S71GL064NB0BHW0P0

S71GL-N Based MCPs Stacked Multi-Chip Product (MCP) Flash Memory and RAM 64/32 Megabit (4/2M x 16-bit) CMOS 3.0 Volt-Only Page Mode Flash Memory and 32/16 Megabit (2M/1M x 16-bit) Pseudo Static RAM S71GL-N Based MCPs Cover Sheet Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions. Publication Number S71GL-N_00 Revision 08 Issue Date May 6, 2013 Data Sheet (Advan ce Infor m a tio n) Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content: “This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.” Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content: “This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.” Combination Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page. Full Production (No Designation on Document) When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category: “This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.” Questions regarding these document designations may be directed to your local sales office. 2 S71GL-N Based MCPs S71GL-N_00_08 May 6, 2013 S71GL-N Based MCPs Stacked Multi-Chip Product (MCP) Flash Memory and RAM 64/32 Megabit (4/2M x 16-bit) CMOS 3.0 Volt-Only Page Mode Flash Memory and 32/16 Megabit (2M/1M x 16-bit) Pseudo Static RAM Data Sheet (Advance Information) Distinctive Characteristics  Packages MCP Features – 7 x 9 x 1.2 mm 56 ball FBGA  Power Supply Voltage of 2.7V to 3.3V  Operating Temperature  High Performance – –25°C to +85°C – 90 ns access time (90 ns Flash, 70 ns pSRAM/SRAM) – 25 ns page read times General Description The S71GL-N product series consists of S29GL-N Flash memory with pSRAM combinations defined as: Flash Memory Density 32 Mb 16 Mb pSRAM Density 64 Mb S71GL032NA0 32 Mb S71GL064NB0 For detailed specifications, please refer to the individual data sheets. Document Publication Identification Number (PID) S29GL-N S29GL-N_00 SPH016D970R1R (16 Mb pSRAM Type 9) SPH016D970R1R SPH032D970R1R (32 Mb pSRAM Type 9) SPH032D970R1R Publication Number S71GL-N_00 Revision 08 Issue Date May 6, 2013 This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice. Data 1. Sheet (Advan ce Infor m a tio n) Product Selector Guide Device-Model# (Note) (p)SRAM density (p)SRAM type Package 16 Mb pSRAM 9 TLC056 32 Mb pSRAM 9 TLC056 S71GL032NA0-0K S71GL032NA0-0P S71GL064NB0-0K S71GL064NB0-0P Note: Please see the valid combinations table for the model# description. 2. MCP Block Diagram VCCf VCC CE1#f WP#/ACC RESET# Flash-only Address Flash Shared Address OE# WE# VSS RY/BY# VCCS DQ15 to DQ0 VCC pSRAM IO15-IO0 CE1#s CE# UB# UB# LB# LB# CE2s 4 S71GL-N Based MCPs S71GL-N_00_08 May 6, 2013 D at a S hee t (Adva nce In for m ation) 3. Connection Diagram 56-ball Fine-Pitch Ball Grid Array (Top View, Balls Facing Down) A2 A3 A4 A5 A6 A7 A7 LB# WP/ACC WE# A8 A11 Legend B1 B2 B3 B4 B5 B6 B7 B8 A3 A6 UB# RST#f CE2s A19 A12 A15 C1 C2 C3 C4 C5 C6 C7 C8 RY/BY# A20 A2 A5 A18 A9 A13 A21 D1 D2 D3 D6 D7 D8 A1 A4 A17 A10 A14 RFU E1 E2 E3 E6 E7 E8 A0 VSS DQ1 DQ6 RFU A16 F1 F2 F3 F4 F5 F6 F7 F8 CE1#f OE# DQ9 DQ3 DQ4 DQ13 DQ15 RFU G1 G2 G3 G4 G5 G6 G7 G8 CE1#s DQ0 DQ10 VCCf VCCs DQ12 DQ7 VSS H2 H3 H4 H5 H6 H7 DQ8 DQ2 DQ11 RFU DQ5 DQ14 Shared (Note 1) Flash only RAM only Reserved for Future Use Note: 1. May be shared depending on density. 3.1 MCP Flash-only Addresses Shared Addresses S71GL032NA0 A20 A19-A0 S71GL064NB0 A21 A20-A0 Special Handling Instructions For FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. May 6, 2013 S71GL-N_00_08 S71GL-N Based MCPs 5 Data 4. Sheet (Advan ce Pin Description Pin A21–A0 DQ15–DQ0 Description 22 Address Inputs (Common and Flash only) (A20-A0 for the S71GL032N) 16 Data Inputs/Outputs (Common) CE1#f Chip Enable (Flash) CE1#s Chip Enable 1 (pSRAM/SRAM) CE2s Chip Enable 2 (pSRAM/SRAM) OE# Output Enable (Common) WE# Write Enable (Common) RY/BY# Ready/Busy Output (Flash 1) UB# Upper Byte Control (pSRAM/SRAM) LB# Lower Byte Control (pSRAM/SRAM) RESET# WP#/ACC 6 Infor m a tio n) Hardware Reset Pin, Active Low (Flash) Hardware Write Protect/Acceleration Pin (Flash) VCCf Flash 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply tolerances) VCCS pSRAM/SRAM Power Supply VSS Device Ground (Common) NC Not Connected. No device internal signal is connected to the package connector nor is there any future plan to use the connector for a signal. The connection may safely be used for routing space for a signal on a Printed Circuit Board (PCB). S71GL-N Based MCPs S71GL-N_00_08 May 6, 2013 D at a 5. S hee t (Adva nce In for m ation) Ordering Information The order number is formed by a valid combinations of the following: S71GL 064 N B0 BF W 0 P 0 PACKING TYPE 0 = Tray 2 = 7” Tape and Reel 3 = 13” Tape and Reel MODEL NUMBER See the Valid Combinations table PACKAGE MODIFIER 0 = 9 x 7 mm, 1.2 mm height, 56 balls TEMPERATURE RANGE W = Wireless (-25°C to +85°C) PACKAGE TYPE BF = Fine-pitch BGA Lead (Pb)-free package BH = Fine-pitch BGA Lead (PB)-free, Low-Halogen package pSRAM / SRAM DENSITY B0 = 32 Mb pSRAM A0 = 16 Mb pSRAM PROCESS TECHNOLOGY N = 110 nm, MirrorBit® Technology FLASH DENSITY 064 = 64 Mb 032 = 32 Mb PRODUCT FAMILY S71GL Multi-chip Product (MCP) 3.0-volt Page Mode Flash Memory and RAM Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. Table 5.1 Valid Combinations S71GL064N Valid Combinations Base Ordering Part Number Package & Temperature S71GL032NA0 BHW Package Modifier/Model Number Packing Type 0K Speed Options (ns)/Boot Sector Option Package Marking pSRAM 9 / 70 TLC056 90 / Bottom Boot Sector 0P 90 / Top Boot Sector 0, 2, 3 (1) S71GL064NB0 (p)SRAM Type/ Access Time (ns) 0K 90 / Bottom Boot Sector 0P 90 / Top Boot Sector BFW, BHW S71GL064NB0 Note: 1. Type 0 is standard. Specify other options as required. May 6, 2013 S71GL-N_00_08 S71GL-N Based MCPs 7 Data Sheet (Advan ce Infor m a tio n) 6. Physical Dimensions 6.1 TLC056—56-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 7 mm Package D1 A D eD 0.15 C (2X) 8 7 SE 7 6 5 E E1 4 3 eE 2 1 H INDEX MARK PIN A1 CORNER B 10 TOP VIEW G F E D C B A PIN A1 CORNER 7 SD 0.15 C (2X) BOTTOM VIEW 0.20 C A A2 A1 C 56X 0.08 C SIDE VIEW 6 b 0.15 M C A B 0.08 M C NOTES: PACKAGE TLC 056 JEDEC N/A DxE 9.00 mm x 7.00 mm PACKAGE SYMBOL MIN NOM MAX A --- --- 1.20 A1 0.20 --- --- A2 0.81 --- 0.97 NOTE PROFILE BODY SIZE E 7.00 BSC. BODY SIZE D1 5.60 BSC. MATRIX FOOTPRINT E1 5.60 BSC. MATRIX FOOTPRINT MD 8 MATRIX SIZE D DIRECTION ME 8 MATRIX SIZE E DIRECTION 56 0.35 0.40 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010. 4. e REPRESENTS THE SOLDER BALL GRID PITCH. 5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. BODY THICKNESS 9.00 BSC. n DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. BALL HEIGHT D φb 1. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. BALL COUNT 0.45 eE 0.80 BSC. BALL PITCH eD 0.80 BSC BALL PITCH SD / SE 0.40 BSC. SOLDER BALL PLACEMENT A1,A8,D4,D5,E4,E5,H1,H8 WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. BALL DIAMETER DEPOPULATED SOLDER BALLS WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 9. N/A 10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. 3348 \ 16-038.22a 8 S71GL-N Based MCPs S71GL-N_00_08 May 6, 2013 D at a S hee t (Adva nce In for m ation) 7. Revision History Section Description Revision 01 (May 14, 2007) Initial release Revision 02 (June 19, 2007) Global Editorial changes to valid combinations table Revision 03 (March 25, 2008) Ordering Information Added Low-Halogen option to package type Revision 04 (October 31, 2008) General Description Product Selector Guide Added pSRAM Type 8, 90 nm Added pSRAM Type 8, 90 nm Changed S71GL064Nxx-xx package to TSC056 Ordering Information Changed S71GL064Nxx-xx package to TSC056 Physical Dimensions Added TSC056 Revision 05 (January 20, 2009) Global Added OPNs S71GL032NA0BHW0B/0F and S71GL064NA0BHW0B/0F General Description Added pSRAM Type 10 Revision 06 (January 13, 2010) General Description Global Updated Table with current pSRAM offerings Removed pSRAM Type 7 MCPs Added 32 Mb and 64 Mb pSRAM Type 9 MCPs Revision 07 (May 8, 2012) Global Removed 4 Mb and 8 Mb pSRAM Updated Document and Publication Identification Number descriptions Revision 08 (May 6, 2013) Changed VCC Range to 2.7-3.3V Global Removed pSRAM Type 8 and Type 10 Corrected Package to TLC056 for S71GL064Nxx May 6, 2013 S71GL-N_00_08 S71GL-N Based MCPs 9 Data Sheet (Advan ce Infor m a tio n) Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2007-2013 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™ and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners. 10 S71GL-N Based MCPs S71GL-N_00_08 May 6, 2013