MB96F612RBPMC-GSE2

Please note that Cypress is an Infineon Technologies Company. The document following this cover page is marked as “Cypress” document as this is the company that originally developed the product. Please note that Infineon will continue to offer the product to new and existing customers as part of the Infineon product portfolio. Continuity of document content The fact that Infineon offers the following product as part of the Infineon product portfolio does not lead to any changes to this document. Future revisions will occur when appropriate, and any changes will be set out on the document history page. Continuity of ordering part numbers Infineon continues to support existing part numbers. Please continue to use the ordering part numbers listed in the datasheet for ordering. www.infineon.com CY96610 Series F2MC-16FX 16-bit Proprietary Microcontroller CY96610 series is based on Cypress advanced F2MC-16FX architecture (16-bit with instruction pipeline for RISC-like performance). The CPU uses the same instruction set as the established F2MC-16LX family thus allowing for easy migration of F2MC-16LX Software to the new F2MC-16FX products. F2MC-16FX product improvements compared to the previous generation include significantly improved performance - even at the same operation frequency, reduced power consumption and faster start-up time. For high processing speed at optimized power consumption an internal PLL can be selected to supply the CPU with up to 32MHz operation frequency from an external 4MHz to 8MHz resonator. The result is a minimum instruction cycle time of 31.2ns going together with excellent EMI behavior. The emitted power is minimized by the on-chip voltage regulator that reduces the internal CPU voltage. A flexible clock tree allows selecting suitable operation frequencies for peripheral resources independent of the CPU speed. Features Technology Low Voltage Detection Function ◼ 0.18µm CMOS ◼ Reset is generated when supply voltage falls below programmable reference voltage CPU ◼ F2MC-16FX CPU Code Security ◼ Optimized instruction set for controller applications (bit, byte, word and long-word data types, 23 different addressing modes, barrel shift, variety of pointers) ◼ Protects Flash Memory content from unintended read-out DMA ◼ 8-byte instruction queue ◼ Automatic transfer function independent of CPU, can be assigned freely to resources ◼ Signed multiply (16-bit  16-bit) and divide (32-bit/16-bit) instructions available Interrupts System Clock ◼ Fast Interrupt processing ◼ On-chip PLL clock multiplier (1 to 8, 1 when PLL stop) ◼ 8 programmable priority levels ◼ 4MHz to 8MHz crystal oscillator (maximum frequency when using ceramic resonator depends on Q-factor) ◼ Non-Maskable Interrupt (NMI) ◼ Up to 8MHz external clock for devices with fast clock input feature ◼ Supports CAN protocol version 2.0 part A and B ◼ 32.768kHz subsystem quartz clock ◼ Bit rates up to 1Mbps ◼ 100kHz/2MHz internal RC clock for quick and safe startup, clock stop detection function, watchdog ◼ 32 message objects ◼ Clock source selectable from mainclock oscillator, subclock oscillator and on-chip RC oscillator, independently for CPU and 2 clock domains of peripherals ◼ Programmable FIFO mode (concatenation of message objects) CAN ◼ ISO16845 certified ◼ Each message object has its own identifier mask ◼ The subclock oscillator is enabled by the Boot ROM program controlled by a configuration marker after a Power or External reset ◼ Maskable interrupt ◼ Low Power Consumption - 13 operating modes (different Run, Sleep, Timer, Stop modes) ◼ Programmable loop-back mode for self-test operation ◼ Disabled Automatic Retransmission mode for Time Triggered CAN applications USART On-Chip Voltage Regulator ◼ Internal voltage regulator supports a wide MCU supply voltage range (Min=2.7V), offering low power consumption ◼ Full duplex USARTs (SCI/LIN) ◼ Wide range of baud rate settings using a dedicated reload timer ◼ Special synchronous options for adapting to different synchronous serial protocols Cypress Semiconductor Corporation Document Number: 002-04709 Rev. *F • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised June 19, 2020 CY96610 Series ◼ LIN functionality working either as master or slave LIN device ◼ Extended support for LIN-Protocol to reduce interrupt load ◼ Internal prescaler allows 1, 1/4, 1/16, 1/64 of peripheral clock as counter clock or of selected Reload timer underflow as clock input A/D Converter ◼ Can trigger ADC conversion ◼ SAR-type ◼ Timing point capture ◼ 8/10-bit resolution ◼ Signals interrupt on conversion end, single conversion mode, continuous conversion mode, stop conversion mode, activation by software, external trigger, reload timers and PPGs ◼ Range Comparator Function ◼ Can be triggered by software or reload timer Quadrature Position/Revolution Counter (QPRC) ◼ Up/down count mode, Phase difference count mode, Count mode with direction ◼ 16-bit position counter ◼ 16-bit revolution counter Source Clock Timers ◼ Two 16-bit compare registers with interrupt ◼ Three independent clock timers (23-bit RC clock timer, 23bit Main clock timer, 17-bit Sub clock timer) ◼ Detection edge of the three external event input pins AIN, BIN and ZIN is configurable Hardware Watchdog Timer Real Time Clock ◼ Hardware watchdog timer is active after reset ◼ Operational on main oscillation (4MHz), sub oscillation (32kHz) or RC oscillation (100kHz/2MHz) ◼ Window function of Watchdog Timer is used to select the lower window limit of the watchdog interval ◼ Capable to correct oscillation deviation of Sub clock or RC oscillator clock (clock calibration) Reload Timers ◼ Read/write accessible second/minute/hour registers ◼ 16-bit wide ◼ Can signal interrupts every half second/second/minute/hour/day ◼ Prescaler with 1/21, 1/22, 1/23, 1/24, 1/25, 1/26 of peripheral clock frequency ◼ Event count function ◼ Internal clock divider and prescaler provide exact 1s clock External Interrupts Free-Running Timers ◼ Edge or Level sensitive ◼ Signals an interrupt on overflow, supports timer clear upon match with Output Compare (0, 4) ◼ Interrupt mask bit per channel ◼ Prescaler with 1, 1/21, 1/22, 1/23, 1/24, 1/25, 1/26, 1/27, 1/28 of peripheral clock frequency Input Capture Units ◼ Each available CAN channel RX has an external interrupt for wake-up ◼ Selected USART channels SIN have an external interrupt for wake-up ◼ 16-bit wide Non Maskable Interrupt ◼ Signals an interrupt upon external event ◼ Disabled after reset, can be enabled by Boot-ROM depending on ROM configuration block ◼ Rising edge, Falling edge or Both (rising & falling) edges sensitive Output Compare Units ◼ 16-bit wide ◼ Signals an interrupt when a match with Free-running Timer occurs ◼ A pair of compare registers can be used to generate an output signal ◼ Once enabled, can not be disabled other than by reset ◼ High or Low level sensitive ◼ Pin shared with external interrupt 0 I/O Ports ◼ Most of the external pins can be used as general purpose I/O ◼ All push-pull outputs Programmable Pulse Generator ◼ Bit-wise programmable as input/output or peripheral signal ◼ 16-bit down counter, cycle and duty setting registers ◼ Bit-wise programmable input enable ◼ Can be used as 2 ×8-bit PPG ◼ One input level per GPIO-pin (either Automotive or CMOS hysteresis) ◼ Interrupt at trigger, counter borrow and/or duty match ◼ PWM operation and one-shot operation Document Number: 002-04709 Rev. *F ◼ Bit-wise programmable pull-up resistor Page 2 of 64 CY96610 Series Built-in On Chip Debugger (OCD) Flash Memory ◼ One-wire debug tool interface ◼ Dual operation flash allowing reading of one Flash bank while programming or erasing the other bank ◼ Break function:  Hardware break: 6 points (shared with code event)  Software break: 4096 points ◼ Event function  Code event: 6 points (shared with hardware break)  Data event: 6 points  Event sequencer: 2 levels + reset ◼ Command sequencer for automatic execution of programming algorithm and for supporting DMA for programming of the Flash Memory ◼ Supports automatic programming, Embedded Algorithm ◼ Write/Erase/Erase-Suspend/Resume commands ◼ A flag indicating completion of the automatic algorithm ◼ Execution time measurement function ◼ Erase can be performed on each sector individually ◼ Trace function: 42 branches ◼ Sector protection ◼ Security function ◼ Flash Security feature to protect the content of the Flash ◼ Low voltage detection during Flash erase or write Document Number: 002-04709 Rev. *F Page 3 of 64 CY96610 Series Contents 1. Product Lineup ...................................................................................................................................................... 6 2. Block Diagram ....................................................................................................................................................... 7 3. Pin Assignment ..................................................................................................................................................... 8 4. Pin Description ...................................................................................................................................................... 9 5. Pin Circuit Type ................................................................................................................................................... 11 6. I/O Circuit Type .................................................................................................................................................... 13 7. Memory Map ........................................................................................................................................................ 18 8. RAMstart Addresses ........................................................................................................................................... 19 9. User ROM Memory Map for Flash Devices ....................................................................................................... 20 10. Serial Programming Communication Interface ................................................................................................ 21 11. Interrupt Vector Table ......................................................................................................................................... 22 12. Handling Precautions ......................................................................................................................................... 26 12.1 Precautions for Product Design .......................................................................................................................... 26 12.2 Precautions for Package Mounting ..................................................................................................................... 27 12.3 Precautions for Use Environment ....................................................................................................................... 29 13. Handling Devices ................................................................................................................................................ 30 13.1 Latch-Up Prevention ........................................................................................................................................... 30 13.2 Unused Pins Handling ........................................................................................................................................ 30 13.3 External Clock Usage ......................................................................................................................................... 30 13.3.1 Single Phase External Clock for Main Oscillator ................................................................................................. 31 13.3.2 Single Phase External Clock for Sub Oscillator .................................................................................................. 31 13.3.3 Opposite Phase External Clock........................................................................................................................... 31 13.4 Notes on PLL Clock Mode Operation ................................................................................................................. 31 13.5 Power Supply Pins (Vcc/Vss) ............................................................................................................................. 31 13.6 Crystal Oscillator and ceramic resonator Circuit ................................................................................................. 31 13.7 Turn on Sequence of Power Supply to A/D Converter and Analog Inputs.......................................................... 32 13.8 Pin Handling when Not Using the A/D Converter ............................................................................................... 32 13.9 Notes on Power-on ............................................................................................................................................. 32 13.10 Stabilization of Power Supply Voltage ................................................................................................................ 32 13.11 Serial Communication ........................................................................................................................................ 32 13.12 Mode Pin (MD) ................................................................................................................................................... 32 14. Electrical Characteristics ................................................................................................................................... 33 14.1 Absolute Maximum Ratings ................................................................................................................................ 33 14.2 Recommended Operating Conditions ................................................................................................................ 35 14.3 DC Characteristics ............................................................................................................................................. 36 14.3.1 Current Rating ..................................................................................................................................................... 36 14.3.2 Pin Characteristics .............................................................................................................................................. 39 14.4 AC Characteristics .............................................................................................................................................. 40 14.4.1 Main Clock Input Characteristics ......................................................................................................................... 40 14.4.2 Sub Clock Input Characteristics .......................................................................................................................... 41 14.4.3 Built-in RC Oscillation Characteristics ................................................................................................................. 42 14.4.4 Internal Clock Timing .......................................................................................................................................... 42 14.4.5 Operating Conditions of PLL ............................................................................................................................... 43 14.4.6 Reset Input .......................................................................................................................................................... 43 14.4.7 Power-on Reset Timing ....................................................................................................................................... 44 14.4.8 USART Timing .................................................................................................................................................... 45 14.4.9 External Input Timing .......................................................................................................................................... 47 14.5 A/D Converter ..................................................................................................................................................... 48 14.5.1 Electrical Characteristics for the A/D Converter .................................................................................................. 48 14.5.2 Accuracy and Setting of the A/D Converter Sampling Time ................................................................................ 49 Document Number: 002-04709 Rev. *F Page 4 of 64 CY96610 Series 14.5.3 Definition of A/D Converter Terms ...................................................................................................................... 49 14.6 Low Voltage Detection Function Characteristics ................................................................................................ 52 14.7 Flash Memory Write/Erase Characteristics ........................................................................................................ 54 15. Example Characteristics..................................................................................................................................... 55 16. Ordering Information .......................................................................................................................................... 58 17. Package Dimension ............................................................................................................................................ 59 18. Major Changes .................................................................................................................................................... 60 Document History ........................................................................................................................................................ 63 Sales, Solutions, and Legal Information .................................................................................................................... 64 Document Number: 002-04709 Rev. *F Page 5 of 64 CY96610 Series 1. Product Lineup Features Product Type Subclock Dual Operation Flash Memory 32.5KB + 32KB 64.5KB + 32KB 128.5KB + 32KB RAM 4KB 10KB 10KB Package DMA USART with automatic LIN-Header transmission/reception with 16 byte RX- and TX-FIFO CY96610 Flash Memory Product Subclock can be set by software CY96F612R, CY96F612A CY96F613R, CY96F613A CY96F615R, CY96F615A LQFP-48 LQA048 2ch 3ch Remark Product Options R: MCU with CAN A: MCU without CAN Yes (only 1ch) LIN-USART 2 LIN-USART 2/7/8 No AN 0/1/3/4/6 to 10/ 12/14/16/24/25/30/31 8/10-bit A/D Converter 16ch with Data Buffer with Range Comparator with Scan Disable with ADC Pulse Detection 16-bit Reload Timer (RLT) No Yes No No 3ch 16-bit Free-Running Timer (FRT) 4ch 16-bit Input Capture Unit (ICU) 7ch (3 channels for LIN-USART) 16-bit Output Compare Unit (OCU) 5ch 8/16-bit Programmable Pulse Generator (PPG) with Timing point capture with Start delay with Ramp Quadrature Position/Revolution Counter (QPRC) 8ch (16-bit) / 16ch (8-bit) Yes No No 2ch QPRC 0/1 CAN Interface 1ch CAN 2 32 Message Buffers External Interrupts (INT) Clock Calibration Unit (CAL) Clock Output Function 11ch 1ch 1ch 35 (Dual clock mode) 37 (Single clock mode) 1ch 2ch Low Voltage Detection Function Yes Hardware Watchdog Timer On-chip RC-oscillator On-chip Debugger Yes Yes Yes Non-Maskable Interrupt (NMI) Real Time Clock (RTC) I/O Ports RLT 1/3/6 FRT 0 to 3 FRT 0 to 3 does not have external clock input pin ICU 0/1/4 to 6/9/10 (ICU 6/9/10 for LIN-USART) OCU 0/1/4/6/7 (OCU 4 for FRT clear) PPG 0/1/3/4/6/7/12/14 INT 0/2/3/4/7 to 13 Low voltage detection function can be disabled by software Note: − All signals of the peripheral function in each product cannot be allocated by limiting the pins of package. It is necessary to use the port relocate function of the general I/O port according to your function use. Document Number: 002-04709 Rev. *F Page 6 of 64 CY96610 Series 2. Block Diagram DEBUG I/F CKOT0_R, CKOT1, CKOT1_R CKOTX1 X0, X1 X0A, X1A RSTX MD NMI Clock & Mode Controller Flash Memory A Interrupt Controller 16FX CPU OCD 16FX Core Bus (CLKB) AVcc AVss AVRH AN0, AN1, AN3, AN4 AN6 to AN10 AN12, AN14, AN16 AN24, AN25 AN30, AN31 ADTG_R TIN1 TOT1, TOT3 IN0, IN1 OUT0_R, OUT1_R IN4, IN5 OUT6, OUT7 Peripheral Bus Bridge 8/10-bit ADC 16ch 16-bit Reload Timer 1/3/6 3ch I/O Timer 0 FRT 0 ICU 0/1 OCU 0/1 I/O Timer 1 FRT 1 ICU 4/5/6 OCU 4/6/7 I/O Timer 2 FRT 2 ICU 9 I/O Timer 3 FRT 3 ICU 10 Document Number: 002-04709 Rev. *F Peripheral Bus Bridge Peripheral Bus 2 (CLKP2) Watchdog Peripheral Bus 1 (CLKP1) DMA Controller RAM Boot ROM Voltage Regulator Vcc Vss C CAN Interface 1ch USART 3ch PPG 8ch (16-bit) / 16ch (8-bit) RX2 TX2 SIN2, SIN2_R, SIN7_R, SIN8_R SOT2, SOT2_R, SOT7_R, SOT8_R SCK2, SCK2_R, SCK7_R, SCK8_R TTG0, TTG1, TTG4, TTG5 TTG12, TTG13 PPG0, PPG1, PPG3, PPG4 PPG6, PPG7, PPG12, PPG14 PPG0_B, PPG1_B, PPG3_B, PPG4_B PPG6_B, PPG7_B, PPG12_B, PPG14_B Real Time Clock AIN0, AIN1 QPRC 2ch BIN0, BIN1 ZIN0, ZIN1 External Interrupt 11ch INT0, INT8 to INT13 INT2_R, INT4_R INT7_R, INT10_R INT3_R1 Page 7 of 64 CY96610 Series 3. Pin Assignment P01_1 / TOT1 / CKOTX1 / OUT1_R P01_4 / PPG4_B P01_5 / SIN2_R / INT7_R*1 P01_6 / SOT2_R / PPG6_B P01_7 / SCK2_R / PPG7_B*1 P02_0 / PPG12 / CKOT1_R P02_2 / ZIN0 / PPG14 / CKOT0_R P02_4 / AIN0 / IN0 / TTG0 RSTX X1 X0 Vss (Top view) 36 35 34 33 32 31 30 29 28 27 26 25 Vcc 37 24 P01_0 / TIN1 / CKOT1 / OUT0_R C 38 23 P00_3 / INT11 / SCK8_R / PPG3_B*1 P02_5 / BIN0 / IN1 / TTG1 / ADTG_R 39 22 P00_5 / INT13 / SIN8_R / PPG14_B*1 P03_0 / AIN1 / IN4 / TTG4 / TTG12 / AN24 40 21 P00_4 / INT12 / SOT8_R / PPG12_B P03_1 / BIN1 / IN5 / TTG5 / TTG13 / AN25 41 20 P00_2 / INT10 / SIN7_R*1 1 42 19 P00_1 / INT9 / SOT7_R / PPG1_B P03_3 / TX2 43 18 P00_0 / INT8 / SCK7_R / PPG0_B*1 P03_6 / ZIN1 / OUT6 / AN30 44 17 DEBUG I/F P03_7 / OUT7 / AN31 45 16 P17_0 P06_0 / AN0 / PPG0 46 15 MD P06_1 / AN1 / PPG1 47 14 P04_1 / X1A*2 AVcc 48 13 P04_0 / X0A*2 8 9 P05_1 / AN9 / SOT2 P05_2 / AN10 / SCK2*1 10 11 12 P07_0 / AN16 / INT0 / NMI 7 P05_6 / AN14 / INT4_R 6 P05_4 / AN12 / TOT3 / INT2_R 5 P05_0 / AN8 / SIN2 / INT3_R1*1 P06_3 / AN3 / PPG3 4 P06_7 / AN7 / PPG7 3 P06_6 / AN6 / PPG6 2 P06_4 / AN4 / PPG4 1 AVss LQFP - 48 AVRH P03_2 / INT10_R / RX2* (LQA048) *1: CMOS input level only *2: Please set ROM Configuration Block (RCB) to use the subclock. Other than those above, general-purpose pins have only Automotive input level. Document Number: 002-04709 Rev. *F Page 8 of 64 CY96610 Series 4. Pin Description Pin Name Feature Description ADTG_R ADC Relocated A/D converter trigger input pin AINn QPRC Quadrature Position/Revolution Counter Unit n input pin ANn ADC A/D converter channel n input pin AVcc Supply Analog circuits power supply pin AVRH ADC A/D converter high reference voltage input pin AVss Supply Analog circuits power supply pin BINn QPRC Quadrature Position/Revolution Counter Unit n input pin C Voltage regulator Internally regulated power supply stabilization capacitor pin CKOTn Clock Output function Clock Output function n output pin CKOTn_R Clock Output function Relocated Clock Output function n output pin CKOTXn Clock Output function Clock Output function n inverted output pin DEBUG I/F OCD On Chip Debugger input/output pin INn ICU Input Capture Unit n input pin INTn External Interrupt External Interrupt n input pin INTn_R External Interrupt Relocated External Interrupt n input pin INTn_R1 External Interrupt Relocated External Interrupt n input pin MD Core Input pin for specifying the operating mode NMI External Interrupt Non-Maskable Interrupt input pin OUTn OCU Output Compare Unit n waveform output pin OUTn_R OCU Relocated Output Compare Unit n waveform output pin Pnn_m GPIO General purpose I/O pin PPGn PPG Programmable Pulse Generator n output pin (16bit/8bit) PPGn_B PPG Programmable Pulse Generator n output pin (16bit/8bit) RSTX Core Reset input pin RXn CAN CAN interface n RX input pin SCKn USART USART n serial clock input/output pin SCKn_R USART Relocated USART n serial clock input/output pin SINn USART USART n serial data input pin SINn_R USART Relocated USART n serial data input pin SOTn USART USART n serial data output pin SOTn_R USART Relocated USART n serial data output pin TINn Reload Timer Reload Timer n event input pin TOTn Reload Timer Reload Timer n output pin TTGn PPG Programmable Pulse Generator n trigger input pin TXn CAN CAN interface n TX output pin Vcc Supply Power supply pin Vss Supply Power supply pin X0 Clock Oscillator input pin X0A Clock Subclock Oscillator input pin X1 Clock Oscillator output pin X1A Clock Subclock Oscillator output pin Document Number: 002-04709 Rev. *F Page 9 of 64 CY96610 Series Pin Name ZINn Feature QPRC Document Number: 002-04709 Rev. *F Description Quadrature Position/Revolution Counter Unit n input pin Page 10 of 64 CY96610 Series 5. Pin Circuit Type Pin No. I/O Circuit Type* Pin Name 1 Supply AVss 2 G AVRH 3 K P06_3 / AN3 / PPG3 4 K P06_4 / AN4 / PPG4 5 K P06_6 / AN6 / PPG6 6 K P06_7 / AN7 / PPG7 7 I P05_0 / AN8 / SIN2 / INT3_R1 8 K P05_1 / AN9 / SOT2 9 I P05_2 / AN10 / SCK2 10 K P05_4 / AN12 / TOT3 / INT2_R 11 K P05_6 / AN14 / INT4_R 12 K P07_0 / AN16 / INT0 / NMI 13 B P04_0 / X0A 14 B P04_1 / X1A 15 C MD 16 H P17_0 17 O DEBUG I/F 18 M P00_0 / INT8 / SCK7_R / PPG0_B 19 H P00_1 / INT9 / SOT7_R / PPG1_B 20 M P00_2 / INT10 / SIN7_R 21 H P00_4 / INT12 / SOT8_R / PPG12_B 22 M P00_5 / INT13 / SIN8_R / PPG14_B 23 M P00_3 / INT11 / SCK8_R / PPG3_B 24 H P01_0 / TIN1 / CKOT1 / OUT0_R 25 H P01_1 / TOT1 / CKOTX1 / OUT1_R 26 H P01_4 / PPG4_B 27 M P01_5 / SIN2_R / INT7_R 28 H P01_6 / SOT2_R / PPG6_B 29 M P01_7 / SCK2_R / PPG7_B 30 H P02_0 / PPG12 / CKOT1_R 31 H P02_2 / ZIN0 / PPG14 / CKOT0_R 32 H P02_4 / AIN0 / IN0 / TTG0 Document Number: 002-04709 Rev. *F Page 11 of 64 CY96610 Series Pin No. I/O Circuit Type* Pin Name 33 C RSTX 34 A X1 35 A X0 36 Supply Vss 37 Supply Vcc 38 F C 39 H P02_5 / BIN0 / IN1 / TTG1 / ADTG_R 40 K P03_0 / AIN1 / IN4 / TTG4 / TTG12 / AN24 41 K P03_1 / BIN1 / IN5 / TTG5 / TTG13 / AN25 42 M P03_2 / INT10_R / RX2 43 H P03_3 / TX2 44 K P03_6 / ZIN1 / OUT6 / AN30 45 K P03_7 / OUT7 / AN31 46 K P06_0 / AN0 / PPG0 47 K P06_1 / AN1 / PPG1 48 Supply AVcc *: See I/O Circuit Type” for details on the I/O circuit types. Document Number: 002-04709 Rev. *F Page 12 of 64 CY96610 Series 6. I/O Circuit Type Type Circuit Remarks A High-speed oscillation circuit: ◼ Programmable between X1 oscillation mode (external crystal or resonator connected to X0/X1 pins) and Fast external Clock Input (FCI) mode (external clock connected to X0 pin) R ◼ Feedback resistor = approx. 0 1 X out 1.0MΩ ◼ The amplitude: 1.8V±0.15V to operate by the internal supply voltage FCI X0 FCI or Osc disable Document Number: 002-04709 Rev. *F Page 13 of 64 CY96610 Series Type Circuit Remarks B Pull-up control Low-speed oscillation circuit shared with GPIO functionality: ◼ Feedback resistor = approx. 5.0MΩ P-ch Standby control for input shutdown P-ch N-ch ◼ GPIO functionality selectable Pout (CMOS level output (IOL = 4mA, IOH = -4mA), Automotive input with input shutdown function and programmable pull-up resistor) Nout R Automotive input X1A R X out 0 1 FCI X0A FCI or Osc disable Pull-up control P-ch Standby control for input shutdown P-ch Pout N-ch Nout R Document Number: 002-04709 Rev. *F Automotive input Page 14 of 64 CY96610 Series Type Circuit Remarks C CMOS hysteresis input pin F Power supply input protection circuit P-ch N-ch G ◼ A/D converter ref+ (AVRH) power supply input pin with protection circuit P-ch ◼ Without protection circuit against VCC for pins AVRH N-ch H ◼ CMOS level output Pull-up control ◼ (IOL = 4mA, IOH = -4mA) ◼ Automotive input with input shutdown function P-ch P-ch Pout N-ch Nout ◼ Programmable pull-up resistor R Standby control for input shutdown Document Number: 002-04709 Rev. *F Automotive input Page 15 of 64 CY96610 Series Type Circuit Remarks I ◼ CMOS level output Pull-up control ◼ (IOL = 4mA, IOH = -4mA) ◼ CMOS hysteresis input with input shutdown function P-ch P-ch N-ch Pout ◼ Programmable pull-up resistor ◼ Analog input Nout R Hysteresis input Standby control for input shutdown Analog input K ◼ CMOS level output Pull-up control ◼ (IOL = 4mA, IOH = -4mA) ◼ Automotive input with input shutdown function P-ch P-ch Pout ◼ Programmable pull-up resistor ◼ Analog input N-ch Nout R Automotive input Standby control for input shutdown Analog input M ◼ CMOS level output Pull-up control ◼ (IOL = 4mA, IOH = -4mA) ◼ CMOS hysteresis input with input shutdown function P-ch R P-ch Pout N-ch Nout ◼ Programmable pull-up resistor Hysteresis input Standby control for input shutdown Document Number: 002-04709 Rev. *F Page 16 of 64 CY96610 Series Type Circuit Remarks O ◼ Open-drain I/O ◼ Output 25mA, Vcc = 2.7V ◼ TTL input N-ch Nout R Standby control for input shutdown Document Number: 002-04709 Rev. *F TTL input Page 17 of 64 CY96610 Series 7. Memory Map FF:FFFFH USER ROM*1 DE:0000H DD:FFFFH Reserved 10:0000H 0F:C000H Boot-ROM Peripheral 0E:9000H Reserved 01:0000H 00:8000H RAMSTART0*2 ROM/RAM MIRROR Internal RAM bank0 Reserved 00:0C00H 00:0380H Peripheral 00:0180H GPR*3 00:0100H DMA 00:00F0H Reserved 00:0000H Peripheral *1: For details about USER ROM area, see “User ROM Memory Map for Flash Devices” on the following pages. *2: For RAMSTART addresses, see the table on the next page. *3: Unused GPR banks can be used as RAM area. GPR: General-Purpose Register The DMA area is only available if the device contains the corresponding resource. The available RAM and ROM area depends on the device. Document Number: 002-04709 Rev. *F Page 18 of 64 CY96610 Series 8. RAMstart Addresses Devices Bank 0 RAM Size RAMSTART0 CY96F612 4KB 00:7200H CY96F613, CY96F615 10KB 00:5A00H Document Number: 002-04709 Rev. *F Page 19 of 64 CY96610 Series 9. User ROM Memory Map for Flash Devices *: Physical address area of SAS-512B is from DF:0000H to DF:01FFH. Others (from DF:0200H to DF:1FFFH) is mirror area of SAS-512B. Sector SAS contains the ROM configuration block RCBA at CPU address DF:0000H -DF:01FFH. SAS can not be used for E2PROM emulation. Document Number: 002-04709 Rev. *F Page 20 of 64 CY96610 Series 10. Serial Programming Communication Interface USART pins for Flash serial programming (MD = 0, DEBUG I/F = 0, Serial Communication mode) CY96610 Pin Number USART Number 7 8 Normal Function SIN2 USART2 SOT2 9 SCK2 20 SIN7_R 19 USART7 SOT7_R 18 SCK7_R 22 SIN8_R 21 23 Document Number: 002-04709 Rev. *F USART8 SOT8_R SCK8_R Page 21 of 64 CY96610 Series 11. Interrupt Vector Table Vector Offset in Number Vector Table Index in Cleared by Vector Name ICR to DMA Description Program 0 3FCH CALLV0 No - CALLV instruction 1 3F8H CALLV1 No - CALLV instruction 2 3F4H CALLV2 No - CALLV instruction 3 3F0H CALLV3 No - CALLV instruction 4 3ECH CALLV4 No - CALLV instruction 5 3E8H CALLV5 No - CALLV instruction 6 3E4H CALLV6 No - CALLV instruction 7 3E0H CALLV7 No - CALLV instruction 8 3DCH RESET No - Reset vector 9 3D8H INT9 No - INT9 instruction 10 3D4H EXCEPTION No - Undefined instruction execution 11 3D0H NMI No - Non-Maskable Interrupt 12 3CCH DLY No 12 Delayed Interrupt 13 3C8H RC_TIMER No 13 RC Clock Timer 14 3C4H MC_TIMER No 14 Main Clock Timer 15 3C0H SC_TIMER No 15 Sub Clock Timer 16 3BCH LVDI No 16 Low Voltage Detector 17 3B8H EXTINT0 Yes 17 External Interrupt 0 18 3B4H - - 18 Reserved 19 3B0H EXTINT2 Yes 19 External Interrupt 2 20 3ACH EXTINT3 Yes 20 External Interrupt 3 21 3A8H EXTINT4 Yes 21 External Interrupt 4 22 3A4H - - 22 Reserved 23 3A0H - - 23 Reserved 24 39CH EXTINT7 Yes 24 External Interrupt 7 25 398H EXTINT8 Yes 25 External Interrupt 8 26 394H EXTINT9 Yes 26 External Interrupt 9 27 390H EXTINT10 Yes 27 External Interrupt 10 28 38CH EXTINT11 Yes 28 External Interrupt 11 29 388H EXTINT12 Yes 29 External Interrupt 12 30 384H EXTINT13 Yes 30 External Interrupt 13 31 380H - - 31 Reserved 32 37CH - - 32 Reserved 33 378H - - 33 Reserved 34 374H - - 34 Reserved 35 370H CAN2 No 35 CAN Controller 2 36 36CH - - 36 Reserved 37 368H - - 37 Reserved 38 364H PPG0 Yes 38 Programmable Pulse Generator 0 39 360H PPG1 Yes 39 Programmable Pulse Generator 1 Document Number: 002-04709 Rev. *F Page 22 of 64 CY96610 Series Vector Offset in Number Vector Table Index in Cleared by Vector Name ICR to DMA Description Program 40 35CH - - 40 Reserved 41 358H PPG3 Yes 41 Programmable Pulse Generator 3 42 354H PPG4 Yes 42 Programmable Pulse Generator 4 43 350H - - 43 Reserved 44 34CH PPG6 Yes 44 Programmable Pulse Generator 6 45 348H PPG7 Yes 45 Programmable Pulse Generator 7 46 344H - - 46 Reserved 47 340H - - 47 Reserved 48 33CH - - 48 Reserved 49 338H - - 49 Reserved 50 334H PPG12 Yes 50 Programmable Pulse Generator 12 51 330H - - 51 Reserved 52 32CH PPG14 Yes 52 Programmable Pulse Generator 14 53 328H - - 53 Reserved 54 324H - - 54 Reserved 55 320H - - 55 Reserved 56 31CH - - 56 Reserved 57 318H - - 57 Reserved 58 314H - - 58 Reserved 59 310H RLT1 Yes 59 Reload Timer 1 60 30CH - - 60 Reserved 61 308H RLT3 Yes 61 Reload Timer 3 62 304H - - 62 Reserved 63 300H - - 63 Reserved 64 2FCH RLT6 Yes 64 Reload Timer 6 65 2F8H ICU0 Yes 65 Input Capture Unit 0 66 2F4H ICU1 Yes 66 Input Capture Unit 1 67 2F0H - - 67 Reserved 68 2ECH - - 68 Reserved 69 2E8H ICU4 Yes 69 Input Capture Unit 4 70 2E4H ICU5 Yes 70 Input Capture Unit 5 71 2E0H ICU6 Yes 71 Input Capture Unit 6 72 2DCH - - 72 Reserved 73 2D8H - - 73 Reserved 74 2D4H ICU9 Yes 74 Input Capture Unit 9 75 2D0H ICU10 Yes 75 Input Capture Unit 10 76 2CCH - - 76 Reserved 77 2C8H OCU0 Yes 77 Output Compare Unit 0 78 2C4H OCU1 Yes 78 Output Compare Unit 1 79 2C0H - - 79 Reserved 80 2BCH - - 80 Reserved Document Number: 002-04709 Rev. *F Page 23 of 64 CY96610 Series Vector Offset in Number Vector Table Index in Cleared by Vector Name ICR to DMA Description Program 81 2B8H OCU4 Yes 81 Output Compare Unit 4 82 2B4H - - 82 Reserved 83 2B0H OCU6 Yes 83 Output Compare Unit 6 84 2ACH OCU7 Yes 84 Output Compare Unit 7 85 2A8H - - 85 Reserved 86 2A4H - - 86 Reserved 87 2A0H - - 87 Reserved 88 29CH - - 88 Reserved 89 298H FRT0 Yes 89 Free-Running Timer 0 90 294H FRT1 Yes 90 Free-Running Timer 1 91 290H FRT2 Yes 91 Free-Running Timer 2 92 28CH FRT3 Yes 92 Free-Running Timer 3 93 288H RTC0 No 93 Real Time Clock 94 284H CAL0 No 94 Clock Calibration Unit 95 280H - - 95 Reserved 96 27CH - - 96 Reserved 97 278H - - 97 Reserved 98 274H ADC0 Yes 98 A/D Converter 0 99 270H - - 99 Reserved 100 26CH - - 100 Reserved 101 268H - - 101 Reserved 102 264H - - 102 Reserved 103 260H - - 103 Reserved 104 25CH - - 104 Reserved 105 258H LINR2 Yes 105 LIN USART 2 RX 106 254H LINT2 Yes 106 LIN USART 2 TX 107 250H - - 107 Reserved 108 24CH - - 108 Reserved 109 248H - - 109 Reserved 110 244H - - 110 Reserved 111 240H - - 111 Reserved 112 23CH - - 112 Reserved 113 238H - - 113 Reserved 114 234H - - 114 Reserved 115 230H LINR7 Yes 115 LIN USART 7 RX 116 22CH LINT7 Yes 116 LIN USART 7 TX 117 228H LINR8 Yes 117 LIN USART 8 RX 118 224H LINT8 Yes 118 LIN USART 8 TX 119 220H - - 119 Reserved 120 21CH - - 120 Reserved 121 218H - - 121 Reserved Document Number: 002-04709 Rev. *F Page 24 of 64 CY96610 Series Vector Offset in Number Vector Table Index in Cleared by Vector Name DMA ICR to Description Program 122 214H - - 122 Reserved 123 210H - - 123 Reserved 124 20CH - - 124 Reserved 125 208H - - 125 Reserved 126 204H - - 126 Reserved 127 200H - - 127 Reserved 128 1FCH - - 128 Reserved 129 1F8H - - 129 Reserved 130 1F4H - - 130 Reserved 131 1F0H - - 131 Reserved 132 1ECH - - 132 Reserved 133 1E8H FLASHA Yes 133 Flash memory A interrupt 134 1E4H - - 134 Reserved 135 1E0H - - 135 Reserved 136 1DCH - - 136 Reserved 137 1D8H QPRC0 Yes 137 Quad Position/Revolution counter 0 138 1D4H QPRC1 Yes 138 Quad Position/Revolution counter 1 139 1D0H ADCRC0 No 139 A/D Converter 0 - Range Comparator 140 1CCH - - 140 Reserved 141 1C8H - - 141 Reserved 142 1C4H - - 142 Reserved 143 1C0H - - 143 Reserved Document Number: 002-04709 Rev. *F Page 25 of 64 CY96610 Series 12. Handling Precautions Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your Cypress semiconductor devices. 12.1 Precautions for Product Design This section describes precautions when designing electronic equipment using semiconductor devices. ◼ Absolute Maximum Ratings Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings. ◼ Recommended Operating Conditions Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical characteristics are warranted when operated within these ranges. Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their sales representative beforehand. ◼ Processing and Protection of Pins These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output functions. 1. Preventing Over-Voltage and Over-Current Conditions Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at the design stage. 2. Protection of Output Pins Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows. Such conditions if present for extended periods of time can damage the device. Therefore, avoid this type of connection. 3. Handling of Unused Input Pins Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be connected through an appropriate resistance to a power supply pin or ground pin. ◼ Latch-up Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is called latch-up. Document Number: 002-04709 Rev. *F Page 26 of 64 CY96610 Series CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the following: 1. 2. Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal noise, surge levels, etc. Be sure that abnormal current flows do not occur during the power-on sequence. ◼ Observance of Safety Regulations and Standards Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the design of products. ◼ Fail-Safe Design Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. ◼ Precautions Related to Usage of Devices Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. 12.2 Precautions for Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you should only mount under Cypress's recommended conditions. For detailed information about mount conditions, contact your sales representative. ◼ Lead Insertion Type Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or mounting by using a socket. Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Cypress recommended mounting conditions. If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be verified before mounting. Document Number: 002-04709 Rev. *F Page 27 of 64 CY96610 Series ◼ Surface Mount Type Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges. You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Cypress ranking of recommended conditions. ◼ Lead-Free Packaging CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength may be reduced under some conditions of use. ◼ Storage of Semiconductor Devices Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following: 1. 2. 3. 4. Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in locations where temperature changes are slight. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C and 30°C.When you open Dry Package that recommends humidity 40% to 70% relative humidity. When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage. Avoid storing packages where they are exposed to corrosive gases or high levels of dust. ◼ Baking Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended conditions for baking. Condition: 125°C/24 h ◼ Static Electricity Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: 1. 2. 3. 4. 5. Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be needed to remove electricity. Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment. Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1 MΩ).Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. Ground all fixtures and instruments, or protect with anti-static measures. Avoid the use of styro foam or other highly static-prone materials for storage of completed board assemblies. Document Number: 002-04709 Rev. *F Page 28 of 64 CY96610 Series 12.3 Precautions for Use Environment Reliability of semiconductor devices depends on ambient temperature and other conditions as described above. For reliable performance, do the following: 1. Humidity Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are anticipated, consider anti-humidity processing. 2. Discharge of Static Electricity When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases, use anti-static measures or processing to prevent discharges. 3. Corrosive Gases, Dust, or Oil Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices. 4. Radiation, Including Cosmic Radiation Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide shielding as appropriate. 5. Smoke, Flame CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices begin to smoke or burn, there is danger of the release of toxic gases. Customers considering the use of Cypress products in other special environmental conditions should consult with sales representatives. Document Number: 002-04709 Rev. *F Page 29 of 64 CY96610 Series 13. Handling Devices Special Care is Required for the Following when Handling the Device: ◼ Latch-up prevention ◼ Unused pins handling ◼ External clock usage ◼ Notes on PLL clock mode operation ◼ Power supply pins (Vcc/Vss) ◼ Crystal oscillator and ceramic resonator circuit ◼ Turn on sequence of power supply to A/D converter and analog inputs ◼ Pin handling when not using the A/D converter ◼ Notes on Power-on ◼ Stabilization of power supply voltage ◼ Serial communication ◼ Mode Pin (MD) 13.1 Latch-Up Prevention CMOS IC chips may suffer latch-up under the following conditions: ◼ A voltage higher than VCC or lower than VSS is applied to an input or output pin. ◼ A voltage higher than the rated voltage is applied between Vcc pins and Vss pins. ◼ The AVCC power supply is applied before the VCC voltage. Latch-up may increase the power supply current dramatically, causing thermal damages to the device. For the same reason, extra care is required to not let the analog power-supply voltage (AVCC, AVRH) exceed the digital power-supply voltage. 13.2 Unused Pins Handling Unused input pins can be left open when the input is disabled (corresponding bit of Port Input Enable register PIER = 0). Leaving unused input pins open when the input is enabled may result in misbehavior and possible permanent damage of the device. To prevent latch-up, they must therefore be pulled up or pulled down through resistors which should be more than 2k. Unused bidirectional pins can be set either to the output state and be then left open, or to the input state with either input disabled or external pull-up/pull-down resistor as described above. 13.3 External Clock Usage The permitted frequency range of an external clock depends on the oscillator type and configuration. See AC Characteristics for detailed modes and frequency limits. Single and opposite phase external clocks must be connected as follows: Document Number: 002-04709 Rev. *F Page 30 of 64 CY96610 Series 13.3.1 Single Phase External Clock for Main Oscillator When using a single phase external clock for the Main oscillator, X0 pin must be driven and X1 pin left open. And supply 1.8V power to the external clock. X0 X1 13.3.2 Single Phase External Clock for Sub Oscillator When using a single phase external clock for the Sub oscillator, “External clock mode” must be selected and X0A/P04_0 pin must be driven. X1A/P04_1 pin can be configured as GPIO. 13.3.3 Opposite Phase External Clock When using an opposite phase external clock, X1 (X1A) pins must be supplied with a clock signal which has the opposite phase to the X0 (X0A) pins. Supply level on X0 and X1 pins must be 1.8V. X0 X1 13.4 Notes on PLL Clock Mode Operation If the microcontroller is operated with PLL clock mode and no external oscillator is operating or no external clock is supplied, the microcontroller attempts to work with the free oscillating PLL. Performance of this operation, however, cannot be guaranteed. 13.5 Power Supply Pins (Vcc/Vss) It is required that all VCC-level as well as all VSS-level power supply pins are at the same potential. If there is more than one VCC or VSS level, the device may operate incorrectly or be damaged even within the guaranteed operating range. Vcc and Vss pins must be connected to the device from the power supply with lowest possible impedance. The smoothing capacitor at Vcc pin must use the one of a capacity value that is larger than Cs. Besides this, as a measure against power supply noise, it is required to connect a bypass capacitor of about 0.1F between Vcc and Vss pins as close as possible to Vcc and Vss pins. 13.6 Crystal Oscillator and ceramic resonator Circuit Noise at X0, X1 pins or X0A, X1A pins might cause abnormal operation. It is required to provide bypass capacitors with shortest possible distance to X0, X1 pins and X0A, X1A pins, crystal oscillator (or ceramic resonator) and ground lines, and, to the utmost effort, that the lines of oscillation circuit do not cross the lines of other circuits. It is highly recommended to provide a printed circuit board art work surrounding X0, X1 pins and X0A, X1A pins with a ground area for stabilizing the operation. It is highly recommended to evaluate the quartz/MCU or resonator/MCU system at the quartz or resonator manufacturer, especially when using low-Q resonators at higher frequencies. Document Number: 002-04709 Rev. *F Page 31 of 64 CY96610 Series 13.7 Turn on Sequence of Power Supply to A/D Converter and Analog Inputs It is required to turn the A/D converter power supply (AVCC, AVRH) and analog inputs (ANn) on after turning the digital power supply (VCC) on. It is also required to turn the digital power off after turning the A/D converter supply and analog inputs off. In this case, AVRH must not exceed AVCC Input voltage for ports shared with analog input ports also must not exceed AVCC (turning the analog and digital power supplies simultaneously on or off is acceptable) 13.8 Pin Handling when Not Using the A/D Converter If the A/D converter is not used, the power supply pins for A/D converter should be connected such as AVCC = VCC AVSS = AVRH = VSS. 13.9 Notes on Power-on To prevent malfunction of the internal voltage regulator, supply voltage profile while turning the power supply on should be slower than 50s from 0.2V to 2.7V. 13.10 Stabilization of Power Supply Voltage If the power supply voltage varies acutely even within the operation safety range of the VCC power supply voltage, a malfunction may occur. The VCC power supply voltage must therefore be stabilized. As stabilization guidelines, the power supply voltage must be stabilized in such a way that VCC ripple fluctuations (peak to peak value) in the commercial frequencies (50Hz to 60Hz) fall within 10% of the standard VCC power supply voltage and the transient fluctuation rate becomes 0.1V/s or less in instantaneous fluctuation for power supply switching. 13.11 Serial Communication There is a possibility to receive wrong data due to noise or other causes on the serial communication. Therefore, design a printed circuit board so as to avoid noise. Consider receiving of wrong data when designing the system. For example apply a checksum and retransmit the data if an error occurs. 13.12 Mode Pin (MD) Connect the mode pin directly to Vcc or Vss pin. To prevent the device unintentionally entering test mode due to noise, lay out the printed circuit board so as to minimize the distance from the mode pin to Vcc or Vss pin and provide a low-impedance connection. Document Number: 002-04709 Rev. *F Page 32 of 64 CY96610 Series 14. Electrical Characteristics 14.1 Absolute Maximum Ratings Parameter Symbol Condition Rating Unit VCC - Analog power supply voltage[1] AVCC - VSS - 0.3 VSS + 6.0 V VCC = AVCC[2] Analog reference voltage[1] AVRH - VSS - 0.3 VSS + 6.0 V AVCC ≥ AVRH, AVRH ≥ AVSS Input voltage[1] VI - VSS - 0.3 VSS + 6.0 V VI ≤ VCC + 0.3V[3] Output voltage[1] VO - VSS - 0.3 VSS + 6.0 V VO ≤ VCC + 0.3V[3] Maximum Clamp Current ICLAMP - -4.0 +4.0 mA Applicable to general purpose I/O pins [4] Total Maximum Clamp Current Σ|ICLAMP| - - 13 mA Applicable to general purpose I/O pins [4] "L" level maximum output current IOL - - 15 mA "L" level average output current IOLAV - - 4 mA "L" level maximum overall output current ΣIOL - - 32 mA "L" level average overall output current ΣIOLAV - - 16 mA "H" level maximum output current IOH - - -15 mA "H" level average output current IOHAV - - -4 mA "H" level maximum overall output current ΣIOH - - -32 mA "H" level average overall output current ΣIOHAV - - -16 mA Power consumption[5] PD TA= +125°C - 284[6] mW Operating ambient temperature TA - -40 +125[7] °C Storage temperature TSTG - -55 +150 °C Power supply voltage [1] Max VSS + 6.0 V Remarks Min VSS - 0.3 [1]: This parameter is based on VSS = AVSS = 0V. [2]: AVCC and VCC must be set to the same voltage. It is required that AVCC does not exceed VCC and that the voltage at the analog inputs does not exceed AVCC when the power is switched on. [3]: VI and VO should not exceed VCC + 0.3V. VI should also not exceed the specified ratings. However if the maximum current to/from an input is limited by some means with external components, the ICLAMP rating supersedes the VI rating. Input/Output voltages of standard ports depend on VCC. [4]: ◼ Applicable to all general purpose I/O pins (Pnn_m). ◼ Use within recommended operating conditions. ◼ Use at DC voltage (current). ◼ The +B signal should always be applied a limiting resistance placed between the +B signal and the microcontroller. ◼ The value of the limiting resistance should be set so that when the +B signal is applied the input current to microcontroller pin does not exceed rated values, either instantaneously or for prolonged periods. Document Number: 002-04709 Rev. *F the Page 33 of 64 CY96610 Series ◼ Note that when the microcontroller drive current is low, such as in the power saving modes, the +B input potential may pass through the protective diode and increase the potential at the VCC pin, and this may affect other devices. ◼ Note that if a +B signal is input when the microcontroller power supply is off (not fixed at 0V), the power supply is provided from the pins, so that incomplete operation may result. ◼ Note that if the +B input is applied during power-on, the power supply is provided from the pins and the resulting supply voltage may not be sufficient to operate the Power reset. ◼ The DEBUG I/F pin has only a protective diode against VSS. Hence it is only permitted to input a negative clamping current (4mA). For protection against positive input voltages, use an external clamping diode which limits the input voltage to maximum 6.0V. Sample recommended circuits: Protective diode VCC Limiting resistance P-ch +B input (0V to 16V) N-ch R [5]: The maximum permitted power dissipation depends on the ambient temperature, the air flow velocity and the thermal conductance of the package on the PCB. The actual power dissipation depends on the customer application and can be calculated as follows: PD = PIO + PINT PIO = Σ (VOL  IOL + VOH  IOH) (I/O load power dissipation, sum is performed on all I/O ports) PINT = VCC  (ICC + IA) (internal power dissipation) ICC is the total core current consumption into VCC as described in the “DC characteristics” and depends on the selected operation mode and clock frequency and the usage of functions like Flash programming. IA is the analog current consumption into AVCC. [6]: Worst case value for a package mounted on single layer PCB at specified TA without air flow. [7]: Write/erase to a large sector in flash memory is warranted with TA ≤ + 105°C. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. Document Number: 002-04709 Rev. *F Page 34 of 64 CY96610 Series 14.2 Recommended Operating Conditions (VSS = AVSS = 0V) Parameter Power supply voltage Symbol VCC, AVCC Value Unit Min 2.7 Typ - Max 5.5 V 2.0 - 5.5 V Remarks Maintains RAM data in stop mode 1.0µF (Allowance within ± 50%) 3.9µF (Allowance within ± 20%) Smoothing capacitor at C pin CS 0.5 1.0 to 3.9 4.7 µF Please use the ceramic capacitor or the capacitor of the frequency response of this level. The smoothing capacitor at VCC must use the one of a capacity value that is larger than CS. WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand. Document Number: 002-04709 Rev. *F Page 35 of 64 CY96610 Series 14.3 DC Characteristics 14.3.1 Current Rating (VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C) Parameter Symbol Pin Name Conditions Value Unit Remarks Min Typ Max - 25 - mA TA = +25°C - - 34 mA TA = +105°C - - 35 mA TA = +125°C - 3.5 - mA TA = +25°C - - 7.5 mA TA = +105°C - - 8.5 mA TA = +125°C RC Run mode with CLKS1/2 = CLKB = CLKP1/2 = CLKRC = 2MHz - 1.7 - mA TA = +25°C Flash 0 wait - - 5.5 mA TA = +105°C - - 6.5 mA TA = +125°C RC Run mode with CLKS1/2 = CLKB = CLKP1/2 = CLKRC = 100kHz - 0.15 - mA TA = +25°C Flash 0 wait - - 3.2 mA TA = +105°C - - 4.2 mA TA = +125°C - 0.1 - mA TA = +25°C - - 3 mA TA = +105°C - - 4 mA TA = +125°C PLL Run mode with CLKS1/2 = CLKB = CLKP1/2 = 32MHz ICCPLL Flash 0 wait (CLKRC and CLKSC stopped) Main Run mode with CLKS1/2 = CLKB = CLKP1/2 = 4MHz ICCMAIN Flash 0 wait (CLKPLL, CLKSC and CLKRC stopped) Power supply current in Run modes[1] ICCRCH Vcc (CLKMC, CLKPLL and CLKSC stopped) ICCRCL (CLKMC, CLKPLL and CLKSC stopped) Sub Run mode with CLKS1/2 = CLKB = CLKP1/2 = 32kHz ICCSUB Flash 0 wait (CLKMC, CLKPLL and CLKRC stopped) Document Number: 002-04709 Rev. *F Page 36 of 64 CY96610 Series Pin Parameter Symbol Nam Value Conditions Unit Remarks Min Typ Max - 6.5 - mA TA = +25°C - - 13 mA TA = +105°C - - 14 mA TA = +125°C - 0.9 - mA TA = +25°C SMCR:LPMSS = 0 - - 4 mA TA = +105°C (CLKPLL, CLKRC and CLKSC stopped) - - 5 mA TA = +125°C RC Sleep mode with CLKS1/2 = CLKP1/2 = CLKRC = 2MHz, - 0.5 - mA TA = +25°C SMCR:LPMSS = 0 - - 3.5 mA TA = +105°C (CLKMC, CLKPLL and CLKSC stopped) - - 4.5 mA TA = +125°C - 0.06 - mA TA = +25°C - - 2.7 mA TA = +105°C - - 3.7 mA TA = +125°C - 0.04 - mA TA = +25°C - - 2.5 mA TA = +105°C - - 3.5 mA TA = +125°C e PLL Sleep mode with ICCSPLL CLKS1/2 = CLKP1/2 = 32MHz (CLKRC and CLKSC stopped) Main Sleep mode with CLKS1/2 = CLKP1/2 = 4MHz, ICCSMAIN Power supply current in Sleep modes[1] ICCSRCH Vcc ICCSRCL RC Sleep mode with CLKS1/2 = CLKP1/2 = CLKRC = 100kHz (CLKMC, CLKPLL and CLKSC stopped) Sub Sleep mode with ICCSSUB CLKS1/2 = CLKP1/2 = 32kHz, (CLKMC, CLKPLL and CLKRC stopped) Document Number: 002-04709 Rev. *F Page 37 of 64 CY96610 Series Parameter Symbol Pin Conditions Name Unit Remarks Typ Max - 1800 2245 µA TA = +25°C - - 3165 µA TA = +105°C - - 3975 µA TA = +125°C - 285 325 µA TA = +25°C SMCR:LPMSS = 0 (CLKPLL, CLKRC and CLKSC stopped) - - 1085 µA TA = +105°C - - 1930 µA TA = +125°C RC Timer mode with - 160 210 µA TA = +25°C - - 1025 µA TA = +105°C - - 1840 µA TA = +125°C - 35 75 µA TA = +25°C - - 855 µA TA = +105°C - - 1640 µA TA = +125°C - 25 65 µA TA = +25°C - - 830 µA TA = +105°C - - 1620 µA TA = +125°C - 20 55 µA TA = +25°C - - 825 µA TA = +105°C - - 1615 µA TA = +125°C - 36 70 µA - 5 - µA TA = +25°C - - 12.5 µA TA = +125°C - 12.5 - mA TA = +25°C - - 20 mA TA = +125°C PLL Timer mode with CLKPLL = 32MHz (CLKRC and CLKSC stopped) ICCTPLL Value Min Main Timer mode with CLKMC = 4MHz, ICCTMAIN Power supply current in Timer modes[2] ICCTRCH Vcc CLKRC = 2MHz, SMCR:LPMSS = 0 (CLKPLL, CLKMC and CLKSC stopped) RC Timer mode with ICCTRCL CLKRC = 100kHz (CLKPLL, CLKMC and CLKSC stopped) Sub Timer mode with ICCTSUB Power supply current in Stop mode[3] ICCH Flash Power Down current ICCFLASHPD Power supply current CLKSC = 32kHz (CLKMC, CLKPLL and CLKRC stopped) - Vcc for active Low ICCLVD Low voltage detector enabled Voltage detector[4] Flash Write/ Erase current [5] ICCFLASH - [1]: The power supply current is measured with a 4MHz external clock connected to the Main oscillator and a 32kHz external clock connected to the Sub oscillator. See chapter “Standby mode and voltage regulator control circuit” of the Hardware Manual for further details about voltage regulator control. Current for "On Chip Debugger" part is not included. Power supply current in Run mode does not include Flash Write / Erase current. [2]: The power supply current in Timer mode is the value when Flash is in Power-down / reset mode. When Flash is not in Power-down / reset mode, ICCFLASHPD must be added to the Power supply current. The power supply current is measured with a 4MHz external clock connected to the Main oscillator and a 32kHz external clock connected to the Sub oscillator. The current for "On Chip Debugger" part is not included. [3]: The power supply current in Stop mode is the value when Flash is in Power-down / reset mode. When Flash is not in Power-down / reset mode, ICCFLASHPD must be added to the Power supply current. [4]: When low voltage detector is enabled, ICCLVD must be added to Power supply current. [5]: When Flash Write / Erase program is executed, ICCFLASH must be added to Power supply current. Document Number: 002-04709 Rev. *F Page 38 of 64 CY96610 Series 14.3.2 Pin Characteristics (VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C) Parameter Symbol Pin Name Conditions - V - VCC×0.8 - VCC+ 0.3 V VD×0.8 - VD V VCC×0.8 - VCC+ 0.3 V VCC×0.8 VCC- 0.3 2.0 VSS- 0.3 - VCC+ 0.3 VCC+ 0.3 VCC+ 0.3 VCC×0.3 V V V V CMOS Hysteresis input CMOS Hysteresis input TTL Input CMOS Hysteresis input VSS- 0.3 - VCC×0.5 V AUTOMOTIVE Hysteresis input VSS - VD×0.2 V VD=1.8V±0.15V VSS- 0.3 - VCC×0.2 V VSS- 0.3 VSS- 0.3 VSS- 0.3 - VCC×0.2 VSS+ 0.3 0.8 V V V VCC- 0.5 - VCC V VIHX0S X0 VIHX0AS X0A VIHR VIHM VIHD RSTX MD DEBUG I/F VIL Port inputs Pnn_m VILX0S X0 VILX0AS X0A VILR VILM VILD RSTX MD DEBUG I/F VOH4 4mA type VOL4 4mA type VOLD DEBUG I/F Input leak current IIL Pnn_m Pull-up resistance value RPU Pnn_m VCC = 5.0V ±10% CIN Other than C, Vcc, Vss, AVcc, AVss, AVRH - "H" level output voltage "L" level output voltage Input capacitance Document Number: 002-04709 Rev. *F Remarks Max VCC+ 0.3 Port inputs Pnn_m "L" level input voltage Unit Typ - VIH "H" level input voltage Value Min VCC×0.7 External clock in "Fast Clock Input mode" External clock in "Oscillation mode" External clock in "Fast Clock Input mode" External clock in "Oscillation mode" 4.5V ≤ VCC ≤ 5.5V IOH = -4mA 2.7V ≤ VCC < 4.5V IOH = -1.5mA 4.5V ≤ VCC ≤ 5.5V IOL = +4mA 2.7V ≤ VCC < 4.5V IOL = +1.7mA VCC = 2.7V IOL = +25mA VSS < VI < VCC AVSS < VI