CYStech Electronics Corp.
Low Vcesat NPN Epitaxial Planar Transistor
Spec. No. : C848T3-H Issued Date : 2002.08.18 Revised Date : 2005.09.16 Page No. : 1/4
BTD882T3/S
Features
• Low VCE(sat), typically 0.25V at IC / IB = 2A / 0.2A • Excellent current gain characteristics • Complementary to BTB772T3/S • Pb-free package is available
Symbol
BTD882T3
Outline
TO-126
B:Base C:Collector E:Emitter
ECB
Absolute Maximum Ratings (Ta=25°C)
Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Junction Temperature Storage Temperature
Note : *1. Single Pulse Pw≦350µs,Duty≦2%.
Symbol VCBO VCEO VEBO IC(DC) IC(Pulse) Pd(Ta=25℃) Pd(Tc=25℃) Tj Tstg
Limit 40 30 5 3 7 1 10 150 -55~+150
Unit V V V A A W °C °C
*1
BTD882T3/S
CYStek Product Specification
CYStech Electronics Corp.
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 40 30 5 52 100 Typ. 0.25 90 45 Max. 1 1 0.5 2 500 Unit V V V µA µA V V MHz pF
Spec. No. : C848T3-H Issued Date : 2002.08.18 Revised Date : 2005.09.16 Page No. : 2/4
Test Conditions IC=50µA, IE=0 IC=1mA, IB=0 IE=50µA, IC=0 VCB=50V, IE=0 VEB=3V, IC=0 IC=2A, IB=0.2A IC=2A, IB=0.2A VCE=2V, IC=20mA VCE=2V, IC=1A VCE=5V, IC=0.1A, f=100MHz VCB=10V, f=1MHz
*Pulse Test : Pulse Width ≤380µs, Duty Cycle≤2%
Classification Of hFE 2
Rank Range Q 100~200 P 160~320 E 250~500
Ordering Information
Device BTB882T3 BTB882T3S Package TO-126 TO-126 (Pb-free) Shipping 500 pcs / bag 500 pcs / bag
BTD882T3/S
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Current gain vs Collector current
1000
VCE=5V
Spec. No. : C848T3-H Issued Date : 2002.08.18 Revised Date : 2005.09.16 Page No. : 3/4
C-E saturation voltage vs Collector current
1000 C-E saturation voltage--VCE(SAT)(mV)
Current gain---HFE
100
IC=40IB
100
VCE=2V VCE=1V
10
IC=10IB IC=20IB
10 1 10 100 1000 10000
1 1 10 100 1000 10000
Collector current---IC(mA)
Collector current---IC(mA)
Power derating curves
B-E saturation votlage vs Collector current
10000
12 Power Dissipation---(W) 10 8 6 4 2 0
1 10 100 1000 10000 Ta=25℃ Tc=25℃
B-E saturation voltage--VBE(SAT)(mV)
IC=10IB
1000
100
0
50
100
150
200
Collector current---IC(mA)
Temperature---(℃)
BTD882T3/S
CYStek Product Specification
CYStech Electronics Corp.
TO-126 Dimension
D A B 123 G C I
Spec. No. : C848T3-H Issued Date : 2002.08.18 Revised Date : 2005.09.16 Page No. : 4/4
E
J
K M
Marking:
α3 α4
D882
Style: Pin 1.Emitter 2.Collector 3.Base
F H L
α1 α2
3-Lead TO-126 Plastic Package CYStek Package Code: T3
*: Typical
DIM α1 α2 α3 α4 A B C D E
Inches Min. Max. *3° *3° *3° *3° 0.1500 0.1539 0.2752 0.2791 0.5315 0.6102 0.2854 0.3039 0.0374 0.0413
Millimeters Min. Max. *3° *3° *3° *3° 3.81 3.91 6.99 7.09 13.50 15.50 7.52 7.72 0.95 1.05
DIM F G H I J K L M
Inches Min. Max. 0.0280 0.0319 0.0480 0.0520 0.1709 0.1890 0.0950 0.1050 0.0450 0.0550 0.0450 0.0550 *0.0217 0.1378 0.1520
Millimeters Min. Max. 0.71 0.81 1.22 1.32 4.34 4.80 2.41 2.66 1.14 1.39 1.14 1.39 *0.55 3.50 3.86
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD882T3/S
CYStek Product Specification
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