W180-52GT

W180 Peak Reducing EMI Solution Features • Cypress PREMIS™ family offering • Generates an EMI optimized clocking signal at the output • Selectable output frequency range • Single 1.25% or 3.75% down or center spread output • Integrated loop filter components • Operates with a 3.3V or 5V supply • Low power CMOS design • Available in 8-pin SOIC (Small Outline Integrated Circuit) FS2 0 0 1 1 FS1 0 1 0 1 -01, 51 (MHz) 8 < FIN < 10 10 < FIN < 15 15 < FIN < 18 18 < FIN < 28 SS% 0 1 Table 1. Modulation Width Selection W180-01, 02, 03 Output W180-51, 52, 53 Output Fin > Fout > Fin – 1.25% Fin + 0.625% > Fin > – 0.625% Fin > Fout > Fin – 3.75% Fin + 1.875% > Fin > –1.875% Table 2. Frequency Range Selection W180 Option# -02, 52 (MHz) 8 < FIN < 10 10 < FIN < 15 N/A N/A -03, 53 (MHz) N/A N/A 15 < FIN < 18 18 < FIN < 28 Key Specifications Supply Voltages:............................................VDD = 3.3V±5% or VDD = 5V±10% Frequency Range:...............................8 MHz < Fin < 28 MHz Cycle to Cycle Jitter: ........................................300 ps (max.) Selectable Spread Percentage:.................... 1.25% or 3.75% Output Duty Cycle: ............................... 40/60% (worst case) Output Rise and Fall Time:...................................5 ns (max.) Simplified Block Diagram 3.3V or 5.0V Pin Configurations SOIC W180-01/51 CLKIN or X1 NC or X2 GND SS% 1 2 3 4 8 7 6 5 FS2 FS1 VDD CLKOUT X1 XTAL Input X2 W180 Spread Spectrum Output (EMI suppressed) W180-02/03 W180-52/53 CLKIN or X1 NC or X2 GND SS% 1 2 3 4 8 7 6 5 SSON# FS1 VDD CLKOUT 3.3V or 5.0V Oscillator or Reference Input W180 Spread Spectrum Output (EMI suppressed) Cypress Semiconductor Corporation Document #: 38-07156 Rev. *B • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised October 5, 2005 W180 Pin Definitions Pin Name CLKOUT CLKIN or X1 Pin No. 5 1 Pin Type O I Pin Description Output Modulated Frequency: Frequency modulated copy of the unmodulated input clock (SSON# asserted). Crystal Connection or External Reference Frequency Input: This pin has dual functions. It may either be connected to an external crystal, or to an external reference clock. Crystal Connection: Input connection for an external crystal. If using an external reference, this pin must be left unconnected. Spread Spectrum Control (Active LOW): Asserting this signal (active LOW) turns the internal modulation waveform on. This pin has an internal pull-down resistor. Frequency Selection Bit(s) 1 and 2: These pins select the frequency range of operation. Refer to Table 2. These pins have internal pull-up resistors. Modulation Width Selection: When Spread Spectrum feature is turned on, this pin is used to select the amount of variation and peak EMI reduction that is desired on the output signal. Internal pull-up resistor. Power Connection: Connected to 3.3V or 5V power supply. Ground Connection: This should be connected to the common ground plane. NC or X2 SSON# FS1:2 SS% 2 8 (-02, -03 52, 53) 7, 8 (-01, 51) 4 I I I I VDD GND 6 3 P G Document #: 38-07156 Rev. *B Page 2 of 10 W180 Overview The W180 products are one series of devices in the Cypress PREMIS family. The PREMIS family incorporates the latest advances in PLL spread spectrum frequency synthesizer techniques. By frequency modulating the output with a low-frequency carrier, peak EMI is greatly reduced. Use of this technology allows systems to pass increasingly difficult EMI testing without resorting to costly shielding or redesign. In a system, not only is EMI reduced in the various clock lines, but also in all signals which are synchronized to the clock. Therefore, the benefits of using this technology increase with the number of address and data lines in the system. The Simplified Block Diagram on page 1 shows a simple implementation. input. The output frequency is then equal to the ratio of P/Q times the reference frequency. (Note: For the W180 the output frequency is equal to the input frequency.) The unique feature of the Spread Spectrum Frequency Timing Generator is that a modulating waveform is superimposed at the input to the VCO. This causes the VCO output to be slowly swept across a predetermined frequency band. Because the modulating frequency is typically 1000 times slower than the fundamental clock, the spread spectrum process has little impact on system performance. Frequency Selection With SSFTG In Spread Spectrum Frequency Timing Generation, EMI reduction depends on the shape, modulation percentage, and frequency of the modulating waveform. While the shape and frequency of the modulating waveform are fixed for a given frequency, the modulation percentage may be varied. Using frequency select bits (FS2:1 pins), the frequency range can be set (see Table 2). Spreading percentage is set with pin SS% as shown in Table 1. A larger spreading percentage improves EMI reduction. However, large spread percentages may either exceed system maximum frequency ratings or lower the average frequency to a point where performance is affected. For these reasons, spreading percentages options are provided. Functional Description The W180 uses a phase-locked loop (PLL) to frequency modulate an input clock. The result is an output clock whose frequency is slowly swept over a narrow band near the input signal. The basic circuit topology is shown in Figure 1. The input reference signal is divided by Q and fed to the phase detector. A signal from the VCO is divided by P and fed back to the phase detector also. The PLL will force the frequency of the VCO output signal to change until the divided output signal and the divided reference signal match at the phase detector VDD Clock Input Freq. Divider Q Phase Detector Charge Pump Reference Input Σ Modulating Waveform VCO Post Dividers CLKOUT (EMI suppressed) Feedback Divider P PLL GND Figure 1. Functional Block Diagram Document #: 38-07156 Rev. *B Page 3 of 10 W180 Spread Spectrum Frequency Timing Generation The device generates a clock that is frequency modulated in order to increase the bandwidth that it occupies. By increasing the bandwidth of the fundamental and its harmonics, the amplitudes of the radiated electromagnetic emissions are reduced. This effect is depicted in Figure 2. As shown in Figure 2, a harmonic of a modulated clock has a much lower amplitude than that of an unmodulated signal. The reduction in amplitude is dependent on the harmonic number and the frequency deviation or spread. The equation for the reduction is: dB = 6.5 + 9*log10(P) + 9*log10(F) Where P is the percentage of deviation and F is the frequency in MHz where the reduction is measured. The output clock is modulated with a waveform depicted in Figure 3. This waveform, as discussed in “Spread Spectrum Clock Generation for the Reduction of Radiated Emissions” by Bush, Fessler, and Hardin produces the maximum reduction in the amplitude of radiated electromagnetic emissions. Figure 3 details the Cypress spreading pattern. Cypress does offer options with more spread and greater EMI reduction. Contact your local Sales representative for details on these devices. EMI Reduction SSFTG Typical Clock Amplitude (dB) Amplitude (dB) Spread Spectrum Enabled NonSpread Spectrum Frequency Span (MHz) Center Spread Frequency Span (MHz) Down Spread Figure 2. Clock Harmonic with and without SSCG Modulation Frequency Domain Representation MAX. FREQUENCY 10% 20% 30% 40% 50% 60% 70% 80% 90% 10% 20% 30% 40% 50% 60% 70% 80% 100% 90% MIN. Figure 3. Typical Modulation Profile Document #: 38-07156 Rev. *B 100% Page 4 of 10 W180 Absolute Maximum Ratings[1] Stresses greater than those listed in this table may cause permanent damage to the device. These represent a stress rating only. Operation of the device at these or any other condi. tions above those specified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect reliability. Rating –0.5 to +7.0 –65 to +150 0 to +70 –55 to +125 0.5 Unit V °C °C °C W Parameter VDD, VIN TSTG TA TB PD Description Voltage on any pin with respect to GND Storage Temperature Operating Temperature Ambient Temperature under Bias Power Dissipation DC Electrical Characteristics: 0°C < TA < 70°C, VDD = 3.3V ±5% Parameter IDD tON VIL VIH VOL VOH IIL IIH IOL IOH CI RP ZOUT Description Supply Current Power Up Time Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Input Low Current Input High Current Output Low Current Output High Current Input Capacitance Input Pull-Up Resistor Clock Output Impedance 500 25 Note 2 Note 2 @ 0.4V, VDD = 3.3V @ 2.4V, VDD = 3.3V 15 15 7 2.4 –50 50 2.4 0.4 First locked clock cycle after Power Good Test Condition Min. Typ. 18 Max. 32 5 0.8 Unit mA ms V V V V µA µA mA mA pF kΩ Ω Notes: 1. Single Power Supply: The voltage on any input or I/O pin cannot exceed the power pin during power-up. 2. Inputs FS2:1& SS% have a pull-up resistor; Input SSON# has a pull-down resistor. Document #: 38-07156 Rev. *B Page 5 of 10 W180 DC Electrical Characteristics: 0°C < TA < 70°C, VDD = 5V ±10% Parameter IDD tON VIL VIH VOL VOH IIL IIH IOL IOH CI RP ZOUT Description Supply Current Power Up Time Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Input Low Current Input High Current Output Low Current Output High Current Input Capacitance Input Pull-Up Resistor Clock Output Impedance 500 25 Note 3 Note 3 @ 0.4V, VDD = 5V @ 2.4V, VDD = 5V 24 24 7 2.4 –50 50 0.7VDD 0.4 First locked clock cycle after Power Good Test Condition Min. Typ. 30 Max. 50 5 0.15VDD Unit mA ms V V V V µA µA mA mA pF kΩ Ω AC Electrical Characteristics: TA = 0°C to +70°C, VDD = 3.3V ±5% or 5V±10% Parameter fIN fOUT tR tF tOD tID tJCYC Description Input Frequency (-01) Output Frequency (-01) Output Rise Time Output Fall Time Output Duty Cycle Input Duty Cycle Jitter, Cycle-to-Cycle Harmonic Reduction fout = 20 MHz, third harmonic measured, reference board, 15-pF load 8 Test Condition Input Clock, Note 4 Spread Off, Note 4 15-pF load 0.8V–2.4V 15-pF load 2.4 –0.8V 15-pF load 40 40 250 Min. 8 8 2 2 Typ. Max. 28 28 5 5 60 60 300 Unit MHz MHz ns ns % % ps dB Notes: 3. Inputs FS1:2 have a pull-up resistor; Input SSON# has a pull-down resistor. 4. Frequency range listed for -01 version. See Table 2 for frequency range of -02 and -03 versions. Document #: 38-07156 Rev. *B Page 6 of 10 W180 Application Information Recommended Circuit Configuration For optimum performance in system applications the power supply decoupling scheme shown in Figure 4 should be used. VDD decoupling is important to both reduce phase jitter and EMI radiation. The 0.1-µF decoupling capacitor should be placed as close to the VDD pin as possible, otherwise the Xtal Connection or Reference Input Xtal Connection or NC GND increased trace inductance will negate its decoupling capability. The 10-µF decoupling capacitor shown should be a tantalum type. For further EMI protection, the VDD connection can be made via a ferrite bead, as shown. Recommended Board Layout Figure 5 shows a recommended 2-layer board layout. 1 W180 2 3 4 8 7 6 5 R1 Clock Output C1 0.1 µF 3.3V or 5V System Supply FB C2 10 µF Tantalum Figure 4. Recommended Circuit Configuration C1 = C2 = High frequency supply decoupling capacitor (0.1-µF recommended). Common supply low frequency decoupling capacitor (10-µF tantalum recommended). Match value to line impedance Ferrite Bead Via To GND Plane R1 = FB = = G Xtal Connection or Reference Input NC C1 G G Clock Output R1 G Power Supply Input (3.3V or 5V) FB C2 Figure 5. Recommended Board Layout (2-Layer Board) Document #: 38-07156 Rev. *B Page 7 of 10 W180 Ordering Information Ordering Code W180-01G W180-01GT W180-02G W180-02GT W180-03G W180-03GT W180-51G W180-51GT W180-52G W180-52GT W180-53G W180-53GT Lead-free CYW180-01SX CYW180-01SXT CYW180-02SX CYW180-02SXT CYW180-03SX CYW180-03SXT CYW180-51SX CYW180-51SXT CYW180-52SX CYW180-52SXT CYW180-53SX CYW180-53SXT 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial Package Type 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel 8-pin Plastic SOIC (150-mil) 8-pin Plastic SOIC (150-mil)- Tape and Reel Operating Temperature Range 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial 0°C to 70°C, Commercial Document #: 38-07156 Rev. *B Page 8 of 10 W180 Package Diagram 8-lead (150-Mil) SOIC S8 8 Lead (150 Mil) SOIC - S08 PIN 1 ID 4 1 1. DIMENSIONS IN INCHES[MM] MIN. MAX. 2. PIN 1 ID IS OPTIONAL, ROUND ON SINGLE LEADFRAME RECTANGULAR ON MATRIX LEADFRAME 3. REFERENCE JEDEC MS-012 0.230[5.842] 0.244[6.197] 0.150[3.810] 0.157[3.987] 4. PACKAGE WEIGHT 0.07gms PART # S08.15 STANDARD PKG. 5 8 SZ08.15 LEAD FREE PKG. 0.189[4.800] 0.196[4.978] SEATING PLANE 0.010[0.254] 0.016[0.406] X 45° 0.061[1.549] 0.068[1.727] 0.004[0.102] 0.050[1.270] BSC 0.004[0.102] 0.0098[0.249] 0°~8° 0.016[0.406] 0.035[0.889] 0.0075[0.190] 0.0098[0.249] 0.0138[0.350] 0.0192[0.487] 51-85066-*C PREMIS is a trademark of Cypress Semiconductor Corporation. All products and company names mentioned in this document may be the trademarks of their respective holders. Document #: 38-07156 Rev. *B Page 9 of 10 © Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. W180 Document Title: W180 Peak Reducing EMI Solution Document Number: 38-07156 REV. ** *A *B ECN NO. 110266 122588 402292 Issue Date 12/15/01 12/27/02 See ECN Orig. of Change SZV RBI RGL Description of Change Change from Spec number: 38-00796 to 38-07156 Added power up requirements to maximum ratings information. Added Lead-free devices Document #: 38-07156 Rev. *B Page 10 of 10