1SS400C2

CYStech Electronics Corp. High Speed Switching diode Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : Page No. : 1/3 1SS400C2 Features •Extremely small surface mounting type.(SC-79/SOD523) •High speed switching applications •Low reverse current Symbol Outline Absolute Maximum Ratings • Maximum Temperatures Storage Temperature Tstg .................................................................................................... -55~+150°C Junction Temperature Tj .............................................................................................................. +150°C • Maximum Voltages and Currents (Ta=25°C) DC Reverse Voltage VR .................................................................................................................... 100 V Mean Rectifying Current IF ........................................................................................……….. 200mA Peak Forward Surge Current IFSM………………………………….. ………………………………………. 500mA • Thermal Characteristics Total Device Dissipation @ TA=25°C (Note) Thermal Resistance, Junction to Ambient Note: FR-5 board minimum pad. PD……………………………………………….200mW RθJA……………………………………………625°C/W 1SS400C2 CYStek Product Specification CYStech Electronics Corp. Characteristics (Ta=25°C) Characteristic Forward Voltage Reverse Leakage Current Diode Capacitance Reverse Recovery Time Symbol VF IR CD trr VR=80V VR=0.5V, f=1MHz IF=IR=10mA Condition IF=100mA Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : Page No. : 2/3 Min. - Max. 1.2 0.1 3 4 Unit V µA pF ns Characteristic Curves Forward Current Derating Curve 120 Percentage of Rated Forward Current---(%) 100 80 60 40 20 0 0 25 50 75 100 125 150 175 200 0.1 0.2 0.4 0.6 0.8 1 1.2 Ambient Temperature---TA(℃) 100 Forward Current vs Forward Voltage Forward Current---I F(mA) M ounting on glass epoxy PCBs 10 8 5℃ 1 25℃ - 40℃ Forward Voltage---VF(V) Reverse Leakage Current vs Reverse Voltage 10 Capacitance between terminals---C T(pF) Reverse Leakage Current---IR(μA) 0.68 Capacitance vs Reverse Voltage 1 T a= 125℃ 0.64 f=1MHz Ta=25℃ 0.1 T a= 8 5℃ 0.6 0.01 T a= 25℃ 0.56 0.001 0 10 20 30 40 50 Reverse Voltage---VR(V) 0.52 0 2 4 Reverse Voltage---VR (V) 6 8 1SS400C2 CYStek Product Specification CYStech Electronics Corp. SOD-523 Dimension Spec. No. : C303C2 Issued Date : 2004.02.11 Revised Date : Page No. : 3/3 Marking Code : 1 A 2 1 2 Style : Pin 1. Cathode 2. Anode 2-lead SOD-523 Plastic Package CYStek Package Code : C2 *: Typical DIM A bp c D Material: Millimeters Min 0.5 0.25 0.1 1.1 .Max. 0.7 0.35 0.2 1.3 DIM E HE V Millimeters Min. 0.7 1.5 0.15(typ) Max. 0.9 1.7 Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.If there is any question with packing specification or packing method, please contact your local CYStek sales office. • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. 1SS400C2 CYStek Product Specification