S34ML08G2
8Gb, 3 V, 4-bit ECC, x8 I/O, SLC NAND
Flash Memory for Embedded
Distinctive Characteristics
Density
– 8 Gb (4 Gb x 2)
Architecture (For each 4 Gb device)
– Input / Output Bus Width: 8-bits
– Page Size: (2048 + 128) bytes; 128-byte spare area
– Block Size: 64 Pages or (128k + 8k) bytes
– Plane Size
– 2048 Blocks per Plane or (256M + 16M) bytes
– Device Size
– 2 Planes per Device or 512 Mbyte
NAND Flash Interface
– Open NAND Flash Interface (ONFI) 1.0 compliant
– Address, Data and Commands multiplexed
Supply Voltage
– 3.3V device: Vcc = 2.7V ~ 3.6V
Performance
Page Read / Program
– Random access: 30 µs (Max)
– Sequential access: 25 ns (Min)
– Program time / Multiplane Program time: 300 µs (Typ)
Block Erase / Multiplane Erase
– Block Erase time: 3.5 ms (Typ)
Security
– One Time Programmable (OTP) area
– Serial number (unique ID)
– Hardware program/erase disabled during power transition
Additional Features
– Supports Multiplane Program and Erase commands
– Supports Copy Back Program
– Supports Multiplane Copy Back Program
– Supports Read Cache
Electronic Signature
– Manufacturer ID: 01h
Operating Temperature
– Industrial: -40°C to 85°C
– industrial Plus: -40°C to 105°C
Reliability
– 100,000 Program / Erase cycles (Typ)
(with 4-bit ECC per 528 bytes)
– 10 Year Data retention (Typ)
– Blocks zero and one are valid and will be valid for at least 1000
program-erase cycles with ECC
Package Options
– Lead Free and Low Halogen
– 48-Pin TSOP 12 x 20 x 1.2 mm
– 63-Ball BGA 11 x 9 x 1 mm
SkyHigh Memory Limited
Document Number: 002-00484 Rev. *J
Suite 4401-02, 44/F One Island East,
18 Westlands Road Hong Kong
www.skyhighmemory.com
Revised May 06, 2019
S34ML08G2
Contents
1.
General Description..................................................... 3
8.4
8.5
Pin Capacitance............................................................ 11
Power Consumptions and Pin Capacitance
for Allowed Stacking Configurations ............................. 11
2.
Connection Diagram.................................................... 3
3.
Pin Description............................................................. 4
4.
Block Diagrams............................................................ 5
9.
9.1
Physical Interface ....................................................... 11
Physical Diagram .......................................................... 12
5.
Addressing ................................................................... 6
10.
Ordering Information .................................................. 14
6.
Read Status Enhanced ................................................ 6
11.
Document History ....................................................... 15
7.
7.1
Read ID.......................................................................... 7
Read Parameter Page ................................................... 8
8.
8.1
8.2
8.3
Electrical Characteristics ..........................................
Valid Blocks .................................................................
Recommended Operating Conditions..........................
DC Characteristics .......................................................
Document Number: 002-00484 Rev. *J
10
10
10
10
Page 2 of 15
S34ML08G2
1. General Description
The SkyHigh S34ML08G2 8-Gb NAND is offered in 3.3 VCC with x8 I/O interface. This document contains information for the
S34ML08G2 device, which is a dual-die stack of two S34ML04G2 die. For detailed specifications, please refer to the discrete die
datasheet: S34ML01G2_04G2.
2. Connection Diagram
Figure 1. 48-Pin TSOP1 Contact x8 Device (1 CE 8 Gb)
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
12
13
48
NAND Flash
TSOP1
37
36
(x8)
24
25
VSS
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC
NC
VCC
VSS
NC
VCC
NC
I/O3
I/O2
I/O1
I/O0
NC
NC
NC
VSS
(1)
(1)
(1)
(1)
Note
1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally.
Figure 2. 63-BGA Contact, x8 Device, Single CE (Top View)
A1
A2
A9
A10
NC
NC
NC
NC
B1
B9
B10
NC
NC
NC
C3
C4
C5
C6
C7
C8
WP#
ALE
VSS
CE#
WE#
RB#
D3
D4
D5
D6
D7
D8
VCC
RE#
CLE
NC
NC
NC
E3
E4
E5
E6
E7
E8
NC
NC
NC
NC
NC
NC
F3
F4
F5
F6
F7
F8
NC
NC
NC
NC
VSS
NC
G3
G4
G5
G6
G7
G8
NC
VCC
NC
NC
NC
NC
H3
H4
H5
H6
H7
H8
NC
I/O0
NC
NC
NC
Vcc
J3
J4
J5
J6
J7
J8
NC
I/O1
NC
VCC
I/O5
I/O7
K3
K4
K5
K6
K7
K8
VSS
I/O2
I/O3
I/O4
I/O6
VSS
L1
L2
L9
L10
NC
NC
NC
NC
M1
M2
M9
M10
NC
NC
NC
NC
Document Number: 002-00484 Rev. *J
Page 3 of 15
S34ML08G2
3. Pin Description
Table 1. Pin Description
Pin Name
Description
I/O0 - I/O7
Inputs/Outputs. The I/O pins are used for command input, address input, data input, and data output. The I/O pins float to High-Z
when the device is deselected or the outputs are disabled.
CLE
Command Latch Enable. This input activates the latching of the I/O inputs inside the Command Register on the rising edge of Write
Enable (WE#).
ALE
Address Latch Enable. This input activates the latching of the I/O inputs inside the Address Register on the rising edge of Write
Enable (WE#).
CE#
Chip Enable. This input controls the selection of the device. When the device is not busy CE# low selects the memory.
WE#
Write Enable. This input latches Command, Address and Data. The I/O inputs are latched on the rising edge of WE#.
RE#
Read Enable. The RE# input is the serial data-out control, and when active drives the data onto the I/O bus. Data is valid tREA after
the falling edge of RE# which also increments the internal column address counter by one.
WP#
Write Protect. The WP# pin, when low, provides hardware protection against undesired data modification (program / erase).
R/B#
Ready Busy. The Ready/Busy output is an Open Drain pin that signals the state of the memory.
VCC
Supply Voltage. The VCC supplies the power for all the operations (Read, Program, Erase). An internal lock circuit prevents the
insertion of Commands when VCC is less than VLKO.
VSS
Ground.
NC
Not Connected.
Notes
1. A 0.1 µF capacitor should be connected between the VCC Supply Voltage pin and the VSS Ground pin to decouple the current surges from the power supply. The PCB
track widths must be sufficient to carry the currents required during program and erase operations.
2. An internal voltage detector disables all functions whenever VCC is below 1.8V to protect the device from any involuntary program/erase during power transitions.
Document Number: 002-00484 Rev. *J
Page 4 of 15
S34ML08G2
4. Block Diagrams
Figure 3. Functional Block Diagram — 8 Gb
Address
Register/
Counter
Program Erase
Controller
HV Generation
X
8192 Mbit + 512 Mbit (8 Gb Device)
NAND Flash
Memory Array
ALE
CLE
WE#
CE#
WP#
D
E
C
O
D
E
R
Command
Interface
Logic
RE#
Page Buffer
Y Decoder
Command
Register
I/O Buffer
Data
Register
I/O0~I/O7
Figure 4. Block Diagram — 1 CE (4 Gb x 8)
IO0~IO7
CE#
WE#
RE#
4 G b x8
N A N D F lash
M em o ry#2
R/B#
VSS
ALE
VCC
CLE
WP#
IO0~IO7
CE#
CE#
W E#
WE#
RE#
RE#
AL E
ALE
CL E
CLE
W P#
WP#
Document Number: 002-00484 Rev. *J
4 G b x8
N A N D F lash
M em o ry#1
IO0~IO7
R/B#
R /B #
VSS
VSS
VCC
V CC
Page 5 of 15
S34ML08G2
5. Addressing
Table 2. Address Cycle Map
Bus Cycle
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
A7 (CA7)
1st / Col. Add. 1
A0 (CA0)
A1 (CA1)
A2 (CA2)
A3 (CA3)
A4 (CA4)
A5 (CA5)
A6 (CA6)
2nd / Col. Add. 2
A8 (CA8)
A9 (CA9)
A10 (CA10)
A11 (CA11)
Low
Low
Low
Low
3rd / Row Add. 1
A12 (PA0)
A13 (PA1)
A14 (PA2)
A15 (PA3)
A16 (PA4)
A17 (PA5)
A18 (PLA0)
A19 (BA0)
4th / Row Add. 2
A20 (BA1)
A21 (BA2)
A22 (BA3)
A23 (BA4)
A24 (BA5)
A25 (BA6)
A26 (BA7)
A27 (BA8)
A28 (BA9)
A29 (BA10)
A30 (BA11)
Low
Low
Low
Low
Low
5th / Row Add. 3
(6)
Notes
1. CAx = Column Address bit.
2. PAx = Page Address bit.
3. PLA0 = Plane Address bit zero.
4. BAx = Block Address bit.
5. Block address concatenated with page address and plane address = actual page address, also known as the row address.
6. A30 for 8 Gb (4 Gb x 2 – DDP) (1CE).
For the address bits, the following rules apply:
A0 - A11: column address in the page
A12 - A17: page address in the block
A18: plane address (for multiplane operations) / block address (for normal operations)
A19 - A30: block address
6. Read Status Enhanced
Read Status Enhanced is used to retrieve the status value for a previous operation in the following cases:
In the case of concurrent operations on a multi-die stack.
When two dies are stacked to form a dual-die package (DDP), it is possible to run one operation on the first die, then activate a
different operation on the second die, for example: Erase while Read, Read while Program, etc.
In the case of multiplane operations in the same die.
Document Number: 002-00484 Rev. *J
Page 6 of 15
S34ML08G2
7. Read ID
The device contains a product identification mode, initiated by writing 90h to the command register, followed by an address input of
00h.
Note: If you want to execute Read Status command (0x70) after Read ID sequence, you should input dummy command (0x00)
before Read Status command (0x70).
For the S34ML08G2 device, five read cycles sequentially output the manufacturer code (01h), and the device code and 3rd, 4th, and
5th cycle ID, respectively. The command register remains in Read ID mode until further commands are issued to it.
Table 3. Read ID for Supported Configurations
Density
Org
VCC
1st
2nd
3rd
4th
4 Gb
x8
3.3V
01h
8 Gb (4 Gb x 2 – DDP with one CE#)
x8
3.3V
01h
5th
DCh
90h
95h
56h
D3h
D1h
95h
5Ah
Figure 5. Read ID Operation Timing — 8 Gb
CLE
CE#
WE#
tWHR
tAR
ALE
tREA
RE#
I/Ox
90h
Read ID
Command
00h
01h
Address 1
Cycle
Maker
Code
D3h
Device
Code
D1h
3rd Cycle
95h
5Ah
4th Cycle
5th Cycle
5th ID Data
Table 4. Read ID Byte 5 Description
Description
ECC Level
Plane Number
Plane Size
(without spare area)
I/O7
I/O6 I/O5 I/O4
I/O3 I/O2
1 bit / 512 bytes
2 bit / 512 bytes
4 bit / 512 bytes
8 bit / 512 bytes
00
01
10
11
1
2
4
8
00
01
10
11
64 Mb
128 Mb
256 Mb
512 Mb
1 Gb
2 Gb
4 Gb
Reserved
Document Number: 002-00484 Rev. *J
I/O1 I/O0
000
001
010
011
100
101
110
0
Page 7 of 15
S34ML08G2
7.1
Read Parameter Page
The device supports the ONFI Read Parameter Page operation, initiated by writing ECh to the command register, followed by an
address input of 00h. The command register remains in Parameter Page mode until further commands are issued to it. Table 5
explains the parameter fields.
Note: For 32nm SkyHigh NAND, for a particular condition, the Read Parameter Page command does not give the correct values.
Toovercome this issue, the host must issue a Reset command before the Read Parameter Page command. Issuance of Reset
before
the Read Parameter Page command will provide the correct values and will not output 00h values.
Table 5. Parameter Page Description
Byte
O/M
Description
Values
Revision Information and Features Block
0-3
M
Parameter page signature
Byte 0: 4Fh, “O”
Byte 1: 4Eh, “N”
Byte 2: 46h, “F”
Byte 3: 49h, “I”
4-5
M
Revision number
2-15
Reserved (0)
1
1 = supports ONFI version 1.0
0
Reserved (0)
02h, 00h
M
Features supported
5-15
Reserved (0)
4
1 = supports odd to even page Copyback
3
1 = supports interleaved operations
2
1 = supports non-sequential page programming
1
1 = supports multiple LUN operations
0
1 = supports 16-bit data bus width
1Eh, 00h
M
Optional commands supported
6-15
Reserved (0)
5
1 = supports Read Unique ID
4
1 = supports Copyback
3
1 = supports Read Status Enhanced
2
1 = supports Get Features and Set Features
1
1 = supports Read Cache commands
0
1 = supports Page Cache Program command
3Bh, 00h
Reserved (0)
00h
6-7
8-9
10-31
4Fh, 4Eh, 46h, 49h
Manufacturer Information Block
32-43
M
Device manufacturer (12 ASCII characters)
53h, 50h, 41h, 4Eh, 53h, 49h, 4Fh,
4Eh, 20h, 20h, 20h, 20h
44-63
M
Device model (20 ASCII characters)
53h, 33h, 34h, 4Dh, 4Ch, 30h, 38h,
47h, 32h, 20h, 20h, 20h, 20h, 20h, 20h,
20h, 20h, 20h, 20h, 20h
64
M
JEDEC manufacturer ID
01h
65-66
O
Date code
00h
67-79
Reserved (0)
00h
Memory Organization Block
80-83
M
Number of data bytes per page
84-85
M
Number of spare bytes per page
00h, 08h, 00h, 00h
80h, 00h
86-89
M
Number of data bytes per partial page
00h, 00h, 00h, 00h
90-91
M
Number of spare bytes per partial page
00h, 00h
92-95
M
Number of pages per block
40h, 00h, 00h, 00h
96-99
M
Number of blocks per logical unit (LUN)
00h, 10h, 00h, 00h
100
M
Number of logical units (LUNs)
02h
101
M
Number of address cycles
4-7
Column address cycles
0-3
Row address cycles
23h
102
M
Number of bits per cell
01h
Document Number: 002-00484 Rev. *J
Page 8 of 15
S34ML08G2
Table 5. Parameter Page Description (Continued)
Byte
O/M
Description
Values
103-104
M
Bad blocks maximum per LUN
50h, 00h
105-106
M
Block endurance
01h, 05h
107
M
Guaranteed valid blocks at beginning of target
01h
108-109
M
Block endurance for guaranteed valid blocks
01h, 03h
110
M
Number of programs per page
04h
111
M
Partial programming attributes
5-7
Reserved
4
1 = partial page layout is partial page data followed by
partial page spare
1-3
Reserved
0
1 = partial page programming has constraints
00h
112
M
Number of bits ECC correctability
04h
M
Number of interleaved address bits
4-7
Reserved (0)
0-3
Number of interleaved address bits
01h
O
Interleaved operation attributes
4-7
Reserved (0)
3
Address restrictions for program cache
2
1 = program cache supported
1
1 = no block address restrictions
0
Overlapped / concurrent interleaving support
04h
Reserved (0)
00h
113
114
115-127
Electrical Parameters Block
128
M
I/O pin capacitance
0Ah
M
Timing mode support
6-15
Reserved (0)
5
1 = supports timing mode 5
4
1 = supports timing mode 4
3
1 = supports timing mode 3
2
1 = supports timing mode 2
1
1 = supports timing mode 1
0
1 = supports timing mode 0, shall be 1
1Fh, 00h
131-132
O
Program cache timing mode support
6-15
Reserved (0)
5
1 = supports timing mode 5
4
1 = supports timing mode 4
3
1 = supports timing mode 3
2
1 = supports timing mode 2
1
1 = supports timing mode 1
0
1 = supports timing mode 0
1Fh, 00h
133-134
M
tPROG Maximum page program time (µs)
BCh, 02h
135-136
M
tBERS Maximum block erase time (µs)
10h, 27h
137-138
M
tR Maximum page read time (µs)
1Eh, 00h
139-140
M
tCCS Minimum Change Column setup time (ns)
C8h, 00h
Reserved (0)
00h
129-130
141-163
Vendor Block
164-165
M
166-253
254-255
M
Vendor specific Revision number
00h
Vendor specific
00h
Integrity CRC
16h, 26h
Redundant Parameter Pages
256-511
M
Value of bytes 0-255
Repeat Value of bytes 0-255
512-767
M
Value of bytes 0-255
Repeat Value of bytes 0-255
768+
O
Additional redundant parameter pages
FFh
Note
1. “O” Stands for Optional, “M” for Mandatory.
Document Number: 002-00484 Rev. *J
Page 9 of 15
S34ML08G2
8. Electrical Characteristics
8.1
Valid Blocks
Table 6. Valid Blocks
Device
Symbol
Min
Typ
Max
Unit
S34ML04G2
NVB
4016
—
4096
Blocks
S34ML08G2
NVB
8032 (1)
—
8192
Blocks
Note
1. Each 4 Gb has maximum 80 bad blocks.
8.2
Recommended Operating Conditions
Table 7. Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Units
Vcc Supply Voltage
Vcc
2.7
3.3
3.6
V
Ground Supply Voltage
Vss
0
0
0
V
8.3
DC Characteristics
Table 8. DC Characteristics and Operating Conditions
Parameter
Power On Current
Operating Current
Symbol
Test Conditions
Min
Typ
Max
Units
ICC0
FFh command input after power on
—
—
50 per
device
mA
—
15
30
mA
Normal
—
15
30
mA
Cache
—
15
30
mA
—
—
15
30
mA
—
—
1
mA
—
10
50
µA
Sequential Read
ICC1
Program
ICC2
Erase
ICC3
Standby Current, (TTL)
ICC4
Standby Current, (CMOS)
ICC5
tRC = tRC (min)
CE# = VIL, Iout = 0 mA
CE# = VIH,
WP# = 0V/Vcc
CE# = VCC-0.2,
WP# = 0/VCC
Input Leakage Current
ILI
VIN = 0 to VCC(max)
—
—
±10
µA
Output Leakage Current
ILO
VOUT = 0 to VCC(max)
—
—
±10
µA
Input High Voltage
VIH
—
VCC x 0.8
—
VCC + 0.3
V
Input Low Voltage
VIL
—
-0.3
—
VCC x 0.2
V
Output High Voltage
VOH
IOH = -400 µA
2.4
—
—
V
Output Low Voltage
VOL
IOL = 2.1 mA
—
—
0.4
V
IOL(R/B#)
VOL = 0.4V
8
10
—
mA
VLKO
—
—
1.8
—
V
Output Low Current (R/B#)
Erase and Program Lockout Voltage
Notes
1. All VCC pins, and VSS pins respectively, are shorted together.
2. Values listed in this table refer to the complete voltage range for VCC and to a single device in case of device stacking.
3. All current measurements are performed with a 0.1 µF capacitor connected between the VCC Supply Voltage pin and the VSS Ground pin.
4. Standby current measurement can be performed after the device has completed the initialization process at power up.
Document Number: 002-00484 Rev. *J
Page 10 of 15
S34ML08G2
8.4
Pin Capacitance
Table 9. Pin Capacitance (TA = 25°C, f=1.0 MHz)
Parameter
Symbol
Test Condition
Min
Max
Unit
Input
CIN
VIN = 0V
—
10
pF
Input / Output
CIO
VIL = 0V
—
10
pF
Note
1. For the stacked devices version the Input is 10 pF x [number of stacked chips] and the Input/Output is 10 pF x [number of stacked chips].
8.5
Power Consumptions and Pin Capacitance for Allowed Stacking
Configurations
When multiple dies are stacked in the same package, the power consumption of the stack will increase according to the number of
chips. As an example, the standby current is the sum of the standby currents of all the chips, while the active power consumption
depends on the number of chips concurrently executing different operations.
When multiple dies are stacked in the same package the pin/ball capacitance for the single input and the single input/output of the
combo package must be calculated based on the number of chips sharing that input or that pin/ball.
9. Physical Interface
Document Number: 002-00484 Rev. *J
Page 11 of 15
S34ML08G2
9.1
9.1.1
Physical Diagram
48-Pin Thin Small Outline Package (TSOP1)
Figure 6. TS2 48 — 48-lead Plastic Thin Small Outline, 12 x 20 mm, Package Outline
PACKAGE
TS2 48
JEDEC
MO-142 (D) DD
NOTES:
SYMBOL
MIN
NOM
MAX
A
---
---
1.20
A1
0.05
---
0.15
A2
0.95
1.00
1.05
b1
0.17
0.20
0.23
b
0.17
0.22
0.27
c1
0.10
---
0.16
c
0.10
---
0.21
D
19.80
20.00
20.20
D1
18.30
18.40
18.50
E
11.90
12.00
12.10
e
L
0.50 BASIC
0.50
0.60
DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y14.5M-1994).
2.
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
3.
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN): INK OR LASER MARK.
4.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE LEADS
ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
5.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD
PROTRUSION ON E IS 0.15mm PER SIDE AND ON D1 IS 0.25mm PER SIDE.
6.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08mm TOTAL IN EXCESS OF b DIMENSION AT MAX.
MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07mm.
7.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10mm AND 0.25mm FROM THE LEAD TIP.
8.
LEAD COPLANARITY SHALL BE WITHIN 0.10mm AS MEASURED FROM
THE SEATING PLANE.
9.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
0.70
O
0˚
---
8
R
0.08
---
0.20
N
1.
48
Document Number: 002-00484 Rev. *J
5007 \ f16-038 \ 6.5.13
Page 12 of 15
S34ML08G2
9.1.2
63-Pin Ball Grid Array (BGA)
Figure 7. VLD063 — 63-Pin BGA, 11 mm x 9 mm Package
NOTES:
PACKAGE
VLD 063
JEDEC
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
M0-207(M)
2. ALL DIMENSIONS ARE IN MILLIMETERS.
11.00 mm x 9.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
A
---
---
1.00
A1
0.25
---
---
NOTE
PROFILE
4.
BALL HEIGHT
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE
"D" DIRECTION.
D
11.00 BSC.
E
9.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
BODY SIZE
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
63
b
0.40
0.45
BALL COUNT
0.50
eE
0.80 BSC.
BALL PITCH
0.80 BSC.
BALL PITCH
SD
0.40 BSC.
SOLDER BALL PLACEMENT
SE
0.40 BSC.
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
e REPRESENTS THE SOLDER BALL GRID PITCH.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE TOTAL NUMBER OF POPULATED SOLDER
BALL POSITIONS FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
“SD” AND “SE” ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
BALL DIAMETER
eD
A3-A8,B2-B8,C1,C2,C9,C10
D1,D2,D9,D10,E1,E2,E9,E10
F1,F2,F9,F10,G1,G2,G9,G10
H1,H2,H9,H10,J1,J2,J9,J10
K1,K2,K9,K10
L3-L8,M3-M8
3. BALL POSITION DESIGNATION PER JEP95, SECTION
3, SPP-020.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW “SD” OR “SE” = 0.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, “SD” = eD/2 AND “SE” = eE/2.
8. "+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
g5013 \ 16-038.28 \ 6.5.13
Document Number: 002-00484 Rev. *J
Page 13 of 15
S34ML08G2
10. Ordering Information
The ordering part number is formed by a valid combination of the following:
S34ML
08G
2
01
T
F
I
00
0
Packing Type
0 = Tray
3 = 13” Tape and Reel
Model Number
00 = Standard Interface / ONFI (x8)
Temperature Range
I = Industrial (–40°C to + 85°C)
A = Industrial with AECQ-100 and GT Grade (-40˚C to +85˚C)
V = Industrial Plus (-40°C to +105°C)
B = Industrial Plus with AECQ-100 and GT Grade (-40˚C to +105˚C)
Materials Set
F = Lead (Pb)-free
H = Lead (Pb)-free and Low Halogen
Package
B = BGA
T = TSOP
Bus Width
00 = x8 NAND, single die
04 = x16 NAND, single die
01 = x8 NAND, dual die
05 = x16 NAND, dual die
Technology
2 = SkyHigh NAND Revision 2 (32 nm)
Density
01G = 1 Gb
02G = 2 Gb
04G = 4 Gb
08G = 8 Gb
Device Family
S34ML
SkyHigh SLC NAND Flash Memory for Embedded
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm
availability of specific valid combinations and to check on newly released combinations.
Valid Combinations
Device
Family
Density
S34ML
08G
Technology
Bus
Width
Package
Type
Temperature
Range
Additional
Ordering Options
Packing
Type
Package
Description
2
01
BH, TF
I, A, V, B
00
0, 3
BGA, TSOP
Document Number: 002-00484 Rev. *J
Page 14 of 15
S34ML08G2
11. Document History
Document Title: S34ML08G2 8 Gb, 4-bit ECC, x8 I/O and 3 V VCC NAND Flash Memory for Embedded
Document Number: 002-00484
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
-
XILA
04/11/2013
Initial release.
Spansion Publication Number: S34ML08G2
Description of Change
*A
-
XILA
05/17/2013
Performance: Reliability - updated
Addressing: Address Cycle Map table - updated Bus Cycle data
Read ID: Read ID for Supported Configurations table - updated 8 Gb Density
for 2nd, 3rd, 4th, and 5th
Read Parameter Page: Parameter Page Description table: corrected values
for Bytes 8-9 and 254-255
*B
-
XILA
08/09/2013
Read ID: Read ID Operation Timing - 8 Gb figure: added values to I/Ox
Physical Interface: Updated TS2 48 - 48-lead Plastic Thin Small Outline, 12 x
20 mm, Package Outline figure
*C
-
XILA
01/08/2015
Performance: Package Options - added 63-Ball BGA 11 x 9 x 1 mm
Connection Diagram: Added figure - 63-BGA Contact, x8 Device, Single CE
Physical Interface: Added 63-Pin Ball Grid Array (BGA)
Ordering Information: Valid Combinations table - added BH to Package Type
and BGA to Package Description
*D
4955117
XILA
10/15/2015
Updated to Cypress template
11/19/2015
Fixed formatting issues
Removed Cover page and Spansion Revision History
Distinctive Characteristics: Added industrial Plus temperature range
Ordering Information: Added A, V, B temperature ranges
04/25/2016
Added Recommended Operating Conditions section.
Updated DC Characteristics section - updated “VCC supply Voltage (erase and
program lockout)” to "Erase and Program Lockout voltage”.
Updated “Read parameter page” section.
Updated “Ordering Information” section.
Updated copyright information at the end of the document.
*E
5017336
XILA
*F
5160512
*G
5767403 AESATMP8
06/08/2017
Updated logo and Copyright.
*H
5893557
MNAD
09/26/2017
Updated Figure 6.
*I
6033716
MNAD
01/17/2018
Updated Sales page and Copyright information.
MNAD
05/06/2019
Updated to SkyHigh format
*J
XILA
Document Number: 002-00484 Rev. *J
Page 15 of 15
