch. 0/ch. 1 (ICCR0/ICCR1). • The actual timing of the I2C bus interface is determined by the values of m and n set by the machine clock (tMCLK) and the CS[4:0] bits in the ICCR0/ICCR1 register. • Standard-mode: m and n can be set to values in the following range: 0.9 MHz  tMCLK (machine clock)  16.25 MHz. The usable frequencies of the machine clock are determined by the settings of m and n as shown below. (m, n) = (1, 8) : 0.9 MHz < tMCLK  1 MHz (m, n) = (1, 22), (5, 4), (6, 4), (7, 4), (8, 4) : 0.9 MHz < tMCLK  2 MHz (m, n) = (1, 38), (5, 8), (6, 8), (7, 8), (8, 8) : 0.9 MHz < tMCLK  4 MHz (m, n) = (1, 98), (5, 22), (6, 22), (7, 22) : 0.9 MHz < tMCLK  10 MHz (m, n) = (8, 22) : 0.9 MHz < tMCLK  16.25 MHz • Fast-mode: m and n can be set to values in the following range: 3.3 MHz < tMCLK (machine clock) < 16.25 MHz. The usable frequencies of the machine clock are determined by the settings of m and n as shown below. (m, n) = (1, 8) : 3.3 MHz < tMCLK  4 MHz (m, n) = (1, 22), (5, 4) : 3.3 MHz < tMCLK  8 MHz (m, n) = (1, 38), (6, 4), (7, 4), (8, 4) : 3.3 MHz < tMCLK  10 MHz (m, n) = (5, 8) : 3.3 MHz < tMCLK  16.25 MHz Document Number: 002-04696 Rev. *B Page 84 of 105 MB95650L Series 18.4.9 UART/SIO, Serial I/O Timing Parameter (VCC = 3.0 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Symbol Pin name Condition Value Unit Min Max 4 tMCLK* — ns 190 190 ns 2 tMCLK* — ns Serial clock cycle time tSCYC UCK0 UCK  UO time tSLOV UCK0, UO0 Valid UI  UCK  tIVSH UCK0, UI0 UCK  valid UI hold time tSHIX UCK0, UI0 2 tMCLK* — ns Serial clock “H” pulse width tSHSL UCK0 4 tMCLK* — ns Serial clock “L” pulse width tSLSH UCK0 4 tMCLK* — ns UCK  UO time tSLOV UCK0, UO0 — 190 ns Valid UI  UCK  tIVSH UCK0, UI0 2 tMCLK* — ns UCK  valid UI hold time tSHIX UCK0, UI0 2 tMCLK* — ns Internal clock operation External clock operation *: See “18.4.2. Source Clock/Machine Clock” for tMCLK. Internal shift clock mode tSCYC 0.8 VCC UCK0 0.2 VCC 0.2 VCC tSLOV 0.8 VCC UO0 0.2 VCC tIVSH tSHIX 0.7 VCC 0.7 VCC UI0 0.3 VCC 0.3 VCC External shift clock mode tSLSH tSHSL 0.8 VCC 0.8 VCC UCK0 0.2 VCC 0.2 VCC tSLOV 0.8 VCC UO0 0.2 VCC tIVSH tSHIX 0.7 VCC 0.7 VCC UI0 0.3 VCC 0.3 VCC Document Number: 002-04696 Rev. *B Page 85 of 105 MB95650L Series 18.5 A/D Converter 18.5.1 A/D Converter Electrical Characteristics Parameter Symbol Resolution Total error Linearity error — Differential linearity error (VCC = 1.8 V to 5.5 V, VSS = 0.0 V, TA = 40 °C to 85 °C) Value Unit Typ Max — — 12 6 — 6 10 — 10 LSB VCC  2.7 V 3 — 3 LSB VCC  2.7 V 5 — 5 LSB VCC  2.7 V 1.9 — 1.9 LSB VCC  2.7 V LSB VCC  2.7 V bit LSB VCC  2.7 V 2.9 — 2.9 Zero transition voltage V0T VSS  6 LSB — VSS  8.2 LSB mV Full-scale transition voltage VFST VCC  6.2 LSB — VCC  9.2 LSB mV Sampling time TS Remarks Min * — 10 µs 0.861 — 14 µs VCC  2.7 V 2.8 — 14 µs VCC  2.7 V Compare time Tcck Time of transiting to operation enabled state Tstt 1 — — µs Analog input current IAIN 0.3 — 0.3 µA Analog input voltage VAIN VSS — VCC V *: See “18.4.2. Notes on Using A/D Converter” for details of the minimum sampling time. Document Number: 002-04696 Rev. *B Page 86 of 105 MB95650L Series 18.5.2 Notes on Using A/D Converter External impedance of analog input and its sampling time The A/D converter of the MB95650L Series has a sample and hold circuit. If the external impedance is too high to keep sufficient sampling time, the analog voltage charged to the capacitor of the internal sample and hold circuit is insufficient, adversely affecting A/D conversion precision. Therefore, to satisfy the A/D conversion precision standard, considering the relationship between the external impedance and minimum sampling time, either adjust the register value and operating frequency or decrease the external impedance so that the sampling time is longer than the minimum value. In addition, if sufficient sampling time cannot be secured, connect a capacitor of about 0.1 µF to the analog input pin. Analog input equivalent circuit Comparator Analog signal source Rext VCC Analog input pins (AN00 to AN05) Rin Cin 13 pF (Max) 2.7 V ≤ VCC < 4.5 V Rin 0.9 kΩ (Max) 1.6 kΩ (Max) 1.8 V ≤ VCC < 2.7 V 4.0 kΩ (Max) 13 pF (Max) 4.5 V ≤ VCC ≤ 5.5 V Cin 13 pF (Max) Note: The values are reference values. Relationship between external impedance and minimum sampling time The sampling required varies according to external impedance. Ensure that the following condition is met when setting the sampling time. Ts   Rin + Rext   Cin  9 Ts Rin Cin Rext : : : : Sampling time Input resistance of A/D converter Input capacitance of A/D converter Output impedance of external circuit A/D conversion error As |VCC  VSS| decreases, the A/D conversion error increases proportionately. Document Number: 002-04696 Rev. *B Page 87 of 105 MB95650L Series 18.5.3 Definitions of A/D Converter Terms Resolution It indicates the level of analog variation that can be distinguished by the A/D converter. When the number of bits is 12, analog voltage can be divided into 212 = 4096. Linearity error (unit: LSB) It indicates how much an actual conversion value deviates from the straight line connecting the zero transition point (“000000000000”   “000000000001”) of a device to the full-scale transition point (“111111111111”   “111111111110”) of the same device. Differential linear error (unit: LSB) It indicates how much the input voltage required to change the output code by 1 LSB deviates from an ideal value. Total error (unit: LSB) It indicates the difference between an actual value and a theoretical value. The error can be caused by a zero transition error, a full-scale transition errors, a linearity error, a quantum error, or noise. Ideal I/O characteristics Total error VFST 0xFFF 0xFFF 2 LSB 0xFFD Digital output Digital output 0xFFD 0x004 0x003 Actual conversion characteristic 0xFFE 0xFFE V0T {1 LSB × (N − 1) + 0.5 LSB} 0x004 VNT 0x003 1 LSB 0x002 0x002 0x001 Actual conversion characteristic Ideal characteristic 0x001 0.5 LSB VSS Analog input 1 LSB = VCC VCC − VSS V 4096 N VSS Analog input Total error of digital output N = VCC VNT − {1 LSB × (N − 1) + 0.5 LSB} LSB 1 LSB : A/D converter digital output value VNT : Voltage at which the digital output transits from 0x(N − 1) to 0xN (Continued) Document Number: 002-04696 Rev. *B Page 88 of 105 MB95650L Series (Continued) Zero transition error Full-scale transition error 0x004 Ideal characteristic Actual conversion characteristic 0xFFF Actual conversion characteristic 0x002 Ideal characteristic Digital output Digital output 0x003 Actual conversion characteristic 0xFFE VFST (measurement value) 0xFFD Actual conversion characteristic 0x001 0xFFC V0T (measurement value) VSS Analog input VCC VSS Linearity error 0xFFF 0xFFE Ideal characteristic 0x(N+1) Actual conversion characteristic {1 LSB × N + V0T} VFST (measurement value) VNT 0x004 Actual conversion characteristic Digital output Digital output 0xFFD 0x002 VCC Differential linearity error Actual conversion characteristic 0x003 Analog input V(N+1)T 0xN VNT 0x(N−1) Ideal characteristic Actual conversion characteristic 0x(N−2) 0x001 V0T (measurement value) VSS Analog input VCC Linearity error of digital output N = VSS VCC VNT − {1 LSB × N + V0T} 1 LSB Differential linearity error of digital output N = N Analog input V(N+1)T − VNT − 1 1 LSB : A/D converter digital output value VNT : Voltage at which the digital output transits from 0x(N − 1) to 0xN V0T (ideal value) = VSS + 0.5 LSB [V] VFST (ideal value) = VCC − 2 LSB [V] Document Number: 002-04696 Rev. *B Page 89 of 105 MB95650L Series 18.6 Flash Memory Program/Erase Characteristics Parameter Value Unit Remarks Min Typ Max Sector erase time (2 Kbyte sector) — 0.3*1 1.6*2 s The time of writing “0x00” prior to erasure is excluded. Sector erase time (32 Kbyte sector) — 0.6*1 3.1*2 s The time of writing “0x00” prior to erasure is excluded. Byte writing time — 17 272 µs System-level overhead is excluded. 100000 — — cycle 1.8 — 5.5 V 20*3 — — 10*3 — — 5*3 — — Program/erase cycle Power supply voltage at program/erase Flash memory data retention time Average TA = 85 °C Number of program/erase cycles: 1000 or below year Average TA = 85 °C Number of program/erase cycles: 1001 to 10000 inclusive Average TA = 85 °C Number of program/erase cycles: 10001 or above *1: VCC = 5.5 V, TA = 25 °C, 0 cycle *2: VCC = 1.8 V, TA = 85 °C, 100000 cycles *3: These values were converted from the result of a technology reliability assessment. (These values were converted from the result of a high temperature accelerated test using the Arrhenius equation with the average temperature being 85 °C.) Document Number: 002-04696 Rev. *B Page 90 of 105 MB95650L Series 19. Sample Characteristics Power supply current temperature characteristics ICC  VCC TA  25 C, FMP  2, 4, 8, 10, 16 MHz (divided by 2) Main clock mode with the external clock operating ICC  TA VCC  3.3V, FMP  2, 4, 8, 10, 16 MHz (divided by 2) Main clock mode with the external clock operating 10 10 FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz 8 FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz 8 6 ICC[mA] ICC[mA] 6 4 4 2 2 0 0 1 2 3 4 5 6 −50 7 0 VCC[V] ICCS  VCC TA  25 C, FMP  2, 4, 8, 10, 16 MHz (divided by 2) Main sleep mode with the external clock operating +150 4 FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz 3 ICCS[mA] 3 ICCS[mA] +100 ICCS  TA VCC  3.3 V, FMP  2, 4, 8, 10, 16 MHz (divided by 2) Main sleep mode with the external clock operating 4 2 1 2 1 0 0 1 2 3 4 5 6 −50 7 0 VCC[V] +50 +100 +150 TA[°C] ICCL  VCC TA  25 C, FMPL  16 kHz (divided by 2) Subclock mode with the external clock operating ICCL  TA VCC  3.3 V, FMPL  16 kHz (divided by 2) Subclock mode with the external clock operating 140 140 120 120 100 100 ICCL[μA] ICCL[μA] +50 TA[°C] 80 80 60 60 40 40 20 20 0 0 1 2 3 4 5 VCC[V] 6 7 −50 0 +50 +100 +150 TA[°C] (Continued) Document Number: 002-04696 Rev. *B Page 91 of 105 MB95650L Series ICCLS  TA VCC  3.3 V, FMPL  16 kHz (divided by 2) Subsleep mode with the external clock operating 10 10 9 9 8 8 7 7 6 6 ICCLS[μA] ICCLS[μA] ICCLS  VCC TA  25 C, FMPL  16 kHz (divided by 2) Subsleep mode with the external clock operating 5 5 4 4 3 3 2 2 1 1 0 0 1 2 3 4 5 6 −50 7 0 VCC[V] ICCT  VCC TA  25 C, FMPL  16 kHz (divided by 2) Watch mode with the external clock operating +100 +150 ICCT  TA VCC  3.3 V, FMPL  16 kHz (divided by 2) Watch mode with the external clock operating 5 4 4 3 3 ICCT[μA] ICCT[μA] 5 2 2 1 1 0 0 1 2 3 4 5 6 −50 7 0 VCC[V] +50 +100 +150 TA[°C] ICCTS  VCC TA  25 C, FMP  2, 4, 8, 10, 16 MHz (divided by 2) Time-base timer mode with the external clock operating ICCTS  TA VCC  3.3 V, FMP  2, 4, 8, 10, 16 MHz (divided by 2) Time-base timer mode with the external clock operating 600 600 FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz 500 FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz 500 400 ICCTS[μA] 400 ICCTS[μA] +50 TA[°C] 300 300 200 200 100 100 0 0 1 2 3 4 VCC[V] Document Number: 002-04696 Rev. *B 5 6 7 −50 0 +50 +100 +150 TA[°C] Page 92 of 105 MB95650L Series ICCH  VCC TA  25 C, FMPL  (stop) Substop mode with the external clock stopping ICCH  TA VCC  3.3 V, FMPL  (stop) Substop mode with the external clock stopping 5 4 4 3 3 ICCH[μA] ICCH[μA] 5 2 2 1 1 0 0 1 2 3 4 5 6 −50 7 0 VCC[V] +100 +150 ICCMCR  TA VCC  3.3 V, FMP  4 MHz (no division) Main CR clock mode 5 5 4 4 3 3 ICCMCR[mA] ICCMCR[mA] ICCMCR  VCC TA  25 C, FMP  4 MHz (no division) Main CR clock mode 2 2 1 1 0 0 1 2 3 4 5 6 −50 7 0 VCC[V] +50 +100 +150 TA[°C] ICCMCRPLL  VCC TA  25 C, FMP  16 MHz (PLL multiplication rate: 4) Main CR PLL clock mode ICCMCRPLL  TA VCC  3.3 V, FMP  16 MHz (PLL multiplication rate: 4) Main CR PLL clock mode 10 10 8 8 ICCMCRPLL[mA] ICCMCRPLL[mA] +50 TA[°C] 6 4 6 4 2 2 0 0 1 2 3 4 VCC[V] 5 6 7 −50 0 +50 +100 +150 TA[°C] (Continued) Document Number: 002-04696 Rev. *B Page 93 of 105 MB95650L Series (Continued) ICCMPLL  TA VCC  3.3 V, FMP  16 MHz (PLL multiplication rate: 4) Main PLL clock mode 10 10 8 8 6 6 ICCMPLL[mA] ICCMPLL[mA] ICCMPLL  VCC TA  25 C, FMP  16 MHz (PLL multiplication rate: 4) Main PLL clock mode 4 2 4 2 0 0 1 2 3 4 5 6 −50 7 0 VCC[V] ICCSCR  VCC TA  25 C, FMPL  50 kHz (divided by 2) Sub-CR clock mode +100 +150 ICCSCR  TA VCC  3.3 V, FMPL  50 kHz (divided by 2) Sub-CR clock mode 200 200 150 150 ICCSCR[μA] ICCSCR[μA] +50 TA[°C] 100 100 50 50 0 0 1 2 3 4 VCC[V] Document Number: 002-04696 Rev. *B 5 6 7 −50 0 +50 +100 +150 TA[°C] Page 94 of 105 MB95650L Series Input voltage characteristics VIHI1  VCC and VILI  VCC TA  25 C VIHI2  VCC and VILI  VCC TA  25 C 5 5 VIHI2 VILI 4 4 3 3 VIHI2/VILI[V] VIHI1/VILI[V] VIHI1 VILI 2 1 2 1 0 0 1 2 3 4 5 6 1 2 3 VCC[V] 4 5 VIHS  VCC and VILS  VCC TA  25 C VIHM  VCC and VILM  VCC TA  25 C 5 5 VIHS VILS VIHM VILM 4 4 3 3 VIHM/VILM[V] VIHS/VILS[V] 6 VCC[V] 2 1 2 1 0 0 1 2 3 4 VCC[V] Document Number: 002-04696 Rev. *B 5 6 1 2 3 4 5 6 VCC[V] Page 95 of 105 MB95650L Series Output voltage characteristics (VCC  VOH2)  IOH TA  25 C 1.0 1.0 0.8 0.8 VCC − VOH2[V] VCC − VOH1[V] (VCC  VOH1)  IOH TA  25 C 0.6 0.4 0.2 0.6 0.4 0.2 0.0 0.0 0 −1 −2 −3 −4 −5 −6 −7 −8 −9 −10 −11 −12 −13 −14 −15 0 −1 −2 −3 −4 −5 −6 −7 −8 −9 −10 −11 −12 −13 −14 −15 IOH[mA] IOH[mA] VCC = 1.8 V VCC = 2.0 V VCC = 2.4 V VCC = 2.7 V VCC = 3.0 V VCC = 3.6 V VCC = 4.0 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V VCC = 1.8 V VCC = 2.0 V VCC = 2.4 V VCC = 2.7 V VCC = 3.0 V VCC = 3.6 V VCC = 4.0 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V VOL1  IOL TA  25 C VOL2  IOL TA  25 C 0.8 0.8 0.6 0.6 VOL2[V] 1.0 VOL1[V] 1.0 0.4 0.4 0.2 0.2 0.0 0.0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 IOL[mA] VCC = 1.8 V VCC = 2.0 V VCC = 2.4 V VCC = 2.7 V VCC = 3.0 V VCC = 3.6 V VCC = 4.0 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V Document Number: 002-04696 Rev. *B 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 IOL[mA] VCC = 1.8 V VCC = 2.0 V VCC = 2.4 V VCC = 2.7 V VCC = 3.0 V VCC = 3.6 V VCC = 4.0 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V Page 96 of 105 MB95650L Series Pull-up characteristics RPULL  VCC TA  25 C 300 250 RPULL[kΩ] 200 150 100 50 0 1 2 3 4 5 6 VCC[V] Document Number: 002-04696 Rev. *B Page 97 of 105 MB95650L Series 20. Mask Options Part number No. MB95F652E MB95F653E MB95F654E MB95F656E Selectable/Fixed MB95F652L MB95F653L MB95F654L MB95F656L Fixed 1 Low-voltage detection reset/interrupt With low-voltage detection reset/interrupt Without low-voltage detection reset/interrupt 2 Reset With dedicated reset input Document Number: 002-04696 Rev. *B Without dedicated reset input Page 98 of 105 MB95650L Series 21. Ordering Information Part number Package MB95F652EPFT-G-SNE2 MB95F652LPFT-G-SNE2 MB95F653EPFT-G-SNE2 MB95F653LPFT-G-SNE2 MB95F654EPFT-G-SNE2 MB95F654LPFT-G-SNE2 MB95F656EPFT-G-SNE2 MB95F656LPFT-G-SNE2 24-pin plastic TSSOP (FPT-24P-M10) MB95F652EPF-G-SNE2 MB95F652LPF-G-SNE2 MB95F653EPF-G-SNE2 MB95F653LPF-G-SNE2 MB95F654EPF-G-SNE2 MB95F654LPF-G-SNE2 MB95F656EPF-G-SNE2 MB95F656LPF-G-SNE2 24-pin plastic SOP (FPT-24P-M34) MB95F652EWQN-G-SNE1 MB95F652EWQN-G-SNERE1 MB95F652LWQN-G-SNE1 MB95F652LWQN-G-SNERE1 MB95F653EWQN-G-SNE1 MB95F653EWQN-G-SNERE1 MB95F653LWQN-G-SNE1 MB95F653LWQN-G-SNERE1 MB95F654EWQN-G-SNE1 MB95F654EWQN-G-SNERE1 MB95F654LWQN-G-SNE1 MB95F654LWQN-G-SNERE1 MB95F656EWQN-G-SNE1 MB95F656EWQN-G-SNERE1 MB95F656LWQN-G-SNE1 MB95F656LWQN-G-SNERE1 32-pin plastic QFN (LCC-32P-M19) Document Number: 002-04696 Rev. *B Page 99 of 105 MB95650L Series 22. Package Dimension 24-pin plastic TSSOP Lead pitch 0.65 mm Package width × package length 4.40 mm × 7.80 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.20 mm MAX Weight 0.10 g (FPT-24P-M10) 24-pin plastic TSSOP (FPT-24P-M10) Note 1) Pins width and pins thickness include plating thickness. Note 2) Pins width do not include tie bar cutting remainder. Note 3) #: These dimensions do not include resin protrusion. # 7.80±0.10(.307±.004) +0.06 24 0.13 –0.03 +.002 .005 –.001 13 BTM E-MARK # 4.40±0.10 (.173±.004) INDEX Details of "A" part 6.40±0.20 (.252±.008) 1 12 0.65(.026) +0.07 0.22 –0.02 +.003 .008 –.001 1.20(.047) (Mounting height) MAX 0~8° "A" 0.10(.004) 0.60±0.15 (.024±.006) 0.10±0.05 (Stand off) (.004±.002) 0.10(.004) C 2008-2010 FUJITSU SEMICONDUCTOR LIMITED F24033S-c-1-2 Dimensions in mm (inches). Note: The values in parentheses are reference values. (Continued) Document Number: 002-04696 Rev. *B Page 100 of 105 MB95650L Series 24-pin plastic SOP Lead pitch 1.27 mm Package width × package length 7.50 mm × 15.34 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height 2.80 mm MAX Weight 0.44 g (FPT-24P-M34) 24-pin plastic SOP (FPT-24P-M34) Note 1) * : These dimensions do not include resin protrusion. *15.34±0.10(.604±.004) 24 0.27±0.07 (.011±.003) 13 10.20±0.40 (.402±.016) +0.10 7.50±0.10 (.295±.004) INDEX ø1.20±0.1 DEP0.20 –0.05 +.004 ø.047±.004 DEP.008 –.002 Details of "A" part 2.60 .102 +0.20 –0.25 +.008 –.010 0.25(.010) 1 12 1.27(.050) 0.42±0.07 (.017±.003) "A" 0~8° 0.25(.010) M 0.60±0.20 (.024±.008) +0.15 0.15 –0.10 .006 +.006 –.004 0.10(.004) C 2009-2010 FUJITSU SEMICONDUCTOR LIMITED F24034S-c-1-2 Dimensions in mm (inches). Note: The values in parentheses are reference values. (Continued) Document Number: 002-04696 Rev. *B Page 101 of 105 MB95650L Series (Continued) 32-pin plastic QFN Lead pitch 0.50 mm Package width × package length 5.00 mm × 5.00 mm Sealing method Plastic mold Mounting height 0.80 mm MAX Weight 0.06 g (LCC-32P-M19) 32-pin plastic QFN (LCC-32P-M19) 3.50±0.10 (.138±.004) 5.00±0.10 (.197±.004) 5.00±0.10 (.197±.004) 3.50±0.10 (.138±.004) INDEX AREA 0.25 (.010 (3-R0.20) ((3-R.008)) 0.50(.020) +0.05 –0.07 +.002 –.003 ) 0.40±0.05 (.016±.002) 1PIN CORNER (C0.30(C.012)) (TYP) 0.75±0.05 (.030±.002) 0.02 (.001 C 2009-2010 FUJITSU SEMICONDUCTOR LIMITED C32071S-c-1-2 Document Number: 002-04696 Rev. *B +0.03 –0.02 +.001 –.001 (0.20(.008)) ) Dimensions in mm (inches). Note: The values in parentheses are reference values. Page 102 of 105 MB95650L Series 23. Major Changes Spansion Publication Number: DS702–00016–3v0-E Page 19 64 Section Details • C pin Corrected the following statement. The bypass capacitor for the VCC pin must have a capacitance larger than CS.  The decoupling capacitor for the VCC pin must have a capacitance equal to or larger than the capacitance of CS. Electrical Characteristics 4. AC Characteristics (1) Clock Timing Corrected the pin name of the parameter “Input clock rising time and falling time”. X0  X0, X0A Pin Connection NOTE: Please see “Document History” about later revised information. Document Number: 002-04696 Rev. *B Page 103 of 105 MB95650L Series Document History Document Title: MB95650L Series New 8FX 8-bit Microcontrollers Document Number: 002-04696 Revision ECN Orig. of Change Submission Date ** — AKIH 06/14/2013 Migrated to Cypress and assigned document number 002-04696. No change to document contents or format. *A 5216808 AKIH 04/12/2016 Updated to Cypress format. *B 5846146 YSAT 08/07/2017 Adapted new Cypress logo Document Number: 002-04696 Rev. *B Description of Change Page 104 of 105 MB95650L Series Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC®Solutions Products ARM® Cortex® Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface cypress.com/clocks cypress.com/interface Internet of Things Memory cypress.com/iot cypress.com/memory Microcontrollers cypress.com/mcu PSoC cypress.com/psoc Power Management ICs Cypress Developer Community Forums| WICED IOT Forums | Projects | Video | Blogs | Training | Components Technical Support cypress.com/support cypress.com/pmic Touch Sensing cypress.com/touch USB Controllers Wireless Connectivity PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 cypress.com/usb cypress.com/wireless © Cypress Semiconductor Corporation, 2012-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). 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Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 002-04696 Rev. *B Revised August 7, 2017 Page 105 of 105