MB96F696RBPMC-GSE1

Please note that Cypress is an Infineon Technologies Company. The document following this cover page is marked as “Cypress” document as this is the company that originally developed the product. Please note that Infineon will continue to offer the product to new and existing customers as part of the Infineon product portfolio. Continuity of document content The fact that Infineon offers the following product as part of the Infineon product portfolio does not lead to any changes to this document. Future revisions will occur when appropriate, and any changes will be set out on the document history page. Continuity of ordering part numbers Infineon continues to support existing part numbers. Please continue to use the ordering part numbers listed in the datasheet for ordering. www.infineon.com CY96690 Series F2MC-16FX 16-Bit Proprietary Microcontroller CY96690 series is based on Cypress advanced F2MC-16FX architecture (16-bit with instruction pipeline for RISC-like performance). The CPU uses the same instruction set as the established F2MC-16LX family thus allowing for easy migration of F2MC-16LX Software to the new F2MC-16FX products. F2MC-16FX product improvements compared to the previous generation include significantly improved performance - even at the same operation frequency, reduced power consumption and faster start-up time. For high processing speed at optimized power consumption an internal PLL can be selected to supply the CPU with up to 32MHz operation frequency from an external 4MHz to 8MHz resonator. The result is a minimum instruction cycle time of 31.2ns going together with excellent EMI behavior. The emitted power is minimized by the on-chip voltage regulator that reduces the internal CPU voltage. A flexible clock tree allows selecting suitable operation frequencies for peripheral resources independent of the CPU speed. Features Technology Low Voltage Detection Function  0.18µm CMOS  Reset is generated when supply voltage falls below programmable reference voltage CPU  F2MC-16FX CPU Code Security  Optimized instruction set for controller applications (bit, byte, word and long-word data types, 23 different addressing modes, barrel shift, variety of pointers)  Protects Flash Memory content from unintended read-out  8-byte instruction queue  Automatic transfer function independent of CPU, can be assigned freely to resources  Signed multiply (16-bit  16-bit) and divide (32-bit/16-bit) instructions available DMA Interrupts System Clock  Fast Interrupt processing  On-chip PLL clock multiplier (1 to 8, 1 when PLL stop)  8 programmable priority levels  4MHz to 8MHz crystal oscillator (maximum frequency when using ceramic resonator depends on Q-factor)  Non-Maskable Interrupt (NMI)  Up to 8MHz external clock for devices with fast clock input feature  Supports CAN protocol version 2.0 part A and B  32.768kHz subsystem quartz clock  Bit rates up to 1Mbps  100kHz/2MHz internal RC clock for quick and safe startup, clock stop detection function, watchdog  32 message objects  Clock source selectable from mainclock oscillator, subclock oscillator and on-chip RC oscillator, independently for CPU and 2 clock domains of peripherals  Programmable FIFO mode (concatenation of message objects) CAN  ISO16845 certified  Each message object has its own identifier mask  The subclock oscillator is enabled by the Boot ROM program controlled by a configuration marker after a Power or External reset  Maskable interrupt  Low Power Consumption - 13 operating modes (different Run, Sleep, Timer, Stop modes)  Programmable loop-back mode for self-test operation  Disabled Automatic Retransmission mode for Time Triggered CAN applications USART On-Chip Voltage Regulator  Internal voltage regulator supports a wide MCU supply voltage range (Min=2.7V), offering low power consumption  Full duplex USARTs (SCI/LIN)  Wide range of baud rate settings using a dedicated reload timer  Special synchronous options for adapting to different synchronous serial protocols Cypress Semiconductor Corporation Document Number: 002-04717 Rev. *D • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised June 21, 2019 CY96690 Series  LIN functionality working either as master or slave LIN device. Programmable Pulse Generator  Extended support for LIN-Protocol (with 16-byte FIFO for selected channels) to reduce interrupt load.  Can be used as 2 ×8-bit PPG I2C  PWM operation and one-shot operation  Up to 400kbps  Master and Slave functionality, 7-bit and 10-bit addressing  Internal prescaler allows 1, 1/4, 1/16, 1/64 of peripheral clock as counter clock or of selected Reload timer underflow as clock input A/D Converter  Can be triggered by software or reload timer  SAR-type  Can trigger ADC conversion  8/10-bit resolution  Timing point capture  Signals interrupt on conversion end, single conversion mode, continuous conversion mode, stop conversion mode, activation by software, external trigger, reload timers and PPGs  Start delay  16-bit down counter, cycle and duty setting registers  Interrupt at trigger, counter borrow and/or duty match Stepping Motor Controller  Range Comparator Function  Stepping Motor Controller with integrated high current output drivers  Scan disable Function  Four high current outputs for each channel  ADC Pulse Detection Function  Two synchronized 8/10-bit PWMs per channel Source Clock Timers  Internal prescaling for PWM clock: 1, 1/4, 1/5, 1/6, 1/8, 1/10, 1/12, 1/16 of peripheral clock  Three independent clock timers (23-bit RC clock timer, 23-bit Main clock timer, 17-bit Sub clock timer)  Dedicated power supply for high current output drivers LCD Controller Hardware Watchdog Timer  LCD controller with up to 4COM ×36SEG  Hardware watchdog timer is active after reset  Window function of Watchdog Timer is used to select the lower window limit of the watchdog interval  Internal or external voltage generation  Duty cycle: Selectable from options: 1/2, 1/3 and 1/4  Fixed 1/3 bias Reload Timers  Programmable frame period  16-bit wide  Clock source selectable from four options (main clock, peripheral clock, subclock or RC oscillator clock)  Prescaler with 1/21, 1/22, 1/23, 1/24, 1/25, 1/26 of peripheral clock frequency  Internal divider resistors or external divider resistors  Event count function  On-chip data memory for display Free-Running Timers  LCD display can be operated in Timer Mode  Signals an interrupt on overflow, supports timer clear upon match with Output Compare (0, 4)  Blank display: selectable  Prescaler with 1, of peripheral clock frequency 1/21, 1/22, 1/23, 1/24, 1/25, 1/26, 1/27, 1/28 Input Capture Units  16-bit wide  Signals an interrupt upon external event  Rising edge, Falling edge or Both (rising & falling) edges sensitive Output Compare Units  16-bit wide  Signals an interrupt when a match with Free-running Timer occurs  A pair of compare registers can be used to generate an output signal Document Number: 002-04717 Rev. *D  All SEG, COM and V pins can be switched between general and specialized purposes Sound Generator  8-bit PWM signal is mixed with tone frequency from 16-bit reload counter  PWM clock by internal prescaler: 1, 1/2, 1/4, 1/8 of peripheral clock Real Time Clock  Operational on main oscillation (4MHz), sub oscillation (32kHz) or RC oscillation (100kHz/2MHz)  Capable to correct oscillation deviation of Sub clock or RC oscillator clock (clock calibration)  Read/write accessible second/minute/hour registers Page 2 of 73 CY96690 Series  Can signal interrupts every half second/second/minute/hour/day Built-in On Chip Debugger (OCD)  Internal clock divider and prescaler provide exact 1s clock External Interrupts  Edge or Level sensitive  Interrupt mask bit per channel  Each available CAN channel RX has an external interrupt for wake-up  Selected USART channels SIN have an external interrupt for wake-up  One-wire debug tool interface  Break function:  Hardware break: 6 points (shared with code event)  Software break: 4096 points  Event function  Code event: 6 points (shared with hardware break)  Data event: 6 points  Event sequencer: 2 levels + reset  Execution time measurement function  Trace function: 42 branches Non Maskable Interrupt  Security function  Disabled after reset, can be enabled by Boot-ROM depending on ROM configuration block Flash Memory  Once enabled, cannot be disabled other than by reset  High or Low level sensitive  Dual operation flash allowing reading of one Flash bank while programming or erasing the other bank  Command sequencer for automatic execution of programming algorithm and for supporting DMA for programming of the Flash Memory  Pin shared with external interrupt 0 I/O Ports  Most of the external pins can be used as general purpose I/O  Supports automatic programming, Embedded Algorithm  All push-pull outputs(except when used as line)  A flag indicating completion of the automatic algorithm I 2C SDA/SCL  Write/Erase/Erase-Suspend/Resume commands  Erase can be performed on each sector individually  Bit-wise programmable as input/output or peripheral signal  Sector protection  Bit-wise programmable input enable  Flash Security feature to protect the content of the Flash  One input level per GPIO-pin (either Automotive or CMOS hysteresis)  Low voltage detection during Flash erase or write  Bit-wise programmable pull-up resistor Document Number: 002-04717 Rev. *D Page 3 of 73 CY96690 Series Contents 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 12.1 12.2 12.3 13. 13.1 13.2 13.3 13.4 13.5 13.6 Product Lineup ............................................................. 5 Block Diagram .............................................................. 6 Pin Assignment ............................................................ 7 Pin Description ............................................................. 8 Pin Circuit Type .......................................................... 10 I/O Circuit Type ........................................................... 13 Memory Map ............................................................... 20 RAM Start Addresses................................................. 21 User ROM Memory Map for Flash Devices .............. 22 Serial Programming Communication Interface ....... 23 Interrupt Vector Table ................................................ 24 Handling Precautions ................................................ 28 Precautions for Product Design .................................. 28 Precautions for Package Mounting ............................. 29 Precautions for Use Environment ............................... 31 Handling Devices ....................................................... 32 Latch-Up Prevention ................................................... 32 Unused Pins Handling ................................................ 32 External Clock Usage ................................................. 32 Notes on PLL Clock Mode Operation ......................... 33 Power Supply Pins (Vcc/Vss) ..................................... 33 Crystal Oscillator and ceramic resonator Circuit ......... 33 Document Number: 002-04717 Rev. *D 13.7 Turn on Sequence of Power Supply to A/D Converter and Analog Inputs ....................................................... 34 13.8 Pin Handling when not using the A/D Converter ......... 34 13.9 Notes on Power-on ..................................................... 34 13.10 Stabilization of Power Supply Voltage ........................ 34 13.11 SMC Power Supply Pins ............................................. 34 13.12 Serial Communication ................................................. 34 13.13 Mode Pin (MD) ............................................................ 34 14. Electrical Characteristics ........................................... 35 14.1 Absolute Maximum Ratings ........................................ 35 14.2 Recommended Operating Conditions ......................... 37 14.3 DC Characteristics ...................................................... 38 14.4 AC Characteristics ...................................................... 44 14.5 A/D Converter ............................................................. 53 14.6 High Current Output Slew Rate................................... 57 14.7 Low Voltage Detection Function Characteristics ......... 57 14.8 Flash Memory Write/Erase Characteristics ................. 59 15. Example Characteristics ............................................ 60 16. Ordering Information .................................................. 63 17. Package Dimension .................................................... 64 18. Major Changes ............................................................ 65 Document History ............................................................... 72 Sales, Solutions, and Legal Information ........................... 73 Page 4 of 73 CY96690 Series 1. Product Lineup Features Product Type Subclock Dual Operation Flash Memory 64.5KB + 32KB 128.5KB + 32KB 256.5KB + 32KB CY96690 Flash Memory Product Subclock can be set by software CY96F693R, CY96F693A CY96F695R, CY96F695A CY96F696R LQFP-100 LQI100 4ch 5ch Product Options R: MCU with CAN A: MCU without CAN 2ch LIN-USART 0/1 I2C 1ch 8/10-bit A/D Converter 27ch I2C 0 AN 2 to 4/6 to 8/10 to 12/ 14 to 31 with Data Buffer with Range Comparator with Scan Disable with ADC Pulse Detection 16-bit Reload Timer (RLT) 16-bit Free-Running Timer (FRT) No Yes Yes Yes 5ch 2ch 16-bit Input Capture Unit (ICU) 6ch (5 channels for LIN-USART) 16-bit Output Compare Unit (OCU) 8/16-bit Programmable Pulse Generator (PPG) with Timing point capture with Start delay with Ramp 4ch 10ch (16-bit) / 14ch (8-bit) Yes Yes No CAN Interface 1ch Stepping Motor Controller (SMC) External Interrupts (INT) Non-Maskable Interrupt (NMI) Sound Generator (SG) 4ch 16ch 1ch 2ch LCD Controller 4COM × 36SEG Real Time Clock (RTC) Clock Calibration Unit (CAL) 1ch 75 (Dual clock mode) 77 (Single clock mode) 1ch Clock Output Function 2ch Low Voltage Detection Function Yes Hardware Watchdog Timer Yes On-chip RC-oscillator Yes On-chip Debugger Yes RAM 8KB 8KB 16KB Package DMA USART with automatic LIN-Header transmission/reception with 16 byte RX- and TX-FIFO I/O Ports Remark LIN-USART 0 to 2/4/5 RLT 0 to 3/6 FRT 0/1 ICU 0/1/4 to 7 (ICU 0/1/4 to 6 for LIN-USART) OCU 0 to 3 PPG 0 to 7/14/15 CAN 0 32 Message Buffers SMC 0 to 2/4 INT 0 to 15 SG 0/1 COM 0 to 3 SEG 0 to 4/7/ 11 to 28/30/33/36 to 45 Low voltage detection function can be disabled by software Note: − All signals of the peripheral function in each product cannot be allocated by limiting the pins of package. It is necessary to use the port relocate function of the general I/O port according to your function use. Document Number: 002-04717 Rev. *D Page 5 of 73 CY96690 Series 2. Block Diagram CKOT0_R, CKOT1, CKOT1_R CKOTX0, CKOTX1, CKOTX1_R X0, X1 X0A, X1A RSTX MD NMI DEBUG I/F 16FX CPU OCD Interrupt Controller Clock & Mode Controller Flash Memory A 16FX Core Bus (CLKB) SDA0 SCL0 AVcc AVss AVRH AVRL AN2 to AN4 AN6 to AN8 AN10 to AN12 2 IC 1ch 8/10-bit ADC 27ch AN14 to AN31 ADTG TIN0 to TIN3 TOT0 to TOT3 FRCK0 FRCK0_R IN0 IN0_R, IN1_R OUT0 to OUT3 OUT0_R, OUT2_R FRCK1 IN6, IN7 IN4_R, IN5_R, IN7_R 16-bit Reload Timer 0/1/2/3/6 5ch I/O Timer 0 FRT0 ICU 0/1 OCU 0/1/2/3 I/O Timer 1 FRT1 ICU 4/5/6/7 Peripheral Bus Bridge Peripheral Bus 2 (CLKP2) Peripheral Bus Bridge Watchdog Peripheral Bus 1 (CLKP1) DMA Controller RAM CAN Interface 1ch Sound Generator 2ch USART 5ch PPG 10ch (16-bit) / 14ch (8-bit) Stepping Motor Controller 4ch Boot ROM Voltage Regulator RX0 Vcc Vss C TX0 SGO0, SGO1, SGO1_R SGA0, SGA1, SGA1_R SIN0 to SIN2, SIN4, SIN5, SIN5_R SOT0 to SOT2, SOT4, SOT5_R SCK0 to SCK2, SCK4, SCK5_R TTG0, TTG2 to TTG4, TTG6, TTG7 TTG12 to TTG14 PPG0, PPG1, PPG3 to PPG7 PPG0_R to PPG4_R PPG4_B to PPG7_B, PPG14_B, PPG15_B DVcc DVss PWM1M0 to PWM1M2, PWM1M4 PWM1P0 to PWM1P2, PWM1P4 PWM2M0 to PWM2M2, PWM2M4 PWM2P0 to PWM2P2, PWM2P4 V0 to V3 COM0 to COM3 SEG0 to SEG4, SEG7 SEG11 to SEG28 SEG30, SEG33 SEG36 to SEG45 Document Number: 002-04717 Rev. *D LCD controller/ driver Real Time Clock 4COM×36SEG External Interrupt 16ch WOT, WOT_R INT0 to INT15 INT1_R to INT7_R Page 6 of 73 CY96690 Series 3. Pin Assignment Vss Vss DEBUG I/F P17_0 MD X0 X1 Vss P04_0 / X0A*3 P04_1 / X1A*3 RSTX P11_0 / COM0 P11_1 / COM1 / PPG0_R P11_2 / COM2 / PPG1_R P11_3 / COM3 / PPG2_R P11_4 / SEG0 / PPG3_R P11_5 / SEG1 / PPG4_R P11_6 / SEG2 / FRCK0_R P11_7 / SEG3 / IN0_R P12_0 / SEG4 / IN1_R P12_3 / SEG7 / OUT2_R P12_7 / SEG11 / INT1_R P00_0 / SEG12 / INT3_R P00_1 / SEG13 / INT4_R P00_2 / SEG14 / INT5_R Vcc (Top view) 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 76 Vcc P00_3 / SEG15 / INT6_R 77 49 P10_3 / PWM2M4 / PPG7 / AN31 P00_4 / SEG16 / INT7_R 78 48 P10_2 / PWM2P4 / SCK2 / PPG6 / AN30*1 P00_5 / SEG17 / IN6 / TTG2 / TTG6 79 47 P10_1 / PWM1M4 /SOT2 / TOT3 / AN29 P00_6 / SEG18 / IN7 / TTG3 / TTG7 80 46 P10_0 / PWM1P4 / SIN2 / TIN3 / INT11 / AN28*1 P00_7 / SEG19 / SGO0 / INT14 81 45 DVss P01_0 / SEG20 / SGA0 82 44 DVcc P01_1 / SEG21 / CKOT1 / OUT0 83 43 P09_3 / PWM2M2 / AN27 P01_2 / SEG22 / CKOTX1 / OUT1 / INT15 84 42 P09_2 / PWM2P2 / AN26 P01_3 / SEG23 / PPG5 85 41 P09_1 / PWM1M2 / AN25 P01_4 / SEG24 / SIN4 / INT8*1 86 40 P09_0 / PWM1P2 / AN24 P01_5 / SEG25 / SOT4 87 39 P08_7 / PWM2M1 / AN23 /PPG7_B P01_6 / SEG26 / SCK4 / TTG12*1 88 38 P08_6 / PWM2P1 / AN22 /PPG6_B P08_5 / PWM1M1 / AN21 LQFP - 100 35 DVcc 92 34 P08_4 / PWM1P1 / AN20 P03_0 / V0 / SEG36 / PPG4_B 93 33 P08_3 / PWM2M0 / AN19 P03_1 / V1 / SEG37 / PPG5_B 94 32 P08_2 / PWM2P0 / AN18 P03_2 / V2 / SEG38 / PPG14_B / SOT5_R 95 31 P08_1 / PWM1M0 / AN17 1 96 30 P08_0 / PWM1P0 / AN16 1 97 29 P05_7 / AN15 / TOT2 / SGA1_R P03_5 / TX0 98 28 P05_6 / AN14 / TIN2 / SGO1_R P03_6 / INT0 / NMI 99 27 P05_4 / AN12 / INT2_R / WOT_R Vss Vcc P05_3 / AN11 / OUT3 / SGA1 P05_2 / AN10 / OUT2 / SGO1 P05_0 / AN8 AVss AVRL AVRH AVcc P06_7 / AN7 / TOT1 / IN5_R 26 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 P06_6 / AN6 / TIN1 / IN4_R 8 P06_4 / AN4 / IN0 / TTG0 / TTG4 7 P06_3 / AN3 / FRCK0 6 P06_2 / AN2 / INT5 / SIN5*1 5 P04_5 / PPG4 / SCL0*2 4 P04_4 / PPG3 / SDA0*2 3 P13_6 / SCK0 / CKOTX0*1 100 1 2 Vss Vcc P13_1 / INT3 / SCK1 / SEG42* P03_4 / RX0 / INT4* P03_7 / INT1 / SIN1 / SEG40* P03_3 / V3 / SEG39 / PPG15_B / SCK5_R* C P02_5 / SEG33 / OUT0_R / INT13 / SIN5_R* P13_5 / SOT0 / ADTG / INT7 91 1 P13_4 / SIN0 / INT6 / SEG45*1 DVss P02_2 / SEG30 / IN7_R / CKOT0_R / INT12 P13_3 / PPG1 / TOT0 / WOT / SEG44 36 P13_2 / PPG0 / TIN0 / FRCK1 / SEG43 90 1 P02_0 / SEG28 / CKOT1_R / INT10 / TTG14 P13_0 / INT2 / SOT1 / SEG41 89 37 1 P01_7 / SEG27 / CKOTX1_R / INT9 / TTG13 (LQI100) *1: CMOS input level only *2: CMOS input level only for I2C *3: Please set ROM Configuration Block (RCB) to use the subclock. Other than those above, general-purpose pins have only Automotive input level. Document Number: 002-04717 Rev. *D Page 7 of 73 CY96690 Series 4. Pin Description Pin Name Feature Description ADTG ADC A/D converter trigger input pin ANn ADC A/D converter channel n input pin AVcc Supply Analog circuits power supply pin AVRH ADC A/D converter high reference voltage input pin AVRL ADC A/D converter low reference voltage input pin AVss Supply Analog circuits power supply pin C Voltage regulator Internally regulated power supply stabilization capacitor pin CKOTn Clock Output function Clock Output function n output pin CKOTn_R Clock Output function Relocated Clock Output function n output pin CKOTXn Clock Output function Clock Output function n inverted output pin CKOTXn_R Clock Output function Relocated Clock Output function n inverted output pin COMn LCD LCD Common driver pin DEBUG I/F OCD On Chip Debugger input/output pin DVcc Supply SMC pins power supply DVss Supply SMC pins power supply FRCKn Free-Running Timer Free-Running Timer n input pin FRCKn_R Free-Running Timer Relocated Free-Running Timer n input pin INn ICU Input Capture Unit n input pin INn_R ICU Relocated Input Capture Unit n input pin INTn External Interrupt External Interrupt n input pin INTn_R External Interrupt Relocated External Interrupt n input pin MD Core Input pin for specifying the operating mode NMI External Interrupt Non-Maskable Interrupt input pin OUTn OCU Output Compare Unit n waveform output pin OUTn_R OCU Relocated Output Compare Unit n waveform output pin Pnn_m GPIO General purpose I/O pin PPGn PPG Programmable Pulse Generator n output pin (16bit/8bit) PPGn_R PPG Relocated Programmable Pulse Generator n output pin (16bit/8bit) PPGn_B PPG Programmable Pulse Generator n output pin (16bit/8bit) PWMn SMC SMC PWM high current output pin RSTX Core Reset input pin RXn CAN CAN interface n RX input pin SCKn USART USART n serial clock input/output pin SCKn_R USART Relocated USART n serial clock input/output pin 2 SCLn IC I2C interface n clock I/O input/output pin SDAn I2C I2C interface n serial data I/O input/output pin SEGn LCD LCD Segment driver pin SGAn Sound Generator Sound Generator amplitude output pin SGAn_R Sound Generator Relocated Sound Generator amplitude output pin SGOn Sound Generator Sound Generator sound/tone output pin SGOn_R Sound Generator Relocated Sound Generator sound/tone output pin Document Number: 002-04717 Rev. *D Page 8 of 73 CY96690 Series Pin Name Feature Description SINn USART USART n serial data input pin SINn_R USART Relocated USART n serial data input pin SOTn USART USART n serial data output pin SOTn_R USART Relocated USART n serial data output pin TINn Reload Timer Reload Timer n event input pin TOTn Reload Timer Reload Timer n output pin TTGn PPG Programmable Pulse Generator n trigger input pin TXn CAN CAN interface n TX output pin Vn LCD LCD voltage reference pin Vcc Supply Power supply pin Vss Supply Power supply pin WOT RTC Real Time clock output pin WOT_R RTC Relocated Real Time clock output pin X0 Clock Oscillator input pin X0A Clock Subclock Oscillator input pin X1 Clock Oscillator output pin X1A Clock Subclock Oscillator output pin Document Number: 002-04717 Rev. *D Page 9 of 73 CY96690 Series 5. Pin Circuit Type Pin No. I/O Circuit Type* Pin Name 1 Supply Vss 2 F C 3 P P03_7 / INT1 / SIN1 / SEG40 4 J P13_0 / INT2 / SOT1 / SEG41 5 P P13_1 / INT3 / SCK1 / SEG42 6 J P13_2 / PPG0 / TIN0 / FRCK1 / SEG43 7 J P13_3 / PPG1 / TOT0 / WOT / SEG44 8 P P13_4 / SIN0 / INT6 / SEG45 9 H P13_5 / SOT0 / ADTG / INT7 10 M P13_6 / SCK0 / CKOTX0 11 N P04_4 / PPG3 / SDA0 12 N P04_5 / PPG4 / SCL0 13 I P06_2 / AN2 / INT5 / SIN5 14 K P06_3 / AN3 / FRCK0 15 K P06_4 / AN4 / IN0 / TTG0 / TTG4 16 K P06_6 / AN6 / TIN1 / IN4_R 17 K P06_7 / AN7 / TOT1 / IN5_R 18 Supply AVcc 19 G AVRH 20 G AVRL 21 Supply AVss 22 K P05_0 / AN8 23 K P05_2 / AN10 / OUT2 / SGO1 24 K P05_3 / AN11 / OUT3 / SGA1 25 Supply Vcc 26 Supply Vss 27 K P05_4 / AN12 / INT2_R / WOT_R 28 K P05_6 / AN14 / TIN2 / SGO1_R 29 K P05_7 / AN15 / TOT2 / SGA1_R 30 R P08_0 / PWM1P0 / AN16 31 R P08_1 / PWM1M0 / AN17 32 R P08_2 / PWM2P0 / AN18 33 R P08_3 / PWM2M0 / AN19 34 R P08_4 / PWM1P1 / AN20 35 Supply DVcc 36 Supply DVss 37 R P08_5 / PWM1M1 / AN21 38 R P08_6 / PWM2P1 / AN22 / PPG6_B Document Number: 002-04717 Rev. *D Page 10 of 73 CY96690 Series Pin No. I/O Circuit Type* Pin Name 39 R P08_7 / PWM2M1 / AN23 / PPG7_B 40 R P09_0 / PWM1P2 / AN24 41 R P09_1 / PWM1M2 / AN25 42 R P09_2 / PWM2P2 / AN26 43 R P09_3 / PWM2M2 / AN27 44 Supply DVcc 45 Supply DVss 46 S P10_0 / PWM1P4 / SIN2 / TIN3 / INT11 / AN28 47 R P10_1 / PWM1M4 / SOT2 / TOT3 / AN29 48 S P10_2 / PWM2P4 / SCK2 / PPG6 / AN30 49 R P10_3 / PWM2M4 / PPG7 / AN31 50 Supply Vcc 51 Supply Vss 52 O DEBUG I/F 53 H P17_0 54 C MD 55 A X0 56 A X1 57 Supply Vss 58 B P04_0 / X0A 59 B P04_1 / X1A 60 C RSTX 61 J P11_0 / COM0 62 J P11_1 / COM1 / PPG0_R 63 J P11_2 / COM2 / PPG1_R 64 J P11_3 / COM3 / PPG2_R 65 J P11_4 / SEG0 / PPG3_R 66 J P11_5 / SEG1 / PPG4_R 67 J P11_6 / SEG2 / FRCK0_R 68 J P11_7 / SEG3 / IN0_R 69 J P12_0 / SEG4 / IN1_R 70 J P12_3 / SEG7 / OUT2_R 71 J P12_7 / SEG11 / INT1_R 72 J P00_0 / SEG12 / INT3_R 73 J P00_1 / SEG13 / INT4_R 74 J P00_2 / SEG14 / INT5_R 75 Supply Vcc 76 Supply Vss 77 J P00_3 / SEG15 / INT6_R Document Number: 002-04717 Rev. *D Page 11 of 73 CY96690 Series Pin No. I/O Circuit Type* Pin Name 78 J P00_4 / SEG16 / INT7_R 79 J P00_5 / SEG17 / IN6 / TTG2 / TTG6 80 J P00_6 / SEG18 / IN7 / TTG3 / TTG7 81 J P00_7 / SEG19 / SGO0 / INT14 82 J P01_0 / SEG20 / SGA0 83 J P01_1 / SEG21 / CKOT1 / OUT0 84 J P01_2 / SEG22 / CKOTX1 / OUT1 / INT15 85 J P01_3 / SEG23 / PPG5 86 P P01_4 / SEG24 / SIN4 / INT8 87 J P01_5 / SEG25 / SOT4 88 P P01_6 / SEG26 / SCK4 / TTG12 89 J P01_7 / SEG27 / CKOTX1_R / INT9 / TTG13 90 J P02_0 / SEG28 / CKOT1_R / INT10 / TTG14 91 J P02_2 / SEG30 / IN7_R / CKOT0_R / INT12 92 P P02_5 / SEG33 / OUT0_R / INT13 / SIN5_R 93 L P03_0 / V0 / SEG36 / PPG4_B 94 L P03_1 / V1 / SEG37 / PPG5_B 95 L P03_2 / V2 / SEG38 / PPG14_B / SOT5_R 96 Q P03_3 / V3 / SEG39 / PPG15_B / SCK5_R 97 M P03_4 / RX0 / INT4 98 H P03_5 / TX0 99 H P03_6 / INT0 / NMI 100 Supply Vcc *: See I/O Circuit Type” for details on the I/O circuit types. Document Number: 002-04717 Rev. *D Page 12 of 73 CY96690 Series 6. I/O Circuit Type Type Circuit Remarks A High-speed oscillation circuit:  Programmable between X1 oscillation mode (external crystal or resonator connected to X0/X1 pins) and Fast external Clock Input (FCI) mode (external clock connected to X0 pin) R  Feedback resistor = approx. 0 1 X out 1.0MΩ  The amplitude: 1.8V±0.15V to operate by the internal supply voltage FCI X0 FCI or Osc disable Document Number: 002-04717 Rev. *D Page 13 of 73 CY96690 Series Type Circuit Remarks B Pull-up control Low-speed oscillation circuit shared with GPIO functionality:  Feedback resistor = approx. 5.0MΩ P-ch Standby control for input shutdown P-ch N-ch  GPIO functionality selectable Pout (CMOS level output (IOL = 4mA, IOH = -4mA), Automotive input with input shutdown function and programmable pull-up resistor) Nout R Automotive input X1A R X out 0 1 FCI X0A FCI or Osc disable Pull-up control P-ch Standby control for input shutdown P-ch Pout N-ch Nout R Document Number: 002-04717 Rev. *D Automotive input Page 14 of 73 CY96690 Series Type Circuit Remarks C CMOS hysteresis input pin F Power supply input protection circuit P-ch N-ch G  A/D converter ref+ (AVRH)/ ref(AVRL) power supply input pin with protection circuit P-ch  Without protection circuit against VCC for pins AVRH/AVRL N-ch H  CMOS level output (IOL = 4mA, IOH Pull-up control = -4mA)  Automotive input with input shutdown function P-ch P-ch Pout N-ch Nout  Programmable pull-up resistor R Standby control for input shutdown Document Number: 002-04717 Rev. *D Automotive input Page 15 of 73 CY96690 Series Type Circuit Remarks I  CMOS level output Pull-up control (IOL = 4mA, IOH = -4mA)  CMOS hysteresis input with input shutdown function P-ch P-ch N-ch Pout  Programmable pull-up resistor  Analog input Nout R Hysteresis input Standby control for input shutdown Analog input J  CMOS level output Pull-up control (IOL = 4mA, IOH = -4mA)  Automotive input with input shutdown function P-ch P-ch Pout  Programmable pull-up resistor  SEG or COM output N-ch Nout R Automotive input Standby control for input shutdown SEG or COM output K  CMOS level output Pull-up control (IOL = 4mA, IOH = -4mA)  Automotive input with input shutdown function P-ch P-ch Pout  Programmable pull-up resistor  Analog input N-ch Nout R Automotive input Standby control for input shutdown Analog input Document Number: 002-04717 Rev. *D Page 16 of 73 CY96690 Series Type Circuit Remarks L  CMOS level output Pull-up control (IOL = 4mA, IOH = -4mA)  Automotive input with input shutdown function P-ch P-ch Pout  Programmable pull-up resistor  Vn input or SEG output N-ch Nout R Automotive input Standby control for input shutdown Vn input or SEG output M  CMOS level output (IOL = 4mA, IOH = -4mA) Pull-up control  CMOS hysteresis input with input shutdown function  Programmable pull-up resistor P-ch P-ch Pout N-ch Nout R Hysteresis input Standby control for input shutdown N  CMOS level output (IOL = 3mA, IOH = -3mA) Pull-up control  CMOS hysteresis input with input shutdown function  Programmable pull-up resistor P-ch R P-ch Pout N-ch Nout* *: N-channel transistor has slew rate control according to I2C spec, irrespective of usage. Hysteresis input Standby control for input shutdown Document Number: 002-04717 Rev. *D Page 17 of 73 CY96690 Series Type Circuit Remarks O  Open-drain I/O  Output 25mA, Vcc = 2.7V  TTL input N-ch Nout R Standby control for input shutdown TTL input P  CMOS level output Pull-up control (IOL = 4mA, IOH = -4mA)  CMOS hysteresis inputs with input shutdown function P-ch P-ch Pout  Programmable pull-up resistor  SEG or COM output N-ch Nout R Hysteresis input Standby control for input shutdown SEG or COM output Q  CMOS level output Pull-up control (IOL = 4mA, IOH = -4mA)  CMOS hysteresis inputs with input shutdown function P-ch P-ch Pout  Programmable pull-up resistor  Vn input or SEG output N-ch Nout R Hysteresis input Standby control for input shutdown Vn input or SEG output Document Number: 002-04717 Rev. *D Page 18 of 73 CY96690 Series Type Circuit Remarks R  CMOS level output Pull-up control P-ch P-ch Pout (programmable IOL = 4mA, IOH = -4mA and IOL = 30mA, IOH = -30mA)  Automotive input with input shutdown function  Programmable pull-up / pull-down resistor N-ch N-ch Nout  Analog input Pull-down control R Automotive input Standby control for input shutdown Analog input S  CMOS level output Pull-up control (programmable IOL = 4mA, IOH = -4mA and IOL = 30mA, IOH = -30mA)  CMOS hysteresis input with input P-ch P-ch Pout shutdown function  Programmable pull-up / pull-down resistor N-ch N-ch Nout  Analog input Pull-down control R Hysteresis input Standby control for input shutdown Analog input Document Number: 002-04717 Rev. *D Page 19 of 73 CY96690 Series 7. Memory Map FF:FFFFH USER ROM*1 DE:0000H DD:FFFFH Reserved 10:0000H 0F:C000H Boot-ROM Peripheral 0E:9000H Reserved 01:0000H 00:8000H RAMSTART0*2 ROM/RAM MIRROR Internal RAM bank0 Reserved 00:0C00H 00:0380H 00:0180H 00:0100H Peripheral GPR*3 DMA 00:00F0H Reserved 00:0000H Peripheral *1: For details about USER ROM area, see ”User ROM Memory Map for Flash Devices” on the following pages. *2: For RAMSTART addresses, see the table on the next page. *3: Unused GPR banks can be used as RAM area. GPR: General-Purpose Register The DMA area is only available if the device contains the corresponding resource. The available RAM and ROM area depends on the device. Document Number: 002-04717 Rev. *D Page 20 of 73 CY96690 Series 8. RAM Start Addresses Bank 0 Devices RAM Size RAMSTART0 CY96F693 CY96F695 8KB 00:6200H CY96F696 16KB 00:4200H Document Number: 002-04717 Rev. *D Page 21 of 73 CY96690 Series 9. User ROM Memory Map for Flash Devices *: Physical address area of SAS-512B is from DF:0000H to DF:01FFH. Others (from DF:0200H to DF:1FFFH) is mirror area of SAS-512B. Sector SAS contains the ROM configuration block RCBA at CPU address DF:0000H -DF:01FFH. SAS cannot be used for E2PROM emulation. Document Number: 002-04717 Rev. *D Page 22 of 73 CY96690 Series 10. Serial Programming Communication Interface USART pins for Flash serial programming (MD = 0, DEBUG I/F = 0, Serial Communication mode) CY96690 Pin Number USART Number 8 9 Normal Function SIN0 USART0 SOT0 10 SCK0 3 SIN1 4 USART1 SOT1 5 SCK1 46 SIN2 47 USART2 SOT2 48 SCK2 86 SIN4 87 USART4 88 Document Number: 002-04717 Rev. *D SOT4 SCK4 Page 23 of 73 CY96690 Series 11. Interrupt Vector Table Vector Offset in Number Vector Table Vector Name Cleared by Index in DMA ICR to Program Description 0 3FCH CALLV0 No - CALLV instruction 1 3F8H CALLV1 No - CALLV instruction 2 3F4H CALLV2 No - CALLV instruction 3 3F0H CALLV3 No - CALLV instruction 4 3ECH CALLV4 No - CALLV instruction 5 3E8H CALLV5 No - CALLV instruction 6 3E4H CALLV6 No - CALLV instruction 7 3E0H CALLV7 No - CALLV instruction 8 3DCH RESET No - Reset vector 9 3D8H INT9 No - INT9 instruction 10 3D4H EXCEPTION No - Undefined instruction execution 11 3D0H NMI No - Non-Maskable Interrupt 12 3CCH DLY No 12 Delayed Interrupt 13 3C8H RC_TIMER No 13 RC Clock Timer 14 3C4H MC_TIMER No 14 Main Clock Timer 15 3C0H SC_TIMER No 15 Sub Clock Timer 16 3BCH LVDI No 16 Low Voltage Detector 17 3B8H EXTINT0 Yes 17 External Interrupt 0 18 3B4H EXTINT1 Yes 18 External Interrupt 1 19 3B0H EXTINT2 Yes 19 External Interrupt 2 20 3ACH EXTINT3 Yes 20 External Interrupt 3 21 3A8H EXTINT4 Yes 21 External Interrupt 4 22 3A4H EXTINT5 Yes 22 External Interrupt 5 23 3A0H EXTINT6 Yes 23 External Interrupt 6 24 39CH EXTINT7 Yes 24 External Interrupt 7 25 398H EXTINT8 Yes 25 External Interrupt 8 26 394H EXTINT9 Yes 26 External Interrupt 9 27 390H EXTINT10 Yes 27 External Interrupt 10 28 38CH EXTINT11 Yes 28 External Interrupt 11 29 388H EXTINT12 Yes 29 External Interrupt 12 30 384H EXTINT13 Yes 30 External Interrupt 13 31 380H EXTINT14 Yes 31 External Interrupt 14 32 37CH EXTINT15 Yes 32 External Interrupt 15 33 378H CAN0 No 33 CAN Controller 0 34 374H - - 34 Reserved 35 370H - - 35 Reserved 36 36CH - - 36 Reserved 37 368H - - 37 Reserved 38 364H PPG0 Yes 38 Programmable Pulse Generator 0 39 360H PPG1 Yes 39 Programmable Pulse Generator 1 Document Number: 002-04717 Rev. *D Page 24 of 73 CY96690 Series Vector Offset in Number Vector Table Vector Name Cleared by Index in DMA ICR to Program Description 40 35CH PPG2 Yes 40 Programmable Pulse Generator 2 41 358H PPG3 Yes 41 Programmable Pulse Generator 3 42 354H PPG4 Yes 42 Programmable Pulse Generator 4 43 350H PPG5 Yes 43 Programmable Pulse Generator 5 44 34CH PPG6 Yes 44 Programmable Pulse Generator 6 45 348H PPG7 Yes 45 Programmable Pulse Generator 7 46 344H - - 46 Reserved 47 340H - - 47 Reserved 48 33CH - - 48 Reserved 49 338H - - 49 Reserved 50 334H - - 50 Reserved 51 330H - - 51 Reserved 52 32CH PPG14 Yes 52 Programmable Pulse Generator 14 53 328H PPG15 Yes 53 Programmable Pulse Generator 15 54 324H - - 54 Reserved 55 320H - - 55 Reserved 56 31CH - - 56 Reserved 57 318H - - 57 Reserved 58 314H RLT0 Yes 58 Reload Timer 0 59 310H RLT1 Yes 59 Reload Timer 1 60 30CH RLT2 Yes 60 Reload Timer 2 61 308H RLT3 Yes 61 Reload Timer 3 62 304H - - 62 Reserved 63 300H - - 63 Reserved 64 2FCH RLT6 Yes 64 Reload Timer 6 65 2F8H ICU0 Yes 65 Input Capture Unit 0 66 2F4H ICU1 Yes 66 Input Capture Unit 1 67 2F0H - - 67 Reserved 68 2ECH - - 68 Reserved 69 2E8H ICU4 Yes 69 Input Capture Unit 4 70 2E4H ICU5 Yes 70 Input Capture Unit 5 71 2E0H ICU6 Yes 71 Input Capture Unit 6 72 2DCH ICU7 Yes 72 Input Capture Unit 7 73 2D8H - - 73 Reserved 74 2D4H - - 74 Reserved 75 2D0H - - 75 Reserved 76 2CCH - - 76 Reserved 77 2C8H OCU0 Yes 77 Output Compare Unit 0 78 2C4H OCU1 Yes 78 Output Compare Unit 1 79 2C0H OCU2 Yes 79 Output Compare Unit 2 80 2BCH OCU3 Yes 80 Output Compare Unit 3 81 2B8H - - 81 Reserved Document Number: 002-04717 Rev. *D Page 25 of 73 CY96690 Series Vector Offset in Number Vector Table Vector Name Cleared by Index in DMA ICR to Program Description 82 2B4H - - 82 Reserved 83 2B0H - - 83 Reserved 84 2ACH - - 84 Reserved 85 2A8H - - 85 Reserved 86 2A4H - - 86 Reserved 87 2A0H - - 87 Reserved 88 29CH - - 88 Reserved 89 298H FRT0 Yes 89 Free-Running Timer 0 90 294H FRT1 Yes 90 Free-Running Timer 1 91 290H - - 91 Reserved 92 28CH - - 92 Reserved 93 288H RTC0 No 93 Real Time Clock 94 284H CAL0 No 94 Clock Calibration Unit 95 280H SG0 No 95 Sound Generator 0 96 27CH IIC0 Yes 96 I2C interface 0 97 278H - - 97 Reserved 98 274H ADC0 Yes 98 A/D Converter 0 99 270H - - 99 Reserved 100 26CH - - 100 Reserved 101 268H LINR0 Yes 101 LIN USART 0 RX 102 264H LINT0 Yes 102 LIN USART 0 TX 103 260H LINR1 Yes 103 LIN USART 1 RX 104 25CH LINT1 Yes 104 LIN USART 1 TX 105 258H LINR2 Yes 105 LIN USART 2 RX 106 254H LINT2 Yes 106 LIN USART 2 TX 107 250H - - 107 Reserved 108 24CH - - 108 Reserved 109 248H LINR4 Yes 109 LIN USART 4 RX 110 244H LINT4 Yes 110 LIN USART 4 TX 111 240H LINR5 Yes 111 LIN USART 5 RX 112 23CH LINT5 Yes 112 LIN USART 5 TX 113 238H - - 113 Reserved 114 234H - - 114 Reserved 115 230H - - 115 Reserved 116 22CH - - 116 Reserved 117 228H - - 117 Reserved 118 224H - - 118 Reserved 119 220H - - 119 Reserved 120 21CH - - 120 Reserved 121 218H SG1 No 121 Sound Generator 1 122 214H - - 122 Reserved 123 210H - - 123 Reserved Document Number: 002-04717 Rev. *D Page 26 of 73 CY96690 Series Vector Offset in Number Vector Table Vector Name Cleared by Index in DMA ICR to Program Description 124 20CH - - 124 Reserved 125 208H - - 125 Reserved 126 204H - - 126 Reserved 127 200H - - 127 Reserved 128 1FCH - - 128 Reserved 129 1F8H - - 129 Reserved 130 1F4H - - 130 Reserved 131 1F0H - - 131 Reserved 132 1ECH - - 132 Reserved 133 1E8H FLASHA Yes 133 Flash memory A interrupt 134 1E4H - - 134 Reserved 135 1E0H - - 135 Reserved 136 1DCH - - 136 Reserved 137 1D8H - - 137 Reserved 138 1D4H - - 138 Reserved 139 1D0H ADCRC0 No 139 A/D Converter 0 - Range Comparator 140 1CCH ADCPD0 No 140 A/D Converter 0 - Pulse detection 141 1C8H - - 141 Reserved 142 1C4H - - 142 Reserved 143 1C0H - - 143 Reserved Document Number: 002-04717 Rev. *D Page 27 of 73 CY96690 Series 12. Handling Precautions Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your Cypress semiconductor devices. 12.1 Precautions for Product Design This section describes precautions when designing electronic equipment using semiconductor devices.  Absolute Maximum Ratings Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings.  Recommended Operating Conditions Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical characteristics are warranted when operated within these ranges. Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their sales representative beforehand.  Processing and Protection of Pins These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output functions. 1. Preventing Over-Voltage and Over-Current Conditions Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at the design stage. 2. Protection of Output Pins Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows. Such conditions if present for extended periods of time can damage the device. Therefore, avoid this type of connection. 3. Handling of Unused Input Pins Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be connected through an appropriate resistance to a power supply pin or ground pin.  Latch-up Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is called latch-up. CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the following: 1. 2. Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal noise, surge levels, etc. Be sure that abnormal current flows do not occur during the power-on sequence.  Observance of Safety Regulations and Standards Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the design of products. Document Number: 002-04717 Rev. *D Page 28 of 73 CY96690 Series  Fail-Safe Design Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.  Precautions Related to Usage of Devices Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. 12.2 Precautions for Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you should only mount under Cypress recommended conditions. For detailed information about mount conditions, contact your sales representative.  Lead Insertion Type Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or mounting by using a socket. Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Cypress recommended mounting conditions. If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be verified before mounting.  Surface Mount Type Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges. You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Cypress ranking of recommended conditions.  Lead-Free Packaging CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength may be reduced under some conditions of use. Document Number: 002-04717 Rev. *D Page 29 of 73 CY96690 Series  Storage of Semiconductor Devices Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following: 1. 2. 3. 4. Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in locations where temperature changes are slight. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C and 30°C. When you open Dry Package that recommends humidity 40% to 70% relative humidity. When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage. Avoid storing packages where they are exposed to corrosive gases or high levels of dust.  Baking Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended conditions for baking. Condition: 125°C/24 h  Static Electricity Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: 1. 2. 3. 4. 5. Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be needed to remove electricity. Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment. Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1 MΩ). Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. Ground all fixtures and instruments, or protect with anti-static measures. Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies. Document Number: 002-04717 Rev. *D Page 30 of 73 CY96690 Series 12.3 Precautions for Use Environment Reliability of semiconductor devices depends on ambient temperature and other conditions as described above. For reliable performance, do the following: 1. Humidity Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are anticipated, consider anti-humidity processing. 2. Discharge of Static Electricity When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases, use anti-static measures or processing to prevent discharges. 3. Corrosive Gases, Dust, or Oil Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices. 4. Radiation, Including Cosmic Radiation Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide shielding as appropriate. 5. Smoke, Flame CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices begin to smoke or burn, there is danger of the release of toxic gases. Customers considering the use of Cypress products in other special environmental conditions should consult with sales representatives. Document Number: 002-04717 Rev. *D Page 31 of 73 CY96690 Series 13. Handling Devices Special Care is Required for the following when Handling the Device:  Latch-up prevention  Unused pins handling  External clock usage  Notes on PLL clock mode operation  Power supply pins (Vcc/Vss)  Crystal oscillator and ceramic resonator circuit  Turn on sequence of power supply to A/D converter and analog inputs  Pin handling when not using the A/D converter  Notes on Power-on  Stabilization of power supply voltage  SMC power supply pins  Serial communication  Mode Pin (MD) 13.1 Latch-Up Prevention CMOS IC chips may suffer latch-up under the following conditions:  A voltage higher than VCC or lower than VSS is applied to an input or output pin.  A voltage higher than the rated voltage is applied between Vcc pins and Vss pins.  The AVCC power supply is applied before the VCC voltage. Latch-up may increase the power supply current dramatically, causing thermal damages to the device. For the same reason, extra care is required to not let the analog power-supply voltage (AVCC, AVRH) exceed the digital power-supply voltage. 13.2 Unused Pins Handling Unused input pins can be left open when the input is disabled (corresponding bit of Port Input Enable register PIER = 0). Leaving unused input pins open when the input is enabled may result in misbehavior and possible permanent damage of the device. To prevent latch-up, they must therefore be pulled up or pulled down through resistors which should be more than 2k. Unused bidirectional pins can be set either to the output state and be then left open, or to the input state with either input disabled or external pull-up/pull-down resistor as described above. 13.3 External Clock Usage The permitted frequency range of an external clock depends on the oscillator type and configuration. See AC Characteristics for detailed modes and frequency limits. Single and opposite phase external clocks must be connected as follows: 13.3.1 Single Phase External Clock for Main Oscillator When using a single phase external clock for the Main oscillator, X0 pin must be driven and X1 pin left open. And supply 1.8V power to the external clock. Document Number: 002-04717 Rev. *D Page 32 of 73 CY96690 Series X0 X1 13.3.2 Single Phase External Clock for Sub Oscillator When using a single phase external clock for the Sub oscillator, “External clock mode” must be selected and X0A/P04_0 pin must be driven. X1A/P04_1 pin can be configured as GPIO. 13.3.3 Opposite Phase External Clock When using an opposite phase external clock, X1 (X1A) pins must be supplied with a clock signal which has the opposite phase to the X0 (X0A) pins. Supply level on X0 and X1 pins must be 1.8V. X0 X1 13.4 Notes on PLL Clock Mode Operation If the microcontroller is operated with PLL clock mode and no external oscillator is operating or no external clock is supplied, the microcontroller attempts to work with the free oscillating PLL. Performance of this operation, however, cannot be guaranteed. 13.5 Power Supply Pins (Vcc/Vss) It is required that all VCC-level as well as all VSS-level power supply pins are at the same potential. If there is more than one VCC or VSS level, the device may operate incorrectly or be damaged even within the guaranteed operating range. Vcc and Vss pins must be connected to the device from the power supply with lowest possible impedance. The smoothing capacitor at Vcc pin must use the one of a capacity value that is larger than Cs. Besides this, as a measure against power supply noise, it is required to connect a bypass capacitor of about 0.1F between Vcc and Vss pins as close as possible to Vcc and Vss pins. 13.6 Crystal Oscillator and ceramic resonator Circuit Noise at X0, X1 pins or X0A, X1A pins might cause abnormal operation. It is required to provide bypass capacitors with shortest possible distance to X0, X1 pins and X0A, X1A pins, crystal oscillator (or ceramic resonator) and ground lines, and, to the utmost effort, that the lines of oscillation circuit do not cross the lines of other circuits. It is highly recommended to provide a printed circuit board art work surrounding X0, X1 pins and X0A, X1A pins with a ground area for stabilizing the operation. It is highly recommended to evaluate the quartz/MCU or resonator/MCU system at the quartz or resonator manufacturer, especially when using low-Q resonators at higher frequencies. Document Number: 002-04717 Rev. *D Page 33 of 73 CY96690 Series 13.7 Turn on Sequence of Power Supply to A/D Converter and Analog Inputs It is required to turn the A/D converter power supply (AVCC, AVRH, AVRL) and analog inputs (ANn) on after turning the digital power supply (VCC) on. It is also required to turn the digital power off after turning the A/D converter supply and analog inputs off. In this case, AVRH must not exceed AVCC . Input voltage for ports shared with analog input ports also must not exceed AVCC (turning the analog and digital power supplies simultaneously on or off is acceptable). 13.8 Pin Handling when not using the A/D Converter If the A/D converter is not used, the power supply pins for A/D converter should be connected such as AVCC = VCC , AVSS = AVRH = AVRL = VSS. 13.9 Notes on Power-on To prevent malfunction of the internal voltage regulator, supply voltage profile while turning the power supply on should be slower than 50s from 0.2V to 2.7V. 13.10 Stabilization of Power Supply Voltage If the power supply voltage varies acutely even within the operation safety range of the VCC power supply voltage, a malfunction may occur. The VCC power supply voltage must therefore be stabilized. As stabilization guidelines, the power supply voltage must be stabilized in such a way that VCC ripple fluctuations (peak to peak value) in the commercial frequencies (50Hz to 60Hz) fall within 10% of the standard VCC power supply voltage and the transient fluctuation rate becomes 0.1V/s or less in instantaneous fluctuation for power supply switching. 13.11 SMC Power Supply Pins All DVcc /DVss pins must be set to the same level as the Vcc /Vss pins. Note that the SMC I/O pin state is undefined if DVCC is powered on and VCC is below 3V. To avoid this, VCC must always be powered on before DVCC. DVCC/DVSS must be applied when using SMC I/O pin as GPIO. 13.12 Serial Communication There is a possibility to receive wrong data due to noise or other causes on the serial communication. Therefore, design a printed circuit board so as to avoid noise. Consider receiving of wrong data when designing the system. For example apply a checksum and retransmit the data if an error occurs. 13.13 Mode Pin (MD) Connect the mode pin directly to Vcc or Vss pin. To prevent the device unintentionally entering test mode due to noise, lay out the printed circuit board so as to minimize the distance from the mode pin to Vcc or Vss pin and provide a low-impedance connection. Document Number: 002-04717 Rev. *D Page 34 of 73 CY96690 Series 14. Electrical Characteristics 14.1 Absolute Maximum Ratings Parameter Symbol Power supply voltage [1] Analog power supply voltage[1] Condition Rating VCC - Min VSS - 0.3 AVCC - VSS - 0.3 Unit Max VSS + 6.0 V VSS + 6.0 V Remarks VCC = AVCC[2] AVCC≥ AVRH, Analog reference AVRH, voltage[1] AVRL - VSS - 0.3 VSS + 6.0 V AVCC ≥ AVRL, AVRH > AVRL, AVRL ≥ AVSS DVCC - VSS - 0.3 VSS + 6.0 V VCC = AVCC= DVCC[2] LCD power supply voltage[1] V0 to V3 - VSS - 0.3 VSS + 6.0 V V0 to V3 must not exceed VCC Input voltage[1] VI - VSS - 0.3 VSS + 6.0 V VI ≤ (D)VCC + 0.3V[3] VO - VSS - 0.3 VSS + 6.0 V VO ≤ (D)VCC + 0.3V[3] Maximum Clamp Current ICLAMP - -4.0 +4.0 mA Applicable to general purpose I/O pins [4] Total Maximum Clamp Current Σ|ICLAMP| - - 25 mA Applicable to general purpose I/O pins [4] - Normal port SMC Power supply Output voltage [1] [1] IOL "L" level maximum output current IOLSMC IOLAV "L" level average output current IOLAVSMC - 15 mA TA= -40°C - 52 mA TA= +25°C - 39 mA TA= +85°C - 32 mA TA= +105°C - 30 mA - - 4 mA TA= -40°C - 40 mA TA= +25°C - 30 mA TA= +85°C - 25 mA TA= +105°C High current port Normal port High current port - 23 mA "L" level maximum overall output current ΣIOL - - 50 mA Normal port ΣIOLSMC - - 260 mA High current port "L" level average overall output current ΣIOLAV - - 25 mA Normal port ΣIOLAVSMC - - 170 mA High current port "H" level maximum output current IOH - - -15 mA Normal port TA= -40°C - -52 mA TA= +25°C - -39 mA TA= +85°C - -32 mA TA= +105°C - -30 mA - -4 mA TA= -40°C - -40 mA TA= +25°C - -30 mA TA= +85°C - -25 mA TA= +105°C IOHSMC IOHAV "H" level average output current "H" level maximum overall output current IOHAVSMC - High current port Normal port High current port - -23 mA ΣIOH - - -50 mA Normal port ΣIOHSMC - - -260 mA High current port Document Number: 002-04717 Rev. *D Page 35 of 73 CY96690 Series Parameter Symbol "H" level average overall output current Power consumption [5] Condition Rating ΣIOHAV - Min - ΣIOHAVSMC - - -170 [6] Unit Remarks Max -25 mA Normal port mA High current port PD TA= +105°C - Operating ambient temperature 333 mW TA - -40 +105 °C Storage temperature TSTG - -55 +150 °C [1]: This parameter is based on VSS = AVSS = DVSS = 0V. [2]: AVCC and VCC and DVCC must be set to the same voltage. It is required that AVCC does not exceed VCC, DVCC and that the voltage at the analog inputs does not exceed AVCC when the power is switched on. [3]: VI and VO should not exceed VCC + 0.3V. VI should also not exceed the specified ratings. However if the maximum current to/from an input is limited by some means with external components, the ICLAMP rating supersedes the VI rating. Input/Output voltages of high current ports depend on DVCC. Input/Output voltages of standard ports depend on VCC. [4]:  Applicable to all general purpose I/O pins (Pnn_m).  Use within recommended operating conditions.  Use at DC voltage (current).  The +B signal should always be applied a limiting resistance placed between the +B signal and the microcontroller.  The value of the limiting resistance should be set so that when the +B signal is applied the input current to the microcontroller pin does not exceed rated values, either instantaneously or for prolonged periods.  Note that when the microcontroller drive current is low, such as in the power saving modes, the +B input potential may pass through the protective diode and increase the potential at the VCC pin, and this may affect other devices.  Note that if a +B signal is input when the microcontroller power supply is off (not fixed at 0V), the power supply is provided from the pins, so that incomplete operation may result.  Note that if the +B input is applied during power-on, the power supply is provided from the pins and the resulting supply voltage may not be sufficient to operate the Power reset.  The DEBUG I/F pin has only a protective diode against VSS. Hence it is only permitted to input a negative clamping current (4mA). For protection against positive input voltages, use an external clamping diode which limits the input voltage to maximum 6.0V. Sample recommended circuits: Protective diode VCC Limiting resistance P-ch +B input (0V to 16V) N-ch R [5]: The maximum permitted power dissipation depends on the ambient temperature, the air flow velocity and the thermal conductance of the package on the PCB. The actual power dissipation depends on the customer application and can be calculated as follows: PD = PIO + PINT PIO = Σ (VOL  IOL + VOH  IOH) (I/O load power dissipation, sum is performed on all I/O ports) PINT = VCC  (ICC + IA) (internal power dissipation) Document Number: 002-04717 Rev. *D Page 36 of 73 CY96690 Series ICC is the total core current consumption into VCC as described in the “DC characteristics” and depends on the selected operation mode and clock frequency and the usage of functions like Flash programming. IA is the analog current consumption into AVCC. [6]: Worst case value for a package mounted on single layer PCB at specified TA without air flow. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. 14.2 Recommended Operating Conditions (VSS = AVSS = DVSS = 0V) Parameter Symbol VCC, Power supply voltage AVCC, DVCC Value Min 2.7 Typ - Max 5.5 2.0 - 5.5 Unit Remarks V V Maintains RAM data in stop mode 1.0µF (Allowance within ± 50%) 3.9µF (Allowance within ± 20%) Smoothing capacitor at C pin CS 0.5 1.0 to 3.9 4.7 µF Please use the ceramic capacitor or the capacitor of the frequency response of this level. The smoothing capacitor at VCC must use the one of a capacity value that is larger than CS. WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand. Document Number: 002-04717 Rev. *D Page 37 of 73 CY96690 Series 14.3 DC Characteristics 14.3.1 Current Rating (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Value Pin Conditions Name Unit Remarks Min Typ Max PLL Run mode with CLKS1/2 = CLKB = CLKP1/2 = 32MHz - 28 - mA TA = +25°C Flash 0 wait - - 38 mA TA = +105°C - 3.5 - mA TA = +25°C - - 8 mA TA = +105°C - 1.8 - mA TA = +25°C - - 6 mA TA = +105°C - 0.16 - mA TA = +25°C - - 3.5 mA TA = +105°C - 0.1 - mA TA = +25°C - - 3.3 mA TA = +105°C - 9.5 - - - 15 mA TA = +105°C Main Sleep mode with CLKS1/2 = CLKP1/2 = 4MHz, SMCR:LPMSS = 0 (CLKPLL, CLKRC and CLKSC stopped) - 1.1 - mA TA = +25°C - - 4.7 mA TA = +105°C RC Sleep mode with CLKS1/2 = CLKP1/2 = CLKRC = 2MHz, SMCR:LPMSS = 0 (CLKMC, CLKPLL and CLKSC stopped) - 0.6 - mA TA = +25°C - - 4.1 mA TA = +105°C RC Sleep mode with CLKS1/2 = CLKP1/2 = CLKRC = 100kHz (CLKMC, CLKPLL and CLKSC stopped) - 0.07 - mA TA = +25°C ICCSRCL - - 2.9 mA TA = +105°C Sub Sleep mode with CLKS1/2 = CLKP1/2 = 32kHz, (CLKMC, CLKPLL and CLKRC stopped) - 0.04 - mA TA = +25°C ICCSSUB - - 2.7 mA TA = +105°C ICCPLL (CLKRC and CLKSC stopped) Main Run mode with CLKS1/2 = CLKB = CLKP1/2 = 4MHz ICCMAIN Flash 0 wait (CLKPLL, CLKSC and CLKRC stopped) RC Run mode with CLKS1/2 = CLKB = CLKP1/2 = CLKRC = 2MHz Power supply current in Run modes[1] ICCRCH Vcc Flash 0 wait (CLKMC, CLKPLL and CLKSC stopped) RC Run mode with CLKS1/2 = CLKB = CLKP1/2 = CLKRC = 100kHz ICCRCL Flash 0 wait (CLKMC, CLKPLL and CLKSC stopped) Sub Run mode with CLKS1/2 = CLKB = CLKP1/2 = 32kHz ICCSUB Flash 0 wait (CLKMC, CLKPLL and CLKRC stopped) PLL Sleep mode with ICCSPLL ICCSMAIN ICCSRCH TA = +25°C CLKS1/2 = CLKP1/2 = 32MHz (CLKRC and CLKSC stopped) Power supply current in Sleep modes[1] mA Vcc Document Number: 002-04717 Rev. *D Page 38 of 73 CY96690 Series Parameter Power supply current in Timer modes[2] Symbol Unit Min Typ Max Remarks PLL Timer mode with CLKPLL = 32MHz (CLKRC and CLKSC stopped) - 1800 2250 µA TA = +25°C ICCTPLL - - 3220 µA TA = +105°C Main Timer mode with CLKMC = 4MHz, SMCR:LPMSS = 0 (CLKPLL, CLKRC and CLKSC stopped) - 285 330 µA TA = +25°C ICCTMAIN - - 1200 µA TA = +105°C RC Timer mode with CLKRC = 2MHz, SMCR:LPMSS = 0 (CLKPLL, CLKMC and CLKSC stopped) - 160 215 µA TA = +25°C - - 1110 µA TA = +105°C RC Timer mode with CLKRC = 100kHz, (CLKPLL, CLKMC and CLKSC stopped) - 35 75 µA TA = +25°C - - 910 µA TA = +105°C Sub Timer mode with CLKSC = 32kHz (CLKMC, CLKPLL and CLKRC stopped) - 25 65 µA TA = +25°C - - - 20 60 µA TA = +25°C - - 880 µA TA = +105°C - 36 70 µA - 5 - µA TA = +25°C - - 12.5 µA TA = +105°C - 12.5 - mA TA = +25°C - - 20 mA TA = +105°C ICCTRCH Vcc ICCTSUB Flash Power Down current Conditions Name ICCTRCL Power supply current in Stop mode[3] Value Pin ICCH 885 A TA = +105°C - ICCFLASHP - D Power supply current for active Low Vcc ICCLVD Low voltage detector enabled Voltage detector[4] Flash Write/ Erase current [5] ICCFLASH - [1]: The power supply current is measured with a 4MHz external clock connected to the Main oscillator and a 32kHz external clock connected to the Sub oscillator. See chapter “Standby mode and voltage regulator control circuit” of the Hardware Manual for further details about voltage regulator control. Current for "On Chip Debugger" part is not included. Power supply current in Run mode does not include Flash Write / Erase current. [2]: The power supply current in Timer mode is the value when Flash is in Power-down / reset mode. When Flash is not in Power-down / reset mode, ICCFLASHPD must be added to the Power supply current. The power supply current is measured with a 4MHz external clock connected to the Main oscillator and a 32 kHz external clock connected to the Sub oscillator. The current for "On Chip Debugger" part is not included. [3]: The power supply current in Stop mode is the value when Flash is in Power-down / reset mode. When Flash is not in Power-down / reset mode, ICCFLASHPD must be added to the Power supply current. [4]: When low voltage detector is enabled, ICCLVD must be added to Power supply current. [5]: When Flash Write / Erase program is executed, ICCFLASH must be added to Power supply current. Document Number: 002-04717 Rev. *D Page 39 of 73 CY96690 Series 14.3.2 Pin Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Pin Name Conditions Unit Min VIH "H" level input voltage "L" level input voltage Typ Remarks Max - VCC×0.7 - VCC+ 0.3 V CMOS Hysteresis input - VCC×0.8 - VCC+ 0.3 V AUTOMOTIVE Hysteresis input VD×0.8 - VD V VD=1.8V±0.15V VCC×0.8 - VCC+ 0.3 V Port inputs Pnn_m External clock in VIHX0S X0 VIHX0AS X0A VIHR RSTX - VCC×0.8 - VCC+ 0.3 V CMOS Hysteresis input VIHM MD - VCC- 0.3 - VCC+ 0.3 V CMOS Hysteresis input VIHD DEBUG I/F - 2.0 - VCC+ 0.3 V TTL Input - VSS- 0.3 - VCC×0.3 V CMOS Hysteresis input VIL Port inputs Pnn_m - VSS- 0.3 - VCC×0.5 V AUTOMOTIVE Hysteresis input External clock in "Fast Clock Input mode" VSS - VD×0.2 V VD=1.8V±0.15V VSS- 0.3 - VCC×0.2 V "Fast Clock Input mode" External clock in "Oscillation mode" VILX0S X0 VILX0AS X0A VILR RSTX - VSS- 0.3 - VCC×0.2 V CMOS Hysteresis input VILM MD - VSS- 0.3 - VSS+ 0.3 V CMOS Hysteresis input VILD DEBUG I/F - VSS- 0.3 - 0.8 V TTL Input Document Number: 002-04717 Rev. *D External clock in "Oscillation mode" Page 40 of 73 CY96690 Series Value Parameter Symbol Pin Name Conditions Unit Min Typ Remarks Max 4.5V ≤ (D)VCC ≤ 5.5V IOH = -4mA VOH4 4mA type 2.7V ≤ (D)VCC < 4.5V (D)VCC- 0.5 - (D)VCC V IOH = -1.5mA 4.5V ≤ DVCC ≤ 5.5V IOH = -52mA TA = -40°C 2.7V ≤ DVCC < 4.5V IOH = -18mA 4.5V ≤ DVCC ≤ 5.5V IOH = -39mA TA = +25°C 2.7V ≤ DVCC < 4.5V "H" level output voltage VOH30 High Drive type* IOH = -16mA 4.5V ≤ DVCC ≤ 5.5V DVCC- 0.5 - DVCC V IOH = -32mA TA = +85°C 2.7V ≤ DVCC < 4.5V IOH = -14.5mA 4.5V ≤ DVCC ≤ 5.5V IOH = -30mA TA = +105°C 2.7V ≤ DVCC < 4.5V IOH = -14mA 4.5V ≤ VCC ≤ 5.5V IOH = -3mA VOH3 3mA type 2.7V ≤ VCC < 4.5V VCC- 0.5 - VCC V IOH = -1.5mA Document Number: 002-04717 Rev. *D Page 41 of 73 CY96690 Series Value Parameter Symbol Pin Name Conditions Unit Min Typ Max - - 0.4 Remarks 4.5V ≤ (D)VCC ≤ 5.5V IOL = +4mA VOL4 4mA type 2.7V ≤ (D)VCC < 4.5V V IOL = +1.7mA 4.5V ≤ DVCC ≤ 5.5V IOL = +52mA TA = -40°C 2.7V ≤ DVCC < 4.5V IOL = +22mA 4.5V ≤ DVCC ≤ 5.5V IOL = +39mA TA = +25°C 2.7V ≤ DVCC < 4.5V "L" level output voltage VOL30 High Drive type* IOL = +18mA 4.5V ≤ DVCC ≤ 5.5V - - 0.5 V IOL = +32mA TA = +85°C 2.7V ≤ DVCC < 4.5V IOL = +14mA 4.5V ≤ DVCC ≤ 5.5V IOL = +30mA TA = +105°C 2.7V ≤ DVCC < 4.5V IOL = +13.5mA VOL3 3mA type VOLD DEBUG I/F 2.7V ≤ VCC < 5.5V - - 0.4 V 0 - 0.25 V -1 - +1 µA -3 - +3 µA VCC = 5.0V - 0.5 10 µA 6.25 12.5 25 kΩ IOL = +3mA VCC = 2.7V IOL = +25mA VSS < VI < VCC Input leak current IIL Pnn_m AVSS, AVRL < VI < AVCC, AVRH P08_m, DVSS < VI < DVCC P09_m, AVSS, AVRL < VI < AVCC, AVRH P10_m Total LCD leak current Internal LCD divide resistance Pull-up resistance Σ|IILCD| All SEG/ COM pin Single port pin except high current output I/O for SMC Maximum leakage current of all LCD pins Between RLCD V3 and V2, V2 and V1, V1 and V0 VCC = 5.0V RPU Pnn_m VCC = 5.0V ±10% 25 50 100 kΩ VCC = 5.0V ±10% 25 50 100 kΩ value Pull-down resistance value P08_m, RDOWN P09_m, P10_m Document Number: 002-04717 Rev. *D Page 42 of 73 CY96690 Series Value Parameter Input capacitance Symbol CIN Pin Name Other than C, Vcc, Vss, DVcc, DVss, AVcc, AVss, AVRH, AVRL, P08_m, P09_m, P10_m Conditions Unit Min Typ Max - - 5 15 pF - - 15 30 pF Remarks P08_m, P09_m, P10_m *: In the case of driving stepping motor directly or high current outputs, set "1" to the bit in the Port High Drive Register (PHDRnn:HDx="1"). Document Number: 002-04717 Rev. *D Page 43 of 73 CY96690 Series 14.4 AC Characteristics 14.4.1 Main Clock Input Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VD=1.8V±0.15V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Input frequency Input frequency fC fFCI Value Pin Symbol Name X0, X1 Unit Min Typ Max 4 - 8 MHz - - 8 MHz 4 - 8 MHz - - 8 MHz 4 - 8 MHz X0 Input clock cycle tCYLH - 125 - - ns Input clock pulse width PWH, PWL - 55 - - ns Document Number: 002-04717 Rev. *D Remarks When using a crystal oscillator, PLL off When using an opposite phase external clock, PLL off When using a crystal oscillator or opposite phase external clock, PLL on When using a single phase external clock in “Fast Clock Input mode”, PLL off When using a single phase external clock in “Fast Clock Input mode”, PLL on Page 44 of 73 CY96690 Series 14.4.2 Sub Clock Input Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin Name Conditions Value Unit Typ Max - - 32.768 - kHz When using an oscillation circuit - - - 100 kHz When using an opposite phase external clock X0A - - - 50 kHz When using a single phase external clock X0A, X1A Input frequency fCL Input clock cycle tCYLL - - 10 - - µs Input clock pulse width - - PWH/tCYLL, PWL/tCYLL 30 - 70 % Document Number: 002-04717 Rev. *D Remarks Min Page 45 of 73 CY96690 Series 14.4.3 Built-in RC Oscillation Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Value Symbol Clock frequency Min Typ Unit Max 50 100 200 kHz When using slow frequency of RC oscillator 1 2 4 MHz When using fast frequency of RC oscillator 80 160 320 s When using slow frequency of RC oscillator (16 RC clock cycles) 64 128 256 s When using fast frequency of RC oscillator (256 RC clock cycles) fRC RC clock stabilization time Remarks tRCSTAB 14.4.4 Internal Clock Timing (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Unit Min Max Internal System clock frequency (CLKS1 and CLKS2) fCLKS1, fCLKS2 - 54 MHz Internal CPU clock frequency (CLKB), Internal peripheral clock frequency (CLKP1) fCLKB, fCLKP1 - 32 MHz Internal peripheral clock frequency (CLKP2) fCLKP2 - 32 MHz Document Number: 002-04717 Rev. *D Page 46 of 73 CY96690 Series 14.4.5 Operating Conditions of PLL (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Unit Min Typ Remarks Max PLL oscillation stabilization wait time tLOCK 1 - 4 ms For CLKMC = 4MHz PLL input clock frequency fPLLI 4 - 8 MHz PLL oscillation clock frequency fCLKVCO 56 - 108 MHz Permitted VCO output frequency of PLL (CLKVCO) PLL phase jitter tPSKEW -5 - +5 ns For CLKMC (PLL input clock) ≥ 4MHz 14.4.6 Reset Input (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Value Pin Name Reset input time tRSTL Unit Min Max 10 - µs 1 - µs RSTX Rejection of reset input time tRSTL RSTX 0.2VCC Document Number: 002-04717 Rev. *D 0.2VCC Page 47 of 73 CY96690 Series 14.4.7 Power-on Reset Timing (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Value Parameter Symbol Pin Name Unit Min Typ Max Power on rise time tR Vcc 0.05 - 30 ms Power off time tOFF Vcc 1 - - ms Document Number: 002-04717 Rev. *D Page 48 of 73 CY96690 Series 14.4.8 USART Timing (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C, CL=50pF) Condition s 4.5V  VCC < 5.5V 2.7V  VCC < 4.5V Min Min Max 4tCLKP1 - ns - 30 + 30 ns Parameter Symbol Pin Name Serial clock cycle time tSCYC SCKn 4tCLKP1 SCK ↓ → SOT delay time tSLOVI SCKn, SOTn - 20 SOT → SCK ↑ delay time tOVSHI SCKn, SOTn SIN →SCK ↑setup time tIVSHI SCKn, SINn SCK ↑ → SIN hold time tSHIXI Serial clock "L" pulse width Max + 20 Unit N×tCLKP1– 20* - N×tCLKP1– 30* - ns tCLKP1+ 45 - tCLKP1+ 55 - ns SCKn, SINn 0 - 0 - ns tSLSH SCKn tCLKP1+ 10 - tCLKP1+ 10 - ns Serial clock "H" pulse width tSHSL SCKn tCLKP1+ 10 - tCLKP1+ 10 - ns SCK ↓ → SOT delay time tSLOVE SCKn, SOTn 2tCLKP1+ 55 ns SIN →SCK ↑setup time tIVSHE SCKn, SINn SCK ↑ → SIN hold time tSHIXE SCK fall time tF SCKn - SCK rise time tR SCKn - SCKn, SINn Internal shift clock mode External shift clock mode - 2tCLKP1+ 45 tCLKP1/2+ 10 - tCLKP1/2+ 10 - ns tCLKP1+ 10 - tCLKP1+ 10 - ns 20 - 20 ns 20 - 20 ns - Notes: −AC characteristic in CLK synchronized mode. −CL is the load capacity value of pins when testing. −Depending on the used machine clock frequency, the maximum possible baud rate can be limited by some parameters. These parameters are shown in “CY96600 series HARDWARE MANUAL”. −tCLKP1 indicates the peripheral clock 1 (CLKP1), Unit: ns −These characteristics only guarantee the same relocate port number.  For example, the combination of SCKn and SOTn_R is not guaranteed. *: Parameter N depends on tSCYC and can be calculated as follows: • If tSCYC = 2  k  tCLKP1, then N = k, where k is an integer > 2 • If tSCYC = (2  k + 1)  tCLKP1, then N = k + 1, where k is an integer > 1 Examples: tSCYC N 4 ×tCLKP1 2 5 ×tCLKP1, 6 ×tCLKP1 3 7 ×tCLKP1, 8 ×tCLKP1 4 Document Number: 002-04717 Rev. *D Page 49 of 73 CY96690 Series tSCYC VOH SCK VOL VOL tOVSHI tSLOVI VOH SOT VOL tIVSHI SIN tSHIXI VIH VIH VIL VIL Internal shift clock mode SCK tSHSL tSLSH VIH VIH VIL tF VIL VIH tR tSLOVE SOT VOH VOL SIN tIVSHE VIH VIL tSHIXE VIH VIL External shift clock mode Document Number: 002-04717 Rev. *D Page 50 of 73 CY96690 Series 14.4.9 External Input Timing (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Value Pin Name Min Remarks General Purpose I/O ADTG A/D Converter trigger input 2tCLKP1 +200 (tCLKP1=1/fCLKP1)* TTGn tINH, tINL Unit Pnn_m TINn Input pulse width Max Reload Timer - ns FRCKn, PPG trigger input FRCKn_R Free-Running Timer input clock INn, INn_R Input Capture INTn, INTn_R 200 NMI - ns External Interrupt Non-Maskable Interrupt *: tCLKP1 indicates the peripheral clock1 (CLKP1) cycle time except stop when in stop mode. tINH External input timing VIH tINL VIH VIL Document Number: 002-04717 Rev. *D VIL Page 51 of 73 CY96690 Series 14.4.10 I2C Timing (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Typical Mode Conditions SCL clock frequency fSCL 0 (Repeated) START condition hold time SDA ↓ → SCL ↓ tHDSTA 4.0 - 0.6 - µs SCL clock "L" width tLOW 4.7 - 1.3 - µs SCL clock "H" width tHIGH 4.0 - 0.6 - µs (Repeated) START condition setup time SCL ↑ → SDA ↓ tSUSTA 4.7 - 0.6 - µs 0 3.45[2] 0 0.9[3] µs tSUDAT 250 - 100 - ns STOP condition setup time SCL ↑ → SDA ↑ tSUSTO 4.0 - 0.6 - µs Bus free time between "STOP condition" and "START condition" tBUS 4.7 - 1.3 - µs Pulse width of spikes which will be suppressed by input noise filter tSP 0 (1-1.5) ×tCLKP1[5] 0 (1-1.5) ×tCLKP1[5] ns Data hold time R = (Vp/IOL)[1] tHDDAT SCL ↓ → SDA ↓ ↑ Data setup time SDA ↓ ↑ →SCL ↑ - Min Unit Max 100 CL = 50pF, Min High-Speed Mode[4] 0 Max 400 kHz [1]: R and CL represent the pull-up resistance and load capacitance of the SCL and SDA lines, respectively. Vp indicates the power supply voltage of the pull-up resistance and IOL indicates VOL guaranteed current. [2]: The maximum tHDDAT only has to be met if the device does not extend the "L" width (tLOW) of the SCL signal. [3]: A high-speed mode I2C bus device can be used on a standard mode I2C bus system as long as the device satisfies the requirement of "tSUDAT ≥ 250ns". [4]: For use at over 100 kHz, set the peripheral clock1 (CLKP1) to at least 6 MHz. [5]: tCLKP1 indicates the peripheral clock1 (CLKP1) cycle time. SDA tSUDAT tSUSTA tBUS tLOW SCL tHDSTA tHDDAT Document Number: 002-04717 Rev. *D tHIGH tHDSTA tSP tSUSTO Page 52 of 73 CY96690 Series 14.5 A/D Converter 14.5.1 Electrical Characteristics for the A/D Converter (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Symb Pin ol Name Value Min Typ Max Unit Remarks Resolution - - - - 10 bit Total error - - - 3.0 - + 3.0 LSB Nonlinearity error - - - 2.5 - + 2.5 LSB Differential Nonlinearity error - - - 1.9 - + 1.9 LSB Zero transition voltage VOT ANn Typ - 20 AVRL+ 0.5LSB Typ + 20 mV Full scale transition voltage VFST ANn Typ - 20 AVRH- 1.5LSB Typ + 20 mV Compare time* - - 1.0 - 5.0 µs 4.5V ≤ ΑVCC ≤ 5.5V 2.2 - 8.0 µs 2.7V ≤ ΑVCC < 4.5V Sampling time* - - 0.5 - - µs 4.5V ≤ ΑVCC ≤ 5.5V 1.2 - - µs 2.7V ≤ ΑVCC < 4.5V - 2.0 3.1 mA A/D Converter active - - 3.3 µA A/D Converter not operated - 520 810 µA A/D Converter active - - 1.0 µA A/D Converter not operated AN2 to 4, 6 to 8, 10 to 12, 14, 15 - - 16.0 pF Normal outputs AN16 to 31 - - 17.8 pF High current outputs - - 2050 Ω 4.5V ≤ AVCC ≤ 5.5V - - 3600 Ω 2.7V ≤ AVCC < 4.5V IA Power supply current Reference power supply current (between AVRH and AVRL) Analog input capacity Analog impedance Analog port input current (during conversion) Analog input voltage Reference voltage range Variation between channels IAH AVCC IR AVRH IRH CVIN RVIN ANn - 0.3 - + 0.3 µA IAIN AN2 to 4, 6 to 8, 10 to 12, 14, 15 AN16 to 31 - 3.0 - + 3.0 µA VAIN ANn AVRL - AVRH V - AVRH - AVCC V - AVRL AVSS - AVSS+ 0.1 V - ANn - - 4.0 LSB AVCC - 0.1 AVSS , AVRL < VAIN < AVCC, AVRH *: Time for each channel. Document Number: 002-04717 Rev. *D Page 53 of 73 CY96690 Series 14.5.2 Accuracy and Setting of the A/D Converter Sampling Time If the external impedance is too high or the sampling time too short, the analog voltage charged to the internal sample and hold capacitor is insufficient, adversely affecting the A/D conversion precision. To satisfy the A/D conversion precision, a sufficient sampling time must be selected. The required sampling time (Tsamp) depends on the external driving impedance Rext, the board capacitance of the A/D converter input pin Cext and the AVCC voltage level. The following replacement model can be used for the calculation: MCU Rext Analog input RVIN Source Comparator Cext CVIN Sampling switch (During sampling:ON) Rext: External driving impedance Cext: Capacitance of PCB at A/D converter input CVIN: Analog input capacity (I/O, analog switch and ADC are contained) RVIN: Analog input impedance (I/O, analog switch and ADC are contained) The following approximation formula for the replacement model above can be used: Tsamp = 7.62  (Rext  Cext + (Rext + RVIN)  CVIN)  Do not select a sampling time below the absolute minimum permitted value. (0.5s for 4.5V ≤ AVCC ≤ 5.5V, 1.2s for 2.7V ≤ AVCC < 4.5V)  If the sampling time cannot be sufficient, connect a capacitor of about 0.1F to the analog input pin.  A big external driving impedance also adversely affects the A/D conversion precision due to the pin input leakage current IIL (static current before the sampling switch) or the analog input leakage current IAIN (total leakage current of pin input and comparator during sampling). The effect of the pin input leakage current IIL cannot be compensated by an external capacitor.  The accuracy gets worse as |AVRH - AVRL| becomes smaller. Document Number: 002-04717 Rev. *D Page 54 of 73 CY96690 Series 14.5.3 Definition of A/D Converter Terms  Resolution : Analog variation that is recognized by an A/D converter.  Nonlinearity error : Deviation of the actual conversion characteristics from a straight line that connects the zero transition point (0b0000000000 ←→ 0b0000000001) to the full-scale transition point (0b1111111110 ←→ 0b1111111111).  Differential nonlinearity error : Deviation from the ideal value of the input voltage that is required to change the output code by 1LSB.  Total error : Difference between the actual value and the theoretical value. The total error includes zero transition error, full-scale transition error and nonlinearity error.  Zero transition voltage: Input voltage which results in the minimum conversion value.  Full scale transition voltage: Input voltage which results in the maximum conversion value. Nonlinearity error of digital output N = Differential nonlinearity error of digital output N = 1LSB = N VOT VFST VNT : : : : VNT - {1LSB ×(N - 1) + VOT} 1LSB V(N + 1) T - VNT 1LSB [LSB] - 1 [LSB] VFST - VOT 1022 A/D converter digital output value. Voltage at which the digital output changes from 0x000 to 0x001. Voltage at which the digital output changes from 0x3FE to 0x3FF. Voltage at which the digital output changes from 0x(N − 1) to 0xN. Document Number: 002-04717 Rev. *D Page 55 of 73 CY96690 Series 1LSB (Ideal value) = Total error of digital output N = AVRH - AVRL 1024 [V] VNT - {1LSB × (N - 1) + 0.5LSB} 1LSB N : A/D converter digital output value. VNT : Voltage at which the digital output changes from 0x(N + 1) to 0xN. VOT (Ideal value) = AVRL + 0.5LSB[V] VFST (Ideal value) = AVRH - 1.5LSB[V] Document Number: 002-04717 Rev. *D Page 56 of 73 CY96690 Series 14.6 High Current Output Slew Rate (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Output rise/fall time tR30, tF30 Pin Name Outputs driving strength set to "30mA" P08_m, P09_m, P10_m Value Conditions Min 15 Typ Max - 75 Voltage Unit ns Remarks CL=85pF VH=VOL30+0.9 × (V OH30-VOL30) VL=VOL30+0.1 × (V OH30-VOL30) VH VH VL VL tR30 tF30 Time 14.7 Low Voltage Detection Function Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Value Conditions Unit VDL0 CILCR:LVL = 0000B 2.70 Typ 2.90 VDL1 CILCR:LVL = 0001B 2.79 3.00 3.21 V VDL2 CILCR:LVL = 0010B 2.98 3.20 3.42 V VDL3 CILCR:LVL = 0011B 3.26 3.50 3.74 V VDL4 CILCR:LVL = 0100B 3.45 3.70 3.95 V VDL5 CILCR:LVL = 0111B 3.73 4.00 4.27 V VDL6 CILCR:LVL = 1001B 3.91 4.20 4.49 V Power supply voltage change rate[2] dV/dt - - 0.004 - + 0.004 V/µs CILCR:LVHYS=0 - - 50 mV Hysteresis width VHYS CILCR:LVHYS=1 80 100 120 mV - - - 75 Detected voltage [1] Min Max 3.10 V µs Stabilization time TLVDSTAB Detection delay time td 30 µs [1]: If the power supply voltage fluctuates within the time less than the detection delay time (td), there is a possibility that the low voltage detection will occur or stop after the power supply voltage passes the detection range. [2]: In order to perform the low voltage detection at the detection voltage (VDLX), be sure to suppress fluctuation of the power supply voltage within the limits of the change ration of power supply voltage. Document Number: 002-04717 Rev. *D Page 57 of 73 CY96690 Series Voltage Vcc dV Detected Voltage dt VDLX max VDLX min Time RCR:LVDE ···Low voltage detection function enable Document Number: 002-04717 Rev. *D Low voltage detection function disable Stabilization time TLVDSTAB Low voltage detection function enable··· Page 58 of 73 CY96690 Series 14.8 Flash Memory Write/Erase Characteristics (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) Parameter Conditions Value Unit Large Sector - Small Sector - - 0.4 2.1 s Security Sector - - 0.31 1.65 s Word (16-bit) write time - - 25 400 µs Not including system-level overhead time. Chip erase time - - 8.31 40.05 s Includes write time prior to internal erase. Sector erase time Typ 1.6 Max 7.5 s Remarks Min - Includes write time prior to internal erase. Note: While the Flash memory is written or erased, shutdown of the external power (VCC) is prohibited. In the application system where the external power (VCC) might be shut down while writing or erasing, be sure to turn the power off by using a low voltage detection function. To put it concrete, change the external power in the range of change ration of power supply voltage (-0.004V/s to +0.004V/s) after the external power falls below the detection voltage (VDLX)[1]. Write/Erase cycles and data hold time Write/Erase Cycles Data Hold Time (Cycle) (Year) 1,000 20 [2] 10,000 10 [2] 100,000 5 [2] [1]: See "14.7 Low Voltage Detection Function Characteristics". [2]: This value comes from the technology qualification (using Arrhenius equation to translate high temperature measurements into normalized value at + 85C). Document Number: 002-04717 Rev. *D Page 59 of 73 CY96690 Series 15. Example Characteristics This characteristic is an actual value of the arbitrary sample. It is not the guaranteed value.  CY96F696 Run Mode (VCC = 5.5V) 100.00 PLL clock (32MHz) 10.00 ICC [mA] Main osc. (4MHz) 1.00 RC clock (2MHz) RC clock (100kHz) 0.10 Sub osc. (32kHz) 0.01 -50 0 50 100 150 TA [ºC] Sleep Mode (VCC = 5.5V) 100.000 PLL clock (32MHz) 10.000 ICC [mA] Main osc. (4MHz) 1.000 RC clock (2MHz) 0.100 RC clock (100kHz) 0.010 Sub osc. (32kHz) 0.001 -50 0 50 100 150 TA [ºC] Document Number: 002-04717 Rev. *D Page 60 of 73 CY96690 Series  CY96F696 Timer Mode (VCC = 5.5V) 10.000 PLL clock (32MHz) ICC [mA] 1.000 Main osc. (4MHz) 0.100 RC clock (2MHz) RC clock (100kHz) 0.010 Sub osc. (32kHz) 0.001 -50 0 50 100 150 TA [ºC] Stop Mode (VCC = 5.5V) 1.000 ICC [mA] 0.100 0.010 0.001 -50 0 50 100 150 TA [ºC] Document Number: 002-04717 Rev. *D Page 61 of 73 CY96690 Series  Used setting Mode Run mode Sleep mode Selected Source Clock Clock/Regulator and FLASH Settings PLL CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 32MHz Main osc. CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 4MHz RC clock fast CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 2MHz RC clock slow CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 100kHz Sub osc. CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 32kHz PLL CLKS1 = CLKS2 = CLKP1 = CLKP2 = 32MHz Regulator in High Power Mode, (CLKB is stopped in this mode) Main osc. CLKS1 = CLKS2 = CLKP1 = CLKP2 = 4MHz Regulator in High Power Mode, (CLKB is stopped in this mode) RC clock fast CLKS1 = CLKS2 = CLKP1 = CLKP2 = 2MHz Regulator in High Power Mode, (CLKB is stopped in this mode) RC clock slow CLKS1 = CLKS2 = CLKP1 = CLKP2 = 100kHz Regulator in Low Power Mode, (CLKB is stopped in this mode) Sub osc. CLKS1 = CLKS2 = CLKP1 = CLKP2 = 32kHz Regulator in Low Power Mode, (CLKB is stopped in this mode) Timer mode PLL CLKMC = 4MHz, CLKPLL = 32MHz (System clocks are stopped in this mode) Regulator in High Power Mode, FLASH in Power-down / reset mode Main osc. CLKMC = 4MHz (System clocks are stopped in this mode) Regulator in High Power Mode, FLASH in Power-down / reset mode RC clock fast CLKMC = 2MHz (System clocks are stopped in this mode) Regulator in High Power Mode, FLASH in Power-down / reset mode RC clock slow CLKMC = 100kHz (System clocks are stopped in this mode) Regulator in Low Power Mode, FLASH in Power-down / reset mode Sub osc. CLKMC = 32 kHz (System clocks are stopped in this mode) Regulator in Low Power Mode, FLASH in Power-down / reset mode Stop mode stopped (All clocks are stopped in this mode) Regulator in Low Power Mode, FLASH in Power-down / reset mode Document Number: 002-04717 Rev. *D Page 62 of 73 CY96690 Series 16. Ordering Information MCU with CAN Controller Part Number CY96F693RBPMC-GS-UJE1 CY96F696RBPMC-GS-UJE1 CY96F696RBPMC-GS-UJE2 Flash Memory Flash A (96.5KB) Flash A (288.5KB) Package* 100-pin plastic LQFP (LQI100) 100-pin plastic LQFP (LQI100) *: For details about package, see "Package Dimension". MCU Without CAN Controller Part Number CY96F693ABPMC-GS-UJE1 CY96F693ABPMC-GS-UJE2 Flash Memory Flash A (96.5KB) CY96F693ABPMC-GS-UKE2 Package* 100-pin plastic LQFP (LQI100) *: For details about package, see "Package Dimension". Document Number: 002-04717 Rev. *D Page 63 of 73 CY96690 Series 17. Package Dimension D D1 75 4 D 5 7 51 D1 51 50 76 4 5 7 75 50 76 E1 E 5 4 7 E1 E 5 4 7 3 6 26 100 1 26 25 1 25 2 5 7 e 100 BOTTOM VIEW 0.1 0 C A-B D 3 0.2 0 C A-B D b TOP VIEW 8 0.0 8 C A-B D 2 A 9 A SEATIN G PLA N E A' 0.25 L1 0.0 8 C c A1 b 10 SECTIO N A-A ' L SIDE VIEW SYM BOL DIM ENSIONS M IN. NOM . M AX. 0.05 0.15 1.70 A A1 DETAIL A b 0.15 0.27 c 0.09 0.20 D 16.00 BSC D1 14.00 BSC e 0.50 BSC E 16.00 BSC E1 14.00 BSC L 0.45 0.60 0.75 L1 0.30 0.50 0.70 NOTES : 1. ALL DIM ENSIONS ARE IN M ILLIM ETERS. 2. DATUM PLANE H IS LOCATED AT THE BOTTOM OF THE M OLD PARTING LINE COINCIDENT W ITH W HERE THE LEAD EXITS THE BODY. 3. DATUM S A-B AND D TO BE DETERM INED AT DATUM PLANE H. 4. TO BE DETERM INED AT SEATING PLANE C. 5. DIM ENSIONS D1 AND E1 DO NOT INCLUDE M OLD PROTRUSION. ALLOW ABLEPROTRUSION IS 0.25m m PRE SIDE. DIM ENSIONS D1 AND E1 INCLUDE M OLD M ISM ATCH AND ARE DETERM INED AT DATUM PLANE H. 6. DETAILS OF PIN 1 IDENTIFIER ARE OPTIONAL BUT M UST BE LOCATED W ITHIN THE ZONE INDICATED. 7. REGARDLESS OF THE RELATIVE SIZE OF THE UPPER AND LOW ER BODY SECTIONS. DIM ENSIONS D1 AND E1 ARE DETERM INED AT THE LARGEST FEATURE OF THE BODY EXCLUSIVE OF M OLD FLASH AND GATE BURRS. BUT INCLUDING ANY M ISM ATCH BETW EEN THE UPPER AND LOW ER SECTIONS OF THE M OLDER BODY. 8. DIM ENSION b DOES NOT INCLUDE DAM BAR PROTRUSION. THE DAM BAR PROTRUSION (S) SHALL NOT CAUSE THE LEAD W IDTH TO EXCEED b M AXIM UM BY M ORE THAN 0.08m m . DAM BAR CANNOT BE LOCATED ON THE LOW ER RADIUS OR THE LEAD FOOT. 9. THESE DIM ENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETW EEN 0.10m m AND 0.25m m FROM THE LEAD TIP. 10. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOW EST POINT OF THE PACKAGE BODY. 002-11500 *A PACKAGE OUTLINE, 100 LEAD LQFP 14.0X14.0X1.7 M M LQI100 REV*A Document Number: 002-04717 Rev. *D Page 64 of 73 CY96690 Series 18. Major Changes Spansion Publication Number: MB96F696-DS704-00011 Page Section Change Results Revision 1.0 - - FEATURES 1 2 2 PRELIMINARY → Data sheet Changed the description of “System clock” Up to 16 MHz external clock for devices with fast clock input feature Up to 8 MHz external clock for devices with fast clock input feature Changed the description of “Free-Running Timers” Signals an interrupt on overflow Signals an interrupt on overflow, supports timer clear upon match with Output Compare (0, 4) Changed the description of “LCD Controller” On-chip drivers for internal divider resistors or external divider resistors Internal divider resistors or external divider resistors 16 Changed the description of “External Interrupts” Interrupt mask and pending bit per channel Interrupt mask bit per channel Changed the description of “Built-in On Chip Debugger” - Event sequencer: 2 levels - Event sequencer: 2 levels + reset Added the Product Changed the Remark of RLT RLT 0/1/2/3/6 Only RLT6 can be used as PPG clock source RLT 0 to 3/6 Changed number of the I/O Ports 77 (Dual clock mode) 79 (Single clock mode) 75 (Dual clock mode) 77 (Single clock mode) Deleted the block of RLT6 from PPG block Changed the RLT block 4ch 0/1/2/3/6 5ch Changed the Description of PPGn_B Programmable Pulse Generator n output (8bit) Programmable Pulse Generator n output (16bit/8bit) Changed the I/O circuit type of Pin no.96 PQ Changed the figure of type B Changed the Remarks of type B (CMOS hysteresis input with input shutdown function, IOL = 4mA, IOH = -4mA, Programmable pull-up resister) (CMOS level output (IOL = 4mA, IOH = -4mA), Automotive input with input shutdown function and programmable pull-up resistor) Changed the figure of type G 19 Added the Type Q 3 3 PRODUCT LINEUP 6 7 9 13 BLOCK DIAGRAM PIN DESCRIPTION PIN CIRCUIT TYPE I/O CIRCUIT TYPE 14 21 23 MEMORY MAP Changed the START addresses of Boot-ROM 0F:E000H 0F:C000H USER ROM MEMORY MAP FOR FLASH Changed the annotation Others (from DF:0200H to DF:1FFFH) are all mirror area of SAS-512B. DEVICES Others (from DF:0200H to DF:1FFFH) is mirror area of SAS-512B. Document Number: 002-04717 Rev. *D Page 65 of 73 CY96690 Series Page Section INTERRUPT VECTOR TABLE 25 26 29 to 32 33 HANDLING PRECAUTIONS HANDLING DEVICES 35 35 ELECTRICAL CHARACTERISTICS 1. Absolute Maximum Ratings 36 37 Change Results Changed the Description of CALLV0 to CALLV7 Reserved CALLV instruction Changed the Description of RESET Reserved Reset vector Changed the Description of INT9 Reserved INT9 instruction Changed the Description of EXCEPTION Reserved Undefined instruction execution Changed the Vector name of Vector number 64 PPGRLT RLT6 Changed the Description of Vector number 64 Reload Timer 6 can be used as PPG clock source Reload Timer 6 Added a section Added the description to “3. External clock usage” (3) Opposite phase external clock Changed the description in “7. Turn on sequence of power supply to A/D converter and analog inputs” In this case, the voltage must not exceed AVRH or AVCC In this case, AVRH must not exceed AVCC. Input voltage for ports shared with analog input ports also must not exceed AVCC Changed the description in “11. SMC power supply pins” To avoid this, VCC must always be powered on before DVCC. To avoid this, VCC must always be powered on before DVCC. DVcc/DVss must be applied when using SMC I/O pin as GPIO. Added the description “13. Mode Pin (MD)” Changed the Symbol of “"L" level average overall output current” ΣIOLSMCAV ΣIOLAVSMC Changed the Symbol of “"H" level average overall output current” ΣIOHSMCAV ΣIOHAVSMC Changed the annotation *2 It is required that AVCC does not exceed VCC and that the voltage at the analog inputs does not exceed AVCC when the power is switched on. It is required that AVCC does not exceed VCC, DVCC and that the voltage at the analog inputs does not exceed AVCC when the power is switched on. Changed the annotation *3 Input/Output voltages of standard ports depend on VCC. Input/Output voltages of high current ports depend on DVCC. Input/Output voltages of standard ports depend on VCC. Changed the annotation *4 Note that if the +B input is applied during power-on, the power supply is provided from the pins and the resulting supply voltage may not be sufficient to operate the Power reset (except devices with persistent low voltage reset in internal vector mode). Note that if the +B input is applied during power-on, the power supply is provided from the pins and the resulting supply voltage may not be sufficient to operate the Power reset. Added the annotation *4 The DEBUG I/F pin has only a protective diode against VSS. Hence it is only permitted to input a negative clamping current (4mA). For protection against positive input voltages, use an external clamping diode which limits the input voltage to maximum 6.0V. Document Number: 002-04717 Rev. *D Page 66 of 73 CY96690 Series Page Section 2. Recommended Operating Conditions 38 3. DC Characteristics (1) Current Rating 39 40 Change Results Added the Value and Remarks to “Power supply voltage” Min: 2.0V Typ: Max: 5.5V Remarks: Maintains RAM data in stop mode Changed the Value of “Smoothing capacitor at C pin” Typ: 1.0F → 1.0F to 3.9F Max: 1.5F → 4.7F Changed the Remarks of “Smoothing capacitor at C pin” Deleted “(Target value)” Added “3.9F (Allowance within ± 20%)” Deleted “(Target value)” Added the Symbol to “Power supply current in Run modes” ICCRCH, ICCRCL Changed the Conditions of ICCPLL, ICCMAIN, ICCSUB in “Power supply current in Run modes” “Flash 0 wait” is added Changed the Value of “Power supply current in Run modes” ICCPLL Typ: 28.5mA → 28mA (TA = +25°C) ICCMAIN Typ:5mA → 3.5mA (TA = +25°C) Max: 10mA → 8mA (TA = +105°C) ICCSUB Typ:0.5mA → 0.1mA (TA = +25°C) Max: 6mA → 3.3mA (TA = +105°C) Added the Symbol to “Power supply current in Sleep modes” ICCSRCH, ICCSRCL Changed the Conditions of ICCSMAIN in “Power supply current in Sleep modes” “SMCR:LPMSS=0” is added Changed the Value of “Power supply current in Sleep modes” ICCSPLL Typ:10mA → 9.5m A (TA = +25°C) ICCSMAIN Typ: 3mA → 1.1m A (TA = +25°C) Max: 8mA → 4.7m A (TA = +105°C) ICCSSUB Typ: 0.3mA → 0.04m A (TA = +25°C) Max: 4.5mA → 2.7m A (TA = +105°C) Added the Symbol to “Power supply current in Timer modes” ICCTPLL Changed the Conditions of ICCTMAIN, ICCTRCH in “Power supply current in Timer modes” “SMCR:LPMSS=0” is added Changed the Value of “Power supply current in Timer modes” ICCTMAIN Max: 355A → 330A (TA = +25°C) Max: 1320A→ 1200A (TA = +105°C) ICCTRCH Max: 245A → 215A (TA = +25°C) Max: 1230A→ 1110A (TA = +105°C) ICCTRCL Max: 105A → 75A (TA = +25°C) Max: 1030A → 910A (TA = +105°C) ICCTSUB Typ: 90A→ 65A (TA = +25°C) Max: 1000A → 885A (TA = +105°C) Document Number: 002-04717 Rev. *D Page 67 of 73 CY96690 Series Page Section 3. DC Characteristics (1) Current Rating Change Results Changed the Value of “Power supply current in Stop modes” ICCH Max: 90A → 60A (TA = +25°C) Max: 1000A → 880A (TA = +105°C) Added the Symbol ICCFLASHPD Changed the Value and condition of “Power supply current for active Low Voltage detector” ICCLVD Typ: 5A, Max: 15A, Remarks: nothing Typ: 5A, Max: -, Remarks: TA = +25°C Typ: -, Max: 12.5A, Remarks: TA = +105°C Changed the condition of “Flash Write/Erase current” ICCFLASH Typ: 12.5mA, Max: 20mA, Remarks: nothing Typ: 12.5mA, Max: -, Remarks: TA = +25°C Typ: -, Max: 20mA, Remarks: TA = +105°C Changed the annotation *2 The power supply current is measured with a 4MHz external clock connected to the Main oscillator and a 32kHz external clock connected to the Sub oscillator. When Flash is not in Power-down / reset mode, ICCFLASHPD must be added to the Power supply current. The power supply current is measured with a 4MHz external clock connected to the Main oscillator and a 32kHz external clock connected to the Sub oscillator. The current for "On Chip Debugger" part is not included. 41 42 3. DC Characteristics (2) Pin Characteristics 43 Added the Symbol for DEBUG I/F pin VOLD Changed the Pin name of “Input capacitance” Other than Vcc, Vss, AVcc, AVss, AVRH, AVRL, P08_m, P09_m, P10_m Other than C, Vcc, Vss, DVcc, DVss, AVcc, AVss, AVRH, AVRL, P08_m, P09_m, P10_m Deleted the annotation “IOH and IOL are target value.” Added the annotation “In the case of driving stepping motor directly or high current outputs, set "1" to the bit in the Port High Drive Register (PHDRnn:HDx="1").” Document Number: 002-04717 Rev. *D Page 68 of 73 CY96690 Series Page Section 4. AC Characteristics (1) Main Clock Input Characteristics 46 Change Results Changed MAX frequency for fFCI in all conditions 16 → 8 Changed MIN frequency for tCYLH 62.5 → 125 Changed MIN, MAX and Unit for PWH, PWL MIN: 30 → 55 MAX: 70 → Unit: % → ns Added the figure (tCYLH) when using the external clock 47 4. AC Characteristics (2) Sub Clock Input Characteristics Added the figure (tCYLL) when using the crystal oscillator clock 48 4. AC Characteristics (3) Built-in RC Oscillation Characteristics Added “RC clock stabilization time” 4. AC Characteristics (5) Operating Conditions of PLL Changed the Value of “PLL input clock frequency” Max: 16MHz → 8MHz Changed the Symbol of “PLL macro oscillation clock frequency” fPLLO → fCLKVCO Added Remarks to “PLL oscillation clock frequency” Added “ PLL phase jitter” and the figure 4. AC Characteristics (6) Reset Input 4. AC Characteristics (8) USART Timing Added the figure for reset input time (tRSTL) 49 51 52 54 4. AC Characteristics (10) I2C timing 55 5. A/D Converter (1) Electrical Characteristics for the A/D Converter 56 5. A/D Converter (2) Accuracy and Setting of the A/D Converter Sampling Time 5. A/D Converter (3) Definition of A/D Converter Terms 57 Changed the condition (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C, CL = 50pF) Changed the HARDWARE MANUAL “MB96690 series HARDWARE MANUAL” “MB96600 series HARDWARE MANUAL” Changed the figure for “Internal shift clock mode” Added parameter, “Noise filter” and an annotation *5 for it Added tSP to the figure Added “Analog impedance” Added “Variation between channels” Added the annotation Deleted the unit “[Min]” from approximation formula of Sampling time Changed the Description and the figure “Linearity” → “Nonlinearity” “Differential linearity error” “Differential nonlinearity error” Changed the Description Linearity error: Deviation of the line between the zero-transition point (0b0000000000←→0b0000000001) and the full-scale transition point (0b1111111110←→0b1111111111) from the actual conversion characteristics. Nonlinearity error: Deviation of the actual conversion characteristics from a straight line that connects the zero transition point (0b0000000000 ←→ 0b0000000001) to the full-scale transition point (0b1111111110 ←→ 0b1111111111). Added the Description “Zero transition voltage” “Full scale transition voltage” Document Number: 002-04717 Rev. *D Page 69 of 73 CY96690 Series Page Section 6. High Current Output Slew Rate Change Results Changed the condition (VCC = AVCC = 2.7V to 5.5V, DVCC = 4.5V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) (VCC = AVCC = DVCC = 2.7V to 5.5V, VSS = AVSS = DVSS = 0V, TA = - 40°C to + 105°C) 59 Changed the Symbol and figure tR2, tF2, VOL2 tR30, tF30, VOL30 7. Low Voltage Detection Function Characteristics Added the Value of “ Power supply voltage change rate” Max: +0.004 V/s Added “Hysteresis width” (VHYS) Added “Stabilization time” (TLVDSTAB) 59 Added “Detection delay time” (td) Deleted the Remarks Added the annotation *1, *2 59 7. Low Voltage Detection Function Characteristics Added the figure for “Hysteresis width” 8. Flash Memory Write/Erase Characteristics Changed the Value of “Sector erase time” Added the figure for “Stabilization time” Added “Security Sector” to “Sector erase time” Changed the Parameter “Half word (16 bit) write time” “Word (16-bit) write time” Changed the Value of “Chip erase time” 61 Changed the Remarks of “Sector erase time” Excludes write time prior to internal erase Includes write time prior to internal erase Added the Note and annotation *1 Deleted “(targeted value)” from title “ Write/Erase cycles and data hold time” 62 to 63 EXAMPLE CHARACTERISTICS ORDERING INFORMATION Added a section Changed part number MCU with CAN controller MB96F696RAPMC-GSE1* → MB96F696RBPMC-GSE1 MB96F696RAPMC-GSE2* → MB96F696RBPMC-GSE2 Added part number MCU with CAN controller MB96F693RBPMC-GSE1 65 MB96F693RBPMC-GSE2 MB96F695RBPMC-GSE1 MB96F695RBPMC-GSE2 MCU without CAN controller MB96F693ABPMC-GSE1 MB96F693ABPMC-GSE2 MB96F695ABPMC-GSE1 MB96F695ABPMC-GSE2 Revision 1.1 - - Company name and layout design change NOTE: Please see “Document History” about later revised information. Document Number: 002-04717 Rev. *D Page 70 of 73 CY96690 Series Page Section Change Results Rev. *B 7, 9, 66,67 66 Marketing Part Numbers changed from an MB prefix to a CY prefix. 1. Product Lineup Package description modified to JEDEC description. 3. Pin Assignment FPT-100P-M20 → LQI100 16. Ordering Information 17. Package Dimension 16. Ordering Information Revised Marketing Part Numbers as follows: Before) MCU with CAN controller MB96F693RBPMC-GSE1 MB96F693RBPMC-GSE2 MB96F695RBPMC-GSE1 MB96F695RBPMC-GSE2 MB96F696RBPMC-GSE1 MB96F696RBPMC-GSE2 MCU without CAN controller MB96F693ABPMC-GSE1 MB96F693ABPMC-GSE2 MB96F695ABPMC-GSE1 MB96F695ABPMC-GSE2 After) MCU with CAN controller CY96F693RBPMC-GS-UJE1 CY96F696RBPMC-GS-UJE1 CY96F696RBPMC-GS-UJE2 MCU without CAN controller CY96F693ABPMC-GS-UJE1 CY96F693ABPMC-GS-UJE2 Rev. *C 63 16. Ordering Information Document Number: 002-04717 Rev. *D Added Marketing Part Number as follows: CY96F693ABPMC-GS-UKE2 Page 71 of 73 CY96690 Series Document History Document Title: CY96690 Series, F2MC-16FX 16-Bit Proprietary Microcontroller Document Number: 002-04717 Revision ECN Orig. of Change **  TORS Submission Date Description of Change 01/31/2014 Migrated to Cypress and assigned document number 002-04717. No change to document contents or format. *A 5148388 TORS *B 6006770 MIYH *C 6353089 SHUS 10/17/2018 Updated Ordering Information. For details, please see 18. Major Changes. *D 6600964 TORS 06/21/2019 Updated to new template. Document Number: 002-04717 Rev. *D 09/22/2016 Updated to Cypress template. 2 12/28/2017 Updated Document Title to read as “CY96690 Series, F MC-16FX 16-Bit Proprietary Microcontroller”. Replaced MB96690 Series with CY96690 Series in all instances across the document. Changed the prefix of all MPNs from MB to CY in all instances across the document. Replaced FPT-100P-M20 with LQI100 in all instances across the document. Updated Ordering Information. For details, please see 18. Major Changes. Page 72 of 73 CY96690 Series Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Arm® Cortex® Microcontrollers Automotive Clocks & Buffers Interface Internet of Things Memory Microcontrollers cypress.com/arm cypress.com/automotive cypress.com/clocks cypress.com/iot cypress.com/memory cypress.com/psoc cypress.com/pmic Wireless Connectivity Community | Projects | Video | Blogs | Training | Components Technical Support cypress.com/support cypress.com/mcu Power Management ICs USB Controllers Cypress Developer Community cypress.com/interface PSoC Touch Sensing PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 MCU cypress.com/touch cypress.com/usb cypress.com/wireless Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. © Cypress Semiconductor Corporation, 2011-2019. This document is the property of Cypress Semiconductor Corporation and its subsidiaries (“Cypress”). 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You shall indemnify and hold Cypress, its directors, officers, employees, agents, affiliates, distributors, and assigns harmless from and against all claims, costs, damages, and expenses, arising out of any claim, including claims for product liability, personal injury or death, or property damage arising from any use of a Cypress product as a Critical Component in a High-Risk Device. Cypress products are not intended or authorized for use as a Critical Component in any High-Risk Device except to the limited extent that (i) Cypress’s published data sheet for the product explicitly states Cypress has qualified the product for use in a specific High-Risk Device, or (ii) Cypress has given you advance written authorization to use the product as a Critical Component in the specific High-Risk Device and you have signed a separate indemnification agreement. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 002-04717 Rev. *D Revised June 21, 2019 Page 73 of 73