BTN2369N3

CYStech Electronics Corp. High Frequency NPN Switching Transistor Spec. No. : C229N3 Issued Date : 2004.08.09 Revised Date : Page No. : 1/3 BTN2369N3 Description • High transition frequency, fT=500MHz(min) • High current, IC(max)=200mA • Low saturation voltage, VCE(SAT)=0.3V(max) Symbol BTN2369N3 Outline SOT-23 B：Base C：Collector E：Emitter Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Power Dissipation Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC Pd RthJA Tj Tstg Limits 40 15 4.5 200 225 556 150 -65~+150 Unit V V V mA mW °C/W °C °C BTN2369N3 CYStek Product Specification CYStech Electronics Corp. Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) 1 *VCE(sat) 2 *VBE(sat) 1 *VBE(sat) 2 *hFE1 *hFE2 fT Cob Min. 40 15 4.5 700 40 20 500 Typ. Max. 100 100 250 300 850 1 120 4 Unit V V V nA nA mV mV mV V MHz pF Spec. No. : C229N3 Issued Date : 2004.08.09 Revised Date : Page No. : 2/3 Test Conditions IC=50µA IC=1mA IE=50µA VCB=40V VEB=4.5V IC=10mA, IB=1mA IC=20mA, IB=1mA IC=10mA, IB=1mA IC=20mA, IB=1mA VCE=1V, IC=10mA VCE=2V, IC=100mA VCE=10V, IC=10mA, f=100MHz VCB=5V, f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% BTN2369N3 CYStek Product Specification CYStech Electronics Corp. SOT-23 Dimension A L 3 B 1 2 S Spec. No. : C229N3 Issued Date : 2004.08.09 Revised Date : Page No. : 3/3 Marking: TE 1J V G 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 Style: Pin 1.Base 2.Emitter 3.Collector C D K H J *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTN2369N3 CYStek Product Specification