BTB1198N3

CYStech Electronics Corp. PNP Epitaxial Planar Transistor Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 1/6 BTB1198N3 Features • Low VCE(SAT), VCE(SAT)= -0.16V (Typ.) @ IC/IB=-500mA/-50mA • High breakdown voltage, BVCEO=-80V • Complementary to BTD1782N3 • Pb-free package Symbol BTB1198N3 Outline SOT-23 B：Base C：Collector E：Emitter Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation (TA=25°C) Power Dissipation (TC=25°C) Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Junction Temperature Storage Temperature Note : Free air condition BTB1198N3 CYStek Product Specification Symbol VCBO VCEO VEBO IC PD PD RθJA RθJC Tj Tstg Limits -80 -80 -5 -0.5 225 (Note) 560 556 (Note) 223 150 -55~+150 Unit V V V A mW mW °C/W °C/W °C °C CYStech Electronics Corp. Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE fT Cob Min. -80 -80 -5 120 Typ. -0.16 180 11 Max. -0.5 -0.5 -0.5 390 Unit V V V µA µA V MHz pF Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 2/6 Test Conditions IC=-50µA IC=-2mA IE=-50µA VCB=-50V VEB=-4V IC=-500mA, IB=-50mA VCE=-3V, IC=-0.1A VCE=-10V, IC=-50mA, f=100MHz VCB=-10V, f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% Classification Of hFE Rank Range Q 120~270 R 180~390 Ordering Information Device BTB1198N3 Package SOT-23 (Pb-free) Shipping 3000 pcs / Tape & Reel Marking AK BTB1198N3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Output Characteristics 0.1 IB=500uA Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 3/6 Output Characteristics 0.45 0.4 Collector Current---IC(A) 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 IB=500uA IB=2.5mA IB=2mA IB=1.5mA IB=1mA Collector Current---IC(A) IB=400uA IB=300uA 0.05 IB=200uA IB=100uA IB=0 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 6 IB=0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 6 Output Characteristics 0.9 0.8 Collector Current---IC(A) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 4 5 6 Collector-to-Emitter Voltage---VCE(V) IB=0 IB=10mA Output Characteristics 1.2 Collector Current---IC(A) IB=8mA IB=6mA IB=4mA IB=2mA IB=25mA IB=20mA IB=15mA IB=10mA 1 0.8 0.6 IB=5mA 0.4 0.2 IB=0 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 6 Current Gain vs Collector Current 1000 VCE=3V Saturation Voltage vs Collector Current 10000 Saturation Voltage---(mV) VCE(SAT) Current Gain---HFE 100 VCE=2V 1000 IC=25IB 10 VCE=1V 100 IC=10IB IC=20IB 1 1 10 100 1000 Collector Current---IC(mA) 10000 10 1 10 100 1000 Collector Current---IC(mA) 10000 BTB1198N3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves(Cont.) Saturation Voltage vs Collector Current 10000 Saturation Voltage---(mV) VBE(SAT)@IC=10IB Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 4/6 Power Derating Curve 250 Power Dissipation---PD(mW) 200 150 100 50 0 1000 100 1 10 100 1000 Collector Current---IC(mA) 10000 0 50 100 150 200 Ambient Temperature---TA(℃) BTB1198N3 CYStek Product Specification CYStech Electronics Corp. Reel Dimension Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 5/6 Carrier Tape Dimension BTB1198N3 CYStek Product Specification CYStech Electronics Corp. SOT-23 Dimension Spec. No. : C824N3 Issued Date : 2006.06.06 Revised Date : Page No. : 6/6 A L 3 B 1 2 S Marking: AK TE V G 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 Style: Pin 1.Base 2.Emitter 3.Collector C D K H J *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTB1198N3 CYStek Product Specification